Circulating heat dissipation components, remote plasma source devices, and semiconductor equipment

Abstract

This application discloses a circulating heat dissipation assembly, a remote plasma source device, and a semiconductor device, which improves the heat dissipation efficiency of the circulating heat dissipation assembly and ensures the stability of the remote plasma source device during high-power operation. The circulating heat dissipation assembly includes a housing, at least one liquid cooler, a liquid-air heat exchanger, and at least one air cooler. The housing has a receiving cavity, a first water inlet, and a first water outlet. The heat-generating component is located within the receiving cavity. The receiving cavity includes a circulating air duct, which is formed between the at least one heat-generating component and the housing. The liquid cooler is installed within the receiving cavity and is used to dissipate heat from the at least one heat-generating component. Each liquid cooler has a second water inlet and a second water outlet, which are connected to the first water inlet and the second water outlet are connected to the first water outlet. The liquid-air heat exchanger is installed within the circulating air duct and is connected to the at least one liquid cooler. The air cooler is located within the circulating air duct.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a circulating heat dissipation component, a remote plasma source device, and a semiconductor device. Background Technology

[0002] Remote plasma sources (RPS) are common devices in semiconductor manufacturing technology. RPS devices have complex internal structures with numerous heat-generating components, resulting in high power consumption. The printed circuit boards, cavity modules, and main transformer cores within the RPS all require significant heat dissipation. Current RPS devices employ limited and ineffective heat dissipation methods, failing to meet the specific heat dissipation needs of existing RPS devices. Summary of the Invention

[0003] This application discloses a circulating heat dissipation component, a remote plasma source device, and a semiconductor device to solve the problems of single heat dissipation system and limited heat dissipation effect, improve the heat dissipation efficiency of the circulating heat dissipation component, and thus improve the reliability and stability of the remote plasma source device during high-power operation.

[0004] In a first aspect, this application provides a circulating heat dissipation assembly for use in a device. The device includes at least one heat-generating component. The circulating heat dissipation assembly includes a housing, at least one liquid cooler, an air-liquid heat exchanger, and at least one air cooler. The housing is provided with a receiving cavity, a first water inlet, and a first water outlet. The receiving cavity is located inside the housing. The first water inlet and the first water outlet both penetrate the housing along the wall thickness direction. The heat-generating component is located inside the receiving cavity. The containment cavity includes a circulating air duct, at least one heat-generating component forms a circulating air duct with the housing, a liquid cooler is installed in the containment cavity and is used to dissipate heat from at least one heat-generating component, each liquid cooler has a second inlet and a second outlet, the second inlet is connected to the first inlet and the second outlet is connected to the first outlet, and a wind-liquid heat exchanger is installed in the circulating air duct and is connected to at least one liquid cooler. The air cooler is located inside the circulating air duct.

[0005] The circulating heat dissipation component of the present application conducts liquid cooling and air cooling for at least one heat-generating component by setting at least one liquid cooler and at least one air cooler. The heat-generating component can dissipate heat to the circulating air duct, forming hot air. Then, through the air cooler, the hot air in the circulating air duct flows. When the hot air passes through the air-liquid heat exchanger located in the circulating air duct, the hot air exchanges heat with the liquid cooler through the air-liquid heat exchanger, realizing heat dissipation in the circulating air duct and combining liquid cooling and air cooling to improve the heat dissipation efficiency of the circulating heat dissipation component. The entire circulating heat dissipation component can have only one first water inlet and one first water outlet to exchange heat with the outside, which is beneficial to the spatial layout of the internal components of the remote plasma source device and can make the internal structure of the remote plasma source device compact, facilitating miniaturization.

[0006] In a possible implementation manner, there are at least two air coolers. The blowing directions of the at least two air coolers are the same, and the at least two air coolers are arranged at intervals along the circulating air duct. By setting two air coolers at intervals with the same blowing direction, it is beneficial to form a circulating air in the circulating air duct and at the same time beneficial to exchange the heat in the circulating air duct to the liquid cooling source in the liquid cooler through the air-liquid heat exchanger, so as to accelerate the air cooling efficiency.

[0007] In a possible implementation manner, the at least two air coolers include a first air cooler and a second air cooler. The power of the first air cooler is greater than that of the second air cooler. The first air cooler is installed on the air-liquid heat exchanger, and the first air cooler is used to blow hot air into the air-liquid heat exchanger. Using a high-power air cooler can accelerate the heat transfer of the hot air at the air-liquid heat exchanger, which is beneficial to improving the heat exchange of the hot air in the circulating air duct to the liquid cooling source of the liquid cooler, thus being beneficial to improving the heat dissipation efficiency of the circulating heat dissipation component.

[0008] In a possible implementation manner, the circulating air duct is in a "return" shape, "S" shape or "L" shape. The specific shape of the circulating air duct is selected according to the distribution of the heat-generating components inside the remote plasma source device, which is beneficial to improving the flexibility of the internal structure layout of the remote plasma source device.

[0009] In a possible implementation manner, the air-liquid heat exchanger includes heat exchange pipes and heat dissipation fins. The heat exchange pipes are connected to at least one liquid cooler, and the heat dissipation fins are sleeved on the heat exchange pipes. In this setting, the air-liquid heat exchanger can be connected in series with the liquid cooler, and the air-liquid heat exchanger can dissipate heat from the hot air in the circulating air duct alone. Specifically, the liquid cooling source can flow out from one liquid cooler and flow into the heat exchange pipes. The hot air in the circulating air duct conducts heat to the liquid cooling source in the heat exchange pipes, realizing the combination of air cooling and liquid cooling. In addition, the heat dissipation fins can increase the contact area between the hot air in the circulating air duct and the air-liquid heat exchanger, improving the heat exchange efficiency. The heat dissipation fins are sleeved on the heat exchange pipes, and the heat of the hot air can be introduced into the liquid cooling source in the heat exchange pipes through the heat dissipation fins, thereby reducing the heat in the circulating air duct.

[0010] In one possible implementation, the heat exchange pipe includes multiple curved sections and at least one straight section, with the straight section connecting two curved sections.

