An integrated liquid cooling distribution system for high-density servers

Abstract

This invention discloses an integrated liquid cooling distribution system for high-density servers, specifically a liquid cooling circulation system for high-density data center servers. The integrated liquid cooling distribution system includes physically isolated primary and secondary side loops, which exchange heat via a heat exchanger. The secondary side loop cools heat-generating devices within the high-density data center server by directly absorbing heat generated by these devices through its internal circulating working fluid flowing over the chassis's cold plates. The primary side loop absorbs heat released by the secondary side loop and discharges the absorbed heat from the liquid cooling distribution system. This invention systematically solves the problems of reliability, heat dissipation efficiency, and environmental adaptability in high-density data center servers by eliminating contamination through physically isolated loops, achieving efficient heat dissipation through a direct liquid cooling path, and ensuring reliable heat exchange through a heat exchanger.

Description

Technical Field

[0001] This invention relates to the technical field of liquid cooling heat dissipation, and in particular to an integrated liquid cooling distribution system for high-density servers. Background Technology

[0002] As data centers evolve towards higher density and higher performance, the power density of electronic devices such as processors and accelerator cards in servers has significantly increased. Traditional air cooling methods are no longer sufficient to meet the high heat flux density requirements. Liquid cooling technology, due to its high thermal conductivity and quiet operation, is gradually becoming the mainstream solution for cooling high-density data centers.

[0003] Currently, most common liquid cooling systems employ a single-loop cooling structure, where the coolant flows directly through the server's internal cold plate for heat exchange before being dissipated through external cooling equipment. While this type of system possesses a certain heat dissipation capacity, it still presents some challenges in practical applications.

[0004] The cooling medium is in direct contact with the external environment or cooling tower, which can easily introduce impurities and corrosive ions, leading to blockage or corrosion of the microchannels in the cold plate and affecting the long-term stable operation of the system. In high-temperature and high-humidity environments, if the temperature of the cooling medium is lower than the ambient dew point temperature, condensation is likely to form on the surface of electronic equipment, causing short-circuit failures. Critical components such as circulating pumps usually do not have backup mechanisms. Once a failure occurs, it will cause the system's heat dissipation to be interrupted, seriously affecting equipment safety. Existing liquid cooling distribution units mostly adopt a split design, which occupies a lot of space and is not conducive to deployment in space-constrained data center racks. There is a lack of integrated judgment and adaptive control of multiple parameters such as pump health status, leak detection, and pressure fluctuations. System operation and maintenance rely on manual intervention, resulting in a lag in response.

[0005] Therefore, this invention proposes an integrated liquid cooling distribution system for high-density servers. Summary of the Invention

[0006] To address at least one of the aforementioned technical problems, this invention provides an integrated liquid cooling distribution system for high-density servers. This system eliminates contamination through physically isolated loops, achieves efficient heat dissipation through a direct liquid cooling path, and ensures reliable heat exchange through heat exchangers (e.g., plate heat exchangers). It systematically solves the problems of reliability, heat dissipation efficiency, and environmental adaptability of high-density data center servers.

[0007] This invention provides an integrated liquid cooling distribution system for high-density servers and a liquid cooling circulation system for high-density data center servers. The integrated liquid cooling distribution system includes: a physically isolated primary side loop and a secondary side loop, wherein the primary side loop and the secondary side loop exchange heat through a heat exchanger. The secondary side loop is used to cool the heat-generating equipment in the high-density data center server. The working fluid circulating inside the secondary side loop flows through the chassis cold plate to directly absorb the heat generated by the heat-generating equipment. The primary side circuit is used to absorb the heat released by the secondary side circuit and discharge the absorbed heat out of the liquid cooling distribution system.

[0008] The beneficial effects of the above solution are that, through physically isolated primary and secondary side loops, this invention ensures complete isolation between the precise and clean cooling medium inside the high-density data center server and the potentially harsher external (or primary side) cooling environment, fundamentally preventing contamination, corrosion, and blockage, thus meeting the high reliability and long lifespan requirements of high-density data center servers. The secondary side loop, through its internal working medium flowing directly through the chassis cold plate to absorb heat from the heat-generating equipment, establishes an efficient and low thermal resistance path from the heat source to the heat dissipation terminal. This results in a heat dissipation efficiency far exceeding that of traditional air cooling, effectively addressing the thermal challenges of high-power-density chips in high-density data center servers. Furthermore, heat exchange via a heat exchanger provides an efficient and reliable heat dissipation path for the high-power heat-generating equipment on the high-density data center server.

