Circuit board slot processing methods and circuit board processing equipment

Abstract

This application relates to the field of circuit board processing technology, and discloses a method and equipment for processing circuit board slots. The method for processing circuit board slots includes: analyzing the drilling data of the slot, obtaining the processing area of ​​the slot and dividing it into a first hole area, a last hole area, and an intermediate hole area; drilling in the first hole area to form a blind hole; drilling in the last hole area to form a second through hole; drilling in the first hole area to form a first through hole; and drilling in the intermediate hole area to form a third through hole. The first through hole, the second through hole, and the third through hole constitute the slot. Because the depth of the first hole is controlled first instead of being directly drilled, the remaining substrate at the un-drilled position of the first hole can support the drilling tool during the subsequent processing of the last hole. This solves the problem of uneven force on both sides of the drilling tool causing hole deformation, thereby improving the processing quality of ultra-short slots.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, specifically to a method for processing slots in circuit boards and circuit board processing equipment. Background Technology

[0002] As PCB manufacturing processes become more refined, the size of slots is getting smaller and smaller. In some scenarios, ultra-short slots are being used more and more, which gradually increases the difficulty of manufacturing them.

[0003] In existing technologies, milling can be used to process ultra-short slots, but because the milling cutter has a small diameter, it is prone to breakage during processing, which increases production costs. To save costs, drilling can also be used to process ultra-short slots, for example, by drilling multiple partially overlapping through holes to eventually form a complete slot. However, during the drilling of partially overlapping through holes, uneven force on the tool can easily lead to deformation, causing the tool to deviate from the intended machining position, thus affecting the machining quality. Summary of the Invention

[0004] In order to overcome the problems existing in the prior art, the main objective of this application is to provide a method for processing slots in circuit boards and a circuit board processing equipment.

[0005] To achieve the above objectives, this application specifically adopts the following technical solution: According to a first aspect of the present application, a method for processing slots in a circuit board is provided, comprising: parsing the drilling data of the slot to obtain the processing area of ​​the slot; decomposing the processing area of ​​the slot into a first hole area, a last hole area, and an intermediate hole area; drilling in the first hole area to form a blind hole; drilling in the last hole area to form a second through hole, wherein the blind hole intersects with the second through hole; drilling in the first hole area to form a first through hole, wherein the first through hole is coaxial with the blind hole; and drilling in the intermediate hole area to form a third through hole, wherein the first through hole, the second through hole, and the third through hole constitute the slot.

[0006] The circuit board slot hole processing method according to the embodiments of this application has at least the following beneficial effects: during processing, the depth of the first hole is controlled instead of being directly drilled. Therefore, in the subsequent processing of the tail hole, the remaining substrate at the position of the undrilled first hole can support the drilling tool, which solves the problem of hole deformation caused by uneven force on both sides of the drilling tool, thereby improving the processing quality of ultra-short slot holes.

[0007] Optionally, the circuit board includes multiple slots, and the method specifically includes: parsing the drill data of each slot to obtain the processing area of ​​each slot; decomposing the processing area of ​​each slot into the first hole area, the last hole area, and the intermediate hole area; drilling all the first hole areas to form blind holes; drilling all the last hole areas to form second through holes; drilling all the first hole areas to form first through holes; and drilling all the intermediate hole areas to form third through holes.

[0008] Optionally, the diameters of the first through hole, the second through hole, the third through hole, and the blind hole are equal.

[0009] Optionally, the centers of the first through hole, the second through hole, and the third through hole are located on the same baseline, and the first through hole, the third through hole, and the second through hole are arranged at equal intervals.

[0010] Optionally, the step of drilling a third through hole in the intermediate hole region specifically includes: drilling a third through hole in the intermediate hole region; or drilling at least two third through holes in the intermediate hole region, wherein the first through hole, at least two third through holes, and the second through hole are arranged at equal intervals.