[0011] The curved section increases the length of the heat exchange pipe per unit area, allowing more liquid cooling source to flow within that area. This improves the heat exchange efficiency between the hot air in the circulating duct and the liquid cooling source within the pipe, thus enhancing the heat dissipation efficiency of the air-liquid heat exchanger. Furthermore, the straight section reduces flow resistance and energy consumption, ensuring smooth flow of the liquid cooling source within the heat exchange pipe. The straight section also acts as a buffer, preventing excessive accumulation of eddies and pressure losses generated by the curved section. Additionally, the straight section promotes uniform flow of the liquid cooling source within the heat exchange pipe, facilitating uniform heat exchange and improving the heat exchange efficiency of the air-liquid heat exchanger, thereby enhancing the heat dissipation efficiency of the hot air in the circulating duct.

[0012] In one possible implementation, the circulating heat dissipation assembly further includes a heat pipe radiator, which is installed within the housing cavity and in contact with at least one heat-generating component. At least one liquid cooler includes a first liquid cooling plate located within a containment cavity and in contact with a heat pipe radiator.

[0013] The heat pipe radiator can be bent and can come into contact with some specially structured heat-generating components and the first liquid cooling plate. This facilitates the heat-generating components to conduct heat to the first liquid cooling plate through the heat pipe radiator, thereby achieving heat dissipation of the heat-generating components and improving the heat dissipation efficiency of the circulating heat dissipation assembly.

[0014] Secondly, this application provides a remote plasma source device, including at least one heat-generating component and a circulating heat dissipation assembly as described above, wherein the circulating heat dissipation assembly dissipates heat from the heat-generating component. By setting up the aforementioned circulating heat dissipation assembly, while performing air cooling and liquid cooling respectively, the heat of the hot air in the circulating air duct is transferred to the liquid cooler, realizing a combination of air cooling and liquid cooling, which is beneficial to improving the heat dissipation efficiency of the circulating heat dissipation assembly and the reliability and stability of the remote plasma source device during high-power operation.

[0015] In one possible implementation, there are multiple heating components, two of which are a first circuit board and a second circuit board. A circulating air duct is formed between the first circuit board and the housing. The second circuit board is spaced apart from the first circuit board and spaced apart from the liquid cooler. The power of the second circuit board is less than that of the first circuit board. At least one liquid cooler includes a second liquid cooling plate, which is mounted on one side of the first circuit board.

[0016] By placing a second liquid cooling plate next to the high-power first circuit board, the first circuit board dissipates heat to the circulating air duct, while the second liquid cooling plate can also perform liquid cooling, thereby improving the heat dissipation efficiency of the circulating heat dissipation component for the higher-power first circuit board.

[0017] Thirdly, this application provides a semiconductor device, including a process chamber and a remote plasma source device as described above. The remote plasma source device is connected to the process chamber to provide the required active particles to the process chamber. The remote plasma source device includes a circulating heat dissipation assembly. By incorporating a liquid cooler, an air cooler, and an air-liquid heat exchanger, it can simultaneously perform liquid and air cooling on the heat-generating components. Simultaneously, it can exchange the heat from the hot air in the circulating air duct with the liquid cooler via the air-liquid heat exchanger, achieving a combination of liquid and air cooling. This improves the heat dissipation efficiency of the remote plasma source device and its reliability and stability during high-power operation, thereby enhancing the process stability of the semiconductor device. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a simplified diagram of a semiconductor device provided in an embodiment of this application; Figure 2 yes Figure 1 A schematic diagram of the remote plasma source device in the semiconductor equipment shown. Figure 3 yes Figure 2 A schematic diagram of the internal structure of the remote plasma source device shown. Figure 4 yes Figure 3 A schematic diagram of the planar structure of the remote plasma source device shown; Figure 5 yes Figure 4 A schematic diagram of the circulating heat dissipation component in the remote plasma source device shown. Figure 6 yes Figure 5 A schematic diagram of the planar structure of the circulating heat dissipation component shown; Figure 7 yes Figure 6 A schematic diagram of the air-liquid heat exchanger in the circulating heat dissipation assembly is shown. Figure 8 yes Figure 7 A schematic diagram of the heat exchange pipes and heat dissipation fins in the air-liquid heat exchanger shown. Figure 9 yes Figure 8 A schematic diagram of the heat exchange pipes and heat dissipation fins shown from another angle; Figure 10 yes Figure 6 The diagram shows the circulation path of the circulating heat dissipation component.

[0020] Explanation of reference numerals in the attached figures: 1-Semiconductor equipment; 10 - Process chamber; 20 - Remote plasma source device; 201 - Heating element; 202 - Second heating element; 203 - First circuit board; 204 - Second circuit board; 210 - Circulating heat dissipation component; 2101 - Shell; 2102 - Base plate; 2103 - Side plate; 21011-Receiving cavity; 21012-Circulating air duct; 21013-Heat dissipation cavity; 21015-First water inlet; 21016-First water outlet; 21031-First panel; 21032-Second panel; 21033-Third panel; 21034-Fourth panel; 2120 - Support frame; 21201 - First support frame; 21202 - Second support frame; 21203 - Third support frame; 21204 - Fourth support frame; 2130 - Liquid cooler; 2131 - First liquid cooling plate; 2132 - Second liquid cooling plate; 2133 - Irregularly shaped liquid cooling radiator; 2140 - Air-Liquid Heat Exchanger; 21401 - Heat exchange pipe; 21402 - Bend section; 21403 - Straight section; 21405 - Heat dissipation fins; 21406 - Through hole; 21407 - Outer shell; 21408 - Assembly hole; 2150 - Air cooler; 2151 - First air cooler; 2152 - Second air cooler; 2160 - Heat pipe radiator; 2170 - Onboard heatsink. Detailed Implementation

[0021] Please see Figure 1 , Figure 1 This is a simplified diagram of the semiconductor device 1 provided in the embodiments of this application.

