Electronic devices

Abstract

This invention discloses an electronic device comprising a back frame, a light-emitting circuit board, and a light guide plate. The back frame has a bend structure, which includes a bottom, a top, and a side portion connecting the bottom and the top. The light guide plate and the light-emitting circuit board are fixed together by a first fastener, and the fixed light-emitting circuit board and light guide plate are disposed within the bend structure. The light-emitting circuit board includes a first protective layer, a first adhesive layer, a first conductive layer, a substrate, a second conductive layer, a second adhesive layer, and a second protective layer, which are stacked sequentially from top to bottom. The substrate has an end portion that protrudes beyond the first protective layer, the first adhesive layer, the second adhesive layer, and the second protective layer, and the end portion is adjacent to the side portion of the bend structure.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device with high yield and high quality. Background Technology

[0002] Electronic devices (such as display devices, light-emitting devices, etc.) may develop defects (such as damage, dents, extra material residue, etc.) that affect the yield and / or quality of the electronic devices during the manufacturing or assembly process. In order to reduce the defects generated during the manufacturing or assembly process, some structures in the electronic devices need to be designed accordingly. Summary of the Invention

[0003] The purpose of this invention is to provide an electronic device.

[0004] This invention provides an electronic device including a back frame, a light-emitting circuit board, and a light guide plate. The back frame has a bend structure, which includes a bottom, a top, and a side portion connecting the bottom and the top. The light guide plate and the light-emitting circuit board are fixed together by a first fastener, and the fixed light-emitting circuit board and light guide plate are disposed in the bend structure. The light-emitting circuit board includes a first protective layer, a first adhesive layer, a first conductive layer, a substrate, a second conductive layer, a second adhesive layer, and a second protective layer, which are stacked sequentially from top to bottom. The substrate has an end portion that protrudes beyond the first protective layer, the first adhesive layer, the second adhesive layer, and the second protective layer, and the end portion is adjacent to the side portion of the bend structure. Attached Figure Description

[0005] Figure 1 This is a cross-sectional schematic diagram of the electronic device according to the first embodiment of the present invention.

[0006] Figure 2 This is a cross-sectional schematic diagram of a light-emitting circuit board according to an embodiment of the present invention.

[0007] Figure 3 This is a top view schematic diagram of a light-emitting circuit board according to an embodiment of the present invention.

[0008] Figure 4 This is a schematic diagram of a partial assembly process of an electronic device according to an embodiment of the present invention.

[0009] Figure 5 This is a top view schematic diagram of a light-emitting circuit board according to another embodiment of the present invention.

[0010] Figure 6 This is a cross-sectional schematic diagram of an electronic device according to a second embodiment of the present invention.

[0011] Figure 7 This is a cross-sectional schematic diagram of an electronic device according to a third embodiment of the present invention.

[0012] Figure 8This is a cross-sectional schematic diagram of an electronic device according to the fourth embodiment of the present invention.

[0013] Explanation of reference numerals in the attached drawings: 100, 100' - Light-emitting circuit board; 110 - Board body; 110C - Connector; 110e1 - First edge; 110e2 - Second edge; 110e3 - Third edge; 112 - Substrate; 112ep - End; 112sp - Side end; 114a - First conductive layer; 114b - Second conductive layer; 116a - First adhesive layer; 116b - Second adhesive layer; 118a - First protective layer; 118b - Second protective layer; 120 - Light-emitting unit; 130 - Connector; 200 - Light guide plate; 210a - First surface; 210b - Second surface; 210i - Light incident surface; 300 - Back frame; 310 - Bottom structure; 320 - Turning structure; 320b - Bottom; 320s - Side; 320t - Top; 320t1 - First top section; 320t2 - Second top section; 330 - Opposite side structure; DP - Display panel; ED1, ED2, ED3, ED4 - Electronic devices; FX1, FX2, FX3 - Fixtures; Gp - Spacing; LS - Light shielding layer; OL, OL1, OL2, OL3, OL4 - Optical films; PS - Pre-assembled structure; RC - Reflective element; RC_1 - Section; RL - Reflective sheet; Sf - Dimension; SU1, SU2 - State; T1, T2 - Thickness; TH1 - First opening; TH2 - Second opening; W - Width; X, Y, Z - Direction. Detailed Implementation

[0014] The present invention can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the accompanying drawings depict only a portion of the electronic device, and specific elements in the drawings are not drawn to scale. Furthermore, the number and size of the elements in the drawings are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0015] Throughout this specification and the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same elements. This invention is not intended to distinguish between elements that have the same function but different names.

[0016] In the specification and claims of this invention, the terms "comprising," "containing," and "having" are open-ended terms and should therefore be interpreted as "containing but not limited to...". Thus, when the terms "comprising," "containing," and / or "having" are used in the description of this invention, they specify the presence of the corresponding features, areas, steps, operations, and / or components, but do not exclude the presence of one or more of the corresponding features, areas, steps, operations, and / or components.

[0017] The directional terms used in this invention, such as "up," "down," "front," "back," "left," and "right," are merely for reference to the accompanying drawings. Therefore, the directional terms used are illustrative and not intended to limit the invention. In the accompanying drawings, each figure illustrates general features of the methods, structures, and / or materials used in specific embodiments. However, these figures should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses, and positions of various film layers, regions, and / or structures may be reduced or enlarged.

