Two-way turbulent heat dissipation structure and power electronic device

Abstract

This application provides a bidirectional turbulent flow heat dissipation structure and a power electronic device, relating to the field of heat dissipation technology. It includes a heat dissipation base plate, within which are formed a flow-diverting channel, a converging channel, and multiple independent and parallel heat exchange channels. One end of each heat exchange channel is connected to the flow-diverting channel, and the other end is connected to the converging channel. The flow-diverting channel introduces cooling fluid and distributes it to each heat exchange channel, while the converging channel collects the cooling fluid flowing out of each heat exchange channel. A turbulence component is provided within each heat exchange channel, which forces the flow direction of the cooling fluid to continuously switch between two directions: parallel to the heat dissipation base plate and perpendicular to the heat dissipation base plate. It is understood that the multiple independent and parallel heat exchange channels ensure temperature uniformity at different locations on the heat dissipation base plate, resulting in better heat dissipation uniformity; while the turbulence component significantly enhances the turbulence effect of the cooling fluid and greatly mitigates the suppression of heat dissipation efficiency by the viscosity effect of the cooling fluid.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a bidirectional turbulent heat dissipation structure and a power electronic device. Background Technology

[0002] Power electronic devices (also known as power semiconductor devices) are mainly used to convert or control electrical energy. During operation, they generate heat, and the efficiency of heat dissipation directly determines their output performance and long-term reliability. Currently, most power electronic devices employ forced convection cooling. However, the viscosity of fluids reduces the efficiency of forced convection cooling. Therefore, turbulent structures need to be designed in forced convection cooling to mitigate the negative impact of fluid viscosity on the cooling process.

[0003] In related technologies, the turbulent structure of forced convection heat dissipation often adopts a needle-fin type, that is, several needle-fin-like structures are arranged alternately on the heat dissipation base plate. When the fluid passes through these needle-fin-like structures, its original direction of movement is changed, thereby suppressing the viscosity effect of the fluid. However, this forced reversal effect of suppressing the viscosity effect of the fluid is limited to a single direction, that is, the fluid flow direction is always perpendicular to the heat dissipation direction, resulting in the lowest flow velocity at the highest temperature point of the heat dissipation base plate, which seriously affects the heat dissipation efficiency. In addition, the flow channels of the needle-fin heat dissipation base plate are mostly in series (the fluid does not split), which makes the heat exchange efficiency at the position near the fluid inlet of the heat dissipation base plate much better than that at the position near the fluid outlet, reducing the heat dissipation uniformity, that is, the temperature difference of power electronic devices at different positions on the heat dissipation base plate is large. Summary of the Invention

[0004] This application provides a bidirectional turbulent heat dissipation structure and a power electronic device, aiming to solve the problem of poor heat dissipation effect of power electronic devices in related technologies and the limitation of fluid viscosity effect.

[0005] To address the aforementioned drawbacks in related technologies, this application provides a bidirectional turbulent flow heat dissipation structure. This structure includes a heat dissipation base plate, within which are formed a flow distribution channel, a flow convergence channel, and multiple heat exchange channels. These heat exchange channels are independent and connected in parallel. One end of each heat exchange channel is connected to the flow distribution channel, and the other end is connected to the flow convergence channel. The flow distribution channel is configured to introduce cooling fluid and distribute it to each heat exchange channel. The flow convergence channel is configured to collect the cooling fluid flowing out of each heat exchange channel and transport it to the outside of the heat dissipation base plate. Each heat exchange channel is equipped with a turbulence component, which is configured to force the flow direction of the cooling fluid to continuously switch between two directions: parallel to the heat dissipation base plate and perpendicular to the heat dissipation base plate.

[0006] In some implementation schemes, the diversion channel and the confluence channel are located on opposite sides of the heat dissipation base plate along the width direction, and both the diversion channel and the confluence channel extend along the length direction of the heat dissipation base plate; multiple heat exchange channels are located between the diversion channel and the confluence channel, and the multiple heat exchange channels are arranged at intervals along the length direction of the heat dissipation base plate, and the multiple heat exchange channels extend along the width direction of the heat dissipation base plate.

[0007] In some implementation schemes, the heat dissipation base plate is provided with a fluid inlet and a fluid outlet; the fluid inlet is connected to the distribution channel and is configured to introduce cooling fluid into the distribution channel; the fluid outlet is connected to the confluence channel and is configured to draw out the cooling fluid in the confluence channel.

[0008] In some implementations, multiple heat exchange chambers are formed within the heat dissipation base plate, and each heat exchange chamber is equipped with a baffle assembly. The baffle assembly is configured to divide the space of the heat exchange chamber to form heat exchange channels. As at least one implementation, each heat exchange channel is a serpentine channel.

[0009] In some implementations, each heat exchange cavity has a branch inlet and a confluence outlet. Specifically, the branch inlet is configured to connect one end of the branch channel and the serpentine flow channel, while the confluence outlet is configured to connect the other end of the confluence channel and the serpentine flow channel.

[0010] In some implementations, the turbulence assembly within the serpentine flow channel includes multiple first turbulence elements and multiple second turbulence elements. Along the extension direction of the serpentine flow channel, the multiple first turbulence elements are alternately arranged on opposite side walls of the serpentine flow channel, and the multiple second turbulence elements are alternately arranged on the bottom and top walls of the serpentine flow channel. Specifically, the multiple first turbulence elements are configured to force the cooling fluid to change direction in a direction parallel to the heat dissipation base plate, while the multiple second turbulence elements are configured to force the cooling fluid to change direction in a direction perpendicular to the heat dissipation base plate.

[0011] In some implementations, the first turbulence element includes a first connecting portion extending from the wall of the serpentine channel in a direction parallel to the heat dissipation base plate into the serpentine channel. A first turbulence portion is formed at the free end of the first connecting portion, and the outer contour dimension of the first turbulence portion is larger than that of the first connecting portion. Similarly, the second turbulence element includes a second connecting portion extending from the wall of the serpentine channel in a direction perpendicular to the heat dissipation base plate into the serpentine channel. A second turbulence portion is formed at the free end of the second connecting portion, and the outer contour dimension of the second turbulence portion is larger than that of the second connecting portion.

[0012] In some implementation schemes, the outer contours of both the first turbulent section and the second turbulent section are elliptical.

[0013] In some implementation schemes, the upper surface of the heat dissipation base plate is provided with a plurality of first mounting areas corresponding one-to-one with a plurality of heat exchange channels, and each first mounting area is configured to mount a first power electronic device; and / or, the lower surface of the heat dissipation base plate is provided with a plurality of second mounting areas corresponding one-to-one with a plurality of heat exchange channels, and each second mounting area is configured to mount a second power electronic device.

[0014] The second aspect of this application provides a power electronic device, which includes a plurality of power electronic devices and the bidirectional turbulent heat dissipation structure provided in the first aspect of this application, wherein the plurality of power electronic devices are arranged on the upper surface and / or lower surface of the heat dissipation base plate in the bidirectional turbulent heat dissipation structure.

[0015] The bidirectional turbulent heat dissipation structure provided in the first aspect of this application has a flow distribution channel, a flow convergence channel and multiple heat exchange channels formed in its heat dissipation base plate. The multiple heat exchange channels are independent of each other and connected in parallel. One end of each of the multiple heat exchange channels is connected to the flow distribution channel, and the other end of each of the multiple heat exchange channels is connected to the flow convergence channel. Each heat exchange channel is provided with a turbulent flow component. In practical applications, cooling fluid is introduced from outside the heat dissipation base plate using a diversion channel. The cooling fluid in the diversion channel flows evenly into multiple independent and parallel heat exchange channels. The cooling fluid flowing out of each heat exchange channel is collected in a confluence channel and transported to the outside of the heat dissipation base plate. When the cooling fluid flows through each heat exchange channel, it exchanges heat with the power electronic devices arranged on the upper and / or lower surfaces of the heat dissipation base plate (i.e., absorbs the heat from the power electronic devices), thereby achieving the purpose of dissipating heat from the power electronic devices. When the cooling fluid flows through each heat exchange channel, the turbulence component in the heat exchange channel forces the flow direction of the cooling fluid to change, causing the flow direction of the cooling fluid to continuously switch between two directions parallel to the heat dissipation base plate and perpendicular to the heat dissipation base plate, thereby enhancing the turbulence effect of the cooling fluid. Understandably, compared to the traditional series flow channels (where the cooling fluid is not split), this application uses multiple independent and parallel heat exchange channels. The cooling fluid is evenly distributed to each heat exchange channel through the distribution channels, which can ensure the consistency of temperature at different locations on the heat dissipation base plate and improve the heat dissipation uniformity. Compared to the traditional solution, which only suppresses the viscosity effect of the cooling fluid in a single direction (i.e., the flow direction of the cooling fluid is always parallel to the heat dissipation base plate), this application, by setting turbulence components in the heat exchange channels, forces the flow direction of the cooling fluid to continuously switch between two directions: parallel to the heat dissipation base plate and perpendicular to the heat dissipation base plate. This can significantly improve the turbulence effect of the cooling fluid and greatly improve the suppression of the heat dissipation efficiency by the viscosity effect of the cooling fluid, ensuring the uniformity of the output performance of power electronic devices and the stability of long-term operation.

