A Multi-device Collaborative Control Method for PCB Pattern Transfer Production Line

Abstract

This invention relates to the field of general control or adjustment system technology, and discloses a multi-device collaborative control method for a PCB pattern transfer production line, comprising: calling a multi-dimensional process sensitivity coefficient matrix to extract exposure error and etching error components from the nonlinear cumulative line error output by the self-tester; using a one-dimensional logic sliding window to buffer the etching error components of the continuous substrate to calculate the average dynamic deviation; comparing the average dynamic deviation with a control dead zone safety threshold, and when the threshold is not exceeded, the control loop enters a protective resting state for the spray pressure proportional adjustment valve; when the threshold is exceeded, the discrete pressure compensation amount is calculated and output to the spray pressure proportional adjustment valve. This invention eliminates feedback hysteresis caused by long-distance transmission through error cascading deconstruction, restores mixed geometric deviations to single-process drift, and isolates random mechanical noise by using dead zone control to avoid surge of the adjustment mechanism, thereby achieving stable convergence of process parameters of multi-device cascade.

Description

Technical Field

[0001] This invention relates to a multi-device collaborative control method for a PCB pattern transfer production line, belonging to the general field of control or regulation system technology. Background Technology

[0002] Currently, in circuit board manufacturing lines, the pattern transfer process adopts a continuous flow processing architecture consisting of laser imaging, developing, and etching single-machine units connected in series. This architecture meets high-volume production demands through process integration. The stability of single-machine parameter states and the dynamic matching of the production line's transport rhythm form the basic premise for maintaining the overall production yield. Under long-distance transport conditions, the processed substrate sequentially crosses multiple process reaction zones. Due to the fixed spatial span and transport time delay of the transport path, the end measurement unit collects the geometric deviation of the line. This deviation is a nonlinear cumulative error caused by the combined effect of multiple preceding processes. The time lag caused by this spatial span results in the complete decoupling of the end-sensing data from the current transient operating variables of the front-end equipment in space and time. When the processing line is running continuously, the error data collected by the end cannot immediately represent the status of the substrate currently being processed at the front end, leading to large time delays and blind adjustments by the adjustment mechanism, which affects the overall line control accuracy.

[0003] To mitigate the control divergence caused by transport delays, directly feeding back commands to the front-end equipment based on the accumulated deviation at the end, attempting to correct the control variable through linear adjustment, not only fails to offset the time displacement caused by transport but also easily leads to misaligned application of control quantities due to the overlapping mechanisms of exposure deformation and excessive etching. Because the causes of mixed errors are opaque, this single-variable feedback triggers control saturation, causing high-frequency surge in the underlying pressure proportional control valve, leading to mechanical fatigue of the control components and system oscillation. Although adjusting the physical structure of the horizontal transport line rollers can improve the liquid-receiving environment on the plate surface, in the global flow conditions of multiple cascaded devices, the single-machine level control method also has fundamental shortcomings. For example, publication number CN117... Chinese invention patent application 881095A discloses a method and system for compensating and optimizing line etching parameters for fine circuit boards. It uses positioning points set in the board surface segmentation blocks to perform in-situ ranging and adjusts the nozzle parameters using the derivative ratio of the real-time etching depth. However, in the high-volume continuous flow pattern transfer production line, the inside of the etching machine is in an extreme environment of high atomization and strong corrosion. The in-situ optical ranging hardware window is easily corroded by acid mist or blocked by droplets, resulting in the failure of the measurement optical path. Its underlying architecture implicitly relies on the premise of interference-free in-situ micro-measurement, which is fundamentally mismatched with the actual complex working conditions. Moreover, this isolated local instantaneous feedback lacks global identification of the time and space transmission delay of multi-task sequence, which is very easy to cause control divergence.

[0004] Therefore, the technical problem to be solved by this invention is how to achieve targeted identification of accumulated geometric errors by establishing a discrete tracking mechanism that includes a queue of spatiotemporal traces while maintaining continuous production line operation, and how to achieve stable convergence of cascaded control loops under large time delay interference. Summary of the Invention

[0005] To address the problems in the background art, the technical solution of the present invention is as follows: A multi-device collaborative control method for a PCB pattern transfer production line, comprising the following steps: Step S1: Obtain the nonlinear cumulative line error generated by the substrate through the detector, call the pre-stored multidimensional process sensitivity coefficient matrix to calculate and separate the process component in the nonlinear cumulative line error, use the physical difference between the measured laser power and the calibrated power to peel off the exposure error component from the process component, and at the same time convert the etching error component from the process component based on the absolute deviation between the dynamic spray pressure of the etching machine and the process standard pressure. Step S2: The etching error components generated by multiple consecutive substrates are sequentially cached through a one-dimensional logic sliding window, and the average dynamic deviation within the one-dimensional logic sliding window is calculated. Step S3: The average dynamic deviation is compared with the preset control dead zone safety threshold. When the average dynamic deviation does not exceed the preset control dead zone safety threshold, the control loop enters a protective resting state for the spray pressure proportional regulating valve of the etching machine and does not issue a regulation command. When the average dynamic deviation exceeds the preset control dead zone safety threshold, the discrete pressure compensation amount under the current control cycle is calculated based on the loop gain calibration constant coefficient, sign function and the minimum discrete pressure regulation physical step unit of the spray pressure proportional regulating valve. The discrete pressure compensation amount is then converted into a control signal and output to the spray pressure proportional regulating valve through the communication gateway.

[0006] Preferably, step S2 includes: when each new substrate flows in, pressing the etching error component corresponding to the new substrate into the end of the one-dimensional logic sliding window, and simultaneously popping out the historical error component at the top of the one-dimensional logic sliding window, keeping the length of the one-dimensional logic sliding window constant at 5 to 15 substrates, and using the built-in arithmetic logic unit to accumulate the etching error components of all substrates in the current one-dimensional logic sliding window in real time and calculate the arithmetic mean as the average dynamic deviation, wherein the preset control dead zone safety threshold ranges from 0.5μm to 1.5μm.

[0007] Preferably, step S1 includes: using the first mapping coefficient between exposure intensity and circuit pattern topology distortion in the multidimensional process sensitivity coefficient matrix to separate the exposure bias from the process component in the nonlinear cumulative circuit error; and using the second mapping coefficient between etching rate and circuit pattern boundary reduction in the multidimensional process sensitivity coefficient matrix to separate the etching bias from the process component in the nonlinear cumulative circuit error.

