An auxiliary positioning device for integrated circuit coated chip processing

Abstract

This invention relates to the field of chip welding processing technology, and more particularly to an auxiliary positioning device for integrated circuit coated chip processing. The device includes a machine base for welding chips, a lifting platform for initially placing the chips on the machine base, two sets of limiting parts, and an ion air purification unit. The two sets of limiting parts are symmetrically arranged on the left and right sides of the machine base, and each set consists of a fixed fixture and a protective fixture. The fixed fixture includes symmetrically distributed right-angle clamping members, which, when closed, securely clamp the edge of the chip. This invention utilizes a purely mechanical linkage system composed of right-angle clamping members, a drive lever, a synchronous connecting rod, a pressure boosting piston, and a coolant container. When the T-shaped traction frame closes the right-angle clamping members, it efficiently neutralizes the static electricity generated by processing friction, preventing dust adsorption due to static electricity, and simultaneously removes microscopic metal particles and oxides generated during processing in real time with a high-speed airflow.

Description

Technical Field

[0001] This invention relates to the field of chip welding and processing technology, and in particular to an auxiliary positioning device for processing coated chips of integrated circuits. Background Technology

[0002] In the field of integrated circuit packaging, chip bonding and wire bonding are key processes that determine packaging quality and reliability. With the development of 3D integration technology, chip functions are becoming increasingly complex, and their surfaces often need to be coated with various functional coatings. Coated chips place extremely stringent requirements on positioning accuracy, clamping stability, and especially surface protection of the coating during the processing.

[0003] Existing technologies, such as the wire bonding clamp for semiconductor chip positioning disclosed in CN213135599U, lack a flexible buffer layer design in their clamping structure and do not have the function of isolating the migration of chemical substances between the clamping end and the coating. Another example is the wire bonding clamp for semiconductor chip positioning disclosed in CN213135599U. In high-temperature processing environments, substances in the clamping components may diffuse into the chip coating, causing chemical contamination. The clamping device only provides mechanical fixation; during bonding and other processes involving thermo-pressing or ultrasonic energy, heat accumulates at the contact area between the chip and the clamp, which may not only exacerbate thermal damage to the coating but also cause thermal expansion of the clamp itself, leading to fluctuations in clamping force and decreased positioning accuracy. Furthermore, due to the lack of corresponding cooling solutions, it is impossible to actively cool and protect the chip edges from thermal shock while clamping. Summary of the Invention

[0004] The purpose of this invention is to solve the problem in the prior art that it is difficult to position the integrated circuit coated chip, which affects the quality of the welding operation, and to propose an auxiliary positioning device for processing integrated circuit coated chips.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An auxiliary positioning device for processing coated chips of integrated circuits includes a machine base for welding chips, a lifting platform for supporting the initial placement of chips on the machine base, and two sets of limiting parts. The two sets of limiting parts are symmetrically arranged on the left and right sides of the machine base and are composed of a fixing fixture and a protective fixture. The fixing fixture includes symmetrically distributed right-angle clamping members. When the two right-angle clamping members are closed, they fix and clamp the edge of the chip. The protective fixture includes a capsule-shaped protective film fitted in the right-angle clamping members. When the capsule-shaped protective film is filled, it flexibly contacts the coating structure of the chip edge to isolate the migration of chemical substances between the clamping end and the chip coating. An ion wind purification unit is located at the rear of the machine and includes a blower hood that rotates around the chip from 0° to 180°. An ion wind generator is provided on the machine and communicates with the blower hood to provide ion wind. The ion wind generator blows ion wind to the chip coating area through the blower hood.

[0006] Preferably, the lifting platform is longitudinally slidably positioned at the vertical center of the machine platform.

[0007] Preferably, the fixed fixture further includes a load-bearing bracket fixedly installed on the machine base, a lifting slider is longitudinally slidably installed on the load-bearing bracket, a damping bearing is fixedly installed in the lifting slider, a drive shaft is fixedly installed in the damping bearing, and a Y-shaped load-bearing bracket for symmetrically distributing two right-angle clamping parts is fixedly connected to the drive shaft.

[0008] Preferably, a T-shaped traction frame for pulling two right-angle clamps to move in opposite directions is slidably mounted on the Y-shaped load-bearing bracket.

[0009] Preferably, the protective fixture further includes a coolant container fixedly mounted on a Y-shaped load-bearing bracket. The coolant container is used to unidirectionally supply coolant to the capsule-shaped protective membrane. The Y-shaped load-bearing bracket is also equipped with a condenser, which is used to unidirectionally recover the high-temperature coolant inside the capsule-shaped protective membrane into the coolant container.

[0010] Preferably, one-way valves are provided between the coolant container and the bladder-shaped protective membrane, and between the bladder-shaped protective membrane and the condenser.

[0011] Preferably, the main body of the capsule-shaped protective film is a flexible capsule, and a dense inorganic film is grown on the outer surface of the flexible capsule using an atomic layer deposition process.

[0012] Preferably, the ion air purification unit further includes a movable support that is laterally slidably installed at the rear of the machine, and an L-shaped bracket for rotating the blower hood is longitudinally slidably installed on the movable support.

[0013] Preferably, the inner wall of the blower shroud is provided with circumferentially equidistant Venturi holes.

[0014] Preferably, a corrugated hose is connected between the ion wind generator and the blower hood.

