A heat dissipation protection frame for multilayer circuit board components

Abstract

This invention relates to the field of circuit board technology, and in particular to a heat dissipation and protection frame for multilayer circuit board components. The frame includes a support base with an upper cover plate on top. A circuit board body is located between the support base and the upper cover plate. It also includes a heat insulation and active heat dissipation mechanism, which is respectively disposed on both sides of the circuit board body and the bottom of the support base, for isolating heat backflow and driving airflow. The heat insulation and active heat dissipation mechanism includes a first heat insulation plate, a second heat insulation plate, and a cooling fan. The first heat insulation plate is located on both sides of the circuit board body and disposed between a thermally conductive pad and the circuit board body. The second heat insulation plate is fixed to the bottom of the thermally conductive pad to prevent heat backflow. A gap is provided between the circuit board body and the support base. Through the cooperation of the above structures, an organic combination of conductive and convective heat dissipation is achieved, significantly improving heat dissipation efficiency and effectively meeting the heat dissipation requirements of high power density multilayer circuit boards.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a heat dissipation and protection bracket for multilayer circuit board components. Background Technology

[0002] Because existing circuit boards have integrated circuits, the circuits and electronic components generate a lot of heat during use. If heat is not dissipated in time, the circuit board will age rapidly or even burn out. Therefore, existing technologies usually use methods such as adding heat sinks and installing cooling fans to dissipate heat from the circuit board in order to reduce the operating temperature of the circuit board and ensure its normal operation.

[0003] However, the heat dissipation methods of existing heat sinks rely on passive heat conduction and natural convection, which have limited heat dissipation efficiency and are not effective for circuit boards with large heat generation. While fan-driven forced cooling can increase airflow, it often suffers from unreasonable airflow organization. The cool air cannot fully contact the heat-generating components for heat exchange, and the hot air after cooling can easily form eddies inside the device, causing heat to flow back to the surface of the circuit board, which reduces the heat dissipation effect. In addition, existing heat dissipation devices are generally complex in structural design, inconvenient to install and disassemble, and are prone to squeezing damage to the circuit board during the fixing process, affecting the product yield and service life. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned shortcomings in the prior art by providing a heat dissipation protection bracket for multilayer circuit board components.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A heat dissipation and protection bracket for multilayer circuit board components includes a support base, an upper cover plate above the support base, a circuit board body between the support base and the upper cover plate, and further includes: A heat insulation and active heat dissipation mechanism is respectively disposed on both sides of the circuit board body and the bottom of the support base to prevent heat backflow and drive airflow. The heat insulation and active heat dissipation mechanism includes a first heat insulation plate, a second heat insulation plate and a cooling fan. The first heat insulation plate is located on both sides of the circuit board body and disposed between the thermal pad and the circuit board body. The second heat insulation plate is fixed to the bottom of the thermal pad to prevent heat backflow. A gap is provided between the circuit board body and the support base. The cooling fan is installed at the bottom of the support base and is used to extract air from the gap. The fixing mechanism is located between the upper cover plate and the bracket base to press and fix the various layers of the structure. The fixing mechanism includes screws that pass through the upper cover plate and are fixed to the bracket base.

[0006] Furthermore, a dustproof net is provided inside the upper cover plate, and the dustproof net covers the upper opening of the ventilation channel.

[0007] Furthermore, heat sinks are installed on both sides of the bracket base, and the side of the thermal pad contacts the heat sinks.

[0008] Furthermore, the longitudinal section of the circuit board body is L-shaped, the horizontal section of the circuit board body is located above the thermal pad, and the vertical section of the circuit board body is located along the inner sidewall of the support base.

[0009] Furthermore, there are four heat-conducting pillars, which are respectively located at the four corners of the circuit board body; each heat-conducting pillar has an independent ventilation channel inside.

[0010] Furthermore, the top of the bracket base is provided with a protrusion, and the protrusion is provided with threads inside; the heat-conducting column passes through the mounting hole of the circuit board body and is sleeved on the protrusion, the screw is engaged with the thread inside the protrusion, and the upper cover plate compresses the heat-conducting column to restrict its movement.

[0011] Furthermore, the first heat insulation board is made of ceramic fiber material and has a thickness of 2-5mm; a pressure plate is installed on one side of the first heat insulation board, and a rubber layer is provided at the bottom of the pressure plate to compress and fix the circuit board body.

