Vacuum suction negative pressure control method, PCB processing equipment

Abstract

This application belongs to the field of circuit board processing technology, and provides a dust suction negative pressure control method and PCB processing equipment. The dust suction negative pressure control method is applied to the PCB processing equipment, which includes a dust suction hood and a spindle connected to the dust suction hood. The spindle is used to clamp a tool. The method includes: acquiring tool parameters of the target tool, including tool diameter and / or tool length; calling a pre-stored mapping relationship to match and obtain target operating parameters corresponding to the tool parameters, wherein the mapping relationship includes operating parameters corresponding to different tool diameters and / or tool lengths, and the target operating parameters include a dust suction negative pressure range; and adjusting the dust suction negative pressure in the dust suction hood according to the target operating parameters.

Description

Technical Field

[0001] This application belongs to the field of circuit board processing technology, and more specifically, relates to a dust suction negative pressure control method and PCB processing equipment. Background Technology

[0002] PCB circuit boards are the core basic components of various electronic devices, bearing the key connections and functions of various electronic components. Their manufacturing process has extremely high requirements for processing precision.

[0003] In PCB manufacturing, negative pressure dust removal systems are typically used to prevent chips from interfering with the machining process. Depending on the machining requirements, different tool sizes are frequently needed. However, because the rigidity and other parameters of each tool size differ, the negative pressure dust removal system has varying effects on each tool, potentially impacting machining accuracy. Particularly for tools with small diameters and long cutting edges, the negative pressure generated by the dust removal system can easily cause tool wobble, leading to tool breakage and affecting machining performance. Summary of the Invention

[0004] The purpose of this application is to provide a dust suction negative pressure control method and PCB processing equipment, which aims to solve the technical problem that the negative pressure dust removal method in the current PCB processing affects the processing accuracy.

[0005] To achieve the above objectives, according to the first aspect of this application, a dust suction negative pressure control method is provided, applied to PCB processing equipment. The PCB processing equipment includes a dust suction hood and a spindle connected to the dust suction hood. The spindle is used to hold a cutting tool. The method includes: Obtain the tool parameters of the target tool, including the tool diameter and / or tool length; The pre-stored mapping relationship is invoked to match the target operating parameters corresponding to the tool parameters. The mapping relationship includes the operating parameters corresponding to different tool diameters and / or tool lengths, and the target operating parameters include the chip suction negative pressure range. Adjust the negative pressure inside the chip suction hood according to the target operating parameters.

[0006] In some embodiments, adjusting the negative pressure inside the dust collection hood according to target operating parameters includes: Obtain the current negative pressure inside the dust collection hood; Compensation parameters are generated based on the deviation between the current suction negative pressure and the suction negative pressure range; Adjust the negative pressure inside the dust collection hood according to the compensation parameters.

[0007] In some embodiments, the PCB processing equipment includes a regulating valve and a dust extraction pipe. The regulating valve is connected to the dust extraction pipe, one end of which is connected to a dust extraction hood. The dust extraction negative pressure inside the dust extraction hood is adjusted according to compensation parameters, including: When the compensation parameter is less than or equal to the preset threshold, the control valve adjusts the negative pressure inside the chip suction hood according to the compensation parameter.

[0008] In some embodiments, the PCB processing equipment further includes a variable frequency negative pressure fan, which is connected to a dust collection hood via a dust extraction pipe. The fan adjusts the negative pressure inside the dust collection hood according to compensation parameters. The equipment also includes: When the compensation parameter is greater than the preset threshold, the variable frequency negative pressure fan is first controlled to make a preliminary adjustment to the negative pressure of the dust collection hood according to the compensation parameter, and then the regulating valve is controlled to make a secondary adjustment to the negative pressure of the dust collection hood.

[0009] In some embodiments, the target operating parameter further includes a target rotational speed, and the method further includes: The target rotational speed corresponding to the tool parameters is obtained by matching the pre-stored mapping relationship; Control the spindle of the PCB processing equipment to run at the target speed.

[0010] In some embodiments, the PCB processing equipment further includes a drive motor connected to the spindle drive, and the method further includes: Obtain the real-time collected actual load current value of the drive motor; Compare the actual load current value with the preset normal current range; When the actual load current value deviates from the preset normal current range, the target speed is adjusted according to the deviation.

[0011] In some embodiments, obtaining the tool parameters of the target tool includes: The identification information of the target cutting tool is acquired using a vision camera; Parse the identification information to obtain the diameter and / or length of the target tool.

[0012] In some embodiments, the method further includes: Obtain the current state of the target tool, including machining state and non-machining state; If the target tool is in a machining state, execute any one of the methods; When the target tool is not in a machining state, the suction negative pressure in the chip suction hood is adjusted to the first negative pressure value, which is greater than the upper limit of the suction negative pressure range, so as to reduce the suction negative pressure in the chip suction hood.

[0013] According to a second aspect of this application, a PCB processing equipment is provided, employing the aforementioned dust suction negative pressure control method, wherein: The chip suction hood is mounted on the outside of the spindle of the PCB processing equipment. The inside of the chip suction hood forms a receiving cavity, and the spindle of the PCB processing equipment can move within the receiving cavity. The bottom of the chip suction hood is provided with a clearance opening that communicates with the receiving cavity. The tool held by the spindle can pass through the clearance opening to process the PCB. The variable frequency negative pressure fan and the dust collection pipeline are connected to the receiving cavity inside the dust collection hood through the dust collection pipeline. The regulating valve is connected to the vacuum pipe; Both the variable frequency negative pressure fan and the regulating valve can adjust the negative pressure of the dust collection hood.

[0014] In some embodiments, the sidewall of the dust collection hood is provided with at least two dust collection ports, which are arranged symmetrically about the central axis of the dust collection hood.

[0015] According to a third aspect of this application, an electronic device is provided, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the electronic device performs the method as described in any one of the above.

[0016] According to a fourth aspect of this application, a computer-readable storage medium is provided that stores a computer program, which, when executed by a processor, implements the method as described in any one of the above.

