Methods, equipment, systems, storage media, program products, and circuit boards for fabricating interconnect circuits.

Abstract

This application relates to a method, apparatus, system, computer device, computer-readable storage medium, computer program product, and circuit board for processing interconnect lines on a circuit board. The circuit board includes a core board and a conductive material layer. The method includes: acquiring processing information of the circuit board, the processing information including processing parameter information of the conductive material layer; controlling a laser pulse based on the processing parameter information to form overlapping focused spots on the conductive material layer; and controlling the overlapping focused spots to etch the conductive material layer, eliminating non-interconnect lines on the conductive material layer, thereby obtaining interconnect lines.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a method, equipment, system, computer equipment, computer-readable storage medium, computer program product, and circuit board for processing interconnect lines on a circuit board. Background Technology

[0002] In the process of manufacturing printed circuit boards (PCBs), it is often necessary to process conductive lines on the surface of the PCB.

[0003] In traditional technology, conductive circuits are typically fabricated using an exposure process, which includes steps such as film application, exposure, development, etching, and film removal. These steps are then combined with subsequent processing steps to transfer the required circuitry onto a circuit board.

[0004] However, traditional methods generate large amounts of wastewater containing various pollutants, including heavy metal ions, organic matter, and other chemicals. The wastewater is energy-intensive to treat and has a low recycling rate, which hinders the green development of the industry and increases the operating costs of enterprises. Summary of the Invention

[0005] Therefore, it is necessary to provide a method, equipment, system, computer equipment, computer-readable storage medium, computer program product, and circuit board for processing interconnect lines of circuit boards that can reduce processing costs, in order to address the above-mentioned technical problems.

[0006] In a first aspect, this application provides a method for processing interconnect lines on a circuit board, the circuit board comprising a core board and a conductive material layer, the method comprising:

[0007] Obtain the processing information of the circuit board, including the processing parameters of the conductive material layer;

[0008] Based on processing parameter information, laser pulses are controlled to form overlapping focused spots on a conductive material layer;

[0009] By controlling overlapping focused light spots to etch the conductive material layer, the non-interconnected parts of the conductive material layer are eliminated, and interconnected lines are obtained.

[0010] In one embodiment, the conductive material layer is a copper foil with a thickness of 1μm-3μm, and the conductive material layer and the core board are laminated to form a circuit board.

[0011] In one embodiment, after controlling overlapping focused light spots to etch the conductive material layer, eliminating non-interconnected portions of the conductive material layer, and obtaining interconnected lines, the method further includes:

[0012] An insulating layer and a second conductive material layer are laminated sequentially on the interconnect lines, and the above-described circuit board interconnect line processing method is repeated to fabricate the second interconnect line on the second conductive material layer.

[0013] Interconnect lines and second interconnect lines together constitute the multilayer interconnect lines of the circuit board.

[0014] In one embodiment, the method is applied to a laser processing apparatus having a laser and a beam deflection device; controlling laser pulses to form overlapping focused spots on a conductive material layer based on processing parameter information, and further comprising:

[0015] Based on the processing parameter information, set the laser parameters of the laser and the deflection speed of the laser pulse by the beam deflection device;

[0016] Based on the laser parameter control, the laser continuously emits multiple laser pulses, and the beam deflection device controls the laser pulses to deflect them sequentially according to the deflection speed, so that the light spots formed by any two successive laser pulses on the conductive material layer overlap with each other.

[0017] In one embodiment, the laser parameters include at least one of laser power and repetition frequency; before setting the laser parameters of the laser and the deflection speed of the laser pulse by the beam deflection device according to the processing parameter information, the method further includes:

[0018] Detect the spot energy density corresponding to the processing parameter information;

[0019] Based on the spot energy density and the preset spot overlap rate, the deflection speed of the laser pulse by the beam deflection device, as well as the laser power and repetition frequency of the laser, are determined. The preset spot overlap rate is positively correlated with the spot size and the repetition frequency, and negatively correlated with the deflection speed. The spot energy density is positively correlated with the laser power, negatively correlated with the spot size, and negatively correlated with the repetition frequency.

[0020] In one embodiment, the conductive material layer is divided into multiple regions to be processed; the laser is controlled to continuously emit multiple laser pulses based on laser parameters, and the beam deflection device is controlled to deflect each laser pulse sequentially according to the deflection speed, including:

[0021] Positioning steps: Select and position the target area to be processed from each area to be processed according to the preset processing sequence;

[0022] Based on the laser parameters, the laser is controlled to continuously emit multiple laser pulses, and the beam deflection device is controlled to deflect each laser pulse sequentially according to the deflection speed, so as to control each laser pulse to process the target area to be processed.

[0023] Return to the positioning step and continue until all areas to be processed are completed.

[0024] In one embodiment, there are multiple lasers; the laser parameters include repetition frequency and emission start time, wherein each laser has the same repetition frequency and a different emission start time.

[0025] In one embodiment, the laser pulse is an ultrafast laser pulse.

[0026] In one embodiment, a focusing system is provided in the optical path before the laser pulse is incident on the conductive material layer. The focusing system includes a first cylindrical lens group and a second cylindrical lens group.

[0027] The first cylindrical mirror group is used to focus the laser pulse along the first direction;

[0028] The second cylindrical mirror group is used to focus the laser pulse along a second direction, which is not collinear with the first direction. The focusing magnification of the second cylindrical mirror group is different from that of the first cylindrical mirror group.

[0029] Secondly, this application also provides a laser processing apparatus, comprising:

[0030] The processing platform is configured to place circuit boards, which include a core board and a conductive material layer.

[0031] A laser is configured to emit laser pulses based on processing parameter information of a conductive material layer, and the laser pulses are used to process the conductive material layer;

[0032] The beam deflection device is configured to control the laser pulse to form overlapping focused beams on the conductive material layer based on the processing parameter information of the conductive material layer, and to control the overlapping focused beams to etch the conductive material layer, thereby eliminating the non-interconnected lines on the conductive material layer and obtaining interconnected lines.