[0012] Furthermore, the height of the gap is 3-10mm, the gap forms a transverse air collection cavity, and the lower opening of the ventilation channel is connected to the gap.

[0013] Furthermore, the thermal pad is made of silicone grease or thermally conductive silicone material, and the thickness of the thermal pad is 0.5-3mm.

[0014] The heat dissipation and protection bracket for multilayer circuit board components proposed in this invention has the following advantages: 1. By setting up a vertically connected ventilation channel inside the heat-conducting column, and using the bottom cooling fan to draw in air to create negative pressure, cold air can pass through the inside of the heat-conducting column from top to bottom. During the flow, it continuously absorbs heat, realizing an organic combination of conductive and convective heat dissipation, which greatly improves heat dissipation efficiency and can effectively meet the heat dissipation requirements of high power density multilayer circuit boards.

[0015] 2. By setting the first heat insulation plate and the second heat insulation plate, the heat return path is blocked from the side and bottom respectively, preventing the dissipated heat from being reconducted to the surface of the circuit board body, avoiding secondary heating, and ensuring stable and reliable heat dissipation effect; at the same time, the heat sink and the side of the heat-conducting pad are in direct contact, forming a lateral heat conduction path, which further increases the heat dissipation channel and improves the overall heat dissipation performance.

[0016] 3. The fixing method adopts a heat-conducting column sleeved on the base protrusion and the upper cover plate squeeze and limit the fixation. The structure is simple and easy to assemble. It can automatically compensate for processing errors, ensure good contact of the heat-conducting interface, and effectively reduce contact thermal resistance. The bottom of the pressure plate is equipped with a rubber layer, which can not only ensure uniform distribution of the clamping force, but also avoid rigid contact damage to the circuit board body, and play a buffer protection role. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a cross-sectional view of the front of the present invention; Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A; Figure 4 This is a schematic diagram of the internal disassembly structure of the present invention; Figure 5 This is a schematic diagram of the structure of the thermal pad of the present invention; Figure 6 This is a schematic diagram of the bottom structure of the present invention; Figure 7 This is a cross-sectional view of the top of the present invention.

[0018] In the diagram: 1. Support base; 2. Thermal pad; 3. Circuit board body; 4. Thermal column; 5. Top cover; 6. Screw; 7. First heat insulation plate; 8. Second heat insulation plate; 9. Ventilation channel; 10. Gap; 11. Cooling fan; 12. Dustproof net; 13. Heat sink; 14. Pressure plate. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] Reference Figure 1-7 A heat dissipation and protection frame for multilayer circuit board components includes a support base 1, an upper cover plate 5 on top of the support base 1, and a circuit board body 3 between the support base 1 and the upper cover plate 5. It also includes: a heat conduction and heat dissipation air duct mechanism, located between the support base 1 and the circuit board body 3, for conducting heat and forming an airflow channel; a heat insulation and active heat dissipation mechanism, located on both sides of the circuit board body 3 and the bottom of the support base 1, for blocking heat backflow and driving airflow; and a fixing mechanism, located between the upper cover plate 5 and the support base 1, for pressing and fixing each layer of the structure.

[0021] The bracket base 1 provides installation support and positioning reference for each component. The top cover 5 covers the top of the device, serving as protection, dust prevention, and clamping fixation. The electronic components on the circuit board body 3 are the heat source. The heat conduction and heat dissipation air duct mechanism is the core channel for heat conduction and air circulation, undertaking the dual functions of heat transfer and airflow organization. The heat insulation and active heat dissipation mechanism blocks reverse heat conduction on the one hand, and actively draws air to form forced convection on the other hand, which is a key component for improving heat dissipation efficiency. The fixing mechanism reliably clamps each layer of structure, ensuring good contact of the heat conduction interface and avoiding loose assembly that would affect the heat dissipation effect.

[0022] The heat conduction and heat dissipation air duct mechanism includes a heat conduction pad 2 and several heat conduction columns 4. The heat conduction pad 2 is set on the inner bottom surface of the support base 1, the circuit board body 3 is set on the top of the heat conduction pad 2, and the heat conduction column 4 is provided with a ventilation channel 9 inside. Both the upper and lower ends of the ventilation channel 9 are provided with openings and pass through the heat conduction column 4.