[0018] When a component (e.g., a membrane or region) is referred to as "on another component," it can be directly on that component, or there may be other components between them. Conversely, when a component is referred to as "directly on another component," there are no components between them. Furthermore, when a component is referred to as "on another component," the two are vertically related, and this component can be above or below the other component, depending on the orientation of the device.

[0019] It should be understood that when a component or membrane is referred to as being "connected to" another component or membrane, it can be directly connected to this other component or membrane, or there can be an interposed component or membrane between them. When a component is referred to as being "directly connected to" another component or membrane, there is no interposed component or membrane between them. Additionally, when a component is referred to as being "coupled to another component (or a variant thereof)," it can be directly connected to this other component, or indirectly connected (e.g., electrically connected) to this other component through one or more components.

[0020] It should be understood that in this specification and claims, the term "horizontal direction" refers to a direction parallel to a horizontal plane; the term "horizontal plane" refers to a surface parallel to directions X and Y in the drawings; and the terms "vertical direction" and "viewing direction" refer to directions parallel to direction Z in the drawings, with directions X, Y, and Z being perpendicular to each other. In this specification and claims, the term "viewing from above" refers to the result of viewing along the vertical direction. In this specification and claims, the term "section" refers to the result of cutting the structure along the vertical direction and viewing it from a horizontal direction.

[0021] In this specification and claims, the term "overlap" means that two components overlap in the Z direction, and unless otherwise specified, the term "overlap" includes partial overlap or complete overlap.

[0022] In the specification and claims of this invention, the terms “approximate” or “identical” are generally interpreted as being within ±20% of a given value, or within ±10%, ±5%, ±3%, ±2%, ±1%, or ±0.5% of a given value.

[0023] In this specification and claims, the term "substantially" means that minor deviations may or may not exist. For example, the terms "substantially parallel" and "substantially along" mean that the included angle between two components may be less than or equal to a specific angle threshold α, and the term "substantially perpendicular" means that the included angle between two components may be greater than or equal to 90 degrees minus the specific angle threshold α and less than or equal to 90 degrees plus the specific angle threshold α (i.e., (90°-α)≤ included angle≤(90°+α)), wherein the specific angle threshold α may be 5 degrees, 3 degrees, or 1 degree.

[0024] The ordinal numbers used in the specification and claims of this invention, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number of that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing methods. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims.

[0025] It should be understood that the features described in the following embodiments can be replaced, recombined, or mixed in several different embodiments to complete other embodiments without departing from the spirit of the invention. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0026] In this invention, the electronic device may include a display device, a light-emitting device, an antenna device, a sensing device, a splicing device, or any combination thereof, but is not limited thereto. The light-emitting device is capable of generating light to serve as a light source (e.g., a backlight module), a display device capable of displaying an image, or other suitable light-emitting devices. The display device may be a non-self-emissive display or a self-emissive display, and may be a color display or a monochrome display, depending on the requirements. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device. The sensing device may be a sensing device that senses capacitance, light, heat, or ultrasound. The splicing device may be a display splicing device or an antenna splicing device, but is not limited thereto. The electronic units in the electronic device may include passive and active components, such as capacitors, resistors, inductors, diodes, switching elements (e.g., transistors), integrated circuits, etc. The diode may include a light-emitting diode (LED) or a photodiode. Light-emitting diodes (LEDs) may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited thereto. Transistors may include, for example, top-gate thin-film transistors (TFTs), bottom-gate thin-film transistors, or dual-gate thin-film transistors, but are not limited thereto. Electronic devices may also include fluorescent materials, phosphorescent materials, quantum dot (QD) materials, or other suitable materials as needed, but are not limited thereto. Electronic devices may have peripheral systems such as drive systems, control systems, light source systems, etc., to support the devices and components within the electronic device.

[0027] For example, in this invention, the electronic device is a light-emitting device capable of emitting light or a display device capable of displaying images.

[0028] Please refer to Figures 1 to 3 As shown, Figure 1 This is a cross-sectional schematic diagram of the electronic device according to the first embodiment of the present invention. Figure 2 This is a cross-sectional schematic diagram of a light-emitting circuit board according to an embodiment of the present invention. Figure 3 This is a top view schematic diagram of a light-emitting circuit board according to an embodiment of the present invention. Figures 1 to 3As shown, the electronic device ED1 includes a light-emitting circuit board 100, which includes a board body 110 for carrying structures and / or components disposed thereon. Conductive structures in the board body 110 are electrically connected to the electronic components disposed thereon. In some embodiments, the board body 110 comprises a circuit board made of conductive material. The board body 110 includes, but is not limited to, a laminated board (e.g., a copper clad laminate, CCL) or any other suitable circuit board.

[0029] In this invention, the plate 110 may have at least one conductive layer and at least one insulating layer, and may selectively include other types of film layers. The material of the conductive layer may include metal, other suitable conductive materials, or combinations thereof, and the material of the insulating layer may include organic insulating materials, inorganic insulating materials, or combinations thereof. Figure 2 In the process, the plate body 110 may include a first protective layer 118a (insulating layer), a first adhesive layer 116a (insulating layer), a first conductive layer 114a, a substrate 112 (insulating layer), a second conductive layer 114b, a second adhesive layer 116b (insulating layer) and a second protective layer 118b (insulating layer), which are stacked sequentially, but are not limited thereto.

