A display motherboard and its cutting method, and a display panel

Abstract

This invention relates to the field of display technology, and discloses a display motherboard, its cutting method, and a display panel. The display motherboard includes a first substrate and a second substrate; the first and second substrates are aligned along a first direction to form a plurality of panel units arranged in an array; each panel unit includes a display area and a stripping bonding area, the display area and the stripping bonding area are arranged along a second direction, and a groove is provided between the display area and the stripping bonding area; along the second direction, every two panel units constitute a repeating unit, and the two display areas in the repeating unit are arranged adjacent to each other. The display motherboard of this invention forms a periodic arrangement by repeating the stripping bonding area, the display area, and the stripping bonding area as a minimum period, thereby ensuring that each panel unit has only one corresponding groove. This increases the number of panel units while maintaining a fixed total area of ​​the display motherboard, thus increasing the number of display panels after cutting.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display motherboard and its cutting method, and a display panel. Background Technology

[0002] OLED (Organic Light-Emitting Diode) display panels are self-emissive display components that use organic light-emitting diode technology. They can achieve pixel-level light emission without backlighting, and emit light by exciting organic materials with an electric field. They have advantages such as high contrast, wide viewing angle, fast response, and flexible design. In the manufacturing process of OLED display panels, a motherboard is typically created first, and then the motherboard is cut to form multiple OLED display panels.

[0003] In the current OLED display panel manufacturing process, the OLED display motherboard is divided into multiple independent panel units before cutting. Each unit contains a display area and a bonding area to be peeled off. To prevent adhesive used for bonding from overflowing from the display area into the bonding area, a groove structure is usually set between adjacent display areas and bonding areas. However, since the display area and bonding area are arranged alternately on the substrate, each panel unit has two corresponding grooves. This structure limits the number of panel units that can be laid out with a fixed total substrate area, resulting in fewer OLED display panels that can be cut into shape. Summary of the Invention

[0004] The purpose of this invention is to provide a display motherboard and its cutting method, as well as a display panel, to solve the problem in the prior art that, because the display area and the area to be peeled off and bonded are alternately arranged on the substrate, each panel unit has two corresponding grooves, which limits the number of panel units to be laid out when the total area of ​​the substrate is fixed, resulting in fewer OLED display panels that can be cut and formed.

[0005] To achieve this objective, the present invention adopts the following technical solution: In a first aspect, the present invention provides a display motherboard, comprising: A first substrate and a second substrate are disposed opposite each other along a first direction to form a plurality of panel units arranged in an array; each panel unit includes a display area and a stripping bonding area, the display area and the stripping bonding area are arranged along a second direction, and a groove is provided between the display area and the stripping bonding area. Along the second direction, every two panel units form a set of repeating units, and the two display areas in the repeating units are arranged adjacent to each other.

[0006] As an alternative to the aforementioned display motherboard, the first substrate includes a plurality of first longitudinal cutting lines extending along the second direction and a plurality of first transverse cutting lines extending along the third direction, the first longitudinal cutting lines and the first transverse cutting lines surrounding the periphery of the panel unit; the second substrate includes a plurality of second longitudinal cutting lines extending along the second direction and a plurality of second transverse cutting lines extending along the third direction, the second longitudinal cutting lines and the second transverse cutting lines surrounding the periphery of the display area.

[0007] As an alternative to the aforementioned display motherboard, the groove is formed on the side of the second substrate facing the first substrate, and the second transverse cutting line between the display area and the bonding area to be peeled off is opposite to the groove.

[0008] As an optional solution for the above-mentioned display motherboard, the distance between the second transverse cutting line between the display area and the bonding area of ​​the piece to be peeled and the groove edge of the groove near the display area is in the range of 0.2mm to 0.4mm.

[0009] As an alternative to the aforementioned display motherboard, the two first horizontal cutting lines between two adjacent panel units are arranged to overlap; within the repeating unit, the two second horizontal cutting lines between two adjacent display areas are arranged to overlap.

