Cold-rolled steel plates and electronic devices

Abstract

This invention discloses a cold plate for thermally coupling to a heat source on a motherboard via a thermal interface material. The cold plate has a liquid inlet channel, a heat exchange chamber, an outer flow channel, and a liquid outlet channel. The heat exchange chamber is connected to the liquid inlet channel. The outer flow channel is connected to the liquid inlet channel and surrounds the heat exchange chamber. The liquid outlet channel connects the heat exchange chamber and the outer flow channel.

Description

Technical Field

[0001] This invention relates to a cold plate and an electronic device. Background Technology

[0002] Liquid metal is a relatively new thermal interface material with a high thermal conductivity. However, due to its high electrical conductivity and fluidity, if proper protective measures are not taken and liquid metal spills from a chip and comes into contact with surrounding electronic components, it can cause damage.

[0003] To prevent liquid metal spillage, a common solution is to coat the chip with resin, which protects surrounding components and also acts as a barrier to prevent liquid metal from leaking out of the chip area. Adding a heatsink module then seals the liquid metal between the chip and the heatsink.

[0004] While adding a resin enclosure can significantly reduce the likelihood of overflow, if the resin surface becomes uneven during coating due to factors such as surface roughness around the chip, insufficient sealing between the resin and the heat dissipation module can allow liquid metal to leak out from tiny gaps. Therefore, researchers in this field are currently working to address these issues. Summary of the Invention

[0005] The present invention provides a cold plate and an electronic device that can prevent liquid metal from overflowing from the gap between the heat dissipation module and the resin, so as to ensure that the liquid metal does not come into contact with the electronic components around the chip.

[0006] An embodiment of the present invention discloses a cold plate for thermally coupling to a heat source on a motherboard via a thermal interface material. The cold plate has a liquid inlet channel, a heat exchange chamber, a peripheral flow channel, and a liquid outlet channel. The heat exchange chamber is connected to the liquid inlet channel. The peripheral flow channel is connected to the liquid inlet channel and surrounds the heat exchange chamber. The liquid outlet channel connects the heat exchange chamber and the peripheral flow channel.

[0007] Another embodiment of the present invention discloses an electronic device comprising a motherboard module. The motherboard module includes a motherboard, a thermal interface material, and a cold plate. The motherboard includes a circuit board and a heat source, the heat source being disposed on the circuit board. The cold plate is thermally coupled to the heat source of the motherboard through the thermal interface material. The cold plate has a liquid inlet channel, a heat exchange chamber, a peripheral flow channel, and a liquid outlet channel. The heat exchange chamber is connected to the liquid inlet channel. The peripheral flow channel is connected to the liquid inlet channel and surrounds the heat exchange chamber. The liquid outlet channel connects the heat exchange chamber and the peripheral flow channel.

[0008] According to the cold plate and electronic device disclosed in the above embodiments, the heat exchange chamber and the peripheral flow channel of the cold plate are connected to the inlet channel and the outlet channel, and the configuration of the peripheral flow channel surrounding the heat exchange chamber allows the low-temperature working fluid entering the cold plate from the inlet channel to flow in the peripheral flow channel. Therefore, the outer thermal interface material can solidify into a solid state when it flows to the part where the peripheral flow channel of the cold plate is located, forming a wall to prevent the inner thermal interface material from continuing to flow outward, thus ensuring that the thermal interface material does not come into contact with the electronic components around the heat source.

[0009] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0010] Figure 1 This is a partial cross-sectional view of an electronic device according to some embodiments of the present invention;

[0011] Figure 2 This is an exploded cross-sectional view of a motherboard module according to some embodiments of the present invention;

[0012] Figure 3 This is a top view of a cold plate according to some embodiments of the present invention;

[0013] Figure 4 This is a schematic diagram showing the cold plate of the motherboard module placed on the motherboard in some embodiments of the present invention;

[0014] Figure 5 This is a schematic diagram of the flow of thermal interface material on the motherboard after the cold plate is pressed down in some embodiments of the present invention.

