A graphene hydrogel heat dissipation patch, its preparation method and application

Abstract

This invention discloses a graphene hydrogel heat dissipation patch, its preparation method, and its application, relating to the field of heat dissipation patch technology. The patch comprises a heat dissipation coating, a copper-based thin mesh layer, and a non-woven fabric substrate layer arranged sequentially from top to bottom. The heat dissipation coating is tightly bonded to the copper-based thin mesh layer. The heat dissipation coating is applied to the upper surface of the copper-based thin mesh layer by coating or rolling, with some of the coating penetrating into the mesh openings of the copper-based thin mesh layer to form an embedded bond. The copper-based thin mesh layer and the non-woven fabric substrate layer are fixedly connected by adhesive. The combination of a copper-based thin mesh layer and graphene significantly increases the heat dissipation efficiency of the heat dissipation patch, expanding its market influence and increasing its competitiveness.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation patch technology, specifically to a graphene hydrogel heat dissipation patch, its preparation method, and its application. Background Technology

[0002] With the miniaturization and high power of electronic devices, and the increasing demand for medical cooling and heat dissipation in small industrial components, traditional thermal pads can no longer meet the requirements for efficient, flexible, and long-lasting heat dissipation. Currently, thermal pads on the market are mainly divided into single gel type and metal foil type. Among them, single gel type thermal pads have low thermal conductivity and can only achieve simple cooling by moisture evaporation, resulting in poor heat dissipation sustainability; metal foil type thermal pads have poor flexibility and poor adhesion, and can only achieve lateral heat distribution, failing to take into account the synergistic effect of heat absorption and conduction.

[0003] Graphene, as a carbon material with ultra-high thermal conductivity, far surpasses the thermal conductivity of traditional metals, while hydrogel possesses excellent heat storage, heat absorption, and flexible adhesion properties. Combining the two can achieve a synergistic improvement in both thermal conductivity and heat absorption. Copper-based thin mesh has excellent lateral thermal conductivity and a certain degree of flexibility, while non-woven fabric provides good fixation, water retention, and skin / device adhesion performance. The combination of these three can solve many defects of traditional thermal pads. However, there is currently no reasonable combination of graphene-hydrogel hybrid coating, copper-based thin mesh, and non-woven fabric with good process adaptability for thermal pad products and preparation methods. Therefore, the development of an efficient, flexible, and long-lasting thermal pad has significant practical application value. Summary of the Invention

[0004] The purpose of this invention is to provide a graphene hydrogel heat dissipation patch, its preparation method, and its application. This invention provides a heat dissipation patch with good heat dissipation effect, flexibility, good adhesion, long service life, and simple preparation process that can be mass-produced, as well as its preparation method.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a graphene hydrogel heat dissipation patch, comprising a heat dissipation coating layer, a copper-based thin mesh layer, and a non-woven fabric substrate layer arranged sequentially from top to bottom. The heat dissipation coating layer is tightly bonded to the copper-based thin mesh layer. The heat dissipation coating layer is applied to the upper surface of the copper-based thin mesh layer by coating or rolling, and part of the heat dissipation coating layer penetrates into the mesh of the copper-based thin mesh layer to form an embedded bond. The copper-based thin mesh layer and the non-woven fabric substrate layer are fixedly connected by adhesive bonding.

[0006] Preferably, the heat dissipation coating is a mixed coating of graphene and hydrogel, wherein the graphene is dispersed modified graphene, and its mass percentage in the heat dissipation coating is 1%-5%.

[0007] Preferably, the dispersed modified graphene is graphene oxide or graphene dispersion, and the hydrogel is a water-locking hydrogel, selected from one or a mixture of two of polyacrylamide hydrogels and sodium alginate hydrogels.

[0008] Preferably, the heat dissipation coating is a graphene coating and a hydrogel coating, wherein the hydrogel coating is tightly bonded to the copper-based thin mesh layer, and the graphene coating is tightly bonded to the top of the hydrogel coating.

[0009] Preferably, the thickness of the copper-based thin mesh layer is 20-80 μm, the mesh size is 0.2-1 mm, and the surface of the copper-based thin mesh layer is subjected to micro-roughening treatment.