[0010] As an alternative to the aforementioned display motherboard, within the repeating unit, the second transverse cutting line between two adjacent display areas is correspondingly arranged with the first transverse cutting line along the first direction.

[0011] As an optional solution for the aforementioned display motherboard, the two first longitudinal cutting lines between two adjacent panel units are arranged to coincide, and the two second longitudinal cutting lines between two adjacent panel units are arranged to coincide.

[0012] As an alternative to the aforementioned display motherboard, the first longitudinal cutting line and the second longitudinal cutting line are arranged in a one-to-one correspondence along the first direction.

[0013] Secondly, the present invention provides a method for cutting a display motherboard, applied to the display motherboard as described above, the method comprising the following steps: A first longitudinal cutting line and a first transverse cutting line are marked on the first substrate of the display motherboard, and a second longitudinal cutting line and a second transverse cutting line are marked on the second substrate of the display motherboard. The second substrate is placed on a cutting table, and the first substrate is cut along the first longitudinal cutting line to form a first longitudinal cutting groove, and the first substrate is cut along the first transverse cutting line to form a first transverse cutting groove. The first substrate is placed on the cutting table, and the second substrate is cut along the second longitudinal cutting line to form a second longitudinal cutting groove, and the second substrate is cut along the second transverse cutting line to form a second transverse cutting groove. A splitting force is applied to the cut display motherboard to cause the first substrate to split along the first longitudinal cutting groove and the first transverse cutting groove, and the second substrate to split along the second longitudinal cutting groove and the second transverse cutting groove.

[0014] Thirdly, the present invention provides a display panel, which is prepared by the display motherboard cutting method described above.

[0015] The beneficial effects of this invention are: The display motherboard includes a first substrate and a second substrate. The first substrate and the second substrate are aligned along a first direction to form a plurality of panel units arranged in an array. Each panel unit includes a display area and a bonding area for the substrate to be peeled off. A display structure is sealed between the first substrate and the second substrate at the display area. The display area and the bonding area for the substrate to be peeled off are arranged along a second direction, and a groove is provided between the display area and the bonding area for the substrate to be peeled off. The groove is provided to prevent adhesive from overflowing into the bonding area for the substrate to be peeled off during the alignment of the first substrate and the second substrate. In this arrangement, along the second direction, every two panel units form a set of repeating units, and the two display areas in the repeating units are arranged adjacent to each other. That is, each set of repeating units along the second direction has a strip-to-be-bonded area, a display area, a display area, and a strip-to-be-bonded area arranged sequentially. At the same time, along the second direction, repeating units with a minimum cycle of strip-to-be-bonded area, display area, display area, and strip-to-be-bonded area appear repeatedly, thus forming a periodic arrangement. This ensures that there is only one corresponding groove in each panel unit, thereby increasing the number of panel units while keeping the total area of ​​the display motherboard fixed. This increases the number of display panels after cutting and forming, and reduces the external size of the display panels.

[0016] The cutting method of the display motherboard of the present invention is applied to the display motherboard as described above. The cutting method of the display motherboard adopts the method of first cutting grooves and then splitting, that is, first cutting a first longitudinal cutting groove and a first transverse cutting groove on the first substrate, and then cutting a second longitudinal cutting groove and a second transverse cutting groove on the second substrate. This guides the splitting, precisely controls the separation process, protects the display area, and improves the product yield. In addition, when the display areas are adjacent to each other in each set of repeating units, the number of display panels after cutting and forming is increased. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the display motherboard provided in an embodiment of the present invention; Figure 2 This is a partial enlarged view of the second substrate provided in an embodiment of the present invention; Figure 3 This is a partial enlarged view of the first substrate provided in an embodiment of the present invention; Figure 4 This is a partial enlarged view of the side of the display motherboard provided in an embodiment of the present invention; Figure 5 This is a schematic flowchart of the method for cutting a display motherboard according to an embodiment of the present invention.

