A circuit board assembly and a communication device

Abstract

This specification provides a circuit board assembly and a communication device, relating to the field of electronic technology. A circuit board assembly includes: a motherboard with a processing chip disposed thereon; a port board with a port module inserted into it on the side of the port board away from the motherboard, a cutout area formed on the side of the port board close to the motherboard, and a connection area disposed on the port board outside the cutout area; and a power board with a power module disposed thereon; wherein the processing chip on the motherboard and the port module on the port board are electrically connected via a flexible circuit board, and the power board is electrically connected to the port board via the connection area. This structure improves the signal integrity of high-speed signal transmission in the communication device.

Description

Technical Field

[0001] This specification relates to the field of electronic technology, and in particular to a circuit board assembly and a communication device. Background Technology

[0002] With the booming development of cloud computing, artificial intelligence, and big data applications, the demand for bandwidth in data centers is exploding. As core communication equipment, high-end switches, routers, servers, and other products are developing towards higher signal transmission rates, and with the increase in the number of ports within these communication devices, space is becoming increasingly challenging.

[0003] Communication equipment contains at least two types of signals: a high-speed signal for data transmission and a power supply signal for powering the devices within the equipment. Due to the high-speed requirements of these signals, the processing chip used for data processing needs to be placed as close to the port as possible. However, the power supply signal transmission requires voltage conversion and filtering via a power module, occupying space on the motherboard where the processing chip resides. This extends the transmission distance of the high-speed signal and reduces the signal integrity of high-speed signal transmission within the communication equipment. Summary of the Invention

[0004] To overcome the problems existing in related technologies, this specification provides a circuit board assembly and a communication device.

[0005] According to a first aspect of the embodiments of this specification, a circuit board assembly is provided, comprising: A motherboard, on which a processing chip is mounted; A port board, wherein a port module is inserted into the side of the port board away from the motherboard, and a cutout area is formed on the side of the port board closer to the motherboard; a connection area is provided on the port board outside the cutout area; and, A power board, on which a power module is mounted; The motherboard's processing chip and the port modules on the port board are electrically connected via a flexible circuit board, and the power board is electrically connected to the port board via the connection area.

[0006] Optionally, the plane where the motherboard is located is orthogonal to the plane where the port board is located; The flexible circuit board is formed on both sides of the inner layers of the motherboard and the port board, respectively.

[0007] Optionally, the connection areas of adjacent port boards are arranged opposite each other.

[0008] Optionally, the plane on which the motherboard is located is arranged parallel to the plane on which the port board is located.

[0009] Optionally, the two sides of the flexible circuit board are formed in the inner layers of the motherboard and the port board, respectively.

[0010] Optionally, a pressure pad is formed between the processing chip of the motherboard and the projection area of ​​the port board and the plane where the motherboard is located; The circuit board assembly further includes: Conductive adhesive; An adapter board, wherein the adapter board and the main board clamp the conductive adhesive; Wherein, one end of the flexible circuit board is formed in the inner layer of the adapter board, and the other end of the flexible circuit board is formed in the inner layer of the port board; The conductive adhesive electrically connects the pressure pads and the flexible circuit board inside the adapter plate.

[0011] Optionally, the adapter plates located on both sides of the motherboard are fixed to the motherboard by a set of fixing screws.

[0012] Optionally, the connection area is located on the side surface of the port board facing away from the motherboard.

[0013] Optionally, the motherboard has an extended region extending toward one side of the port board, and a port module is disposed on the extended region of the motherboard.

[0014] According to a second aspect of the embodiments of this specification, a communication device is provided, comprising: The circuit board assembly described in any of the above.

[0015] The technical solutions provided in the embodiments of this specification may include the following beneficial effects: In the embodiments described in this specification, the power module of the corresponding port board can avoid the transmission path of the flexible circuit board through the above-mentioned circuit board assembly, so that the high-speed signal transmitted on the flexible circuit board can be closer to the signal input and output port module, shortening the transmission path of the high-speed signal and improving the signal integrity of high-speed signal transmission in the communication device.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this specification and, together with the description, serve to explain the principles of this specification.