[0030] The substrate 112 can be a rigid substrate or a flexible substrate, such that the plate 110 can be a rigid plate or a flexible plate. The substrate 112 may include suitable materials depending on its type. The substrate 112 may include glass, quartz, ceramic, sapphire, silicon, polymers (such as polyimide (PI), polyethylene terephthalate (PET)), other suitable materials, or combinations thereof.

[0031] exist Figure 2 In this circuit, the substrate 112 may be located between the first conductive layer 114a and the second conductive layer 114b. The first conductive layer 114a and the second conductive layer 114b may be electrically connected to each other through some vias (not shown), and may be electrically connected to electronic components disposed on the board 110 to form a suitable circuit. The materials of the first conductive layer 114a and the second conductive layer 114b may include any suitable metal (e.g., copper), but are not limited thereto.

[0032] The substrate 112, the first conductive layer 114a, and the second conductive layer 114b may be located between the first protective layer 118a and the second protective layer 118b. The first protective layer 118a and the second protective layer 118b may be located on opposite sides of the substrate 112, the first conductive layer 114a, and the second conductive layer 114b, respectively, to protect the substrate 112, the first conductive layer 114a, and the second conductive layer 114b. In this invention, the first protective layer 118a and the second protective layer 118b may comprise any suitable insulating material (such as organic insulating materials, inorganic insulating materials, or combinations thereof). The first protective layer 118a can be adhered to the first conductive layer 114a via the first adhesive layer 116a (i.e., the first adhesive layer 116a is between the first protective layer 118a and the first conductive layer 114a), and the second protective layer 118b can be adhered to the second conductive layer 114b via the second adhesive layer 116b (i.e., the second adhesive layer 116b is between the second protective layer 118b and the second conductive layer 114b). In this invention, the first adhesive layer 116a and the second adhesive layer 116b may comprise any suitable adhesive material. For example, the first adhesive layer 116a and the second adhesive layer 116b may comprise epoxy resin, but are not limited thereto.

[0033] During the manufacturing process of the plate 110, the first conductive layer 114a and the second conductive layer 114b can be formed on opposite sides of the substrate 112. Then, the first protective layer 118a and the first adhesive layer 116a are bonded to the first conductive layer 114a in a suitable manner, and the second protective layer 118b and the second adhesive layer 116b are bonded to the second conductive layer 114b in a suitable manner. For example, the first protective layer 118a and the first adhesive layer 116a can be bonded to the first conductive layer 114a and the second protective layer 118b and the second adhesive layer 116b can be bonded to the second conductive layer 114b through a single hot-press vacuum bonding process, but this is not a limitation.

[0034] exist Figure 1 and Figure 2 In this invention, the light-emitting circuit board 100 includes a light-emitting unit 120 disposed on the board body 110, wherein the light-emitting unit 120 is used to emit light. The light-emitting unit 120 can be any element capable of generating light. The light-emitting unit 120 may include light-emitting diodes (such as organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs), but is not limited thereto. In this invention, the color of the light emitted by the light-emitting unit 120 can be designed according to requirements, and the light emitted by the light-emitting unit 120 can be white light, blue light, or other suitable colors.

[0035] exist Figure 1 and Figure 2In this configuration, the light-emitting unit 120 can be electrically connected to the conductive structure in the plate 110 via the connector 130. The light-emitting unit 120 can also be electrically connected to the pad in the first conductive layer 114a via the connector 130, thereby connecting to the conductive path formed by the first conductive layer 114a and the second conductive layer 114b in the plate 110. Figure 2 In this invention, the first protective layer 118a may have a first opening TH1, the first adhesive layer 116a may have a second opening TH2, and the pads of the first conductive layer 114a may correspond to the first opening TH1 and the second opening TH2. A connector 130 may be disposed in the first opening TH1 and the second opening TH2 and on the pads, allowing the light-emitting unit 120 to be electrically connected to the pads of the first conductive layer 114a through the connector 130 in the first opening TH1 and the second opening TH2. In this invention, the connector 130 may include a suitable conductive material, for example, solder or solder pads, but is not limited thereto. In the Z direction, the first opening TH1 may overlap with the second opening TH2, and the outlines of the first opening TH1 and the second opening TH2 may be the same or different. The widths of the first opening TH1 and the second opening TH2 in the X or Y directions may be the same or different.

[0036] exist Figure 1 In this invention, the electronic device ED1 includes a light guide plate 200 disposed on a portion of the light-emitting circuit board 100 and adjacent to the light-emitting unit 120. The light guide plate 200 is used to adjust the incident light to control the direction of the light emitted from the light guide plate 200 (e.g., the light entering the light guide plate 200 may be reflected and / or refracted due to the design of the light guide plate 200), thereby achieving a suitable light guiding effect. In this invention, the light guide plate 200 may include suitable materials with high light transmittance as needed, for example, polyimide (PI), polycarbonate (PC), poly(methylmethacrylate) (PMMA), cycloolefin polymer (COP), other suitable materials, or combinations thereof.