[0011] Optionally, at least two of the third through holes include a third through hole a and a third through hole b; the step of drilling to form at least two of the third through holes in the intermediate hole region specifically includes: drilling to form a third through hole a in the intermediate hole region, wherein the distance between the third through hole a and the first through hole is minimal; drilling to form a third through hole b in the intermediate hole region, wherein the distance between the third through hole b and the second through hole is minimal.

[0012] Optionally, the step of drilling in the first hole area to form the blind hole specifically includes: drilling in the first hole area using a drilling tool to form the blind hole, wherein the depth of the blind hole is equal to the diameter of the drilling tool.

[0013] Optionally, after the step of parsing the drill tape data of the slot, and before the step of decomposing the processing area of ​​the slot into the first hole area, the last hole area, and the middle hole area, the method further includes: setting a preset judgment threshold K1, obtaining the length and width of the slot and calculating the aspect ratio K2, and when the aspect ratio K2 of the slot is less than or equal to the threshold K1, determining that the current type of the slot is an ultra-short slot, and performing the processing method as described above.

[0014] Optionally, the method for obtaining the length and width of the slot and calculating the aspect ratio K2 specifically includes: obtaining the diameter D of the drilling tool, parsing the drill strip program to obtain the length L of the slot, and the aspect ratio K2 = ((L+D) / D).

[0015] Optionally, the step of determining the current slot type specifically includes: if the aspect ratio of the slot is greater than the threshold, then the slot to be processed is determined to be a normal slot; the processing method of the circuit board slot further includes performing the step of processing a normal slot on the normal slot.

[0016] According to a second aspect of the present application, a circuit board processing device is provided, comprising: a spindle for drilling holes in a circuit board; and a controller communicatively connected to the spindle, wherein the controller controls the spindle to perform the circuit board slot hole processing method as described in any one of the embodiments of the first aspect according to a preset drilling program.

[0017] The circuit board processing equipment according to the embodiments of this application has at least the following beneficial effects: the controller controls the spindle to process the circuit board according to the circuit board slot processing method described in the first aspect, thereby reducing the manual involvement in the determination of the ultra-short slot processing area and the spindle's ultra-short slot processing process in the processing area, which is conducive to improving process consistency, improving the processing quality of ultra-short slots on the circuit board, improving circuit board processing efficiency, and thus improving the overall quality of the circuit board.

[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0019] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of a method for processing slot holes in a circuit board according to an embodiment of this application, which shows a side view of the structural changes in the drilling of the circuit board during the processing. Figure 2 This is a schematic diagram of a method for processing slots in a circuit board according to an embodiment of this application, showing a top view of the structural changes in the circuit board during the drilling process. Figure 3 This is a top view showing the structural changes of the circuit board slot hole processing method in another embodiment of this application, which illustrates the structural changes of drilling holes in the circuit board during the processing. Figure 4 This is a flowchart of the method for processing circuit board slots in the embodiments of this application; Figure 5 This is a schematic diagram of the processing flow of the circuit board processing equipment in the embodiments of this application.

[0020] Reference numerals: circuit board 100, processing area 101, ultra-short slot 102, drilling tool 103, blind hole 104, baseline 201, first through hole 202, second through hole 203, third through hole 204, third through hole a301, third through hole b302. Detailed Implementation

[0021] The following will clearly and completely describe the concept and technical effects of this application in conjunction with embodiments, so as to fully understand the purpose, features and effects of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are all within the scope of protection of this application.