[0022] This application provides an apparatus in some embodiments. The apparatus includes a semiconductor apparatus 1. The semiconductor apparatus 1 includes a process chamber 10 and a remote plasma source device 20. The remote plasma source device 20 is connected to the process chamber 10 so that the remote plasma source device 20 excites gas to form plasma through radio frequency or electromagnetic means, filters out high-energy particles, and then sends active particles into the process chamber, thereby enabling semiconductor manufacturing processes to be performed within the process chamber. The remote plasma source (RPS) device 20, used in an apparatus, particularly in the semiconductor apparatus 1, is a core component of the semiconductor apparatus 1. For example, the semiconductor apparatus 1 can be one of an etching apparatus, a chemical vapor deposition (CVD) apparatus, an atomic layer deposition (ALD) apparatus, or a physical vapor deposition (PVD) apparatus. The remote plasma source device 20 is used to output high concentrations of free radicals and / or ions such as fluorine (F) / oxygen (O) / hydrogen (H) / nitrogen (N) to support various process applications in semiconductor manufacturing, such as deposition, metal oxide cleaning, and etching.

[0023] Please see Figures 2 to 4 , Figure 2 yes Figure 1 The diagram shows the structure of the remote plasma source device 20 in the semiconductor device 1. Figure 3 yes Figure 2 The diagram shows the internal structure of the remote plasma source device 20. Figure 4 yes Figure 3 The diagram shows a planar structure of the remote plasma source device 20.

[0024] The remote plasma source device 20 includes at least one heat-generating component 201 and a circulating heat dissipation assembly 210. The circulating heat dissipation assembly 210 dissipates heat from the heat-generating component 201. At least one heat-generating component 201 is located within the circulating heat dissipation assembly 210. In this embodiment, there are multiple heat-generating components 201. The heat-generating components 201 are components that generate heat when the remote plasma source device 20 is operating, such as circuit boards, cavity modules, magnetic cores, etc. Throughout this text, "multiple" means at least two. When the remote plasma source device 20 is operating at high power, the multiple heat-generating components 201 will generate a large amount of heat.

[0025] The plurality of heat-generating components 201 includes a first heat-generating component and a second heat-generating component 202. There are multiple first heat-generating components and multiple second heat-generating components 202. The plurality of first heat-generating components surround and form a partial heat dissipation cavity 21013 with the plurality of second heat-generating components 202. A liquid cooler or other heat dissipation device can be installed within the heat dissipation cavity 21013 to dissipate heat from the heat-generating components 201.

[0026] The circulating heat dissipation assembly 210 includes a housing 2101, a support frame 2120, at least one liquid cooler 2130, an air-liquid heat exchanger 2140, and at least one air cooler 2150. The support frame 2120, liquid cooler 2130, air-liquid heat exchanger 2140, and air cooler 2150 are all located inside the housing 2101. The air-liquid heat exchanger 2140 is connected to at least one liquid cooler 2130, allowing the liquid cooling source to circulate within the air-liquid heat exchanger 2140 and the liquid cooler 2130. The air-liquid heat exchanger 2140 is installed within the circulating air duct 21012 to achieve a combination of air-cooling and liquid-cooling heat dissipation.

[0027] The housing 2101 has a receiving cavity 21011, a first water inlet 21015, and a first water outlet 21016. The receiving cavity 21011 is located inside the housing 2101 and is used to house the heating element 201, the support frame 2120, the liquid cooler 2130, the air-liquid heat exchanger 2140, and the air cooler 2150. That is, the heating element 201, the support frame 2120, the liquid cooler 2130, the air-liquid heat exchanger 2140, and the air cooler 2150 are all located within the receiving cavity 21011. The receiving cavity 21011 includes the aforementioned heat dissipation cavity 21013 and a circulation duct 21012, with at least one heating element 201 forming a circulation duct 21012 with the housing 2101. The heating element 201 can directly dissipate heat into the circulation duct 21012 for air cooling. Both the first inlet 21015 and the first outlet 21016 penetrate the shell 2101 along its wall thickness and communicate with the receiving cavity 21011 to connect with the liquid cooler 2130 located in the receiving cavity 21011. The first inlet 21015 and the first outlet 21016 are used to deliver the liquid cooling source. Specifically, the liquid cooling source enters through the first inlet 21015, flows through the air-liquid heat exchanger 2140 and each liquid cooler 2130, and then exits through the first outlet 21016.

[0028] The housing 2101 includes a bottom plate 2102, side plates 2103, and a cover plate (not shown in the figure). The side plates 2103 are fixedly connected to the bottom plate 2102 and are arranged around the bottom plate 2102. The side plates 2103 include a first panel 21031, a second panel 21032, a third panel 21033, and a fourth panel 21034. The first panel 21031 and the second panel 21032 are arranged opposite to each other. The third panel 21033 and the fourth panel 21034 are located between the first panel 21031 and the second panel 21032 and are arranged opposite to each other. The cover plate is arranged opposite to the bottom plate 2102 and is fixedly connected to the first panel 21031, the second panel 21032, the third panel 21033, and the fourth panel 21034. In this embodiment, both the first water inlet 21015 and the first water outlet 21016 are provided on the third panel 21033 of the side plates 2103.

[0029] The support frame 2120 is installed in the accommodation cavity 21011. Among them, the second heating component 202 is installed on the support frame 2120. The support frame 2120 divides the accommodation cavity 21011 into a heat dissipation cavity 21013 and a circulation air duct 21012. The heat dissipation cavity 21013 is used to accommodate the first heating component. The circulation air duct 21012 is arranged around the heat dissipation cavity 21013 and is used to accommodate the second heating component 202. In the circulation air duct 21012, the second heating component 202 can be cooled by air cooling. In this embodiment, the circulation air duct 21012 is in a "return" shape, and the air can continuously circulate in the "return" shape in the circulation air duct 21012 to cool the second heating component 202. In some other embodiments, the circulation air duct 21012 can be in an "S" shape or an "L" shape, etc. The specific shape of the circulation air duct 21012 is selected according to the distribution of the heating components 201 inside the remote plasma source device 20, which is beneficial to improving the flexibility of the internal structure layout of the remote plasma source device 20 and reducing the layout limitations. The present application does not specifically limit the specific shape of the circulation air duct.

