Cold plate and its power supply module and server

Abstract

An integrated power supply and heat dissipation cold plate, its power supply module, and a server are provided. The cold plate includes a cold plate body, a power supply layer, liquid cooling channels, and an insulating layer. The power supply layer has power supply terminals exposed above the cold plate body, configured to be electrically connected to heat-generating components to supply power to them via the power supply layer. The liquid cooling channels are configured to allow cooling liquid to circulate and dissipate heat from the heat-generating components. The insulating layer is located between the power supply layer and the liquid cooling channels. By integrating power supply and liquid cooling into the same cold plate body, the power supply structure and heat dissipation structure do not need to occupy separate spaces, which helps to reduce the overall height dimension and simplify the layout.

Description

Technical Field

[0001] The described examples generally relate to the fields of heat dissipation and power supply technology for electronic devices, and particularly to an integrated power supply and heat dissipation cold plate, its power supply module, and a server. Background Technology

[0002] With the increasing integration of electronic devices, the industry has placed higher demands on the heat dissipation efficiency of heat-generating components and the space utilization of power supply structures. Summary of the Invention

[0003] In one embodiment, a cold plate is provided, comprising a cold plate body, the cold plate body including: a power supply layer having power supply terminals exposed above the cold plate body, the power supply terminals being configured to be electrically connected to a heat-generating component to supply power to the heat-generating component via the power supply layer; a liquid cooling channel configured to allow cooling liquid to flow through to dissipate heat from the heat-generating component; and an insulating layer located between the power supply layer and the liquid cooling channel.

[0004] In another scenario, a power supply module is provided, including a cold plate as described above and a power conversion circuit. The power conversion circuit is disposed on the cold plate body of the cold plate and electrically connected to a power supply terminal to obtain electrical energy via a power supply layer. The liquid cooling channels of the cold plate are configured to dissipate heat from the power conversion circuit, and the power conversion circuit has an output terminal configured to be electrically connected to a chip to output electrical energy to the chip.

[0005] In another scenario, a server is provided, comprising a motherboard, a chip, and a power supply module as described above, wherein the chip is disposed on a first side of the motherboard, the power supply module is disposed on a second side of the motherboard opposite to the first side, and the output terminals of the power supply module are electrically connected to the chip via the motherboard.

[0006] By integrating power supply and liquid cooling into the same cold plate body, the power supply structure and heat dissipation structure do not need to occupy separate spaces. This allows for the simultaneous supply of power to the heat-generating components and the dissipation of heat-generating components, which helps to reduce the overall size in the height direction and simplifies the arrangement of cooling liquid pipelines and power supply.

[0007] It should be understood that the content described in this section is not intended to limit the key or important features of the examples, nor is it intended to restrict the scope. Other features will become readily apparent from the following description. Attached Figure Description

[0008] The above and other features, advantages, and aspects of the various examples will become more apparent when taken in conjunction with the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein: Figure 1 This is a schematic diagram of a basic implementation scenario for a server. Figure 2 A cross-sectional schematic diagram of a layered structure of a cold-rolled steel plate; Figure 3 This is a cross-sectional schematic diagram of another layered structure of a cold-rolled steel plate; Figure 4 A cross-sectional schematic diagram of an assembly structure for a power supply module and a server. Detailed Implementation

[0009] The examples will now be described in more detail with reference to the accompanying drawings. While some examples are shown in the drawings, it should be understood that various forms can be employed, and these examples should not be construed as limiting the scope to those set forth herein. Rather, they are provided for a more thorough and complete understanding. It should be understood that the drawings and examples are for illustrative purposes only and are not intended to limit the scope of protection.

[0010] It should be noted that the headings of any section / subsection provided herein are not restrictive. Various examples are described throughout, and examples of any type may be included under any section / subsection. Furthermore, examples described in any section / subsection may be combined in any way with any other examples described in the same section / subsection and / or different sections / subsections.

[0011] In the description of examples herein, the term "including" and similar terms should be understood as open inclusion, i.e., "including but not limited to". The term "based on" should be understood as "at least partially based on". The terms "one example" or "the example" should be understood as "at least one example". The term "some examples" should be understood as "at least some examples". The terms "first", "second", etc., may refer to different or the same objects. Other explicit and implicit definitions may also be included below.