[0016] The power electronic device provided in the second aspect of this application includes the bidirectional turbulent heat dissipation structure provided in the first aspect of this application, and therefore possesses all the advantages of that heat dissipation structure. Attached Figure Description

[0017] To more clearly illustrate the related technologies or the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the related technologies or the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application, and not all embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 An isometric view of the bidirectional turbulent heat dissipation structure provided in the embodiments of this application;

[0019] Figure 2 This is a first cross-sectional view of the bidirectional turbulent heat dissipation structure provided in an embodiment of this application;

[0020] Figure 3 A schematic diagram of the heat exchange cavity and its internal serpentine flow channel provided in an embodiment of this application;

[0021] Figure 4 This is a second cross-sectional view of the bidirectional turbulent heat dissipation structure provided in an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the structure of the first turbulence element provided in an embodiment of this application;

[0023] Figure 6 This is a schematic diagram of the structure of the second turbulence element provided in the embodiments of this application;

[0024] Figure 7 This is a schematic diagram illustrating an application scenario of the bidirectional turbulent heat dissipation structure provided in the embodiments of this application;

[0025] Figure 8 This is a schematic diagram of the structure of a power electronic device provided in an embodiment of this application.

[0026] The labels in the above figures represent: 1-heat dissipation base plate, 2-diversion channel, 3-converging channel, 4-heat exchange chamber, 5-partition assembly, 6-heat exchange flow channel, 7-turbulent flow assembly, 8-power electronic device, 11-fluid inlet, 12-fluid outlet, 41-diversion inlet, 42-converging outlet, 51-partition, 71-first turbulent flow component, 72-second turbulent flow component, 711-first connecting part, 712-first turbulent flow part, 721-second connecting part, 722-second turbulent flow part, 81-first power electronic device, 82-second power electronic device. Detailed Implementation

[0027] In related technologies, forced convection cooling turbulent structures often employ a needle-fin type, where several needle-fin-like structures are arranged alternately on a heat sink base. When the fluid passes through these needle-fin-like structures, its original direction of movement changes, thereby suppressing the fluid's viscosity effect. However, this forced reversal's suppression of the fluid viscosity effect is limited to a single direction; that is, the fluid flow direction is always perpendicular to the heat dissipation direction. This results in the highest temperature point on the heat sink base having the lowest flow velocity, severely impacting heat dissipation efficiency. Furthermore, the flow channels of the needle-fin-like heat sink base are often series-connected (no fluid splitting), leading to a significantly higher heat transfer efficiency near the fluid inlet than near the outlet, reducing heat dissipation uniformity. This means that the temperature difference between power electronic devices at different locations on the heat sink base is substantial, affecting overall performance output. In view of this, this application proposes a bidirectional turbulent cooling structure and power electronic device in the embodiments below to address the aforementioned drawbacks of the related technologies.

[0028] To make the objectives, technical solutions, and advantages of this application more apparent and understandable, this application will be clearly and completely described below in conjunction with its embodiments and corresponding drawings. Throughout, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. It should be understood that the embodiments of this application described below are only for explaining this application and are not intended to limit this application. That is, all other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. Furthermore, the technical features involved in the various embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0029] Please see Figure 1 and Figure 2 , Figure 1 This is an isometric drawing of a two-way turbulent cooling structure. Figure 2 This is the first cross-sectional view of the bidirectional turbulent heat dissipation structure. Figure 2 The dashed lines with arrows indicate the flow path of the cooling fluid. This embodiment provides a bidirectional turbulent flow heat dissipation structure, which includes a heat dissipation base plate 1. The heat dissipation base plate 1 has a flow distribution channel 2, a flow convergence channel 3, and multiple heat exchange channels 6 formed therein. The multiple heat exchange channels 6 are independent of each other and connected in parallel. One end of each of the multiple heat exchange channels 6 is connected to the flow distribution channel 2, and the other end of each of the multiple heat exchange channels 6 is connected to the flow convergence channel 3. Each heat exchange channel 6 is provided with a turbulent flow component 7.

[0030] In this embodiment, the diversion channel 2 is configured to introduce cooling fluid and distribute it to each heat exchange channel 6; the confluence channel 3 is configured to collect the cooling fluid flowing out of each heat exchange channel 6 and transport it to the outside of the heat dissipation base plate 1; the turbulence component 7 is configured to force the flow direction of the cooling fluid to continuously switch between two directions: parallel to the heat dissipation base plate 1 and perpendicular to the heat dissipation base plate 1. In other words, in practical applications, cooling fluid is introduced from outside the heat dissipation base plate 1 using the diversion channel 2. The cooling fluid in the diversion channel 2 flows evenly into multiple independent and parallel heat exchange channels 6. The cooling fluid flowing out of each heat exchange channel 6 is collected in the confluence channel 3 and transported to the outside of the heat dissipation base plate 1 by the confluence channel 3. When the cooling fluid flows through each heat exchange channel 6, the cooling fluid in the heat exchange channel 6 exchanges heat with the power electronic devices 8 (e.g., power modules) arranged on the upper and / or lower surfaces of the heat dissipation base plate 1, that is, it absorbs the heat of the power electronic devices 8, thereby achieving the purpose of heat dissipation for the power electronic devices 8. When the cooling fluid flows through each heat exchange channel 6, the turbulence component 7 in the heat exchange channel 6 will forcibly change the flow direction of the cooling fluid, so that the flow direction of the cooling fluid continuously switches between two directions parallel to the heat dissipation base plate 1 and perpendicular to the heat dissipation base plate 1, thereby enhancing the turbulence effect of the cooling fluid in the heat exchange channel 6.

[0031] In this embodiment, the heat dissipation base plate 1 is the core load-bearing component of the entire heat dissipation structure. It not only needs to provide a mounting reference for the power electronic devices 8, but also needs to rapidly transfer the heat generated by the power electronic devices 8 to the cooling fluid, while simultaneously withstanding the pressure of the cooling fluid. Therefore, the material selection for the heat dissipation base plate 1 needs to comprehensively consider many factors such as thermal conductivity, mechanical strength, processing performance, corrosion resistance, and cost. Currently, commonly used materials for the heat dissipation base plate 1 include aluminum alloys, copper alloys, copper-aluminum composite materials, and ceramic materials, which can be selected according to actual needs. This embodiment does not impose a unique limitation on this material.

[0032] Regarding aluminum alloys, their thermal conductivity is approximately 150~230 W / ( Its density is only 2.7 g / cm³. 3It possesses excellent characteristics such as light weight, good machinability, and low cost. Currently, commonly used aluminum alloy grades include 6061, 6063, and 5052. Among them, 6061 aluminum alloy has good comprehensive mechanical properties and can be strengthened through heat treatment, making it suitable for applications requiring high strength. 6063 aluminum alloy has excellent extrusion performance, making it suitable for manufacturing complex cross-sectional flow channel structures. 6061-T6 aluminum alloy is the preferred material in this embodiment. After solution treatment and artificial aging, its tensile strength can reach 310 MPa, its yield strength can reach 276 MPa, and its hardness can reach 95 HB. It can withstand cooling fluid pressures of over 1.6 MPa, fully meeting the requirements of most power electronic devices. In addition, 6061 aluminum alloy has good weldability and can be welded using various processes such as tungsten inert gas welding (TIG), metal inert gas welding (MIG), and vacuum brazing, making it easy to process into structures with complex internal flow channels. Of course, it should be noted that the mechanical properties of aluminum alloys will decrease at high temperatures. When the working temperature exceeds 120℃, its strength will gradually decrease. Therefore, when designing the heat dissipation base plate 1, it is necessary to check the strength according to the actual working temperature.

[0033] Regarding copper alloys, their thermal conductivity is as high as 401 W / ( Copper has about twice the thermal conductivity of aluminum alloys and possesses excellent thermal conductivity, but its density is relatively high (8.9 g / cm³). 3 Copper alloys weigh more than three times that of aluminum alloys, are more expensive, and are more difficult to process. Copper alloys are typically used in applications where heat dissipation is extremely important and weight is not a primary concern, such as high-power laser equipment and high-frequency power supplies. Currently, commonly used copper alloy grades include T2 copper and H62 brass; among them, T2 copper has a purity of over 99.9%, and its thermal conductivity at 20℃ is 401 W / (m²). ), at 100℃, it is 393W / ( Copper exhibits low thermal conductivity with temperature changes, making it ideal for applications requiring high heat flux density. However, its strength is relatively low, with a tensile strength of only around 220 MPa. To improve its strength, cold working can be used, increasing the tensile strength to over 350 MPa, although this reduces its ductility. Brass H62 has higher strength than copper, with a tensile strength reaching 390 MPa, but its thermal conductivity is lower, approximately 116 W / (m²). It is typically used for structural components that require high strength but not high thermal conductivity.

[0034] Copper-aluminum composite materials combine the high thermal conductivity of copper with the lightweight advantages of aluminum. Typically, a thin copper sheet is laminated onto the surface of an aluminum alloy base plate, improving the thermal conductivity of the base plate while controlling the overall weight and cost. The main preparation methods for copper-aluminum composite materials include explosive bonding, rolling bonding, and brazing bonding. Explosive bonding utilizes the impact force generated by an explosive explosion to achieve a metallurgical bond between the copper sheet and the aluminum alloy plate under high-speed collision, achieving a bond strength of over 200 MPa, capable of withstanding significant thermal and mechanical stresses. Rolling bonding involves rolling the copper sheet and aluminum alloy plate together under high temperature and pressure using rolls, resulting in a smooth interface and uniform bond strength, suitable for large-scale production. Brazing bonding involves welding the copper sheet and aluminum alloy plate together with brazing filler metal; this process is simple and low-cost, but the bond strength is lower, typically used in applications where high strength requirements are not critical. In this embodiment, the copper layer thickness of the copper-aluminum composite material is typically 0.5~2 mm, and the aluminum alloy layer thickness is typically 10~20 mm. This ensures good thermal conductivity on the base plate surface while keeping the overall weight within an acceptable range.

