electronic devices

Abstract

This invention provides an electronic device capable of efficiently cooling an electronic module. The electronic device includes: a housing having a vertical wall with vents; a substrate disposed within the housing and fitted with a connector; a card-type electronic module connected to the connector; and a plate-shaped metal member that presses the electronic module, the plate-shaped metal member having: a support portion supported by the substrate or the housing; a pressing portion thermally connected to the electronic module and pressing it; and a heat dissipation portion extending from the pressing portion and provided with a plurality of heat sinks arranged facing the vents.

Description

Technical Field

[0001] This invention relates to electronic devices. Background Technology

[0002] Electronic devices such as tablet PCs and laptop PCs have connectors mounted on the substrate where the CPU and other components are installed, and electronic modules such as SSDs are connected to the connectors (see, for example, Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2020-057737

[0004] As electronic modules like those described above increase in capacity and speed, they also generate more heat, thus requiring efficient cooling. However, there is a strong demand for thinner housings in electronic devices. Therefore, it is sometimes difficult to use heat dissipation modules designed for cooling CPUs, etc., for cooling electronic modules in such devices. Summary of the Invention

[0005] The present invention was made in consideration of the problems of the prior art described above, and its object is to provide an electronic device capable of efficiently cooling electronic modules.

[0006] An electronic device according to one aspect of the present invention includes: a housing having a vertical wall with a vent; a substrate disposed within the housing and fitted with a connector; a card-type electronic module connected to the connector; and a plate-shaped metal member for pressing the electronic module, the plate-shaped metal member having: a support portion supported by the substrate or the housing; a pressing portion thermally connected to the electronic module and pressing the electronic module; and a heat dissipation portion extending from the pressing portion and provided with a plurality of heat sinks disposed facing the vent.

[0007] According to the above-described method of the present invention, electronic modules can be cooled efficiently. Attached Figure Description

[0008] Figure 1 This is a schematic top view of an electronic device according to an embodiment.

[0009] Figure 2 It is a schematic representation Figure 1 A top view of the internal structure of the electronic device shown.

[0010] Figure 3A It is a schematic exploded perspective view of the electronic module and plate-shaped metal components.

[0011] Figure 3B Pressing with plate-shaped metal parts Figure 3A The diagram shows the state of the electronic module.

[0012] Figure 4It is a schematic three-dimensional sectional view of the housing of the electronic module and its surrounding parts.

[0013] Figure 5 It is a schematic side sectional view of the electronic module and the electronic equipment in its surrounding parts.

[0014] Explanation of reference numerals in the attached figures

[0015] 10…electronic device; 12…housing; 14…display; 16…housing component; 16B…wall; 20…substrate; 22…heat dissipation module; 24…electronic module; 25…plate-shaped metal component; 28…CPU; 30…connector; 32…metal plate; 35…fan; 38, 39…vent; 40…support; 42…pressing part; 44…elastic support; 46…heat dissipation part; 46a…extension; 46b…heat sink. Detailed Implementation

[0016] Hereinafter, preferred embodiments are listed, and the electronic device of the present invention will be described in detail with reference to the accompanying drawings.

[0017] Figure 1 This is a schematic top view of an electronic device 10 according to an embodiment. Figure 2 It is a schematic representation Figure 1 The diagram shows a top view of the internal structure of the electronic device 10. In this embodiment, a tablet PC (tablet terminal) is exemplified as the electronic device 10. The electronic device 10 may also be a device other than a tablet PC, such as a desktop PC, a laptop PC, a smartphone, a mobile phone, or an e-notebook.

[0018] like Figure 1 and Figure 2 As shown, the electronic device 10 includes a housing 12 and a display 14. The housing 12 has, for example, a cubic shape. Hereinafter, the housing 12 and its constituent elements will be described... Figure 1 The direction of the long side of the housing 12 shown is referred to as the X direction, the direction of the short side as the Y direction, and the direction of thickness as the Z direction. Regarding the X direction, it is sometimes referred to as X1 and X2 directions separately, and similarly, the Y and Z directions are sometimes referred to as Y1, Y2, Z1, and Z2 directions. These directions are defined for ease of explanation and may vary depending on the usage or orientation of the electronic device 10.