[0012] In related technologies, high-power heat-generating components typically require a power supply structure to provide them with electrical energy and a heat dissipation structure to dissipate their heat. In one related technology, the power supply to the heat-generating component is achieved by a separate power supply circuit board, and the heat dissipation is achieved by a separate heat dissipation plate; the power supply circuit board and the heat dissipation plate are set separately from each other. Furthermore, to dissipate heat from the power conversion circuit located near the heat-generating component, a separate heat dissipation structure is often stacked outside the circuit board containing the power conversion circuit. In yet another related technology, the power conversion circuit supplies power to the heat-generating component in a horizontal direction, and the power supply path extends along the plane of the circuit board.

[0013] In the aforementioned related technologies, the power supply circuit board and the heat dissipation plate are separate and stacked in the height direction, resulting in a large overall size in the height direction, which is not conducive to thin-film and high-density layout within a limited height space. The power supply structure and the heat dissipation structure are independent, requiring separate arrangement of cooling liquid pipes and power supply lines, making assembly more complex. Furthermore, the heat of the power conversion circuit located near the heat-generating components is concentrated and the temperature is high, requiring further improvement in its heat dissipation, which to some extent affects the overall achievable power. Based on this, the following example, described with reference to the accompanying drawings, provides a solution that integrates power supply and heat dissipation onto the same heat dissipation plate, as well as a power supply module and server based on this heat dissipation plate.

[0014] Figure 1 This is a schematic diagram of a basic server implementation scenario. The following is combined with... Figure 1 The basic components of a server are described. In one embodiment, the server includes a motherboard 300 and a chip 310 disposed on the motherboard 300. As used herein, "motherboard 300" refers to a circuit board that houses the chip 310. As used herein, "chip 310" refers to an integrated circuit device that generates heat during operation, such as a graphics processing chip or other high-power main chip. The server may also include peripheral devices 400, which may include at least one of, for example, storage devices, network devices, and cooling fans. The server may also include an inlet manifold 320 and an outlet manifold 330, configured to supply and discharge coolant respectively, thereby creating a coolant circulation within the server.

[0015] Figure 2 This is a cross-sectional schematic diagram of a layered structure of a cold-rolled steel plate. The following is combined with... Figure 2 The basic components of a cold plate are described. In one embodiment, a cold plate is provided, comprising a cold plate body 100, which includes a power supply layer 110, a liquid cooling channel 120, and an insulating layer 130. The power supply layer 110 has power supply terminals 111 exposed above the cold plate body 100, configured to be electrically connected to a heat-generating component to supply power to the heat-generating component via the power supply layer 110. The liquid cooling channel 120 is configured to allow cooling liquid to flow through, thereby dissipating heat from the heat-generating component. The insulating layer 130 is located between the power supply layer 110 and the liquid cooling channel 120 to provide electrical isolation between the power supply layer 110 and the liquid cooling channel 120.

[0016] The term "cold plate" as used herein refers to a plate-like structure used for heat dissipation from heat-generating components, such as a liquid-cooled cold plate with internal channels for the flow of cooling liquid. The term "cold plate body 100" as used herein refers to the main structure constituting the cold plate, such as a plate-like body composed of several stacked layers. The term "power supply layer 110" as used herein refers to a conductive layer capable of conducting current to supply electrical energy to heat-generating components, such as a copper layer or other metal conductive layer. The term "power supply terminal 111" as used herein refers to a portion of the power supply layer 110 used for external electrical connection, such as a pin extending from the cold plate body 100, an exposed copper portion protruding from the surface of the cold plate body 100, or a crimp terminal.

[0017] The term "heat-generating component" as used herein refers to electronic components that require electrical power and generate heat during operation, necessitating heat dissipation. Examples include power conversion circuit 200, voltage regulation circuit, chips, integrated circuit devices, or modules comprising such circuits / devices. The term "liquid cooling channel 120" as used herein refers to a channel through which cooling liquid flows to remove heat, such as a microchannel channel, jet channel, or embedded tube channel. The term "cooling liquid" as used herein refers to a fluid used to absorb and remove heat, such as water or a fluorinated liquid. The term "insulating layer 130" as used herein refers to a layer used for electrical isolation, such as a resin layer or other insulating material layer.

[0018] In one embodiment, the liquid cooling channel 120 includes at least one of a microchannel channel, a jet channel, and an embedded tube channel. As an example, the liquid cooling channel 120 may include a small-sized microchannel channel, a jet channel that exchanges heat through jet impingement, an embedded tube channel with embedded tubing, or a combination of the above channel types. Optionally, the orthographic projection of the liquid cooling channel 120 onto the cold plate body 100 covers the power supply layer 110, thereby allowing the cooling liquid to cover the area corresponding to the power supply layer 110, thus providing more uniform heat dissipation to the heat-generating components disposed on one side of the power supply layer 110.

