A cooling structure for aluminum-based heat dissipation circuit boards

Abstract

This invention relates to the field of heat dissipation technology for printed circuit boards, specifically to an aluminum-based heat dissipation type printed circuit board cooling structure, including a heat sink with a flow channel mounted on it, and a follower component installed on the flow channel. The follower component includes a rotating shaft, a follower shaft, and an output shaft. The rotating shaft is radially mounted within the flow channel, the follower shaft is located outside the flow channel, and a transmission component is provided between the follower shaft and the rotating shaft. A gear assembly is provided between the follower shaft and the output shaft. This invention, by setting up a flow channel, a force-driven rotating baffle, a non-contact magnetic transmission structure, a bevel gear reversing mechanism, and a fan blade and flow-guiding stirring structure, achieves the operation of components driven by the flow of the heat dissipation medium itself, improving the overall heat dissipation efficiency without consuming additional power. At the same time, it makes the heat dissipation medium evenly distributed, reduces local overheating, and also reduces component wear and the risk of medium leakage.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for circuit boards, specifically to an aluminum-based heat dissipation type circuit board cooling structure. Background Technology

[0002] Aluminum-based heat-dissipating circuit board cooling structure is a thermal management structure specifically adapted for aluminum-based circuit boards. Its core is to utilize the excellent thermal conductivity of the aluminum substrate and combine it with various heat sinks to build a complete system for heat conduction, heat exchange and dissipation. It quickly conducts the heat generated by the electronic components during the operation of the aluminum-based circuit board to the heat dissipation structure, and then dissipates the heat to the outside through medium heat exchange, airflow and other methods, thereby controlling the operating temperature of the circuit board and avoiding the impact of heat accumulation on the performance and service life of electronic components. It is widely used in high-power, high-heat-density aluminum-based circuit board related electronic equipment and belongs to the field of electronic component heat dissipation technology.

[0003] Currently, cooling structures for aluminum-based heat-dissipating circuit boards mostly employ water cooling, air cooling, or a combination of both. These methods can meet the basic cooling requirements in most scenarios and are widely used in practical applications. To ensure effective heat dissipation, such structures typically require an independent power unit to drive the circulation of the heat dissipation medium or power the air-cooled components. While the power unit and the heat dissipation structure are independently configured, achieving stable heat dissipation, there is still room for optimization in terms of energy consumption control and ease of use. Therefore, we propose a cooling structure for aluminum-based heat-dissipating circuit boards. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides an aluminum-based heat-dissipating circuit board cooling structure, including a heat sink with a flow channel mounted on it. A follower component is installed on the flow channel. The follower component includes a rotating shaft, a follower shaft, and an output shaft. The rotating shaft is movably mounted within the flow channel along its radial direction. The follower shaft is located outside the flow channel, and a transmission component is provided between the follower shaft and the rotating shaft. A gear assembly is provided between the follower shaft and the output shaft.

[0005] In some embodiments, the transmission assembly includes a first magnetic block and a second magnetic block, the first magnetic block being mounted on one end of the rotating shaft near the follower shaft, the second magnetic block being mounted on one end of the follower shaft near the rotating shaft, and the first magnetic block and the second magnetic block being located on opposite sides of the wall of the flow channel.

[0006] In some embodiments, both the first and second magnetic blocks are ring structures, and their N and S poles are arranged alternately.

[0007] In some embodiments, the axes of the follower shaft and the rotating shaft are collinear, and a first mounting bracket is connected between the follower shaft and the guide channel. The follower shaft is movably mounted on the outside of the guide channel through the first mounting bracket.

[0008] In some embodiments, the gear assembly includes a first bevel gear and a second bevel gear, the first bevel gear being fixedly mounted on the outside of the follower shaft, and the second bevel gear being fixedly mounted on the outside of the output shaft.

[0009] In some embodiments, the first bevel gear meshes with the second bevel gear, and the axis of the follower shaft is spatially perpendicular to the axis of the output shaft.

[0010] In some embodiments, a second mounting bracket is connected between the output shaft and the flow channel, and the output shaft is movably mounted on the outside of the flow channel via the second mounting bracket.

[0011] In some embodiments, a fan blade is fixedly mounted on the end of the output shaft away from the second bevel gear, and the fan blade is located on the side of the second mounting bracket away from the flow channel.

