Array substrate, display panel and electronic equipment

Abstract

This application provides an array substrate, a display panel, and an electronic device. The array substrate includes a driving circuit layer and a bonding electrode layer. The bonding electrode layer includes multiple bonding sets, each bonding set including three first bonding groups, and each first bonding group including three bonding positions for bonding light-emitting devices of different colors. Three bonding positions in adjacent bonding sets for bonding light-emitting devices of the same color form a second bonding group. A repair position is provided within the area enclosed by the three bonding positions in the second bonding group. There is a first distance between two bonding positions belonging to different bonding sets in the second bonding group, and a second distance between two adjacent bonding positions in the same bonding set for bonding light-emitting devices of the same color. The first distance and the second distance are different. The above structure ensures that when using the repair position, the distance between other light-emitting devices in the same pixel and the light-emitting device of the repair position is appropriate, thereby ensuring the uniformity of the display effect of the display panel after repair.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to an array substrate, a display panel, and an electronic device. Background Technology

[0002] In Micro-LED display technology, defect repair of light-emitting devices is a crucial process for reducing manufacturing defects. When one light-emitting device fails, a repaired device replaces it. However, existing repair bit placement methods lead to a decrease in the pixel density of the display panel, and the display uniformity of the panel is somewhat affected after repair. Summary of the Invention

[0003] In order to overcome the technical problems mentioned in the above technical background, this application provides an array substrate.

[0004] In a first aspect of this application, the array substrate includes:

[0005] Drive circuit layer;

[0006] A bonding electrode layer is located on one side of the driving circuit layer. The bonding electrode layer includes multiple bonding sets, each bonding set includes three first bonding groups, and each first bonding group includes three bonding positions for bonding different color light-emitting devices.

[0007] Three bonding positions in adjacent bonding sets used to bond the same color light-emitting device form a second bonding group, and a repair position is provided in the area enclosed by the three bonding positions in the second bonding group;

[0008] In the second binding group, there is a first distance between two binding positions belonging to different binding sets, and a second distance between two adjacent binding positions in the same binding set used to bind the same color light-emitting device. The first distance is different from the second distance.

[0009] In one possible implementation of this application, the first distance is greater than the second distance;

[0010] Each of the bonding bits includes a first bonding electrode and a second bonding electrode, the first bonding electrode and the second bonding electrode being connected to the driving circuit layer;

[0011] The repair site includes a first repair electrode and a second repair electrode. The first repair electrode is connected to a first binding electrode of an adjacent binding site, and there is a gap between the second repair electrode and a second binding electrode of an adjacent binding site.

[0012] In one possible implementation of this application, a plurality of binding sets are distributed in a first direction to form binding rows, and the plurality of binding rows are arranged at equal intervals in a second direction, wherein the first direction and the second direction are perpendicular;

[0013] In each of the binding sets, the binding set includes a first binding bit row and a second binding bit row arranged along the first direction;

[0014] The first row of binding bits includes six binding bits arranged along the first direction, and the second row of binding bits includes three binding bits arranged along the first direction.

[0015] In one possible implementation of this application, the binding sets are misaligned in different binding rows.

[0016] In one possible implementation of this application, the first binding position row includes a first binding position, a second binding position, a fourth binding position, a fifth binding position, a seventh binding position, and an eighth binding position arranged sequentially along the first direction, and the second binding position row includes a third binding position, a sixth binding position, and a ninth binding position arranged sequentially along the first direction.

[0017] The first binding bit, the second binding bit, and the third binding bit form a first binding group; the fourth binding bit, the fifth binding bit, and the sixth binding bit form a first binding group; and the seventh binding bit, the eighth binding bit, and the ninth binding bit form a first binding group.

[0018] In one possible implementation of this application, the first binding bit, the sixth binding bit, and the ninth binding bit are used to bind light-emitting devices of the same color, the second binding bit, the fourth binding bit, and the eighth binding bit are used to bind light-emitting devices of the same color, and the third binding bit, the fifth binding bit, and the seventh binding bit are used to bind light-emitting devices of the same color.