[0015] Symbol Explanation

[0016] 1: Electronic devices

[0017] 2: Motherboard Module

[0018] 3: Server rack

[0019] 4: Load-bearing components

[0020] 10: Motherboard

[0021] 11: Circuit Board

[0022] 12: Heat source

[0023] 13: Components on the board

[0024] 14: Ring frame

[0025] 20: Thermal interface materials

[0026] 30: Cold Plate

[0027] 31: Liquid Inlet Channel

[0028] 311: First Branch

[0029] 312: Second Branch

[0030] 313: Main inflow section

[0031] 32: Heat exchange chamber

[0032] 33: Peripheral flow channel

[0033] 34: Liquid outlet channel

[0034] 341: First outflow section

[0035] 342: Second outflow section

[0036] 343: Main Convergence Section

[0037] 35: Thermal coupling surface

[0038] 36: Contact surface

[0039] 37: Trench

[0040] 40: Ring-shaped insulator

[0041] G: Gap Detailed Implementation

[0042] Please see Figure 1 , Figure 1 A partial cross-sectional view of an electronic device 1, showing some embodiments of the present invention, is shown. Figure 1 The structural features can be applied in other embodiments of the present invention.

[0043] Electronic device 1 includes a motherboard module 2. In some embodiments, electronic device 1 may also include a cabinet 3 and a carrier 4. The carrier 4 is, for example, a tray or bracket. The motherboard module 2 is configured to be mounted in the cabinet 3 via the carrier 4, but is not limited thereto. In other embodiments, the motherboard module may also be mounted in other types of housings.

[0044] Figure 2 An exploded cross-sectional view of a motherboard module 2 according to some embodiments of the present invention is shown. Figure 3 A top view of a cold plate 30 according to some embodiments of the present invention is shown. Figure 2 and Figure 3 The structural features can be applied in other embodiments of the present invention.

[0045] The motherboard module 2 includes a motherboard 10, a thermal interface material 20, and a cold plate 30. The motherboard 10 includes a circuit board 11 and a heat source 12, with the heat source 12 disposed on the circuit board 11. The cold plate 30 is thermally coupled to the heat source 12 of the motherboard 10 through the thermal interface material 20. The cold plate 30 has a liquid inlet channel 31, a heat exchange chamber 32, a peripheral flow channel 33, and a liquid outlet channel 34. The heat exchange chamber 32 is connected to the liquid inlet channel 31. The peripheral flow channel 33 is connected to the liquid inlet channel 31 and surrounds the heat exchange chamber 32. The liquid outlet channel 34 connects the heat exchange chamber 32 and the peripheral flow channel 33.

[0046] In some embodiments, the thermal interface material 20 may be a metal that can undergo phase change between liquid and solid states, and has thermal conductivity and high electrical conductivity.

[0047] In some embodiments, the heat source 12 of the motherboard 10 may be a central processing unit (CPU) or a graphics processing unit (GPU). In some embodiments, the motherboard 10 may also include a plurality of on-board components 13 disposed on the circuit board 11 and located around the heat source 12. The on-board components 13 may be electronic components other than the CPU or GPU, such as capacitors.

[0048] In some embodiments, the cold plate 30 further has a thermal coupling surface 35 and a contact surface 36. The thermal coupling surface 35 corresponds to (e.g., opposite to) the heat exchange chamber 32 and is used to thermally couple to the heat source 12 of the motherboard 10 through the thermal interface material 20. The contact surface 36 is located around the thermal coupling surface 35 and corresponds to (e.g., opposite to) the peripheral flow channel 33. The contact surface 36 is configured to correspond to the on-board components 13 of the motherboard 10.

[0049] In some embodiments, the thermal coupling surface 35 and the contact surface 36 of the cold plate 30 are coplanar, but this is not a limitation. In other embodiments, the thermal coupling surface and the contact surface may not be coplanar.

[0050] In some embodiments, the cold plate 30 has a groove 37 that separates the peripheral flow channel 33 from the heat exchange chamber 32. The groove 37 is used to accommodate a portion of the thermal interface material 20. In some embodiments, the groove 37 is annular, but not limited thereto. In other embodiments, the groove may not be annular, and there may be multiple grooves arranged in a ring.

[0051] In some embodiments, the motherboard module 2 further includes an annular insulating member 40 disposed between the contact surface 36 of the on-board components 13 and the cold plate 30 and blocking the thermal interface material 20. In some embodiments, the annular insulating member 40 is elastic and is made of, for example, resin. In some embodiments, the annular insulating member 40 may be pre-positioned on the contact surface 36 of the cold plate 30 or on the on-board components 13 of the motherboard 10 before the cold plate 30 is assembled to the motherboard 10.

[0052] In some embodiments, the motherboard 10 further includes an annular frame 14 disposed on the circuit board 11 and in contact with the outer edge of the heat source 12, with the orthographic projection of the groove 37 entirely located on the annular frame 14. That is, the groove 37 is located directly above the annular frame 14. The annular frame 14 contacts the annular insulator 40. In some embodiments, the opposite sides of the annular insulator 40 contact the components 13 on the board, the contact surface 36, and the annular frame 14, respectively.