[0033] Thirdly, this application also provides a laser processing system, including a controller and the aforementioned laser processing equipment, wherein the controller is used for:

[0034] Obtain the processing information of the circuit board, including the processing parameters of the conductive material layer;

[0035] The laser processing equipment is controlled based on the processing parameter information so that the laser pulse forms overlapping focused spots on the conductive material layer, and the overlapping focused spots etch the conductive material layer to eliminate the non-interconnected lines on the conductive material layer and obtain interconnected lines.

[0036] Fourthly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0037] Obtain the processing information of the circuit board, including the processing parameters of the conductive material layer;

[0038] Based on processing parameter information, laser pulses are controlled to form overlapping focused spots on a conductive material layer;

[0039] By controlling overlapping focused light spots to etch the conductive material layer, the non-interconnected parts of the conductive material layer are eliminated, and interconnected lines are obtained.

[0040] Fifthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0041] Obtain the processing information of the circuit board, including the processing parameters of the conductive material layer;

[0042] Based on processing parameter information, laser pulses are controlled to form overlapping focused spots on a conductive material layer;

[0043] By controlling overlapping focused light spots to etch the conductive material layer, the non-interconnected parts of the conductive material layer are eliminated, and interconnected lines are obtained.

[0044] Sixthly, this application also provides a computer program product, including a computer program that, when executed by a processor, performs the following steps:

[0045] Obtain the processing information of the circuit board, including the processing parameters of the conductive material layer;

[0046] Based on processing parameter information, laser pulses are controlled to form overlapping focused spots on a conductive material layer;

[0047] By controlling overlapping focused light spots to etch the conductive material layer, the non-interconnected parts of the conductive material layer are eliminated, and interconnected lines are obtained.

[0048] Seventhly, this application also provides a circuit board including interconnect lines, which are fabricated using the method described above.

[0049] The aforementioned method, equipment, system, computer equipment, computer-readable storage medium, computer program product, and circuit board for processing interconnect lines on printed circuit boards (PCBs) first acquire processing information for the PCB, including processing parameters for the conductive material layer. Then, based on these parameters, laser pulses are controlled to form overlapping focused spots on the conductive material layer. These overlapping focused spots are then used to etch the conductive material layer, eliminating non-interconnection areas and obtaining the interconnect lines. This overcomes the technical prejudice that lasers can only be used for drilling, enabling direct laser processing of conductive lines by performing line or surface processing on the conductive material layer. Compared to exposure methods, the PCB interconnect line processing method provided in this application effectively reduces the amount of chemical reagents used and generates almost no wastewater. This not only reduces the emission of harmful substances but also significantly alleviates the pressure and cost of pollutant treatment. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 This is a flowchart illustrating a method for fabricating interconnect lines on a circuit board in one embodiment.

[0052] Figure 2 This is a schematic diagram of a surface processing scenario in one embodiment;

[0053] Figure 3 This is a schematic diagram of a scenario in one embodiment where multiple lasers are set up;

[0054] Figure 4 This is a schematic diagram of the structure of a laser processing device in one embodiment;

[0055] Figure 5 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0057] In circuit board manufacturing, conductive lines are often fabricated on the surface of the circuit board. Traditional techniques typically employ an exposure process to create these lines. This process involves steps such as film lamination, exposure, development, etching, and film removal, along with subsequent processing steps, to transfer the desired lines onto the circuit board. However, the exposure quality is affected by factors such as film quality and lamination effectiveness, resulting in inconsistent line thickness, open circuits, short circuits, vias, and poor interlayer alignment. Furthermore, the cumbersome process steps and the need for additional processing or treatment materials not only increase costs but also reduce processing efficiency. Traditional methods also generate large amounts of wastewater containing various pollutants, including heavy metal ions, organic matter, and other chemicals. Treatment of this wastewater is energy-intensive and has low recycling rates, hindering the industry's green development and increasing operating costs for businesses.

[0058] Laser drilling technology involves focusing a laser beam onto a small area of ​​material and using the interaction between the laser and the material to create circular or other shaped holes or grooves. While this method is environmentally friendly, laser drilling typically only creates point-like structures and is difficult to form circuits. Therefore, lasers are currently only used for drilling and not for etching lines or forming circuits on copper foil.

[0059] In one exemplary embodiment, such as Figure 1 As shown, a method for processing interconnect lines on a circuit board is provided. This method is applied to a laser processing device. This embodiment uses the execution subject of the method as the terminal for illustration. The terminal can be the laser processing device or other terminals capable of controlling the laser processing device, such as various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. The laser processing device can be a device capable of roughening the surface of a material using a high-energy-density laser beam. Roughening refers to creating an uneven structure on the surface of the material by applying a laser beam to the surface of the material to be processed. This can be achieved using at least one of the processing techniques such as laser drilling, scribing, and patterning. IoT devices can be smart speakers, smart TVs, smart air conditioners, smart in-vehicle devices, projection devices, etc. Portable wearable devices can be smartwatches, smart bracelets, head-mounted devices, etc. Head-mounted devices can be virtual reality (VR) devices, augmented reality (AR) devices, smart glasses, etc. It is understandable that the execution subject of this method can also be a server, or a system that includes both a terminal and a server, and can be implemented through the interaction between the terminal and the server.

[0060] In this embodiment, the method includes the following steps S10-S30. Wherein:

[0061] Step S10: Obtain the processing information of the circuit board, including the processing parameter information of the conductive material layer.