[0035] Ceramic materials possess extremely high high-temperature resistance and insulation properties, and also have relatively high thermal conductivity; for example, aluminum nitride ceramics can achieve a thermal conductivity of 200 W / (m²). While ceramic materials are generally brittle, difficult to process, and expensive, they are typically used for heat dissipation in special environments such as aerospace and nuclear industries. Aluminum nitride (AlN) ceramics are currently the most promising ceramic heat dissipation material, with a thermal conductivity as high as 200~320 W / (m²·K). It achieves performance close to that of aluminum alloys, while also possessing excellent insulation properties (breakdown voltage greater than 15kV / mm) and high-temperature resistance (operating temperature up to 1800℃ and above). Furthermore, the coefficient of thermal expansion of aluminum nitride ceramics is very close to that of silicon chips (approximately 4.5×10⁻⁶). -6 Aluminum nitride ceramics (6000-6000℃) can effectively reduce thermal stress and improve device reliability; however, aluminum nitride ceramics are brittle, difficult to process into complex shapes and have high costs, and are currently mainly used as heat dissipation base plates for high-end power semiconductor devices.

[0036] In this embodiment, the processing technology of the heat dissipation base plate 1 mainly depends on the structure and material of the flow channel. For simple straight flow channels, extrusion molding is usually used, where aluminum alloy blanks are extruded into profiles with flow channels through a mold, and then cut, drilled, and surface-treated. For complex serpentine or three-dimensional flow channels, brazing is usually used, where the upper cover plate and lower base plate with flow channel grooves are brazed together to form a closed flow channel structure. In recent years, with the development of additive manufacturing technology (3D printing), it has become possible to directly print heat dissipation base plates 1 with complex internal flow channels using selective laser melting (SLM) technology. This process can realize complex flow channel structures that cannot be manufactured by traditional processing methods, such as conformal flow channels and lattice flow channels, providing greater freedom for the design of heat dissipation structures. However, 3D printing technology still has problems such as high cost, low production efficiency, and large surface roughness, and has not yet achieved large-scale industrial application. Vacuum brazing is the preferred process for processing the heat dissipation base plate 1 in this embodiment. Its advantages are high welding quality, dense weld without pores, ability to withstand high pressure, and no need to add flux during the welding process, thus avoiding flux residue and pollution of the cooling fluid.

[0037] In this embodiment, the selection of the cooling fluid has a crucial impact on the performance of the bidirectional turbulent heat dissipation structure. An ideal cooling fluid should possess the following characteristics: high thermal conductivity, high specific heat capacity, low viscosity, low freezing point, high boiling point, good chemical stability, non-corrosiveness, non-toxicity, and low cost. Currently, commonly used cooling fluids include deionized water, ethylene glycol aqueous solution, transformer oil, and fluorinated liquid, which can be selected according to actual needs. This embodiment does not impose a unique limitation on this.

[0038] Deionized water is the most commonly used cooling fluid, with a thermal conductivity of approximately 0.6 W / (m²). Its specific heat capacity is approximately 4200 J / ( Deionized water possesses extremely high heat exchange capacity and is inexpensive, non-toxic, and harmless. However, water has a freezing point of 0℃ and a boiling point of 100℃, resulting in a narrow operating temperature range. Furthermore, it is prone to scaling and metal corrosion at high temperatures. To prevent corrosion, corrosion inhibitors are typically added to the water. To lower the freezing point, antifreeze agents such as ethylene glycol or propylene glycol are usually added. The resistivity of deionized water should be greater than 1. To prevent electrochemical corrosion, common corrosion inhibitors for aluminum alloy heat sink base plates include sodium silicate, sodium molybdate, and benzotriazole (BTA). Sodium silicate is typically added at a level of 0.1-0.5%, forming a dense oxide film on the aluminum alloy surface to effectively prevent corrosion. It is important to note that excessive amounts of corrosion inhibitor should be avoided, as this can increase the viscosity of the cooling fluid and reduce heat exchange efficiency.

[0039] Ethylene glycol aqueous solution is currently the most widely used antifreeze coolant. Its freezing point can be as low as -50°C and its boiling point can be as high as 120°C or higher, offering a wide operating temperature range and good chemical stability. However, the thermal conductivity and specific heat capacity of ethylene glycol aqueous solution are slightly lower than pure water, and it has a certain degree of toxicity, requiring careful handling. Commonly used ethylene glycol aqueous solution concentrations are 30-50%, which can be adjusted according to the lowest temperature of the operating environment. A 50% (volume fraction) ethylene glycol aqueous solution is the preferred cooling fluid in this embodiment, with a freezing point of -35°C, a boiling point of 107°C, and a thermal conductivity of 0.42 W / (m²·s) at 20°C. ), specific heat capacity is 3300 J / ( ), viscosity is This meets the usage requirements of most regions. Furthermore, ethylene glycol aqueous solutions typically contain additives such as corrosion inhibitors, defoamers, and colorants to improve their performance.

[0040] Transformer oil is a mineral oil with good insulating properties and chemical stability. It has a low freezing point (typically below -40℃) and a high boiling point (typically above 140℃), making it suitable for applications requiring insulation, such as transformers and high-voltage frequency converters. However, the thermal conductivity of transformer oil is approximately 0.12 W / (m²). ), with a specific heat capacity of approximately 2000 J / ( Transformer oil with a lower heat exchange capacity than water is flammable and requires fire prevention measures during use. No. 25 transformer oil is the most commonly used grade of transformer oil, with a freezing point of -25℃, a flash point of 140℃, and a kinematic viscosity of 13~25 mmHg at 20℃. 2 Transformer oil has good insulation properties, with a breakdown voltage greater than 35kV, and can effectively prevent electrical short circuits; however, because transformer oil has relatively poor heat exchange capacity, it is usually used in power electronic devices with low power density.

[0041] Fluorinated fluids are a new type of insulating cooling fluid with excellent insulation properties and chemical stability. They are non-flammable, non-explosive, non-toxic, and harmless, with a wide operating temperature range (-80~200℃). However, fluorinated fluids have low thermal conductivity and specific heat capacity, and are expensive. They are typically used in applications with extremely high safety and reliability requirements, such as data centers and aerospace. 3MNovec7100 is a commonly used fluorinated fluid with a boiling point of 61℃, a freezing point of -125℃, and a thermal conductivity of 0.075 W / (m²) at 25℃. ), specific heat capacity is 1180 J / ( ), viscosity is Fluorinated liquids have excellent insulation properties, a breakdown voltage greater than 40kV, and excellent chemical stability. They do not react with most metals and plastics and have a service life of more than 10 years.

[0042] In this embodiment, the heat transfer from the power electronic device 8 to the cooling fluid is a complex heat transfer process, which mainly includes three stages: First, the heat generated by the chip of the power electronic device 8 is transferred to the bottom of the device's casing (i.e., the heat dissipation surface) through the chip packaging material; Second, the heat at the bottom of the device's casing is transferred to the surface of the heat dissipation base plate 1 through the thermal interface material; Third, the heat on the surface of the heat dissipation base plate 1 is transferred to the cooling fluid in the heat exchange channel 6 through convection heat transfer.

[0043] Regarding the first stage, its thermal resistance mainly includes the internal thermal resistance of the chip, the thermal resistance of the adhesive layer between the chip and the substrate, the thermal resistance of the substrate, and the thermal resistance of the adhesive layer between the substrate and the outer casing. Among these, the internal thermal resistance R_chip refers to the thermal resistance from the chip junction to the chip surface, and is calculated using the formula R_chip = t_chip / ( ), where t_chip is the chip thickness, k_chip is the chip thermal conductivity, and A_chip is the chip area; for silicon chips, k_chip is approximately 150W / ( The thickness is typically 0.2~0.5mm. The thermal resistance of the substrate, R_substrate = t_substrate / ( ), t_substrate is the substrate thickness, k_substrate is the thermal conductivity of the substrate, and A_substrate is the substrate area; commonly used substrate materials include alumina ceramic (k_substrate≈20W / ( ), aluminum nitride ceramics (k_substrate≈200W / ( ()) and copper substrate (k_substrate≈400W / ( The bonding layer between the chip and the substrate often uses solder or conductive adhesive, and its thermal resistance R_adhesive = t_adhesive / ( ), where t_adhesive is the adhesive layer thickness, A_adhesive is the adhesive layer area, and k_adhesive is the thermal conductivity of the adhesive layer; the thermal conductivity of the solder is approximately 50~80 W / ( The thickness is typically 0.05~0.1mm; the thermal conductivity of the conductive adhesive is approximately 1~5W / ( The thickness is usually 0.1~0.2mm.

