A prefabricated layered heat dissipation device based on honeycomb structure and air-liquid synergy

Abstract

This invention discloses a prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, relating to the field of data center server heat dissipation technology. Addressing the problems of low efficiency, poor adaptability, and lack of air-liquid coordination in high-density server scenarios, traditional heat dissipation solutions employ the following approach: the heat dissipation device is integrated inside the server rack, vertically divided into three functional layers from bottom to top: a liquid-cooled base layer, an air-cooled middle layer, and an air-liquid coupling layer. The liquid-cooled base layer is attached to the server backplane via modular microchannel liquid-cooled plates, utilizing the flow channels of the microchannel liquid-cooled plates to precisely capture heat. The honeycomb airflow distributor in the air-cooled middle layer works in conjunction with the heat dissipation fins to achieve efficient airflow guidance and heat conduction. The air-liquid coupling layer utilizes a plate-type gas-liquid heat exchanger and a temperature sensor to complete heat exchange between the coolant and hot air, and adaptive heat dissipation adjustment. This invention can improve heat dissipation efficiency and enhance the stability of server operation.

Description

Technical Field

[0001] This invention relates to the field of data center server heat dissipation technology, specifically a prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling. Background Technology

[0002] With the rapid development of the digital economy, data centers, as the core of computing infrastructure, are experiencing increasingly higher server deployment densities, with single-rack power requirements now exceeding 50kW. While high-density deployment significantly improves computing power output efficiency, it also makes server heat dissipation a key bottleneck restricting the stable operation of data centers. Traditional cooling solutions primarily rely on single-air cooling, using rack fans or air conditioning systems to force airflow. However, in high-density scenarios, airflow is prone to short-circuiting and dead zones, leading to heat accumulation. This not only affects the operational stability and lifespan of servers but also results in excessive energy consumption, contradicting the current demand for green and low-carbon data center development.

[0003] To address the heat dissipation challenges of high-density servers, the industry has gradually explored liquid cooling technology, which demonstrates certain advantages in high-power scenarios due to its higher heat dissipation efficiency. However, existing liquid cooling solutions are mostly deployed independently or simply superimposed on air cooling, lacking deep collaborative design. On the one hand, liquid cooling components (such as cold plates) often require additional rack space, limiting server deployment density and posing a higher risk of leakage, which can severely damage server hardware. On the other hand, air cooling systems cannot dynamically adjust airflow distribution based on the liquid cooling effect, easily leading to overheating or underheating, resulting in energy waste. Furthermore, existing cooling solutions have poor adaptability to different form factors such as 1U / 2U rack servers and high-power GPU servers, requiring customized solutions and increasing the construction and maintenance costs of data centers. Summary of the Invention

[0004] This invention addresses the problems of low efficiency, poor adaptability, and lack of air-liquid coordination in traditional heat dissipation solutions in high-density server scenarios by providing a prefabricated layered heat dissipation device based on a honeycomb structure with air-liquid coordination.

[0005] The present invention provides a prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, and the technical solution adopted to solve the above-mentioned technical problems is as follows: A prefabricated layered cooling device based on a honeycomb structure and featuring coordinated air and liquid cooling is integrated inside a server rack. Vertically, from bottom to top, it comprises three functional layers: a liquid-cooled base layer, an air-cooled middle layer, and an air-liquid coupling layer. The liquid cooling base layer includes a modularly deployed microchannel liquid cooling plate on the server backplane. The microchannel liquid cooling plate absorbs the heat generated by the server, and the coolant inside the microchannel liquid cooling plate heats up and flows to the air-liquid coupling layer. The heat dissipation fins on the upper surface of the microchannel liquid cooling plate dissipate heat outwards simultaneously. The air-cooled middle layer includes a honeycomb airflow distributor installed inside the server rack. The airflow distributor absorbs the heat dissipated outward by the heat dissipation fins and transports it upward to the air-liquid coupling layer with the help of the air guide vanes on its top. The air-liquid coupling layer includes an air-liquid heat exchanger installed on the top of the server rack; the coolant delivered by the microchannel liquid cooling plate exchanges heat with the hot air delivered by the airflow distributor, the coolant after heat exchange flows back to the microchannel liquid cooling plate, and the hot air after heat exchange is discharged from the top of the rack.

[0006] Optionally, the microchannel liquid cooling plate has heat dissipation fins on its upper surface and flow channels inside, and the flow channels cover all the heat-generating components of the server CPU and GPU to ensure that the coolant completes heat exchange with the heat-generating components during the flow of the flow channels. The coolant that has completed heat exchange flows out from the outlet and flows to the air-liquid coupling layer.