[0019] In one possible implementation of this application, the first, third, and eighth binding bits belonging to adjacent different binding sets form a second binding group; the second and fourth binding bits in the same binding set form a second binding group with the sixth binding bit in an adjacent binding set; and the fifth and seventh binding bits in the same binding set form a second binding group with the ninth binding bit in an adjacent binding set; and / or,

[0020] The first, eighth, and ninth binding bits belonging to adjacent different binding sets form a second binding group; the second and fourth binding bits in the same binding set and the third binding bit in an adjacent binding set form a second binding group; the fifth and seventh binding bits in the same binding set and the sixth binding bit in an adjacent binding set form a second binding group.

[0021] Preferably, the repair position is located at the center of the area enclosed by the three binding positions in the second binding group.

[0022] In one possible implementation of this application, in the same second binding group, the distance between binding bits located in different binding groups in the first direction or the second direction is the first distance;

[0023] In the same second binding group, the distance between two binding bits located in the same binding group in the first direction is the second distance.

[0024] A second aspect of this application provides a display panel, the display panel including light-emitting devices and an array substrate according to any of the possible embodiments of the first aspect. Three bonding positions in the first bonding group are respectively bonded to light-emitting devices of different colors;

[0025] The three binding positions in the second binding group are each bound to a light-emitting device of the same color;

[0026] Preferably, at least one of the light-emitting devices is bound to a corresponding repair position, wherein the color of the light-emitting device bound to the corresponding repair position is the same as the color of the light-emitting device bound to the undamaged binding position on the corresponding second binding group.

[0027] A third aspect of this application also provides an electronic device, which includes a display panel as described in any of the possible embodiments of the second aspect.

[0028] This application provides an array substrate, a display panel, and an electronic device. The array substrate includes a driving circuit layer and a bonding electrode layer. The bonding electrode layer is located on one side of the driving circuit layer and includes multiple bonding sets. Each bonding set includes three first bonding groups, and each first bonding group includes three bonding positions for bonding different color light-emitting devices. Three bonding positions in adjacent bonding sets for bonding the same color light-emitting device form a second bonding group. A repair position is provided in the area enclosed by the three bonding positions in the second bonding group. There is a first distance between two bonding positions belonging to different bonding sets in the second bonding group, and there is a second distance between two adjacent bonding positions in the same bonding set for bonding the same color light-emitting device. The first distance and the second distance are different. In the above structure, three bonding positions for bonding the same color light-emitting device share a single repair position. This reduces the number of repair positions and increases the density of bonding positions and pixels on the array substrate. In addition, setting the distance between two bonding positions belonging to different bonding sets in the second bonding group to be different from the distance between two adjacent bonding positions for bonding the same color light-emitting device in the same bonding set ensures that when using the repair position, the distance between other light-emitting devices in the same pixel and the light-emitting device on the repair position is appropriate. This ensures the uniformity of the display effect of the display panel after repair. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of an array substrate provided in this embodiment;

[0031] Figure 2 for Figure 1 A magnified view of a portion of the second binding group;

[0032] Figure 3 for Figure 1 A magnified view of a portion of the binding set;

[0033] Figure 4 for Figure 1 A magnified view of a portion of the binding bits in the middle section;

[0034] Figure 5 for Figure 1 A diagram illustrating the binding of the middle section;

[0035] Figure 6 This is a schematic diagram of an array substrate with light-emitting devices provided in this embodiment;

[0036] Figure 7 for Figure 6 A magnified view of a portion of the device after it has been set up in the binding set.

