An outdoor light-emitting semiconductor screen heat dissipation system and method

Abstract

This invention provides a heat dissipation system and method for outdoor light-emitting semiconductor screens, relating to the field of outdoor light-emitting semiconductor screen technology. The system includes a data acquisition and preprocessing module, a thermal matrix construction module, an environmental matrix construction module, a thermal field distribution analysis module, a linkage control decision-making module, and a dynamic execution module. By determining key moments and calculating their average parameter values ​​as processing values, this invention effectively filters out instantaneous fluctuations and noise in the monitored parameters, reduces the interference of abnormal data on subsequent analysis, improves data stability and reliability, provides high-quality basic data for subsequent modules such as thermal matrix construction, ensures the accuracy of the entire heat dissipation system analysis and control, simplifies the data processing flow, and improves the system's operating efficiency.

Description

Technical Field

[0001] This invention belongs to the field of outdoor light-emitting semiconductor screen technology, specifically relating to an outdoor light-emitting semiconductor screen heat dissipation system and method. Background Technology

[0002] Outdoor light-emitting semiconductor screens, widely used in outdoor advertising, information display, and other scenarios, operate in complex and ever-changing outdoor environments for extended periods, facing severe heat dissipation challenges. Due to large temperature fluctuations in outdoor environments, factors such as high summer temperatures and strong solar radiation make it difficult for the heat generated by the screen itself to dissipate quickly. When the semiconductor devices inside the screen operate in high-temperature environments, their performance will significantly decrease, which will not only affect the stability of the display effect, causing problems such as brightness decay and color distortion, but also accelerate the aging of the devices, shorten the lifespan of the screen, and in severe cases, even cause serious malfunctions such as circuit failure and screen blackout, resulting in economic losses. Currently, most outdoor light-emitting semiconductor screens use a single air-cooling or water-cooling system, or a simple combination of both, for heat dissipation. Their heat dissipation control strategies are often based on fixed parameters or simple temperature threshold triggers, lacking comprehensive analysis and dynamic response to the screen's real-time thermal state, environmental parameters, and thermal field distribution. For example, some heat dissipation systems only regulate heat dissipation based on the average temperature of the screen, failing to accurately identify local overheating areas, resulting in unreasonable allocation of heat dissipation resources. Although some systems use a combination of air-cooling and water-cooling, they do not consider the synergistic linkage mechanism between the two. When environmental parameters (such as ambient temperature, solar radiation intensity, wind speed, etc.) change, they cannot adjust the heat dissipation power and method in a timely manner, easily leading to insufficient or excessive heat dissipation, which affects the heat dissipation effect and increases energy consumption. Furthermore, existing technologies for monitoring and processing heat dissipation parameters are relatively simple, often relying directly on real-time monitoring data for regulation without effectively filtering out fluctuations in the data. This leads to frequent changes in regulation commands, affecting the stability of the heat dissipation system. Simultaneously, the lack of mining and utilization of historical heat dissipation performance data makes it difficult to optimize current heat dissipation strategies based on heat dissipation experience under similar operating conditions. This results in low intelligence and adaptability of the heat dissipation system, failing to meet the efficient, stable, and energy-saving heat dissipation requirements of outdoor light-emitting semiconductor screens in complex environments. Therefore, developing a heat dissipation system and method capable of comprehensively analyzing multi-dimensional parameters, achieving intelligent linkage between air cooling and water cooling, and accurately adapting to different operating conditions is crucial for solving the current heat dissipation problem of outdoor light-emitting semiconductor screens. Summary of the Invention

[0003] The present invention provides an outdoor light-emitting semiconductor screen heat dissipation system and method to solve at least one of the technical problems mentioned above.

[0004] To address the aforementioned technical problems, this invention discloses an outdoor light-emitting semiconductor screen heat dissipation system and method, comprising: The data acquisition and preprocessing module is used to obtain the processed values ​​of all monitoring parameters of all types of heat dissipation methods of the outdoor light-emitting semiconductor screen at the current moment, based on all monitoring parameters of all types of heat dissipation methods of the screen at each moment within a preset time period before the current moment. The thermal matrix construction module is used to obtain the thermal matrix of the screen at the current moment based on the processed values ​​of all monitoring parameters of all types of heat dissipation methods at all times within a preset time period before the current moment. The environment matrix construction module is used to obtain the screen's environment matrix at the current moment based on all class environment parameters of the screen at all times within a preset time period before the current moment; The thermal field distribution analysis module is used to acquire the surface temperature distribution data of the screen at the current moment, and calculate the thermal field pressure coefficient of the screen at the current moment based on the temperature distribution data. The linkage control decision module is used to obtain the optimal reference control time of the screen at the current moment based on the screen's thermal state matrix, environmental matrix, and thermal field urgency coefficient, and based on the optimal reference control time, to obtain the optimal control target value of all monitoring parameters of all types of heat dissipation methods of the screen at the current moment. The dynamic execution module is used to adjust the screen's air-cooling and water-cooling systems based on the optimal control target value of all monitoring parameters of all types of heat dissipation methods at the current moment, so as to obtain the best multimodal linkage heat dissipation result of the screen at the current moment.

[0005] Preferably, the data acquisition and preprocessing module includes: The acquisition submodule is used to acquire all monitoring parameters of air cooling and water cooling at each moment within a preset time period before the current moment; The critical moment determination submodule is used to determine a critical moment when the difference between each monitoring parameter of each type of heat dissipation method of the screen at a time within a preset time period before the current moment and the corresponding monitoring parameter of the corresponding type of heat dissipation method at all adjacent times is not greater than a preset difference. The numerical processing and acquisition submodule is used to calculate the average value of each monitoring parameter of each type of heat dissipation method for all key moments within a preset time period before the current moment, and use it as the processed value of the corresponding monitoring parameter of the corresponding type of heat dissipation method for the screen at the current moment.

