A display panel and its manufacturing method, and a splicing display device.

Abstract

This invention discloses a display panel and its manufacturing method, as well as a splicing display device. The display panel includes: a substrate, comprising a first surface, a second surface, and a side surface connecting the first and second surfaces, wherein a TFT circuit layer, a pad circuit layer, a conductive particle layer, an LED chip array, and an optical film are sequentially disposed on the first surface along the thickness direction of the substrate; a side trace disposed on the side surface, one end of the side trace extending to the first surface and electrically connected to the TFT circuit layer and the pad circuit layer, and the other end extending to the second surface; and an optical encapsulation layer, which is black and surrounds the perimeter of the substrate, with the outer edge of the optical encapsulation layer flush with the edge of the display panel. By adding a black optical encapsulation layer around the perimeter of the substrate, this invention makes the splicing seam invisible from the front of the screen, thereby improving the problem of obvious splicing seam appearance and increasing reliability.

Description

Technical Field

[0001] This invention relates to the field of display technology, specifically to a display panel and its manufacturing method, and a splicing display device. Background Technology

[0002] Micro LED display panels are miniaturized LED arrays. Compared with LCD and OLED display panels, Micro LED display panels have advantages such as high brightness, high efficiency, short response time, long lifespan, and wide operating range. They can be applied to terminal products such as televisions, augmented and virtual reality (AR / VR), automotive displays, wearable devices, and smartphones.

[0003] Currently, to achieve large-size displays with Micro LED panels, smaller screens need to be spliced ​​together. To minimize bezels and achieve seamless splicing, existing technologies typically employ side-wiring, directing the circuitry to the back. However, this often results in noticeable seams and low reliability after the screens are spliced ​​together. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned problems of splicing screens by providing a display panel and its manufacturing method, as well as a splicing display device, which can improve the problem of obvious seams after splicing and enhance the reliability of the splicing screen.

[0005] This invention is achieved through the following technical solution:

[0006] In a first aspect, the present invention provides a display panel, comprising:

[0007] The substrate includes a first surface, a second surface, and a side surface connecting the first surface and the second surface, which are disposed opposite to each other. A TFT circuit layer, a pad circuit layer, a conductive particle layer, an LED chip array, and an optical film are sequentially disposed on the first surface along the thickness direction of the substrate.

[0008] Side traces are disposed on the side surface, with one end extending to the first surface and electrically connected to the TFT circuit layer and the pad circuit layer, and the other end extending to the second surface;

[0009] An optical encapsulation layer, which is black and is disposed around the periphery of the substrate.

[0010] This solution adds a black optical encapsulation layer to the four edges of the substrate, building upon the existing side traces on the back panel. After adjacent display panels are spliced ​​together, the optical encapsulation layer absorbs light below the seam, making the seam invisible from the front of the screen and thus improving the problem of a noticeable seam. Simultaneously, because the optical encapsulation layer fills the outer side of the side traces, it enhances the reliability of the side traces.

[0011] As a preferred embodiment of the present invention, the side trace is provided with a side trace encapsulation layer on the side away from the substrate, and the optical encapsulation layer at least covers a portion of the side trace encapsulation layer.

[0012] As a preferred embodiment of the present invention, the cross-section of the side trace encapsulation layer is U-shaped to cover the outside of the side trace.

[0013] As a preferred embodiment of the present invention, the conductive particle layer has a cut-off area around its perimeter, such that the edge of the conductive particle layer is located inside the perimeter edge of the substrate.

[0014] As a preferred embodiment of the present invention, the cross-section of the optical encapsulation layer is L-shaped.

[0015] As a preferred embodiment of the present invention, the cross-section of the optical encapsulation layer is C-shaped.

[0016] As a preferred embodiment of the present invention, the optical encapsulation layer is formed by dispensing, pad printing or film application after side wiring encapsulation.

[0017] As a preferred embodiment of the present invention, the optical encapsulation layer can be implemented using one of the following: organic adhesives, organic-doped inorganic adhesives, or organic films.

[0018] In a second aspect, the present invention provides a method for manufacturing a display panel as described in the first aspect, comprising:

[0019] After setting the TFT circuit layer and the pad circuit layer on the substrate, side routing and packaging are performed.

[0020] A conductive particle layer is attached, and the edges of the conductive particle layer are laser-cut so that the edges are located inside the perimeter of the substrate.

[0021] A black optical encapsulation layer is fabricated around the perimeter of the substrate;

[0022] Transfer and fabrication of optical films.

[0023] Thirdly, the present invention provides a splicing display device, comprising at least two display panels spliced ​​together as described in the first aspect.

