Heat dissipation components for vapor chamber modules that adapt to full-rate SFP connectors

Abstract

This invention discloses a vapor chamber module heat dissipation assembly adapted to full-rate SFP connectors, relating to the field of SFP connector technology. It includes: a composite vapor chamber, suspended directly above the SFP module with the module horizontally inserted into the connector, the connector being disposed within a base chamber; a through slot corresponding to the composite vapor chamber is formed on the upper surface of the connector; the composite vapor chamber includes an upper metal cover plate, a lower metal base plate, and a graphene thermally conductive layer sandwiched between the upper metal cover plate and the lower metal base plate; an array of metal thermally conductive pillars are disposed throughout the graphene thermally conductive layer, with each end of the metal thermally conductive pillars perpendicular to the insertion direction forming a metallurgical bond with the upper metal cover plate and the lower metal base plate, respectively, to construct a low thermal resistance thermal conductive path across the graphene thermally conductive layer; this invention achieves efficient Z-axis heat conduction, in-plane temperature uniformity, and thermal stress release, realizing efficient directional heat dissipation for full-rate modules.

Description

Technical Field

[0001] This invention relates to the field of SFP connector technology, and more specifically to a heat dissipation assembly for a vapor chamber module adapted to full-rate SFP connectors. Background Technology

[0002] In data application centers, the same switch port may need to accommodate SFP modules with different speeds and power consumptions. Existing SFP cooling solutions typically use large heat sinks to meet the cooling requirements of the highest power modules. However, when low-power modules are inserted, the large heat sinks overcool them, causing low-temperature wavelength drift in the laser. Secondly, while heat-equalizing materials such as graphene have extremely high in-plane thermal conductivity, they exhibit significant anisotropy. Due to interlayer van der Waals forces in the Z-axis direction perpendicular to the plane, their thermal conductivity is extremely low, making it difficult for heat to be quickly transferred from the bottom surface to the top heat sink fins.

[0003] Therefore, it is necessary to provide a heat dissipation assembly for a vapor chamber module that is compatible with full-rate SFP connectors to solve the above problems. Summary of the Invention

[0004] To address the above problems, the present invention provides the following technical solution: a heat dissipation assembly for a vapor chamber module adapted to full-rate SFP connectors, comprising: A composite heat spreader is suspended directly above the SFP module, with the SFP module horizontally inserted into the connector as a reference. The connector is located inside the base compartment. A snap fastener is used to snap the composite heat exchange plate onto the connector, and the upper surface of the connector is provided with a through groove corresponding to the composite heat exchange plate; The composite heat exchanger includes an upper metal cover plate, a lower metal base plate, and a graphene thermal conductive layer sandwiched between the upper metal cover plate and the lower metal base plate. An array of metal thermal conductive columns are disposed through the graphene thermal conductive layer. The two ends of the metal thermal conductive columns perpendicular to the insertion direction are respectively metallurgically bonded to the upper metal cover plate and the lower metal base plate to construct a low thermal resistance thermal conductive path across the graphene thermal conductive layer. A composite thermally conductive contact layer is disposed on the side of the lower metal base plate facing the SFP module; Modular heat dissipation fins are attached to the side of the upper metal cover plate away from the graphene thermal conductive layer.

[0005] Furthermore, as a preferred embodiment, the metal heat-conducting pillar is a copper pillar or a copper alloy pillar, and the sum of its cross-sectional areas perpendicular to the SFP module insertion direction accounts for 15%-35% of the total cross-sectional area of ​​the lower metal base plate.

[0006] Furthermore, as a preferred embodiment, the distribution density of the metal heat-conducting pillars is greater than that of the distribution density of the non-heat-generating areas of the SFP module directly above the optical device area and the DSP chip area where heat generation is concentrated, so as to achieve directional and rapid heat dissipation.

[0007] Furthermore, as a preferred embodiment, the lower metal base plate has stress-relieving microgrooves in the region corresponding to the root of the metal heat-conducting column, so as to form a local flexible relief area around the root of the metal heat-conducting column. The stress-relieving microgroove is an annular groove surrounding the root of the metal heat-conducting pillar, or a strip-shaped weakening groove extending between adjacent metal heat-conducting pillars.