[0044] Regarding the second stage, its thermal resistance is called contact thermal resistance, and its magnitude mainly depends on the thermal conductivity of the interface material, the contact area, and the contact pressure. Both the device casing and the heat sink 1 have microscopic unevenness on their surfaces. The actual contact area between them is only 1-10% of the nominal contact area, with most of the gap filled by air. Since air has extremely low thermal conductivity, contact thermal resistance accounts for a large proportion of the total thermal resistance of the entire heat dissipation system. To reduce contact thermal resistance, it is usually necessary to fill the space between them with thermal interface materials, such as thermal grease, thermal pads, or solder. The empirical formula for contact thermal resistance R_contact is R_contact = 1 / ( A_contact is the nominal contact area, and h_c is the contact heat transfer coefficient, the magnitude of which is related to the contact pressure, surface roughness, and thermal conductivity of the interface material; when no interface material is filled, h_c is typically 100~500 W / ( After filling with thermal grease, h_c can be increased to 1000~5000W / ( When using solder, h_c can reach up to 10000W / ( )above.

[0045] Regarding the third stage, its thermal resistance is called convective heat transfer resistance, and its magnitude mainly depends on the flow rate of the cooling fluid, the structural form of the heat transfer channel 6, and the physical properties of the cooling fluid. The formula for calculating convective heat transfer resistance is: Here, h is the convective heat transfer coefficient, and A is the heat transfer area. Increasing the convective heat transfer coefficient h and increasing the heat transfer area A are two main ways to reduce convective heat transfer resistance. In this embodiment, the convective heat transfer resistance is mainly reduced by increasing the convective heat transfer coefficient h.

[0046] In forced convection heat transfer, the commonly used calculation formula is the Dittus-Boelter equation: Nu is the Nusselt number, Re is the Reynolds number, Pr is the Prandtl number, and n is the exponent. When the cooling fluid is heated, n = 0.4; when the cooling fluid is cooled, n = 0.3. Convective heat transfer coefficient. Where k is the thermal conductivity of the cooling fluid, and D_h is the hydraulic diameter of the heat exchange channel 6. Reynolds number. ρ is the density of the cooling fluid, v is the average velocity of the cooling fluid, and μ is the dynamic viscosity of the cooling fluid. From the above formulas, it can be seen that the convective heat transfer coefficient h is proportional to the 0.8th power of the cooling fluid velocity. Therefore, increasing the cooling fluid velocity is an effective way to improve heat transfer efficiency, but it will also increase pressure loss. A trade-off needs to be struck between heat transfer efficiency and pressure loss.

[0047] Understandably, the temperature of power electronic devices 8 has a decisive impact on their performance and lifespan. Typically, for every 10°C increase in the junction temperature of a power electronic device 8, its failure rate doubles; therefore, controlling the junction temperature of the power electronic device 8 within the allowable range is crucial to ensuring the reliable operation of the power electronic device. For IGBT modules, the maximum allowable junction temperature is typically 150°C, but to ensure sufficient reliability, the actual operating junction temperature is usually controlled below 125°C. The relationship between the lifespan of the power electronic device 8 and its junction temperature conforms to the Arrhenius equation: L_0 is a constant, L is the device lifetime, E_a is the activation energy (for silicon devices, E_a is approximately 0.7 eV), and k is the Boltzmann constant (8.62 × 10⁻⁶). -5 (eV / K), where T_j is the junction temperature (absolute temperature) of the device; as can be seen from the equation, when the junction temperature increases from 125℃ (398K) to 150℃ (423K), the device lifetime is shortened to about 1 / 5 of the original. Therefore, keeping the junction temperature at a low level is crucial for improving the reliability of the device.

[0048] In traditional series-flow channel cooling structures, the cooling fluid flows sequentially through each heat exchange region. The fluid temperature gradually increases with the flow direction, resulting in a significantly lower heat exchange efficiency in the downstream heat exchange region compared to the upstream region. This leads to substantial temperature differences at different locations on the heat dissipation base plate 1. For example, in a series-flow channel cooling structure, the fluid temperature at the inlet may be 25°C, while the fluid temperature at the outlet could rise to 50°C. This results in the junction temperature of the downstream power electronic device 8 being more than 20°C higher than that of the upstream power electronic device 8. This temperature unevenness not only leads to inconsistent output performance among the various power electronic devices 8 but also accelerates the aging of devices with higher temperatures, reducing the overall lifespan of the device.

[0049] The parallel flow channel structure (i.e., multiple independent and parallel heat exchange channels 6) adopted in this embodiment effectively solves this problem. In the parallel flow channel structure, the cooling fluid flows into each heat exchange channel 6 simultaneously, and the fluid temperature at the inlet of each heat exchange channel 6 is the same. Therefore, the heat exchange conditions of each heat exchange channel 6 are basically the same, thus ensuring the temperature uniformity at different locations on the heat dissipation base plate 1. In addition, the parallel flow channel structure also has a lower pressure loss because the flow distance of the fluid in each heat exchange channel 6 is shorter, and the friction resistance is smaller. Under the same flow rate and total heat exchange area, the pressure loss of the parallel flow channel is only about 1 / 4 of that of the series flow channel. For example, for a flow channel with a total length of 1000 mm, if a series structure is used, the fluid flow distance is 1000 mm; if a parallel structure with 5 flow channels is used, the length of each flow channel is only 200 mm. The friction loss is proportional to the length of the flow channel, so the friction loss of the parallel structure is only 1 / 5 of that of the series structure; plus the difference in local resistance loss, the total pressure loss of the parallel structure is about 1 / 4 of that of the series structure.

[0050] In summary, compared to the traditional series flow channel structure (where the cooling fluid is not split), this embodiment uses multiple independent and parallel heat exchange channels 6 (i.e., a parallel flow channel structure). The cooling fluid is evenly distributed to each heat exchange channel 6 by the distribution channel 2, which can ensure the temperature consistency at different locations on the heat dissipation base plate 1. This improves the temperature unevenness between different locations of the power electronic devices 8 caused by the temperature difference of the cooling fluid, resulting in better heat dissipation uniformity. In contrast, the traditional solution's suppression of the cooling fluid viscosity effect is limited to a single direction (i.e., the flow direction of the cooling fluid is always parallel to the heat dissipation base plate 1). (Direction of the hot plate 1) In this embodiment, by setting a turbulence component 7 in the heat exchange channel 6, the flow direction of the cooling fluid in the heat exchange channel 6 is forced to continuously switch between two directions parallel to the heat dissipation plate 1 and perpendicular to the heat dissipation plate 1. This can significantly improve the turbulence effect of the cooling fluid in the heat exchange channel 6, enhance the flow rate of the cooling liquid at the heat dissipation plate 1 (which is also the highest temperature point of the heat exchange channel 6), avoid the reduction in flow rate caused by the viscosity effect of a single surface, and greatly improve the suppression of heat dissipation efficiency by the viscosity effect of the cooling fluid, ensuring the uniformity of the output performance of the power electronic device 8 and the stability of long-term operation.

[0051] In some embodiments, such as Figure 2As shown, the diversion channel 2 and the confluence channel 3 are located on opposite sides of the heat dissipation base plate 1 along its width direction, and both the diversion channel 2 and the confluence channel 3 extend along the length direction of the heat dissipation base plate 1. Multiple heat exchange channels 6 are located between the diversion channel 2 and the confluence channel 3, and are spaced apart along the length direction of the heat dissipation base plate 1, while also extending along the width direction of the heat dissipation base plate 1. Furthermore, the heat dissipation base plate 1 is provided with a fluid inlet 11 and a fluid outlet 12. The fluid inlet 11 is connected to the diversion channel 2 and is configured to introduce cooling fluid into the diversion channel 2, while the fluid outlet 12 is connected to the confluence channel 3 and is configured to draw out the cooling fluid from the confluence channel 3. In other words, in practical applications, the cooling fluid outside the heat dissipation base plate 1 enters the diversion channel 2 through the fluid inlet 11. The cooling fluid in the diversion channel 2 will flow evenly into multiple independent and parallel heat exchange channels 6. The cooling fluid flowing out from each heat exchange channel 6 will be collected in the converging channel 3 and discharged to the outside of the heat dissipation base plate 1 through the fluid outlet 12 for recycling.

[0052] The design of the diversion channel 2 and the confluence channel 3 is crucial to ensuring uniform flow distribution in each heat exchange channel 6. An improperly designed diversion channel 2 will result in excessive flow in the heat exchange channels 6 near the fluid inlet 11, while the flow in the channels 6 farther from the fluid inlet 11 will be insufficient, leading to uneven heat dissipation. To achieve uniform flow distribution, the design of the diversion channel 2 must adhere to the following four principles.

[0053] The first principle is that the cross-sectional area of ​​the diversion channel 2 should be greater than the sum of the cross-sectional areas of all heat exchange channels 6 to ensure a low flow rate of cooling fluid in the diversion channel 2 and uniform static pressure distribution.

[0054] Generally, the cross-sectional area of ​​the diversion channel 2 should be at least 1.5 times the sum of the cross-sectional areas of all heat exchange channels 6. When the cross-sectional area of ​​the diversion channel 2 is twice the sum of the cross-sectional areas of all heat exchange channels 6, the flow velocity of the cooling fluid in the diversion channel 2 is only half that in the heat exchange channels 6. At this time, the static pressure distribution in the diversion channel 2 is very uniform, and the flow deviation of each heat exchange channel 6 can be controlled within 5%. If the cross-sectional area of ​​the diversion channel 2 is too small, the flow velocity of the cooling fluid in the diversion channel 2 will be too high, resulting in excessive pressure loss along the flow path. The flow rate of the heat exchange channels 6 near the fluid inlet 11 will be significantly greater than that of the heat exchange channels 6 far from the fluid inlet 11, and the flow deviation may exceed 20%.