[0008] Preferably, after the exposure error component is extracted in step S1, the method further includes the following steps: inputting the exposure error component as a compensation input for the exposure locality to the pulse trigger delay controller of the lithography machine, and adjusting the triggering time of the laser beam to offset the exposure position deviation caused by the nonlinear cumulative displacement error of the stage.

[0009] Preferably, step S3 includes: converting a digital control word containing discrete pressure compensation into a voltage control signal through a digital-to-analog converter module in a communication gateway, and then converting the voltage control signal into an industrial standard current control signal of 4mA to 20mA through a voltage-to-current conversion circuit, thereby driving the electromagnetic coil of the spray pressure proportional regulating valve to change the valve opening.

[0010] Preferably, the method further includes the following steps: during the operation of the one-dimensional logic sliding window, if the absolute value of the rate of change of the continuously flowing etching error component is greater than the preset abnormal jump threshold, it is determined that there is a pulse mechanical shock in the current production environment, and the window freeze protection is automatically activated. The historical data in the one-dimensional logic sliding window remains unchanged within the current 3 control cycles, and the error data of the new substrate is rejected until the absolute value of the rate of change drops below the preset abnormal jump threshold.

[0011] Preferably, the method further includes the following steps: sequentially recording the time series of multiple consecutive sets of average dynamic deviations, and using the least squares trend fitting algorithm to calculate the first derivative of the time series as the process drift change rate; when the process drift change rate continues to be greater than the preset deterioration slope threshold and the current average dynamic deviation approaches the preset control dead zone safety threshold, before the average dynamic deviation exceeds the preset control dead zone safety threshold, an early warning signal of sub-health of the system where the spray pressure proportional regulating valve is located is output in advance.

[0012] Preferably, before step S1, the method further includes the following steps: obtaining the initial geometric linewidth error of the production line by prototyping and developing and etching a standard test substrate; after eliminating environmental noise interference, using the initial geometric linewidth error as the zero-point reference for the nonlinear cumulative line error; and writing the physical calibration value of the spray pressure at this time as the process standard pressure into the non-volatile memory.

[0013] Preferably, the method further includes the following steps: during the period when the control loop enters a protective resting state for the spray pressure proportional adjustment valve and does not issue adjustment commands, the main controller synchronously reads the real-time operating status data of the lithography machine. If the real-time operating status data indicates that the core temperature fluctuation of the laser generator of the lithography machine is less than 0.1℃, the current exposure energy calibration value is maintained unchanged; if the core temperature fluctuation is greater than or equal to 0.1℃, the exposure energy recalibration process is triggered, and the power drift caused by temperature change is offset by adjusting the laser pump current to ensure the parameter coordination and convergence between the exposure process and the etching process.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. In the multi-device collaborative control of the PCB pattern transfer production line, the main controller synchronously constructs a state vector sequence with spatiotemporal identification based on the flow status of the transmission channel. It maintains a traceability queue containing historical measured parameters of multiple tasks in the memory space. In this way, the time-lag line detection deviation generated at the end of the production line is established as a definite causal relationship chain with the corresponding substrate processing process parameters processed at specific spatial nodes at the front end of the production line. This eliminates the feedback time misalignment and control lag caused by long-distance mechanical transmission, freeing the feedback adjustment mechanism from the blind adjustment state caused by spatial span and avoiding the overload of the adjustment amount or the oscillation and divergence of the control loop in the closed-loop line correction control flow.

[0015] 2. The main controller calls the multi-dimensional process sensitivity coefficient matrix pre-stored in the non-volatile memory to perform cascaded deconstruction calculation on the nonlinear cumulative line error output by the end scanning equipment. It uses the physical difference between the measured laser power and the calibrated power to extract the single exposure error component. At the same time, it combines the absolute deviation between the dynamic spray pressure and the process standard pressure to convert the single etching error component. In this way, the overlapping and intertwined mixed geometric errors are precisely reduced to the substantial physical drift of the control variables within each process. This overcomes the problem of multi-task sequence error coupling caused by the complexity of the line pattern evolution and provides a definite and independent control target for subsequent collaborative scheduling.

[0016] 3. The main controller opens a one-dimensional logic sliding window in the data layer to sequentially cache the error components generated by multiple consecutive substrates. It uses an arithmetic logic unit to calculate the average dynamic deviation within the current window and directly compares the average dynamic deviation with the preset control dead zone safety threshold. When the set threshold range is met, the control loop enters a protective resting state and does not issue adjustment commands. This effectively isolates random physical noise and mechanical transmission jitter in the production environment, avoids mechanical fatigue or system overcorrection oscillation caused by continuous high-frequency response of the regulating proportional valve and other regulating mechanisms, and ensures that the entire continuous production line remains constant during long-term operation. Attached Figure Description

[0017] Figure 1 This is a flowchart of the discrete compensation control for nonlinear cumulative line error of the present invention. Figure 2 This is a structural diagram showing the stable convergence of process parameters in the multi-device cascaded process of the present invention.

[0018] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0020] A multi-device collaborative control method for a PCB pattern transfer production line includes the following steps: Step S1: Obtain the nonlinear cumulative line error generated by the substrate through the detector, call the pre-stored multidimensional process sensitivity coefficient matrix to calculate and separate the process component in the nonlinear cumulative line error, use the physical difference between the measured laser power and the calibrated power to peel off the exposure error component from the process component, and at the same time convert the etching error component from the process component based on the absolute deviation between the dynamic spray pressure of the etching machine and the process standard pressure. Step S2: The etching error components generated by multiple consecutive substrates are sequentially cached through a one-dimensional logic sliding window, and the average dynamic deviation within the one-dimensional logic sliding window is calculated. Step S3: The average dynamic deviation is compared with the preset control dead zone safety threshold. When the average dynamic deviation does not exceed the preset control dead zone safety threshold, the control loop enters a protective resting state for the spray pressure proportional regulating valve of the etching machine and does not issue a regulation command. When the average dynamic deviation exceeds the preset control dead zone safety threshold, the discrete pressure compensation amount under the current control cycle is calculated based on the loop gain calibration constant coefficient, sign function and the minimum discrete pressure regulation physical step unit of the spray pressure proportional regulating valve. The discrete pressure compensation amount is then converted into a control signal and output to the spray pressure proportional regulating valve through the communication gateway.