[0010] Preferably, it also includes a release film layer, which is adhered to the heat dissipation coating and can be peeled off from the surface of the heat dissipation coating.

[0011] A method for preparing a graphene hydrogel heat dissipation patch, characterized by comprising the following steps: Step 1: Perform surface micro-roughening treatment on the copper-based thin mesh, then clean and dry it for later use; Step 2: Prepare a graphene and hydrogel mixed slurry by mixing the dispersed modified graphene with hydrogel monomers and crosslinking agents, stirring evenly to obtain a heat dissipation coating slurry; Step 3: Using a coating or rolling method, the heat dissipation coating slurry prepared in step 2 is applied to the surface of the copper-based thin mesh after step 1, allowing some of the slurry to penetrate into the mesh openings of the copper-based thin mesh. Then, a curing process is performed to form an embedded bond between the heat dissipation coating and the copper-based thin mesh layer. Step 4: Apply a hydrophilic adhesive evenly to the side of the copper-based thin mesh away from the heat dissipation coating, align and bond the non-woven fabric substrate layer to the copper-based thin mesh layer, apply pressure to fix it, and then dry it. Step 5: Cover the heat dissipation coating with the release film layer and fix it in place to obtain the finished heat dissipation sticker.

[0012] Furthermore, the micro-roughening treatment in step 1 is carried out by chemical etching or physical polishing, and the surface roughness Ra of the copper-based thin mesh after treatment is 0.5-2μm; the curing treatment temperature in step 3 is 40-60℃, and the curing time is 1-3h.

[0013] Compared with the prior art, the beneficial effects of the present invention are: High heat dissipation efficiency: It adopts a graphene-hydrogel hybrid coating and a copper-based thin mesh layer. Graphene provides ultra-high longitudinal thermal conductivity, hydrogel realizes phase change heat absorption and passive evaporation heat dissipation, and copper-based thin mesh realizes lateral heat diffusion. The three work together to improve heat dissipation efficiency by more than 30% compared with traditional heat dissipation patches. It can quickly remove heat from the heat source and achieve efficient cooling. Good structural stability: The surface of the copper-based thin mesh is micro-roughened, and the heat dissipation coating is embedded in the copper-based thin mesh. The copper-based thin mesh is bonded to the non-woven fabric with a hydrophilic adhesive, which effectively avoids delamination and delamination problems. The service life can reach 2-3 times that of traditional gel heat dissipation stickers. Excellent flexibility and fit: The copper-based thin mesh adopts a thin mesh structure, combined with the flexibility of hydrogel and non-woven fabric, which can be bent freely and adapted to curved heat sources. Whether it is used on the skin or attached to electronic devices and small chips, it can achieve a tight fit and improve heat dissipation. It has a wide range of applications: it can be used for heat dissipation in consumer electronics (mobile phones, tablets, power banks, etc.), medical cooling (heat-reducing patches, sports cooling patches, etc.), and industrial small components (chips, LED lights, etc.). It is also highly safe, with the hydrogel being gentle and non-irritating, and the copper-based thin mesh and non-woven fabric being environmentally friendly and non-toxic. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the heat dissipation coating structure of the present invention; In the figure: 1. Heat dissipation coating; 101. Graphene coating; 102. Hydrogel coating; 2. Copper-based thin mesh layer; 3. Non-woven fabric substrate layer; 4. Release film layer. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] A graphene hydrogel heat dissipation patch includes a heat dissipation coating layer, a copper-based thin mesh layer, and a non-woven fabric substrate layer arranged sequentially from top to bottom, with the following specific structure: Heat dissipation coating: Graphene-hydrogel hybrid coating, wherein the dispersed modified graphene is graphene oxide, which accounts for 2% of the mass of the heat dissipation coating, and the hydrogel is a polyacrylamide-based water-locking hydrogel. Copper-based thin mesh layer: 40μm thick, 0.5mm mesh size, and the surface is micro-roughened by chemical etching, resulting in a surface roughness Ra of 1μm. Non-woven fabric substrate layer: hydrophilic non-woven fabric with a thickness of 70μm, which has good water absorption and water retention properties; The copper-based thin mesh layer and the non-woven fabric substrate layer are bonded together with a hydrophilic adhesive. The heat dissipation coating is applied to the upper surface of the copper-based thin mesh layer, and part of the coating penetrates into the mesh of the copper-based thin mesh to form an embedded bond.

