Display panel, display device, and method for manufacturing display panel

Abstract

This application discloses a display panel, a display device, and a method for fabricating the display panel. The panel includes a display backplate, a light-absorbing layer, and a light-emitting element. The display backplate has pads, and the light-absorbing layer is disposed on one side of the display backplate. The light-absorbing layer has through-holes, and the pads are exposed in the through-holes. The light-emitting element is electrically connected to the display backplate through the pads exposed in the through-holes. This application provides a light-absorbing layer between the display backplate and the light-emitting element, achieving a black encapsulation effect while avoiding the light-absorbing layer affecting the luminous efficiency of the light-emitting element.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] In Micro-LED direct-view displays, processes such as printing ink and applying black film to the LEDs are often used to ensure a dark appearance, improve contrast, and reduce reflectivity. However, this structure reduces the luminous efficiency of the LED sidewalls and requires customized equipment, such as printing and ashing equipment, to match the size of the transfer substrate, increasing mass production costs. Summary of the Invention

[0003] The main technical problem solved by this application is to provide a display panel, a display device, and a method for manufacturing the display panel, which can ensure the black encapsulation effect of the display panel without affecting the luminous efficiency of the light-emitting elements.

[0004] To solve the above-mentioned technical problems, this application adopts a technical solution: providing a display panel, including a display back panel, a light-absorbing layer and a light-emitting element, wherein the display back panel is provided with pads, the light-absorbing layer is disposed on one side of the display back panel, the light-absorbing layer is provided with through holes, and the pads are exposed in the through holes; the light-emitting element is electrically connected to the display back panel through the pads exposed in the through holes.

[0005] The light-absorbing layer is made of a black material; preferably, the light-absorbing layer extends further to the side of the display back panel; preferably, the display back panel includes a substrate and at least side traces formed on the side of the substrate, wherein the light-absorbing layer covers the side traces.

[0006] The display back panel has a groove on its surface facing the light-absorbing layer, and the light-absorbing layer further fills the groove.

[0007] The display backplane includes: a substrate; a circuit layer disposed on one side of the substrate; a light-absorbing layer disposed on the side of the circuit layer opposite to the substrate; the circuit layer includes the pads and a plurality of pixel circuits; wherein the circuit layer has the groove, and the groove is located between two adjacent pixel circuits; preferably, the groove penetrates the circuit layer so that a portion of the substrate is exposed in the groove.

[0008] The display panel further includes an encapsulation layer disposed on the side of the light-emitting element away from the display back panel, for encapsulating the light-emitting element; preferably, the encapsulation layer includes an anti-reflection film.

[0009] The display panel further includes: a bonding layer disposed between the light-emitting element and the display back panel, wherein the connection terminals of the light-emitting element pass through the bonding layer and are electrically connected to the pads exposed in the through-holes; preferably, the bonding layer is a full-film layer, or the bonding layer has a patterned structure, and the orthographic projection of the light-emitting element on the display back panel covers the orthographic projection of the bonding layer on the display back panel; preferably, the bonding layer includes at least one of anisotropic conductive adhesive and non-conductive adhesive.

[0010] To solve the above-mentioned technical problems, the present invention also provides a technical solution: a display device including the display panel described above.

[0011] To solve the above-mentioned technical problems, the present invention also provides a technical solution: a method for preparing a display panel, the method comprising: preparing a display back panel; forming a light-absorbing layer with through holes on one side of the display back panel, wherein pads on the display back panel are exposed in the through holes; and electrically connecting the connection terminals of the light-emitting elements to the pads.

[0012] The step of forming a light-absorbing layer with through holes on one side of the display back panel includes: forming a full-surface light-absorbing material layer on one side of the display back panel; patterning the light-absorbing material layer to obtain a light-absorbing layer with through holes; preferably, before forming the full-surface light-absorbing material layer on one side of the display back panel, the step further includes: forming a groove on the surface of the display back panel, wherein the light-absorbing material layer fills the groove when it is subsequently formed.