[0017] According to a fifth aspect of this application, a computer program product is provided that, when the computer program product is run on an electronic device, causes the electronic device to perform the method of any one of the first aspects above.

[0018] It is understandable that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here.

[0019] The beneficial effects of the embodiments in this application compared with the prior art are: The dust suction negative pressure control scheme provided in this application embodiment is applied to PCB processing equipment. The PCB processing equipment includes a dust suction hood and a spindle connected to the dust suction hood. The spindle is used to clamp a tool. By acquiring the tool parameters of the target tool, including the tool diameter and / or tool length, a pre-stored mapping relationship is called to match the target operating parameters corresponding to the tool parameters. Specifically, the mapping relationship includes operating parameters corresponding to different tool diameters and / or tool lengths. The target operating parameters include a dust suction negative pressure range. Then, according to the target operating parameters, the dust suction negative pressure in the dust suction hood is adjusted to achieve adaptive matching of the corresponding dust suction negative pressure for tools of different specifications. This can solve the technical problem of decreased PCB processing accuracy caused by the mismatch between the dust suction negative pressure parameters of the dust suction hood and the tool characteristics during PCB processing. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic flowchart of a vacuum suction negative pressure control method provided in an embodiment of this application; Figure 2 This is a schematic flowchart of a vacuum suction negative pressure control method provided in an embodiment of this application; Figure 3 This is a schematic flowchart of a vacuum suction negative pressure control method provided in an embodiment of this application; Figure 4 This is a schematic flowchart of a vacuum suction negative pressure control method provided in an embodiment of this application; Figure 5 This is a schematic flowchart of a vacuum suction negative pressure control method provided in an embodiment of this application; Figure 6 This is a schematic flowchart of a vacuum suction negative pressure control method provided in an embodiment of this application; Figure 7a This is a cross-sectional schematic diagram of a dust collection hood provided in an embodiment of this application; Figure 7b This is a schematic diagram of a negative pressure regulating mechanism provided in an embodiment of the present invention.

[0022] Figure 8 This is a side view schematic diagram of a dust collection hood provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of a vacuum suction negative pressure control device provided in an embodiment of this application.

[0023] Figure label: 1. Spindle, 2. Cutting tool, 4. Presser foot mounting ring groove, 5. Spindle buffer pad, 12. Dust suction port, 13. Negative pressure air inlet, 20. Clearance port, 100. Dust suction hood, 200. Receiving cavity, 201. Pneumatic regulating valve, 202. Pneumatic positioner, 203. Air pressure sensor, 204. Rotatable blade, 300. Negative pressure air path. Detailed Implementation

[0024] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0025] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0026] It should also be understood that, in the description of this application, unless otherwise stated, the " / " used in the specification and appended claims indicates that the related objects are in an "or" relationship. For example, A / B can mean A or B. The "and / or" in this application is merely a description of the relationship between the related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0027] Furthermore, to facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, but are only used for distinguishing descriptions, and the terms "first" and "second" do not necessarily imply that they are different, nor should they be construed as indicating or implying relative importance.

[0028] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0029] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0030] PCB circuit boards are the core basic components of various electronic devices, bearing the key connections and functions of various electronic components. Their manufacturing process has extremely high requirements for processing precision.

[0031] In PCB manufacturing, negative pressure dust removal systems are typically used to prevent chips from interfering with the machining process. Depending on the machining requirements, different tool sizes are frequently needed. However, because the rigidity and other parameters of each tool size differ, the negative pressure dust removal system has varying effects on each tool, potentially impacting machining accuracy. Particularly for tools with small diameters and long cutting edges, the negative pressure generated by the dust removal system can easily cause tool wobble, leading to tool breakage and affecting machining performance.

[0032] To address the aforementioned technical problems, this application provides an example of a dust suction negative pressure control method. This method involves automatically matching and adapting dust suction negative pressure parameters based on the specifications of the cutting tools used in the current machining process during PCB circuit board drilling.

[0033] Please refer to Figure 1 As shown, Figure 1 This illustration shows a schematic flowchart of a vacuum negative pressure control method provided in this application. It is provided as an example and not as a limitation. The vacuum negative pressure control method of this disclosure can be executed on a local controller of a PCB processing equipment. The method is applied to the PCB processing equipment, which includes a dust collection hood and a spindle connected to the dust collection hood. The spindle is used to hold a tool. The method includes: S101, Obtain the tool parameters of the target tool, including the tool diameter and / or tool length; S102, call the pre-stored mapping relationship to match the target operating parameters corresponding to the tool parameters. The mapping relationship includes the operating parameters corresponding to different tool diameters and / or tool lengths, and the target operating parameters include the chip suction negative pressure range. S103, adjust the negative pressure of the chip suction hood according to the target operating parameters.

[0034] First, a brief description of steps 101-103 above will be given.

[0035] In this embodiment, the chip suction hood can be coaxially mounted on the outside of the spindle of the PCB processing equipment. As a negative pressure dust removal execution structure, the chip suction hood has a receiving cavity, which can be understood as covering the processing area of ​​the target tool.

[0036] In step 101, the PCB processing equipment is equipped with a parameter acquisition unit, such as a vision camera, which can automatically identify the tool parameters of the target tool (i.e., the tool currently being processed).

[0037] In some embodiments, the tool parameters of the target tool currently being processed can be acquired by a vision camera equipped with the PCB processing equipment. These tool parameters include the tool diameter, which characterizes the radial dimension of the tool, and the tool length, which characterizes the axial dimension of the tool. The tool length may include the total length of the tool and / or the length of the cutting edge.

[0038] It should be understood that during PCB manufacturing, different specifications of cutting tools need to be switched according to different processing requirements. The rigidity, cutting volume, and chip removal requirements of different specifications of cutting tools are significantly different. Therefore, the tool parameters of the target cutting tool are the basis for matching the dust removal negative pressure parameters.