[0007] Alternatively, the microchannel liquid cooling plate may have aluminum heat dissipation fins on its upper surface and an S-shaped flow channel inside, with the inlet and outlet of the flow channel located on the back of the cabinet.

[0008] Alternatively, the honeycomb airflow distributor may adopt a regular hexagonal cell structure, with a guide vane at the top air outlet of each cell; during the heat exchange between the coolant and the heating element, the heat absorbed by the microchannel liquid cooling plate is transferred upward to each cell through the heat dissipation fins, and the air inside the cell is heated. The honeycomb airflow distributor has a built-in temperature sensor that collects heat density data of each cell in real time. The data is uploaded to the control module for analysis and comparison. Based on the comparison results, the speed of the guide vanes of the corresponding cell is automatically adjusted so that the heat in the cell is directed upward to the air-liquid coupling layer.

[0009] Preferably, the honeycomb airflow distributor uses a regular hexagonal cell structure with a side length of 15cm, and the angle between the top air guide vane of the cell and the horizontal plane is 0°-60°.

[0010] Optionally, the gas-liquid heat exchanger is divided into independent fluid flow channels and air flow channels by corrugated plates. The coolant flowing out of the outlet of the microchannel liquid cooling plate flows into the fluid flow channel, while the heat in each cell of the honeycomb airflow distributor is directed upward into the air flow channel under the action of the air guide vanes. At this time, the coolant in the fluid flow channel and the hot air in the air flow channel complete the initial heat exchange. Temperature sensor two is installed inside the fluid flow channel. Temperature sensor two monitors the coolant temperature in real time and, based on the comparison between the monitoring result and the preset value, executes either a) or b): a) Coolant flows back to the microchannel liquid cooling plate, and hot air is exhausted from the top of the cabinet; b) First, the hot air mixes with the outside air and then undergoes a secondary heat exchange with the coolant. Subsequently, the coolant flows back to the microchannel liquid cooling plate, and the hot air is discharged from the top of the cabinet.

[0011] Optionally, the second temperature sensor monitors the coolant temperature in real time and performs either a) or b) based on the comparison between the monitoring result and a preset value. a) When the coolant temperature does not exceed the preset value of 35°C, the current heat exchange mode is maintained. The hot air in the airflow channel exchanges heat with the coolant and is heated up before being discharged from the top of the cabinet. The coolant in the fluid flow channel exchanges heat with the hot air and is cooled down before flowing back to the inlet of the microchannel liquid cooling plate. b) When the coolant temperature exceeds the preset value of 35°C, the bypass ventilation door of the gas-liquid heat exchanger is automatically opened to introduce low-temperature fresh air from outside the cabinet into the airflow channel. The low-temperature fresh air mixes with the original hot air, and the mixed air and coolant complete a secondary heat exchange. Temperature sensor 2 monitors the coolant temperature in real time and finds that it does not exceed the preset value of 35°C. After the mixed air is heated, it is discharged from the top of the cabinet, and after the coolant is cooled, it flows back to the inlet of the microchannel liquid cooling plate.

[0012] Preferably, the gas-liquid heat exchanger in question adopts a plate structure, with stainless steel corrugated plates arranged inside, and the channel spacing of the corrugated plates is set to 3mm.

[0013] Preferably, the device involved is a standardized prefabricated layered structure, with multiple devices arranged in a matrix array.

[0014] The prefabricated layered heat dissipation device based on a honeycomb structure and featuring coordinated air-liquid cooling has the following advantages compared to existing technologies: The prefabricated layered heat dissipation device of this invention is integrated inside the server rack and is vertically divided into three functional layers from bottom to top: a liquid-cooled base layer, an air-cooled middle layer, and an air-liquid coupling layer. The liquid-cooled base layer is attached to the server back panel through a modular microchannel liquid-cooled plate, which accurately captures heat through the flow channels of the microchannel liquid-cooled plate. The honeycomb airflow distributor and heat dissipation fins of the air-cooled middle layer work together to achieve efficient airflow guidance and heat conduction. The air-liquid coupling layer uses a plate-type air-liquid heat exchanger and a temperature sensor to complete the heat exchange between the coolant and the hot air and to achieve adaptive heat dissipation adjustment. This solves the problems of low efficiency, poor adaptability, and lack of air-liquid synergy in traditional heat dissipation solutions in high-density server scenarios. Attached Figure Description