[0024] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0025] In this invention, a black optical encapsulation layer is added to the existing back panel side traces, so that the light below the seam is absorbed and the seam is not visible when viewed from the front of the screen; at the same time, by cutting the conductive particle layer, the black optical encapsulation layer fills the outside of the side traces, which not only enhances the reliability of electrostatic protection, but also enhances the reliability of the side traces. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention and should not be considered as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort. In the drawings:

[0027] Figure 1 This is a schematic diagram of a display panel after splicing in the prior art;

[0028] Figure 2 This is a schematic diagram of the display panel in the present invention at the part with side wiring;

[0029] Figure 3 This is a schematic diagram of the display panel in the part without side traces in this invention;

[0030] Figure 4 This is a schematic diagram of the display panel in this invention after side wiring and encapsulation;

[0031] Figure 5 This is a schematic diagram of the attachment and cutting of the conductive particle layer of the display panel in this invention;

[0032] Figure 6 This is a schematic diagram of the display panel in this invention after the optical encapsulation layer has been fabricated;

[0033] Figure 7 This is a schematic diagram of the display panel transfer and optical film fabrication process in this invention.

[0034] Figure 8 This is a schematic diagram of the structure of another display panel in the present invention, in the part with side wiring;

[0035] Figure 9 This is a schematic diagram of the structure of another display panel in the part without side wiring in this invention;

[0036] Figure 10 This is a schematic diagram of a splicing display device according to the present invention.

[0037] The attached diagram shows the markings and corresponding component names:

[0038] 1-Substrate, 11-First surface, 12-Second surface, 13-Side surface, 2-TFT circuit layer, 3-Pad circuit layer, 4-Conductive particle layer, 5-LED chip array, 6-Optical film, 7-Side trace, 71-Side trace encapsulation layer, 8-Optical encapsulation layer, A-Display area, B-Splicing gap, C-Cut-out area, D-Laser. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0041] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features.

[0042] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0043] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0044] In the embodiments of this application, the same reference numerals denote the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width, and other dimensions of various components in the embodiments of this application shown in the accompanying drawings, as well as the overall thickness, length, width, and other dimensions of the integrated device, are merely illustrative and should not constitute any limitation on this application.

[0045] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces), unless otherwise explicitly specified.

[0046] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0047] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0048] Currently, to achieve large-size displays with Micro LED panels, multiple smaller screens are typically spliced ​​together. To minimize screen bezels and achieve seamless splicing, existing technologies usually employ side-wiring techniques, directing the circuitry to the back. Please refer to... Figure 1 , Figure 1 This is a schematic diagram of the splicing of display panels in the prior art. After seamless splicing, a splicing gap B is formed between two adjacent screens. The blackness of the display area A and the splicing gap B are inconsistent, which can easily cause the problem of white edges at the splicing seam, making the splicing seam visible when viewed from the front of the screen.

[0049] Meanwhile, due to the thin side encapsulation layer in the existing technology, the screen's waterproof and oxygen resistance / weather resistance are low. Moreover, because the side encapsulation layer is thin and the conductive particle layer 4 is exposed in the splicing gap, external electrostatic discharge can enter the screen from the conductive particle layer 4 and the side encapsulation layer, thereby causing damage to the screen.

[0050] In order to improve and optimize the quality of splicing screens, the applicant has conducted in-depth research and invented a display panel. By adding a black optical encapsulation layer 8 to the existing back panel side wiring, the light below the splicing seam is absorbed and the splicing seam is not visible when viewed from the front of the screen. At the same time, by cutting the conductive particle layer 4, the black optical encapsulation layer 8 fills the outside of the side wiring, which not only enhances the reliability of electrostatic protection, but also enhances the reliability of the side wiring.

[0051] Please refer to Figure 2 and Figure 3 , Figure 2 and Figure 3 The diagrams show the structural features of the display panel of this application with and without side wiring. An embodiment of this application provides a display panel comprising:

[0052] The substrate 1 includes a first surface 11, a second surface 12 disposed opposite to each other, and a side surface 13 connecting the first surface 11 and the second surface 12. A TFT circuit layer 2, a pad circuit layer 3, a conductive particle layer 4, an LED chip array 5, and an optical film 6 are sequentially disposed on the first surface 11 along the thickness direction of the substrate 1.

[0053] Side trace 7 is disposed on the side surface 13. One end of the side trace 7 extends to the first surface 11 and is electrically connected to the TFT circuit layer 2 and the pad circuit layer 3, and the other end extends to the second surface 12.

[0054] An optical encapsulation layer 8, which is black, is disposed around the periphery of the substrate 1.

