Thermal management for electrical components

Abstract

A heat transfer assembly (50) includes a cold plate (150) comprising a cold plate body (152) to form a fluid cavity configured to receive coolant. The cold plate includes a fluid inlet (156) and a fluid outlet (158) in fluid communication with the fluid cavity. The heat transfer assembly includes a thermal bridge (200) coupled to the cold plate. The thermal bridge includes an upper thermal interface (102) and a lower thermal interface (104). The thermal bridge includes a plurality of staggered plates arranged in a plate stack (402), wherein the plates are movable relative to each other in the plate stack. The lower thermal interface is configured to be in thermal communication with an electrical component (100) to dissipate heat from the electrical component. The thermal bridge extends through the cold plate body, wherein the upper thermal interface is exposed in the fluid cavity to contact the coolant.

Description

Technical Field

[0001] The main topic of this article concerns thermal management for electrical components. Background Technology

[0002] It may be desirable to transfer heat energy (or heat) from designated components of a system or device. Some systems use electrical components (such as electrical connectors) to transmit data and / or power to and from different systems or devices. Some systems use electrical components, such as pluggable modules, for transmitting data signals in the form of optical and / or electrical signals over (multiple) communication cables. Some systems use electrical components (such as integrated circuits) to control the system. Electrical components define heat sources within the system.

[0003] A common challenge for electrical system developers is thermal management. Heat generated by electrical components within a system can degrade performance or even damage system components. To dissipate this heat, systems include thermal components, such as heat sinks, which are connected to a heat source to absorb heat and transfer it away. The amount of heat dissipation from such a system can be limited. Some known electrical systems include cold plates to dissipate heat from hot components, thus improving heat dissipation compared to heat sinks. However, connecting a cold plate to a hot component (e.g., a pluggable I / O module) can be challenging. Furthermore, such systems incorporating cold plates typically involve multiple thermal interfaces between the hot component and the cold plate. Each thermal interface creates a thermal interruption, resulting in inefficient heat dissipation.

[0004] There is a need for a thermal management system that can effectively transfer heat away from electrical components. Summary of the Invention

[0005] According to one aspect of the invention, a heat transfer assembly is provided, comprising a cold plate including a cold plate body to form a fluid cavity configured to receive a coolant. The cold plate includes a fluid inlet and a fluid outlet in fluid communication with the fluid cavity. The heat transfer assembly includes a thermal bridge coupled to the cold plate. The thermal bridge includes an upper thermal interface and a lower thermal interface. The thermal bridge includes a plurality of staggered plates arranged in a plate stack, wherein the plates are movable relative to each other within the plate stack. The lower thermal interface is configured to be in thermal communication with electrical components to dissipate heat from the electrical components. The thermal bridge extends through the cold plate body, wherein the upper thermal interface is exposed in the fluid cavity to contact the coolant.

[0006] According to another aspect of the invention, a heat transfer assembly is provided, comprising a cold plate including a cold plate body to form a fluid cavity configured to receive coolant. The cold plate includes a fluid inlet and a fluid outlet in fluid communication with the fluid cavity. The heat transfer assembly includes a thermal bridge coupled to the cold plate. The thermal bridge includes an upper bridge assembly thermally coupled to the cold plate, a lower bridge assembly configured to be thermally coupled to an electrical component, and a spring element between the upper and lower bridge assemblies allowing expansion and compression of the thermal bridge. The upper bridge assembly includes a plurality of upper plates arranged in an upper plate stack. Each upper plate has a front end and a rear end. Each upper plate has a side portion between the front and rear ends. Each upper plate has an inner end and an outer end. The outer end of the upper plate forms an upper thermal interface. The upper bridge assembly extends through the cold plate body, wherein the upper thermal interface is exposed in the fluid cavity to contact the coolant. The lower bridge assembly includes a plurality of lower plates arranged in a lower plate stack. Each lower plate has a front end and a rear end. Each lower plate has a side portion between the front and rear ends. Each lower plate has an inner end and an outer end. The outer end of the lower plate is configured to face and thermally connect to electrical components. The side of the lower plate faces the side of the upper plate so that the lower plate is thermally connected to the upper plate. The spring element includes an upper spring member that engages with the upper plate and a lower spring member that engages with the lower plate to bias the lower plate using an opening force substantially away from the upper plate.

[0007] According to another aspect of the invention, a communication system is provided, comprising an electrical component including a hot surface. The communication system includes a heat transfer assembly thermally coupled to the hot surface to dissipate heat from the electrical component. The heat transfer assembly includes a cold plate and a thermal bridge coupled to the cold plate. The cold plate includes a cold plate body to form a fluid cavity configured to receive coolant. The cold plate includes a fluid inlet and a fluid outlet in fluid communication with the fluid cavity. The thermal bridge includes an upper thermal interface and a lower thermal interface. The thermal bridge includes a plurality of staggered plates arranged in a plate stack, wherein the plates are movable relative to each other in the plate stack. The lower thermal interface is configured to be in thermal communication with the hot surface of the electrical component to dissipate heat from the electrical component. The thermal bridge extends through the cold plate body, wherein the upper thermal interface is exposed in the fluid cavity to contact the coolant. Attached Figure Description

[0008] Figure 1 This is a front perspective view of a communication system formed according to an exemplary embodiment.

[0009] Figure 2 This is a top perspective view of a heat transfer assembly according to an exemplary embodiment.

[0010] Figure 3 This is a bottom perspective view of a heat transfer assembly according to an exemplary embodiment.

[0011] Figure 4 This is an exploded view of a heat transfer assembly according to an exemplary embodiment.