[0062] In this context, a circuit board (PCB) can refer to a substrate used in electronic devices to connect and support electronic components, such as a PCB (Printed Circuit Board) or an IC (Integrated Circuit) substrate. A PCB includes at least a core board and conductive material layers, and may also include organic material layers, inorganic material layers, etc. In some feasible embodiments, the core board can refer to the base material constituting the internal structure of the PCB, typically located in the middle of the PCB, with other layers stacked on the core board forming the circuit layers. In other feasible embodiments, for multilayer PCBs, the core board may be composed of the base material located in the middle of the PCB and the stacked layers processed on it. The core board can be made of one or more composite materials, such as metallic materials, organic materials, and inorganic materials. The conductive material layers use conductive materials, which can refer to materials that allow electric charge to move freely within them, thereby conducting current, such as copper, aluminum, glass, or composite materials.

[0063] The processing information of the circuit board can refer to the relevant data and parameters used to guide the processing technology and equipment operation during the circuit board manufacturing process. It can include at least one of the following: material, thickness, absorption efficiency, thermal conductivity, melting point, vaporization temperature, etc. of various materials or parts in the circuit board. It can also include at least one of the following: positional relationship, connection relationship, etc. of various materials or parts in the circuit board. The specific information can be determined according to the actual processing requirements. This embodiment does not impose any restrictions on this.

[0064] The processing information for a circuit board includes at least the processing parameters for the conductive material layer. These parameters refer to the physical and chemical properties of the conductive material layer, which directly affect the laser processing results and the final performance of the circuit board.

[0065] For example, the processing information of the circuit board can be automatically detected, or the processing information of the circuit board manually entered by relevant personnel can be obtained. The method for automatically detecting the processing information of the circuit board may include at least one of image recognition, thickness measurement, etc. The method for obtaining the processing information of the circuit board can be determined according to the actual situation, and this embodiment does not impose any limitations on it.

[0066] Step S20: Based on the processing parameter information, control the laser pulse to form overlapping focused spots on the conductive material layer.

[0067] In this embodiment, the method for processing interconnecting circuits on a circuit board is applied to a laser processing equipment. The laser processing equipment includes at least a laser, which is used to emit laser pulses. The laser pulses are used to concentrate laser energy on the surface of the conductive material layer by passing through the processing point of the conductive material layer of the circuit board, forming a light spot on the surface of the conductive material layer, and using the laser energy at the light spot to process the conductive material layer.

[0068] Laser processing equipment may also include a spot-moving device, which refers to a device capable of changing the position of the spot formed by the laser pulse on the surface of the conductive material layer. Examples include a displacement platform, a galvanometer, a rotating mirror, and an acousto-optic deflector. The displacement platform can generate relative displacement between the substrate and the laser pulse, while the galvanometer, rotating mirror, and acousto-optic deflector can change the position of the spot formed by the laser pulse on the surface of the conductive material layer by deflecting the laser pulse.

[0069] As an example, after determining the processing parameters of the conductive material layer, the corresponding laser processing parameters can be queried based on these parameters. Then, the laser processing equipment can be set up based on these parameters. After setting the laser processing parameters, the equipment can be started, causing it to emit multiple laser pulses onto the conductive material layer according to the laser processing parameters, resulting in overlapping focused spots on the conductive material layer. The laser processing parameters corresponding to the processing parameters of the conductive material layer should ensure that the laser pulses emitted by the laser form overlapping focused spots on the conductive material layer. A correspondence between the processing parameters and the laser processing parameters can be established in advance based on actual conditions and test results. During actual processing, this correspondence can be directly queried to quickly determine the laser processing parameters.

[0070] As another example, overlapping of focused laser spots and effective processing can be achieved by setting a first cylindrical lens group and a second cylindrical lens group with different focusing magnifications. The first cylindrical lens group can be placed in the optical path of the laser pulse to focus the laser pulse along a first direction. The second cylindrical lens group can be placed in the optical path of the laser pulse to focus the laser pulse along a second direction, which is not collinear with the first direction. The focusing magnification of the second cylindrical lens group is different from that of the first cylindrical lens group, thus forming an elliptical focused laser spot. A smaller focusing magnification can increase the length of the laser spot in that direction, thereby improving the overlap rate of the focused laser spots. At the same time, a larger focusing magnification can avoid the situation where the energy distribution is too dispersed and the energy density is insufficient due to an excessively large laser spot diameter, thus ensuring the effective execution of laser processing.

[0071] As another example, the overlapping of focused light spots and effective processing can also be achieved by adjusting the laser parameters and setting a first cylindrical lens group and a second cylindrical lens group with different focusing magnifications.

[0072] Step S30: Control the overlapping focused light spots to etch the conductive material layer, eliminate the non-interconnected lines on the conductive material layer, and obtain the interconnected lines.

[0073] Interconnect lines refer to conductive paths formed on a conductive material layer through processing, used to achieve electrical connections between electronic components. It is understood that a circuit board can have multiple interconnect lines, and each interconnect line can be formed using the circuit board interconnect line processing method provided in this embodiment.

[0074] For example, the interconnection area and non-interconnection area on the conductive material layer can be determined in advance according to the actual needs of the interconnection lines. The moving path of the focused spot is planned according to the position of the non-interconnection area. Then, the spot moving device is controlled according to the planned moving path so that the spot moving device controls the interaction between the spot and the non-interconnection area according to the moving path to eliminate the non-interconnection area. The interconnection area that is not eliminated is the interconnection line.

[0075] In the aforementioned method for processing interconnect lines on a circuit board, the processing information of the circuit board is first obtained, including processing parameters of the conductive material layer. Then, based on these parameters, laser pulses are controlled to form overlapping focused spots on the conductive material layer. These overlapping focused spots are then used to etch the conductive material layer, eliminating non-interconnection lines and obtaining the interconnect lines. This overcomes the technical prejudice that lasers can only be used for drilling, allowing for line or surface processing on the conductive material layer, thus enabling direct laser processing of conductive lines. Compared to exposure methods, the circuit board interconnect line processing method provided in this application effectively reduces the amount of chemical reagents used and produces almost no wastewater. This not only reduces the emission of harmful substances to the environment but also significantly alleviates the pressure and cost of pollutant treatment.

