Liquid-cooled cabinets, rack servers and liquid cooling systems

Abstract

This application relates to the field of server technology, and discloses a liquid-cooled cabinet, a rack-mount server, and a liquid cooling system. The liquid-cooled cabinet includes a cabinet body and liquid cooling components. The liquid cooling components include a heat exchanger, a first liquid cooling device, and a second liquid cooling device. The first liquid cooling device connects a first immersion liquid cooling device and a first liquid cooling pipe in the heat exchanger to form a liquid cooling channel for the flow of a first liquid cooling medium. The second liquid cooling device connects a cold plate and a second liquid cooling pipe in the heat exchanger to form a liquid cooling channel for the flow of a second liquid cooling medium. The heat exchanger performs heat exchange between the first liquid cooling medium in the first liquid cooling pipe and the second liquid cooling medium in the second liquid cooling pipe. Thus, both immersion liquid cooling and cold plate liquid cooling of the server can be simultaneously achieved, improving the overall heat dissipation effect of the server and simplifying the structure of the data center and the complexity of liquid cooling control.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a liquid-cooled cabinet, rack-mounted server, and liquid cooling system. Background Technology

[0002] With the rapid development of the digital economy, the transmission speed of data centers is constantly increasing. Consequently, the power consumption of electronic devices such as servers and switches is also increasing, leading to higher demands for heat dissipation. Currently, cold plate liquid cooling technology or immersion liquid cooling technology can be used to dissipate heat from electronic devices. Taking servers as an example, cold plate liquid-cooled servers or immersion liquid-cooled servers can be installed inside the racks in the data center.

[0003] However, both cold plate liquid cooling and immersion liquid cooling technologies have their limitations and cannot address the heat dissipation of all components in electronic devices. For example, cold plate liquid cooling is more effective at dissipating heat from high-heat components but less effective at dissipating heat from low-heat components, while immersion liquid cooling is the opposite. This limits the overall heat dissipation effect of electronic devices. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides a liquid-cooled cabinet, a rack-mounted server, and a liquid cooling system. The following describes this application from multiple aspects, and the implementation methods and beneficial effects of these aspects can be referenced interchangeably.

[0005] In a first aspect, this application provides a liquid-cooled cabinet, comprising a cabinet body and a liquid-cooling assembly. The liquid-cooling assembly includes a heat exchanger, a first liquid-cooling device, and a second liquid-cooling device. The first liquid-cooling device connects a first immersion liquid-cooling device mounted on a server within the cabinet body to a first liquid-cooling pipe in the heat exchanger, forming a liquid-cooling channel for the flow of a first liquid-cooling medium. The second liquid-cooling device connects a cold plate mounted on the server within the cabinet body to a second liquid-cooling pipe in the heat exchanger, forming a liquid-cooling channel for the flow of a second liquid-cooling medium. The heat exchanger performs heat exchange between the first liquid-cooling medium in the first liquid-cooling pipe and the second liquid-cooling medium in the second liquid-cooling pipe.

[0006] Thus, employing both a first and a second liquid cooling unit enables simultaneous immersion liquid cooling and cold plate liquid cooling for the server, improving overall heat dissipation. Furthermore, the second liquid cooling unit can be connected only to the external liquid cooling piping of the liquid-cooled cabinet to dissipate heat from the second liquid cooling medium. The first liquid cooling unit, however, can remain isolated from the outside, using a heat exchanger to exchange heat between the first and second liquid cooling media, achieving heat dissipation within the liquid-cooled cabinet. Therefore, only one set of liquid cooling piping connected to the second liquid cooling unit needs to be installed externally to the liquid-cooled cabinet, eliminating the need for dedicated liquid cooling piping for the first unit, thereby reducing the structural and control complexity of the liquid-cooled cabinet and server room.

[0007] In one possible implementation of the first aspect described above, the server may include a first device and a second device, both of which are located in a first immersion liquid cooling device, with a cold plate covering the first device. Thus, the first device dissipates heat primarily through the cold plate, and the second device dissipates heat primarily through the first liquid cooling medium in the first immersion liquid cooling device.

[0008] For example, the first device can be a high-power device, i.e., a high-heat device, such as the main chip, which generates a significant amount of heat. The second device can be a low-power device, i.e., a low-heat device, such as a hard drive, optical module, and memory, which generates less heat. Therefore, the high heat generated by the high-heat devices in the server can be transferred to the cold plate, while the low heat generated by the low-heat devices can be transferred to the first liquid cooling medium in the first immersion liquid cooling device. This achieves targeted heat dissipation for different devices in the server, improving the overall heat dissipation effect of the server.

[0009] In one possible implementation of the first aspect described above, the second liquid cooling device includes a pipeline network, which includes multiple pipelines and at least one valve for controlling the on / off state of the multiple pipelines; when the at least one valve is in different on / off states, the pipeline network and the cold plate form different liquid cooling channels for the flow of the second liquid cooling medium, and the second liquid cooling medium in the different liquid cooling channels has different heat exchange efficiencies with the first liquid cooling medium.

[0010] Thus, by incorporating multiple valves in the piping network, this application enables different heat dissipation strategies under varying conditions. For instance, it allows for the configuration of different liquid cooling channels for the liquid cooling medium based on varying load conditions, automatically adjusting heat dissipation efficiency. This dynamically adjusts the heat dissipation capacity of the liquid-cooled cabinet under different power consumption conditions, thereby avoiding unnecessary energy waste. Therefore, this application achieves dynamic control of the heat dissipation efficiency of liquid-cooled components under different power consumption levels in the liquid-cooled cabinet, increasing the diversity and flexibility of the liquid-cooled cabinet heat dissipation solution.

[0011] In one possible implementation of the first aspect above, the first liquid cooling device includes a first pipeline and a second pipeline, wherein the first pipeline, the first immersion liquid cooling device, the second pipeline and the first liquid cooling pipe are connected in sequence, and the first liquid cooling pipe is connected to the first pipeline to form a circulation channel for the flow of the first liquid cooling medium.

[0012] It is understood that the first liquid cooling unit is an internal circulation pipeline inside the liquid cooling cabinet and is not connected to the outside of the liquid cooling cabinet. In this way, only one set of liquid cooling pipelines connected to the second liquid cooling unit needs to be installed on the outside of the liquid cooling cabinet, without the need to install corresponding liquid cooling pipelines for the first liquid cooling unit, thereby reducing the structural and control complexity of the liquid cooling cabinet and the computer room.

[0013] According to an embodiment of this application, the heat exchanger can be located at the bottom of the liquid-cooled cabinet, and the heat exchanger includes heat exchange plates and a first liquid-cooled pipe and a second liquid-cooled pipe separated by the heat exchange plates. Thus, the liquid in the first liquid-cooled pipe and the second liquid-cooled pipe can exchange heat through the heat exchange plates. It should be noted that the heat exchanger can also be installed in other locations within the liquid-cooled cabinet; this application does not impose any restrictions on the location of the heat exchanger.

[0014] In one possible implementation of the first aspect described above, the liquid-cooled cabinet also includes a power supply located within the cabinet, and the first liquid-cooling device is also used to connect the second immersion liquid-cooling device on the power supply and the first liquid-cooling pipe in the heat exchanger.

[0015] Thus, immersing the power supply in the liquid cooling medium of the second immersion liquid cooling device can improve the heat dissipation effect of the power supply.

[0016] For example, the second immersion liquid cooling unit can be located on top of the liquid cooling cabinet.

[0017] In one possible implementation of the first aspect described above, the liquid-cooled cabinet further includes a power busbar, which is electrically connected to a power source; at least a portion of the first conduit is a trough-shaped conduit that covers the power busbar.

[0018] According to an embodiment of this application, the power busbar can extend along the height of the liquid-cooled cabinet and be electrically connected to the power supply for transmitting power output from the power supply to the server. At least a portion of the liquid supply pipe of the first immersion liquid cooling device in the first liquid cooling system is a grooved pipe, which covers the power busbar. A grooved pipe refers to a pipe with a groove on its outer shell, which covers at least a portion of the surface of the power busbar. This increases the contact area between the power busbar and the grooved pipe, and utilizes the first liquid cooling medium within the grooved pipe for heat dissipation, thereby improving the heat dissipation efficiency of the power busbar and addressing the current problem of poor heat dissipation in power busbars.

[0019] In one possible implementation of the first aspect described above, a first liquid pump is also provided in the circulation channel.

[0020] In one possible implementation of the first aspect described above, the first liquid pump is located inside the first immersion liquid cooling device.

[0021] Thus, the first liquid pump can be used to control the rate at which the first liquid cooling medium enters the first immersion liquid cooling device.

[0022] For example, the first liquid pump can be installed on the connection structure between the first immersion liquid cooling equipment and the first liquid cooling device.

[0023] According to other embodiments of this application, the first liquid pump may also be located outside the first immersion liquid cooling device. In this case, the first liquid pump can be a master pump that controls the total rate of the first liquid cooling medium. For example, the first liquid pump may be located at the bottom of the liquid cooling cabinet.

[0024] In one possible implementation of the first aspect described above, the first liquid cooling device may further include a temperature sensor and a pressure sensor. By incorporating the temperature sensor and pressure sensor, the temperature and pressure of the first liquid cooling medium can be monitored in real time, thereby helping to ensure the normal operation of the liquid cooling components.

[0025] In one possible implementation of the first aspect described above, the first liquid cooling device may further include a replenishment tank, a liquid level sensing component, and a replenishment pump.

[0026] According to an embodiment of this application, the replenishment tank can be connected to the first pipeline. The replenishment tank stores liquid cooling medium, thereby supplying liquid cooling medium to the first pipeline. This allows the liquid cooling medium to circulate within the internal circulation channel formed by the first pipeline, the first immersion liquid cooling device, the second pipeline, and the first liquid cooling pipe. Furthermore, during the heat dissipation process of the first liquid cooling device on the server, the amount of the first liquid cooling medium may decrease due to evaporation. At this time, the replenishment tank can also replenish the first liquid cooling medium to the first pipeline, thereby ensuring sufficient supply of the first liquid cooling medium in the circulation channel, thus maintaining the server's heat dissipation effect and the safety of the first liquid cooling device.

[0027] According to an embodiment of this application, the liquid level sensing component can be located inside the replenishment tank. The liquid level sensing component can monitor the liquid level of the liquid cooling medium in the replenishment tank so that the liquid cooling medium can be automatically replenished by the liquid replenishment actuator when the liquid level is too low, or the operator can manually replenish the liquid cooling medium in the replenishment tank to ensure that the liquid cooling medium in the replenishment tank is sufficient.

