A high-frequency, high-speed PCB metal substrate surface treatment system

Abstract

This invention discloses a high-frequency, high-speed PCB metal substrate surface treatment system, specifically relating to the field of PCB metal substrate processing. It includes: a raw board carrier acquisition module comprising a board conveying platform, clamping components, board height acquisition components, thickness acquisition components, and board number reading components, used to receive stainless steel raw board, target PCB lamination dimensions, and target hole position data; acquiring the initial external dimensions, initial board height, initial thickness, and initial clamping position of the stainless steel raw board according to the board number; and outputting raw board data; and a heat setting and retesting module comprising a heat setting device, a cooling carrier platform, board height retesting components, thickness retesting components, and external shape retesting components. Through heat setting and retesting, post-heat data is generated, and the number of migration points, migration points, and hole deviations are statistically analyzed according to the point migration lines, ensuring that the final lamination area avoids the concentrated area of ​​post-heat reference migration, relatively reducing the risk of a room-temperature qualified area becoming an inaccurate reference area.

Description

Technical Field

[0001] This invention relates to the field of PCB metal substrate processing technology, and more specifically, to a high-frequency, high-speed PCB metal substrate surface treatment system. Background Technology

[0002] In the processing of 5G communication high-frequency and high-speed PCB metal substrates for integrated circuit manufacturing, the existing processing mainly focuses on obtaining stainless steel electronic lamination steel plates that meet the factory specifications at room temperature. In production, stainless steel plates are subjected to grinding, leveling, straightening, heat treatment and cutting in sequence. Then, the quality of the plates is judged by testing surface roughness, flatness, parallelism, thickness tolerance, hole spacing tolerance, diagonal tolerance, hardness, thermal conductivity and coefficient of thermal expansion. In multi-stage HDI board lamination scenarios, stainless steel metal substrates need to continuously provide lamination support surfaces and positioning references during insulation layer bonding, multi-layer lamination, hole alignment, and repeated heating and cooling. As the board thickness increases, the hole spacing decreases, and the lamination temperature increases, the springback traction formed by the board edges, corners, clamping positions, and locally hardened areas during heat treatment and subsequent lamination will be transferred to the originally intended effective lamination area. On-site, this manifests as the board material that passed the final inspection at room temperature exhibiting an increased edge height difference in the effective lamination area, local thickness residual shift, change in diagonal traction direction, and deviation of the positioning hole reference relative to the lamination surface after heating. This makes the qualified area originally determined by the overall board shape unsuitable as the reference surface for subsequent PCB lamination. The technical problem to be solved by this application is: how to redetermine the final effective area of ​​lamination, the datum for positioning holes and the final cutting edge line based on the thermal datum migration results during the surface treatment of high-frequency and high-speed PCB metal substrates, so as to avoid the qualified area at room temperature from being transformed into the inaccurate datum area under high-temperature lamination conditions. Summary of the Invention

[0003] To overcome the aforementioned deficiencies of the prior art, embodiments of the present invention provide a high-frequency, high-speed PCB metal substrate surface treatment system. This system performs original board acquisition, heat-setting retesting, candidate pressing area screening, migration particle calculation, and final benchmark output on a stainless steel metal substrate. Based on the post-heating board surface migration results, the final pressing area, final hole processing benchmark, and final cutting edge line are redefined to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a high-frequency, high-speed PCB metal substrate surface treatment system, comprising: The original board carrying acquisition module includes a board conveying platform, clamping components, board height acquisition components, thickness acquisition components, and board number reading components. It is used to receive stainless steel original board, target PCB lamination dimensions, and target hole position data, and to acquire the initial external dimensions, initial board height, initial thickness, and initial clamping position of the stainless steel original board according to the board number, and output the original board data. The heat setting and retesting module includes a heat setting device, a cooling support platform, a plate height retesting component, a thickness retesting component, and a shape retesting component. It is used to receive stainless steel substrates that have completed grinding pretreatment, perform heat setting, cooling support, and in-situ retesting according to the plate number, collect the post-heating shape dimensions, post-heating plate height, and post-heating thickness of the stainless steel substrate, and output post-heating data. The candidate reference generation module receives original board data, post-thermal data, target PCB lamination dimensions, and target hole position data. It moves the target PCB lamination dimensions within the stainless steel substrate using the row and column spacing of the board height acquisition points as steps, generating a set of candidate lamination areas. Each candidate lamination area is then linked to the target hole position data, candidate hole area, and candidate cut-off area. The module calculates the number of entry points of the candidate cut-off area after thermal processing into the candidate lamination area, the number of exit points of the candidate lamination area after thermal processing, the hole offset of the candidate hole area relative to the candidate lamination area, and the area of ​​the candidate cut-off area. These are then sorted in ascending order by the number of entry points, the number of exit points, the hole offset, and the area of ​​the candidate cut-off area. The candidate lamination area with the sequence number 1 is selected as the greedy reference, and the candidate reference data is output.

[0005] In a preferred embodiment, the system further includes: The migration particle calculation module receives candidate reference data and post-heating data. It uses a greedy reference as the first particle position and generates the remaining particle positions based on the candidate pressing areas that are sorted in the later stages. It uses the pressing area lateral displacement, pressing area longitudinal displacement, pressing area corner displacement, four-sided cutting edge inward displacement, hole area lateral displacement, and hole area longitudinal displacement as particle position fields. For each particle position, it calculates the number of migration points, the number of migration points, hole offset, absolute value of the pressing area height difference, and candidate excised area area to form a particle sorting sequence. In each round, it reads the current particle position, the particle position with individual index 1, and the particle position with group index 1. It takes the median value of the three sorted values ​​for each particle position field to generate the particle position field for the next round. When the median value is the same as the current particle position field, it moves the current particle position field to the particle position field with group index 1 by one acquisition step until no unevaluated particle positions are generated in the current round, and outputs the migration particle data. The final reference output module is used to receive migration particle data, target PCB lamination dimensions and target hole position data, read the position of particle with sequence number 1 in the particle sorting sequence, determine the candidate lamination area in the particle position as the final lamination area, write the transverse displacement and longitudinal displacement of the hole area in the particle position into the final hole processing reference, write the inward movement of the four sides of the cutting edge in the particle position into the final cutting edge line, and output the surface treatment data of the metal substrate for surface reprocessing, hole processing and final cutting.

[0006] In a preferred embodiment, the original board carrying acquisition module includes: The sheet material conveying platform is used to carry stainless steel raw sheets. Clamping components are located on both sides of the sheet material conveying platform and are used to fix the stainless steel raw sheets. The sheet height acquisition component is located above the sheet material conveying platform and is used to acquire the initial sheet height. The thickness acquisition component is located on the feeding side of the sheet material conveying platform and is used to acquire the initial thickness. The sheet number reading component is located at the feeding end of the sheet material conveying platform and is used to read the sheet number. Receive the stainless steel original plate, target PCB lamination dimensions and target hole position data, read the plate number through the plate number reading component, and write the plate number, target PCB lamination dimensions and target hole position data into the original plate record; The stainless steel plate is fixed by a clamping assembly. The boundary position where the clamping assembly contacts the stainless steel plate is collected as the initial clamping position. An in-plate coordinate system is established with one long side and one short side of the stainless steel plate. The initial external dimensions, initial plate height and initial thickness are collected in the in-plate coordinate system. The plate number, target PCB lamination dimensions, target hole data, initial clamping position, initial external dimensions, initial plate height and initial thickness are merged and the original plate data is output.

