An LED flat-leg packaging bracket and its manufacturing method

Abstract

This invention discloses an LED flat-leg packaging bracket and its manufacturing method, relating to the field of packaging technology. It includes several bracket units and a frame for fixing the bracket units. The bracket units are arranged in a matrix within the frame, with intervals between them. Through the matrix-closed arrangement of the bracket units and the complete embedding of the second welding area into the insulating substrate, with the end of the second welding area flush with the sidewall of the insulating substrate and without any protruding structure, the horizontal projection area of ​​a single bracket and the spacing between adjacent brackets are significantly reduced. The number of brackets integrated per unit area is effectively increased compared to traditional "C"-shaped brackets. Simultaneously, the manufacturing method uses insert injection molding, which automatically arranges the bracket units in a matrix within the frame, eliminating the need for subsequent splicing. This further improves raw material utilization and production efficiency, perfectly meeting the miniaturization and high-density integration requirements of electronic products.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and specifically to an LED flat-leg packaging bracket and its manufacturing method. Background Technology

[0002] In the fields of electronic packaging and microelectronic interconnection, with the increasing trend of product miniaturization and high-density integration, the requirements for welding processes are also becoming more stringent. Currently, most existing packaging brackets use a "C"-shaped lead, which necessitates extended solder leads, resulting in large spacing between individual LEDs and a small number of units per unit. Furthermore, the subsequent processes for the lead structure have high requirements for the folding dimensions, which not only reduces production efficiency and increases manufacturing costs but also easily leads to breakage failures and uneven welding due to insufficient folding precision and excessive lead extension, severely affecting the stability and lifespan of LED packaged products. In addition, existing packaging brackets still have room for improvement in terms of luminous efficacy, anti-interference performance, and board flatness. Some flat-lead bracket designs suffer from insufficient cup protection, unreasonable pin-cup fit, and low brightness utilization, failing to fully meet the current application requirements of LED products in terms of thinness, high density, high reliability, and high brightness.

[0003] To address the aforementioned drawbacks of C-shaped lead packaging, flat-lead packaging brackets are gradually being applied in the LED packaging field. Various improved solutions for flat-lead packaging brackets and manufacturing processes have also been proposed in related technical fields. The following solutions are disclosed in the existing technology:

[0004] 1) Announcement No. CN223844176U specifically discloses a back pin structure for a flat-footed indoor LED bracket, comprising: a substrate, with a cup-shaped body on one side of the substrate; and a pin structure disposed on the other side of the substrate, the pin structure including a common pin and three control pins, the pin structure being flush with the bottom surface of the substrate. This utility model greatly saves space by making the pin structure flush with the bottom of the substrate 1 and adopting a folding design, making the entire device more compact and easy to install and integrate into various devices, especially in space-constrained application scenarios. At the same time, the folded part of the pin structure extends to the outside of the substrate, allowing the pins to be unfolded when needed, increasing the product's flexibility and adaptability to different application scenarios, and meeting diverse usage needs.

[0005] 2) Publication No. CN119635969A discloses a mold, an LED bracket preform, an LED bracket, and an LED bracket manufacturing process. Multiple side grooves extend outward from the hollowed-out area of ​​the strip. The mold core contains several positioning protrusions located in the side grooves. By combining multiple positioning protrusions and abutting against one side of the side groove, a fixing mechanism for positioning the strip is formed. A flow channel for injection fluid is reserved between the positioning protrusions and the inside of the side groove. The central area of ​​the hollowed-out area corresponds to the injection port of the injection molding machine. The positioning protrusions located in the side grooves extending outward from the hollowed-out area can reduce the impact of the injection fluid. This delays the contact time between the injection fluid and the positioning protrusions, extending the collision stroke between the injection fluid and the positioning protrusions. This allows the injection fluid to contact the positioning protrusions only after its flow rate slows down, significantly reducing the impact force generated by the injection fluid on the positioning protrusions and minimizing damage.