[0030] In this embodiment, the support frame 2120 includes a first support frame 21201, a second support frame 21202, a third support frame 21203, and a fourth support frame 21204. The first support frame 21201 and the second support frame 21202 are arranged opposite to each other and spaced apart. For example, both the first support frame 21201 and the second support frame 21202 are parallel to the first panel 21031 and the second panel 21032, and are spaced apart from them. The second support frame 21202 is located on the side of the first support frame 21201 away from the first panel 21031, and is located between the first support frame 21201 and the second panel 21032. The third support frame 21203 and the fourth support frame 21204 are both fixedly connected between the first support frame 21201 and the second support frame 21202, and are arranged opposite to each other and spaced apart. For example, the third support frame 21203 and the fourth support frame 21204 are both parallel to the third panel 21033 and the fourth panel 21034. The fourth support frame 21204 is located on the side of the third support frame 21203 opposite to the fourth panel 21034, and is located between the first support frame 21201 and the second support frame 21202.

[0031] Please refer to the following: Figure 5 and Figure 6 , Figure 5 yes Figure 4 The schematic diagram of the circulating heat dissipation component 210 in the remote plasma source device 20 is shown. Figure 6 yes Figure 5 The diagram shows a planar structure of the circulating heat dissipation assembly 210, excluding the housing 2101.

[0032] A liquid cooler 2130 is installed within a receiving cavity 21011 and is used to dissipate heat from at least one heat-generating component 201. In this embodiment, there are multiple liquid coolers 2130. At least one liquid cooler 2130 is installed within a heat dissipation cavity 21013 and is used to dissipate heat from a first heat-generating component. At least one liquid cooler 2130 is installed within a circulating air duct 21012 and is used to dissipate heat from a second heat-generating component 202. The multiple liquid coolers 2130 are interconnected, allowing the liquid cooling source to flow within the multiple liquid coolers 2130. Each liquid cooler 2130 can dissipate heat from either the first heat-generating component or the second heat-generating component 202, which facilitates the independent design of the heat dissipation unit.

[0033] Each liquid cooler 2130 has a second inlet (not shown) and a second outlet (not shown). The second inlet is connected to the first inlet 21015, and the second outlet is connected to the first outlet 21016, forming a liquid cooling channel with one inlet and one outlet. The entire circulating heat dissipation assembly 210 transmits liquid cooling source through only one first inlet 21015 and one first outlet 21016, so as to realize liquid cooling heat dissipation of the remote plasma source device 20 at the same time. Specifically, the liquid cooling source flows into the second inlet of a liquid cooler 2130 from the first inlet 21015, then through multiple liquid coolers 2130 and the air-liquid heat exchanger 2140, and finally flows from the second outlet of a liquid cooler 2130 to the first outlet 21016, and then out of the first outlet 21016 to the outside of the remote plasma source device 20. This creates a continuous liquid cooling channel, allowing each liquid cooler 2130 to dissipate heat from a single heat-generating component 201. This enables independent design of the heat dissipation units, allowing each liquid cooler 2130 to operate independently and making the application more flexible. The liquid cooling channel refers to the path through which the liquid cooling source flows. At the same time, at least one liquid cooler 2130 is connected to the air-liquid heat exchanger 2140, which is located in the circulating air duct 21012. This allows the heat in the circulating air duct 21012 to be exchanged to the liquid cooling channel of the liquid cooler 2130 through the air-liquid heat exchanger 2140, thereby continuously reducing the temperature of the circulating air duct 21012 and achieving a combination of air cooling and liquid cooling.

[0034] At least one liquid cooler 2130 includes a first liquid cooling plate 2131, a second liquid cooling plate 2132, and a shaped liquid cooling radiator 2133. The first liquid cooling plate 2131 is located within the heat dissipation cavity 21013 and is fixedly connected to the housing 2101, and is used to dissipate heat from the first heat-generating component. In this embodiment, there is one first liquid cooling plate 2131. In some other embodiments, there may be multiple first liquid cooling plates 2131, and this application does not limit this.

[0035] In this embodiment, two of the multiple second heating components 202 are a first circuit board 203 and a second circuit board 204. The first circuit board 203 and the second circuit board 204 form the aforementioned circulating air duct 21012 with the housing. The power of the second circuit board 204 is less than the power of the first circuit board 203. The first circuit board 203 can be cooled simultaneously using both liquid cooling and air cooling to improve the heat dissipation efficiency of the circulating heat dissipation assembly 210. There are multiple first circuit boards 203. For example, there are two first circuit boards 203. The two first circuit boards 203 are spaced apart from the first support frame 21201 and the second support frame 21202, respectively.

[0036] The second circuit board 204 is spaced apart from the first circuit board 203 and spaced apart from at least one liquid cooler 2130. It should be noted that the second circuit board 204 uses air cooling for heat dissipation. The second circuit board 204 can be air-cooled solely by the air cooler 2150. Multiple second circuit boards 204 are present. For example, there are two second circuit boards 204. The two second circuit boards 204 are respectively fixedly connected to the third support frame 21203 and the fourth support frame 21204. The second circuit boards 204 are mounted on the support frame 2120 and spaced apart from the multiple liquid coolers 2130. Specifically, the heat from the second circuit board 204 is directly released into the circulating air duct 21012, achieving direct air cooling. It should be noted that air cooling can be used for low-power heat-generating components 201, while liquid cooling or a combination of air and liquid cooling can be used for high-power heat-generating components 201 to improve the heat dissipation efficiency of the circulating heat dissipation component 210. The choice between air cooling and liquid cooling can be made according to the actual power of the heat-generating component 201 and the heat dissipation requirements.

