A chip pick-up and placement device suitable for ultra-thin packaging

Abstract

This invention relates to the field of semiconductor device manufacturing equipment technology, specifically to a chip pick-up and placement device suitable for ultra-thin packaging. It includes a first processing stage and a second processing stage disposed on top of a base. The first processing stage is used to place the chip to be picked up, and the second processing stage is used to fix the substrate to be packaged. A fixing nozzle for transferring the chip is provided above the first and second processing stages. A hollow fixing stage is installed on top of the first processing stage to fix a blue film with the chip attached. Both the first processing stage and the hollow fixing stage are hollow structures. A lifting seat combined with a negative pressure adsorption structure replaces the traditional ejector pin structure. During the chip lifting process, the chip can be stably adsorbed onto the top of the lifting seat, effectively avoiding chip skew caused by the lifting position deviating from the chip center, ensuring that the fixing nozzle can stably adsorb the chip, and improving the reliability of the chip transfer process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing equipment technology, and more specifically, to a chip pick-up and placement device suitable for ultra-thin packaging. Background Technology

[0002] Chips with a thickness of less than 50μm are considered ultra-thin chips. During the picking, transfer and mounting process, they are prone to problems such as bending, warping, cracking, sticking and positioning deviation. In order to achieve non-destructive, high-precision and high-efficiency picking and placing of chips, and to ensure the yield and performance of ultra-thin chip packaging.

[0003] In chip packaging technology, the pick-and-place process is one of the core steps. Its main function is to separate the individual chips from the blue film after wafer dicing and transfer them to the designated positions on the packaging substrate, laying the foundation for subsequent bonding, molding, and other processes. During chip pick-up, to reduce the possibility of the lifting structure causing large areas of the blue film to bulge due to its large cross-sectional area, thus affecting the position of surrounding chips, the industry typically uses ejector pins as the lifting structure. These pins lift the chips attached to the blue film from below, gradually separating the chips from the blue film so that the vacuum nozzle can smoothly pick up the chips and complete the transfer and placement operation.

[0004] However, in practical applications, when the ejector pin lifts the chip, if the position of the ejector pin on the bottom of the chip is off from the center area of ​​the chip, it often causes the chip to tilt, which may make it impossible for the vacuum nozzle to stably fix the chip, thus adversely affecting the chip transfer process.

[0005] In view of this, we propose a chip pick-up and placement device suitable for ultra-thin packages to improve the shortcomings of the prior art. Summary of the Invention

[0006] This invention provides a chip pick-up and placement device suitable for ultra-thin packages, which solves the problem that when existing ejector pins lift chips, the chip tilts and the vacuum nozzle cannot stably fix the chip when the ejector pins are deviated from the center area of ​​the chip, thus affecting the stability of chip transfer and placement.

[0007] To achieve the above objectives, the chip pick-up and placement device suitable for ultra-thin packaging includes a first processing stage and a second processing stage disposed on the top of a base. The first processing stage is used to place the chip to be picked up, and the second processing stage is used to fix the substrate to be packaged. A fixing nozzle for transferring the chip is provided above the first processing stage and the second processing stage.

[0008] A hollow fixing platform is installed on the top of the first processing table. The hollow fixing platform is used to fix the blue film with the chip attached. Both the first processing table and the hollow fixing platform are hollow structures. A rotating seat is fixedly connected to the internal axis of the first processing table, and a limiting seat is fixedly connected to the internal axis of the hollow fixing platform. A lifting and fixing assembly is provided below the axis of the first processing table and the hollow fixing platform. The lifting and fixing assembly includes:

[0009] The lifting seat is slidably connected to the limiting seat, and a lifting seat is fixedly connected to the top. The lifting seat has an adjustment cavity inside.

[0010] The rotating rod is rotatably connected to the rotating seat in the horizontal direction, and the top is coaxially connected with a threaded rod and a piston plate from near to far.

[0011] The threaded rod is used to drive the lifting seat to rise and fall. When the lifting seat rises with the lifting seat to lift the chip, the air intake speed of the top space of the piston plate is greater than the air exhaust speed, which is used to adsorb the chip onto the top of the lifting seat.