[0039] In step 102, the controller internally stores a mapping relationship that has been calibrated and corrected by process testing. This mapping relationship is a one-to-one correspondence library between tool parameters and operating parameters, including the tool diameter and tool length of tools of all specifications for PCB processing, and pre-stores the corresponding operating parameters for different tool diameters and tool lengths. The controller calls the pre-stored mapping relationship, uses the tool parameters of the acquired target tool as search conditions, and matches them to obtain the target operating parameters that are suitable for the target tool. The target operating parameters at least include the chip suction negative pressure range suitable for the target tool.

[0040] In step 103, the controller sends an adjustment command to the negative pressure adjustment mechanism of the PCB processing equipment according to the target operating parameters matched in step 102, adjusting and stabilizing the negative pressure inside the dust collection hood within the range corresponding to the target operating parameters. Unlike the traditional fixed negative pressure dust removal mode, the dust collection negative pressure control method provided in this embodiment can automatically match the corresponding target operating parameters according to the different specifications of the cutting tools being switched, and then adjust the negative pressure inside the dust collection hood according to the target operating parameters. This can prevent the weak micro-diameter cutting tools from wobbling and breaking due to excessive negative pressure, and can also prevent large-diameter cutting tools from accumulating chips due to insufficient negative pressure, ensuring the processing accuracy and stability of the PCB processing equipment when using different specifications of cutting tools.

[0041] The dust suction negative pressure control scheme provided in this application embodiment is applied to PCB processing equipment. The PCB processing equipment includes a dust suction hood and a spindle connected to the dust suction hood. The spindle is used to clamp the tool. By acquiring the tool parameters of the target tool, including the tool diameter and / or tool length, a pre-stored mapping relationship is called to match the target operating parameters corresponding to the tool parameters. Specifically, the mapping relationship includes operating parameters corresponding to different tool diameters and / or tool lengths. The target operating parameters include the dust suction negative pressure range. Then, according to the target operating parameters, the dust suction negative pressure in the dust suction hood is adjusted to achieve adaptive matching of the corresponding dust suction negative pressure for tools of different specifications. This can solve the technical problem that the dust suction negative pressure parameters of the dust suction hood do not match the characteristics of the tool during PCB processing, resulting in tool wobble or poor dust suction effect, thereby reducing the PCB processing accuracy.

[0042] In some embodiments, the acquisition of the tool parameters of the target tool can be achieved through multiple acquisition methods. The acquisition scheme can be flexibly selected according to the hardware configuration of the PCB processing equipment, without being limited to a single acquisition form.

[0043] In one implementation, please refer to Figure 2 As shown, Figure 2 A schematic flowchart of a vacuum suction negative pressure control method provided in this application is shown. Step 101, obtaining the tool parameters of the target tool, may include the following steps 1011 to 1012: Step 1011: Collect the identification information of the target tool using a vision camera; Step 1012: Parse the identification information to obtain the diameter and / or length of the target tool.

[0044] The following is a detailed description of steps 1011-1012 above.

[0045] In step 1011, the vision camera is an industrial vision acquisition unit equipped with the PCB processing equipment, which can be installed next to the spindle. During the tool change process, the vision camera acquires the identification information on the surface of the tool box where the target tool is placed. The identification information can be a QR code, barcode, or laser-etched specification code, which corresponds one-to-one with the tool in the box, and the tool parameters of the corresponding tool are pre-entered.

[0046] In step 1012, the controller decodes and analyzes the identification information collected by the vision camera to extract the corresponding tool specifications, ultimately obtaining the diameter and length of the target tool. This process is highly efficient, requires no manual intervention, and effectively avoids the problem of human error in judging tool parameters. The tool box can be equipped with a full range of PCB processing tools with diameters from 0.1mm to 3.0mm and cutting lengths from 0.3mm to 9.5mm.

[0047] For example, the tool parameters of the target tool can also be acquired by scanning the tool library code: each tool position in the tool library has a unique code attached to it. The code is pre-associated with the specification parameters of the tool in the corresponding tool position. When changing tools, the code of the current tool position is read, and the tool diameter and tool length of the tool corresponding to the current tool position can be obtained directly.

[0048] For example, manual input can also be used, where the operator inputs the diameter and length parameters of the target tool currently in use.

[0049] For example, a tool inspector can also be used to inspect the tool to identify its diameter and length.

[0050] For example, the cutting tool can also be directly photographed using a CCD camera, and the image information can be analyzed to obtain the tool's diameter and length information.

[0051] In this embodiment, the tool parameters of the target tool can be obtained through multiple parameter acquisition methods, which can be adapted to PCB processing equipment with different configurations and ensure accurate acquisition of tool specification information.

[0052] This application uses a vision camera to collect the identification information of the target tool and parse it to obtain the tool diameter and / or tool length. This eliminates the need for manual parameter input, avoids errors in manual parameter input, and improves the efficiency of tool changing and the accuracy of parameter matching.

[0053] In some embodiments, in step 102, the pre-stored mapping relationship can be pre-calibrated in multiple groups according to the processing scenario, sheet material type, and equipment characteristics. The controller can call the corresponding mapping relationship according to the current processing requirements without limiting a single parameter matching rule.

[0054] In one implementation, the mapping relationship is pre-stored inside the controller in the form of a parameter mapping table. Table 1 below shows a set of exemplary calibration parameters for the mapping relationship: Table 1

[0055] After the controller obtains the tool parameters of the target tool, it can use Table 1 above as the retrieval benchmark to match and obtain the corresponding tool's chip suction negative pressure range.

[0056] It should be understood that Table 1 above are exemplary calibration parameters. In actual applications, the parameter range can be expanded and adjusted according to specific processing conditions to cover the processing needs of all specifications of cutting tools and all types of PCB boards.

[0057] For example, the target operating parameters may also include the target spindle speed. The mapping relationship can simultaneously store the target speed range / target speed of the spindle corresponding to different tool diameters and tool lengths. While the controller matches the chip suction negative pressure range corresponding to the tool parameters, it can also synchronously match the target speed corresponding to the tool parameters, so as to realize the coordinated matching of cutting parameters and dust removal parameters.

