An etching machine for circuit board production

Abstract

This invention discloses an etching machine for circuit board production, relating to the field of etching machine technology. It includes an etching assembly and a PLC controller. The etching assembly includes a vertical etching machine body, with a negative pressure assembly mounted on the top of the vertical etching machine body. In this etching machine for circuit board production, during the rotary etching process, when adhesive bubbles form on the circuit board surface, the contacts become unstable, causing the corresponding static and moving contacts to come into contact, opening the circuit and allowing current to flow immediately. This powers the corresponding electromagnet, attracting and sealing the slider, thus connecting the negative pressure chamber to the negative pressure suction tubes on both sides. This automatically connects the negative pressure suction tubes to the negative pressure side within the negative pressure chamber. Under the action of negative pressure, bubbles and the surrounding etching liquid are instantly and locally adsorbed, providing strong targeting. This solves the problem in existing technologies where vertical etching machines easily generate bubbles on the etching surface when etching rectangular photomasks, leading to uneven etching.

Description

Technical Field

[0001] This invention relates to the field of etching machine technology, specifically to an etching machine for circuit board production. Background Technology

[0002] The PCB etching machine is a core process equipment in the production of printed circuit boards. It is used to selectively remove unwanted copper foil from copper-clad laminates, retaining the circuit patterns protected by the resist layer, and finally forming circuit patterns such as conductive lines and pads. The PCB etching machine is a key process equipment in PCB manufacturing. It mainly consists of a conveying mechanism, a spray system, a chemical solution circulation system, a cleaning unit, and a drying unit. It uses a chemical etching solution to selectively chemically react with the copper foil on the surface of the PCB that is not protected by the resist layer, dissolving and removing the excess copper foil, and retaining the preset circuit wire patterns to complete the circuit forming process of the PCB.

[0003] The existing Eurocard 3U industrial control board, as a double-sided PCB, has a rectangular shape. During the etching process, a vertical continuous etching machine is often used to etch both sides. Due to its rectangular shape, the etching section mainly uses high-pressure spray etching solution from both sides to dissolve and remove the copper layer on the board surface that is not protected by photoresist through chemical corrosion reaction, thereby forming the required circuit. During the etching process, factors such as gas generation from the etching reaction, air entrainment from the spray, and liquid film retention on the board surface can lead to the formation of microbubbles on the PCB surface. These microbubbles adhere to the PCB surface and cannot escape in time, thus covering the surface and affecting the etching uniformity. Most existing vertical continuous etching machines adopt a global passive treatment to address the bubble problem on the photoresist surface, which has defects such as poor targeting, easy damage to photoresist, easy generation of microbubbles, and easy destruction of the etching solution film, resulting in uneven etching.

[0004] Therefore, we propose an etching machine for circuit board production to solve the problems mentioned above. Summary of the Invention

[0005] The purpose of this invention is to provide an etching machine for circuit board production, so as to solve the problem that the vertical etching machine mentioned in the background art is prone to generating air bubbles on the etching surface, resulting in uneven etching.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an etching machine for circuit board production, comprising an etching assembly and a PLC controller. The etching assembly includes a vertical etching machine body, a negative pressure assembly at the top of the vertical etching machine body, the negative pressure assembly including multiple inlet tubes, a positioning assembly including two clamping members for fixing the circuit board, and an equipment support frame. Multiple sliding grooves are formed on both outer surfaces of the equipment support frame, and stationary contacts are provided on the opposing inner walls of the sliding grooves. Two drive circuit boards are movably embedded inside the equipment support frame. A rotating gear ring and a pressure detection assembly are included. The pressure detection assembly includes two fixed rings, the outer surfaces of which are fixedly connected to the outer surfaces of the two sides of the equipment support frame. The inner walls of both fixed rings are slidably connected to contacts for detecting whether there are air bubbles on the circuit board surface. A sliding rod is fixedly connected to the outer surface of each contact. An elastic element is provided at one end of the contact, and a moving block is fixed at one end of the sliding rod. Moving contacts for detecting whether the contact movement is normal are provided on both sides of the moving block. Negative pressure suction tubes for negative pressure adsorption of air bubbles on the circuit board surface are provided on both sides of the contact.

[0007] Preferably, the positioning component further includes a drive disk, which is movably embedded inside the equipment support frame. Limiting tubes are fixed between the relative inner walls of the drive disk. The inner walls of the two clamping members slide against the outer surfaces of the two limiting tubes respectively. A bidirectional hydraulic rod is fixedly installed inside the drive disk through an auxiliary ring. The two ends of the bidirectional hydraulic rod are fixedly connected to the outer surfaces of the two clamping members respectively.