[0037] Icons: 1-Array substrate, 10-Driver circuit layer, 20-Bond electrode layer, 21-Bond set, 210-First bonding group, 211-Second bonding group, 212-First bonding bit row, 213-Second bonding bit row, 2101-Bond bit, 21010-First bonding electrode, 21011-Second bonding electrode, 2101a-First bonding bit, 2101b-Second bonding bit, 2101c-Third bonding bit, 2101d-Fourth bonding bit, 2101e-Fifth bonding bit, 2101f-Sixth bonding bit, 2101g-Seventh bonding bit, 2101h-Eighth bonding bit, 2101i-Ninth bonding bit, 30-Repair bit, 300-First repair electrode, 310-Second repair electrode, 40-Bond row, 50-Light emission device. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0039] In the description of this application, it should be noted that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0040] To address the aforementioned technical problems, the inventor has innovatively designed the following technical solution, the specific implementation of which will be described in detail below with reference to the accompanying drawings.

[0041] It should be noted that the defects in the solutions in the prior art are all the result of the inventors’ practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed by the embodiments of this application in the following text should be the inventors’ contributions to this application in the process of invention and creation, and should not be understood as technical content known to those skilled in the art.

[0042] Please refer to Figure 1 , Figure 1This is a schematic diagram of an array substrate 1 provided in this embodiment. In this embodiment, the array substrate 1 is a substrate structure for a display panel, which includes a driving circuit layer 10 and a bonding electrode layer 20, with the bonding electrode layer 20 located on one side of the driving circuit layer 10. The driving circuit layer 10 is responsible for controlling the pixel driving of the display panel, and the bonding electrode layer 20 is used to connect the light-emitting device 50 to the driving circuit layer 10, thereby realizing the display function.

[0043] The bonding electrode layer 20 includes multiple bonding sets 21, each bonding set 21 includes three first bonding groups 210, each first bonding group 210 includes three bonding bits 2101 for bonding different color light-emitting devices. For example, the three bonding bits 2101 in the first bonding group 210 can bond a red light-emitting device, a green light-emitting device, or a blue light-emitting device, respectively.

[0044] Three bonding positions 2101 in adjacent bonding sets 21, used to bond light-emitting devices of the same color, form a second bonding group 211. A repair position 30 is provided within the area enclosed by the three bonding positions 2101 in the second bonding group 211. When a light-emitting device at any bonding position 2101 in the second bonding group 211 fails to display properly, a new light-emitting device can be bonded to the repair position 30 to replace the malfunctioning device. That is, the three bonding positions 2101 in the second bonding group 211 can share the same repair position 30, thus improving the space utilization of the array substrate 1 and increasing the density of bonding positions and pixels on the array substrate 1.

[0045] Please refer to Figure 2 and Figure 3 , Figure 2 for Figure 1 A magnified view of a portion of the second binding group 211. Figure 3 for Figure 1 A partial enlarged view of the binding set 21. In the second binding group 211, there is a first distance D1 between two binding bits 2101 belonging to different binding sets 21, and a second distance D2 between two adjacent binding bits 2101 in the same binding set 21 used to bind light-emitting devices of the same color. The first distance D1 and the second distance D2 are different. This design ensures that when using the repair bit 30, the distance between other light-emitting devices in the same pixel and the light-emitting device on the repair bit 30 is appropriate, thus guaranteeing the uniformity of the display panel's display effect after repair.

[0046] Further, please refer to Figure 1 , Figure 2 and Figure 3In the second binding group 211, three binding bits 2101 form a triangle, and the repair bit 30 is located inside the triangle. By setting the first distance D1 between two binding bits 2101 belonging to different binding sets 21 in the second binding group 211 to be greater than the second distance D2 between two adjacent binding bits 2101 in the same binding set 21 used to bind the same color light-emitting device, the spacing between the repair bit 30 and the binding bits 2101 in the second binding group 211 can be increased. Since the repair bit 30 and the binding bits 2101 in the second binding group 211 are connected to the same color light-emitting device, when the repair bit 30 is used, the problem of poor display uniformity caused by the excessive concentration of the same color light-emitting devices can be avoided.