[0021] Preferably, step S2 includes: when each new substrate flows in, pressing the etching error component corresponding to the new substrate into the end of the one-dimensional logic sliding window, and simultaneously popping out the historical error component at the top of the one-dimensional logic sliding window, keeping the length of the one-dimensional logic sliding window constant at 5 to 15 substrates, and using the built-in arithmetic logic unit to accumulate the etching error components of all substrates in the current one-dimensional logic sliding window in real time and calculate the arithmetic mean as the average dynamic deviation, wherein the preset control dead zone safety threshold ranges from 0.5μm to 1.5μm.

[0022] Preferably, step S1 includes: using the first mapping coefficient between exposure intensity and circuit pattern topology distortion in the multidimensional process sensitivity coefficient matrix to separate the exposure bias from the process component in the nonlinear cumulative circuit error; and using the second mapping coefficient between etching rate and circuit pattern boundary reduction in the multidimensional process sensitivity coefficient matrix to separate the etching bias from the process component in the nonlinear cumulative circuit error.

[0023] Preferably, after the exposure error component is extracted in step S1, the method further includes the following steps: inputting the exposure error component as a compensation input for the exposure locality to the pulse trigger delay controller of the lithography machine, and adjusting the triggering time of the laser beam to offset the exposure position deviation caused by the nonlinear cumulative displacement error of the stage.

[0024] Preferably, step S3 includes: converting a digital control word containing discrete pressure compensation into a voltage control signal through a digital-to-analog converter module in a communication gateway, and then converting the voltage control signal into an industrial standard current control signal of 4mA to 20mA through a voltage-to-current conversion circuit, thereby driving the electromagnetic coil of the spray pressure proportional regulating valve to change the valve opening.

[0025] Preferably, the method further includes the following steps: during the operation of the one-dimensional logic sliding window, if the absolute value of the rate of change of the continuously flowing etching error component is greater than the preset abnormal jump threshold, it is determined that there is a pulse mechanical shock in the current production environment, and the window freeze protection is automatically activated. The historical data in the one-dimensional logic sliding window remains unchanged within the current 3 control cycles, and the error data of the new substrate is rejected until the absolute value of the rate of change drops below the preset abnormal jump threshold.

[0026] Preferably, the method further includes the following steps: sequentially recording the time series of multiple consecutive sets of average dynamic deviations, and using the least squares trend fitting algorithm to calculate the first derivative of the time series as the process drift change rate; when the process drift change rate continues to be greater than the preset deterioration slope threshold and the current average dynamic deviation approaches the preset control dead zone safety threshold, before the average dynamic deviation exceeds the preset control dead zone safety threshold, an early warning signal of sub-health of the system where the spray pressure proportional regulating valve is located is output in advance.

[0027] Preferably, before step S1, the method further includes the following steps: obtaining the initial geometric linewidth error of the production line by prototyping and developing and etching a standard test substrate; after eliminating environmental noise interference, using the initial geometric linewidth error as the zero-point reference for the nonlinear cumulative line error; and writing the physical calibration value of the spray pressure at this time as the process standard pressure into the non-volatile memory.

[0028] Preferably, the method further includes the following steps: during the period when the control loop enters a protective resting state for the spray pressure proportional adjustment valve and does not issue adjustment commands, the main controller synchronously reads the real-time operating status data of the lithography machine. If the real-time operating status data indicates that the core temperature fluctuation of the laser generator of the lithography machine is less than 0.1℃, the current exposure energy calibration value is maintained unchanged; if the core temperature fluctuation is greater than or equal to 0.1℃, the exposure energy recalibration process is triggered, and the power drift caused by temperature change is offset by adjusting the laser pump current to ensure the parameter coordination and convergence between the exposure process and the etching process.

[0029] Example 1: This example is applied to a production line consisting of a feeder, coating machine, drying oven, lithography machine, developing machine, etching machine, and inspection instrument. The substrate is fed into the transmission channel by the feeder and sequentially undergoes coating, drying, exposure, developing, etching, and inspection. The main controller is located in the production line control cabinet and is connected to the control interfaces and status acquisition interfaces of each device via a communication gateway. The main controller's memory pre-stores a multi-dimensional process sensitivity coefficient matrix, calibration power, process standard pressure, loop gain calibration constant coefficient, control dead zone safety threshold, and the minimum discrete pressure adjustment physical step unit of the spray pressure proportional control valve. The main controller generates a spatiotemporal identifier for each substrate and establishes a state vector corresponding to the spatiotemporal identifier. The state vector contains the measured laser power of the substrate at the lithography machine and the measured laser power at the etching machine. The dynamic spray pressure establishes a correspondence between the detection results output by the detector and the process state during the processing of the substrate. Before the production line enters the continuous processing state, a standard test substrate is used to complete coating, drying, exposure, development, etching and detection. The detector measures the line geometry of the standard test substrate and obtains the initial geometric linewidth error. After eliminating environmental noise interference, the initial geometric linewidth error is used as the zero point reference for the nonlinear cumulative line error. The physical calibration value of the spray pressure corresponding to the standard test substrate is written into the non-volatile memory of the main controller as the process standard pressure. At the same time, based on the measurement results of the standard test substrate, the first mapping coefficient between exposure intensity and line pattern topology distortion and the second mapping coefficient between etching rate and line pattern boundary reduction in the multi-dimensional process sensitivity coefficient matrix are determined.

