A method for bonding perovskite substrates, perovskite substrate structural components, and perovskite solar cell films.

Abstract

This application discloses a method for bonding perovskite substrates, a perovskite substrate structural component, and a perovskite battery film, belonging to the field of perovskite substrate bonding technology. The method includes the following steps: placing a rigid substrate in a groove within a carrier for adhesive film and conductive film application, followed by scribing and cutting to obtain the perovskite substrate structural component. The carrier includes a support sheet and a molding sheet located above the support sheet. Compared to existing substrate bonding processes, this application primarily designs a carrier to fix the perovskite substrate, avoiding line deformation caused by the bonding process, ensuring neat scribing and easy edge peeling. Simultaneously, combined with the process improvement of bonding before scribing and cutting, it avoids irregular adhesion of the adhesive film. The film peeling process ensures a clean substrate surface without residual impurities, improving the quality of the perovskite substrate and thus meeting the usage requirements in the perovskite battery field.

Description

Technical Field

[0001] This application belongs to the field of perovskite substrate bonding process, specifically relating to a method for bonding perovskite substrates, perovskite substrate structural components, and perovskite battery films. Background Technology

[0002] In electronic device manufacturing, especially in cutting-edge fields such as perovskite solar cells, substrate bonding processes play a decisive role in product performance and precision. Among these, the fabrication process of composite structures consisting of rigid substrates, adhesive films, and conductive films is a key factor influencing subsequent assembly and the quality of the final product. However, traditional processes have revealed numerous problems in practical applications, severely restricting improvements in product performance and production efficiency.

[0003] Traditional processes suffer from significant deficiencies in alignment, easily leading to alignment errors that prevent precise bonding of layers, thus affecting electron transport paths and light absorption. Furthermore, protruding film is a serious issue; protruding film not only affects the overall structural flatness but may also interfere with other components during subsequent assembly, causing assembly difficulties or even device damage. In addition, deviations in the conductive film's scribing direction can alter the series connection of sub-cells, reducing sub-cell survival rate and negatively impacting product performance.

[0004] Among commonly used materials, polydimethylsiloxane (PDMS) has found applications in related fields due to its unique properties. PDMS is liquid at room temperature and needs to be mixed according to specific ratios before use. Although it has the advantage of high light transmittance, it faces many challenges in practical applications. PDMS requires annealing with a spin coater and hot plate, a process that is not only time-consuming, increasing production costs and cycle time, but also prone to misalignment of the flexible substrate during operation. More seriously, the adhesive can easily overflow onto the surface of the flexible substrate, directly preventing the flexible substrate from adhering properly when depositing perovskite-related layers, severely affecting the formation quality and stability of the perovskite layer. Summary of the Invention

[0005] This application aims to at least partially address one of the technical problems in related technologies. Therefore, the purpose of this application is to propose a method for bonding perovskite substrates, a perovskite substrate structural component, and a perovskite solar cell film. Compared to existing substrate bonding processes, this application primarily designs a carrier to fix the perovskite substrate, avoiding line deformation caused by the bonding process, ensuring neat scribing and easy edge peeling. Simultaneously, it combines a process improvement of bonding before scribing and cutting to avoid irregular adhesion of the adhesive film. The film peeling process ensures a clean substrate surface free of residual impurities, improving the quality of the perovskite substrate and thus meeting the application requirements in the field of perovskite solar cells.

[0006] This application firstly discloses a method for bonding perovskite substrates. According to embodiments of this application, the method for bonding perovskite substrates includes the following steps: A rigid substrate is placed in a groove within a carrier for adhesive film and conductive film application, followed by scribing and cutting to obtain a perovskite substrate structural component. The carrier includes a support piece and a molding piece located above the support piece. Positioning points are provided at the four edges of the molding piece, and the grooves are arranged in an array within the area formed by all the positioning points. The difference between the planar dimension parameter of the groove and the planar dimension parameter of the perovskite substrate is X2, where X2 is 0.1~0.5mm.