[0007] In a preferred embodiment, the heat setting retesting module includes: The heat setting device is used to receive the stainless steel substrate that has completed the grinding pretreatment and perform heat setting. The cooling support platform is connected to the discharge side of the heat setting device and is used to support the stainless steel substrate after heat setting. The plate height re-measuring component is located above the cooling support platform and is used to collect the plate height after heat setting. The thickness re-measuring component is located on one side of the cooling support platform and is used to collect the thickness after heat setting. The shape re-measuring component is located on the periphery of the cooling support platform and is used to collect the shape dimensions after heat setting. The system receives a stainless steel substrate that has undergone grinding pretreatment, reads the substrate number, writes the substrate number into the post-heating record, performs heat setting on the stainless steel substrate using a heat setting device, and holds the heat-set stainless steel substrate on a cooling support platform. Using the in-plate coordinate system in the original plate data as the coordinate system for retesting, the thermally heated outer dimensions, thermally heated plate height, and thermally heated thickness of the stainless steel substrate are collected under the coordinate system for retesting. The plate number, thermally heated outer dimensions, thermally heated plate height, and thermally heated thickness are merged and the thermally heated data is output.

[0008] In a preferred embodiment, the execution of the candidate benchmark generation module includes: Receive original board data, post-thermal data, target PCB lamination dimensions and target hole position data, read the board coordinate system, row spacing and column spacing of board surface height acquisition points in the original board data, place the lower left corner of the target PCB lamination dimension in the board coordinate system at each board surface height acquisition point in the board coordinate system, and retain the position where all four sides of the target PCB lamination dimension are within the post-thermal outline dimensions, and generate a candidate lamination area set; For each candidate pressing area in the candidate pressing area set, the center coordinates of each hole in the target hole position data are translated according to the coordinates of the lower left corner of the candidate pressing area to generate a candidate hole area. The area within the thermal outline size and located outside the candidate pressing area is generated as a candidate cut-off area. The candidate pressing area, candidate hole area and candidate cut-off area are written into the candidate reference record.

[0009] In a preferred embodiment, the execution of the candidate benchmark generation module further includes: Pair each initial board height acquisition point in the original board data with the post-heated board height acquisition points in the post-heated data that have the same row and column numbers. Read the initial coordinates and post-heated coordinates of each pair of acquisition points. Connect the initial coordinates and post-heated coordinates to form point migration lines. Count the number of point migration lines whose initial coordinates are located in the candidate cutting area and whose post-heated coordinates are located in the candidate pressing area as the number of migration points. Count the number of point migration lines whose initial coordinates are located in the candidate pressing area and whose post-heated coordinates are located outside the candidate pressing area as the number of migration points. Read the migration lines of each point located in the candidate hole area with initial coordinates. Subtract the initial abscissa from the thermally heated abscissa of each migration line to obtain the hole lateral displacement. Subtract the initial ordinate from the thermally heated ordinate of each migration line to obtain the hole longitudinal displacement. Add the absolute values ​​of all hole lateral displacements and all hole longitudinal displacements to obtain the hole offset. Multiply the lateral length and longitudinal length of the candidate excision area to obtain the area of ​​the candidate excision area. Sort the candidate reference records in ascending order by the number of migration points, the number of migration points, the hole offset, and the area of ​​the candidate excision area. Take the candidate pressing area with the sequence number 1 as the greedy reference and output the candidate reference data.

[0010] In a preferred embodiment, the execution of the migrating particle computation module includes: Receive candidate reference data and post-heating data, read the greedy reference, candidate pressing zone set, point migration line, and row and column spacing of plate height acquisition points, write the greedy reference as the first particle position, and write the candidate pressing zones that are sorted later in the candidate pressing zone set as the remaining particle positions in sequence. Write the pressing zone lateral displacement, pressing zone longitudinal displacement, pressing zone corner displacement, four-sided cutting edge inward displacement, hole area lateral displacement, and hole area longitudinal displacement in each particle position.

[0011] In a preferred embodiment, the execution of the migrating particle computing module further includes: For each particle position, a particle pressing zone is generated according to the lateral displacement, longitudinal displacement, and angular displacement of the pressing zone; a particle hole zone is generated according to the lateral displacement and longitudinal displacement of the hole zone; and a particle excision zone is generated according to the inward inclination of the four sides. The number of migration lines of points whose initial coordinates are in the particle excision zone and whose post-heating coordinates are in the particle pressing zone is counted as the number of migration points. The number of migration lines of points whose initial coordinates are in the particle pressing zone and whose post-heating coordinates are outside the particle pressing zone is counted as the number of migration points. The migration lines of points whose initial coordinates are in the particle hole zone are read and the hole offset is obtained by summing the absolute values ​​of the hole lateral displacement and the absolute values ​​of the hole longitudinal displacement. The height of each post-heating plate surface in the particle pressing zone is read and the absolute value of the height difference of the pressing zone is obtained by summing the absolute values ​​of the height differences of adjacent collection points. The area of ​​the particle excision zone is calculated. The number of entry points, number of exit points, hole deviation, absolute value of the height difference of the pressing zone, and area of ​​the particle removal zone for each particle position are arranged in ascending order to form a particle sorting sequence. The particle position with sorting number 1 in the epoch of the same particle is taken as the individual particle position with sorting number 1. The particle position with sorting number 1 in the epoch of all particles is taken as the group particle position with sorting number 1.

[0012] In a preferred embodiment, the execution of the migrating particle computing module further includes: In each round, the current particle position, the position of the particle with individual index 1, and the position of the particle with group index 1 are read. The middle value of the three values ​​after sorting the lateral displacement of the pressing zone, the longitudinal displacement of the pressing zone, the inward retraction of the four-sided cutting edge, the lateral displacement of the hole area, and the longitudinal displacement of the hole area is used to generate the field value for the next round. The middle value of the three values ​​after sorting the corner value of the pressing zone is used to generate the corner value for the next round. If the field value of the next round is the same as the current field value, the current field value is moved once to the same field of the particle position with group index 1 according to the column spacing or row spacing. If the corner value of the next round is the same as the current corner value, the current corner value is moved once to the pressing zone corner value of the particle position with group index 1 according to the minimum corner formed by the adjacent collection points. This process continues until all the particle positions generated in the current round have existed in the particle positions of the previous rounds. The migrated particle data is then output.

[0013] In a preferred embodiment, the execution of the final benchmark output module includes: Receive migration particle data, target PCB lamination dimensions, and target hole position data. Read the position of particle number 1 in the particle sorting sequence. Generate the final lamination area according to the lamination area lateral displacement, lamination area longitudinal displacement, and lamination area rotation amount in the lamination area of ​​particle number 1. Add the hole area lateral displacement and hole area longitudinal displacement in the particle position of particle number 1 to the center coordinates of each hole in the target hole position data to generate the final hole processing reference. Read the inward reduction of the four sides of the particle position with serial number 1, shift the left boundary of the heated outer dimension to the right by the inward reduction of the left side of the cut edge, shift the right boundary to the left by the inward reduction of the right side of the cut edge, shift the lower boundary upward by the inward reduction of the lower side of the cut edge, and shift the upper boundary downward by the inward reduction of the upper side of the cut edge to generate the final cut edge line. Combine the plate number, the final pressing area, the final hole processing reference and the final cut edge line, and output the surface treatment data of the metal substrate.

