Chip transfer apparatus

Abstract

The present application relates to chip transfer technology field, especially in a kind of chip transfer equipment.The chip transfer equipment includes workbench, and workbench is equipped with wafer supply component, transfer head component and chip bearing component;Transfer head component includes first transfer head and second transfer head, chip bearing component, first transfer head and second transfer head are sequentially arranged along the length direction of workbench;Second transfer head includes R-axis motor and turnover mechanism, R-axis motor is drivenly connected with turnover mechanism, to drive turnover mechanism to rotate, R-axis motor and turnover mechanism are collinearly arranged with the rotation axis of R-axis motor as reference;First transfer head and second transfer head are delimited with transfer unloading position, first transfer head and second transfer head can move along the length direction of workbench, and transfer unloading position is located on the moving track of first transfer head and second transfer head.Solve the problem that the structure of existing transfer equipment is bulky and low compatibility.

Description

Technical Field

[0001] This invention relates to the field of chip transfer technology, and in particular to a chip transfer device. Background Technology

[0002] Semiconductor chip transfer equipment is mainly used for transferring chips of various models. Traditional transfer equipment is bulky, has a cumbersome structure, low production efficiency, and most existing transfer equipment can only be used for transferring a single model, resulting in poor versatility. Summary of the Invention

[0003] To address the technical problems of low transfer efficiency and low compatibility of existing transfer equipment, this invention provides a chip transfer device.

[0004] The present invention provides a chip transfer device, comprising a worktable, wherein a wafer supply assembly, a transfer head assembly, a vision recognition assembly, and a chip carrier assembly are provided on the worktable; the transfer head assembly includes a first transfer head and a second transfer head, the chip carrier assembly, the first transfer head, and the second transfer head are arranged sequentially along the length direction of the worktable, and the wafer supply assembly and the second transfer head are arranged sequentially along the width direction of the worktable; the second transfer head includes an R-axis motor and a flipping mechanism, the R-axis motor being drivenly connected to the flipping mechanism to drive the flipping mechanism to rotate, and the R-axis motor and the flipping mechanism being collinearly arranged with the rotation axis of the R-axis motor as a reference; the vision recognition assembly includes a first downward-facing camera, a second downward-facing camera, a third downward-facing camera, and a top-facing camera; the first downward-facing camera ... are arranged collinearly with the rotation axis of the R-axis motor as a reference; the vision recognition assembly includes a first downward-facing camera, a second downward-facing camera, a third downward-facing camera, and a top-facing camera; the first downward The chip carrier component is positioned accordingly; the second downward-facing camera and the upward-facing camera are positioned with the intermediate unloading position; the third downward-facing camera is positioned with the wafer supply component. The first downward-facing camera, the upward-facing camera, the second downward-facing camera, and the third downward-facing camera are all collinear and staggered. An intermediate unloading position is defined between the first and second rotating heads. The first and second rotating heads can move along the length of the worktable. The intermediate unloading position is located on the movement trajectory of the first and second rotating heads. After the second rotating head obtains a chip from the wafer supply component, it moves to the intermediate unloading position and flips it at a preset angle. The first rotating head moves to the intermediate unloading position to transfer the chip from the flipping mechanism and moves to the chip carrier component to place the chip.

[0005] Preferably, the chip carrier component includes a material stage, which can store wafer blue films or waffle boxes of different sizes; the material stage is provided with a vacuum adsorption gas path, and the waffle box is fixed to the material stage by adsorption through the vacuum adsorption gas path.

[0006] Preferably, the first rotating head and the second rotating head can move synchronously.

[0007] Preferably, the first transfer head includes a first moving component and a picking mechanism. The first moving component is driven to the picking mechanism to drive the picking mechanism to move between the chip carrier component and the transfer unloading position. The picking mechanism includes a connecting seat, a first drive motor and a picking head. One end of the connecting seat is connected to the first moving component and the other end is connected to the first drive motor. The driving end of the first drive motor is driven to the picking head to drive the picking head to rotate.

[0008] Preferably, the feeding head includes a first mounting base, on which a second drive motor and a first suction head are provided. The second drive motor is driven to move the first suction head up and down, and the moving stroke of the first suction head is less than 2 mm. The second drive motor is a voice coil motor.

[0009] Preferably, the second drive motor is connected to a first synchronous pulley at its drive end, and a second synchronous pulley is provided at a position corresponding to the first suction head and the first synchronous pulley. A synchronous belt is sleeved between the first synchronous pulley and the second synchronous pulley. The first synchronous pulley is concentric with the rotation shaft of the second drive motor, and the second synchronous pulley is concentric with the first suction head. The second drive motor drives the first synchronous pulley to rotate, and drives the second synchronous pulley and the first suction head to rotate synchronously through the synchronous belt.

[0010] Preferably, a calibration plate is fixed to one side of the first nozzle head. The calibration plate is L-shaped, with one end fixed to the first nozzle head and the other end extending away from the first nozzle head.

[0011] Preferably, the flipping mechanism includes a base, on which an R-axis limiting block is provided. The end of the R-axis motor away from the flipping mechanism is fixed to the base, and the R-axis limiting block and the R-axis motor are spaced apart. A connecting member is provided at the end of the R-axis motor near the flipping mechanism, and the R-axis motor and the flipping mechanism are connected through the connecting member. A first limiting protrusion and a second limiting protrusion are provided on the outer circumferential surface of the connecting member. A limiting post is provided on the side of the R-axis limiting block near the connecting member. The first limiting protrusion and the second limiting protrusion are spaced apart along the outer circumferential surface of the connecting member. When the connecting member changes from abutting against the first limiting protrusion and the limiting post to abutting against the second limiting protrusion and the limiting post, the rotation angle of the connecting member is 180°. The R-axis motor is a DD motor.

[0012] Preferably, the flipping mechanism includes a second mounting base, a third drive motor, and a second suction head. The second mounting base is provided with a first linear guide rail, and the third drive motor drives the second suction head to slide along the length direction of the first linear guide rail. The third drive motor is a voice coil motor. The second mounting base includes a first mounting plate and a second mounting plate that are slidably connected. The first linear guide rail is disposed on the side of the first mounting plate near the second suction head. The second suction head is fixed on the second mounting plate and slidably connected to the first mounting plate through the first linear guide rail. The first mounting plate is also provided with a spring mounting base, on which a first magnetic spring is mounted. The first magnetic spring includes a spring stator and a spring mover. The second mounting base is provided with a mounting hole, in which the spring stator is fixed. One end of the spring mover is fixed on the second mounting plate, and the other end is embedded in the mounting hole and movably engaged with the mounting hole. The side of the first mounting plate near the second suction head is also provided with a first reading head, and the second mounting plate is provided with a first grating ruler that engages with the first reading head at a position corresponding to the first reading head.