[0022] In the description of the embodiments of this application, if directional descriptions are involved, such as "up", "down", "front", "back", "left", "right" etc., indicating the directional or positional relationship based on the directional or positional relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or device referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0023] In the description of the embodiments of this application, if a feature is referred to as "setting," "fixing," "connecting," or "installing" on another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, connected, or installed on the other feature. In the description of the embodiments of this application, if "several" is involved, it means one or more; if "multiple" is involved, it means two or more; if "greater than," "less than," or "exceeds," it should be understood as excluding the stated number; if "above," "below," or "within," it should be understood as including the stated number. If "first" or "second" is involved, it should be understood as used to distinguish technical features, and not as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0024] Combination Figures 1 to 4 This application discloses a method for processing slot holes on a circuit board, comprising: determining an ultra-short slot 102 according to a drilling program, and obtaining a processing area 101 for the ultra-short slot 102; and processing the ultra-short slot 102 on the circuit board 100 in the processing area 101. This allows for the processing of the ultra-short slot 102 specifically within the determined processing area 101 during the processing of the circuit board 100, ensuring the orderly progress of the circuit board 100 processing.

[0025] Combination Figures 1 to 4A method for processing a slot hole in a circuit board according to an embodiment of this application includes: parsing the drilling data of the slot hole to obtain a processing area 101 of the slot hole; decomposing the processing area 101 of the slot hole into a first hole area, a last hole area, and an intermediate hole area; drilling in the first hole area to form a blind hole 104; drilling in the last hole area to form a second through hole 203, wherein the blind hole 104 intersects with the second through hole 203; drilling in the first hole area to form a first through hole 202, wherein the first through hole 202 is coaxial with the blind hole 104; and drilling in the intermediate hole area to form a third through hole 204, wherein the first through hole 202, the second through hole 203, and the third through hole 204 constitute a slot hole. Because the depth of the first hole is controlled instead of being directly drilled, the remaining substrate at the undrilled position of the first hole can support the drilling tool 103 during the subsequent machining of the tail hole. This solves the problem of uneven force on both sides of the drilling tool 103 causing hole deformation, thereby improving the machining quality of the ultra-short slot hole 102.

[0026] Understandably, the drilling program is the core instruction file used in the manufacturing of the printed circuit board 100 to guide the drilling equipment in drilling operations. It is essentially a procedural document containing all the necessary CNC instructions to drive the drilling tool 103 to drill holes at precise coordinate positions on the circuit board 100, thereby completing the hole-forming process of the circuit board 100. This program file defines the hole position coordinate system through a standardized format and integrates key technical parameters such as tool parameters (radius, material, etc.), movement path, and drilling tool 103 coordination. Therefore, determining the ultra-short slot 102 and obtaining the processing area 101 of the ultra-short slot 102 can be achieved by parsing the drilling program. The processing area 101 on the circuit board 100 is the area for processing the ultra-short slot 102; in the drilling program, this is reflected in the coordinates of the first hole center, the coordinates of the last hole center, and the slot width. In the machining area 101, a first hole or a tail hole is formed by drilling. The central axis of the drilling tool 103 is moved to the center of the target hole (blind hole 104, first through hole 202, second through hole 203 or third through hole 204) by controlling the drilling tool 103, and then feeds along the Z-axis.

[0027] For example, in some methods, the drill strip program for the ultra-short slot 102 with coordinates X0Y0 and X0.5Y0 is M18Z0.6; X0Y0; M19; X0.5Y0; X0Y0; X0.25Y0. Wherein, coordinates X0Y0G85X0.5Y0 represent the need to process an ultra-short slot 102 with the first hole coordinates being X0Y0 and the last hole coordinates being X0.5Y0. M18Z0.6 represents the execution of the depth control command (M18), which drills in the first hole area to form a blind hole 104 with a depth Z of 0.7 and a depth control coordinate of X0Y0 (first hole coordinates). Then, the depth control command is terminated by executing M19, followed by drilling through X0.5Y0 (drilling in the last hole area to form a second through hole 203), then drilling through X0Y0 (drilling in the first hole area to form a first through hole 202), and finally drilling through X0.25Y0 (drilling in the middle hole area to form a third through hole 204).