[0018] Figure 1 This is a schematic diagram of the structure of a circuit board assembly involved in this application; Figure 2This is a schematic diagram of the structure of a circuit board assembly according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a circuit board assembly according to another embodiment of this application; Figure 4 This is a schematic diagram of the connection between the motherboard and the port board in a circuit board assembly according to an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a communication device involved in this application. Detailed Implementation

[0019] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this specification. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this specification as detailed in the appended claims.

[0020] The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this specification. The singular forms “a,” “the,” and “the” as used in this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0021] It should be understood that although the terms first, second, third, etc., may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this specification, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0022] This application provides a circuit board assembly 100, such as Figure 1-3 As shown, it includes: The motherboard 1 has a processing chip 10, which can be a processor of a communication device or a forwarding chip, depending on the actual needs. The inner layer of the motherboard 1 has high-speed signal lines for transmitting data signals, low-speed signal lines for transmitting power supply signals and control signals, and a ground plane for improving signal transmission quality. The high-speed signal lines, low-speed signal lines and ground plane can be swapped within the motherboard 1 through vias, blind vias and buried vias, and when they extend to the surface of the motherboard 1, they can be connected to other devices through pads. Port board 2, such as Figure 4 As shown, a port module 20 is inserted into the side of the port board 2 away from the motherboard 1. A cutout area 21 is formed on the side of the port board 2 close to the motherboard 1. A connection area 22 is provided on the port board 2 outside the cutout area 21. The port module 20 can be inserted into one or both surfaces of the port board 2. High-speed signal lines, low-speed signal lines, and a ground plane can also be provided in the inner layer of the port board 2. Several pads can be formed in the connection area 22. The power board 3 has a power module on it. Several solder points are formed on one side surface of the power board 3 and are soldered to the solder pads in the connection area 22. The power module can be used to realize voltage conversion, filtering and other processing of the power supply signal based on the motherboard 1, and to supply power to the port module 20 on the port board 2. The processing chip 10 of the motherboard 1 and the port module 20 on the port board 2 are electrically connected through a flexible circuit board 4, and the power board 3 is electrically connected to the port board 2 through the connection area 22.

[0023] Part of the flexible circuit board 4 is integrally formed with the port board 2; another part of the flexible circuit board 4 can be integrally formed with the motherboard 1, or it can be integrally formed with the adapter board and then electrically connected to the pads on the motherboard 1 by means of conductive adhesive or soldering, thereby realizing the electrical connection between the processing chip 10 on the motherboard 1 and the port module 20 on the port board 2. For example, when the flexible circuit board 4 is integrally formed with the port board 2, the motherboard 1, and the adapter board, this part of the flexible circuit board 4 can form a rigid-flexible hybrid pressure plate with the port board 2, the motherboard 1, and the adapter board, that is, the port board 2, the motherboard 1, and the adapter board are formed by pressing the flexible circuit board 4 placed in the inner layer and the rigid circuit board placed in the outer layer.

[0024] Specifically, the motherboard 1 and port board 2 can be integrally formed in the manner described above. Alternatively, the port board 2 and the adapter board can be integrally formed in the manner described above, and then the adapter board can be electrically connected to the motherboard 1. Based on the above integral forming, a portion of the rigid circuit board can be removed to form a structure that can be bent by the flexible circuit board 4. This can be set according to actual needs and is not limited. In addition, when forming the above-mentioned rigid-flexible hybrid pressure board, signal layer switching between the rigid circuit board and the flexible circuit board 4 can be achieved through vias, blind vias, buried vias, etc.

[0025] With the above structure, high-speed and low-speed signals can be transmitted between the motherboard 1 and the port board 2, or between the motherboard 1, the adapter board and the port board 2, through the flexible circuit board 4. Furthermore, the flexible circuit board 4 can be configured to form a bent cross-plane arrangement between the motherboard 1 and the port board 2, or between the adapter board and the port board 2, enabling flexible deployment of various circuit boards within the communication equipment.