[0037] exist Figure 1In this light guide plate 200, light may include a light-incident surface 210i, through which light can enter the light guide plate 200. The light-incident surface 210i (a side surface of the light guide plate 200) can be designed according to requirements. Additionally, the light guide plate 200 may include a first surface 210a and a second surface 210b opposite to each other, wherein the first surface 210a and the second surface 210b are not parallel to the light-incident surface 210i, and the light-incident surface 210i connects the first surface 210a and the second surface 210b. In some embodiments, light entering the light guide plate 200 from the light-incident surface 210i can exit the light guide plate 200 from the first surface 210a and / or the second surface 210b. For example, in... Figure 1 In the process, the first surface 210a of the light guide plate 200 faces the user during the operation of the electronic device ED1.

[0038] exist Figure 1 In this light-emitting circuit board 100, a light-emitting unit 120 is also included. The light-emitting unit 120 is disposed adjacent to the light-incident surface 210i of the light guide plate 200, so that the light generated by the light-emitting unit 120 can enter the light guide plate 200 from the light-incident surface 210i. For example, the light-emitting unit 120 can contact the light guide plate 200, so that the light generated by the light-emitting unit 120 can effectively enter the light guide plate 200 to increase the light intensity. It can also reduce the variation caused by the difference in the coefficient of thermal expansion between the light-emitting unit 120 and the light guide plate 200 when the temperature changes (for example, since the light-emitting unit 120 contacts the light guide plate 200, the gap will not exist between the light-emitting unit 120 and the light guide plate 200 due to temperature changes, thereby reducing the gap variation caused by temperature changes), thereby improving the light emission quality of the electronic device ED1.

[0039] In this invention, the light guide plate 200 and the plate body 110 of the light-emitting circuit board 100 can be fixed by the fastener FX1. For example... Figure 1 As shown, the fastener FX1 is disposed between the light guide plate 200 and the plate body 110 of the light-emitting circuit board 100, and has a suitable material and secures the light guide plate 200 and the plate body 110 of the light-emitting circuit board 100 in a suitable manner. The fastener FX1 may be adhesive, such that the light guide plate 200 and the light-emitting circuit board 100 can be adhered to each other by means of the fastener FX1, but is not limited thereto. The fastener FX1 may include tape (such as double-sided tape), adhesive strips, or other suitable adhesive structures.

[0040] The dimensions of the FX1 fastener can be designed to meet specific requirements. For example, in... Figure 1In this context, the dimension Sf of the fastener FX1 in direction X may be less than or equal to 4 mm, or less than or equal to 3 mm, or less than or equal to 2 mm, or less than or equal to 1 mm, but is not limited thereto. The dimension Sf of the fastener FX1 in direction X (e.g., width) and another dimension (e.g., width) in direction Y may both be approximately 1 mm, but is not limited thereto.

[0041] It should be noted that after the light guide plate 200 and the light-emitting circuit board 100 are fixed to each other by the fastener FX1, the light guide plate 200, the light-emitting circuit board 100 and the fastener FX1 can be combined into a pre-assembled structure PS.

[0042] like Figure 1 As shown, the electronic device ED1 includes a back frame 300 for protecting the structure within the electronic device ED1, wherein the back frame 300 may include any suitable material as required. For example, the back frame 300 may include metal (e.g., iron) or other suitable rigid materials to serve the function of protecting the structure within the electronic device ED1, but is not limited thereto.

[0043] like Figure 1 As shown, the back frame 300 may have a bottom structure 310 for supporting structures mounted on the back frame 300. Figure 1 In the middle, the bottom structure 310 may be set in a manner substantially parallel to the horizontal plane (i.e., parallel to directions X and Y), but is not limited thereto.

[0044] like Figure 1 As shown, the back frame 300 may have a transition structure 320, wherein the transition structure 320 may include a bottom 320b, a top 320t, and a side portion 320s connecting the bottom 320b and the top 320t, such that the transition structure 320 may be a U-shaped structure in cross-section. The bottom 320b and the top 320t may overlap each other in the Z direction and be substantially parallel to each other, the side portion 320s may be substantially perpendicular to the bottom 320b and the top 320t, and the bottom 320b may be part of the bottom structure 310, but is not limited thereto.

[0045] like Figure 1 As shown, the back frame 300 may also optionally include a side structure 330 opposite to the turning structure 320, and a bottom structure 310 may be connected between the side structure 330 and the turning structure 320. For example, the side structure 330 may be substantially perpendicular to the bottom structure 310, but is not limited thereto.

[0046] like Figure 1As shown, a pre-assembled structure PS comprising a light guide plate 200, a light-emitting circuit board 100, and a fixing member FX1 can be disposed (assembled) on the bottom structure 310 of the back frame 300 and disposed (assembled) in the transition structure 320 of the back frame 300, wherein at least a portion of the light-emitting circuit board 100 and at least a portion of the light guide plate 200 are disposed in the transition structure 320. Figure 1 As shown, the light-emitting unit 120 of the light-emitting circuit board 100 can be completely disposed in the transition structure 320. A portion of the light guide plate 200 and a portion of the plate body 110 of the light-emitting circuit board 100 can be disposed in the transition structure 320. The side of the light guide plate 200 opposite to the light-emitting unit 120 can be adjacent to or contact the opposite structure 330 of the back frame 300, but is not limited thereto. For example (not shown), the light-emitting circuit board 100 can be disposed in the transition structure 320, a portion of the light guide plate 200 can be disposed in the transition structure 320, and the side of the light guide plate 200 opposite to the light-emitting unit 120 can be adjacent to or contact the opposite structure 330 of the back frame 300, but is not limited thereto.