[0055] The second principle is that the cross-sectional shape of the diversion channel 2 should be circular or trapezoidal as much as possible, and rectangular shapes should be avoided, because eddies are easily generated at the four corners of a rectangular cross-section, which affects the flow distribution.

[0056] Regarding the trapezoidal cross-section of the flow divider channel 2, its width gradually decreases along the flow direction of the cooling fluid, which can better compensate for the pressure loss along the flow path and make the inlet static pressure of each heat exchange channel 6 more uniform. Its contraction angle is typically 5~10°, which ensures that the static pressure within the flow divider channel 2 remains essentially constant along the flow direction, thereby achieving uniform flow distribution in each heat exchange channel 6. Simulation results show that when the flow divider channel 2 uses a trapezoidal cross-section, the flow deviation of each heat exchange channel 6 can be controlled within 3%, while when the flow divider channel 2 uses a rectangular cross-section, the flow deviation of each heat exchange channel 6 is approximately 10%.

[0057] The third principle is that the connection between the heat exchange channel 6 and the diversion channel 2 should be a smooth transition to avoid right angles or sharp corners, so as to reduce local resistance loss.

[0058] For example, a fillet or chamfer can be provided at the inlet of the heat exchange channel 6. The fillet radius is typically 0.2 to 0.5 times the width of the heat exchange channel 6. When the fillet radius at the inlet of the heat exchange channel 6 is 0.3 times the width of the heat exchange channel 6, the local resistance coefficient can be reduced by about 40%, thereby effectively reducing the pressure loss at the inlet of the heat exchange channel 6 and improving the uniformity of flow distribution. If the heat exchange channel 6 and the branch channel 2 are connected at a right angle, strong vortices will be generated at the inlet of the heat exchange channel 6, which will not only increase the pressure loss but also cause uneven velocity distribution of the cooling fluid in the heat exchange channel 6, affecting the heat exchange effect.

[0059] The fourth principle is that for a long diversion channel 2, a guide plate or diversion rib can be installed in the diversion channel 2 to divide the diversion channel 2 into multiple small diversion areas, thereby improving the uniformity of flow distribution.

[0060] The number and location of the guide vanes need to be optimized through fluid dynamics simulation. Porous guide vanes are a commonly used flow homogenization device, typically with an opening ratio of 30-50% and a pore diameter of 2-5 mm. Porous guide vanes can make the velocity distribution of the cooling fluid within the distribution channel 2 more uniform, thereby improving the flow distribution accuracy of each heat exchange channel 6. Simulation results show that after installing porous guide vanes in the distribution channel 2, the flow deviation of each heat exchange channel 6 can be controlled within 2%.

[0061] Of course, the design principles of the manifold channel 3 are similar to those of the branch channel 2. Its cross-sectional area should also be greater than the sum of the cross-sectional areas of all heat exchange channels 6 to ensure a low flow velocity of the cooling fluid and a smaller pressure loss within the manifold channel 3. Furthermore, the outlet of the manifold channel 3 should be located at its end, avoiding its location in the middle to prevent backflow. If the outlet of the manifold channel 3 is located in the middle, the heat exchange channels 6 closer to the outlet will have lower outflow resistance and higher flow rates, while those farther from the outlet will have higher outflow resistance and lower flow rates, resulting in uneven flow distribution. Placing the outlet of the manifold channel 3 at its end ensures that the outflow resistance of the cooling fluid in each heat exchange channel 6 is essentially the same, thus guaranteeing uniform flow distribution.

[0062] In this application, the fluid inlet 11 and fluid outlet 12 are typically circular in shape, which facilitates processing and provides good sealing when connected to external pipes. The diameters of the fluid inlet 11 and fluid outlet 12 should be designed based on the system's flow rate and allowable pressure loss. Generally, the flow velocity of the cooling fluid at the fluid inlet 11 and fluid outlet 12 should be controlled between 1 and 3 m / s. For a heat dissipation system with a flow rate of 10 L / min, the diameters of the fluid inlet 11 and fluid outlet 12 are typically 8 to 10 mm, at which point the flow velocity of the cooling fluid at the fluid inlet 11 and fluid outlet 12 is approximately 2 to 3 m / s, and the local resistance loss is approximately 0.01 to 0.02 MPa. If the diameter of the fluid inlet 11 and fluid outlet 12 is 6 mm, the flow velocity will be as high as 5 to 7 m / s, and the local resistance loss will increase to 0.05 to 0.1 MPa, significantly increasing the energy consumption of the heat dissipation system.

[0063] To further reduce local resistance losses, a diffuser section can be installed inside the fluid inlet 11, allowing the cooling fluid velocity to gradually decrease and the static pressure to gradually increase. The diffusion angle of the diffuser section is typically 5~10°. An excessively large diffusion angle can cause the cooling fluid to separate within the diffuser section, generating eddies and thus increasing resistance losses. The length of the diffuser section is typically 3~5 times the diameter of the fluid inlet 11. This allows the cooling fluid velocity to gradually decrease from 3 m / s at the fluid inlet 11 to approximately 1 m / s within the diversion channel 2, achieving a static pressure recovery coefficient of over 0.8. If the diffuser section is too short, the cooling fluid cannot diffuse sufficiently, generating eddies within the diffuser section, leading to a decrease in the static pressure recovery coefficient and an increase in resistance losses.

[0064] Correspondingly, a contraction section can also be provided inside the fluid outlet 12 to gradually increase the flow rate of the cooling fluid, thereby reducing energy loss at the fluid outlet 12.

[0065] In some embodiments, please combine Figure 3 , Figure 3The diagram shows a heat exchange cavity and its internal serpentine flow channel. Multiple heat exchange cavities 4 are formed inside the heat dissipation base plate 1. Each heat exchange cavity 4 is equipped with a baffle assembly 5, which is configured to divide the space inside the heat exchange cavity 4 to form a serpentine heat exchange flow channel 6. That is, each heat exchange flow channel 6 is a serpentine flow channel. The serpentine flow channel can extend the heat dissipation path and increase the heat dissipation area, thus helping to improve heat dissipation efficiency. The baffle assembly 5 is typically composed of several baffles 51, which are arranged alternately along the width direction of the heat dissipation base plate 1 to form a serpentine flow channel. Furthermore, it should be noted that each heat exchange chamber 4 has a diversion inlet 41 and a confluence outlet 42. The diversion inlet 41 is configured to connect one end of the diversion channel 2 and the serpentine flow channel, while the confluence outlet 42 is configured to connect the other end of the confluence channel 3 and the serpentine flow channel. That is to say, the cooling fluid in the diversion channel 2 enters the serpentine flow channel through the diversion inlet 41, and the cooling fluid in the serpentine flow channel flows out through the confluence outlet 42 and gathers in the confluence channel 3, and is finally discharged from the fluid outlet 12 for recycling.

[0066] The number and size of heat exchange cavities 4 should be designed according to the number and layout of power electronic devices 8. Generally, each power electronic device 8 corresponds to one heat exchange cavity 4, which ensures that each device has an independent heat exchange channel 6 below it, resulting in more uniform heat dissipation. The length and width of the heat exchange cavity 4 should be slightly larger than the size of the power electronic device 8 to ensure that the heat generated by the device can be completely covered by the heat exchange channel 6. The height of the heat exchange cavity 4 (i.e., the height of the heat exchange channel 6) needs to be designed by comprehensively considering heat exchange efficiency and pressure loss: the smaller the height of the heat exchange channel 6, the larger the heat exchange area and the higher the convective heat transfer coefficient, but the greater the pressure loss; the larger the height of the heat exchange channel 6, the smaller the pressure loss, but the lower the heat exchange efficiency. For liquid cooling systems, the height of the heat exchange channel 6 is usually 1~5mm, and the specific value needs to be optimized through fluid dynamics and thermal simulation. For power densities of 20~50W / cm² 2 For power electronic devices, the height of the heat exchange channel 6 is typically 2-3 mm, at which point the balance between heat exchange efficiency and pressure loss is optimal. When the height of the heat exchange channel 6 is reduced from 5 mm to 2 mm, the convective heat transfer coefficient can be increased by about 60%, but the pressure loss will increase by about 3 times. Therefore, the design should take into account the pump power and heat dissipation requirements.

[0067] The baffle assembly 5 is a key component in forming the serpentine flow channel, and its structure and parameters directly affect the flow characteristics and heat transfer performance of the serpentine flow channel. The height of the baffle 51 is usually the same as the height of the heat exchange chamber 4 to ensure the sealing of the serpentine flow channel. The thickness of the baffle 51 is usually 1-3 mm. If it is too thin, the baffle 51 will lack strength and easily deform under the pressure of the cooling fluid; if it is too thick, it will reduce the effective heat transfer area of ​​the serpentine flow channel. The turning distance of the serpentine flow channel is usually 2-5 times the width of the serpentine flow channel. If the distance is too small, the serpentine flow channel will have too many turns, and the cooling fluid will generate strong secondary flows and eddies at the turns, resulting in a sharp increase in pressure loss. If the distance is too large, the advantages of the serpentine flow channel cannot be fully utilized, and the heat dissipation path cannot be effectively extended; the heat transfer efficiency is not much different from that of a straight flow channel. When the turning distance of the serpentine flow channel is 3 times the width of the serpentine flow channel, the heat transfer efficiency of the serpentine flow channel is about 40% higher than that of a straight flow channel, while the pressure loss only increases by about 20%, resulting in the best overall performance.