[0006] Preferably, the thermal matrix construction module includes: The status value calculation submodule is used to take the ratio between the processing value of each monitoring parameter of each type of heat dissipation method at each moment of the preset time period before the current moment and the maximum value among the processing values ​​of the corresponding monitoring parameter of the corresponding type of heat dissipation method at all moments of the preset time period before the current moment as the status value of the processing value of the monitoring parameter of the corresponding type of heat dissipation method at that moment. The ordinal definition submodule is used to take the sum of the state values ​​of the monitoring parameters of each type of heat dissipation method of the screen in all time periods within the preset time period before the current time as the state and value of the monitoring parameters of the corresponding type of heat dissipation method of the screen at the current time, and define the ordinal values ​​of all monitoring parameters of all types of heat dissipation methods of the screen at the current time in descending order of state and value. The matrix construction submodule is used to construct a thermal matrix based on the state values ​​of each type of heat dissipation method and each type of monitoring parameter processing value at all times and their ordinal definition results at the current time.

[0007] Preferably, the environment matrix construction module includes: The parameter processing submodule is used to obtain the ambient temperature behind the screen, ambient air temperature, solar radiation intensity, and ambient wind speed at each moment within a preset time period before the current moment, and to calculate the temperature rise potential parameter of the screen at each moment within the preset time period before the current moment. The temperature rise potential parameter is the difference between the ambient temperature behind the screen and the ambient air temperature. The matrix construction submodule is used to construct an environmental matrix based on the ambient temperature behind the screen, ambient air temperature, solar radiation intensity, ambient wind speed, and optional temperature rise potential parameters at all times.

[0008] Preferably, the thermal field distribution analysis module includes: The thermal field parameter calculation submodule is used to calculate the highest temperature point, average temperature, and temperature standard deviation of the screen at the current moment based on the screen surface temperature distribution data. The Compression Factor Calculation Submodule is used to calculate the thermal field compression factor based on the highest temperature point, average temperature, and temperature standard deviation.

[0009] Preferably, the formula for calculating the thermal field tightness factor is: ;in, For thermal field pressure coefficient, The temperature at the highest point. For safe temperature threshold, For temperature standard deviation, The average temperature. and These are the weighting coefficients for local overheating and uneven heat distribution, respectively.

[0010] Preferably, the linkage control decision module includes: The reference matrix generation submodule is used to generate a historical heat dissipation performance reference matrix of the screen at the current moment based on the thermal matrix and the environment matrix. The reference time analysis submodule is used to select the best reference control time from the historical heat dissipation performance reference matrix by combining the thermal field urgency coefficient and matching the current thermal field urgency state. The target value determination submodule is used to determine the processed values ​​of all monitoring parameters of all types of heat dissipation methods corresponding to the optimal reference control time as the optimal control target value of the corresponding monitoring parameter of the corresponding type of heat dissipation method of the screen at the current time.

[0011] Preferably, the reference time analysis submodule includes: The state matching degree calculation unit is used to calculate the matching degree between the current thermal field urgency state and the thermal field state at each historical moment based on the thermal field urgency coefficient at the current moment and the thermal field urgency coefficient at each historical moment in the historical heat dissipation efficiency reference matrix. The heat dissipation efficiency quantification unit is used to quantify the heat dissipation efficiency value at each historical moment in the historical heat dissipation efficiency reference matrix, in combination with its corresponding thermal state matrix, environmental matrix and actual heat dissipation results. The heat dissipation efficiency value includes temperature control efficiency, energy consumption cost coefficient and heat distribution improvement rate. The optimal moment filtering unit is used to select historical moments with a state matching degree higher than a preset matching threshold as candidate moments, and select the moment with the best heat dissipation efficiency value from the candidate moments as the best reference control moment.

[0012] Preferably, the dynamic execution module includes: The control command generation unit is used to generate fan speed control commands, water pump flow control commands, and water pump power control commands based on the optimal control target value. The execution drive unit is used to drive the fan controller to adjust the fan speed to the target value, and drive the water pump controller to adjust the cooling water flow and water pump power to the target value, so as to realize the linkage control of air cooling and water cooling.

[0013] A method for heat dissipation of an outdoor light-emitting semiconductor screen includes the following steps: Step 1: Based on all monitoring parameters of all heat dissipation methods of the outdoor light-emitting semiconductor screen at each moment within a preset time period before the current moment, obtain the processed values ​​of all monitoring parameters of all heat dissipation methods of the screen at the current moment. Step 2: Based on the processed values ​​of all monitoring parameters of all types of heat dissipation methods at all times within the preset time period before the current time, obtain the thermal state matrix of the screen at the current time. Step 3: Based on all class environment parameters of the screen at all times within the preset time period before the current time, obtain the screen's environment matrix at the current time; Step 4: Obtain the surface temperature distribution data of the screen at the current moment, and calculate the thermal field pressure coefficient of the screen at the current moment based on the temperature distribution data; Step 5: Based on the screen's thermal state matrix, environmental matrix, and thermal field urgency coefficient at the current moment, obtain the optimal reference control time for the screen at the current moment, and based on the optimal reference control time, obtain the optimal control target values ​​for all monitoring parameters of all types of heat dissipation methods for the screen at the current moment. Step 6: Based on the optimal control target value of all monitoring parameters of all types of heat dissipation methods of the screen at the current moment, adjust the air cooling and water cooling systems of the screen to obtain the best multimodal linkage heat dissipation result of the screen at the current moment.