[0076] In one exemplary embodiment, the conductive material layer is a copper foil with a thickness of 1μm-3μm, and the conductive material layer and the core board are laminated to form a circuit board.

[0077] Copper has excellent electrical conductivity, which means lower resistance and less energy loss. This is crucial for ensuring signal integrity and reducing heat generation. It also has good thermal conductivity, which helps to quickly dissipate the heat generated by electronic components during operation, thereby improving the heat dissipation efficiency of the entire system and ensuring long-term stable operation. In addition, copper is inexpensive and easy to process, making it an ideal material choice for current circuit board design and production.

[0078] It should be noted that when the conductive material layer is a copper foil layer, in related technologies, when etching the copper foil layer to process conductive lines, it is usually necessary to first form a copper foil with a thickness greater than 6μm on the core board to effectively prevent the copper foil layer from being etched through by chemical reagents, thereby avoiding damage to the core board during the etching process. However, the actual thickness of the copper foil layer only needs to be 2μm or even thinner to achieve conductivity between the circuit structures. Therefore, after the conductive lines are etched, the copper foil layer needs to be thinned as a whole by CMP (Chemical Mechanical Polishing) process.

[0079] In this embodiment, laser is used to directly process the copper foil layer, which can precisely control the processing depth and directly process conductive lines on the surface of the copper foil layer of 1μm-3μm. For example, conductive lines can be processed on the surface of copper foil layers of 1μm, 2μm, and 3μm without damaging the core board. Therefore, the thinning steps of the CMP process can be reduced and the processing efficiency can be improved.

[0080] In one exemplary embodiment, the laser pulse is an ultrafast laser pulse.

[0081] Ultrafast laser pulses refer to laser pulses with extremely short pulse widths, typically ranging from picoseconds to femtoseconds. Pulse width refers to the duration of a single laser pulse; a wider pulse width results in a longer pulse duration, leading to greater heat accumulation and more severe thermal impact. Shorter pulse widths reduce the heat-affected zone of materials, enabling more precise and efficient processing. For example, when the conductive material layer is copper foil, a pulse width on the nanosecond scale can still cause significant thermal impact, leading to quality issues such as deformation of the conductive material layer. Therefore, pulse widths need to reach the picosecond or even femtosecond scale to meet product quality requirements.

[0082] In the field of circuit board processing, laser types typically include carbon dioxide lasers, ultraviolet lasers, and ultrafast lasers. Among them, carbon dioxide lasers are difficult to be absorbed by copper foil and cannot be directly processed, thus making them unsuitable for circuit etching. Ultraviolet lasers have high focused spot energy, but the spot size is small, resulting in extremely low processing efficiency when directly processing large areas of copper foil. Ultrafast lasers have high focused spot energy and a moderate spot size, which is conducive to achieving overlapping of focused spots and also facilitates efficient processing of large areas of copper foil.

[0083] In an exemplary embodiment, a focusing system is provided in the optical path before the laser pulse is incident on the conductive material layer. The focusing system includes a first cylindrical lens group and a second cylindrical lens group.

[0084] The first cylindrical mirror group is used to focus the laser pulse along the first direction;

[0085] The second cylindrical mirror group is used to focus the laser pulse along a second direction, which is not collinear with the first direction. The focusing magnification of the second cylindrical mirror group is different from that of the first cylindrical mirror group.

[0086] The focusing system can refer to a combination of optical elements and mechanical structures used to concentrate a laser beam into a smaller area or focal point. In this embodiment, the focusing system includes at least a first cylindrical lens group and a second cylindrical lens group. A cylindrical lens group can refer to an optical system composed of one or more cylindrical lenses. The focusing direction of the cylindrical lens is the same as the curvature direction of the cylindrical lens; therefore, by simply rotating the cylindrical lens to align its curvature direction with the desired focusing direction, the laser beam can be focused along the desired focusing direction.

[0087] The first cylindrical mirror group can be positioned in the optical path of the laser pulse to focus the laser pulse along a first direction. The second cylindrical mirror group can be positioned in the optical path of the laser pulse to focus the laser pulse along a second direction, which is not collinear with the first direction. The focusing magnification of the second cylindrical mirror group is different from that of the first cylindrical mirror group, thus forming an elliptical focused spot. By using a smaller focusing magnification, the length of the spot in that direction can be increased, thereby improving the overlap rate of the focused spot. At the same time, by using a larger focusing magnification, the energy distribution can be avoided from being too dispersed and the energy density insufficient due to an excessively large spot diameter, thus ensuring the effective execution of laser processing.

[0088] In an exemplary embodiment, after controlling overlapping focused light spots to etch the conductive material layer, eliminating non-interconnected portions of the conductive material layer, and obtaining interconnected lines, the method further includes:

[0089] An insulating layer and a second conductive material layer are sequentially laminated onto the interconnect lines. The same circuit board interconnect line processing method as described above is repeated to fabricate a second interconnect line on the second conductive material layer. The interconnect lines and the second interconnect line together constitute the multilayer interconnect lines of the circuit board.

[0090] It should be noted that when the circuit board is a multilayer board, conductive lines need to be fabricated on each layer.

[0091] For example, in the process of multilayer board processing, after the interconnection line of any layer is processed, an insulating layer and a second conductive material layer can be laminated sequentially on the interconnection line. Then, the second conductive material layer is processed with interconnection lines in the same way. Specifically, the processing parameter information of the second conductive material layer is obtained, and the laser pulse is controlled to form overlapping focused spots on the second conductive material layer based on the processing parameter information of the second conductive material layer. The overlapping focused spots are controlled to form interconnection lines on the second conductive material layer.

[0092] Understandably, if the circuit board has more layers, an insulating layer and a second conductive material layer can be laminated sequentially on the processed interconnect lines, and the processing method of the circuit board interconnect lines can be repeated until the number of layers of the processed circuit board reaches the preset number, thus obtaining a processed multilayer board.