[0019] The housing 12 is a flat box. Various electronic and mechanical components are housed within the interior space of the housing 12. The housing 12 has a housing component 16 that extends from the back of the electronic device 10 to its outer peripheral sides. The housing component 16 may also be composed of a cover plate 16A and a vertical wall 16B. The cover plate 16A is a plate-shaped component forming the back of the electronic device 10. The vertical wall 16B is a side wall component that rises from the outer peripheral edge of the cover plate 16A along the Z1 direction. The vertical wall 16B may also be integrally formed with the cover plate 16A. Alternatively, the vertical wall 16B may be separately formed from the cover plate 16A and configured such that both can be attached and detached. The housing component 16 may, for example, be made of a thin sheet of resin or metal.

[0020] The housing component 16 has an opening on its front side (Z1 side surface). The display 14 is supported by the upper end (Z1 side end) of the vertical wall 16B, which closes the opening on the front surface of the housing component 16. The display 14 can be, for example, a touch-operable organic EL display panel or a liquid crystal display panel. The display 14 can also be surrounded by a bezel component 18. The housing component 16 can also have a frame component for supporting the substrate 20 (described later) provided immediately below the display 14, and be configured to allow the cover plate 16A to be attached and detached relative to this frame component.

[0021] like Figure 2 As shown, the housing 12, for example, houses a substrate 20, a heat dissipation module 22, an electronic module 24, a plate-shaped metal component 25, and a battery device 26. The battery device 26 is a rechargeable battery that serves as the power source for the electronic device 10. Various electronic components such as memory, antennas, and speakers may also be further housed inside the housing 12.

[0022] The substrate 20 is a printed circuit board that serves as the motherboard of the electronic device 10. The substrate 20 is, for example, positioned near the center of the housing 12 and fixed to the inner surface of the cover plate 16A. The substrate 20 houses a CPU (Central Processing Unit) 28 and a connector 30. The CPU 28 is a computing device that performs calculations related to the main control and processing of the electronic device 10. The connector 30 conforms to a specified connection standard, such as the M.2 standard. An electronic module 24 is connected to the connector 30. Various electronic components, such as a GPU (Graphics Processing Unit), memory, and communication modules, are further mounted on the substrate 20. For example, the Z1 side surface of the substrate 20 serves as the mounting surface 20a for the CPU 28 and the connector 30. The shape, configuration, and mounting components of the substrate 20 are, of course, not limited to the above description.

[0023] The heat dissipation module 22 can absorb the heat generated by the CPU 28 and dissipate it to the outside of the casing 12. The heat dissipation module 22 may also include a metal plate 32, a heat pipe 33, a heat sink 34, and a fan 35.

[0024] The metal plate 32 is a thin plate-shaped component made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 32 is a copper plate. The metal plate 32 may also be composed of a plate-shaped component (vapor chamber) in which the working fluid is sealed in a closed space formed between two metal plates. The metal plate 32 is provided such that it covers a portion of the mounting surface 20a of the substrate 20 from the Z1 side together with the CPU 28. As a result, the metal plate 32 can absorb and diffuse the heat generated by the CPU 28 and its surrounding components.

[0025] The heat pipe 33 is a tubular heat transfer component. For example, the heat pipe 33 is formed by pressing a copper tube into a thin, flat shape with an elliptical cross-section, and sealing a working fluid within its inner closed space. One end of the heat pipe 33 is thermally connected to the CPU 28 via a metal plate 32, and the other end is thermally connected to the heat sink 34. Thus, the heat pipe 33 can efficiently transfer heat from the CPU 28 to the heat sink 34.

[0026] The heat sink 34 is, for example, constructed by arranging thin metal fins made of copper or aluminum at equal intervals in the Y direction. Each fin stands upright in the Z direction and extends along the X direction. Gaps are formed between adjacent fins to allow air exhausted from the fan 35 to pass through.

[0027] The fan 35 has a fan housing 35a, an intake port 35b, and an exhaust port 35c. The intake port 35b is an opening formed on one or both sides of the fan housing 35a in the thickness direction (Z direction). The exhaust port 35c is an opening formed on the side of the fan housing 35a. The heat sink 34 is close to and opposite the exhaust port 35c. The fan 35 can be configured as a centrifugal fan that rotates an impeller housed inside the fan housing 35a by a motor. The fan 35 can exhaust air drawn in from the intake port 35b through the exhaust port 35c.