[0007] Compared with existing substrate bonding processes, the perovskite substrate bonding method of the above embodiments of this application mainly designs a carrier to fix the perovskite substrate, avoids line deformation caused by the bonding process, ensures neat scribing and easy edge peeling, and combines the process improvement of bonding first and scribing and cutting to avoid irregular adhesion of the adhesive film; the film peeling process ensures that the substrate surface is clean and free of residual impurities, improves the quality of the perovskite substrate, and thus meets the use requirements in the field of perovskite batteries.

[0008] In addition, the perovskite substrate bonding method according to the above embodiments of this application may also have the following additional technical features: In some embodiments of this application, the difference between the thickness of the perovskite substrate and the depth of the groove is X1, where X1 is 0.1~1.0 mm; And / or, the distance from the positioning point to the perimeter of the insert is 0.3~1cm; And / or, the shape of the positioning point includes a circle with a radius of 0.1~0.5mm.

[0009] In some embodiments of this application, the area of ​​the adhesive film used during film application is larger than the surface area of ​​the carrier; And / or, when the conductive film is applied, the area of ​​the conductive film is greater than the surface area of ​​the carrier.

[0010] In some embodiments of this application, the thickness of the support sheet is 0.1mm to 0.5mm; And / or, the support sheet includes a sheet-like rigid substrate, the sheet-like rigid substrate being made of at least one of glass and stainless steel.

[0011] In some embodiments of this application, the thickness of the insert is 0.3mm to 1.5mm; And / or, the material of the insert includes stainless steel.

[0012] In some embodiments of this application, the perovskite substrate includes a rigid substrate, which includes at least one of a glass substrate, a ceramic substrate, and a stainless steel substrate.

[0013] In some embodiments of this application, the adhesive film includes transparent double-sided adhesive, and the conductive film includes at least one of indium tin oxide conductive film (ITO conductive film), aluminum-doped zinc oxide conductive film (AZO conductive film), and fluorine-doped tin oxide conductive film (FTO conductive film); And / or, the methods of applying the adhesive film and the conductive film both include at least one of laminating machine application and pressure roller application.

[0014] In some embodiments of this application, the scribing and cutting method includes laser scribing and cutting.

[0015] The second aspect of this application discloses a perovskite substrate structural component. According to an embodiment of this application, the perovskite substrate structural component is fabricated using the perovskite substrate bonding method described in the first aspect. The perovskite substrate structural component comprises a rigid substrate, a film, and a conductive film sequentially stacked. Therefore, the quality of the perovskite substrate structural component is significantly improved.

[0016] A third aspect of this application discloses a perovskite solar cell film. According to an embodiment of this application, the perovskite solar cell film includes the perovskite substrate structure described in the second aspect. Therefore, the bonding method provided in this application effectively improves the survival rate of sub-cells and significantly enhances the performance of the perovskite solar cell film.

[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 A top view of the carrier in the method for bonding perovskite substrates provided in this application.

[0019] Figure 2 This is a schematic diagram of a perovskite substrate structure with a rigid substrate-adhesive film-conductive film structure obtained by the perovskite substrate bonding method provided in Embodiment 1 of this application. Detailed Implementation

[0020] The embodiments of this application are described in detail below, and the embodiments described below with reference to the accompanying drawings are merely exemplary and intended to explain this application, and should not be construed as limiting this application.

[0021] This application firstly discloses a method for bonding perovskite substrates. According to embodiments of this application, the method for bonding perovskite substrates includes the following steps: A rigid substrate (a rigid substrate refers to a substrate that uses inflexible rigid materials such as glass, ceramics, or hard metals as a supporting structure) is placed in a groove within the carrier (e.g., Figure 1 The adhesive film and conductive film are applied in the groove of a square structure with a side length of M mm, and then the perovskite substrate structure is obtained by scribing and cutting. The carrier includes a support piece and a molding piece located above the support piece, wherein positioning points (such as...) are provided at the four edges of the molding piece. Figure 1 (The red circle in the middle) indicates that the grooves are arranged in an array within the area formed by all the positioning points; The difference between the planar dimension parameter of the groove and the planar dimension parameter of the perovskite substrate is X2, where X2 is 0.1~0.5mm.

