Circuit board assemblies and electronic devices

Abstract

This application discloses a circuit board assembly and an electronic device. The circuit board assembly includes: a circuit board, a first shielding cover, a second shielding cover, a first device, a second device, and a shielding assembly; wherein the first shielding cover, the second shielding cover, the first device, and the second device are all disposed on the circuit board; the second shielding cover is disposed outside the first device; the first shielding cover is disposed outside the second shielding cover and the second device, a gap is provided between the top wall of the first shielding cover and the top wall of the second shielding cover, the second shielding cover has an opening facing the side wall of the first shielding cover, the second device is located outside the second shielding cover and disposed opposite the side wall of the relative opening of the second shielding cover; the shielding assembly is disposed on the second shielding cover, and at least part of the shielding assembly is blocked between the gap and the second device.

Description

Technical Field

[0001] This application belongs to the field of electromagnetic shielding technology, specifically relating to a circuit board assembly and an electronic device. Background Technology

[0002] In related technologies, with the development of electronic devices, their functions are becoming increasingly powerful, and users have higher and higher requirements for them, such as better camera performance, thinner and lighter designs, and longer battery life. However, keeping electronic devices within a small size means that the area of ​​the printed circuit board (PCB) is limited. As the functions of electronic devices become more powerful, the number of components on the PCB also increases. To avoid electromagnetic interference, electromagnetic shielding structures are usually added. However, circuit board components occupy PCB area, and current electromagnetic shielding solutions cannot simultaneously reduce the area occupied by the electromagnetic shielding structure on the PCB while meeting electromagnetic shielding requirements. Summary of the Invention

[0003] This application aims to provide a circuit board assembly and electronic device that at least solves the problem that current electromagnetic shielding solutions cannot simultaneously reduce the area occupied by the electromagnetic shielding structure on the PCB while meeting electromagnetic shielding requirements.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application provide a circuit board assembly, comprising: a circuit board, a first shielding cover, a second shielding cover, a first device, a second device, and a shielding component; wherein, The first shielding cover, the second shielding cover, the first device, and the second device are all disposed on the circuit board; The second shielding cover is disposed over the first device; The first shielding cover is disposed outside the second shielding cover and the second device. A gap is provided between the top wall of the first shielding cover and the top wall of the second shielding cover. The second shielding cover has an opening facing the side wall of the first shielding cover. The second device is located outside the second shielding cover and is disposed opposite the side wall of the second shielding cover opposite the opening. The shielding component is disposed on the second shielding cover, and at least a portion of the shielding component is blocked between the gap and the second device.

[0005] Secondly, embodiments of this application provide an electronic device, including a housing and a circuit board assembly as described above, the circuit board assembly being disposed within the housing.

[0006] In the embodiments of this application, a first shielding cover is disposed outside the first shielding cover and the second device. The first shielding cover is disposed outside the first device, and the first shielding cover, the first device, and the second device are all disposed on a circuit board. This allows for electromagnetic isolation protection of the first and second devices through the first shielding cover, preventing electromagnetic interference from the first and second devices to devices outside the first shielding cover, and preventing electromagnetic interference from devices outside the first shielding cover to the first and second devices. The second shielding cover has an opening facing the side wall of the first shielding cover, which reduces the area occupied by the open side of the second shielding cover on the circuit board. The second device is disposed opposite the side wall of the second shielding cover away from the opening. A gap is provided between the top wall of the first shielding cover and the top wall of the second shielding cover. Since the shielding component is disposed on the second shielding cover and at least partially blocks the gap between the second device and the second device, the shielding component and the second shielding cover cooperate to isolate the first and second devices, effectively blocking the interference path from the second device to the first device, thereby ensuring the reliability of the first device's operation. Therefore, the circuit board assembly in the embodiments of this application can simultaneously reduce the area occupied by the electromagnetic shielding structure on the PCB while meeting the electromagnetic shielding requirements.

[0007] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0008] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a cross-sectional view of a circuit board assembly according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a first shielding member according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a second shielding cover according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a first shielding cover according to an embodiment of this application; Figure 5 This is a schematic diagram of the structure of another second shielding cover according to an embodiment of this application; Figure 6 This is a schematic diagram of the structure of a conductive connector according to an embodiment of this application; Figure 7 This is a schematic diagram of a second shielding cover and a second shielding member integrally formed according to an embodiment of this application; Figure 8 This is a schematic diagram of another first shielding cover according to an embodiment of this application; Figure 9This is a schematic diagram of the structure after both the first shielding cover and the second shielding cover are soldered to the circuit board according to an embodiment of this application; Figure 10 This is a schematic diagram of the structure of a third shielding member according to an embodiment of this application; Figure 11 This is a schematic diagram of the structure of a second shielding cover according to an embodiment of this application; Figure 12 This is a schematic diagram of another embodiment of the present application after both the first shielding cover and the second shielding cover are soldered to the circuit board.

[0009] Figure label: 10. First shielding cover; 13. Opening; 14. Top wall of the first shielding cover; 141. Extension; 142. Fourth snap-fit ​​part; 20. Circuit board; 21. First connection area; 22. Second connection area; 30. Conductive connectors; 40. Second shielding cover; 41. Top wall of the second shielding cover; 411. Connection area; 42. Side wall of the second shielding cover; 421. Second snap-fit ​​part; 43. Opening; 51. First shielding member; 511. Blocking part; 5111. First engaging part; 512. Connecting part; 5121. Third engaging part; 513. Abutting part; 52. Second shielding member; 53. Third shielding member; 60. First device; 70. Second device; 80. Gap. Detailed Implementation

[0010] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0011] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0013] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0014] The following is combined with Figures 1-12 This application describes circuit board assemblies and electronic devices according to embodiments of the present application.