[0055] In this embodiment, the substrate 1 can be a glass substrate 1, wherein the first surface 11 is the side of the substrate 1 facing the light-emitting surface, and the second surface 12 is the side of the substrate 1 facing the backlight surface. The side traces 7 can be located on one or two sides of the substrate 1, and there can be multiple side traces 7, which are spaced apart on the side surface 13 of the substrate 1.

[0056] Since the two ends of the side trace 7 need to extend to the first surface 11 and the second surface 12 respectively, the side trace 7 is roughly shaped at the edge of the substrate 1 after it is formed, so as to realize the electrical connection of the conductors on both sides of the substrate 1, thereby leading the circuit of the light-emitting surface to the back light surface.

[0057] In this application, a black optical encapsulation layer 8 is added to the four edges of the substrate 1 based on the existing side trace 7 on the back panel. After adjacent display panels are spliced, the optical encapsulation layer 8 can absorb the light below the splice seam, making the seam invisible when viewed from the front of the screen, thus improving the problem of obvious seam appearance. At the same time, since the optical encapsulation layer 8 fills the outer side of the side trace, it can enhance the reliability of the side trace.

[0058] According to some embodiments of this application, the side trace 7 is provided with a side trace encapsulation layer 71 on the side facing away from the substrate 1, and the optical encapsulation layer 8 at least partially covers the side trace encapsulation layer 71. Since the side trace 7 has a side trace encapsulation layer 71 on its outer side, by having the optical encapsulation layer 8 at least partially cover the side trace encapsulation layer 71, it is equivalent to thickening at least a portion of the side trace encapsulation layer 71, thereby improving the problem of low reliability such as waterproof oxygen performance / weather resistance caused by the thin side encapsulation layer in the prior art, further enhancing the reliability of the side trace, and reducing the impact of external electrostatic discharge on the screen.

[0059] According to some embodiments of this application, the side trace encapsulation layer 71 has an inverted cross-section to cover the outside of the side trace 7. Since the side trace 7 is approximately inverted at the edge of the substrate 1 after being formed, the shape of the side trace encapsulation layer 71 is approximately similar to it and covers the outside of the side trace 7, thereby protecting the side trace 7.

[0060] According to some embodiments of this application, the conductive particle layer 4 has a cut-out region C around its perimeter, such that the edge of the conductive particle layer 4 is located inside the perimeter edge of the substrate 1. For example... Figure 5 As shown, the excised area C is located around the perimeter of the conductive particle layer 4 and can be removed by laser D after the conductive particle layer 4 is attached. In this example, the excised area C extends inward from the edge of the conductive particle layer 4 with a certain width. Preferably, the width of the excised area C is approximately equal to the width of the side area, that is, the width area occupied by the side trace 7.

[0061] Since the conductive particle layer 4 is cut off at its periphery after being attached to form the cut area C, the conductive particle layer 4 can be surrounded inside after the optical encapsulation layer 8 is made. This prevents the conductive particle layer 4 from being directly exposed in the seam and prevents external electrostatic discharge from entering the screen body from the conductive particle layer 4, causing damage to the screen body.

[0062] According to some embodiments of this application, the cross-section of the optical encapsulation layer 8 is L-shaped. By using an L-shaped black optical encapsulation layer 8, not only can the conductive particle layer 4 be prevented from being exposed in the seam, but it can also thicken the two sides of the side trace encapsulation layer 71, which is beneficial to enhancing the reliability of the side trace and the reliability of electrostatic discharge protection.

[0063] Please refer to Figures 8 to 9 , Figure 8 and Figure 9A schematic diagram of another C-shaped optical encapsulation layer 8 is shown. According to some embodiments of this application, the cross-section of the optical encapsulation layer 8 is C-shaped. By adopting a C-shaped black optical encapsulation layer 8, not only can the conductive particle layer 4 be prevented from being exposed in the seam, but it can also thicken all the outer surfaces of the side trace encapsulation layer 71, further enhancing the reliability of the side traces and the reliability of electrostatic discharge protection.

[0064] According to some embodiments of this application, the optical encapsulation layer 8 is formed by dispensing, pad printing, or film application after side wiring encapsulation. Based on the actual manufacturing process of the display panel, the optical encapsulation layer 8 in this embodiment can be formed by adding dispensing, pad printing, or film application after side wiring encapsulation. This black optical encapsulation layer 8 effectively improves the display effect after the display panel is spliced.

[0065] According to some embodiments of this application, the optical encapsulation layer 8 can be implemented using one of the following: organic adhesives, organic-doped inorganic adhesives, or organic films. The black optical encapsulation layer 8 in this application can be formed using one of the following: organic adhesives, organic-doped inorganic adhesives, or organic films, through processes such as dispensing, pad printing, or lamination.