[0058] In this embodiment, the corresponding target operating parameters are automatically matched through pre-stored mapping relationships, eliminating the need for manual setting of operating parameters such as chip suction negative pressure range and spindle speed. After the PCB processing equipment changes tools, it automatically adapts to the corresponding processing conditions, effectively improving PCB processing efficiency and parameter matching accuracy.

[0059] In some embodiments, in step 103, adjusting the negative pressure of the dust collection hood can be achieved by a graded adjustment, which takes into account both the efficiency of quickly switching between different dust collection negative pressure ranges and the accuracy of small-scale corrections to the same dust collection negative pressure range.

[0060] In one implementation, please refer to Figure 3 As shown, Figure 3 A schematic flowchart of a vacuum suction negative pressure control method provided in this application is shown. Step 103, adjusting the vacuum suction negative pressure inside the vacuum hood according to the target operating parameters, may include the following steps 1031 to 1033: Step 1031: Obtain the current negative pressure of the dust collection hood; Step 1032: Generate compensation parameters based on the deviation between the current suction negative pressure and the suction negative pressure range; Step 1033: Adjust the negative pressure inside the dust suction hood according to the compensation parameters.

[0061] The following is a detailed description of steps 1031-1033 above.

[0062] In step 1031, a pressure sensor is installed inside the negative pressure pipeline, which can collect the current negative pressure of the negative pressure pipeline and the inside of the dust collection hood in real time, and transmit the real-time collected negative pressure to the controller to realize uninterrupted monitoring of the negative pressure status inside the dust collection hood.

[0063] In step 1032, the controller compares the current suction negative pressure with the suction negative pressure range in the target operating parameters to obtain the deviation value of the current suction negative pressure relative to the target negative pressure range. This deviation value is the compensation parameter, which can specifically include two types of information: deviation direction and deviation magnitude.

[0064] In step 1033, the controller can send an adjustment command to the negative pressure adjustment mechanism (adjusting valve) according to the compensation parameters to adjust the negative pressure of the chip suction hood.

[0065] In some embodiments, the PCB processing equipment includes a regulating valve connected to a dust extraction pipeline. The regulating valve adjusts the negative pressure inside the dust extraction hood according to a compensation parameter. Specifically, when the compensation parameter is less than or equal to a preset threshold, the regulating valve is controlled to adjust the negative pressure inside the dust extraction hood.

[0066] In some embodiments, the PCB processing equipment also includes a variable frequency negative pressure fan, which is connected to the dust collection hood through a dust collection pipe. The dust collection negative pressure inside the dust collection hood is adjusted according to the compensation parameter. The equipment also includes: when the compensation parameter is greater than a preset threshold, controlling the variable frequency negative pressure fan and the regulating valve to adjust the dust collection negative pressure inside the dust collection hood respectively.

[0067] In one embodiment, when the compensation parameter is greater than a preset threshold, the variable frequency negative pressure fan is controlled to make coarse adjustments, specifically by quickly switching between different dust suction negative pressure ranges, while the regulating valve connected to the dust suction pipeline is controlled to make fine adjustments, specifically by making small corrections to the same dust suction negative pressure range.

[0068] In another embodiment, when the compensation parameter is less than or equal to a preset threshold, only the regulating valve is controlled to finely adjust the dust collection negative pressure within a small range. Specifically, the variable frequency negative pressure fan adjusts the base negative pressure of the negative pressure pipeline by adjusting its operating frequency, enabling rapid switching (within a wide range) between different dust collection negative pressure ranges; the regulating valve adjusts the flow area of ​​the dust collection pipeline by changing its opening, achieving fine-tuning of the specific dust collection negative pressure value within the same range. The combination of these two mechanisms allows for adjustment within the dust collection negative pressure range of -0.5 kPa to -14 kPa.

[0069] In some embodiments, different negative pressure ranges for chip suction can be quickly switched by controlling the regulating valve, specifically according to the adjustment range parameters of the regulating valve. In this embodiment, by adjusting the chip suction negative pressure inside the chip suction hood in a graded manner, the chip suction negative pressure inside the chip suction hood can be quickly and accurately maintained within the target negative pressure range, adapting to the processing requirements of different specifications of tools, and effectively reducing the probability of problems such as tool wobble, tool breakage, and chip accumulation.

[0070] By acquiring the current negative pressure inside the dust collection hood, compensation parameters are generated based on the deviation between the current negative pressure and the dust collection negative pressure range to adjust the internal negative pressure of the dust collection hood, thus achieving closed-loop control of the dust collection negative pressure. When the compensation parameter is less than or equal to a preset threshold, fine adjustment is performed only through the regulating valve connected to the dust collection pipeline to ensure the accuracy of negative pressure adjustment. When the compensation parameter is greater than the preset threshold, the variable frequency negative pressure fan and the regulating valve are controlled simultaneously for coordinated adjustment, taking into account both the efficiency and accuracy of rapid switching between different dust collection negative pressure ranges, adapting to rapid switching of negative pressure ranges after tool replacement and correction of small negative pressure fluctuations within the same dust collection negative pressure range during processing.

[0071] In some embodiments, the target operating parameters also include a target rotational speed; please refer to [reference needed]. Figure 4 As shown, Figure 4 A schematic flowchart of a vacuum suction negative pressure control method provided in this application is shown. The method further includes the following steps: Step 1041: Match the target rotation speed corresponding to the tool parameters according to the pre-stored mapping relationship; Step 1042: Control the spindle of the PCB processing equipment to run at the target speed.

[0072] The following is a detailed description of steps 1041-1042 above.

[0073] In step 1041, the pre-stored mapping relationship simultaneously stores the spindle target speed range or fixed target speed corresponding to different tool diameters and tool lengths. This speed parameter and the chip suction negative pressure range are a one-to-one calibrated combination, taking into account both the stability of the cutting process and the chip removal requirements of negative pressure dust removal. While the controller matches the chip suction negative pressure range corresponding to the tool parameters of the target tool, it can simultaneously retrieve the target speed corresponding to the tool parameters from the mapping relationship.