[0015] like Figure 1 As shown, a circuit board assembly according to some embodiments of this application includes: a circuit board 20, a first shielding cover 10, a second shielding cover 40, a first device 60, a second device 70, and a shielding component; wherein, the first shielding cover 10, the second shielding cover 40, the first device 60, and the second device 70 are all disposed on the circuit board 20; the second shielding cover 40 covers the first device 60; the first shielding cover 10 covers the second shielding cover 40 and the second device 70, a gap 80 is provided between the top wall 14 of the first shielding cover and the top wall 41 of the second shielding cover, the second shielding cover 40 has an opening 43 facing the side wall of the first shielding cover 10, the second device 70 is located outside the second shielding cover 40 and disposed opposite the side wall of the opposite opening 43 of the second shielding cover 40; the shielding component is disposed on the second shielding cover 40, and at least part of the shielding component is blocked between the gap 80 and the second device 70.

[0016] In the embodiments of this application, a first shielding cover 10 is disposed outside the first shielding cover 10 and the second device 70, and the first shielding cover 10 is disposed outside the first device 60. The first shielding cover 10, the first device 60, and the second device 70 are all disposed on the circuit board 20. This allows for electromagnetic isolation protection of the first device 60 and the second device 70 through the first shielding cover 10, preventing electromagnetic interference from the first device 60 and the second device 70 to devices outside the first shielding cover 10, and preventing electromagnetic interference from devices outside the first shielding cover 10 to the first device 60 and the second device 70. The second shielding cover 40 has an opening 43 facing the sidewall of the first shielding cover 10, which reduces the area occupied by the opening 43 of the second shielding cover 40 on the circuit board 20. The second device 70 is located outside the second shielding cover 40 and on the side wall opposite the opening 43 of the second shielding cover 40. A gap 80 is provided between the top wall 14 of the first shielding cover and the top wall 41 of the second shielding cover. Since the shielding component is disposed on the second shielding cover 40 and at least partially blocks the gap 80 between the shielding component and the second shielding cover 40, the shielding component and the second shielding cover 40 cooperate to isolate the first device 60 and the second device 70, effectively blocking the interference path from the second device 70 to the first device 60, thereby ensuring the reliability of the first device 60. Therefore, the circuit board assembly in this embodiment can simultaneously reduce the area occupied by the electromagnetic shielding structure on the PCB while meeting the electromagnetic shielding requirements.

[0017] The circuit board assembly described in this application embodiment can construct a continuous closed barrier to block the propagation of electromagnetic fields and achieve internal and external isolation. The circuit board assembly includes a circuit board 20, which is a substrate inside the electronic device that carries chips, capacitors, resistors, radio frequency modules, and high-speed signal lines. Power lines, ground lines, high-frequency signal lines, radio frequency antennas, and other traces are arranged inside the circuit board 20. Components such as CPUs, main control chips, radio frequency modules, and baseband modules are typically soldered onto the circuit board 20.

[0018] Because the high-frequency chips and high-speed traces on the circuit board 20 radiate electromagnetic waves, interfering with surrounding circuits and affecting signal reception, or because external electromagnetic waves and interference signals can also enter the circuit board 20, causing problems such as system crashes, noise, and touch malfunctions. Therefore, in this embodiment, a first shielding cover 10 is provided, which covers the second shielding cover 40 and the second device 70, and the second shielding cover 40 covers the first device 60. This can isolate the first device 60 and the second device 70 through the first shielding cover 10, preventing external devices from generating electromagnetic interference to the first device 60 and the second device 70 inside the first shielding cover 10, and at the same time, preventing the first device 60 and the second device 70 from generating electromagnetic interference to external devices outside the first shielding cover 10.

[0019] In some embodiments, the first shielding cover 10 can be enclosed with the circuit board 20 to form a closed shielding space. In other embodiments, an opening 13 can be formed in the top wall of the first shielding cover 10, and a conductive connector 30 can be used to connect to and cover the opening 13 with the top wall 14 of the first shielding cover, so that the first shielding cover 10, the circuit board 20, and the conductive connector 30 can together enclose a closed shielding space. Figure 4 The illustration shows a first shielding cover 10 as a cuboid structure including a top wall and four side walls. An opening 13 is provided on the top wall, and the bottom of the first shielding cover 10 is hollowed out to form a through hole. In other embodiments of this application, the first shielding cover 10 includes more side walls that are sequentially connected to each other.

[0020] Specifically, by arranging the first device 60 and the second device 70, which require electromagnetic shielding, within the shielding space, the first device 60 and the second device 70 can be protected within the shielding space. This prevents the first device 60 and the second device 70 from generating electromagnetic interference to devices outside the shielding space, and also prevents devices outside the shielding space from generating electromagnetic interference to the first device 60 and the second device 70. This achieves the blocking of electromagnetic crosstalk between the inside and outside of the shielding space, ensuring the reliability of the operation of the first device 60 and the second device 70.

[0021] In some embodiments, the second shielding cover 40 is disposed outside the first device 60, and the first shielding cover 10 is disposed outside the second shielding cover 40, so that the second shielding cover 40 can be disposed within the shielding space. Since the second shielding cover 40 is first connected to the circuit board 20 during the assembly of the circuit board assembly, and then the first shielding cover 10 is disposed on the second shielding cover 40 and connected to the circuit board 20, a gap 80 is provided between the top wall 41 of the second shielding cover and the top wall 14 of the first shielding cover to prevent the second shielding cover 40 from interfering with the connection of the first shielding cover 10 to the circuit board 20.

[0022] In some embodiments of this application, in order to reduce the space occupied by the second shielding cover 40 on the circuit board, an opening 43 is often made in the second shielding cover 40, that is, part of the side wall is omitted. However, this can easily cause radiated signals from adjacent devices to enter the second shielding cover 40 through the opening 43. Therefore, it is necessary to use a shielding component to block the signal radiation path.