[0093] In this embodiment, compared to processing all target substrates separately and then laminating them uniformly, the layer-by-layer lamination and processing method in this embodiment can improve the alignment accuracy between layers, thereby improving the quality, performance and reliability of the target multilayer board.

[0094] In one exemplary embodiment, the method is applied to a laser processing device, which includes a laser and a beam deflection device; controlling laser pulses to form overlapping focused spots on a conductive material layer based on processing parameter information, and further includes:

[0095] Step S21: Based on the processing parameter information, set the laser parameters of the laser and the deflection speed of the laser pulse by the beam deflection device;

[0096] Different conductive materials possess different physical and chemical properties, which influence how they interact with laser pulses. The processing effect can be improved by adjusting the laser parameters, which can include at least one of laser power, pulse width, repetition frequency, and wavelength. Processing parameter information for the conductive material layer characterizes the physical or chemical properties of the conductive material, including at least one of material composition, thickness, absorption efficiency, thermal conductivity, melting point, and vaporization temperature. Different conductive materials have different absorption efficiencies for specific wavelengths of laser pulses. Insufficient absorption efficiency may lead to reduced processing efficiency, or even prevent the laser from penetrating the conductive material, thus hindering effective processing. Different conductive materials exhibit varying thermal conductivity. High thermal conductivity materials, such as copper and aluminum, can rapidly conduct heat, potentially affecting areas outside the processing zone and causing deformation or other quality problems. The melting point and vaporization temperature of different conductive materials may also differ. For materials with high melting points, higher laser power may be required to achieve the desired processing effect, while for conductive materials with low vaporization temperatures, excessive energy input should be avoided to prevent over-evaporation or sputtering.

[0097] A beam deflection device refers to an optical element or system capable of changing the propagation direction of a laser pulse, including galvanometers, rotating mirrors, or acousto-optic deflectors. Different beam deflection devices may have different processing areas and deflection speeds for laser pulses. For example, compared to rotating mirrors and acousto-optic deflectors, galvanometers have a larger processing area but a slower deflection speed for laser pulses. While rotating mirrors and acousto-optic deflectors deflect laser pulses faster, their processing areas are smaller. When the area to be processed is large, more partitioning and splicing processes are required.

[0098] The deflection speed of a laser pulse by a beam deflector can refer to the speed at which the laser pulse moves under the deflection of the beam deflector, and can be angular velocity or linear velocity, etc. The deflection speed can be controlled by adjusting the operating state of the beam deflector itself. For example, for a rotating mirror or galvanometer, the deflection speed can be controlled by adjusting the rotating mirror or its rotation speed; for an acousto-optic deflector, the deflection speed can be controlled by adjusting the input signal frequency of the acousto-optic deflector. In some feasible embodiments, the deflection speed of a laser pulse by a beam deflector can be characterized by the speed at which the laser pulse moves as it strikes the conductive material layer, forming a spot.

[0099] In some feasible implementations, the beam deflection device can be a galvanometer. On the one hand, although rotating mirrors and acousto-optic deflectors deflect laser pulses relatively quickly, linear processing can only be achieved if the repetition frequency and laser power of the laser are matched. Even if the laser power is high enough, if the repetition frequency is low, only point structures can be processed. If the laser power is insufficient, even if the repetition frequency is high enough, if the single pulse energy is too low, the laser pulse cannot penetrate the conductive material, and effective processing cannot be achieved. Neither of these can meet the actual requirements for conductive circuit processing, and currently, the repetition frequency and laser power of lasers are often difficult to meet the required requirements. On the other hand, compared to rotating mirrors and acousto-optic deflectors, although galvanometers deflect slower, they have a larger processing area, thus reducing the number of partitions and improving processing efficiency.

[0100] For example, after determining the circuit board, the corresponding laser parameters and deflection speed can be set according to the processing parameter information of the conductive material layer on the circuit board, the laser can be set based on the laser parameters corresponding to the processing parameter information, and the beam deflection device can be set based on the deflection speed corresponding to the processing parameter information.

[0101] The laser parameters and deflection speeds corresponding to different processing parameters can be determined before laser processing based on actual conditions or test results, and can be in the form of data tables or functional relationships. During laser processing, the corresponding laser parameters and deflection speeds can be quickly mapped or calculated based on the processing parameter information.

[0102] Step S22: Based on the laser parameters, control the laser to continuously emit multiple laser pulses, and control the beam deflection device to deflect each laser pulse sequentially according to the deflection speed, so that the light spots formed by any two successive laser pulses on the conductive material layer overlap with each other.

[0103] For example, after setting up the laser and beam deflection device, a start signal can be sent to both the laser and the beam deflection device, instructing them to start working synchronously. Upon receiving the start signal, the laser continuously emits multiple laser pulses according to its parameters. Upon receiving the start signal, the beam deflection device sequentially deflects the incident laser pulses according to a set deflection speed.

[0104] After the laser is turned on, the rotating mirror can be immediately controlled to rotate at a pre-set speed in a single direction at a uniform speed. Simultaneously, the processing position control device is controlled to change according to a pre-set working state change speed. In this way, by simply setting the rotation speed of the rotating mirror and the working state change speed of the processing position control device so that the movement speed of the action point in the first direction is greater than the movement speed of the action point in the second direction, the two can work together to process multiple rows of holes on the surface processing area of ​​the substrate, thereby achieving the roughening treatment of the substrate surface.

[0105] In some feasible implementations, laser parameters and deflection speed are used to ensure that the energy density of the laser spot formed by each laser pulse on the conductive material layer exceeds a preset energy density threshold, the pulse width of the laser spot formed by each laser pulse on the conductive material layer is less than a preset pulse width threshold, and that the laser spots formed by any two successive laser pulses on the conductive material layer overlap. The preset energy density threshold and preset pulse width threshold can be determined based on the processing parameters of the conductive material. The preset energy density threshold can be the minimum energy density at which the laser pulse can effectively process the conductive material layer, and the preset pulse width threshold can be the maximum pulse width at which the thermal impact of the laser pulse on the conductive material layer meets actual requirements. In this way, the thermal impact of the conductive material layer can be controlled while ensuring effective linear processing, so that the processed conductive material layer meets actual requirements.

