A method and apparatus for removing residual adhesive from a substrate.

Abstract

This invention belongs to the field of wet stripping technology and discloses a method and equipment for stripping residual adhesive on a substrate. The method for stripping residual adhesive on a substrate includes: conveying the substrate to a stripping device via a feeding device; spraying a stripping solution onto the substrate via the stripping device; and including the following steps: within a first stripping unit, the first nozzle of the first stripping unit sprays the stripping solution from top to bottom toward the top layer of the substrate to strip the residual adhesive on the top layer; the solution in the soaking tank of the first stripping unit soaks the bottom layer of the substrate to strip the residual adhesive on the bottom layer; a replacement device sprays clean water onto the substrate after passing through the stripping device to replace the residual solution on the substrate; a washing device cleans the substrate; a drying device dries the washed substrate; and a unloading device unloads the finished product. This method can accurately strip residual adhesive from the substrate without damaging the etched pattern, improving replacement efficiency and overall process stability.

Description

Technical Field

[0001] This invention relates to the field of wet peeling technology, and in particular to a method and apparatus for peeling residual adhesive from a substrate. Background Technology

[0002] In the AMOLED display panel array manufacturing process, after dry or wet etching, a wet stripping process is required to remove residual photoresist. The core mechanism of this process lies in supplying a wet stripping chemical solution to the substrate surface. The solution's penetration, swelling, and dissolution of the photoresist layer cause the photoresist to peel off from the patterned metal or semiconductor film surface, thus preserving the desired pattern structure while protecting the functional film from corrosion. However, existing wet stripping processes have certain limitations: firstly, because the substrate forms a "wider top, narrower bottom" structure after special etching processes, traditional stripping methods are prone to damaging the pattern or leaving incomplete stripping, resulting in photoresist residue; secondly, conventional stripping methods, due to poor stripping performance, can lead to insufficient subsequent replacement efficiency, thus affecting the overall process stability.

[0003] Therefore, there is an urgent need for a method and equipment for removing residual adhesive from substrates to solve the above-mentioned technical problems. Summary of the Invention

[0004] One objective of this invention is to provide a method for removing residual adhesive from a substrate. This method can not only accurately remove the residual adhesive from the substrate, but also avoid damaging the etched pattern. It improves the replacement efficiency while ensuring the removal effect, thereby enhancing the overall process stability.

[0005] To achieve this objective, the present invention adopts the following technical solution: A method for removing residual adhesive from a substrate, comprising: S100: The substrate is conveyed to the stripping device via the feeding device; S200: Spraying a stripping agent onto the substrate using a stripping device; S200 includes the following steps: within the first stripping unit... S210. The first nozzle of the first stripping unit sprays the stripping solution from top to bottom toward the top layer of the substrate to remove the residual adhesive from the top layer. S220, The solution in the soaking tank of the first stripping unit soaks the bottom layer of the substrate to remove the residual adhesive from the bottom layer; S300. The substrate that has been stripped by the replacement device is sprayed with clean water to replace the residual medicine on the substrate. S400: The substrate is cleaned using a water washing device; S500: The substrate after being washed with water is dried using an air-drying device; S600: Finished products are unloaded via a feeding device.

[0006] Preferably, in step S220, the oscillator in the soaking tank is turned on so that the medicinal liquid vibrates at a preset frequency.

[0007] Preferably, step S200 includes the following step: when the substrate enters the second stripping unit after passing through the first stripping unit, S230. The second peeling unit has a plurality of first nozzles, and the first nozzles are provided above and below the substrate. The first nozzles can spray liquid to peel off the residual adhesive on the sidewall of the substrate.

[0008] Preferably, step S200 includes the following step: when the substrate enters the third peeling unit after passing through the second peeling unit, S240. The third peeling unit has a plurality of second nozzles, and the second nozzles are provided above and below the substrate. The second nozzles can spray liquid to peel off the residual adhesive on the sidewall of the substrate.