[0022] Compared with existing substrate bonding processes, the perovskite substrate bonding method of the above embodiments of this application mainly designs a carrier to fix the perovskite substrate, avoids line deformation caused by the bonding process, ensures neat scribing and easy edge peeling, and combines the process improvement of bonding first and scribing and cutting to avoid irregular adhesion of the adhesive film; the film peeling process ensures that the substrate surface is clean and free of residual impurities, improves the quality of the perovskite substrate, and thus meets the use requirements in the field of perovskite batteries.

[0023] The top view of the carrier in this application is shown in the figure below. Figure 1 As shown, the structural parameters of its core components include: The support piece is a sheet-like rigid substrate with a thickness of 0.3mm or 0.5mm, and planar dimensions of length L mm × width W mm, providing stable support for subsequent functional layers. The insert piece is a sheet-like structure adapted to the support piece, with a thickness of 0.4mm or 0.6mm, and planar dimensions identical to the support piece (length L mm × width W mm), ensuring precise surface fit during assembly. During assembly, the support piece and insert piece are precisely aligned according to their planar dimensions, ensuring complete overlap of their edge contours. Then, resistance spot welding is used to fix the edge areas together. The welding points are evenly distributed along the edges, with a spacing of 5-10mm between adjacent weld points. The welding depth penetrates the insert piece and forms a stable bond with the support piece, creating the carrier structure.

[0024] Meanwhile, this application limits the difference between the planar dimensions of the groove and the planar dimensions of the perovskite substrate to X2, where X2 is 0.1~0.5mm (e.g., 0.2mm, 0.4mm, etc.). Taking a rectangle as an example (i.e., the top view of the perovskite substrate is rectangular, and the top view of the groove is also rectangular), the length and width of the groove are set to be slightly larger than the perovskite substrate. This ensures that the rigid substrate can be smoothly placed into the groove and that there will be no significant shaking after placement, thereby achieving stable fixation of the rigid substrate during the processing.

[0025] In addition, the perovskite substrate bonding method according to the above embodiments of this application may also have the following additional technical features: In some embodiments of this application, the difference between the thickness of the rigid substrate and the depth of the groove is X1, where X1 is 0.1~1.0mm. Regarding the groove depth, by limiting "the difference between the thickness of the rigid substrate and the depth of the groove to X1, where X1 is 0.1~1.0mm (e.g., 0.6mm, 0.8mm, etc.)," ​​this thickness difference design is intended to ensure that in subsequent processes, the groove can both frame the rigid substrate and allow the adhesive film to better adhere tightly to the rigid substrate, thus guaranteeing the stability of the composite structure.

[0026] In some embodiments of this application, the distance from the positioning point to the periphery of the insert is 0.3~1cm (e.g., 0.5cm, 0.8cm, etc.); and / or, the shape of the positioning point includes a circle with a radius of 0.1~0.5mm (e.g., 0.1mm, 0.3mm, etc.).

[0027] In some embodiments of this application, the area of ​​the adhesive film used during application is larger than the surface area of ​​the carrier; and / or, the area of ​​the conductive film used during application is larger than the surface area of ​​the carrier. An adhesive film or conductive film with an area larger than the surface area of ​​the carrier is taken and applied to the entire surface using a professional laminating machine. In this process, because the area of ​​the adhesive film is larger than the surface area of ​​the carrier, there is no complex alignment process, reducing the difficulty of operation and the skill requirements for operators.

[0028] In some embodiments of this application, the thickness of the support sheet is 0.1 mm to 0.5 mm (e.g., 0.1 mm or 0.3 mm); and / or, the support sheet includes a sheet-like rigid substrate, the material of which includes at least one of glass and stainless steel.

[0029] In some embodiments of this application, the thickness of the insert is 0.3mm to 1.5mm (e.g., 0.3mm, 0.5mm, etc.); and / or, the material of the insert includes stainless steel.

[0030] In some embodiments of this application, the perovskite substrate includes a rigid substrate, which includes at least one of a glass substrate, a ceramic substrate, and a stainless steel substrate.