[0008] Preferably, the inner walls of both gear rings are fixedly connected to the outer surface of the drive disk. The outer surface of the equipment support frame is fixed with a mounting bracket by screws. A drive motor is provided on the inner wall of the mounting bracket. A drive rod is fixed to the output end of the drive motor. Two drive gears are fixedly sleeved on the outer surface of the drive rod. Both ends of the drive rod extend movably to the outside of the equipment support frame. The outer surfaces of the two drive gears mesh with the outer surfaces of the two gear rings respectively. Both drive gears are located inside the equipment support frame.

[0009] Preferably, a positioning tube is movably sleeved on the outer surface of the contact, one end of the positioning tube is fixedly connected to the outer surface of the fixing ring, the elastic element is disposed inside the positioning tube, one end of the elastic element is fixedly connected to the inner wall of the positioning tube, the other end of the elastic element is fixedly connected to one end of the contact, and the other end of the contact movably penetrates into the interior of the fixing ring.

[0010] Preferably, the outer surface of the slide rod slides against the inner wall of the positioning tube, the outer surface of the moving block slides against the inner wall of the slide groove, the outer surface of the negative pressure suction tube is fixedly connected to the inner wall of the fixing ring, and multiple negative pressure chambers are fixed on both outer surfaces of the equipment support frame.

[0011] Preferably, one end of each pair of negative pressure suction tubes is fixedly connected to the inner wall of the negative pressure chamber, an electromagnet is provided on the inner wall of the negative pressure chamber, a limit frame is fixedly installed between the opposite inner walls of the negative pressure chamber, a sealing slider is slidably connected to the inner wall of the negative pressure chamber, and the interior of the negative pressure chamber is fixedly connected to the interior of the inlet tube.

[0012] Preferably, the negative pressure assembly further includes a negative pressure chamber, the bottom end of which is fixedly connected to the top of the vertical etching machine body, the top end of the inlet tube passes through the vertical etching machine body to the inside of the negative pressure chamber, the top of the negative pressure chamber is fixedly connected to a drain tube, and a buffer chamber is fixedly installed on the top of the vertical etching machine body by screws, with the bottom end of the drain tube fixedly penetrating into the inside of the buffer chamber.

[0013] Preferably, an air pump is fixedly installed on the top of the vertical etching machine body by screws. The input end of the air pump is fixedly connected to an air suction pipe. One end of the air suction pipe is fixedly inserted into the interior of the buffer chamber. A return pipe is fixedly connected to the outer surface of the buffer chamber. A solenoid valve is installed on the outer surface of the return pipe.

[0014] Preferably, the etching assembly further includes a perforated plate, the outer surface of which is fixedly connected to the inner wall of the vertical etching machine body. Fixing brackets are fixedly installed near the two side edges between the opposite inner walls of the vertical etching machine body. The inner walls of the two fixing brackets are fixedly connected to the outer surface of the equipment support frame. A liquid accumulation tank is provided inside the vertical etching machine body, and the bottom end of the return pipe is fixedly inserted into the interior of the liquid accumulation tank.

[0015] Preferably, a spray pump is installed on the inner bottom surface of the vertical etching machine body. The inlet end of the spray pump is fixedly connected to an inlet pipe, and the top end of the inlet pipe is fixedly inserted into the interior of the liquid accumulation tank. The outlet end of the spray pump is fixedly connected to an outlet pipe, and both ends of the outlet pipe are fixedly inserted into the interior of the vertical etching machine body. Both ends of the outlet pipe are provided with nozzle assemblies, and both nozzle assemblies are located on the opposite inner walls of the vertical etching machine body.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. During the rotary etching process of the circuit board, when adhesive bubbles form on the surface of the circuit board, the contact is unstable, causing the corresponding static and moving contacts to come into contact, the circuit is turned on, and the current flows immediately, powering the corresponding electromagnet, adsorbing the sealing slider, and realizing the purpose of connecting the negative pressure chamber with the negative pressure suction tubes on both sides. It automatically realizes the connection between the negative pressure suction tubes and the negative pressure side inside the negative pressure chamber. Under the action of negative pressure, it will instantly adsorb bubbles and the etching liquid around the bubbles in a small area. It is highly targeted and solves the problem that bubbles are easily generated on the etching surface when vertical etching machines etch rectangular photomasks, resulting in uneven etching.