[0053] In some embodiments, the peripheral flow channel 33 of the cold plate 30 is not directly connected to the heat exchange chamber 32. In some embodiments, the liquid inlet channel 31 of the cold plate 30 has a first branch 311 and a second branch 312, the first branch 311 being connected to the heat exchange chamber 32 and the second branch 312 being connected to the peripheral flow channel 33. In some embodiments, the liquid inlet channel 31 of the cold plate 30 also has a main inlet 313, the first branch 311 being connected to the main inlet 313 and the second branch 312 being connected to the main inlet 313. In some embodiments, the liquid outlet channel 34 of the cold plate 30 has a first outlet 341 and a second outlet 342, the first outlet 341 being connected to the heat exchange chamber 32 and the second outlet 342 being connected to the peripheral flow channel 33. In some embodiments, the liquid outlet channel 34 of the cold plate 30 further includes a main manifold 343, a first outlet 341 is connected to the main manifold 343, and a second outlet 342 is connected to the main manifold 343.

[0054] Next, the process of assembling the cold plate 30 onto the motherboard 10 will be described below. First, as... Figure 2 As shown, the thermal interface material 20 is disposed on the heat source 12 and the annular frame 14, wherein the thermal interface material 20 can be liquid or solid.

[0055] Next, please refer to Figure 4 . Figure 4 A schematic diagram showing the cold plate 30 of the motherboard module 2 of some embodiments of the present invention is placed on the motherboard 10. Figure 4 The structural features can be applied in other embodiments of the present invention. For example... Figure 4As shown, the cold plate 30 is placed on the motherboard 10, such that the thermal coupling surface 35 of the cold plate 30 contacts the side of the thermal interface material 20 away from the heat source 12, and the opposite sides of the annular insulating member 40 contact the contact surface 36 of the cold plate 30, the annular frame 14, and the components 13 on these boards, respectively. At this time, the cold plate 30 is in a state of waiting to be pressed, and the liquid or solid thermal interface material 20 is not under pressure, and maintains a distance from the annular insulating member 40 to form a gap G. If the thermal interface material 20 is solid at this time, it is then heated to become liquid.

[0056] Next, please refer to Figure 5 . Figure 5 This diagram illustrates the flow of thermal interface material 20 on a motherboard 10 after the cold plate 30 is pressed down, according to some embodiments of the present invention. Figure 5 The structural features can be applied in other embodiments of the present invention. For example... Figure 5 As shown, an external force is applied to the cold plate 30 in the direction of the heat source 12, causing the cold plate 30 to move and change from a state to a state of being pressed. At this time, part of the liquid thermal interface material 20 flows outward into the gap G and onto the contact surface 36 of the cold plate 30 facing away from the outer flow channel 33, while another part of the liquid thermal interface material 20 flows into the groove 37 of the cold plate 30, and the annular insulating member 40 stops the thermal interface material 20. In this way, the process of assembling the cold plate 30 onto the main board 10 is completed.

[0057] In the above embodiment, the heat exchange chamber 32 and the peripheral flow channel 33 of the cold plate 30 are both connected to the liquid inlet channel 31 and the liquid outlet channel 34. The peripheral flow channel 33 surrounds the heat exchange chamber 32, allowing the low-temperature working fluid entering the cold plate 30 from the liquid inlet channel 31 to flow in the peripheral flow channel 33. Therefore, the outer thermal interface material 20 can solidify into a solid state when it flows to the part of the peripheral flow channel 33 of the cold plate 30, forming a wall to prevent the inner thermal interface material 20 from continuing to flow outward. Thus, it can be ensured that the thermal interface material 20 will not come into contact with the plate components 13 around the heat source 12.

[0058] Furthermore, in the above embodiments, the main inlet section 313 of the liquid inlet channel 31 is connected to the heat exchange chamber 32 and the peripheral flow channel 33 through the first branch section 311 and the second branch section 312, and the heat exchange chamber 32 and the peripheral flow channel 33 are connected to the main confluence section 343 through the first outlet section 341 and the second outlet section 342 of the liquid outlet channel 34, so that the heat exchange chamber 32 and the peripheral flow channel 33 are arranged in parallel. Therefore, the working fluid entering the peripheral flow channel 33 will not absorb heat from the heat source 12, so as to ensure that the working fluid in the peripheral flow channel 33 remains at a low temperature and the thermal interface material 20 can solidify.