[0019] In one embodiment, the power supply terminal 111 includes at least one of the following: a lead extending from the cold plate body 100, an exposed copper portion protruding from the surface of the cold plate body 100, and a crimp terminal. As an example, the power supply terminal 111 may include a lead extending outward from the cold plate body 100, the lead being insertable into a heating element. In one embodiment, the power supply terminal 111 may also include an exposed copper portion protruding from the surface of the cold plate body 100, the exposed copper portion being crimped or soldered to the heating element. In one embodiment, the power supply terminal 111 may further include a crimp terminal, the crimp terminal being crimped into the heating element. The power supply layer 110 can be electrically connected to the heating element via any of the above-described forms of power supply terminals 111.

[0020] The cold plate body 100 can be made of various materials and electrically isolated in different ways accordingly. In one case, the cold plate body 100 includes a metal substrate and an insulating coating on the surface of the metal substrate, with the power supply terminal 111 exposed from the insulating coating. As an example, the metal substrate can be made of copper, aluminum, or a combination thereof to improve structural strength and assist heat transfer; the insulating coating can be made of insulating materials such as resin to electrically isolate the metal substrate from the power supply layer 110 and the liquid cooling channel 120, while allowing the power supply layer 110 to be electrically connected to the outside through the exposed portion at locations where electrical connection is required.

[0021] In another scenario, the material of the cold plate body 100 includes a polymer material. The polymer material's inherent insulation properties provide electrical isolation between the power supply layer 110 and the liquid cooling channel 120, as well as between the cold plate body 100 and the outside environment. Since the liquid cooling channel 120 supplies cooling liquid, the thermal conductivity of the cold plate body 100 itself does not need to be very high to achieve heat dissipation through the cooling liquid. Therefore, the material of the cold plate body 100 can be selected from a wide range of options.

[0022] In one embodiment, the cold plate body 100 includes a phase change material configured to absorb heat from the heat-generating component, thereby further absorbing heat through the phase change of the phase change material. In another embodiment, the insulation layer 130 includes a thermally conductive filler that improves the heat transfer efficiency from the self-powered layer 110 to the liquid cooling channel 120 while maintaining the electrical isolation function of the insulation layer 130. In yet another embodiment, the cooling liquid flowing in the liquid cooling channel 120 includes at least one of water and a fluorinated liquid; for example, the cooling liquid can be water, a fluorinated liquid, or other working fluids.

[0023] Figure 3 This is a cross-sectional schematic diagram of another layered structure of cold-rolled steel plate. The following is combined with... Figure 3 Another layered structure of the cold plate is described. In one embodiment, the cold plate body 100 further includes an adhesive layer 160 located between the power supply layer 110 and the heat-generating component, and configured to adhere to the heat-generating component, thereby conducting heat from the heat-generating component to the cold plate body 100 via the adhesive layer 160. As used herein, "adhesive layer 160" refers to a layer used for adhering to the heat-generating component and conducting heat, such as a layer that combines thermal conductivity and insulation.

[0024] In one embodiment, the cold plate body 100 further includes a signal layer 140 and a second insulating layer 150. The signal layer 140 has signal terminals 141 exposed above the cold plate body 100. The signal terminals 141 are configured to be electrically connected to a heating element to transmit control signals to the heating element. The second insulating layer 150 is located between the signal layer 140 and the power supply layer 110 to provide electrical isolation between the signal layer 140 and the power supply layer 110. Figure 3As shown, along the thickness direction of the cold plate body 100, the bonding layer 160, the signal layer 140, the second insulating layer 150, the power supply layer 110, the insulating layer 130 and the liquid cooling channel 120 are arranged in sequence, and the power supply terminal 111 and the signal terminal 141 are exposed on the cold plate body 100.

[0025] In one scenario, the thickness of the signal layer 140 is less than the thickness of the power supply layer 110. For example, the signal layer 140 can be a thinner conductive layer for transmitting control signals, while the power supply layer 110 can be a thicker conductive layer for conducting current to power the heating components. This allows the power supply layer 110 to carry a larger current, while the signal layer 140 facilitates the arrangement of lines for transmitting control signals.