[0017] 2. During the etching process of the rectangular circuit board using a vertical etching machine, the drive gear ring rotates, which in turn drives the two clamping parts to rotate, thereby driving the circuit board to rotate. At the same time, the etching liquid is evenly sprayed onto the surface of the circuit board by the spraying equipment set in the etching section of the vertical etching machine body, so as to achieve the purpose of etching while rotating, thereby making the etching liquid evenly distributed on the circuit board.

[0018] 3. Before etching the circuit board on the vertical etching machine body, start the air pump to make the drainage pipe, negative pressure chamber, multiple inlet pipes and negative pressure chamber all in a negative pressure state, to complete the preparation of the negative pressure state in advance, so as to facilitate the instantaneous extraction of air bubbles. When the vertical etching machine body stops running, open the solenoid valve, and the etching liquid will accumulate in the liquid tank along the return pipe under its own gravity. Attached Figure Description

[0019] Figure 1 This is a frontal perspective view of the present invention; Figure 2 This is a partial cross-sectional perspective view of the etching component of the present invention; Figure 3 This is a perspective view of the positioning component of the present invention; Figure 4 This is a perspective view of the limiting tube portion of the present invention; Figure 5 This is a perspective view of the drive rod portion of the present invention. Figure 6 This is a sectional perspective view of the equipment support frame portion of the present invention; Figure 7 for Figure 6 Enlarged view of point A in the middle; Figure 8 This is a perspective view of the pressure detection component of the present invention; Figure 9 This is a three-dimensional sectional view of a portion of the pressure detection component of the present invention. Figure 10 This is a plan view of the sealing slider portion of the present invention; Figure 11 This is a perspective view of the negative pressure component of the present invention.

[0020] In the picture: 1. Etching components; 101. Vertical etching machine body; 102. Perforation plate; 103. Fixing frame; 104. Liquid collection tank; 105. Spray pump; 106. Liquid inlet pipe; 107. Liquid outlet pipe; 108. Nozzle assembly; 2. PLC controller; 3. Positioning components; 301. Equipment support frame; 302. Drive plate; 303. Limiting tube; 304. Clamping component; 305. Bidirectional hydraulic rod; 306. Gear ring; 307. Mounting frame; 308. Drive motor; 309. Drive rod; 310. Drive gear; 311. Slide groove; 312. Static contact; 4. Pressure detection assembly; 401. Fixing ring; 402. Positioning tube; 403. Elastic element; 404. Contact; 405. Slide rod; 406. Moving block; 407. Moving contact; 408. Negative pressure chamber; 409. Limiting frame; 410. Electromagnet; 411. Sealing slider; 412. Negative pressure suction tube; 5. Negative pressure assembly; 501. Negative pressure chamber; 502. Inlet tube; 503. Drain tube; 504. Buffer chamber; 505. Air pump; 506. Suction tube; 507. Return tube; 508. Solenoid valve. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-10 The present invention provides a technical solution: an etching machine for circuit board production, including an etching component 1 and a PLC controller 2. The etching component 1 includes a vertical etching machine body 101. A negative pressure component 5 is provided on the top of the vertical etching machine body 101. The negative pressure component 5 includes multiple inlet pipes 502 and a positioning component 3. The positioning component 3 includes two clamping parts 304 for fixing the circuit board and an equipment support frame 301. Multiple sliding grooves 311 are provided on both outer surfaces of the equipment support frame 301. Static contacts 312 are provided on the opposite inner walls of the sliding grooves 311. Two toothed rings 306 for driving the circuit board to rotate are movably embedded inside the equipment support frame 301. The pressure detection component 4 includes two fixed rings 401. The outer surfaces of the two fixed rings 401 are fixedly connected to the outer surfaces of the two sides of the equipment support frame 301, respectively. The inner walls of the two fixed rings 401 are slidably connected to contacts 404 for detecting whether there are air bubbles on the surface of the circuit board. The outer surface of the contacts 404 is fixedly connected to a slide rod 405. One end of the contacts 404 is provided with an elastic element 403. One end of the slide rod 405 is fixed with a moving block 406. The outer surfaces of the two sides of the moving block 406 are provided with moving contacts 407 for detecting whether the movement of the contacts 404 is normal. Negative pressure suction tubes 412 for negative pressure adsorption of air bubbles on the surface of the circuit board are provided on both sides of the contacts 404. One end of each pair of negative pressure suction tubes 412 is fixedly connected to the inner wall of the negative pressure chamber 408. An electromagnet 410 is installed on the inner wall of the negative pressure chamber 408. A limit frame 409 is fixedly installed between the opposite inner walls of the negative pressure chamber 408. A sealing slider 411 is slidably connected to the inner wall of the negative pressure chamber 408. The interior of the negative pressure chamber 408 is fixedly connected to the interior of the inlet pipe 502.