[0023] The thermal pad 2 fills the gap between the circuit board and the base, eliminating microscopic unevenness of the contact surface, reducing contact thermal resistance, and ensuring efficient heat conduction. The thermal column 4 acts as a thermal conductive component to conduct the heat generated by the circuit board downwards. At the same time, the ventilation channel 9 inside it serves as a vertical air passage for air circulation, allowing cold air to pass through the interior of the thermal column from top to bottom. During the flow, it continuously absorbs the heat of the column, achieving an organic combination of conductive and convective heat dissipation. The ventilation channel 9 is open from top to bottom, forming a complete airflow path, ensuring that air can enter and exit smoothly and avoiding airflow dead zones.

[0024] The heat insulation and active heat dissipation mechanism includes a first heat insulation plate 7, a second heat insulation plate 8, and a cooling fan 11. The first heat insulation plate 7 is located on both sides of the circuit board body 3 and is disposed between the thermal pad 2 and the circuit board body 3. The second heat insulation plate 8 is fixed to the bottom of the thermal pad 2 to prevent heat backflow. A gap 10 is provided between the circuit board body 3 and the support base 1. The cooling fan 11 is installed at the bottom of the support base 1 and is used to extract air from the gap 10.

[0025] The first heat insulation plate 7 is set on both sides of the circuit board to isolate the circuit board area from the heat dissipation areas on both sides, preventing high-temperature air on the heat dissipation side from flowing back to the circuit board surface through the side and avoiding secondary heating; the second heat insulation plate 8 is set at the bottom of the thermal pad to block heat from being conducted upwards and backwards through the base, ensuring that heat is dissipated outwards in one direction; the gap 10 serves as a transverse air collection chamber, collecting the hot air flowing out of each ventilation channel 9, so that the airflow is evenly distributed before being extracted; the cooling fan 11 actively extracts the air in the gap, forming a negative pressure inside the device, driving external cold air to enter from the top and flow downwards through the ventilation channel, forming a stable forced convection circulation, which greatly improves the heat dissipation efficiency.

[0026] The fixing mechanism includes screw 6, which passes through the upper cover plate 5 and is fixed to the bracket base 1.

[0027] Screw 6 serves as the main fastener, reliably connecting the upper cover plate 5 to the bracket base 1. The tightening torque applies uniform pressure to each layer of the structure, ensuring good surface contact between the thermal pad and the circuit board, and between the thermal pillar and the circuit board, minimizing contact thermal resistance and ensuring stable and reliable heat dissipation performance. At the same time, the threaded connection facilitates disassembly and maintenance, making it convenient for the inspection and replacement of the circuit board.

[0028] like Figure 3 As shown, the longitudinal section of the circuit board body 3 is L-shaped. The horizontal section of the circuit board body 3 is located above the thermal pad 2, and the vertical section of the circuit board body 3 is located along the inner wall of the support base 1.

[0029] The L-shaped circuit board body 3 has a horizontal section that carries the main heat-generating components and makes full contact with the thermal pads to achieve surface heat conduction. The vertical section is set along the inner wall of the support base, which increases the heat dissipation surface area and utilizes the space of the side wall to arrange some components, thus improving space utilization. At the same time, the narrow channel formed between the vertical section and the inner wall can guide airflow along the wall surface, further removing heat from the side wall and enhancing the overall heat dissipation effect.

[0030] like Figure 3 , 7 As shown, there are four heat-conducting pillars 4, which are respectively located at the four corners of the circuit board body 3; each heat-conducting pillar 4 has an independent ventilation channel 9 inside.

[0031] Four heat-conducting pillars 4 are distributed at the four corners of the circuit board, forming a multi-point support and multi-point heat conduction layout, which makes the circuit board evenly stressed and avoids local stress concentration. Each heat-conducting pillar has an independent ventilation channel 9, forming four parallel vertical airflow paths, which makes the airflow distribution more even and can cover all areas of the circuit board, avoiding local overheating. The corner arrangement can also take into account the positioning function, so that the circuit board can be quickly aligned during assembly and improve assembly efficiency.

[0032] like Figure 3 As shown, the top of the bracket base 1 is provided with a protrusion, and the inside of the protrusion is provided with threads; the heat-conducting column 4 passes through the mounting hole of the circuit board body 3 and is fitted onto the protrusion; the screw 6 is connected to the thread inside the protrusion; the upper cover plate 5 compresses the heat-conducting column 4 to restrict its movement.

