A linear module for wafer transfer

Abstract

This invention relates to the field of wafer transfer technology and discloses a linear module for wafer transfer, including a linear module body with a transfer robot arm. The linear module body includes a main stroke drive unit fixed in the feeding cavity, and a micro-feed compensation unit on the main stroke drive unit. Sealing structures are provided between the two ends of the main slide and the end of the base. The advantages of this invention compared with the prior art are as follows: the main stroke drive unit adopts a semi-enclosed linear telescopic cover, which automatically extends and retracts with the movement of the main slide. The bottom guide block slides synchronously along the guide rail, always completely covering all moving parts such as the lead screw and guide rail, sealing the wear debris and oil mist inside the module; the micro-feed compensation unit seals the gap between the truncated cone and the convex groove through an annular sealing cover. The corrugated annular telescopic cover deforms synchronously with the micro-movement of the piezoelectric nano-positioning stage, preventing residual dust inside from overflowing.

Description

Technical Field

[0001] This invention relates to the field of wafer transfer technology, specifically to a linear module for wafer transfer. Background Technology

[0002] Semiconductor wafer manufacturing involves multiple precision processes such as photolithography, etching, coating, inspection, and packaging. The transfer of wafers from the feeding cassette to the processing station has stringent requirements at the nanometer level for positioning accuracy, motion stability, cleanliness, and high-speed response. As the core drive carrier of the wafer transfer robot arm, the performance of the linear module directly determines the wafer alignment accuracy, surface cleanliness, and production efficiency.

[0003] Existing modules have fatal flaws in cleanliness control. The wafer surface is highly sensitive to metal dust, lubricating grease, and microparticle contamination. Even minor contamination can lead to photolithography defects and circuit failures. Traditional linear modules are generally open-type modules where the lead screw and guide rail continuously rub against each other during high-speed movement, generating metal shavings. Lubricating grease evaporates, forming oil mist that diffuses directly into the cleanroom and easily adheres to the wafer surface. The modules lack a fully enclosed dynamic sealing structure, with only simple dust covers at the ends, leaving the sides completely exposed. This makes it impossible to prevent the leakage of moving dust, resulting in an extremely high risk of contamination.

[0004] In terms of positioning accuracy and error control, existing modules can only achieve micron-level positioning, which cannot meet the requirements of nanometer-level alignment. Traditional ball screws have three inherent defects: backlash, thermal deformation, and cumulative stroke error. After high-speed start-stop and long-distance movement, the error can reach 5-10μm. The module has no error compensation unit and cannot correct the screw backlash and visual positioning deviation in real time. Wafer alignment is prone to misalignment, which leads to an increase in the scrap rate of photolithography and inspection processes. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the above-mentioned difficulties and provide a linear module for wafer transfer.

[0006] To solve the above-mentioned technical problems, the technical solution provided by the present invention is as follows: A linear module for wafer transfer includes a linear module body disposed within a transfer device. The linear module body is equipped with a transfer robot arm capable of transferring wafers. The transfer device includes a feeding chamber and a working chamber. The linear module body is disposed within the feeding chamber. The linear module body includes a main stroke drive unit fixed within the feeding chamber and capable of linearly driving the transfer robot arm. The main stroke drive unit is equipped with a micro-feed compensation unit capable of finely adjusting the transfer robot arm. The transfer robot arm is disposed on the micro-feed compensation unit. The main stroke drive unit includes a base. A ball screw driven by a motor is disposed on the base. A main slide is threaded onto the external thread of the ball screw. A cover plate that slides through the main slide is connected between the two ends of the base. A sealing structure is provided between the two ends of the main slide and the end of the base to keep the main stroke drive unit sealed.

[0007] As an improvement, the base is provided with side plates on both sides of the main slide. The sealing structure includes a linear telescopic cover that is semi-enclosed and whose bottom end is slidably connected to the side plates. Both ends of the linear telescopic cover are provided with end plates and are connected to the ends of the main slide and the base through the end plates.

[0008] As an improvement, a second guide rail is provided on the side plate along the direction of movement of the main slide, and a guide block is provided at the fold inside the bottom of the linear telescopic cover, which is slidably inserted into the second guide rail.

[0009] As an improvement, the base is provided with a guide rail 1, and the bottom of the main slide is provided with a guide groove 1 that is slidably connected to the guide rail 1 and a guide groove 2 that is slidably connected to the guide rail 2.