[0028] According to an embodiment of this application, a replenishment pump can be disposed between the replenishment tank and the first pipeline. The replenishment pump is used to drive the liquid cooling medium in the replenishment tank to flow to the first pipeline, thereby enabling the replenishment tank to supply liquid cooling medium to the first pipeline, and thus enabling the liquid cooling medium to circulate in the internal circulation channel formed by the first pipeline, the first immersion liquid cooling device, the second pipeline and the first liquid cooling pipe.

[0029] In one possible implementation of the first aspect described above, the first liquid cooling device may further include an expansion tank connected to the first pipeline. The expansion tank is used to stabilize pressure fluctuations in the internal circulation channel. For example, when the volume of the liquid cooling medium in the internal circulation channel increases due to temperature rise, the expansion tank can absorb the excess liquid cooling medium via the first pipeline to prevent the pressure of the liquid cooling medium in the internal circulation channel from rising too quickly; when the volume of the liquid cooling medium in the internal circulation channel decreases due to temperature drop, the expansion tank can release the liquid cooling medium into the first pipeline, thereby replenishing the liquid cooling medium in the first pipeline and preventing the pressure of the liquid cooling medium in the internal circulation channel from dropping too quickly.

[0030] In one possible implementation of the first aspect described above, the first liquid cooling device may further include a chuck. The chuck may be disposed in the first pipeline and the second pipeline. The chuck is used to adjust the rate and flow rate of the liquid cooling medium in the first pipeline and the second pipeline to improve the heat dissipation effect of the first liquid cooling device on the server.

[0031] In one possible implementation of the first aspect described above, the pipeline network may include a first pipe segment, a second pipe segment, a third pipe segment, a fourth pipe segment, a fifth pipe segment, a sixth pipe segment, a seventh pipe segment, an eighth pipe segment, a ninth pipe segment, a tenth pipe segment, an eleventh pipe segment, and a twelfth pipe segment.

[0032] Specifically, the first end of the first pipe segment is connected to the liquid inlet of the piping network, the second end is connected to the first end of the second pipe segment, and the second end of the second pipe segment is connected to the first end of the third pipe segment. The second end of the third pipe segment is connected to the first end of the second liquid cooling pipe. The first end of the fourth pipe segment is connected to the second end of the second liquid cooling pipe, and the second end of the fourth pipe segment is connected to the first end of the fifth pipe segment. The second end of the fifth pipe segment is connected to the first end of the sixth pipe segment. The second end of the sixth pipe segment is connected to the first end of the cold plate on the server. The first end of the seventh pipe segment is connected to the second end of the cold plate on the server, and the second end of the seventh pipe segment is connected to the first end of the eighth pipe segment. The second end of the eighth pipe segment is connected to the first end of the ninth pipe segment. The second end of the ninth pipe segment is connected to the liquid return port of the piping network. The first end of the tenth pipe segment is connected to the second ends of both the first and second pipe segments, and the second end is connected to the second ends of both the fifth and sixth pipe segments. The first end of the eleventh pipe segment is connected to the second ends of both the seventh and eighth pipe segments, and the second end is connected to the second ends of both the fourth and fifth pipe segments. The first end of the twelfth pipe section is connected to the second end of the second pipe section and the first end of the third pipe section. The second end of the twelfth pipe section is connected to the second end of the eighth pipe section and the first end of the ninth pipe section.

[0033] In one possible implementation of the first aspect described above, at least one valve in the pipeline network includes a first valve, a second valve, a third valve, a fourth valve, and a fifth valve. Specifically, the first valve is located on the twelfth pipe segment, the second valve on the second pipe segment, the third valve on the eleventh pipe segment, the fourth valve on the fifth pipe segment, and the fifth valve on the tenth pipe segment.

[0034] It should be noted that this application does not impose any restrictions on the number of pipe sections, connection structures, or the number and location of valves. Those skilled in the art can make appropriate structural settings according to actual needs.

[0035] In one possible implementation of the first aspect described above, the liquid-cooled cabinet further includes a first controller, which controls the on / off state of at least one valve based on the power consumption of the liquid-cooled cabinet.

[0036] In this way, the first controller can be used to precisely regulate and manage the operating status of each component in the liquid cooling system. For example, the first controller can be used to control valves, proportional valves, temperature sensors, pressure sensors, and level sensors. By centrally controlling these key components, the first controller can automatically adjust parameters such as flow rate, temperature, pressure, and level in the liquid cooling path according to system operating requirements, achieving refined management within the liquid cooling cabinet. Therefore, setting up a first controller in the liquid cooling system not only allows for real-time response to dynamic changes in the liquid cooling pipeline but also optimizes cooling performance through intelligent algorithms, ensuring that the heat dissipation requirements of the liquid cooling cabinet are met under different workloads. Furthermore, unified control simplifies the control logic within the liquid cooling cabinet, reduces complex adjustments to individual components, and improves the reliability and maintenance efficiency of the liquid cooling cabinet.

[0037] In one possible implementation of the first aspect above, the first controller controls the on / off state of at least one valve according to the power consumption of the liquid-cooled cabinet, including: when the liquid-cooled cabinet is at a first power consumption, the first controller controls at least one valve to be in a first state.

[0038] In one possible implementation of the first aspect described above, the liquid-cooled cabinet further includes a second controller, which determines the power consumption of the liquid-cooled cabinet and sends the power consumption to the first controller.

[0039] According to an embodiment of this application, the liquid-cooled cabinet also includes a server control board. The server control board is used to control the corresponding servers and identify the power consumption of the corresponding servers.

[0040] For example, the server control board can be a node management sub-card, which is used to monitor the health status of the server in real time, including monitoring the operating status of various components in the server (such as main chip, memory, hard drive, fan and other hardware).

[0041] According to an embodiment of this application, the second controller can be a main controller. Specifically, the main controller can be used to receive power consumption signals sent by each server control board and determine the overall power consumption of the liquid-cooled cabinet based on the power consumption signals sent by each server control board.

[0042] In one possible implementation of the first aspect above, when at least one valve is in the first state, the piping network forms a third, fourth, and fifth piping, wherein the inlet of the piping network, the third piping, the second liquid-cooled pipe, the fourth piping, the cold plate, the fifth piping, and the return port of the piping network are sequentially connected to form a first channel for the flow of the second liquid-cooled medium.

[0043] In one possible implementation of the first aspect described above, the first power consumption is the full-load power consumption.

[0044] In this way, the second liquid cooling medium first enters the heat exchanger, exchanges heat with the first liquid cooling medium, and lowers the temperature of the first liquid cooling medium. Then, it dissipates heat from the server through a cold plate. This process utilizes the lower temperature characteristic of the second liquid cooling medium to improve the heat exchange efficiency of the first liquid cooling medium. Specifically, because the second liquid cooling medium is at a lower temperature, it can quickly absorb heat from the first liquid cooling medium, thereby effectively reducing the temperature of the first liquid cooling medium and improving the heat exchange efficiency between the first and second liquid cooling media, further enhancing the overall heat dissipation performance of the liquid cooling assembly. In the above heat dissipation strategy, under full-load power consumption of the liquid-cooled cabinet, the heat generated by the electronic equipment in the liquid-cooled cabinet increases significantly. The liquid cooling assembly can withstand higher heat dissipation demands, thus not only improving heat exchange efficiency but also enhancing the stability and heat dissipation capacity of the liquid-cooled cabinet under high power consumption conditions, extending the server's lifespan and improving the server's overall operating efficiency.

[0045] In one possible implementation of the first aspect above, when at least one valve is in the second state, the piping network forms a sixth and a seventh piping network, wherein the inlet of the piping network, the sixth piping network, the cold plate, the seventh piping network and the return port of the piping network are connected in sequence to form a second channel for the flow of the second liquid cooling medium.

[0046] In one possible implementation of the first aspect above, the first controller controls the on / off state of at least one valve according to the power consumption of the liquid cooling cabinet, including: when the liquid cooling cabinet is in a second power consumption state, the first controller controls at least one valve to be in a second state; wherein the first power consumption is greater than the second power consumption.

[0047] In one possible implementation of the first aspect above, the second power consumption is the standby power consumption.

[0048] In this way, the second liquid cooling medium does not enter the heat exchanger (or is called the second liquid cooling medium bypass heat exchanger). At this time, the first liquid cooling medium does not exchange heat but intermittently stores heat within the circulation channel. This process can temporarily stop the heat exchange between the first and second liquid cooling media when the power consumption of the liquid-cooled cabinet is low, i.e., when the liquid-cooled cabinet is in standby mode or operating under low load. Since the server generates less heat in this situation, the heat absorbed by the first liquid cooling medium is naturally greatly reduced. In this case, the first liquid cooling medium does not need to exchange heat with the second liquid cooling medium, but instead stores the heat in the circulation channel through a heat storage mechanism, forming a certain amount of heat accumulation. Therefore, the above heat dissipation strategy can reduce the operating burden of the liquid cooling components, thereby improving energy efficiency and reducing unnecessary energy consumption, achieving energy-saving control of the data center.

[0049] As the load in the liquid-cooled cabinet gradually resumes operation or increases, the generated heat will rise significantly. For example, when the liquid-cooled cabinet transitions from low load power consumption to high load power consumption, the first liquid cooling medium can begin to enter the heat exchanger and exchange heat with the second liquid cooling medium. Therefore, the liquid cooling components can respond promptly to load fluctuations in the liquid-cooled cabinet, ensuring that the second liquid cooling medium can immediately exchange heat when the liquid-cooled cabinet requires higher heat dissipation capacity. This satisfies heat dissipation requirements while avoiding unnecessary energy waste. Therefore, the above heat dissipation strategy not only optimizes the thermal management efficiency of the liquid cooling components but also extends their service life, enabling the liquid-cooled cabinet to maintain good heat dissipation performance under different operating conditions.

[0050] In one possible implementation of the first aspect above, when at least one valve is in the third state, the piping network forms an eighth, ninth, and tenth piping, wherein the inlet of the piping network, the eighth piping, the cold plate, the ninth piping, the second liquid-cooled pipe, and the tenth piping are connected in sequence to form a third channel for the flow of the second liquid-cooled medium.

[0051] In one possible implementation of the first aspect above, the first controller controls the on / off state of at least one valve based on the power consumption of the liquid-cooled cabinet, including: when the liquid-cooled cabinet is in a third power consumption state, the first controller controls at least one valve to be in a third state; wherein the third power consumption is greater than the second power consumption and less than the first power consumption.