[0012] In the above technical solution, the rotating rod is kept relatively stationary with the rotating seat in the vertical direction. That is, the lifting seat gradually rises and lifts the chip that is attached to the blue film, so that the chip gradually separates from the blue film. Then, the fixed suction nozzle picks up the chip from the top, so that the chip is completely separated from the blue film. Finally, the fixed suction nozzle moves the picked-up chip to the top of the substrate, and places the chip on the substrate for packaging.

[0013] Based on this, a mounting frame is fixedly installed on the base above the first and second processing tables, and a guide rail is fixedly connected to the bottom of the mounting frame. A slide block is slidably connected to the guide rail on the side close to the first and second processing tables.

[0014] Based on the above, the slide block has several pulleys rotatably connected inside on the side near the guide rail. The pulleys are rotatably fitted against the outer wall of the guide rail. The slide block is equipped with a translation motor for driving the pulleys to rotate. The translation motor includes a body and an output shaft. The body is fixedly connected to the slide block, and the output shaft is rotatably connected to the pulleys.

[0015] With this design, after the fixed suction nozzle picks up the chip and completely separates it from the blue film, the power supply of the translation motor is turned on. The output shaft of the translation motor drives the pulley connected to it to rotate. Under the action of friction between the pulley and the outer wall of the guide rail, the slide moves along the trajectory of the guide rail.

[0016] In another technical solution, the top of the fixed suction nozzle is connected to an air extraction pipe, which is connected to an external air pump. The slide is fixedly connected to a first mounting base on the side facing the first processing table, and a second mounting base is slidably connected to the bottom of the first mounting base. The first mounting base is used to install a hydraulic rod, and the second mounting base is used to fix the air extraction pipe.

[0017] Furthermore, the hydraulic rod includes a cylinder body and a piston rod, the cylinder body of the hydraulic rod being fixedly connected to a first mounting base, and the piston rod of the hydraulic rod being fixedly connected to a second mounting base.

[0018] In this technical solution, when the slide moves the first mounting seat to above the first processing table, the piston rod of the hydraulic rod extends downward, and the second mounting seat slides downward relative to the first mounting seat, so that the fixed suction nozzle is in contact with the top of the chip. Then, the suction pump connected to the suction pipe is started to make the fixed suction nozzle suck up the top of the chip.

[0019] In addition, a fixed base plate is fixedly connected to the bottom of the first processing table, and a lifting motor is installed on the top of the fixed base plate. The output shaft of the lifting motor is coaxially connected to the rotating rod.

[0020] Furthermore, a threaded groove is provided at the center of the internal shaft of the lifting seat. The threaded groove is threadedly connected to a threaded rod. A connecting rod is fixedly connected to the top of the threaded rod, and the end of the connecting rod away from the threaded rod is fixedly connected to the piston plate.

[0021] Furthermore, the cross-sectional area of ​​the connecting rod is smaller than that of the threaded rod, the cross-sectional area of ​​the adjusting cavity is larger than that of the threaded groove, and the outer wall of the piston plate is sealed and fitted to the inner wall of the adjusting cavity.

[0022] The top of the regulating chamber is provided with an air intake port, and the side wall of the regulating chamber is provided with several exhaust ports. The air intake port and exhaust ports are always located above the piston plate, and both the air intake port and exhaust ports are used to connect the regulating chamber to the outside.

[0023] The exhaust port is equipped with a one-way valve, which makes the exhaust port only for exhaust. When the lifting seat slides upward relative to the limiting seat, the air intake speed of the air inlet is greater than the air outlet speed of the exhaust port.

[0024] As described above, when the lifting motor drives the rotating rod to rotate, the threaded rod rotates synchronously with it. Driven by the outer thread of the threaded rod, the inner thread of the threaded groove converts the rotational driving force of the threaded rod into the driving force for the lifting seat to rise. The lifting seat then moves the top seat upwards, lifting the chip to separate it from the adhered blue film. Since the vertical height of the piston plate remains constant, the space above the piston plate in the adjusting chamber draws air inwards through the suction port, thus holding the chip above the top seat in place. When the chip's off-center position contacts the top seat, it prevents the chip from being pushed outwards and tilted. Simultaneously, the exhaust port slowly discharges the gas in the adjusting chamber above the piston plate, preventing excessive negative pressure suction that could cause mechanical damage to the chip.