[0013] The step of electrically connecting the connection terminal of the light-emitting element to the pad includes: forming a bonding layer on one side of the display back panel; placing the light-emitting element on the side of the bonding layer away from the display back panel; applying pressure to the light-emitting element so that the connection terminal of the light-emitting element passes through the bonding layer and electrically connects to the pad exposed in the through-hole; preferably, after electrically connecting the connection terminal of the light-emitting element to the pad, the step further includes: removing the bonding layer, or patterning the bonding layer so that the orthographic projection of the light-emitting element on the display back panel covers the orthographic projection of the bonding layer on the display back panel; or, the step of electrically connecting the connection terminal of the light-emitting element to the pad includes: electrically connecting the connection terminal of the light-emitting element to the pad by laser welding.

[0014] Beneficial effects: This application provides a light-absorbing layer between the display back panel and the light-emitting element. While achieving a black encapsulation effect using the light-absorbing layer, it can avoid the light-absorbing layer affecting the luminous efficiency of the light-emitting element. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0016] Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the connection structure between the display back panel and the light-absorbing layer provided in an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the connection structure between the light-emitting element and the display backplate provided in an embodiment of this application;

[0019] Figure 4 This is a schematic diagram of the connection structure between the light-emitting element and the display backplate provided in another embodiment of this application;

[0020] Figure 5 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0021] Figure 6 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0022] Figure 7 This is a process flow diagram of the manufacturing process of a display panel provided in one embodiment of this application. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0024] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0025] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] Please refer to the following: Figure 1 and Figure 2 In one embodiment of this application, a display panel 100 is provided, including a display backplate 10, a light-absorbing layer 20, and a light-emitting element 30. The display backplate 10 is provided with pads 11. The display backplate 10 serves as the supporting structure for the entire display panel 100 and is provided with a plurality of pads 11. The pads 11 are connected to the driving circuit inside the display backplate 10 and are responsible for transmitting control signals and data signals to establish an electrical connection between the driving circuit inside the display backplate 10 and the external light-emitting element 30.

[0027] The light-absorbing layer 20 is disposed on one side of the display back panel 10 and has light-absorbing properties, which can ensure that the display panel 100 has a black encapsulation effect.

[0028] Meanwhile, the light-absorbing layer 20 is provided with through holes 21, and the pads 11 are exposed in the through holes 21. The light-emitting element 30 is electrically connected to the display back panel 10 through the pads 11 exposed in the through holes 21, so that the light-emitting element 30 emits visible light after receiving the electrical signal from the display back panel 10, thereby forming the basic pixel of the display panel 100.

[0029] The light-emitting element 30 in this application can be an organic light-emitting diode (OLED), a micro-LED, or other light-emitting device, and is not limited herein.

[0030] In the aforementioned display panel 100, by providing a light-absorbing layer 20 between the display back panel 10 and the light-emitting element 30, a black encapsulation effect can be achieved by utilizing the light-absorbing layer 20, while avoiding the light-absorbing layer 20 affecting the light-emitting efficiency of the light-emitting element 30.

[0031] In one embodiment, the material of the light-absorbing layer 20 includes a black material. When the material of the light-absorbing layer 20 is black, the black light-absorbing layer 20 can improve the display effect of the display back panel 10, making the color uniformity of the area on the display panel 100 other than the plurality of light-emitting elements 30, thereby improving the color difference of the display panel 100.

[0032] In this embodiment, the material of the light-absorbing layer 20 is specifically a glossy black or matte black material. It is understood that the material of the light-absorbing layer 20 can also be other dark-colored materials, and there is no limitation here.

[0033] In one embodiment, the material of the light-absorbing layer 20 includes an organic material; in another embodiment, the material of the light-absorbing layer 20 includes an inorganic material; and in yet another embodiment, the material of the light-absorbing layer 20 includes both organic and inorganic materials.

[0034] Please continue reading. Figure 1 and Figure 2 In one embodiment, the surface of the display back panel 10 facing the light-absorbing layer 20 is provided with a groove 12, and the light-absorbing layer 20 further fills the groove 12. Specifically, the groove 12 can increase the contact area between the display back panel 10 and the light-absorbing layer 20, thereby improving the bonding strength between the light-absorbing layer 20 and the display back panel 10. At the same time, filling the groove 12 with the light-absorbing layer 20 can further improve the blackness of the display panel 100, thereby further reducing the reflectivity and improving the uniformity of the black color in the appearance of the display panel 100.

[0035] In one embodiment, the cross-section of the groove 12 may be a regularly arranged series of tiny pits, channels or complex three-dimensional textures, without limitation.

[0036] In one embodiment, the groove 12 on the display backplate 10 can be formed by an ashing etching process.