[0052] In this way, the second liquid cooling medium first enters the cold plate to dissipate heat from the server, and then enters the heat exchanger to exchange heat with the first liquid cooling medium, reducing the temperature of the first liquid cooling medium. This process can simultaneously address the server's heat dissipation needs and the temperature regulation requirements of the first liquid cooling medium, thereby ensuring the efficient operation of the entire liquid cooling assembly. Specifically, when the power consumption of the liquid-cooled cabinet is less than the full-load power consumption, the heat generated by the server is relatively limited and will not cause excessive heat generation. Therefore, the lower-temperature second liquid cooling medium can be used first to meet the heat dissipation needs of the high-heat components inside the server, thereby effectively reducing the temperature of the high-heat components inside the server. At the same time, the heat absorbed by the second liquid cooling medium is exchanged with the first liquid cooling medium through the heat exchanger, which can reduce the temperature of the first liquid cooling medium, ensuring that the heat dissipation needs of the low-heat components inside the server are met.

[0053] The second aspect of this application provides a rack-mount server, which includes a first liquid-cooled server and a liquid-cooled cabinet as described in the first aspect above; the first liquid-cooled server is located in the liquid-cooled cabinet, and the first liquid-cooled server is an immersion liquid-cooled server or a cold plate liquid-cooled server.

[0054] In one possible implementation of the second aspect above, the rack server further includes a second liquid-cooled server; the second liquid-cooled server is located in a liquid-cooled cabinet, and the liquid cooling method of the second liquid-cooled server includes immersion liquid cooling and cold plate liquid cooling.

[0055] Therefore, the rack-mount server provided in this application can be equipped with immersion liquid-cooled servers or cold plate liquid-cooled servers, or even liquid-cooled servers that utilize both immersion and cold plate liquid cooling methods simultaneously. This allows for the installation of liquid-cooled servers with different cooling methods within the liquid-cooled rack according to actual needs, meeting the heat dissipation requirements of different components within the server and thus improving the heat dissipation effect of the liquid-cooled rack. Furthermore, in this application, even with different liquid cooling methods within the liquid-cooled rack, the liquid supply pipelines, return pipelines, and control interface of the liquid-cooled rack can be standardized, thereby reducing the structural cost and control complexity of the data center.

[0056] The third aspect of this application provides a liquid cooling system, which includes a liquid cooling distribution unit and a liquid cooling cabinet as described in the first aspect above, wherein the liquid cooling distribution unit is connected to a second liquid cooling device.

[0057] The beneficial effects of the second to third aspects described above can be referred to the relevant descriptions in the various embodiments of the first aspect described above, and will not be repeated here. Attached Figure Description

[0058] To more clearly illustrate the technical solution of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0059] Figure 1 This application illustrates a liquid cooling scenario for a server in some embodiments;

[0060] Figure 2 An exemplary structure of a rack server, shown in perspective view, is illustrated in some embodiments of this application.

[0061] Figure 3 An exemplary structure of a rack server, as shown in a rear view, is illustrated in some embodiments of this application;

[0062] Figure 4 An exemplary structure of a rack server, shown in a side view, is illustrated in some embodiments of this application;

[0063] Figure 5 An exemplary structure of a rack server, shown in a top view, is illustrated in some embodiments of this application;

[0064] Figure 6 Exemplary structures and heat dissipation principles of pipes in a liquid cooling assembly are shown in some embodiments of this application;

[0065] Figure 7 This application illustrates an exemplary structure and heat dissipation principle of a pipe in another liquid cooling assembly in some embodiments;

[0066] Figure 8 This application illustrates an exemplary structure and heat dissipation principle of a pipeline in another liquid cooling assembly, as shown in some embodiments.

[0067] Figure 9 This paper illustrates another liquid cooling scenario for a server in some embodiments of this application. Detailed Implementation

[0068] The illustrative embodiments of this application include, but are not limited to, liquid-cooled cabinets, rack-mounted servers, and liquid-cooling systems.

[0069] Figure 1 This illustration depicts a liquid cooling scenario for a server in some embodiments of this application. (Reference) Figure 1 The computer room 001 is equipped with rack-mount servers 01, a liquid cooling distribution unit (CDU) 3 and a liquid cooling door 4. The rack-mount servers 01 include liquid cooling electronic equipment 1 and a liquid cooling cabinet 2. The liquid cooling electronic equipment 1 is located inside the liquid cooling cabinet 2. The computer room 001 is equipped with cooling towers 5, 6, and 7, liquid pumps 5a, 5b, 6a, 7a, 7b, and 7c, a chiller unit 8 and a heat exchanger 8a.

[0070] The number of liquid-cooled cabinets 2 can be one or more (e.g., two, three, four, or five, etc.), and this application does not impose a specific limitation on this. Each liquid-cooled cabinet 2 can be equipped with one or more liquid-cooled electronic devices 1 (e.g., two, three, four, or five, etc.), and this application does not impose a specific limitation on this.

[0071] First, combine Figure 1 Explain the heat dissipation process of rack-mounted server 01.

[0072] The liquid-cooled cabinet 2 and the liquid-cooled distribution unit 3 are connected by liquid-cooled pipes 2a and 2b. The liquid cooling medium (e.g., water) within the liquid-cooled pipes 2a and 2b can circulate between the liquid-cooled cabinet 2 and the liquid-cooled distribution unit 3. Figure 1 The arrows marked between the liquid cooling cabinet 2 and the liquid cooling distribution unit 3 indicate the flow direction of the liquid cooling medium in the liquid cooling pipes 2a and 2b. That is, the liquid cooling pipe 2a can be a liquid supply pipe and the liquid cooling pipe 2b can be a liquid return pipe.

[0073] The liquid-cooled distribution unit 3 and the cooling tower 5 are connected by liquid-cooled pipes 3a and 3b. The liquid cooling medium (e.g., water) within the liquid-cooled pipes 3a and 3b can circulate between the liquid-cooled distribution unit 3 and the cooling tower 5. Figure 1 The arrows marked between the liquid cooling distribution unit 3 and the cooling tower 5 indicate the flow direction of the liquid cooling medium in the liquid cooling pipes 3a and 3b. That is, the liquid cooling pipe 3a can be a liquid supply pipe, and the liquid cooling pipe 3b can be a liquid return pipe.

[0074] A liquid pump 5a may also be installed in the liquid cooling pipeline 3a, and a liquid pump 5b may also be installed in the liquid cooling pipeline 3b. The liquid pump 5a and the liquid pump 5b are used to drive the liquid cooling medium to flow in the liquid cooling pipeline 3a and the liquid cooling pipeline 3b, respectively.

[0075] The aforementioned liquid-cooled electronic device 1 may include electronic devices (such as servers, switches, etc.) and liquid cooling devices (…). Figure 1 (omitted), the liquid cooling device is connected to liquid cooling pipes 2a and 2b to dissipate heat from the electronic equipment. It should be noted that the electronic equipment in this application can also be other devices that dissipate heat through liquid cooling. For ease of description, a server is used as an example of an electronic equipment in the embodiments of this application.

[0076] The aforementioned liquid cooling device may include a cold plate and liquid cooling pipes that provide the cold plate with a cooling medium. The cold plate may cover the server for heat dissipation. Accordingly, the liquid cooling electronic device 1 may be a cold plate-type liquid-cooled server. Alternatively, the liquid cooling device may include an immersion liquid cooling shell and liquid cooling pipes that provide the immersion liquid cooling shell with a cooling medium. The server may be located in the immersion liquid cooling shell, and the cooling medium in the immersion liquid cooling shell is used to dissipate heat from the server. Accordingly, the liquid cooling electronic device 1 may be an immersion liquid-cooled server.

[0077] In this way, the heat generated by the server during operation can be transferred to the corresponding cold plate or immersion liquid cooling shell, and then transferred to liquid cooling pipe 2b through the liquid cooling medium in the liquid cooling system's liquid cooling pipes. The liquid cooling medium in liquid cooling pipe 2b then transfers the heat to liquid cooling distribution unit 3. Then, liquid cooling distribution unit 3 transfers the heat to cooling tower 4 through the liquid cooling medium in liquid cooling pipe 3b, and cooling tower 4 dissipates the heat into the atmosphere outside the computer room 001. This ultimately achieves heat dissipation for the server.

[0078] As mentioned earlier, both cold-plate liquid cooling and immersion liquid cooling technologies have limitations and cannot simultaneously address the heat dissipation of all components in electronic devices. Specifically, in cold-plate liquid-cooled servers, the limited contact area between the cold plate and the electronic equipment hinders the effective transfer of heat from low-heat components to the cold plate, resulting in poor heat dissipation for these components. Conversely, in immersion liquid-cooled servers, the poor thermal conductivity and flow characteristics of the liquid cooling medium within the immersion cooling shell lead to low heat dissipation efficiency for high-heat components.

[0079] However, because cold-plate liquid-cooled servers and immersion liquid-cooled servers differ in their heat dissipation methods, cooling media, and structural configurations, these two types of liquid-cooled servers require independent liquid supply pipelines and control systems. For example, liquid cooling pipelines 2a and 2b can only be used for one type of liquid-cooled server, making these two liquid cooling methods incompatible within the same liquid-cooled rack. Therefore, currently, only one liquid cooling method is typically used to dissipate heat from servers and other electronic equipment within the same liquid-cooled rack, resulting in consistently poor heat dissipation for some components within the electronic equipment.

[0080] Continue to refer to Figure 1 Since some components in electronic devices are difficult to dissipate heat, the heat that is not carried away by the liquid cooling device will be transferred to the air inside the computer room 001. Therefore, in some embodiments, a liquid cooling door 4 can be installed to absorb the heat in the air inside the computer room 001 and transfer the heat to the outside of the computer room 001.

[0081] The following is combined Figure 1 The heat dissipation process after the liquid cooling door 4 absorbs heat is described.

[0082] The liquid cooling door 4 and the cooling tower 6 are connected by liquid cooling pipes 4a and 4b. The liquid cooling medium (e.g., water) within the liquid cooling pipes 4a and 4b can circulate between the liquid cooling door 4 and the cooling tower 6. Liquid cooling pipe 4a can be a supply pipe, and liquid cooling pipe 4b can be a return pipe. A liquid pump 6a may also be installed in liquid cooling pipe 4a to drive the flow of the liquid cooling medium within it.

[0083] When the temperature of the liquid cooling medium in the liquid cooling pipe 4a is higher than the preset temperature (e.g., 28 degrees Celsius (°C)), the heat dissipation efficiency of the liquid cooling door 4 is low. The cooling tower 7 and the chiller unit 8 can be used to further reduce the temperature of the liquid cooling medium in the liquid cooling pipe 4a.