[0006] The two existing technologies mentioned above have explored the optimization direction of flat-pin packaging brackets and manufacturing processes from different perspectives, and indeed represent important progress in this field, providing useful inspiration for this invention. However, they still have common limitations. Specifically, the pins of CN223844176U adopt a folded design with the folded part extending outward, requiring space to be reserved for unfolding, resulting in a large horizontal projection area of ​​a single bracket, making it difficult to reduce the spacing between adjacent brackets and limiting integration density; at the same time, there is no mechanical interlocking structure between the pins and the substrate, relying only on attachment for fixation, resulting in poor bonding stability, and the cup body does not have an optimized inner wall reflection structure and protective design, so the optical performance needs to be improved, making it difficult to fully utilize the inherent advantages of the flat-pin structure; the manufacturing process of CN119635969A includes a pin cutting and bending process, which is cumbersome, not only posing a risk of copper shavings short circuits, but also easily causing pin breakage due to insufficient bending precision, and production efficiency and product qualification rate need to be improved. In summary, existing flat-leg LED packaging brackets and manufacturing processes still have significant room for improvement in terms of high-density integration, structural stability, optical performance, process simplification, and cost control. Therefore, developing an LED flat-leg LED packaging bracket and its manufacturing method that can achieve high-density arrangement, high reliability, high brightness, simple manufacturing process, and controllable cost has become an urgent technical problem to be solved in this field. Summary of the Invention

[0007] The purpose of this invention is to provide an LED flat-leg packaging bracket and its manufacturing method, so as to solve the problem of low integration of the existing flat-leg packaging bracket and manufacturing process.

[0008] To achieve the above objectives, the present invention provides the following technical solution: an LED flat-leg packaging bracket, comprising a plurality of bracket units and a frame for fixing the bracket units; the plurality of bracket units are arranged in a matrix within the frame, and the bracket units are spaced apart from each other;

[0009] Each support unit includes an insulating substrate, a reflective cup, and several pins;

[0010] The insulating substrate has a top surface and a bottom surface that are disposed opposite to each other;

[0011] The reflective cup is integrally injection molded with the top surface of the insulating substrate and is used to house the LED chip;

[0012] The pin is embedded in the insulating substrate, and its bottom surface is coplanar with the bottom surface of the insulating substrate to form a flat-footed welding surface. The pin includes a first functional area located at the bottom of the reflector cup and a second welding area extending outward from the first functional area and embedded in the insulating substrate. The first functional area is exposed at the bottom of the reflector cup, and its exposed surface is provided with a metal plating layer. The metal plating layer is used for die bonding and gold wire bonding of the LED chip. The end side of the second welding area is flush with the sidewall of the insulating substrate.

[0013] Furthermore, the inner wall of the reflective cup is funnel-shaped, gradually narrowing from the rim to the bottom.

[0014] Furthermore, an annular flange extending outwards is integrally formed on the outer edge of the cup mouth of the reflector cup. The annular flange covers part of the top surface of the insulating substrate, which is used to enhance the structural strength of the cup mouth and form an outer protection for the LED chip.

[0015] Furthermore, the pin is made of copper alloy, and the portion of it embedded in the insulating substrate has an anchoring structure, which is a through hole, a blind hole, or a barbed protrusion, used to enhance the bonding strength between the pin and the insulating substrate.

[0016] Furthermore, the bottom surface of the insulating substrate, corresponding to the area of ​​the second welding zone, is provided with a roughened texture. The roughened texture consists of staggered microgrooves or dot-like protrusions, which are used to improve the welding firmness between the bracket and the PCB board.

[0017] A method for manufacturing an LED flat-leg package bracket, for manufacturing the LED flat-leg package bracket according to any one of claims 1-6, comprising the following steps:

[0018] S1: Pin frame fabrication: Provide metal strip and fabricate a pin frame containing multiple arrayed pin units through a stamping process. Each pin unit includes a first functional area and a second soldering area connected by connecting ribs, and a metal plating layer for die bonding and gold wire bonding of LED chips is formed on the surface of the first functional area.

[0019] S2: Insert injection molding: The pin frame is placed in an injection mold, and engineering plastic is injected for insert injection molding to form an insulating substrate, a reflective cup, and a frame for fixing the support unit that encloses the pin frame; wherein, the bottom surface of the second welding area and the upper surface of the first functional area are not covered by engineering plastic, and after injection molding, several support units are arranged in a matrix and closely within the frame.

[0020] S3: Bottom surface grinding: The bottom surface of the injection-molded sheet product is precisely ground to make the bottom surface of the pin flush with the bottom surface of the insulating substrate, forming a flat welding surface.