[0012] Figure 5This is a front perspective view of a portion of a thermal bridge according to an exemplary embodiment.

[0013] Figure 6 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment.

[0014] Figure 7 This is a side view of a portion of a thermal bridge according to an exemplary embodiment.

[0015] Figure 8 A pair of plates according to an exemplary embodiment is shown, including an upper plate and a lower plate arranged relative to each other in the pair.

[0016] Figure 9 A pair of plates according to an exemplary embodiment is shown, including an upper plate and a lower plate arranged relative to each other in the pair.

[0017] Figure 10 This is a top perspective view of a portion of a heat transfer assembly according to an exemplary embodiment, wherein the cold plate housing is removed to show the thermal bridge relative to the base of the cold plate.

[0018] Figure 11 This is a cross-sectional view of a portion of a heat transfer assembly according to an exemplary embodiment, wherein the cold plate housing is removed to show the thermal bridge relative to the base of the cold plate.

[0019] Figure 12 This is a cross-sectional view of a portion of a heat transfer assembly according to an exemplary embodiment.

[0020] Figure 13 This is a cross-sectional view of a heat transfer component according to an exemplary embodiment.

[0021] Figure 14 This is a cross-sectional view of a portion of a heat transfer assembly according to an exemplary embodiment, showing coolant channels through the heat transfer assembly.

[0022] Figure 15 This is a cross-sectional view of a portion of a heat transfer assembly according to an exemplary embodiment.

[0023] Figure 16 This is a top perspective view of a heat transfer assembly according to an exemplary embodiment.

[0024] Figure 17 This is according to an exemplary embodiment. Figure 16 The diagram shows a cross-sectional view of the heat transfer component.

[0025] Figure 18 This is according to an exemplary embodiment. Figure 16 The exploded top-view perspective view of the heat transfer assembly is shown.

[0026] Figure 19 This is according to an exemplary embodiment. Figure 16The exploded perspective view of the heat transfer assembly shown.

[0027] Figure 20 This is a cross-sectional view of a portion of the heat transfer assembly 50 according to an exemplary embodiment. Detailed Implementation

[0028] Figure 1 This is a front perspective view of a communication system 10 formed according to an exemplary embodiment. The communication system 10 includes a heat transfer assembly 50 having heat dissipation components for thermal management of one or more electrical components 100 of the communication system 10. The heat transfer assembly 50 is thermally coupled to the electrical components(s) 100 to dissipate heat from the electrical components(s) 100 when cooperating with the electrical components(s) 100.

[0029] In an exemplary embodiment, the heat transfer assembly 50 includes a cold plate 150 and a thermal bridge 200 coupled to the cold plate 150. The cold plate 150 is a conductive cooling device. In an exemplary embodiment, the cold plate 150 is a liquid cold plate that uses a liquid coolant to dissipate heat. The cold plate 150 allows fluid to circulate through it to dissipate heat from the communication system 10. In an exemplary embodiment, the thermal bridge 200 is in direct thermal communication with the liquid coolant for efficient heat transfer between the thermal bridge 200 and the coolant. For example, a portion of the thermal bridge 200 extends into the interior of the cold plate 150 for direct contact with the coolant. The coolant removes heat directly from the thermal bridge 200 without any additional interface between the thermal bridge 200 and the coolant. The cold plate 150 and the thermal bridge 200 are sealed to contain the coolant and allow the coolant to circulate through the heat transfer assembly.

[0030] Thermal bridge 200 is configured to thermally connect to cold plate 150, such as coolant in cold plate 150, at the upper thermal interface 102 at the top of thermal bridge 200. Thermal bridge 200 is configured to thermally connect to electrical component 100 at the lower thermal interface 104 at the bottom of thermal bridge 200. Thermal bridge 200 thermally connects electrical component 100 and cold plate 150 to transfer heat from electrical component 100.

[0031] In an exemplary embodiment, the thermal bridge 200 is compressible to allow the lower thermal interface 104 to conform to the electrical component 100. The lower thermal interface 104 may be conformable to the shape of the electrical component 100 to facilitate efficient heat transfer between them. For example, the thermal bridge 200 may be a stacked plate structure, wherein the individual plates are movable relative to each other to conform to the electrical component 100. Hot grease or other thermal interface materials may be provided at the lower thermal interface 104 to enhance heat transfer between the thermal bridge 200 and the electrical component 100.

[0032] Electrical component 100 can be mounted to circuit board 110. In various embodiments, electrical component 100 can be a communication connector, such as a receptacle connector, headstock connector, plug connector, or another type of communication connector. In other various embodiments, electrical component 100 can be an electronic package, such as an integrated circuit. In other various embodiments, electrical component 100 can be a pluggable module, such as an I / O transceiver module. In alternative embodiments, other types of electrical components may be provided.

[0033] Figure 2 This is a top perspective view of the heat transfer assembly 50 according to an exemplary embodiment. Figure 3 This is a bottom perspective view of a heat transfer assembly 50 according to an exemplary embodiment. The heat transfer assembly 50 includes a cold plate 150 and a thermal bridge 200.

[0034] The cold plate 150 includes a cold plate body 152 forming a fluid cavity 154 configured to receive coolant. The cold plate body 152 may be a multi-piece body, for example, including a cold plate base 170 at the bottom and a cold plate housing 190 at the top. In alternative embodiments, the cold plate body 152 may include additional body elements. In various other embodiments, the cold plate body 152 may be a single-piece body. In an exemplary embodiment, the cold plate body 152 is made of a thermally conductive material, such as a metallic material, such as aluminum or copper. The cold plate body 152 may be formed by die casting, molding, stamping, or other forming processes. In various other embodiments, the cold plate body 152 may be made of a plastic material, such as a molded plastic body. The plastic material may be a thermally conductive plastic material.