[0074] It should be understood that the target rotation speed in the mapping relationship can be pre-calibrated in multiple sets according to the type and thickness of the processed board material, which can adapt to the processing requirements of different types of PCB materials such as HDI micro-hole boards, high-density multilayer boards, and aluminum substrates. Table 1 only shows the processing parameters corresponding to some types of processed boards; the processing parameters for other types can refer to industry-standard experience values.

[0075] In step 1042, the controller sends a speed control command to the spindle drive unit to control the spindle to run at the target speed obtained by matching, so as to achieve coordinated matching of cutting parameters and dust removal parameters, and avoid problems such as tool wobble and poor chip removal caused by mismatch between spindle speed and chip suction negative pressure.

[0076] For example, for a micro-diameter tool with a diameter of 0.2 mm and a cutting length of 6.5 mm, the target rotation speed synchronously calibrated in the mapping relationship is 100~130 krpm, which is bound to the chip suction negative pressure range of -4.8~-5.0 kPa. The controller can synchronously complete the matching and distribution of the two parameters without the need for manual setting.

[0077] In this embodiment, the target speed is synchronously matched and the spindle operation is controlled by pre-stored mapping relationship. There is no need to manually set the spindle speed parameters. After tool change, the cutting parameters and dust removal parameters are automatically matched, which effectively improves the processing efficiency and parameter matching accuracy and avoids processing defects caused by mismatch between speed and negative pressure.

[0078] Detailed Implementation of Dynamic Correction of Target Speed ​​Based on Load Current In some embodiments, the PCB processing equipment also includes a drive motor connected to the spindle drive; please refer to... Figure 5 As shown, Figure 5 A schematic flowchart of a vacuum suction negative pressure control method provided in this application is shown. The method further includes the following steps: Step 1051: Obtain the real-time collected actual load current value of the drive motor; Step 1052: Compare the actual load current value with the preset normal current range; Step 1053: When the actual load current value deviates from the preset normal current range, adjust the target speed according to the deviation.

[0079] The following is a detailed description of steps 1051-1053 above.

[0080] In step 1051, a current sensor is installed at the assembly position of the drive motor. The current sensor can collect the actual load current value of the drive motor in real time during operation and transmit the collected current data to the controller in real time. The actual load current value can intuitively reflect the cutting resistance, chip removal smoothness, and actual force state of the tool during the current drilling process.

[0081] In step 1052, the controller has pre-stored preset normal current ranges corresponding to different tool specifications and different processed materials. These ranges are current ranges obtained by actual measurement and calibration under normal and stable cutting conditions, and are used as a benchmark to determine whether the current processing state is normal.

[0082] In step 1053, the controller dynamically corrects the current target speed based on the direction and magnitude of the deviation of the actual load current from the preset normal current range.

[0083] In one embodiment, when the actual load current value is higher than the upper limit of the preset normal current range, it is determined that the current cutting resistance is too high, which is likely caused by poor chip removal. The target speed is reduced accordingly based on the deviation, thereby reducing the cutting load.

[0084] In another embodiment, when the actual load current value is lower than the lower limit of the preset normal current range, it is determined that the current cutting load is too small, and the target speed is increased accordingly according to the deviation range to improve the machining efficiency.

[0085] In this embodiment, the target speed is dynamically corrected by collecting the actual load current value of the drive motor, thereby realizing the adaptive closed-loop adjustment of the spindle speed under working conditions. This can effectively cope with dynamic working conditions such as poor chip removal and abnormal load during the machining process, further improve the stability of the machining process, and avoid problems such as tool breakage and poor hole shape caused by abnormal load.

[0086] This application achieves coordinated adaptation of cutting parameters and dust removal parameters by synchronously matching the corresponding target speed and controlling the spindle operation through mapping relationship; at the same time, by collecting the actual load current value of the drive motor, the target speed is corrected according to the magnitude of the current deviation from the preset normal range, which can adaptively adjust the cutting conditions to cope with dynamic processing states such as poor chip removal and abnormal load, and further improve the stability of PCB processing.

[0087] In some embodiments, please refer to Figure 6 As shown, Figure 6 A schematic flowchart of a vacuum suction negative pressure control method provided in this application is shown. The method further includes the following steps: Step 1061: Obtain the current state of the target tool, which includes the machining state and the non-machining state.

[0088] Step 1062: When the target tool is in the machining state, execute any of the aforementioned dust suction negative pressure control methods.

[0089] Step 1063: When the target tool is not in a machining state, adjust the negative pressure of the chip suction hood to the first negative pressure value.

[0090] The first negative pressure value is greater than the lower limit of the dust suction negative pressure range, so as to reduce the dust suction negative pressure inside the dust suction hood.

[0091] The following is a detailed description of steps 1061-1063 above.

[0092] In step 1061, the controller can determine the current state of the tool by reading the spindle feed signal and the tool position signal: for example, when the spindle is in the feed drilling state, it is determined to be in the machining state; when the spindle is in the tool lifting, tool changing, or standby state, it is determined to be in the non-machining state.

[0093] In step 1062, when the target tool is in the machining state, the controller executes the full-process control steps of tool parameter identification, parameter matching, and negative pressure adjustment in the aforementioned dust suction negative pressure control method, maintaining the dust suction negative pressure in the dust suction hood within the dust suction negative pressure range adapted to the target tool, and ensuring the chip removal effect and tool force stability during PCB machining.

[0094] In step 1063, when the target tool is in a non-machining state, the controller issues a command to lower the negative pressure of the chip suction hood to the first negative pressure value. The first negative pressure value is pre-calibrated to be higher than the upper limit of the negative pressure range of the chip suction under all machining states.

[0095] For example, the lowest value of the negative pressure range for chip suction during processing is -4.8 kPa, and the first negative pressure value can be calibrated to -3.0 kPa. This is sufficient to maintain the basic suction force to prevent dust leakage, while reducing the force of the negative pressure on the cutting tool.