[0008] Furthermore, preferably, the depth of the stress relief microgroove is 30%-50% of the thickness of the lower metal base plate, so that when the lower metal base plate is subjected to force, the area where the stress relief microgroove is located will produce an elastic yielding deformation similar to a micro-hinge. The inner cavity of the stress relief microgroove is filled with flexible thermally conductive silicone or phase change thermally conductive material. The filling surface of the flexible thermally conductive silicone or phase change thermally conductive material is flush with the surface of the lower metal base plate facing the SFP module.

[0009] Furthermore, as a preferred embodiment, the composite thermally conductive contact layer includes a flexible thermally conductive substrate and flexible thermally conductive protrusions arrayed in the flexible thermally conductive substrate; The flexible thermally conductive protrusions protrude from the end of the flexible thermally conductive substrate on the side facing the SFP module, and the projection positions of some of the flexible thermally conductive protrusions on the plane perpendicular to the SFP module insertion direction correspond one-to-one with the positions of the metal thermally conductive pillars on the lower metal base plate to form a straight thermal conduction path. The composite thermally conductive contact layer can extend into the through groove, and the cross-section of the composite heat spreader is larger than the cross-section of the through groove.

[0010] Furthermore, as a preferred embodiment, the surface of the flexible thermally conductive protrusion facing the SFP module is provided with a microscopic anti-slip thermally conductive texture, which is a cross-shaped mesh or a micro-barb structure.

[0011] Furthermore, as a preferred embodiment, the modular heat dissipation fin assembly includes a plug-in component and a heat dissipation insert plugged into the plug-in component, wherein a portion of the plug-in component is connected to the upper metal cover plate, and a portion of the plug-in component is connected to the area of ​​the upper metal cover plate corresponding to the metal heat-conducting pillar.

[0012] Furthermore, as a preferred embodiment, the plug-in assembly includes a slot, and a limiting ring is fixed to the inner wall of the slot near the side of the upper metal cover plate to limit the insertion depth of the heat dissipation plug in the direction toward the SFP module. A thermal expansion actuator is fixed to the end of the slot in the direction away from the SFP module. When the insertion depth of the heat dissipation plug is limited by the limiting ring, the thermal expansion actuator does not contact the heat dissipation plug. The slot has multiple side passages on its side, and an elastic abutment plate is connected in the side passage. A wedge is connected to the side of the elastic abutment plate opposite to the center of the slot. The slot is also provided with a receiving groove for receiving a locking ring. The inner surface of the locking ring has a wedge surface that matches the wedge block. The locking ring is also threadedly connected to the receiving groove.

[0013] Furthermore, as a preferred embodiment, when the sensed temperature is lower than a preset temperature threshold, the thermal expansion actuator maintains its initial state, thereby maintaining an air insulation gap between the heat dissipation strip and the upper metal cover plate, and is in a thermal blocking state to prevent the SFP module from being overcooled. When the sensed temperature is higher than the temperature threshold, the thermal expansion actuator is heated and generates a mechanical displacement in the direction away from the SFP module, eliminating the air insulation gap and forcing the heat dissipation strip to fit into the thermal expansion actuator, thus entering a thermally conductive state.

[0014] Compared with the prior art, the present invention provides a heat dissipation assembly for a vapor chamber module adapted to full-rate SFP connectors, which has the following advantages: In this invention, a Z-axis low thermal resistance path is constructed using metal thermally conductive pillars that penetrate the graphene thermally conductive layer. Combined with the in-plane diffusion characteristics of graphene itself, a three-dimensional heat flow scheduling network is formed, realizing the crossing of heat from bottom to top.

[0015] In this invention, by setting specific stress-relieving microgrooves on the lower metal base plate, a local flexible relief zone is constructed, which transforms the stress originally concentrated at the metallurgical bonding interface into controllable elastic bending strain at the microgrooves, fundamentally preventing interlayer tearing failure of the composite heat exchange plate under harsh working conditions.

[0016] In this invention, an air gap is used to achieve adaptive switching between low-temperature overcooling prevention and high-temperature high-power conduction, without the need for any electronic components or wiring, thus solving the thermal management contradiction in full-rate, cross-power consumption scenarios.

