A Precise Thermal Management Method for Overheated Areas of Electronic Components Based on 4D Printed Protective Devices

Abstract

This invention discloses a method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device. The method includes the following steps: Step 1, preparation of resin with DLP-type 4D printing performance; Step 2, construction of a 3D model of a 4D-printed two-dimensional array protective device for the electronic device; Step 3, 4D printing of the modeled array; Step 4, 4D path programming of the two-dimensional array protective device for the electronic device; Step 5, precise protection and thermal management of electronic components in the working area of ​​the power system. The 4D-printed protective device used in this method is based on thermally responsive shape memory polymers and combined with digital light processing photopolymerization 3D printing technology to construct a two-dimensional array plate composed of repeating pyramidal symmetrical structural units. This array plate can be assembled with the system and supports free disassembly. Through shape memory effect and liquid directional transport function, it achieves protection of electronic components in overheated areas of the power system.

Description

Technical Field

[0001] This invention belongs to the field of electronic device protection and relates to a thermal management method for overheated electronic devices, specifically a method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protection device. Background Technology

[0002] In modern mechanical equipment, the stability of the power system is a core prerequisite for ensuring the reliable operation of the entire machine. However, during long-term, high-load continuous operation, the power system inevitably generates a large amount of heat. If this heat cannot be controlled in a timely and effective manner, it will directly affect the normal operating status of key electronic components in the system, leading to performance degradation, inaccurate response, and even equipment failure or permanent damage. Traditional heat dissipation methods, such as air cooling, finned cooling, or fixed-pipe liquid cooling, often suffer from problems such as fixed cooling paths, delayed response, and difficulty in dynamically adapting to different working areas. Especially when the equipment needs to switch between multiple working areas, traditional cooling methods cannot achieve precise and flexible cooling of critical areas to achieve protection. Therefore, there is an urgent need for a programmable and adaptive intelligent thermal management technology that can adjust in real time according to the working status of the power system to achieve on-demand, efficient, and targeted protection of key electronic components. Summary of the Invention

[0003] This invention provides a method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device. The 4D-printed protective device used in this method is based on thermally responsive shape memory polymer (SMP) and combined with digital light processing (DLP) photopolymerization 3D printing technology to construct a two-dimensional array plate composed of repeating pyramidal symmetrical structural units. This array plate can be arbitrarily designed according to the planar shape of the integrated working system, can be assembled with the system and supports free disassembly. Through the shape memory effect and liquid directional transport function, the protection of overheated electronic components in the power system is achieved.

[0004] The objective of this invention is achieved through the following technical solution:

[0005] A method for precise thermal management of overheated areas of electronic devices based on 4D-printed protective devices includes the following steps:

[0006] Step 1: Preparation of resin with DLP-type 4D printing performance:

[0007] A bifunctional flexible polyurethane-acrylate crosslinking agent, a bifunctional rigid acrylate crosslinking agent, and a monofunctional acrylate diluent are placed in a container and mixed evenly. A photoinitiator and a light absorber are added under light-protected conditions and mixed thoroughly. The mixture is then stored in a light-protected place. The mass ratio of the bifunctional flexible polyurethane-acrylate crosslinking agent, the bifunctional rigid acrylate crosslinking agent, and the monofunctional acrylate diluent is 10-20:10-20:60-80. The photoinitiator content is 0.5-1.5% of the total mass of the bifunctional flexible polyurethane-acrylate crosslinking agent, the bifunctional rigid acrylate crosslinking agent, and the monofunctional acrylate diluent. The light absorber content is 0.01~0.05 wt% of the total mass of the bifunctional flexible polyurethane-acrylate crosslinking agent, the bifunctional rigid acrylate crosslinking agent, and the monofunctional acrylate diluent; the bifunctional flexible polyurethane-acrylate crosslinking agent is one of polyurethane-acrylate crosslinking agents CN996, CN966, and CN9021; the bifunctional rigid acrylate crosslinking agent is one of polyethylene glycol diacrylate and tripropylene glycol diacrylate; the monofunctional acrylate diluent is one or more of isobornyl methacrylate (IBOA), n-butyl methacrylate, hydroxyethyl acrylate (HEA), 4-acryloylmorpholine, and N-vinylpyrrolidone; the photoinitiator is photoinitiator 819; and the light absorber is Sudan III.