[0018] In the picture: 1. First substrate; 11. First longitudinal cutting line; 12. First transverse cutting line; 2. Second substrate; 21. Second longitudinal cutting line; 22. Second transverse cutting line; 3. Panel unit; 31. Display area; 32. Sheet to be peeled bonding area; 33. Groove. Detailed Implementation

[0019] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Furthermore, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0023] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] like Figures 1-4 As shown, the present invention provides a display motherboard that can be cut into several display panels.

[0025] The display motherboard includes a first substrate 1 and a second substrate 2. The first substrate 1 and the second substrate 2 are aligned along a first direction (i.e., the Z direction in the figure) to form a plurality of panel units 3 arranged in an array. Each panel unit 3 includes a display area 31 and a strip-to-be-bonded area 32. A display structure is sealed between the first substrate 1 and the second substrate 2 at the display area 31. The display area 31 and the strip-to-be-bonded area 32 are arranged along a second direction (i.e., the X direction in the figure), and a groove 33 is provided between the display area 31 and the strip-to-be-bonded area 32 to prevent glue from overflowing into the strip-to-be-bonded area 32 during the alignment of the first substrate 1 and the second substrate 2.

[0026] Along the second direction, every two panel units 3 form a set of repeating units, and the two display areas 31 in the repeating units are arranged adjacent to each other. That is, each set of repeating units is arranged in sequence along the second direction with a strip-to-be-peeled binding area 32, a display area 31, a display area 31, and a strip-to-be-peeled binding area 32. At the same time, along the second direction, repeating units with a minimum cycle of strip-to-be-peeled binding area 32, a display area 31, a display area 31, and a strip-to-be-peeled binding area 32 appear repeatedly, thus forming a periodic arrangement. This ensures that there is only one corresponding groove 33 in each panel unit 3, so that with a fixed total area of ​​the display motherboard, the number of panel units 3 can be increased, thereby increasing the number of display panels after cutting and forming, and reducing the external size of the display panels.

[0027] like Figures 2-4As shown, the first substrate 1 includes a plurality of first longitudinal cutting lines 11 extending along a second direction and a plurality of first transverse cutting lines 12 extending along a third direction (i.e., the Y direction in the figure). The first longitudinal cutting lines 11 and the first transverse cutting lines 12 surround the periphery of the panel unit 3, so that the cutting path of the first substrate 1 can be marked by the first longitudinal cutting lines 11 and the first transverse cutting lines 12, and the shape of the formed display panel on one side of the first substrate 1 can be precisely controlled, that is, the display panel retains the display area 31 and the peelable bonding area 32 on one side of the first substrate 1. The second substrate 2 includes a plurality of second longitudinal cutting lines 21 extending along a second direction and a plurality of second transverse cutting lines 22 extending along a third direction. The second longitudinal cutting lines 21 and the second transverse cutting lines 22 surround the periphery of the display area 31, so that the cutting path of the second substrate 2 can be marked by the second longitudinal cutting lines 21 and the second transverse cutting lines 22, and the shape of the formed display panel on one side of the second substrate 2 can be precisely controlled, that is, the display panel retains only the display area 31 on one side of the second substrate 2, so that the peelable bonding area 32 can be peeled off. Among them, the first direction, the second direction, and the third direction are set perpendicular to each other.

[0028] Specifically, the groove 33 is formed on the side of the second substrate 2 facing the first substrate 1, and the second transverse cutting line 22 between the display area 31 and the peelable bonding area 32 is opposite to the groove 33. Therefore, by setting the groove 33, the difficulty of peeling the display panel from the peelable bonding area 32 on the second substrate 2 can be reduced. Optionally, the distance between the second transverse cutting line 22 between the display area 31 and the peelable bonding area 32 and the groove edge of the groove 33 near the display area 31 is in the range of 0.2mm to 0.4mm, which can further reduce the peeling difficulty and improve product yield.