[0010] As an improvement, the micro-feed compensation unit includes an assembly housing bolted to the main slide, and a piezoelectric nano-positioning stage for a micro-adjustment transfer robot arm is bolted into the assembly housing.

[0011] As an improvement, the top of the assembly housing is provided with an outward convex circular groove, and the moving plate of the piezoelectric nano positioning stage is provided with a truncated cone located in the outward convex circular groove. The transfer robot arm is detachably mounted on the truncated cone, and an annular sealing cover is provided between the truncated cone and the outward convex circular groove to seal the outward convex circular groove.

[0012] As an improvement, both the outer end of the frustum and the inner end of the convex groove are provided with grooves, and the annular sealing cover includes an insert ring that is inserted into the groove, and an annular telescopic cover is connected between the two insert rings.

[0013] As an improvement, openings are arranged at the side of the feeding chamber and a loading device that can carry wafers is provided at the openings. The wafers are transferred between the loading device and the working chamber by a transfer robot arm.

[0014] As an improvement, the loading device includes a feeding support, on which a wafer cassette is mounted and a sealing cover that opens and closes over the wafer cassette.

[0015] The advantages of this invention compared to the prior art are as follows: 1. This module employs a semi-enclosed linear telescopic cover in its main stroke drive unit, which automatically extends and retracts with the movement of the main slide. The bottom guide block slides synchronously along the guide rail, always completely covering all moving parts such as the lead screw and guide rail, thus sealing wear debris and oil mist inside the module. The micro-feed compensation unit seals the gap between the frustum and the outwardly convex groove with an annular sealing cover. The corrugated annular telescopic cover deforms synchronously with the micro-movement of the piezoelectric nano-positioning stage, preventing residual dust from overflowing. This double sealing eliminates the spread of contaminants at the source, ensuring an ultra-clean environment throughout the wafer transfer process.

[0016] 2. This module uses a ball screw and has a built-in absolute encoder to provide real-time position feedback, enabling long-distance coarse positioning. The integrated piezoelectric nano-positioning stage utilizes the inverse piezoelectric effect and achieves gapless and frictionless nano-level micro-motion through flexible hinges. It can compensate for backlash, thermal deformation, cumulative errors, and visual positioning deviations in the main stroke in real time, improving the absolute positioning accuracy to sub-micron or even nanometer level, perfectly adapting to the ultra-high precision alignment requirements of wafer lithography, inspection, and other processes.

[0017] 3. The main slide of this module adopts a support and guiding structure with bottom guide rail one and guide rail two. Guide groove one and guide groove two are precisely matched with the corresponding guide rails to effectively resist the off-center load torque during the transfer process and ensure the linearity of the movement. The closed structure not only isolates the internal pollutants from overflowing, but also prevents external dust and moisture from entering the module, protecting the core moving parts such as lead screw, guide rail, and bearing, and greatly extending the service life of the equipment. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural schematic diagram of a linear module for wafer transfer according to the present invention.

[0019] Figure 2 This is a front view schematic diagram of the overall structure of a linear module for wafer transfer according to the present invention.

[0020] Figure 3 This is a right-side view of the overall structure of a linear module for wafer transfer according to the present invention.

[0021] Figure 4 This is a right-side cross-sectional view of the overall structure of a linear module for wafer transfer according to the present invention.

[0022] Figure 5 This is a three-dimensional structural diagram of the linear module body of a linear module for wafer transfer according to the present invention.

[0023] Figure 6 This is a front view schematic diagram of the linear module body structure of a linear module for wafer transfer according to the present invention.

[0024] Figure 7 This is a front sectional view of the linear module body of a linear module for wafer transfer according to the present invention.

[0025] Figure 8 This is a schematic diagram of the disassembled structure of the linear module body of a linear module for wafer transfer according to the present invention.

[0026] Figure 9 This invention relates to a linear module for wafer transfer. Figure 7 Schematic diagram of the structure at point A in the middle.

[0027] Figure 10 This invention relates to a linear module for wafer transfer. Figure 8 Schematic diagram of the structure at point B.

[0028] Figure 11 This is a schematic diagram of the sealing structure of a linear module for wafer transfer according to the present invention.

[0029] Figure 12 This is a schematic diagram of the main slide of a linear module for wafer transfer according to the present invention.