[0015] Appendix Figure 1 This is an isometric view of the heat dissipation device of the present invention; Appendix Figure 2 This is a front view of the heat dissipation device of the present invention; Appendix Figure 3 This is a structural diagram of the liquid-cooled base layer of the heat dissipation device of the present invention; Appendix Figure 4 This is a flow chart of the heat dissipation process when the heat dissipation device of the present invention is running. Detailed Implementation

[0016] To make the technical solution, the technical problem solved, and the technical effect of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments. Example

[0017] This embodiment proposes a prefabricated layered heat dissipation device based on a honeycomb structure and air-liquid synergy. The device is integrated and deployed inside the server rack, and is divided into three functional layers from bottom to top vertically: a liquid cooling base layer, an air cooling middle layer, and an air-liquid coupling layer.

[0018] The three-layer functional structure of this embodiment is described in detail below. Please refer to the appendix for details. Figure 1-4 ,in: Figure 1 In the air-cooled middle layer, only one air guide vane is drawn and shown; air guide vanes are not drawn in other cells. Figure 2 This is the front view of the heat dissipation device; Figure 3 This is a diagram of the liquid cooling base structure, which does not show the heat dissipation fins, but only the flow path of the coolant; Figure 4 This is a flowchart illustrating the heat dissipation process during the operation of the heat dissipation device.

[0019] The liquid cooling base layer comprises a modularly deployed microchannel liquid cooling plate on the server backplane. The microchannel liquid cooling plate has heat dissipation fins on its upper surface and internal flow channels. The inlet and outlet of these channels are located on the back of the server rack, covering all heat-generating components of the server's CPU and GPU. When the server is operating, the heat generated by the CPU and GPU components is absorbed by the microchannel liquid cooling plate. Low-temperature coolant enters the flow channels of the microchannel liquid cooling plate through the inlet, absorbing heat and increasing in temperature as it flows through the channels before flowing further towards the air-liquid coupling layer. Simultaneously, the heat dissipation fins on the upper surface of the microchannel liquid cooling plate dissipate heat outwards. In short, the microchannel liquid cooling plate absorbs heat generated by the heat-generating components using flowing coolant and directs it to the air-liquid coupling layer. The heat dissipation fins then transfer the heat generated by the heat-generating components upwards to the air-cooled middle layer.

[0020] The air-cooled middle layer includes a honeycomb airflow distributor installed inside the server rack. The honeycomb airflow distributor uses a regular hexagonal cell structure, with a guide vane at the top of each cell. During heat exchange between the coolant and the heat-generating elements, the heat absorbed by the microchannel liquid cooling plate is transferred upwards to each cell via the heat dissipation fins, raising the air temperature within the cell. The honeycomb airflow distributor has a built-in temperature sensor that collects heat density data from each cell in real time. This data is uploaded to the control module for analysis and comparison, and the module automatically adjusts the rotation speed of the guide vanes in the corresponding cell based on the comparison results, directing the heat within the cell upwards to the air-liquid coupling layer. In specific implementations, to better guide heat, the guide vanes can be a cross-shaped structure with four blades arranged in a ring and integrally connected to a bushing (e.g., Figure 1 At this point, the blade body adopts a straight plate structure or an arc plate structure. The angle between the plane of the blade body with the straight plate structure or the plane of the tangent of the blade body surface with the horizontal plane is 0°-60°. The output shaft of the micro servo motor drives the guide vane to rotate, thereby directing the heat in the cell upward to the wind-liquid coupling layer.

[0021] The air-liquid coupling layer includes a gas-liquid heat exchanger installed on top of the server rack. The gas-liquid heat exchanger is internally divided into independent fluid and air channels by corrugated plates. High-temperature coolant (high temperature relative to the initial coolant flowing into the microchannel liquid-cooled plate) flows from the outlet of the microchannel liquid-cooled plate into the fluid channel. Simultaneously, heat from each cell of the honeycomb airflow distributor is directed upwards into the air channel by the guide vanes. At this point, the high-temperature coolant in the fluid channel and the low-temperature hot air in the air channel (low temperature relative to the high-temperature coolant temperature) complete the initial heat exchange. A second temperature sensor is installed inside the fluid channel. This sensor monitors the coolant temperature in real time and, based on the comparison between the monitoring result and a preset value, executes either a) or b). a) When the coolant temperature does not exceed the preset value of 35°C, the current heat exchange mode is maintained. The hot air in the airflow channel exchanges heat with the coolant and is heated up before being discharged from the top of the cabinet. The coolant in the fluid flow channel exchanges heat with the hot air and is cooled down before flowing back to the inlet of the microchannel liquid cooling plate. b) When the coolant temperature exceeds the preset value of 35°C, the bypass ventilation door of the gas-liquid heat exchanger is automatically opened to introduce low-temperature fresh air from outside the cabinet into the airflow channel (the low temperature here is compared with the current hot air temperature). The low-temperature fresh air mixes with the current hot air, and the mixed air and coolant complete a secondary heat exchange (after the secondary heat exchange, the coolant temperature is lower than the initial temperature when it enters the air-liquid coupling layer, and the mixed air temperature is higher than the initial temperature when the hot air enters the air-liquid coupling layer). The temperature sensor 2 monitors the coolant temperature in real time to ensure that it does not exceed the preset value of 35°C. After the mixed air is heated, it is discharged from the top of the cabinet, and after the coolant is cooled, it flows back to the inlet of the microchannel liquid cooling plate.