[0084] Specifically, cooling tower 7 and chiller unit 8 are connected via liquid cooling pipes 4c and 4d, where liquid cooling pipe 4c serves as a supply pipe and liquid cooling pipe 4d serves as a return pipe. Liquid cooling pipe 4a connects to heat exchanger 8a, and chiller unit 8 and heat exchanger 8a are connected via liquid cooling pipes 4e and 4f, where liquid cooling pipe 4e serves as a supply pipe and liquid cooling pipe 4f serves as a return pipe. Liquid cooling pipes 4c, 4e, and 4d may also be equipped with liquid pumps 7a, 7b, and 7c, respectively, to drive the flow of the liquid cooling medium within the corresponding liquid cooling pipes.

[0085] Thus, when the temperature of the liquid cooling medium in liquid cooling pipe 4a exceeds a preset temperature (e.g., 28 degrees Celsius), the chiller unit 8 and liquid pump 7b can be turned on. The chiller unit 8 can further cool the liquid cooling medium in liquid cooling pipe 4c (e.g., to 18°C) and transfer it to liquid cooling pipe 4e. The liquid cooling medium in liquid cooling pipe 4e and the liquid cooling medium in liquid cooling pipe 4a exchange heat in heat exchanger 8a. After heat exchange, the heated liquid cooling medium (e.g., from 18°C ​​to 24°C) flows back to the chiller unit 8 via liquid cooling pipe 4f, and then flows back to the cooling tower 7 via liquid cooling pipe 4d. This improves the heat dissipation efficiency of the liquid cooling gate 4.

[0086] However, the liquid cooling door 4 can only absorb heat released into the air inside the computer room 001, and it still cannot directly dissipate heat from components in the liquid-cooled electronic equipment 1 that have poor heat dissipation performance. Furthermore, the heat dissipation of the liquid cooling door 4 requires independent liquid cooling pipelines and cold sources (such as cooling tower 6, cooling tower 7, and chiller unit 8), which increases the complexity of the liquid cooling system.

[0087] To address the aforementioned issues, this application provides a liquid-cooled server rack. The rack contains a liquid-cooling assembly, which includes a heat exchanger, a first liquid-cooling device, and a second liquid-cooling device. The first liquid-cooling device connects a first immersion liquid-cooling device and a first liquid-cooling pipe in the heat exchanger to form a liquid-cooling channel for the flow of a first liquid-cooling medium. The second liquid-cooling device connects a cold plate and a second liquid-cooling pipe in the heat exchanger to form a liquid-cooling channel for the flow of a second liquid-cooling medium. The heat exchanger performs heat exchange between the first liquid-cooling medium in the first liquid-cooling pipe and the second liquid-cooling medium in the second liquid-cooling pipe. Therefore, by employing both the first and second liquid-cooling devices, both immersion liquid-cooling and cold-plate liquid-cooling of the server can be simultaneously achieved, thereby improving the overall heat dissipation effect of the server.

[0088] Furthermore, the second liquid cooling unit can be connected only to the external liquid cooling piping of the liquid-cooled cabinet to dissipate heat from the second liquid cooling medium. The first liquid cooling unit, however, can remain isolated from the outside, using a heat exchanger to exchange heat between the first and second liquid cooling media, thus achieving heat dissipation for the first liquid cooling medium within the liquid-cooled cabinet. Therefore, only one set of liquid cooling piping connected to the second liquid cooling unit needs to be installed externally to the liquid-cooled cabinet, eliminating the need for a separate liquid cooling piping system for the first liquid cooling unit, thereby reducing the structural and control complexity of the liquid-cooled cabinet and the server room.

[0089] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0090] The following is combined Figures 2-5 The specific structure of a rack-mounted server according to this application is described in detail.

[0091] Figures 2-5 An exemplary structure of a rack server 01 is shown in a perspective view, a rear view, a side view, and a top view.

[0092] refer to Figure 2 and combined Figure 3 , Figure 4 The rack-mount server 01 may include a liquid-cooled cabinet 2 and multiple liquid-cooled servers located within the liquid-cooled cabinet 2. For example, the multiple liquid-cooled servers may include liquid-cooled server 1a, liquid-cooled server 1b, ..., liquid-cooled server 1n. For clarity, Figure 2 Only liquid-cooled servers 1a and 1n are shown. Each liquid-cooled server can be a hybrid liquid-cooled server, meaning the liquid cooling method includes both immersion liquid cooling and cold plate liquid cooling. Specifically, each liquid-cooled server may include a server, a first immersion liquid cooling device, and a cold plate. For example, liquid-cooled server 1a may include server 11a and a first immersion liquid cooling device and cold plate located on server 11a; liquid-cooled server 1b may include server 11b and a first immersion liquid cooling device and cold plate located on server 11b; liquid-cooled server 1n may include server 11n and a first immersion liquid cooling device and cold plate located on server 11n.

[0093] The following section uses liquid-cooled server 1a (as an example of a second liquid-cooled server) as an example to describe a specific structure of a hybrid liquid-cooled server. It is understood that the other liquid-cooled servers can refer to the following description of liquid-cooled server 1a, and will not be elaborated upon further.

[0094] refer to Figure 2 and combined Figure 4 The liquid-cooled server 1a may include server 11a installed in the liquid-cooled rack 2. Figure 2 (omitted), first immersion liquid cooling device 12 and cold plate 13, server 11a and cold plate 13 are both located in the first immersion liquid cooling device 12, and cold plate 13 can cover at least part of the components of server 11a.

[0095] In this embodiment, each liquid-cooled server is a hybrid liquid-cooled server, but this application is not limited to this. In some other embodiments, at least some of the liquid-cooled servers (as an example of a first liquid-cooled server) may also be cold-plate liquid-cooled servers. Correspondingly, the liquid-cooled server may include a server mounted in the liquid-cooled cabinet 2 and a cold plate on the server.

[0096] In some other embodiments, the liquid-cooled server (as another example of the first liquid-cooled server) may also be an immersion liquid-cooled server. Correspondingly, the liquid-cooled server may include a server mounted in a liquid-cooled cabinet 2 and a first immersion liquid-cooling device on the server.

[0097] Reference Figure 4 and combined Figure 2 The liquid-cooled server 1a described above may also include a server control board 15. The server control board 15 is used to control the corresponding server and identify the power consumption of the corresponding server.

[0098] In some embodiments, the server control board 15 can be a node management sub-card, which is used to monitor the health status of the server in real time, including monitoring the operating status of various devices in the server (such as main chip, memory, hard disk, fan and other hardware).

[0099] For ease of description, in the following embodiments, the liquid-cooled server 1a is taken as a hybrid liquid-cooled server to illustrate the specific structure of the liquid-cooled server 1a and the liquid-cooled cabinet 2.

[0100] refer to Figure 5 In some embodiments, server 11a may include a first device 111 and a second device 112, both of which are located in a first immersion liquid cooling device 12, and a cold plate 13 covers the first device 111. Thus, the first device 111 dissipates heat mainly through the cold plate 13, and the second device 112 dissipates heat mainly through the first liquid cooling medium in the first immersion liquid cooling device 12.

[0101] In some embodiments, the first device 111 can be a high-power device, i.e., a high-heat device, such as the main chip, etc., and the first device 111 generates a relatively high amount of heat. The second device 112 can be a low-power device, i.e., a low-heat device, such as a hard drive, optical module, and memory, etc., and the second device 112 generates a relatively low amount of heat. Therefore, the high heat generated by the high-heat device in the server 11a can be transferred to the cold plate 13, while the low heat generated by the low-heat device in the server 11a can be transferred to the first liquid cooling medium in the first immersion liquid cooling device 12, thereby achieving targeted heat dissipation for different devices in the server 11a and improving the overall heat dissipation effect of the server 11a.

[0102] The following is a detailed description of a specific structure of the liquid-cooled cabinet 2.

[0103] refer to Figure 2 and Figure 3 The liquid-cooled cabinet 2 includes a cabinet body 21, a liquid cooling assembly 22, and a power supply 23. Figure 2 (omitted) and power busbar 24, the liquid cooling assembly 22, power supply 23 and power busbar 24 are located inside the cabinet 21. The liquid cooling assembly 22 includes a heat exchanger 221, a first liquid cooling device 222 and a second liquid cooling device 223.

[0104] The heat exchanger 221 can be located at the bottom of the liquid-cooled cabinet 2, and includes heat exchange plates 221a and a first liquid-cooled pipe H1 and a second liquid-cooled pipe H2 separated by the heat exchange plates 221a. Thus, the liquids in the first liquid-cooled pipe H1 and the second liquid-cooled pipe H2 can exchange heat through the heat exchange plates 221a. It should be noted that the heat exchanger 221 can also be located in other positions within the liquid-cooled cabinet 2; this application does not impose any restrictions on the location of the heat exchanger 221.

[0105] The first liquid cooling device 222 connects the first immersion liquid cooling device 12 on the server 11a and the first liquid cooling pipe H1 in the heat exchanger 221 to form a liquid cooling channel for the flow of the first liquid cooling medium. The second liquid cooling device 223 connects the cold plate 13 on the server 11a and the second liquid cooling pipe H2 in the heat exchanger 221 to form a liquid cooling channel for the flow of the second liquid cooling medium. Accordingly, the heat exchanger 221 is used to exchange heat between the first liquid cooling medium in the first liquid cooling pipe H1 and the second liquid cooling medium in the second liquid cooling pipe H2.

[0106] In some embodiments, continue to refer to Figure 2 and combined Figure 3The first liquid cooling device 222 includes multiple pipelines connected to the first immersion liquid cooling device 12, including at least one liquid supply pipeline and at least one liquid return pipeline of the first immersion liquid cooling device 12. The second liquid cooling device 223 includes a pipeline network connected to the cold plate 13, the pipeline network including multiple pipelines (also referred to as manifolds), including at least one liquid supply pipeline and at least one liquid return pipeline of the cold plate 13.

[0107] The liquid cooling cabinet 2 also includes a liquid inlet I1 and a liquid return port O1, which can be connected to the second liquid cooling device 223. Specifically, the liquid inlet I1 can be connected to the liquid supply pipeline of the cold plate 13, and the liquid return port O1 can be connected to the liquid return pipeline of the cold plate 13. Furthermore, the liquid inlet I1 and the liquid return port O1 can connect the second liquid cooling device 223 to the liquid cooling distribution unit 3 outside the liquid cooling cabinet 2. Figure 1 The two liquid cooling media are connected to provide a heat exchange channel for the second liquid cooling medium, so that the second liquid cooling medium can exchange heat outside the liquid cooling cabinet 2.