[0025] Based on the above description, the beneficial effects of the present invention compared with the prior art are as follows:

[0026] 1. The lifting seat combined with a negative pressure adsorption structure replaces the traditional ejector pin structure. During the chip lifting process, the chip can be stably adsorbed on the top of the lifting seat, effectively avoiding chip tilting caused by the lifting position deviating from the chip center. This ensures that the fixed nozzle can stably adsorb the chip, improving the reliability of the chip transfer process.

[0027] 2. When lifting the chip, the air intake port and the exhaust port with a one-way valve work together to make the air intake speed greater than the air exhaust speed to form a gentle negative pressure. This can ensure the adsorption and positioning effect while avoiding excessive suction force that could cause mechanical damage to the ultra-thin chip, thus meeting the requirements of ultra-thin packaging process.

[0028] 3. The transmission structure using a threaded rod and threaded groove smoothly converts rotary motion into linear lifting motion. The lifting action of the lifting seat is stable and controllable, and the separation process between the chip and the blue film is smooth, making it less likely to damage the chip and the blue film. Attached Figure Description

[0029] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0030] Figure 1 This is a perspective view of the overall structure of the present invention;

[0031] Figure 2 This is one of the partial structural side views of the present invention;

[0032] Figure 3 This is a second partial structural side view of the present invention;

[0033] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle;

[0034] Figure 5This is a schematic diagram illustrating the principle of changing the position of the fixed suction nozzle in this invention;

[0035] Figure 6 This is a three-dimensional schematic diagram of the lifting and fixing assembly of the present invention;

[0036] Figure 7 This is a side view schematic diagram of the lifting and fixing assembly of the present invention;

[0037] Figure 8 This is a cross-sectional perspective view of the lifting and fixing assembly of the present invention;

[0038] Figure 9 This is a schematic diagram illustrating the principle of the lifting seat lifting the chip away from the blue film in this invention.

[0039] The meanings of the labels in the diagram are as follows:

[0040] 100. Base; 101. First processing table; 102. Second processing table; 103. Mounting frame; 104. Hollow fixed table; 105. Fixed base plate; 106. Rotating seat; 107. Limiting seat;

[0041] 200. Fixed suction nozzle; 201. Guide rail; 202. Slide; 203. Pulley; 204. Translation motor; 210. First mounting base; 211. Hydraulic rod; 220. Second mounting base; 221. Suction pipe;

[0042] 300. Lifting and fixing assembly; 301. Lifting motor; 310. Lifting seat; 311. Adjustment chamber; 312. Exhaust port; 313. Intake port; 314. Threaded groove; 320. Threaded rod; 321. Connecting rod; 322. Piston plate; 323. Rotating rod; 330. Lifting seat. Detailed Implementation

[0043] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] During chip pickup, to reduce the risk of large blue film bulges caused by the large cross-sectional area of ​​the lifting structure, which could affect the position of surrounding chips, the industry typically uses ejector pins as the lifting structure. These pins lift the chip, which is attached to the blue film, from below, gradually separating the chip from the blue film so that the vacuum nozzle can smoothly pick up the chip and complete the transfer. However, in actual chip packaging, if the ejector pin's position on the bottom of the chip deviates from the center, it often causes the chip to tilt. This can prevent the vacuum nozzle from stably securing the chip, adversely affecting the chip transfer process.

[0045] Please see Figures 1-3 To solve the above problems, the present invention aims to provide a chip picking and placement device suitable for ultra-thin packaging. The picking and placement device includes a first processing stage 101 and a second processing stage 102 disposed on the top of a base 100. The first processing stage 101 is used to place the chip to be picked up, and the second processing stage 102 is used to fix the substrate to be packaged. A fixing nozzle 200 for transferring the chip is provided above the first processing stage 101 and the second processing stage 102.

[0046] A hollow fixing platform 104 is installed on the top of the first processing table 101. The hollow fixing platform 104 is used to fix the blue film with the chip attached. Both the first processing table 101 and the hollow fixing platform 104 are hollow structures. A rotating seat 106 is fixedly connected to the internal axis of the first processing table 101, and a limiting seat 107 is fixedly connected to the internal axis of the hollow fixing platform 104. A lifting and fixing assembly 300 is provided below the axis of the first processing table 101 and the hollow fixing platform 104. The lifting and fixing assembly 300 includes:

[0047] The lifting seat 310 is slidably connected to the limiting seat 107, and the top is fixedly connected to the lifting seat 330. The lifting seat 330 has an adjustment cavity 311 inside.