[0017] In this invention, the modular heat dissipation fin assembly adopts a combination design of plug-in components and heat dissipation strips, allowing users to flexibly increase or decrease the heat dissipation area according to actual power consumption. Attached Figure Description

[0018] Figure 1A schematic diagram of the overall structure of the heat dissipation assembly for the vapor chamber module adapted to full-rate SFP connectors. Figure 2 An exploded view of the heat dissipation assembly of a vapor chamber module designed to accommodate full-rate SFP connectors. Figure 3 This is a cross-sectional view of the composite heat exchanger. Figure 4 This is a cross-sectional view of the plug-in assembly. In the diagram: 1-Base compartment; 2-Composite heat spreader; 3-Connector; 4-Composite thermally conductive contact layer; 5-Heat dissipation strip; 6-Snap-on; 7-Through slot; 8-Flexible thermally conductive protrusion; 9-Plug-in assembly; 21-Upper metal cover plate; 22-Graphene thermally conductive layer; 23-Lower metal base plate; 24-Metal thermally conductive pillar; 25-Stress relief microgroove; 91-Slot; 92-Limiting ring; 93-Elastic abutment plate; 94-Locking ring; 95-Wedge block; 10-Thermal expansion actuator. Detailed Implementation

[0019] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements, but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0020] Example: In this embodiment of the invention, please refer to... Figures 1-4 It provides a vapor chamber module heat dissipation assembly that adapts to full-rate SFP connectors, including: The composite heat exchanger 2 is suspended directly above the SFP module, with the SFP module horizontally inserted into the connector 3 as a reference. The connector 3 is located inside the base compartment 1. The buckle 6 is used to snap the composite heat exchange plate 2 onto the connector 3. The upper surface of the connector 3 is provided with a through groove 7 corresponding to the composite heat exchange plate 2. The composite heat exchanger 2 includes an upper metal cover plate 21, a lower metal base plate 23, and a graphene thermal conductive layer 22 sandwiched between the upper metal cover plate 21 and the lower metal base plate 23; an array of metal thermal conductive columns 24 are disposed through the graphene thermal conductive layer 22, and the two ends of the metal thermal conductive columns 24 perpendicular to the insertion direction are respectively metallurgically bonded to the upper metal cover plate 21 and the lower metal base plate 23 to construct a low thermal resistance thermal conductive path across the graphene thermal conductive layer 22; A composite thermally conductive contact layer 4 is disposed on the side of the lower metal base plate 23 facing the SFP module; Modular heat dissipation fins are attached to the side of the upper metal cover plate 21 that is away from the graphene thermal conductive layer 22.

[0021] In this embodiment, the heat generated by the SFP module is transferred upwards, passing sequentially through the composite thermally conductive contact layer 4 and the lower metal base plate 23. Due to the interlayer van der Waals forces in the graphene thermally conductive layer 22, its thermal conductivity along the Z-axis perpendicular to the plane is extremely low. The heat flow automatically avoids the high thermal resistance region and is forcibly guided to the metal thermally conductive pillar 24 that penetrates the graphene thermally conductive layer 22. It is then quickly conducted to the upper metal cover plate 21 and finally dissipated into the environment by the modular heat dissipation fins attached to the top. In other words, in this embodiment, the sandwich composite structure is used to fully utilize the efficient temperature uniformity of the graphene thermally conductive layer 22 in the plane (XY axis). At the same time, the through-hole metal thermally conductive pillar 24 solves the physical defect of poor thermal conductivity of graphene along the Z-axis, constructing a low thermal resistance thermal conduction path across the graphene thermally conductive layer 22, and realizing three-dimensional efficient scheduling of heat flow.

[0022] In this embodiment, the metal heat-conducting pillar 24 is a copper pillar or a copper alloy pillar. The sum of its cross-sectional area perpendicular to the SFP module insertion direction accounts for 15%-35% of the total cross-sectional area of ​​the lower metal base plate 23. Within this range, the metal heat-conducting pillar 24 provides sufficient Z-direction heat-conducting cross-sectional area, while reserving sufficient space for the graphene heat-conducting layers 22 on both sides. This avoids the problem of excessively high Z-direction thermal resistance caused by the metal heat-conducting pillar 24 having too small a proportion, and also prevents excessive encroachment on the space of the graphene heat-conducting layer 22 due to its excessively large proportion, which could lead to the breakage of the in-plane heat diffusion network.

[0023] In this embodiment, the distribution density of the metal heat-conducting pillars 24 is greater than that of the distribution density of the non-heat-generating areas of the SFP module directly above the optical device area and the DSP chip area where heat generation is concentrated, so as to achieve directional and rapid heat dissipation.