[0013] Preferably, the second transfer head includes a second moving component, which moves between the wafer supply component and the intermediate unloading position. The second moving component includes a support frame, a fourth drive motor, and a second linear guide rail. The base is slidably connected to the second linear guide rail, and the fourth drive motor is drivenly connected to the base to drive the base to slide along the second linear guide rail. The support frame is provided with a second grating ruler, and the base is provided with a second reading head that cooperates with the second grating ruler on the side near the second grating ruler.

[0014] Compared with the prior art, the chip transfer device provided by the present invention has the following advantages: 1. This invention provides a chip transfer device. By sequentially arranging a chip carrier component, a first transfer head, and a second transfer head along the length direction on a worktable, and arranging a wafer supply component corresponding to the second transfer head along the width direction, an L-shaped, efficient, and compact transfer production line is constructed. The second transfer head integrates a co-linearly arranged R-axis motor and a flipping mechanism. This direct connection or short-distance transmission design between the motor and the rotating mechanism eliminates the backlash and accumulated errors caused by traditional transmission mechanisms, ensuring the absolute accuracy of the chip flipping angle. By setting up first, second, and third downward-looking cameras at key workstations on the workbench—the chip carrier component, the intermediate unloading station, and the wafer supply component—and setting up an upward-looking camera directly below the intermediate unloading station, a comprehensive, closed-loop visual positioning and calibration network is constructed. All cameras are collinear and staggered, and the first and second transfer heads are also collinear with the cameras, so that the transfer heads only need to move along the collinear direction to complete the entire detection and identification process, simplifying the movement path of the transfer heads.

[0015] 2. The chip transfer equipment provided in this embodiment of the invention has a material stage configured to be compatible with storing wafer blue film or waffle boxes of different sizes, which greatly improves the versatility and flexibility of the equipment. It can meet the chip feeding requirements of various packaging forms and sizes without changing the hardware. The material stage integrates a vacuum adsorption air path. When placing a small, lightweight, and easily movable carrier such as a waffle box, the vacuum adsorption can be activated to firmly fix the waffle box on the material stage. When the equipment is running at high speed, it can effectively resist the vibration or position drift caused by mechanical movement, and avoid collisions, chip misalignment or scratches caused by the displacement of carriers such as waffle boxes.

[0016] 3. In the chip transfer device provided in this embodiment of the invention, the first transfer head and the second transfer head can move synchronously during actual operation, so as to shorten the movement time of the transfer head and improve the transfer efficiency.

[0017] 4. The chip transfer equipment provided in this embodiment of the invention adopts a modular drive structure of a first moving component and a picking mechanism for its first transfer head. The first moving component enables the picking mechanism to move smoothly over a wide range. The picking mechanism is structurally connected through a connecting seat. The first drive motor independently drives the picking head to rotate, and the chip placement angle and orientation can be flexibly adjusted according to the requirements of the feeding process to meet the diverse feeding process requirements such as waffle box grid placement and blue film fixed-point mounting. The linear movement and rotational posture adjustment functions are driven independently, resulting in a clear structural logic, no interference between movements, low equipment failure rate, and modular structure that facilitates later disassembly, maintenance, and component replacement, effectively extending the service life of the equipment and adapting to long-term continuous mass production operations.

[0018] 5. The chip transfer device provided in this embodiment of the invention uses a voice coil motor as the second drive motor for the first transfer head, which drives the first suction head to achieve a short-stroke up-and-down telescopic movement. The movement of the suction head is strictly controlled to be less than 2mm. The ultra-short stroke and micro-distance action design greatly reduces the impact force of the suction head contacting the chip, and eliminates the chip chip chipping, breakage and cracking problems caused by hard impact.

[0019] 6. The chip transfer device provided in this embodiment of the invention has a first transfer head that drives a first synchronous wheel via a second drive motor, and drives a second synchronous wheel concentric with the first suction head via a synchronous belt, thereby achieving flexible and precise transmission between the drive source and the execution end. The first synchronous wheel is concentric with the motor rotation shaft and the second synchronous wheel is concentric with the suction head, ensuring a 1:1 precise transmission of the rotation angle without cumulative error, and ensuring that the center point of the chip does not shift after the suction head rotates the chip to the target angle.

[0020] 7. The chip transfer device provided in this embodiment of the invention has an L-shaped calibration plate fixed on one side of the first transfer head. The calibration plate moves and rotates synchronously with the nozzle head. It is used in conjunction with multiple vision cameras in the device and can serve as a visual positioning reference object to quickly complete the nozzle head coordinate calibration, angle calibration and error compensation, and correct the mechanical displacement deviation caused by long-term operation in real time.

[0021] 8. This embodiment of the invention also provides a chip transfer device, wherein an R-axis limiting block and an R-axis motor are spaced apart on the base of the second transfer head. The R-axis limiting block is provided with a limiting post, and one end of the R-axis motor is provided with a connector. The connector is provided with a limiting protrusion. The limiting post and the limiting protrusion form a mechanical limiting engagement mechanism, which can physically limit the rotation stroke of the R-axis motor and the flipping head, effectively preventing the motor from overshooting or exceeding its travel range, and avoiding the risk of chip collision with surrounding components and structural damage due to excessive flipping. By limiting the distance between the limiting protrusion and the limiting post, the limiting engagement is ensured to be precise and controllable, avoiding the problems of limiting failure or motion interference jamming.

[0022] Specifically, a DD motor with high torque, low vibration, high positioning accuracy, and fast response speed is used as the R-axis drive component to reduce the risk of scratches and chipping of precision chips caused by minor mechanical vibrations, and further improve the control accuracy of chip flipping angle and the stability of operation.

[0023] 9. The chip transfer device provided in this embodiment of the invention has a split second mounting base for the second transfer head, and a first linear guide rail is provided on the second mounting base. A third drive motor drives the suction nozzle to slide along the length direction of the first linear guide rail. The third drive motor provides stable power output to the suction nozzle, realizing automatic and precise displacement adjustment of the suction nozzle. It can adapt to chip picking and placing operations with different heights and different spacings. At the same time, relying on the first linear guide rail, it provides high-precision guidance constraints for the linear sliding of the suction nozzle, ensuring high linearity and smooth operation of the suction nozzle lifting, translating picking and placing actions without jamming. In addition, the first grating ruler and the first reading head cooperate with high precision to form a closed-loop detection, which can monitor the sliding stroke and displacement data of the suction nozzle in real time, accurately control the suction nozzle feed amount, greatly improve the alignment accuracy of chip adsorption, picking, and placement, effectively solve the problems of inaccurate alignment and crushing damage during the picking and placing of ultra-thin chips and micro chips, and meet the requirements of high-precision semiconductor chip processing technology. Secondly, a spring mounting base is set on the first mounting plate and a magnetic spring is assembled. The magnetic spring consists of a spring stator and a spring mover. The stator is fixed inside the mounting hole, and the mover moves synchronously with the second mounting plate. The magnetic force of the magnetic spring provides flexible buffering and pressure adaptive compensation for the linear sliding action of the nozzle. During the chip adsorption, bonding, placement and docking stages, it can adapt to small pitch errors and assembly deviations.