[0030] As shown in the figure: 1. Transfer equipment; 101. Feeding chamber; 102. Working chamber; 103. Feeding support; 104. Wafer box; 105. Sealing cover; 2. Main stroke drive unit; 201. Base; 202. Ball screw; 203. Cover plate; 204. Guide rail one; 205. Side plate; 206. Guide rail two; 207. Main slide; 2071. Guide groove one; 2072. Guide groove two; 3. Micro-feed compensation unit; 302. Assembly housing; 303. Piezoelectric nano positioning stage; 304. Outward convex circular groove; 305. Frustum; 306. Annular sealing cover; 3061. Embedded ring; 3062. Annular telescopic cover; 307. Embedded groove; 4. Transfer robot arm; 5. Sealing structure; 501. Linear telescopic cover; 502. End plate; 503. Guide block. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings.

[0032] Combined with appendix Figure 1 Appendix Figure 2 Appendix Figure 3 Appendix Figure 4 Appendix Figure 5 Appendix Figure 8 As shown: A linear module for wafer transfer includes a linear module body disposed within a transfer device 1. The linear module body is provided with a transfer robot arm 4 capable of transferring wafers. The transfer device 1 includes a feeding chamber 101 and a working chamber 102. The linear module body is disposed within the feeding chamber 101. The linear module body includes a main stroke drive unit 2 fixed within the feeding chamber 101 and capable of linearly driving the transfer robot arm 4. The main stroke drive unit 2 is provided with a micro-feed compensation unit 3 capable of finely adjusting the transfer robot arm 4. The transfer robot arm 4 is disposed on the micro-feed compensation unit 3. The main stroke drive unit 2 includes a base 201 and a ball screw 202. A main slide 207 is threaded onto the external thread of the ball screw 202. Sealing structures 5 are provided between both ends of the main slide 207 and the ends of the base 201 to keep the main stroke drive unit 2 sealed.

[0033] Working principle of this invention: This linear module for wafer transfer addresses the three core requirements of the semiconductor industry for wafer transfer: nanometer-level positioning accuracy, ultra-clean environment, and high-speed stability. It constructs a three-level collaborative architecture of high-speed coarse positioning in the main stroke, piezoelectric nanometer-level fine compensation, and fully enclosed dynamic dust prevention. It completely solves the industry pain points of traditional ball screw modules, such as the inability to eliminate backlash, positioning accuracy only reaching the micrometer level, dust contamination of wafers caused by wear of moving parts, and high-speed transfer jitter.

[0034] The present invention uses the main stroke drive unit 2 as the basic carrier and achieves long-distance, high-rigidity, rapid linear motion through the ball screw 202 to complete the coarse positioning of the wafer from the wafer box 104 to the processing station. The micro-feed compensation unit 3 integrated on the main slide 207 utilizes the inverse piezoelectric effect of piezoelectric ceramics to perform nanometer-level real-time compensation for the backlash, cumulative error, thermal deformation error and visual positioning deviation of the main stroke, thereby achieving submicron-level absolute positioning. The entire process is sealed by a double dynamic seal formed by the sealing structure 5, which completely encloses all moving parts inside the module, preventing metal dust and lubricating grease volatiles from contaminating the wafer surface; ultimately driving the transfer robot arm 4 to achieve stable, high-precision, and contamination-free wafer transfer, perfectly adapting to the high-precision transfer requirements of the entire process of wafer cutting, photolithography, coating, inspection, and packaging.

[0035] The transfer device 1 provides the overall support and ultra-clean working environment for the entire system and is based on existing technology. It includes an independently sealed and separated feeding chamber 101 and working chamber 102. Multiple wafer loading openings are arranged vertically on the side of the feeding chamber 101. Each opening is equipped with a feeding support 103 with a positioning pin. A wafer box 104 with an internal wafer carrier groove is placed on the feeding support 103. A transparent acrylic sealing cover 105 with a silicone rubber sealing strip embedded on the edge is hinged to the rear side of the feeding support 103. The feeding chamber 101 and the working chamber 102 are connected by a sealed channel with an anti-static polytetrafluoroethylene film.