[0024] Furthermore, the lower metal base plate 23 has stress relief microgrooves 25 in the region corresponding to the root of the metal heat-conducting column 24 to form a local flexible relief area around the root of the metal heat-conducting column 24. The stress-relieving microgroove 25 is either an annular groove surrounding the root of the metal heat-conducting pillar 24 or a strip-shaped weakening groove extending between adjacent metal heat-conducting pillars 24. In other words, to address physical defects such as the mismatch in thermal expansion coefficients between the metal and graphene, this embodiment provides a stress-relieving microgroove 25 in the region corresponding to the root of the metal heat-conducting pillar 24 on the lower metal base plate 23. This creates a localized flexible relief zone around the root of the metal heat-conducting pillar 24, significantly reducing the bending stiffness of the root region and transforming the stress originally concentrated at the hard metallurgical interface into micro-elastic deformation at the microgroove. This fundamentally prevents interlayer tearing failure of the composite heat spreader 2 under long-term thermal cycling.

[0025] Furthermore, the depth of the stress relief microgroove 25 is 30%-50% of the thickness of the lower metal base plate 23, so that when the lower metal base plate 23 is subjected to force, the area where the stress relief microgroove 25 is located will produce an elastic yielding deformation similar to a micro hinge. The inner cavity of the stress relief microgroove 25 is filled with flexible thermally conductive silicone or phase change thermally conductive material. The filling surface of the flexible thermally conductive silicone or phase change thermally conductive material is flush with the surface of the lower metal base plate 23 facing the SFP module.

[0026] In this embodiment, the composite thermally conductive contact layer 4 includes a flexible thermally conductive substrate and flexible thermally conductive protrusions 8 arrayed in the flexible thermally conductive substrate; The flexible thermally conductive protrusion 8 protrudes from the end of the flexible thermally conductive substrate on the side facing the SFP module along the direction toward the SFP module, and the projection position of some of the flexible thermally conductive protrusions 8 on the plane perpendicular to the insertion direction of the SFP module corresponds one-to-one with the position of the metal thermally conductive pillar 24 on the lower metal base plate 23 to form a straight thermal conduction path. The composite thermally conductive contact layer 4 can extend into the through groove 7, and the cross-section of the composite heat spreader 2 is larger than the cross-section of the through groove 7.

[0027] During assembly under pressure, the flexible thermally conductive substrate fills the unevenness of the SFP module housing. Specifically, the projection positions of some of the flexible thermally conductive protrusions 8 on the plane perpendicular to the SFP module insertion direction are set to correspond one-to-one with the positions of the metal thermally conductive pillars 24 on the lower metal base plate 23, forming a straight thermal conduction path.

[0028] In addition, the flexible thermally conductive protrusion 8 has a microscopic anti-slip thermally conductive texture on the surface facing the SFP module. The microscopic anti-slip thermally conductive texture is a cross-shaped mesh or a micro-barb structure.

[0029] When the SFP module is inserted, these microscopic anti-slip thermally conductive textures can generate high local contact pressure, thereby actively and physically piercing the microscopic oxide layer and contaminant insulation film naturally present on the surface of the SFP module shell, so that the flexible thermally conductive protrusions 8 can directly and microscopically fit with the SFP module shell. At the same time, the microscopic anti-slip thermally conductive textures also provide frictional anchoring force to resist lateral slippage.

[0030] In this embodiment, the modular heat dissipation fin assembly includes a plug-in component 9 and a heat dissipation insert 5 plugged into the plug-in component 9, wherein a portion of the plug-in component 9 is connected to the upper metal cover plate 21, and a portion of the plug-in component 9 is connected to the area of ​​the upper metal cover plate 21 corresponding to the metal heat-conducting pillar 24.

[0031] The heat dissipation strip 5 can be either a square strip or a cylindrical strip.

[0032] When dealing with SFP modules of different power consumption, users do not need to replace the entire connector 3. They can adjust the heat dissipation area simply by increasing or decreasing the number of heat dissipation strips 5. Of course, in practical applications, this adjustment frequency will not be too frequent.