[0008] Step 2: Constructing a 3D model of a two-dimensional array protection device for electronic components using 4D printing:

[0009] A 3D model of a 4D-printed two-dimensional array protection device for electronic components is created using 3D modeling software. The 4D-printed two-dimensional array protection device consists of several structural units arranged on a base plate. The specific steps are as follows:

[0010] Step 2-1: Construct a pointed pyramidal structure with full symmetry, wherein the structural unit is divided into two parts: a prism structure in the lower half and a pyramidal structure in the upper half. The base of the prism structure has a side length of... A square, with a central platform having a side length of [missing information]. a square, , Less than 2mm; the base platform of the pyramid structure has a side length of A square with a pointed pyramidal top; the angle between the lateral edges of the prism and the base of the prism is... Its range can be adjusted between 100 and 130°;

[0011] Step 2-2: Construct a three-dimensional model of the base plate. The base plate can be freely designed according to the shape of the working area of ​​the power system.

[0012] Step 2-3: On the base plate constructed in Step 2-2, assemble the pointed pyramidal structure with full symmetry designed in Step 2-1 and form a linear array to obtain the surface array structure assembly model. The spacing between adjacent structural units is 3~5mm, and the number of arrays can be adjusted according to the size of the base plate.

[0013] Step 3: 4D print the modeled array:

[0014] The surface array structure assembly model was imported into a 3D printer, and 4D printing was performed using the resin prepared in step 1. The 4D printing parameters were as follows: the resin was cured layer by layer to the upper platform under a 385nm light source, the height of each cured layer was 0.02~0.1mm, and the curing time of each layer was controlled at 6~10s.

[0015] Step 4: 4D path programming for the two-dimensional array protection device for electronic components:

[0016] Step 4-1: Heat the printed two-dimensional array to its glass transition temperature (T). g The above describes the path programming of the electronic components to protect their positions, causing the structural units to tilt and deform at 40-60°, and then cooling to room temperature to fix them, thus completing the 4D change and path programming of the thermal stimulus response of the surface array structure.

[0017] Step 4-2: Assemble the two-dimensional array protection device with the power system;

[0018] Step 4-3: When switching the operating circuit, disassemble the two-dimensional array thermal management device and heat it to the glass transition temperature (T). g Reset after 5-10 minutes, then program the path according to the location of the electronic device to be protected, so that the structural unit tilts and deforms at 40-60° and then cools to room temperature to fix.

[0019] Step 5: Precise protection and thermal management of electronic components in the power system operating area:

[0020] Step 5-1: During the operation of the power system, when the temperature reaches the set threshold, the liquid injection device is immediately activated and coolant is dripped along the pre-programmed path in the two-dimensional array, wherein: the surface tension of the coolant is less than 27.8 mN / m;

[0021] Step 5-2: The coolant flows passively along the route formed by the structural units, and is cooled when it flows through the electronic device area, thereby achieving thermal management and protection of the electronic devices in the working area of ​​the power system.

[0022] The structural unit designed in this invention can tilt and deform under thermal stimulation, and this deformed shape can be fixed. The deformed structural unit can guide the passive directional transport of liquid injected onto it. Utilizing the shape memory effect of thermal stimulation response, paths connecting the electronic devices can be designed and formed in two dimensions (X± and Y±) within the array plate according to the actual positions of the electronic devices. After fixing the path shape, it is assembled with the power system. When the power system is working, cooling liquid is injected along the preset path. The deformation of the structural unit will induce the liquid to achieve passive directional transport, thereby precisely protecting the electronic devices in the power system and effectively reducing their temperature. In addition, this cooling path can be reconfigured according to the switching of the power system's working area. When it is necessary to switch to different areas of the power system, the two-dimensional array protection device can return to its initial shape under thermal stimulation and reprogram the path according to the position of the electronic devices in the new working area, achieving dynamic adjustment.

[0023] Compared with the prior art, the present invention has the following advantages:

[0024] 1. High-precision customized manufacturing using 4D printing; based on DLP photopolymerization 3D printing technology, it can be integrally formed according to any contour of the working area of ​​the power system. The pyramidal angle (100~130°), spacing (3~5 mm), and array number of structural units can all be adjusted as needed to achieve precise coverage of electronic components and local thermal management.

[0025] 2. Programmable and dynamically reconfigurable paths: Utilizing the 4D printing characteristics of thermally responsive shape memory polymers, cooling paths can be freely designed in a two-dimensional plane based on the actual position of electronic devices. When the working area of ​​the power system switches, the device can restore its initial shape through thermal stimulation and reprogram the path, achieving dynamic adjustment of the cooling channels and overcoming the shortcomings of traditional fixed cooling structures that cannot be flexibly changed.