[0059] It should be noted that the heat exchange chamber 32 and the peripheral flow channel 33 are not limited to being arranged in parallel. In other embodiments, the heat exchange chamber and the peripheral flow channel may be arranged in series, with the liquid inlet channel, the peripheral flow channel, the heat exchange chamber, and the liquid outlet channel connected sequentially. In another embodiment, the heat exchange chamber and the peripheral flow channel may be independent of each other and have no communication relationship. That is, the cold plate may not have a main inlet and a main confluence, and the path formed by the first branch, the heat exchange chamber, and the first outlet may be independent of the path formed by the second branch, the peripheral flow channel, and the second outlet.

[0060] In the above embodiments, the configuration in which the orthographic projection of the groove 37 is completely located on the annular frame 14 ensures that the position of the groove 37 does not sacrifice the contact area of ​​the thermal coupling surface 35 between the heat source 12 and the cold plate 30, thereby avoiding affecting the heat exchange efficiency between the heat source 12 and the cold plate 30.

[0061] It should be noted that the orthographic projection of the groove 37 is not limited to being entirely located on the annular frame 14. In other embodiments, if the arrangement of the groove does not excessively affect the heat exchange efficiency between the heat source and the cold plate, the orthographic projection of the groove may be partially or completely located on the heat source. That is, the orthographic projection of the groove may be partially located on the annular frame, or the orthographic projection of the groove may not be located on the annular frame at all. On the other hand, the annular frame 14 is an optional element and may be omitted in other embodiments.

[0062] In some embodiments, the groove 37 of the cold plate 30, which separates the peripheral flow channel 33 and the heat exchange chamber 32, not only accommodates a portion of the thermal interface material 20 but also reduces heat exchange between the heat exchange chamber 32 and the peripheral flow channel 33. This further ensures that the working fluid in the peripheral flow channel 33 is at a sufficiently low temperature to allow the thermal interface material 20 to solidify. It should be noted that the groove 37 is an optional structure and may be omitted in other embodiments.

[0063] In the above embodiments, the annular insulating member 40, with its opposite sides contacting the contact surface 36 of the cold plate 30, the annular frame 14, and the on-plate components 13, can further isolate the thermal interface material 20 from the on-plate components 13. It should be noted that the annular insulating member 40 is an optional component and may be omitted in other embodiments.

[0064] According to the cold plate and electronic device disclosed in the above embodiments, the heat exchange chamber and the peripheral flow channel of the cold plate are connected to the inlet channel and the outlet channel, and the configuration of the peripheral flow channel surrounding the heat exchange chamber allows the low-temperature working fluid entering the cold plate from the inlet channel to flow in the peripheral flow channel. Therefore, the outer thermal interface material can solidify into a solid state when it flows to the part where the peripheral flow channel of the cold plate is located, forming a wall to prevent the inner thermal interface material from continuing to flow outward, thus ensuring that the thermal interface material does not come into contact with the plate components around the heat source.

[0065] Furthermore, the main inlet section of the liquid inlet channel is connected to the heat exchange chamber and the peripheral flow channel via the first branch and the second branch, respectively, and the heat exchange chamber and the peripheral flow channel are connected to the main confluence section via the first outlet section and the second outlet section of the liquid outlet channel, respectively. This configuration allows the heat exchange chamber and the peripheral flow channel to be arranged in parallel, thus preventing the working fluid entering the peripheral flow channel from absorbing heat from the heat source. This ensures that the working fluid in the peripheral flow channel remains at a low temperature, allowing the thermal interface material to solidify.

[0066] Furthermore, the grooves in the cold plate, which separate the outer flow channel and the heat exchange chamber, not only accommodate some of the heat interface material but also reduce heat exchange between the heat exchange chamber and the outer flow channel. This further ensures that the working fluid in the outer flow channel is at a sufficiently low temperature so that the heat interface material can solidify.

Claims

1. A cold plate for thermally coupling to a heat source of a motherboard via a thermal interface material, the cold plate having: Liquid inlet channel; The heat exchange chamber is connected to the liquid inlet channel; An outer flow channel connects to the liquid inlet channel and surrounds the heat exchange chamber; and The liquid outlet channel connects the heat exchange chamber and the surrounding flow channel.

2. The cold plate of claim 1, wherein the cold plate has a thermal coupling surface and a contact surface, the thermal coupling surface corresponding to the heat exchange chamber, the thermal coupling surface being used to thermally couple to the heat source of the motherboard through the thermal interface material, the contact surface being located around the thermal coupling surface and corresponding to the peripheral flow channel, the contact surface being configured to correspond to a plurality of on-board components of the motherboard.