[0047] Please refer to Figure 1 and Figure 4 , Figure 4 This is a partial enlarged view of the bonding positions 2101 on the array substrate 1 provided in this embodiment. Each bonding position 2101 includes a first bonding electrode 21010 and a second bonding electrode 21011, which are connected to the driving circuit layer 10. This ensures that the light-emitting device disposed on the bonding position 2101 can receive the electrical signal provided by the driving circuit layer 10, thereby enabling the light-emitting device to emit light.

[0048] The repair position 30 includes a first repair electrode 300 and a second repair electrode 310. The first repair electrode 300 is connected to the first binding electrode 21010 of the adjacent binding position 2101, and there is a gap between the second repair electrode 310 and the second binding electrode 21011 of the adjacent binding position 2101. During repair, the gap between the second repair electrode 310 and the second binding electrode 21011 of the corresponding binding position of the light-emitting device to be repaired is connected. This allows the light-emitting device at the repair position 30 to receive the same electrical signal as the light-emitting device to be repaired, thereby achieving consistency between the light-emitting effect of the repaired light-emitting device and the original light-emitting device. When repair is not required, the gap between the second repair electrode 310 of the repair position 30 and the second binding electrode 21011 of the binding position 2101 can prevent short circuits or signal interference.

[0049] For example, when a light-emitting device in the display panel malfunctions, the location of the bonding point 2101 of the light-emitting device 50 to be repaired is first identified. Then, the second repair electrode 310 of the repair point 30 in the second bonding group 211 to which the bonding point 2101 to be repaired is located is electrically connected to the second bonding electrode 21011 of the bonding point 2101 to be repaired. After the electrical connection is completed, a new light-emitting device is bonded to the aforementioned repair point 30. It is worth noting that the electrical connection between the second repair electrode 310 of the repair point 30 and the second bonding electrode 21011 of the bonding point 2101 to be repaired can be accomplished by using soldering materials or coating with conductive materials.

[0050] Further, please refer to Figure 1 and Figure 3 Multiple binding sets 21 are distributed in a first direction X to form binding rows 40, and the multiple binding rows 40 are equally spaced in a second direction Y, wherein the first direction X and the second direction Y are perpendicular. Each binding set 21 includes a first binding bit row 212 and a second binding bit row 213 arranged along the first direction X. The first binding bit row 212 includes six binding bits 2101 arranged along the first direction X, and the second binding bit row 213 includes three binding bits 2101 arranged along the first direction X.

[0051] Further, please refer to Figure 1 and Figure 5 , Figure 5 for Figure 1 A schematic diagram of the middle binding rows 40. In the different binding rows 40, the binding sets 21 are staggered. On one hand, the staggered arrangement of the binding sets 21 improves the utilization rate of the array substrate 1. On the other hand, its staggered arrangement causes the binding groups 210 in the binding sets 21 to form a hexagonal pixel arrangement structure between adjacent binding rows 40. Compared to a rectangular pixel arrangement structure, the hexagonal pixel arrangement structure can make the edges of the displayed image smoother, achieving the effect of eliminating visual jagged edges and improving the display effect of the display panel.

[0052] Further, please refer to Figure 3 The first binding position row 212 includes a first binding position 2101a, a second binding position 2101b, a fourth binding position 2101d, a fifth binding position 2101e, a seventh binding position 2101g, and an eighth binding position 2101h arranged sequentially along the first direction X. The second binding position row 213 includes a third binding position 2101c, a sixth binding position 2101f, and a ninth binding position 2101i arranged sequentially along the first direction X. These binding positions 2101 are arranged at certain intervals. The binding positions 2101 of the second binding position row 213 cooperate with the binding positions 2101 of the first binding position row 212 to form a complete binding set structure, providing binding positions for light-emitting devices of different colors.