[0028] Combination Figure 1 It can be understood that S1 is the drilling of a blind hole 104 by the drilling tool 103 in the first hole area; S2 is a side view of the circuit board 100 after the blind hole 104 is processed; S3 is the drilling of a second through hole 203 in the tail hole area; S4 is a side view of the circuit board 100 after the second through hole 203 is processed; during the processing, the un-drilled part at the first hole position provides mechanical support for the drilling tool 103 to prevent its deformation; S5 is the drilling of a first through hole 202 in the first hole area; and S6 is a side view of the circuit board 100 after the first through hole 202 is processed. The top view of the slot at this point can be combined with... Figure 2 and Figure 3 It is understood that S7 is to drill a hole in the middle hole area to form a third through hole 204. After S7 is completed, the first through hole 202, the second through hole 203 and the third through hole 204 form a slot.

[0029] In some methods, the circuit board 100 includes multiple slots. Specifically, the method includes: parsing the drilling data for each slot to obtain the processing area 101 of each slot; decomposing the processing area 101 of each slot into a first hole area, a last hole area, and a middle hole area; drilling all first hole areas to form blind holes 104; drilling all last hole areas to form second through holes 203; drilling all first hole areas to form first through holes 202; and drilling all middle hole areas to form third through holes 204. Firstly processing all blind holes 104 in the processing areas 101 simplifies the drilling process. This is because the processing method for ordinary slots typically involves first processing the edge holes (equivalent to the first or last holes of the ultra-short slot 102) and finally processing the middle holes (equivalent to the middle holes of the ultra-short slot 102). The processing sequence is similar. Therefore, after processing the blind holes 104, the unfinished instructions for the ultra-short slot 102 can be completed together with the ordinary slots, simplifying the drilling process and facilitating parsing. For example, if three slots need to be machined, including two ultra-short slots 102 and one ordinary slot, the first hole depth control command for the two ultra-short slots 102 can be executed first (machine blind holes 104). Then, all tail holes and the rear holes of the ordinary slot can be machined sequentially (the optimal machining route can be obtained by analyzing the drill strip program). Then, all first hole drilling commands can be executed (drilling holes in the first hole area to form the first through hole 202) and the front holes of the ordinary slot can be machined. Finally, all intermediate holes and the middle holes of the ordinary slot can be machined to form two ultra-short slots 102 and one ordinary slot.

[0030] For example, in some methods, the drilling program for machining the ultra-short slot 102 with two coordinates X0Y0, X0.5Y0 and X10Y0, X10.5Y0 is M18Z0.6, X0Y0, X10Y0, M19, X0.5Y, X10.5Y, X0Y0, X10Y0, X0.25Y0, X10.25Y0. Wherein, (M18Z0.6, X0Y0, X10Y0) represents first executing the M18 depth control command (machining blind hole 104), with depth control coordinates of X0Y0 and X10Y0, which are the coordinates of the first hole of the two ultra-short slot holes 102 to be machined. Then, the M19 depth control command is executed to terminate the depth control. Next, the (X0.5Y, X10.5Y) drilling command is executed, which is to machine the tail hole of the two ultra-short slot holes 102 to be machined. Then, the (X0Y0, X10Y0) drilling command is executed, which is to open the first hole of the two ultra-short slot holes 102 to be machined. Finally, the (X0.25Y0, X10.25Y0) drilling command is executed, which is to machine the middle hole of the two ultra-short slot holes 102 to be machined.

[0031] Another possible approach is to first complete the initial hole depth control commands for all machining areas 101, and then process each ultra-short slot 102 one by one. For example, if three ultra-short slots 102 need to be machined, after completing the initial hole depth control commands for all three ultra-short slots 102, execute the commands for tail hole machining (drilling in the tail hole area to form a second through hole 203), initial hole drilling (drilling in the initial hole area to form a first through hole 202), and intermediate hole machining (drilling in the intermediate hole area to form a third through hole 204) for the first ultra-short slot 102 to form the first ultra-short slot 102. Then, execute the commands for tail hole machining, initial hole drilling, and intermediate hole machining for the second ultra-short slot 102 to form the second ultra-short slot 102, and so on. Sequential machining can reduce the frequency of reciprocating movement of the drilling tool 103 and improve machining efficiency.