[0014] The technical effects and advantages of this invention are as follows: By generating post-heating data through heat setting and retesting, and by counting the number of migration points, migration points and hole deviations according to the point migration lines, the final pressing zone avoids the concentrated area of ​​post-heating reference migration, thereby relatively reducing the risk of the qualified area at room temperature becoming an inaccurate reference area. By generating candidate pressing area sets grid by grid and selecting greedy references, the post-heating dimensions, candidate cut area area, and hole position offset are all included in the region screening, so that the pressing area selection no longer depends solely on the overall plate shape, which relatively improves the pressing reference placement results. By calculating the migration particles, the transverse displacement, longitudinal displacement, angular displacement, hole area translation, and inward retraction of the four-sided cutting edge are adjusted synchronously, so that the pressing area, hole processing datum, and cutting edge line converge to the same particle position, thereby reducing the deviation caused by determining the three separately. By using the board number to connect the original board data, post-heating data, candidate reference data, and metal substrate surface treatment data, the same processing results are read for surface reprocessing, hole processing, and final cutting, which relatively enhances the data continuity of subsequent processes. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the system modules of the present invention. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Refer to the instruction manual appendix Figure 1The present invention provides a high-frequency, high-speed PCB metal substrate surface treatment system, comprising: The original board carrying acquisition module includes a board conveying platform, clamping components, board height acquisition components, thickness acquisition components, and board number reading components. It is used to receive stainless steel original board, target PCB lamination dimensions, and target hole position data, and to acquire the initial external dimensions, initial board height, initial thickness, and initial clamping position of the stainless steel original board according to the board number, and output the original board data. In this embodiment, the original board bearing acquisition module is used to form an original record associated with the same board number before the stainless steel original board enters the heat setting retest. This ensures that subsequent post-heat data pairing, candidate pressing area generation, point migration line statistics, hole deviation calculation, and final cutting edge generation are all based on the same board object. The target PCB pressing dimensions include at least the lateral length, longitudinal length, and direction of the pressing area. The target hole position data includes at least the hole number, hole center abscissa, hole center ordinate, and hole diameter. The hole center abscissa and hole center ordinate take the lower left corner of the target PCB pressing dimensions as the origin. After completing the board number reading, clamping position recording, board coordinate system establishment, and initial data acquisition, the original board bearing acquisition module outputs the original board data. The hardware layout of the original plate carrying and acquisition module is used to define the relative position of the stainless steel original plate during carrying, clamping, number reading, height acquisition, and thickness acquisition. The plate conveying platform carries the stainless steel original plate and conveys it from the feed end to the discharge end. The clamping components are located on both sides of the plate conveying platform and contact the two sides of the stainless steel original plate. The plate height acquisition component is located above the plate conveying platform and acquires the plate height in both the horizontal and vertical directions. The thickness acquisition component is located on the feed side of the plate conveying platform and acquires the thickness as the stainless steel original plate passes through the feed side. The plate number reading component is located at the feed end of the plate conveying platform and reads the plate number on the surface of the stainless steel original plate. The plate height acquisition component generates the row number, column number, initial horizontal coordinate, initial vertical coordinate, and initial height of the acquisition point. The thickness acquisition component generates the thickness acquisition position and initial thickness. The plate number reading component generates the plate number. When the plate number is not read, the plate conveying platform stops conveying to the discharge end and does not generate an original plate record. Acquisition continues after the plate number is reread. The original board bearing acquisition module first writes the external process data under the board number to avoid the target PCB lamination size and target hole position data being deviating from the actual board. After receiving the stainless steel original board, target PCB lamination size, and target hole position data, it reads the board number through the board number reading component and checks whether the target PCB lamination size has the lamination area's lateral length, longitudinal length, and direction. It also checks whether each hole in the target hole position data has a hole number, hole center x-coordinate, hole center y-coordinate, and hole diameter. After verification, the board number, target PCB lamination size, and target hole position data are written into the original board record for the candidate benchmark generation module to read. If the target PCB lamination size lacks the lamination area's lateral length or longitudinal length, the original board record only writes the board number and marks it as a missing dimension, without generating a candidate lamination area set. If a single hole in the target hole position data lacks the hole number, hole center x-coordinate, hole center y-coordinate, or hole diameter, that hole is discarded, and the remaining holes are continued to be written into the original board record. Subsequently, the initial coordinate data required for subsequent in-situ retesting and point migration line calculations are generated. After the stainless steel plate is fixed by the clamping assembly, the boundary position where the clamping assembly contacts the stainless steel plate is read, and this boundary position is written into the plate record as the initial clamping position. The lower boundary is read from the feed end boundary where the assembly is located, with the long side on the left side when facing the feed end and intersecting the lower boundary as the left boundary. The intersection of the left and lower boundaries is taken as the origin of the plate coordinate system, with the horizontal axis positive to the right along the lower boundary and the vertical axis positive upward along the left boundary. In the plate coordinate system, the initial left boundary and the initial... The right boundary, initial lower boundary, and initial upper boundary are used as the initial external dimensions. The initial board height is collected according to the row number and column number of the collection point, and the initial thickness is collected according to the thickness collection position. The board number, target PCB lamination size, target hole data, initial clamping position, initial external dimensions, initial board height, and initial thickness are merged into the original board data. When the stainless steel original board is obstructed by the boundary after clamping, the coordinate system inside the board is established with the left boundary point column and the lower boundary point column that are not obstructed by the clamping component. The area obstructed by the clamping component is only written into the initial clamping position and does not participate in the boundary fitting of the initial external dimensions. The original board data serves as the starting data for subsequent processing. The board number is used to connect the original board data, post-thermal data, and metal substrate surface treatment data. The board coordinate system is used to express the initial coordinates, post-thermal coordinates, candidate pressing areas, candidate hole areas, and candidate cutting areas. The initial clamping position is used to identify whether the clamping contact area enters the final pressing area during subsequent surface reprocessing and final cutting. In practical applications, for a stainless steel original board to be processed, the board number reading component first reads the board number. The original board bearing acquisition module writes the lateral length, longitudinal length, pressing direction, and hole position table of the 5G PCB pressing area into the original board record. Then, the clamping component fixes the stainless steel original board. The board height acquisition component collects the initial board height by row and column, and the thickness acquisition component collects the initial thickness. Finally, the original board data is output for the heat shaping and retesting module and the candidate benchmark generation module to read.