[0021] S4: Segmentation: The polished sheet products are cut and separated to remove the connecting structure between the frame and the bracket unit, forming individual LED flat-foot package bracket finished products.

[0022] Furthermore, in step S1, during stamping, anchoring holes are simultaneously formed in the second welding area; in step S2, the injection-molded engineering plastic melt fills the anchoring holes, forming a mechanical interlock between the pin and the insulating substrate, thereby enhancing the bonding strength between the two.

[0023] Compared with the prior art, the LED flat-leg packaging bracket and its manufacturing method provided by the present invention have the following specific advantages:

[0024] 1. This invention features a matrix-like, tightly arranged bracket unit and a second welding area that is fully embedded in the insulating substrate. The end of the second welding area is flush with the sidewall of the insulating substrate, with no protruding structure. This significantly reduces the horizontal projection area of ​​a single bracket and the spacing between adjacent brackets, effectively increasing the number of brackets integrated per unit area compared to traditional "C"-shaped brackets. Simultaneously, the manufacturing method uses one-piece injection molding of inserts, which automatically arranges the bracket units in a matrix within the frame, eliminating the need for subsequent splicing. This further improves the utilization rate of raw materials and production efficiency, perfectly meeting the miniaturization and high-density integration requirements of electronic products.

[0025] 2. This invention employs a flat-foot structure with anchoring structures such as through holes, blind holes, or barbed protrusions in the part where the pin is embedded in the insulating substrate. During manufacturing, the anchoring holes are filled with injection molten metal to form a mechanical interlock. The bonding strength between the pin and the insulating substrate is improved compared to flat-foot brackets without anchoring structures, effectively preventing the pin from loosening or falling off and significantly extending the product's service life. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0027] Figure 1 This is a schematic diagram of the overall structure provided for an embodiment of the present invention;

[0028] Figure 2 A schematic diagram of the support unit is provided for an embodiment of the present invention;

[0029] Figure 3 A top view provided for an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of the bottom surface provided in an embodiment of the present invention;

[0031] Figure 5 This is a cross-sectional view provided for an embodiment of the present invention.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Support unit; 101. Insulating substrate; 102. Reflector cup; 103. Pin; 1031. First functional area; 1032. Second welding area; 2. Frame. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0035] As attached Figure 1 To be continued Figure 5 As shown:

[0036] Example 1:

[0037] The present invention provides an LED flat-leg packaging bracket, comprising a plurality of bracket units 1 and a frame 2 for fixing the bracket units 1; the plurality of bracket units 1 are arranged in a matrix within the frame 2, and the bracket units 1 are spaced apart. This design not only facilitates continuous manufacturing, electroplating and processing in the production process, but also helps to increase the packaging density per unit area and achieve efficient miniaturized integration.

[0038] Each support unit 1 includes an insulating substrate 101, a reflector cup 102, and several pins 103;

[0039] The insulating substrate 101 is made of engineering plastic with high temperature resistance and excellent electrical insulation properties, and has a top surface and a bottom surface that are arranged opposite to each other;

[0040] The reflective cup 102 is integrally injection molded with the top surface of the insulating substrate 101 to accommodate the LED chip. Its cup structure provides die bonding and protection space for the LED chip.

[0041] The pin 103 is embedded in the insulating substrate 101, and its bottom surface is coplanar with the bottom surface of the insulating substrate 101 to form a flat-foot soldering surface. The pin 103 includes a first functional area 1031 located at the bottom of the reflector cup 102 and a second soldering area 1032 extending outward from the first functional area 1031 and embedded in the insulating substrate 101. The first functional area 1031 is exposed at the bottom of the reflector cup 102, and its exposed surface is provided with a metal plating layer. The metal plating layer is used for die bonding and gold wire bonding of the LED chip. The end side of the second soldering area 1032 is flush with the side wall of the insulating substrate 101.

[0042] In one embodiment of the present invention, the inner wall of the reflector cup 102 is in the shape of a trumpet that gradually narrows from the mouth to the bottom, which is used to improve the light extraction efficiency and light uniformity of the LED chip.

[0043] In one embodiment of the present invention, an annular flange extending outward is integrally formed on the outer edge of the mouth of the reflector cup 102. The annular flange covers the top surface of part of the insulating substrate 101 to enhance the structural strength of the mouth of the reflector cup 102 and to form an outer protection for the LED chip.