[0031] In some embodiments of this application, the adhesive film includes transparent double-sided adhesive, and the conductive film includes at least one of indium tin oxide conductive film (ITO conductive film), aluminum-doped zinc oxide conductive film (AZO conductive film), and fluorine-doped tin oxide conductive film (FTO conductive film); and / or, the adhesive film application and the conductive film application methods both include at least one of laminating machine application and pressure roller application.

[0032] In some embodiments of this application, the scribing and cutting method includes laser scribing and cutting. During laser scribing and cutting in this application, the laser device identifies pre-designed positioning points on the carrier, enabling accurate laser scribing and cutting of the perovskite substrate located at a fixed position within the groove, thereby removing excess adhesive film and conductive film. Furthermore, the specific parameters for laser scribing and cutting in this application are not particularly limited, as long as they ensure the removal of excess adhesive film and conductive film. For example, the laser power can be 50~200W (e.g., 60W, 100W, etc.), the cutting speed can be 100~800mm / s (e.g., 150mm / s, 200mm / s), and the pulse frequency can be 10~50kHz (e.g., 20kHz, 30kHz), etc.

[0033] The second aspect of this application discloses a perovskite substrate structural component. According to an embodiment of this application, the perovskite substrate structural component is fabricated using the perovskite substrate bonding method described in the first aspect. The perovskite substrate structural component comprises a rigid substrate, a film, and a conductive film sequentially stacked. Therefore, the quality of the perovskite substrate structural component is significantly improved.

[0034] A third aspect of this application discloses a perovskite solar cell film. According to an embodiment of this application, the perovskite solar cell film includes the perovskite substrate structure described in the second aspect. This significantly improves the performance of the perovskite solar cell film.

[0035] The embodiments of this application are described in detail below. It should be noted that the embodiments described below are exemplary and are only used to explain this application, and should not be construed as limiting this application. In addition, unless otherwise specified, all reagents used in the following embodiments are commercially available or can be synthesized according to the methods described herein or known methods. For reaction conditions not listed, they are also readily available to those skilled in the art.

[0036] Example 1 This embodiment provides a method for bonding perovskite substrates, including the following steps: Step (1): Clean the 2.5cm×2.5cm hard glass substrate to ensure that the glass substrate is clean when applying the adhesive film, otherwise it may cause bulges.

[0037] Step (2): Place 16 hard glass substrates into the grooves in the carrier, ensuring that each substrate is embedded in the groove. The carrier size is 145.1*145.1mm. The structural diagram of the carrier is shown below. Figure 1 As shown, it specifically includes: a support piece (made of stainless steel) and a molding piece (made of stainless steel); the support piece has a thickness of 0.3 mm, a length of 145.1 mm, and a width of 145.1 mm; while the molding piece has a thickness of 0.4 mm, a length of 145.1 mm, and a width of 145.1 mm. Positioning points with a radius of 0.35 mm are marked around the perimeter at a distance of 0.3 mm from the length and width, respectively. The dimensions are arranged in the molding piece, and the groove is pre-cut according to the plane size parameters and thickness of the hard glass substrate in step (1) to form a groove (the difference between the thickness of the perovskite substrate and the depth of the groove). X1 is 0.3mm, and the difference between the planar dimensions of the groove (i.e., length and width) and the planar dimensions of the perovskite substrate is X2, which is 0.4mm. The edges of the support plate and the insert plate are spot-welded together to obtain a complete carrier structure. The core is that the support plate plays a supporting role. When the substrate is placed in the insert carrier, the support plate can support the substrate, so that the substrate is perfectly embedded in the scribed square. The insert carrier plays a role in fixing the substrate and will not go out of the frame during bonding. The positioning point is used for positioning during laser scribing.

[0038] Step (3): Take a 160*160mm adhesive film (specifically, transparent double-sided tape) that is larger than the carrier in both length and width. Use a professional laminating machine to apply the film to the entire surface. In this operation, no fine alignment is required. Just make sure that the adhesive film can be applied to all 16 glass substrates.

[0039] Step (4): Take an ITO conductive substrate (i.e. conductive film) with a size of 160*160mm and apply it to the carrier with the adhesive film already bonded using a laminating machine.