[0023] Furthermore, the second shielding cover 40 is connected to the circuit board 20. Since the second shielding cover 40 has an opening 43 facing the sidewall of the first shielding cover 10, and the second device 70 is located outside the second shielding cover 40 and positioned relative to the sidewall of the opening 43, the second shielding cover 40 can separate the first device 60 and the second device 70. The second shielding cover 40 can effectively block the interference path from the second device 70 to the first device 60. Simultaneously, a shielding component is disposed within the second shielding cover 40 and at least partially blocks the gap 80 between the second device 70 and the second device 70, further blocking the interference path from the second device 70 to the first device 60, thus preventing the electromagnetic interference signal generated by the second device 70 from propagating from the gap 80 into the second shielding cover 40. The shielding component, in conjunction with the second shielding cover 40, effectively blocks the interference path from the second device 70 to the first device 60, resulting in good electromagnetic shielding.

[0024] like Figure 3 and Figure 5 The illustration shows a second shielding cover 40, which is a cuboid shape including a top wall and three side walls. The thickened bottom edge represents the solder joints for welding the second shielding cover 40 to the circuit board 20. The three side walls of the second shielding cover 40 are welded to the circuit board 20. The side of the second shielding cover 40 with the opening 43 does not require welding to the circuit board 20, thus reducing the area occupied by the circuit board 20. The second device 70 is disposed relative to the side wall 42 of the second shielding cover, with the opening 43 and the second device 70 located on opposite sides of the side wall 42 of the second shielding cover.

[0025] Specifically, the three sidewalls of the second shield 40 are soldered to the circuit board 20 so that the second shield 40 and the circuit board 20 can form a shielding groove with the opening facing the sidewall of the first shield 10. The first device 60 can be located in the shielding groove. The second shield 40 and the first shield 10 are spaced apart to avoid the shielding groove being sealed, thereby avoiding cavity resonance, ensuring the safety of the first device, and also helping to ensure the reliability of the grounding of the second shield.

[0026] Specifically, the opening 43 on the side wall 42 of the second shield can be a circular hole, a polygonal hole, etc., which is not specifically limited in this embodiment.

[0027] In some embodiments, the portion of the circuit board 20 facing the shielded space is provided with a first connection area 21 for accommodating a first device 60 and a second connection area 22 for accommodating a second device 70. The first device 60 can be one of a CPU, a main control chip, an RF module, or a baseband module, and the second device 70 can be another of the same devices. In this embodiment, the first device 60 is an RF module and the second device 70 is a baseband module. Baseband modules typically have large power signals and high spectral noise on the power supply, which interferes with the RF receiving circuit. The RF module includes the signal transceiver circuit of the electronic device. If the interference path from the baseband module to the RF module is open, the RF module will be interfered with, leading to a decrease in the communication performance of the electronic device, or even failure. In this embodiment, since the second shielding cover 40 and the shielding component work together to effectively block the interference path from the second device 70 to the first device 60, by setting the radio frequency module in the first connection area 21 and the baseband module in the second connection area 22, the interference path transmitted from the baseband module to the radio frequency module can be effectively blocked, thereby effectively ensuring the reliability and stability of the radio frequency module's signal transmission and reception, which is beneficial to improving the communication performance of the radio frequency module.

[0028] In some embodiments, both the first device 60 and the second device 70 can be soldered to the circuit board 20. The first shielding cover 10 can be soldered to the circuit board 20 to achieve a ground connection, enabling the first shielding cover 10 to shield electromagnetic wave signals. The second shielding cover 40 can be soldered to the circuit board 20 to achieve a ground connection, enabling the second shielding cover 40 to shield electromagnetic wave signals. The shielding component is disposed on the second shielding cover 40, so that the shielding component and the second shielding cover 40 can form an integral shielding body, which can together shield electromagnetic wave signals.

[0029] In some embodiments, such as Figure 1 As shown, the opening of the shielding groove (i.e., the opening) is set towards the left side wall of the first shielding cover 10, the second device 70 is located on the right side of the second shielding cover 40, and part of the shielding component is blocked between the gap 80 and the second device 70, so that the second shielding cover 40 and the shielding component together can block the interference path transmitted by the second device 70 from right to left.

[0030] In some embodiments, the first shielding cover 10, the second shielding cover 40, and the shielding component can all be made of metal or other conductive materials. Specifically, the materials can be pure copper, copper alloy, stainless steel, or aluminum alloy, etc., to ensure the reliability and stability of shielding electromagnetic wave signals. The materials of the first shielding cover 10, the second shielding cover 40, and the shielding component can be the same, partially the same, or different, etc., and this application does not limit this.

[0031] In some embodiments, the shielding assembly may include a first shielding member 51, which may include a blocking portion 511 and two connecting portions 512. The blocking portion 511 may be separated between the gap 80 and the second device 70 and connected to the side wall 42 of the second shielding cover. The two connecting portions 512 are respectively connected to the two ends of the blocking portion 511 and are both connected to the first shielding cover 10. The two connecting portions 512 are respectively located on both sides of the second shielding cover 40.

[0032] In this embodiment, the first shielding member 51 may include two parts: a blocking part 511 and a connecting part 512. The blocking part 511 can block the interference path from the second device 70 to the first device 60 by cooperating with the second shielding cover 40. Alternatively, the blocking part 511 can be connected to the second shielding cover 40, and the connecting part 512 can be connected to the first shielding cover 10. The first shielding member 51 can act as a bridge between the second shielding cover 40 and the first shielding cover 10, connecting the first shielding cover 10 and the second shielding cover 40 into a single unit. This combination forms a shield, improving the reliability of blocking electromagnetic interference from the second device 70 to the first device 60, thereby ensuring the electromagnetic shielding effect.