[0009] Furthermore, the secondary side circuit includes two sets of pump assemblies connected in parallel, forming a redundant structure with one in use and one on standby. Each pump assembly includes a circulating pump and a check valve connected in series. The suction side of the circulating pump is coupled to the heat exchanger, and the discharge side of the circulating pump is coupled to the chassis cold plate.

[0010] The beneficial effects of the above solution are that, by using two sets of parallel pump assemblies to form a redundant structure with one in operation and one in standby, the system can immediately switch to the standby pump when one circulating pump fails, ensuring uninterrupted power to the cooling circuit and greatly improving the overall system's success rate and survivability. Simultaneously, the circulating pump and check valve connected in series in each pump assembly ensure unidirectional fluid flow during operation, preventing backflow of the working fluid from impacting the standby pump or creating ineffective circulation during single-pump operation or switching, thus guaranteeing the stability and reliability of the system.

[0011] Furthermore, the circulating pump is a high-speed micro water pump with a rated speed of not less than 10,000 rpm; The circulating pump adopts a dual AC / DC power supply architecture, supporting 220VAC AC power supply and 800VDC DC direct power supply; The circulating pump and the heat exchanger are integrated together in a standard 4U high chassis, achieving a heat dissipation power of not less than 80kW.

[0012] The beneficial effects of the above solution are that this invention achieves an extremely high heat dissipation power of no less than 80kW and can be integrated into a standard 4U chassis, directly meeting the core heat dissipation requirements of high-density data center servers. The high-speed (≥10000rpm) micro-pump ensures sufficient flow rate and volume of coolant within the narrow cold plate channels, rapidly removing a large amount of heat. This allows a single device to cool multiple high-power server racks, significantly saving data center space. Furthermore, the circulating pump supports both 220VAC and 800VDC power supplies, and within the 4U space, the circulating pump can use the same power supply as the server. Integrating the circulating pump and heat exchanger into a standard 4U chassis allows for direct installation in server racks, enabling integrated deployment with IT equipment without additional server room space or complex piping, achieving plug-and-play functionality and reducing deployment costs.

[0013] Furthermore, the circulating pump includes: a pump chamber; The pump chamber is provided with an inlet pipe and an outlet pipe on both sides; A pump shaft is rotatably provided inside the pump chamber. An impeller is provided at one end of the pump shaft, and a motor assembly for driving the impeller to rotate is provided around the pump shaft.

[0014] The beneficial effect of the above solution is that, by clearly defining the core components of the circulating pump (pump chamber, inlet and outlet pipes, pump shaft, impeller, and motor assembly), the present invention can meet the requirements of high-density data center servers for miniaturization and lightweighting of equipment.

[0015] Furthermore, the integrated liquid-cooled distribution system also includes a first sensor assembly, which comprises: A dew point temperature sensor, used to detect ambient temperature and humidity; A leak detection rope is installed at the bottom of the liquid cooling distribution system to detect whether a liquid leak has occurred at the bottom of the system. The first temperature sensor is installed on the primary side supply water pipe and the primary side return water pipe of the primary side circuit to monitor the temperature difference between the supply and return water of the primary side circuit. The second temperature sensor is installed on the secondary side water supply pipe and the secondary side water return pipe of the secondary side circuit to monitor the temperature difference between the supply and return water in the secondary side circuit. A pressure sensor is installed on the secondary side water supply pipe of the secondary side circuit to monitor the system pressure.

[0016] The beneficial effects of the above solution are as follows: This invention provides a data foundation for proactive condensation prevention through a dew point temperature sensor, avoiding the risk of short circuits caused by condensation. The leak detection rope provides early leak detection and location capabilities, allowing ground personnel to formulate countermeasures promptly. Temperature sensors on both the primary and secondary sides monitor heat exchange efficiency and system load in real time. Pressure sensors monitor system health and circulating pump performance.

[0017] Furthermore, the integrated liquid cooling distribution system also includes a water tank, which is equipped with a liquid replenishment port and a pressure relief valve. The liquid replenishment port is coupled to the secondary side water supply pipe of the secondary side circuit. The water tank integrates a second sensor assembly, which includes: A liquid level sensor is installed on the water tank to monitor the liquid level in the water tank. A water immersion sensor is installed inside the water tank to detect whether there is a liquid leak or abnormal liquid level inside the water tank.

[0018] The beneficial effects of the above solution are that the water tank and pressure relief valve act as an expansion tank and pressure buffer, absorbing changes in the working fluid volume caused by temperature variations and maintaining stable system pressure. The liquid level sensor monitors the total amount of working fluid, providing a basis for automatic replenishment and preventing system failure due to working fluid deficiency. The water immersion sensor provides leakage monitoring inside the water tank, serving as an internal safety barrier and complementing the leak detection rope at the bottom, thus constructing a three-dimensional leakage protection system.