[0048] The rotating rod 323 is rotatably connected to the rotating seat 106 in the horizontal direction, and the top is coaxially connected with the threaded rod 320 and the piston plate 322 from near to far.

[0049] The threaded rod 320 is used to drive the lifting seat 310 to rise and fall. When the lifting seat 330 rises with the lifting seat 310 to lift the chip, the air intake speed of the top space of the piston plate 322 is greater than the air exhaust speed, which is used to adsorb the chip onto the top of the lifting seat 330.

[0050] In practice, the blue film with the chip to be packaged attached is first fixed to the top of the hollow fixing stage 104. The rotating rod 323 is then started to rotate, causing the threaded rod 320 to rotate synchronously. In the vertical direction, the lifting seat 310 slides upward relative to the limiting seat 107. At the same time, the rotating rod 323 remains relatively stationary with the rotating seat 106 in the vertical direction. That is, the lifting seat 330 gradually rises and lifts the chip attached to the blue film, causing the chip to gradually separate from the blue film. Then, the fixed suction nozzle 200 picks up the chip from the top, completely separating the chip from the blue film. Finally, the fixed suction nozzle 200 moves the picked-up chip to the top of the substrate, and the chip is placed on the substrate for packaging.

[0051] Next, as Figure 3 As shown, a mounting bracket 103 is fixedly installed on the base 100 above the first processing table 101 and the second processing table 102. A guide rail 201 is fixedly connected to the bottom of the mounting bracket 103. A slide block 202 is slidably connected to the guide rail 201 on the side close to the first processing table 101 and the second processing table 102.

[0052] Based on the above, a number of pulleys 203 are rotatably connected inside the slide 202 on the side near the guide rail 201. The pulleys 203 are rotatably fitted with the outer wall of the guide rail 201. The slide 202 is provided with a translation motor 204 for driving the pulleys 203 to rotate. The translation motor 204 includes a body and an output shaft. The body is fixedly connected to the slide 202, and the output shaft is rotatably connected to the pulleys 203.

[0053] It should be noted that after the fixed suction nozzle 200 sucks up the chip and completely separates it from the blue film, the power supply of the translation motor 204 is turned on. The output shaft of the translation motor 204 drives the pulley 203 connected to it to rotate. Under the action of the friction between the pulley 203 and the outer wall of the guide rail 201, the slide 202 moves along the trajectory of the guide rail 201.

[0054] exist Figure 4 In the middle, the top of the fixed suction nozzle 200 is connected to the suction pipe 221, which is connected to an external suction pump. The slide 202 is fixedly connected to the first mounting base 210 on the side facing the first processing table 101. The bottom of the first mounting base 210 is slidably connected to the second mounting base 220. The first mounting base 210 is used to install the hydraulic rod 211, and the second mounting base 220 is used to fix the suction pipe 221.

[0055] Furthermore, the hydraulic rod 211 includes a cylinder body and a piston rod. The cylinder body of the hydraulic rod 211 is fixedly connected to the first mounting base 210, and the piston rod of the hydraulic rod 211 is fixedly connected to the second mounting base 220.

[0056] In other words, when the slide 202 moves the first mounting base 210 above the first processing table 101, the piston rod of the hydraulic rod 211 extends downward, and the second mounting base 220 slides downward relative to the first mounting base 210, so that the fixed suction nozzle 200 is in contact with the top of the chip. Then, the suction pump connected to the suction pipe 221 is started to make the fixed suction nozzle 200 suck up the top of the chip.

[0057] Preferably, please refer to Figures 6-8 The bottom of the first processing table 101 is fixedly connected to a fixed base plate 105, and a lifting motor 301 is installed on the top of the fixed base plate 105. The output shaft of the lifting motor 301 is coaxially connected to the rotating rod 323.

[0058] Furthermore, a threaded groove 314 is provided at the inner shaft of the lifting seat 310. The threaded groove 314 is threadedly connected to the threaded rod 320. A connecting rod 321 is fixedly connected to the top of the threaded rod 320. The end of the connecting rod 321 away from the threaded rod 320 is fixedly connected to the piston plate 322.