[0012] In some embodiments, the rotating shaft extends to a portion of the outer wall inside the flow channel, and multiple sets of baffles are fixedly installed at uniform intervals along its circumference. Each set of baffles extends radially outward along the rotating shaft, and each set of baffles has a flow-guiding component on its outer wall.

[0013] In some embodiments, the flow guiding component includes a flow guiding channel and a baffle, the flow guiding channel being formed on the outer wall of the baffle along the width direction of the baffle, and the baffle being fixedly assembled inside the flow guiding channel.

[0014] This invention has at least the following beneficial effects: (1) By setting up a flow channel, a baffle that rotates under force, a non-contact magnetic transmission structure and a bevel gear reversing mechanism, the present invention realizes the operation of the component driven by the flow of the heat dissipation medium itself, thereby improving the overall heat dissipation efficiency without consuming additional power, reducing power loss and component wear, and avoiding leakage of heat dissipation medium, thus reducing safety hazards.

[0015] (2) By setting up a diversion and stirring structure, modular assembly layout and flexible installation design, the present invention achieves uniform mixing of heat dissipation medium, reduces local overheating to protect circuit board, improves structural maintenance convenience and environmental adaptability, expands the scope of application, and reduces operation and maintenance costs. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the flow channel structure of the present invention; Figure 3 This is a cross-sectional view of the flow channel structure of the present invention; Figure 4 This is a schematic diagram of the follower component structure of the present invention; Figure 5 This is a schematic diagram of the baffle structure of the present invention; Figure 6 This is a schematic diagram of the first magnetic block structure of the present invention; Figure 7 This is a schematic diagram of the first bevel gear structure of the present invention; Figure 8 This is a schematic diagram of the fan blade structure of the present invention.

[0017] In the diagram: 1-Radiator; 2-Flow channel; 3-Follower component; 4-Shaft; 5-Baffle; 6-Follower shaft; 7-First magnet; 8-Second magnet; 9-First mounting bracket; 10-First bevel gear; 11-Output shaft; 12-Second bevel gear; 13-Second mounting bracket; 14-Fan blade; 15-Flow channel; 16-Baffle. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Example 1: Please refer to Figure 1-8 This invention provides a technical solution for a cooling structure of an aluminum-based heat-dissipating circuit board: A cooling structure of an aluminum-based heat-dissipating circuit board includes a heat sink 1, a flow channel 2 mounted on the heat sink 1, and a follower component 3 installed on the flow channel 2; the follower component 3 includes a rotating shaft 4, a follower shaft 6, and an output shaft 11. The rotating shaft 4 is movably installed in the flow channel 2 along the radial direction of the flow channel 2, the follower shaft 6 is located outside the flow channel 2, and a transmission component is provided between the follower shaft 6 and the rotating shaft 4, and a gear component is provided between the follower shaft 6 and the output shaft 11.

[0020] The transmission assembly includes a first magnetic block 7 and a second magnetic block 8. The first magnetic block 7 is installed on one end of the rotating shaft 4 near the follower shaft 6, and the second magnetic block 8 is installed on one end of the follower shaft 6 near the rotating shaft 4. The first magnetic block 7 and the second magnetic block 8 are located on both sides of the wall of the guide channel 2, respectively.

[0021] Both the first magnetic block 7 and the second magnetic block 8 are ring structures, and their N poles and S poles are arranged alternately inside.

[0022] The follower shaft 6 and the rotating shaft 4 are arranged on the same axis, and a first mounting bracket 9 is connected between the follower shaft 6 and the guide channel 2. The follower shaft 6 is movably mounted on the outside of the guide channel 2 through the first mounting bracket 9.

[0023] The gear assembly includes a first bevel gear 10 and a second bevel gear 12. The first bevel gear 10 is fixedly mounted on the outside of the follower shaft 6, and the second bevel gear 12 is fixedly mounted on the outside of the output shaft 11.

[0024] The first bevel gear 10 and the second bevel gear 12 mesh and are properly matched, and the axis of the follower shaft 6 and the axis of the output shaft 11 are perpendicular to each other in space.

[0025] A second mounting bracket 13 is connected between the output shaft 11 and the flow channel 2, and the output shaft 11 is movably mounted on the outside of the flow channel 2 through the second mounting bracket 13.

[0026] A fan blade 14 is fixedly installed at the end of the output shaft 11 away from the second bevel gear 12. The fan blade 14 is located on the side of the second mounting bracket 13 away from the guide channel 2.