[0019] Furthermore, the integrated liquid-cooled distribution system also includes: A proportional regulating valve is installed on the primary side water supply pipe of the primary side circuit and is used to regulate the flow rate of the primary side cooling medium.

[0020] A bypass circuit is connected in parallel with the pump assembly. The bypass circuit is equipped with an automatic unloading valve for opening and releasing pressure when the system pressure is abnormal.

[0021] The beneficial effects of the above solution are that the present invention enables the system to precisely control the heat dissipation on the primary side through a proportional regulating valve, thereby achieving precise regulation of the secondary side water supply temperature, which can both meet heat dissipation requirements and achieve energy-saving operation. A pressure safety barrier is formed by the bypass circuit and the automatic unloading valve. When the system starts up or a pressure spike occurs due to momentary blockage in the pipeline, it can quickly release pressure, protecting the pump, sensors, and pipelines from damage, greatly improving the robustness of the system.

[0022] Furthermore, the integrated liquid-cooled distribution system also includes a controller, which is configured to: The opening and closing of the one-way valves in the two sets of pump assemblies are switched according to the health index of the pump assembly. One set of the two sets of pump assemblies is the main pump assembly, and the other set is the standby pump assembly. Adjust the secondary water supply temperature according to the ambient dew point temperature; Adjust the opening degree of the automatic unloading valve according to the secondary circuit pressure.

[0023] The beneficial effects of the above solution are that, through predictive switching of the controller, condensation control, and pressure relief control, the present invention integrates dispersed hardware components into an organic intelligent entity, achieving high reliability, high safety, and long lifespan operation of the system. Predictive switching transforms passive faults into proactive maintenance, improving reliability; condensation control proactively eliminates safety hazards; and pressure relief control achieves an optimal balance between safety and performance.

[0024] Furthermore, the step of switching the opening and closing of the check valves in the two sets of pump assemblies based on the health index of the pump assembly includes: Real-time monitoring of the operating parameters of the main pump assembly, including the current fluctuation spectrum of the circulating pump, bearing vibration data, and outlet pressure pulsation characteristics; Calculate the overall health index of the main pump assembly based on the aforementioned operating parameters; When the comprehensive health index is lower than the first preset threshold, an alarm is triggered to indicate a decline in the performance of the main pump component. When the comprehensive health index is lower than the second preset threshold, during the low load period of the system, the one-way valve of the current main pump component is opened and the one-way valve of the main pump component is closed.

[0025] The beneficial effect of the above solution is that, by analyzing performance parameters such as current fluctuation spectrum and bearing vibration data, this invention can provide early warning when the mechanical performance of the pump deteriorates but has not yet completely failed. Seamless switching during low-load periods avoids system interruptions caused by sudden pump failures when high-density data center servers are performing high-load tasks, minimizing the impact of maintenance actions on tasks.

[0026] Furthermore, adjusting the secondary water supply temperature based on the ambient dew point temperature includes: Real-time acquisition of ambient dew point temperature and secondary water supply temperature; Compare the difference between the secondary water supply temperature and the dew point temperature with the preset safety margin. If the difference between the secondary water supply temperature and the dew point temperature is less than or equal to a preset safety margin, the opening of the proportional regulating valve is adjusted and / or the speed of the circulating pump is reduced to increase the secondary water supply temperature.

[0027] The beneficial effect of the above solution is that, through real-time calculation and comparison, this invention can proactively intervene before condensation occurs. By adjusting the proportional control valve and the circulation pump speed to increase the secondary side temperature, the operating conditions can be fundamentally changed to eliminate condensation conditions. This is more direct and reliable than simple heating or dehumidification, ensuring the absolute safety of electronic equipment under humid conditions.

[0028] Furthermore, adjusting the opening degree of the automatic unloading valve based on the secondary circuit pressure includes: Real-time acquisition of secondary circuit pressure; In response to a pressure threshold fluctuation in the secondary circuit within a preset time period, the opening of the automatic unloading valve is adjusted according to the magnitude and rate of pressure change, so that the pressure fluctuation in the secondary circuit within the preset time period is less than the pressure threshold.

[0029] The beneficial effects of the above solution are that the present invention achieves smooth pressure relief by adjusting the opening degree, avoiding drastic fluctuations in system pressure and flow, ensuring the stability of working fluid flow and heat dissipation effect, providing a more stable operating system for precision electronic equipment on high-density data center servers, and also extending the life of pipelines and valves themselves.