[0017] The manufacturing process of the above-mentioned heat dissipation sticker is as follows: Step 1: Take a copper-based thin mesh and perform surface micro-roughening treatment using chemical etching. After etching, rinse it three times with deionized water and dry it in a 60℃ oven for 30 minutes. Set aside for later use. Step 2: Mix graphene oxide, polyacrylamide monomer, and N,N-methylenebisacrylamide (crosslinking agent) at a mass ratio of 2:95:3, add deionized water, and stir for 40 minutes at a speed of 500 r / min and an ambient temperature of 22℃ to obtain a heat dissipation coating slurry. Step 3: Apply the heat dissipation coating slurry to the treated copper-based thin mesh surface using a coating machine. The coating thickness is 0.1 mm, ensuring that some of the slurry penetrates into the mesh holes. Then, place it in a 50°C oven to cure for 2 hours to form an embedded bond between the heat dissipation coating and the copper-based thin mesh layer. Step 4: Apply a hydrophilic adhesive evenly to the side of the copper-based mesh away from the heat dissipation coating, with a coating amount of 5g / m². Align the hydrophilic nonwoven fabric with the copper-based mesh, apply a pressure of 0.2MPa to fix it, and place it in a 60℃ oven to dry for 1 hour to obtain the finished heat dissipation sticker. Example

[0018] A graphene hydrogel heat dissipation patch includes, from top to bottom, a release film layer, a heat dissipation coating layer, a copper-based thin mesh layer, and a non-woven fabric substrate layer, with the following specific structure: Release film layer: covering the heat dissipation coating; Heat dissipation coating: Graphene-hydrogel hybrid coating, wherein the dispersed modified graphene is a graphene dispersion, which accounts for 4% of the mass of the heat dissipation coating, and the hydrogel is a water-locking hydrogel that is a mixture of polyacrylamide-based hydrogel and sodium alginate-based hydrogel in a mass ratio of 1:1. Copper-based thin mesh layer: 60μm thick, 0.8mm mesh size, and the surface is micro-roughened by physical polishing, resulting in a surface roughness Ra of 1.5μm. Non-woven fabric substrate layer: hydrophilic non-woven fabric with a thickness of 90μm, which has good water absorption and water retention properties; The copper-based thin mesh layer and the non-woven fabric substrate layer are bonded together with a hydrophilic adhesive. The heat dissipation coating is applied to the upper surface of the copper-based thin mesh layer by roller pressing. Part of the coating penetrates into the mesh of the copper-based thin mesh to form an embedded bond. The breathable PE film layer covers the surface of the heat dissipation coating and is attached and fixed.

[0019] The manufacturing process of the above-mentioned heat dissipation sticker is as follows: Step 1: Take a copper-based thin mesh and perform surface roughening treatment by physical polishing. After polishing, wash it three times with deionized water and dry it in a 60℃ oven for 30 minutes. Set aside for later use. Step 2: Mix graphene dispersion, polyacrylamide monomer, sodium alginate, and N,N-methylenebisacrylamide (crosslinking agent) in a mass ratio of 4:45:45:6, add deionized water, and stir for 50 minutes at a speed of 700 r / min and an ambient temperature of 24℃ to obtain a heat dissipation coating slurry. Step 3: Use a roller press to roll the heat dissipation coating slurry onto the surface of the treated copper-based thin mesh. The rolling thickness is 0.12mm, ensuring that some of the slurry penetrates into the mesh holes. Then, place it in a 55℃ oven to cure for 2.5 hours to form an embedded bond between the heat dissipation coating and the copper-based thin mesh layer. Step 4: Apply a hydrophilic adhesive evenly to the side of the copper-based mesh away from the heat dissipation coating, with a coating amount of 6g / m². Align the hydrophilic nonwoven fabric with the copper-based mesh, apply a pressure of 0.25MPa to fix it, and place it in a 65℃ oven to dry for 1.5h. Step 5: Cover the surface of the heat dissipation coating with the release film layer and fix it with a bonding machine to obtain the finished heat dissipation sticker.