[0028] Vents 38 and 39 may also be formed on the side of the housing 12. Vents 38 and 39 may be formed, for example, on the left and right vertical walls 16B extending along the Y direction. Vents 38 and 39 may be formed, for example, by a plurality of small window-like openings arranged along the long side of the vertical wall 16B (see also...). Figure 4 The vent 38 on the X1 side is positioned opposite the exhaust port 35c of the fan 35 across the heat sink 34. Thus, the vent 38 functions as an exhaust port for discharging air exhausted from the fan 35 to the outside of the housing 12. The vent 39 on the X2 side functions as an intake port for introducing air from outside the housing 12 into the housing 12. External air introduced through the vent 39 is drawn into the fan housing 35a through the intake port 35b. Figure 2 The arrow indicated by the single-dot-dash line schematically shows the flow of air.

[0029] In this heat dissipation module 22, the heat from the CPU 28 is diffused by the metal plate 32 and transported to the heat sink 34 by the heat pipe 33. The fan 35 draws in outside air through the vent 39 to the intake vent 35b and exhausts it from the outlet 35c. This air is cooled as it passes through the heat sink 34 and is exhausted from the vent 38 to the outside of the housing 12.

[0030] Next, the structure of the electronic module 24, the plate-shaped metal component 25, and their surrounding parts will be described.

[0031] Figure 3A This is a schematic exploded perspective view of the electronic module 24 and the plate-shaped metal component 25. Figure 3B Press with plate-shaped metal part 25 Figure 3A The diagram shows the state of electronic module 24. Figure 4 This is a schematic three-dimensional sectional view of the electronic module 24 and its surrounding housing 12. Figure 5 This is a schematic side sectional view of the electronic module 24 and the electronic equipment 10 in its surrounding parts.

[0032] Electronic module 24 is, for example, a card-type module component capable of connecting to a connector 30 conforming to the M.2 standard. Electronic module 24 is, for example, a storage device. In this embodiment, electronic module 24 is an SSD (Solid State Drive). The connection standard of connector 30 can also be other standards. Electronic module 24 can also be, for example, a communication module corresponding to WWAN (Wireless Wide Area Network). Figure 2 and Figure 4 As shown, the electronic module 24 is positioned, for example, near the X2 side of the vertical wall 16B in the X direction, with its long side oriented along the Y direction. Of course, the configuration and orientation of the electronic module 24 can also be other than this.

[0033] like Figures 3A-4 As shown, the electronic module 24 includes a module substrate 24a and a semiconductor chip 24b mounted on the module substrate 24a. The module substrate 24a is a printed circuit board. The module substrate 24a has a connection terminal for connection with the connector 30 at one end (Y2 side). In the electronic module 24, which is an SSD, the semiconductor chip 24b can exemplify a controller, NAND flash memory, and DRAM (Dynamic Random Access Memory), etc.

[0034] like Figures 2-5 As shown, the plate-shaped metal component 25 is used to press the electronic module 24 against the substrate 20 and the housing component 16 and to hold it in place. The plate-shaped metal component 25 is also used to cool the electronic module 24.

[0035] The plate-shaped metal component 25 is preferably made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the plate-shaped metal component 25 is made of copper. The plate-shaped metal component 25 can be integrally formed, for example, by bending a stamping component of a thin copper plate. Furthermore, the heat sink 46b, described later, can be formed by welding or the like. Of course, other methods can also be used to form the plate-shaped metal component 25.

[0036] The plate-shaped metal component 25 has an extremely thin thickness, for example, about 0.1 mm to 0.4 mm. In this embodiment, the plate-shaped metal component 25, for example, has a thickness of 0.2 mm for any of the support portion 40, pressing portion 42, elastic support portion 44, extension portion 46a, and heat sink 46b, which will be described later. Furthermore, the metal plate 32 constituting the heat dissipation module 22 has a thickness of about 0.8 mm to 1.2 mm. That is, the thickness of the plate-shaped metal component 25 is much thinner than the thickness of the metal plate 32.

[0037] The plate-shaped metal component 25 may also have a pair of support portions 40, 40, a pressing portion 42, a pair of elastic support portions 44, 44, and a heat dissipation portion 46.

[0038] The support portion 40 is used to fix the plate-shaped metal component 25 to the housing 12 (housing component 16). The support portion 40 is formed, for example, of a tongue-shaped plate protruding from the center of a semi-circular elastic support portion 44 toward the pressing portion 42. A pair of support portions 40, 40 are arranged across the electronic module 24 in the long side direction (Y direction) at intervals between each other and opposite to each other. Alternatively, one of the pair of support portions 40 may be fixed to the substrate 20, and the other fixed to the inner surface of the cover plate 16A. One or more support portions 40 may be provided.