[0024] 10. The chip transfer equipment provided in this embodiment of the invention has a second transfer head equipped with a second moving component consisting of a support frame, a fourth drive motor, and a second linear guide rail. The base and the second linear guide rail are slidably engaged. The fourth drive motor drives the base and the flipping head to move horizontally, allowing the second transfer head to flexibly shuttle back and forth between multiple workstations such as chip loading, visual inspection, and transfer unloading. This achieves automated flow connection between multiple workstations, reduces manual handling intervention, and comprehensively improves the automation level of the chip transfer process. A second grating ruler is provided on the support frame, and a matching second reading head is mounted on the base. The two work together to form a high-precision displacement closed-loop detection, accurately collecting the device's movement position data in real time, precisely controlling the docking accuracy of multiple workstations, and ensuring accurate alignment of the flipping device with each functional component. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the layout framework of a chip transfer device provided in an embodiment of the present invention. Figure 1 .

[0027] Figure 2 This is a schematic diagram of the layout framework of a chip transfer device provided in an embodiment of the present invention. Figure 2 .

[0028] Figure 3 This is a schematic diagram of the material stage frame in a chip transfer device provided in an embodiment of the present invention.

[0029] Figure 4 This is a schematic diagram of the structure of the first transfer head in a chip transfer device provided in an embodiment of the present invention. Figure 1 .

[0030] Figure 5 This is a schematic diagram of the structure of the first transfer head in a chip transfer device provided in an embodiment of the present invention. Figure 2 .

[0031] Figure 6This is a schematic diagram of the structure of the second transfer head in a chip transfer device provided in an embodiment of the present invention. Figure 1 .

[0032] Figure 7 This is a schematic diagram of the structure of the second transfer head in a chip transfer device provided in an embodiment of the present invention. Figure 2 .

[0033] Figure 8 This is a schematic diagram of the structure of the second transfer head in a chip transfer device provided in an embodiment of the present invention. Figure 3 .

[0034] Figure 9 This is a front view of the connector and R-axis limiting block in a chip transfer device provided in an embodiment of the present invention.

[0035] Figure 10 This is a schematic diagram of the flipping mechanism in a chip transfer device provided by an embodiment of the present invention. Figure 1 .

[0036] Figure 11 This is a schematic diagram of the flipping mechanism in a chip transfer device provided by an embodiment of the present invention. Figure 2 .

[0037] Explanation of reference numerals in the attached diagram: 100. Chip transfer equipment; 10. Material transfer head assembly; 1. First rotating head; 11. First moving component; 12. Material handling mechanism; 121. Connecting seat; 122. First drive motor; 123. Material handling head; 1231. First mounting seat; 1232. Second drive motor; 1233. First suction head; 1234. First synchronous pulley; 1235. Second synchronous pulley; 1236. Synchronous belt; 1237. Third reading head; 124. Calibration plate; 1241. First extension arm; 1242. Second extension arm; 1243. Calibration point; 125. Second magnetic spring; 126. Third linear guide rail; 2. Second rotating head; 21. Tilting mechanism; 22. R-axis motor; 23. Base; 231. R-axis limiting block; 2311. Limiting post; 232. Second reading head; 24. Second moving assembly; 241. Support frame; 2411. Second grating ruler; 242. Fourth drive motor; 243. Second linear guide rail; 25. Connector; 251. First limiting protrusion; 252. Second limiting protrusion; 26. Second mounting base; 261. First linear guide rail; 262. First mounting plate; 621. Spring mounting base; 26211. Mounting hole; 2622. First reading head; 2623. First limiting block; 2624. Through hole; 2625. Fixing point; 263. Second mounting plate; 2631. First grating ruler; 2632. Second limiting block; 27. Third drive motor; 28. Second suction head; 281. Connecting section; 282. Adsorption section; 283. Air passage interface; 284. Air pipe; 29. ​​First magnetic spring; 291. Spring stator; 292. Spring mover; 20. Workbench; 30. Wafer supply components; 40. Chip carrier assembly; 401. Material stage; 402. Vacuum adsorption gas path; 50. Visual recognition component; 501. First downward-facing camera; 502. Second downward-facing camera; 503. Third downward-facing camera; 504. Upward-facing camera; 60. Transfer and unloading position. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0039] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0040] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0041] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0042] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0043] It should be noted that chips are initially manufactured on a single wafer. Subsequent processes require cutting them off the wafer and transferring them to corresponding carriers, such as wafer blue film, waffle boxes, and tape and cable. Secondly, many chip processes require the front or back of the chip to be facing up at different stages. For example, in flip chip technology, the chip needs to be facing down to align with the substrate, which requires flipping the chip in this process.

[0044] Please see Figure 1 and Figure 6This invention provides a chip transfer device 100, including a worktable 20. The worktable 20 is provided with a wafer supply assembly 30, a transfer head assembly 10, and a chip carrier assembly 40. The transfer head assembly 10 includes a first transfer head 1 and a second transfer head 2. The chip carrier assembly 40, the first transfer head 1, and the second transfer head 2 are arranged sequentially along the length of the worktable 20, while the wafer supply assembly 30 and the second transfer head 2 are arranged sequentially along the width of the worktable 20. The second transfer head 2 includes a second moving assembly 24, an R-axis motor 22, and a flipping mechanism 21. The second transfer head 2 moves entirely along the length of the second moving assembly 24 via the second moving assembly 24. The R-axis motor 22 and the flipping mechanism 21... The rotating mechanism 21 is driven to rotate the flipping mechanism 21. The R-axis motor 22 and the flipping mechanism 21 are collinear with the rotation axis of the R-axis motor 22 as the reference. A transfer unloading position 60 is defined between the first rotating head 1 and the second rotating head 2. The first rotating head 1 and the second rotating head 2 can move along the length of the worktable 20. The transfer unloading position 60 is located on the movement trajectory of the first rotating head 1 and the second rotating head 2. After the second rotating head 2 obtains the chip from the wafer supply assembly 30, it moves to the transfer unloading position 60 and flips it at a preset angle. The first rotating head 1 moves to the transfer unloading position 60 to transfer the chip from the flipping mechanism 21 and moves to the chip carrying assembly 40 to place the chip.

[0045] In this embodiment, a highly efficient and compact L-shaped transfer production line is constructed by sequentially arranging a chip carrier assembly 40, a first transfer head 1, and a second transfer head 2 along the length direction on the workbench 20, and arranging a wafer supply assembly 30 along the width direction corresponding to the second transfer head 2. The first transfer head 1 and the wafer supply assembly 30 are compactly arranged in different directions around the second transfer head 2, which reduces the travel distance of the second transfer head 2 between the two processes and improves the overall production efficiency.