[0096] In this embodiment, by identifying the machining and non-machining states of the tool, the negative pressure of the chip suction hood can be adjusted in stages. During machining, the appropriate working negative pressure is maintained to ensure the machining effect, while the negative pressure is reduced during non-machining. This can reduce the energy consumption of the air source during non-machining periods and avoid the problem of no-load swaying and tool fatigue damage caused by the continuous pulling of the tool under high negative pressure in no-load conditions, thus extending the tool's service life.

[0097] According to an embodiment of this application, a PCB processing equipment is provided, employing a dust suction negative pressure control method as described in any of the above embodiments, including: The chip suction hood is mounted on the outside of the spindle of the PCB processing equipment. The inside of the chip suction hood forms a receiving cavity, and the spindle of the PCB processing equipment can move within the receiving cavity. The bottom of the chip suction hood is provided with a clearance opening that communicates with the receiving cavity. The tool held by the spindle can pass through the clearance opening to process the PCB. The variable frequency negative pressure fan and the dust collection pipeline are connected to the receiving cavity inside the dust collection hood through the dust collection pipeline. The regulating valve is connected to the vacuum pipe; Both the variable frequency negative pressure fan and the regulating valve can adjust the negative pressure of the dust collection hood.

[0098] The PCB processing equipment provided in this application forms a negative pressure in the cavity of the dust collection hood through a pressure supply component to adsorb dust. In conjunction with the controller, the above-mentioned dust collection negative pressure control method is executed to achieve fully automatic adaptive adjustment of the negative pressure. The dust collection hood is provided with at least two dust collection ports that are symmetrical about the central axis. A uniform negative pressure field can be formed around the tool, further balancing the lateral force on the tool, reducing the risk of sway, and improving the processing accuracy and yield of PCB processing.

[0099] According to one embodiment of this disclosure, a PCB processing device is provided. This device is equipped with an adaptive dust suction negative pressure control function, which can automatically match the parameters of different sized cutting tools and adaptively adjust the negative pressure to meet the high-precision processing requirements of various PCB materials. The PCB processing device of this disclosure can operate as a standalone machine or be integrated into an automated PCB production line as a processing unit.

[0100] For ease of understanding, the following is a combination Figure 7a , Figure 7b , Figure 8 The embodiments of the PCB processing equipment provided in this application will be explained and described.

[0101] In this embodiment, as Figure 7aAs shown, a receiving cavity 200 is provided at the center of the chip suction hood 100. The internal space dimensions of the receiving cavity 200 are matched with the lifting and lowering feed stroke of the tool 2 held by the spindle 1, providing sufficient motion margin for the high-speed downward pressing and lifting reciprocating motion of the spindle 1, effectively avoiding structural interference between the spindle 1 and the chip suction hood 100 during operation. At the same time, the receiving cavity 200 can form a closed working space around the tool 2, gathering negative pressure airflow, preventing the dust removal airflow from leaking out, ensuring that the negative pressure airflow acts concentrated on the processing area, and ensuring the stability of the chip removal and dust removal effect.

[0102] In some embodiments, it is still as follows Figure 7a As shown, the chip suction hood 100 also has a pressure foot mounting groove 4 and a spindle buffer pad 5. The pressure foot mounting groove 4 is located around the bottom clearance opening 20 of the chip suction hood 100 and is used to mount the pressure foot component (for fixing and pressing down the board to be processed). The tool 2 held by the spindle 1 can pass through the pressure foot component to process the PCB. The spindle buffer pad 5 is fixedly mounted on the upper end face of the chip suction hood 100 and is arranged around the upper opening of the receiving cavity 200. It is used to buffer the impact vibration generated by the downward pressing operation of the spindle 1 and to relatively seal the receiving cavity 200 of the chip suction hood 100.

[0103] In some embodiments, such as Figure 7b As shown, the negative pressure air passage 300 of the PCB processing equipment is also equipped with a negative pressure regulating mechanism, which includes a variable frequency negative pressure fan (not shown in the figure), a pneumatic regulating valve 201, a pneumatic positioner 202, and a pressure sensor 203. The variable frequency negative pressure fan and the pneumatic regulating valve 201 are connected in series on the negative pressure air passage 300. The variable frequency negative pressure fan is connected to the negative pressure air passage 300 and is used to regulate the basic negative pressure of the negative pressure air passage 300. The signal input terminal of the pneumatic positioner 202 is connected to the controller signal, and the power output terminal of the pneumatic positioner 202 is connected to the pneumatic regulating valve 201. The pneumatic regulating valve 201 can be equipped with a rotatable blade 204. The rotatable blade 204 adjusts the opening of the pneumatic regulating valve 201 by rotation to change the flow area of ​​the negative pressure air passage 300.

[0104] First, a brief description of each of the above components: The chip suction hood 100 is a negative pressure dust removal execution structure. It is coaxially sleeved on the outside of the spindle 1 and can move up and down synchronously with the spindle 1 for feeding. The internal cavity 200 provides feeding space for the spindle 1 while forming a closed negative pressure working space. The clearance opening 20 at the bottom of the chip suction hood 100 provides a channel for the tool 2 to extend for processing.

[0105] The variable frequency negative pressure fan 211 and the dust suction pipe 212 together constitute a negative pressure power unit. The variable frequency negative pressure fan 211 is the power source of the negative pressure dust removal system. It is connected to the receiving cavity 200 of the dust suction hood 100 through the dust suction pipe 212, and can provide a stable basic negative pressure for the receiving cavity 200.

[0106] The pneumatic regulating valve 201 is connected to the dust collection pipe 212 and serves as the actuator for fine-tuning the negative pressure. By changing its opening degree, it adjusts the flow area of ​​the dust collection pipe 212, thereby achieving precise fine-tuning of the negative pressure within the dust collection hood 100. The pneumatic regulating valve 201 can be a pneumatic regulating valve or an electric regulating valve, and there is no limitation on this.