[0009] Preferably, step S200 includes the following step: when the substrate enters the fourth stripping unit after passing through the third stripping unit, S250. The fourth peeling unit has a second nozzle with multiple angles. The second nozzle can spray liquid at multiple angles to perform secondary peeling of residual adhesive on the substrate.

[0010] Preferably, S300 includes the following step: during the first replacement stage... S310, the multiple third nozzles of the replacement device can spray water mist onto the substrate, so that the surface of the substrate is wetted, and the first replacement stage has a heater for raising the temperature during the replacement of water and medicine.

[0011] Preferably, step S300 includes the following step: when the substrate reaches the second replacement stage after passing through the first replacement stage... S320, the two liquid blades of the replacement device are angled against the substrate.

[0012] Preferably, step S300 includes the following step: when the substrate reaches the third replacement stage after passing through the second replacement stage... S330, the multiple fourth nozzles of the replacement device can spray water towards the substrate, and the spraying range completely covers the substrate.

[0013] Preferably, step S100 includes the following steps: S110. The robotic arm of the feeding unit places the substrate in a preset position according to a preset posture; S120, The transfer unit transfers the substrate to the transition process area; S130, The lifting unit transfers the substrate from the transition process zone to the target process zone upstream of the stripping device.

[0014] Another objective of this invention is to provide a device for removing residual adhesive from a substrate, which improves the ease of execution of the above-mentioned method and increases work efficiency.

[0015] To achieve this objective, the present invention adopts the following technical solution: A device for removing residual adhesive from a substrate, wherein the method for removing residual adhesive from the substrate is performed using the device, and the device comprises: The feeding device includes the feeding unit, the conveying unit, and the lifting unit; The stripping device is located downstream of the feeding device and has a first stripping unit, a second stripping unit, a third stripping unit, and a fourth stripping unit arranged sequentially. An isolation unit is disposed between the feeding device and the stripping device to isolate the liquid medicine; The replacement device is located downstream of the stripping device, and an air curtain is provided between the replacement device and the stripping device. The replacement device includes a first replacement stage, a second replacement stage, and a third replacement stage arranged sequentially. The water washing device is located downstream of the replacement device; The air-drying device is located downstream of the washing device; The feeding device is located downstream of the drying device; A liquid storage tank is connected to the stripping device, and the liquid storage tank is used to recover the waste liquid generated by the stripping device.

[0016] The beneficial effects of this invention are: This invention discloses a method for removing residual adhesive from a substrate. The method includes: conveying the substrate to a peeling device via a feeding device; spraying a peeling solution onto the substrate via the peeling device; and the following steps: within a first peeling unit, the first nozzle of the first peeling unit sprays the peeling solution from top to bottom toward the top layer of the substrate to peel off the residual adhesive; the solution in the soaking tank of the first peeling unit soaks the bottom layer of the substrate to peel off the residual adhesive; a replacement device sprays clean water onto the substrate after passing through the peeling device to replace the residual solution on the substrate; a washing device cleans the substrate; a drying device dries the washed substrate; and a unloading device unloads the finished product.

[0017] In this method, the feeding device enables automatic feeding, thereby improving the degree of automation and increasing operational efficiency. In the first stripping unit, the first nozzle at the top sprays a chemical solution onto the top layer of the substrate, thereby stripping the photoresist on the top layer. The sprayed chemical solution ensures that the pattern on the top layer is not damaged. At the same time, the bottom layer is located in the immersion tank, so the chemical solution in the immersion tank can immerse and strip the bottom layer. By separating the top and bottom layers, the residual adhesive on the top and bottom layers is stripped separately. Furthermore, the amount of chemical solution removed from the top and bottom layers is different during the stripping process, so there is no damage to the etched pattern. This ensures a good stripping effect and lays a good foundation for subsequent replacement work, improving the efficiency of later replacement and enhancing the overall process stability.