[0014] Compared with the prior art, the present invention has the following beneficial effects: This invention achieves comprehensive monitoring and precise control of heat dissipation for outdoor light-emitting semiconductor screens through multi-module collaborative operation. Combining multi-modal linkage heat dissipation methods of air cooling and water cooling, it can adapt to different thermal states and environmental conditions, effectively improve heat dissipation efficiency, ensure stable operation of the screen in complex outdoor environments, reduce the risk of failure due to overheating, and extend the lifespan of the screen. At the same time, dynamic control improves the level of intelligence in heat dissipation and reduces the cost of manual intervention. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the outdoor light-emitting semiconductor screen heat dissipation system of the present invention. Detailed Implementation

[0016] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0017] Furthermore, in this invention, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the invention. They are merely used to distinguish components or operations described using the same technical terms and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0018] The present invention provides the following embodiments. Example 1 This invention provides an outdoor light-emitting semiconductor screen heat dissipation system and method, such as... Figure 1 As shown, the system includes: The data acquisition and preprocessing module is used to obtain the processed values ​​of all monitoring parameters of all types of heat dissipation methods of the outdoor light-emitting semiconductor screen at the current moment, based on all monitoring parameters of all types of heat dissipation methods of the screen at each moment within a preset time period before the current moment. The thermal matrix construction module is used to obtain the thermal matrix of the screen at the current moment based on the processed values ​​of all monitoring parameters of all types of heat dissipation methods at all times within a preset time period before the current moment. The environment matrix construction module is used to obtain the screen's environment matrix at the current moment based on all class environment parameters of the screen at all times within a preset time period before the current moment; The thermal field distribution analysis module is used to acquire the surface temperature distribution data of the screen at the current moment, and calculate the thermal field pressure coefficient of the screen at the current moment based on the temperature distribution data. The linkage control decision module is used to obtain the optimal reference control time of the screen at the current moment based on the screen's thermal state matrix, environmental matrix, and thermal field urgency coefficient, and based on the optimal reference control time, to obtain the optimal control target value of all monitoring parameters of all types of heat dissipation methods of the screen at the current moment. The dynamic execution module is used to adjust the screen's air-cooling and water-cooling systems based on the optimal control target value of all monitoring parameters of all types of heat dissipation methods at the current moment, so as to obtain the best multimodal linkage heat dissipation result of the screen at the current moment.

[0019] In this embodiment, all types of heat dissipation methods include air cooling and water cooling. All types of monitoring parameters for air cooling include fan speed, air volume, and air temperature. All types of monitoring parameters for water cooling include cooling water flow rate, the difference between cooling water inlet temperature and cooling water outlet temperature, and water pump power.

[0020] In this embodiment, all environmental parameters include the ambient temperature behind the screen, the ambient air temperature, the solar radiation intensity, and the ambient wind speed.

[0021] The working principle and beneficial effects of the above technical solution are as follows: The data acquisition and preprocessing module obtains the processing value at the current moment based on all monitoring parameters of all types of heat dissipation methods at each moment within a preset time period before the current moment of the outdoor light-emitting semiconductor screen; the thermal state matrix construction module constructs the thermal state matrix at the current moment based on the processing values ​​at all moments within the preset time period; the environmental matrix construction module constructs the environmental matrix at the current moment based on all types of environmental parameters at all moments within the preset time period; the thermal field distribution analysis module obtains the screen surface temperature distribution data at the current moment and calculates the thermal field pressure coefficient; the linkage control decision module determines the optimal reference control moment and the optimal control target value of all types of monitoring parameters of all types of heat dissipation methods based on the thermal state matrix, environmental matrix and thermal field pressure coefficient; and the dynamic execution module controls the air-cooled and water-cooled heat dissipation systems based on the optimal control target value to obtain the optimal multimodal linkage heat dissipation result. To address the issue that "existing heat dissipation methods are mostly single air cooling or water cooling, or a simple combination thereof, lacking comprehensive analysis and dynamic response to the real-time thermal state of the screen, environmental parameters, and thermal field distribution," Implementation 1 sets up a data acquisition and preprocessing module, a thermal state matrix construction module, an environmental matrix construction module, and a thermal field distribution analysis module. The data acquisition and preprocessing module acquires and processes heat dissipation monitoring parameters within a preset time period. The thermal state matrix construction module constructs a thermal state matrix reflecting the real-time thermal state based on the processed values. The environmental matrix construction module constructs an environmental matrix reflecting environmental changes based on environmental parameters. The thermal field distribution analysis module calculates the thermal field stress coefficient through surface temperature distribution data, realizing a comprehensive and integrated analysis of the real-time thermal state, environmental parameters, and thermal field distribution, providing a data foundation for subsequent dynamic response. To address the problem that "relying solely on average temperature control cannot accurately identify local overheating areas, leading to unreasonable allocation of heat dissipation resources," the thermal field distribution analysis module of this invention specifically acquires screen surface temperature distribution data. By calculating the highest temperature point, average temperature, temperature standard deviation, and thermal field tightness coefficient, it can accurately identify local overheating areas (through the highest temperature point) and the uniformity of heat distribution (through the temperature standard deviation), avoiding the limitations of relying solely on average temperature and providing a basis for the rational allocation of heat dissipation resources. To address the problem that "the lack of a coordinated linkage mechanism between air cooling and water cooling makes it difficult to adjust in time when the environment changes, which can easily lead to insufficient or excessive heat dissipation and increased energy consumption," the dynamic execution module of this invention clearly regulates the air cooling and water cooling systems in conjunction with the optimal control target value. Combined with the optimal reference control time and control target value output by the linkage control decision module, it realizes multi-modal coordinated linkage between air cooling and water cooling. It can adjust the operating parameters of both in a timely manner according to the thermal state, environment, and the urgency of the thermal field, avoiding the problem of insufficient or excessive heat dissipation under a single or simple combination method, and reducing unnecessary energy consumption. To address the problem that "simple monitoring and processing of heat dissipation parameters without filtering out fluctuation interference leads to frequent changes in control commands, affecting system stability," the data acquisition and preprocessing module of this invention obtains monitoring parameters within a preset time period and processes them to obtain stable processed values ​​(providing reliable data for subsequent matrix construction and decision-making). This reduces the interference of instantaneous fluctuations on parameters, avoids frequent changes in control commands due to fluctuations in the original data, and improves the stability of system operation. To address the problem of "lack of mining and utilization of historical heat dissipation performance data, difficulty in optimizing the current heat dissipation strategy based on similar working conditions, and low intelligence and adaptability", the linkage control decision module of this invention selects the best reference control time and determines the best control target value based on the thermal state matrix, environmental matrix and thermal field urgency coefficient within a preset time period. In essence, it mines and utilizes heat dissipation data under similar historical working conditions, so that the current heat dissipation strategy can refer to the best historical experience, improve the intelligence and adaptability of the system, and meet the heat dissipation needs in complex outdoor environments. Through the collaborative work of multiple modules, comprehensive monitoring and precise control of heat dissipation of outdoor light-emitting semiconductor screens are achieved. Combining multi-modal linkage heat dissipation methods of air cooling and water cooling, it can adapt to different thermal states and environmental conditions, effectively improve heat dissipation efficiency, ensure stable operation of the screen in complex outdoor environments, reduce the risk of failure due to overheating, and extend the service life of the screen. At the same time, dynamic control improves the level of intelligence of heat dissipation and reduces the cost of manual intervention.