[0068] The turning radius of a serpentine flow channel is a crucial parameter, significantly impacting the flow resistance and heat transfer performance of the cooling fluid. When the cooling fluid flows through the bend of a serpentine channel, centrifugal force is generated, causing the fluid velocity to increase on the outer side of the bend and decrease on the inner side. Simultaneously, secondary flows and eddies are generated downstream of the bend. A smaller turning radius results in greater centrifugal force, stronger secondary flows and eddies, and better heat transfer, but also greater pressure loss; conversely, a larger turning radius results in less pressure loss but poorer heat transfer. Generally, the turning radius of a serpentine flow channel is 0.5 to 2 times the channel width, with the specific value determined by a trade-off between the system's pressure loss and heat transfer requirements. When the turning radius of the serpentine flow channel is 1 times the width of the flow channel, the intensity of the secondary flow is moderate, the heat transfer efficiency is about 30% higher than that of the straight flow channel, and the pressure loss only increases by about 15%. If the turning radius is 0.5 times the width of the flow channel, the heat transfer efficiency can be increased by about 50%, but the pressure loss will increase by about 50%. If the turning radius is 2 times the width of the flow channel, the heat transfer efficiency will only be increased by about 15%, and the pressure loss will only increase by about 5%.

[0069] Besides the serpentine flow channel, the heat exchange channel 6 can also adopt various other forms, such as straight flow channels, spiral flow channels, corrugated flow channels, and lattice flow channels. Straight flow channels have a simple structure, are easy to manufacture, and have low pressure loss, but have a small heat exchange area and low heat exchange efficiency. Spiral flow channels can induce fluid rotation, enhancing turbulence and resulting in high heat exchange efficiency, but they are difficult to manufacture and have relatively high pressure loss. Corrugated flow channels can cause the fluid to continuously change direction, disrupting the laminar sublayer, resulting in relatively high heat exchange efficiency and moderate pressure loss. Lattice flow channels are a novel flow channel structure, composed of numerous lattice units, possessing a very large heat exchange area and extremely strong turbulence, resulting in extremely high heat exchange efficiency, but they are extremely difficult to manufacture and very costly. This application preferably uses a serpentine flow channel because it achieves a good balance between heat exchange efficiency, pressure loss, and manufacturing difficulty. Experimental verification shows that serpentine and corrugated flow channels have the best overall performance, while lattice flow channels, although having the highest heat transfer coefficient, have excessive pressure loss and the worst overall performance.

[0070] In some embodiments, please combine Figure 4 , Figure 4 The diagram shows a second cross-sectional view of the bidirectional turbulent flow cooling structure. The turbulent flow assembly 7 includes multiple first turbulent flow elements 71 and multiple second turbulent flow elements 72. The multiple first turbulent flow elements 71 are staggered along the extension direction of the serpentine flow channel (i.e., the flow direction of the cooling fluid) on opposite side walls of the serpentine flow channel. The multiple second turbulent flow elements 72 are staggered along the extension direction of the serpentine flow channel on the bottom and top walls of the serpentine flow channel. Specifically, the multiple first turbulent flow elements 71 are configured to force the cooling fluid to change direction in a direction parallel to the heat dissipation base plate 1, while the multiple second turbulent flow elements 72 are configured to force the cooling fluid to change direction in a direction perpendicular to the heat dissipation base plate 1. It is understandable that since the first turbulence element 71 and the second turbulence element 72 are arranged alternately, the "cooling fluid changing direction in the direction parallel to the heat dissipation base plate 1" and the "cooling fluid changing direction in the direction perpendicular to the heat dissipation base plate 1" are carried out alternately, thereby enhancing the turbulence effect of the cooling fluid in the heat exchange channel 6.

[0071] Traditional turbulence structures can only force the cooling fluid to change direction in a single direction parallel to the heat dissipation base plate 1, and can only disrupt the laminar sublayer on the sidewall of the flow channel. The disruption effect on the laminar sublayer on the top and bottom walls of the flow channel is very poor, resulting in the convective heat transfer coefficient at the top and bottom walls of the flow channel being only about 50% of that at the sidewall. However, the turbulence component 7 of this application, by setting a first turbulence element 71 on the sidewall of the flow channel and a second turbulence element 72 on the top and bottom walls of the flow channel, realizes the alternating direction of the cooling fluid in two mutually perpendicular directions. This bidirectional reversal method can simultaneously disrupt the laminar sublayer at the sidewall, top wall and bottom wall of the flow channel, which can significantly improve the convective heat transfer coefficient, with an overall improvement of about 50% or more compared to the traditional solution.

[0072] The distance between the first turbulence element 71 and the second turbulence element 72 is a key parameter affecting the turbulence effect and pressure loss. If the distance is too small, the cooling fluid will be forced to change direction again before it has fully developed, resulting in a sharp increase in pressure loss, while the improvement in heat exchange efficiency is not significant. If the distance is too large, the cooling fluid will re-form a laminar sublayer between the two reversals, and the turbulence effect will be greatly reduced. Generally, the distance between the first turbulence element 71 and the second turbulence element 72 is 2 to 5 times the hydraulic diameter of the flow channel. The hydraulic diameter of the flow channel is D_h = 4A / P, where A is the cross-sectional area of ​​the flow channel and P is the wetted perimeter of the flow channel. For a rectangular cross-section flow channel, the hydraulic diameter D_h = 2ab / (a+b), where a and b are the width and height of the flow channel, respectively. Experiments have shown that when the distance between the first turbulent flow element 71 and the second turbulent flow element 72 is three times the hydraulic diameter of the flow channel, the balance between heat transfer efficiency and pressure loss is optimal. Under this condition, the cooling fluid develops fully between the two reversals, and the thickness of the laminar sublayer reaches its maximum value. Reversing the flow at this time can maximize the disruption of the laminar sublayer and improve heat transfer efficiency.

[0073] The heights of the first turbulence element 71 and the second turbulence element 72 also need to be designed appropriately. The height of the first turbulence element 71 is typically 0.3 to 0.7 times the channel width. If the height is too low, it cannot effectively force the cooling fluid to change direction; if the height is too high, the effective flow area of ​​the channel will decrease, increasing pressure loss. When the height of the first turbulence element 71 is 0.5 times the channel width, the cooling fluid reversal effect is optimal. At this point, approximately 50% of the cooling fluid is forcibly reversed, effectively disrupting the laminar sublayer at the channel sidewalls. Simultaneously, the effective flow area of ​​the channel does not decrease significantly, and the pressure loss does not increase substantially. If the height of the first turbulence element 71 is less than 0.3 times the channel width, only a small amount of cooling fluid is forcibly reversed, failing to effectively disrupt the laminar sublayer. If the height of the first turbulence element 71 is greater than 0.7 times the channel width, the effective flow area of ​​the channel will decrease significantly, and the pressure loss will increase sharply. The height of the second turbulence element 72 is also 0.3 to 0.7 times the channel height, and its design principle is the same as that of the first turbulence element 71.

[0074] To further improve the turbulence effect, the first turbulence element 71 and the second turbulence element 72 can be arranged in a non-uniform manner. Specifically, in areas with high heat load (such as directly below the power electronic device 8), the distance between the first turbulence element 71 and the second turbulence element 72 is reduced, resulting in a denser arrangement; in areas with low heat load, the distance between the first turbulence element 71 and the second turbulence element 72 is increased, resulting in a sparser arrangement. This non-uniform arrangement can improve the heat exchange efficiency in high heat load areas and further improve heat dissipation uniformity without significantly increasing the overall pressure loss. For example, for the area directly below the power electronic device 8, the distance between the first turbulence element 71 and the second turbulence element 72 can be twice the hydraulic diameter of the flow channel, while for the area between two adjacent power electronic devices 8, the distance can be four times the hydraulic diameter of the flow channel. Simulation results show that after adopting this non-uniform arrangement, the maximum junction temperature of the power electronic device 8 can be reduced by about 5°C, while the overall pressure loss only increases by about 10%.

[0075] As at least one embodiment, please refer to Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of the first turbulence-generating component. Figure 6 This is a schematic diagram of the second turbulence element. The first turbulence element 71 includes a first connecting portion 711 extending from the wall (side wall) of the serpentine channel in a direction parallel to the heat dissipation base plate 1 toward the interior of the serpentine channel. A first turbulence portion 712 is formed at the free end of the first connecting portion 711. The outer contour dimension of the first turbulence portion 712 is larger than the outer contour dimension of the first connecting portion 711. Similar to the first turbulence element 71, the second turbulence element 72 includes a second connecting portion 721 extending from the wall (bottom wall / top wall) of the serpentine channel in a direction perpendicular to the heat dissipation base plate 1 toward the interior of the serpentine channel. A second turbulence portion 722 is formed at the free end of the second connecting portion 721. The outer contour dimension of the second turbulence portion 722 is larger than the outer contour dimension of the second connecting portion 721.