[0022] Based on the heat dissipation device of this embodiment, the liquid-cooled base layer ensures accurate heat capture, the air-cooled middle layer ensures smooth heat conduction, and the air-liquid coupling layer ensures thorough heat dissipation. The three work together continuously to form a complete closed loop of "capture-conduction-dissipation-heat exchange-exhaust," ultimately achieving a single-rack heat dissipation capacity exceeding 50kW, meeting the heat dissipation requirements of high-performance servers. It can effectively solve the problem of airflow short-circuiting within the rack, increasing airflow utilization to over 90% and improving air-cooling efficiency. The modular microchannel liquid-cooled plate used in the liquid-cooled base layer has a flow channel design that precisely corresponds to the heat source and has low contact thermal resistance, which can improve heat exchange efficiency. The gas-liquid heat exchanger in the air-liquid coupling layer can realize a stepped relay of air-liquid heat exchange and enhance the adaptability and energy efficiency of the heat dissipation device through automatic adjustment under different temperature conditions.

[0023] Based on the structure of the embodiment, it is necessary to add that: (1) the heat dissipation fins are preferably made of aluminum material, the microchannel liquid cooling plate has an S-shaped flow channel inside, and the liquid inlet and outlet of the flow channel are located on the same side of the back of the cabinet. (2) the honeycomb airflow distributor adopts a regular hexagonal cell structure with a side length of 15cm. (3) the gas-liquid heat exchanger adopts a plate structure, and stainless steel corrugated plates are arranged inside, with the channel spacing of the corrugated plates set to 3mm. (4) the heat dissipation device is a standardized prefabricated layered structure, and multiple heat dissipation devices are arranged in a matrix array.

[0024] It should be further noted that the heat dissipation device in this embodiment adopts an "embedded, covered, and top-centralized" space design, occupying only the gap space and redundant space of the rack, without compressing the core area where the server is installed; at the same time, the prefabrication and integration reduces the space waste of scattered components, making the space occupancy more compact than traditional solutions and greatly improving the rack space utilization rate.

[0025] In summary, the prefabricated layered heat dissipation device based on a honeycomb structure and featuring air-liquid synergy, as described in this invention, solves the problems of low efficiency, poor adaptability, and lack of air-liquid synergy in traditional heat dissipation solutions for high-density server scenarios. It can effectively improve airflow utilization, enabling the heat dissipation capacity of a single rack to exceed 50kW, significantly reducing the risk of leakage, and adapting to server power fluctuations. It has significant advantages in integrated heat dissipation scenarios such as 1U / 2U rack servers and high-power GPU servers.

[0026] The above specific examples illustrate the principles and implementation methods of the present invention in detail. These embodiments are merely for the purpose of helping to understand the core technical content of the present invention. Based on the above specific embodiments of the present invention, any improvements and modifications made to the present invention by those skilled in the art without departing from the principles of the present invention should fall within the patent protection scope of the present invention.

Claims

1. A prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, characterized in that, The device is integrated inside the server rack and is vertically divided into three functional layers from bottom to top: a liquid-cooled base layer, an air-cooled middle layer, and an air-liquid coupling layer; among which: The liquid cooling base layer includes a modularly deployed microchannel liquid cooling plate on the server backplane. The microchannel liquid cooling plate absorbs the heat generated by the server, and the coolant inside the microchannel liquid cooling plate heats up and flows to the air-liquid coupling layer. The heat dissipation fins on the upper surface of the microchannel liquid cooling plate dissipate heat outwards simultaneously. The air-cooled middle layer includes a honeycomb airflow distributor installed inside the server rack. The airflow distributor absorbs the heat dissipated outward by the heat dissipation fins and transports it upward to the air-liquid coupling layer with the help of the air guide vanes on its top. The air-liquid coupling layer includes an air-liquid heat exchanger installed on the top of the server rack; the coolant delivered by the microchannel liquid cooling plate exchanges heat with the hot air delivered by the airflow distributor, the coolant after heat exchange flows back to the microchannel liquid cooling plate, and the hot air after heat exchange is discharged from the top of the rack.

