A heat dissipation structure and circuit board assembly

Abstract

This application provides a heat dissipation structure and circuit board assembly, relating to the field of heat dissipation technology for high-power components. The heat dissipation structure includes a vapor chamber plate protruding towards and connected to a heat-generating element; a fin assembly disposed on the side of the vapor chamber plate away from the heat-generating element; and a heat pipe assembly having a first portion and a second portion. The first portion is connected to the vapor chamber plate and correspondingly projected onto the heat-generating element, extending perpendicular to the heat-generating element and passing through the fin assembly. The second portion extends towards both sides of the vapor chamber plate and passes through the fin assembly. This application's embodiment improves heat dissipation efficiency by adjusting the heat dissipation structure based on the fact that the heat-generating center of the heat-generating element is offset from the center of the heat sink.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for heat-generating elements, and in particular to a heat dissipation structure and circuit board assembly. Background Technology

[0002] As the power consumption of heat-generating components (such as chips) increases, the requirements for the trace length of the chips themselves also increase. In order to ensure the operation of the chips, heat dissipation is necessary. In scenarios such as switching chips, data center CPUs / GPUs, power IGBTs, and laser chips, chips have localized high heat flux density, and the chip layout space is limited.

[0003] In related technologies, a symmetrical heat sink is used, with the chip located in the central area of ​​the heat sink. The center of the heat sink is aligned with the heat-generating center of the chip, and the heat sink is placed on one side of the chip. The chip is cooled by air cooling.

[0004] However, in complex layouts with limited space, the heat-generating center of the chip is often off-center from the heat sink, resulting in poor heat dissipation performance when using the aforementioned heat dissipation methods. Summary of the Invention

[0005] This application provides a heat dissipation structure and circuit board assembly. By adjusting the heat dissipation structure based on the fact that the heat dissipation center of the chip is offset from the center of the heat sink, the heat dissipation effect is improved.

[0006] To achieve the above objectives, the technical solution of this application is as follows:

[0007] In a first aspect, this application provides a heat dissipation structure, including: a heat spreader plate, which protrudes toward and is connected to the chip; a fin assembly, which is disposed on the side of the heat spreader plate away from the chip; and a heat pipe assembly, which has a first part and a second part, the first part being connected to the heat spreader plate and correspondingly projected onto the chip, extending in a direction perpendicular to the chip and passing through the fin assembly, and the second part extending toward both sides of the heat spreader plate and passing through the fin assembly.

[0008] In one possible implementation, the heat spreader includes a connecting portion and a first extension and a second extension respectively disposed on opposite sides of the connecting portion, with a portion of the connecting portion protruding toward the chip; the fin assembly includes a plurality of fins, the plurality of fins respectively forming a first portion disposed on the connecting portion, a second portion disposed on the first extension and a third portion disposed on the second extension, the height of the first portion in the direction perpendicular to the chip being greater than the height of at least a portion of the second and third portions in the direction perpendicular to the chip.

[0009] In one possible implementation, the fin assembly includes a connecting frame to which a plurality of fins are connected, the connecting frame being located on the side of the fins away from the chip, and at least a portion of the second portion and at least a portion of the third portion being suspended on the side of the connecting portion away from the chip.

[0010] In one possible implementation, the heat pipe assembly includes multiple heat pipes arranged sequentially along the width of the chip, each heat pipe being connected to a vapor chamber, with adjacent heat pipes extending to opposite sides of the vapor chamber respectively.

[0011] In one possible implementation, the heat pipe includes a first segment, a bent segment, and a second segment connected in sequence. The first segment and a portion of the second segment are disposed opposite each other. The bent segment is disposed in a direction perpendicular to the chip. The first segment is connected to the connecting portion and is disposed corresponding to the chip. The end of the second segment away from the bent segment extends to the side of the heat spreader. The first segment and the bent segment form a first portion, and the second segment forms a second portion.

[0012] In one possible implementation, the first segment has a heating area and the second segment has a heat dissipation area, the area of ​​which is larger than that of the heating area, and the heat dissipation area is located outside the first segment.

[0013] In one possible implementation, both the first and second segments have pointed ends away from the curved segment, and the length of the first segment corresponding to the middle of the chip is greater than the length of the first segment away from the middle of the chip.