[0037] Please see Figure 1 In one embodiment, the light-absorbing layer 20 further extends to the side of the display back panel 10. This arrangement can further improve the contrast of the display panel 100, and when multiple display panels 100 are spliced ​​together, this arrangement can also improve the splicing effect of the display panels 100, achieving a seamless appearance.

[0038] Please continue reading. Figure 1 In one embodiment, the display back panel 10 includes a substrate 13 and at least side traces (not shown) formed on the side surface of the substrate 13, wherein a light-absorbing layer 20 covers the side traces. The light-absorbing layer 20 can absorb stray light at the side traces and further improve the splicing effect when multiple display panels 100 are spliced ​​together, thereby improving the display effect of the display panel 100.

[0039] Please refer to it again. Figure 1 and Figure 2 In one embodiment, the display backplane 10 further includes a circuit layer 14 disposed on one side of the substrate 13. A light-absorbing layer 20 is disposed on the side of the circuit layer 14 facing away from the substrate 13. The circuit layer 14 includes pads 11 and a plurality of pixel circuits 141. The circuit layer 14 has a recess 12 located between two adjacent pixel circuits 141. Specifically, the substrate 13 provides support for the display backplane 10, and the circuit layer 14 with a plurality of pixel circuits 141 is disposed on the substrate 13. The circuit layer 14 is responsible for driving the light-emitting element 30, and each pixel circuit 141 is responsible for controlling the light output of a corresponding specific area on the display backplane 10. The recess 12, located between two adjacent pixel circuits 141, reduces the risk of the recess 12 affecting the pixel circuit 141 and also reduces the fabrication difficulty.

[0040] Please continue reading. Figure 1 and Figure 2 In one embodiment, the groove 12 penetrates the circuit layer 14, so that a portion of the substrate 13 is exposed in the groove 12. Specifically, the groove 12 penetrating the circuit layer 14 can increase the depth of the groove 12, thereby further increasing the contact area between the light-absorbing layer 20 and the display back panel 10, improving the connection strength between the light-absorbing layer 20 and the display back panel 10, and at the same time further improving the blackness of the display panel 100 to reduce the reflectivity of the display panel 100.

[0041] In one embodiment, the groove 12 may not penetrate the circuit layer 14; that is, the groove 12 is a blind groove disposed on the circuit layer 14.

[0042] Please refer to it again. Figure 1 In one embodiment, the display panel 100 further includes an encapsulation layer 40 disposed on the side of the light-emitting element 30 facing away from the display backplate 10, for encapsulating the light-emitting element 30. By encapsulating the light-emitting element 30 with the encapsulation layer 40, the reflectivity of the display panel 100 can be reduced. At the same time, the encapsulation layer 40 can also prevent external moisture from entering the welding position between the light-emitting element 30 and the display backplate 10, thereby improving the product reliability of the display panel 100.

[0043] In one embodiment, the encapsulation layer 40 includes an antireflection film (not shown). That is, the encapsulation layer 40 is made of a high-transmittance material, reducing the risk that the encapsulation layer 40 will affect the display effect of the light-emitting element 30.

[0044] In one embodiment, the material of the antireflective film includes at least one of AR film (anti-reflective coating) and AG film (anti-glare coating), without limitation.

[0045] Please continue reading. Figure 1 In one embodiment, the display panel 100 further includes a bonding layer 50 disposed between the light-emitting element 30 and the display back panel 10, wherein the connection terminal 31 of the light-emitting element 30 (i.e. the electrode of the light-emitting element 30) passes through the bonding layer 50 and is electrically connected to the pad 11 exposed in the through hole 21.

[0046] Specifically, the connection terminal 31 of the light-emitting element 30 passes through the bonding layer 50, so that the connection terminal 31 on the light-emitting element 30 can directly contact the pad 11 exposed in the through hole 21, and achieve electrical connection between the light-emitting element 30 and the display back panel 10 through soldering or other connection techniques.

[0047] Please refer to the following: Figure 1 and Figure 3 In one embodiment, the bonding layer 50 is a full-film layer, or the bonding layer 50 has a patterned structure, and the orthographic projection of the light-emitting element 30 on the display back panel 10 covers the orthographic projection of the bonding layer 50 on the display back panel 10.