[0023] During the etching process of a rectangular circuit board using a vertical etching machine, the circuit board is first clamped and fixed by the relative movement of two clamping members 304. Then, the drive gear ring 306 rotates, which drives the two clamping members 304 to rotate, thereby driving the circuit board to rotate. At the same time, the spraying device set in the etching section of the vertical etching machine body 101 sprays the etching liquid evenly onto the surface of the circuit board, achieving the purpose of etching while rotating, so that the etching liquid is evenly distributed on the circuit board. During the rotation of the circuit board, the etching solution remaining on its surface is thrown outwards radially along the circuit board surface under centrifugal force, impacting the inner wall of the fixing ring 401. This causes the contact 404, located in the fixing ring 401, to move towards the inner wall of its corresponding positioning tube 402 due to the impact of the etching solution. For example... Figure 3As shown, each fixed ring 401 has four contacts 404, distributed at different angles. This is to enable more comprehensive and multi-directional detection of liquid flow uniformity, significantly improving bubble identification accuracy, avoiding missed or false detections, and ensuring reliable subsequent negative pressure debubbling. The contacts 404 then spring back into the fixed ring 401 under the elastic force of the elastic element 403. The elastic element 403 can be an elastic rubber strip, a spring, or a metal spring sheet. In this application, the elastic element 403 is a spring. When there are no bubbles on the circuit board surface, with the uniform spraying of the etching solution, the elastic element 403 experiences stable force, thereby driving the slide bar 405 on its surface to move at a fixed frequency, thus pushing the moving block 406 along... The inner wall of the corresponding slide groove 311 moves, causing the movable contacts 407 on both sides to move back and forth. The movable contacts 407 are made of beryllium copper. The length of the slide groove 311 is within the safe range for the movable block 406 to move back and forth. When the etching solution is sprayed at high speed through the nozzle and entrains the surrounding air, or when the etching solution reacts chemically with the copper layer on the circuit board surface, a small amount of gas is generated. In addition, a liquid film that flows continuously downwards perpendicular to the board surface is formed, preventing the gas from escaping in time and trapping it between the liquid film and the board surface. This eventually forms an adhesive bubble on the circuit board surface. When a bubble forms at a certain point on the circuit board, the bubble will disrupt the flow direction and impact intensity of the etching solution, causing the etching solution flow thrown out at that point to be intermittent, deviated, and strong. The uneven force distribution causes unstable force on contact 404, resulting in uneven extension and contraction of elastic element 403, which fluctuates in size. When elastic element 403 experiences greater force, it moves the corresponding moving contact 407 away from positioning tube 402, thus contacting the outer surface of stationary contact 312 (made of brass). When elastic element 403 experiences less force, it moves the corresponding moving contact 407 closer to positioning tube 402, also contacting the outer surface of stationary contact 312. Furthermore, stationary contact 312 and moving contact 407 are each connected to one end of the control circuit. When they are not in contact, the circuit is open and there is no current. When the two come into contact, the circuit is completed, and current flows immediately, thus powering the corresponding electromagnet 410. Electromagnet 410 is a mature existing technology and will not be described in detail here. Electromagnet 410 generates an attractive force on its corresponding sealing slider 411. The outer wall of the sealing slider 411 is made of a rubber ring with a sealing function, and the inner wall is made of ferrite permanent magnet material. When the corresponding electromagnet 410 is energized, it generates an attractive force on the sealing slider 411, thereby pushing it along the inner wall of the negative pressure chamber 408 to a position where it is tightly attached to the outer surface of the electromagnet 410, achieving the purpose of connecting the negative pressure chamber 408 with the negative pressure suction tubes 412 on both sides. For example... Figure 10As shown, when the electromagnet 410 is not energized, the sealing slider 411 moves along the inner wall of the negative pressure chamber 408 under the attraction of negative pressure to a position where it is in contact with the limit frame 409, thereby blocking the connection between the negative pressure part of the negative pressure chamber 408 and the negative pressure suction tube 412. When the electromagnet 410 is energized, the sealing slider 411 moves to the other side of the connection between the negative pressure suction tube 412 and the negative pressure chamber 408, thereby automatically realizing the connection between the negative pressure suction tube 412 and the negative pressure side inside the negative pressure chamber 408. At this time, the PLC controller 2 detects the contact conduction signal. The PLC controller 2 controls the electromagnet 410 to be energized for 1 to 3 seconds. During this period, under the action of negative pressure, it will instantly adsorb bubbles and the etching liquid around the bubbles in a small area. The adsorbed bubbles and etching liquid flow outward along the corresponding inlet pipe 502, completing the instantaneous adsorption of bubbles. It is highly targeted and prevents bubbles from adhering to the surface of the photomask for a long time, thus preventing uneven etching. This solves the problem that bubbles are easily generated on the etching surface when vertical etching machines etch rectangular photomasks, which leads to uneven etching.