[0032] Another possible approach is to first complete the first hole depth control command for all ultra-short slots 102 when the slots to be machined include ordinary slots, and then process each ultra-short slot 102 and ordinary slot one by one. Based on the coordinates of the ultra-short slots 102 and ordinary slots, the path that allows the drilling tool 103 to move the minimum range is determined.

[0033] Combination Figure 2 and Figure 3 In some methods, the diameters of the first through hole 202, the second through hole 203, the third through hole 204, and the blind hole 104 are equal. The equal diameter of each drilled hole means that only the same specification of drilling tool 103 needs to be used during the machining process, eliminating the need to change drilling tools 103 and improving machining efficiency.

[0034] Combination Figure 2 and Figure 3 In some methods, the centers of the first through hole 202, the second through hole 203, and the third through hole 204 are located on the same baseline 201, and the first through hole 202, the third through hole 204, and the second through hole 203 are arranged at equal intervals. Having the centers of the three drilled holes on the same baseline 201 improves the machining efficiency of the ultra-short slot 102 formed. Figure 2 and Figure 3 The flatness of the ultra-short slot 102 shown can be improved, and when the drilling tool 103 executes the tail hole machining command, the surface of the drilling tool 103 on the side of the first hole is subjected to more uniform support force, and when the intermediate hole machining command is executed, the mechanical support force on both sides of the first hole and the tail hole is also more uniform.

[0035] Understandably, in some technologies, the deviation of the center of the intermediate hole from the baseline 201 during processing is within the normal range of processing fluctuations and does not affect the quality of the final formed ultra-short slot 102. The equidistant arrangement of the first through hole 202, the third through hole 204, and the second through hole 203 can further improve the uniformity of the force on the drilling tool 103 during processing, thereby reducing the deformation of the ultra-short slot 102 and improving the flatness of the ultra-short slot 102.

[0036] It is understandable that the distance between the centers of two adjacent drilled holes may not be equal. When machining the intermediate hole, the drilling tool 103 can deviate towards the first or last hole to adapt to different machining scenarios and machining equipment with different precision.

[0037] Combination Figure 2 and Figure 3 It is understandable that the step of drilling a third through hole 204 in the intermediate hole area specifically includes: drilling a third through hole 204 in the intermediate hole area; or drilling at least two third through holes 204 in the intermediate hole area, with the first through hole 202, at least two third through holes 204, and the second through hole 203 arranged at equal intervals. Machining one or more third through holes 204 in the intermediate hole area while maintaining equal intervals between adjacent through holes can further improve the uniformity of force on the drilling tool 103 (i.e., the drilling tool 103) during machining, thereby reducing the deformation of the ultra-short slot 102 and improving the flatness of the ultra-short slot 102.

[0038] Combination Figure 3 It is understandable. Figure 3 The process includes two third through holes 204, namely third through hole a301 and third through hole b302. The step of drilling at least two third through holes 204 in the intermediate hole region specifically includes: drilling third through hole a301 in the intermediate hole region, wherein the distance between third through hole a301 and first through hole 202 is minimized; drilling third through hole b302 in the intermediate hole region, wherein the distance between third through hole b302 and second through hole 203 is minimized. Third through hole a301 is closer to the first hole, and third through hole b302 is closer to the tail hole. Machining the intermediate hole closer to the first hole first can optimize the movement path of the drilling tool 103. After the drilling tool 103 controls the depth of the first hole, the tail hole is machined, and then the first hole is opened. At this time, the drilling tool 103 is closer to the first hole. Therefore, the next step of machining the intermediate hole closer to the first hole can reduce the movement path of the drilling tool 103 and improve the machining efficiency.