[0059] Furthermore, the cross-sectional area of ​​the connecting rod 321 is smaller than that of the threaded rod 320, the cross-sectional area of ​​the adjusting cavity 311 is larger than that of the threaded groove 314, and the outer wall of the piston plate 322 is sealed and fitted with the inner wall of the adjusting cavity 311.

[0060] An air intake port 313 is provided at the top of the regulating cavity 311, and several exhaust ports 312 are provided on the side wall of the regulating cavity 311. The air intake port 313 and the exhaust ports 312 are always located above the piston plate 322. The air intake port 313 and the exhaust ports 312 are used to connect the regulating cavity 311 to the outside.

[0061] The exhaust port 312 is equipped with a one-way valve, which makes the exhaust port 312 only used for exhaust. When the lifting seat 330 slides upward relative to the limit seat 107, the air intake speed of the intake port 313 is greater than the air exhaust speed of the exhaust port 312.

[0062] It should be disclosed that when the lifting motor 301 drives the rotating rod 323 to rotate, the threaded rod 320 rotates synchronously with the rotating rod 323. Driven by the outer thread of the threaded rod 320, the inner thread of the threaded groove 314 converts the rotational driving force of the threaded rod 320 into the driving force for the lifting seat 310 to rise. Thus, the lifting seat 310 drives the lifting seat 330 to move upward, lifting the chip to separate it from the attached blue film. Since the vertical height of the piston plate 322 remains unchanged, the space above the piston plate 322 in the adjusting chamber 311 draws air from the outside in through the suction port 313, thereby holding the chip above the lifting seat 330. When the off-center position of the chip contacts the lifting seat 330, it prevents the chip from being pushed outward by the lifting seat 330. At the same time, the exhaust port 312 slowly discharges the gas above the piston plate 322 in the adjusting chamber 311 to the outside, preventing the negative pressure suction force generated from being too large, thereby causing mechanical damage to the chip.

[0063] The following is based on Figure 9 Detailed explanation of the working principle of the pick-up and place-up device:

[0064] Before the equipment starts working, the blue film with the chip to be packaged is fixed on the hollow fixed stage 104 on the top of the first processing stage 101. The substrate to be packaged is fixed on the second processing stage 102. The fixed suction nozzle 200 is moved between the two processing stages through the mounting bracket 103, the guide rail 201 and the slide 202. The translational force is provided by the translation motor 204 driving the pulley 203.

[0065] When picking up the chip, the lifting motor 301 drives the rotating rod 323 to rotate, which in turn drives the threaded rod 320 to rotate synchronously. The threaded rod 320 cooperates with the threaded groove 314 in the lifting seat 310 to convert the rotational motion into the upward motion of the lifting seat 310, so that the lifting seat 310 slides upward along the limit seat 107 and drives the top lifting seat 330 to rise, lifting the chip off the blue film and separating it.

[0066] During the lifting process, the height of the piston plate 322 remains unchanged. The rise of the lifting seat 330 increases the volume of the space above the piston plate 322 in the adjustment chamber 311. The air intake speed of the air inlet 313 is greater than the air outlet speed of the exhaust port 312 with a one-way valve, forming a negative pressure that adsorbs the chip onto the top of the lifting seat 330, preventing the chip from tilting due to non-centered contact position.

[0067] Subsequently, the hydraulic rod 211 pushes the second mounting base 220 down, so that the fixed suction nozzle 200 fits against the top of the chip, and the external suction pump connected to the suction pipe 221 forms a negative pressure to firmly adsorb the chip; then the lifting base 330 descends and resets, and the fixed suction nozzle 200 moves horizontally to the top of the second processing table 102 under the drive of the slide 202, and finally places the chip in the designated position on the substrate to complete the encapsulation.