[0037] The second liquid cooling plate 2132 is located within the circulating air duct 21012 and is mounted on the support frame 2120, situated between the support frame 2120 and the first circuit board 203. It is understood that the first circuit board 203 is mounted on the side of the second liquid cooling plate 2132 facing away from the support frame 2120. Multiple second liquid cooling plates 2132 are present. Each second liquid cooling plate 2132 is mounted on one side of the first circuit board 203 and situated between the support frame 2120 and the first circuit board 203. For example, there are two second liquid cooling plates 2132. The two second liquid cooling plates 2132 are respectively fixedly connected to the first support frame 21201 and the second support frame 21202. In this embodiment, the second inlet of one second liquid cooling plate 2132 communicates with the first inlet 21015, allowing the liquid cooling source to enter the liquid cooler 2130 from the first inlet 21015. Another second liquid cooling plate 2132 is located between another first circuit board 203 and the second support frame 21202, and is connected between a second liquid cooling plate 2132 and a first liquid cooling plate 2131. In this configuration, while the first circuit board 203 dissipates heat to the circulating air duct 21012, the heat can be transferred to the liquid cooling source in the second liquid cooling plate 2132 for liquid cooling heat dissipation, thereby improving the heat dissipation efficiency of the circulating heat dissipation component 210 for the high-power first circuit board 203, and improving the reliability and stability of the remote plasma source device 20 during high-power operation.

[0038] In this embodiment, two of the multiple first heating components are a cavity module and a magnetic core, respectively. The magnetic core surrounds the cavity module. For example, the magnetic core is the main transformer core. The irregularly shaped liquid-cooled radiator 2133 is located within the heat dissipation cavity 21013, contacts one heating component 201, communicates with another liquid cooler 2130, and is fixedly connected to the housing 2101. In this embodiment, the irregularly shaped liquid-cooled radiator 2133 encloses the cavity module and communicates with the first liquid cooling plate 2131. Specifically, the second inlet of the irregularly shaped liquid-cooled radiator 2133 communicates with the second outlet of the first liquid cooling plate 2131, and the second outlet of the irregularly shaped liquid-cooled radiator 2133 communicates with the first outlet. The liquid cooling source in the first liquid cooling plate 2131 flows through the first liquid cooling plate 2131 once and then flows out from its second outlet to the second inlet of the irregular liquid cooling radiator 2133. After flowing through the irregular liquid cooling radiator 2133 once, it flows out from the second outlet of the irregular liquid cooling radiator 2133 to the first outlet, thus delivering a high-temperature liquid cooling source to the outside of the remote plasma source device 20. This connects the irregular liquid cooling radiator 2133 and the first liquid cooling plate 2131 in series, allowing the first liquid cooling plate 2131 and the irregular liquid cooling radiator 2133 to dissipate heat from the two heat-generating components 201 respectively, achieving an independent design of the heat dissipation unit.

[0039] In this embodiment, the irregularly shaped liquid-cooled radiator 2133 is a labyrinthine water-channel radiator. A labyrinthine water-channel refers to the labyrinthine shape of the liquid cooling channels through which the liquid cooling source flows in the irregularly shaped liquid-cooled radiator 2133. The labyrinthine shape increases the length of the liquid cooling channels per unit area, thereby increasing the contact area between the central receiving cavity 21011 and the liquid cooling channels in the irregularly shaped liquid-cooled radiator 2133, thus improving the heat dissipation efficiency of the irregularly shaped liquid-cooled radiator 2133 on the cavity module. For example, the irregularly shaped liquid-cooled radiator 2133 is annular, surrounding and enclosing the cavity module. The shape of the irregularly shaped liquid-cooled radiator 2133 matches the shape of the cavity module to improve the heat dissipation efficiency of the irregularly shaped liquid-cooled radiator 2133 on the cavity module, while also facilitating a compact internal structure and miniaturization of the device.

[0040] In this embodiment, there is one irregularly shaped liquid-cooled heat sink 2133. In some other embodiments, there may be multiple irregularly shaped liquid-cooled heat sinks 2133. The specific number of irregularly shaped liquid-cooled heat sinks 2133 can be selected according to the heat dissipation requirements and structure of the heat-generating component 201, which allows for flexible layout of the liquid coolers 2130, improves the heat dissipation efficiency of the circulating heat dissipation assembly 210 on the heat-generating component 201, and enhances the reliability and stability of the remote plasma source device 20 during high-power operation.

[0041] The circulating heat dissipation assembly 210 also includes a heat pipe radiator 2160. The heat pipe radiator 2160 is installed within the receiving cavity 21011 and contacts at least one heat-generating component 201, as well as the first liquid cooling plate 2131. In this embodiment, the heat pipe radiator 2160 is installed in the heat dissipation cavity 21013, and is fitted around and surrounding the magnetic core, and fitted onto the irregularly shaped liquid cooling radiator 2133. The heat pipe radiator 2160 is used to dissipate heat from the magnetic core. Specifically, the heat generated by the magnetic core is conducted to the heat pipe radiator 2160, and then, through the contact between the heat pipe radiator 2160 and the first liquid cooling plate 2131, the heat is conducted to the liquid cooling source in the first liquid cooling plate 2131, thereby achieving heat dissipation from the magnetic core. It is important to note that the heat pipe radiator 2160 has a tubular structure, can be bent, and surrounds a heat-generating component 201. The heat pipe radiator 2160 can be used in conjunction with a specially structured heat-generating component 201, which is beneficial for heat dissipation of the specially structured heat-generating component 201, improves the heat dissipation efficiency of the circulating heat dissipation assembly 210, and enhances the reliability and stability of the remote plasma source device 20 during high-power operation. For example, the heat pipe radiator 2160 is fitted around a magnetic core. The magnetic core of the remote plasma source device 20 is located between the irregularly shaped liquid-cooled radiator 2133 and the heat pipe radiator 2160. The structure of the heat pipe radiator 2160 matches the magnetic core and the irregularly shaped liquid-cooled radiator 2133, which helps to make the internal structure of the remote plasma source device 20 compact and highly integrated, forming a miniaturized device.

[0042] Please refer to the following: Figure 7 , Figure 7 yes Figure 6 A schematic diagram of the air-liquid heat exchanger 2140 in the circulating heat dissipation assembly 210 shown.