[0018] The heat setting and retesting module includes a heat setting device, a cooling support platform, a plate height retesting component, a thickness retesting component, and a shape retesting component. It is used to receive stainless steel substrates that have completed grinding pretreatment, perform heat setting, cooling support, and in-situ retesting according to the plate number, collect the post-heating shape dimensions, post-heating plate height, and post-heating thickness of the stainless steel substrate, and output post-heating data. In this embodiment, the heat setting and retesting module is used to subject stainless steel substrates with the same plate number to heat setting, cooling load-bearing, and post-heat retesting after the grinding pretreatment is completed. The post-heat dimensions, post-heat plate height, and post-heat thickness are written into the post-heat data. The stainless steel substrate that has completed the grinding pretreatment refers to the plate that has completed the initial surface removal and retains the surface retreatment allowance. Heat setting is used to expose the boundary springback, plate height change, and thickness change of the plate after heating, holding, and cooling. Post-heat retesting is used to provide post-heat coordinates and post-heat height for subsequent candidate pressing zone generation, point migration line construction, and migration particle calculation. The heat setting device executes according to the plate process sheet, which includes steel type, plate thickness, heat setting temperature, holding time, and cooling method, and is written into the post-heat record along with the plate number. The hardware layout of the heat-setting retest module is used to define the bearing position of the stainless steel substrate during heat setting, cooling, and retesting, so that the retesting data after heat setting can be linked with the in-plate coordinate system in the original plate data. The heat setting device receives the stainless steel substrate that has completed the grinding pretreatment and performs heating, heat preservation, and unloading according to the plate process sheet. The cooling bearing platform is connected to the unloading side of the heat setting device, bearing the heat-set stainless steel substrate and keeping the orientation of the stainless steel substrate's plate number the same as the orientation of the feeding end in the original plate bearing acquisition module. The plate height retesting component is located above the cooling bearing platform and collects the plate height after heat setting according to the row and column numbers of the acquisition points in the original plate data. The thickness retesting component is located on one side of the cooling bearing platform and collects the thickness after heat setting according to the thickness acquisition position in the original plate data. The shape retesting component is located on the periphery of the cooling bearing platform and collects the left, right, lower, and upper boundaries after heat setting, and outputs the shape dimensions after heat setting. If the orientation of the plate number does not match the original plate data, the cooling bearing platform adjusts the orientation of the stainless steel substrate before retesting. During execution, the heat setting and retesting module first establishes a post-heat setting record, ensuring that both the heat setting process and the post-heat setting retesting data belong to the same plate number. After receiving the stainless steel substrate that has undergone grinding pretreatment, it reads the plate number of the stainless steel substrate and searches for the original plate record corresponding to the same plate number in the original plate data. Once the original plate record is found, the plate number, steel type, plate thickness, heat setting temperature, holding time, and cooling method are written into the post-heat setting record. Then, the stainless steel substrate is heat-set using the heat setting device. After heat setting, the stainless steel substrate is sent to the cooling support platform, which carries the stainless steel substrate to the retesting position. If no original plate record corresponding to the same plate number is found, the post-heat setting record only writes the plate number and anomaly mark, and no same-position retest is performed. If the plate number is not read, the heat setting and retesting module does not generate a post-heat setting record. Subsequently, using the in-board coordinate system from the original board data as the coordinate system for the re-measurement, the post-heating coordinates, post-heating height, and post-heating thickness required for the subsequent point migration lines are generated. The in-board coordinate system, row number, column number, initial x-coordinate, and initial y-coordinate from the original board data are read. The shape re-measurement component first collects the post-heating left boundary, post-heating right boundary, post-heating lower boundary, and post-heating upper boundary, using the post-heating lower boundary direction as the post-heating x-axis direction and the post-heating left boundary direction as the post-heating y-axis direction. The board surface height re-measurement component then proceeds according to the collection points... The row number and column number of each collection point are re-measured point by point to obtain the post-heating abscissa, post-heating ordinate, and post-heating height of each collection point; the thickness re-measurement component is used to re-measure the thickness at the collection position to obtain the post-heating thickness; the plate number, post-heating dimensions, post-heating abscissa, post-heating ordinate, post-heating height, and post-heating thickness of each collection point are merged to output the post-heating data; when a single collection point is missing from the re-measurement, the row number and column number of that collection point are retained in the post-heating data and marked as missing from the re-measurement, and that collection point is not included in the subsequent point migration line statistics; Through the above processing, the post-heating data not only records the state of the sheet metal after heat setting, but also provides the candidate benchmark generation module with retest data that is paired with the original sheet metal data. The post-heating dimensions are used to limit the generation range of the candidate pressing zone set and the final cutting edge line. The post-heating abscissa and post-heating ordinate are used to form a point migration line with the initial abscissa and initial ordinate. The post-heating sheet surface height is used to calculate the absolute value of the height difference of the pressing zone. The post-heating thickness is used for surface reprocessing and finished product thickness inspection. In practical applications: After the stainless steel substrate that has completed the grinding pretreatment enters the heat setting device, the heat setting retest module reads the sheet metal number and retrieves the original sheet metal data corresponding to that sheet metal number. The heat setting device completes the heat setting according to the sheet metal process sheet. The cooling support platform supports the heat-set stainless steel substrate. The shape retest component collects the four boundaries after heat setting. The sheet surface height retest component collects the post-heating sheet surface height according to the original collection point row number and column number. The thickness retest component collects the post-heating thickness. Finally, the post-heating data is formed and provided to the candidate benchmark generation module for reading.

[0019] The candidate reference generation module receives original board data, post-thermal data, target PCB lamination dimensions, and target hole position data. It moves the target PCB lamination dimensions within the stainless steel substrate with the row and column spacing of the board height acquisition points as the step size, generating a set of candidate lamination areas. Each candidate lamination area is associated with the target hole position data, candidate hole area, and candidate cut-off area. The module calculates the number of entry points of the candidate cut-off area after thermal processing into the candidate lamination area, the number of exit points of the candidate lamination area after thermal processing, the hole offset of the candidate hole area relative to the candidate lamination area, and the area of ​​the candidate cut-off area. The modules are sorted in ascending order by the number of entry points, the number of exit points, the hole offset, and the area of ​​the candidate cut-off area. The candidate lamination area with the sequence number 1 is selected as the greedy reference, and the candidate reference data is output. In this embodiment, the candidate reference generation module is used to establish a calculable candidate region between the original plate data and the post-thermal data, so that the post-thermal dimensions, point migration lines, and target hole position data can all participate in the screening of the pressing region. During processing, a set of candidate pressing regions is first generated in the plate coordinate system, then candidate hole areas and candidate cut-off areas are generated for each candidate pressing region. Subsequently, the post-thermal migration in, migration out, and hole position offset are statistically analyzed using point migration lines. Finally, a greedy reference is obtained according to a determined sorting rule, and the candidate reference data is output. The specific processing is as follows: The generation of candidate lamination area sets is used to ensure that the target PCB lamination size falls within the post-thermal outline size, avoiding subsequent particle calculations using out-of-bounds areas as initial objects. After receiving the original board data, post-thermal data, target PCB lamination size, and target hole position data, the system reads the board coordinate system, sampling point row number, sampling point column number, initial coordinates of the sampling point, and row and column spacing of the sampling points at the board height from the original board data. The row spacing is the difference in the ordinate of adjacent row number sampling points, and the column spacing is the difference in the abscissa of adjacent column number sampling points. The lower left corner of the target PCB lamination size is then... The height acquisition points of each board surface are placed in the board coordinate system. The horizontal edge of the target PCB lamination dimension is arranged along the horizontal axis of the board coordinate system, and the vertical edge is arranged along the vertical axis of the board coordinate system. The left boundary, right boundary, lower boundary, and upper boundary of the heat-treated data are read. The positions of the target PCB lamination dimensions with all four sides within the heat-treated outline dimensions are retained to generate a candidate lamination area set. If the target PCB lamination dimension lacks the horizontal length or vertical length of the lamination area, no candidate lamination area set is generated, and a dimension missing item mark is written in the candidate reference record. The generation of candidate hole areas and candidate cut-off areas is used to establish a spatial relationship between each candidate pressing area and the target hole position data and the post-heated external dimensions. For each candidate pressing area in the candidate pressing area set, the coordinates of the lower left corner of the candidate pressing area are read. The abscissa of each hole center in the target hole position data is added to the abscissa of the lower left corner of the candidate pressing area to obtain the abscissa of the candidate hole center. The ordinate of each hole center is added to the ordinate of the lower left corner of the candidate pressing area to obtain the ordinate of the candidate hole center. The candidate hole area is generated using the candidate hole center and half-value of the hole diameter. The area within the post-heated external dimensions and located outside the candidate pressing area is read as the candidate cut-off area. The candidate pressing area, candidate hole area, and candidate cut-off area are all expressed using the in-plate coordinate system. When the acquisition point is located at the boundary of the area, the left and lower boundaries are included in the area, while the right and upper boundaries are not included. When there is no plate surface height acquisition point in the candidate hole area, the four plate surface height acquisition points closest to the candidate hole center are read as the acquisition points of the candidate hole area. The acquisition points of the candidate pressing area, candidate hole area, candidate cut-off area, and candidate hole area are written into the candidate reference record. The point migration line is used to convert the displacement of the sampling points before and after heat treatment into the number of migration-in points and migration-out points. It reads the initial plate height sampling points from the original plate data and the post-heat treatment data from the post-heat treatment data that have the same row and column numbers. The initial x-coordinate, initial y-coordinate, post-heat treatment x-coordinate, and post-heat treatment y-coordinate of each pair of sampling points are merged into a point migration line. For each candidate pressing zone, the number of point migration lines whose initial coordinates are located in the candidate cutting zone and whose post-heat treatment coordinates are located in the candidate pressing zone is counted as the number of migration-in points. The number of point migration lines whose initial coordinates are located in the candidate pressing zone and whose post-heat treatment coordinates are located outside the candidate pressing zone is counted as the number of migration-out points. When sampling points with the same row and column numbers are missing in the post-heat treatment data, no point migration line is generated for that sampling point, and it is not included in the counting of migration-in points and migration-out points. The point migration line is only used for data recording and not as the geometric boundary of the plate surface. The hole offset and greedy datum are used to select the initial datum with the least post-thermal migration impact among candidate pressing zones. The migration lines of each point within the candidate hole area are read from the initial coordinates. The post-thermal abscissa of each migration line is subtracted from the initial abscissa to obtain the hole lateral displacement, and the post-thermal ordinate is subtracted from the initial ordinate to obtain the hole longitudinal displacement. The absolute values ​​of the hole lateral and longitudinal displacements are accumulated separately for each hole number, and then the accumulated results for all hole numbers are summed to obtain the hole offset. The area of ​​the candidate cut-off zone is obtained by subtracting the area of ​​the candidate pressing zone from the area of ​​the post-thermal external dimensions. When the post-thermal external dimensions are recorded according to four straight line boundaries, the post-thermal external dimensions area... The candidate pressing area is calculated by multiplying the horizontal length after heating by the vertical length after heating. The candidate pressing area is calculated by multiplying the horizontal length of the pressing area by the vertical length of the pressing area. Candidate reference records are arranged in ascending order by the number of migration points, the number of migration points, the hole deviation, and the candidate excision area. When the four items are the same, they are arranged in ascending order by the vertical coordinate of the lower left corner of the candidate pressing area. When the vertical coordinates are still the same, they are arranged in ascending order by the horizontal coordinate of the lower left corner of the candidate pressing area. The candidate pressing area with the sequence number 1 is taken as the greedy reference. The greedy reference, the candidate pressing area set, the candidate hole area, the candidate excision area, the point migration line, the number of migration points, the number of migration points, the hole deviation, and the candidate excision area are merged and output as candidate reference data. Through the above processing, the candidate reference data not only provides an initial pressing area, but also converts the impact of post-thermal migration on the pressing area, the cutting area, and the hole location area into readable data fields; the number of migration-in points reflects the number of sampling points in the candidate cutting area that enter the candidate pressing area after thermal processing, the number of migration-out points reflects the number of sampling points in the candidate pressing area that leave their own area after thermal processing, the hole offset reflects the impact of the post-thermal displacement of sampling points in the candidate hole area on the hole processing reference, and the area of ​​the candidate cutting area reflects the range of board material that needs to be removed for subsequent cutting; in practical applications: a stainless steel substrate that has completed thermal shaping and retesting has a fixed four-boundary post-thermal shape. The target PCB pressing size moves grid by grid on the board height sampling point. The system calculates the number of migration-in points, the number of migration-out points, the hole offset, and the area of ​​the candidate cutting area one by one, and uses the candidate pressing area with the sequence number 1 as the greedy reference for the migration particle calculation module to continue generating particle positions.