[0030] Compared with the prior art, the above-described technical solution of the present invention has the following advantages: The integrated liquid cooling distribution system for high-density servers described in this invention ensures complete isolation between the precise and clean cooling medium inside the high-density data center server and the potentially harsher external (or primary) cooling environment through physically isolated primary and secondary side loops. This fundamentally prevents contamination, corrosion, and blockage, meeting the high reliability and long lifespan requirements of high-density data center servers. The secondary side loop allows the internal cooling medium to flow directly through the chassis's cold plate to absorb heat from the heat-generating devices, establishing a highly efficient and low thermal resistance path from the heat source to the heat dissipation terminal. This results in significantly higher heat dissipation efficiency than traditional air cooling, effectively addressing the thermal challenges posed by high-power-density chips in high-density data center servers. Furthermore, heat exchangers facilitate heat exchange, providing an efficient and reliable heat dissipation path for the high-power heat-generating devices on the high-density data center server. Attached Figure Description

[0031] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein: Figure 1 This is a schematic block diagram of an integrated liquid cooling distribution system for high-density servers in one embodiment of the present invention.

[0032] Figure 2This is a schematic diagram of another structure of an integrated liquid cooling distribution system for a high-density server using a circulating pump, according to one embodiment of the present invention.

[0033] Figure 3 This is a top view of an integrated liquid cooling distribution system for high-density servers according to one embodiment of the present invention. In the figure, 1 is a water tank; 2 is a liquid level sensor; 3 is a heat exchanger; 4 is a check valve; 5 is a pressure relief valve; 6 is a proportional regulating valve; 7 is a circulating pump; 8 is a control unit; and 9 is an automatic unloading valve. Detailed Implementation

[0034] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0035] With the continuous increase in power density of high-density data center server electronic devices (such as data processing units), their heat dissipation requirements are increasing dramatically. However, the application environment faced by the heat dissipation system of high-density data center servers is extremely harsh: firstly, due to space constraints, their weight, volume, and power consumption have strict limits; secondly, some high-density data center servers need to withstand extreme mechanical and thermal environments during operation and cannot be repaired in a timely manner, placing extreme demands on the system's long lifespan and ultra-high reliability. In addition, the wide temperature fluctuations that may exist in the working environment of high-density data center servers make it easy for condensation to occur on the surface of precision electronic devices when the working fluid temperature is lower than the dew point temperature of the working environment, leading to the risk of short circuits. To solve the heat dissipation problem of high-power-density data center server electronic devices, this invention introduces an integrated liquid cooling distribution system (CDU) for high-density servers, which is a liquid cooling circulation system for high-density data center servers.

[0036] The integrated liquid cooling distribution system for high-density servers of the present invention includes: physically isolated primary side loops and secondary side loops.

[0037] In application, the secondary side loop is used to cool the heat-generating equipment within the high-density data center server. The secondary side loop directly absorbs the heat generated by the heat-generating equipment by circulating its internal working fluid through the chassis's cold plate. (Reference) Figures 1 to 3 The secondary side loop and the primary side loop exchange heat through a heat exchanger 3 (e.g., a plate heat exchanger); the primary side loop is used to absorb the heat released by the secondary side loop and discharge the absorbed heat out of the liquid cooling distribution system.

[0038] In addition, the primary circuit has a flow rate of 95 L / min, and the working fluid can be softened water, PG25, or EG25 aqueous solution. The inlet temperature is 37℃, and the outlet temperature is 49.5℃. The secondary circuit has a rated supply flow rate of 95 L / min, corresponding to a supply pressure of 0.22 MPa. The working fluid is a 25% ethylene glycol aqueous solution, and the supply temperature is set at 40℃, enabling a heat dissipation power greater than 80 kW.

[0039] In practical applications, the secondary side loop of this invention includes two sets of parallel pump assemblies, forming a redundant structure with one in use and one on standby. Each pump assembly includes a circulating pump 7 and a one-way valve 4 connected in series. The suction side of the circulating pump 7 is coupled to the heat exchanger 3, and the discharge side of the circulating pump 7 is coupled to the chassis cold plate. Further, the circulating pump 7 includes: a pump chamber; inlet pipes and outlet pipes on both sides of the pump chamber; a pump shaft rotatably disposed within the pump chamber; an impeller at one end of the pump shaft; and a motor assembly for driving the impeller to rotate around the pump shaft. The motor assembly includes a rotor connected to the pump shaft, a stator covered by the rotor, and a housing covering the stator. In actual implementation, the integrated liquid cooling distribution system for high-density servers also includes a first sensor assembly, a proportional regulating valve 6, and a bypass circuit. Further, the integrated liquid cooling distribution system for high-density servers also includes an exhaust valve and a drain valve.