[0018] The present invention also provides a device for removing residual adhesive on a substrate. The method for removing residual adhesive on a substrate using this device can improve the convenience of the above method and improve work efficiency. Attached Figure Description

[0019] Figure 1 This is a logic diagram of the method for removing residual adhesive from a substrate according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the substrate structure according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the adhesive stripping device on the substrate described in an embodiment of the present invention. Figure 4 This is a schematic diagram of the structure of the first stripping unit according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the second stripping unit according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the third stripping unit according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the fourth stripping unit according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the replacement device described in an embodiment of the present invention.

[0020] In the picture: 10. Feeding device; 11. Feeding unit; 12. Conveying unit; 13. Lifting unit; 20. Peeling device; 21. First peeling unit; 211. First nozzle; 212. Soaking tank; 213. Vibrator; 22. Second peeling unit; 221. First nozzle; 23. Third peeling unit; 231. Second nozzle; 24. Fourth peeling unit; 241. Second nozzle; 30. Displacement device; 31. Third nozzle; 32. Liquid knife; 33. Fourth nozzle; 40. Water washing device; 50. Air drying device; 60. Feeding device; 70. Isolation unit; 100, substrate; 110, top layer; 120, bottom layer. Detailed Implementation

[0021] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0022] In this invention, the terms "comprising," "including," "having," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0023] In this invention, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A alone, A and B simultaneously, and B alone. Additionally, in this invention, the character " / " generally indicates that the preceding and following related objects have an "and / or" relationship.

[0024] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," "fixed," "combined," "coupled," and "installed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a direct connection or an indirect connection via an intermediate medium; or the internal communication of two components or the interaction between two components. As examples, a direct connection refers to two parts or components being connected together without the need for an intermediate medium, while an indirect connection refers to two parts or components each being connected to at least one intermediate medium, with the connection achieved through the intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, "connected" and "coupled" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0025] In this invention, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the value and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​not using relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0026] In this invention, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0027] In this invention, the terms "upper," "lower," "left," "right," "front," and "rear," etc., refer to the orientations or positional relationships shown in the accompanying drawings. They are used solely for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, in the context, it should be understood that when an element is mentioned as being "upper" or "lower" than another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as "upper side," "lower side," "left side," "right side," "front side," and "rear side" not only represent positive orientation but can also be understood as lateral orientation. For example, "above," "on top of," "upper side of," and "above" the first feature "above" or "on the second feature" includes the first feature being directly above, to the upper left, to the upper right, to the upper front, and to the upper rear of the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature. The terms "below," "under," "below," and "below" for "first feature" and "second feature" include situations where the first feature is directly below, to the lower left, to the lower right, in front of, or behind the second feature, or simply indicate that the first feature is at a lower horizontal level than the second feature. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no specific meaning.

[0028] In the AMOLED display panel array manufacturing process, after dry or wet etching, a wet stripping process is required to remove residual photoresist. The core mechanism of this process is to supply a wet stripping chemical solution to the substrate surface. The solution's penetration, swelling, and dissolution of the photoresist layer allow the photoresist to be stripped from the patterned metal or semiconductor film surface, thus preserving the desired pattern structure while protecting the functional film from corrosion. However, existing wet stripping processes have certain limitations: firstly, because the substrate forms a "wider top, narrower bottom" structure after special etching processes, traditional stripping methods are prone to damaging the pattern or leaving incomplete stripping, resulting in photoresist residue; secondly, conventional stripping methods, due to poor stripping performance, can lead to insufficient subsequent replacement efficiency, thus affecting the overall process stability. To address these problems, this embodiment provides a method for stripping residual photoresist from a substrate. The technical solution of this invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0029] like Figures 1 to 8 As shown, the method for removing residual adhesive from the substrate includes the following steps: S100, The substrate 100 is conveyed to the stripping device 20 by the feeding device 10; S200: Spraying a stripping agent onto the substrate 100 via the stripping device 20; S200 includes the following steps: within the first stripping unit 21... S210, the first nozzle 211 of the first peeling unit 21 sprays peeling liquid from top to bottom toward the top layer 110 of the substrate 100 to peel off the residual adhesive on the top layer 110. S220, the solution in the soaking tank 212 of the first peeling unit 21 soaks the bottom layer 120 of the substrate 100 to peel off the residual adhesive of the bottom layer 120. S300: The substrate 100 that has passed through the peeling device is sprayed with clean water by the replacement device 30 to replace the residual medicine on the substrate 100. S400, the substrate 100 is cleaned by the water washing device 40; S500, the substrate 100 after being washed is dried by the air-drying device 50; S600, finished products are unloaded via the unloading device 60.