[0036] The transfer equipment 1 adopts a design that separates the material supply area from the processing area to prevent waste gas and microparticles generated at the processing station from spreading to the material supply area and contaminating the unprocessed wafers. Before operation, the operator places the standard wafer box 104 filled with wafers on the feeding support 103. The positioning pin on the support is inserted into the positioning hole at the bottom of the wafer box 104. Then the transparent sealing cover 105 is closed. The silicone rubber sealing strip is deformed under pressure, completely sealing the wafer box 104 in the dust-free storage chamber to prevent external dust and moisture from entering the wafer box 104 and scratching or contaminating the wafer surface. The linear module body inside the feeding chamber 101 is mounted on a precision-leveled base to ensure the horizontality of the linear module body. The width of the sealed channel between the feeding chamber 101 and the working chamber 102 is perfectly matched with the range of motion of the transfer robot arm 4. The anti-static coating on the inner wall of the channel can effectively prevent static electricity from adsorbing dust, ensuring that the wafer is always in an ultra-clean environment throughout the transfer process, meeting the production requirements of semiconductor wafers.

[0037] Combined with appendix Figure 1 Appendix Figure 2 Appendix Figure 6 Appendix Figure 7 Appendix Figure 8 Appendix Figure 10 Appendix Figure 12 As shown: The main stroke drive unit 2 is the core power unit for long-distance linear motion, including a high-strength aluminum alloy base 201 fixed on the base. A preloaded ball screw 202 is rotatably mounted at the center of the base 201 through angular contact ball bearings at both ends. One end of the ball screw 202 is connected to a servo motor with a built-in absolute encoder through an elastic coupling. The ball screw 202 is fitted with an integrally cast main slide 207 via a ball screw 202 nut pair. The bottom of the main slide 207 has a guide groove 2071 adapted to guide rail 204 and a guide groove 2072 adapted to guide rail 206. The upper surface of the base 201 is fixed with a high-precision guide rail 204. Vertical side plates 205 are symmetrically welded on both sides. A guide rail 206 is fixed on the upper surface of each side plate 205. A cover plate 203 is fixed between the tops of the two side plates 205 and slides through the main slide 207. A sealing structure 5 is set between the two ends of the main slide 207 and the two ends of the base 201 to achieve full dynamic sealing in the main stroke area.

[0038] When it is necessary to drive the transfer robot arm 4 to move a long distance, the servo motor receives the pulse signal sent by the control system and drives the preloaded ball screw 202 to rotate at a set speed. The preloaded ball screw 202 can eliminate backlash and accurately convert the rotational motion into the linear motion of the main slide table 207. During the movement of the main slide 207, the bottom guide groove 2071 moves along the guide rail 204, and the two guide grooves 2072 on both sides move synchronously along the guide rail 206 on the side plate 205, forming a support and guide structure, which can effectively resist the off-center load moment during the transfer process and ensure the linearity of the main slide 207. The cover plate 203 at the top of the base 201 is fixed and slides through the reserved through hole at the top of the main slide 207. The main slide 207 seals the space on both sides of the ball screw 202. At the same time, the sealing structure 5 at both ends of the main slide 207 automatically extends and retracts with the movement of the main slide 207, completely sealing the space on both sides and forming an all-round sealing protection to prevent the metal dust and lubricating grease volatiles generated by the wear of moving parts from spreading to the clean room environment. The servo motor's built-in absolute encoder can provide real-time feedback on the position information of the main slide 207. The control system adjusts the motor speed in real time based on the feedback to achieve smooth acceleration and deceleration control, meeting the requirements of high-speed wafer transfer. Moreover, it does not need to return to zero upon startup and can directly enter the working state.

[0039] Combined with appendix Figure 1 Appendix Figure 2 Appendix Figure 7 Appendix Figure 8 Appendix Figure 11 As shown: The sealing structure 5 is the core protection unit for achieving full sealing of the main stroke area. Two sets are set up, located at both ends of the main slide table 207 respectively. Each sealing structure 5 includes a foldable linear telescopic cover 501, a front end plate 502, a rear end plate 502, and multiple nylon guide blocks 503. The linear telescopic cover 501 is made of wear-resistant and anti-static polyurethane coated nylon cloth, with a stainless steel support frame embedded inside, forming a semi-enclosed structure that covers the sides and upper area of ​​the base 201; one end of the linear telescopic cover 501 is sealed to the end face of the main slide table 207 through the front end plate 502, and the other end is sealed to the end of the base 201 through the rear end plate 502. Two guide blocks 503 are symmetrically fixed on the bottom inner side of each fold. The inner side of the guide block 503 is provided with a guide groove that matches the guide rail 206, so that the guide block 503 is slidably sleeved on the guide rail 206.