[0106] In some feasible implementations, a single beam deflection device can deflect laser pulses to achieve line processing, but surface processing is more complex and less efficient. Multiple beam deflection devices can be used, or a processing position control device can be added. The processing position control device can refer to a device capable of controlling the displacement of the processing platform or other optical systems. For example, the processing position control device and the processing platform can form a displacement platform to move the circuit board. One beam deflection device can be controlled to deflect each laser pulse sequentially along a first direction according to a deflection speed, while another beam deflection device or processing position control device can be controlled to move the laser pulses along a second direction. The first and second directions are not collinear; in some feasible implementations, the first direction can be perpendicular to the second direction. Thus, as... Figure 2 As shown, a beam deflection device can be used to process multiple point-like structures, at least partially overlapping each other, along a first direction on a conductive material layer. Figure 2The circles in the diagram represent point structures. At least some areas of these point structures overlap to form line structures. Simultaneously, another beam deflection device or processing position control device can be used to move the laser pulse in the second direction, so that the beam deflection device can start from a new starting point and process a new line structure along the first direction. This process is repeated. As long as the movement distance in the second direction is less than the spot diameter, the line structures can be connected together, thereby realizing the processing of planar structures on the conductive material layer.

[0107] In this embodiment, the beam deflection device has high processing accuracy and fast deflection speed, enabling high-precision and high-efficiency processing of circuit board interconnect lines.

[0108] In an exemplary embodiment, the laser parameters include at least one of laser power and repetition frequency; before setting the laser parameters and the deflection speed of the laser pulse by the beam deflection device according to the processing parameter information, the method further includes:

[0109] The beam energy density corresponding to the processing parameters is detected. Based on the beam energy density and the preset beam overlap rate, the deflection speed of the laser pulse by the beam deflection device, as well as the laser power and repetition frequency of the laser are determined. The preset beam overlap rate is positively correlated with the beam size and the repetition frequency, and negatively correlated with the deflection speed. The beam energy density is positively correlated with the laser power, negatively correlated with the beam size, and negatively correlated with the repetition frequency.

[0110] In this context, spot energy density refers to the energy emitted by a single laser pulse on a unit area. Spot energy density is related to the spot size and the laser's single-pulse energy; a smaller spot size and higher single-pulse energy result in a higher spot energy density. Conversely, single-pulse energy is related to the laser's power and repetition frequency; higher laser power and lower repetition frequency result in higher single-pulse energy. Therefore, spot energy density is positively correlated with laser power, negatively correlated with spot size, and negatively correlated with repetition frequency.

[0111] The beam overlap rate refers to the ratio of the overlapping area between the beams formed by two consecutive laser pulses on a conductive material layer to the area of ​​each individual beam. The beam overlap rate is related to the beam size and the distance between adjacent laser pulses. A larger beam size and a smaller distance between adjacent laser pulses result in a higher beam overlap rate. The distance between adjacent laser pulses is related to the deflection speed of the beam deflector and the repetition frequency of the laser. A slower deflection speed and a higher repetition frequency result in a smaller distance between adjacent laser pulses and a higher beam overlap rate. Therefore, the beam overlap rate is positively correlated with beam size and repetition frequency, and negatively correlated with deflection speed.

[0112] To fabricate interconnect lines on a circuit board, sufficient laser energy density and a certain laser overlap rate are required. Sufficient energy density ensures the laser pulse interacts with the conductive material layer for effective processing, while a certain overlap rate enables linear processing. A faster beam deflection speed results in higher processing efficiency. However, excessively fast deflection can increase the distance between adjacent laser pulses, leading to low or no overlap, making line or surface processing impossible. In such cases, increasing the laser repetition rate increases the overlap rate. However, as the repetition rate increases, the single-pulse energy decreases. Insufficient energy prevents interaction with the conductive material layer, hindering the elimination of non-interconnected areas and preventing effective processing. Therefore, increasing laser power is necessary. However, laser power typically has an upper limit. When the laser power reaches its maximum, processing efficiency can only be reduced by decreasing the repetition rate and laser cutting speed to ensure effective processing and laser beam continuity.

[0113] For example, before laser processing, the processing parameters of the conductive material layer can be obtained. Then, the processing parameters and the corresponding spot energy density can be queried from historical detection data. Alternatively, a test sample can be made based on the processing parameters, and the spot energy density corresponding to the test sample can be detected. Then, the laser power, repetition frequency, and deflection speed that simultaneously meet the requirements of spot energy density and preset spot overlap rate can be found by optimizing the model or by adjusting the parameters on the physical equipment or simulation model of the laser and beam deflection device.

[0114] The detection method for the spot energy density corresponding to the processing parameter information may include: using a laser to emit laser pulses to the test sample corresponding to the processing parameter information, while keeping other laser parameters unchanged, continuously decreasing the spot energy density test value until the test sample cannot be effectively processed under the action of the laser pulse, and determining the spot energy density test value of the previous test as the spot energy density corresponding to the processing parameter information.

[0115] In some feasible implementations, when the conductive material layer is a copper foil layer, the spot energy density needs to reach 0.25 μJ / μm. 2 Through adjustments, the laser spot diameter was set to 30 μm, the laser repetition frequency to 500 kHz, the laser power to 7.5 W, the spot movement speed to 1000 mm / s, and the spot energy density to 0.25 μJ / μm. 2 Furthermore, the beam overlap rate can reach 93.3%, thus enabling efficient line processing on copper surfaces.