[0068] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip pick-up and placement device suitable for ultra-thin packaging, comprising a first processing stage (101) and a second processing stage (102) disposed on the top of a base (100), wherein a fixed suction nozzle (200) is provided above the first processing stage (101) and the second processing stage (102), characterized in that: A hollow fixed platform (104) is installed on the top of the first processing table (101). Both the first processing table (101) and the hollow fixed platform (104) are hollow structures. A rotating seat (106) is fixedly connected to the internal axis of the first processing table (101), and a limiting seat (107) is fixedly connected to the internal axis of the hollow fixed platform (104). A lifting and fixing assembly (300) is provided below the axis of the first processing table (101) and the hollow fixed platform (104). The lifting and fixing assembly (300) includes: The lifting seat (310) is slidably connected to the limiting seat (107) and the top is fixedly connected to the lifting seat (330). The lifting seat (330) has an adjustment cavity (311) inside. The rotating rod (323) is rotatably connected to the rotating seat (106) in the horizontal direction, and the top is coaxially connected with the threaded rod (320) and the piston plate (322) from near to far. When the lifting seat (330) rises with the lifting seat (310) to lift the chip, the air intake speed of the top space of the piston plate (322) is greater than the air exhaust speed.

2. The chip pickup and placement device suitable for ultra-thin packaging according to claim 1, characterized in that: The base (100) is fixedly provided with a mounting bracket (103) above the first processing table (101) and the second processing table (102). The bottom of the mounting bracket (103) is fixedly connected with a guide rail (201). The guide rail (201) is slidably connected with a slide block (202) on the side near the first processing table (101) and the second processing table (102).

3. The chip pickup and placement device suitable for ultra-thin packaging according to claim 2, characterized in that: The slide (202) has several pulleys (203) rotatably connected inside on the side near the guide rail (201). The pulleys (203) rotatably fit against the outer wall of the guide rail (201). The slide (202) is provided with a translation motor (204) for driving the pulleys (203) to rotate. The translation motor (204) includes a body and an output shaft. The body is fixedly connected to the slide (202), and the output shaft is rotatably connected to the pulleys (203).

4. The chip pickup and placement device suitable for ultra-thin packaging according to claim 2, characterized in that: The top of the fixed suction nozzle (200) is connected to an air extraction pipe (221), which is connected to an external air pump. The slide (202) is fixedly connected to a first mounting base (210) on the side facing the first processing table (101). The bottom of the first mounting base (210) is slidably connected to a second mounting base (220). The first mounting base (210) is used to install the hydraulic rod (211), and the second mounting base (220) is used to fix the air extraction pipe (221).

5. The chip pick-up and placement device suitable for ultra-thin packaging according to claim 4, characterized in that: The hydraulic rod (211) includes a cylinder and a piston rod. The cylinder of the hydraulic rod (211) is fixedly connected to the first mounting seat (210), and the piston rod of the hydraulic rod (211) is fixedly connected to the second mounting seat (220).

6. The chip pick-up and placement device suitable for ultra-thin packaging according to claim 1, characterized in that: The bottom of the first processing table (101) is fixedly connected to a fixed base plate (105), and a lifting motor (301) is installed on the top of the fixed base plate (105). The output shaft of the lifting motor (301) is coaxially connected to the rotating rod (323).

7. The chip pickup and placement device suitable for ultra-thin packaging according to claim 1, characterized in that: The lifting seat (310) has a threaded groove (314) at the center of the shaft. The threaded groove (314) is threadedly connected to the threaded rod (320). A connecting rod (321) is fixedly connected to the top of the threaded rod (320). The end of the connecting rod (321) away from the threaded rod (320) is fixedly connected to the piston plate (322).

8. The chip pick-up and placement device suitable for ultra-thin packaging according to claim 7, characterized in that: The cross-sectional area of ​​the connecting rod (321) is smaller than that of the threaded rod (320), the cross-sectional area of ​​the adjusting cavity (311) is larger than that of the threaded groove (314), and the outer wall of the piston plate (322) is sealed and fitted with the inner wall of the adjusting cavity (311).

9. The chip pickup and placement device suitable for ultra-thin packaging according to claim 1, characterized in that: The top of the regulating cavity (311) is provided with an air intake (313), and the side wall of the regulating cavity (311) is provided with a number of exhaust holes (312). The air intake (313) and the exhaust holes (312) are always located above the piston plate (322). The air intake (313) and the exhaust holes (312) are both used to connect the regulating cavity (311) and the outside.

10. The chip pickup and placement device suitable for ultra-thin packaging according to claim 9, characterized in that: The exhaust port (312) is equipped with a one-way valve, which makes the exhaust port (312) only for exhaust. When the lifting seat (330) slides upward relative to the limiting seat (107), the intake speed of the air inlet (313) is greater than the exhaust speed of the exhaust port (312).

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