[0014] In one possible implementation, the system further includes two opposing support frames, which are bent to support at least partially suspended second and / or at least partially suspended third parts. It also includes fasteners connected to the second or third parts via the support frames to adjust pressure on the second or third parts. The support frames are connected to a heat spreader plate, which has mounting grooves in which some heat pipes are disposed.

[0015] In one possible implementation, the heat dissipation structure also includes a buffer component disposed on the periphery of the chip and away from the vapor chamber.

[0016] Secondly, this application also provides a circuit board assembly, including a chip and a heat dissipation structure as described in any of the first aspects above.

[0017] This application provides a heat dissipation structure and circuit board assembly. The heat dissipation structure forms a surface-to-surface thermal contact with the chip through a vapor chamber with its protrusions. The first part of the heat pipe assembly is connected to the vapor chamber and is projected onto the chip. The heat generated by the chip is conducted through the vapor chamber and further transferred through the first part of the heat pipe assembly in a direction perpendicular to the chip, and is dissipated by the corresponding fin assembly. The heat is then carried away by the airflow. The second part of the heat pipe assembly extends in a direction parallel to the vapor chamber, carrying the heat generated by the chip away from the vertical position of the chip and extending to both sides of the chip in a lateral heat transfer manner. The heat drawn out in the direction perpendicular to the chip is laterally transferred to the far end of the corresponding fin assembly. The heat pipe assembly guides the locally concentrated heat to the far end area of ​​the heat sink. Through longitudinal heat conduction and lateral heat transfer, the heat dissipation space is increased, and the local heat accumulation caused by chip eccentricity is reduced. Even when the chip is eccentrically arranged relative to the heat dissipation structure, the heat conduction of the chip is still improved, heat concentration is avoided, the heat dissipation space is expanded, and the heat dissipation effect is improved. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] Figure 1 An exploded view of a heat dissipation structure provided in an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of the heat dissipation structure provided in the embodiments of this application;

[0021] Figure 3 for Figure 2 A schematic diagram of the heat dissipation structure from view A.

[0022] Figure 4 This is a schematic diagram of the heat dissipation structure of the vapor chamber provided in the embodiments of this application;

[0023] Figure 5 An exploded view of the fin assembly in the heat dissipation structure provided in the embodiment of this application;

[0024] Figure 6 This is a schematic diagram of the heat pipe assembly in the heat dissipation structure provided in the embodiments of this application;

[0025] Figure 7 This is a schematic diagram of the structure of a heat sink in related technologies.

[0026] Explanation of reference numerals in the attached figures:

[0027] 10-chip;

[0028] 100 - Heat spreader; 110 - Connecting part; 120 - First extension; 130 - Second extension;

[0029] 200 - Heat pipe assembly; 210 - Heat pipe; 211 - First section; 212 - Bending section; 213 - Second section; 201 - Heating zone; 202 - Heat dissipation zone;

[0030] 300 - Fin assembly; 310 - Fin; 320 - Connector; 301 - First part; 302 - Second part; 303 - Third part;

[0031] 400-Support Frame;

[0032] 500-Buffer;

[0033] 600 - Fastener; 601 - First fastener; 602 - Second fastener;

[0034] 700 - Mounting bracket; 701 - Clearance hole;

[0035] 800-positioning post.

[0036] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0037] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended application.

[0038] It should be noted that in the description of the embodiments of this application, the terms "upper", "lower", "inner", "outer" and other terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description, and are not intended to indicate or imply that the device or component must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application.

[0039] Furthermore, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "fixation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] In related technologies, symmetrical heat sinks are used, with the chip located in the central area of ​​the heat sink, aligning the center of the heat sink with the heat-generating center of the chip, such as... Figure 7 As shown, the heat sink is placed on one side of the chip, and the chip is cooled by air.

[0042] However, in complex layouts with limited space, the heat dissipation center of the chip is often offset from the center of the heat sink, resulting in poor heat dissipation performance using the aforementioned heat dissipation methods. Specifically, symmetrical heat sinks in related technologies achieve radial heat diffusion by using the chip's heat source center. However, in complex layouts with limited space, the chip's mounting position is offset from the heat dissipation center due to signal integrity and wiring constraints, leading to an asymmetrical heat conduction path. The increased physical distance between the heat dissipation center and the edge of the heat sink increases lateral thermal resistance, preventing the distal fins from effectively participating in heat exchange and reducing the utilization rate of the heat dissipation area. Secondly, the limited heat diffusion space leads to localized thermal saturation in the area above the chip, limiting the heat flux density extraction capacity per unit area. If the chip position is forced to move to accommodate this symmetrical structure, the transmission performance of high-speed signals will be sacrificed.