[0024] like Figure 1 and Figures 3-7 As shown, the positioning component 3 also includes a drive disk 302, which is movably embedded inside the equipment support frame 301. Limiting tubes 303 are fixed between the relative inner walls of the drive disk 302. The inner walls of the two clamping members 304 slide against the outer surfaces of the two limiting tubes 303 respectively. A bidirectional hydraulic rod 305 is fixedly installed inside the drive disk 302 through an auxiliary ring. The two ends of the bidirectional hydraulic rod 305 are fixedly connected to the outer surfaces of the two clamping members 304 respectively.

[0025] During the positioning of the photomask, the bidirectional hydraulic rod 305 is activated by the PLC controller 2, which pushes both ends of the bidirectional hydraulic rod 305 to shorten, thereby causing the two clamping parts 304 to move towards each other and clamp and fix the photomask. The limiting tube 303 plays a limiting role for the clamping parts 304. The outer surfaces of both sides of the drive disk 302 can move through the outside of the equipment support frame 301 to facilitate the subsequent rotation of the equipment support frame 301.

[0026] like Figure 1 and Figures 3-7As shown, the inner walls of the two gear rings 306 are fixedly connected to the outer surface of the drive disk 302. The outer surface of the equipment support frame 301 is fixed with a mounting bracket 307 by screws. The inner wall of the mounting bracket 307 is provided with a drive motor 308. The output end of the drive motor 308 is fixed with a drive rod 309. The outer surface of the drive rod 309 is fixedly fitted with two drive gears 310. Both ends of the drive rod 309 extend movably through to the outside of the equipment support frame 301. The outer surfaces of the two drive gears 310 mesh with the outer surfaces of the two gear rings 306 respectively. Both drive gears 310 are located inside the equipment support frame 301.

[0027] During the process of spraying etching solution onto the circuit board surface, the drive motor 308 is started, which drives the drive rod 309 to rotate, thereby driving the two drive gears 310 to rotate, which in turn drives the two gear rings 306 to rotate, causing the drive disk 302 to rotate, which in turn drives the two clamping parts 304 to rotate, and finally drives the circuit board to rotate, so that the etching solution on the circuit board surface is sprayed evenly.

[0028] like Figure 4 and Figures 8-10 As shown, a positioning tube 402 is movably sleeved on the outer surface of the contact 404. One end of the positioning tube 402 is fixedly connected to the outer surface of the fixing ring 401. An elastic element 403 is disposed inside the positioning tube 402. One end of the elastic element 403 is fixedly connected to the inner wall of the positioning tube 402, and the other end of the elastic element 403 is fixedly connected to one end of the contact 404. The other end of the contact 404 movably penetrates into the interior of the fixing ring 401.

[0029] When the contact 404 is squeezed, the elastic element 403 is shortened, causing the contact 404 to slide inside the positioning tube 402. Since the contact 404 is located inside the fixing ring 401, it is not affected by the external environment. When the etching liquid moves to this location under the action of centrifugal force, it will have a stable frequency impact on the contact 404, which facilitates subsequent detection of whether there are bubbles on the surface of the circuit board.

[0030] like Figures 3-10 As shown, the outer surface of the slide rod 405 slides against the inner wall of the positioning tube 402, the outer surface of the moving block 406 slides against the inner wall of the slide groove 311, the outer surface of the negative pressure suction tube 412 is fixedly connected to the inner wall of the fixing ring 401, and multiple negative pressure chambers 408 are fixed on both outer surfaces of the equipment support frame 301.

[0031] The positioning tube 402 limits the sliding rod 405, and the sliding groove 311 limits the moving block 406. When there are air bubbles on the circuit board surface, under negative pressure, the air bubbles are moved out of the circuit board surface through the negative pressure suction tube 412. Since the circuit board is rotating at a low speed when adsorbing air bubbles, to prevent the air bubbles from rotating to the position corresponding to the contact 404 when adsorbing air bubbles, therefore, Figure 4 As shown, the negative pressure suction tube 412 is arranged on both sides of the contact 404. Its purpose is to expand the negative pressure adsorption range within a certain space, so as to better adsorb bubbles.

