A vehicle-mounted lens and its manufacturing method

Abstract

This application discloses an automotive lens and its manufacturing method, including: pre-preparing a lens, a circuit board, and solder; wherein, the lens has a solder post at its tail end, and the circuit board has solder holes; assembling the circuit board at the tail end of the lens, with the solder post and solder both located in the solder holes; controlling a laser device to emit a welding laser towards the solder blocking the solder hole channel, or to emit a welding laser towards a heat transfer element located on the solder, so as to melt the solder and complete the welding between the circuit board and the solder post. When there is no interference from the solder post or the solder is blocked by the heat transfer element, the welding laser can fully melt the solder without irradiating the circuit board, thereby effectively preventing overheating of the circuit board and ensuring its safety.

Description

Technical Field

[0001] This invention relates to the field of automotive lens technology, and more particularly to an automotive lens and its manufacturing method. Background Technology

[0002] In related technologies, vehicle-mounted cameras include lenses and circuit boards. The lens comprises a front housing and a lens body connected together. A solder post is located at the rear of the front housing, and the circuit board is soldered to the solder post. During the soldering process, the circuit board is fitted onto the circuit board, and a solder ring is fitted onto the solder post, positioned on the side of the circuit board away from the lens. Then, the soldering equipment emits a soldering laser towards the solder ring, causing the solder ring to melt and solidify, thereby welding and fixing the solder post to the circuit board.

[0003] However, the above methods also irradiate the circuit board when laser soldering irradiates the solder ring, which greatly affects the circuit board due to heat. For example, the circuit board will deform greatly due to heat and its physical properties will deteriorate. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a vehicle-mounted lens and its manufacturing method, which ensures the safety of the circuit board during the welding of the welding post and the circuit board.

[0005] The preparation method provided in this application adopts the following technical solution:

[0006] A method for manufacturing a vehicle-mounted lens, comprising:

[0007] Prepare the lens, circuit board, and solder in advance; wherein the lens has a solder post at the tail and the circuit has solder holes;

[0008] The circuit board is assembled at the rear of the lens, with the solder posts and solder located in the solder holes;

[0009] The laser device is controlled to emit a welding laser towards the solder that blocks the solder hole channel, or to emit a welding laser towards the heat transfer element 500 located on the solder, so as to melt the solder and complete the welding between the circuit board and the solder pillar.

[0010] According to some embodiments of the present invention, before the laser device is controlled to emit a welding laser, the solder is disposed at the end of the welding column and at least partially located in the welding hole.

[0011] According to some embodiments of the present invention, the solder is spherical or columnar.

[0012] According to some embodiments of the present invention, before controlling the laser device to emit a welding laser, the solder is disposed on the side of the circuit board away from the lens and blocks the port of the weld hole away from the lens.

[0013] According to some embodiments of the present invention, the solder has a protrusion for being embedded in the solder hole.

[0014] According to some embodiments of the present invention, the welding column extends at least partially into the welding hole but does not penetrate the welding hole, and a receiving gap is reserved between the side wall of the welding column and the inner wall of the welding hole.

[0015] According to some embodiments of the present invention, before the laser device is controlled to emit a welding laser, the welding post is disposed through the welding hole, the solder is sleeved on the welding post, and located on the side of the circuit board away from the lens;

[0016] The welding column is also fitted with a heat transfer element, and the solder is located between the circuit board and the heat transfer element. The melting point of the heat transfer element is higher than that of the solder.

[0017] According to some embodiments of the present invention, the lens includes a front housing and a lens body that are assembled and connected, and the welding post is disposed at the rear of the front housing; wherein,

[0018] The preparation method further includes:

[0019] Perform EOL (End-of-Life) testing on the assembled vehicle-mounted camera lens;

[0020] If the test is successful, apply adhesive to the connection between the lens body and the front shell.

[0021] Secondly, this application discloses a vehicle-mounted camera, including:

[0022] The lens includes a front housing and a lens body that are assembled and connected, and the rear end of the front housing is provided with a welding post;

[0023] A circuit board is disposed at the rear of the lens. The circuit board has solder holes, and the solder post is located in the solder holes but does not pass through the solder holes.

[0024] A welding section is provided between the welding column and the welding hole;

[0025] The rear cover is assembled and connected to the tail of the front shell.