[0044] In one embodiment of the present invention, the pin 103 is made of copper alloy, and the part of it embedded in the insulating substrate 101 is provided with an anchoring structure. The anchoring structure is a through hole, a blind hole or a barbed protrusion. The plastic filling during injection molding forms a mechanical interlock to enhance the bonding strength between the pin 103 and the insulating substrate 101.

[0045] In one embodiment of the present invention, the bottom surface of the insulating substrate 101, corresponding to the area of ​​the second welding area 1032, is provided with a roughened texture. The roughened texture consists of staggered microgrooves or dot-like protrusions, which are used to improve the welding firmness between the bracket and the PCB board.

[0046] Working principle: The LED chip is placed inside the reflector cup 102 and bonded to the metal plating surface of the first functional area 1031 through a die bonding process, thereby mechanically fixing the chip to the pin 103; then, through a gold wire bonding process, the electrodes of the chip are connected to the corresponding pin 103 in the first functional area 1031 to form an electrical conduction circuit; the horn-shaped inner wall of the reflector cup 102 reflects and converges the light emitted by the chip and then conducts it outward, while the annular flange serves as a protective and anti-overflow adhesive function;

[0047] During the mounting process, the bracket precisely aligns with the PCB board's pads via its flat soldering surface. After reflow soldering, solder fills the roughened texture of the insulating substrate 101, forming a robust solder connection and enabling electrical conduction between pin 103 and the PCB board. Throughout the entire process, all components work together to ensure normal LED chip illumination, stable signal transmission, and reliable bracket fixation.

[0048] Example 2:

[0049] This embodiment is basically the same as the previous embodiment, except that a method for manufacturing an LED flat-leg packaging bracket includes the following steps:

[0050] S1: Pin frame fabrication: Provide metal strip and fabricate a pin frame containing multiple arrayed pin units through a stamping process. Each pin unit includes a first functional area 1031 and a second soldering area 1032 connected by connecting ribs, and a metal plating layer for die bonding and gold wire bonding of LED chips is formed on the surface of the first functional area 1031.

[0051] S2: Insert injection molding: The pin frame is placed in the injection mold, and engineering plastic is injected for insert injection molding to form an insulating substrate 101, a reflective cup 102, and a frame 2 for fixing the support unit 1, which are integrally formed to enclose the pin frame; wherein, the bottom surface of the second welding area 1032 and the upper surface of the first functional area 1031 are not covered by engineering plastic, and after injection molding, several support units 1 are arranged in a matrix and closely within the frame 2;

[0052] S3: Bottom surface grinding: The bottom surface of the injection-molded sheet product is precisely ground to make the bottom surface of the pin 103 flush with the bottom surface of the insulating substrate 101, forming a flat welding surface.

[0053] S4: Segmentation: Cut and separate the polished continuous product, remove the connecting structure between frame 2 and bracket unit 1, and form a single LED flat-foot package bracket finished product.

[0054] In one embodiment of the present invention, in step S1, during stamping, anchoring holes are simultaneously formed in the second welding area 1032; in step S2, the injection-molded engineering plastic melt fills into the anchoring holes, forming a mechanical interlock between the pin 103 and the insulating substrate 101, thereby enhancing the bonding strength between the two.

[0055] In conjunction with Embodiments 1 and 2 above, this invention also provides a specific manufacturing process, which, by combining process parameters, equipment selection, and quality control, ensures stable product performance and scalable production. The specific implementation is as follows:

[0056] 1. Pin frame fabrication (S1)

[0057] 1.1 Material Preparation:

[0058] Specific specifications of copper alloy strip (such as C194, KFC) are selected, with a thickness typically ranging from 0.15 mm to 0.25 mm. This material must possess excellent electrical conductivity (≥85% IACS), moderate tensile strength (≥350 MPa), and good elongation to ensure stamping formability and subsequent mechanical strength.

[0059] 1.2 Stamping Forming:

[0060] Equipment: High-speed precision progressive press, combined with multi-station progressive dies.

[0061] Process parameters: The stamping speed can be set to 200-400 times / minute, and the die clearance is controlled to be 8%-12% of the material thickness.

[0062] Process: The tape enters the mold through the feeding device and completes punching, blanking, stretching, and shaping processes in sequence to form a continuous pin frame containing multiple pin units arranged in an array.