[0035] The cold plate 150 includes a fluid inlet 156 with a fluid inlet fitting 157 and a fluid outlet 158 ​​with a fluid outlet fitting 159. Coolant flows into the fluid chamber 154 through the fluid inlet 156. Coolant flows out of the fluid chamber 154 through the fluid outlet 158. In an exemplary embodiment, a thermal bridge 200 extends through the cold plate body 152 into the fluid chamber 154. The thermal bridge 200 contacts the coolant in the fluid chamber 154 to dissipate heat from the thermal bridge 200.

[0036] Cold plate 150 extends between front portion 160 and rear portion 162. Cold plate 150 includes a top portion 164 and a bottom portion 166. Cold plate 150 has a side portion 168 between the top portion 164 and the bottom portion 166. Cold plate 150 may be rectangular. However, in alternative embodiments, cold plate 150 may have other shapes. In other embodiments, cold plate 150 may include additional sides, walls, and / or surfaces.

[0037] Figure 4This is an exploded view of a heat transfer assembly 50 according to an exemplary embodiment. The heat transfer assembly 50 includes a cold plate 150 and a thermal bridge 200. The thermal bridge 200 is configured to be thermally coupled to the cold plate 150. For example, the upper portion of the thermal bridge 200 at the upper thermal interface 102 is configured to be received within the interior of the cold plate 150 for direct engagement with a coolant. In an exemplary embodiment, the heat transfer assembly 50 includes a fluid barrier 140 configured to be coupled to the thermal bridge 200 and / or the cold plate 150 to provide a fluid seal for the heat transfer assembly 50.

[0038] In the illustrated embodiment, the cold plate 150 includes a cold plate base 170 and a cold plate housing 190. In an exemplary embodiment, a thermal bridge 200 is configured to connect to the cold plate base 170. For example, the thermal bridge 200 may extend through the cold plate base 170 into a fluid cavity 154. The upper portion of the thermal bridge 200 is configured to extend into the fluid cavity 154 within the cold plate housing 190. The cold plate housing 190 is configured to cover the upper portion of the thermal bridge 200.

[0039] The cold plate base 170 includes a base portion 172 and a support portion 174 extending from the base portion 172. The base portion 172 may be located at the rear of the cold plate base 170, and the support portion 174 may be located at the front of the cold plate base 170. In alternative embodiments, other locations are also possible. In the illustrated embodiment, the base portion 172 is thicker than the support portion 174. The base portion 172 may be generally box-shaped. However, in alternative embodiments, the base portion 172 may have other shapes. In the illustrated embodiment, the support portion 174 is generally planar. For example, the support portion 174 may be plate-shaped. In alternative embodiments, the support portion 174 may have other shapes.

[0040] In an exemplary embodiment, a fluid inlet 156 and a fluid outlet 158 ​​pass through a base portion 172. The fluid inlet 156 and fluid outlet 158 ​​may serve as channels to a support portion 174, allowing coolant to flow into and out of the fluid chamber 154. The base portion 172 receives a fluid inlet fitting 157 and a fluid outlet fitting 159. For example, the inlet and outlet fittings 157, 159 may be coupled to a rear portion of the base portion 172. The inlet and outlet fittings 157, 159 may be threaded onto the base portion 172. In alternative embodiments, the inlet and outlet fittings 157, 159 may be attached in other ways. In an exemplary embodiment, the inlet and outlet fittings 157, 159 have a sealing interface with the base portion 172.

[0041] The support portion 174 includes an upper surface 176 and a lower surface 178. A cold plate housing 190 is configured to be coupled to the upper surface 176. For example, a fluid cavity 154 is defined between the cold plate housing 190 and the upper surface 176 of the support portion 174. In an exemplary embodiment, the support portion 174 of the cold plate base 170 includes an opening 180 therethrough. The opening 180 is surrounded by sidewalls 182 and endwalls 184. The opening 180 is sized and shaped to receive a thermal bridge 200. The thermal bridge 200 is configured to be coupled to the support portion 174. For example, the thermal bridge 200 may be coupled to the lower surface 178 of the support portion 174 and / or around the edge of the opening 180. A portion of the thermal bridge 200 may extend over the upper surface 176 into the fluid cavity 154 to contact the coolant in the fluid cavity 154.

[0042] The cold plate housing 190 is configured to attach to the cold plate base 170 to form a fluid cavity 154. The cold plate housing 190 covers the thermal bridge 200. In an exemplary embodiment, the cold plate housing 190 includes an outer wall 192 and side walls 194 extending from the outer wall 192. In the illustrated embodiment, the cold plate housing 190 is generally box-shaped. However, in alternative embodiments, the cold plate housing 190 may have other shapes. The outer wall 192 and the side walls 194 surround the fluid cavity 154. The cold plate base 170 forms the bottom of the fluid cavity 154. A portion of the thermal bridge 200 may close a portion of the bottom of the fluid cavity 154. For example, the thermal bridge 200 may close an opening 180, and the fluid barrier 140 may seal the thermal bridge 200 at the opening 180.

[0043] In an exemplary embodiment, thermal bridge 200 includes an upper bridge assembly 202 and a lower bridge assembly 204. In an exemplary embodiment, thermal bridge 200 includes a spring element 206 between the upper bridge assembly and the lower bridge assemblies 202, 204, and a bridge frame 208 for holding the upper bridge assembly and the lower bridge assemblies 202, 204 together. The lower bridge assembly 204 is configured to be coupled to and thermally contacted with the electrical component 100. The upper bridge assembly 202 is configured to be coupled to and thermally contacted with the cold plate 150. In an exemplary embodiment, the upper bridge assembly 204 is configured to transfer heat to a coolant. For example, a portion of the upper bridge assembly 202 is received in a fluid cavity 154 to be in direct contact with the coolant. The upper bridge assembly 202 is in thermal communication with the lower bridge assembly 204 and transfers heat from the lower bridge assembly 204 to cool the electrical component 100.