[0026] In one scenario, the cross-sectional area of ​​the power supply layer 110 is larger than that of the signal layer 140, thereby enabling the power supply layer 110 to carry a larger current. Furthermore, when the thicknesses of the power supply layer 110 and the signal layer 140 are similar, the larger cross-sectional area is also used to conduct the current for power supply.

[0027] Figure 4 This is a cross-sectional view of an assembly structure for a power supply module and a server. The following is combined with... Figure 4 The assembly structure of the power supply module and the server is described. In one case, a power supply module is provided, which includes the cold plate as described above and the power conversion circuit 200. The "power conversion circuit 200" referred to herein refers to a circuit capable of converting electrical energy into voltage or current, such as a voltage regulation circuit that provides operating voltage to chip 310, and may include a carrier substrate 210 and a power conversion chip 220.

[0028] A power conversion circuit 200 is disposed on the cold plate body 100 of the cold plate and electrically connected to the power supply terminal 111 to obtain electrical energy via the power supply layer 110; the liquid cooling channel 120 of the cold plate is configured to dissipate heat from the power conversion circuit 200. The power conversion circuit 200 has an output terminal 210, which is configured to be electrically connected to the chip 310 to output electrical energy to the chip 310. The term "output terminal 210" as used herein refers to the portion of the power conversion circuit 200 used to output electrical energy. Thus, the cold plate body 100 of the cold plate supplies power to the power conversion circuit 200 via the power supply layer 110 and the power supply terminal 111, and also dissipates heat from the power conversion circuit 200 via the liquid cooling channel 120.

[0029] In one scenario, the power conversion circuit 200 has a first side and a second side facing away from each other. The first side faces the cold plate body 100, and the output terminal 210 is located on the second side. This allows the power conversion circuit 200 to obtain electrical energy and dissipate heat from the side facing the cold plate body 100, and to output electrical energy to the outside via the output terminal 210 from the side away from the cold plate body 100.

[0030] In one scenario, a server is provided, comprising a motherboard 300, a chip 310, and a power supply module as described above. The chip 310 is disposed on a first side of the motherboard 300, and the power supply module is disposed on a second side of the motherboard 300, opposite to the first side. The output terminal 210 of the power supply module is electrically connected to the chip 310 via the motherboard 300. Thus, the chip 310 and the power supply module are located on opposite sides of the motherboard 300, and the power conversion circuit 200 supplies power to the chip 310 via the output terminal 210 and the motherboard 300, ensuring that the power supply occurs along the thickness direction of the motherboard 300.

[0031] Thus, the power supply from the power conversion circuit 200 to the chip 310 occurs along the thickness direction of the motherboard 300, that is, along the direction perpendicular to the plane where the chip 310 is located, which can be called vertical power supply. Compared with the horizontal power supply method where the power conversion circuit supplies power to the heat-generating components along the plane of the circuit board, in the above-mentioned vertical power supply method, the power supply module and the chip are arranged opposite each other in the thickness direction of the motherboard 300, and the power supply path extends along the thickness direction without having to detour along the plane direction of the motherboard 300. This shortens the power supply path, reduces power supply path losses, and eliminates the need for the power supply module and the chip to avoid each other in the plane direction of the motherboard 300, which helps to reduce the overall size stacked in the height direction.

[0032] In one configuration, the server further includes a main chip cold plate 340, with chip 310 located between the motherboard 300 and the main chip cold plate 340. The main chip cold plate 340 is configured to dissipate heat from chip 310, thereby dissipating heat from the side of chip 310 away from the motherboard 300. In another configuration, the server further includes an inlet manifold 320 and a return manifold 330, which are respectively connected to a liquid cooling channel 120 to supply and discharge coolant to and from the liquid cooling channel 120. In yet another configuration, the main chip cold plate 340 and the liquid cooling channel 120 are connected to the same cooling circuit, thereby allowing the main chip cold plate 340 and the liquid cooling channel 120 of the cold plate to share a common cooling liquid circulation circuit.

[0033] In one scenario, the server includes multiple chips 310 and multiple power supply modules. Each chip 310 is powered by at least one power supply module, thereby accommodating multiple chips 310 and multiple power supply modules that power and dissipate heat for each chip 310 within the server to accommodate high-density placement. In another scenario, a single chip 310 is powered by multiple power supply modules arranged around the chip 310, each supplying power to the chip 310 via its own output terminal 210 and the motherboard 300, thereby meeting the chip 310's large current requirements and distributing heat dissipation.