[0020] The migration particle calculation module receives candidate reference data and post-heating data. It uses a greedy reference as the first particle position and generates the remaining particle positions based on the candidate pressing areas that are sorted in the later stages. It uses the pressing area lateral displacement, pressing area longitudinal displacement, pressing area corner displacement, four-sided cutting edge inward displacement, hole area lateral displacement, and hole area longitudinal displacement as particle position fields. For each particle position, it calculates the number of migration points, the number of migration points, hole offset, absolute value of the pressing area height difference, and candidate excised area area to form a particle sorting sequence. In each round, it reads the current particle position, the particle position with individual index 1, and the particle position with group index 1. It takes the median value of the three sorted values ​​for each particle position field to generate the particle position field for the next round. When the median value is the same as the current particle position field, it moves the current particle position field to the particle position field with group index 1 by one acquisition step until no unevaluated particle positions are generated in the current round, and outputs the migration particle data. In this embodiment, the migration particle calculation module performs discrete migration calculations on the greedy benchmark and the subsequent candidate pressing areas based on the candidate benchmark data. This ensures that the final pressing area is no longer limited to a single greedy selection, but continues to search for the particle positions ranked first by the number of migration points, the number of migration points, the hole offset, the absolute value of the pressing area height difference, and the particle cut area area within the plate surface acquisition grid. Each particle position is expressed as the pressing area lateral displacement, pressing area longitudinal displacement, pressing area corner displacement, left edge inward displacement, right edge inward displacement, bottom edge inward displacement, top edge inward displacement, hole area lateral displacement, and hole area longitudinal displacement. The left edge inward displacement, right edge inward displacement, bottom edge inward displacement, and top edge inward displacement together constitute the four-sided edge inward displacement. The specific processing is as follows: To ensure the particle position obtains a definite initial value from the candidate reference data, the candidate reference data and post-heating data are first received. The row and column spacing of the greedy reference, candidate pressing zone set, point migration line, and plate height acquisition points are read, and the greedy reference is written as the first particle position. At the first particle position, the pressing zone lateral displacement, pressing zone longitudinal displacement, pressing zone corner displacement, left edge inward displacement, right edge inward displacement, lower edge inward displacement, upper edge inward displacement, hole area lateral displacement, and hole area longitudinal displacement are all set to zero. The candidate pressing zone set is sorted in... The candidate pressing areas are then written as the positions of the remaining particles. The horizontal displacement of the pressing area at each of the remaining particle positions is the difference between the horizontal coordinate of the lower left corner of the current candidate pressing area and the horizontal coordinate of the lower left corner of the greedy reference area. The vertical displacement of the pressing area is the difference between the vertical coordinate of the lower left corner of the current candidate pressing area and the vertical coordinate of the lower left corner of the greedy reference area. The cornering amount of the pressing area is zero, and the inward movement of the four sides is zero. The horizontal and vertical displacement of the hole area are the translation amounts of the current candidate hole area relative to the greedy reference candidate hole area. The generated particle positions are written into the historical particle positions for subsequent evaluation and update reading. The evaluation of each particle position is used to convert the compression zone migration, hole zone migration, and edge retraction into the same sorting data. For each particle position, based on the compression zone in the greedy benchmark, it is translated according to the lateral and longitudinal displacement of the compression zone, and rotated around the center of the compression zone according to the compression zone rotation angle to generate the particle compression zone. Based on the candidate hole zone in the greedy benchmark, it is translated according to the lateral and longitudinal displacement of the hole zone to generate the particle hole zone. The left edge retraction of the left boundary is translated to the right after heating, the right edge retraction of the right boundary is translated to the left after heating, the lower boundary is translated upwards, and the upper boundary is translated downwards, generating the particle retention zone. The area within the external dimensions after heating and located outside the particle retention zone is the particle removal zone. When the four sides of the particle compression zone are not all within the particle retention zone, the particle is removed. The sub-position is written as the position of the out-of-bounds particle and is not written into the particle sorting sequence. When the particle position does not exceed the boundary, the number of migration lines of points whose initial coordinates are in the particle cutting area and whose post-heating coordinates are in the particle pressing area is counted as the number of migration points. The number of migration lines of points whose initial coordinates are in the particle pressing area and whose post-heating coordinates are outside the particle pressing area is counted as the number of migration points. The migration lines of points whose initial coordinates are in the particle hole area are read and the hole offset is obtained by summing the absolute values ​​of the hole horizontal displacement and the absolute values ​​of the hole vertical displacement. The height of each plate surface after heating in the particle pressing area is read. Adjacent points are formed horizontally by adjacent column numbers with the same row number and adjacent points are formed vertically by adjacent row numbers with the same column number. The absolute values ​​of the height difference after heating of all adjacent point pairs are added to obtain the sum of the absolute values ​​of the height difference of the pressing area. The area of ​​the particle cutting area is obtained by subtracting the area of ​​the particle retention area from the area of ​​the post-heating outer dimensions. Particle sorting is used to determine the position of the individual particle with index 1 for each particle, and to determine the position of the collective particle with index 1 for all particles. The system reads the number of entry points, number of exit points, hole offset, absolute value of the height difference in the pressing zone, and area of ​​the particle cut-off zone for each particle position. First, it sorts the particles in ascending order by the number of entry points. If the number of entry points is the same, it sorts them in ascending order by the number of exit points. If the number of exit points is the same, it sorts them in ascending order by the hole offset. If the hole offset is the same, it sorts them in ascending order by the absolute value of the height difference in the pressing zone. If the absolute value of the height difference in the pressing zone is the same, it sorts them in ascending order by the area of ​​the particle cut-off zone. If the particle cut-off area is still the same, the particles are arranged in ascending order by their numbers to form a particle sorting sequence. In the chronological order of the same particle, the particle position with the highest sorting number in the particle sorting sequence is taken as the particle position with individual number 1. In the chronological order of all particles, the particle position with sorting number 1 in the particle sorting sequence is taken as the particle position with group number 1. If a particle position is not written into the particle sorting sequence due to exceeding the limit, that particle position will not participate in the selection of individual number 1 and group number 1. Particle position update is used to move the particle positions within the discrete plate surface acquisition grid to positions earlier in the previous rounds of sorting without introducing a continuous velocity term. Each round reads the current particle position, the position of the particle with individual index 1, and the position of the particle with group index 1. For the lateral displacement of the pressing zone, the lateral displacement of the hole zone, the inward movement of the left cut edge, and the inward movement of the right cut edge, the median value of these three values ​​after sorting is taken as the field value for the next round. If the field value for the next round is the same as the current field value and the current field value is different from the field value with the same name in group index 1, then the current field value is moved once towards the field value with the same name in group index 1 according to the column spacing. For the longitudinal displacement of the pressing zone, the longitudinal displacement of the hole zone, the inward movement of the lower cut edge, and the inward movement of the upper cut edge, the median value of these three values ​​after sorting is taken as the field value for the next round. If the field value for the next round is the same as the current field value and the current field value is different from the field value with group index 1... If there are identical field values, the current field value will move once towards the field value with the same name in the group number 1, according to the row spacing. For the corner value of the pressing area, the median value after sorting the current particle position, the particle position with individual number 1, and the particle position with group number 1 will be used as the corner value for the next round. If the corner value of the next round is the same as the current corner value and the current corner value is different from the corner value of the pressing area in the group number 1, the minimum corner value will be moved once towards the corner value of the pressing area in the group number 1. The minimum corner value is obtained by fixing one end of the horizontal edge of the target PCB pressing size and moving the other end longitudinally along the adjacent sampling point by one row spacing. If the particle position generated in the current round does not appear in the previous round's particle positions, the particle position will be written into the evaluation record and the evaluation will be performed. If the particle positions generated in the current round all exist in the previous round's particle positions, no more evaluation records will be generated, and the migration particle data will be output. Through the above processing, the migrated particle data includes the post-heated external dimensions, plate number, particle position in each wheel, particle sorting sequence, particle position with individual number 1, particle position with group number 1, and particle position with sorting number 1. This data can be read by the final reference output module to generate the final pressing zone, final hole processing reference, and final cutting edge line. This discrete migration calculation does not make a one-time selection of candidate pressing zones, but rather, based on a greedy reference, it allows the pressing zone position, hole position, and the inward adjustment of the four-sided cutting edge to participate in the evaluation of migration in, migration out, hole deviation, and height difference. In practical applications: After the candidate compressing region with the sequence number 1 is given in the candidate benchmark data, the system takes this candidate compressing region as the position of the first particle, and writes the candidate compressing regions that are sorted later as the positions of the remaining particles. Each particle is updated at a discrete position limited by row spacing, column spacing and minimum turning angle, until all the particle positions generated in this round have been evaluated. Finally, the position of the particle with the sequence number 1 in the particle sorting sequence is handed over to the final benchmark output module for reading.