[0044] Multiple spring elements 206 bias the upper bridge assembly 202 and the lower bridge assembly 204 separately. The upper and lower bridge assemblies 202 and 204 are compressible relative to each other. For example, the upper and lower bridge assemblies 202 and 204 are compressible between the electrical component 100 and the cold plate 150 (e.g., to compress the spring elements 206). In an alternative embodiment, the thermal bridge 200 may be provided without the spring elements 206. In such an embodiment, the upper bridge assembly 202 may be coupled to the cold plate 150, and the lower bridge assembly 204 may be coupled to the electrical component 100, and the upper and lower bridge assemblies 202 and 204 are configured to engage with each other to form the thermal bridge 200. The lower bridge assembly 204 may engage or otherwise coupled to the electronic component 100.

[0045] Bridge frame 208 provides support for the upper and lower bridge assemblies 202, 204. For example, bridge frame 208 may surround the outer periphery or periphery of thermal bridge 200 to hold components within the internal space of bridge frame 208. In an exemplary embodiment, bridge frame 208 may extend along its sides and ends, leaving a top and bottom to form a thermal interface with electrical component 100 and coolant. Alternatively, bridge frame 208 may provide internal support via bridge assemblies 202, 204. For example, connecting spars, pins, or other types of internal connecting elements may pass through bridge assemblies 202, 204.

[0046] In an exemplary embodiment, spring element 206 presses against upper bridge assembly 202 in a first bias direction (e.g., upward), and spring element 206 presses against lower bridge assembly 204 in a second bias direction (e.g., downward). Upper bridge assembly 202 and lower bridge assembly 204 may be held by bridge frame 208 to allow a limited amount of floating movement of upper bridge assembly 202 and / or lower bridge assembly 204 relative to bridge frame 208.

[0047] In an exemplary embodiment, thermal bridge 200 is a parallelepiped (e.g., generally box-shaped). For example, thermal bridge 200 includes a top 270, a bottom 272, a front portion 274, a rear portion 276, a first side portion 280, and a second side portion 282. Top 270 may be generally planar. Bottom 272 may be generally planar. Front 274 may be generally planar. Rear 276 may be generally planar. First side portion 280 may be generally planar. Second side portion 282 may be generally planar. However, in alternative embodiments, thermal bridge 200 may have other shapes. A frame structure for holding thermal bridge 200 together is defined by bridge frame 208. Top 270 and bottom 272 have large surface areas to allow a large amount of available external surface area for heat transfer.

[0048] In an exemplary embodiment, bridge assemblies 202 and 204 each include a plurality of plates arranged together in a plate stack. These plates are staggered to provide thermal communication between the upper bridge assembly 202 and the lower bridge assembly 204. Each plate is movable relative to each other, allowing the plates to be individually hinged to conform to the electrical component 100. For example, each plate may conform to the electrical component 100 at the lower thermal interface 104 to improve contact and / or proximity between the thermal bridge 200 and the electrical component 100. Gaps or spaces may be provided between the plates of the upper bridge assembly 202 and the lower bridge assembly 204 to allow compressive movement of the spring element 206 between the bridge assemblies 202 and 204.

[0049] In an exemplary embodiment, the bridge frame 208 is made of a plurality of frame elements that can be connected together to form a support structure for the bridge assemblies 202, 204. For example, the frame elements may surround the outer periphery of the plate stack. The frame elements may extend through the interior of the plate stack to hold the bridge assemblies 202, 204. In an exemplary embodiment, the bridge frame 208 includes a front rail 240, a rear rail 250, a first side rail 260 extending between the front rail 240 and the rear rail 250, and a second side rail 262 extending between the front rail 240 and the rear rail 250. The rails may be stamped elements. In an exemplary embodiment, the front rail and the rear rail 240, 250 engage the bridge assemblies 202, 204 to limit the deployment of the bridge assemblies 202, 204 against the opening force of the spring element 206.

[0050] Figure 5 This is a front perspective view of a portion of the thermal bridge 200 according to an exemplary embodiment. Figure 6 This is a cross-sectional view of the thermal bridge 200 according to an exemplary embodiment. Figure 7 This is a side view of a portion of the thermal bridge 200 according to an exemplary embodiment. Figure 5 and Figure 6 Part of bridge frame 208 has been removed to show the plates of bridge assemblies 202 and 204.

[0051] In an exemplary embodiment, the upper bridge assembly 202 includes a plurality of upper plates 300 arranged in an upper plate stack 302. Each upper plate 300 has a side portion 304 extending between an inner end 306 and an outer end 308 of the upper plate 300. The inner end 306 faces the lower bridge assembly 204. The outer end 308 faces outward, for example, toward the top. Optionally, the various upper plates 300 may have different shapes, such as different heights and / or different features between the inner end 306 and the outer end 308.

[0052] In an exemplary embodiment, the lower bridge assembly 204 includes a plurality of lower plates 400 disposed in a lower plate stack 402. Each lower plate 400 has a side 404 extending between an inner end 406 and an outer end 408 of the lower plate 400. The inner end 406 faces the upper bridge assembly 202. The outer end 408 faces outward, for example toward an electrical component 100 (such as...). Figure 1 (As shown). Optionally, the various lower plates 400 may have different shapes and / or heights between the inner end 406 and the outer end 408.