[0033] In some embodiments, a portion of the blocking portion 511 may be opposite to and connected to the sidewall 42 of the second shield, and a portion of the blocking portion 511 may protrude from the top wall 41 of the second shield to block between the gap 80 and the second device 70. The blocking portion 511 may be connected to the sidewall of the second shield 40 opposite to the opening 43, or the blocking portion 511 may be connected to the sidewall of the second shield 40 adjacent to the opening 43.

[0034] In some embodiments, the blocking part 511 and the connecting part 512 can be integrally formed, or the blocking part 511 and the connecting part 512 can also be fixed by welding, snap-fitting or other methods. This application does not specifically limit this.

[0035] In some embodiments, two connecting portions 512 are respectively connected to the two ends of the blocking portion 511, so that the first shielding member 51 can be in a U-shaped structure.

[0036] In other embodiments, such as Figure 2As shown, the first shielding member 51 may further include an abutting portion 513, which may be connected to the blocking portion 511 and the two connecting portions 512 respectively, and the abutting portion 513 may be disposed opposite to the top wall 41 of the second shielding cover, so that the first shielding member 51 may cover at least a portion of the second shielding cover 40. The abutting portion 513 may abut against the top wall 41 of the second shielding cover, or the abutting portion 513 may be spaced apart from the top wall 41 of the second shielding cover.

[0037] In some alternative embodiments, the blocking portion 511 is provided with a first latching portion 5111 on the side facing the side wall 42 of the second shield, and the side wall 42 of the second shield is provided with a second latching portion 421, which latches with the first latching portion 5111; the connecting portion 512 is provided with a third latching portion 5121, and the first shield 10 is provided with an extension portion 141 opposite to the connecting portion 512. The extension portion 141 is located on the side of the top wall 14 of the first shield facing the circuit board 20, and the extension portion 141 is provided with a fourth latching portion 142, which latches with the third latching portion 5121.

[0038] In this embodiment, the second latching part 421 and the first latching part 5111 latch together, which can improve the reliability and convenience of latching and fixing the blocking part 511 and the second shielding cover 40. The fourth latching part 142 and the third latching part 5121 latch together, which can improve the reliability and convenience of latching and fixing the connecting part 512 and the first shielding cover 10.

[0039] In some embodiments, the second latching portion 421 and the first latching portion 5111 can be latched together by a snap-fit, a tongue-and-groove engagement, or a shaft hole engagement. Similarly, the fourth latching portion 142 and the third latching portion 5121 can be latched together by a snap-fit, a tongue-and-groove engagement, or a shaft hole engagement.

[0040] In some optional embodiments, one of the first latching portion 5111 and the second latching portion 421 is provided with a first limiting hole, and the other is provided with a first protrusion. The first protrusion is latched into the first limiting hole, so that the first latching portion 5111 and the second latching portion 421 are latched together by the cooperation of the protrusion and the limiting hole, which is relatively simple and convenient.

[0041] In some embodiments, the first latching portion 5111 is provided with a first protrusion, and the second latching portion 421 is provided with a first limiting hole. In other embodiments, the first latching portion 5111 is provided with a first limiting hole, and the second latching portion 421 is provided with a first protrusion.

[0042] like Figure 3 As shown, a row of first limiting holes is formed on the side wall 42 of the second shielding cover. Figure 2 The first shielding member 51 shown has a row of first protrusions on the blocking portion 511, with the first protrusions protruding towards the inner side of the blocking portion 511. For example... Figure 1 As shown, the first protrusion is engaged in the first limiting hole, which can engage the blocking part 511 with the side wall 42 of the second shielding cover. The blocking part 511 can also be used to block the first limiting hole to avoid magnetic leakage at the first limiting hole, effectively blocking the interference path from the second device 70 to the first device 60, thereby improving the shielding effect.

[0043] In some alternative embodiments, one of the first latching portion 5111 and the second latching portion 421 is provided with a first limiting groove, and the other is provided with a second protrusion. The second protrusion is latched into the first limiting groove, so that the first latching portion 5111 and the second latching portion 421 are latched together by the cooperation of the protrusion and the limiting groove, which is a relatively simple and convenient method.

[0044] In some embodiments, the first latching portion 5111 is provided with a second protrusion, and the second latching portion 421 is provided with a first limiting groove. In other embodiments, the first latching portion 5111 is provided with a first limiting groove, and the second latching portion 421 is provided with a second protrusion.

[0045] In some alternative embodiments, one of the third latching portion 5121 and the fourth latching portion 142 is provided with a second limiting hole, and the other is provided with a third protrusion. The third protrusion is latched into the second limiting hole, so that the third latching portion 5121 and the fourth latching portion 142 are latched together by the cooperation of the protrusion and the limiting hole, which is a relatively simple and convenient method.

[0046] In some embodiments, the third latching portion 5121 is provided with a third protrusion, and the fourth latching portion 142 is provided with a second limiting hole. In other embodiments, the third latching portion 5121 is provided with a second limiting hole, and the fourth latching portion 142 is provided with a third protrusion.

[0047] like Figure 2 As shown, both connecting portions 512 have a row of third protrusions, which protrude outwards from the connecting portion 512. Figure 4 As shown, the top wall 14 of the first shielding cover is bent downwards on the side facing the shielding cavity 11 to form two extensions 141, and a row of second limiting holes is formed on the extensions 141. Figure 1 As shown, by inserting the third protrusion into the second limiting hole, the connecting part 512 and the extension part 141 can be locked together and fixed, which is a convenient and reliable operation method.

[0048] In some alternative embodiments, one of the third latching portion 5121 and the fourth latching portion 142 is provided with a second limiting groove, and the other is provided with a fourth protrusion. The fourth protrusion is latched into the second limiting groove, so that the third latching portion 5121 and the fourth latching portion 142 can be latched together through the cooperation of the protrusion and the limiting groove. The implementation method is relatively simple and convenient.

[0049] In some embodiments, the third latching portion 5121 is provided with a fourth protrusion, and the fourth latching portion 142 is provided with a second limiting groove. In other embodiments, the third latching portion 5121 is provided with a second limiting groove, and the fourth latching portion 142 is provided with a fourth protrusion.