[0040] Step (5): The formed perovskite substrate structure is scribing and cutting using a laser device. The laser device accurately scribing the rigid substrate located at a fixed position within the groove by identifying pre-designed positioning points on the carrier. During the scribing and cutting process, the laser can not only scribing the set dimensional parameters, but also laser-cut the adhesive film and conductive film on the rigid substrate, which have an area slightly smaller than the rigid substrate, ultimately forming a perovskite substrate structure with a substrate-adhesive film-conductive film structure, as shown in the schematic diagram below. Figure 2 As shown.

[0041] Example 2 This embodiment provides a method for bonding perovskite substrates, which differs from Embodiment 1 only in that: (1) The size of the ceramic substrate in step (1) is 2cm × 2cm; (2) The carrier size in step (2) is 125.1*125.1mm; (3) The size of the adhesive film in step (3) is 140*140mm; (4) The conductive film in step (4) is an AZO conductive substrate with a size of 140*140mm.

[0042] Example 3 This embodiment provides a method for bonding perovskite substrates, which differs from Embodiment 1 only in that: (1) In step (1), the groove size in the stainless steel substrate is 15cm×15cm (i.e., a large area substrate is prepared). (2) In step (2), the carrier size is 170*170mm, and the number of hard glass substrates placed in the groove of the carrier is 1. (3) The size of the adhesive film in step (3) is 190*190mm; (4) The conductive film in step (4) is an FTO conductive substrate with a size of 190*190mm.

[0043] Comparative Example 1 This comparative example provides a method for bonding existing perovskite substrates, including the following steps: using PDMS as an adhesive, and requiring a spin coater, the prepared PMDS solution is dropped onto a glass substrate and then spin-coated, followed by annealing for 5 minutes, and then manually applying the scribed flexible AZO substrate onto the PMDS and continuing annealing for 15 minutes; the other specific dimensional parameters, such as those of the glass substrate, flexible AZO substrate and adhesive film, are the same as in Example 2.

[0044] Comparative Example 2 This comparative example provides a method for bonding existing perovskite substrates, including the following steps: applying UV adhesive to one side surface of a flexible substrate (i.e., the ITO conductive substrate in Example 1), and then attaching the scribed flexible substrate to a rigid substrate (i.e., the hard glass substrate in Example 1) using UV adhesive; the specific dimensional parameters of the glass substrate, ITO conductive substrate, and adhesive film are the same as in Example 3.

[0045] Comparative Example 3 This comparative example provides a method for bonding existing perovskite substrates, including the following steps: applying UV adhesive to one side surface of a flexible substrate (i.e., the ITO conductive substrate in Example 1), and then attaching the scribed flexible substrate to a rigid substrate (i.e., the hard glass substrate in Example 1) using UV adhesive; the specific dimensional parameters of the glass substrate, ITO conductive substrate, and adhesive film are the same as in Example 1.

[0046] Comparative Example 4 This comparative example provides a method for bonding existing perovskite substrates, differing from Example 1 only in that... (1) The difference between the planar dimension parameter of the groove and the planar dimension parameter of the perovskite substrate is X2, and X2 is 1.2 mm.

[0047] Test Example 1 This test case examines the quality of the perovskite substrate structural components obtained in the above embodiments and comparative examples. The quality of the perovskite substrate bonding process is judged by observing the warping, air bubbles, skewing, and whether the bonded flexible substrate can be easily removed from the rigid substrate.

[0048] The quality test results of the perovskite substrate are shown in Table 1.

[0049] Table 1

[0050] As shown in Table 1, compared to the traditional "scribing before bonding" method in Comparative Examples 1 and 2, the perovskite substrate bonding process provided in this application results in perovskite substrate structures with no warping, no bubbles, minimal skewing, no detachment during annealing, and easy removal of the complete device, thus overcoming the shortcomings of the prior art. Furthermore, if the dimensions of the grooves in this application differ significantly from the dimensions of the perovskite substrate, the quality of the resulting perovskite substrate structures will be reduced.