[0053] In an exemplary embodiment, upper and lower plates 300, 400 are arranged as plate pairs 230. Each plate pair 230 includes an upper plate 300 and a lower plate 400. The plates 300, 400 in the plate pair 230 are aligned with each other. For example, the upper plate 300 and lower plate 400 are stacked vertically, with the upper plate 300 above the lower plate 400. The plate pairs 230 are stacked together to form a thermal bridge 200 in the stacked arrangement. A bridge frame 208 holds the plate pairs 230 in the stacked arrangement. A spring element 206 is configured to be positioned between the upper and lower plates 300, 400 and to separate the upper plate 300 from the lower plate 400.

[0054] For further reference Figure 8 and Figure 9 , Figure 8 and Figure 9 Various plate pairs 230 are shown, including an upper plate 300 and a lower plate 400 arranged relative to each other in the plate pair 230. Figure 8 The first pair of 232 is shown. Figure 9 The second pair 234 is shown. The upper plate 300 of the first pair 232 is different from the upper plate 300 of the second pair 234. The lower plate 400 of the first pair 232 is different from the lower plate 400 of the second pair 234.

[0055] In an exemplary embodiment, the upper plate 300 includes an upper limiting tab 310 for positioning the upper plate 300 relative to the lower plate 400 and / or relative to the bridge frame 208. The upper limiting tab 310 may engage the lower plate 400 and / or the bridge frame 208 to position the upper plate 300 within the upper plate stack 302. The upper limiting tab 310 restricts vertical movement of the upper plate 300 to limit the upper plate 300 from unfolding from the lower plate 400. A spring element 206 may press the upper plate 300 outward (e.g., upward) until the upper limiting tab 310 bottoms against the lower plate 400, the bridge frame 208, or other intermediate structures.

[0056] In an exemplary embodiment, the upper panel 300 includes an upper interface panel 320 ( Figure 8 ) and upper partition 322 ( Figure 9 The upper partition 322 is located between the upper interface plates 320. Both the upper interface plate 320 and the upper partition 322 include an upper limiting tab 310.

[0057] refer to Figure 8 Each upper interface plate 320 includes a base 330, an overlapping region 332 at an inner end 306, and a fluid delivery portion 334 at an outer end 308. The overlapping region 332 is configured to overlap with an adjacent lower plate 400 of the lower bridge assembly 204, and the fluid delivery portion 334 is configured to directly engage with the coolant fluid. The overlapping region 332 provides a large surface area configured for thermal bonding to the lower plate 400. The fluid delivery portion 334 extends above the base 330 and is configured to be received in a fluid cavity 154. The fluid delivery portion 334 provides a large surface area configured for thermal bonding to the coolant. For example, the sides of the fluid delivery portion 334 may directly interface with the coolant. In various embodiments, the upper interface plate 320 includes an upper gap 336 for receiving a portion of the spring element 206.

[0058] refer to Figure 9 Each upper baffle 322 includes a baffle base 350 at its outer end 308. The baffle base 350 is alignable with the base 330 of the upper interface plate 320. The fluid transfer portion 334 of the upper interface plate 320 extends above the baffle base 350. Fluid barrier 140 ( Figure 4 It can be applied to or attached to the base 350 of the partition, for example at the outer end 308 of the base 350 of the partition.

[0059] In an exemplary embodiment, the lower plate 400 includes a lower limiting tab 410 for positioning the lower plate 400 relative to the upper plate 300 and / or relative to the bridge frame 208. The lower limiting tab 410 may engage the upper plate 300 and / or the bridge frame 208 to position the lower plate 400 within the lower plate stack 402. The lower limiting tab 410 restricts vertical movement of the lower plate 400 to limit the lower plate 400 from unfolding from the upper plate 300. A spring element 206 may press the lower plate 400 outward (e.g., downward) until the lower limiting tab 410 bottoms against the upper plate 300, the bridge frame 208, or other intermediate structures.

[0060] In an exemplary embodiment, the lower plate 400 includes a lower interface plate 420 ( Figure 9 ) and lower partition 422 ( Figure 8 The lower partition 422 is located between the lower interface plates 420. Both the lower interface plate 420 and the lower partition 422 include a lower limiting tab 410.

[0061] refer to Figure 9Each lower interface plate 420 includes a base 430 at an outer end 408 and an overlapping region 432 at an inner end 406, the overlapping region being configured to overlap with an adjacent upper plate 300 of the upper bridge assembly 202. For example, the overlapping region 432 overlaps with the overlapping region 332 of an adjacent upper interface plate 320. The overlapping region 432 provides a large surface area configured to be thermally coupled to the upper interface plate 320. The overlapping region 432 is configured to overlap with the overlapping region 332 by an overlap distance sufficient to allow effective heat transfer between the lower plate 400 and the upper plate 300. The sides of the plates are slidable relative to each other to allow movement between the upper plate 300 and the lower plate 400 and to change the overlap distance. In various embodiments, the lower interface plate 420 includes a lower gap 436 that receives a portion of the spring element 206.

[0062] refer to Figure 8 Each lower partition 422 includes a partition base 450 at its outer end 308. The partition base 450 is alignable with the base 430 of the lower interface plate 420. A gap is provided between the lower partition base 450 and the upper interface plate 320. The gap may narrow when the thermal bridge 200 is compressed (e.g., when the spring element 206 is compressed).

[0063] Figure 10 This is a top perspective view of a portion of a heat transfer assembly 50 according to an exemplary embodiment, wherein the cold plate housing 190 is removed to show the thermal bridge 200 relative to the cold plate base 170. Figure 11 This is an end view of a portion of a heat transfer assembly 50 according to an exemplary embodiment, wherein the cold plate housing 190 is removed to show a thermal bridge 200 relative to the cold plate base 170.