[0026] For port board 2, a cutout area 21 can be formed on the side near motherboard 1. The cutout area 21 can be in the form of a cutout or a groove. The outer edge of the cutout area 21 can serve as a connection area 22 for electrical connection with power board 3. High-speed signals and low-speed signals between motherboard 1 and port board 2, or between motherboard 1, adapter board and port board 2, can be transmitted through flexible circuit board 4. Among them, the power supply signal in the low-speed signal is transmitted from motherboard 1 to port board 2 through flexible circuit board 4, and can be transmitted through the pads of connection area 22 to the power module on power board 3 for voltage conversion and filtering, and then transmitted through port board 2 to port module 20 for use.

[0027] The flexible circuit board 4 on one side of the port board 2 can be exposed through the cutout area 21, providing better bending flexibility. This makes the port board 2 easier to deploy within the communication equipment and further shortens the distance between the motherboard 1 and the port board 2, thereby reducing the length of high-speed signal lines on the motherboard 1 and port board 2 and improving the signal integrity of high-speed signal transmission within the communication equipment. Since the cutout area 21, being in a hollowed-out form, allows for more flexible bending of the flexible circuit board 4, the following description will use the hollowed-out form of the cutout area 21 as an example.

[0028] In one possible implementation, such as Figure 2 As shown, the plane where the motherboard 1 is located is orthogonal to the plane where the port board 2 is located. For example, the motherboard 1 can be set on a vertical plane, and the port board 2 can be set on a horizontal plane. The flexible circuit board 4 is formed on both sides of the inner layers of the main board 1 and the port board 2, respectively.

[0029] exist Figure 2In the implementation shown, the motherboard 1 and the port board 2 can be understood as being integrally formed by a rigid-flexible hybrid pressure plate. High-speed signals, power supply signals and low-speed signals between the motherboard 1 and the port board 2 are transmitted through the flexible circuit board 4 inside the motherboard 1 and the port board 2.

[0030] Furthermore, such as Figure 2 As shown, the connection areas 22 of adjacent port boards 2 are arranged opposite each other.

[0031] Since the motherboard 1 may be relatively large, the height difference between its edge and the port board 2 is small. To prevent excessive bending of the flexible circuit board 4 after extending from the edge of the motherboard 1, which could cause breakage of high-speed signal lines, low-speed signal lines, and grounding planes within the flexible circuit board 4, the connection area 22 can be set with opposite planes of adjacent port boards 2. Correspondingly, the power boards 3 on the adjacent port boards 2 are also positioned opposite each other. In this way, after the flexible circuit board 4 extends from the edge of the motherboard 1, it can extend a further length in the vertical plane, allowing for a larger bending radius for the flexible circuit board 4, thereby preventing damage from excessive bending and improving the connection reliability of the communication equipment.

[0032] In another possible implementation, such as Figure 1 As shown, the plane containing the motherboard 1 is parallel to the plane containing the port board 2, meaning that both the motherboard 1 and the port board 2 are positioned on a horizontal plane. Correspondingly, when the motherboard 1 can be set to a smaller size, the flexible circuit board 4 can be formed in the inner layers of both the motherboard 1 and the port board 2. When the motherboard 1 is set to a larger size, it can be set using an adapter board and conductive adhesive. In this case, the flexible circuit board 4 can be formed in the inner layers of both the adapter board and the port board 2, meaning that the adapter board and the port board 2 are integrally formed using a rigid-flexible hybrid pressing plate.

[0033] Optional, such as Figure 3 As shown, the flexible circuit board 4 has two sides formed on the inner layers of the main board 1 and the port board 2, respectively.