[0116] In this embodiment, by adjusting the deflection speed of the beam deflection device, as well as the laser power and repetition frequency of the laser, the processing efficiency, beam overlap rate, and beam capability density can be effectively balanced, thereby improving processing efficiency while ensuring effective linear processing.

[0117] In one exemplary embodiment, the conductive material layer is divided into multiple regions to be processed; the laser is controlled to continuously emit multiple laser pulses based on laser parameters, and the beam deflection device is controlled to deflect each laser pulse sequentially according to the deflection speed, including:

[0118] Step S221, Positioning Step: Select and position the target area to be processed from each area to be processed according to the preset processing sequence.

[0119] It should be noted that, since the processing area of ​​the beam deflection device is limited, if the area to be processed on the conductive material layer is larger than the processing area of ​​the beam deflection device, the area to be processed on the conductive material layer can be divided into multiple processing areas. Each processing area is smaller than the processing area of ​​the beam deflection device. Then, other beam deflection devices or displacement platforms can be used to jump between processing areas, thereby realizing the processing of a large-area conductive material layer.

[0120] For example, before laser processing, the area to be processed on the conductive material layer can be divided into multiple areas to be processed. These areas can then be sorted according to actual needs to determine the processing order. During laser processing, the target area to be processed can be selected from the areas to be processed according to the predetermined processing order. Then, the laser pulse can be deflected to a preset starting position on the target area using a beam deflection device or a displacement platform.

[0121] Step S222: Based on the laser parameters, control the laser to continuously emit multiple laser pulses, and control the beam deflection device to deflect each laser pulse sequentially according to the deflection speed, so as to control each laser pulse to process the target area to be processed.

[0122] For example, after the laser pulses are deflected to a preset starting position in the target processing area, a start signal can be sent to the laser and the beam deflection device, instructing them to start working synchronously. Upon receiving the start signal, the laser continuously emits multiple laser pulses according to its parameters. Upon receiving the start signal, the beam deflection device sequentially deflects the incident laser pulses at a set deflection speed, allowing the laser pulses to process within the target processing area.

[0123] Step S223: Return to the positioning step until all areas to be processed are completed.

[0124] For example, after the target area to be processed is completed, the process can return to the positioning step, determine the next target area to be processed according to the preset processing order, and process the next target area to be processed. This process is repeated until all areas to be processed are completed, thus completing the processing of the conductive material layer.

[0125] In this embodiment, by using a partitioned processing method, the processing area limitation of the beam deflection device can be overcome, enabling the processing of a larger area of ​​conductive material layers.

[0126] In one exemplary embodiment, there are multiple lasers; the laser parameters include repetition frequency and emission start time, wherein each laser has the same repetition frequency and a different emission start time.

[0127] It should be noted that the laser power and repetition frequency of current lasers are limited. With limited laser power, even if the repetition frequency can meet the requirements, the single pulse energy will be very low, which will not be able to effectively process the conductive material layer. To meet the single pulse energy requirements, the repetition frequency may not be able to make the spot continuous, thus making it impossible to achieve linear processing.

[0128] In this case, multiple lasers can be used, each with the same repetition frequency but different emission start times. This allows for exceeding the upper limits of laser power and repetition frequency for each individual laser, multiplying the laser power and repetition frequency, thereby enabling linear processing on a conductive material layer. For example, as... Figure 3 As shown, two lasers 302 and a beam deflection device 304 are provided. Assuming that the repetition frequency of both lasers 302 is 1Hz and the laser power is 1W, the emission start time of the left laser 302 is 0 seconds and the emission start time of the right laser 302 is 0.5 seconds, then the laser pulse can process the circuit board 306 once every 0.5s. Compared with a single laser transmitting 1J of energy to the circuit board 306 every 1s, after adding lasers, the circuit board 306 can receive 1J of energy every 0.5s. In this way, the actual processing frequency can be increased without reducing the single-pulse laser energy.

[0129] In this embodiment, by using multiple lasers to emit light asynchronously at the same repetition frequency, the upper limits of laser power and repetition frequency can be broken, enabling linear processing on a conductive material layer.

[0130] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps.

[0131] Based on the same inventive concept, this application also provides a laser processing apparatus for implementing the above-described method for processing interconnect lines on a circuit board. The solution provided by this apparatus is similar to the solution described in the above method; therefore, the specific limitations in one or more laser processing apparatus embodiments provided below can be found in the limitations of the processing method for interconnect lines on a circuit board described above, and will not be repeated here.

[0132] In one exemplary embodiment, a circuit board is provided, the circuit board including interconnect lines, the interconnect lines on the circuit board being fabricated using the circuit board interconnect line fabrication method described above.

[0133] In one exemplary embodiment, such as Figure 4 As shown, a laser processing device is provided, including: a processing platform 402, a laser 404, and a beam deflection device 406, wherein:

[0134] The processing platform 402 is configured to place a circuit board 408, which includes a core board and a conductive material layer.

[0135] Laser 404 is configured to emit laser pulses based on processing parameter information of the conductive material layer, the laser pulses being used to process the conductive material layer;

[0136] The beam deflection device 406 is configured to control the laser pulse to form overlapping focused beams on the conductive material layer based on the processing parameter information of the conductive material layer, and to control the overlapping focused beams to etch the conductive material layer, thereby eliminating the non-interconnected lines on the conductive material layer and obtaining interconnected lines.

[0137] In one exemplary embodiment, the laser processing equipment further includes a focusing system disposed in the optical path before the laser pulse is incident on the conductive material layer, including a first cylindrical lens group and a second cylindrical lens group;

[0138] The first cylindrical mirror group is used to focus the laser pulse along the first direction;

[0139] The second cylindrical mirror group is used to focus the laser pulse along a second direction, which is not collinear with the first direction. The focusing magnification of the second cylindrical mirror group is different from that of the first cylindrical mirror group.