[0040] Specifically, the proportional regulating valve 6 is installed on the primary side water supply pipe of the primary side circuit to regulate the flow rate of the primary side cooling medium. A bypass circuit is connected in parallel with the pump assembly, and an automatic unloading valve 9 is installed on the bypass circuit to release pressure when the system pressure is abnormal. An vent valve is installed at the highest point of the system pipeline, preferably at the highest position of the secondary side circuit, to expel air from the circuit during filling. A drain valve is installed at the lowest point of the secondary side circuit. During draining, the vent valve is usually opened to allow air to enter the system, breaking the vacuum inside the system and allowing the working medium to flow out smoothly under gravity.

[0041] In addition, the first sensor assembly includes: a dew point temperature sensor, a leakage detection rope, a first temperature sensor, a second temperature sensor, and a pressure sensor.

[0042] Furthermore, a dew point temperature sensor is used to detect ambient temperature and humidity. A leak detection rope is installed at the bottom of the liquid-cooled distribution system to detect whether liquid leakage has occurred at the bottom of the system. A first temperature sensor is installed on the primary side supply and return water pipes of the primary circuit to monitor the supply and return water temperature difference of the primary circuit. A second temperature sensor is installed on the secondary side supply and return water pipes of the secondary circuit to monitor the supply and return water temperature difference of the secondary circuit. A pressure sensor is installed on the secondary side supply water pipe of the secondary circuit to monitor system pressure. In addition, the pressure sensor is set with a high-pressure alarm threshold of 0.25 MPa and a pressure loss alarm threshold of 0.12 MPa.

[0043] In some embodiments, the integrated liquid cooling distribution system for high-density servers of the present invention further includes a water tank 1.

[0044] When applying, refer to Figure 1 The water tank 1 of the present invention is provided with a heat dissipation working fluid tank, a high-pressure gas cylinder, a liquid replenishment port and a pressure relief valve 5.

[0045] The bottom of water tank 1 is coupled to the secondary side water supply pipe of the secondary side circuit via a replenishment port. A pressure relief valve 5 is installed on the top of water tank 1. Furthermore, the top of water tank 1 is connected to a heat dissipation working fluid tank and a high-pressure gas cylinder via a three-way valve. A volumetric pump is installed on the pipeline between the heat dissipation working fluid tank and the three-way valve; the inlet of the volumetric pump is connected to the heat dissipation working fluid tank, which stores spare cooling working fluid (such as a special working fluid). The high-pressure gas cylinder stores high-pressure inert gas (such as nitrogen), and a hydraulic valve is installed on the pipeline between the high-pressure gas cylinder and the three-way valve. The hydraulic valve controls the opening and closing of the gas path between the high-pressure gas cylinder and the heat dissipation working fluid tank. When the hydraulic valve is open, high-pressure gas enters water tank 1, serving as the power source for the pressure-driven replenishment mode.

[0046] Furthermore, the circulating pump 7 adopts an AC / DC dual-source power supply architecture, supporting 220VAC AC power supply and 800VDC direct DC power supply. The motor drive circuit of the circulating pump 7 is compatible with both AC frequency conversion and DC speed regulation operating modes, and can be directly powered by the server rack power supply. In addition, the circulating pump 7 is a high-speed micro water pump with a rated power of 1000W and a rated speed of not less than 10000rpm. The high-speed micro water pump, heat exchanger 3, and control unit 8 are integrated in a standard 4U height chassis (dimensions 482mm×880mm×175mm), achieving a heat dissipation power density of not less than 80kW in practical applications. The water tank 1 integrates a second sensor assembly, which includes a liquid level sensor 2 and a water immersion sensor. The liquid level sensor 2 is installed on the water tank 1 to monitor the liquid level status of the water tank 1. The water immersion sensor is installed inside the water tank 1 to detect whether there is liquid leakage or abnormal liquid level inside the water tank 1.

[0047] In some embodiments, the integrated liquid cooling distribution system for high-density servers further includes a controller. The controller of the present invention is configured to perform (1) to (3): (1) Switch the opening and closing of the one-way valve 4 in the two sets of pump assemblies according to the health index of the pump assembly, wherein one set of the two sets of pump assemblies is the main pump assembly and the other set is the standby pump assembly.

[0048] (2) Adjust the secondary water supply temperature according to the ambient dew point temperature.

[0049] (3) Adjust the opening of the automatic unloading valve 9 according to the secondary side circuit pressure.