[0043] A wind-liquid heat exchanger 2140 is installed within the circulating air duct 21012 and is connected to at least one liquid cooler 2130. In this embodiment, the wind-liquid heat exchanger 2140 is connected in series with multiple liquid coolers 2130. For example, the wind-liquid heat exchanger 2140 is connected between two second liquid cooling plates 2132. In this configuration, the liquid cooling source can flow through multiple liquid coolers 2130 and the wind-liquid heat exchanger 2140. Each liquid cooler 2130 can dissipate heat for one heat-generating component 201, achieving independent design of the heat dissipation unit. Simultaneously, the wind-liquid heat exchanger 2140 can exchange the heat of the hot air in the circulating air duct 21012 to the liquid cooling source in the wind-liquid heat exchanger 2140, forming cold air. The cold air then dissipates heat for the second heat-generating component 202, achieving a combination of air cooling and liquid cooling, improving the heat dissipation efficiency of the circulating heat dissipation component 210, thereby improving the reliability and stability of the remote plasma source device 20 under high-power operation.

[0044] Please see Figure 8 and Figure 9 , Figure 8 yes Figure 7The diagram shows the structure of the heat exchange pipe 21401 and the heat dissipation fins 21405 in the air-liquid heat exchanger 2140. Figure 9 yes Figure 8 The diagram shows the structure of the heat exchange pipe 21401 and the heat dissipation fins 21405 from another angle.

[0045] The air-liquid heat exchanger 2140 includes a heat exchange pipe 21401, heat dissipation fins 21405, and a housing 21407. The housing 21407 covers the heat exchange pipe 21401 and the heat dissipation fins 21405. The heat exchange pipe 21401 is connected to at least one liquid cooler 2130, thereby connecting the air-liquid heat exchanger 2140 and the liquid cooler 2130 in series. The air-liquid heat exchanger 2140 can dissipate heat from the hot air in the circulating air duct 21012 independently. Specifically, a liquid cooling source can flow out from a liquid cooler 2130 and into the heat exchange pipe 21401. The hot air in the circulating air duct 21012 conducts heat to the liquid cooling source in the heat exchange pipe 21401, forming cool air and achieving a combination of air cooling and liquid cooling.

[0046] The heat exchange pipe 21401 includes multiple curved sections 21402 and at least one straight section 21403. The multiple curved sections 21402 are connected sequentially. By connecting the multiple curved sections 21402 sequentially, the heat exchange pipe 21401 can be arranged in a tortuous manner. In this embodiment, the heat exchange pipe 21401 is distributed in an S-shape. The arrangement of the curved sections 21402 can increase the length of the heat exchange pipe 21401 per unit area, allowing more liquid cooling source to flow per unit area, improving the heat exchange efficiency between the hot air in the circulating air duct 21012 and the liquid cooling source in the heat exchange pipe 21401, thereby improving the heat dissipation efficiency of the air-liquid heat exchanger 2140 for the hot air. It should be noted that the sequential connection of multiple curved sections 21402 means that the multiple curved sections 21402 are directly connected, or that the multiple curved sections 21402 are indirectly connected through other components such as the straight section 21403 described below. Both methods can make the heat exchange pipe 21401 bend, thereby increasing the length of the heat exchange pipe 21401 per unit area. This application does not limit the specific connection form.

[0047] A straight section 21403 connects the two curved sections 21402. The straight section 21403 reduces flow resistance and energy consumption of the liquid cooling source, allowing it to flow smoothly within the heat exchange pipe 21401. It also acts as a buffer, preventing excessive accumulation of eddies and pressure losses generated by the curved section 21402. Furthermore, the straight section 21403 promotes uniform flow of the liquid cooling source within the heat exchange pipe 21401, facilitating uniform heat exchange and improving the heat exchange efficiency of the air-liquid heat exchanger 2140, thereby increasing the heat dissipation efficiency of the hot air in the circulating air duct 21012. For example, there are four curved sections 21402 and three straight sections 21403. The four curved sections 21402 include two first curved sections and two second curved sections. Two first curved sections are spaced apart along the width direction of the air-liquid heat exchanger 2140, and two second curved sections are spaced apart from the two first curved sections along the height direction of the air-liquid heat exchanger 2140, and are staggered. Each straight section 21403 is connected between one first curved section and one second curved section. Three straight sections 21403 are spaced apart and arranged parallel to each other along the width direction of the air-liquid heat exchanger 2140.

[0048] Heat dissipation fins 21405 are fitted onto heat exchange pipe 21401, and are used to contact the hot air in the circulating air duct 21012. The heat from the hot air in the circulating air duct 21012 can be introduced into the liquid cooling source in the heat exchange pipe 21401 through the heat dissipation fins 21405, thereby reducing the heat in the circulating air duct 21012 and forming cool air. Furthermore, the heat dissipation fins 21405 are arranged opposite to at least one air cooler 2150, which can continuously blow the hot air from the circulating air duct 21012 onto the heat dissipation fins 21405, facilitating continuous contact between the hot air in the circulating air duct 21012 and the heat dissipation fins 21405, thereby accelerating the cooling of the hot air. For example, the heat dissipation fins 21405 are fitted onto multiple straight sections 21403. Each heat dissipation fin 21405 is provided with a through hole 21406. A through-hole 21406 extends through the heat dissipation fin 21405 along its thickness direction to allow the heat exchange pipe 21401 to pass through. Multiple through-holes 21406 are provided, spaced apart along the width direction of the air-liquid heat exchanger 2140. For example, three through-holes 21406 are provided, each allowing a straight section 21403 to pass through.

[0049] The device includes multiple heat dissipation fins 21405, which are spaced apart to densely cover the heat exchange pipe 21401. This increases the contact area between the hot air in the circulating air duct 21012 and the air-liquid heat exchanger 2140, thereby improving heat exchange efficiency. This, in turn, improves the efficiency of heat exchange between the circulating air duct 21012 and the liquid-cooled cold source, thus enhancing the heat dissipation efficiency of the circulating heat dissipation component 210 and improving the reliability and stability of the remote plasma source device 20 during high-power operation. In this embodiment, the multiple heat dissipation fins 21405 are spaced apart along the height direction of the air-liquid heat exchanger 2140, that is, they are spaced apart along the length direction of the straight section 21403.