[0107] The variable frequency negative pressure fan 211 and the pneumatic regulating valve 201 work together to achieve a wide range of rapid switching of negative pressure and a small range of precise correction within the chip suction hood 100, adapting to the processing needs of different specifications of cutting tools 2.

[0108] The embodiments of each component are described in detail below: In one implementation, the receiving cavity 200 of the chip suction hood 100 is a hollow cavity extending along the axial direction of the spindle 1. The inner diameter of the cavity matches the outer diameter of the spindle 1 and the vertical feed stroke. This not only provides sufficient space for the reciprocating lifting and lowering motion of the spindle 1, avoiding structural interference between the spindle 1 and the chip suction hood 100, but also forms a closed fluid space around the machining area of ​​the tool 2, ensuring that the negative pressure dust removal airflow stably surrounds the drilling area and prevents chips from splashing.

[0109] The clearance opening 20 at the bottom of the chip suction hood 100 is a circular opening. The opening size is adapted to the swing range and feed path of the tool 2, ensuring that the tool 2 can smoothly pass through the clearance opening 20 to contact the PCB board and complete the drilling process. This minimizes the opening gap, reduces negative pressure leakage, and improves the utilization rate of negative pressure.

[0110] In one implementation, a variable frequency negative pressure fan 211 is connected in series at the end of a dust extraction pipe 212. One end of the dust extraction pipe 212 is sealed and connected to the side wall interface of the dust extraction hood 100, and the other end is connected to the air inlet of the variable frequency negative pressure fan 211, forming a complete closed air extraction circuit. The variable frequency negative pressure fan 211 can change its output air volume and negative pressure by adjusting its own operating frequency, achieving a wide range of negative pressure adjustment from -0.5kPa to -14kPa. This covers basic negative pressure conditions ranging from drilling micro-aperture HDI boards to drilling large-aperture thick copper plates, providing a stable basic negative pressure range for precise pressure regulation. When switching between different specifications of cutting tools 2, the variable frequency negative pressure fan 211 can quickly adjust its operating frequency to complete the switching of the basic negative pressure level, adapting to the chip removal requirements of different cutting tools 2.

[0111] In one implementation, a pneumatic regulating valve 201 is connected in series in the middle section of the dust collection pipe 212, located between the dust collection hood 100 and the variable frequency negative pressure fan 211. The pneumatic regulating valve 201 has a rotatable blade 204 inside, which can rotate steplessly within a preset angle range. By rotating the rotatable blade 204, the valve opening is changed, thereby continuously changing the effective flow area of ​​the dust collection pipe 212, achieving minute and continuous dynamic correction of the dust collection negative pressure within the dust collection hood 100.

[0112] Compared to the coarse adjustment mode of the variable frequency negative pressure fan 211, the pneumatic regulating valve 201 has a higher flow area adjustment accuracy, which can offset the negative pressure error generated during the coarse adjustment of the fan, as well as the negative pressure fluctuation caused by the changes in drilling feed and cutting state of the tool 2, so that the negative pressure inside the chip suction hood 100 is always kept stable within the chip suction negative pressure range.

[0113] The PCB processing equipment in this embodiment uses a two-stage adjustment architecture: a variable frequency negative pressure fan 211 provides basic negative pressure, and a pneumatic regulating valve 201 completes fine pressure adjustment. Combined with the aforementioned adaptive dust suction negative pressure control method, it can automatically identify the parameters of the tool 2 and match the corresponding dust suction negative pressure range. First, the variable frequency negative pressure fan 211 quickly adjusts the basic negative pressure, and then the pneumatic regulating valve 201 accurately calibrates the dust suction negative pressure to the dust suction negative pressure range. No manual intervention is required, which effectively solves problems such as tool 2 wobble, tool breakage, and poor chip removal, and significantly improves the drilling accuracy and mass production yield of PCB processing.

[0114] In one implementation, such as Figure 8 As shown, the side wall of the dust collection hood is provided with at least two dust collection ports 12, and the at least two dust collection ports 12 are arranged symmetrically about the central axis of the dust collection hood.

[0115] Still Figure 8 As shown, the dust collection hood 100 is provided with two negative pressure air inlets 13, which are respectively connected to two dust collection ports 12, and both negative pressure air inlets 13 are connected to an external negative pressure device.

[0116] Each suction port 12 is independently connected to a suction pipe 212, which ultimately converges into the extraction circuit of the variable frequency negative pressure fan 211. This allows the negative pressure airflow to be synchronously drawn from symmetrical positions around the tool 2, forming a uniformly distributed negative pressure flow field within the receiving cavity 200. Unlike the traditional single-sided suction port structure, the symmetrically arranged suction ports 12 can evenly distribute the negative pressure adsorption force on both sides of the tool 2, mutually canceling the radial pulling force caused by the single-sided negative pressure. This prevents the tool 2 from radially deflecting due to uneven force on one side, making it particularly suitable for high-speed machining scenarios with large length-to-diameter ratio micro-diameter tools. It can effectively reduce machining defects such as hole position displacement, hole diameter deviation, and tool breakage caused by tool 2 deflection.

[0117] Furthermore, the symmetrical outflow structure allows for a more regular airflow pattern within the cavity, reducing eddies and turbulence caused by unilateral outflow. Chips generated during drilling are simultaneously drawn away from the machining area along with the uniform airflow, resulting in a smoother chip removal path and reducing the likelihood of localized chip accumulation or needle blockage. Combined with the aforementioned graded pressure regulation mechanism of the variable frequency negative pressure fan and regulating valve, the negative pressure force on the tool's circumference remains balanced during dynamic adjustment across different negative pressure ranges, further enhancing machining stability and hole position consistency under high-speed drilling conditions.