[0064] During assembly, thermal bridge 200 is connected to cold plate 150. For example, thermal bridge 200 is connected to the lower surface 178 of cold plate base 170. Thermal bridge 200 may be brazed, welded, fastened, clamped, latched, or otherwise connected to cold plate base 170. For example, bridge frame 208 may be connected to cold plate base 170. When assembled, thermal bridge 200 passes through opening 180. For example, the upper portion of thermal bridge 200 is located above upper surface 176. In alternative embodiments, bridge frame 208 may be located in opening 180 or above cold plate base 170.

[0065] In the illustrated embodiment, the fluid delivery portion 334 of the upper interface plate 320 is located above the cold plate base 170 (e.g., in the fluid cavity 154). The fluid delivery portion 334 is configured to be in direct contact with the coolant in the cold plate 150. In an exemplary embodiment, the fluid delivery portions 334 are parallel to each other and spaced apart to define a fluid passage 340 between the fluid delivery portions 334. The fluid passage 340 is configured to receive coolant circulating through the fluid cavity 154, such that the coolant flows along the side portion 304 of the fluid delivery portion 334.

[0066] Fluid barrier 140 ( Figure 11 The fluid barrier 140 can be applied to or attached to the base 350 of the partition, for example, at the outer end 308 of the base 350. The fluid barrier 140 provides a fluid seal to seal the fluid cavity via the plate stack 302. For example, the fluid barrier 140 provides a fluid seal between the thermal bridge 200 and the cold plate 150 to seal the fluid cavity. The fluid barrier 140 can be directly sealed to the cold plate 150, for example, to the cold plate base 170. For example, the fluid barrier 140 can be sealed to the upper surface 176 and / or at the inner edge defining the opening 180. The fluid barrier 140 can be directly sealed to the upper plate 300. For example, the fluid barrier 140 can be sealed to the side of the fluid transfer section 334 and / or the outer end 308 of the partition 322. The fluid barrier 140 can provide a fluid seal to seal the fluid cavity through the interior of the thermal bridge 200. For example, the fluid barrier 140 can be sealed between the upper plates 300. In various embodiments, the fluid barrier 140 may be sealed to the sides of the fluid delivery section 334 and the sides of the partition 322.

[0067] In an exemplary embodiment, the fluid barrier 140 includes a solder layer 142 soldered to an upper plate 300 in the plate stack 302. The solder layer 142 may be applied directly to the upper plate 300 and / or the cold plate base 170. The solder layer 142 may partially fill the space between the upper plates 300.

[0068] Figure 12 This is a cross-sectional view of a portion of the heat transfer assembly 50 according to an exemplary embodiment. Figure 13 This is a cross-sectional view of the heat transfer assembly 50 according to an exemplary embodiment. Figure 12 and Figure 13 A cold plate housing 190 is shown attached to the cold plate base 170 and covers the thermal bridge 200.

[0069] During assembly, thermal bridge 200 is connected to cold plate 150, for example at the lower surface 178 of cold plate base 170. Thermal bridge 200 enters fluid cavity 154 through opening 180. The upper portion of thermal bridge 200 is located above the upper surface 176 of cold plate base 170 in fluid cavity 154. The upper portion of thermal bridge 200 defines a wet portion 210 of thermal bridge 200. The lower portion of thermal bridge 200, for example below fluid barrier 140, defines a dry portion 212 of thermal bridge 200. Dry portion 212 is configured to connect with electrical component 100 ( Figure 1 (Connected)

[0070] The fluid transfer portion 334 of the upper interface plate 320 is located above the cold plate base 170 in the fluid cavity 154 to directly contact the coolant in the cold plate 150. The cold plate housing 190 surrounds the upper portion of the thermal bridge 200 to allow the coolant in the fluid cavity to circulate along the fluid transfer portion 334. For example, the coolant is configured to flow along the side 304 of the fluid transfer portion 334 in the fluid channel 340 between the fluid transfer portions 334. The coolant dissipates heat from the upper plate 300 to cool the thermal bridge 200 and allows heat transfer from electrical components.

[0071] Figure 14 This is a cross-sectional view of a portion of a heat transfer assembly 50 according to an exemplary embodiment, showing coolant channels through the heat transfer assembly 50. Figure 15 This is a cross-sectional view of a portion of the heat transfer assembly 50 according to an exemplary embodiment. Figure 12 and Figure 13 A thermal bridge 200 in the fluid cavity 154 is shown.

[0072] In an exemplary embodiment, the thermal bridge 200 includes a separator 220 dividing the thermal bridge 200 into an inlet side 222 and an outlet side 224. The inlet side 222 is in flow communication with a fluid inlet 156. The outlet side 224 is in flow communication with a fluid outlet 158. Coolant circulates from the fluid inlet 156, through the inlet side 222, through the transition channel 214, and through the outlet side 224 to the fluid outlet 158 ​​via the fluid cavity 154 and the fluid passage 340. The separator 220 may be located between two upper plates in the upper plate 300. The separator 220 isolates the inlet side 222 from the outlet side 224, thereby restricting fluid flow from the inlet side 222 to the outlet side 224. The coolant is forced to flow along the length of the thermal bridge 200 to facilitate effective heat transfer from the thermal bridge 200.

[0073] Figure 16 This is a top perspective view of a heat transfer assembly 50 according to an exemplary embodiment. In the illustrated embodiment, the heat transfer assembly 50 includes components for communication with a plurality of electrical components 100 (…). Figure 1Multiple thermal bridges 200 connected together. For example, the cold plate 150 is enlarged to receive multiple thermal bridges 200.