[0026] 3. Passive transport, energy saving and high efficiency: Relying on the thermal tilting deformation of structural units to guide the passive directional flow of liquid, no additional pumping or microfluidic drive is required, which significantly reduces system energy consumption and structural complexity, while improving the reliability and integration of the cooling process.

[0027] 4. Disassembly and reusability. The device can be freely disassembled, and when reset, it only needs to be heated to above the glass transition temperature to restore its original planar shape. It supports repeated programming and multiple uses, extending the service life of the protection device and reducing maintenance costs. Attached Figure Description

[0028] Figure 1 A 3D model of the structural unit of a two-dimensional array;

[0029] Figure 2 A 3D model and three views of a two-dimensional array;

[0030] Figure 3 A schematic diagram of the programming path for the two-dimensional array device according to the electronic device positions in the power system working areas 2 and 4;

[0031] Figure 4 Photographs and thermal images showing the transport path of liquid along the electronic device positions in two-dimensional array regions 2 and 4;

[0032] Figure 5 The temperature change curves of electronic devices in regions 2 and 4 within 65 seconds are shown.

[0033] Figure 6 A schematic diagram of the programming path for the electronic components of a two-dimensional array device according to the positions of the electronic components in the power system working areas 1, 2, 3 and 4;

[0034] Figure 7 Photographs and thermal images showing the transport path of the liquid along the electronic device locations in regions 1, 2, 3, and 4;

[0035] Figure 8 The temperature change curves of electronic devices in regions 1, 2, 3 and 4 are shown within 65 seconds. Detailed Implementation

[0036] The technical solution of the present invention will be further described below with reference to the accompanying drawings, but it is not limited thereto. Any modifications or equivalent substitutions to the technical solution of the present invention that do not depart from the spirit and scope of the technical solution of the present invention should be covered within the protection scope of the present invention.

[0037] Example 1: Protection of electronic components in power system operating areas 2 and 4:

[0038] Step 1: Place 20 wt% of crosslinking agent polyurethane-acrylate CN996, 20 wt% tripropylene glycol diacrylate, 40 wt% isobornyl acrylate (IOBA), and 20 wt% hydroxyethyl acrylate (HEA) in a container and mechanically stir for 6 hours to ensure uniform mixing. Then, under light-protected conditions, add 1 wt% of the total polymer mass of photoinitiator 819 and 0.01 wt% of the light absorber Sudan III. Sonicate in an ice-water bath for 15 minutes until completely dissolved, then store in the dark. After curing under 385 nm UV light for 5 minutes, the resulting glass transition temperature is 65℃.

[0039] Step 2: Create a part (Part 1) using Solidworks software, construct a plane (Plane 1), and create a square sketch with a bottom side length of 1mm within this plane. Figure 1Construct another plane (plane 2) at a perpendicular distance of 2.5mm from the original plane, with the two planes being parallel to each other; create a square sketch with a side length of 1.88mm in plane 2. Figure 2 The two sketches are positioned such that their center points are on a straight line, and the straight-line distance between their center points is 2.5 mm; Regarding the sketches... Figure 1 ,Grass Figure 2 Lofting the bosses yields a three-dimensional structure (Structure 1). At a distance from the grass... Figure 2 Construct plane 3 at a distance of 2mm (vertical distance) from the existing plane, with the two planes being parallel; in plane 3, at a distance of 2mm (vertical distance) from the grass Figure 2 Create a center point sketch 2mm from the center point (sketching) Figure 3 ), the grass Figure 3 with grass Figure 2 Loft the boss to obtain the 3D structure (Structure 2). Merge Structure 1 and Structure 2 to obtain the 3D model of the structural unit, whose three views are as follows. Figure 1 As shown.

[0040] Step 3: Create the part (part 2) using Solidworks software and build a rough sketch. Figure 1 The sketch is 45mm long and 45mm wide, with four rectangular notches measuring 8mm x 10mm. (Regarding the sketch...) Figure 1 Perform a boss stretching operation with a feature value of 2 mm to obtain a planar part with a length of 45 mm, a width of 45 mm, and a height of 2 mm; create a new draft on plane 1. Figure 2 Create a square with sides of 1mm centered at the plane's center point and save it with a filename ending in .SLDPRT. Create a new assembly using Solidworks and insert Part 1 and Part 2. (The text abruptly ends here, likely due to an incomplete sentence or missing information.) Figure 1 The four sides of the grass in part 2 Figure 2 The four sides of part 1 are made to overlap and fit together. Part 1 is then arranged in a two-dimensional surface array with the length and width of part 2 as the direction. The spacing between each adjacent unit is 2.5mm, resulting in a 3D model of a two-dimensional array open module with symmetrical structural units (e.g., ...). Figure 2 (As shown), save it as a file with the .STL extension.