[0047] To ensure the pre-assembled structure PS can be securely positioned on the bottom structure 310 of the back frame 300 and within the transition structure 320, the light guide plate 200 and the side of the back frame 300 furthest from (or opposite to) the transition structure 320 can be fixed to each other by a fastener FX3. The fastener FX3 is disposed on the side of the light guide plate 200 opposite to (against) the light-emitting unit 120 to fix the light guide plate 200 and the side of the back frame 300 furthest from (or opposite to) the transition structure 320 to each other. The fastener FX3 can be disposed on the bottom structure 310 and / or the opposite structure 330 of the back frame 300, such that the side of the light guide plate 200 opposite to the light-emitting unit 120 can be fixed to the bottom structure 310 and / or the opposite structure 330 of the back frame 300 by the fastener FX3, but is not limited thereto. The fastener FX3 can include any suitable adhesive material to have adhesive properties, such that the light guide plate 200 and the back frame 300 can be adhered to each other by the fastener FX3, but is not limited thereto.

[0048] like Figure 1As shown, the electronic device ED1 may further include a reflective sheet RL, which is disposed on the bottom structure 310 of the back frame 300 and below the light guide plate 200 (i.e., the reflective sheet RL is disposed between the bottom structure 310 of the back frame 300 and the second surface 210b of the light guide plate 200). Through the placement of the reflective sheet RL, light emitted from the second surface 210b of the light guide plate 200 can be reflected back to the light guide plate 200 by the reflective sheet RL, thereby increasing the light intensity and improving the light emission quality of the electronic device ED1. In this invention, the material of the reflective sheet RL may include a material with high light reflectivity, such as a metallic material with high light reflectivity, for example, silver, aluminum, molybdenum, other suitable metallic materials, other suitable high reflectivity materials, or combinations thereof, but is not limited thereto.

[0049] In some embodiments, the reflective sheet RL may or may not overlap with the top 320t of the bend structure 320 of the back frame 300 in the Z direction (in Figure 1 In the meantime, the reflector RL may not overlap with the top 320t of the bend structure 320 of the back frame 300 in the Z direction.

[0050] In some embodiments (such as) Figure 1 As shown), the reflector RL can be fixed between the bottom structure 310 of the back frame 300 and the light guide plate 200 by means of the fastener FX2. For example (such as...) Figure 1 As shown, the fastener FX2 can be disposed on the side of the reflector RL opposite to the light-emitting unit 120 to fix the reflector RL to the side of the back frame 300 away from (or opposite to) the turning structure 320. The side of the back frame 300 away from the turning structure 320 is fixed to the reflector RL by the fastener FX2, but this is not a limitation. In some embodiments, the fastener FX2 can be disposed on the bottom structure 310 and / or the opposite structure 330 of the back frame 300, so that the side of the reflector RL opposite to the light-emitting unit 120 can be fixed to the bottom structure 310 and / or the opposite structure 330 of the back frame 300 by the fastener FX2. For example, the fastener FX2 can include any suitable adhesive material to have adhesiveness, so that the reflector RL and the back frame 300 can be adhered to each other by the fastener FX2, but this is not a limitation.

[0051] like Figure 1As shown, the electronic device ED1 may further include a reflective element RC disposed between the top 320t of the bend structure 320 of the back frame 300 and the light guide plate 200, for reflecting light incident on the bend structure 320 back to the light guide plate 200, thereby improving the light emission quality of the electronic device ED1. At least a portion of the reflective element RC overlaps the top 320t of the bend structure 320 in the Z direction. The material of the reflective element RC may include a material with high light reflectivity, such as a metallic material with high light reflectivity, for example including silver, aluminum, molybdenum, other suitable metallic materials, other suitable high reflectivity materials, or combinations thereof, but is not limited thereto. The reflective element RC may be disposed on the top 320t of the back frame 300 in a suitable manner.

[0052] In this invention, the reflective element RC can be designed according to requirements. For example... Figure 1 As shown, in the top view (i.e., direction Z) of the electronic device ED1, the reflective element RC can be superimposed on the light-emitting unit 120 and the light guide plate 200 to reflect the light incident on the top 320t of the bending structure 320 back to the light guide plate 200. Figure 1 As shown, in the top view (direction Z) of the electronic device, a portion RC_1 of the reflective element RC may not overlap with the top 320t of the bend structure 320 of the back frame 300 (i.e., the reflective element RC protrudes from the top 320t of the bend structure 320 in cross-section). This (protruding) portion RC_1 may overlap with and be substantially parallel to the light guide plate 200 to improve the reflection effect of the reflective element RC on light incident on the top 320t of the bend structure 320 and reduce light leakage, but this is not a limitation. Whether the reflective element RC and the reflective sheet RL overlap in direction Z can be designed according to requirements (e.g., in...). Figure 1 In the process, a portion of the reflective element RC, RC_1, may overlap with the reflective sheet RL in the Z direction, but this is not a limitation.