[0046] It should be noted that the second rotating head 2 adopts a coaxial and co-linear mounting structure for the R-axis motor 22 and the flipping mechanism 21. When the R-axis motor 22 is driven, the power transmission will not be eccentric or deflected. Furthermore, the design of the direct drive connection between the R-axis motor 22 and the flipping mechanism 21 shortens the transmission distance, eliminates the backlash and accumulated errors caused by traditional gear or belt drive structures, and ensures uniform and stable transmission of rotational driving force, thus guaranteeing the coaxiality of the rotational motion of the flipping mechanism 21 and the accuracy of the flipping angle.

[0047] In practical applications, both the first transfer head 1 and the second transfer head 2 can move along the length of the worktable 20. The intermediate unloading position 60, located at the intersection of their movement trajectories, is the core collaborative node. Specifically, after the second transfer head 2 picks up the chip from the wafer supply assembly 30, it moves to the intermediate unloading position 60 to complete a specific angle flip. Then, the first transfer head 1 takes the chip from the second transfer head 2 and moves it to the chip carrying assembly 40. This achieves the reversal of the chip's front and back sides or angle correction during the transfer process. This relay-style dual transfer head division of labor and collaborative operation eliminates the problem of waiting and jamming in single-head multi-process operations, and greatly improves the chip transfer efficiency.

[0048] It should be understood that while the first rotating head 1 moves toward the intermediate material feeding position 60, the second rotating head 2 also moves toward the intermediate material feeding position 60 at the same time. That is, the first rotating head 1 and the second rotating head 2 can move synchronously to reduce the overall material feeding efficiency.

[0049] Optionally, the flipping mechanism 21 in this embodiment can achieve multi-angle flipping under the drive of the R-axis motor 22, including but not limited to 30°, 45°, 60°, 90°, 120°, 180° flipping, etc., which can be set according to actual process requirements.

[0050] It should be noted that the orientation of the material-taking end of the first rotating head 1 is opposite to the orientation of the material-taking end after the flipping mechanism 21 flips.

[0051] For example, the flipping mechanism 21 can be flipped 180° under the drive of the R-axis motor 22. That is, the initial orientation of the picking end of the flipping mechanism 21 is with the picking end facing down. After it is flipped 180°, the picking end of the flipping mechanism 21 is set to face up, while the picking end of the first rotating head 1 is set to face down. This allows the first rotating head 1 to dock with the flipping mechanism 21 without any angle adjustment, so as to transfer the chip on it.

[0052] Please see Figure 3 The chip carrier component 40 includes a material stage 401, which can store wafer blue films or waffle boxes of different sizes; the material stage 401 is provided with a vacuum adsorption gas path 402, and the waffle box is fixed on the material stage 401 by adsorption through the vacuum adsorption gas path 402.

[0053] It should be noted that the material stage 401 is configured to be compatible with storing wafer blue film or waffle boxes of different sizes, which greatly improves the versatility and flexibility of the equipment and can meet the chip feeding needs of various packaging forms and sizes without changing the hardware.

[0054] Optionally, a 6-inch, 4-inch, or 2-inch waffle box can be fixed on the material table 401, or a 12-inch, 8-inch, or 6-inch wafer blue film can be configured, depending on the actual production needs.

[0055] Specifically, the material platform 401 integrates a vacuum adsorption air path 402. When placing a small, lightweight, and easily movable carrier such as a waffle box, the vacuum adsorption can be activated to firmly fix the waffle box on the material platform 401. During high-speed operation of the equipment, it can effectively resist vibration or positional drift caused by mechanical movement, and avoid collisions, misalignment or scratches of chips caused by the displacement of carriers such as waffle boxes.

[0056] Please refer to the following: Figure 2 The chip transfer equipment 100 also includes a vision recognition component 50, which includes a first downward-facing camera 501, a second downward-facing camera 502, a third downward-facing camera 503, and an upward-facing camera 504. The first downward-facing camera 501 corresponds to the position of the chip carrier component 40, the second downward-facing camera 502 and the upward-facing camera 504 correspond to the positions of the transfer unloading position 60, and the third downward-facing camera 503 corresponds to the position of the wafer supply component 30. The first downward-facing camera 501, the upward-facing camera 504, the second downward-facing camera 502, and the third downward-facing camera 503 are all collinear and staggered.

[0057] In this embodiment, a comprehensive, closed-loop visual positioning and calibration network is constructed by setting a first downward-looking camera 501, a second downward-looking camera 502, and a third downward-looking camera 503 at the key workstations of the workbench 20: the chip carrier component 40, the transfer unloading position 60, and the wafer supply component 30, respectively, and setting an upward-looking camera 504 at the transfer unloading position 60. This enables real-time visual monitoring and positioning correction of the entire process of chip loading, flipping transfer, and unloading. All cameras are collinear and staggered, and the first transfer head 1 and the second transfer head 2 are also collinear with the cameras, so that the transfer head only needs to move along the collinear direction to complete the detection and identification process of the entire process, simplifying the movement path of the transfer head.

[0058] It should be noted that the third downward-viewing camera 503 pre-positions the chips on the wafer supply assembly 30, guiding the second transfer head 2 to accurately grasp them; the second downward-viewing camera 502 and the upward-viewing camera 504 perform double-sided recognition or posture verification of the chips from above and below at the intermediate unloading position 60, respectively, and can especially identify whether the chips have undergone angular deviation or warping after passing through the flipping mechanism 21, and feed back to the first transfer head 1 for compensation grasping; the first downward-viewing camera 501 performs final coordinate confirmation of each placement position of the carrier on the chip carrying assembly 40 to ensure accurate chip feeding and placement.

[0059] In some embodiments, each downward-facing camera is provided with a Z-axis drive to control the up-and-down movement of the downward-facing camera to achieve focusing. It should be understood that different models of chips may have slight differences in focusing distance due to differences in their size, thickness, reflectivity, etc. Therefore, the downward-facing camera in this embodiment can adapt to the focusing recognition of different models of chips under the action of the Z-axis drive, thus improving the versatility of the device.

[0060] Specifically, the first downward-viewing camera 501, the upward-viewing camera 504, the second downward-viewing camera 502, the third downward-viewing camera 503, the first rotating head 1, and the second rotating head 2 are collinear along the X direction. The first rotating head 1 and the second rotating head 2 only move along the X direction, so that the chip can be transferred to different cameras for photographing and recognition.

[0061] Further, please refer to Figure 4 and Figure 5 The first rotating head 1 includes a first moving component 11 and a picking mechanism 12. The first moving component 11 is driven to the picking mechanism 12 to drive the picking mechanism 12 to move between the chip carrier component 40 and the intermediate unloading position 60. The picking mechanism 12 includes a connecting seat 121, a first drive motor 122 and a picking head 123. One end of the connecting seat 121 is connected to the first moving component 11 and the other end is connected to the first drive motor 122. The driving end of the first drive motor 122 is driven to the picking head 123 to drive the picking head 123 to rotate.