[0029] Furthermore, the two first transverse cutting lines 12 between two adjacent panel units 3 are arranged to overlap, and within the repeating unit, the two second transverse cutting lines 22 between two adjacent display areas 31 are arranged to overlap. This reduces the number of first transverse cutting lines 12 and second transverse cutting lines 22 when the total area of ​​the first substrate 1 and the total area of ​​the second substrate 2 are both fixed, thereby reducing the number of cutting blades and improving cutting efficiency. It also facilitates increasing the number of panel units 3 arranged in the second direction. Optionally, within the repeating unit, the second transverse cutting lines 22 between two adjacent display areas 31 are arranged corresponding to the first transverse cutting lines 12 along the first direction. This reduces the difficulty of peeling the first substrate 1 and the second substrate 2 during the peeling process and avoids potential edge chipping or breakage. It also compresses the ineffective area of ​​the display motherboard used for cutting in the second direction, enabling separation within the minimum cutting width through double-sided relative cutting.

[0030] Furthermore, the two first longitudinal cutting lines 11 between two adjacent panel units 3 are arranged to overlap, and the two second longitudinal cutting lines 21 between two adjacent panel units 3 are arranged to overlap. This reduces the number of first longitudinal cutting lines 11 and second longitudinal cutting lines 21 when the total area of ​​the first substrate 1 and the total area of ​​the second substrate 2 are both fixed, thereby reducing the cutting count and improving cutting efficiency. It also facilitates increasing the number of panel units 3 arranged in the third direction. Optionally, the first longitudinal cutting lines 11 and second longitudinal cutting lines 21 are arranged one-to-one along the first direction, thereby reducing the difficulty of peeling the first substrate 1 and the second substrate 2 during the peeling process and avoiding potential edge chipping or breakage. It also compresses the ineffective area of ​​the display motherboard used for cutting in the third direction, enabling separation within the minimum cutting width through double-sided relative cutting.

[0031] This embodiment also provides a method for cutting a display motherboard, applicable to the display motherboard described above, such as... Figure 5 As shown, the cutting method for the display motherboard includes the following steps: The first longitudinal cutting line 11 and the first transverse cutting line 12 are marked on the first substrate 1 of the display motherboard, and the second longitudinal cutting line 21 and the second transverse cutting line 22 are marked on the second substrate 2 of the display motherboard. The second substrate 2 is placed on the cutting table, and the first substrate 1 is cut along the first longitudinal cutting line 11 to form the first longitudinal cutting groove, and the first substrate 1 is cut along the first transverse cutting line 12 to form the first transverse cutting groove. The first substrate 1 is placed on the cutting table, and the second substrate 2 is cut along the second longitudinal cutting line 21 to form the second longitudinal cutting groove, and the second substrate 2 is cut along the second transverse cutting line 22 to form the second transverse cutting groove. A splitting force is applied to the cut display motherboard to cause the first substrate 1 to split along the first longitudinal cutting groove and the first transverse cutting groove, and the second substrate 2 to split along the second longitudinal cutting groove and the second transverse cutting groove.

[0032] The cutting method of the display motherboard adopts the method of first cutting grooves and then splitting, that is, first cutting the first longitudinal cutting groove and the first transverse cutting groove into the first substrate 1, and then cutting the second longitudinal cutting groove and the second transverse cutting groove into the second substrate 2. This guides the splitting, precisely controls the separation process, protects the display area 31, and thus improves the product yield. In addition, when the display areas 31 are adjacent to each other in each set of repeating units, the number of display panels after cutting and forming is increased.

[0033] This embodiment also provides a display panel, which is prepared by the cutting method of the display motherboard described above. By using the display motherboard and its cutting method described above, the number of panel units 3 can be increased while the total area of ​​the display motherboard is fixed, thereby increasing the number of display panels after cutting and forming, and reducing the external size of the display panel.