[0026] According to some embodiments of the present invention, the welding post does not extend into the welding hole, and the welding portion is disposed at one end of the welding post near the circuit board and is at least partially located in the welding hole.

[0027] According to some embodiments of the present invention, the welded portion is formed by melting solder located within the weld hole.

[0028] According to some embodiments of the present invention, the solder is placed at the end of the weld column and is at least partially located in the weld hole, and the solder is a spherical or columnar body.

[0029] According to some embodiments of the present invention, the welding post extends at least partially into the welding hole and does not extend to the port of the welding hole away from the lens, and the welding portion is disposed between the side of the welding post and the inner wall of the welding hole.

[0030] According to some embodiments of the present invention, the welded portion is formed by melting solder on the side of the circuit board away from the lens.

[0031] According to some embodiments of the present invention, the solder has a protrusion that is embedded in the solder hole.

[0032] Thirdly, this application discloses a vehicle-mounted camera, including:

[0033] The lens includes a front housing and a lens body that are assembled and connected, and the rear end of the front housing is provided with a welding post;

[0034] A circuit board is disposed at the rear of the lens, the circuit board has solder holes, and the solder posts are connected to the solder holes;

[0035] The welding section is located between the side of the welding column and the inner wall of the welding hole;

[0036] A heat transfer element is sleeved on the outside of the welding column and disposed on the side of the circuit board away from the lens;

[0037] The rear cover is assembled and connected to the tail of the front shell.

[0038] According to some embodiments of the present invention, the welding part is formed by melting solder that is sleeved on the welding post and located between the circuit board and the heat transfer element, wherein the melting point of the solder is lower than the melting point of the heat transfer element.

[0039] According to some embodiments of the present invention, the heat transfer element is a copper ring and the solder is a tin ring.

[0040] As can be seen from the above technical solution, the present invention has the following advantages: the welding post does not extend into or pass through the weld hole, and the solder can be shielded in the channel of the weld hole. With this configuration, the welding laser emitted by the laser equipment can fully irradiate the channel of the weld hole, thereby fully irradiating the solder. Under the irradiation of the welding laser, the solder melts and solidifies to complete the welding connection between the circuit board and the welding post. It is understood that without the interference of the welding post, the channel of the weld hole has sufficient space for the welding laser to irradiate the solder without irradiating the circuit board, thus effectively preventing overheating of the circuit board and ensuring its safety.

[0041] Alternatively, the solder is located on the side of the circuit board away from the lens. A heat transfer element is located on this side of the circuit board. The welding laser emitted by the laser equipment irradiates the heat transfer element, which heats the solder, melting it to complete the welding connection between the circuit board and the solder post. Understandably, after the solder melts, the heat transfer element effectively prevents the welding laser from irradiating the circuit board, thus effectively avoiding overheating and ensuring the safety of the circuit board. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0043] Figure 1 This is a schematic diagram of the manufacturing process of the vehicle-mounted lens disclosed in the embodiments of this application;

[0044] Figure 2 This is a schematic diagram of the detection process structure of the vehicle-mounted camera disclosed in an embodiment of this application;

[0045] Figure 3 This is a schematic diagram of the structure of the first type of vehicle-mounted lens before welding, as disclosed in the embodiments of this application;

[0046] Figure 4 This is a schematic diagram of the structure of the first type of vehicle-mounted lens after welding, as disclosed in the embodiments of this application;

[0047] Figure 5 This is a schematic diagram of the structure of the second type of vehicle-mounted lens before welding, as disclosed in the embodiments of this application;

[0048] Figure 6 This is a schematic diagram of the structure of the second type of vehicle-mounted lens after welding, as disclosed in the embodiments of this application;

[0049] Figure 7 This is a schematic diagram of the structure of the third type of vehicle-mounted lens before welding, as disclosed in the embodiments of this application;

[0050] Figure 8 This is a schematic diagram of the structure of the third type of vehicle-mounted lens after welding, as disclosed in the embodiments of this application.

[0051] Explanation of reference numerals in the attached figures:

[0052] 100. Lens; 110. Front housing; 111. Mounting hole; 112. Stepped surface; 120. Lens body; 121. Mounting boss; 130. Solder post; 140. Encapsulating adhesive; 200. Circuit board; 210. Solder hole; 300. Solder; 310. Welded part; 320. Plate part; 330. Protrusion; 400. Rear cover; 500. Heat transfer component Detailed Implementation

[0053] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.