[0034] Optional, such as Figure 1 As shown, a pressure pad 12 is formed between the processing chip 10 of the motherboard 1 and the projection area 11 of the port board 2 and the plane where the motherboard 1 is located. That is, when viewed from the top view, the pressure pad 12 is located between the processing chip 10 and the port board 2 at the position of the motherboard 1. The circuit board assembly 100 further includes: Conductive adhesive 5, which can have conductive properties when pressed with a certain force; The adapter board 6 and the main board 1 clamp the conductive adhesive 5. When the conductive adhesive 5 is clamped and pressed together by the adapter board 6 and the main board 1, the conductive adhesive 5 can be electrically connected to the pressure bonding pad 12. Wherein, one end of the flexible circuit board 4 is formed in the inner layer of the adapter board 6, and the other end of the flexible circuit board 4 is formed in the inner layer of the port board 2; Specifically, the conductive adhesive 5 electrically connects the pressure pad 12 and the flexible circuit board 4 inside the adapter plate 6. The adapter plate 6 and the flexible circuit board 4 can be connected by through-holes that extend to the surface of the adapter plate 6 facing the conductive adhesive 5. When the adapter plate 6, the conductive adhesive 5 and the main board 1 are aligned and pressed together, an electrical connection is formed between the main board 1, the conductive adhesive 5, the adapter plate 6 and the flexible circuit board 4 inside the adapter plate 6.

[0035] By using conductive adhesive 5 and adapter board 6, the size of the motherboard 1 is not limited by the position of the flexible circuit board 4 at the edge of the motherboard 1, thus ensuring that the motherboard 1 can accommodate more components and increase the density of circuit boards in communication equipment. On the other hand, since the motherboard 1 and port board 2 are set on parallel planes, the flexible circuit board 4 does not need to be bent to a large radius, shortening the transmission distance of high-speed signal transmission from the motherboard 1 to the port board 2, thereby further improving the signal integrity of high-speed signal transmission in communication equipment.

[0036] Optional, such as Figure 1 , 4 As shown, the adapter plates 6 located on both sides of the motherboard 1 are fixed to the motherboard 1 by a set of fixing screws 60.

[0037] Due to the increased bandwidth, more ports need to be set up in communication equipment to meet the data transmission requirements. Correspondingly, more port boards 2 and flexible circuit boards 4 are needed to realize the electrical connection between the motherboard 1 and the port boards 2 in the communication equipment.

[0038] When signal transmission from motherboard 1 to port board 2 is achieved through conductive adhesive 5, adapter board 6, and flexible circuit board 4, with the addition of port board 2, pressure pads 12 are provided on both sides of motherboard 1. The pressure pads 12 are connected to the processing chip 10 through high-speed signal lines and low-speed signal lines in the inner layer of motherboard 1.

[0039] When the conductive adhesive 5 is pressed onto the adapter plate 6, the adapter plate 6 needs to maintain a certain pressure to ensure a reliable electrical connection between the conductive adhesive 5 and the bonding pad 12. Therefore, the adapter plate 6 needs to be fixed to the motherboard 1 with fixing screws 60 to maintain a reliable pressure. However, since the fixing screws 60 pass through the motherboard 1, the high-speed signal lines and low-speed signal lines on the inner layer of the motherboard 1 need to avoid the fixing screws. In the case of multiple adapter plates 6, the space occupied on the motherboard 1 increases.

[0040] In order to minimize the space occupied by the adapter plate 6 when fixing it, the pressure pads 12 on both sides of the motherboard 1 are set within a defined area, and the pressure plates 6 on both sides are respectively set within the set area. Through holes corresponding to the fixing screws 60 are opened in the set area. Furthermore, the pressure plates 6 on both sides can share several through holes and fixing screws 60 for fixing. In this way, when the number of ports increases, the space occupied by the electrical connection in the form of pressure plates 6 and conductive adhesive 5 on the motherboard is reduced, and the difficulty of deploying circuits and components on the motherboard is reduced.

[0041] Furthermore, such as Figure 1 , 4 As shown, the connection area 22 is disposed on the side surface of the port board 2 facing away from the motherboard 1.