[0034] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A display motherboard, characterized in that, include: A first substrate (1) and a second substrate (2) are disposed opposite each other along a first direction to form a plurality of panel units (3) arranged in an array; the panel unit (3) includes a display area (31) and a strip-to-be-peeled binding area (32), the display area (31) and the strip-to-be-peeled binding area (32) are arranged along a second direction, and a groove (33) is provided between the display area (31) and the strip-to-be-peeled binding area (32); Along the second direction, every two panel units (3) constitute a set of repeating units, and the two display areas (31) in the repeating units are arranged adjacent to each other.

2. The display motherboard according to claim 1, characterized in that, The first substrate (1) includes a plurality of first longitudinal cutting lines (11) extending along the second direction and a plurality of first transverse cutting lines (12) extending along the third direction, the first longitudinal cutting lines (11) and the first transverse cutting lines (12) surrounding the periphery of the panel unit (3); the second substrate (2) includes a plurality of second longitudinal cutting lines (21) extending along the second direction and a plurality of second transverse cutting lines (22) extending along the third direction, the second longitudinal cutting lines (21) and the second transverse cutting lines (22) surrounding the periphery of the display area (31).

3. The display motherboard according to claim 2, characterized in that, The groove (33) is formed on the side of the second substrate (2) facing the first substrate (1), and the second transverse cutting line (22) between the display area (31) and the peelable bonding area (32) is opposite to the groove (33).

4. The display motherboard according to claim 3, characterized in that, The distance between the second transverse cutting line (22) between the display area (31) and the bonding area to be peeled (32) and the groove edge of the groove (33) near the display area (31) is in the range of 0.2mm to 0.4mm.

5. The display motherboard according to claim 2, characterized in that, The two first horizontal cutting lines (12) between two adjacent panel units (3) are arranged to overlap; within the repeating unit, the two second horizontal cutting lines (22) between two adjacent display areas (31) are arranged to overlap.

6. The display motherboard according to claim 5, characterized in that, Within the repeating unit, the second horizontal cutting line (22) between two adjacent display areas (31) is correspondingly arranged with the first horizontal cutting line (12) along the first direction.

7. The display motherboard according to any one of claims 2 to 6, characterized in that, The two first longitudinal cutting lines (11) between two adjacent panel units (3) are arranged to overlap, and the two second longitudinal cutting lines (21) between two adjacent panel units (3) are arranged to overlap.

8. The display motherboard according to claim 7, characterized in that, The first longitudinal cutting line (11) and the second longitudinal cutting line (21) are set in a one-to-one correspondence along the first direction.

9. A method for cutting a display motherboard, characterized in that, Applied to the display motherboard as described in any one of claims 1 to 8, the cutting method of the display motherboard includes the following steps: A first longitudinal cutting line (11) and a first transverse cutting line (12) are marked on the first substrate (1) of the display motherboard, and a second longitudinal cutting line (21) and a second transverse cutting line (22) are marked on the second substrate (2) of the display motherboard. The second substrate (2) is placed on the cutting table, and the first substrate (1) is cut along the first longitudinal cutting line (11) to form a first longitudinal cutting groove, and the first substrate (1) is cut along the first transverse cutting line (12) to form a first transverse cutting groove. The first substrate (1) is placed on the cutting table, and the second substrate (2) is cut along the second longitudinal cutting line (21) to form a second longitudinal cutting groove, and the second substrate (2) is cut along the second transverse cutting line (22) to form a second transverse cutting groove. A splitting force is applied to the cut display motherboard so that the first substrate (1) splits along the first longitudinal cutting groove and the first transverse cutting groove, and the second substrate (2) splits along the second longitudinal cutting groove and the second transverse cutting groove.

10. A display panel, characterized in that, It is prepared using the cutting method of the display motherboard as described in claim 9.

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