[0022] Example 2 Based on Example 1, the data acquisition and preprocessing module includes: The acquisition submodule is used to acquire all monitoring parameters of air cooling and water cooling at each moment within a preset time period before the current moment; The critical moment determination submodule is used to determine a critical moment when the difference between each monitoring parameter of each type of heat dissipation method of the screen at a time within a preset time period before the current moment and the corresponding monitoring parameter of the corresponding type of heat dissipation method at all adjacent times is not greater than a preset difference. The numerical processing and acquisition submodule is used to calculate the average value of each monitoring parameter of each type of heat dissipation method for all key moments within a preset time period before the current moment, and use it as the processed value of the corresponding monitoring parameter of the corresponding type of heat dissipation method for the screen at the current moment.

[0023] The working principle and beneficial effects of the above technical solution are as follows: The acquisition submodule of the data acquisition and preprocessing module first acquires all types of monitoring parameters of air cooling and water cooling at each moment within a preset time period before the current moment of the screen. The key moment determination submodule determines the key moment when the difference between each type of monitoring parameter of each type of cooling method at a moment and the corresponding type of monitoring parameter of the corresponding type of cooling method at all adjacent moments is not greater than a preset difference. The processing value acquisition submodule calculates the average value of each type of monitoring parameter of each type of cooling method at all key moments, and uses it as the processing value of the corresponding type of monitoring parameter of the corresponding type of cooling method at the current moment. By identifying key moments and calculating their average values ​​as processing values, instantaneous fluctuations and noise in the monitored parameters can be effectively filtered out, reducing the interference of abnormal data on subsequent analysis, improving the stability and reliability of the data, providing high-quality basic data for subsequent modules such as thermal matrix construction, ensuring the accuracy of the entire heat dissipation system analysis and control, simplifying the data processing flow, and improving the system's operating efficiency.

[0024] Example 3 Based on Example 1, the thermal matrix construction module includes: The status value calculation submodule is used to take the ratio between the processing value of each monitoring parameter of each type of heat dissipation method at each moment of the preset time period before the current moment and the maximum value among the processing values ​​of the corresponding monitoring parameter of the corresponding type of heat dissipation method at all moments of the preset time period before the current moment as the status value of the processing value of the monitoring parameter of the corresponding type of heat dissipation method at that moment. The ordinal definition submodule is used to take the sum of the state values ​​of the monitoring parameters of each type of heat dissipation method of the screen in all time periods within the preset time period before the current time as the state and value of the monitoring parameters of the corresponding type of heat dissipation method of the screen at the current time, and define the ordinal values ​​of all monitoring parameters of all types of heat dissipation methods of the screen at the current time in descending order of state and value. The matrix construction submodule is used to construct a thermal matrix based on the state values ​​of each type of heat dissipation method and each type of monitoring parameter processing value at all times and their ordinal definition results at the current time.

[0025] In this embodiment, the thermal state matrix is:

[0026] in, This represents the thermal state matrix of an outdoor light-emitting semiconductor screen at the current moment. This refers to the status value of the first type of monitoring parameter for air-cooling heat dissipation of an outdoor light-emitting semiconductor screen at the first moment within a preset time period prior to the current moment. For outdoor light-emitting semiconductor screens, within a preset time period before the current moment, the first The status value of the processed value of the first type of monitoring parameter for air-cooled heat dissipation at a given moment. This refers to the status value of the second type of monitoring parameter for air-cooling heat dissipation of an outdoor light-emitting semiconductor screen at the first moment within a preset time period prior to the current moment. For outdoor light-emitting semiconductor screens, within a preset time period before the current moment, the first The processed value of the second type of monitoring parameter for air-cooled heat dissipation at a given moment. This refers to the status value of the third type of monitoring parameter for air-cooling heat dissipation of an outdoor light-emitting semiconductor screen at the first moment within a preset time period prior to the current moment. For outdoor light-emitting semiconductor screens, within a preset time period before the current moment, the first The status value of the processed values ​​of the third type of monitoring parameter for air-cooled heat dissipation at a given moment. This refers to the status value of the first type of monitoring parameter for liquid cooling heat dissipation of an outdoor light-emitting semiconductor screen at the first moment within a preset time period prior to the current moment. For outdoor light-emitting semiconductor screens, within a preset time period before the current moment, the first The processed state value of the first type of monitoring parameter for liquid cooling heat dissipation at a given moment. This refers to the status value of the second type of monitoring parameter for liquid cooling heat dissipation of an outdoor light-emitting semiconductor screen at the first moment within a preset time period prior to the current moment. For outdoor light-emitting semiconductor screens, within a preset time period before the current moment, the first The processed state value of the second type of monitoring parameter for liquid cooling heat dissipation at a given moment. This refers to the status value of the third type of monitoring parameter for liquid cooling heat dissipation of an outdoor light-emitting semiconductor screen at the first moment within a preset time period prior to the current moment. For outdoor light-emitting semiconductor screens, within a preset time period before the current moment, the first The status value of the processed values ​​of the third type of monitoring parameter for liquid cooling heat dissipation at a given moment.