[0033] The protrusion on the top of the bracket base 1 provides a positioning reference for the heat-conducting column. The heat-conducting column is fitted onto the protrusion to achieve radial limitation and prevent lateral displacement of the heat-conducting column. The internal thread inside the protrusion cooperates with the screw to form a threaded connection pair to achieve axial fastening. During the screw tightening process, the upper cover plate 5 compresses the top of the heat-conducting column, axially pressing and fixing the heat-conducting column, restricting its vertical movement, and ensuring that both ends of the heat-conducting column maintain stable contact with the circuit board and the base respectively, ensuring a continuous and reliable heat conduction path. This fitting + compression fixing method has a simple structure, is easy to assemble, and can automatically compensate for processing errors.

[0034] like Figure 3 As shown, a pressure plate 14 is installed on one side of the first heat insulation plate 7. A rubber layer is provided at the bottom of the pressure plate 14 to compress and fix the circuit board body 3.

[0035] The pressure plate 14 provides auxiliary fixation to the circuit board from the side, forming a multi-point pressing layout together with the top cover plate, making the circuit board more securely fixed. The rubber layer at the bottom of the pressure plate has an elastic buffering effect, which can compensate for the dimensional tolerances of each component and ensure that the pressing force is evenly distributed. On the other hand, it can prevent the rigid pressure plate from directly contacting the surface of the circuit board, preventing scratches or damage to the circuit board and playing a protective role. The elasticity of the rubber layer can also absorb the vibration during the operation of the device and improve the vibration resistance of the structure.

[0036] like Figure 1 , 3 As shown, heat sinks 13 are installed on both sides of the bracket base 1, and the side of the thermal pad 2 is in contact with the heat sink 13.

[0037] Heat sinks 13 are installed on both sides of the bracket base, which greatly increases the heat dissipation surface area of ​​the device, allowing the heat conducted to the base to be quickly dissipated to the surrounding environment through the heat sinks; the side of the thermal pad is in direct contact with the heat sink, forming a lateral heat conduction path, so that heat can not only be conducted downward, but also directly transferred to the heat sink through the side, increasing the heat dissipation channel and improving the overall heat dissipation efficiency; the symmetrical arrangement of heat sinks on both sides makes the device dissipate heat evenly, avoiding the temperature gradient caused by overheating on one side.

[0038] like Figure 2 As shown, a dustproof net 12 is provided inside the upper cover plate 5, and the dustproof net 12 covers the upper opening of the ventilation channel 9.

[0039] The dustproof net 12 covers the upper opening of the ventilation channel, ensuring smooth airflow while effectively blocking external dust and debris from entering the device. This prevents dust from accumulating on the circuit board surface and inside the ventilation channel, thus preventing a decrease in heat dissipation and insulation performance due to dust accumulation. The dustproof net is located inside the upper cover plate, making it easy to disassemble, clean, and replace, and facilitating maintenance. At the same time, the dustproof net also plays a role in equalizing airflow, making the airflow entering the ventilation channel more uniform and stable.

[0040] like Figure 3 As shown, the height of the gap 10 is 3-10mm, the gap 10 forms a transverse air collection cavity, and the lower opening of the ventilation channel 9 is connected to the gap 10.

[0041] The gap 10 serves as a transverse air collection chamber, gathering the hot air flowing from each vertical ventilation channel. This allows the airflow to mix thoroughly in the transverse direction before being extracted by the cooling fan, preventing mutual interference between airflows in different channels and ensuring uniform airflow resistance and consistent flow distribution in each ventilation channel. The height range of 3-10mm ensures sufficient cross-sectional area for airflow, preventing excessive pressure drop, while also avoiding excessive space occupation due to excessive height, resulting in a compact overall structure. The lower opening of the ventilation channel is directly connected to the gap, forming a complete airflow organization pattern of vertical air intake—transverse air collection—bottom extraction, with a clear airflow path and high heat dissipation efficiency.