[0027] The rotating shaft 4 extends to the outer wall of the inner side of the guide channel 2, and multiple sets of baffles 5 are fixedly installed at even intervals along its circumference. Each set of baffles 5 extends outward radially along the rotating shaft 4, and each set of baffles 5 has a flow-guiding component on its outer wall.

[0028] The flow guiding assembly includes a flow guiding groove 15 and a baffle 16. The flow guiding groove 15 is opened on the outer wall of the baffle 5 along the width direction of the baffle 5, and the baffle 16 is fixedly assembled inside the flow guiding groove 15.

[0029] Through the above technical solution: In use, firstly, the flow channel 2 is fixedly assembled on the top of the heat sink 1, with the two seamlessly fitted together. This assembly method not only ensures the normal flow of the heat dissipation medium within the flow channel 2, preventing leakage, but also improves the heat transfer efficiency between the heat sink 1 and the flow channel 2. The heat generated by the aluminum-based circuit board can be transferred through the heat sink 1 to the heat dissipation medium within the flow channel 2, achieving rapid heat dissipation and improving the heat transfer loss problem caused by loose connections in traditional structures. The flow channel 2 is made of a high-temperature resistant material with excellent thermal conductivity, and its interior has pre-reserved channels for the flow of the heat dissipation medium, which can be heat dissipation oil, coolant, etc.

[0030] When this cooling structure is working, a heat dissipation medium is first introduced into the flow channel 2. The heat dissipation medium flows continuously within the flow channel 2, constantly impacting the baffles 5 on the rotating shaft 4. Since the baffles 5 are evenly distributed around the circumference of the rotating shaft 4 and extend radially, the impact force of the heat dissipation medium causes the baffles 5 to rotate around the axis of the rotating shaft 4, thereby driving the rotating shaft 4 to rotate along its own axis. Here, the evenly distributed design of the baffles 5 ensures that the rotating shaft 4 is subjected to balanced force, reducing uneven wear and jamming. At the same time, the flow guide groove 15 of the flow guide component guides the heat dissipation medium to flow in the direction of the baffles 5, reducing medium flow resistance, reducing energy loss, and enabling the medium to drive the rotating shaft 4 to rotate without the need to increase the flow pressure of the medium, thus reducing operating costs.

[0031] When the rotating shaft 4 rotates, the first magnetic block 7 at its end rotates synchronously. Since the first magnetic block 7 and the second magnetic block 8 are annular magnetic blocks with corresponding magnetic poles, and they form a non-contact magnetic transmission separated by the wall of the flow channel 2, the rotation of the first magnetic block 7 will drive the second magnetic block 8 to rotate synchronously through the magnetic field force, thereby driving the follower shaft 6, which is fixedly connected to the second magnetic block 8, to rotate around its own axis. The follower shaft 6 and the rotating shaft 4 have the same speed and direction of rotation. The advantages of this non-contact magnetic transmission are fully demonstrated here: on the one hand, there is no need for mechanical contact, reducing the wear of transmission components, reducing the frequency of maintenance, and extending the service life of the entire structure; on the other hand, the magnetic field transmission has a certain buffering effect. When the flow rate of the heat dissipation medium fluctuates, causing the rotation speed of the rotating shaft 4 to change, the magnetic transmission can buffer the speed fluctuation, reduce the impact on the follower shaft 6 and gear assembly due to sudden speed changes, and protect the subsequent components. In addition, the wall-separated transmission does not need to damage the sealing of the flow channel 2, ensuring that the heat dissipation medium will not leak, avoiding safety hazards such as heat dissipation failure and circuit board short circuits caused by medium leakage.

[0032] When the follower shaft 6 rotates, the first bevel gear 10 mounted on its exterior rotates synchronously. Since the first bevel gear 10 meshes with the second bevel gear 12 and their axes are perpendicular in space, the rotation of the first bevel gear 10 will drive the second bevel gear 12 to rotate, thereby driving the output shaft 11 to rotate around its own axis, achieving a vertical change in the direction of rotation. The meshing of the bevel gears has the advantages of stable transmission ratio and high power transmission efficiency, which can transmit the power of the follower shaft 6 to the output shaft 11, reduce power loss, ensure that the fan blade 14 obtains a suitable speed, and achieve a good heat dissipation effect. At the same time, the bevel gear has a compact structure and occupies little space, which is suitable for the design of the components of this structure being centrally assembled on the outside of the guide channel 2, further improving the compactness of the structure and making it easier to install the entire cooling structure in space-constrained aluminum-based circuit board equipment, thus improving the adaptability of the structure.