3. The cold plate as claimed in claim 1, wherein the cold plate further has a groove that separates the peripheral flow channel and the heat exchange chamber, the groove being used to accommodate a portion of the thermal interface material.

4. The cold plate as claimed in claim 3, wherein the groove is annular.

5. The cold plate as claimed in claim 2, wherein the thermal coupling surface and the contact surface are coplanar.

6. The cold plate as claimed in claim 1, wherein the liquid inlet channel of the cold plate has a first branch and a second branch, the first branch being connected to the heat exchange chamber, and the second branch being the peripheral flow channel.

7. The cold plate as claimed in claim 1, wherein the liquid outlet channel of the cold plate has a first outlet portion and a second outlet portion, the first outlet portion being connected to the heat exchange chamber, and the second outlet portion being connected to the peripheral flow channel.

8. The cold plate as claimed in claim 6, wherein the liquid inlet channel of the cold plate further has a main inlet portion, the first branch portion is further connected to the main inlet portion, and the second branch portion is further connected to the main inlet portion.

9. The cold plate as claimed in claim 7, wherein the liquid outlet channel of the cold plate further comprises a main confluence portion, the first outlet portion is further connected to the main confluence portion, and the second outlet portion is further connected to the main confluence portion.

10. The cold plate as claimed in claim 1, wherein the peripheral flow channel is not directly connected to the heat exchange chamber.

11. An electronic device comprising: Motherboard module, including: The motherboard includes a circuit board and a heat source, the heat source being disposed on the circuit board; Thermal interface materials; and A cold plate, thermally coupled to the heat source of the motherboard via the thermal interface material, the cold plate having: Liquid inlet channel; The heat exchange chamber is connected to the liquid inlet channel; An outer flow channel connects to the liquid inlet channel and surrounds the heat exchange chamber; and The liquid outlet channel connects the heat exchange chamber and the surrounding flow channel.

12. The electronic device of claim 11, wherein the cold plate has a groove that separates the peripheral flow channel and the heat exchange chamber, the groove being used to accommodate a portion of the thermal interface material.

13. The electronic device of claim 12, wherein the motherboard module further includes an annular insulating member, the motherboard further includes a plurality of on-board components located around the heat source, the cold plate has a contact surface corresponding to the peripheral flow channel, and the annular insulating member is disposed between the on-board components and the contact surface and blocks the thermal interface material.

14. The electronic device of claim 13, wherein the annular insulating member is elastic.

15. The electronic device of claim 13, wherein the motherboard further comprises an annular frame disposed on the circuit board and in contact with the outer edge of the heat source, the orthographic projection of the groove being entirely located on the annular frame, and the annular frame contacting the annular insulator.

16. The electronic device of claim 15, wherein the opposite sides of the annular insulating member contact the components on the board, the contact surface, and the annular frame, respectively.

17. The electronic device of claim 12, wherein the groove is annular.

18. The electronic device of claim 11, wherein the cold plate further has a thermal coupling surface and a contact surface, the thermal coupling surface corresponding to the heat exchange chamber, the thermal coupling surface being thermally coupled to the heat source of the motherboard through the thermal interface material, the contact surface being located around the thermal coupling surface and corresponding to the peripheral flow channel, the contact surface being configured to correspond to a plurality of on-board components of the motherboard.

19. The electronic device of claim 18, wherein the thermal coupling surface and the contact surface are coplanar.

20. The electronic device of claim 11, wherein the liquid inlet channel of the cold plate has a first branch and a second branch, the first branch being connected to the heat exchange chamber, and the second branch being the peripheral flow channel.

21. The electronic device of claim 11, wherein the liquid outlet channel of the cold plate has a first outlet portion and a second outlet portion, the first outlet portion being connected to the heat exchange chamber and the second outlet portion being connected to the peripheral flow channel.

22. The electronic device of claim 20, wherein the liquid inlet channel of the cold plate further comprises a main inlet portion, the first branch portion further communicates with the main inlet portion, and the second branch portion further communicates with the main inlet portion.

23. The electronic device of claim 21, wherein the liquid outlet channel of the cold plate further comprises a main confluence portion, the first outlet portion is further connected to the main confluence portion, and the second outlet portion is further connected to the main confluence portion.

24. The electronic device of claim 11, wherein the peripheral flow channel is not in direct communication with the heat exchange chamber.

25. The electronic device of claim 11, further comprising a cabinet, wherein the motherboard module is configured to be mounted in the cabinet.

Images