[0054] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0055] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0056] Please see Figure 1 This application discloses a method for manufacturing a vehicle-mounted lens 100, comprising:

[0057] S100: Prepare a lens 100, a circuit board 200, and solder 300 in advance; wherein, the lens 100 is provided with a solder post 130 at its tail and the circuit is provided with a solder hole 210.

[0058] The solder 300 can be made of tin, silver solder 300 or other materials; and the lens 100 is provided with a welding post 130 at the tail end. More precisely, the lens 100 includes a front shell 110 and a lens body 120. The lens body 120 is assembled and connected to the front shell 110, and the welding post 130 is riveted or otherwise fixedly connected to the tail end of the front shell 110.

[0059] S200, the circuit board 200 is assembled at the tail of the lens 100, and the solder post 130 and the solder 300 are both located in the solder hole 210.

[0060] S300, control the laser device to emit a welding laser towards the solder 300 that is blocking the channel of the weld hole 210 (see also...) Figure 3 ), or emit a welding laser onto the heat transfer element 500 located on the solder 300 (see also... Figure 7 This allows the solder 300 to melt and complete the welding between the circuit board 200 and the solder post 130.

[0061] The circuit board 200 is mounted on the rear of the lens 100; more precisely, the rear of the lens 100 is positioned towards the side of the circuit board 200. All solder posts 130 are located in the solder holes 210, meaning the solder posts 130 face the solder holes but do not extend into them; or, the solder posts 130 extend into the solder holes 210 but do not extend to the port of the solder hole 210 away from the lens 100; or, the solder posts 130 completely penetrate the solder holes 210. The specific configuration depends on actual needs and will be explained in detail later. The solder 300 is located in the solder holes 210; for example, some or all of the solder 300 may be located within the solder holes 210, or at the port of the solder hole 210, as will be explained in detail later.

[0062] Specifically, the solder post 130 does not extend into or pass through the solder hole 210, and the solder 300 can be shielded in the channel of the solder hole 210. With this configuration, the welding laser emitted by the laser equipment can fully irradiate the channel of the solder hole 210, thereby fully irradiating the solder 300. Under the irradiation of the welding laser, the solder 300 melts and solidifies to complete the welding connection between the circuit board 200 and the solder post 130. It can be understood that without the interference of the solder post 130, the channel of the solder hole 210 has sufficient space to irradiate the solder 300 without irradiating the circuit board 200, thus effectively preventing overheating of the circuit board 200 and ensuring its safety.

[0063] Alternatively, the solder 300 is located on the side of the circuit board 200 away from the lens 100. A heat transfer element 500 is provided on the side of the solder 300 away from the circuit board 200. The welding laser emitted by the laser device irradiates the heat transfer element 500, which heats the solder 300, causing it to melt and thus completing the welding connection between the circuit board 200 and the solder post 130. It is understood that after the solder 300 melts, the heat transfer element 500 can effectively prevent the welding laser from irradiating the circuit board 200, thereby effectively avoiding overheating of the circuit board 200 and ensuring its safety.

[0064] In some embodiments, please refer to Figure 3 and Figure 4 Before the laser equipment emits the welding laser, solder 300 is placed at the end of the welding post 130 and at least partially located in the welding hole 210. With this arrangement, the welding post 130 does not penetrate the welding hole 210, and the welding laser can irradiate the solder 300 located on the welding post 130 from the port of the welding hole 210 away from the lens 100. The solder 300 melts under the action of the welding laser, thereby achieving the welding between the welding post 130 and the circuit board 200.

[0065] Understandably, with the solder 300 arranged as described above, at least part of the solder 300 is located within the solder hole 210. The welding laser can irradiate the solder 300 through the port of the solder hole 210, thereby melting the solder 300 and ensuring a stable weld connection between the solder post 130 and the circuit board 200. Understandably, when the welding laser irradiates the solder hole 210, without interference from the solder post 130, the welding laser can fully irradiate the solder 300 within the solder hole 210 without irradiating the circuit board, thus ensuring the safety of the circuit board. Furthermore, the solder 300 arrangement described above is relatively simple and convenient for the production and manufacturing of automotive lenses.