[0033] When the output shaft 11 rotates, the fan blades 14 at its end rotate synchronously. The rotation of the fan blades 14 generates airflow, creating a diversion effect and bringing dual heat dissipation advantages: On the one hand, the airflow accelerates the air circulation on the surface of the heat sink 1, carrying away the heat on the surface of the heat sink 1, complementing the heat dissipation of the heat dissipation medium in the guide channel 2, improving the overall heat dissipation efficiency, and improving the problem of insufficient heat dissipation efficiency of traditional aluminum-based circuit boards that rely solely on medium heat dissipation. It can meet the heat dissipation requirements of high-power aluminum-based circuit boards. On the other hand, the airflow can also cool the outer wall of the guide channel 2, reducing the temperature of the heat dissipation medium in the guide channel 2, improving the heat dissipation capacity of the medium, and forming a virtuous cycle of medium heat dissipation, fan blade 14 cooling, and enhanced medium heat dissipation.

[0034] Simultaneously, during the rotation of the baffle 5, the guide grooves 15 on its surface cooperate with the baffle 16 to stir the heat dissipation medium within the guide channel 2, breaking the laminar flow state of the heat dissipation medium and making the mixing of the heat dissipation medium within the guide channel 2 more uniform. This reduces the problem of localized overheating caused by localized stagnation of the heat dissipation medium. This advantage protects the aluminum-based circuit board, reducing issues such as solder joint detachment, chip damage, and performance degradation caused by localized overheating, ensuring long-term operation of the circuit board and extending its service life. In addition, the stirring effect increases the contact area between the heat dissipation medium and the inner wall of the guide channel 2, accelerating the transfer of heat from the medium to the guide channel 2 and then to the heat sink 1, further improving heat dissipation efficiency.

[0035] The entire operation requires no additional power drive, relying entirely on the flow impact force of the heat dissipation medium within the guide channel 2 to achieve linkage transmission. This design offers significant energy-saving advantages, eliminating the need for external motors or other power components, reducing energy consumption and equipment costs, while also minimizing maintenance work on power components and lowering subsequent operation and maintenance costs. Furthermore, all components are modularly assembled, and key transmission components such as the magnetic block and bevel gear are located outside the guide channel 2, away from the heat dissipation medium, reducing corrosion and wear on the transmission components, extending component lifespan, and facilitating later disassembly, inspection, and replacement of transmission components and fan blades 14, thus improving maintenance convenience.

[0036] It is important to note that this solution is optimized to match the upper limit of magnetic transmission torque with the driving force under low flow conditions. The magnetic blocks are made of neodymium iron boron high-temperature resistant permanent magnet material, and the size of a single magnet is set to an outer diameter of 12mm and a thickness of 3mm. The first magnetic block 7 and the second magnetic block 8 both adopt an eight-pole ring alternating magnetic pole arrangement, with sufficient area for the magnetic poles to face each other, which can stably output the coupling torque. The minimum starting heat dissipation medium flow rate of the entire transmission system is calibrated to be 0.25m / s. When the medium flow rate is greater than or equal to this value, the fluid thrust on the baffle 5 can completely offset the magnetic coupling resistance, gear meshing friction resistance and fan blade 14 rotation load resistance, so as to achieve stable self-starting operation.

[0037] The baffle 5 adopts a large frontal arc plate structure, and the plate surface is opened with a guide groove 15 to enhance the fluid impact force. It can effectively amplify the fluid driving force under low power and low flow rate conditions. The bevel gear is a small module low friction precision gear, and the gear meshing part is coated with high temperature resistant solid grease, which greatly reduces mechanical transmission loss and torque consumption.

[0038] For extreme low-power operating conditions with ultra-low flow rates for extended periods, this structure can be equipped with an external micro-auxiliary flow guiding and pressurizing component as an optional adapter. This component only intervenes with micro-pressurization for short periods in the extreme range where the flow rate is below 0.25 m / s. In the normal operating range, the operation is driven entirely by the flow rate of the medium itself, without changing the magnetic drive structure that prevents sealing and leakage.