[0066] Please refer to Figures 4 to 7 , Figures 4 to 7 The diagrams sequentially illustrate the display panel of this application after side wiring 7 and encapsulation, attachment and cutting of conductive particle layer 4, fabrication of optical encapsulation layer 8, and transfer and fabrication of optical film 6. An embodiment of this application provides a method for fabricating the above-described display panel, comprising:

[0067] After sequentially setting the TFT circuit layer 2 and the pad circuit layer 3 on the substrate 1, the side trace 7 and the side trace encapsulation layer 71 are fabricated.

[0068] The conductive particle layer 4 is attached, and the edge of the conductive particle layer 4 is laser-cut to remove the cut area C at the edge of the conductive particle layer 4, so that the edge of the conductive particle layer 4 is located inside the periphery of the substrate 1.

[0069] A black optical encapsulation layer 8 is formed around the perimeter of substrate 1;

[0070] 6. Transfer and fabrication of optical films.

[0071] Specifically, a TFT circuit layer 2 and a pad circuit layer 3 are fabricated on the first surface 11 of the substrate 1, and then side routing and encapsulation are performed to lead the circuits on the first surface 11 of the substrate 1 to the second surface 12; then a conductive particle layer 4 is attached, and the edge of the conductive particle layer 4 is laser-cut using a laser cutting process so that its edge is located inside the periphery of the substrate 1; then a black optical encapsulation layer 8 is fabricated on the periphery of the substrate 1 to surround the conductive particle layer 4, the side routing and encapsulation inside; finally, a transfer process and an optical film 6 are performed.

[0072] After the display panel prepared by the above process is spliced, the black optical encapsulation layer 8 can absorb the light below the splice seam, making the splice seam invisible when viewed from the front of the screen, and thus increasing reliability. At the same time, after laser cutting the conductive particle layer 4, the black optical encapsulation layer 8 fills the perimeter of the screen, enhancing the reliability of electrostatic protection.

[0073] Please refer to Figure 10 This application provides a splicing display device comprising at least two display panels spliced ​​together as described above. After multiple display panels are spliced, a seam is formed between adjacent display panels. Since the black optical encapsulation layer 8 fills the perimeter of the screen, the optical encapsulation layer 8 can absorb the light below the seam, thus making the seam invisible when viewed from the front of the screen. This improves the problem of obvious seam appearance and increases reliability.

[0074] It should be noted that the splicing display device in this embodiment only demonstrates the splicing of two display panels. It is understood that in some other feasible embodiments, splicing can also be performed in four directions (up, down, left, right) or more directions to form a larger display screen, which will not be elaborated here.

[0075] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that, include: The substrate includes a first surface, a second surface, and a side surface connecting the first surface and the second surface, which are disposed opposite to each other. A TFT circuit layer, a pad circuit layer, a conductive particle layer, an LED chip array, and an optical film are sequentially disposed on the first surface along the thickness direction of the substrate. Side traces are disposed on the side surface, with one end extending to the first surface and electrically connected to the TFT circuit layer and the pad circuit layer, and the other end extending to the second surface; An optical encapsulation layer, which is black and is disposed around the periphery of the substrate.

2. The display panel according to claim 1, characterized in that, The side trace has a side trace encapsulation layer on the side away from the substrate, and the optical encapsulation layer covers at least a portion of the side trace encapsulation layer.

3. The display panel according to claim 2, characterized in that, The side trace encapsulation layer has a U-shaped cross section to cover the outside of the side trace.

4. The display panel according to claim 2, characterized in that, The conductive particle layer has a cut-out area around its perimeter so that the edge of the conductive particle layer is located inside the perimeter of the substrate.

5. The display panel according to claim 4, characterized in that, The cross-section of the optical encapsulation layer is L-shaped.

6. The display panel according to claim 4, characterized in that, The cross-section of the optical encapsulation layer is shaped like an inverted triangle.

7. The display panel according to any one of claims 1-6, characterized in that, The optical encapsulation layer is formed by dispensing, pad printing, or film application after side wiring encapsulation.

8. The display panel according to any one of claims 1-6, characterized in that, The optical encapsulation layer can be implemented using one of the following: organic adhesives, organic-doped inorganic adhesives, or organic films.

9. A method for manufacturing a display panel as described in any one of claims 1-8, characterized in that, include: After setting the TFT circuit layer and the pad circuit layer on the substrate, side routing and packaging are performed. A conductive particle layer is attached, and the edges of the conductive particle layer are laser-cut so that the edges are located inside the perimeter of the substrate. A black optical encapsulation layer is fabricated around the perimeter of the substrate; Transfer and fabrication of optical films.

10. A splicing display device, characterized in that, It includes at least two display panels spliced ​​together and as described in any one of claims 1-8.

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