[0066] Furthermore, the solder 300 can be spherical. Firstly, the solder 300 absorbs the welding laser energy more uniformly, effectively preventing localized overheating or failure to melt. The welding laser is a single-point high-energy beam with extremely rapid heating and high heat concentration; the spherical solder is an omnidirectional curved surface, ensuring uniform energy distribution across the spherical surface regardless of the laser's incident angle. This avoids the problem of localized overheating or insufficient heat absorption at edges, which can lead to poor welding results. Secondly, the spherical solder 300 has regular geometry, a fixed center, and dimensional tolerances controlled within micrometers, allowing for precise alignment with the laser spot center. Combined with a vision positioning system, this enables offset-free welding. Thirdly, the spherical solder 300 has balanced surface tension and a minimal surface area. During melting, the liquid solder contracts inward due to surface tension, eliminating sharp edges and stress concentration, preventing localized boiling and solder balling / splattering. Simultaneously, the oxide layer is extremely thin, free of impurities and bubbles, eliminating the risk of short circuits and maximizing solder joint cleanliness after welding. Of course, in other possible embodiments, the weldment may be designed as a column or other shape.

[0067] Instead of the solder 300 configuration described above, in some embodiments, please refer to... Figure 5 and Figure 6Before the laser equipment emits the welding laser, solder 300 is placed on the side of the circuit board 200 away from the lens 100, and blocks the port of the solder hole 210 away from the lens 100. Specifically, solder 300 includes a board body 320 and a protrusion 330. The protrusion 330 is disposed on the side of the board body 320. When the board body 320 is placed on the side of the circuit board 200 away from the lens 100, the protrusion 330 is embedded in the solder hole 210. When the circuit board 200 is welded to the solder post 130, the welding laser irradiates the part of the board body 320 located in the solder hole 210. The solder 300 melts under the action of the welding laser and flows into the solder hole 210, thereby realizing the welding between the solder post 130 and the circuit board 200.

[0068] Understandably, with the aforementioned structural form, the solder 300 allows for convenient laser irradiation onto it, melting the solder. Simultaneously, the protrusion 330 of the solder 300, located in the solder hole, ensures uniform flow of the solder 300 into the solder hole 210, thereby achieving soldering between the solder post 130 and the circuit board 200. Furthermore, the solder 300's arrangement is simple and facilitates the manufacturing of automotive lenses.

[0069] In some embodiments, please refer to Figure 5 and Figure 6 The solder post 130 extends at least partially into the solder hole 210, but does not penetrate the solder hole 210; that is, the solder post 130 does not extend to the port of the solder hole 210 away from the lens 100, and a receiving gap is reserved between the side wall of the solder post 130 and the inner wall of the solder hole 210. The solder 300 can be placed directly on the solder post 130, or the solder 300 can be placed directly on the side of the circuit board 200 away from the lens 100.

[0070] In practical applications, the solder 300 melts under the action of a welding laser. The molten solder 300 flows into the receiving gap between the side wall of the welding post 130 and the inner wall of the welding hole 210. After the solder 300 solidifies, it welds the welding post 130 to the circuit board 200. This arrangement provides a sufficiently large contact area between the welding post 130 and the circuit board 200, thus ensuring that the circuit board 200 is securely connected to the welding post 130.

[0071] Instead of the aforementioned solder 300 shielding material disposed on the solder hole 210 channel, in some embodiments, please refer to... Figure 7 and Figure 8Before the laser equipment emits the welding laser, the welding post 130 is inserted through the welding hole 210, that is, the welding post 130 passes through the port of the welding hole 210 away from the lens 100. The solder 300 is annular and is fitted onto the welding post 130, located on the side of the circuit board 200 away from the lens 100. A heat transfer element 500 is fitted onto the welding post 130, and the solder 300 is located between the circuit board 200 and the heat transfer element 500. The melting point of the heat transfer element 500 is higher than that of the solder 300. For example, the heat transfer element 500 is a copper ring, and the solder 300 is a tin ring.

[0072] In practical applications, the welding equipment emits a welding laser onto the heat transfer element 500, which transfers heat to the solder 300. The solder 300 transforms from a solid state to a molten state and flows into the weld hole 210, filling the gap between the weld post 130 and the inner wall of the weld hole 210. The molten solder 300 solidifies between the weld post 130 and the inner wall of the weld hole 210, thereby achieving the welding of the weld post 130 to the circuit board 200. It is understood that, through the design of the heat transfer element 500, when the solder 300 is heated to a molten state, the heat transfer element 500 itself does not melt, thus effectively blocking the welding laser and preventing it from irradiating the circuit board 200.