[0051] Test Example 2 This test example evaluates the performance of the perovskite substrate structures obtained in the above embodiments and comparative examples when used to prepare perovskite solar cell thin films. The perovskite solar cell thin film preparation method is as follows. FAPbI3 was dissolved in N,N-dimethylformamide and N-methylpyrrolidone to obtain a 1 mol / L FAPbI3 perovskite precursor solution. Using the prepared FAPbI3 perovskite precursor solution, perovskite solar cell films were fabricated on the obtained perovskite substrate structure by spin coating. Before spin coating: Treat with PLASMA (plasma) for 20 min to improve the wettability of the perovskite substrate, so that the perovskite precursor solution can be uniformly spin coated in the subsequent spin coating step. Spin coating: The prepared FAPbI3 perovskite precursor solution is evenly dropped onto a flexible substrate, the spin speed is set to 5000 rpm, and the time is 40 s to obtain a uniformly dispersed perovskite wet film. After spin coating: The film is annealed at 120℃ for 50 min to obtain a perovskite solar cell film with a thickness of 450 nm.

[0052] The testing method is as follows: The perovskite cell units made in the above embodiments and comparative examples were tested using an IV testing instrument.

[0053] The test results are shown in Table 2.

[0054] Table 2

[0055] As shown in Table 2, compared with Comparative Examples 1-4, the perovskite substrate structure provided in this application performs better when used to prepare perovskite battery films.

[0056] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0057] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A method for bonding perovskite substrates, characterized in that, Includes the following steps: A rigid substrate is placed in a groove within a carrier for adhesive film and conductive film application, followed by scribing and cutting to obtain a perovskite substrate structural component. The carrier includes a support piece and a molding piece located above the support piece. Positioning points are provided at the four edges of the molding piece, and the grooves are arranged in an array within the area formed by all the positioning points. The difference between the planar dimension parameter of the groove and the planar dimension parameter of the perovskite substrate is X2, where X2 is 0.1~0.5mm.

2. The method for bonding perovskite substrates according to claim 1, characterized in that, The difference between the thickness of the perovskite substrate and the depth of the groove is X1, where X1 is 0.1~1.0 mm; And / or, the distance from the positioning point to the perimeter of the insert is 0.3~1cm; And / or, the shape of the positioning point includes a circle with a radius of 0.1~0.5mm.

3. The method for bonding perovskite substrates according to claim 1, characterized in that, When applying the adhesive film, the area of ​​the adhesive film used is larger than the surface area of ​​the carrier; And / or, when the conductive film is applied, the area of ​​the conductive film is greater than the surface area of ​​the carrier.

4. The method for bonding perovskite substrates according to claim 1, characterized in that, The thickness of the support piece is 0.1mm~0.5mm; And / or, the support sheet includes a sheet-like rigid substrate, the sheet-like rigid substrate being made of at least one of glass and stainless steel.

5. The method for bonding perovskite substrates according to claim 1, characterized in that, The thickness of the insert is 0.3mm to 1.5mm; And / or, the material of the insert includes stainless steel.

6. The method for bonding perovskite substrates according to any one of claims 1 to 5, characterized in that, The perovskite substrate includes a rigid substrate, which includes at least one of a glass substrate, a ceramic substrate, and a stainless steel substrate.

7. The method for bonding perovskite substrates according to any one of claims 1 to 5, characterized in that, The adhesive film includes transparent double-sided adhesive, and the conductive film includes at least one of indium tin oxide conductive film, aluminum-doped zinc oxide conductive film, and fluorine-doped tin oxide conductive film. And / or, the methods of applying the adhesive film and the conductive film both include at least one of laminating machine application and pressure roller application.

8. The method for bonding perovskite substrates according to any one of claims 1 to 5, characterized in that, The scribing and cutting method includes laser scribing and cutting.

9. A perovskite-based structural component, characterized in that, The perovskite substrate structure is fabricated using the perovskite substrate bonding method according to any one of claims 1 to 8, and the perovskite substrate structure comprises a rigid substrate, a film, and a conductive film stacked sequentially.

10. A perovskite solar cell film, characterized in that, The perovskite solar cell film includes the perovskite substrate structure as described in claim 9.

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