[0042] Working principle: During operation, the cooling fan 11 starts and draws air from the gap 10 at the bottom of the bracket base 1, creating a negative pressure environment inside the device. External cold air, filtered by the dust filter 12 inside the upper cover 5, enters the ventilation channels 9 inside each heat-conducting column 4 from the top. As the cold air flows downwards along the ventilation channels 9, it fully contacts and exchanges heat with the inner wall of the heat-conducting columns 4. The heat generated by the circuit board body 3 is first conducted to the heat-conducting columns 4. When the heat reaches the ventilation channel 9 area, it splits into two paths: one path directly transfers heat through the inner wall of the ventilation channel 9 to the flowing cold air within the channel, is carried downwards by the airflow, and finally merges with the hot air into the gap 10, where it is directly cooled by the cooling fan 11. The heat is drawn out of the device, forming a convection heat dissipation path. Another path of heat continues to be conducted downward along the heat-conducting column 4, and then dispersed to the side through the heat-conducting pad 2 to the heat sink 13. The heat is then naturally dissipated from the surface of the heat sink 13 to the surrounding environment, forming a conduction heat dissipation path. The first heat insulation plate 7 is set around the circuit board body 3 to isolate the circuit board area from the surrounding heat dissipation area, preventing the hot air after heat dissipation from flowing back to the surface of the circuit board body 3 through the side and causing secondary heating. The second heat insulation plate 8 is set at the bottom of the heat-conducting pad 2 to block the path of heat conduction downward and then flowing back upward, ensuring that the heat is dissipated outward in one direction. The two heat dissipation paths cooperate and work together to effectively improve the overall heat dissipation efficiency.

[0043] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A heat dissipation and protection frame for multilayer circuit board components, comprising a support base (1), an upper cover plate (5) above the support base (1), and a circuit board body (3) between the support base (1) and the upper cover plate (5), characterized in that, Also includes: The heat insulation and active heat dissipation mechanism is respectively set on both sides of the circuit board body (3) and the bottom of the support base (1) to isolate heat backflow and drive airflow; the heat insulation and active heat dissipation mechanism includes a first heat insulation plate (7), a second heat insulation plate (8) and a heat dissipation fan (11). The first heat insulation plate (7) is located on both sides of the circuit board body (3) and is set between the heat-conducting pad (2) and the circuit board body (3). The second heat insulation plate (8) is fixed to the bottom of the heat-conducting pad (2) to prevent heat backflow. A gap (10) is provided between the circuit board body (3) and the support base (1). The heat dissipation fan (11) is installed at the bottom of the support base (1) and is used to extract the air inside the gap (10). The fixing mechanism is located between the upper cover plate (5) and the bracket base (1) to press and fix the structure of each layer; The fixing mechanism includes a screw (6), which passes through the upper cover plate (5) and is fixed to the bracket base (1).

2. The heat dissipation and protection bracket for multilayer circuit board components according to claim 1, characterized in that: The upper cover plate (5) is provided with a dustproof net (12) inside, which covers the upper opening of the ventilation channel (9).

3. The heat dissipation and protection bracket for multilayer circuit board components according to claim 1, characterized in that: Heat sinks (13) are installed on both sides of the bracket base (1), and the side of the thermal pad (2) is in contact with the heat sink (13).

4. The heat dissipation and protection bracket for multilayer circuit board components according to claim 1, characterized in that: The longitudinal section of the circuit board body (3) is L-shaped. The horizontal section of the circuit board body (3) is located above the heat-conducting pad (2), and the vertical section of the circuit board body (3) is located along the inner wall of the support base (1).

5. The heat dissipation and protection bracket for multilayer circuit board components according to claim 1, characterized in that: The number of heat-conducting columns (4) is four, which are respectively set at the four corners of the circuit board body (3); each heat-conducting column (4) has an independent ventilation channel (9) inside.

6. The heat dissipation protection bracket for multilayer circuit board components according to claim 1, characterized in that: The top of the bracket base (1) is provided with a protrusion, and the protrusion is provided with a thread inside; the heat-conducting column (4) passes through the mounting hole of the circuit board body (3) and is sleeved on the protrusion; the screw (6) is connected to the thread inside the protrusion; the upper cover plate (5) squeezes the heat-conducting column (4) to restrict its movement.

7. The heat dissipation and protection bracket for multilayer circuit board components according to claim 1, characterized in that: The first heat insulation board (7) is made of ceramic fiber material and the thickness of the first heat insulation board (7) is 2-5mm; a pressure plate (14) is installed on one side of the first heat insulation board (7), and a rubber layer is provided at the bottom of the pressure plate (14) to form a compression fixation on the circuit board body (3).

8. A heat dissipation and protection bracket for multilayer circuit board components according to claim 1, characterized in that: The height of the gap (10) is 3-10mm, the gap (10) forms a transverse air collection cavity, and the lower opening of the ventilation channel (9) is connected to the gap (10).

9. A heat dissipation and protection bracket for multilayer circuit board components according to claim 1, characterized in that: The thermal pad (2) is made of silicone grease or thermally conductive silicone material, and the thickness of the thermal pad (2) is 0.5-3mm.

Images