[0030] In this method, the feeding device 10 can automatically feed materials, thereby improving the degree of automation and increasing work efficiency. In the first stripping unit 21, the first nozzle 211 above can spray a chemical solution onto the top layer 110 of the substrate 100, thereby stripping the photoresist on the top layer 110. The sprayed chemical solution ensures that the pattern on the top layer 110 is not damaged. At the same time, the bottom layer 120 is located in the soaking tank 212, so the chemical solution in the soaking tank 212 can soak and strip the bottom layer 120. By separating the top and bottom layers, the residual adhesive on the top layer 110 and the bottom layer 120 are stripped respectively. The amount of chemical solution removed from the top layer 110 and the bottom layer 120 is different during the stripping process, so the etched pattern will not be damaged. This ensures a good stripping effect and also lays a good foundation for subsequent replacement work, improving the efficiency of subsequent replacement and enhancing the stability of the overall process.

[0031] It should be noted that, as Figure 1 and Figure 3 As shown, S100 includes the following steps: S110, the robotic arm of the feeding unit 11 places the substrate 100 in a preset position according to a preset posture; S120, the conveying unit 12 conveys the substrate 100 to the transition process area; S130, the lifting unit 13 conveys the substrate 100 from the transition process area to the target process area upstream of the peeling device 20.

[0032] In step S110, after the robotic arm places the substrate 100 in the preset position within the feeding unit 11, it uses a cylinder to drive the substrate 100 to correct its position, bringing it into a preset posture. Step S120 achieves substrate 100 transfer, and during the transfer process, electrostatic protection measures (such as using ion bars, using rollers made of special conductive material, and shaft grounding) significantly reduce the static electricity on the surface of the substrate 100. Finally, step S130 transfers the substrate 100 from the transition process zone to the area to be peeled off, facilitating subsequent peeling operations. The entire feeding process is fully automated, requiring no manual operation, which not only improves feeding efficiency but also avoids operators directly touching the substrate 100 with residual adhesive.

[0033] Furthermore, within the first stripping unit 21, the first nozzle 211 is a fan-shaped nozzle, and the liquid is sprayed using alternating atmospheric pressure spraying and high pressure spraying to ensure uniform spraying and thus ensure a good stripping effect.

[0034] In addition, such as Figure 4As shown, in S220, the oscillator 213 in the soaking tank 212 is turned on to make the medicine solution vibrate at a preset frequency. The oscillator 213 can make the medicine solution in the soaking tank 212 vibrate at a certain frequency, thereby fully improving the contact surface between the medicine solution and the bottom layer 120, providing good conditions for the peeling reaction, and thus ensuring a good reaction effect.

[0035] After completing the above steps, as follows Figure 5 As shown, S200 includes the following steps: When the substrate 100 enters the second peeling unit 22 after passing through the first peeling unit 21, S230, the second peeling unit 22 has multiple first nozzles 221, and the first nozzles 221 are provided above and below the substrate 100. The first nozzles 221 can spray a liquid to peel off the residual adhesive on the sidewall of the substrate 100. In this step, the multiple first nozzles 221 can spray the liquid simultaneously onto the top layer 110 and the bottom layer 120 of the substrate 100, thereby further accelerating the swelling of the residual adhesive after the initial peeling of the first peeling unit 21, improving the peeling ability. At the same time, the multiple first nozzles 221 can also increase the wetting speed of the residual adhesive on the inner sidewall of the channel of the substrate 100, ensuring the effectiveness of peeling.