[0053] The first binding bit 2101a, the second binding bit 2101b and the third binding bit 2101c form a first binding group 210, the fourth binding bit 2101d, the fifth binding bit 2101e and the sixth binding bit 2101f form a first binding group 210, and the seventh binding bit 2101g, the eighth binding bit 2101h and the ninth binding bit 2101i form a first binding group 210.

[0054] Further, please refer to Figure 6 and Figure 7 , Figure 6 for Figure 1 A schematic diagram of the array substrate 1 after the light-emitting device 50 is bonded. Figure 7 for Figure 6 This is a schematic diagram showing the binding of the light-emitting device 50 to the binding set 21. The first binding bit 2101a, the sixth binding bit 2101f, and the ninth binding bit 2101i are used to bind light-emitting devices 50 of the same color; the second binding bit 2101b, the fourth binding bit 2101d, and the eighth binding bit 2101h are used to bind light-emitting devices 50 of the same color; and the third binding bit 2101c, the fifth binding bit 2101e, and the seventh binding bit 2101g are used to bind light-emitting devices 50 of the same color. For example, the first binding bit 2101a, the sixth binding bit 2101f, and the ninth binding bit 2101i can be used to bind a light-emitting device 50 of the first color; the second binding bit 2101b, the fourth binding bit 2101d, and the eighth binding bit 2101h can be used to bind a light-emitting device 50 of the second color; and the third binding bit 2101c, the fifth binding bit 2101e, and the seventh binding bit 2101g can be used to bind a light-emitting device 50 of the third color. Thus, within a binding set 21, the layout of these binding bits 2101 helps improve the color consistency of the display panel, wherein the first color, the second color, and the third color can be any one of red, green, and blue.

[0055] In one possible implementation of this embodiment, the binding bits constituting the second binding group 211 may have the following distribution, please refer to... Figure 1 and Figure 3 The first binding bit 2101a, the third binding bit 2101c, and the eighth binding bit 2101h, belonging to adjacent different binding sets 21, form a second binding group 211, and the three share a repair bit 30. The second binding bit 2101b and the fourth binding bit 2101d in the same binding set 21, together with the sixth binding bit 2101f in the adjacent binding set 21, form a second binding group 211, and the three share a repair bit 30. The fifth binding bit 2101e and the seventh binding bit 2101g in the same binding set 21, together with the ninth binding bit 2101i in the adjacent binding set 21, form a second binding group 211, and the three share a repair bit 30.

[0056] In this embodiment, the binding bits constituting the second binding group 211 may also have the following distribution, please refer again. Figure 1 and Figure 3 The first binding bit 2101a, the eighth binding bit 2101h, and the ninth binding bit 2101i, belonging to adjacent binding sets 21, form a second binding group 211, and all three share a repair bit 30. The second binding bit 2101b and the fourth binding bit 2101d in the same binding set 21, together with the third binding bit 2101c in the adjacent binding set 21, form a second binding group 211, and all three share a repair bit 30. The fifth binding bit 2101e and the seventh binding bit 2101g in the same binding set 21, together with the sixth binding bit 2101f in the adjacent binding set 21, form a second binding group 211, and all three share a repair bit 30. Thus, through the cooperation between the binding set 21 and the adjacent binding set 21, a flexible and efficient repair scheme is provided when all binding bits 2101 in the binding set 21 fail. That is, when a binding bit 2101 in the binding set 21 fails, the repair operation can be performed by using the repair bit 30 shared by the binding bits 2101 in the second binding group 211 to which it belongs.

[0057] For example, if the first binding bit 2101a in a certain binding set 21 fails, the repair bit 30 in the second binding group 211 where the first binding bit 2101a is located can be used for repair. That is, the repair bit 30 in the second binding group 211 composed of the first binding bit 2101a, the third binding bit 2101c, and the eighth binding bit 2101h ensures that the first binding bit 2101a that has failed can be replaced by the repair bit 30 to control the light-emitting device to emit light, thus ensuring the display effect of the display panel.