[0073] In some embodiments, please refer to Figure 2 and Figure 8 The lens 100 includes a front housing 110 and a lens body 120 that are assembled and connected, and the welding post 130 is disposed at the tail of the front housing 110. The manufacturing method further includes A1 to A2.

[0074] A1 performs an EOL test on the assembled vehicle-mounted lens 100.

[0075] If the test is successful, apply adhesive to the connection between the lens body 120 and the front shell 110.

[0076] The front housing 110 is provided with a mounting hole 111. The side wall of the mounting hole 111 is provided with a stepped surface 112 facing the head of the front housing 110. The side of the lens body 120 is provided with a mounting boss 121. When the lens body 120 is assembled into the mounting hole 111, the mounting boss 121 is assembled and connected in the mounting hole 111 and is sealed and connected with the stepped surface 112 by a sealing ring.

[0077] Specifically, after the welding post 130 is welded to the circuit board 200, the vehicle-mounted lens 100 also includes a rear cover 400, the periphery of which is connected to the periphery of the front housing 110 of the lens 100. Then, the assembled vehicle-mounted lens 100 undergoes an end-of-life (EOL) test. If the EOL test is passed, adhesive is applied to the connection between the lens body 120 and the front housing 110; that is, encapsulating adhesive 140 is dripped into the mounting hole 111 and solidifies on the side of the mounting boss 121 away from the step surface 112, thereby encapsulating the connection between the lens body 120 and the front housing 110. If the EOL test fails, the lens 100 and circuit board 200 are recycled. This design effectively avoids the waste of expensive encapsulation costs and reduces rework and disassembly costs.

[0078] This application discloses a vehicle-mounted camera; please refer to [link / reference]. Figure 3 and Figure 4 The system includes a lens 100, a circuit board 200, a soldering part 310, and a rear cover 400. The lens 100 includes a front housing 110 and a lens body 120. The front housing 110 has a mounting hole 111, and the side wall of the mounting hole 111 has a stepped surface 112 facing the head of the front housing 110. The side of the lens body 120 has a mounting boss 121. When the lens body 120 is assembled into the mounting hole 111, the mounting boss 121 is assembled and connected to the stepped surface 112, and is sealed to the stepped surface 112 by a sealing ring. The circuit board 200 is located at the rear of the lens 100 and has soldering holes 210. The rear of the front housing 110 has a soldering post 130, which is located in the soldering hole 210 but does not penetrate it. The soldering part 310 is soldered between the soldering post 130 and the soldering hole 210. The rear cover 400 is assembled and connected to the rear of the front housing 110.

[0079] Specifically, when the circuit board 200 is assembled at the tail of the lens 100, the solder post 130 does not extend into or pass through the solder hole 210, that is, it does not pass through the port of the solder hole 210 away from the lens 100. Therefore, the solder 300 forming the solder joint 310 can be shielded from the channel of the solder hole 210 during installation. With this arrangement, the welding laser can fully irradiate the channel of the solder hole 210, thereby fully irradiating the solder 300. The welding laser melts the solder 300 to form the solder joint 310, thus completing the welding between the circuit board 200 and the solder post 130. It is understood that with the above-described arrangement, the solder post 130 does not interfere with the welding laser irradiating the solder 300. When the welding laser fully irradiates the solder 300, it does not irradiate the circuit board 200, effectively preventing overheating of the circuit board 200 and ensuring its safety.

[0080] In some embodiments, please refer to Figure 3 and Figure 4The solder post 130 does not extend into the solder hole 210. The solder portion 310 is disposed at one end of the solder post 130 near the circuit board 200 and is at least partially located in the solder hole 210. For example, solder 300 is placed at the end of the solder post 130 and is at least partially located in the solder hole 210. The solder portion 310 is formed by melting the solder 300 located in the solder hole 210.

[0081] Understandably, with the solder 300 arranged as described above, at least part of the solder 300 is located within the solder hole 210. The welding laser can irradiate the solder 300 through the port of the solder hole 210, thereby melting the solder 300 and ensuring a stable weld connection between the solder post 130 and the circuit board 200. Understandably, when the welding laser irradiates the solder hole 210, without interference from the solder post 130, the welding laser can fully irradiate the solder 300 within the solder hole 210 without irradiating the circuit board, thus ensuring the safety of the circuit board. Furthermore, the solder 300 arrangement described above is relatively simple and convenient for the production and manufacturing of automotive lenses.