[0040] When the main slide 207 moves along the guide rail toward one end of the base 201, the linear telescopic cover 501 on the side closer to the direction of movement is pushed by the main slide 207, and the internal stainless steel support frame drives the folding structure to fold and retract in sequence. The linear telescopic cover 501 on the other side is pulled by the main slide 207, and the folding structure unfolds in sequence. The two telescopic covers always maintain complete coverage of the sides of the base 201 and the upper lead screw and guide rail area, with no exposed moving parts. The guide blocks 503 at each fold of the bottom of the linear telescopic cover 501 slide synchronously along the guide rails 206 on the side plate 205; the front plate 502 and the end face of the main slide table 207, and the rear plate 502 and the end of the base 201 are all sealed with oil-resistant rubber sealing strips to ensure that the entire main stroke area forms a completely closed cavity. The metal dust and lubricating grease volatiles generated by the wear of moving parts are all sealed in the cavity and cannot diffuse to the external clean room environment. At the same time, external dust and water vapor cannot enter the module, protecting the moving parts such as lead screws, guide rails, and bearings from contamination and extending their service life. The 501 linear telescopic cover made of polyurethane-coated nylon fabric is wear-resistant and anti-aging, meeting the requirements of long-term continuous operation of the main stroke drive unit 2.

[0041] Combined with appendix Figure 1 Appendix Figure 2 Appendix Figure 6 Appendix Figure 7 Appendix Figure 8 Appendix Figure 9 As shown: The micro-feed compensation unit 3 includes an assembly housing 302 bolted to the main slide 207, and a piezoelectric nano-positioning stage 303 for micro-motion adjustment transfer robot arm 4 is bolted into the assembly housing 302.

[0042] The top of the assembly housing 302 is provided with an outwardly protruding circular groove 304. The movable plate of the piezoelectric nano positioning stage 303 is provided with a frustum 305 located in the outwardly protruding circular groove 304. The transfer robot arm 4 is detachably mounted on the frustum 305. An annular sealing cover 306 is provided between the frustum 305 and the outwardly protruding circular groove 304 to seal the outwardly protruding circular groove 304.

[0043] Both the outer end of the frustum 305 and the inner end of the convex circular groove 304 are provided with grooves 307. The annular sealing cover 306 includes an insert ring 3061 that is inserted into the groove 307, and an annular telescopic cover 3062 is connected between the two insert rings 3061.

[0044] The micro-feed compensation unit 3 is the core compensation unit for realizing nano-level positioning. It includes a square assembly housing 302 fixed to the upper surface of the main slide 207 by internal hex bolts. The assembly housing 302 has an installation groove inside, and a piezoelectric nano-positioning stage 303 is embedded in the groove. The piezoelectric nanopositioning stage 303 is an existing technology: it uses the inverse piezoelectric effect as its driving principle and piezoelectric ceramic stacks as its power source. Through an integrated flexible hinge mechanism, it achieves precise guidance and displacement transmission without gaps, friction, or wear. It is paired with a high-precision grating or capacitive displacement sensor to form a fully closed-loop feedback. It relies on elastic deformation to achieve ultra-high positioning accuracy at the nanometer level and fast response at the microsecond level. There are no mechanical transmission gaps or friction losses. It can complete ultra-precision micro-motion positioning within a micrometer-level stroke and perfectly adapts to the coaxiality micro-compensation and high-precision alignment requirements of wafer pre-alignment processes.

[0045] A cylindrical frustum 305 is integrally formed on the movable plate at the top of the piezoelectric nano positioning stage 303. A convex circular groove 304 with a diameter larger than the frustum 305 is opened at the center of the top of the assembly housing 302. The frustum 305 extends into the convex circular groove 304 and its top surface is higher than the assembly housing 302. A groove 307 is provided on the upper part of the outer side wall of the frustum 305 and the upper part of the inner side wall of the convex circular groove 304. An annular sealing cover 306 is installed in the annular gap between the two and consists of two embedded rings 3061 and a corrugated annular telescopic cover 3062 in the middle. The embedded rings 3061 are respectively inserted into the groove 307 to achieve sealing. The top surface of the frustum 305 is provided with a threaded hole and a positioning pin hole for detachable installation of the transfer robot arm 4.