[0039] In the normal operating conditions of industrial aluminum-based circuit boards, after the circuit board is powered on and heats up, the temperature of the heat dissipation medium rises and the fluidity increases simultaneously. The medium flow rate is naturally maintained above 0.35m / s, which is much higher than the minimum starting flow rate threshold. The entire magnetic drive follow-up heat dissipation mechanism can operate autonomously and stably throughout the process, with sufficient torque transmission margin, and there will be no situation of insufficient driving force or fan blade 14 stopping.

[0040] Furthermore, the layout design of this structure offers excellent compatibility: the heat sink 1 can be flexibly designed according to the size of the aluminum-based circuit board, the flow channel 2 can accommodate heat dissipation media with different flow rates, and the mounting positions of the follower component 3 and gear assembly can be finely adjusted via the mounting bracket. This allows it to adapt to aluminum-based circuit boards of different specifications and installation spaces, resulting in a wide range of applications. Simultaneously, the non-contact magnetic drive design enhances the structure's sealing performance, making it suitable for humid and dusty working environments, improving its environmental adaptability and expanding its application scenarios.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure for an aluminum-based circuit board, comprising a heat sink (1), characterized in that: The radiator (1) is equipped with a flow channel (2), and a follower assembly (3) is installed on the flow channel (2). The follower assembly (3) includes a rotating shaft (4), a follower shaft (6) and an output shaft (11). The rotating shaft (4) is movably installed in the flow channel (2) along the radial direction of the flow channel (2). The follower shaft (6) is located outside the flow channel (2), and a transmission assembly is provided between the follower shaft (6) and the rotating shaft (4). A gear assembly is provided between the follower shaft (6) and the output shaft (11).

2. The aluminum-based heat-dissipating circuit board cooling structure according to claim 1, characterized in that: The transmission assembly includes a first magnetic block (7) and a second magnetic block (8). The first magnetic block (7) is installed on one end of the rotating shaft (4) near the follower shaft (6), and the second magnetic block (8) is installed on one end of the follower shaft (6) near the rotating shaft (4). The first magnetic block (7) and the second magnetic block (8) are located on both sides of the wall of the guide channel (2).

3. The aluminum-based heat-dissipating circuit board cooling structure according to claim 2, characterized in that: The first magnetic block (7) and the second magnetic block (8) are both ring structures, and their N poles and S poles are arranged alternately inside.

4. The aluminum-based heat dissipation circuit board cooling structure according to claim 3, characterized in that: The follower shaft (6) and the rotating shaft (4) are arranged in the same direction, and a first mounting bracket (9) is connected between the follower shaft (6) and the guide channel (2). The follower shaft (6) is movably mounted on the outside of the guide channel (2) through the first mounting bracket (9).

5. The aluminum-based heat-dissipating circuit board cooling structure according to claim 4, characterized in that: The gear assembly includes a first bevel gear (10) and a second bevel gear (12). The first bevel gear (10) is fixedly mounted on the outside of the follower shaft (6), and the second bevel gear (12) is fixedly mounted on the outside of the output shaft (11).

6. The aluminum-based heat-dissipating circuit board cooling structure according to claim 5, characterized in that: The first bevel gear (10) meshes with the second bevel gear (12), and the axis of the follower shaft (6) is perpendicular to the axis of the output shaft (11) in space.

7. The aluminum-based heat-dissipating circuit board cooling structure according to claim 6, characterized in that: A second mounting bracket (13) is connected between the output shaft (11) and the flow channel (2), and the output shaft (11) is movably mounted on the outside of the flow channel (2) through the second mounting bracket (13).

8. The aluminum-based heat-dissipating circuit board cooling structure according to claim 7, characterized in that: A fan blade (14) is fixedly installed at one end of the output shaft (11) away from the second bevel gear (12), and the fan blade (14) is located on the side of the second mounting bracket (13) away from the guide channel (2).

9. The aluminum-based heat-dissipating circuit board cooling structure according to claim 1, characterized in that: The rotating shaft (4) extends to the outer wall of the inner side of the guide channel (2), and multiple sets of baffles (5) are fixedly installed at uniform intervals along its circumference. Each set of baffles (5) extends outward along the radial direction of the rotating shaft (4), and each set of baffles (5) has a drainage component on its outer wall.

10. The aluminum-based heat-dissipating circuit board cooling structure according to claim 9, characterized in that: The flow guiding component includes a flow guide groove (15) and a baffle (16). The flow guide groove (15) is opened on the outer wall of the baffle (5) along the width direction of the baffle (5), and the baffle (16) is fixedly assembled inside the flow guide groove (15).

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