[0033] Specifically, the plug-in assembly 9 includes a slot 91, and a limiting ring 92 is fixed on the inner wall of the slot 91 near the side of the upper metal cover plate 21 to limit the insertion depth of the heat dissipation plug 5 in the direction toward the SFP module. A thermal expansion actuator 10 is fixed at the end of the slot 91 in the direction away from the SFP module. When the insertion depth of the heat dissipation plug 5 is limited by the limiting ring 92, the thermal expansion actuator 10 does not contact the heat dissipation plug 5. The side of the slot 91 is provided with multiple side through slots, and an elastic abutment plate 93 is connected in the side through slot. A wedge block 95 is connected to the side of the elastic abutment plate 93 away from the center of the slot. The slot 91 is also provided with a receiving groove for receiving a locking ring 94. The inner surface of the locking ring 94 has a wedge surface that matches the wedge block 95. The locking ring 94 is also threadedly connected to the receiving groove.

[0034] The thermal expansion actuator 10 is any one of a bimetallic disc, a shape memory alloy spring that expands upon heating, or a high-purity copper pin. When the heat dissipation strip 5 is inserted downwards into the slot 91 and blocked by the limiting ring 92, an air insulation gap remains between the thermal expansion actuator 10 and the heat dissipation strip 5. Simultaneously, the side of the slot 91 is connected to an elastic abutment plate 93 with a wedge block 95 via a side groove. Rotating the locking ring 94, which is threadedly connected to the receiving groove, causes the inner wedge surface of the locking ring 94 to compress the wedge block 95 inwards, driving the elastic abutment plate 93 to clamp the heat dissipation strip 5 from the side.

[0035] When the temperature is lower than the preset temperature threshold, the thermal expansion actuator 10 maintains its initial state, so that the heat dissipation strip 5 and the upper metal cover plate 21 maintain an air thermal insulation gap and are in a thermal blocking state to prevent the SFP module from being overcooled. When the temperature is higher than the temperature threshold, the thermal expansion actuator 10 is heated and generates a mechanical displacement in the direction away from the SFP module, eliminating the air insulation gap and forcing the heat dissipation strip 5 to fit into the thermal expansion actuator 10, thus being in a thermally conductive state.

[0036] In other words, in this embodiment, the traditional electronic temperature control system is replaced by the basic physical law of thermal expansion and contraction of materials. In a small space, the intelligent switching logic of low power consumption, heat insulation and anti-overcooling and high power consumption conduction and heat dissipation is realized with zero power consumption and zero wiring.

[0037] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A heat dissipation assembly for a vapor chamber module adapted to full-rate SFP connectors, characterized in that, include: The composite heat exchange plate (2) is suspended directly above the SFP module, with the SFP module horizontally inserted into the connector (3) as the reference. The connector (3) is located in the base compartment (1). The buckle (6) is used to snap the composite heat exchange plate (2) onto the connector (3), and the upper surface of the connector (3) is provided with a through groove (7) corresponding to the composite heat exchange plate (2). The composite heat exchanger (2) includes an upper metal cover plate (21), a lower metal base plate (23), and a graphene thermal conductive layer (22) sandwiched between the upper metal cover plate (21) and the lower metal base plate (23). An array of metal thermal conductive columns (24) are disposed inside the graphene thermal conductive layer (22). The two ends of the metal thermal conductive columns (24) perpendicular to the insertion direction are respectively metallurgically bonded to the upper metal cover plate (21) and the lower metal base plate (23) to construct a low thermal resistance thermal conductive path across the graphene thermal conductive layer (22). A composite thermally conductive contact layer (4) is disposed on the side of the lower metal base plate (23) facing the SFP module; Modular heat dissipation fins are attached to the side of the upper metal cover (21) away from the graphene thermal conductive layer (22).

2. The heat dissipation assembly for a vapor chamber module adapted to full-rate SFP connectors according to claim 1, characterized in that: The metal heat-conducting pillar (24) is a copper pillar or a copper alloy pillar, and the sum of its cross-sectional area perpendicular to the SFP module insertion direction accounts for 15%-35% of the total cross-sectional area of ​​the lower metal base plate (23).

3. The heat dissipation assembly for a vapor chamber module adapted to full-rate SFP connectors according to claim 2, characterized in that: The distribution density of the metal heat-conducting pillars (24) is greater than that of the distribution density of the non-heat-generating areas of the SFP module, corresponding to the area of ​​the optical device and the DSP chip area where heat generation is concentrated, so as to achieve directional and rapid heat dissipation.