[0108] Thus, the second liquid cooling medium can exchange heat outside the liquid cooling cabinet 2, meaning the second liquid cooling device 223 can be an external circulation pipe connected to the outside of the liquid cooling cabinet 2. The first liquid cooling medium can exchange heat inside the liquid cooling cabinet 2, meaning the first liquid cooling device 222 can be an internal circulation pipe inside the liquid cooling cabinet 2. This allows for the simultaneous use of immersion liquid cooling and cold plate liquid cooling methods, while the liquid cooling cabinet 2 only needs one liquid inlet I1 and one liquid return outlet O1. In other words, only one supply pipe and one return pipe are needed between the liquid cooling cabinet 2 and the liquid cooling distribution unit 3. This simplifies the liquid cooling piping setup outside the liquid cooling cabinet 2 and reduces the control complexity of the liquid cooling cabinet 2.

[0109] In some embodiments, the first liquid cooling device 222 and the first immersion liquid cooling device 12 can be connected by a connection structure (e.g., quick connector). In the second liquid cooling device 223, the pipes located inside the first immersion liquid cooling device 12 and the pipes located outside the first immersion liquid cooling device 12 can be connected by a connection structure (e.g., quick connector).

[0110] In some embodiments, the first immersion liquid cooling device 12 can be an immersion liquid cooling shell, also known as a tank shell.

[0111] In some embodiments, the first cooling medium may be a fluorinated liquid, etc. The second cooling medium may be water (e.g., deionized water), etc. It should be noted that this application does not impose any limitations on the specific composition of the first and second cooling media.

[0112] In some embodiments, continue to refer to Figure 2 and combined Figure 3 , Figure 4 The liquid-cooled cabinet 2 may also house a second immersion liquid-cooling device 14, in which the power supply 23 may be located. Furthermore, the first liquid-cooling device 222 is used to connect the second immersion liquid-cooling device 14 and the first liquid-cooling pipe H1 in the heat exchanger 221. For example, the second immersion liquid-cooling device 14 may be located at the top of the liquid-cooled cabinet 2. Thus, immersing the power supply 23 in the liquid-cooling medium within the second immersion liquid-cooling device 14 improves the heat dissipation effect of the power supply 23.

[0113] In some embodiments, continue to refer to Figure 2 and combined Figure 3 The power busbar 24 extends along the height of the liquid-cooled cabinet 2 and is electrically connected to the power supply 23 to transmit power output from the power supply 23 to the server 11a. At least a portion of the liquid supply pipe of the first immersion liquid cooling device 12 in the first liquid cooling unit 222 is a grooved pipe, which covers the power busbar 24. A grooved pipe refers to a pipe with a groove on its outer shell, which covers at least a portion of the surface of the power busbar 24. This increases the contact area between the power busbar 24 and the grooved pipe, and utilizes the first liquid cooling medium within the grooved pipe for heat dissipation, thereby improving the heat dissipation efficiency of the power busbar 24 and addressing the current problem of poor heat dissipation in the power busbar 24.

[0114] In some embodiments, continue to refer to Figure 4 The liquid cooling assembly 22 also includes a control board 224 (as an example of a first controller), and the piping network of the second liquid cooling device 223 may further include at least one valve for controlling the on / off state of multiple pipes. Figures 2-5 (omitted). The control board 224 can be used to control the on / off state of at least one valve according to the power consumption of the liquid cooling cabinet 2. For the sake of continuity, the specific structure and control process of the piping network and valves in the second liquid cooling device 223 will be described in the following embodiments, and will not be elaborated here.

[0115] In some embodiments, the liquid-cooled cabinet 2 also includes a central controller (omitted in the figure as an example of a second controller). The central controller is used to determine the overall power consumption of the liquid-cooled cabinet 2 and send the power consumption to the control board 224. Specifically, the central controller can be used to receive power consumption signals sent by each server control board 15 and determine the overall power consumption of the liquid-cooled cabinet 2 based on the power consumption signals sent by each server control board 15.

[0116] In some embodiments, the central controller may be a rack management unit, such as the RM211 rack management unit. The central controller is used to monitor and manage the electronic equipment in the liquid-cooled cabinet 2, ensuring stable operation of the electronic equipment and optimizing energy efficiency.

[0117] In some embodiments, the bottom of the liquid cooling cabinet 2 may be provided with a receiving space, which may be referred to as an immersion embedding unit, and the immersion embedding unit may be used to accommodate the heat exchanger 221 and the control board 224.

[0118] It is understood that in the aforementioned liquid-cooled cabinet 2, by setting up heat exchanger 221, first liquid cooling device 222, and second liquid cooling device 223, heat exchange between the first liquid cooling medium and the second liquid cooling medium can be achieved within the liquid-cooled cabinet 2. This simplifies the liquid cooling piping of the liquid-cooled cabinet 2, thereby standardizing the control interface of the liquid-cooled cabinet 2 and simplifying the control system of the computer room 001. Furthermore, the structure of the aforementioned liquid-cooled cabinet 2 can be deployed using existing cold-plate liquid-cooled cabinets, improving the ease of modification and saving modification costs. In addition, by setting up the second immersion liquid cooling device 14 and the channel-type piping, the heat dissipation efficiency of the power supply 23 and the power bus 24 can be improved. Therefore, the overall heat dissipation effect of the aforementioned liquid-cooled cabinet 2 can be improved.

[0119] The following is combined Figures 6-8 The specific piping structure and heat dissipation strategy of a liquid cooling component according to this application are described in detail.

[0120] Figures 6-8 The diagram shows three different liquid cooling channels and their corresponding heat dissipation strategies in the same piping structure of the liquid cooling assembly 22.

[0121] Firstly Figure 6 The specific piping structure of the liquid cooling component 22 will be described in detail using this example.

[0122] It should be noted that, Figures 6-8 The specific structure of the liquid cooling component 22 is the same, therefore Figure 7 and Figure 8 The structure can be referenced in Figure 6 The relevant descriptions will not be repeated below.

[0123] The first liquid cooling device 222 will be introduced below.

[0124] refer to Figure 6 and combined Figure 2 The first liquid cooling device 222 includes a first pipeline L1 and a second pipeline L2, the first pipeline L1 and the first immersion liquid cooling device 12 ( Figure 6(The text is omitted here.) The second pipe L2 and the first liquid cooling pipe H1 are connected in sequence. The first liquid cooling pipe H1 is connected to the first pipe L1 to form a circulation channel for the flow of the first liquid cooling medium. It can be understood that the first liquid cooling device 222 is an internal circulation pipe inside the liquid cooling cabinet 2 and is not connected to the outside of the liquid cooling cabinet 2.

[0125] In some embodiments, continue to refer to Figure 6 A first liquid pump 225 (e.g., a fluorine pump) may also be provided in the circulation channel. The first liquid pump can be located inside the first immersion liquid cooling device 12 to control the rate at which the first liquid cooling medium enters the first immersion liquid cooling device 12. Exemplarily, the first liquid pump can be located on the connection structure between the first immersion liquid cooling device 12 and the first liquid cooling unit 222. Furthermore, the on / off state of the first liquid pump can be controlled by… Figure 4 The server control panel 15 shown is used for control.

[0126] In other embodiments, the first liquid pump may also be located outside the first immersion liquid cooling device 12. In this case, the first liquid pump can be a master pump that controls the total rate of the first liquid cooling medium. Exemplarily, the first liquid pump may be located at the bottom of the liquid cooling cabinet 2, for example, it may be located in the immersion embedded unit.

[0127] In some embodiments, continue to refer to Figure 6 The first liquid cooling device 222 may also include a temperature sensor 226a and a pressure sensor 226b. By setting the temperature sensor 226a and the pressure sensor 226b, the temperature and pressure of the first liquid cooling medium can be monitored in real time, thereby helping to ensure the normal operation of the liquid cooling component 22.

[0128] For example, a temperature sensor 226a and a pressure sensor 226b can be installed in the first pipeline L1, and a temperature sensor 226a and a pressure sensor 226b can be installed in the second pipeline L2 to achieve comprehensive monitoring of temperature and pressure in the supply and return pipelines. It should be noted that the above... Figure 6 This illustration merely illustrates one arrangement of temperature sensor 226a and pressure sensor 226b and does not constitute a limitation of this application. In other embodiments, the temperature sensor 226a and pressure sensor 226b on the pipeline network may have other arrangements and may be in other numbers (e.g., one, three, four, or five, etc.).

[0129] In some embodiments, continue to refer to Figure 6The first liquid cooling device 222 may further include a replenishment tank 227a, a liquid level sensing component 227b, and a replenishment pump 227c. The replenishment tank 227a can be connected to the first pipeline L1. The replenishment tank 227a stores liquid cooling medium, thereby supplying liquid cooling medium to the first pipeline L1, allowing the liquid cooling medium to circulate within the internal circulation channel formed by the first pipeline L1, the first immersion liquid cooling device 12, the second pipeline L2, and the first liquid cooling pipe H1. Furthermore, during the heat dissipation process of the first liquid cooling device 222 on the server 11a, the amount of the first liquid cooling medium will decrease due to evaporation. At this time, the replenishment tank 227a can also replenish the first liquid cooling medium to the first pipeline L1, thereby ensuring sufficient supply of the first liquid cooling medium in the circulation channel, thus maintaining the heat dissipation effect of the server 11a and the safety of the first liquid cooling device 222.

[0130] The liquid level sensing component 227b can be located inside the replenishment tank 227a. The liquid level sensing component 227b can monitor the liquid level of the liquid cooling medium in the replenishment tank 227a, so that the liquid cooling medium can be automatically replenished by the liquid replenishment actuator when the liquid level is too low, or the operator can manually replenish the liquid cooling medium in the replenishment tank 227a to ensure that the liquid cooling medium in the replenishment tank 227a is sufficient.

[0131] The replenishment pump 227c can be located between the replenishment tank 227a and the first pipeline L1. The replenishment pump 227c is used to drive the liquid cooling medium in the replenishment tank 227a to flow to the first pipeline L1, so that the replenishment tank 227a can supply liquid cooling medium to the first pipeline L1, and thus the liquid cooling medium can circulate in the internal circulation channel formed by the first pipeline L1, the first immersion liquid cooling device 12, the second pipeline L2 and the first liquid cooling pipe H1.