[0082] Furthermore, the solder 300 can be spherical. Firstly, the solder 300 absorbs the welding laser energy more uniformly, effectively preventing localized overheating or failure to melt. The welding laser is a single-point high-energy beam with extremely rapid heating and high heat concentration; the spherical solder is an omnidirectional curved surface, ensuring uniform energy distribution across the spherical surface regardless of the laser's incident angle. This avoids the problem of localized overheating or insufficient heat absorption at edges, which can lead to poor welding results. Secondly, the spherical solder 300 has regular geometry, a fixed center, and dimensional tolerances controlled within micrometers, allowing for precise alignment with the laser spot center. Combined with a vision positioning system, this enables offset-free welding. Thirdly, the spherical solder 300 has balanced surface tension and a minimal surface area. During melting, the liquid solder contracts inward due to surface tension, eliminating sharp edges and stress concentration, preventing localized boiling and solder balling / splattering. Simultaneously, the oxide layer is extremely thin, free of impurities and bubbles, eliminating the risk of short circuits and maximizing solder joint cleanliness after welding. Of course, in other possible embodiments, the weldment may be designed as a column or other shape.

[0083] In some embodiments, please refer to Figure 5 and Figure 6The welding post 130 extends at least partially into the welding hole 210, but does not extend to the port of the welding hole 210 away from the lens 100. The welding part 310 is disposed between the side of the welding post 130 and the inner wall of the welding hole 210. In this way, the welding part 310 can make the welding post 130 and the circuit board 200 firmly welded together. In one specific embodiment, the welding part 310 is formed by melting the solder 300 located on the side of the circuit board 200 away from the lens 100. For example, the solder 300 includes a plate body 320 and a protrusion 330. The protrusion 330 is disposed on the side of the plate body. When the plate body 320 is placed on the side of the circuit board 200 away from the lens 100, the protrusion 330 is embedded in the welding hole 210. When the circuit board 200 is welded to the solder post 130, the welding laser irradiates the part of the board body 320 located in the solder hole 210. More precisely, the welding laser is set towards the solder hole 210, and the solder 300 melts under the action of the welding laser, thereby realizing the welding between the solder post 130 and the circuit board 200.

[0084] Understandably, with the aforementioned structural form, the solder 300 allows for convenient laser irradiation onto it, melting the solder. Simultaneously, the protrusion 330 of the solder 300, located in the solder hole, ensures uniform flow of the solder 300 into the solder hole 210, thereby achieving soldering between the solder post 130 and the circuit board 200. Furthermore, the solder 300's arrangement is simple and facilitates the manufacturing of automotive lenses.

[0085] This application discloses a vehicle-mounted camera 100; please refer to [link / reference needed]. Figure 7 and Figure 8 The system includes a lens 100, a circuit board 200, a soldering part 310, a heat transfer element 500, and a rear cover 400. The lens 100 includes a front housing 110 and a lens body 120 that are assembled and connected. A solder post 130 is provided at the rear end of the front housing 110. The circuit board 200 is located at the rear end of the lens 100 and has solder holes 210. The solder post 130 passes through and connects to the solder holes 210. The soldering part 310 is soldered between the side of the solder post 130 and the inner wall of the solder hole 210. The heat transfer element 500 is sleeved on the outside of the solder post 130 and is located on the side of the circuit board 200 away from the lens 100. The rear cover 400 is assembled and connected to the rear end of the front housing 110. The heat transfer element 500 can be a copper ring, and the solder 300 can be a tin ring.

[0086] In practical applications, the welding equipment emits a welding laser onto the heat transfer element 500, which transfers heat to the solder 300. The solder 300 transforms from a solid state to a molten state and flows into the weld hole 210, filling the gap between the weld post 130 and the inner wall of the weld hole 210. Then, the molten solder 300 solidifies between the side wall of the weld post 130 and the inner wall of the weld hole 210, thereby achieving the welding of the weld post 130 to the circuit board 200. It is understood that, through the arrangement of the heat transfer element 500, when the heat transfer element 500 heats the solder 300 to a molten state, the melting point of the solder 300 is lower than the melting point of the heat transfer element 500, so the heat transfer element 500 does not melt. This effectively blocks the welding laser, preventing it from irradiating the circuit board 200, thus ensuring the safety of the circuit board 200.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. A method for manufacturing a vehicle-mounted lens, characterized in that, include: Prepare the lens, circuit board, and solder in advance; wherein the lens has a solder post at the tail and the circuit has solder holes; The circuit board is assembled at the rear of the lens, with the solder posts and solder located in the solder holes; The laser device is controlled to emit a welding laser towards the solder that blocks the solder hole channel, or to emit a welding laser towards the heat transfer element 500 located on the solder, so as to melt the solder and complete the welding between the circuit board and the solder pillar.