4. The heat dissipation assembly for a vapor chamber module adapted to a full-rate SFP connector according to claim 1, characterized in that: The lower metal base plate (23) has stress relief microgrooves (25) in the root region corresponding to the metal heat-conducting column (24) to form a local flexible relief area around the root of the metal heat-conducting column (24). The stress relief microgroove (25) is an annular groove surrounding the root of the metal heat-conducting column (24), or a strip-shaped weakening groove extending between adjacent metal heat-conducting columns (24).

5. The heat dissipation assembly for a vapor chamber module adapted to a full-rate SFP connector according to claim 4, characterized in that: The depth of the stress relief microgroove (25) is 30%-50% of the thickness of the lower metal base plate (23), so that when the lower metal base plate (23) is subjected to force, the area where the stress relief microgroove (25) is located will produce an elastic yielding deformation similar to a micro hinge. The inner cavity of the stress relief microgroove (25) is filled with flexible thermally conductive silicone or phase change thermally conductive material. The filling surface of the flexible thermally conductive silicone or phase change thermally conductive material is flush with the surface of the lower metal base plate (23) facing the SFP module.

6. The heat dissipation assembly for a vapor chamber module adapted to a full-rate SFP connector according to claim 1, characterized in that: The composite thermally conductive contact layer (4) includes a flexible thermally conductive substrate and flexible thermally conductive protrusions (8) arrayed in the flexible thermally conductive substrate. The flexible heat-conducting protrusion (8) protrudes from the end of the flexible heat-conducting substrate on the side facing the SFP module in the direction of the SFP module, and the projection position of part of the flexible heat-conducting protrusion (8) on the plane perpendicular to the insertion direction of the SFP module corresponds one-to-one with the position of the metal heat-conducting pillar (24) on the lower metal base plate (23) to form a straight heat conduction path. The composite thermally conductive contact layer (4) can extend into the through groove (7), and the cross-section of the composite heat spreader (2) is larger than the cross-section of the through groove (7).

7. The heat dissipation assembly for a vapor chamber module adapted to a full-rate SFP connector according to claim 6, characterized in that: The flexible thermally conductive protrusion (8) has a microscopic anti-slip thermally conductive texture on the surface facing the SFP module. The microscopic anti-slip thermally conductive texture is a cross-shaped mesh or a small barb structure.

8. The heat dissipation assembly for a vapor chamber module adapted to a full-rate SFP connector according to claim 1, characterized in that: The modular heat dissipation fin assembly includes a plug-in assembly (9) and a heat dissipation insert (5) plugged into the plug-in assembly (9), wherein a portion of the plug-in assembly (9) is connected to the upper metal cover plate (21), and a portion of the plug-in assembly (9) is connected to the area of ​​the upper metal cover plate (21) corresponding to the metal heat-conducting column (24).

9. The heat dissipation assembly for a vapor chamber module adapted to a full-rate SFP connector according to claim 8, characterized in that: The plug-in assembly (9) includes a slot (91), and a limiting ring (92) is fixed on the inner wall of the slot (91) near the side of the upper metal cover plate (21) to limit the insertion depth of the heat dissipation plug (5) in the direction toward the SFP module. A thermal expansion actuator (10) is fixed at the end of the slot (91) in the direction away from the SFP module. When the insertion depth of the heat dissipation plug (5) is limited by the limiting ring (92), the thermal expansion actuator (10) does not contact the heat dissipation plug (5). The slot (91) has multiple side through slots on its side, and an elastic abutment plate (93) is connected in the side through slot. A wedge (95) is connected to the side of the elastic abutment plate (93) away from the center of the slot. The slot (91) is also provided with a receiving groove for receiving a locking ring (94). The inner surface of the locking ring (94) has a wedge surface that matches the wedge block (95). The locking ring (94) is also threadedly connected to the receiving groove.

10. The heat dissipation assembly for a vapor chamber module adapted to a full-rate SFP connector according to claim 9, characterized in that: When the sensed temperature is lower than the preset temperature threshold, the thermal expansion actuator (10) maintains the initial state, so that the heat dissipation strip (5) and the upper metal cover plate (21) maintain an air thermal insulation gap and are in a thermal blocking state to prevent the SFP module from being overcooled. When the temperature is higher than the temperature threshold, the thermal expansion actuator (10) is heated and generates a mechanical displacement in the direction away from the SFP module and eliminates the air insulation gap, forcing the heat dissipation strip (5) to fit with the thermal expansion actuator (10) and be in a thermally conductive state.

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