[0039] The support part 40 is supported by screw 40a (see reference). Figure 2 It can be fastened to the housing component 16 or the base plate 20 fixed to the housing component 16. A hole 40b for inserting a through screw 40a is formed in the support portion 40. Figures 3A-4 The diagram of screw 40a is omitted. A stud portion (boss portion) for fastening screw 40a can be pre-formed on the inner surface of cover plate 16A or the mounting surface 20a of substrate 20. The stud portion is a cylindrical component with a threaded hole for fastening screw 40a. For example, one of the pair of support portions 40, 40 can also be composed of a claw portion capable of engaging and disengaging with a hook formed on substrate 20 or cover plate 16A.

[0040] The pressing part 42 presses the plate portion of the electronic module 24 from above (Z1 side). The pressing part 42 is also a heat-absorbing part that is thermally connected to the electronic module 24 and absorbs the heat generated by the electronic module 24. When viewed from above, the pressing part 42 has an outer shape that is the same as or slightly smaller than the electronic module 24. The pressing part 42 may also have an outer shape larger than the electronic module 24. Figures 2-4 As shown, the pressing part 42 is positioned between a pair of support parts 40, 40. In this way, the plate-shaped metal part 25 can hold the electronic module 24 more stably.

[0041] Preferably, the heat-conducting component 48 is sandwiched between the pressing part 42 and the surface of the electronic module 24 (see reference). Figure 4 and Figure 5 The heat-conducting component 48 can be formed, for example, from a component called a TIM (Thermal Interface Material). The heat-conducting component 48 is, for example, a sheet-like or pad-like component filled with a heat-conducting filler in a resin such as silicone or epoxy, and has high thermal conductivity.

[0042] Elastic support portions 44 are respectively disposed between each support portion 40 and pressing portion 42, and elastically support the pressing portion 42 relative to the support portion 40 in the Z direction. The elastic support portion 44 is, for example, a narrow, semi-circular ring. The elastic support portion 44 supports the pressing portion 42 so that it can elastically displace relative to the support portion 40 fixed to the substrate 20 (housing component 16) in the Z direction. Therefore, the pressing portion 42 can easily adapt to differences in thickness caused by the type and individual variations of the electronic module 24 and the heat conduction component 48. Furthermore, the pressing portion 42 is pressed against the electronic module 24 by the elastic support portion 44. Therefore, the plate-shaped metal component 25 improves the holding stability of the electronic module 24 and the heat absorption efficiency from the electronic module 24.

[0043] The heat dissipation section 46 is used to efficiently dissipate the heat of the electronic module 24 absorbed by the pressing section 42. The heat dissipation section 46 may also have an extension section 46a and multiple heat sinks 46b.

[0044] The heat dissipation section 46 of this embodiment can diffuse the heat of the electronic module 24 and dissipate heat to the vent 39 located near the electronic module 24. The extension section 46a is an extension plate for distributing the heat sink 46b at a position opposite to the vent 39. The extension section 46a protrudes in a generally X2 direction from the side edge of the pressing section 42 on the X2 side facing the vent 39. More specifically, in Figure 2 As shown in the top view, the extension 46a slopes from the pressing part 42 toward the vent 39 toward the Y1 side and extends toward the X2 side. The shape of the extension 46a is, of course, not limited to... Figure 2 The shape shown can also extend in a straight line, for example.

[0045] A bent piece 46c may also be provided on one or both edges of the extension 46a in the width direction. The bent piece 46c is a plate formed by bending the edge of the extension 46a towards the Z2 side. The plate thickness of the extension 46a is extremely thin, for example, 0.2 mm. The bent piece 46c improves the rigidity of the extension 46a. Depending on the length and shape of the extension 46a, the bent piece 46c may be omitted.

[0046] Alternatively, a curved piece 42a, identical to the curved piece 46c, can also be provided in the pressing part 42 (see reference). Figure 4 and Figure 5 The bending plate 42a is a plate formed by bending the edge of the pressing part 42 on the side opposite to the extension part 46a in the width direction (X direction) towards the X2 side. The bending plate 42a increases the rigidity of the pressing part 42.