[0118] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0119] Corresponding to the vacuum suction negative pressure control method in the above embodiments, Figure 9 This is a schematic diagram of a dust suction negative pressure control device provided in an embodiment of this application, applied to PCB processing equipment. The PCB processing equipment includes a dust suction hood and a spindle connected to the dust suction hood. The spindle is used to hold a cutting tool. (Refer to...) Figure 9 The vacuum suction negative pressure control device includes: The acquisition unit 901 acquires the tool parameters of the target tool, including the tool diameter and / or tool length.

[0120] Matching unit 902 calls the pre-stored mapping relationship to match the target operating parameters corresponding to the tool parameters. The mapping relationship includes the operating parameters corresponding to different tool diameters and / or tool lengths, and the target operating parameters include the chip suction negative pressure range.

[0121] The adjustment unit 903 adjusts the negative pressure of the chip suction hood according to the target operating parameters.

[0122] It is understood that the embodiments of the vacuum suction negative pressure control device and any implementation thereof correspond to the embodiments of the vacuum suction negative pressure control method and any implementation thereof. The technical effects corresponding to the embodiments of the vacuum suction negative pressure control device and any implementation thereof can be found in the technical effects corresponding to the aforementioned embodiments of the vacuum suction negative pressure control method and any implementation thereof, and will not be repeated here.

[0123] It should be noted that the vacuum suction negative pressure control device provided in the above embodiments is only an example of the division of the above functional modules. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0124] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments claimed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0125] In the embodiments provided in this application, it should be understood that the disclosed apparatus / network devices and methods can be implemented in other ways. For example, the apparatus / network device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0126] The technical features of the various embodiments described above in this application can be combined arbitrarily without conflict. For the sake of brevity, this specification does not describe all possible combinations, but as long as these combinations do not violate the technical spirit of this application, they should all be considered within the scope of this application. Based on the content disclosed in this application, those skilled in the art can reasonably combine, delete, or replace the technical features of the above embodiments according to actual needs, and such modifications and variations all fall within the protection scope of this application.

[0127] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A dust suction negative pressure control method, applied to PCB processing equipment, the PCB processing equipment including a dust suction hood and a spindle connected to the dust suction hood, the spindle being used to hold a cutting tool, characterized in that, The method includes: Obtain the tool parameters of the target tool, including the tool diameter and / or tool length; The pre-stored mapping relationship is invoked to match the target operating parameters corresponding to the tool parameters. The mapping relationship includes operating parameters corresponding to different tool diameters and / or tool lengths, and the target operating parameters include the chip suction negative pressure range. Adjust the negative pressure inside the chip suction hood according to the target operating parameters.

2. The method according to claim 1, characterized in that, The step of adjusting the negative pressure of the dust collection hood according to the target operating parameters includes: Obtain the current negative pressure inside the dust collection hood; Compensation parameters are generated based on the deviation between the current dust suction negative pressure and the dust suction negative pressure range; Adjust the negative pressure inside the dust collection hood according to the compensation parameters.

3. The method according to claim 2, characterized in that, The PCB processing equipment includes a regulating valve and a dust suction pipe. The regulating valve is connected to the dust suction pipe, and one end of the dust suction pipe is connected to the dust collection hood. Adjusting the dust collection negative pressure inside the dust collection hood according to the compensation parameters includes: When the compensation parameter is less than or equal to a preset threshold, the regulating valve is controlled according to the compensation parameter to adjust the negative pressure of the dust collection hood.

4. The method according to claim 3, characterized in that, The PCB processing equipment further includes a variable frequency negative pressure fan, which is connected to the dust collection hood via the dust collection pipe. The step of adjusting the dust collection negative pressure inside the dust collection hood according to the compensation parameters also includes: When the compensation parameter is greater than the preset threshold, the variable frequency negative pressure fan is first controlled to make a preliminary adjustment to the negative pressure of the dust collection hood according to the compensation parameter, and then the regulating valve is controlled to make a secondary adjustment to the negative pressure of the dust collection hood.

5. The method according to claim 1, characterized in that, The target operating parameters also include a target rotational speed, and the method further includes: The target rotational speed corresponding to the tool parameters is obtained by matching the pre-stored mapping relationship. The spindle of the PCB processing equipment is controlled to run at the target speed.

6. The method according to claim 5, characterized in that, The PCB processing equipment further includes a drive motor connected to the spindle drive, and the method further includes: Obtain the real-time collected actual load current value of the drive motor; The actual load current value is compared with the preset normal current range; When the actual load current value deviates from the preset normal current range, the target speed is adjusted according to the deviation.

7. The method according to claim 1, characterized in that, The process of obtaining the tool parameters of the target tool includes: The identification information of the target cutting tool is acquired using a vision camera; The identification information is parsed to obtain the diameter and / or length of the target cutting tool.

8. The method according to any one of claims 1 to 7, characterized in that, The method further includes: Obtain the current state of the target tool, including the machining state and the non-machining state; When the target tool is in the machining state, perform the method described in any one of 1 to 7; When the target tool is in the non-machining state, the negative pressure of the chip suction hood is adjusted to a first negative pressure value, which is greater than the upper limit of the negative pressure range of the chip suction hood, so as to reduce the negative pressure of the chip suction hood.

9. A PCB processing equipment, employing the dust suction negative pressure control method as described in any one of claims 1 to 8, characterized in that, include: The chip suction cover is mounted on the outside of the spindle of the PCB processing equipment. A receiving cavity is formed inside the chip suction cover. The spindle of the PCB processing equipment can move within the receiving cavity. The bottom of the chip suction cover is provided with a clearance opening that communicates with the receiving cavity. The tool held by the spindle can pass through the clearance opening to process the PCB. The variable frequency negative pressure fan and the dust collection pipe are connected to the receiving cavity inside the dust collection hood through the dust collection pipe. A regulating valve is connected to the dust extraction pipe; Both the variable frequency negative pressure fan and the regulating valve can adjust the negative pressure of the dust collection hood.

10. The PCB processing equipment according to claim 9, characterized in that, The side wall of the dust collection hood is provided with at least two dust collection ports, and the at least two dust collection ports are arranged symmetrically about the central axis of the dust collection hood.

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