[0053] On the other hand, the reflective element RC does not contact the light guide plate 200, thereby reducing the difficulty of setting (assembling) the pre-assembled structure PS in the bend structure 320 of the back frame 300. The reflective element RC and the light guide plate 200 are separated by a gap Gp in a normal direction (i.e., direction Z) of the light-emitting circuit board 100, and this gap Gp may be greater than 0 and less than or equal to 1 mm, or greater than 0 and less than or equal to 0.075 mm, or greater than or equal to 0.075 mm and less than or equal to 1 mm, or greater than or equal to 0.04 mm and less than or equal to 0.07 mm, but is not limited thereto.

[0054] The pre-assembled structure PS, back frame 300, reflective sheet RL and reflective element RC in electronic device ED1 can be combined to form a backlight module (i.e. a light-emitting device), but are not limited thereto.

[0055] Please refer to Figure 4 As shown, Figure 4 This is a schematic diagram of a partial assembly process of an electronic device according to an embodiment of the present invention, wherein... Figure 4 The back frame 300 omits the opposite side structure 330. For example... Figure 4 As shown, before setting the pre-assembled structure PS, which includes the light guide plate 200, the light-emitting circuit board 100, and the fixing member FX1, in the turning structure 320 of the back frame 300, the reflective sheet RL can be set on the bottom structure 310 of the back frame 300, and the reflective element RC can be set on the top 320t of the back frame 300. Then, in Figure 4 During assembly, the pre-assembled structure PS is inserted obliquely into the transition structure 320 of the back frame 300, such that at least a portion of the light-emitting circuit board 100 and at least a portion of the light guide plate 200 are disposed in the transition structure 320. Figure 4 In the diagram, state SU1 shows a point in time when the pre-assembled structure PS is being inserted obliquely into the transition structure 320, while state SU2 shows that the pre-assembled structure PS has already been inserted into the transition structure 320.

[0056] During the process of the pre-assembled structure PS being inserted at an angle into the turning structure 320 (e.g. Figure 4 As shown in state SU1), one end of the board body 110 of the light-emitting circuit board 100 may come into contact with a structure provided on the bottom structure 310 of the back frame 300 (after the pre-assembled structure PS is inserted into the bend structure 320, this end will be adjacent to the side 320s of the bend structure 320). Figure 4 As shown in state SU1, one end of the board body 110 of the light-emitting circuit board 100 may come into contact with the reflector RL during the process of the pre-assembly structure PS being inserted obliquely into the turning structure 320. Therefore, this invention designs this end of the board body 110 to reduce the possibility that the pre-assembly structure PS may cause defects (such as damage, dents, additional material residue, etc.) to the structure (such as the reflector RL) provided on the bottom structure 310 of the back frame 300 due to contact with the structure (such as the reflector RL) on the bottom structure 310 during the assembly process, thereby improving the yield and / or quality of the electronic device ED1.

[0057] like Figure 2 and Figure 3As shown, regarding the aforementioned end of the plate 110, the base 112 may have an end portion 112ep at this end. This end portion 112ep will be adjacent to the side portion 320s of the transition structure 320 after the pre-assembled structure PS is inserted into the transition structure 320, and this end portion 112ep has a first edge 110e1 in the plate 110 (base 112) adjacent to the side portion 320s of the transition structure 320. In this invention, this end portion 112ep protrudes beyond the first protective layer 118a, the first adhesive layer 116a, the second adhesive layer 116b, and the second protective layer 118b. In other words, the first protective layer 118a, the first adhesive layer 116a, the second adhesive layer 116b, and the second protective layer 118b are not disposed on the end 112ep of the substrate 112, such that the end 112ep of the substrate 112 is not covered by the first protective layer 118a, the first adhesive layer 116a, the second adhesive layer 116b, and the second protective layer 118b (i.e., the end 112ep of the substrate 112 is not covered by any adhesive material). In some embodiments, the first protective layer 118a, the first adhesive layer 116a, the second adhesive layer 116b, and the second protective layer 118b can be removed from the end 112ep of the substrate 112 by a suitable method. The first protective layer 118a, the first adhesive layer 116a, the second adhesive layer 116b, and the second protective layer 118b can be removed from the end 112ep of the substrate 112 by an etching process, but this is not a limitation. In some embodiments, the first conductive layer 114a and the second conductive layer 114b may not be disposed on the end 112ep of the substrate 112, so that the end 112ep of the substrate 112 is exposed, but this is not a limitation.

[0058] In other words, the light-emitting circuit board 100 includes a first protective layer 118a, a first adhesive layer 116a, a first conductive layer 114a, a substrate 112, a second conductive layer 114b, a second adhesive layer 116b, and a second protective layer 118b, stacked sequentially from top to bottom. The substrate 112 has an end 112ep that protrudes beyond the first protective layer 118a, the first adhesive layer 116a, the second adhesive layer 116b, and the second protective layer 118b, and is adjacent to the side 320s of the transition structure 320. It should be noted that the sequential stacking of the first protective layer 118a, the first adhesive layer 116a, the first conductive layer 114a, the substrate 112, the second conductive layer 114b, the second adhesive layer 116b, and the second protective layer 118b from top to bottom only illustrates the arrangement of the components. Figure 2 However, this does not mean that the first protective layer 118a, the first adhesive layer 116a, the first conductive layer 114a, the substrate 112, the second conductive layer 114b, the second adhesive layer 116b, and the second protective layer 118b are arranged in sequence during the manufacturing process. These components can be arranged or combined with each other in a suitable way to form the structure.