[0074] Figure 17 This is according to an exemplary embodiment. Figure 16 The diagram shows a cross-sectional view of the heat transfer assembly 50. In the illustrated embodiment, the cold plate 150 includes a plurality of fluid chambers 154 connected by a connecting channel 216 between transition channels 214. Coolant can flow from a fluid inlet 156 to a fluid outlet 158 ​​through the plurality of fluid chambers 154. Each fluid chamber 154 receives a corresponding thermal bridge 200.

[0075] Figure 18 This is according to an exemplary embodiment. Figure 16 The exploded top view of the heat transfer component 50 is shown. Figure 19 This is according to an exemplary embodiment. Figure 16 The exploded bottom perspective view of the heat transfer assembly 50 shown. Figure 18 and Figure 19 A thermal bridge 200 is shown that is connected to the cold plate base 170 of the cold plate 150.

[0076] Thermal bridge 200 is received in a corresponding opening 180 in the cold plate base 170. Cold plate housing 190 is configured to cover thermal bridge 200. Cold plate housing 190 includes respective chambers 218 separated by partition walls 219. Chambers 218 form individual fluid chambers 154. Chambers 218 receive the corresponding thermal bridge 200.

[0077] Figure 20 This is a cross-sectional view of a portion of a heat transfer assembly 50 according to an exemplary embodiment. The heat transfer assembly 50 includes a cold plate 150 and a thermal bridge 200. The thermal bridge 200 is configured to be thermally coupled to the cold plate 150. For example, the upper portion of the thermal bridge 200 at the upper thermal interface 102 is configured to be coupled to the cold plate 150. In the illustrated embodiment, the cold plate base 170 forms a fluid barrier 140 to provide a fluid seal between the thermal bridge 200 and the coolant in the fluid cavity 154.

[0078] In the illustrated embodiment, the cold plate 150 includes a cold plate base 170 and a cold plate housing 190. A thermal bridge 200 is configured to connect to the cold plate base 170. In an exemplary embodiment, the cold plate base 170 includes a substrate 500, an upper transfer fin array 510 above the substrate 500, and a lower transfer fin array 520 below the plate 500. The upper transfer fin array 510 includes a plurality of upward heat transfer fins 512 arranged parallel to each other and spaced apart by gaps 514. The upward heat transfer fins 512 are located in a fluid cavity 154 to contact the coolant. The lower transfer fin array 520 includes a plurality of downward heat transfer fins 522 arranged parallel to each other and spaced apart by gaps 524. The downward heat transfer fins 522 are exposed at the bottom of the cold plate base 170.

[0079] The upper portion of the thermal bridge 200 is configured to dock with the lower heat transfer fin array 520. For example, an upper interface plate 320 is received in a gap 524 such that the side of the upper interface plate 320 faces the side of the lower heat transfer fin 522 and can dock with the side of the lower heat transfer fin 522. The upper interface plate 320 and the lower heat transfer fin 522 have an overlapping area that provides a large surface area configured for thermal connection to provide an effective thermal interface and heat transfer between the thermal bridge 200 and the cold plate 150.

Claims

1. A heat transfer assembly (50), the heat transfer assembly comprising: The cold plate (150) includes a cold plate body (152) forming a fluid cavity configured to receive coolant, and the cold plate includes a fluid inlet (156) and a fluid outlet (158) in flow communication with the fluid cavity. and A thermal bridge (200) is connected to the cold plate, the thermal bridge including an upper thermal interface (102) and a lower thermal interface (104), the thermal bridge including a plurality of staggered plates arranged in a plate stack (402), wherein the plates are movable relative to each other in the plate stack, the lower thermal interface being configured to be in thermal communication with an electrical component (100) to dissipate heat from the electrical component, the thermal bridge extending through the cold plate body, wherein the upper thermal interface is exposed in the fluid cavity to contact the coolant.

2. The heat transfer component (50) according to claim 1, wherein, The plate stack (402) includes a wet portion (210) in fluid communication with the coolant in the fluid cavity and a dry portion (212) outside the fluid cavity and isolated from the coolant.

3. The heat transfer component (50) according to claim 1, wherein, The cold plate body (152) includes a cold plate base (170) and a cold plate shell (190) connected to the cold plate base, the fluid cavity being defined between the cold plate base and the cold plate shell, and the cold plate shell covering the thermal bridge (200).

4. The heat transfer component (50) according to claim 3, wherein, The cold plate base (170) includes an opening (180) through which the thermal bridge (200) passes to connect with the electrical component (100) and the coolant.

5. The heat transfer component (50) according to claim 4, wherein, The upper portion of the plate stack (402) is located above the cold plate body (152) in the fluid cavity, and the lower portion of the plate stack is located below the cold plate body to connect with the electrical component (100).

6. The heat transfer component (50) according to claim 1, wherein, The plates of the plate stack (402) include a fluid transfer portion (334) in fluid cavity that is in flow communication with the coolant.

7. The heat transfer assembly (50) according to claim 6, wherein the thermal bridge (200) includes a fluid passage (340) between the fluid transfer portions (334), the fluid passage being configured to receive the coolant flowing between the fluid inlet (156) and the fluid outlet (158).

8. The heat transfer component (50) according to claim 1, wherein, The thermal bridge (200) includes a fluid barrier (140) to provide a fluid seal through the plate stack (402).

9. The heat transfer component (50) according to claim 1, wherein, The thermal bridge (200) includes a fluid barrier (140) to provide a fluid seal between the thermal bridge and the cold plate (150).