[0050] In some alternative embodiments, the shielding assembly further includes a second shielding member 52, which is disposed on the side of the top wall 41 of the second shielding cover away from the circuit board 20. The second shielding member 52 is separated between the gap 80 and the second device 70, and the second shielding member 52 protrudes along the top wall 41 of the second shielding cover in the direction away from the circuit board 20.

[0051] In this embodiment, the second shielding member 52 protrudes along the top wall 41 of the second shielding cover in a direction away from the circuit board 20, which can improve the reliability of the second shielding member 52 blocking the gap 80 and the second device 70, effectively prevent electromagnetic interference signals from propagating from the gap 80 into the second shielding cover 40, and ensure the reliability and stability of the first device 60 in transmitting and receiving signals.

[0052] In some embodiments, along the height direction of the first shielding cover 10, the height of the second shielding member 52 protruding along the top wall 41 of the second shielding cover in the direction away from the circuit board 20 can be higher than the height of the gap 80, so as to ensure that the second shielding member 52 effectively blocks the gap 80 and reduces the risk of magnetic leakage.

[0053] In some embodiments, the second shielding member 52 may be adhered to or welded to the top wall 41 of the second shielding cover.

[0054] In other embodiments, the second shielding member 52 can be integrally formed with the second shielding cover 40, which can improve the structural strength and structural reliability of the overall structure formed by the second shielding member 52 and the second shielding cover 40, and can reduce one step of assembling the second shielding member 52 and the second shielding cover 40.

[0055] Specifically, the second shielding member 52 can be a solid structure or a hollow structure, etc., and this application embodiment does not make specific limitations on this.

[0056] In some alternative embodiments, the shielding assembly includes a third shielding member 53, which is positioned between the gap 80 and the second device 70. The third shielding member 53 is disposed on the side of the top wall 41 of the second shield facing away from the circuit board 20. The third shielding member 53 is a conductive element.

[0057] In this embodiment, the third shielding member 53 is a conductive member, which can improve the electromagnetic shielding effect of the third shielding member 53 and facilitate the formation of an integral shielding body with the second shielding cover 40, thereby ensuring the reliability of blocking the interference path from the second device 70 to the first device 60.

[0058] In some embodiments, the height of the third shielding member 53 along the height direction of the first shielding cover 10 can be higher than the height of the gap 80, so that the third shielding member 53 can effectively block the gap 80, prevent the electromagnetic interference signal generated by the second device 70 from propagating from the gap 80 into the second shielding cover 40, and reduce the risk of magnetic leakage.

[0059] In some embodiments, the third shielding member 53 and the second shielding cover 40 can be manufactured separately and then assembled into one unit, which improves the ease of manufacturing the third shielding member 53 and reduces the manufacturing difficulty. The third shielding member 53 can be bonded or welded to the second shielding cover 40. In this case, the second shielding cover 40 can adopt an existing structure, which can avoid re-molding the second shielding cover 40 and reduce molding costs.

[0060] Specifically, the second shielding member 52 can be a solid structure or a hollow structure, etc., and this application embodiment does not make specific limitations on this.

[0061] In some alternative embodiments, the third shielding element 53 includes one of a conductive adhesive layer, conductive foam, or a metal component, which provides a wide range of options for the third shielding element 53 and a simple structure.

[0062] like Figure 10 and Figure 11 As shown, a conductive foam or metal component is added to the existing second shielding cover 40, or adhesive is applied to the top wall 41 of the second shielding cover to form a thicker conductive adhesive layer. Specifically, by rationally designing the dimensions of the third shielding component 53, after one end of the third shielding component 53 is fixed to the top wall 41 of the second shielding cover, the end of the third shielding component 53 facing away from the top wall 41 of the second shielding cover can be embedded in the opening 13. This ensures that the height of the third shielding component 53 is higher than the height of the gap 80, allowing the third shielding component 53 to effectively block the gap 80 and the second device 70.

[0063] In some alternative embodiments, the shielding component may include any one of the first shielding member 51, the second shielding member 52, and the third shielding member 53, so as to block the gap 80 and the second device 70 by any one of the first shielding member 51, the second shielding member 52, and the third shielding member 53, so as to fully block the gap 80 and cooperate with the second shielding cover 40 to effectively block the interference path from the second device 70 to the first device 60.

[0064] In some alternative embodiments, a portion of the second shielding cover 40 can be raised to obtain an integrally formed second shielding member 52, and a first shielding member 51 can be added. That is, the shielding assembly can simultaneously include the first shielding member 51 and the second shielding member 52. The first shielding member 51 and the second shielding member 52 cooperate to block the gap 80 and the second device 70, effectively blocking the interference path from the second device 70 to the first device 60. The second shielding member 52 is located between the abutment portion 513 and the top wall 41 of the second shielding cover.

[0065] In some alternative embodiments, a first shielding member 51 and a third shielding member 53 may be added to the existing second shielding cover 40, meaning the shielding assembly may include both the first shielding member 51 and the third shielding member 53. The first shielding member 51 and the third shielding member 53 cooperate to block the gap 80 and the second device 70, effectively blocking the gap 80, and cooperate with the second shielding cover 40 to effectively block the interference path from the second device 70 to the first device 60. The third shielding member 53 is located between the abutment portion 513 and the top wall 41 of the second shielding cover.

[0066] In some alternative embodiments, the shielding component may include both a second shielding member 52 and a third shielding member 53. The third shielding member 53 and the second shielding member 52 cooperate to block the gap 80 and the second device 70, thereby fully blocking the gap 80 and cooperating with the second shielding cover 40 to effectively block the interference path from the second device 70 to the first device 60.