[0043] Therefore, this application provides a heat dissipation structure and circuit board assembly. The heat dissipation structure establishes a thermal connection with the chip through the protrusion of the heat spreader plate. The heat generated by the chip is longitudinally led out along the direction perpendicular to the chip by the first part of the heat pipe assembly and transferred to the fin assembly. Subsequently, the heat is carried away from the vertical projection area of ​​the chip by the second part of the heat pipe assembly and diffused to the edge of the fin assembly in a lateral heat transfer manner.

[0044] The multi-dimensional heat transfer path, combining vertical heat conduction and lateral diffusion, enables the distribution and regulation of locally concentrated heat over a larger spatial area, effectively compensating for uneven heat dissipation resources caused by the off-center chip layout. Even when the chip is offset relative to the heat dissipation structure, this application can still effectively expand the effective heat dissipation area, avoid local heat accumulation, and significantly improve the overall heat dissipation performance.

[0045] This application utilizes the first part of a heat pipe assembly to form a longitudinal heat conduction channel perpendicular to the vapor chamber plane directly above the chip's heat generation center. This changes the heat transfer mode in related technologies that relies solely on two-dimensional horizontal diffusion. Taking advantage of the high equivalent thermal conductivity of the heat pipe assembly, the second part extends in a direction parallel to the vapor chamber, reducing the increase in physical spacing caused by the off-center chip layout and the resulting lateral thermal resistance.

[0046] The following is combined with Figures 1 to 6 The present application will be described in detail with reference to specific embodiments.

[0047] This application provides a heat dissipation structure, including: a heat spreader 100, a fin assembly 300, and a heat pipe assembly 200.

[0048] For ease of description, the direction perpendicular to chip 10 in the embodiments of this application is as follows: Figure 1 As shown in the z-direction, the width direction of chip 10 or heat spreader 100 is as follows: Figure 1 As shown in the x-direction, the length direction of chip 10 or heat spreader 100 is as follows: Figure 1 As shown in the y-direction, the horizontal plane is the xy plane.

[0049] like Figure 1 , Figure 2 , Figure 3 , Figure 4 The heat spreader 100 protrudes towards and connects to the chip 10. The heat spreader 100 has a contact surface with the chip 10, which adheres to the chip 10 to receive the heat dissipated by the chip 10. The projected area of ​​the heat spreader 100 in the horizontal plane is larger than that of the chip 10 in the horizontal plane. The center of the protrusion does not coincide with the geometric center of the heat spreader 100, thus enabling the heat dissipation structure to adapt to the position of the chip 10 through active biasing of the protrusion without moving the chip 10.

[0050] On the one hand, the protrusion refers to the fact that the heat spreader 100 protrudes towards the chip 10 on the horizontal plane to accommodate the position of the chip 10. For example, the heat spreader 100 is projected into a convex shape on the horizontal plane. On the other hand, since there are some protective structures around the chip 10 in the direction perpendicular to the chip 10, in order to achieve surface-to-surface contact between the heat spreader 100 and the chip 10, part of the heat spreader 100 will protrude in the direction perpendicular to the chip 10 to fit the chip 10, thereby forming a stepped clearance space between the protrusion and the other bottom surfaces of the heat spreader 100.

[0051] The vapor chamber 100 uses capillary structures (such as grooves and sintered powder) to drive the internal working fluid (such as water or ammonia) to evaporate and condense in a cycle. After heat is absorbed from the evaporation zone (the contact surface of the chip 10), the working fluid evaporates and diffuses to the condensation zone (the fin assembly 300 side). After condensation, it flows back through capillary force, forming a continuous heat conduction.

[0052] The fin assembly 300 is disposed on the side of the heat spreader 100 opposite to the chip 10. The fin assembly 300 is disposed on the heat spreader 100 and can dissipate heat received by the heat spreader 100 itself. The fin assembly 300 projects onto the heat spreader 100 in a horizontal plane.

[0053] The heat pipe assembly 200 has a first part and a second part. The first part is connected to the heat spreader 100 and is projected onto the chip 10. It extends in a direction perpendicular to the chip 10 and passes through the fin assembly 300. The second part extends toward both sides of the heat spreader 100 and passes through the fin assembly 300.