[0050] In this embodiment, both the heat exchange pipe 21401 and the heat dissipation fins 21405 are made of copper. It should be noted that, due to the excellent thermal conductivity of copper, the use of copper for the heat exchange pipe 21401 and / or the heat dissipation fins 21405 helps to improve the rapid heat transfer of the hot air in the circulating air duct 21012 to the liquid cooling source in the heat exchange pipe 21401, thereby improving the heat dissipation efficiency of the hot air in the circulating air duct 21012.

[0051] The outer casing 21407 is provided with mounting holes 21408. The mounting holes 21408 penetrate the outer casing 21407 along the thickness direction and are used to install the air cooler 2150. There are two mounting holes 21408, which are spaced apart along the height direction of the air-liquid heat exchanger 2140.

[0052] Please continue reading. Figure 6 The air cooler 2150 is located within the circulating air duct 21012. The air cooler 2150 blows air through the circulating air duct 21012, causing airflow and continuously dissipating heat from the heat-generating component 201. In this embodiment, there are at least two air coolers 2150, spaced apart. The arrangement of the two air coolers 2150 creates circulating air within the circulating air duct 21012, accelerating the dissipation of heat from the second heat-generating component 202 and improving heat dissipation efficiency. It should be noted that when the circulating air dissipates heat from the second heat-generating component 202, the heat in the second heat-generating component 202 is released into the circulating air duct 21012, forming hot air. The fact that the airflow from at least two air coolers 2150 is directed in the same direction facilitates the formation of circulating air within the circulating air duct 21012 and also facilitates the exchange of heat within the circulating air duct 21012 with the liquid cooling source via the air-liquid heat exchanger 2140, thereby accelerating the air-cooling efficiency.

[0053] In this embodiment, at least two air coolers 2150 are spaced apart along the circulation duct 21012 and distributed along the diagonal of the circulation duct 21012. This facilitates the formation of circulating air within the circulation duct 21012, thereby facilitating the continuous dissipation of heat from the second heat-generating component 202 by the circulating air. It also facilitates the continuous blowing of hot air towards the air-liquid heat exchanger 2140, exchanging the heat in the hot air with the liquid cooling source in the air-liquid heat exchanger 2140, and forming cold air in the circulation duct 21012. The cold air then continuously circulates to dissipate heat from the second heat-generating component 202.

[0054] In this embodiment, at least two air coolers 2150 include a first air cooler 2151 and a second air cooler 2152. The first air cooler 2151 has a higher power than the second air cooler 2152. The first air cooler 2151 is installed in the air-liquid heat exchanger 2140 and is used to blow hot air into the air-liquid heat exchanger 2140. Using a high-power air cooler 2150 can accelerate the heat transfer of hot air in the air-liquid heat exchanger 2140, which is beneficial to improving the efficiency of heat exchange from the hot air in the circulating air duct 21012 to the liquid-cooled cold source. This, in turn, improves the heat dissipation efficiency of the circulating heat dissipation component 210 and enhances the reliability and stability of the remote plasma source device 20 during high-power operation. The first air cooler 2151 is installed at the mounting hole 21408 of the air-liquid heat exchanger 2140, which facilitates the blowing of hot air from the circulating air duct 21012 into the air-liquid heat exchanger 2140, and then the heat in the circulating air duct 21012 is exchanged to the liquid cooling source in the liquid cooling channel through the air-liquid heat exchanger 2140. Specifically, the first air cooler 2151 is installed on the outer casing 21407. The first air cooler 2151 has two fans. The two fans of the first air cooler 2151 are spaced apart along the height direction of the air-liquid heat exchanger 2140 and are each installed in a mounting hole 21408. The second air cooler 2152 is installed at one end of the second liquid cooling plate 2132 and is distributed diagonally with the first air cooler 2151 along the circulating air duct 21012. For example, both the first air cooler 2151 and the second air cooler 2152 have at least one fan. In some other embodiments, there may be one or more air coolers 2150, and multiple air coolers 2150 are arranged at intervals along the circulating air duct 21012. This application does not limit the number of air coolers 2150.

[0055] Please continue reading. Figure 4The circulating heat dissipation assembly 210 also includes an on-board heat sink 2170. The on-board heat sink 2170 includes a thermal pad, thermal adhesive, or heat sink fins, etc. Specifically, the on-board heat sink can be an aluminum heat sink fin. The on-board heat sink 2170 is located on the side of the first circuit board 203 facing the second liquid cooling plate 2132 and is in contact with the second liquid cooling plate 2132. The arrangement of the on-board heat sink 2170 can improve the heat conduction efficiency of the first circuit board 203 during operation to the second liquid cooling plate 2132, and at the same time, it can make the heat on the first circuit board 203 evenly distributed, reducing local overheating of the first circuit board 203. There are multiple on-board heat sinks 2170, each located between a first circuit board 203 and a second liquid cooling plate 2132. For example, there are two on-board heat sinks 2170.

[0056] Please see Figure 10 , Figure 10 yes Figure 6 The diagram shows the circulation path of the circulating heat dissipation component 210. The hollow arrow in the diagram represents the air cooling circulation, and the thick black solid arrow represents the liquid cooling channel path.