[0039] It is understandable that the middle holes near the tail hole can be machined first, followed by the middle holes near the head hole, which can also form the ultra-short slot 102. It is also understandable that when the number of middle holes is odd, after the head hole is drilled, the middle hole in the very center can be machined first, followed by the middle holes on both sides. For example, if there are three middle holes, and the order from the head hole to the tail hole is hole 1, hole 2, and hole 3, then one possible implementation is to drill hole 2 first, followed by holes 1 and 3, after the head hole is drilled to form the ultra-short slot 102.

[0040] Combination Figure 2 and Figure 3 In some technologies, the step of drilling a blind hole 104 in the first hole area specifically includes: drilling a blind hole 104 in the first hole area using a drilling tool 103, wherein the depth of the blind hole 104 is equal to the diameter of the drilling tool 103. The depth of the blind hole 104 being equal to the diameter of the tool simplifies the drilling process, reduces analytical difficulty, and improves machining efficiency. Figure 1 The end of the drilling tool 103 usually has a tapered structure to facilitate drilling into the circuit board 100. This part is called the ineffective tip. In order to make the diameter of the blind hole 104 formed after the first hole depth control step is equal to that of the final first hole, the ineffective tip needs to be drilled into the circuit board 100 in the depth control step. This allows the main body of the drilling tool 103 to participate in the drilling. Combining the structural characteristics of the drilling tool 103, the above purpose can be achieved by making the depth of the blind hole 104 equal to the diameter of the tool. This also makes it possible for the drilling program to not need to adjust different depth control depths. The tool diameter data can be directly input into the depth control depth in the drilling program.

[0041] It is understood that this application is for processing ultra-short slots 102 on circuit board 100 and solves the deformation fluctuation problem of drilling tool 103. Therefore, the diameter of drilling tool 103 is relatively small, and there will be no situation where the diameter of drilling tool 103 is greater than the thickness of circuit board 100. Therefore, the depth of blind hole 104 is equal to the diameter of the tool, which can meet the depth control requirements while simplifying the drilling process.

[0042] Understandably, the depth parameters of the first hole control can also be set individually based on parameters such as the length of the ultra-short slot 102, the diameter of the drilling tool 103, and the thickness of the circuit board 100, so as to design an appropriate control depth for different types of circuit boards 100.

[0043] It is understandable that blind hole 104 and the first hole can be machined with tools of different diameters. For example, blind hole 104 can be machined with a tool of smaller diameter. When machining the first hole, the tool is drilled into the position of blind hole 104. The smaller diameter blind hole 104 acts as a guide hole, making the drilling of the first hole smoother and the position more accurate.

[0044] Combination Figure 4 Understandably, after parsing the drill tape data of the slots and before decomposing the slot processing area into the first hole area, the last hole area, and the middle hole area, the circuit board slot processing method also includes: setting a preset judgment threshold K1; parsing all slots to be processed according to the drill tape program, obtaining the length and width of the slots, and calculating the aspect ratio K2; when the aspect ratio K2 of the slot is less than or equal to the threshold, the current slot type is determined to be an ultra-short slot 102. The ultra-short slot 102 is processed in processing area 101 using the circuit board slot processing method. For different production needs, the definition of ultra-short slot 102 varies on different circuit boards 100; therefore, setting the threshold K1 can satisfy various production needs, thereby determining and obtaining all ultra-short slots 102 and their coordinates. For example, in the processing of some circuit boards 100, the circuit board slot processing method is only used when the aspect ratio of the slot is less than or equal to 2. In this case, the determination threshold K1 is set to 2, and all slots to be processed are analyzed to obtain and calculate the aspect ratio. When the aspect ratio is less than or equal to 2, the circuit board slot processing method in the embodiment of this application is used.

[0045] Combination Figure 2 It is understandable that slots are typically oblong, with semi-circular ends and a rectangular middle section. By analyzing the drilling program to process all slots, the length of the middle rectangle can be determined from the coordinates of the first and last holes in the slot. Then, the radii of the arcs at both ends of the slot can be obtained within the drilling program. Using this data, the length and width of the slot can be calculated. Alternatively, the processing area 101 can be pre-defined on the circuit board 100, and its length and width can be measured to calculate the aspect ratio. This eliminates the need for parameters such as the tool diameter, and the obtained length and width are more intuitive.