[0063] The key control points are:

[0064] Pin unit consistency: The relative positional accuracy of the first functional area 1031 and the second soldering area 1032 in each pin unit must be within ±0.02mm.

[0065] Anchor hole forming: When stamping the second welding zone 1032, simultaneously punch out through holes or blind holes with a diameter of 0.1mm-0.3mm as anchor structures. The edges of the holes must be smooth and burr-free.

[0066] Connecting rib strength: The small connecting ribs that connect each pin unit need to have sufficient strength to maintain the integrity of the frame, and also need to be easy to cut during subsequent segmentation.

[0067] 1.3 Electroplating treatment:

[0068] Equipment: Fully automated selective electroplating line.

[0069] Process: The stamped continuous lead frame undergoes pretreatment such as degreasing, pickling, and activation. Subsequently, selective electroplating is performed on the upper surface and surrounding area of ​​the first functional area 1031. A typical plating sequence is: pre-plating nickel (approximately 1-2 μm thick, to enhance adhesion and barrier properties) → main silver plating (approximately 3-5 μm thick, to provide high reflectivity and excellent bonding / die-bonding interface).

[0070] Quality control: The thickness and composition of the coating are inspected online using an X-ray fluorescence thickness gauge (XRF) to ensure that the silver plating layer is uniform in thickness and free from impurities.

[0071] 2. Insert injection molding (S2)

[0072] 2.1 Molds and Equipment:

[0073] Equipment: High-precision injection molding machine (clamping force is selected according to the number of components, usually 50-150 tons), with insert injection molds with precision positioning system.

[0074] Mold design considerations: The cavity must accurately replicate all features of the insulating substrate 101, the reflective cup 102 (including the flared inner wall and annular flange), the outer frame 2, and the roughened texture of the bottom surface. A precise insert positioning mechanism and ejection system are required.

[0075] 2.2 Injection Molding Process:

[0076] Materials: High reflectivity, high temperature resistance (>260℃), and low moisture absorption white engineering plastics are selected, such as high temperature nylon (PPA) or polycyclohexanediol terephthalate (PCT).

[0077] Process parameters (example): Barrel temperature 280-320℃, mold temperature 120-150℃, injection pressure 80-120MPa, holding pressure 60-80MPa, cooling time 8-15 seconds.

[0078] Process control:

[0079] Insert placement: The electroplated pin frame is precisely placed into the lower mold of the mold by a robotic arm, ensuring that the bottom surface of the second soldering area 1032 of the pin is in close contact with the lower mold surface.

[0080] Injection and filling: Molten plastic is injected. The molten plastic will envelop all metal parts except the bottom surface of the second welding area 1032 and the upper surface of the first functional area 1031, and completely fill all anchor holes to form a mechanical interlock.

[0081] Molding and holding pressure: Ensure that the plastic is fully filled into the fine structure of the reflective cup 102 (such as the annular flange at the cup mouth) and hold pressure to reduce shrinkage deformation.

[0082] Ejection after mold opening: After cooling, the mold is opened, and the formed continuous product is ejected. At this time, the functional area and soldering area of ​​the pins are exposed as designed, and multiple support units 1 are connected into a whole by the frame 2.

[0083] 3. Bottom surface grinding (S3)

[0084] 3.1 Equipment and Processes:

[0085] Equipment: Double-sided or single-sided precision surface grinding machine, using diamond grinding discs.

[0086] Objective: To remove overflow that may occur during the injection molding process and to ensure that the bottom surface of the second solder area 1032 of all pins has a very high degree of coplanarity with the plastic bottom surface of the insulating substrate 101.

[0087] Process parameters: The grinding amount is usually controlled between 0.02mm and 0.05mm (single-sided). After grinding, the coplanarity requirement between the bottom surface of the lead and the bottom surface of the plastic is usually ≤0.02mm.

[0088] Quality control: Use a laser coplanarity tester or a high-precision flatness measuring instrument for full inspection or high-frequency sampling inspection.

[0089] 4. Segmentation (S4)

[0090] 4.1 Equipment and Processes:

[0091] Equipment: High-precision laser cutting machine or precision high-speed punch press.

[0092] Process:

[0093] For laser cutting, ultraviolet or green laser is used, with the power adjusted according to the plastic material and thickness, and the focused spot diameter is approximately 20-40 μm. The cutting path follows the center of the connecting ribs between frame 2 and each support unit 1.