[0032] like Figures 1-2 and Figure 11 As shown, the negative pressure assembly 5 also includes a negative pressure chamber 501. The bottom end of the negative pressure chamber 501 is fixedly connected to the top of the vertical etching machine body 101. The top end of the inlet pipe 502 passes through the vertical etching machine body 101 to the inside of the negative pressure chamber 501. The top of the negative pressure chamber 501 is fixedly connected to a drain pipe 503. The top of the vertical etching machine body 101 is fixedly installed with a buffer chamber 504 by screws. The bottom end of the drain pipe 503 is fixedly inserted into the inside of the buffer chamber 504. The top of the vertical etching machine body 101 is fixedly installed with an air pump 505 by screws. The input end of the air pump 505 is fixedly connected to a suction pipe 506. One end of the suction pipe 506 is fixedly inserted into the inside of the buffer chamber 504. The outer surface of the buffer chamber 504 is fixedly connected to a return pipe 507. A solenoid valve 508 is provided on the outer surface of the return pipe 507.

[0033] Before etching the circuit board in the vertical etching machine body 101, the air pump 505 is started by the PLC controller 2, which drives the suction pipe 506 to draw gas into the buffer chamber 504, and then draws gas into the drainage pipe 503, the negative pressure chamber 501, multiple inlet pipes 502 and the negative pressure chamber 408, so that the multiple negative pressure chambers 408 are all in a negative pressure state, completing the preparation of the negative pressure state in advance, which facilitates the subsequent instantaneous extraction of air bubbles. During the process of extracting air bubbles under negative pressure, the etching liquid flows along the negative pressure chamber 408, multiple inlet pipes 502, negative pressure chamber 501 and drainage pipe 503 and finally enters the buffer chamber 504 for temporary storage. When the vertical etching machine body 101 stops running, the solenoid valve 508 is opened, and the etching liquid will accumulate in the liquid tank 104 along the return pipe 507 under its own gravity. The air pump 505 is a VN-300 oil-free negative pressure vacuum pump.

[0034] like Figures 1-2As shown, the etching assembly 1 also includes a perforated plate 102. The outer surface of the perforated plate 102 is fixedly connected to the inner wall of the vertical etching machine body 101. Fixing brackets 103 are fixedly installed near the two side edges between the relative inner walls of the vertical etching machine body 101. The inner walls of the two fixing brackets 103 are fixedly connected to the outer surface of the equipment support frame 301. A liquid accumulation tank 104 is provided inside the vertical etching machine body 101. The bottom end of the return pipe 507 is fixedly inserted into the interior of the liquid accumulation tank 104.

[0035] After the circuit board surface is sprayed with etching solution, the etching solution enters the interior of the liquid accumulation tank 104 under its own gravity. The perforated plate 102 can filter the impurities generated during the etching process. The two fixed brackets 103 play a role in limiting and supporting the equipment support frame 301. The etching solution with air bubbles adsorbed by negative pressure can enter the interior of the liquid accumulation tank 104 for secondary use along the return pipe 507.

[0036] like Figures 1-2 As shown, a spray pump 105 is installed on the bottom surface of the vertical etching machine body 101. The inlet end of the spray pump 105 is fixedly connected to an inlet pipe 106. The top end of the inlet pipe 106 is fixedly inserted into the interior of the liquid accumulation tank 104. The outlet end of the spray pump 105 is fixedly connected to an outlet pipe 107. Both ends of the outlet pipe 107 are fixedly inserted into the interior of the vertical etching machine body 101. Both ends of the outlet pipe 107 are provided with nozzle groups 108. The two nozzle groups 108 are both located on the opposite inner walls of the vertical etching machine body 101.

[0037] During the etching process of the circuit board, the spray pump 105 is first started, which drives the inlet pipe 106 to draw etching solution into the liquid accumulation tank 104. The etching solution is distributed to the interior of the two nozzle groups 108 through the outlet pipe 107 and sprayed outward to perform spray etching on both sides of the circuit board. The nozzle group 108 is a Changyuan CYCO KY-1 / 4-PVDF-80° fan-shaped nozzle, and the spray pump 105 is a Subao STD-40SK-1 acid and alkali resistant liquid pump.