[0140] In one exemplary embodiment, a laser processing system is provided, the system including a controller and the aforementioned laser processing equipment; the controller is used to control the aforementioned laser processing equipment to realize a method for processing interconnect lines on a circuit board, specifically for:

[0141] Obtain the processing information of the circuit board, including the processing parameters of the conductive material layer;

[0142] The laser processing equipment is controlled based on the processing parameter information so that the laser pulses form overlapping focused spots on the conductive material layer, and the overlapping focused spots form interconnect lines on the conductive material layer.

[0143] In one exemplary embodiment, the controller may also implement the steps in the above-described method embodiments.

[0144] In one exemplary embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 5As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, Near Field Communication (NFC), or other technologies. When the computer program is executed by the processor, it implements a method for fabricating interconnect circuits on a circuit board. The display unit is used to form a visually visible image and can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0145] Those skilled in the art will understand that Figure 5 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0146] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0147] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0148] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0149] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0150] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, database, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0151] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0152] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for processing interconnect lines on a circuit board, characterized in that, The circuit board includes a core board and a conductive material layer, and the processing method includes: Obtain the processing information of the circuit board, the processing information including the processing parameter information of the conductive material layer; Based on the processing parameter information, the laser pulse is controlled to form overlapping focused spots on the conductive material layer; The overlapping focused light spots are controlled to etch the conductive material layer, eliminating the non-interconnected parts of the conductive material layer to obtain interconnected lines.

2. The method according to claim 1, characterized in that, The conductive material layer is a copper foil with a thickness of 1μm-3μm, and the conductive material layer and the core board are laminated to form a circuit board.

3. The method according to claim 1, characterized in that, After controlling the overlapping focused light spots to etch the conductive material layer, eliminating the non-interconnected portions of the conductive material layer, and obtaining the interconnected lines, the process further includes: An insulating layer and a second conductive material layer are sequentially laminated on the interconnect line, and the second interconnect line is fabricated on the second conductive material layer by repeating the circuit board interconnect line processing method as described in claim 1. The interconnecting lines and the second interconnecting line together constitute the multilayer interconnecting lines of the circuit board.

4. The method according to claim 1, characterized in that, The method is applied to a laser processing equipment, which includes a laser and a beam deflection device; the step of controlling laser pulses based on the processing parameter information to form overlapping focused spots on the conductive material layer further includes: Based on the processing parameter information, the laser parameters of the laser and the deflection speed of the laser pulse by the beam deflection device are set; Based on the laser parameters, the laser is controlled to continuously emit multiple laser pulses, and the beam deflection device is controlled to deflect each laser pulse sequentially according to the deflection speed, so that the light spots formed by any two successive laser pulses on the conductive material layer overlap with each other.

5. The method according to claim 4, characterized in that, The laser parameters include at least one of laser power and repetition frequency; before setting the laser parameters of the laser and the deflection speed of the laser pulse by the beam deflection device according to the processing parameter information, the method further includes: Detect the spot energy density corresponding to the processing parameter information; Based on the beam energy density and the preset beam overlap rate, the deflection speed of the laser pulse by the beam deflection device, as well as the laser power and repetition frequency of the laser, are determined. The preset beam overlap rate is positively correlated with the beam size and the repetition frequency, and negatively correlated with the deflection speed. The beam energy density is positively correlated with the laser power, negatively correlated with the beam size, and negatively correlated with the repetition frequency.

6. The method according to claim 4, characterized in that, Dividing the conductive material layer into multiple processing areas; controlling the laser to continuously emit multiple laser pulses based on the laser parameters, and controlling the beam deflection device to sequentially deflect each laser pulse according to the deflection speed, includes: Positioning Step: Select and position the target area to be processed from each of the pre-defined processing areas according to the preset processing sequence; Based on the laser parameters, the laser is controlled to continuously emit multiple laser pulses, and the beam deflection device is controlled to deflect each laser pulse sequentially according to the deflection speed, so as to control each laser pulse to process the target area to be processed; Return to the positioning steps and continue until all areas to be processed are completed.

7. The method according to claim 4, characterized in that, The number of lasers is multiple; the laser parameters include repetition frequency and emission start time, wherein the repetition frequency of each laser is the same, and the emission start time of each laser is different.

8. The method according to claim 1, characterized in that, The laser pulse is an ultrafast laser pulse.

9. The method according to claim 1, characterized in that, A focusing system is provided in the optical path before the laser pulse is incident on the conductive material layer. The focusing system includes a first cylindrical lens group and a second cylindrical lens group. The first cylindrical mirror group is used to focus the laser pulse along a first direction; The second cylindrical lens group is used to focus the laser pulse along a second direction, which is not collinear with the first direction, and the focusing magnification of the second cylindrical lens group is different from that of the first cylindrical lens group.

10. A laser processing device, characterized in that, The laser processing equipment includes: A processing platform is configured to place a circuit board, the circuit board including a core board and a conductive material layer; A laser is configured to emit laser pulses based on processing parameter information of a conductive material layer, the laser pulses being used to process the conductive material layer; The beam deflection device is configured to control laser pulses to form overlapping focused spots on the conductive material layer based on processing parameter information of the conductive material layer, and to control the overlapping focused spots to etch the conductive material layer, thereby eliminating non-interconnected circuit portions on the conductive material layer and obtaining interconnected circuits.

11. A laser processing system, characterized in that, The system includes a controller and the laser processing equipment of claim 8, wherein the controller is used for: Obtain the processing information of the circuit board, the processing information including the processing parameter information of the conductive material layer; Based on the processing parameter information, the laser processing equipment is controlled so that the laser pulse forms overlapping focused spots on the conductive material layer, and the overlapping focused spots etch the conductive material layer to eliminate the non-interconnected lines on the conductive material layer, thereby obtaining interconnected lines.

12. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 7.

13. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 9.

14. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 9.

15. A circuit board, characterized in that, The circuit board includes interconnect lines, which are fabricated using the method described in any one of claims 1 to 9.

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