[0062] It should be noted that the first transfer head 1 adopts a modular drive structure of the first moving component 11 and the picking mechanism 12. The first moving component 11 realizes the large-range and stable displacement of the picking mechanism 12. This modular design is not only compact, but also gives the picking mechanism 12 an independent degree of rotational freedom. In the actual chip transfer process, the chip picked up from the intermediate unloading position 60 may have different orientations relative to the target placement position on the chip carrier component 40 due to the needs of the previous process or visual recognition. At this time, the first drive motor 122 can drive the picking head 123 to rotate and drive the chip to perform precise angle correction in the plane, so as to ensure the accuracy of unloading.

[0063] Specifically, the material handling mechanism 12 is structurally and stably connected to the first moving component 11 through the connecting seat 121. The first drive motor 122 independently drives the material handling head 123 to rotate, and the chip placement angle and orientation can be flexibly adjusted according to the material handling process requirements to meet the diverse material handling process requirements such as waffle box compartment placement and blue film fixed-point mounting.

[0064] This embodiment separates the linear movement and rotational attitude adjustment functions into independent drives, resulting in a clear structural logic, non-interference between the movements, low equipment failure rate, and modular structure that facilitates disassembly, maintenance, and component replacement, effectively extending the equipment's service life and adapting to long-term continuous mass production operations.

[0065] Furthermore, the feeding head 123 includes a first mounting base 1231, on which a second drive motor 1232 and a first suction head 1233 are provided. The second drive motor 1232 is driven to connect with the first suction head 1233, and the second drive motor 1232 drives the first suction head 1233 to move up and down. The moving stroke of the first suction head 1233 is less than 2 mm.

[0066] Specifically, the second drive motor 1232 is a voice coil motor.

[0067] It should be noted that voice coil motors have the characteristics of fast response speed, high repeatability, smooth low-speed operation and extremely low vibration. Using a voice coil motor to drive the first suction head 1233 can realize rapid micro-lifting of the first suction head 1233, shorten the time of a single material picking and unloading action and improve material transfer efficiency.

[0068] As a feasible implementation method, the second drive motor 1232 drives the first suction head 1233 to move up and down, and strictly controls the movement stroke within a small range of less than 2 mm. The ultra-short stroke and micro-distance action design greatly reduces the impact force of the first suction head 1233 contacting the chip, and eliminates chip chip chipping, breakage and cracking caused by hard impact.

[0069] In some embodiments, the first mounting base 1231 is provided with a third linear guide rail 126 on the side near the feeding head 123, and the first suction head 1233 is movably connected to the first mounting base 1231 through the third linear guide rail 126 to guide the first suction head 1233 to slide linearly in a specific direction.

[0070] In addition, the first mounting base 1231 and the first suction head 1233 are respectively provided with a matching third grating ruler (not shown) and a third reading head 1237, so as to monitor the position of the first suction head 1233 in real time during the movement of the first suction head 1233.

[0071] Specifically, the first suction head 1233 moves up and down relative to the first mounting base 1231 under the action of the third linear guide rail 126. The third grating ruler is set at the bottom of the first mounting base 1231. The third reading head 1237 is fixed on the first suction head 1233 and moves synchronously with the first suction head 1233, so that the displacement of the first suction head 1233 can be detected in real time.

[0072] As a feasible implementation method, the first mounting base 1231 is also provided with a second magnetic spring 125, which can be used to balance the weight of the first suction head 1233, thereby achieving high-precision material handling with low force control.

[0073] Furthermore, the drive end of the second drive motor 1232 is connected to a first synchronous pulley 1234, and a second synchronous pulley 1235 is provided at a corresponding position to the first synchronous pulley 1234. A synchronous belt 1236 is sleeved between the first synchronous pulley 1234 and the second synchronous pulley 1235. The first synchronous pulley 1234 is concentric with the rotation axis of the second drive motor 1232, and the second synchronous pulley 1235 and the first suction head 1233 are concentrically arranged. The second drive motor 1232 drives the first synchronous pulley 1234 to rotate, and drives the second synchronous pulley 1235 and the first suction head 1233 to rotate synchronously through the synchronous belt 1236.

[0074] In this embodiment, the first rotating head 1 drives the first synchronous pulley 1234 via the second drive motor 1232, and drives the second synchronous pulley 1235, which is concentric with the first suction head 1233, via the synchronous belt 1236. This achieves flexible and precise transmission between the drive source and the execution end. It should be understood that the rotation of the rotating shaft of the second drive motor 1232 can be smoothly transmitted to the independent first suction head 1233, effectively isolating the influence of the radial runout or axial movement of the second drive motor 1232 on the first suction head 1233, and ensuring the stability of the first suction head 1233 when rotating at high speed.

[0075] Specifically, the first synchronous pulley 1234 is concentric with the motor rotation shaft, and the second synchronous pulley 1235 is concentric with the first suction head 1233, ensuring a precise 1:1 transmission of the rotation angle without cumulative error, and ensuring that the center point of the chip does not shift after the first suction head 1233 rotates the chip to the target angle.

[0076] It should be noted that the vertical movement of the first suction head 1233 is within 2 millimeters, which is much smaller than the width of the synchronous belt 1236. Therefore, the vertical movement of the first suction head 1233 will not affect the power transmission of the synchronous belt 1236.

[0077] In particular, the flexible synchronous belt 1236 can also buffer the operating vibration and start-stop impact of the second drive motor 1232, reducing the vibration transmission to the chip.

[0078] Furthermore, a calibration plate 124 is fixed to one side of the first suction head 1233. The calibration plate 124 is L-shaped, with one end fixed to the first suction head 1233 and the other end extending away from the first suction head 1233.

[0079] In some embodiments, an L-shaped calibration plate 124 is fixed to one side of the first suction head 1233. The calibration plate 124 includes a first extension arm 1241 and a second extension arm 1242 that are perpendicular to each other. The first extension arm 1241 is fixed to the side of the first suction head 1233, and the second extension arm 1242 is perpendicular to the first extension arm 1241 and extends away from the first suction head 1233. The second extension arm 1242 is provided with a calibration point 1243, which can be used as the recognition base point of the visual camera.

[0080] Specifically, the calibration plate 124 is fixedly connected to the first suction head 1233. When the first suction head 1233 moves, it drives the calibration plate 124 to move synchronously. It can be used as a visual positioning reference object to quickly complete the coordinate calibration, angle calibration and error compensation of the first suction head 1233, and correct the mechanical displacement deviation caused by long-term operation in real time.

[0081] Further, please refer to Figures 6-9 The flipping mechanism 21 includes a base 23, on which an R-axis limiting block 231 is provided. The end of the R-axis motor 22 away from the flipping mechanism 21 is fixed to the base 23. The R-axis limiting block 231 and the R-axis motor 22 are spaced apart. A connector 25 is provided at the end of the R-axis motor 22 near the flipping mechanism 21. The R-axis motor 22 and the flipping mechanism 21 are connected through the connector 25. A first limiting protrusion 251 and a second limiting protrusion 252 are provided on the outer peripheral surface of the connector 25. A limiting post 2311 is provided on the side of the R-axis limiting block 231 near the connector 25. The first limiting protrusion 251 and the second limiting protrusion 252 are spaced apart along the outer peripheral surface of the connector 25. When the connector 25 changes from abutting against the first limiting protrusion 251 and the limiting post 2311 to abutting against the second limiting protrusion 252 and the limiting post 2311, the connecting member 25 rotates by 180°.