[0054] The first part of the projection falls entirely or partially within the projection area of ​​chip 10, vertically guiding the high-density heat accumulated in the protrusion to the middle and high part of the fin assembly 300. The second part passes through the interior of the fin assembly 300, horizontally guiding the vertically drawn heat to an area away from chip 10, avoiding the underutilization of the far part of the fin assembly 300 due to the off-center layout, thus forming a path for heat to be guided from the projection center of chip 10 to the edge area of ​​the heat sink.

[0055] The first part connects to the vapor chamber 100, conducting heat from the vapor chamber 100 along the z-direction, further enhancing heat conduction to the chip 10 and preventing heat concentration on the surface of the chip 10 or the vapor chamber 100. The second part extends laterally away from the chip 10 and towards the vapor chamber 100, i.e., towards the y-direction. Since the heat pipe assembly 200 is installed inside the fin assembly 300, the fin assembly 300 can also dissipate heat from the heat pipe assembly 200.

[0056] In this embodiment, the vapor chamber 100 protrudes towards the chip 10 to correspond to the chip 10 layout (rather than the geometric center of the heat sink in related technologies being offset from the chip 10). Regardless of the chip 10's offset on the circuit board, the protruding contact surface of the vapor chamber 100 can adhere to the chip 10. The heat pipe assembly 200 is directly connected to the vapor chamber 100 and extends from the corresponding part of the chip 10, so that the evaporation end of the heat pipe assembly 200 is close to the area directly above or to the side above the chip 10. Heat does not need to be laterally conducted through the long vapor chamber 100 to enter the heat pipe 210, providing a rapid heat dissipation channel and efficiently transferring heat to the fin assembly 300 for heat dissipation, thereby eliminating local overheating. By adjusting the protruding position of the vapor chamber 100 and the extension direction of the heat pipe assembly 200, different offset distances can be flexibly adapted.

[0057] In one possible implementation, the heat spreader 100 includes a connecting portion 110 and a first extension 120 and a second extension 130 respectively disposed on opposite sides of the connecting portion 110. A portion of the connecting portion 110 protrudes towards the chip 10 to accommodate the position of the chip 10. In the direction towards the chip 10, the area of ​​the first extension 120 is greater than or equal to the area of ​​the second extension 130. In the direction towards the chip 10, the area of ​​the first extension 120 is greater than or equal to the area of ​​the second extension 130, thereby adjusting the layout of the heat spreader 100. The shapes of the first extension 120 and the second extension 130 may be the same or different, and this embodiment does not limit this. For example, the first extension 120 or the second extension 130 may have an inclined surface, which is used to avoid adjacent irregularly shaped devices on the circuit board.

[0058] The fin assembly 300 includes a plurality of fins 310, which are respectively formed in a first part 301 corresponding to the connection part 110, a second part 302 corresponding to the first extension part 120, and a third part 303 corresponding to the second extension part 130. In the direction perpendicular to the chip 10, the height of the first part 301 is greater than the height of at least a portion of the second part 302 and at least a portion of the third part 303, thereby improving the heat dissipation effect of the corresponding chip 10 area, and forming a space below the second part 302 and the third part 303 that facilitates air recirculation or avoids electronic components.

[0059] In some embodiments, this application further includes a mounting bracket 700, on which a heat spreader 100 is mounted. The mounting bracket 700 has clearance holes 701 to expose a portion of the heat spreader 100 for contact with the chip 10. For ease of description, the clearance holes 701 include at least one first clearance hole and multiple second clearance holes. For example, the mounting bracket 700 has a first clearance hole at a corresponding position on the connecting portion 110 to facilitate heat conduction by connecting the connecting portion 110 to the chip 10. The mounting bracket 700 has second clearance holes at corresponding positions on the first extension 120 and the second extension 130. The second clearance holes are used to avoid the first extension 120 and the second extension 130, allowing them to connect with chips surrounding the chip 10. The diameter of the first clearance hole is larger than that of the second clearance hole. The shapes of the first and second clearance holes can be customized according to the chip profile, for example, square or circular. The mounting bracket 700 has connection holes to allow fasteners 600 to pass through, thus fixing the heat dissipation structure to the corresponding position on the chip 10.

[0060] In one possible implementation, the fin assembly 300 includes a connecting frame 320, with a plurality of fins 310 connected to the connecting frame 320. The connecting frame 320 is located on the side of the fins 310 away from the chip 10. At least a portion of the second part 302 and at least a portion of the third part 303 are suspended on the side of the connecting part 110 away from the chip 10 to adjust the center of gravity of the heat dissipation of the chip 10 relative to the structure of the heat exchange plate 100, thereby reducing the uneven force on the heat sink caused by the eccentric setting of the protrusion.