[0067] In some alternative embodiments, the shielding assembly may simultaneously include a first shielding member 51, a second shielding member 52, and a third shielding member 53. The first shielding member 51, the second shielding member 52, and the third shielding member 53 cooperate to block the gap between the gap and the second device 70, effectively blocking the gap, and cooperate with the second shielding cover 40 to effectively block the interference path from the second device 70 to the first device 60. The second shielding member 52 and the third shielding member 53 are located between the abutment portion 513 and the top wall 41 of the second shielding cover.

[0068] In some alternative embodiments, the top wall 14 of the first shield is provided with an opening 13; at least a portion of the second shield 40 is disposed opposite the opening 13, and at least a portion of the second device 70 is disposed opposite the opening 13.

[0069] In this embodiment, at least a portion of the second shield 40 is disposed relative to the opening 13, and at least a portion of the second device 70 is disposed relative to the opening 13. During the assembly of the first shield 10 and the circuit board 20, it is convenient to observe the positions of the second shield 40 and the second device 70 through the opening 13, so as to improve the accuracy and efficiency of assembly.

[0070] In some alternative embodiments, the circuit board assembly further includes a conductive connector 30 connected to the side of the first shield 10 away from the circuit board 20 and covering the opening 13; the side of the shielding assembly away from the second shield 40 abuts against the conductive connector 30.

[0071] In this embodiment, the conductive connector 30 can be used to seal the opening 13 to ensure the sealing of the shielding space and improve the reliability of electromagnetic isolation protection for the first device 60 and the second device 70. The conductive connector 30 is connected to the first shielding cover 10 and can abut against the shielding component, so that the shielding component and the first shielding cover 10 can be connected into a whole through the conductive connector 30, so that the first shielding cover 10 and the second shielding cover 40 can be combined to form a shielding body with better shielding effect.

[0072] In some embodiments, the conductive connector 30 can be a metal foil or a metal plate, etc., so that the conductive connector 30 can be a flexible part or a rigid part, etc., which can improve the structural diversity of the conductive connector 30.

[0073] In some embodiments, when the conductive connector 30 is designed as a metal foil, the thickness of the conductive connector 30 can be further designed to be thinner, which is beneficial to reducing the Z-axis stacking size of the circuit board assembly.

[0074] In some embodiments, the conductive connector 30 and the first shielding cover 10 can be directly connected by snap-fit, or indirectly connected by conductive adhesive, so as to achieve a shielding connection, i.e., an equipotential connection, between the conductive connector 30 and the first shielding cover 10, so that the conductive connector 30 and the first shielding cover 10 are at the same potential and form a continuous conductive surface, which makes it easier to ensure that the conductive connector 30 and the first shielding cover 10 constitute a complete shield.

[0075] In some embodiments, the conductive connector 30 can be connected to the shielding component, specifically by direct contact connection via snap-fit ​​or indirect connection via conductive adhesive, so that the conductive connector 30 and the shielding component are shielded and connected, the conductive connector 30 and the shielding component are at the same potential and form a continuous conductive surface, and the conductive connector 30 and the shielding component constitute a complete shield.

[0076] Taking the shielding component including the first shielding member 51 as an example, the first shielding member 51 can be connected to the conductive connector 30 through the blocking part 511, or the first shielding member 51 can also be connected to the conductive connector 30 through the abutting part 513, so as to further increase the contact area between the first shielding member 51 and the conductive connector 30, improve the connection reliability, help reduce the leakage magnetic problem, and improve the communication performance of the first device 60.

[0077] Taking the shielding assembly including a second shielding member 52 or a third shielding member 53 as an example, the second shielding member 52 or the third shielding member 53 can protrude along the top wall 41 of the second shielding cover toward the conductive connector 30, and the side surface of the second shielding member 52 or the third shielding member 53 facing away from the top wall 41 of the second shielding cover can be connected to the conductive connector 30.

[0078] In some embodiments, the shielding component can be directly connected to the second shielding cover 40 by snap-fit ​​or indirectly connected by conductive adhesive, so that the first shielding cover 10 and the second shielding cover 40 are at the same potential and form a continuous conductive surface, and the first shielding cover 10 and the second shielding cover 40 constitute a complete shield.

[0079] In some embodiments, the conductive connector 30 and the shielding component work together to connect the first shielding cover 10 and the second shielding cover 40 into a whole, so that the first shielding cover 10 and the second shielding cover 40 can form a complete shielding body, which can not only block electromagnetic interference between the inside and outside of the shielding space, but also block electromagnetic interference between the first device 60 and the second device 70 disposed in the shielding space, resulting in a good shielding effect.

[0080] In some embodiments, the assembly process of the circuit board assembly may include: first, arranging a first device 60 in the first connection area 21 of the circuit board 20, and arranging a second device 70 in the second connection area 22; then assembling a second shielding cover 40 to connect the second shielding cover 40 to the circuit board 20; next, assembling a first shielding cover 10 to connect the first shielding cover 10 to the circuit board 20; and finally assembling a conductive connector 30 to connect the conductive connector 30 to the side of the first shielding cover 10 opposite to the circuit board 20. The connection between the shielding component and the second shielding cover 40 can be completed during the assembly of the second shielding cover 40, or the shielding component can be assembled to the second shielding cover 40 beforehand. The connection between the conductive connector 30 and the shielding component can be completed during the assembly of the conductive connector 30.

[0081] In some alternative embodiments, the projection of the shielding component toward the opening 13 may fall within the opening 13.

[0082] In this embodiment, the projection of the shielding component toward the opening 13 falls within the opening 13. During the assembly of the first shielding cover 10 and the circuit board 20, it is convenient to insert the end of the shielding component away from the second shielding cover 40 into the opening 13, thereby avoiding assembly interference between the shielding component and the first shielding cover 10.

[0083] In some embodiments, the shielding component may be positioned between the gap and the second device 70 along the length of the first shield 10. The shielding component may be spaced apart from the first shield 10 along its length or width, so that the projection of the shielding component toward the opening 13 falls within the opening 13.