[0036] It should be noted here that, as Figure 6 As shown, step S200 includes the following steps: When the substrate 100 enters the third peeling unit 23 after passing through the second peeling unit 22, step S240 describes how the third peeling unit 23 has multiple second nozzles 231, with second nozzles 231 positioned both above and below the substrate 100. The second nozzles 231 can spray a chemical solution to peel off residual adhesive from the sidewalls of the substrate 100. In other words, the third peeling unit 23 functions identically to the second peeling unit 22, thereby significantly improving the wetting effect of the chemical solution on the residual adhesive and ensuring a good peeling effect.

[0037] Furthermore, the second stripping unit 22 and the third stripping unit 23 have a structure in which atmospheric pressure nozzles and high pressure nozzles are arranged alternately, thereby providing a large number of microparticle-sized drug liquid particles with strong flow and penetration capabilities.

[0038] In addition, such as Figure 7 As shown, step S200 includes the following steps: When the substrate 100 enters the fourth stripping unit 24 after passing through the third stripping unit 23, step S250 involves the fourth stripping unit 24 having multiple second nozzles 241 at various angles. These second nozzles 241 can spray a chemical solution at multiple angles to perform a secondary stripping of the residual photoresist on the substrate 100. The multiple second nozzles 241 in the fourth stripping unit 24 can be sprayed in a counter-current manner to ensure that the chemical solution is sprayed omnidirectionally to cover all angles, thereby performing a secondary stripping of the photoresist remaining on the substrate 100, which has a "wider top and narrower bottom" structure, thus ensuring the overall stripping effect.

[0039] It should be noted that in the fourth stripping unit 24, the second nozzle 241 is an atmospheric pressure fan-shaped nozzle. The atmospheric pressure fan-shaped nozzles in the front half are all tilted in the same direction, while the atmospheric pressure fan-shaped nozzles in the rear half are all tilted in another direction. The nozzles in the front half and the rear half form a front-to-back opposing structure, and the nozzles at the bottom spray the liquid at a vertically upward angle.

[0040] Furthermore, air curtains are installed at the inlet and outlet of each stripping unit. These air curtains isolate the liquid medication on the surface of the substrate 100 within the stripping unit, allowing it to flow back to the lower storage tanks for reuse. Additionally, an isolation unit 70 is provided between the feeding device 10 and the stripping device 20. This isolation unit 70 is a grid capable of isolating the liquid medication gas. The grid is opened and closed by a cylinder-driven rotation, thereby preventing the liquid medication gas from diffusing and contaminating the front chamber in the subsequent stripping device 20.

[0041] like Figure 8 As shown, after the peeling is completed, the substrate 100 needs to enter the replacement device 30. Step S300 includes the following steps: In the first replacement stage, in step S310, multiple third nozzles 31 (fan-shaped nozzles, arranged in 2-3 rows) of the replacement device 30 spray water mist onto the substrate 100, keeping the surface of the substrate 100 wet. The first replacement stage also includes a heater to increase the temperature during the water and chemical replacement process. This step ensures that the surface of the substrate 100 remains wet, and the heater increases the reaction temperature, accelerating the water and chemical replacement. Further, step S300 includes the following steps: when the substrate 100 reaches the second replacement stage after passing through the first replacement stage, in step S320, the two liquid blades 32 of the replacement device 30 are angled against the substrate 100. The two liquid blades 32 can form an opposing structure, thereby targeting... Figure 2 The special "wider at the top and narrower at the bottom" structure of the substrate 100 shown enables the replacement of residual liquid at various angles.