[0027] The working principle and beneficial effects of the above technical solution are as follows: The state value calculation submodule of the thermal matrix construction module takes the processing value of each monitoring parameter of each type of heat dissipation method at each moment within a preset time period before the current moment of the screen and the maximum value among the processing values ​​of the corresponding monitoring parameters of the corresponding type of heat dissipation method at all moments within the preset time period as the state value of the processing value of the monitoring parameter of the corresponding type of heat dissipation method at that moment. The ordinal definition submodule takes the sum of the state values ​​of the processing values ​​of each monitoring parameter of each type of heat dissipation method at all moments within the preset time period as the state sum of the corresponding monitoring parameters of the corresponding type of heat dissipation method at the current moment, and defines the ordinals of all monitoring parameters of all types of heat dissipation methods in descending order of the state sum. The matrix construction submodule constructs the thermal matrix based on the state values ​​of the processing values ​​of each monitoring parameter of each type of heat dissipation method at all moments and their ordinal definition results. By converting the processed values ​​of monitoring parameters into state values ​​and constructing a thermal state matrix, a quantitative representation of the screen's heat dissipation state is achieved. This facilitates intuitive analysis of the relative changing trends of heat dissipation parameters at different times. The ordinal definition distinguishes the importance of various parameters, enhances the information carrying capacity of the matrix, and provides structured and comparable thermal state data support for subsequent linkage control decisions. This helps to more accurately grasp the operating status of the heat dissipation system and improve the scientific nature of control.

[0028] Example 4 Based on Example 1, the environment matrix construction module includes: The parameter processing submodule is used to obtain the ambient temperature behind the screen, ambient air temperature, solar radiation intensity, and ambient wind speed at each moment within a preset time period before the current moment, and to calculate the temperature rise potential parameter of the screen at each moment within the preset time period before the current moment. The temperature rise potential parameter is the difference between the ambient temperature behind the screen and the ambient air temperature. The matrix construction submodule is used to construct an environmental matrix based on the ambient temperature behind the screen, ambient air temperature, solar radiation intensity, ambient wind speed, and optional temperature rise potential parameters at all times.

[0029] In this embodiment, the environment matrix is: in, The environment matrix at the current moment. This refers to the solar radiation intensity at the first moment within a preset time period before the current moment. This is the solar radiation intensity at the second moment within a preset time period before the current moment. This refers to the solar radiation intensity at the third moment within a preset time period before the current moment. To determine the ambient wind speed at the first moment within a preset time period before the current moment, To determine the ambient wind speed at the second time point within a preset time period before the current time. To determine the ambient wind speed at the third time point within a preset time period before the current time. To determine the potential temperature rise at the first moment within a preset time period before the current moment, To estimate the temperature rise potential at the second time point within a preset time period before the current time. The potential for temperature rise at the third time point within a preset time period before the current time; in, = - ; ; ;in, To determine the ambient temperature behind the screen at the first moment within a preset time period before the current moment. To determine the ambient temperature behind the screen at the second time within a preset time period before the current time. This refers to the ambient temperature behind the screen at the third time within a preset time period before the current time. The ambient air temperature at the first moment within a preset time period before the current moment. The ambient air temperature at the second time point within a preset time period before the current time. The ambient air temperature is the third time within a preset time period before the current time.

[0030] The working principle and beneficial effects of the above technical solution are as follows: The parameter processing submodule of the environment matrix construction module obtains the ambient temperature, ambient air temperature, solar radiation intensity, and ambient wind speed of the screen back environment at each time within a preset time period before the current time of the screen, and calculates the temperature rise potential parameter (i.e., the difference between the ambient temperature of the screen back environment and the ambient air temperature) at each time. The matrix construction submodule constructs the environment matrix based on the ambient temperature of the screen back environment, ambient air temperature, solar radiation intensity, ambient wind speed, and optional temperature rise potential parameters at all times. The system comprehensively collects and processes various environmental parameters that affect screen heat dissipation. In particular, it calculates temperature rise potential parameters to reflect the impact of the temperature difference between the screen and the environment on heat dissipation. The constructed environmental matrix can systematically present the changes in environmental factors, providing comprehensive environmental background information for the heat dissipation system. This enables subsequent linkage control decisions to better adapt to changes in the external environment, improves the adaptability and coping ability of the heat dissipation system to complex outdoor environments, and ensures the stability of heat dissipation performance.

[0031] Example 5 Based on Example 1, the thermal field distribution analysis module includes: The thermal field parameter calculation submodule is used to calculate the highest temperature point, average temperature, and temperature standard deviation of the screen at the current moment based on the screen surface temperature distribution data. The Compression Factor Calculation Submodule is used to calculate the thermal field compression factor based on the highest temperature point, average temperature, and temperature standard deviation. The formula for calculating the thermal field pressure coefficient is: ;in, For thermal field pressure coefficient, The temperature at the highest point. For safe temperature threshold, For temperature standard deviation, The average temperature. and These are the weighting coefficients for local overheating and uneven heat distribution, respectively.

[0032] The working principle and beneficial effects of the above technical solution are as follows: the thermal field parameter calculation submodule of the thermal field distribution analysis module calculates the highest temperature point temperature, average temperature, and temperature standard deviation at the current moment based on the screen surface temperature distribution data; the thermal field pressure coefficient calculation submodule calculates the thermal field pressure coefficient based on the highest temperature point temperature, average temperature, and temperature standard deviation through a formula. By calculating the highest temperature point, average temperature, and temperature standard deviation, the thermal field distribution characteristics of the screen surface are comprehensively reflected. The calculation of the thermal field urgency coefficient combines two key factors: local overheating and uneven heat distribution. Through weighting coefficients, it can accurately quantify the urgency of the thermal field, providing an intuitive and crucial indicator for coordinated control decisions. This makes control measures more targeted, effectively avoids damage caused by local overheating, improves the problem of uneven overall heat distribution, and enhances the screen's heat dissipation safety.