[0042] In the case where electrical connection is achieved through adapter board 6, conductive adhesive 5 and flexible circuit board 4, the connection area 22 is located on the side surface of port board 2 facing away from motherboard 1. In this way, when power board 3 is soldered to connection area 22, it will not block the extension of flexible circuit board 4 to motherboard 1, thereby further shortening the transmission distance of high-speed signals and low-speed signals in communication equipment.

[0043] Optional, such as Figure 1 As shown, the motherboard 1 has an extension region 13 extending toward the port board 2, and a port module 14 is provided on the extension region 13 of the motherboard 1.

[0044] With the motherboard 1 and port board 2 arranged along a horizontal plane, the motherboard 1 can be extended to a position flush with the port board 2, and a port module 14 can be arranged on the extended area 13. In this way, the number of ports in the communication device can be further increased, thereby increasing the overall bandwidth of the communication device.

[0045] Correspondingly, this application also provides a communication device 200, such as Figure 5 As shown, it includes: The circuit board assembly 100 described in any of the above claims.

[0046] The technical solutions provided in the embodiments of this specification may include the following beneficial effects: In the embodiments described in this specification, the power module of the corresponding port board can avoid the transmission path of the flexible circuit board through the above-mentioned circuit board assembly, so that the high-speed signal transmitted on the flexible circuit board can be closer to the signal input and output port module, shortening the transmission path of the high-speed signal and improving the signal integrity of high-speed signal transmission in the communication device.

[0047] Other embodiments of this specification will readily occur to those skilled in the art upon consideration of the specification and practice of the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations that follow the general principles of this specification and include common knowledge or customary techniques in the art not claimed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this specification are indicated by the following claims.

[0048] It should be understood that this specification is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this specification is limited only by the appended claims.

[0049] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A circuit board assembly, characterized in that, include: A motherboard, on which a processing chip is mounted; A port board, wherein a port module is inserted into the side of the port board away from the motherboard, and a cutout area is formed on the side of the port board closer to the motherboard; a connection area is provided on the port board outside the cutout area; and, A power board, on which a power module is mounted; The motherboard's processing chip and the port modules on the port board are electrically connected via a flexible circuit board, and the power board is electrically connected to the port board via the connection area.

2. The circuit board assembly according to claim 1, characterized in that, The plane where the motherboard is located is orthogonal to the plane where the port board is located. The flexible circuit board is formed on both sides of the inner layers of the motherboard and the port board, respectively.

3. The circuit board assembly according to claim 2, characterized in that, The connection areas of adjacent port boards are arranged opposite each other.

4. The circuit board assembly according to claim 1, characterized in that, The plane on which the motherboard is located is parallel to the plane on which the port board is located.

5. The circuit board assembly according to claim 4, characterized in that, The flexible circuit board is formed on both sides of the inner layers of the motherboard and the port board, respectively.

6. The circuit board assembly according to claim 4, characterized in that, A pressure pad is formed between the processing chip on the motherboard and the projection area of ​​the port board onto the plane where the motherboard is located; The circuit board assembly further includes: Conductive adhesive; An adapter board, wherein the adapter board and the main board clamp the conductive adhesive; Wherein, one end of the flexible circuit board is formed in the inner layer of the adapter board, and the other end of the flexible circuit board is formed in the inner layer of the port board; The conductive adhesive electrically connects the pressure pads and the flexible circuit board inside the adapter plate.

7. The circuit board assembly according to claim 6, characterized in that, The adapter plates located on both sides of the motherboard are fixed to the motherboard by a set of fixing screws.

8. The circuit board assembly according to claim 4, characterized in that, The connection area is located on the side surface of the port board facing away from the motherboard.

9. The circuit board assembly according to claim 4, characterized in that, The motherboard has an extended region extending toward one side of the port board, and a port module is disposed on the extended region of the motherboard.

10. A communication device, characterized in that, include: The circuit board assembly according to any one of claims 1-9.

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