[0046] After the main slide 207 moves the micro-feed compensation unit 3 to the vicinity of the target station to complete the coarse positioning, the vision positioning system captures the alignment mark on the wafer, calculates the positional deviation between the wafer and the processing station, and sends the deviation signal to the piezoelectric nano-positioning stage 303. The multilayer piezoelectric ceramic stack inside the piezoelectric nano-positioning stage 303 generates the inverse piezoelectric effect under the action of the simulated voltage, and undergoes nanoscale elastic deformation, which drives the top moving plate and the frustum 305 to produce precise micro-movements, and compensates for the backlash, cumulative error, thermal deformation error and vision positioning deviation of the main stroke in real time, and finally achieves the absolute positioning accuracy of the transfer robot arm 4. During the micro-motion of the frustum 305, the corrugated annular telescopic cover 3062 of the annular sealing cover 306 synchronously expands and deforms with the micro-motion of the frustum 305. The two embedded rings 3061 are always firmly embedded in the groove 307, keeping the annular gap between the frustum 305 and the convex circular groove 304 completely sealed, preventing wear dust inside the piezoelectric nano positioning stage 303 and residual dust inside the assembly housing 302 from overflowing and contaminating the wafer, and also preventing external dust from entering the assembly housing 302 and affecting the performance of the piezoelectric element. The positioning pin holes and threaded holes on the top surface of the frustum 305 enable the quick disassembly and replacement of the transfer robot arm 4, adapting to the transfer needs of wafers of different sizes.

[0047] The transfer robotic arm 4 is a prior art: it is an execution unit that directly performs wafer pick-and-place operations. It is integrally molded from high-strength carbon fiber material and includes a vertical mounting arm and a horizontal cantilever. The bottom of the vertical mounting arm is fixed to the top surface of the frustum 305 by positioning pins and bolts. The end of the horizontal cantilever integrates a vacuum adsorption component, including antistatic fluororubber vacuum cups distributed in an equilateral triangle. The top of the suction cups is connected to an external vacuum generator through a vacuum pipeline, and a high-precision pressure sensor is integrated inside the pipeline. The upper surface of the horizontal cantilever is covered with carbon fiber reinforcing ribs to improve the rigidity and deformation resistance of the cantilever.

[0048] The transfer robot arm 4 completes long-distance high-speed movement with the main slide 207 and achieves nanometer-level precise positioning with the piezoelectric nano-positioning stage 303. When it moves to above the target wafer in the wafer box 104, the vacuum generator is activated, and negative pressure is simultaneously formed inside each suction cup. The three-point adsorption ensures that the wafer is subjected to uniform force. The main slide 207 drives the robot arm to slowly lift it upward, smoothly removing the wafer from the support slot of the wafer box 104, and then moving it into the working chamber 102 at a set speed. During the movement, the pressure sensor in the vacuum pipeline detects the adsorption pressure in real time. When the robot arm moves to the processing station, the main slide 207 decelerates and stops to complete the coarse positioning. The piezoelectric nano positioning stage 303 performs nanometer-level position compensation based on the feedback from the vision positioning system to ensure that the alignment mark of the wafer is completely aligned with the mark of the processing station. Then, the vacuum generator slowly breaks the vacuum and places the wafer stably on the carrier of the processing station. The robot arm quickly returns to the feeding chamber 101 to transfer the next wafer.

[0049] In the specific implementation of the linear module for wafer transfer, the base 201 of the linear module body is first fixed in the feeding chamber 101 of the transfer equipment 1. The ball screw 202, guide rail 1 204, side plate 205 and guide rail 206 are installed on the base 201. The main slide 207 is slidably engaged with guide rail 1 204 and guide rail 206 through guide groove 1 2071 and guide groove 2 2072 respectively and threaded onto the ball screw 202. Then, the linear telescopic cover 501, end plate 502 and guide block 503 are installed at both ends of the main slide 207 to form a sealing structure 5, thus completing the assembly of the main stroke drive unit 2. Next, the assembly housing 302 is fixed to the main slide table 207 with bolts, the built-in piezoelectric nano positioning stage 303, the frustum 305 extends into the outward convex circular groove 304 and is sealed by the annular sealing cover 306, and then the transfer robot arm 4 is detachably installed on the frustum 305. The inside of the feeding chamber 101 is the installation space for the linear module, and the inside of the working chamber 102 is the detection and centering station. During operation, the servo motor drives the ball screw 202 to rotate, which in turn drives the main slide 207 to perform long-distance high-speed coarse positioning along guide rail 1 204 and guide rail 2 206. The linear telescopic cover 501 automatically extends and retracts with the main slide 207 to maintain a fully enclosed dustproof environment. After coarse positioning, the piezoelectric nano-positioning stage 303 receives the deviation signal and drives the frustum 305 to move slightly through the inverse piezoelectric effect of the piezoelectric ceramic, thus completing nanoscale position compensation. After the transfer robot arm 4 picks up the wafer, it moves at high speed with the main stroke and is precisely aligned with the micro-feed, moving the wafer from the wafer box 104 in the feeding chamber 101 to the processing station in the working chamber 102. The entire process is doubly sealed to isolate dust, achieving clean, stable and high-precision wafer transfer.