[0082] Specifically, the R-axis motor 22 is a DD motor, which integrates a high-resolution encoder to provide accurate position feedback, thereby ensuring high-precision rotation of the R-axis. Furthermore, the rotor of the DD motor is rigidly connected to the external load, eliminating transmission backlash and achieving contactless power transmission.

[0083] The R-axis limit block 231 and the R-axis motor 22 are spaced apart. There is an assembly gap between the connector 25 and the R-axis limit block 231, which provides ample space for the rotation of the connector 25 and facilitates heat dissipation after the R-axis motor 22 has been working continuously. This prevents the motor from slowing down and reducing its accuracy due to high temperature, and ensures the stability of the equipment during long-term mass production.

[0084] It should be noted that the distance L2 from the outer end face of the first limiting protrusion 251 and the second limiting protrusion 252 to the outer peripheral surface of the connector 25 is greater than the distance L1 from the outer end face of the limiting post 2311 to the outer peripheral surface of the connector 25. This makes the limiting post 2311 located on the movement trajectory of the first limiting protrusion 251 and the second limiting protrusion 252. That is, after the connector 25 rotates by the corresponding angle, the first limiting protrusion 251 or the second limiting protrusion 252 on it will abut against the limiting post 2311. The limiting post 2311 and the first limiting protrusion 251 or the second limiting protrusion 252 form a mechanical limiting engagement mechanism, which can physically limit the rotation stroke of the R-axis motor 22 and the flipping head, effectively preventing the motor from overshooting and overtraveling, and avoiding the risk of chip collision with surrounding components and structural damage due to excessive flipping.

[0085] Specifically, the limiting post 2311 is an elastic structure.

[0086] Optionally, the limiting post 2311 may be made of one or more materials, including but not limited to urethane, rubber, silicone, polyurethane, etc., to form a flexible buffer effect at the moment when the limiting protrusion and the limiting post 2311 come into contact, effectively avoiding the impact vibration, operating noise and component wear caused by hard metal collision.

[0087] In some embodiments, the first limiting protrusion 251 and the second limiting protrusion 252 are specifically bolts fixed on the connector 25. Through the abutting cooperation of the first limiting protrusion 251 and the second limiting protrusion 252, the connector 25 can only rotate up to 180°, so as to avoid the R-axis motor 22 rotating too many times, causing the internal wiring to become excessively tangled and affecting the operation of the R-axis motor 22.

[0088] It should be noted that the limiting post 2311 and the limiting protrusion form a mechanical limiting engagement mechanism, which can physically limit the rotational stroke of the R-axis motor 22 and the flipping head, effectively preventing the motor from overshooting or exceeding its travel range, and avoiding the risk of the chip colliding with surrounding components or structural damage due to excessive flipping. By limiting the distance between the limiting protrusion and the limiting post 2311, the limiting engagement is ensured to be precise and controllable, avoiding problems such as limiting failure or motion interference and jamming.

[0089] Furthermore, please refer to the following: Figure 10 and Figure 11 The flipping mechanism 21 includes a second mounting base 26, a third drive motor 27, and a second suction head 28. The second mounting base 26 is provided with a first linear guide rail 261. The third drive motor 27 drives the second suction head 28 to slide along the length direction of the first linear guide rail 261. The third drive motor 27 is a voice coil motor.

[0090] Understandably, the third drive motor 27 provides stable power output to the second suction head 28, enabling the second suction head 28 to automatically and precisely adjust its displacement. This allows it to adapt to chip picking and placing operations with different heights and spacings. At the same time, relying on the first linear guide rail 261, it provides high-precision guiding constraints for the linear sliding of the second suction head 28, ensuring that the lifting, lateral, picking and placing actions of the second suction head 28 have high linearity and run smoothly without jamming.

[0091] As a feasible implementation, the second suction head 28 is L-shaped, including a connecting section 281 and an adsorption section 282 connected to each other. The connecting section 281 and the adsorption section 282 are perpendicular to each other. The central axis of the connecting section 281 is parallel to the rotation axis of the R-axis motor 22, and the adsorption section 282 is perpendicular to the length direction of the R-axis motor 22. It can be used to adsorb chips. The coaxial design makes the second suction head 28 subjected to uniform and reasonable force. Long-term reciprocating flipping operation is not prone to problems such as component wear and loose connection, effectively extending the overall service life of the device.

[0092] Specifically, the second mounting base 26 includes a first mounting plate 262 and a second mounting plate 263 that are slidably connected. A first linear guide rail 261 is disposed on the side of the first mounting plate 262 near the second suction head 28. The second suction head 28 is fixed on the second mounting plate 263 and is slidably connected to the first mounting plate 262 through the first linear guide rail 261.

[0093] As an optional implementation, the first mounting plate 262 and the second mounting plate 263 are L-shaped. The first mounting plate 262 is provided with a first linear guide rail 261 on the side away from the R-axis motor 22. The second mounting plate 263 is slidably connected to the first linear guide rail 261 on one side. The second suction head 28 is fixed to the side of the second mounting plate 263 away from the first linear guide rail 261. The third drive motor 27 drives the second suction head 28 to slide along the length direction of the first linear guide rail 261.

[0094] Furthermore, the first mounting plate 262 is also provided with a spring mounting seat 2621, on which a first magnetic spring 29 is mounted. The first magnetic spring 29 includes a spring stator 291 and a spring mover 292. The second mounting seat 26 is provided with a mounting hole 26211. The spring stator 291 is fixed in the mounting hole 26211. One end of the spring mover 292 is fixed on the second mounting plate 263, and the other end is embedded in the mounting hole 26211 and movably cooperates with the mounting hole 26211. The first mounting plate 262 is also provided with a first reading head 2622 on the side near the second suction head 28. The second mounting plate 263 is provided with a first grating ruler 2631 corresponding to the first reading head 2622, which cooperates with the first reading head 2622.

[0095] In this embodiment, the magnetic force of the first magnetic spring 29 provides flexible buffering and pressure adaptive compensation for the linear sliding motion of the second suction head 28. During the chip adsorption, bonding, placement and docking stages, it can adapt to minute pitch errors and assembly deviations.

[0096] It should be noted that the first mounting plate 262 has a spring mounting seat 2621 for mounting the first magnetic spring 29 on the side opposite to the second suction nozzle. The first magnetic spring 29 works by magnetic coupling, without mechanical contact friction, operates without noise, has a compact structure and is resistant to aging, and is suitable for semiconductor cleanroom operation environments.

[0097] Specifically, the spring stator 291 and the spring mover 292 are coaxially mounted, and the direction of their magnetic force is consistent with the sliding direction.

[0098] In some embodiments, a constant force magnetic spring is provided on the spring mounting base 2621.