[0030] The multidimensional process sensitivity coefficient matrix of this invention is constructed based on the local first-order Taylor series expansion at the stable operating point of the process standard pressure and calibration power. The bias of the pattern transfer production line operation is a small disturbance increment, and high-order nonlinear terms are ignored in the neighborhood of the operating point. The specific engineering calibration includes: controlling the dynamic spray pressure of the etching machine to be constant at the process standard pressure, adjusting the laser generator power in step steps of 1% within the range of 95% to 105% of the standard operating power, recording the final linewidth distortion deviation of the standard test substrate, and using the least squares method to fit the local slope of the final linewidth distortion deviation to determine the first mapping coefficient between the exposure intensity and the topological distortion of the circuit pattern.The laser beam energy of the lithography machine is kept constant at the rated power. The dynamic spray pressure of the etching machine is subjected to step-wise pressure perturbation within 90% to 110% of the standard process pressure. The substrate boundary shrinkage deviation is measured, and the change in lateral etching boundary caused by a unit pressure change is calculated. A second mapping coefficient between the etching rate and the reduction of the circuit pattern boundary is determined. The main controller pre-stores the two-dimensional dual-channel array structure composed of the first and second mapping coefficients as a multi-dimensional process sensitivity coefficient matrix in non-volatile memory. A linear homogeneous equation incorporating two unknown process deviation variables—exposure deviation and etching deviation—is established. The group uses the total nonlinear cumulative line error as a known observation vector and performs matrix multiplication scalar product operation with the inverse matrix of the multidimensional process sensitivity coefficient matrix to independently solve for the initial values ​​of the deviation components caused only by the exposure process and the deviation components caused only by the etching process. This multidimensional process sensitivity coefficient matrix is ​​constructed using a 2D dual-channel array structure, where the horizontal row vectors correspond to the physical disturbance sources of the exposure and etching processes, respectively, and the vertical column vectors correspond to the linewidth distortion deviation and boundary reduction deviation, respectively. The first mapping coefficient partial derivative term inside the matrix records the pattern edge displacement caused by a unit change in lithography energy. The partial derivatives of the two mapping coefficients record the change in the lateral erosion boundary caused by a unit change in spray pressure. When the pre-stored matrix is ​​invoked, the main controller receives the current total nonlinear cumulative line error. By establishing a system of linear homogeneous equations containing two unknown process deviation variables, the cumulative line error is treated as a known observation vector and multiplied by a matrix scalar product with the inverse of the sensitivity coefficient matrix. This mathematically decouples the total error and independently solves for the initial values ​​of the deviation components caused only by the exposure process and the initial values ​​of the deviation components caused only by the etching process. During the acquisition and separation of error components, the processing... After being processed by the etching machine, the substrate enters the inspection instrument. The inspection instrument detects the circuit edges and circuit patterns of the processed substrate and outputs the nonlinear cumulative circuit error generated by the processed substrate. The main controller reads the state vector corresponding to the processed substrate based on the spatiotemporal identifier of the processed substrate, calls the pre-stored multi-dimensional process sensitivity coefficient matrix to calculate and separate the process component in the nonlinear cumulative circuit error, uses the physical difference between the measured laser power and the calibrated power to extract the exposure error component from the process component, and simultaneously converts the etching error component from the process component based on the absolute deviation between the dynamic spray pressure of the etching machine and the process standard pressure.

[0031] The main controller uses the first mapping coefficient between exposure intensity and circuit pattern topological distortion in the multidimensional process sensitivity coefficient matrix to separate the exposure bias from the process component of the nonlinear cumulative circuit error. It then uses the second mapping coefficient between etching rate and circuit pattern boundary reduction in the multidimensional process sensitivity coefficient matrix to separate the etching bias from the process component of the nonlinear cumulative circuit error. The main controller associates and stores the exposure error component and etching error component with the spatiotemporal identifier of the processed substrate to maintain the data correspondence between the detection results, measured laser power, and dynamic spray pressure. This process of stripping and converting errors from the process components achieves the mapping conversion from measured physical quantities to spatial geometric dimensions. The main controller has a built-in spatial displacement conversion coefficient based on photochemical reaction kinetics, which establishes a conversion value per watt. The lateral photoinduced reaction boundary expansion caused by laser power fluctuations in the resist layer is converted into exposure linewidth offset in the geometric space domain by multiplying the power difference between the measured laser power and the calibrated power by the spatial displacement conversion coefficient. Similarly, the main controller has a boundary reduction conversion coefficient based on the hydrodynamic scouring rate. This coefficient establishes the change in copper layer lateral etching rate and the final linewidth reduction caused by the absolute deviation of spray pressure per 1 MPa. Its physical dimension is micrometers per MPa. By multiplying the absolute deviation between the dynamic spray pressure and the process standard pressure by this boundary reduction conversion coefficient, the dimension unification from the pressure domain to the spatial geometric domain is achieved, thereby accurately restoring the micrometer-level geometric error component caused purely by the drift of the etching single-machine process.