[0048] Specifically, when the bonding layer 50 is designed as a full-film layer (see...) Figure 1 It covers the entire surface of the display backplate 10, and during the preparation process, a full-surface bonding layer 50 can be directly formed, reducing the difficulty of preparation.

[0049] When the bonding layer 50 is designed as a patterned structure (see...) Figure 3The bonding layer 50 covers only the specific area on the display backplane 10 where the light-emitting elements 30 need to be connected. The size of the bonding layer 50 can be adjusted according to the layout and size of the light-emitting elements 30, thereby optimizing the use of bonding layer 50 material and reducing unnecessary costs. At the same time, the patterned bonding layer 50 can also reduce light loss and reduce the risk of blocking or absorbing light in non-connected areas. In this case, during the fabrication process, after forming the entire bonding layer 50 and electrically connecting the light-emitting elements 30 to the pads 11 on the display backplane 10, the bonding layer 50 is patterned. At this time, due to the presence of the light-emitting elements 30, after patterning, the orthographic projection of the light-emitting elements 30 on the display backplane 10 covers the orthographic projection of the bonding layer 50 on the display backplane 10, ensuring that each light-emitting element 30 can establish an electrical connection with the corresponding pad 11 on the display backplane 10 through the bonding layer 50.

[0050] In one embodiment, the bonding layer 50 includes at least one of anisotropic conductive adhesive and non-conductive adhesive.

[0051] Specifically, anisotropic conductive film (ACF) can conduct current in a specific direction while remaining insulating in other directions. When anisotropic conductive film is used in bonding layer 50, the conductive particles in the film are uniformly dispersed. When pressure is applied, the conductive particles form continuous conductive channels in a specific direction, such as the vertical direction, thereby achieving an electrical connection between the light-emitting element 30 and the display backplane 10.

[0052] Non-conductive paste (NCP) is applied to the surface of the pads 11 of the display backplate 10. The connection terminals 31 of the light-emitting element 30 are bonded to the pads 11 by thermo-press bonding to achieve electrical interconnection. After curing, the non-conductive paste serves to bond and fix the light-emitting element 30 to the display backplate 10.

[0053] The bonding layer 50 may consist only of anisotropic conductive adhesive, or only of non-conductive adhesive, or may consist of both anisotropic conductive adhesive and non-conductive adhesive; no limitation is imposed here.

[0054] Please see Figure 4 In other embodiments, the bonding layer 50 may be omitted, and the connection terminal 31 of the light-emitting element 30 may be electrically connected to the pad 11 directly by laser welding. No restrictions are imposed here.

[0055] Please see Figure 5 This application also provides a display device 200, including the display panel 100 described above.

[0056] The aforementioned display device 200 can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, or digital photo frame.

[0057] Please refer to the following: Figure 6 and Figure 7 This application also provides a method for manufacturing a display panel, the method comprising:

[0058] S300: Fabrication of display backplate 10.

[0059] S310: A light-absorbing layer 20 with through holes 21 is formed on one side of the display back panel 10, wherein the pads 11 on the display back panel 10 are exposed in the through holes 21.

[0060] Specifically, a light-absorbing layer 20 is prepared using a material with good light-absorbing properties, thereby effectively absorbing stray light generated by the light-emitting element 30 and reducing the reflectivity of the display panel 100. Specifically, through-holes 21 can be fabricated on the light-absorbing layer 20 using methods such as laser drilling, mechanical drilling, or chemical etching. The size and position of the through-holes 21 must match the pads 11 to ensure that the pads 11 are completely exposed within the through-holes 21.

[0061] S320: Connect the connection terminal 31 of the light-emitting element 30 to the pad 11.

[0062] Specifically, the connection terminal 31 of the light-emitting element 30 is electrically connected to the pad 11 on the display back panel 10 to realize signal transmission and power supply between the light-emitting element 30 and the display back panel 10.

[0063] In the above method, since the step of preparing the light-absorbing layer 20 is placed before the transfer of the light-emitting element 30, it can better achieve the shielding of the bottom traces of the display back panel 10, thereby reducing the reflectivity of the display panel 100.

[0064] In one embodiment, the thickness of the light-absorbing layer 20 is between 1µm and 3µm, achieving an OD > 4, thus giving the light-absorbing layer 20 excellent light-blocking ability. Here, OD (Optical Density) is an indicator that measures a material's ability to block light; a high OD value means that the material can effectively block light from passing through.