[0059] In this invention, the dimensions (width) of the end portion 112ep can be designed according to requirements. For example... Figure 3 As shown, in top view, the width W (i.e., the dimension in direction X) of the protruding end 112ep can be greater than 0 and less than or equal to 0.5 mm, or greater than 0 and less than or equal to 0.45 mm, or greater than 0 and less than or equal to 0.4 mm, or greater than 0 and less than or equal to 0.35 mm, but is not limited thereto. In this invention, the end 112ep can be adjacent to the light-emitting unit 120, and can be non-overlapping with the light-emitting unit 120 in direction Z.

[0060] According to the above design, during the process of the pre-assembled structure PS being inserted at an angle into the turning structure 320 (e.g. Figure 4 As shown in state SU1, the end 112ep of the substrate 112 of the light-emitting circuit board 100 may come into contact with the reflector RL. Since the adhesive material (such as the first adhesive layer 116a and the second adhesive layer 116b) is not present on the end 112ep of the substrate 112, even if the end 112ep of the substrate 112 of the light-emitting circuit board 100 comes into contact with the reflector RL during assembly, the possibility of adhesive material (such as the first adhesive layer 116a and the second adhesive layer 116b) on the light-emitting circuit board 100 remaining on the reflector RL is greatly reduced. This reduces the possibility of defects caused to the reflector RL by the pre-assembled structure PS during assembly, thereby improving the yield and / or quality of the electronic device ED1.

[0061] In addition, Figure 3 In this embodiment, the board body 110 of the light-emitting circuit board 100 may also selectively have a connecting portion 110C on the same side of the end 112ep of the substrate 112 for connecting an external device to receive external signals. Figure 3 In the process, the extension direction of the connecting part 110C can be approximately perpendicular to the direction Y, which is, for example, the arrangement direction of the light-emitting unit 120, but is not limited thereto.

[0062] Furthermore, in another embodiment of the light-emitting circuit board 100' Figure 5In this design, the adhesive materials (such as the first adhesive layer 116a and the second adhesive layer 116b) are not disposed on the end 112ep of the substrate 112, nor are they disposed on the two side ends 112sp of the substrate 112. The end 112ep is connected between the two side ends 112sp, and the two side ends 112sp respectively have a second edge 110e2 and a third edge 110e3 connected to the first edge 110e1. The extension direction of the first edge 110e1 is different from the extension direction of the second edge 110e2 (and / or the third edge 110e3). This design reduces the possibility of adhesive materials (such as the first adhesive layer 116a and the second adhesive layer 116b) remaining on the reflective sheet RL, thereby reducing the possibility of defects in the reflective sheet RL caused by the pre-assembled structure PS during assembly and improving the yield and / or quality of the electronic device ED1.

[0063] In some embodiments (such as) Figure 1 As shown), the electronic device ED1 may also include one or more optical films OL to properly adjust light (such as light emitted from the first surface 210a of the light guide plate 200). Figure 1 In this configuration, the optical film OL can be positioned on the pre-assembled structure PS and the bottom structure 310 of the back frame 300 in the top view direction (direction Z) of the electronic device, and can also be positioned between the turning structure 320 of the back frame 300 and the opposite side structure 330 in the direction X. For example... Figure 1 As shown, the optical film OL may overlap the light guide plate 200 but not the top 320t of the bending structure 320 in the top view (direction Z) of the electronic device, but is not limited thereto. In this invention, the type of optical film OL can be designed according to requirements. Optical films OL1, OL2, OL3, and OL4 may include diffusers, prism sheets, lenses, or other suitable optical films.

[0064] like Figure 1 As shown, the electronic device ED1 may also include a display panel DP disposed on the back frame 300 and the pre-assembled structure PS, and light emitted from the first surface 210a of the light guide plate 200 can be directed toward the display panel DP.

[0065] In this invention, the display panel (DP) can be designed according to requirements. Figure 1 In this display panel DP, a light-blocking layer LS may optionally be included. The light-blocking layer LS can be used to separate sub-pixels in the display panel DP and to shield some components (such as components in the peripheral area and / or areas overlapping the back frame 300) to improve display quality. The light-blocking layer LS may include metal, photoresist, ink, resin, pigment, other suitable light-blocking materials, or combinations thereof, but is not limited thereto.

[0066] The electronic device of the present invention is not limited to the above embodiments. Other embodiments will continue to be disclosed below. However, in order to simplify the description and highlight the differences between the embodiments and the above embodiments, the same reference numerals are used to refer to the same elements below, and repeated parts will not be described again.

[0067] Please refer to Figure 6 As shown, Figure 6 This is a cross-sectional schematic diagram of an electronic device according to a second embodiment of the present invention. Figure 6 As shown, the difference between this embodiment and the first embodiment lies in the design of the reflective element RC in the electronic device ED2 of this embodiment. Figure 6 In this configuration, the reflective element RC can completely overlap the top 320t of the bending structure 320 in the Z direction, so that the reflective element RC does not protrude from the top 320t of the bending structure 320.