[0132] In some embodiments, continue to refer to Figure 6 The first liquid cooling device 222 may further include an expansion tank 228, which is connected to the first pipeline L1. The expansion tank 228 is used to stabilize pressure fluctuations in the internal circulation channel. For example, when the volume of the liquid cooling medium in the internal circulation channel increases due to temperature rise, the expansion tank 228 can absorb the excess liquid cooling medium through the first pipeline L1 to prevent the pressure of the liquid cooling medium in the internal circulation channel from rising too quickly; when the volume of the liquid cooling medium in the internal circulation channel decreases due to temperature drop, the expansion tank 228 can release the liquid cooling medium into the first pipeline L1, thereby replenishing the liquid cooling medium in the first pipeline L1 and preventing the pressure of the liquid cooling medium in the internal circulation channel from dropping too quickly.

[0133] In some embodiments, continue to refer to Figure 6The first liquid cooling device 222 may further include a chuck 229, which may be disposed in the first pipeline L1 and the second pipeline L2. The chuck 229 is used to adjust the rate and flow rate of the liquid cooling medium in the first pipeline L1 and the second pipeline L2 to improve the heat dissipation effect of the first liquid cooling device 222 on the server.

[0134] The second liquid cooling device 223 will be described below.

[0135] Continue to refer to Figure 6 and combined Figure 2 The second liquid cooling device 223 includes a piping network, which comprises multiple pipes and at least one valve for controlling the on / off state of the multiple pipes. When the at least one valve is in different on / off states, the piping network and the cold plate 13 form different liquid cooling channels for the flow of the second liquid cooling medium, and the second liquid cooling medium in the different liquid cooling channels has different heat exchange efficiencies with the first liquid cooling medium.

[0136] In this way, the heat dissipation rate of the first liquid cooling medium can be controlled according to different situations (e.g., based on the different total power consumption of the liquid-cooled cabinet 2). For example, when the power consumption of the liquid-cooled cabinet 2 is low, the heat dissipation rate of the first liquid cooling medium can be slowed down by setting up liquid cooling channels, at which time the power consumption of the liquid cooling component 22 is low. When the power consumption of the liquid-cooled cabinet 2 is high, the heat dissipation rate of the first liquid cooling medium can be accelerated by setting up liquid cooling channels, at which time the power consumption of the liquid cooling component 22 is high. Thus, it is possible to adjust the energy consumption of the liquid cooling component 22 according to the power consumption of the liquid-cooled cabinet 2, thereby achieving energy saving of the liquid cooling component 22.

[0137] Before introducing the different on / off states of the valves and the different liquid cooling channels through which the second liquid cooling medium flows, we will first give a detailed introduction to a specific structure of the pipeline network and valves in the second liquid cooling device 223.

[0138] It should be noted that this application does not impose any restrictions on the structure of the pipeline network and valves in the second liquid cooling device 223, and those skilled in the art can make other structural settings and modifications according to actual needs.

[0139] Continue to refer to Figure 6 The pipeline network may include the first pipe segment P1, the second pipe segment P2, the third pipe segment P3, the fourth pipe segment P4, the fifth pipe segment P5, the sixth pipe segment P6, the seventh pipe segment P7, the eighth pipe segment P8, the ninth pipe segment P9, the tenth pipe segment P10, the eleventh pipe segment P11, and the twelfth pipe segment P12. Figure 6 In the text, for ease of understanding, the ends of the pipe sections are marked with solid dots.

[0140] The following uses the pipeline network connected to server 11a as an example to illustrate the connection relationship of each pipeline segment. The connection relationship of pipelines on other servers is the same as that of server 11a.

[0141] Specifically, the first end of the first pipe segment P1 is connected to the liquid inlet I1 of the piping network, and the second end is connected to the first end of the second pipe segment P2. The second end of the second pipe segment P2 is connected to the first end of the third pipe segment P3. The second end of the third pipe segment P3 is connected to the first end of the second liquid cooling pipe H2. The first end of the fourth pipe segment P4 is connected to the second end of the second liquid cooling pipe H2, and the second end of the fourth pipe segment P4 is connected to the first end of the fifth pipe segment P5. The second end of the fifth pipe segment P5 is connected to the first end of the sixth pipe segment P6. The second end of the sixth pipe segment P6 is connected to the cold plate 13 on the server 11a. Figure 2 The first end of the seventh pipe segment P7 is connected to the second end of the cold plate 13 on server 11a, and the second end of the seventh pipe segment P7 is connected to the first end of the eighth pipe segment P8. The second end of the eighth pipe segment P8 is connected to the first end of the ninth pipe segment P9. The second end of the ninth pipe segment P9 is connected to the return port O1 of the pipeline network. The first end of the tenth pipe segment P10 is connected to the second ends of the first pipe segment P1 and the second pipe segment P2, and the second end is connected to the second ends of the fifth pipe segment P5 and the sixth pipe segment P6. The first end of the eleventh pipe segment P11 is connected to the second ends of the seventh pipe segment P7 and the eighth pipe segment P8, and the second end is connected to the second ends of the fourth pipe segment P4 and the fifth pipe segment P5. The first end of the twelfth pipe segment P12 is connected to the second ends of the second pipe segment P2 and the third pipe segment P3, and the second end is connected to the second ends of the eighth pipe segment P8 and the ninth pipe segment P9.

[0142] Continue to refer to Figure 6 The pipeline network includes at least one valve, comprising a first valve S1, a second valve S2, a third valve S3, a fourth valve S4, and a fifth valve S5. Specifically, the first valve S1 is located on the twelfth pipe segment P12, the second valve S2 is located on the second pipe segment P2, the third valve S3 is located on the eleventh pipe segment P11, the fourth valve S4 is located on the fifth pipe segment P5, and the fifth valve S5 is located on the tenth pipe segment P10.

[0143] It should be noted that this application does not impose any restrictions on the number of pipe sections, connection structures, or the number and location of valves. Those skilled in the art can make appropriate structural settings according to actual needs.

[0144] In some embodiments, continue to refer to Figure 6 The piping network can also be equipped with a proportional valve S6, which can be installed on the sixth pipe section P6. By adjusting the opening of the proportional valve S6, the flow rate of the liquid cooling medium in the sixth pipe section P6 can be adjusted to meet the actual heat dissipation requirements.

[0145] It should be noted that the above Figure 6This illustration only shows one possible arrangement of the proportional valve S6 and does not constitute a limitation of this application. In some other embodiments, the proportional valve S6 may also be located in other pipe sections of the pipeline network. In other embodiments, there may be multiple proportional valves S6, each located in a different pipe section of the pipeline network. For example, there may be two proportional valves S6, located in the sixth pipe section P6 and the ninth pipe section P9, respectively.

[0146] In some embodiments, a proportional-integral-derivative (PID) control mode can be used to adjust the opening of the proportional valve S6, thereby controlling the flow rate of the liquid cooling medium in the sixth pipe section P6. The PID control mode can adjust the control quantity based on the real-time difference between the setpoint and the actual output value to improve control accuracy.

[0147] In some embodiments, continue to refer to Figure 6 The piping network can also be equipped with temperature sensor 226a and pressure sensor 226b. By setting temperature sensor 226a and pressure sensor 226b, the temperature and pressure of the liquid cooling medium in the piping network can be monitored in real time, which helps to ensure the normal operation of the liquid cooling component 22.

[0148] For example, temperature sensor 226a and pressure sensor 226b can be installed on the first pipe section P1. It should be noted that the above... Figure 6 This illustration merely illustrates one arrangement of temperature sensor 226a and pressure sensor 226b and does not constitute a limitation of this application. In other embodiments, temperature sensor 226a and pressure sensor 226b can also be installed in other pipe sections on the pipeline network, and the number can be multiple (e.g., two, three, four, or five). Therefore, if one of the temperature sensor 226a or pressure sensor 226b fails, other temperature and pressure sensors can immediately take over, ensuring real-time monitoring of the temperature and pressure of the liquid cooling medium within the pipeline network.

[0149] In some embodiments, continue to refer to Figure 6The control board 224 can be used to precisely adjust and manage the operating status of the aforementioned components. For example, the control board 224 can be used to control valves S1-S5, proportional valve S6, temperature sensor 226a, pressure sensor 226b, and liquid level sensing assembly 227b. By centrally controlling these key components, the control board 224 can automatically adjust parameters such as flow rate, temperature, pressure, and liquid level in the liquid cooling path according to the system's operating requirements, achieving refined management within the liquid cooling cabinet 2. Therefore, by setting the control board 224 in the liquid cooling assembly 22, it can not only respond to the dynamic changes in the liquid cooling pipeline in real time, but also optimize cooling performance through intelligent algorithms, ensuring that the heat dissipation requirements of the liquid cooling cabinet 2 are met under different workloads. In addition, unified control simplifies the control logic within the liquid cooling cabinet 2, reduces the complex adjustment of individual components, and improves the reliability and maintenance efficiency of the liquid cooling cabinet 2.

[0150] The following are combined with Figures 6-8 The three heat dissipation strategies of liquid-cooled cabinet 2 are described in detail.

[0151] As mentioned earlier, valves S1-S5 in different on / off states can create different liquid cooling channels in the piping network, thereby altering the heat exchange efficiency of the first liquid cooling medium. For example, it can change the power consumption of the liquid cooling component 22 under different load power consumption of the liquid cooling cabinet 2, thus achieving energy saving of the liquid cooling component 22.

[0152] First, combine Figure 6 The heat dissipation strategy of the first type of liquid-cooled cabinet 2 is described in detail.

[0153] refer to Figure 6 , Figure 6 When the liquid-cooled cabinet 2 is at full load power consumption (as an example of the first power consumption), the control board 224 controls at least one valve to be in a first state for heat dissipation strategy. Here, the full load power consumption of the liquid-cooled cabinet 2 refers to the power consumption of the entire liquid-cooled cabinet 2 when all electronic devices (such as servers, storage devices, switches, etc.) in the liquid-cooled cabinet 2 reach their maximum workload.

[0154] In some other embodiments, Figure 6 It can also be used to deal with situations where the liquid-cooled cabinet 2 is under high load power consumption. High load power consumption refers to the power consumption generated when most of the load is running in the liquid-cooled cabinet 2.

[0155] When at least one valve is in the first state, the second valve S2 and the fourth valve S4 are in the open state, and the first valve S1, the third valve S3, and the fifth valve S5 are in the closed state. At this time, the piping network forms the third pipe L3, the fourth pipe L4, and the fifth pipe L5. The piping network includes the liquid inlet I1, the third pipe L3, the second liquid cooling pipe H2, the fourth pipe L4, and the cold plate 13. Figure 2 The fifth pipeline L5 and the return port O1 of the pipeline network are connected in sequence to form a first channel for the flow of the second liquid cooling medium.