[0065] Please continue reading. Figure 6 and Figure 7 In one embodiment, S310 includes:

[0066] S311: A light-absorbing material layer is formed on one side of the display back panel 10 (not shown).

[0067] In this process, a light-absorbing material is uniformly coated or deposited on one side of the display back panel 10 to form a light-absorbing material layer covering the entire surface.

[0068] S312: Patterned light-absorbing material layer to obtain light-absorbing layer 20 with through holes 21.

[0069] After forming a full-surface light-absorbing material layer, it is patterned to form a light-absorbing layer 20 with through holes 21. The light-absorbing layer 20 is used to absorb stray light emitted from the light-emitting element 30 or other light sources, reduce light scattering and reflection, thereby improving the display effect of the display panel 100.

[0070] The position and size of the through hole 21 need to match the pad 11 on the display back panel 10 so that the connection terminal 31 of the light-emitting element 30 can be electrically connected to the pad 11 later.

[0071] Please continue reading. Figure 6 and Figure 7 In one embodiment, the process further includes the following step before S311:

[0072] S313: A groove 12 is formed on the surface of the display back panel 10, wherein the light-absorbing material layer fills the groove 12 when the light-absorbing material layer is subsequently formed.

[0073] The groove 12 provides additional support or space for the light-absorbing material layer in subsequent steps. When the entire light-absorbing material layer is formed in step S311, the light-absorbing material fills the groove 12, thereby forming a more stable and structured light-absorbing layer 20. After step S311 is completed, since the groove 12 is filled with light-absorbing material, the formed light-absorbing layer 20 can further improve the blackness of the display panel 100, thereby further reducing reflectivity and improving the uniformity of the black color in the appearance of the display panel 100.

[0074] Please see Figure 1 In one embodiment, S320 includes:

[0075] S321: A bonding layer 50 is formed on one side of the display back panel 10.

[0076] S322: Place the light-emitting element 30 on the side of the bonding layer 50 away from the display back panel 10.

[0077] Specifically, a layer of material with specific adhesion and conductivity is coated or deposited on one side of the display backplate 10 to form a bonding layer 50. The bonding layer 50 can serve to pre-fix the light-emitting element 30.

[0078] S323: Apply pressure to the light-emitting element 30 so that the connection terminal 31 of the light-emitting element 30 passes through the bonding layer 50 and is electrically connected to the pad 11 exposed in the through hole 21.

[0079] After the light-emitting element 30 is placed, it is pressurized to allow the connection terminals 31 of the light-emitting element 30 to penetrate the bonding layer 50 and form a good electrical connection with the pads 11 exposed in the through-hole 21. Understandably, the pressure should be kept uniform during the pressurization process to ensure that all light-emitting elements 30 can achieve a reliable electrical connection.

[0080] Please see Figure 3 In one embodiment, after S323, the method further includes: removing the bonding layer 50.

[0081] Specifically, removing the bonding layer 50 refers to completely removing the bonding layer 50 material covering the display backplate 10 or the light-emitting element 30, thereby reducing the impact of the bonding layer 50 on the display effect and structural stability, and ensuring that the electrical connection between the light-emitting element 30 and the display backplate 10 is not affected. For example, non-conductive adhesive (NCP) can be applied to the surface of the pads 11 of the display backplate 10, and the connection terminals 31 of the light-emitting element 30 can be bonded to the pads 11 using a thermosetting bonding method. Then, the non-conductive adhesive can be peeled off from the display backplate 10.

[0082] Please continue reading. Figure 3 In another embodiment, after S323, a patterned bonding layer 50 is further included, such that the orthographic projection of the light-emitting element 30 on the display back panel 10 covers the orthographic projection of the bonding layer 50 on the display back panel 10.

[0083] Specifically, the patterned bonding layer 50 refers to retaining only the portion of the bonding layer 50 corresponding to the connection terminal 31 of the light-emitting element 30, while removing the rest of the bonding layer 50. This maintains the electrical connection while reducing the impact of the bonding layer 50 on the display effect and structural stability. During the patterning process, it is necessary to ensure that the shape and size of the bonding layer 50 match the light-emitting element 30 to achieve a reliable electrical connection. For example, after using anisotropic conductive film (ACF) to achieve the electrical connection between the light-emitting element 30 and the display backplate 10, removing the anisotropic conductive film outside the light-emitting element 30 can reduce the reflectivity by 0.5%-1%.