[0047] Each heat sink 46b is, for example, a structure in which thin copper heat sinks are arranged at equal intervals in the Y direction. Each heat sink 46b may also be formed from other parts of the plate-shaped metal member 25, for example, a copper plate with the same thickness as the pressing part 42 and the extension part 46a. Each heat sink 46b rises from the Z2 side surface of the extension part 46a in the Z2 direction and extends in the X direction. A gap is formed between adjacent heat sinks 46b. As a result, the surface area of ​​the heat dissipation part 46 is increased to promote heat dissipation from the heat sinks 46b, and it is possible to further allow external air passing through the vent 39 to come into contact with each heat sink 46b.

[0048] like Figure 5 As shown, in the electronic device 10 of this embodiment, the height h1 of the vertical wall 16B is, for example, 8 mm, and the height h2 of the internal space of the housing 12 is, for example, 5.4 mm. The height of the inner wall surface 16B1 of the vertical wall 16B is the same as the height h2. On the other hand, the height h3 of the vent 39 is, for example, 3.5 mm. Therefore, the inner wall surface 16B1 can only ensure a margin of about 0.9 mm above and below the vent 39. Therefore, it is difficult to install mesh components or the like on the inner wall surface 16B1 to prevent foreign objects such as dust from entering through the vent 39.

[0049] Furthermore, the thickness t1 of the electronic module 24 is, for example, 2.4 mm, and the thickness t2 of the electronic module 24, including the heat conduction component 48, is, for example, 3.2 mm. That is, the thickness of the heat conduction component 48 is, for example, 0.8 mm. In the plate-shaped metal component 25, the plate thickness t3 of the pressing part 42 and the extension part 46a, etc., is, for example, 0.2 mm, and the height h4 of the heat sink 46b is, for example, 3.7 mm.

[0050] As such, the electronic device 10 has an extremely thin housing 12, and the components housed inside are also thin. Therefore, due to the limited space within the housing 12, the electronic device 10 becomes a structure that makes it difficult to cool the electronic module 24 via the heat dissipation module 22.

[0051] Therefore, in the electronic device 10 of this embodiment, the plate-shaped metal component 25 of the pressing electronic module 24 includes a support portion 40, a pressing portion 42, and a heat dissipation portion 46. The heat dissipation portion 46 extends from the pressing portion 42 and has a plurality of heat sinks 46b arranged facing the vent 39.

[0052] Therefore, the electronic device 10 can utilize the plate-shaped metal component 25, which holds the electronic module 24, as a cooling component for the electronic module 24. That is, the plate-shaped metal component 25 can dissipate heat received by the pressing portion 42, which is thermally connected to the electronic module 24, via the heat dissipation section 46. When the fan 35 is stopped, and the electronic device 10 is not equipped with a fan 35, the heat dissipation section 46 can passively dissipate heat from the electronic module 24 from the heat sink 46b to the vent 39. When the fan 35 is activated, the heat dissipation section 46 can actively dissipate heat from the electronic module 24 through the external air flowing around the heat sink 46b from the vent 39.

[0053] Furthermore, the heat sink 46b is positioned facing the vent 39. Thus, the heat sink 46b also functions as a protective barrier to prevent dust and other foreign objects from entering the housing 12 through the vent 39. As described above, the height h1 of the vertical wall 16B of the electronic device 10 is very low. Therefore, it is difficult to install mesh components or the like on the inner wall surface 16B1 of the vertical wall 16B to prevent foreign objects from entering through the vent 39. In this respect, the electronic device 10 can also utilize the heat sink 46b for heat dissipation as a substitute for mesh components. Therefore, the electronic device 10 can reduce the number of components and also reduce manufacturing costs such as component costs and assembly operations. In particular, the electronic device 10 of this embodiment is equipped with a fan 35. Therefore, by arranging the heat sink 46b opposite to the vent 39, which serves as an air inlet, the electronic device 10 can suppress dust intrusion into the housing 12 and also suppress malfunctions of the fan 35.

[0054] The heat sink 46b is integrally formed with the plate-shaped metal component 25 of the press-on electronic module 24. Therefore, even if dust clogs the heat sink 46b, it can be easily cleaned by simply removing the plate-shaped metal component 25, making it highly maintainable.