[0042] Furthermore, S300 includes the following steps: when the substrate 100 reaches the third replacement stage after the second replacement stage, S330, the multiple fourth nozzles 33 (circular nozzles, multiple rows can be arranged) of the replacement device 30 can spray water towards the substrate 100, and the spraying range completely covers the substrate 100. In this stage, the multiple fourth nozzles 33 can utilize the characteristics of sufficient flow and large impact coverage to perform a comprehensive secondary rapid replacement of the residual liquid on the surface of the substrate 100.

[0043] It should be noted that air curtains are installed at both the inlet and outlet of the replacement device 30 to prevent the chemical gas in the preceding stripping device 20 from mixing with the water gas in the subsequent water washing unit, thereby ensuring a good replacement effect.

[0044] In addition, in step S400, pressure modules such as roller brushes, two-fluid systems, and HPMJ are used in conjunction with ordinary fan-shaped nozzles to spray and clean particles of different sizes on the surface of the substrate 100.

[0045] In step S500, a partition is used to separate the wet and dry parts of the air knife, and a double-edged air knife is used to dry the surface of the substrate 100. Water mist prevention is provided to ensure that the generated water vapor will not cover the dried substrate 100 again.

[0046] In step S600, the substrate 100 is aligned to a preset posture by the alignment mechanism of the unloading device 60, and finally the substrate is taken out by the robot arm.

[0047] The present invention also provides a device for removing residual adhesive on a substrate, such as... Figure 3 As shown, the above-mentioned method for removing residual adhesive from the substrate is performed using a substrate residual adhesive removal device. The substrate residual adhesive removal device includes a feeding device 10, a removal device 20, an isolation unit 70, a replacement device 30, a washing device 40, a drying device 50, a discharging device 60, and a storage tank. The feeding device 10 has an infeed unit 11, a conveying unit 12, and a lifting unit 13. The removal device 20 is located downstream of the feeding device 10 and has a first removal unit 21, a second removal unit 22, a third removal unit 23, and a fourth removal unit 24 arranged sequentially. The separation unit 70 is located between the feeding device 10 and the stripping device 20 to isolate the liquid medicine; the replacement device 30 is located downstream of the stripping device 20, and an air curtain is provided between the replacement device 30 and the stripping device 20. The replacement device 30 includes a first replacement stage, a second replacement stage, and a third replacement stage arranged in sequence; the water washing device 40 is located downstream of the replacement device 30; the air drying device 50 is located downstream of the water washing device 40; the feeding device 60 is located downstream of the air drying device 50; and the liquid storage tank is connected to the stripping device 20 and is used to recover the waste liquid generated by the stripping device 20.

[0048] Based on this equipment, the above method can be executed smoothly, thereby accurately removing the residual colloid on the substrate without damaging the etched pattern. While ensuring the removal effect, it improves the replacement efficiency, thereby enhancing the overall process stability and ensuring operational efficiency.

[0049] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for removing residual adhesive from a substrate, characterized in that, include: S100, the substrate (100) is conveyed to the stripping device by the feeding device (10); S200, spraying a stripping solution onto the substrate (100) using the stripping device (20); S200 includes the following steps: within the first stripping unit (21), S210, the first nozzle (211) of the first stripping unit (21) sprays the stripping solution from top to bottom toward the top layer (110) of the substrate (100) to strip the residual adhesive from the top layer (110); S220, the solution in the soaking tank (212) of the first peeling unit (21) soaks the bottom layer (120) of the substrate (100) to peel off the residual adhesive of the bottom layer (120); S300: The substrate (100) that has passed through the peeling device is sprayed with clean water by the replacement device (30) to replace the residual medicine on the substrate (100); S400, the substrate (100) is cleaned by a water washing device (40); S500, the substrate (100) after being washed is dried by the air drying device (50); S600, finished products are unloaded by the unloading device (60).