[0084] Please refer to the following: Figure 4 and Figure 6 In one embodiment, S320 includes:

[0085] The connection terminal 31 of the light-emitting element 30 is electrically connected to the pad 11 by laser welding.

[0086] In this process, laser welding ensures a reliable and stable electrical connection between the connection terminal 31 of the light-emitting element 30 and the bonding pad 11 on the display back panel 10. The laser welding process is fast and highly automated, thereby improving bonding efficiency. The weld formed by laser welding has high strength and good conductivity, which can meet the requirements of the display panel 100 for the reliability and stability of electrical connections.

[0087] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A display panel, characterized in that, include: Display back panel, with solder pads; A light-absorbing layer is disposed on one side of the display back panel, the light-absorbing layer has through holes, and the pads are exposed in the through holes; The light-emitting element is electrically connected to the display backplate through the pads exposed in the through-hole.

2. The display panel according to claim 1, characterized in that, The light-absorbing layer is made of a black material; Preferably, the light-absorbing layer further extends to the side of the display back panel; Preferably, the display backplane includes a substrate and at least side traces formed on the side surface of the substrate, wherein the light-absorbing layer covers the side traces.

3. The display panel according to claim 1, characterized in that, The display back panel has a groove on the surface facing the light-absorbing layer, and the light-absorbing layer further fills the groove.

4. The display panel according to claim 3, characterized in that, The display back panel includes: Substrate; A circuit layer is disposed on one side of the substrate, and a light-absorbing layer is disposed on the side of the circuit layer opposite to the substrate. The circuit layer includes the pads and a plurality of pixel circuits. The circuit layer has the grooves, and the grooves are located between two adjacent pixel circuits. Preferably, the groove extends through the circuit layer, so that a portion of the substrate is exposed in the groove.

5. The display panel according to claim 1, characterized in that, The display panel also includes: An encapsulation layer is disposed on the side of the light-emitting element away from the display back panel, for encapsulating the light-emitting element; Preferably, the encapsulation layer includes an antireflective film.

6. The display panel according to claim 1, characterized in that, The display panel also includes: A bonding layer is disposed between the light-emitting element and the display back panel, and the connection terminals of the light-emitting element pass through the bonding layer and are electrically connected to the pads exposed in the through-hole; Preferably, the bonding layer is a full-film layer, or the bonding layer has a patterned structure, and the orthographic projection of the light-emitting element on the display back panel covers the orthographic projection of the bonding layer on the display back panel; Preferably, the bonding layer includes at least one of anisotropic conductive adhesive and non-conductive adhesive.

7. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 6.

8. A method for manufacturing a display panel, characterized in that, The method includes: Fabrication of display backplane; A light-absorbing layer with through holes is formed on one side of the display back panel, wherein the pads on the display back panel are exposed in the through holes; The connection terminals of the light-emitting element are electrically connected to the solder pad.

9. The method according to claim 8, characterized in that, The step of forming a light-absorbing layer with through holes on one side of the display back panel includes: A light-absorbing material layer is formed on one side of the display back panel; The light-absorbing material layer is patterned to obtain a light-absorbing layer with the through holes; Preferably, before forming a full-surface light-absorbing material layer on one side of the display back panel, the method further includes: A groove is formed on the surface of the display back panel, wherein the light-absorbing material layer subsequently fills the groove when the light-absorbing material layer is formed.

10. The method according to claim 8, characterized in that, The step of electrically connecting the connection terminal of the light-emitting element to the pad includes: A bonding layer is formed on one side of the display back panel; The light-emitting element is placed on the side of the bonding layer away from the display back panel; Pressure is applied to the light-emitting element so that the connection terminal of the light-emitting element passes through the bonding layer and is electrically connected to the pad exposed in the through hole; Preferably, after electrically connecting the connection terminal of the light-emitting element to the pad, the method further includes: Remove the bonding layer, or pattern the bonding layer so that the orthographic projection of the light-emitting element on the display backplane covers the orthographic projection of the bonding layer on the display backplane; Alternatively, the step of electrically connecting the connection terminals of the light-emitting element to the pad includes: The connection terminal of the light-emitting element is electrically connected to the solder pad by laser welding.

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