10. The heat transfer assembly (50) according to claim 1, wherein, The thermal bridge (200) includes a fluid barrier (140) that extends through the interior of the thermal bridge to seal the fluid cavity.

11. The heat transfer assembly (50) according to claim 10, wherein, The fluid barrier (140) includes a solder layer (142) of the plates welded to the plate stack (402).

12. The heat transfer assembly (50) according to claim 1, wherein, The thermal bridge (200) includes an upper bridge assembly (202) thermally connected to the cold plate (150), a lower bridge assembly (204) configured to thermally connect to an electrical component (100), and a spring element (206) located between the upper and lower bridge assemblies, the spring element (206) allowing the thermal bridge to expand and compress. The upper bridge assembly includes a plurality of upper plates (300) arranged in an upper plate stack (302), each upper plate having an inner end (306) and an outer end (308), the outer end of the upper plate forming the upper thermal interface (102). The upper bridge assembly extends through the cold plate body. (152), wherein the upper thermal interface is exposed in the fluid cavity to contact the coolant, the lower bridge assembly includes a plurality of lower plates (400) arranged in a lower plate stack (402), each lower plate having an inner end (406) and an outer end (408), the outer end of the lower plate being configured to face and thermally connect to the electrical component, the side (168) of the lower plate facing the side of the upper plate to thermally connect the lower plate to the upper plate, and the spring element including an upper spring member engaging with the inner end of the upper plate and a lower spring member engaging with the inner end of the lower plate to bias the lower plate with an opening (180) force substantially away from the upper plate.

13. A heat transfer assembly (50), the heat transfer assembly comprising: The cold plate (150) includes a cold plate body (152) forming a fluid cavity configured to receive coolant, and the cold plate includes a fluid inlet (156) and a fluid outlet (158) in flow communication with the fluid cavity. and A thermal bridge (200) is connected to the cold plate, the thermal bridge including an upper bridge assembly (202) thermally connected to the cold plate, a lower bridge assembly (204) configured to thermally connect to an electrical component (100), and a spring element (206) between the upper bridge assembly and the lower bridge assembly, the spring assembly allowing the thermal bridge to expand and compress; The upper bridge assembly includes a plurality of upper plates (300) arranged in an upper plate stack (302), each upper plate having a front end and a rear end, each upper plate having a side portion (168) between the front end and the rear end, each upper plate having an inner end (306) and an outer end (308), the outer end of the upper plate forming an upper thermal interface (102), the upper bridge assembly extending through the cold plate body, wherein the upper thermal interface is exposed in the fluid cavity to contact the coolant; The lower bridge assembly includes a plurality of lower plates (400) arranged in a lower plate stack (402), each lower plate having a front end and a rear end, each lower plate having a side portion between the front end and the rear end, each lower plate having an inner end (406) and an outer end (408), the outer end of the lower plate being configured to face and thermally connect to the electrical component, and the side portion of the lower plate facing the side portion of the upper plate to thermally connect the lower plate to the upper plate; and The spring element includes an upper spring member engaged with the upper plate and a lower spring member engaged with the lower plate to bias the lower plate with an opening (180) force substantially away from the upper plate.

14. The heat transfer assembly (50) according to claim 13, wherein, The upper plate (300) includes an upper interface plate (320) and an upper partition plate (322) between the upper interface plates, and the lower plate (400) includes a lower interface plate (420) and a lower partition plate (422) between the lower interface plates. The side portion (168) of the upper interface plate overlaps with the side portion of the lower interface plate and faces the side portion of the lower interface plate so that the lower plate is in thermal contact with the upper plate.

15. The heat transfer assembly (50) according to claim 14, wherein, The upper portion of the upper partition (322) and / or the upper interface plate (320) forms a fluid transfer portion (334), which is located in the fluid cavity in flow communication with the coolant.

16. The heat transfer assembly (50) according to claim 15, wherein, The thermal bridge (200) includes a fluid passage (216) between the fluid transfer portions (334) configured to receive coolant flowing between the fluid inlet (156) and the fluid outlet (158).

17. The heat transfer assembly (50) according to claim 13, wherein, The thermal bridge (200) includes a thermal bridge frame (208) surrounding the upper bridge assembly (202) and the lower bridge assembly (204) to hold the upper plate (300) in the upper plate stack (302) and the lower plate (400) in the lower plate stack (402).

18. The heat transfer assembly (50) according to claim 13, wherein, The upper plate stack (302) includes a wet portion (210) in fluid communication with the coolant in the fluid cavity and a dry portion (212) outside the fluid cavity and isolated from the coolant.

19. The heat transfer assembly (50) according to claim 13, wherein, The upper bridge assembly (202) includes a fluid barrier (140) to provide a fluid seal through the upper plate stack (302).

20. A communication (10) system, comprising: Electrical components (100), including hot surfaces; and A heat transfer assembly (50) thermally coupled to the hot surface to dissipate heat from the electrical component, the heat transfer assembly including a cold plate (150) and a thermal bridge (200) coupled to the cold plate, the cold plate including a cold plate body (152) forming a fluid cavity (154) configured to receive coolant, the cold plate including a fluid inlet (156) and a fluid outlet (158) in flow communication with the fluid cavity, the thermal bridge including an upper thermal interface (102) and a lower thermal interface (104), the thermal bridge including a plurality of staggered plates arranged in a plate stack, wherein the plates are movable relative to each other in the plate stack, the lower thermal interface being configured to thermally communicate with the hot surface of the electrical component to dissipate heat from the electrical component, the thermal bridge extending through the cold plate body, wherein the upper thermal interface is exposed in the fluid cavity to contact the coolant.

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