[0021] The final reference output module is used to receive migration particle data, target PCB lamination size and target hole position data, read the position of particle with sequence number 1 in the particle sorting sequence, determine the candidate lamination area in the particle position as the final lamination area, write the transverse displacement and longitudinal displacement of the hole area in the particle position into the final hole processing reference, write the inward movement of the four sides of the cutting edge in the particle position into the final cutting edge line, and output the surface treatment data of the metal substrate for surface reprocessing, hole processing and final cutting. In this embodiment, the final reference output module is used to convert the positions of the top-ranked particles in the migrated particle data into actual processing references, ensuring that the final pressing area, final hole processing references, and final cutting edge lines all originate from the same particle position. This avoids mutual offsets that occur after the pressing area, hole processing, and cutting boundaries are determined separately. The migrated particle data includes the plate number, post-heating dimensions, particle sorting sequence, and the position of particle number 1. The particle position with number 1 includes the lateral displacement of the pressing area, the longitudinal displacement of the pressing area, the corner displacement of the pressing area, the lateral displacement of the hole area, the longitudinal displacement of the hole area, the inward reduction of the left cutting edge, the inward reduction of the right cutting edge, the inward reduction of the lower cutting edge, and the inward reduction of the upper cutting edge. The specific processing is as follows: The generation of the final pressing zone and the final hole machining reference is used to map the particle sorting results onto the PCB pressing surface and hole machining coordinates. After receiving the migration particle data, target PCB pressing dimensions, and target hole position data, the position of particle number 1 in the particle sorting sequence is read. Based on the pressing zone in the greedy reference, the pressing zone in the greedy reference is translated along the horizontal axis of the board coordinate system by the pressing zone's horizontal displacement and along the vertical axis of the board coordinate system by the pressing zone's vertical displacement. Then, the center of the translated pressing zone is used as the rotation center and rotated by the pressing zone's rotation angle to generate the final pressing zone. The hole number and hole position data in the target hole position data are read. The final hole center coordinate is obtained by adding the horizontal coordinate of the hole center, the vertical coordinate of the hole center, and the hole diameter. The horizontal coordinate of the hole center is then added to the horizontal coordinate of the lower left corner of the final pressing area, plus the horizontal displacement of the hole area. The final vertical coordinate of the hole center is then added to the vertical coordinate of the hole center, plus the vertical displacement of the hole area. The hole number, the final hole center coordinate, the final hole center coordinate, and the hole diameter are then combined to form the final hole machining datum. If a single hole position in the target hole position data is missing the hole number, the horizontal coordinate of the hole center, the vertical coordinate of the hole center, or the hole diameter, then that hole position is not written into the final hole machining datum, while the final hole machining datums for the remaining hole positions continue to be generated. The final cut-off line generation is used to exclude the post-thermal unstable boundary from the subsequent PCB lamination area and maintain data association with the final lamination area under the same board number; read the post-thermal outline dimensions and the four-sided cut-off indentation of the particle position with sequence number 1 from the migration particle data, where the four-sided cut-off indentation consists of the left cut-off indentation, right cut-off indentation, bottom cut-off indentation, and top cut-off indentation; shift the post-thermal left boundary to the right side of the board by the left cut-off indentation to generate the final left cut-off line, shift the post-thermal right boundary to the left side of the board by the right cut-off indentation to generate the final right cut-off line, and shift the post-thermal lower boundary... The lower edge of the cut edge is shifted inward by a certain amount towards the upper side of the board to generate the final lower cut edge line. The upper boundary after heating is shifted inward by a certain amount towards the lower side of the board to generate the final upper cut edge line. The final cut edge line is composed of the final left cut edge line, the final right cut edge line, the final lower cut edge line, and the final upper cut edge line. When the area enclosed by the final cut edge line does not cover the final pressing area, no surface treatment data for the metal substrate is output, and the particle position is recorded as a cut edge over-boundary record. When the area enclosed by the final cut edge line covers the final pressing area, the board number, the final pressing area, the final hole processing reference, and the final cut edge line are merged, and the surface treatment data for the metal substrate is output. Through the above processing, the particle positions obtained from the thermal migration calculation of the metal substrate surface treatment data are transformed into subsequent processing objects. The final pressing area is used for surface reprocessing, the final hole processing reference is used for hole processing, and the final cutting line is used for final trimming. All three originate from the particle position with the sequence number 1 in the particle sorting sequence. In practical applications: after completing the migration particle calculation, the final reference output module reads the particle position with the sequence number 1 in the particle sorting sequence. First, it determines the final pressing area according to the pressing area lateral displacement, pressing area longitudinal displacement, and pressing area angular displacement. Then, it generates the final hole center coordinates of each hole according to the coordinates of the lower left corner of the final pressing area and the hole area translation. Subsequently, it generates the final cutting line according to the inward inclination of the four sides, thus forming the metal substrate surface treatment data used for surface reprocessing, hole processing, and final trimming.