[0032] During the average dynamic deviation calculation process, the main controller sets a one-dimensional logic sliding window in the memory. The length of the one-dimensional logic sliding window is constant, ranging from 5 to 15 substrates. In this embodiment, the length of the one-dimensional logic sliding window is 10 substrates. When a new substrate enters, the etching error component corresponding to the new substrate is pushed into the end of the one-dimensional logic sliding window, while the historical error component at the top of the one-dimensional logic sliding window is popped out. The main controller uses its built-in arithmetic logic unit to accumulate the etching error components of all substrates in the current one-dimensional logic sliding window in real time and calculates the arithmetic mean as the average dynamic deviation. This makes the average dynamic deviation reflect the etching process offset state of the continuously processed substrates within the current window length. The selection criteria for the above structural parameters and threshold range are as follows: The length of the one-dimensional logic sliding window is limited to between 5 and 15 substrates because if the length is less than 5 substrates, the high-frequency mechanical vibration noise cannot be sufficiently smoothed by arithmetic averaging, which will cause the average dynamic deviation to jump drastically and trigger the underlying adjustment valve frequency. Frequent malfunctions; if the length exceeds 15 substrates, the data update delay within the sliding window is too large, which will mask the true linear temperature drift trend of the process, causing phase lag in feedback adjustment. Similarly, the preset control dead zone safety threshold is limited to the range of 0.5 micrometers to 1.5 micrometers. Its engineering and physical significance is that below 0.5 micrometers, normal minor air disturbances or liquid spray pulsations in the production line environment will frequently trigger compensation, causing the proportional control valve to always be in a high-frequency surge state, leading to accelerated fatigue and burnout of the electromagnetic coil; while above 1.5 micrometers, the allowable single-machine drift is too large, approaching the yield tolerance limit of the fine line pattern transfer process, which will cause a large number of consecutive batches of circuit boards to be directly over-etched and scrapped. Therefore, the above-set parameter range serves as the control boundary to meet the mechanical life of the transmission system and the manufacturing yield of the process. During the pressure compensation control process, the main controller compares the average dynamic deviation with the preset control dead zone safety threshold for judgment. The preset control dead zone safety threshold ranges from 0.5 micrometers to 1.5 micrometers.In this embodiment, the preset control dead zone safety threshold is set to 1 micrometer. When the average dynamic deviation does not exceed the preset control dead zone safety threshold, the control loop enters a protective resting state for the spray pressure proportional regulating valve of the etching machine and does not issue adjustment commands. The main controller continues to receive the nonlinear cumulative line error output by the detector and updates the etching error component in the one-dimensional logic sliding window. When the average dynamic deviation exceeds the preset control dead zone safety threshold, the main controller calculates the discrete pressure compensation amount under the current control cycle based on the loop gain calibration constant coefficient, the sign function, and the minimum discrete pressure regulation physical step unit of the spray pressure proportional regulating valve. The sign function determines the pressure regulation direction of the spray pressure proportional regulating valve according to the offset direction of the average dynamic deviation. The loop gain calibration constant coefficient is used to limit the adjustment range corresponding to the discrete pressure compensation amount. The minimum discrete pressure regulation physical step unit is used to match the discrete pressure compensation amount with the executable pressure regulation resolution of the spray pressure proportional regulating valve. The main controller converts the discrete pressure compensation amount into a control signal output through the communication gateway. The calculation of the discrete pressure compensation amount for the spray pressure proportional control valve is executed by the control algorithm module of the main controller. The algorithm extracts the current average dynamic deviation and inputs it into a preset sign function. When the average dynamic deviation is positive, the sign function outputs a positive 1, indicating that the etching is excessive and the spray pressure needs to be reduced; when the average dynamic deviation is negative, the sign function outputs a negative 1, indicating that the etching is insufficient and the spray pressure needs to be increased. The algorithm multiplies the output value of the sign function with the loop gain calibration constant coefficient to determine the basic adjustment opening, where the loop gain calibration constant coefficient is fixed at 1.5. Finally, the calculated basic adjustment opening is divided by the hardware inherent resolution of the spray pressure proportional control valve, i.e., the minimum discrete pressure adjustment physical step unit, to ensure that the final output discrete pressure compensation amount is an integer multiple of the minimum physical step unit. In this embodiment, the minimum discrete pressure adjustment physical step unit is 0.002 MPa, thereby ensuring that the generated control word can be accurately recognized and executed without error by the stepper motor of the proportional control valve.

[0033] Example 2: After the exposure error component is stripped out, the main controller inputs the exposure error component associated with the spatiotemporal marker of the processing substrate as a compensation input for the local exposure to the pulse trigger delay controller of the lithography machine. The pulse trigger delay controller adjusts the triggering time of the laser beam according to the exposure error component to offset the exposure position deviation caused by the nonlinear cumulative displacement error of the stage. After the average dynamic deviation exceeds the preset control dead zone safety threshold and the discrete pressure compensation amount is calculated, the digital-to-analog conversion module in the communication gateway receives the digital control word containing the discrete pressure compensation amount and converts the digital control word into a voltage control signal. The voltage-to-current conversion circuit converts the voltage control signal into an industrial standard current control signal of 4mA to 20mA and applies the industrial standard current control signal to the electromagnetic coil of the spray pressure proportional regulating valve, so that the spray pressure proportional regulating valve changes the valve opening according to the discrete pressure compensation amount.

[0034] During the operation of the one-dimensional logic sliding window, the main controller sequentially reads the continuously flowing etching error components and calculates the absolute value of the rate of change of the continuously flowing etching error components. When the absolute value of the rate of change of the continuously flowing etching error components exceeds the preset abnormal jump threshold, the main controller determines that there is a pulsed mechanical shock in the current production environment and automatically activates window freeze protection. For the current three control cycles, the controller maintains the historical data within the one-dimensional logic sliding window unchanged and refuses to receive error data from new substrates. During the window freeze protection period, the main controller maintains the historical data within the one-dimensional logic sliding window unchanged and continues to monitor the rate of change of the continuously flowing etching error components until the absolute value of the rate of change of the continuously flowing etching error components drops to the preset abnormal jump threshold. After the limit is reached, the main controller resumes receiving error data from the new substrate, allowing the one-dimensional logic sliding window to continue updating. During the operation of the one-dimensional logic sliding window, the main controller controls the data flow through a built-in circular bidirectional first-in-first-out buffer queue. When the current substrate etching error component is calculated, the algorithm calculates the absolute difference between the current substrate etching error component and the substrate etching error component of the immediately preceding sampling cycle. If the absolute difference is greater than the preset abnormal jump threshold of 0.8 micrometers per control cycle, it is determined that there is a non-process pulse mechanical impact caused by conveyor roller jamming or pump fluid cavitation in the current production environment. The main controller immediately intercepts this component to prevent it from being forced into the end of the window, and at the same time, the data pointer is left floating and the window freeze protection is activated. The queued data inside the window is completely replaced by the data before the freeze. The system continuously fills in historical error data and locks the digital control word output by the analog-to-digital converter module in the communication gateway in the previous cycle for the next three control cycles. This ensures that the voltage-to-current conversion circuit continuously outputs the current industry standard current control signal to drive the electromagnetic coil of the spray pressure proportional regulating valve, maintaining the valve opening without mechanical adjustment. Once the absolute difference drops below the preset abnormal jump threshold, the main controller resumes receiving the etching error component of the new substrate. This prevents abnormal pulse data from contaminating the window or causing the spray pressure proportional regulating valve to return to zero. In actual operation, the aforementioned preset abnormal jump threshold is set to 0.8 micrometers per control cycle. When two adjacent substrates flow through the detector, if the absolute value of the difference between their decoupled etching error components exceeds 0.8 micrometers... If the impact is determined to be a non-process-related pulse shock caused by a sudden jamming of the conveyor rollers on the horizontal transmission line or instantaneous cavitation of the pump fluid, the window freeze protection is activated for a fixed period of 3 control cycles. This is because in the production line's flow design, the maximum physical number of substrates that can be accommodated in a single process reaction zone is 3. When a sudden impact occurs, the affected mechanical abnormal disturbance data will be concentrated in the next 3 control cycles. By forcibly locking the sliding window data for 3 cycles, it can be ensured that the abnormal pulse data contaminated by random jitter of mechanical transmission passes through the detection station completely and will not be mistakenly pushed into the sliding window as a long-term process trend drift, thereby effectively preventing the control loop from generating unstable overcorrection.