[0050] In some further embodiments, the switching of the opening and closing of the one-way valve 4 in the two sets of pump assemblies according to the health index of the pump assembly includes steps SS11 to SS14.

[0051] Step SS11: Monitor the operating parameters of the main pump assembly in real time, including the current fluctuation spectrum of the circulating pump 7, bearing vibration data, and outlet pressure pulsation characteristics.

[0052] The current fluctuation spectrum represents the total harmonic distortion of the current signal from the circulating pump 7. Bearing vibration data includes the root mean square (RMS) and peak value of the vibration acceleration signal from the circulating pump 7. The RMS value of the vibration acceleration signal reflects the overall vibration energy of the circulating pump 7, while the peak value is highly sensitive to localized damage such as surface spalling of the circulating pump 7. The outlet pressure pulsation characteristic represents the standard deviation of the pressure signal from the circulating pump 7.

[0053] Step SS12: Calculate the overall health index of the main pump assembly based on the operating parameters.

[0054] ; ; ; ; ; ; In the formula, For current sub-index; The index of the oscillator; For voltage sub-index; The current carrier index weights; The weights are the exponential weights of the oscillators; The voltage sub-index weights.

[0055] Step SS13: When the comprehensive health index is lower than the first preset threshold, an alarm is triggered to indicate that the performance of the main pump component is deteriorating.

[0056] When applied, the first preset threshold can be determined based on the normal fluctuation range of device performance and the statistical data of historical slow performance degradation, generally between 0.7 and 0.8, preferably 0.75.

[0057] Step SS14: When the comprehensive health index is lower than the second preset threshold, during the low load period of the system, the one-way valve 4 of the current main pump assembly is opened and the one-way valve 4 of the main pump assembly is closed.

[0058] When applied, the second preset threshold can be determined based on the remaining life prediction model and the failure progression rate, generally between 0.5 and 0.6, preferably 0.55.

[0059] In practical applications, low-load periods refer to times when the heat dissipation requirements of high-density data center servers and their systems are at a low level. By reading the task timeline of the high-density data center servers, planned low-power phases are marked as low-load periods. Furthermore, when the temperature difference between the secondary side supply and return water remains below 5°C, and the operating frequency of the circulating pump 7 is below 50% of its rated speed, it is determined to be a low-load period.

[0060] In some further embodiments, adjusting the secondary water supply temperature according to the ambient dew point temperature includes steps SS21 to SS23.

[0061] Step SS21: Obtain the ambient dew point temperature and the secondary water supply temperature in real time.

[0062] Step SS22: Compare the difference between the secondary water supply temperature and the dew point temperature with the preset safety margin.

[0063] When applying this technology, set the preset safety margin to 3°C to 5°C based on experience.

[0064] Step SS23: If the difference between the secondary side water supply temperature and the dew point temperature is less than or equal to the preset safety margin, adjust the opening of the proportional regulating valve 6 and / or reduce the speed of the circulating pump 7 to increase the secondary side water supply temperature.

[0065] In application, to increase the secondary side supply water temperature in the most energy-efficient way without affecting the equipment's heat dissipation safety, the opening of the proportional regulating valve 6 is first reduced. The proportional regulating valve 6 is installed on the primary side circuit, and reducing its opening will directly reduce the flow rate of the primary side cooling medium (such as cold water). With less primary side medium flowing through the heat exchanger 3, its cooling capacity for the secondary side circuit medium decreases, causing the secondary side supply water temperature flowing out of the heat exchanger 3 to naturally increase.

[0066] When adjusting only the proportional control valve 6, if the increase in secondary side water supply temperature does not reach the expected level (i.e., the temperature difference still does not return to above the preset safety margin), reduce the speed of the circulating pump 7 in the secondary side circuit. Reducing the pump speed will reduce the circulation flow rate of the secondary side working fluid. The working fluid flows through the heating device (cold plate of the chassis) at a slower speed, and has a longer residence time to absorb heat, resulting in a higher temperature when it leaves the cold plate (return water temperature). As the return water temperature rises, the temperature of the mixed water supply also rises.

[0067] In practical applications, once the temperature difference exceeds twice the preset safety margin, the control action will stop or be finely adjusted in the opposite direction to maintain the temperature difference at 1.5 times the preset safety margin.

[0068] In some further embodiments, adjusting the opening of the automatic unloading valve 9 according to the secondary side circuit pressure includes steps SS31 to SS32.

[0069] Step SS31: Obtain the secondary circuit pressure in real time.

[0070] Step SS32: In response to the pressure fluctuation of the secondary circuit being greater than or equal to a pressure threshold within a preset time period, adjust the opening of the automatic unloading valve 9 according to the magnitude and rate of pressure change, so that the pressure fluctuation of the secondary circuit is less than the pressure threshold within the preset time period.