[0038] The usage and working principle of this device are as follows: During the etching process of a rectangular circuit board, the etching solution is first stored in the accumulation tank 104. Then, the air pump 505 is started by the PLC controller 2, which drives the suction pipe 506 to draw gas into the buffer chamber 504, and then draws gas into the drainage pipe 503, the negative pressure chamber 501, multiple inlet pipes 502 and the negative pressure chamber 408, so that all the negative pressure chambers 408 are in a negative pressure state. Then, one end of the circuit board is embedded in the clamping member 304 located at the bottom, and the bidirectional hydraulic rod 305 is activated to move the two clamping members 304 towards each other, thus etching the photomask. The circuit board is clamped and fixed. The spray pump 105 is started, which drives the inlet pipe 106 to draw etching solution into the liquid accumulation tank 104. The etching solution is distributed to the inside of the two nozzle groups 108 through the outlet pipe 107 and sprayed outward to perform spray etching on both sides of the circuit board. At this time, the drive motor 308 can be started to drive the drive rod 309 to rotate, which in turn drives the two clamping parts 304 to rotate, causing the circuit board to rotate. Under the action of centrifugal force, the etching solution remaining on its surface flows radially along the circuit board surface and is evenly thrown outward, impacting the inner wall of the fixing ring 401, thereby setting the fixing ring 401 into a fixed position. In circuit 01, contact 404 is impacted by the etching solution and moves towards the inner wall of its corresponding positioning tube 402. With the uniform spraying of the etching solution, the elastic element 403 experiences stable force, causing its corresponding slide rod 405 to move at a stable frequency, driving the moving contacts 407 on both sides to move back and forth. When an air bubble forms at a certain point on the circuit board, the force on contact 404 becomes unstable, resulting in uneven extension and contraction of the elastic element 403, fluctuating in size. This causes it to contact one of the stationary contacts 312 in its corresponding slide groove 311. When the two contacts, the circuit is completed, and current immediately flows through, supplying power to the corresponding contact. Magnet 410 is powered to generate an adsorption force on sealing slider 411. The inner wall of sealing slider 411 is made of ferrite permanent magnet material, which pushes it to move along the inner wall of negative pressure chamber 408 to a position where it is tightly attached to the outer surface of electromagnet 410. At this time, PLC controller 2 detects the contact conduction signal and controls the electromagnet 410 at this position to be energized for 1 to 3 seconds. During this period, under the action of negative pressure, bubbles and etching liquid around the bubbles will be instantly adsorbed in a small area. The adsorbed bubbles and etching liquid flow outward along the corresponding inlet pipe 502, completing the instantaneous adsorption of bubbles.

[0039] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An etching machine for circuit board production, comprising an etching assembly (1) and a PLC controller (2), wherein the etching assembly (1) includes a vertical etching machine body (101), and a negative pressure assembly (5) is disposed on the top of the vertical etching machine body (101), the negative pressure assembly (5) including a plurality of inlet tubes (502), characterized in that: The positioning component (3) includes two clamping parts (304) for fixing the circuit board and a device support frame (301). Multiple sliding grooves (311) are provided on both outer surfaces of the device support frame (301). Static contacts (312) are provided on the opposite inner walls of the sliding grooves (311). Two toothed rings (306) for driving the circuit board to rotate are movably embedded inside the device support frame (301). The pressure detection assembly (4) includes two fixed rings (401). The outer surfaces of the two fixed rings (401) are fixedly connected to the outer surfaces of the two sides of the equipment support frame (301). The inner walls of the two fixed rings (401) are slidably connected to a contact (404) for detecting whether there are bubbles on the surface of the circuit board. The outer surface of the contact (404) is fixedly connected to a slide rod (405). One end of the contact (404) is provided with an elastic element (403). One end of the slide rod (405) is fixed with a moving block (406). The outer surfaces of the two sides of the moving block (406) are provided with moving contacts (407) for detecting whether the movement of the contact (404) is normal. Both sides of the contact (404) are provided with negative pressure suction tubes (412) for negative pressure adsorption of bubbles on the surface of the circuit board.

2. The etching machine for circuit board production according to claim 1, characterized in that: The positioning component (3) also includes a drive disk (302), which is movably embedded inside the equipment support frame (301). Limiting tubes (303) are fixed between the relative inner walls of the drive disk (302). The inner walls of the two clamping members (304) slide against the outer surfaces of the two limiting tubes (303). A bidirectional hydraulic rod (305) is fixedly installed inside the drive disk (302) through an auxiliary ring. The two ends of the bidirectional hydraulic rod (305) are fixedly connected to the outer surfaces of the two clamping members (304).