[0061] For example, the front portions of the second part 302 and the third part 303 are both suspended relative to the plane where the chip 10 is located, with the direction closest to the chip 10 being the front portion. If the heat spreader 100 is convex in shape, the front portions of the second part 302 and the third part 303 are on both sides of the convexity, and their horizontal projections are offset from the first extension 120 and the second extension 130, respectively. The rear portions of the second part 302 and the third part 303 are on both sides of the convexity, and their horizontal projections fall into the corresponding first extension 120 and second extension 130, thereby improving the heat dissipation effect in the corresponding chip 10 area. Since the front portions of the second part 302 and the third part 303 are close to the chip 10, the suspended arrangement prevents the heat dissipation of the front portions of the second part 302 and the third part 303 from affecting the chip 10.

[0062] Specifically, the first part 301 is connected to the upper surface of the heat spreader 100, and the first part 301 corresponds to the position of the chip 10 in the z-direction, for directly transferring heat from the chip 10 to the first part 301 via the connecting part 110. The lower surface of the heat spreader 100 is connected to the chip 10.

[0063] Both the second part 302 and the third part 303 are suspended on the same side of the protrusion, such as the upper or lower side of the protrusion. By suspending the second part 302 and the third part 303, the center of gravity of the entire heat dissipation structure is shifted relative to the center of the protrusion, thereby adapting to the layout of chip 10.

[0064] The first part 301 is used to dissipate the heat transferred from the chip 10. The second part 302 and the third part 303 are used to transfer the heat from the heat-conducting core area of ​​the chip 10 to both sides of the heat dissipation plate, thereby avoiding the heat being concentrated only at the protrusion and avoiding heat accumulation and uneven distribution.

[0065] The connecting frame 320 can be a cover plate. The connecting frame 320 is provided with connecting holes. For example, multiple connecting holes are spaced apart around the connecting frame 320, and multiple connecting holes are spaced apart along the y-direction inside the connecting frame 320. The connecting holes avoid the projection area where the chip 10 is located. The fin assembly 300 has a first hole corresponding to the connecting hole, and the heat spreader 100 has a second hole corresponding to the connecting hole. Some fasteners 600 pass through the connecting hole, the first hole and the second hole in sequence from the outside of the connecting frame 320, so that the fin assembly 300 is connected to the heat spreader 100, so that the entire heat dissipation structure forms a whole, which is convenient for assembly onto the corresponding chip 10.

[0066] The fastener 600 includes a plurality of first fasteners 601 and at least one second fastener 602. For example, four first fasteners 601 are provided around the chip 10 corresponding to the heat spreader 100, and these four first fasteners 601 protrude from the surface of the connector 320. The first fasteners 601, through a preset downward pressure, make the load distribution at the contact interface between the protrusion and the chip 10 uniform, enhance the heat distribution effect in the core area of ​​the heat source, thereby ensuring the heat conduction of the chip 10 and preventing the protrusion from lifting off the chip 10. The first fasteners 601 have a limiting boss that protrudes from the surface of the connector 320, and the limiting boss prevents loosening of the fit due to transportation vibration or accidental collision, thus avoiding the degradation of heat dissipation performance. In addition, two more first fasteners 601 are arranged in the corresponding areas of the first extension 120 and the second extension 130. The second fasteners 602 apply downward pressure to the edge of the heat spreader 100 to make the heat spreader 100 subject to uniform force.

[0067] The heat spreader 100 has a positioning hole on the side facing away from the chip 10 in the x-direction to provide a reference during assembly and ensure that the protrusion is aligned with the eccentric chip 10. For example, it also includes a positioning post 800. The circuit board assembly has fixing holes, and the positioning post 800 passes through the positioning hole and the fixing hole in sequence to fix the heat dissipation structure to the circuit board, achieving rapid positioning of the heat dissipation structure.

[0068] In another embodiment, the heat pipe assembly 200 includes a plurality of heat pipes 210 arranged sequentially along the width direction. The plurality of heat pipes 210 are all connected to the heat spreader 100, and two adjacent heat pipes 210 extend to opposite sides of the heat spreader 100 respectively.