2. The method for peeling off residual adhesive on a substrate according to claim 1, characterized in that, In S220, the oscillator (213) in the soaking tank (212) is turned on so that the medicine solution vibrates at a preset frequency.

3. The method for peeling off residual adhesive on a substrate according to claim 2, characterized in that, The S200 includes the following steps: when the substrate (100) enters the second peeling unit (22) after passing through the first peeling unit (21), S230, the second peeling unit (22) has a plurality of first nozzles (221), and the first nozzles (221) are provided above and below the substrate (100). The first nozzles (221) can spray liquid to peel off the residual adhesive on the sidewall of the substrate (100).

4. The method for peeling off residual adhesive on a substrate according to claim 3, characterized in that, S200 includes the following steps: when the substrate (100) enters the third peeling unit (23) after passing through the second peeling unit (22), S240, the third peeling unit (23) has a plurality of second nozzles (231), and the second nozzles (231) are provided above and below the substrate (100). The second nozzles (231) can spray liquid to peel off the residual adhesive on the sidewall of the substrate (100).

5. The method for peeling off residual adhesive on a substrate according to claim 4, characterized in that, The S200 includes the following steps: when the substrate (100) enters the fourth peeling unit (24) after passing through the third peeling unit (23), S250, the fourth peeling unit (24) has a second nozzle (241) with multiple angles. The second nozzle (241) can spray liquid at multiple angles to peel off the residual adhesive from the substrate (100) for a second time.

6. The method for peeling off residual adhesive on a substrate according to claim 5, characterized in that, The S300 includes the following steps: during the first replacement stage, S310, the multiple third nozzles (31) of the replacement device (30) can spray water mist onto the substrate (100) to keep the surface of the substrate (100) wet, and the first replacement stage has a heater to raise the temperature during water and drug replacement.

7. The method for peeling off residual adhesive on a substrate according to claim 6, characterized in that, The S300 includes the following steps: when the substrate (100) reaches the second replacement stage after passing through the first replacement stage, S320, the two liquid blades (32) of the replacement device (30) are angled against the substrate (100).

8. The method for peeling off residual adhesive on a substrate according to claim 7, characterized in that, The S300 includes the following steps: when the substrate (100) reaches the third replacement stage after passing through the second replacement stage, S330, the plurality of fourth nozzles (33) of the replacement device (30) can spray water toward the substrate (100) and the spray range completely covers the substrate (100).

9. The method for peeling off residual adhesive on a substrate according to claim 8, characterized in that, S100 includes the following steps: S110, the robotic arm of the feeding unit (11) places the substrate (100) in a preset position according to a preset posture; S120, the transfer unit (12) transfers the substrate (100) to the transition process area; S130, the lifting unit (13) transfers the substrate (100) from the transition process zone to the target process zone upstream of the stripping device (20).

10. A device for peeling off residual adhesive on a substrate, characterized in that, The method for removing residual adhesive on a substrate according to claim 9 is performed using the same adhesive removal device, wherein the adhesive removal device comprises: The feeding device (10) includes the feeding unit (11), the conveying unit (12), and the lifting unit (13). The peeling device (20) is located downstream of the feeding device (10) and has a first peeling unit (21), a second peeling unit (22), a third peeling unit (23) and a fourth peeling unit (24) arranged in sequence. An isolation unit (70) is disposed between the feeding device (10) and the stripping device (20) for isolating the liquid medicine; The replacement device (30) is located downstream of the stripping device (20), and an air curtain is provided between the replacement device (30) and the stripping device (20). The replacement device (30) includes a first replacement stage, a second replacement stage and a third replacement stage arranged sequentially. The water washing device (40) is located downstream of the replacement device (30); The air-drying device (50) is located downstream of the washing device (40); The feeding device (60) is located downstream of the drying device (50); A liquid storage tank is connected to the stripping device (20) and is used to recover the waste liquid generated by the stripping device (20).

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