3. The etching machine for circuit board production according to claim 2, characterized in that: The inner walls of the two gear rings (306) are fixedly connected to the outer surface of the drive disk (302). The outer surface of the equipment support frame (301) is fixed with a mounting bracket (307) by screws. The inner wall of the mounting bracket (307) is provided with a drive motor (308). The output end of the drive motor (308) is fixed with a drive rod (309). The outer surface of the drive rod (309) is fixedly fitted with two drive gears (310). Both ends of the drive rod (309) extend movably through to the outside of the equipment support frame (301). The outer surfaces of the two drive gears (310) mesh with the outer surfaces of the two gear rings (306) respectively. Both drive gears (310) are located inside the equipment support frame (301).

4. The etching machine for circuit board production according to claim 3, characterized in that: The outer surface of the contact (404) is movably fitted with a positioning tube (402). One end of the positioning tube (402) is fixedly connected to the outer surface of the fixing ring (401). The elastic element (403) is disposed inside the positioning tube (402). One end of the elastic element (403) is fixedly connected to the inner wall of the positioning tube (402). The other end of the elastic element (403) is fixedly connected to one end of the contact (404). The other end of the contact (404) movably penetrates into the interior of the fixing ring (401).

5. The etching machine for circuit board production according to claim 4, characterized in that: The outer surface of the slide rod (405) slides against the inner wall of the positioning tube (402), the outer surface of the moving block (406) slides against the inner wall of the slide groove (311), the outer surface of the negative pressure suction tube (412) is fixedly connected to the inner wall of the fixing ring (401), and multiple negative pressure chambers (408) are fixed on both outer surfaces of the equipment support frame (301).

6. The etching machine for circuit board production according to claim 5, characterized in that: One end of each pair of negative pressure suction tubes (412) is fixedly connected to the inner wall of the negative pressure chamber (408). An electromagnet (410) is provided on the inner wall of the negative pressure chamber (408). A limit frame (409) is fixedly installed between the opposite inner walls of the negative pressure chamber (408). A sealing slider (411) is slidably connected to the inner wall of the negative pressure chamber (408). The interior of the negative pressure chamber (408) is fixedly connected to the interior of the inlet tube (502).

7. The etching machine for circuit board production according to claim 6, characterized in that: The negative pressure assembly (5) also includes a negative pressure chamber (501). The bottom end of the negative pressure chamber (501) is fixedly connected to the top of the vertical etching machine body (101). The top end of the inlet pipe (502) passes through the vertical etching machine body (101) to the inside of the negative pressure chamber (501). The top of the negative pressure chamber (501) is fixedly connected to a drain pipe (503). The top of the vertical etching machine body (101) is fixedly installed with a buffer chamber (504) by screws. The bottom end of the drain pipe (503) is fixedly inserted into the inside of the buffer chamber (504).

8. The etching machine for circuit board production according to claim 7, characterized in that: An air pump (505) is fixedly installed on the top of the vertical etching machine body (101) by screws. The input end of the air pump (505) is fixedly connected to an air suction pipe (506). One end of the air suction pipe (506) is fixedly inserted into the interior of the buffer chamber (504). The outer surface of the buffer chamber (504) is fixedly connected to a return pipe (507). A solenoid valve (508) is provided on the outer surface of the return pipe (507).

9. The etching machine for circuit board production according to claim 8, characterized in that: The etching assembly (1) also includes a perforated plate (102). The outer surface of the perforated plate (102) is fixedly connected to the inner wall of the vertical etching machine body (101). Fixing brackets (103) are fixedly installed near the two side edges between the relative inner walls of the vertical etching machine body (101). The inner walls of the two fixing brackets (103) are fixedly connected to the outer surface of the equipment support frame (301). A liquid accumulation tank (104) is provided inside the vertical etching machine body (101). The bottom end of the return pipe (507) is fixedly inserted into the inside of the liquid accumulation tank (104).

10. The etching machine for circuit board production according to claim 9, characterized in that: A spray pump (105) is installed on the bottom surface of the vertical etching machine body (101). The inlet end of the spray pump (105) is fixedly connected to an inlet pipe (106). The top end of the inlet pipe (106) is fixedly inserted into the interior of the liquid accumulation tank (104). The outlet end of the spray pump (105) is fixedly connected to an outlet pipe (107). Both ends of the outlet pipe (107) are fixedly inserted into the interior of the vertical etching machine body (101). Both ends of the outlet pipe (107) are provided with nozzle groups (108). The two nozzle groups (108) are both located on the opposite inner walls of the vertical etching machine body (101).

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