[0055] like Figure 5As shown, the distance L between the heatsink 46b and the vent 39 is not particularly limited, as long as it is sufficient to prevent foreign objects from entering through the vent 39. The distance L can, for example, be zero or negative, meaning a portion of the heatsink 46b can be inserted into the vent 39. However, it is preferable that the distance L is, for example, about a few millimeters, specifically about 5mm to 10mm. This improves the workability of assembling the plate-shaped metal component 25. Furthermore, it makes removing the plate-shaped metal component 25 easier during maintenance, SSD replacement, etc.

[0056] Preferably, a pair of support portions 40 are arranged at intervals across the electronic module 24 along its long side. A pressing portion 42 is positioned between the pair of support portions 40. A heat dissipation portion 46 protrudes from the pressing portion 42 in a direction intersecting the long side of the electronic module 24. This improves the stability of the pressing portion 42 and the heat dissipation portion 46.

[0057] The electronic device 10 may also include a processing unit, i.e., a CPU 28, mounted on the substrate 20, and a metal plate 32 for absorbing and dissipating the heat from the CPU 28. In this case, it is preferable that the thickness of the pressing part 42 is thinner than that of the metal plate 32. That is, the plate-shaped metal component 25 does not target the CPU 28, which generates a large amount of heat, for cooling, unlike the metal plate 32. Therefore, if the plate-shaped metal component 25, including the pressing part 42, is formed of a plate-shaped metal thinner than the metal plate 32, the problem of installation space within the thin housing 12 is less likely to arise.

[0058] The housing 12 may also have other vents 38 formed at a different location than the vent 39 on the vertical wall 16B. The exhaust port 35c of the fan 35 and the heat sink 34 can be arranged opposite to the vents 38. The heat pipe 33, which serves as a heat transfer component, can also be connected to the heat sink 34, and this heat pipe 33 transfers the heat from the CPU 28, etc., received by the metal plate 32. In this way, the vent 38 becomes an exhaust port, and the vent 39 becomes an intake port for air to enter the housing 12. Therefore, the heat sink 46b can effectively prevent foreign objects from entering through the vent 39, which serves as an intake port. Furthermore, the heat generated by the electronic module 24 is sufficiently small compared to the heat generated by the CPU 28, etc., which is the object being cooled by the metal plate 32. Therefore, even if the heat sink 46b is provided at the vent 39, the temperature of the external air introduced into the housing 12 will not be too high.

[0059] The aforementioned electronic device 10 exemplifies a flat-panel PC. The electronic device 10 can also be configured to connect two or more housings so that they can rotate relative to each other. In this configuration, the display 14 can also be a dual-display type, where each housing is individually mounted, or a flexible display extending into each housing. In such an electronic device, for example, an electronic module 24 can be housed within a defined housing, on which a plate-shaped metal component 25 is mounted and cooled.

[0060] Furthermore, the present invention is not limited to the embodiments described above, and can of course be freely modified without departing from the spirit of the present invention.

Claims

1. An electronic device, characterized in that, have: The shell has a vertical wall with vents formed thereon; A substrate is disposed within the housing and is fitted with a connector; A card-type electronic module, connected to the connector; and A plate-shaped metal component is used to press down on the electronic module. The plate-shaped metal component has: The support portion is supported by the base plate or the housing; The pressing part is thermally connected to the electronic module and presses the electronic module; and The heat dissipation section extends from the pressing section and is provided with a plurality of heat dissipation fins arranged facing the vent.

2. The electronic device according to claim 1, characterized in that, The plate-shaped metal component has an elastic support portion disposed between the support portion and the pressing portion, which elastically supports the pressing portion relative to the support portion.

3. The electronic device according to claim 1 or 2, characterized in that, The support portions are arranged in pairs across the electronic module along its long side at intervals from each other. The pressing part is disposed between the pair of support parts. The heat dissipation part protrudes from the pressing part in a direction that intersects with the long side of the electronic module.

4. The electronic device according to claim 1 or 2, characterized in that, have: A computing processing device is mounted on the substrate; and A metal plate, configured to cover a portion of the substrate along with the computing processing device, is capable of absorbing and diffusing heat from the computing processing device. The thickness of the pressing part is thinner than the thickness of the metal plate.

5. The electronic device according to claim 4, characterized in that, The vertical wall forms a second vent at a different position than the first vent. This electronic device also features: The fan has an exhaust port located facing the second vent. A heat sink is disposed between the exhaust port of the fan and the second vent; and A heat transfer component thermally connects the metal plate to the heat sink. The vent is an air inlet that allows air to be introduced into the housing.

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