[0099] It should be noted that the first mounting plate 262 is also provided with a first reading head 2622 on the side opposite to the R-axis motor 22, and the second mounting plate 263 is provided with a first grating ruler 2631. The first reading head 2622 and the first grating ruler 2631 are positioned correspondingly. When the second mounting plate 263 drives the second suction nozzle to slide relative to the first mounting plate 262, the first reading head 2622 and the first grating ruler 2631 cooperate to detect the sliding stroke and displacement data of the second suction nozzle head 28 in real time, accurately control the feed amount of the second suction nozzle head 28, greatly improve the alignment accuracy of chip adsorption, picking and placing, effectively solve the problems of misalignment and crushing damage during the picking and placing of ultra-thin chips and micro chips, and meet the requirements of high-precision semiconductor chip processing technology.

[0100] Furthermore, the first mounting plate 262 is provided with two first limiting blocks 2623 on the side near the second suction head 28. The two first limiting blocks 2623 are spaced apart along the length direction of the first linear guide rail 261. The second mounting plate 263 is provided with a second limiting block 2632 on the side near the first mounting plate 262. The second limiting block 2632 is embedded between the two first limiting blocks 2623.

[0101] Understandably, the second limiting block 2632 is integrally formed on the side of the second mounting plate 263 away from the second suction head 28. By embedding the second limiting block 2632 between the two first limiting blocks 2623, a bidirectional mechanical limit is formed on the linear sliding stroke of the second suction head 28, preventing the second suction head 28 from sliding beyond its travel and causing the guide rail to derail, thereby improving the safety of equipment operation.

[0102] Specifically, the first limiting block 2623 is an elastic structure, which can be made of one or more materials including but not limited to urethane, rubber, silicone, polyurethane, etc. It forms a flexible buffer effect at the moment when the first limiting block 2623 and the second limiting block 2632 come into contact, effectively avoiding the impact vibration, operating noise and component wear caused by hard metal collision.

[0103] Furthermore, the second suction head 28 is provided with an air passage interface 283, and an air pipe 284 is connected to the air passage interface 283. The upper surface of the first mounting plate 262 is provided with a through hole 2624 and a fixing point 2625. One end of the air pipe 284 is connected to the air passage interface 283, and the other end is fixed to the fixing point 2625 and extends outward through the through hole 2624 to connect with an external air supply device. The air pipe 284 located at the air passage interface 283 and the fixing point 2625 is arc-shaped.

[0104] Understandably, the second suction head 28 is equipped with an air passage interface 283 for an external air pipe 284. The other end of the air pipe 284 is connected to an external air supply device to provide a continuous and balanced air source for the vacuum adsorption of chips. This makes the adsorption clamping force of the second suction head 28 on various chips uniform and controllable, preventing chips from falling off during transport.

[0105] In some embodiments, one end of the air tube 284 is connected to the air passage interface 283, and the other end extends outward through the through hole 2624 to communicate with an external air supply device. The first mounting plate 262 is provided with a fixing point 2625 near the second suction head 28. The air tube 284 is fixed to the fixing point 2625 by means of rope, buckle or Velcro, so as to make the wiring neat and scientific and avoid the air tube 284 from being scattered and tangled.

[0106] Specifically, the air pipe 284 between the air inlet 283 and the fixing point 2625 has an arc-shaped routing, which provides a flexible length for the flipping device. This accommodates the sliding and flipping of the second suction head 28, avoiding problems such as air blockage, aging and cracking of the air pipe 284, and fluctuations in negative pressure airflow caused by pulling, bending and squeezing of the pipe during movement.

[0107] Please refer to the previous document. Figure 6 and Figure 7 The second transfer head 2 includes a second moving component 24, which moves between the wafer supply component 30 and the intermediate unloading position 60. The second moving component 24 includes a support frame 241, a fourth drive motor 242, and a second linear guide rail 243. The base 23 is slidably connected to the second linear guide rail 243, and the fourth drive motor 242 is drivenly connected to the base 23 to drive the base 23 to slide along the second linear guide rail 243. The support frame 241 is provided with a second grating ruler 2411, and the base 23 is provided with a second reading head 232 that cooperates with the second grating ruler 2411 on the side near the second grating ruler 2411.

[0108] Specifically, the second moving component 24 extends from the wafer supply component 30 to the transfer unloading position 60. The length direction of the second moving component 24 is perpendicular to the rotation axis direction of the R-axis motor 22. The second transfer head 2 can move along the length direction of the second moving component 24 to repeatedly transfer the chip to be mounted on the wafer supply component 30 to the transfer unloading position 60.

[0109] In some embodiments, the wafer supply component 30 is disposed on the side of the second transfer head 2 near the second moving component 24, the intermediate unloading position 60 is disposed in parallel with the wafer supply component 30, the second moving component 24 is parallel to the line connecting the intermediate unloading position 60 and the wafer supply component 30, and the second transfer head 2 moves along the length direction of the second moving component 24.

[0110] Specifically, the wafer supply assembly 30 includes a moving module. The second suction head 28 moves between the wafer supply assembly 30 and the transfer unloading position 60 via the second moving component 24. It only has displacement in the X-axis direction. The wafer supply assembly 30 also needs to move in the Y direction or X and Y directions via the moving module. When the second suction head 28 moves to below the wafer supply assembly 30, the wafer supply assembly 30, under the action of the moving module, makes the chip on it just below the second suction head 28 so that the second suction head 28 can pick up the chip.

[0111] As a feasible implementation, the final position coordinates of the second suction head 28 moving above the wafer supply assembly 30 are preset. When the second suction head 28 moves from the intermediate unloading position 60 to the wafer supply assembly 30, the moving module can synchronously control the wafer supply assembly 30 to move the chip on it to the preset coordinate position. By moving the second transfer head 2 and the wafer supply assembly 30 synchronously, the efficiency of the second transfer head 2 in picking up the material is improved.

[0112] It should be noted that the flipping mechanism 21 slides with the second linear track through the base 23, and drives the base 23 and the entire flipping mechanism 21 to move horizontally through the fourth drive motor 242, so that the flipping mechanism 21 can flexibly shuttle back and forth between multiple work stations such as wafer supply, vision inspection, and material transfer and unloading, and realize the automated flow connection of multiple work stations.

[0113] Specifically, the support frame 241 and the base 23 are respectively equipped with a second grating ruler 2411 and a second reading head 232. The two work together to form a high-precision displacement closed-loop detection, which can accurately collect the device's movement position data in real time, accurately control the multi-station docking accuracy, and ensure that the flipping device is accurately aligned with each functional component.