[0035] Example 3: During the period when the error data of receiving the new substrate is recovered in the one-dimensional logic sliding window and the average dynamic deviation is continuously formed, the main controller sequentially records the time series of multiple consecutive sets of average dynamic deviations. The first derivative of the time series is calculated using the least squares trend fitting algorithm as the process drift rate. When the process drift rate continuously exceeds the preset deterioration slope threshold and the current average dynamic deviation approaches the preset control dead zone safety threshold, before the average dynamic deviation exceeds the preset control dead zone safety threshold, the main controller outputs a sub-health warning signal for the system where the spray pressure proportional control valve is located. Based on the time series of multiple consecutive sets of average dynamic deviations, the main controller uses the least squares trend fitting algorithm to calculate the first derivative of the time series as the process drift rate. When the process drift rate continuously exceeds the preset deterioration slope threshold and the current average dynamic deviation approaches the preset control dead zone safety threshold, before the average dynamic deviation exceeds the preset control dead zone safety threshold, the main controller... The device outputs a sub-health warning signal to the external monitoring terminal for the spray pressure proportional regulating valve system, triggering adaptive reconfiguration of the control loop parameters. Upon receiving the sub-health warning signal, it automatically shortens the window length of the next control cycle from the original ten substrates to five substrates, lowers the loop gain calibration constant coefficient in the control algorithm module from 1.5 to 1.0, shortens the data update delay within the window, improves the system's response sensitivity to trend-based temperature drift and adjusts the phase synchronization, and adjusts the gain of the control loop parameters to suppress the impending excessive drift, so that the processing accuracy of the production line under cascaded large delay conditions finally converges. The process standard pressure in the non-volatile memory is obtained by prototyping and developing and etching the standard test substrate. The detector obtains the initial geometric linewidth error corresponding to the standard test substrate. After eliminating environmental noise interference, the initial geometric linewidth error is used as the zero-point reference for the nonlinear cumulative line error, and the physical calibration value of the spray pressure at this time is written into the non-volatile memory as the process standard pressure.

[0036] During the period when the control loop enters a protective quiescent state for the spray pressure proportional control valve and does not issue adjustment commands, the main controller synchronously reads the real-time operating status data of the lithography machine. When the real-time operating status data indicates that the core temperature fluctuation of the laser generator of the lithography machine is less than 0.1℃, the current exposure energy calibration value is maintained unchanged. When the core temperature fluctuation is greater than or equal to 0.1℃, the exposure energy recalibration process is triggered, and the power drift caused by temperature changes is offset by adjusting the laser pump current, so that the parameters between the exposure process and the etching process converge. The convergence mechanism here is a forward cross-process predictive decoupling collaboration established through spatiotemporal identifier association. Although the spray pressure proportional control valve of the etching machine is in a protective quiescent state at this time, and its control output is passively frozen, the main controller has already confirmed the current status through the aforementioned sliding window. The etching process offset is in a stable and controlled state within the 1-micron dead zone. At this time, when the core temperature fluctuation of the laser generator of the lithography machine is greater than or equal to 0.1 degrees Celsius, the independent closed-loop recalibration process of the lithography machine will directly intercept and reduce the energy offset of the laser power caused by temperature drift at the front end by adjusting the pump current. Since the uncertain interference term caused by etching pressure fluctuation has been eliminated in the total nonlinear cumulative line error, the targeted suppression of power drift at the lithography front end can directly map and ensure that the total geometric error transmitted to the end continues to converge. Under the premise of achieving local steady state in the etching process, this invention uses time-division reusable decoupling control with one end resting and the other end finely adjusted to break the control interference conflict caused by cascaded large time delay, thereby achieving the final convergence of multi-task sequence parameters in the global timing of continuous flow of the entire line.

[0037] Example 4: This example combines Figures 1 to 2 This document describes a multi-device collaborative control method for a PCB pattern transfer production line, such as... Figure 1 As shown, after obtaining the nonlinear cumulative line error, the multidimensional process sensitivity matrix is ​​called to separate the line error process components. Then, after stripping the exposure and converting the etching error, the logic sliding window buffer error is executed to calculate the average dynamic deviation within the window. The calculation result is input to the deviation and compared with the control dead zone threshold for judgment. When the comparison judgment result is not exceeded, the control loop drives the regulating valve to enter the protective rest. When the comparison judgment result is exceeded, the control loop calculates the discrete pressure compensation amount and outputs the control signal to the regulating valve.

[0038] like Figure 2As shown, the multi-dimensional process sensitivity coefficient matrix, the peeling exposure error, and the etching error components are collectively attributed to the nonlinear cumulative line error decomposition. The comparison of the average dynamic deviation and the safety threshold with the calculation of the current cycle discrete pressure compensation are collectively attributed to the spray pressure proportional regulating valve control. The sequential buffering of the one-dimensional logic sliding window and the real-time accumulation and calculation of the average dynamic deviation are collectively attributed to the one-dimensional logic sliding window buffering. The pulsed mechanical impact window freeze protection and the early output of the system sub-health warning signal are collectively attributed to the window freeze and system warning. The above-mentioned nonlinear cumulative line error decomposition, spray pressure proportional regulating valve control, one-dimensional logic sliding window buffering, and window freeze and system warning are collectively input and coordinated to promote the stable convergence of process parameters of multi-device cascade.

[0039] Example 5: This example was verified on a continuous production line consisting of a feeder, coating machine, drying oven, lithography machine, developing machine, etching machine, and inspection instrument. Each group continuously processed 60 substrates of the same batch. The inspection instrument repeatedly scanned the edges of the processed substrate lines. The main controller used the initial geometric linewidth error of the production line obtained from the standard test substrate prototyping and developing / etching measurements as the zero-point reference for the nonlinear cumulative line error, and used the physical calibration value of the spray pressure corresponding to the standard test substrate as the process standard pressure. The present invention sample group used a multi-dimensional process sensitivity coefficient matrix, a one-dimensional logic sliding window, a preset control dead zone safety threshold, discrete pressure compensation, window freeze protection, sub-health warning signal, and exposure energy recalibration process. The comparison sample group used the conventional closed-loop control of the etching machine, which directly fed back the nonlinear cumulative line error output by the inspection instrument. The partially missing control group removed the multi-dimensional process sensitivity coefficient matrix or removed the one-dimensional logic sliding window and the preset control dead zone safety threshold, while keeping the other conveying cycle time, inspection conditions, substrate batch, and equipment operating boundaries consistent.