[0033] Example 6 Based on Example 1, the linkage control decision module includes: The reference matrix generation submodule is used to generate a historical heat dissipation performance reference matrix of the screen at the current moment based on the thermal matrix and the environment matrix. The reference time analysis submodule is used to select the best reference control time from the historical heat dissipation performance reference matrix by combining the thermal field urgency coefficient and matching the current thermal field urgency state. The target value determination submodule is used to determine the processed values ​​of all monitoring parameters of all types of heat dissipation methods corresponding to the optimal reference control time as the optimal control target value of the corresponding monitoring parameter of the corresponding type of heat dissipation method of the screen at the current time.

[0034] In this embodiment, the formula for calculating the thermal field urgency factor takes into account the ratio of the highest temperature point to the safety threshold and the non-uniformity of heat distribution reflected by the temperature standard deviation.

[0035] In this embodiment, the historical heat dissipation performance reference matrix is ​​as follows: ;in This is a historical heat dissipation performance reference matrix.

[0036] The working principle and beneficial effects of the above technical solution are as follows: The reference matrix generation submodule of the linkage control decision module generates a historical heat dissipation efficiency reference matrix based on the current thermal state matrix and environmental matrix. The reference time analysis submodule selects the historical time that matches the current thermal field urgency coefficient and has the best heat dissipation efficiency performance as the best reference control time in the historical heat dissipation efficiency reference matrix. The target value determination submodule determines the processed values ​​of all types of monitoring parameters of all types of heat dissipation methods corresponding to the best reference control time as the best control target value of the corresponding type of monitoring parameter of the corresponding type of heat dissipation method at the current time. By generating a historical heat dissipation efficiency reference matrix, the effective information in historical operating data is fully utilized. Combined with the current thermal field urgency coefficient, the optimal reference control time is selected, making the control decision based on history and with practical relevance. This ensures the rationality and effectiveness of the optimal control target value, realizes intelligent and precise heat dissipation control, optimizes the operating status of the heat dissipation system while ensuring heat dissipation effect, improves heat dissipation efficiency and reduces unnecessary energy consumption.

[0037] Example 7 Based on Example 6, the reference time analysis submodule includes: The state matching degree calculation unit is used to calculate the matching degree between the current thermal field urgency state and the thermal field state at each historical moment based on the thermal field urgency coefficient at the current moment and the thermal field urgency coefficient at each historical moment in the historical heat dissipation efficiency reference matrix. The heat dissipation efficiency quantification unit is used to quantify the heat dissipation efficiency value at each historical moment in the historical heat dissipation efficiency reference matrix, in combination with its corresponding thermal state matrix, environmental matrix and actual heat dissipation results. The heat dissipation efficiency value includes temperature control efficiency, energy consumption cost coefficient and heat distribution improvement rate. The optimal moment filtering unit is used to select historical moments with a state matching degree higher than a preset matching threshold as candidate moments, and select the moment with the best heat dissipation efficiency value from the candidate moments as the best reference control moment.

[0038] In this embodiment, the state matching degree is calculated by the percentage of the absolute value of the difference between the current thermal field urgency coefficient and the thermal field urgency coefficient at historical moments; the heat dissipation efficiency value is obtained by the weighted sum of temperature control efficiency, energy consumption cost coefficient and heat distribution improvement rate, with temperature control efficiency having the highest weight and energy consumption cost coefficient having the second highest weight.

[0039] The working principle and beneficial effects of the above technical solution are as follows: The state matching degree calculation unit of the reference time analysis submodule calculates the matching degree between the current thermal field urgency coefficient and the thermal field urgency coefficient corresponding to each historical time in the historical heat dissipation efficiency reference matrix by calculating the ratio of the absolute value of the difference between the two to obtain the matching degree between the current thermal field urgency state and the thermal field state at each historical time. The heat dissipation efficiency quantification unit calculates the heat dissipation efficiency value at each historical time in the historical heat dissipation efficiency reference matrix by combining its corresponding thermal state matrix, environmental matrix and actual heat dissipation results, and by weighted summation of temperature control efficiency, energy consumption cost coefficient and heat distribution improvement rate (where temperature control efficiency has the highest weight and energy consumption cost coefficient has the second highest weight). The optimal time screening unit selects historical times with a state matching degree higher than the preset matching threshold as candidate times, and selects the time with the best heat dissipation efficiency value from the candidate times as the best reference control time. The calculation method of state matching degree can accurately measure the similarity between the current thermal field state and historical moments, ensuring that the selected reference moments have high comparability and reference value, and avoiding control deviations caused by excessive state differences. When quantifying heat dissipation efficiency, temperature control efficiency, energy consumption cost coefficient and heat distribution improvement rate are comprehensively considered, and temperature control efficiency is given the highest weight. This ensures the priority of heat dissipation effect while taking into account the optimization of energy consumption cost and heat distribution, making the performance evaluation more comprehensive and reasonable. By first screening candidate moments with high matching degree and then selecting the optimal performance moment, it is ensured that the best reference control moment not only matches the current state but also achieves the optimal heat dissipation efficiency. This makes the subsequent control target value more scientific, effectively improving the control accuracy and efficiency of the heat dissipation system, reducing energy consumption, improving heat distribution, and enhancing the system's adaptability to different thermal field states, further ensuring the stable operation of outdoor light-emitting semiconductor screens.

[0040] Example 8 Based on Example 1, the dynamic execution module includes: The control command generation unit is used to generate fan speed control commands, water pump flow control commands, and water pump power control commands based on the optimal control target value. The execution drive unit is used to drive the fan controller to adjust the fan speed to the target value, and drive the water pump controller to adjust the cooling water flow and water pump power to the target value, so as to realize the linkage control of air cooling and water cooling.