[0058] Preferably, the repair position 30 is located at the center of the area enclosed by the three binding positions 2101 in the second binding group 211. This ensures that the distance between the repair position 30 and the three binding positions 2101 in the second binding group 211 is the same, so that when the light-emitting device on the repair position 30 forms a pixel unit with the light-emitting devices on the other binding positions 2101, the distance between the light-emitting devices is moderate, which is beneficial to the overall display uniformity of the display panel.

[0059] Furthermore, please refer to again Figure 2In the same second binding group 211, the distance between binding bits 2101 located in different binding sets 21 in the first direction X or the second direction Y is a first distance D1. In the same second binding group 211, the distance between two binding bits 2101 located in the same binding set 21 in the first direction X is a second distance D2. The first distance D1 is greater than the second distance D2, which increases the spacing between the repair bit 30 and other binding bits 2101 in the second binding group 211. Since the repair bit 30 and the binding bits 2101 in the second binding group 211 are equipped with light-emitting devices of the same color, when the repair bit 30 is used, the problem of poor display uniformity caused by the excessive concentration of light-emitting devices of the same color can be avoided.

[0060] Based on the same inventive concept, please refer again. Figure 6 This embodiment also provides a display panel, which includes light-emitting devices 50 and multiple array substrates 1 as described in the previous embodiments. Three bonding positions 2101 in the first bonding group 210 are respectively bonded to light-emitting devices 50 of different colors, and three bonding positions 2101 in the second bonding group 211 are respectively bonded to light-emitting devices 50 of the same color.

[0061] In this embodiment, at least one light-emitting device 50 is bound to a corresponding repair position 30. The color of the light-emitting device 50 bound to the corresponding repair position 30 is the same as the color of the light-emitting device 50 bound to the undamaged binding position 2101 in the corresponding second binding group 211. Thus, when a light-emitting device 50 malfunctions and needs repair, the repaired light-emitting device 50 can maintain a high degree of consistency in color and brightness with the surrounding light-emitting devices 50, thereby avoiding uneven display effects on the display panel caused by repair.

[0062] Based on the same inventive concept, this embodiment also provides an electronic device, which includes multiple display panels described in the preceding embodiments. Due to the consistency of the light-emitting devices 50 on the array substrate 1 in the aforementioned display panels, the uniformity of the display effect is ensured, improving the user experience and thus enhancing the market competitiveness of the electronic device.

[0063] In summary, this embodiment provides an array substrate, a display panel, and an electronic device. The array substrate includes a driving circuit layer and a bonding electrode layer. The bonding electrode layer is located on one side of the driving circuit layer and includes multiple bonding sets. Each bonding set includes three first bonding groups, and each first bonding group includes three bonding positions for bonding different color light-emitting devices. Three bonding positions in adjacent bonding sets for bonding the same color light-emitting device form a second bonding group. A repair position is provided in the area enclosed by the three bonding positions in the second bonding group. There is a first distance between two bonding positions belonging to different bonding sets in the second bonding group, and a second distance between two adjacent bonding positions in the same bonding set for bonding the same color light-emitting device. The first distance and the second distance are different. In the above structure, three bonding positions for bonding the same color light-emitting device share a single repair position. This reduces the number of repair positions and increases the density of bonding positions and pixels on the array substrate. In addition, setting the distance between two bonding positions belonging to different bonding sets in the second bonding group to be different from the distance between two adjacent bonding positions for bonding the same color light-emitting device in the same bonding set ensures that when using the repair position, the distance between other light-emitting devices in the same pixel and the light-emitting device on the repair position is appropriate. This ensures the uniformity of the display effect of the display panel after repair.