[0040] After the 16th to 25th processed substrates entered the inspection instrument, the instrument recorded the nonlinear cumulative line errors of these 10 substrates as 3.42 μm, 3.18 μm, 3.55 μm, 3.31 μm, 3.74 μm, 3.49 μm, 3.62 μm, 3.28 μm, 3.40 μm, and 3.57 μm, respectively. The main controller, based on the corresponding spatiotemporal identifiers, reads the state vectors and calls the multidimensional process sensitivity coefficient matrix, then separates the etching error components of these 10 substrates as 1.84 μm, 1.92 μm, and 1.92 μm, respectively. The 10 etching error components—2.05 μm, 1.98 μm, 2.17 μm, 2.08 μm, 2.14 μm, 1.96 μm, 2.01 μm, and 2.09 μm—are used as the current window data by a one-dimensional logic sliding window, forming an average dynamic deviation of 2.02 μm. When this average dynamic deviation exceeds the preset control dead zone safety threshold of 1.0 μm, the main controller converts the discrete pressure compensation amount into a control signal that the spray pressure proportional regulating valve can execute, thereby adjusting the industrial standard current control signal from 12.0 mA to 13.6 mA.

[0041] In a comparative verification of continuously processed 60 substrates, the average absolute deviation of the circuit edge relative to the zero-point reference in the sample group of this invention was 0.58 micrometers, the maximum absolute deviation was 1.06 micrometers, and the number of substrates with an absolute deviation not exceeding 1.5 micrometers was 60. The spray pressure proportional control valve was activated 8 times. In the comparison sample group, the average absolute deviation of the circuit edge relative to the zero-point reference was 1.72 micrometers, the maximum absolute deviation was 3.64 micrometers, and the number of substrates with an absolute deviation not exceeding 1.5 micrometers was 46. The spray pressure proportional control valve was activated 31 times. The average absolute deviation of the partially missing control group after removing the multidimensional process sensitivity coefficient matrix was 1.28 micrometers, the maximum absolute deviation was 2.61 micrometers, and the number of substrates with an absolute deviation not exceeding 1.5 micrometers was 51. The average absolute deviation of the partially missing control group after removing the one-dimensional logic sliding window and the preset control dead zone safety threshold was 0.91 micrometers, and the maximum absolute deviation was... The mean absolute deviation was 1.82 micrometers, and the spray pressure proportional control valve actuated 43 times. In the boundary verification of the preset control dead zone safety threshold, the main controller used 0.5 micrometers, 1.0 micrometers, and 1.5 micrometers as the preset control dead zone safety threshold, respectively. The mean absolute deviations of 60 consecutive processed substrates were 0.55 micrometers, 0.58 micrometers, and 0.83 micrometers, respectively, and the spray pressure proportional control valve actuated 16 times, 8 times, and 4 times, respectively. When the out-of-range control group used 0.3 micrometers as the preset control dead zone safety threshold, the mean absolute deviation was 0.52 micrometers and the spray pressure proportional control valve actuated 39 times. When 1.8 micrometers was used as the preset control dead zone safety threshold, the spray pressure proportional control valve actuated 2 times and the mean absolute deviation increased to 1.31 micrometers. When the preset control dead zone safety threshold was in the range of 0.5 micrometers to 1.5 micrometers, the mean absolute deviation and the actuation frequency of the spray pressure proportional control valve maintained a stable state of mutual constraint.

[0042] During the operation of the one-dimensional logic sliding window, when the absolute value of the rate of change of the continuously flowing etching error component increased from 0.32 micrometers per control cycle to 2.76 micrometers per control cycle, the main controller determined that there was a pulsed mechanical shock in the current production environment and activated window freeze protection. For the current three control cycles, the historical data within the one-dimensional logic sliding window remained unchanged. After the window freeze protection ended, the absolute value of the rate of change of the continuously flowing etching error component dropped to 0.41 micrometers per control cycle, and the one-dimensional logic sliding window resumed receiving error data from the new substrate. The average absolute deviation of the 20 processed substrates after the recovery was 0.67 micrometers. In the control record without window freeze protection, the average absolute deviation of the 20 processed substrates after the same disturbance was 1.46 micrometers. In the process drift rate verification, the main controller... The time series of multiple consecutive sets of average dynamic deviations were recorded sequentially. The average dynamic deviations in five consecutive control cycles were 0.42 μm, 0.55 μm, 0.67 μm, 0.80 μm, and 0.93 μm, respectively. The process drift change rate obtained by the least squares trend fitting algorithm was 0.13 μm per control cycle. Before the average dynamic deviation exceeded the preset control dead zone safety threshold of 1.0 μm, the main controller output a sub-health warning signal for the system where the spray pressure proportional regulating valve is located. The average absolute deviation of the 30 processing substrates regulated by discrete pressure compensation was 0.63 μm. In the control record where the sub-health warning signal was not enabled, the average dynamic deviation exceeded the preset control dead zone safety threshold within two control cycles, and the average absolute deviation of the subsequent 30 processing substrates was 1.18 μm.

[0043] In the exposure energy recalibration process verification, the main controller reads the real-time operating status data of the lithography machine. When the core temperature fluctuation of the laser generator is 0.08 degrees Celsius, the current exposure energy calibration value remains unchanged, corresponding to an exposure error component of 0.34 micrometers. When the core temperature fluctuation of the laser generator rises to 0.14 degrees Celsius, the main controller triggers the exposure energy recalibration process and adjusts the laser pump current, corresponding to an exposure error component decreasing from 0.82 micrometers to 0.31 micrometers. The average dynamic deviation of the substrates processed in the same batch decreases from 2.02 micrometers to 0.64 micrometers after the discrete pressure compensation, ensuring that the compensation input of the exposure locality and the control signal of the spray pressure proportional adjustment valve maintain the same spatiotemporal correspondence during continuous processing. This addresses the issue of intensity gradient verification. In the demonstration, the control process of the sample group of the present invention remained unchanged, and the absolute deviation between the dynamic spray pressure and the process standard pressure was set to three working points: 0.006 MPa, 0.018 MPa and 0.030 MPa. The average absolute deviations recorded by the detector before processing were 1.12 μm, 2.38 μm and 3.51 μm, respectively. After multi-dimensional process sensitivity coefficient matrix separation, one-dimensional logic sliding window smoothing, comparison of preset control dead zone safety threshold and adjustment of discrete pressure compensation, the average absolute deviations after processing were 0.43 μm, 0.61 μm and 0.86 μm, respectively. The spray pressure proportional regulating valve was activated 3 times, 8 times and 14 times, respectively. When the deviation of the dynamic spray pressure increased, the adjustment amount increased accordingly, and the terminal line deviation remained in a recordable and controlled state.