[0084] In some embodiments, the width of the shielding component along the width direction of the first shield 10 may be less than or equal to the width of the opening 13, so that the projection of the shielding component toward the opening 13 can fall within the opening 13.

[0085] In some embodiments, the projection of the shielding component toward the top wall 41 of the second shield may fall on the top wall 41 of the second shield. Along the width direction of the first shield 10, the width of the shielding component may be less than or equal to the width of the second shield 40.

[0086] In some alternative embodiments, the surface of the shielding component facing away from the second shield 40 is flush with the surface of the first shield 10 facing away from the circuit board 20.

[0087] In this embodiment, the surface of the shielding component facing away from the second shielding cover 40 is flush with the surface of the first shielding cover 10 facing away from the circuit board 20. This improves the convenience of connecting the conductive connector 30 to the first shielding cover 10 and the shielding component simultaneously, and ensures the reliability of the connection.

[0088] like Figure 1 Taking the shielding component including the abutment portion 513 as an example, the abutment portion 513 is located inside the opening 13, and the upper surface of the abutment portion 513 is flush with the upper surface of the first shielding cover 10. When assembling the conductive connector 30, the conductive connector 30 can be connected to the upper surface of the first shielding cover 10 and the upper surface of the abutment portion 513 respectively. The abutment portion 513 of the shielding component is connected to the conductive connector 30, resulting in a large contact area and a better connection effect. This can further reduce the problem of magnetic leakage and is beneficial to improving the communication performance of the first device 60.

[0089] In some alternative embodiments, the surface of the shielding component facing away from the second shielding cover 40 may be recessed into the surface of the first shielding cover 10 facing away from the circuit board 20. In this case, more adhesive may be applied to the surface of the shielding component facing away from the second shielding cover 40 or to the area where the conductive connector 30 and the connecting part 512 are connected, so as to ensure good contact between the conductive connector 30 and the surface of the shielding component facing away from the second shielding cover 40 and the surface of the first shielding cover 10 facing away from the circuit board 20, thereby ensuring the reliability of the conductive connector 30, the first shielding cover 10, the shielding component and the second shielding cover 40 forming an integral shield.

[0090] Example 1 The shielding assembly includes a first shielding element 51, such as Figure 2 As shown, the first shielding member 51 includes a blocking portion 511, two connecting portions 512 connected to both ends of the blocking portion 511, and an abutting portion 513. The first shielding member 51 is disposed on the top wall 41 of the second shielding cover. The blocking portion 511 blocks the gap between the second device 70, and the blocking portion 511 is provided with a row of first protrusions protruding towards the side wall 42 of the second shielding cover. The side wall 42 of the second shielding cover has a row of first limiting holes. The connecting portion 512 is provided with a row of third protrusions protruding towards the extension portion 141, and the extension portion 141 is provided with a row of second limiting holes. During the assembly of the circuit board assembly, the first protrusions are engaged in the first limiting holes, which can realize the locking and fixing of the blocking portion 511 of the first shielding member 51 to the second shielding cover 40. The third protrusions are engaged in the second limiting holes, which can realize the locking and fixing of the connecting portion 512 of the first shielding member 51 to the first shielding cover 10. The first shielding member 51 can connect the first shielding cover 10 and the second shielding cover 40 into a whole.

[0091] The abutment portion 513 is at least partially embedded in the opening, and the upper surface of the abutment portion 513 is flush with the upper surface of the first shielding cover 10. For example... Figure 1 As shown, after the conductive copper foil is attached to the side of the first shielding cover 10 away from the circuit board 20, the conductive copper foil is bonded to the upper surface of the contact portion 513 and the upper surface of the first shielding cover 10. The conductive copper foil connects the first shielding cover 10 and the first shielding member 51 together, so that the first shielding cover 10 and the second shielding cover 40 can together form a complete shield, which can effectively block interference paths from inside to outside the shielding space, interference paths from outside to inside the shielding space, and interference paths from the second device 70 to the first device 60.

[0092] Example 2 The shielding assembly includes a second shielding element 52, such as Figure 7 As shown, a portion of the second shielding cover 40 is raised to form a second shielding member 52, making the second shielding member 52 integrally formed with the second shielding cover 40. Figure 8 As shown, the opening 13 on the first shielding cover 10 can be designed to be relatively large, allowing the end of the second shielding member 52 facing away from the second shielding cover 40 to be located within the opening 13. After both the first shielding cover 10 and the second shielding cover 40 are soldered to the circuit board 20, as shown... Figure 9 As shown, the surface of the second shielding member 52 facing away from the second shielding cover 40 is flush with the surface of the first shielding cover 10 facing away from the circuit board 20. Further, conductive copper foil is used to seal the opening 13 on the first shielding cover 10. After the conductive copper foil is attached, it can seal the opening 13 on the first shielding cover 10, and simultaneously adhere to the first shielding cover 10 and the second shielding member 52. This allows the conductive copper foil and the second shielding member 52 to connect the first shielding cover 10 and the second shielding cover 40 together. The first shielding cover 10 and the second shielding cover 40 together can form a complete shield, effectively blocking interference paths from inside to outside the shielding space, interference paths from outside to inside the shielding space, and interference paths from the second device 70 to the first device 60.

[0093] Example 3 The shielding assembly includes a third shielding element 53, which is conductive foam. Figure 10 and Figure 11 Conductive foam can be adhered to the connection area 411 on the top wall 41 of the second shielding cover. After both the first shielding cover 10 and the second shielding cover 40 are soldered to the circuit board 20, as... Figure 12 As shown, the upper surface of the conductive foam is flush with the upper surface of the first shielding cover 10. Further, a conductive copper foil is bonded to the upper surface of the first shielding cover 10 and the upper surface of the conductive foam. The conductive copper foil can seal the opening 13 on the first shielding cover 10, and it can also connect the first shielding cover 10 and the conductive foam together. The conductive copper foil and the conductive foam can connect the first shielding cover 10 and the second shielding cover 40 into a whole. The first shielding cover 10 and the second shielding cover 40 together form a complete shield, effectively blocking interference paths from inside to outside the shielding space, interference paths from outside to inside the shielding space, and interference paths from the second device 70 to the first device 60.