[0076] Understandably, the first turbulence element 71 essentially functions as a guide. When the cooling fluid impacts the first turbulence element 71 along the extension direction of the serpentine channel, the cooling fluid will be redirected in the direction parallel to the heat dissipation base plate 1 under the guidance of the first turbulence element 71. Similarly, when the cooling fluid impacts the second turbulence element 72 along the extension direction of the serpentine channel, the cooling fluid will be redirected in the direction perpendicular to the heat dissipation base plate 1 under the guidance of the second turbulence element 72. Furthermore, taking the first turbulence element 71 as an example, the outer contour dimension of its first turbulence portion 712 is larger than the outer contour dimension of the first connecting portion 711. This not only enhances the turbulence effect of the cooling fluid but also improves the deformation problem of the first turbulence element 71 under long-term, high-speed scouring by the cooling fluid; the same applies to the second turbulence element 72. For example, the outer contours of the first turbulent section 712 and the second turbulent section 722 are both elliptical. Of course, in addition to elliptical, various shapes such as circular, spherical, rhomboid, polygonal, and streamlined can also be used. Turbulent sections of different shapes have different flow characteristics and heat transfer performance. The specific design can be made according to actual needs. This application does not limit it to a single shape.

[0077] The cross-sectional shapes of the first connecting part 711 and the second connecting part 721 can be various shapes such as circular, rectangular, elliptical, and polygonal. Among them, circular cross-sections are easy to process, have uniform stress distribution, and good fatigue resistance; rectangular cross-sections have a large contact area with the flow channel wall and high connection strength; elliptical cross-sections have good streamline shape and low cooling fluid resistance. This application does not impose specific limitations on the cross-sectional shape of the connecting parts, as long as they can serve to connect and support the turbulent flow section.

[0078] The transition between the first turbulent section 712 and the first connecting section 711, and between the second turbulent section 722 and the second connecting section 721, is also crucial. A right-angle transition would result in severe stress concentration at the transition point, which, under long-term, high-speed scouring by the cooling fluid, could easily lead to fatigue cracks and breakage of the turbulent component. Therefore, a rounded corner transition is necessary, with the radius typically 0.2 to 0.5 times the diameter or width of the connecting section. A rounded corner transition not only reduces stress concentration and improves the fatigue resistance of the turbulent component, but also allows the cooling fluid to flow more smoothly through the transition point, reducing local resistance loss. When the rounded corner radius is 0.3 times the diameter of the connecting section, the maximum stress at the transition point can be reduced by approximately 50%, while local resistance loss can be reduced by approximately 20%. If the rounded corner radius is too small, the improvement in stress concentration is not significant; if the rounded corner radius is too large, it will reduce the effective flow-facing area of ​​the turbulent section, decreasing the turbulence effect.

[0079] Of course, to further improve the erosion resistance and service life of turbulent flow components, surface strengthening treatments can be applied, such as surface hardening, carburizing, nitriding, and spraying wear-resistant coatings. These surface treatment methods can significantly improve the surface hardness and wear resistance of turbulent flow components, extending their service life. Furthermore, for highly corrosive cooling fluids, anti-corrosion treatments can be applied to the surface of turbulent flow components, such as nickel plating, chromium plating, and spraying anti-corrosion coatings. Nitriding is a commonly used surface strengthening process that can form a nitrided layer with a thickness of 0.05~0.2mm on the aluminum alloy surface, achieving a hardness of HV1000 or higher and improving wear resistance by approximately 5 times. The nitriding temperature is relatively low (approximately 500℃), preventing deformation of the heat sink base plate, making it ideal for surface strengthening of aluminum alloy turbulent flow components.

[0080] In some embodiments, please combine Figure 7 , Figure 7 This is a schematic diagram illustrating the application scenario of the bidirectional turbulent flow heat dissipation structure. The bidirectional turbulent flow heat dissipation structure of this application has two heat dissipation forms: single-sided heat dissipation and double-sided heat dissipation. In the single-sided heat dissipation form, the upper surface of the heat dissipation base plate 1 is provided with multiple first mounting areas corresponding to multiple heat exchange channels 6. Each first mounting area is configured to mount a first power electronic device 81. When the cooling fluid flows through the heat exchange channel 6, the cooling fluid can exchange heat with the first power electronic device 81 mounted on the corresponding first mounting area. Alternatively, the lower surface of the heat dissipation base plate 1 is provided with multiple second mounting areas corresponding to multiple heat exchange channels 6. Each second mounting area is configured to mount a second power electronic device 82. When the cooling fluid flows through the heat exchange channel 6, the cooling fluid can exchange heat with the second power electronic device 82 mounted on the corresponding second mounting area.

[0081] Based on this, when the bidirectional turbulent heat dissipation structure is a double-sided heat dissipation form, multiple first power electronic devices 81 and multiple second power electronic devices 82 are respectively installed on the upper and lower surfaces of the heat dissipation base plate 1. It can be understood that the double-sided heat dissipation form, by simultaneously installing power electronic devices 8 on the upper and lower surfaces of the heat dissipation base plate 1, makes full use of both surfaces of the heat dissipation base plate 1 for heat dissipation, which can significantly improve the power density of the heat dissipation system. Compared with the single-sided heat dissipation form, its heat dissipation capacity can be increased by 50% to 100%.

[0082] The design of the mounting area is crucial to ensuring good thermal contact between the power electronic device 8 and the heat sink 1. Its surface should have high flatness and low surface roughness to reduce contact thermal resistance. Generally, the flatness of the mounting area should be controlled within 0.05 mm / m, and the surface roughness should be controlled below 1.6 μm. To improve the flatness and surface quality of the mounting area, finishing processes such as milling, grinding, and polishing are usually required. Surface roughness has a significant impact on contact thermal resistance; when the surface roughness is reduced from 3.2 μm to 1.6 μm, the contact thermal resistance can be reduced by approximately 30%; when the surface roughness is reduced to 0.8 μm, the contact thermal resistance can be reduced by approximately 50%. Therefore, for power electronic devices 8 with high heat flux density, the surface roughness of the mounting area should be controlled below 0.8 μm.

[0083] To facilitate the positioning and installation of the power electronic device 8, positioning structures such as positioning bosses, positioning grooves, and positioning pin holes can be provided in the installation area. Specifically, the positioning bosses mate with the grooves on the bottom of the power electronic device 8; the positioning grooves mate with the protruding ridges on the bottom of the power electronic device 8; and the positioning pin holes mate with the positioning pins on the bottom of the power electronic device 8. These positioning structures ensure the positional accuracy of the power electronic device 8 during installation and prevent poor contact caused by installation deviations.

[0084] Of course, mounting screw holes can also be provided in the mounting area for fixing the power electronic device 8 to the heat sink base plate 1 with screws. The preload of the screws also has a great influence on the contact thermal resistance. The greater the preload, the greater the contact pressure and the smaller the contact thermal resistance; however, excessive preload may damage the power electronic device 8 or deform the heat sink base plate 1. The specific value of the preload should be determined according to the device's datasheet.

[0085] Please see Figure 8 , Figure 8 This is a schematic diagram of the structure of a power electronic device. This embodiment provides a power electronic device, which includes the bidirectional turbulent heat dissipation structure described above and multiple power electronic devices 8. The multiple power electronic devices 8 are arranged on the upper and / or lower surfaces of the heat dissipation base plate 1 in the bidirectional turbulent heat dissipation structure. Furthermore, it should be noted that the power electronic devices 8 can be mounted on the upper and / or lower surfaces of the heat dissipation base plate 1 by welding or pressing with thermal interface materials; wherein, thermal interface materials include thermally conductive silicone grease, thermally conductive pads, thermally conductive adhesives, etc. This application does not impose a unique limitation on the mounting method of the power electronic devices 8; the specific design can be based on actual needs. It should also be noted that the power electronic devices 8 include diodes, thyristors, power transistors (GTRs), power modules, power MOSFETs, insulated-gate bipolar transistors (IGBTs), etc.

[0086] It is understood that, based on the foregoing description of the bidirectional turbulent heat dissipation structure, the power electronic device in this embodiment has a single-sided heat dissipation form and a double-sided heat dissipation form. In the single-sided heat dissipation form, the multiple power electronic devices 8 include multiple first power electronic devices 81, which are mounted on the upper surface of the heat dissipation base plate 1 and correspond one-to-one with multiple heat exchange channels 6. When the cooling fluid flows through the heat exchange channel 6, the cooling fluid can exchange heat with the corresponding first power electronic device 81. Alternatively, the multiple power electronic devices 8 include multiple second power electronic devices 82, which are mounted on the lower surface of the heat dissipation base plate 1 and correspond one-to-one with multiple heat exchange channels 6. When the cooling fluid flows through the heat exchange channel 6, the cooling fluid can exchange heat with the corresponding second power electronic device 82. Based on this, regarding the double-sided heat dissipation form, the multiple power electronic devices 8 include multiple first power electronic devices 81 and multiple second power electronic devices 82. The multiple first power electronic devices 81 are installed on the upper surface of the heat dissipation base plate 1 and correspond one-to-one with the multiple heat exchange channels 6 respectively. The multiple second power electronic devices 82 are installed on the lower surface of the heat dissipation base plate 1 and correspond one-to-one with the multiple heat exchange channels 6 respectively.

[0087] To verify the heat dissipation effect of the bidirectional turbulent heat dissipation structure of this application, CFD (Computational Fluid Dynamics) software was used for simulation analysis, and the results were compared with those of a traditional pin-fin heat dissipation structure. The simulation conditions were as follows: the dimensions of the heat dissipation base plate 1 were 200mm × 150mm × 20mm, and the material was 6061 aluminum alloy; the cooling fluid was deionized water, the temperature of the fluid inlet 11 was 25℃, and the flow rate was 10L / min; the power electronic devices 8 were IGBT modules, each 50mm × 50mm in size, with a quantity of 6, evenly distributed on the upper surface of the heat dissipation base plate 1, each IGBT module having a power consumption of 200W, and a total power consumption of 1200W.