[0050] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A linear module for wafer transfer, comprising a linear module body disposed within a transfer device (1), wherein the linear module body is provided with a transfer robotic arm (4) capable of transferring wafers, the transfer device (1) comprising a feeding chamber (101) and a working chamber (102), the linear module body being disposed within the feeding chamber (101), characterized in that: The linear module body includes a main stroke drive unit (2) fixed in the feeding chamber (101) and capable of linearly driving the transfer robot arm (4). The main stroke drive unit (2) is provided with a micro-feed compensation unit (3) that can finely adjust the transfer robot arm (4). The transfer robot arm (4) is located on the micro-feed compensation unit (3). The main stroke drive unit (2) includes a base (201). The base (201) is provided with a ball screw (202) driven by a motor. The ball screw (202) is threaded with a main slide (207). A cover plate (203) that slides through the main slide (207) is connected between the two ends of the base (201). A sealing structure (5) is provided between the two ends of the main slide (207) and the end of the base (201) to keep the main stroke drive unit (2) sealed.

2. The linear module for wafer transfer according to claim 1, characterized in that: The base (201) is provided with side plates (205) located on both sides of the main slide (207). The sealing structure (5) includes a linear telescopic cover (501) that is semi-enclosed and whose bottom end is slidably connected to the side plate (205). Both ends of the linear telescopic cover (501) are provided with end plates (502) and are connected to the ends of the main slide (207) and the base (201) through the end plates (502).

3. The linear module for wafer transfer according to claim 2, characterized in that: A guide rail (206) is provided on the side plate (205) along the movement direction of the main slide (207), and a guide block (503) is provided at the fold inside the bottom of the linear telescopic cover (501) to slide and insert with the guide rail (206).

4. The linear module for wafer transfer according to claim 3, characterized in that: The base (201) is provided with a guide rail (204), and the bottom of the main slide (207) is provided with a guide groove (2071) that is slidably connected to the guide rail (204) and a guide groove (2072) that is slidably connected to the guide rail (206).

5. The linear module for wafer transfer according to claim 1, characterized in that: The microfeed compensation unit (3) includes an assembly housing (302) bolted to the main slide (207), and a piezoelectric nanopositioning stage (303) for a micro-motion adjustment transfer robot arm (4) is bolted into the assembly housing (302).

6. The linear module for wafer transfer according to claim 5, characterized in that: The top of the assembly housing (302) is provided with an outward convex circular groove (304). The moving plate of the piezoelectric nano positioning stage (303) is provided with a frustum (305) located in the outward convex circular groove (304). The transfer robot arm (4) is detachably mounted on the frustum (305). An annular sealing cover (306) is provided between the frustum (305) and the outward convex circular groove (304) to seal the outward convex circular groove (304).

7. The linear module for wafer transfer according to claim 6, characterized in that: The outer end of the truncated cone (305) and the inner end of the convex circular groove (304) are both provided with grooves (307). The annular sealing cover (306) includes an insert ring (3061) that is inserted into the groove (307), and an annular telescopic cover (3062) is connected between the two insert rings (3061).

8. The linear module for wafer transfer according to claim 1, characterized in that: The feeding chamber (101) has openings arranged on the side and a loading device that can carry the wafer is provided at the opening. The wafer is transferred between the loading device and the working chamber (102) by the transfer robot arm (4).

9. The linear module for wafer transfer according to claim 8, characterized in that: The loading device includes a feeding support (103), on which a wafer cassette (104) is mounted, and a sealing cover (105) covering the wafer cassette (104) is openable and closed on the feeding support (103).

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