[0094] The circuit board assembly described in this application embodiment has at least the following advantages: In the embodiments of this application, a first shielding cover is disposed outside the first shielding cover and the second device. The first shielding cover is disposed outside the first device, and the first shielding cover, the first device, and the second device are all disposed on a circuit board. This allows the first shielding cover to provide electromagnetic isolation protection for the first and second devices, preventing the first and second devices from generating electromagnetic interference to the devices outside the first shielding cover, and preventing the devices outside the first shielding cover from generating electromagnetic interference to the first and second devices. The second shielding cover has an opening facing the side wall of the first shielding cover, which can reduce the area occupied by the open side of the second shielding cover on the circuit board. The second device is located outside the second shielding cover and disposed opposite the side wall of the relatively open side wall of the second shielding cover. A gap is provided between the top wall of the first shielding cover and the top wall of the second shielding cover. Since the shielding component is disposed on the second shielding cover and at least partially blocks the gap between the second device and the second device, the shielding component and the second shielding cover cooperate to isolate the first and second devices, effectively blocking the interference path from the second device to the first device, thereby ensuring the reliability of the first device's operation. Therefore, the circuit board assembly in the embodiments of this application can simultaneously reduce the area occupied by the electromagnetic shielding structure on the PCB while meeting the electromagnetic shielding requirements.

[0095] Secondly, this application also discloses an electronic device, which may include a housing and a circuit board assembly as described above.

[0096] The electronic devices described in this application are applicable to devices for designing circuit board assemblies, including but not limited to mobile phones, tablets, and watches.

[0097] Specifically, the housing is the exterior component of an electronic device, housing the circuit board assembly and protecting the circuit board assembly.

[0098] The electronic device described in this application embodiment has the same beneficial effects as the circuit board assembly described above, and will not be repeated here.

[0099] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0100] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that, include: Circuit board, first shielding cover, second shielding cover, first device, second device, shielding assembly; wherein, The first shielding cover, the second shielding cover, the first device, and the second device are all disposed on the circuit board; The second shielding cover is disposed over the first device; The first shielding cover is disposed outside the second shielding cover and the second device. A gap is provided between the top wall of the first shielding cover and the top wall of the second shielding cover. The second shielding cover has an opening facing the side wall of the first shielding cover. The second device is located outside the second shielding cover and is disposed opposite the side wall of the second shielding cover opposite the opening. The shielding component is disposed on the second shielding cover, and at least a portion of the shielding component is blocked between the gap and the second device.

2. The circuit board assembly according to claim 1, characterized in that, The shielding assembly includes a first shielding member, which includes a blocking portion and two connecting portions. The blocking portion is located between the gap and the second device and is connected to the side wall of the second shielding cover. The two connecting parts are respectively connected to both ends of the blocking part and are both connected to the first shielding cover. The two connecting parts are respectively located on both sides of the second shielding cover.

3. The circuit board assembly according to claim 2, characterized in that, The blocking part is provided with a first snap-fit ​​part on the side facing the side wall of the second shield, and the side wall of the second shield is provided with a second snap-fit ​​part, and the second snap-fit ​​part and the first snap-fit ​​part snap-fit ​​together. The connecting part is provided with a third snap-fit ​​part, and the first shielding cover is provided with an extension part opposite to the connecting part. The extension part is located on the side of the top wall of the first shielding cover facing the circuit board, and the extension part is provided with a fourth snap-fit ​​part. The fourth snap-fit ​​part and the third snap-fit ​​part snap-fit ​​together.

4. The circuit board assembly according to claim 3, characterized in that, One of the first and second latching portions is provided with a first limiting hole, and the other is provided with a first protrusion, the first protrusion being latched into the first limiting hole; or, One of the first and second latching portions is provided with a first limiting groove, and the other is provided with a second protrusion, the second protrusion being latched into the first limiting groove; or, One of the third and fourth engaging portions is provided with a second limiting hole, and the other is provided with a third protrusion, the third protrusion being engaged within the second limiting hole; or... One of the third and fourth locking portions is provided with a second limiting groove, and the other is provided with a fourth protrusion, the fourth protrusion being locked into the second limiting groove.

5. The circuit board assembly according to claim 1, characterized in that, The shielding assembly includes a second shielding member disposed on the side of the top wall of the second shielding cover away from the circuit board. The second shielding member blocks the gap between the second device and the second shielding cover, and the second shielding member protrudes along the top wall of the second shielding cover in a direction away from the circuit board.

6. The circuit board assembly according to claim 1, characterized in that, The shielding assembly includes a third shielding member that blocks the gap and the second device, and the third shielding member is disposed on the side of the top wall of the second shielding cover opposite to the circuit board. The third shielding element is a conductive element.

7. The circuit board assembly according to any one of claims 1-6, characterized in that, The top wall of the first shielding cover has an opening; at least a portion of the second shielding cover is disposed opposite the opening, and at least a portion of the second device is disposed opposite the opening.

8. The circuit board assembly according to claim 7, characterized in that, The circuit board assembly further includes a conductive connector, which is connected to the side of the first shield away from the circuit board and covers the opening. The shielding component abuts against the conductive connector on the side facing away from the second shield.

9. The circuit board assembly according to claim 7, characterized in that, The projection of the shielding component toward the opening falls within the opening.

10. An electronic device, characterized in that, It includes a housing and a circuit board assembly as described in any one of claims 1-9, the circuit board assembly being disposed within the housing.

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