[0094] For punching, use a precision blanking die.

[0095] Result: After removing the connecting material between the outer frame 2 and the unit, a single independent LED flat-leg package bracket was obtained. Because the lead sidewalls are flush with the substrate sidewalls, the cut surface is neat and there are no exposed metal burrs.

[0096] Post-processing and packaging: After being cut, the products are ultrasonically cleaned to remove dust, and then inspected for appearance (AOI automated optical inspection) and electrical performance (continuity test). Qualified products are packed into anti-static carrier tapes or trays in standard quantities, and wound into reels for easy access by automated placement equipment.

[0097] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An LED flat-leg packaging bracket, characterized in that, It includes several support units (1) and a frame (2) for fixing the support units (1); the several support units (1) are arranged in a matrix in the frame (2) and are spaced apart from each other; Each of the support units (1) includes an insulating substrate (101), a reflector cup (102), and several pins (103). The insulating substrate (101) has a top surface and a bottom surface disposed opposite to each other; The reflective cup (102) is integrally injection molded with the top surface of the insulating substrate (101) and is used to accommodate the LED chip; The pin (103) is embedded in the insulating substrate (101), and its bottom surface is coplanar with the bottom surface of the insulating substrate (101) to form a flat-foot welding surface. The pin (103) includes a first functional area (1031) located at the bottom of the reflector cup (102) and a second welding area (1032) extending outward from the first functional area (1031) and embedded in the insulating substrate (101). The first functional area (1031) is exposed at the bottom of the reflector cup (102), and its exposed surface is provided with a metal plating layer. The metal plating layer is used for die bonding and gold wire bonding of LED chips. The end side of the second welding area (1032) is flush with the side wall of the insulating substrate (101).

2. The LED flat-leg packaging bracket according to claim 1, characterized in that, The inner wall of the reflective cup (102) is flared, gradually narrowing from the mouth to the bottom.

3. The LED flat-leg packaging bracket according to claim 2, characterized in that, The outer edge of the cup mouth of the reflective cup (102) is integrally formed with an annular flange extending in all directions, and the annular flange covers part of the top surface of the insulating substrate (101).

4. The LED flat-leg packaging bracket according to claim 1, characterized in that, The pin (103) is made of copper alloy and the part of it embedded in the insulating substrate (101) is provided with an anchoring structure, which is a through hole, a blind hole or a barbed protrusion.

5. The LED flat-leg packaging bracket according to claim 1, characterized in that, The bottom surface of the insulating substrate (101) is provided with a roughened texture corresponding to the area of ​​the second welding area (1032). The roughened texture consists of staggered microgrooves or dot-like protrusions.

6. A method for manufacturing an LED flat-leg package bracket, characterized in that, The method for manufacturing the LED flat-leg package bracket according to any one of claims 1-6 includes the following steps: S1: Pin frame fabrication: Provide metal strip and fabricate a pin frame containing multiple arrayed pin units by stamping process. Each pin unit includes a first functional area (1031) and a second soldering area (1032) connected by connecting ribs. A metal plating layer for die bonding and gold wire bonding of LED chips is formed on the surface of the first functional area (1031). S2: Insert injection molding: The pin frame is placed in an injection mold, and engineering plastic is injected for insert injection molding to form an insulating substrate (101), a reflective cup (102), and a frame (2) for fixing the support unit (1) that wraps the pin frame; wherein, the bottom surface of the second welding area (1032) and the upper surface of the first functional area (1031) are not covered by engineering plastic, and after injection molding, several support units (1) are arranged in a matrix and closely arranged in the frame (2); S3: Bottom surface grinding: The bottom surface of the injection-molded sheet product is precisely ground so that the bottom surface of the pin (103) is flush with the bottom surface of the insulating substrate (101) to form a flat foot welding surface. S4: Segmentation: Cut and separate the polished continuous product, remove the connection structure between the frame (2) and the bracket unit (1) to form a single LED flat-foot package bracket finished product.

7. The manufacturing method according to claim 6, characterized in that, In step S1, during stamping, anchoring holes are simultaneously formed in the second welding area (1032); in step S2, the injection-molded engineering plastic melt fills the anchoring holes to form a mechanical interlock between the pin (103) and the insulating substrate (101), thereby enhancing the bonding strength between the two.

Images