[0069] The ends of two adjacent heat pipes 210 are staggered. For example, among a plurality of heat pipes 210 arranged along the width of the heat spreader 100, the evaporation end of the first heat pipe 210 is located above the protrusion, and its condensation end extends to the left side of the heat spreader 100; the evaporation end of the second heat pipe 210 adjacent to the first heat pipe 210 is also located above the protrusion, but its condensation end extends to the right side of the heat spreader 100; the condensation end of the third heat pipe 210 extends to the left side, and so on, thus forming an alternating distribution.

[0070] Meanwhile, the ends of two adjacent heat pipes 210 are staggered and opposite each other. Specifically, the condensing ends of the first heat pipe 210 and the second heat pipe 210 are staggered in the horizontal direction. This staggered arrangement avoids the condensing ends of adjacent heat pipes 210 being concentrated in the same area, which is beneficial for the uniform distribution of heat to different areas of the fin assembly 300.

[0071] In some embodiments, the heat spreader 100 has a mounting groove, such as at least one mounting groove on the upper surface of the heat spreader 100. The shape and size of the mounting groove match the outer contour of the heat pipe 210. This application embodiment does not limit the connection method between the mounting groove and the heat pipe 210; for example, the heat pipe 210 can be directly embedded in the mounting groove or fixed with thermally conductive adhesive. When the heat pipe 210 is disposed in the mounting groove, the outer wall of the heat pipe 210 forms surface-to-surface contact with the groove wall and the bottom of the groove. Specifically, at least one side of the heat pipe 210 is in contact with the groove wall, and the bottom surface of the heat pipe 210 is in contact with the bottom of the groove. The heat pipe 210 is disposed in the mounting groove, thereby achieving surface-to-surface contact. Compared to directly attaching the heat pipe 210 to the plane of the heat spreader 100 (which is only line contact or point contact with a small contact area), this application embodiment increases the contact area between the heat pipe 210 and the heat spreader 100, resulting in better heat dissipation.

[0072] In some embodiments, the heat pipe 210 includes a first segment 211, a bent segment 212, and a second segment 213 connected in sequence. The first segment 211 is disposed opposite to a portion of the second segment 213. The bent segment 212 is disposed in a direction perpendicular to the chip 10. The first segment 211 is connected to the connecting portion 110 and is disposed corresponding to the chip 10. One end of the second segment 213 away from the bent segment 212 extends to the side of the heat spreader 100. The first segment 211 and the bent segment 212 form a first portion, and the second segment 213 forms a second portion.

[0073] Specifically, the first segment 211, the curved segment 212, and the second segment 213 are integrally formed tubes. For example, the heat pipe 210 is shaped like an umbrella handle. The first segment 211 and a portion of the second segment 213 are arranged opposite each other, that is, the first segment 211 and a portion of the second segment 213 are arranged approximately parallel to each other in space and facing each other, with a gap between them.

[0074] The curved segment 212 is arranged perpendicular to the direction of the chip 10. Specifically, the curved segment 212 is arc-shaped or zigzag-shaped, and its bending axis is aligned with the z-direction. The first segment 211 is connected to the connecting portion 110, wherein the bottom refers to the root region of the protrusion facing the chip 10. The first segment 211 corresponds to the position of the chip 10, that is, the projection of the first segment 211 onto the chip 10 at least partially overlaps with the chip 10.

[0075] The second segment 213 extends away from one end of the curved segment 212 to the side of the heat spreader 100. Specifically, the second segment 213 extends outward in a horizontal direction from the curved segment 212 until it is flush with the edge of the heat spreader 100 or located inside the edge.

[0076] Overall, the heat pipe 210 is shaped like an inverted umbrella handle. The first segment 211 corresponds to the straight part of the umbrella handle, the curved segment 212 corresponds to the hook part of the umbrella handle, and the second segment 213 corresponds to the grip part of the umbrella handle. This allows the heat pipe 210 to transfer heat from the heat source area at the bottom of the protrusion, through the protrusion of the heat spreader 100, to the side of the heat spreader 100.

[0077] In one possible implementation, the first segment 211 provided in this application embodiment has a heating area 201, and the second segment 213 has a heat dissipation area 202. The area of ​​the heat dissipation area 202 is larger than the area of ​​the heating area 201, and the heating area 201 is located on the side of the second segment 213 away from the curved segment 212.