[0088] The simulation was conducted using ANSYS Fluent software. The RNGk-ε model was selected as the turbulence model, which can effectively simulate rotating and separated flows. A structured mesh was used, with a finer boundary layer mesh near the wall. The first boundary layer mesh was 0.01 mm thick, and the total number of meshes was approximately 5 million. The boundary conditions were set as follows: fluid inlet 11 was a velocity inlet with a velocity of 2.12 m / s; fluid outlet 12 was a pressure outlet with a pressure of 0 Pa; the outer surface of the heat dissipation base plate 1 was set as an adiabatic boundary condition; and the bottom of the IGBT module was set as a heat flux density boundary condition with a heat flux density of 8 W / cm².

[0089] Simulation results show that, under the same flow rate and power consumption conditions, the highest junction temperature of the proposed bidirectional turbulent heat dissipation structure is 85℃, with a temperature uniformity of ±3℃, while the highest junction temperature of the traditional needle-fin heat dissipation structure is 102℃, with a temperature uniformity of ±8℃. The pressure loss of the proposed bidirectional turbulent heat dissipation structure is 0.12MPa, while the pressure loss of the traditional needle-fin heat dissipation structure is 0.15MPa. Therefore, the highest junction temperature of the proposed bidirectional turbulent heat dissipation structure is 17℃ lower than that of the traditional needle-fin heat dissipation structure, the temperature uniformity is improved by 62.5%, and the pressure loss is reduced by 20%. These results fully demonstrate that the proposed bidirectional turbulent heat dissipation structure possesses excellent heat dissipation performance and low pressure loss.

[0090] The above embodiments are merely preferred implementations of this application and are not the only limitations on the bidirectional turbulent heat dissipation structure and power electronic device. Those skilled in the art can flexibly design based on these embodiments according to actual application scenarios. It is understood that through the implementation of the above embodiments of this application, a diversion channel 2, a confluence channel 3, and multiple heat exchange channels 6 are formed inside the heat dissipation base plate 1. These multiple heat exchange channels 6 are independent and connected in parallel. One end of each heat exchange channel 6 is connected to the diversion channel 2, and the other end of each heat exchange channel 6 is connected to the confluence channel 3. Each heat exchange channel 6 is equipped with a turbulent flow component 7. In practical applications, cooling fluid is introduced from outside the heat dissipation base plate 1 through the diversion channel 2. The cooling fluid in the diversion channel 2 flows evenly into multiple independent and parallel heat exchange channels 6. The cooling fluid flowing out of each heat exchange channel 6 is collected in the confluence channel 3 and transported to the outside of the heat dissipation base plate 1 by the confluence channel 3. When the cooling fluid flows through each heat exchange channel 6, the cooling fluid in the heat exchange channel 6 exchanges heat with the power electronic devices 8 arranged on the upper and / or lower surfaces of the heat dissipation base plate 1 (i.e., absorbs the heat of the power electronic devices 8), thereby achieving the purpose of dissipating heat for the power electronic devices 8. When the cooling fluid flows through each heat exchange channel 6, the turbulence component 7 in the heat exchange channel 6 will forcibly change the flow direction of the cooling fluid, so that the flow direction of the cooling fluid continuously switches between two directions parallel to the heat dissipation base plate 1 and perpendicular to the heat dissipation base plate 1, thereby enhancing the turbulence effect of the cooling fluid. Therefore, compared to the traditional series flow channel (where the cooling fluid is not split), this application uses multiple independent and parallel heat exchange channels 6. The cooling fluid is evenly distributed to each heat exchange channel 6 by the split channel 2, which can ensure the consistency of temperature at different locations on the heat dissipation base plate 1 and improve the heat dissipation uniformity. Compared to the traditional solution, which only suppresses the viscosity effect of the cooling fluid in one direction (i.e., the flow direction of the cooling fluid is always parallel to the heat dissipation base plate 1), this application, by setting turbulence components 7 in the heat exchange channels 6, forces the flow direction of the cooling fluid to continuously switch between two directions: parallel to the heat dissipation base plate 1 and perpendicular to the heat dissipation base plate 1. This can significantly improve the turbulence effect of the cooling fluid and greatly improve the suppression of the heat dissipation efficiency by the viscosity effect of the cooling fluid, ensuring the uniformity of the output performance of the power electronic device 8 and the stability of its long-term operation, and has a very broad application prospect.

[0091] It should be noted that the several embodiments shown above in this application are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. It should also be noted that in the textual description of this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply such an actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements may include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus; and, without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0092] Furthermore, those skilled in the art can implement or use this application by practicing the several embodiments shown above. Various modifications to the embodiments shown above will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments not shown without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the several embodiments shown above, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bidirectional turbulent heat dissipation structure, characterized in that, The device includes a heat dissipation base plate, within which a flow distribution channel, a flow convergence channel, and multiple heat exchange channels are formed. The multiple heat exchange channels are independent of each other and connected in parallel. One end of each of the multiple heat exchange channels is connected to the flow distribution channel, and the other end of each of the multiple heat exchange channels is connected to the flow convergence channel. The flow distribution channel is configured to introduce cooling fluid and distribute it to each of the heat exchange channels. The flow convergence channel is configured to collect the cooling fluid flowing out of each of the heat exchange channels and transport it to the outside of the heat dissipation base plate. Each of the heat exchange channels is provided with a turbulence component, which is configured to force the flow direction of the cooling fluid to continuously switch between two directions: parallel to the heat dissipation base plate and perpendicular to the heat dissipation base plate.

2. The bidirectional turbulent heat dissipation structure according to claim 1, characterized in that, The diversion channel and the confluence channel are located on opposite sides of the heat dissipation base plate along the width direction, and both extend along the length direction of the heat dissipation base plate; the plurality of heat exchange channels are located between the diversion channel and the confluence channel, the plurality of heat exchange channels are arranged at intervals along the length direction of the heat dissipation base plate, and the plurality of heat exchange channels extend along the width direction of the heat dissipation base plate.

3. The bidirectional turbulent heat dissipation structure according to claim 1, characterized in that, The heat dissipation base plate has a fluid inlet and a fluid outlet; the fluid inlet is connected to the distribution channel and is configured to introduce the cooling fluid into the distribution channel; the fluid outlet is connected to the confluence channel and is configured to draw out the cooling fluid in the confluence channel.

4. The bidirectional turbulent heat dissipation structure according to claim 1, characterized in that, The heat dissipation base plate has multiple heat exchange chambers, and each heat exchange chamber is provided with a baffle assembly. The baffle assembly is configured to divide the space of the heat exchange chamber to form the heat exchange channel. All heat exchange channels are serpentine channels.

5. The bidirectional turbulent heat dissipation structure according to claim 4, characterized in that, Each of the heat exchange chambers has a branch inlet and a confluence outlet; The diversion inlet is configured to connect the diversion channel and one end of the serpentine flow channel; The confluence outlet is configured to connect the confluence channel to the other end of the serpentine channel.

6. The bidirectional turbulent heat dissipation structure according to claim 4, characterized in that, The turbulence assembly includes a plurality of first turbulence elements and a plurality of second turbulence elements; along the extension direction of the serpentine flow channel, the plurality of first turbulence elements are alternately disposed on opposite side walls of the serpentine flow channel, and the plurality of second turbulence elements are alternately disposed on the bottom and top walls of the serpentine flow channel, with the plurality of first turbulence elements and the plurality of second turbulence elements arranged alternately; the plurality of first turbulence elements are configured to force the cooling fluid to change direction in a direction parallel to the heat dissipation base plate; the plurality of second turbulence elements are configured to force the cooling fluid to change direction in a direction perpendicular to the heat dissipation base plate.

7. The bidirectional turbulent heat dissipation structure according to claim 6, characterized in that, The first turbulence component includes a first connecting portion extending from the wall of the serpentine channel in a direction parallel to the heat dissipation base plate into the serpentine channel. The free end of the first connecting portion forms a first turbulence portion, and the outer contour dimension of the first turbulence portion is larger than the outer contour dimension of the first connecting portion. The second turbulence component includes a second connecting portion extending from the wall of the serpentine channel in a direction perpendicular to the heat dissipation base plate into the serpentine channel. The free end of the second connecting portion forms a second turbulence portion, and the outer contour dimension of the second turbulence portion is larger than the outer contour dimension of the second connecting portion.

8. The bidirectional turbulent heat dissipation structure according to claim 7, characterized in that, The outer contours of both the first turbulent section and the second turbulent section are elliptical.

9. The bidirectional turbulent heat dissipation structure according to claim 1, characterized in that, The upper surface of the heat dissipation base plate is provided with a plurality of first mounting areas corresponding to the plurality of heat exchange channels, and each of the first mounting areas is configured to mount a first power electronic device; and / or, The lower surface of the heat dissipation base plate is provided with a plurality of second mounting areas corresponding to the plurality of heat exchange channels, and each of the second mounting areas is configured to mount a second power electronic device.

10. A power electronic device, characterized in that, It includes multiple power electronic devices and a bidirectional turbulent heat dissipation structure as described in any one of claims 1 to 9, wherein the multiple power electronic devices are arranged on the upper surface and / or lower surface of the heat dissipation base plate in the bidirectional turbulent heat dissipation structure.

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