2. The prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, as described in claim 1, is characterized in that... The microchannel liquid cooling plate has heat dissipation fins on its upper surface and flow channels inside. The flow channels cover all the heat-generating components of the server CPU and GPU to ensure that the coolant completes heat exchange with the heat-generating components during the flow of the flow channels. The coolant that has completed heat exchange flows out from the outlet and flows to the air-liquid coupling layer.

3. The prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, as described in claim 2, is characterized in that... The microchannel liquid cooling plate has aluminum heat dissipation fins on its upper surface and an S-shaped flow channel inside. The liquid inlet and outlet of the flow channel are both located on the back of the cabinet.

4. The prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, as described in claim 2, is characterized in that... The honeycomb airflow distributor adopts a regular hexagonal cell structure, and each cell has a guide vane at the top air outlet. During the heat exchange between the coolant and the heating element, the heat absorbed by the microchannel liquid cooling plate is transferred upward to each cell through the heat dissipation fins, and the air inside the cell is heated. The honeycomb airflow distributor has a built-in temperature sensor that collects heat density data of each cell in real time. The data is uploaded to the control module for analysis and comparison. Based on the comparison results, the speed of the guide vanes of the corresponding cell is automatically adjusted so that the heat in the cell is directed upward to the air-liquid coupling layer.

5. The prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, as described in claim 4, is characterized in that... The honeycomb airflow distributor uses a regular hexagonal cell structure with a side length of 15cm; the angle between the top guide vane of the cell and the horizontal plane is 0°-60°.

6. A prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, as described in claim 4, is characterized in that... The gas-liquid heat exchanger is divided into independent fluid flow channels and air flow channels by a corrugated plate. The coolant flowing out of the outlet of the microchannel liquid cooling plate flows into the fluid flow channel, while the heat in each cell of the honeycomb airflow distributor is directed upward into the air flow channel by the action of the air guide vanes. At this time, the coolant in the fluid flow channel and the hot air in the air flow channel complete the initial heat exchange. Temperature sensor two is installed inside the fluid flow channel. Temperature sensor two monitors the coolant temperature in real time and, based on the comparison between the monitoring result and the preset value, executes either a) or b): a) Coolant flows back to the microchannel liquid cooling plate, and hot air is exhausted from the top of the cabinet; b) First, the hot air mixes with the outside air and then undergoes secondary heat exchange with the coolant. Subsequently, the coolant flows back to the microchannel liquid cooling plate, and the hot air is discharged from the top of the cabinet.

7. A prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, as described in claim 6, is characterized in that... Temperature sensor 2 monitors the coolant temperature in real time and performs either a) or b) based on the comparison between the monitoring result and the preset value. a) When the coolant temperature does not exceed the preset value of 35°C, the current heat exchange mode is maintained. The hot air in the airflow channel exchanges heat with the coolant and is heated up before being discharged from the top of the cabinet. The coolant in the fluid flow channel exchanges heat with the hot air and is cooled down before flowing back to the inlet of the microchannel liquid cooling plate. b) When the coolant temperature exceeds the preset value of 35°C, the bypass ventilation door of the gas-liquid heat exchanger is automatically opened to introduce low-temperature fresh air from outside the cabinet into the airflow channel. The low-temperature fresh air mixes with the original hot air, and the mixed air and coolant complete a secondary heat exchange. Temperature sensor 2 monitors the coolant temperature in real time and finds that it does not exceed the preset value of 35°C. After the mixed air is heated, it is discharged from the top of the cabinet, and after the coolant is cooled, it flows back to the inlet of the microchannel liquid cooling plate.

8. A prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, as described in claim 6, is characterized in that... The gas-liquid heat exchanger adopts a plate structure, with stainless steel corrugated plates arranged inside, and the channel spacing of the corrugated plates is set to 3mm.

9. A prefabricated layered heat dissipation device based on a honeycomb structure with coordinated air and liquid cooling, as described in claim 1, is characterized in that... The device is a standardized prefabricated layered structure, with multiple devices arranged in a matrix array.

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