[0078] The heating zone 201 is at least a portion of the outer surface area of ​​the first segment 211. During operation, it receives heat from the chip 10 and conducts it through the protrusions of the heat spreader 100, causing the working fluid inside the tube to evaporate. The heating zone 201 can also be called the evaporation zone. The heat dissipation zone 202 is at least a portion of the outer surface area of ​​the second segment 213. It releases heat to the external environment or the fin assembly 300. The heat dissipation zone 202 can also be called the condensation zone. The area of ​​the heat dissipation zone 202 is larger than the area of ​​the heating zone 201. Specifically, the axial length of the second segment 213 is greater than the axial length of the first segment 211.

[0079] In one possible implementation, both the first segment 211 and the second segment 213 have a pointed end away from the curved segment 212. Specifically, the length of the first segment 211 located in the middle of the chip 10 is greater than the length of the first segment 211 located at the edge of the chip 10. Through this area difference and positional arrangement, heat is concentrated and absorbed in the smaller heating area 201 to reduce thermal resistance, and then rapidly dissipated in the larger heat dissipation area 202, thereby improving heat dissipation efficiency.

[0080] The first segment 211 has a first pointed tip at one end away from the curved segment 212. The second segment 213 has a second pointed tip at one end away from the curved segment 212. Both the first and second pointed tips are gradually narrowing structures. Specifically, the first pointed tip is formed by the outer diameter of the first segment 211 gradually decreasing along the axial direction, and its end is a rounded transition point or a flat opening. The structure of the second pointed tip is similar to that of the first pointed tip.

[0081] The first and second tips can reduce stress concentration at the ends of the heat pipe 210, preventing end cracking during thermal cycling or vibration. Simultaneously, during assembly, the first and second tips facilitate insertion into pre-drilled mounting holes on the fin assembly 300 or into the positioning slots of the heat spreader 100, serving as guides and positions.

[0082] In some embodiments, the present application further includes two opposing support frames 400, which are bent to support at least partially suspended second part 302 and / or at least partially suspended third part 303, and also include fasteners 600 connected to the second part 302 or the third part 303 via the support frames 400 to adjust the pressure on the second part 302 or the third part 303. The support frames 400 are connected to a heat spreader 100, which has a mounting groove, and a portion of the heat pipes 210 are disposed in the mounting groove.

[0083] Fastener 600 includes at least one second fastener 602. Exemplarily, there are two second fasteners 602, each corresponding to one of the two support frames 400. The two second fasteners 602 are located on opposite sides of the chip 10. Each second fastener 602 is connected to either the second part 302 or the third part 303 via the support frame 400, or vice versa. Each second fastener 602 includes a connecting rod, an elastic element, and a locking nut. Both the elastic element and the locking nut are fitted onto the connecting rod. One end of the elastic element is connected to the locking nut, and the other end is connected to a boss on the connecting rod or to the support frame 400. Rotating the locking nut causes it to move along the connecting rod, thereby driving the elastic element to compress or extend, thus adjusting the pressure on the second part 302 or the third part 303. The second fastener 602 applies downward pressure to the edge of the heat spreader 100, generating a torque opposite to the eccentric torque of the heat spreader 100. This counteracts the tendency of the heat spreader 100 to flip due to the shift in the center of gravity, ensuring the stress balance of the heat dissipation structure during operation. The two symmetrically arranged second fasteners 602 facilitate the balancing of the gravitational deviation caused by the eccentric layout, counteract the additional torque caused by the structural eccentricity, and prevent loosening of the connection due to uneven stress on the module during long-term use.

[0084] In some embodiments, a buffer 500 is also included, which is disposed around the chip 10 and away from the heat spreader 100. Furthermore, a buffer 500 is provided around the protrusion; the buffer 500 is a buffer pad added around the chip 10 to absorb mechanical impacts and vibration stresses from the z-direction or horizontal direction, thereby reducing the impact of vibration on the overall operational reliability of the chip 10 heat dissipation module.

[0085] Secondly, embodiments of this application also provide a circuit board assembly, including a chip 10 and a heat dissipation structure connected to the chip 10 as described in any of the above embodiments.

[0086] The circuit board assembly also includes a circuit board on which the chip 10 is mounted. On the circuit board, the chip 10 is installed in a predetermined area based on signal integrity and high-speed routing requirements. Due to limitations imposed by surrounding electronic components (such as connectors, power modules, etc.) and trace length, the physical center of the chip 10 on the circuit board is offset from the geometric center of the mounting area of ​​the heat dissipation structure. A thermally conductive interface material, such as thermally conductive adhesive, is provided between the protrusion and the top surface of the chip 10, and heat is conducted from the chip 10 to the vapor chamber 100 through surface-to-surface contact.