[0071] In application, based on engineering practice, the preset duration is generally 2 to 10 seconds; the pressure threshold is 5% to 10% of the rated working pressure. Preferably, the preset duration is 5 seconds.

[0072] In practical applications, pressure values ​​are continuously recorded within a preset duration (e.g., 5 seconds) to identify the maximum and minimum pressure values. The difference between the maximum and minimum pressure values ​​is taken as the magnitude of the pressure change. The absolute value of the difference between the first moment corresponding to the maximum pressure value and the second moment corresponding to the minimum pressure value is taken as the duration of the pressure change. The ratio of the magnitude of the pressure change to the duration of the pressure change is taken as the rate of pressure change.

[0073] If the rate of pressure change is small (e.g., less than a preset rate threshold based on historical data), the opening of the automatic unloading valve 9 is adjusted according to the difference between the magnitude of the pressure change and the pressure threshold. In this case, the opening of the automatic unloading valve 9 is proportional to the difference between the magnitude of the pressure change and the pressure threshold.

[0074] If the rate of pressure change is large (e.g., greater than or equal to a preset rate threshold based on historical data), and the pressure rises within a preset time (e.g., 5 seconds), the opening of the automatic unloading valve 9 is first adjusted according to the difference between the magnitude of the pressure change and the pressure threshold, and then the opening of the automatic unloading valve 9 is further adjusted according to the rate of pressure change. In summary, the integrated liquid cooling distribution system of this invention, through physically isolated primary and secondary circuits, ensures complete isolation between the precise and clean cooling medium inside the high-density data center server and the external circuit, fundamentally preventing contamination, corrosion, and blockage, and meeting the requirements of high-density data center servers for long lifespan and high reliability. The secondary circuit, through its internal working medium flowing directly through the chassis cold plate to absorb heat from the heating equipment, establishes an efficient and low thermal resistance path from the heat source to the heat dissipation terminal. The heat dissipation efficiency is far higher than traditional air cooling, effectively addressing the thermal challenges of high-power-density chips in high-density data center servers.

[0075] Furthermore, this invention employs two parallel pump assemblies to form a redundant structure with one in use and one on standby, and is equipped with a one-way valve 4 to ensure absolute continuity of circulating power. Even if a single pump fails, seamless switching can be achieved, greatly improving the success rate of system tasks.

[0076] Furthermore, this invention is equipped with components such as a leak detection rope, a water immersion sensor, and a liquid level sensor 2, constructing a three-dimensional, multi-level leak monitoring and location system from the inside of the housing to the bottom of the system. It can also maintain pressure through an automatic liquid replenishment system, providing a guarantee for the long-term stable operation of the system.

[0077] Furthermore, this invention achieves predictive switching based on a health assessment that integrates multiple parameters such as current, vibration, and pressure of the circulating pump 7. It can provide early warnings in the initial stages of pump performance degradation and proactively switch over at the appropriate time, transforming post-failure maintenance into pre-failure prevention.

[0078] Furthermore, this invention employs adaptive control of condensation risk, monitors and compares the dew point temperature with the secondary side water supply temperature in real time, and actively adjusts the system operating conditions to eliminate condensation conditions. This fundamentally eliminates the catastrophic risk of short circuits in electronic equipment caused by condensation, ensuring the safety of the system under complex operating conditions.

[0079] Furthermore, this invention manages the pressure relief bypass and dynamically adjusts the opening of the unloading valve according to the magnitude and rate of pressure over-limit, achieving smooth pressure relief and avoiding the pressure and flow shocks caused by traditional binary on-off valves. While ensuring safety, it also maintains stable heat dissipation performance.

[0080] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. An integrated liquid cooling distribution system for high-density servers, characterized in that, A liquid cooling circulation system for high-density data center servers, the integrated liquid cooling distribution system comprising: a physically isolated primary side loop and a secondary side loop, wherein the primary side loop and the secondary side loop exchange heat through a heat exchanger; The secondary side loop is used to cool the heat-generating equipment inside the high-density data center server. The working fluid circulating inside the secondary side loop flows through the chassis cold plate to directly absorb the heat generated by the heat-generating equipment. The primary side circuit is used to absorb the heat released by the secondary side circuit and discharge the absorbed heat out of the liquid cooling distribution system.

2. The integrated liquid cooling distribution system for high-density servers according to claim 1, characterized in that, The secondary side circuit includes two sets of pump assemblies connected in parallel, forming a redundant structure with one in use and one on standby. Each pump assembly includes a circulating pump and a check valve connected in series. The suction side of the circulating pump is coupled to the heat exchanger, and the discharge side of the circulating pump is coupled to the chassis cold plate.