[0041] Step 4: Import the .STL file of the assembly from Step 3 into the slicing software for slicing. The model slice layer height is 0.1mm. Pour the resin from Step 1 into the resin tank of the DLP 3D printer, import the slice file into the 3D printer, and perform 3D printing. The printing parameters are as follows: printing at 25℃ under a 385nm wavelength light source with a light source power of 1000W; the first layer curing time is 30s, the substrate curing layers are 3, and the lifting height of each layer is 5mm; subsequently, each layer curing time is 15s. After printing, the printed array structure is ultrasonically cleaned in ethanol for 5min to remove unpolymerized components from the surface; then, the printed array structure is post-treated in a 385nm ultraviolet curing chamber for 15min to ensure complete curing.

[0042] Step 5: Heat the 3D-printed 2D array to its glass transition temperature (T0). g Based on the above, the electronic device positions in the power system's working areas 2 and 4 are programmed to cause the structural units to tilt and deform at 40-60°, then cool to room temperature and fix, thus realizing the 4D change and path programming of the surface array structure's thermal stimulus response. Figure 3 As shown.

[0043] Step 6: When the power system is working, if the working area is above the set temperature (50℃), the liquid injection device will start, and cooling liquid (a mixture of anhydrous ethanol and propylene glycol, with 60wt% anhydrous ethanol and 40wt% propylene glycol) will be added dropwise at a rate of 2.86μL / s. The liquid will be transported along the set path, and as time increases to 65s, thermal imaging will show that the temperature of the electronic devices in areas 2 and 4 decreases. Figure 4 As shown, compared to the initial stage, they decreased by 33.6% and 35.4% respectively, as... Figure 5 As shown.

[0044] Example 2: Protection of electronic components in power system operating areas 1, 2, 3, and 4:

[0045] Step 1: 20 wt% of crosslinking agent polyurethane-acrylate CN966, 20 wt% bisphenol A dimethacrylate, 30 wt% 4-acryloylmorpholine, and 30 wt% n-butyl methacrylate were placed in a container and mechanically stirred for 6 hours to ensure uniform mixing. Then, under light-protected conditions, 1 wt% of photoinitiator 819 and 0.01 wt% of light absorber Sudan III were added. The mixture was then sonicated in an ice-water bath for 15 minutes until completely dissolved, and stored in the dark. After curing under 385 nm UV light for 5 minutes, the glass transition temperature was 65℃.

[0046] Steps 2, 3, and 4 are the same as in Example 1.

[0047] Step 5: Heat the 3D-printed 2D array to its glass transition temperature (T0). g The above describes how, according to the programming paths of the electronic device positions in the power system's working areas 1, 2, 3, and 4, the structural units undergo a 40-60° tilt deformation and are then cooled to room temperature for fixation. This achieves 4D change and path programming of the surface array structure's thermal stimulus response. Figure 6 As shown.

[0048] Step 5: When the power system is working, and the working area is above the set temperature (50℃), the liquid injection device is activated. Cooling liquid (a mixture of anhydrous ethanol and propylene glycol, with 60wt% anhydrous ethanol and 40wt% propylene glycol) is added dropwise at a rate of 5.72 μL / s. The liquid is transported along the set path, and as time increases to 65s, thermal imaging shows that the temperature of the electronic components in areas 1, 2, 3, and 4 decreases. Figure 7 As shown, compared to the initial stage, they decreased by 25.3%, 29.6%, 32.9%, and 29.5%, respectively. Figure 8 As shown.