[0087] In the circuit board assembly provided in this embodiment, after heat is generated by the chip 10, it enters the heat spreader 100 through the protrusion for planar diffusion, and is longitudinally led out by the first part of the heat pipe assembly 200 to the height of the fin assembly 300, and then laterally transported by the second part to the edge area of ​​the fin 310 away from the center of the chip 10.

[0088] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.

[0089] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope.

Claims

1. A heat dissipation structure, characterized in that, include: A heat spreader (100) protrudes toward the heating element and is connected to the heating element; A fin assembly (300) is disposed on the side of the heat spreader (100) away from the heating element; A heat pipe assembly (200) has a first portion and a second portion connected to the first portion. The first portion is connected to the heat spreader (100) and is projected onto the heating element. It extends in a direction perpendicular to the heating element and passes through the fin assembly (300). The second portion extends toward both sides of the heat spreader (100) and passes through the fin assembly (300).

2. The heat dissipation structure according to claim 1, characterized in that, The heat spreader (100) includes a connecting portion (110) and a first extension portion (120) and a second extension portion (130) respectively disposed on opposite sides of the connecting portion (110). A portion of the connecting portion (110) protrudes toward the heating element. The fin assembly (300) includes a plurality of fins (310). The plurality of fins (310) respectively form a first part (301) disposed on the connecting portion (110), a second part (302) disposed on the first extension portion (120), and a third part (303) disposed on the second extension portion (130). In the direction perpendicular to the heating element, the height of the first part (301) is greater than the height of at least a portion of the second part (302) and at least a portion of the third part (303).

3. The heat dissipation structure according to claim 2, characterized in that, The fin assembly (300) includes a connecting frame (320), to which a plurality of fins (310) are connected. The connecting frame (320) is located on the side of the fins (310) away from the heating element. At least a portion of the second part (302) and at least a portion of the third part (303) are suspended on the side of the connecting part (110) away from the heating element to adjust the center of gravity of the heat dissipation structure.

4. The heat dissipation structure according to claim 2 or 3, characterized in that, The heat pipe assembly (200) includes a plurality of heat pipes (210) arranged sequentially along the width direction of the heating element. The plurality of heat pipes (210) are all connected to the heat spreader (100), and two adjacent heat pipes (210) extend to opposite sides of the heat spreader (100) respectively.

5. The heat dissipation structure according to claim 4, characterized in that, The heat pipe (210) includes a first section (211), a bent section (212), and a second section (213) connected in sequence. The first section (211) is disposed opposite to a portion of the second section (213). The bent section (212) is disposed in a direction perpendicular to the heating element. The first section (211) is connected to the heat spreader (100) and is disposed corresponding to the heating element. A portion of the second section (213) away from the bent section (212) extends to the side of the heat spreader (100). The first section (211) and the bent section (212) form the first part, and the second section (213) forms the second part.

6. The heat dissipation structure according to claim 5, characterized in that, The first segment (211) has a heating area (201), and the second segment (213) has a heat dissipation area (202). The area of ​​the heat dissipation area (202) is larger than the area of ​​the heating area (201), and the heat dissipation area (202) is located outside the first segment (211).

7. The heat dissipation structure according to claim 5, characterized in that, The first segment (211) and the second segment (213) both have a pointed end away from the curved segment (212), and the length of the first segment (211) corresponding to the middle of the heating element is greater than the length of the first segment (211) away from the middle of the heating element.

8. The heat dissipation structure according to claim 5, characterized in that, It also includes two opposing support frames (400) that are bent to support at least partially suspended second part (302) and / or at least partially suspended third part (303), and fasteners (600) that are connected to the second part (302) or the third part (303) via the support frames (400) to adjust the pressure on the second part (302) or the third part (303). The support frames (400) are connected to the heat spreader (100) which has mounting grooves in which a portion of the heat pipe (210) is disposed.

9. The heat dissipation structure according to claim 2, characterized in that, It also includes a buffer (500) which is disposed on the periphery of the heating element and away from the heat spreader (100).

10. A circuit board assembly, characterized in that, It includes a heating element and a heat dissipation structure as described in any one of claims 1-9 connected to the heating element.

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