[0068] Please refer to Figure 7 As shown, Figure 7 This is a cross-sectional schematic diagram of an electronic device according to a third embodiment of the present invention. Figure 7 As shown, the difference between this embodiment and the first embodiment lies in the design of the reflective element RC in the electronic device ED3 of this embodiment. Figure 7 In this structure, a portion RC_1 of the reflective element RC may not overlap the top 320t of the bend structure 320 of the back frame 300 (i.e., the reflective element RC protrudes from the top 320t of the bend structure 320 in cross-section), and this portion RC_1 (i.e., the protruding portion) may overlap the light guide plate 200 but is not parallel to the light guide plate 200. For example... Figure 7 As shown, the protruding portion RC_1 of the reflective element RC can be tilted or bent toward the display panel DP to reduce the difficulty of setting (assembling) the pre-assembled structure PS in the bend structure 320 of the back frame 300, but is not limited thereto.

[0069] Please refer to Figure 8 As shown, Figure 8 This is a cross-sectional schematic diagram of an electronic device according to a fourth embodiment of the present invention. Figure 8 As shown, the difference between this embodiment and the first embodiment lies in the design of the back frame 300 and the reflective element RC of the electronic device ED4 in this embodiment. Figure 8In the case of the back frame 300, the top 320t of the transition structure 320 can have various thicknesses. The reflective element RC is correspondingly arranged according to the cross-sectional contour of the top 320t of the transition structure 320. The thickness of the portion of the top 320t near the side 320s is greater than the thickness of the portion of the top 320t away from the side 320s, so as to reduce the difficulty of setting (assembling) the pre-assembled structure PS in the transition structure 320 of the back frame 300. The top 320t may include a first top portion 320t1 and a second top portion 320t2. The first top portion 320t1 is located between the side 320s and the second top portion 320t2. The thickness T1 of the first top portion 320t1 in the Z direction is greater than the thickness T2 of the second top portion 320t2 in the Z direction, but it is not limited thereto.

[0070] In summary, because the substrate of the light-emitting circuit board of the present invention has an end design, even if the end of the substrate of the light-emitting circuit board directly contacts the structure (e.g., reflective sheet) provided on the bottom structure of the back frame during the assembly process, the possibility of adhesive material remaining on this structure (e.g., reflective sheet) is greatly reduced, thereby reducing or avoiding the possibility of defects caused to this structure (e.g., reflective sheet) by the pre-assembled structure during the assembly process, thereby improving the yield and / or quality of electronic devices.

[0071] While embodiments and advantages of the present invention have been provided above, it should be understood that any person skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material composition, apparatus, methods, and steps described in the specific embodiments of the specification. Any process, machine, manufacturing, material composition, apparatus, method, and step developed in the present invention can be understood from the disclosure of the present invention, whether currently developed or in the future, and can be used according to the present invention as long as substantially the same function can be implemented or substantially the same result can be obtained in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing, material composition, apparatus, methods, and steps. In addition, each claim constitutes an independent embodiment, and the scope of protection of the present invention also includes combinations of the various claims and embodiments. The scope of protection of the present invention shall be determined by the appended claims.

[0072] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Those skilled in the art will recognize that the present invention can have various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that, include: A back frame having a turning structure, the turning structure including a bottom, a top, and a side portion connecting the bottom and the top; A light-emitting circuit board; and A light guide plate, wherein the light guide plate is fixed to the light-emitting circuit board by a first fixing member; The light-emitting circuit board and the light guide plate, which are fixed to each other, are disposed in the transition structure; The light-emitting circuit board includes a first protective layer, a first adhesive layer, a first conductive layer, a substrate, a second conductive layer, a second adhesive layer and a second protective layer, which are stacked sequentially from top to bottom. The substrate has an end that protrudes beyond the first protective layer, the first adhesive layer, the second adhesive layer and the second protective layer, and the end is adjacent to the side of the bend structure.

2. The electronic device as claimed in claim 1, characterized in that, The end protrudes with a width greater than 0 and less than or equal to 0.5 mm.

3. The electronic device as claimed in claim 1, characterized in that, The light-emitting circuit board also includes a light-emitting unit, which contacts the light guide plate.

4. The electronic device as claimed in claim 1, characterized in that, The electronic device also includes a reflective element disposed between the top of the bend structure and the light guide plate, wherein the reflective element is not in contact with the light guide plate.

5. The electronic device as claimed in claim 4, characterized in that, The reflective element and the light guide plate are spaced apart by a distance in one normal direction of the light-emitting circuit board, and the distance is greater than 0 and less than or equal to 1 mm.

6. The electronic device as claimed in claim 4, characterized in that, In a top view of the electronic device, a portion of the reflective element does not overlap the top of the bend structure, and the portion of the reflective element overlaps the light guide plate.

7. The electronic device as claimed in claim 1, characterized in that, The electronic device also includes a reflective sheet disposed under the light guide plate, and the reflective sheet is fixed to the side of the back frame away from the turning structure by a second fastener.

8. The electronic device as claimed in claim 1, characterized in that, The light guide plate is fixed to the side of the back frame away from the turning structure by a third fastener.

9. The electronic device as claimed in claim 1, characterized in that, The light-emitting circuit board further includes a light-emitting unit. The first protective layer has a first opening, and the first adhesive layer has a second opening. The light-emitting unit is electrically connected to the first conductive layer through the first opening and the second opening.

10. The electronic device as claimed in claim 1, characterized in that, The electronic device further includes an optical film, wherein the optical film overlaps the light guide plate but does not overlap the top of the bend structure in the top view of the electronic device.

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