2. The preparation method according to claim 1, characterized in that, Before the laser device is controlled to emit the welding laser, the solder is placed at the end of the welding column and at least partially located in the welding hole.

3. The preparation method according to claim 2, characterized in that, The solder is spherical or columnar.

4. The preparation method according to claim 1, characterized in that, Before the laser device emits the welding laser, the solder is placed on the side of the circuit board away from the lens and covers the port of the weld hole away from the lens.

5. The preparation method according to claim 4, characterized in that, The solder has a raised portion, which is used to be embedded in the solder hole.

6. The preparation method according to any one of claims 2-5, characterized in that, The welding column extends at least partially into the welding hole but does not penetrate the welding hole, and a accommodating gap is reserved between the side wall of the welding column and the inner wall of the welding hole.

7. The preparation method according to claim 1, characterized in that, Before the laser equipment emits the welding laser, the welding column is inserted into the welding hole, and the solder is sleeved on the welding column and located on the side of the circuit board away from the lens. The welding column is also fitted with a heat transfer element, and the solder is located between the circuit board and the heat transfer element. The melting point of the heat transfer element is higher than that of the solder.

8. The preparation method according to claim 1, characterized in that, The lens includes a front housing and a lens body that are assembled and connected, and the welding post is disposed at the rear of the front housing; wherein, The preparation method further includes: Perform EOL (End-of-Life) testing on the assembled vehicle-mounted camera lens; If the test is successful, apply adhesive to the connection between the lens body and the front shell.

9. A vehicle-mounted lens, characterized in that, include: The lens includes a front housing and a lens body that are assembled and connected, and the rear end of the front housing is provided with a welding post; A circuit board is disposed at the rear of the lens. The circuit board has solder holes, and the solder post is located in the solder holes but does not pass through the solder holes. A welding section is provided between the welding column and the welding hole; The rear cover is assembled and connected to the tail of the front shell.

10. The vehicle-mounted lens according to claim 9, characterized in that, The welding post does not extend into the welding hole, and the welding part is located at one end of the welding post near the circuit board and is at least partially located in the welding hole.

11. The vehicle-mounted lens according to claim 10, characterized in that, The welded portion is formed by melting the solder located within the weld hole.

12. The vehicle-mounted lens according to claim 11, characterized in that, The solder is placed at the end of the weld column and is at least partially located within the weld hole. The solder is spherical or columnar.

13. The vehicle-mounted lens according to claim 9, characterized in that, The welding column extends at least partially into the welding hole and does not extend to the port of the welding hole away from the lens. The welding portion is disposed between the side of the welding column and the inner wall of the welding hole.

14. The vehicle-mounted lens according to claim 13, characterized in that, The welded portion is formed by melting solder on the side of the circuit board away from the lens.

15. The vehicle-mounted lens according to claim 14, characterized in that, The solder has a raised portion, which is embedded in the solder hole.

16. A vehicle-mounted lens, characterized in that, include: The lens includes a front housing and a lens body that are assembled and connected, and the rear end of the front housing is provided with a welding post; A circuit board is disposed at the rear of the lens, the circuit board has solder holes, and the solder posts are connected to the solder holes; The welding section is located between the side of the welding column and the inner wall of the welding hole; A heat transfer element is sleeved on the outside of the welding column and disposed on the side of the circuit board away from the lens; The rear cover is assembled and connected to the tail of the front shell.

17. The vehicle-mounted lens according to claim 10, characterized in that, The welding part is formed by melting solder that is sleeved on the welding column and located between the circuit board and the heat transfer component. The melting point of the solder is lower than that of the heat transfer component.

18. The vehicle-mounted lens according to claim 17, characterized in that, The heat transfer element is a copper ring, and the solder is a tin ring.

Images