[0041] The working principle and beneficial effects of the above technical solution are as follows: The control instruction generation unit of the dynamic execution module generates fan speed control instructions, water pump flow control instructions and water pump power control instructions based on the optimal control target values ​​of all monitoring parameters of all types of heat dissipation methods at the current moment. The execution drive unit drives the fan controller to adjust the fan speed to the target value and drives the water pump controller to adjust the cooling water flow and water pump power to the target values, thereby realizing the linkage control of air cooling and water cooling. The control command generation unit can convert the optimal control target value into specific execution commands, ensuring the executability of the control target. The execution drive unit directly drives the fan and water pump controller to adjust parameters, realizing real-time linkage between air cooling and water cooling. This enables the heat dissipation system to quickly respond to control requirements and adjust its operating status in a timely manner to achieve the best heat dissipation effect, ensuring the timeliness and effectiveness of heat dissipation control. At the same time, the linkage control method can give full play to the advantages of air cooling and water cooling, improve the overall heat dissipation capacity, and adapt to the complex heat dissipation requirements of outdoor screens.

[0042] Example 9 Based on any one of Examples 1-8, a heat dissipation method for an outdoor light-emitting semiconductor screen includes the following steps: Step 1: Based on all monitoring parameters of all heat dissipation methods of the outdoor light-emitting semiconductor screen at each moment within a preset time period before the current moment, obtain the processed values ​​of all monitoring parameters of all heat dissipation methods of the screen at the current moment. Step 2: Based on the processed values ​​of all monitoring parameters of all types of heat dissipation methods at all times within the preset time period before the current time, obtain the thermal state matrix of the screen at the current time. Step 3: Based on all class environment parameters of the screen at all times within the preset time period before the current time, obtain the screen's environment matrix at the current time; Step 4: Obtain the surface temperature distribution data of the screen at the current moment, and calculate the thermal field pressure coefficient of the screen at the current moment based on the temperature distribution data; Step 5: Based on the screen's thermal state matrix, environmental matrix, and thermal field urgency coefficient at the current moment, obtain the optimal reference control time for the screen at the current moment, and based on the optimal reference control time, obtain the optimal control target values ​​for all monitoring parameters of all types of heat dissipation methods for the screen at the current moment. Step 6: Based on the optimal control target value of all monitoring parameters of all types of heat dissipation methods of the screen at the current moment, adjust the air cooling and water cooling systems of the screen to obtain the best multimodal linkage heat dissipation result of the screen at the current moment.

[0043] The working principle and beneficial effects of the above technical solution are as follows: The outdoor light-emitting semiconductor screen heat dissipation method sequentially performs the following steps: Step 1: Based on all monitoring parameters of all types of heat dissipation methods at each moment within a preset time period before the current moment of the screen, obtain the corresponding processing value at the current moment; Step 2: Based on the processing values ​​at all moments within the preset time period, obtain the thermal state matrix at the current moment; Step 3: Based on all types of environmental parameters at all moments within the preset time period, obtain the environmental matrix at the current moment; Step 4: Obtain the screen surface temperature distribution data at the current moment and calculate the thermal field pressure coefficient; Step 5: Based on the thermal state matrix, environmental matrix, and thermal field pressure coefficient, obtain the optimal reference control moment and the optimal control target value; Step 6: Based on the optimal control target value, regulate the air cooling and water cooling systems to obtain the optimal multimodal linkage heat dissipation result. This method features clear steps and rigorous logic. From data processing, matrix construction, thermal field analysis to control decisions and heat dissipation execution, it forms a complete closed-loop process, ensuring the systematic and standardized nature of the heat dissipation process. Each step is closely linked, with each step providing the data foundation for the next and the next step further processing the results of the previous step. This makes the entire heat dissipation process orderly and efficient, capable of comprehensively addressing the complexity of outdoor environments and the variability of screen thermal states. It effectively improves heat dissipation performance, ensures stable screen operation, extends screen lifespan, and simultaneously enhances the intelligence and operational efficiency of the heat dissipation system while reducing energy consumption and maintenance costs.

[0044] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. An outdoor light-emitting semiconductor screen heat dissipation system, characterized in that: include: The data acquisition and preprocessing module is used to obtain the processed values ​​of all monitoring parameters of all types of heat dissipation methods of the outdoor light-emitting semiconductor screen at the current moment, based on all monitoring parameters of all types of heat dissipation methods of the screen at each moment within a preset time period before the current moment. The thermal matrix construction module is used to obtain the thermal matrix of the screen at the current moment based on the processed values ​​of all monitoring parameters of all types of heat dissipation methods at all times within a preset time period before the current moment. The environment matrix construction module is used to obtain the screen's environment matrix at the current moment based on all class environment parameters of the screen at all times within a preset time period before the current moment; The thermal field distribution analysis module is used to acquire the surface temperature distribution data of the screen at the current moment, and calculate the thermal field pressure coefficient of the screen at the current moment based on the temperature distribution data. The linkage control decision module is used to obtain the optimal reference control time of the screen at the current moment based on the screen's thermal state matrix, environmental matrix, and thermal field urgency coefficient, and based on the optimal reference control time, to obtain the optimal control target value of all monitoring parameters of all types of heat dissipation methods of the screen at the current moment. The dynamic execution module is used to adjust the screen's air-cooling and water-cooling systems based on the optimal control target value of all monitoring parameters of all types of heat dissipation methods at the current moment, so as to obtain the best multimodal linkage heat dissipation result of the screen at the current moment.

2. The outdoor light-emitting semiconductor screen heat dissipation system according to claim 1, characterized in that: The data acquisition and preprocessing module includes: The acquisition submodule is used to acquire all monitoring parameters of air cooling and water cooling at each moment within a preset time period before the current moment; The critical moment determination submodule is used to determine a critical moment when the difference between each monitoring parameter of each type of heat dissipation method of the screen at a time within a preset time period before the current moment and the corresponding monitoring parameter of the corresponding type of heat dissipation method at all adjacent times is not greater than a preset difference. The numerical processing and acquisition submodule is used to calculate the average value of each monitoring parameter of each type of heat dissipation method for all key moments within a preset time period before the current moment, and use it as the processed value of the corresponding monitoring parameter of the corresponding type of heat dissipation method for the screen at the current moment.