[0020] The above embodiments are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

[0021] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A graphene hydrogel heat dissipation patch, characterized in that, The material includes a heat dissipation coating (1), a copper-based thin mesh layer (2), and a non-woven fabric substrate layer (3) arranged sequentially from top to bottom. The heat dissipation coating (1) is tightly bonded to the copper-based thin mesh layer (2). The heat dissipation coating (1) is applied to the upper surface of the copper-based thin mesh layer (2) by coating or rolling, and part of the heat dissipation coating (2) penetrates into the mesh of the copper-based thin mesh layer (2) to form an embedded bond. The copper-based thin mesh layer (2) and the non-woven fabric substrate layer (3) are fixedly connected by adhesive bonding.

2. The graphene hydrogel heat dissipation patch according to claim 1, characterized in that: The heat dissipation coating (1) is a mixed coating of graphene and hydrogel, wherein the graphene is dispersed modified graphene and its mass percentage in the heat dissipation coating is 1%-5%.

3. The graphene hydrogel heat dissipation patch according to claim 2, characterized in that: The dispersed modified graphene is graphene oxide or graphene dispersion, and the hydrogel is a water-locking hydrogel, selected from one or a mixture of two of polyacrylamide hydrogels and sodium alginate hydrogels.

4. The graphene hydrogel heat dissipation patch according to claim 1, characterized in that: The heat dissipation coating (1) is a graphene coating (101) and a hydrogel coating (102), and the hydrogel coating (102) is tightly bonded to the copper-based thin mesh layer (2), and the hydrogel coating (102) is tightly bonded to the graphene coating (101).

5. The graphene hydrogel heat dissipation patch according to claim 1, characterized in that: The thickness of the copper-based thin mesh layer (2) is 20-80 μm, the mesh size is 0.2-1 mm, and the surface of the copper-based thin mesh layer (2) is subjected to micro-roughening treatment.

6. The graphene hydrogel heat dissipation patch according to claim 1, characterized in that: It also includes a release film layer (4) which is bonded to the heat dissipation coating (1) and can be peeled off from the surface of the heat dissipation coating (1).

7. A method for preparing a graphene hydrogel heat dissipation patch according to claim 1, characterized in that, Includes the following steps: Step 1: Perform surface micro-roughening treatment on the copper-based thin mesh, then clean and dry it for later use; Step 2: Prepare a graphene and hydrogel mixed slurry by mixing the dispersed modified graphene with hydrogel monomers and crosslinking agents, stirring evenly to obtain a heat dissipation coating slurry; Step 3: Using coating or rolling, the heat dissipation coating (1) slurry prepared in step 2 is applied to the surface of the copper-based thin mesh after step 1, so that some of the slurry penetrates into the mesh of the copper-based thin mesh, and then a curing process is performed to form an embedded bond between the heat dissipation coating (1) and the copper-based thin mesh layer (2). Step 4: Apply a hydrophilic adhesive evenly to the side of the copper-based thin mesh away from the heat dissipation coating, align and bond the non-woven fabric substrate layer to the copper-based thin mesh layer, apply pressure to fix it, and then dry it. Step 5: Cover the heat dissipation coating (1) with the release film layer (4), and fix it to obtain the finished heat dissipation sticker.

8. The method for preparing a graphene hydrogel heat dissipation patch according to claim 1, characterized in that: The micro-roughening treatment in step 1 is carried out by chemical etching or physical polishing, and the surface roughness Ra of the copper-based thin mesh after treatment is 0.5-2μm; the curing treatment in step 3 is carried out at a temperature of 40-60℃ and a curing time of 1-3h.

9. The graphene hydrogel heat dissipation patch as described in claim 1, applied to heat dissipation in electronic products.

10. The graphene hydrogel heat dissipation patch as described in claim 1, applied to heat dissipation in the medical field.

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