[0156] The following section introduces the heat dissipation strategy of liquid-cooled cabinet 2 under full load power consumption as an example.

[0157] When the liquid-cooled cabinet 2 is operating at full power, its heat dissipation strategy is as follows: The second liquid cooling medium (e.g., working fluid water) enters the third pipe L3 through the inlet I1, and then first enters the second liquid cooling pipe H2 of the heat exchanger 221 to cool the first liquid cooling medium (e.g., fluorinated liquid) in the first liquid cooling pipe H1 of the heat exchanger 221. After exiting the second liquid cooling pipe H2, the second liquid cooling medium enters the cold plate 13 on the server 11a via the fourth pipe L4 to dissipate heat from the high-heat components in the server 11a. Then, after exiting the cold plate 13, the second liquid cooling medium returns to the outside of the liquid-cooled cabinet 2 via the fifth pipe L5 and the return port O1.

[0158] In the above heat dissipation strategy, the second liquid cooling medium first enters the heat exchanger 221 to exchange heat with the first liquid cooling medium, reducing the temperature of the first liquid cooling medium. Then, the server 11a is cooled by the cold plate 13. This process utilizes the lower temperature characteristic of the second liquid cooling medium to improve the heat exchange efficiency of the first liquid cooling medium. Specifically, because the second liquid cooling medium has a lower temperature, it can quickly absorb heat from the first liquid cooling medium, thereby effectively reducing the temperature of the first liquid cooling medium and improving the heat exchange efficiency between the first and second liquid cooling media, further enhancing the overall heat dissipation performance of the liquid cooling assembly 22. In the above heat dissipation strategy, under full-load power consumption of the liquid-cooled cabinet 2, the heat generated by the electronic equipment in the liquid-cooled cabinet 2 increases significantly. The liquid cooling assembly 22 can withstand higher heat dissipation demands, thus not only improving heat exchange efficiency but also enhancing the stability and heat dissipation capacity of the liquid-cooled cabinet 2 under high power consumption conditions, extending the service life of the server 11a and improving the overall operating efficiency of the server 11a.

[0159] In some embodiments, the control board 224 can also control the rotation speed of the first liquid pump 225 based on the power consumption and temperature of some components in the server 11a (e.g., temperature-sensitive components such as capacitors and resistors), for example, by using a PID algorithm to control the rotation speed of the first liquid pump 225. This increases the flow rate of the first liquid cooling medium in the circulation channel of the first liquid cooling device 222, thereby increasing the rate at which the first liquid cooling medium enters the heat exchanger 221, and further accelerating the heat dissipation efficiency of the first liquid cooling medium to meet the heat dissipation requirements of low-heat components in the server 11a.

[0160] The following is combined Figure 7 The heat dissipation strategy of the second type of liquid-cooled cabinet 2 is described in detail.

[0161] refer to Figure 7 , Figure 7 When the liquid-cooled cabinet 2 is in standby power consumption (as an example of a second power consumption), the control board 224 controls at least one valve to be in a second state for a heat dissipation strategy. Here, the standby power consumption of the liquid-cooled cabinet 2 refers to the power consumption of the entire liquid-cooled cabinet 2 when all electronic devices (such as servers, storage devices, switches, etc.) in the liquid-cooled cabinet 2 are in standby mode. It can be understood that standby power consumption is less than full-load power consumption.

[0162] In some other embodiments, Figure 7 It can also be used to deal with the situation where the liquid-cooled cabinet 2 is under low load power consumption. Low load power consumption refers to the power consumption generated when a small portion of the load is running in the liquid-cooled cabinet 2.

[0163] When at least one valve is in the second state, the fifth valve S5 is open, and the first valve S1, second valve S2, third valve S3, and fourth valve S4 are closed. At this time, the pipeline network forms the sixth pipeline L6 and the seventh pipeline L7, wherein the inlet I1 of the pipeline network, the sixth pipeline L6, and the cold plate 13 ( Figure 2 The seventh pipe L7 and the return port O1 of the pipe network are connected in sequence to form a second channel for the flow of the second liquid cooling medium.

[0164] The following section uses the standby power consumption of liquid-cooled cabinet 2 as an example to introduce the heat dissipation strategy of liquid-cooled cabinet 2.

[0165] When the liquid-cooled cabinet 2 is in standby power consumption, the corresponding heat dissipation strategy of the liquid-cooled cabinet 2 is as follows: the second liquid cooling medium (e.g., working fluid water) enters the sixth pipe L6 from the inlet I1 and then directly enters the cold plate 13 on the server 11a to dissipate heat from the high-heat components in the server 11a. Then, after the second liquid cooling medium exits from the cold plate 13, it returns to the outside of the liquid-cooled cabinet 2 via the seventh pipe L7 and the return port O1.

[0166] In the above heat dissipation strategy, the second liquid cooling medium does not enter the heat exchanger 221 (or is referred to as the second liquid cooling medium bypass heat exchanger 221). At this time, the first liquid cooling medium does not exchange heat but intermittently stores heat within the circulation channel. This process can temporarily stop the heat exchange between the first and second liquid cooling media when the power consumption of the liquid-cooled cabinet 2 is low, i.e., when the liquid-cooled cabinet 2 is in standby mode or operating under low load. Since the server 11a generates less heat in this situation, the heat absorbed by the first liquid cooling medium is naturally greatly reduced. In this case, the first liquid cooling medium does not need to exchange heat with the second liquid cooling medium, but instead stores the heat within the circulation channel through a heat storage mechanism, forming a certain amount of heat accumulation. Therefore, Figure 7The heat dissipation strategy shown can reduce the operating burden of the liquid cooling component 22, thereby improving energy efficiency and reducing unnecessary energy consumption, and achieving energy-saving control of the computer room 001.

[0167] As the load in liquid-cooled cabinet 2 gradually resumes operation or increases, the generated heat will rise significantly. For example, when liquid-cooled cabinet 2 changes from low load power consumption to high load power consumption, corresponding to the above... Figure 6 As shown, the first liquid cooling medium can begin to enter the heat exchanger and exchange heat with the second liquid cooling medium. Therefore, the liquid cooling component 22 can respond promptly to load fluctuations in the liquid-cooled cabinet 2, ensuring that the second liquid cooling medium can immediately exchange heat when the liquid-cooled cabinet 2 requires higher heat dissipation capacity. This satisfies heat dissipation requirements while avoiding unnecessary energy waste. Therefore, the above heat dissipation strategy not only optimizes the thermal management efficiency of the liquid cooling component 22 but also extends its service life, enabling the liquid-cooled cabinet 2 to maintain good heat dissipation performance under different operating conditions.

[0168] In addition, in some embodiments, the control board 224 can also perform PID control on the proportional valve S6 according to the temperature of some components in the server 11a (such as the main chip and other components that are not conducive to heat dissipation) to dynamically adjust the heat dissipation performance of the cold plate 13 on the server 11a.

[0169] In some embodiments, the control board 224 can also control the rotation speed of the first liquid pump 225 based on the power consumption and temperature of some components (e.g., temperature-sensitive components such as capacitors and resistors) in the server 11a, for example, by using a PID algorithm to control the rotation speed of the first liquid pump 225. This dynamically changes the flow rate of the first liquid cooling medium in the circulation channel of the first liquid cooling device 222, thereby adjusting the rate at which the first liquid cooling medium enters the heat exchanger 221, and thus adjusting the heat dissipation efficiency of the first liquid cooling medium on the server 11a to meet the heat dissipation requirements of low-heat components in the server 11a.

[0170] The following is combined Figure 8 The heat dissipation strategy of the third type of liquid-cooled cabinet 2 is described in detail.

[0171] refer to Figure 8 , Figure 8 When the liquid-cooled cabinet 2 is in the third power consumption state (as an example of the first power consumption), the control board 224 controls at least one valve to be in the third state for a heat dissipation strategy. The third power consumption of the liquid-cooled cabinet 2 can be less than... Figure 6 The power consumption (e.g., full-load power consumption) of the liquid-cooled cabinet 2 is greater than... Figure 7 The power consumption (e.g., standby power consumption) of the liquid-cooled cabinet 2.

[0172] For example, the third power consumption of liquid-cooled cabinet 2 can correspond to the power consumption generated when part of the load in liquid-cooled cabinet 2 is running and the other part of the load is in standby mode.

[0173] When at least one valve is in the third state, the first valve S1, the third valve S3, and the fifth valve S5 are open, and the second valve S2 and the fourth valve S4 are closed. At this time, the pipeline network forms the eighth pipeline L8, the ninth pipeline L9, and the tenth pipeline L10. The inlet I1, the eighth pipeline L8, and the cold plate 13 (…) are part of the pipeline network. Figure 2 The ninth pipe L9, the second liquid cooling pipe H2, and the tenth pipe L10 are connected in sequence to form a third channel for the flow of the second liquid cooling medium.

[0174] The following describes the heat dissipation strategy for liquid-cooled cabinet 2 when it is at the third power consumption level.

[0175] When the liquid-cooled cabinet 2 is in the third power consumption state, the corresponding heat dissipation strategy of the liquid-cooled cabinet 2 is as follows: the second liquid cooling medium (e.g., working fluid water) enters the eighth pipe L8 from the inlet I1, and first enters the cold plate 13 to dissipate heat from the high-heat components in the server 11a. Then, after exiting the cold plate 13, the second liquid cooling medium enters the second liquid cooling pipe H2 via the ninth pipe L9 to cool the first liquid cooling medium (e.g., fluorinated liquid) in the first liquid cooling pipe H1 of the heat exchanger 221. Then, after exiting the second liquid cooling pipe H2, the second liquid cooling medium returns to the outside of the liquid-cooled cabinet 2 via the tenth pipe L10 and the return port O1.

[0176] In the aforementioned heat dissipation strategy, the second liquid cooling medium first enters the cold plate 13 to dissipate heat from the server 11a, and then enters the heat exchanger 221 to exchange heat with the first liquid cooling medium, thereby reducing the temperature of the first liquid cooling medium. This process can simultaneously meet the heat dissipation requirements of the server 11a and the temperature regulation requirements of the first liquid cooling medium, thus ensuring the efficient operation of the entire liquid cooling assembly 22. Specifically, when the power consumption of the liquid-cooled cabinet 2 is less than the full-load power consumption, the heat generated by the server 11a is relatively limited and will not overheat. Therefore, the lower-temperature second liquid cooling medium can be used first to meet the heat dissipation requirements of the high-heat components inside the server 11a, thereby effectively reducing the temperature of the high-heat components inside the server 11a. At the same time, the heat absorbed by the second liquid cooling medium is exchanged with the first liquid cooling medium through the heat exchanger, which can reduce the temperature of the first liquid cooling medium, ensuring that the heat dissipation requirements of the low-heat components inside the server 11a are met.