[0064] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An array substrate, characterized in that, The array substrate includes: Drive circuit layer; A bonding electrode layer is located on one side of the driving circuit layer. The bonding electrode layer includes multiple bonding sets, each bonding set includes three first bonding groups, and each first bonding group includes three bonding positions for bonding different color light-emitting devices. Three bonding positions in adjacent bonding sets used to bond the same color light-emitting device form a second bonding group, and a repair position is provided in the area enclosed by the three bonding positions in the second bonding group; In the second binding group, there is a first distance between two binding positions belonging to different binding sets, and a second distance between two adjacent binding positions in the same binding set used to bind the same color light-emitting device. The first distance is different from the second distance.

2. The array substrate as described in claim 1, characterized in that, The first distance is greater than the second distance; Each of the bonding bits includes a first bonding electrode and a second bonding electrode, the first bonding electrode and the second bonding electrode being connected to the driving circuit layer; The repair site includes a first repair electrode and a second repair electrode. The first repair electrode is connected to a first binding electrode of an adjacent binding site, and there is a gap between the second repair electrode and a second binding electrode of an adjacent binding site.

3. The array substrate as described in claim 1, characterized in that, Multiple binding sets are distributed in a first direction to form binding rows, and multiple binding rows are arranged at equal intervals in a second direction, wherein the first direction and the second direction are perpendicular to each other; In each of the binding sets, the binding set includes a first binding bit row and a second binding bit row arranged along the first direction; The first row of binding bits includes six binding bits arranged along the first direction, and the second row of binding bits includes three binding bits arranged along the first direction.

4. The array substrate as described in claim 3, characterized in that, The binding sets are misaligned in different binding rows.

5. The array substrate as described in claim 3, characterized in that, The first binding position row includes a first binding position, a second binding position, a fourth binding position, a fifth binding position, a seventh binding position, and an eighth binding position arranged sequentially along the first direction; the second binding position row includes a third binding position, a sixth binding position, and a ninth binding position arranged sequentially along the first direction. The first binding bit, the second binding bit, and the third binding bit form a first binding group; the fourth binding bit, the fifth binding bit, and the sixth binding bit form a first binding group; and the seventh binding bit, the eighth binding bit, and the ninth binding bit form a first binding group.

6. The array substrate as described in claim 5, characterized in that, The first binding bit, the sixth binding bit, and the ninth binding bit are used to bind light-emitting devices of the same color; the second binding bit, the fourth binding bit, and the eighth binding bit are used to bind light-emitting devices of the same color; and the third binding bit, the fifth binding bit, and the seventh binding bit are used to bind light-emitting devices of the same color.

7. The array substrate as described in claim 6, characterized in that, The first, third, and eighth binding bits belonging to adjacent binding sets form a second binding group; the second and fourth binding bits in the same binding set form a second binding group with the sixth binding bit in an adjacent binding set; the fifth and seventh binding bits in the same binding set form a second binding group with the ninth binding bit in an adjacent binding set; and / or, The first, eighth, and ninth binding bits belonging to adjacent different binding sets form a second binding group; the second and fourth binding bits in the same binding set and the third binding bit in an adjacent binding set form a second binding group; the fifth and seventh binding bits in the same binding set and the sixth binding bit in an adjacent binding set form a second binding group. Preferably, the repair position is located at the center of the area enclosed by the three binding positions in the second binding group.

8. The array substrate as claimed in claim 7, characterized in that, In the same second binding group, the distance between binding bits located in different binding groups in the first direction or the second direction is the first distance; In the same second binding group, the distance between two binding bits located in the same binding group in the first direction is the second distance.

9. A display panel, characterized in that, The display panel includes a light-emitting device and an array substrate according to any one of claims 1-8; The three binding positions in the first binding group are respectively bound to light-emitting devices of different colors; The three binding positions in the second binding group are each bound to a light-emitting device of the same color; Preferably, at least one of the light-emitting devices is bound to a corresponding repair position, wherein the color of the light-emitting device bound to the corresponding repair position is the same as the color of the light-emitting device bound to the undamaged binding position on the corresponding second binding group.

10. An electronic device, characterized in that, Includes the display panel as described in claim 9.

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