[0046] Combination Figure 2It is understandable that the method for obtaining the length and width of the slot and calculating the aspect ratio K2 includes: obtaining the diameter D of the drilling tool 103, parsing the drill strip program to obtain the length L of the slot, and the aspect ratio = ((L+D) / D). The slot is usually an oblong hole with semi-circular arcs at both ends and a rectangle in the middle. In some methods, it is not necessary to change the tool. The diameter of the drilling tool 103 is the diameter D of the semi-circular arcs at both ends of the slot, and the length of the middle rectangle is the distance L between the center of the first hole and the center of the last hole. The length of the slot is equal to the diameter (the sum of the radii of the two semi-circular arcs) plus the length L, and the width is equal to the diameter D. Therefore, the aspect ratio = ((L+D) / D). This calculation formula can improve the calculation efficiency, thereby improving the efficiency of judging and processing ultra-short slots 102. For example, if the threshold K1 is set to 2.0mm, and the diameter D of the drilling tool 103 is identified as 0.5mm, the center coordinates of the first hole are X0Y0, and the center coordinates of the last hole are X0.3Y0, then L=0.3mm is obtained. According to the algorithm, the aspect ratio K2=1.6mm is calculated, which is less than the judgment threshold K1, and the current slot type is determined to be an ultra-short slot 102.

[0047] Combination Figure 4 It is understandable that the method for determining the slot type also includes: if the aspect ratio of the slot is greater than a threshold, then the slot to be processed is determined to be a normal slot; the processing method for circuit board slots also includes performing the steps for processing normal slots. Adding the determination and processing steps for normal slots to the processing method can improve the applicability of the circuit board slot processing method, enabling the processing of circuit board 100 that simultaneously contains both ultra-short slots 102 and normal slots.

[0048] Understandably, machining a standard slot can be achieved using a tool with a diameter equal to or slightly smaller than the slot width, drilled on a CNC drilling machine to create a series of overlapping circular holes along the slot path to form the slot shape. Alternatively, positioning holes can be drilled at both ends of the slot first, followed by the middle holes to reduce uneven drill bit stress and potential misalignment. Another approach is to first machine the front and rear holes at both ends of the slot, and then machine the multiple middle holes.

[0049] Combination Figure 4 and Figure 5An embodiment of this application discloses a circuit board processing device, comprising: a drilling tool 103 for drilling a circuit board 100; and a controller, communicatively connected to the drilling tool 103, which controls the drilling tool 103 according to a preset drilling program to implement the circuit board slot processing method of this application embodiment. Using the controller to control the drilling tool 103 to process the circuit board 100 according to the circuit board slot processing method described in the first aspect reduces manual intervention in determining the ultra-short slot 102 processing area 101 and the drilling process of the ultra-short slot 102 within the processing area 101. This improves process consistency, enhances the processing quality of the ultra-short slot 102 on the circuit board 100, increases the processing efficiency of the circuit board 100, and ultimately improves the overall quality of the circuit board 100.

[0050] The processing flow of the circuit board processing equipment can be referred to as follows: the production line issues the drilling program, the controller obtains the drilling program and parses the slot to be processed, and converts the drilling program according to the slot type (for example, for ordinary slots, the original ordinary slot drilling program is maintained, and for ultra-short slots 102, the drilling program used in the aforementioned ultra-short slot 102 processing method is used). The controller issues the drilling program to the drilling tool 103 to process the circuit board 100.

[0051] A circuit board 100 according to an embodiment of this application is prepared using the circuit board slot processing method of the embodiment of this application. The ultra-short slot 102 on the circuit board 100 first undergoes depth control, so that the remaining substrate at the undrilled first hole position can support the drilling tool 103, solving the problem of hole deformation caused by uneven force on both sides of the drilling tool 103. The quality of the ultra-short slot 102 is improved, and the overall quality of the circuit board 100 is also improved.