[0057] In this embodiment, the liquid cooling source of the liquid cooling heat dissipation system flows through the following liquid cooling channels in sequence: the liquid cooling source enters a second liquid cooling plate 2132 from the first inlet 21015, flows through the second liquid cooling plate 2132 for one cycle, enters the air-liquid heat exchanger 2140, passes through the heat exchange pipe 21401 and enters another second liquid cooling plate 2132, flows through the second liquid cooling plate 2132 for one cycle and enters the first liquid cooling plate 2131, flows through the first liquid cooling plate 2131 for one cycle, flows from the second liquid cooling plate 2132 into the irregular liquid cooling radiator 2133, flows through the irregular liquid cooling radiator 2133 for one cycle and then flows out to the first outlet 21016 and flows to the outside of the remote plasma source device 20. The air-cooling process is as follows: air is blown through the air cooler 2150 in the circulating air duct 21012. When the air passes through the second heating element 202, it dissipates heat from the second heating element 202. The heat from the second heating element 202 is released into the air to form hot air. The hot air is continuously contacted with the heat dissipation fins 21405 of the air-liquid heat exchanger 2140 under the blowing of the air cooler 2150, and the heat in the hot air is transferred to the liquid cooling source in the heat exchange pipe 21401 to form cold air. The cold air is circulated under the blowing of the air cooler 2150 to dissipate heat from the second heating element 202. In this embodiment, by setting up a liquid-air heat exchanger 2140 in the liquid cooling channel, hot air from the air-cooled cooling system can be continuously transferred to the liquid-cooled cold source to cool the hot air and form cold air, thus combining liquid cooling and air cooling. At the same time, by setting up two air coolers 2150, circulating air is continuously generated to dissipate heat from the second heat-generating component 202, and hot air is continuously blown into the liquid-air heat exchanger 2140, thereby forming a liquid-cooled and air-cooled combined internal circulation heat dissipation component 210, which is beneficial to improving the heat dissipation efficiency of the circulation heat dissipation component 210 and improving the reliability and stability of the remote plasma source device 20 under high power operation.

[0058] The circulating heat dissipation assembly 210 of this application provides liquid cooling and air cooling for at least one heat-generating component 201 by setting at least one liquid cooler 2130 and at least one air cooler 2150. The heat-generating component 201 can dissipate heat to the circulating air duct 21012 to form hot air. The hot air then flows through the air cooler 2150. When the hot air passes through the air-liquid heat exchanger 2140 located in the circulating air duct 21012, the hot air exchanges heat with the liquid cooler 2130 through the air-liquid heat exchanger 2140, thereby achieving heat dissipation within the circulating air duct 21012 and combining liquid cooling and air cooling. This improves the heat dissipation efficiency of the circulating heat dissipation assembly 210 and the reliability and stability of the remote plasma source device 20 during high-power operation, thereby improving the process stability of the semiconductor equipment. The entire circulating heat dissipation assembly 210 can exchange heat with the outside with only a first water inlet 21015 and a first water outlet 21016, which is beneficial to the spatial arrangement of the internal components of the remote plasma source device 20 and can make the internal structure of the remote plasma source device 20 compact, which is conducive to miniaturization.

[0059] The foregoing preferred embodiments have further illustrated the objectives, technical solutions, and advantages of the present invention. It should be understood that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A circulating heat dissipation assembly for use in a device, said device comprising at least one heat-generating component, characterized in that, The cyclic heat dissipation component includes a housing, at least one liquid cooler, a liquid-air heat exchanger, and at least one air cooler. The housing is provided with a receiving cavity, a first water inlet, and a first water outlet. The receiving cavity is located inside the housing. The first water inlet and the first water outlet both penetrate the housing along the wall thickness direction of the housing. The heat generating component is located in the receiving cavity. The receiving cavity includes a circulating air duct. The circulating air duct is formed between at least one of the heat generating components and the housing. The liquid cooler is installed in the receiving cavity and is used to dissipate heat from at least one of the heat generating components. Each liquid cooler has a second water inlet and a second water outlet. The second water inlet is connected to the first water inlet, and the second water outlet is connected to the first water outlet. The liquid-air heat exchanger is installed in the circulating air duct and is connected to at least one of the liquid coolers. The air cooler is located in the circulating air duct.

2. The circulating heat dissipation assembly according to claim 1, characterized in that, There are at least two air coolers. The blowing directions of at least two air coolers are the same, and at least two air coolers are arranged at intervals along the circulating air duct.

3. The circulating heat dissipation assembly according to claim 2, characterized in that, At least two air coolers include a first air cooler and a second air cooler. The power of the first air cooler is greater than that of the second air cooler. The first air cooler is installed on the liquid-air heat exchanger.

4. The circulating heat dissipation assembly according to any one of claims 1 to 3, characterized in that, The circulating air duct is in a "return" shape, an "S" shape, or an "L" shape.

5. The circulating heat dissipation assembly according to any one of claims 1 to 4, characterized in that, The liquid-air heat exchanger includes a heat exchange pipe and heat dissipation fins. The heat exchange pipe is connected to at least one of the liquid coolers. The heat dissipation fins are sleeved on the heat exchange pipe.

6. The circulating heat dissipation assembly according to claim 5, characterized in that, The heat exchange pipe includes a plurality of bending segments and at least one straight segment. The straight segment is connected between two bending segments.

7. The circulating heat dissipation assembly according to any one of claims 1 to 6, characterized in that, The cyclic heat dissipation component further includes a heat pipe radiator. The heat pipe radiator is installed in the receiving cavity and is in contact with at least one of the heat generating components. At least one of the liquid coolers includes a first liquid cooling plate. The first liquid cooling plate is located in the receiving cavity and is in contact with the heat pipe radiator.

8. A remote plasma source device, characterized in that, It includes at least one heat generating component and the cyclic heat dissipation component according to any one of claims 1 to 7. The cyclic heat dissipation component dissipates heat from the heat generating component.

9. The remote plasma source device according to claim 8, characterized in that, There are multiple heat generating components. Two of the multiple heat generating components are respectively a first circuit board and a second circuit board. The circulating air duct is formed between the first circuit board and the second circuit board and the housing. The second circuit board is arranged at an interval from the first circuit board. The second circuit board is arranged at an interval from the liquid cooler. The power of the second circuit board is less than that of the first circuit board. At least one of the liquid coolers includes a second liquid cooling plate. The second liquid cooling plate is installed on one side of the first circuit board.

10. A semiconductor device, characterized in that, It includes a process chamber and the remote plasma source device according to claim 8 or 9. The remote plasma source device is connected to the process chamber.

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