[0022] Working principle: This solution first establishes a board number for the stainless steel original plate, collects the initial external dimensions, initial board height, initial thickness, and initial clamping position, and then performs heat setting and in-situ re-measurement on the stainless steel substrate that has completed the grinding pretreatment to obtain the external dimensions, board height, and thickness after heat setting. Subsequently, the target PCB lamination dimensions are placed grid by grid within the external dimensions after heat setting to form a set of candidate lamination areas. Based on the displacement of the collection points before and after heat setting, the number of migration points, the number of migration points, the hole offset, and the area of ​​the candidate cut-off area are statistically analyzed to obtain a greedy reference first. Then, the lamination area position, hole area position, and the inward adjustment of the four-sided cutting edge are adjusted synchronously through migration particle calculation. Finally, the final lamination area, the final hole processing reference, and the final cutting edge line are output. The core of the whole process is not to simply flatten the entire stainless steel plate, but to use the board surface migration results exposed after heat setting to reselect the area that is truly suitable as the lamination reference for 5G high-frequency and high-speed PCBs, and bind the hole processing and final cutting to this area. In practical applications, after an initial grinding, a stainless steel sheet enters a heat-setting device. Post-heat retesting reveals that deformation at the edges and corners of the sheet can propagate to the originally planned lamination area. Instead of directly cutting according to the original shape or simply performing routine corrections, the system repositions the PCB lamination dimensions within the sheet and compares the extent of post-heat migration impact on each candidate location. When the migration in, migration out, and hole offsets of a candidate area are reduced, the system uses that area as the initial reference and then fine-tunes the lamination area, hole area, and cutting edge line through discrete particle migration. Finally, it generates the data required for surface reprocessing, hole machining, and final cutting, making the remaining stainless steel substrate area more suitable for subsequent insulation layer bonding, multilayer lamination, and hole alignment.

[0023] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-frequency, high-speed PCB metal substrate surface treatment system, characterized in that, include: The original board carrying acquisition module includes a board conveying platform, clamping components, board height acquisition components, thickness acquisition components, and board number reading components. It is used to receive stainless steel original board, target PCB lamination dimensions, and target hole position data, and to acquire the initial external dimensions, initial board height, initial thickness, and initial clamping position of the stainless steel original board according to the board number, and output the original board data. The heat setting and retesting module includes a heat setting device, a cooling support platform, a plate height retesting component, a thickness retesting component, and a shape retesting component. It is used to receive stainless steel substrates that have completed grinding pretreatment, perform heat setting, cooling support, and in-situ retesting according to the plate number, collect the post-heating shape dimensions, post-heating plate height, and post-heating thickness of the stainless steel substrate, and output post-heating data. The candidate reference generation module receives original board data, post-thermal data, target PCB lamination dimensions, and target hole position data. It moves the target PCB lamination dimensions within the stainless steel substrate using the row and column spacing of the board height acquisition points as steps, generating a set of candidate lamination areas. Each candidate lamination area is then linked to the target hole position data, candidate hole area, and candidate cut-off area. The module calculates the number of entry points of the candidate cut-off area after thermal processing into the candidate lamination area, the number of exit points of the candidate lamination area after thermal processing, the hole offset of the candidate hole area relative to the candidate lamination area, and the area of ​​the candidate cut-off area. These are then sorted in ascending order by the number of entry points, the number of exit points, the hole offset, and the area of ​​the candidate cut-off area. The candidate lamination area with the sequence number 1 is selected as the greedy reference, and the candidate reference data is output.

2. The high-frequency, high-speed PCB metal substrate surface treatment system according to claim 1, characterized in that: The system also includes: The migration particle calculation module receives candidate reference data and post-heating data. It uses a greedy reference as the first particle position and generates the remaining particle positions based on the candidate pressing areas that are sorted in the later stages. It uses the pressing area lateral displacement, pressing area longitudinal displacement, pressing area corner displacement, four-sided cutting edge inward displacement, hole area lateral displacement, and hole area longitudinal displacement as particle position fields. For each particle position, it calculates the number of migration points, the number of migration points, hole offset, absolute value of the pressing area height difference, and candidate excised area area to form a particle sorting sequence. In each round, it reads the current particle position, the particle position with individual index 1, and the particle position with group index 1. It takes the median value of the three sorted values ​​for each particle position field to generate the particle position field for the next round. When the median value is the same as the current particle position field, it moves the current particle position field to the particle position field with group index 1 by one acquisition step until no unevaluated particle positions are generated in the current round, and outputs the migration particle data. The final reference output module is used to receive migration particle data, target PCB lamination dimensions and target hole position data, read the position of particle with sequence number 1 in the particle sorting sequence, determine the candidate lamination area in the particle position as the final lamination area, write the transverse displacement and longitudinal displacement of the hole area in the particle position into the final hole processing reference, write the inward movement of the four sides of the cutting edge in the particle position into the final cutting edge line, and output the surface treatment data of the metal substrate for surface reprocessing, hole processing and final cutting.

3. The high-frequency, high-speed PCB metal substrate surface treatment system according to claim 2, characterized in that: The original board carrying the acquisition module includes: The sheet material conveying platform is used to carry stainless steel raw sheets. Clamping components are located on both sides of the sheet material conveying platform and are used to fix the stainless steel raw sheets. The sheet height acquisition component is located above the sheet material conveying platform and is used to acquire the initial sheet height. The thickness acquisition component is located on the feeding side of the sheet material conveying platform and is used to acquire the initial thickness. The sheet number reading component is located at the feeding end of the sheet material conveying platform and is used to read the sheet number. Receive the stainless steel original plate, target PCB lamination dimensions and target hole position data, read the plate number through the plate number reading component, and write the plate number, target PCB lamination dimensions and target hole position data into the original plate record; The stainless steel plate is fixed by a clamping assembly. The boundary position where the clamping assembly contacts the stainless steel plate is collected as the initial clamping position. An in-plate coordinate system is established with one long side and one short side of the stainless steel plate. The initial external dimensions, initial plate height and initial thickness are collected in the in-plate coordinate system. The plate number, target PCB lamination dimensions, target hole data, initial clamping position, initial external dimensions, initial plate height and initial thickness are merged and the original plate data is output.