[0052] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A method for processing slot holes on a circuit board, characterized in that, include: Analyze the drill tape data of the slot to obtain the machining area of ​​the slot; The processing area of ​​the slot is divided into the first hole area, the last hole area, and the middle hole area. A blind hole is formed by drilling in the area of ​​the first hole. A second through hole is formed by drilling in the tail hole area, wherein the blind hole intersects with the second through hole; A first through hole is formed by drilling in the first hole area, wherein the first through hole is coaxial with the blind hole; A third through hole is formed by drilling in the intermediate hole area, and the first through hole, the second through hole, and the third through hole constitute the slot.

2. The method for processing circuit board slots according to claim 1, characterized in that, The circuit board includes multiple slots, and the method specifically includes: Analyze the drill tape data for each slot to obtain the machining area for each slot; The processing area of ​​each slot is decomposed into the first hole area, the tail hole area, and the middle hole area; Drill holes in all of the aforementioned first hole areas to form blind holes; Drill holes in all of the aforementioned tail hole areas to form a second through hole; Drill holes in all of the aforementioned first hole areas to form the first through hole; Drill holes in all the intermediate hole areas to form a third through hole.

3. The method for processing circuit board slots according to claim 1, characterized in that, The diameters of the first through hole, the second through hole, the third through hole, and the blind hole are equal.

4. The method for processing circuit board slots according to claim 1, characterized in that, The centers of the first through hole, the second through hole, and the third through hole are located on the same baseline, and the first through hole, the third through hole, and the second through hole are arranged at equal intervals.

5. The method for processing circuit board slots according to claim 1, characterized in that, The step of drilling a third through hole in the intermediate hole region specifically includes: A third through hole is formed by drilling in the intermediate hole region; Alternatively, at least two third through holes may be formed by drilling in the intermediate hole region, with the first through hole, at least two third through holes, and the second through hole arranged at equal intervals.

6. The method for processing circuit board slots according to claim 5, characterized in that, At least two of the third through holes include a third through hole a and a third through hole b; the step of drilling holes in the intermediate hole region to form at least two of the third through holes specifically includes: A third through hole a is formed by drilling in the intermediate hole region, wherein the distance between the third through hole a and the first through hole is minimal; A third through hole b is formed by drilling in the intermediate hole region, wherein the distance between the third through hole b and the second through hole is the smallest.

7. The method for processing circuit board slots according to claim 1, characterized in that, The specific steps of drilling a hole in the first hole area to form the blind hole include: The blind hole is formed by drilling in the first hole area using a drilling tool, and the depth of the blind hole is equal to the diameter of the drilling tool.

8. The method for processing circuit board slots according to any one of claims 1-7, characterized in that, After the step of analyzing the drill tape data of the slot, and before the step of decomposing the machining area of ​​the slot into the first hole area, the last hole area, and the intermediate hole area, the method further includes: Preset judgment threshold K1; Obtain the length and width of the slot and calculate the aspect ratio K2. When the aspect ratio K2 of the slot is less than or equal to the threshold K1, determine that the current type of the slot is an ultra-short slot and execute the processing method as described in any one of claims 1-7.

9. The method for processing circuit board slots according to claim 8, characterized in that, The method for obtaining the length and width of the slot and calculating the aspect ratio K2 specifically includes: Obtain the diameter D of the drilling tool, analyze the drill strip program to obtain the length L of the slot, and the length-to-width ratio K2 = ((L+D) / D).

10. Circuit board processing equipment, characterized in that, include: Spindle, used for drilling holes in circuit boards; A controller is communicatively connected to the spindle, and the controller controls the spindle to perform the circuit board slot hole processing method as described in any one of claims 1 to 9 according to a preset drilling program.

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