[0114] It should be noted that the working process of the chip transfer device 100 provided in this embodiment is as follows: Place the wafer blue film with the chip onto the wafer supply assembly 30, place the waffle box on the material stage 401, and start the vacuum adsorption gas path 402 to adsorb and fix it. The third downward-facing camera 503 takes pictures and positions the chips on the wafer supply assembly 30. The second rotating head 2 moves directly above the chip and then moves down to contact the chip before activating vacuum adsorption to adsorb the chip. After the second rotating head 2 adsorbs the chip, it moves upward and resets, and moves to the intermediate unloading position 60 under the control of the second moving component 24. At the same time, the R-axis motor 22 controls the second suction head 28 to rotate by a preset angle. The second downward-facing camera 502 takes pictures of the chip on the second suction head 28 and positions it. The first moving component 11 controls the material picking mechanism 12 to move to the intermediate unloading position 60 to pick up the chip on the second suction head 28. The upward-facing camera 504 takes pictures of the chip on the first suction head 1233 for a second time. The first downward-facing camera 501 takes pictures of the chip placement position on the chip carrier stage and, based on the recognition results, the first suction head 1233 places the chip onto the chip carrier stage, and finally enters the next chip transfer cycle.

[0115] The foregoing has provided a detailed description of a chip transfer device disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip transfer device, characterized in that: The system includes a worktable, on which a wafer supply assembly, a transfer head assembly, a vision recognition assembly, and a chip carrier assembly are provided. The transfer head assembly includes a first transfer head and a second transfer head. The chip carrier assembly, the first transfer head and the second transfer head are arranged sequentially along the length direction of the worktable, and the wafer supply assembly and the second transfer head are arranged sequentially along the width direction of the worktable. The second rotating head includes a second moving component, an R-axis motor, and a flipping mechanism. The second rotating head moves as a whole along the length of the second moving component via the second moving component. The R-axis motor is driven to rotate the flipping mechanism. The R-axis motor and the flipping mechanism are collinear with the rotation axis of the R-axis motor as a reference. The visual recognition component includes a first downward-viewing camera, a second downward-viewing camera, a third downward-viewing camera, and a top-viewing camera; the first downward-viewing camera corresponds to the position of the chip carrier component, the second downward-viewing camera and the top-viewing camera correspond to the positions of the transfer unloading station, and the third downward-viewing camera corresponds to the position of the wafer supply component; the first downward-viewing camera, the top-viewing camera, the second downward-viewing camera, and the third downward-viewing camera are all collinear and staggered. A transfer unloading position is defined between the first and second transfer heads. The first and second transfer heads can move along the length of the worktable. The transfer unloading position is located on the movement trajectory of the first and second transfer heads. After the second transfer head obtains a chip from the wafer supply assembly, it moves to the transfer unloading position and flips it at a preset angle. The first transfer head moves to the transfer unloading position to transfer the chip from the flipping mechanism and moves to the chip carrier assembly to place the chip.

2. The chip transfer equipment as described in claim 1, characterized in that: The chip carrier component includes a material stage, which can store wafer blue film or waffle boxes of different sizes. The material platform is equipped with a vacuum adsorption gas path, and the waffle box is fixed to the material platform by adsorption through the vacuum adsorption gas path.

3. The chip transfer equipment as described in claim 1, characterized in that: The first rotating head and the second rotating head can move synchronously.

4. The chip transfer equipment as described in claim 1, characterized in that: The first transfer head includes a first moving component and a picking mechanism. The first moving component is driven to the picking mechanism to drive the picking mechanism to move between the chip carrier component and the transfer unloading position. The material handling mechanism includes a connecting seat, a first drive motor, and a material handling head. One end of the connecting seat is connected to the first moving component, and the other end is connected to the first drive motor. The drive end of the first drive motor is connected to the material handling head to drive the material handling head to rotate.

5. The chip transfer equipment as described in claim 4, characterized in that: The feeding head includes a first mounting base, on which a second drive motor and a first suction head are provided. The second drive motor is driven to move the first suction head up and down. The moving stroke of the first suction head is less than 2 mm. The second drive motor is a voice coil motor.

6. The chip transfer equipment as described in claim 5, characterized in that: The second drive motor is connected to a first synchronous pulley at its drive end. A second synchronous pulley is provided at the position corresponding to the first synchronous pulley at the first suction head. A synchronous belt is sleeved between the first synchronous pulley and the second synchronous pulley. The first synchronous pulley is concentric with the rotating shaft of the second drive motor, and the second synchronous pulley is concentric with the first suction head. The second drive motor drives the first synchronous pulley to rotate, and drives the second synchronous pulley and the first suction head to rotate synchronously through the synchronous belt.

7. The chip transfer equipment as described in claim 5, characterized in that: A calibration plate is fixed to one side of the first nozzle head. The calibration plate is L-shaped, with one end fixed to the first nozzle head and the other end extending away from the first nozzle head.

8. The chip transfer equipment as described in claim 1, characterized in that: The flipping mechanism includes a base, on which an R-axis limiting block is provided. The end of the R-axis motor away from the flipping mechanism is fixed to the base, and the R-axis limiting block and the R-axis motor are spaced apart. The R-axis motor is provided with a connector near one end of the flipping mechanism. The R-axis motor and the flipping mechanism are connected through the connector. A first limiting protrusion and a second limiting protrusion are provided on the outer peripheral surface of the connector. A limiting post is provided on the side of the R-axis limiting block near the connector. The first limiting protrusion and the second limiting protrusion are spaced apart along the outer peripheral surface of the connector. When the connector changes from being pressed against the first limiting protrusion and the limiting post to being pressed against the second limiting protrusion and the limiting post, the connector rotates by 180°. The R-axis motor is a DD motor.

9. The chip transfer equipment as described in claim 8, characterized in that: The flipping mechanism includes a second mounting base, a third drive motor, and a second suction head. The second mounting base is provided with a first linear guide rail. The third drive motor drives the second suction head to slide along the length direction of the first linear guide rail. The third drive motor is a voice coil motor. The second mounting base includes a first mounting plate and a second mounting plate that are slidably connected. The first linear guide rail is disposed on the side of the first mounting plate near the second suction head. The second suction head is fixed on the second mounting plate and is slidably connected to the first mounting plate through the first linear guide rail. The first mounting plate is also provided with a spring mounting seat, on which a first magnetic spring is mounted. The first magnetic spring includes a spring stator and a spring mover. The second mounting seat is provided with a mounting hole. The spring stator is fixed in the mounting hole. One end of the spring mover is fixed to the second mounting plate, and the other end is embedded in the mounting hole and movably cooperates with the mounting hole. The first mounting plate is also provided with a first reading head on the side near the second suction head, and the second mounting plate is provided with a first grating ruler at the position corresponding to the first reading head, which cooperates with the first reading head.

10. The chip transfer equipment as described in claim 8, characterized in that: The second transfer head moves between the wafer supply assembly and the intermediate unloading position via the second moving component; The second moving component includes a support frame, a fourth drive motor, and a second linear guide rail. The base is slidably connected to the second linear guide rail, and the fourth drive motor is drivenly connected to the base to drive the base to slide along the second linear guide rail. The support frame is provided with a second grating ruler, and the base is provided with a second reading head that cooperates with the second grating ruler on the side near the second grating ruler.

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