[0034] Through the above solution, the cold plate body 100 integrates a power supply layer 110 for power supply and a liquid cooling channel 120 for heat dissipation, and achieves electrical isolation through an insulating layer 130 located between them. This integrates the power supply structure and the heat dissipation structure into the same cold plate body 100, eliminating the need for a separate power supply structure stacked outside the heat dissipation cold plate. This reduces the overall height dimension and facilitates thinner and higher-density arrangement within limited height space. As an example, in related technologies, the heat dissipation cold plate and the independent power supply structure are stacked together in the height direction, requiring their dimensions to be superimposed. In the above solution, the power supply structure and the heat dissipation structure are integrated into the same cold plate body 100, eliminating the need for a separate power supply structure stacked outside the heat dissipation cold plate, thus saving the height dimension occupied by one of them. Therefore, the integrated cold plate's dimensions in the height direction are significantly smaller than the combined dimensions of the heat dissipation cold plate and the independent power supply structure in the height direction. In some cases, the height can be reduced by several millimeters, for example, by about one-third. The specific value can vary depending on the power supply layer 110, the liquid cooling channel 120, and the thickness of each layer. The liquid cooling channel 120 dissipates heat from the heat-generating components disposed on the cold plate body 100, and the orthographic projection of the liquid cooling channel 120 covers the power supply layer 110 and the bonding layer 160, allowing the heat from the heat-generating components to be dissipated more fully.

[0035] By integrating the power supply layer 110 and the liquid cooling channel 120 onto the same cold plate body 100, the power conversion circuit 200 in the power supply module receives power and dissipates heat from the side facing the cold plate body 100, and supplies power to the chip 310 from the side away from the cold plate body 100 via the output terminal 210. This ensures that the power supply runs along the thickness direction of the motherboard 300, thereby shortening the power supply path. The cold plate body 100 serves both power supply and heat dissipation functions, allowing for the integrated arrangement of the cooling liquid piping and power supply lines, which simplifies assembly. Furthermore, the cold plate body 100 can be a combination of a metal substrate and an insulating coating, or it can be a polymer material, and may include a phase change material; the liquid cooling channel 120 can be a microchannel channel, a jet channel, or an embedded tube channel; the power supply terminal 111 can be a pin, an exposed copper portion, or a crimp terminal; the cooling liquid can be water or a fluorinated liquid, so that the above solutions can be adapted to various implementation methods; and, multiple chips 310 and multiple power supply modules that supply power and dissipate heat for each chip 310 can be arranged in the server to meet the needs of high-density arrangement.

[0036] Based on the above solution, in one scenario, a cold plate is provided, including a cold plate body 100. The cold plate body 100 includes a power supply layer 110, a liquid cooling channel 120, and an insulating layer 130. The power supply layer 110 has a power supply terminal 111 exposed on the cold plate body 100. The power supply terminal 111 is configured to be electrically connected to a heat-generating component to supply power to the heat-generating component via the power supply layer 110. The liquid cooling channel 120 is configured to allow cooling liquid to flow to dissipate heat from the heat-generating component. The insulating layer 130 is located between the power supply layer 110 and the liquid cooling channel 120. The orthographic projection of the liquid cooling channel 120 on the cold plate body 100 covers the power supply layer 110, and the insulating layer 130 includes thermally conductive filler. This improves heat transfer from the power supply layer 110 to the liquid cooling channel 120 while electrically isolating the power supply layer 110 from the liquid cooling channel 120, and allows the cooling liquid to cover the area corresponding to the power supply layer 110.

[0037] Based on the above solution, in one scenario, a server is provided, including a motherboard 300, a chip 310, and a power supply module. The power supply module includes a cold plate as described above and a power conversion circuit 200. The power conversion circuit 200 is disposed on the cold plate body 100 and electrically connected to a power supply terminal 111 to obtain power via a power supply layer 110. A liquid cooling channel 120 is configured to dissipate heat from the power conversion circuit 200. The power conversion circuit 200 has an output terminal 210. The chip 310 is disposed on a first side of the motherboard 300. The power supply module is located on the second side of the motherboard 300, and the output terminal 210 is electrically connected to the chip 310 via the motherboard 300. The server also includes a main chip cold plate 340, with the chip 310 located between the motherboard 300 and the main chip cold plate 340. The main chip cold plate 340 is configured to dissipate heat from the chip 310, and the main chip cold plate 340 is connected to the liquid cooling channel 120 in the same cooling circuit, thereby dissipating heat from both sides of the chip 310 and allowing the main chip cold plate 340 and the liquid cooling channel 120 to share the same cooling liquid circulation circuit.