3. The integrated liquid cooling distribution system for high-density servers according to claim 2, characterized in that, The circulating pump is a high-speed micro water pump; The circulating pump adopts a dual AC / DC power supply architecture, supporting 220VAC AC power supply and 800VDC DC direct power supply; The circulating pump and the heat exchanger are integrated together in a standard 4U high chassis, achieving a heat dissipation power of not less than 80kW.

4. The integrated liquid cooling distribution system for high-density servers according to claim 1, characterized in that, The integrated liquid cooling distribution system further includes a first sensor assembly, which comprises: A dew point temperature sensor, used to detect ambient temperature and humidity; A leak detection rope is installed at the bottom of the liquid cooling distribution system to detect whether a liquid leak has occurred at the bottom of the system. The first temperature sensor is installed on the primary side supply water pipe and the primary side return water pipe of the primary side circuit to monitor the temperature difference between the supply and return water of the primary side circuit. The second temperature sensor is installed on the secondary side water supply pipe and the secondary side water return pipe of the secondary side circuit to monitor the temperature difference between the supply and return water in the secondary side circuit. A pressure sensor is installed on the secondary side water supply pipe of the secondary side circuit to monitor the system pressure.

5. The integrated liquid cooling distribution system for high-density servers according to claim 1, characterized in that, The integrated liquid cooling distribution system also includes a water tank, which is equipped with a liquid replenishment port and a pressure relief valve. The liquid replenishment port is coupled to the secondary side water supply pipe of the secondary side circuit. The water tank integrates a second sensor assembly, which includes: A liquid level sensor is installed on the water tank to monitor the liquid level in the water tank. A water immersion sensor is installed inside the water tank to detect whether there is a liquid leak or abnormal liquid level inside the water tank.

6. The integrated liquid cooling distribution system for high-density servers according to claim 2, characterized in that, The integrated liquid cooling distribution system also includes: A proportional regulating valve is installed on the primary side water supply pipe of the primary side circuit and is used to regulate the flow rate of the primary side cooling medium. A bypass circuit is connected in parallel with the pump assembly. The bypass circuit is equipped with an automatic unloading valve for opening and releasing pressure when the system pressure is abnormal.

7. The integrated liquid cooling distribution system for high-density servers according to claim 6, characterized in that, The integrated liquid cooling distribution system also includes a controller, which is configured to: The opening and closing of the one-way valves in the two sets of pump assemblies are switched according to the health index of the pump assembly. One set of the two sets of pump assemblies is the main pump assembly, and the other set is the standby pump assembly. Adjust the secondary water supply temperature according to the ambient dew point temperature; Adjust the opening degree of the automatic unloading valve according to the secondary circuit pressure.

8. The integrated liquid cooling distribution system for high-density servers according to claim 7, characterized in that, The method of switching the opening and closing of the check valves in the two sets of pump assemblies based on the health index of the pump assemblies includes: Real-time monitoring of the operating parameters of the main pump assembly, including the current fluctuation spectrum of the circulating pump, bearing vibration data, and outlet pressure pulsation characteristics; Calculate the overall health index of the main pump assembly based on the aforementioned operating parameters; When the comprehensive health index is lower than the first preset threshold, an alarm is triggered to indicate a decline in the performance of the main pump component. When the comprehensive health index is lower than the second preset threshold, during the low load period of the system, the one-way valve of the current main pump component is opened and the one-way valve of the main pump component is closed.

9. The integrated liquid cooling distribution system for high-density servers according to claim 7, characterized in that, The adjustment of the secondary water supply temperature based on the ambient dew point temperature includes: Real-time acquisition of ambient dew point temperature and secondary water supply temperature; Compare the difference between the secondary water supply temperature and the dew point temperature with the preset safety margin. If the difference between the secondary water supply temperature and the dew point temperature is less than or equal to a preset safety margin, the opening of the proportional regulating valve is adjusted and / or the speed of the circulating pump is reduced to increase the secondary water supply temperature.

10. The integrated liquid cooling distribution system for high-density servers according to claim 7, characterized in that, The step of adjusting the opening degree of the automatic unloading valve according to the secondary circuit pressure includes: Real-time acquisition of secondary circuit pressure; In response to a pressure threshold fluctuation in the secondary circuit within a preset time period, the opening of the automatic unloading valve is adjusted according to the magnitude and rate of pressure change, so that the pressure fluctuation in the secondary circuit within the preset time period is less than the pressure threshold.

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