[0177] Understandably, at this point, the heat exchange efficiency of the first liquid cooling medium is lower than that under full-load power consumption, but higher than that under standby power consumption. In this situation, the heat exchange efficiency of the first liquid cooling medium is lower than that under full-load power consumption, but still remains at a relatively high level. It is understandable that the temperature of the first liquid cooling medium can be controlled within a suitable range, avoiding overheating and simultaneously saving energy consumption of the liquid cooling component 22.

[0178] In addition, in some embodiments, the control board 224 can also perform PID control on the proportional valve S6 according to the temperature of some components in the server 11a (such as the main chip and other components that are not conducive to heat dissipation) to dynamically adjust the heat dissipation performance of the cold plate 13 on the server 11a.

[0179] In some embodiments, the control board 224 can also control the rotation speed of the first liquid pump 225 based on the power consumption and temperature of some components (e.g., temperature-sensitive components such as capacitors and resistors) in the server 11a, for example, by using a PID algorithm to control the rotation speed of the first liquid pump 225. This dynamically changes the flow rate of the first liquid cooling medium in the circulation channel of the first liquid cooling device 222, thereby adjusting the rate at which the first liquid cooling medium enters the heat exchanger 221, and thus adjusting the heat dissipation efficiency of the first liquid cooling medium on the server 11a to meet the heat dissipation requirements of low-heat components in the server 11a.

[0180] In summary, by incorporating multiple valves and control boards 224 within the liquid cooling assembly 22, this application enables the implementation of different heat dissipation strategies under varying conditions. For instance, it allows for the configuration of different liquid cooling channels for the liquid cooling medium based on different load conditions, automatically adjusting the heat dissipation efficiency. This allows for dynamic adjustment of the heat dissipation capacity of the liquid-cooled cabinet 2 under different power consumption conditions, thereby avoiding unnecessary energy waste. Therefore, this application can achieve dynamic control of the heat dissipation efficiency of the liquid cooling assembly 2 under different power consumption levels in the liquid-cooled cabinet 2, increasing the diversity and flexibility of the heat dissipation solutions for the liquid-cooled cabinet 2.

[0181] Furthermore, as mentioned above, the rack-mount server 01 provided in this application can be equipped with an immersion liquid-cooled server or a cold plate liquid-cooled server, or it can also be equipped with a liquid-cooled server that utilizes both immersion liquid cooling and cold plate liquid cooling methods (i.e., a hybrid liquid-cooled server). In this way, liquid-cooled servers with different liquid cooling methods can be installed inside the liquid-cooled rack 2 according to actual needs to meet the heat dissipation requirements of different components in the server, thereby improving the heat dissipation effect of the liquid-cooled rack 2. Moreover, in this application, when different liquid cooling methods are used inside the liquid-cooled rack 2, the liquid supply pipeline, liquid return pipeline, and control interface of the liquid-cooled rack can be normalized, thereby reducing the structural cost and control complexity of the data center 001.

[0182] In some embodiments, this application also provides a liquid cooling system, which includes a liquid cooling distribution unit and a liquid cooling cabinet as described in the embodiments of this application. The liquid cooling distribution unit is connected to a second liquid cooling device. The specific structures of the liquid cooling distribution unit and the liquid cooling cabinet can be referred to the above description. Figures 1-5 The descriptions in the relevant embodiments will not be repeated here.

[0183] In some embodiments, the rack-mount server 01 and liquid-cooled cabinet 2 provided in this application can be applied to the above-mentioned... Figure 1 In the liquid cooling heat dissipation scenario shown, it can also be applied to the following: Figure 9 In the liquid cooling heat dissipation scenario shown.

[0184] The following is combined Figure 9 Another liquid cooling scenario for a server is described in some embodiments of this application.

[0185] refer to Figure 9 ,and Figure 1 Compared to the liquid cooling scenario shown, Figure 9 The difference in the liquid cooling scenario shown is that liquid cooling door 4 and its cooling system have been removed. Specifically, Figure 9 The following components can be removed from the configuration: liquid cooling door 4, cooling tower 6, cooling tower 7, chiller unit 8, liquid cooling pipeline 4a, liquid cooling pipeline 4b, liquid cooling pipeline 4c, liquid cooling pipeline 4d, liquid cooling pipeline 4e, liquid cooling pipeline 4f, liquid pump 6a, liquid pump 7a, liquid pump 7b and liquid pump 7c.

[0186] As mentioned above, Figure 1 The liquid cooling door 4 and its cooling system are designed to absorb the heat released into the air by some of the less heat-dissipating components in the server. Therefore, since the rack-mount server 01 and liquid-cooled cabinet 2 provided in this application can improve the server's heat dissipation effect—that is, simultaneously dissipate heat from both high-heat and low-heat components in the server—the liquid cooling door 4 and its cooling system are no longer necessary, further simplifying the cost and control complexity of the data center 001.

[0187] It should be noted that, Figure 9 Other structures in Figure 1 The same applies; please refer to the above. Figure 1 The descriptions in the relevant embodiments will not be repeated here.

[0188] The specific embodiments described above illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0189] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "outer", "inner", "circumferential", "radial", "axial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0190] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0191] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A liquid-cooled cabinet, characterized in that, Includes a cabinet and a liquid cooling assembly, wherein the liquid cooling assembly includes: Heat exchanger; The first liquid cooling device is used to connect the first immersion liquid cooling equipment on the server mounted in the cabinet and the first liquid cooling pipe in the heat exchanger to form a liquid cooling channel for the flow of the first liquid cooling medium. The second liquid cooling device is used to connect the cold plate on the server mounted in the cabinet and the second liquid cooling pipe in the heat exchanger to form a liquid cooling channel for the flow of the second liquid cooling medium. The heat exchanger is used to exchange heat between the first liquid cooling medium in the first liquid cooling pipe and the second liquid cooling medium in the second liquid cooling pipe.

2. The liquid-cooled cabinet according to claim 1, characterized in that, The second liquid cooling device includes a piping network, which includes multiple pipes and at least one valve for controlling the on / off state of the multiple pipes; When the at least one valve is in different on / off states, the piping network and the cold plate form different liquid cooling channels for the second liquid cooling medium to flow through, and the second liquid cooling medium in the different liquid cooling channels has different heat exchange efficiencies than the first liquid cooling medium.

3. The liquid-cooled cabinet according to claim 1 or 2, characterized in that, The first liquid cooling device includes a first pipeline and a second pipeline. The first pipeline, the first immersion liquid cooling device, the second pipeline and the first liquid cooling pipe are connected in sequence. The first liquid cooling pipe is connected to the first pipeline to form a circulation channel for the first liquid cooling medium to circulate.

4. The liquid-cooled cabinet according to claim 3, characterized in that, The liquid-cooled cabinet also includes a power supply located inside the cabinet, and the first liquid-cooling device is also used to connect a second immersion liquid-cooling device on the power supply and a first liquid-cooling pipe in the heat exchanger.

5. The liquid-cooled cabinet according to claim 4, characterized in that, The liquid-cooled cabinet also includes a power busbar, which is electrically connected to the power supply. At least a portion of the first conduit is a trough-shaped conduit, which covers the power busbar.

6. The liquid-cooled cabinet according to claim 3, characterized in that, The circulation channel is also equipped with a first liquid pump.

7. The liquid-cooled cabinet according to claim 6, characterized in that, The first liquid pump is located inside the first immersion liquid cooling device.

8. The liquid-cooled cabinet according to claim 2, characterized in that, When the at least one valve is in the first state, the pipeline network forms a third pipeline, a fourth pipeline, and a fifth pipeline, wherein the liquid inlet of the pipeline network, the third pipeline, the second liquid cooling pipeline, the fourth pipeline, the cold plate, the fifth pipeline, and the liquid return port of the pipeline network are connected in sequence to form a first channel for the flow of the second liquid cooling medium.

9. The liquid-cooled cabinet according to claim 2, characterized in that, When the at least one valve is in the second state, the pipeline network forms a sixth pipeline and a seventh pipeline, wherein the liquid inlet of the pipeline network, the sixth pipeline, the cold plate, the seventh pipeline and the liquid return port of the pipeline network are connected in sequence to form a second channel for the flow of the second liquid cooling medium.

10. The liquid-cooled cabinet according to claim 2, characterized in that, When the at least one valve is in the third state, the pipeline network forms an eighth pipeline, a ninth pipeline, and a tenth pipeline, wherein the liquid inlet of the pipeline network, the eighth pipeline, the cold plate, the ninth pipeline, the second liquid cooling pipeline, and the tenth pipeline are connected in sequence to form a third channel for the flow of the second liquid cooling medium.

11. The liquid-cooled cabinet according to any one of claims 2, 8 to 10, characterized in that, The liquid-cooled cabinet also includes a first controller, which is used to control the opening and closing status of at least one valve according to the power consumption of the liquid-cooled cabinet.

12. The liquid-cooled cabinet according to claim 11, characterized in that, The first controller controls the opening and closing state of at least one valve based on the power consumption of the liquid-cooled cabinet, including: When the liquid-cooled cabinet is at a first power consumption level, the first controller controls the at least one valve to be in a first state; When the liquid-cooled cabinet is in the second power consumption state, the first controller controls the at least one valve to be in the second state; Wherein, the first power consumption is greater than the second power consumption.

13. The liquid-cooled cabinet according to claim 12, characterized in that, The first power consumption is the full-load power consumption, and the second power consumption is the standby power consumption.

14. The liquid-cooled cabinet according to claim 11, characterized in that, The liquid-cooled cabinet also includes a second controller, which is used to determine the power consumption of the liquid-cooled cabinet and send the power consumption to the first controller.

15. A rack-mount server, characterized in that, It includes a first liquid-cooled server and a liquid-cooled cabinet as described in any one of claims 1 to 14; the first liquid-cooled server is located in the liquid-cooled cabinet, and the first liquid-cooled server is an immersion liquid-cooled server or a cold plate liquid-cooled server.

16. The rack-mount server according to claim 15, characterized in that, The rack-mount server also includes a second liquid-cooled server; the second liquid-cooled server is located in the liquid-cooled cabinet, and the liquid cooling method of the second liquid-cooled server includes immersion liquid cooling and cold plate liquid cooling.

17. A liquid cooling system, characterized in that, include: The liquid cooling distribution unit and the liquid cooling cabinet according to any one of claims 1 to 14, wherein the liquid cooling distribution unit is connected to the second liquid cooling device.

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