[0038] The above description is merely illustrative and not intended to limit the scope of protection. Those skilled in the art can make modifications or variations based on the above description, and all such modifications and variations should fall within the scope of protection of the appended claims.

Claims

1. A cold-rolled steel plate, comprising a cold-rolled steel plate body (100), the cold-rolled steel plate body comprising: A power supply layer (110) having power supply terminals (111) exposed to the cold plate body, the power supply terminals being configured to be electrically connected to a heating element to supply power to the heating element via the power supply layer; A liquid cooling channel (120) configured for the flow of cooling liquid to dissipate heat from the heat-generating components; and An insulating layer (130) is located between the power supply layer and the liquid cooling channel.

2. The cold plate according to claim 1, wherein the cold plate body (100) further comprises a signal layer (140) and a second insulating layer (150), the signal layer having a signal terminal (141) exposed in the cold plate body, the signal terminal being configured to be electrically connected to the heating element to transmit a control signal to the heating element, and the second insulating layer being located between the signal layer and the power supply layer (110).

3. The cold plate according to claim 2, wherein the thickness of the signal layer (140) is less than the thickness of the power supply layer (110).

4. The cold plate according to claim 1, wherein the cold plate body (100) further includes an adhesive layer (160), the adhesive layer (160) being located between the power supply layer (110) and the heating element, and configured to be in contact with the heating element.

5. The cold plate according to claim 1, wherein the liquid cooling channel (120) comprises at least one of a microchannel channel, a jet channel, and an embedded tube channel.

6. The cold plate according to claim 1, wherein the orthographic projection of the liquid cooling channel (120) covers the power supply layer (110).

7. The cold plate according to claim 1, wherein the power supply terminal (111) includes at least one of the following: a pin extending from the cold plate body (100), an exposed copper portion exposed on the surface of the cold plate body, and a crimp terminal.

8. The cold plate according to claim 1, wherein the cold plate body (100) comprises a metal substrate and an insulating coating on the surface of the metal substrate, and the power supply terminal (111) is exposed from the insulating coating.

9. The cold plate according to claim 1, wherein the material of the cold plate body (100) comprises a polymer material.

10. The cold plate according to claim 1, wherein the cold plate body (100) comprises a phase change material configured to absorb heat from the heating element.

11. The cold plate according to claim 1, wherein the insulating layer (130) comprises a thermally conductive filler.

12. The cold plate according to claim 1, wherein the cooling liquid comprises at least one of water and fluorinated liquid.

13. A power supply module, comprising: Cold plate according to any one of claims 1-12; as well as A power conversion circuit (200) is disposed on the cold plate body (100) of the cold plate and electrically connected to a power supply terminal (111) to obtain electrical energy via a power supply layer (110). The liquid cooling channel (120) of the cold plate is configured to dissipate heat from the power conversion circuit, and the power conversion circuit has an output terminal (210) configured to be electrically connected to the chip (310) to output electrical energy to the chip.

14. The power supply module according to claim 13, wherein the power conversion circuit (200) has a first side and a second side facing away from each other, the first side facing the cold plate body (100), and the output terminal (210) is located on the second side.

15. A server, comprising: Motherboard (300); Chip (310); as well as According to claim 13, the power supply module is disposed on a first side of the motherboard, the power supply module is disposed on a second side of the motherboard, the second side is opposite to the first side, and the output terminal (210) of the power supply module is electrically connected to the chip via the motherboard.

16. The server according to claim 15, wherein the power supply module (200) supplies power to the chip (310) via the output terminal (210) and the motherboard (300) along the thickness direction of the motherboard (300), the thickness direction being perpendicular to the plane in which the chip (310) is located.

17. The server according to claim 15 further includes an inlet manifold (320) and a return manifold (330), wherein the inlet manifold and the return manifold are respectively connected to the liquid cooling channel (120).

18. The server according to claim 15, wherein the number of chips (310) is multiple, the number of power supply modules is multiple, and each chip is powered by at least one of the power supply modules.

19. The server according to claim 15 further includes a main chip cold plate (340), wherein the chip (310) is located between the motherboard (300) and the main chip cold plate, and the main chip cold plate is configured to dissipate heat from the chip.

20. The server according to claim 19, wherein the main chip cold plate (340) and the liquid cooling channel (120) are connected in the same cooling circuit.

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