Claims

1. A method for precise thermal management of overheated areas of electronic devices based on 4D-printed protective devices, characterized in that... The method includes the following steps: Step 1: Preparation of resin with DLP-type 4D printing performance: Mix the bifunctional flexible polyurethane-acrylate crosslinking agent, the bifunctional rigid acrylate crosslinking agent, and the monofunctional acrylate diluent in a container. Add the photoinitiator and the light absorber under light-protected conditions and mix well. Store in a light-protected place. Step 2: Constructing a 3D model of a two-dimensional array protection device for electronic components using 4D printing: A 3D modeling software was used to create a 4D printed two-dimensional array protection device for electronic components. The 4D printed two-dimensional array protection device is composed of several structural units arranged on a base plate. Step 3: 4D print the modeled array: The surface array structure assembly model was imported into a 3D printer and 4D printed using the resin prepared in step 1. Step 4: 4D path programming for the two-dimensional array protection device for electronic components: Step 4-1: Heat the printed two-dimensional array to above the glass transition temperature, and program the path to protect the electronic components as needed, so that the structural units tilt and deform by 40~60°. Then cool it to room temperature to fix it, thus completing the thermal stimulus response 4D change and path programming of the surface array structure. Step 4-2: Assemble the two-dimensional array protection device with the power system; Step 4-3: When switching the working circuit, disassemble the two-dimensional array thermal management device and heat it to 5-10 minutes above the glass transition temperature for resetting. Then, program the path according to the location of the electronic device to be protected, so that the structural unit tilts and deforms at 40-60° and then cools to room temperature to fix it. Step 5: Precise protection and thermal management of electronic components in the power system operating area: Step 5-1: During the operation of the power system, when the temperature reaches the set threshold, the liquid injection device is immediately activated and coolant is dripped along the pre-programmed path in the two-dimensional array. Step 5-2: The coolant flows passively along the route formed by the structural units, and is cooled when it flows through the electronic device area, thereby achieving thermal management and protection of the electronic devices in the working area of ​​the power system.

2. The method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device according to claim 1, characterized in that... In step 1, the mass ratio of the bifunctional flexible polyurethane-acrylate crosslinking agent, the bifunctional rigid acrylate crosslinking agent, and the monofunctional acrylate diluent is 10~20:10~20:60~80. The content of the photoinitiator is 0.5~1.5 wt% of the total mass of the bifunctional flexible polyurethane-acrylate crosslinking agent, the bifunctional rigid acrylate crosslinking agent, and the monofunctional acrylate diluent. The content of the light absorber is 0.01~0.05 wt% of the total mass of the bifunctional flexible polyurethane-acrylate crosslinking agent, the bifunctional rigid acrylate crosslinking agent, and the monofunctional acrylate diluent.

3. The method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device according to claim 2, characterized in that... The bifunctional flexible polyurethane-acrylate crosslinking agent is one of polyurethane-acrylate crosslinking agents CN996, CN966, and CN9021; the bifunctional rigid acrylate crosslinking agent is one of polyethylene glycol diacrylate and tripropylene glycol diacrylate; the monofunctional acrylate diluent is one or more of isobornyl methacrylate, n-butyl methacrylate, hydroxyethyl acrylate, 4-acryloylmorpholine, and N-vinylpyrrolidone; the photoinitiator is photoinitiator 819; and the light absorber is Sudan III.

4. The method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device according to claim 1, characterized in that... The specific steps of step 2 are as follows: Step 2-1: Construct a pointed pyramidal structure with full symmetry, wherein the structural unit is divided into two parts: a prism structure in the lower half and a pyramidal structure in the upper half. The base of the prism structure has a side length of... A square, with a central platform having a side length of [missing information]. A square; the base platform of the pyramid structure has a side length of... A square shape with a pointed pyramidal top; Step 2-2: Construct a 3D model of the base plate; Step 2-3: On the base plate constructed in step 2-2, assemble the pointed pyramidal structure with a fully symmetrical structure designed in step 2-1 and form a linear array to obtain the surface array structure assembly model.

5. The method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device according to claim 4, characterized in that... In step 2-1, Less than 2mm; the angle between the lateral edge of the prism and the base of the prism is Its range is adjustable between 100 and 130°.

6. The method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device according to claim 4, characterized in that... In step 2-2, the base plate is designed freely according to the shape of the working area of ​​the power system.

7. The method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device according to claim 4, characterized in that... In steps 2-3, the spacing between adjacent structural units is 3-5 mm.

8. The method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device according to claim 1, characterized in that... In step 3, the 4D printing parameters are as follows: the layers are cured layer by layer onto the upper platform under a 385nm light source, the height of each cured layer is 0.02~0.1mm, and the curing time of each layer is controlled at 6~10s.

9. The method for precise thermal management of overheated areas of electronic devices based on a 4D-printed protective device according to claim 1, characterized in that... In step 5-1, the surface tension of the coolant is less than 27.8 mN / m.

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