[0044] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A multi-device collaborative control method for a PCB pattern transfer production line, characterized in that, Includes the following steps: Step S1: Obtain the nonlinear cumulative line error generated by the substrate through the detector, call the pre-stored multidimensional process sensitivity coefficient matrix to calculate and separate the process component in the nonlinear cumulative line error, use the physical difference between the measured laser power and the calibrated power to peel off the exposure error component from the process component, and at the same time convert the etching error component from the process component based on the absolute deviation between the dynamic spray pressure of the etching machine and the process standard pressure. Step S2: The etching error components generated by multiple consecutive substrates are sequentially cached through a one-dimensional logic sliding window, and the average dynamic deviation within the one-dimensional logic sliding window is calculated. Step S3: The average dynamic deviation is compared with the preset control dead zone safety threshold. When the average dynamic deviation does not exceed the preset control dead zone safety threshold, the control loop enters a protective resting state for the spray pressure proportional regulating valve of the etching machine and does not issue a regulation command. When the average dynamic deviation exceeds the preset control dead zone safety threshold, the discrete pressure compensation amount under the current control cycle is calculated based on the loop gain calibration constant coefficient, sign function and the minimum discrete pressure regulation physical step unit of the spray pressure proportional regulating valve. The discrete pressure compensation amount is then converted into a control signal and output to the spray pressure proportional regulating valve through the communication gateway.

2. The multi-device collaborative control method for PCB pattern transfer production line according to claim 1, characterized in that, Step S2 includes: when each new substrate flows in, pressing the etching error component corresponding to the new substrate into the end of the one-dimensional logic sliding window, and popping out the historical error component at the top of the one-dimensional logic sliding window. The length of the one-dimensional logic sliding window is kept constant at 5 to 15 substrates. The built-in arithmetic logic unit is used to accumulate the etching error components of all substrates in the current one-dimensional logic sliding window in real time and calculate the arithmetic mean as the average dynamic deviation. The preset control dead zone safety threshold ranges from 0.5μm to 1.5μm.

3. The multi-device collaborative control method for a PCB pattern transfer production line according to claim 1, characterized in that, Step S1 includes: using the first mapping coefficient between exposure intensity and circuit pattern topology distortion in the multidimensional process sensitivity coefficient matrix to separate the exposure bias from the process component in the nonlinear cumulative circuit error; and using the second mapping coefficient between etching rate and circuit pattern boundary reduction in the multidimensional process sensitivity coefficient matrix to separate the etching bias from the process component in the nonlinear cumulative circuit error.

4. The multi-device collaborative control method for a PCB pattern transfer production line according to claim 1, characterized in that, After the exposure error component is extracted in step S1, the method further includes the following steps: inputting the exposure error component as a compensation input for the exposure locality to the pulse trigger delay controller of the lithography machine, and adjusting the triggering time of the laser beam to offset the exposure position deviation caused by the nonlinear cumulative displacement error of the stage.

5. The multi-device collaborative control method for a PCB pattern transfer production line according to claim 1, characterized in that, Step S3 includes: converting the digital control word containing discrete pressure compensation into a voltage control signal through the digital-to-analog converter module in the communication gateway, and then converting the voltage control signal into an industrial standard current control signal of 4mA to 20mA through the voltage-to-current conversion circuit, thereby driving the electromagnetic coil of the spray pressure proportional regulating valve to change the valve opening.

6. The multi-device collaborative control method for a PCB pattern transfer production line according to claim 1, characterized in that, The method also Includes the following steps: During the operation of the one-dimensional logic sliding window, if the absolute value of the rate of change of the continuously flowing etching error component is greater than the preset abnormal jump threshold, it is determined that there is a pulse mechanical shock in the current production environment, and the window freeze protection is automatically activated. The historical data in the one-dimensional logic sliding window remains unchanged within the current 3 control cycles, and the error data of the new substrate is rejected until the absolute value of the rate of change drops below the preset abnormal jump threshold.

7. The multi-device collaborative control method for a PCB pattern transfer production line according to claim 1, characterized in that, The method also includes the following steps: sequentially recording the time series of multiple consecutive sets of average dynamic deviations, and using the least squares trend fitting algorithm to calculate the first derivative of the time series as the process drift change rate; when the process drift change rate continues to be greater than the preset deterioration slope threshold and the current average dynamic deviation approaches the preset control dead zone safety threshold, before the average dynamic deviation exceeds the preset control dead zone safety threshold, the sub-health warning signal of the system where the spray pressure proportional regulating valve is located is output in advance.

8. A multi-device collaborative control method for a PCB pattern transfer production line according to claim 1, characterized in that, Before step S1, the method further includes the following steps: by prototyping and developing and etching a standard test substrate, the initial geometric linewidth error of the production line is obtained. After eliminating environmental noise interference, the initial geometric linewidth error is used as the zero-point reference for the nonlinear cumulative line error, and the physical calibration value of the spray pressure at this time is written into the non-volatile memory as the process standard pressure.

9. A multi-device collaborative control method for a PCB pattern transfer production line according to claim 1, characterized in that, The method also includes the following steps: During the period when the control loop enters a protective resting state for the spray pressure proportional adjustment valve and does not issue adjustment commands, the main controller synchronously reads the real-time operating status data of the lithography machine. If the real-time operating status data indicates that the core temperature fluctuation of the laser generator of the lithography machine is less than 0.1℃, the current exposure energy calibration value is maintained unchanged; if the core temperature fluctuation is greater than or equal to 0.1℃, the exposure energy recalibration process is triggered, and the power drift caused by temperature change is offset by adjusting the laser pump current to ensure the parameter coordination and convergence between the exposure process and the etching process.

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