4. The high-frequency, high-speed PCB metal substrate surface treatment system according to claim 3, characterized in that: The heat setting retest module includes: The heat setting device is used to receive the stainless steel substrate that has completed the grinding pretreatment and perform heat setting. The cooling support platform is connected to the discharge side of the heat setting device and is used to support the stainless steel substrate after heat setting. The plate height re-measuring component is located above the cooling support platform and is used to collect the plate height after heat setting. The thickness re-measuring component is located on one side of the cooling support platform and is used to collect the thickness after heat setting. The shape re-measuring component is located on the periphery of the cooling support platform and is used to collect the shape dimensions after heat setting. The system receives a stainless steel substrate that has undergone grinding pretreatment, reads the substrate number, writes the substrate number into the post-heating record, performs heat setting on the stainless steel substrate using a heat setting device, and holds the heat-set stainless steel substrate on a cooling support platform. Using the in-plate coordinate system in the original plate data as the coordinate system for retesting, the thermally heated outer dimensions, thermally heated plate height, and thermally heated thickness of the stainless steel substrate are collected under the coordinate system for retesting. The plate number, thermally heated outer dimensions, thermally heated plate height, and thermally heated thickness are merged and the thermally heated data is output.

5. The high-frequency, high-speed PCB metal substrate surface treatment system according to claim 4, characterized in that: The execution of the candidate benchmark generation module includes: Receive original board data, post-thermal data, target PCB lamination dimensions and target hole position data, read the board coordinate system, row spacing and column spacing of board surface height acquisition points in the original board data, place the lower left corner of the target PCB lamination dimension in the board coordinate system at each board surface height acquisition point in the board coordinate system, and retain the position where all four sides of the target PCB lamination dimension are within the post-thermal outline dimensions, and generate a candidate lamination area set; For each candidate pressing area in the candidate pressing area set, the center coordinates of each hole in the target hole position data are translated according to the coordinates of the lower left corner of the candidate pressing area to generate a candidate hole area. The area within the thermal outline size and located outside the candidate pressing area is generated as a candidate cut-off area. The candidate pressing area, candidate hole area and candidate cut-off area are written into the candidate reference record.

6. The high-frequency, high-speed PCB metal substrate surface treatment system according to claim 5, characterized in that: The execution of the candidate benchmark generation module also includes: Pair each initial board height acquisition point in the original board data with the post-heated board height acquisition points in the post-heated data that have the same row and column numbers. Read the initial coordinates and post-heated coordinates of each pair of acquisition points. Connect the initial coordinates and post-heated coordinates to form point migration lines. Count the number of point migration lines whose initial coordinates are located in the candidate cutting area and whose post-heated coordinates are located in the candidate pressing area as the number of migration points. Count the number of point migration lines whose initial coordinates are located in the candidate pressing area and whose post-heated coordinates are located outside the candidate pressing area as the number of migration points. Read the migration lines of each point located in the candidate hole area with initial coordinates. Subtract the initial abscissa from the thermally heated abscissa of each migration line to obtain the hole lateral displacement. Subtract the initial ordinate from the thermally heated ordinate of each migration line to obtain the hole longitudinal displacement. Add the absolute values ​​of all hole lateral displacements and all hole longitudinal displacements to obtain the hole offset. Multiply the lateral length and longitudinal length of the candidate excision area to obtain the area of ​​the candidate excision area. Sort the candidate reference records in ascending order by the number of migration points, the number of migration points, the hole offset, and the area of ​​the candidate excision area. Take the candidate pressing area with the sequence number 1 as the greedy reference and output the candidate reference data.

7. The high-frequency, high-speed PCB metal substrate surface treatment system according to claim 6, characterized in that: The execution of the migrating particle computing module includes: Receive candidate reference data and post-heating data, read the greedy reference, candidate pressing zone set, point migration line, and row and column spacing of plate height acquisition points, write the greedy reference as the first particle position, and write the candidate pressing zones that are sorted later in the candidate pressing zone set as the remaining particle positions in sequence. Write the pressing zone lateral displacement, pressing zone longitudinal displacement, pressing zone corner displacement, four-sided cutting edge inward displacement, hole area lateral displacement, and hole area longitudinal displacement in each particle position.

8. The high-frequency, high-speed PCB metal substrate surface treatment system according to claim 7, characterized in that: The execution of the migrating particle computing module also includes: For each particle position, a particle pressing zone is generated according to the lateral displacement, longitudinal displacement, and angular displacement of the pressing zone; a particle hole zone is generated according to the lateral displacement and longitudinal displacement of the hole zone; and a particle excision zone is generated according to the inward inclination of the four sides. The number of migration lines of points whose initial coordinates are in the particle excision zone and whose post-heating coordinates are in the particle pressing zone is counted as the number of migration points. The number of migration lines of points whose initial coordinates are in the particle pressing zone and whose post-heating coordinates are outside the particle pressing zone is counted as the number of migration points. The migration lines of points whose initial coordinates are in the particle hole zone are read and the hole offset is obtained by summing the absolute values ​​of the hole lateral displacement and the absolute values ​​of the hole longitudinal displacement. The height of each post-heating plate surface in the particle pressing zone is read and the absolute value of the height difference of the pressing zone is obtained by summing the absolute values ​​of the height differences of adjacent collection points. The area of ​​the particle excision zone is calculated. The number of entry points, number of exit points, hole deviation, absolute value of the height difference of the pressing zone, and area of ​​the particle removal zone for each particle position are arranged in ascending order to form a particle sorting sequence. The particle position with sorting number 1 in the epoch of the same particle is taken as the individual particle position with sorting number 1. The particle position with sorting number 1 in the epoch of all particles is taken as the group particle position with sorting number 1.

9. The high-frequency, high-speed PCB metal substrate surface treatment system according to claim 8, characterized in that: The execution of the migrating particle computing module also includes: In each round, the current particle position, the position of the particle with individual index 1, and the position of the particle with group index 1 are read. The middle value of the three values ​​after sorting the lateral displacement of the pressing zone, the longitudinal displacement of the pressing zone, the inward retraction of the four-sided cutting edge, the lateral displacement of the hole area, and the longitudinal displacement of the hole area is used to generate the field value for the next round. The middle value of the three values ​​after sorting the corner value of the pressing zone is used to generate the corner value for the next round. If the field value of the next round is the same as the current field value, the current field value is moved once to the same field of the particle position with group index 1 according to the column spacing or row spacing. If the corner value of the next round is the same as the current corner value, the current corner value is moved once to the pressing zone corner value of the particle position with group index 1 according to the minimum corner formed by the adjacent collection points. This process continues until all the particle positions generated in the current round have existed in the particle positions of the previous rounds. The migrated particle data is then output.

10. The high-frequency, high-speed PCB metal substrate surface treatment system according to claim 9, characterized in that: The execution of the final benchmark output module includes: Receive migration particle data, target PCB lamination dimensions, and target hole position data. Read the position of particle number 1 in the particle sorting sequence. Generate the final lamination area according to the lamination area lateral displacement, lamination area longitudinal displacement, and lamination area rotation amount in the lamination area of ​​particle number 1. Add the hole area lateral displacement and hole area longitudinal displacement in the particle position of particle number 1 to the center coordinates of each hole in the target hole position data to generate the final hole processing reference. Read the inward reduction of the four sides of the particle position with serial number 1, shift the left boundary of the heated outer dimension to the right by the inward reduction of the left side of the cut edge, shift the right boundary to the left by the inward reduction of the right side of the cut edge, shift the lower boundary upward by the inward reduction of the lower side of the cut edge, and shift the upper boundary downward by the inward reduction of the upper side of the cut edge to generate the final cut edge line. Combine the plate number, the final pressing area, the final hole processing reference and the final cut edge line, and output the surface treatment data of the metal substrate.

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