3. The outdoor light-emitting semiconductor screen heat dissipation system according to claim 1, characterized in that: The thermal matrix construction module includes: The status value calculation submodule is used to take the ratio between the processing value of each monitoring parameter of each type of heat dissipation method at each moment of the preset time period before the current moment and the maximum value among the processing values ​​of the corresponding monitoring parameter of the corresponding type of heat dissipation method at all moments of the preset time period before the current moment as the status value of the processing value of the monitoring parameter of the corresponding type of heat dissipation method at that moment. The ordinal definition submodule is used to take the sum of the state values ​​of the monitoring parameters of each type of heat dissipation method of the screen in all time periods within the preset time period before the current time as the state and value of the monitoring parameters of the corresponding type of heat dissipation method of the screen at the current time, and define the ordinal values ​​of all monitoring parameters of all types of heat dissipation methods of the screen at the current time in descending order of state and value. The matrix construction submodule is used to construct a thermal matrix based on the state values ​​of each type of heat dissipation method and each type of monitoring parameter processing value at all times and their ordinal definition results at the current time.

4. The outdoor light-emitting semiconductor screen heat dissipation system according to claim 1, characterized in that: The environment matrix construction module includes: The parameter processing submodule is used to obtain the ambient temperature behind the screen, ambient air temperature, solar radiation intensity, and ambient wind speed at each moment within a preset time period before the current moment, and to calculate the temperature rise potential parameter of the screen at each moment within the preset time period before the current moment. The temperature rise potential parameter is the difference between the ambient temperature behind the screen and the ambient air temperature. The matrix construction submodule is used to construct an environmental matrix based on the ambient temperature behind the screen, ambient air temperature, solar radiation intensity, ambient wind speed, and optional temperature rise potential parameters at all times.

5. The outdoor light-emitting semiconductor screen heat dissipation system according to claim 1, characterized in that: The thermal field distribution analysis module includes: The thermal field parameter calculation submodule is used to calculate the highest temperature point, average temperature, and temperature standard deviation of the screen at the current moment based on the screen surface temperature distribution data. The Compression Factor Calculation Submodule is used to calculate the thermal field compression factor based on the highest temperature point, average temperature, and temperature standard deviation.

6. The outdoor light-emitting semiconductor screen heat dissipation system according to claim 5, characterized in that: The formula for calculating the thermal field pressure coefficient is: ;in, For thermal field tightness coefficient, The temperature at the highest point. For safe temperature threshold, For temperature standard deviation, The average temperature. and These are the weighting coefficients for local overheating and uneven heat distribution, respectively.

7. The outdoor light-emitting semiconductor screen heat dissipation system according to claim 1, characterized in that: The coordinated control decision-making module includes: The reference matrix generation submodule is used to generate a historical heat dissipation performance reference matrix of the screen at the current moment based on the thermal matrix and the environment matrix. The reference time analysis submodule is used to select the best reference control time from the historical heat dissipation performance reference matrix by combining the thermal field urgency coefficient and matching the current thermal field urgency state. The target value determination submodule is used to determine the processed values ​​of all monitoring parameters of all types of heat dissipation methods corresponding to the optimal reference control time as the optimal control target value of the corresponding monitoring parameter of the corresponding type of heat dissipation method of the screen at the current time.

8. The outdoor light-emitting semiconductor screen heat dissipation system according to claim 7, characterized in that: The reference time analysis submodule includes: The state matching degree calculation unit is used to calculate the matching degree between the current thermal field urgency state and the thermal field state at each historical moment based on the thermal field urgency coefficient at the current moment and the thermal field urgency coefficient at each historical moment in the historical heat dissipation efficiency reference matrix. The heat dissipation efficiency quantification unit is used to quantify the heat dissipation efficiency value at each historical moment in the historical heat dissipation efficiency reference matrix, in combination with its corresponding thermal state matrix, environmental matrix and actual heat dissipation results. The heat dissipation efficiency value includes temperature control efficiency, energy consumption cost coefficient and heat distribution improvement rate. The optimal moment filtering unit is used to select historical moments with a state matching degree higher than a preset matching threshold as candidate moments, and select the moment with the best heat dissipation efficiency value from the candidate moments as the best reference control moment.

9. The outdoor light-emitting semiconductor screen heat dissipation system according to claim 1, characterized in that: The dynamic execution module includes: The control command generation unit is used to generate fan speed control commands, water pump flow control commands, and water pump power control commands based on the optimal control target value. The execution drive unit is used to drive the fan controller to adjust the fan speed to the target value, and drive the water pump controller to adjust the cooling water flow and water pump power to the target value, so as to realize the linkage control of air cooling and water cooling.

10. A method for heat dissipation of an outdoor light-emitting semiconductor screen, used for heat dissipation of the screen using an outdoor light-emitting semiconductor screen heat dissipation system as described in any one of claims 1-9, characterized in that: Includes the following steps: Step 1: Based on all monitoring parameters of all heat dissipation methods of the outdoor light-emitting semiconductor screen at each moment within a preset time period before the current moment, obtain the processed values ​​of all monitoring parameters of all heat dissipation methods of the screen at the current moment. Step 2: Based on the processed values ​​of all monitoring parameters of all types of heat dissipation methods at all times within the preset time period before the current time, obtain the thermal state matrix of the screen at the current time. Step 3: Based on all class environment parameters of the screen at all times within the preset time period before the current time, obtain the screen's environment matrix at the current time; Step 4: Obtain the surface temperature distribution data of the screen at the current moment, and calculate the thermal field pressure coefficient of the screen at the current moment based on the temperature distribution data; Step 5: Based on the screen's thermal state matrix, environmental matrix, and thermal field urgency coefficient at the current moment, obtain the optimal reference control time for the screen at the current moment, and based on the optimal reference control time, obtain the optimal control target values ​​for all monitoring parameters of all types of heat dissipation methods for the screen at the current moment. Step 6: Based on the optimal control target value of all monitoring parameters of all types of heat dissipation methods of the screen at the current moment, adjust the air cooling and water cooling systems of the screen to obtain the best multimodal linkage heat dissipation result of the screen at the current moment.

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