[0015] Compared with the prior art, the present invention has the following advantages: 1. This invention utilizes a purely mechanical linkage system consisting of a right-angle clamping component, a drive lever, a synchronous connecting rod, a booster piston, and a coolant container. When the T-shaped traction frame closes the right-angle clamping component, the clamping displacement is directly converted into the pressurizing action of the booster piston through the drive lever and synchronous connecting rod. This forces the coolant to be injected into the capsule-shaped protective film, causing it to fill synchronously at the clamping position. The flexible contact prevents physical damage. The filled capsule-shaped protective film flexibly adheres to the edge coating of the chip, achieving chemical inert isolation. The outer surface of the capsule-shaped protective film is a dense inorganic thin film grown using atomic layer deposition technology, which can isolate the migration of chemical substances between the clamping end and the coated chip during high-temperature processing, preventing contamination of the coating. Active cooling and circulating heat dissipation are achieved by the coolant absorbing processing heat inside the film and then entering the condenser for cooling through a pipeline controlled by a one-way valve and flowing back to the container, forming a closed cooling cycle.

[0016] 2. This invention integrates an ion air purification unit on the machine base. The position of the blower hood in the horizontal and vertical directions is adjusted by a movable support and an L-shaped bracket. The blower hood is driven to rotate back and forth around the chip from 0° to 180°. The positive and negative ion airflow generated by the ion air generator enters the blower hood and is ejected at high speed from the Venturi holes that are equidistantly distributed around its inner wall. This multi-angle, dead-angle-free ion air curtain covers the entire chip area. It can efficiently neutralize the static electricity generated by processing friction, prevent dust from being adsorbed by static electricity, and blow away the microscopic metal particles and oxides generated during processing in real time with high-speed airflow. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an auxiliary positioning device for processing integrated circuit coated chips according to the present invention; Figure 2 This is a bottom view of an auxiliary positioning device for processing integrated circuit coated chips according to the present invention; Figure 3 This is a front sectional view of an auxiliary positioning device for processing integrated circuit coated chips according to the present invention; Figure 4 This is a right sectional view of an auxiliary positioning device for processing integrated circuit coated chips according to the present invention; Figure 5 This is a schematic diagram of the limiting part structure of an auxiliary positioning device for processing integrated circuit coated chips according to the present invention; Figure 6 This is a schematic diagram of the protective tooling structure of an auxiliary positioning device for integrated circuit coated chip processing proposed in this invention; Figure 7 This is a schematic diagram of the ion wind purification section of an auxiliary positioning device for integrated circuit coated chip processing proposed in this invention; Figure 8This is a cross-sectional view of the ion wind purification section of an auxiliary positioning device for integrated circuit coated chip processing proposed in this invention.

[0018] In the diagram: 1. Machine base; 2. Lifting platform; 3. Limiting part; 31. Fixed fixture; 311. Load-bearing bracket; 312. Lifting slider; 313. Damping bearing; 314. Drive shaft; 315. Y-type load-bearing bracket; 316. T-type traction frame; 317. Moving slider; 318. Limiting rod; 319. Right-angle clamp; 3110. Traction rod; 32. Protective fixture; 321. Drive lever; 322. Coolant container; 3 23. Pressure boosting piston; 324. Synchronous connecting rod; 325. Supply tube; 326. Opening receiving groove; 327. Bag-shaped protective membrane; 328. First recovery tube; 329. Condenser; 3210. Second recovery tube; 4. Ionizing air purification unit; 41. Movable support; 42. L-shaped bracket; 43. Drive gear; 44. Guide ring groove; 45. Blower hood; 46. Driven gear; 47. Ionizing air generator; 48. Venturi orifice. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] Reference Figures 1-8 An auxiliary positioning device for processing coated chips of integrated circuits includes a machine base 1 for soldering chips, and a lifting platform 2 for supporting the initial placement of chips on the machine base 1. (Refer to...) Figure 1 and Figure 3 The lifting platform 2 is traction-provided by a drive cylinder located at the lower end of the machine base 1. Specifically, the drive cylinder is a double-acting thin cylinder with a precision pressure regulating valve. It pushes the piston rod with compressed air, and then converts the linear motion into the vertical feed of the lifting platform 2 through a gear and rack mechanism.

[0021] Furthermore, Invar alloy 4J36 is used, whose coefficient of thermal expansion is approximately 1.2 × 10⁻⁶. -1 / K, and the coefficient of thermal expansion of silicon-based chips (approximately 2.6 × 10⁻⁶). -1 Similar to / K), the lifting platform 2 has an integrated thermal expansion compensation structure. The main body is made of Invar alloy with a thermal expansion coefficient similar to that of the chip substrate. After adjusting the initial height, its longitudinal thermal drift can be controlled within 2μm / ℃, ensuring that the chip is always within the precise clamping plane of the two sets of limiting parts 3 throughout the entire processing temperature range, providing a stable initial reference with thermal compensation for subsequent precision clamping and positioning.

[0022] The auxiliary positioning device also includes two sets of limiting parts 3 and an ion wind purification part 4: Two sets of limiting parts 3 are symmetrically arranged on the left and right sides of the machine base 1, and each set consists of a fixed fixture 31 and a protective fixture 32. Reference Figure 5 The fixed fixture 31 includes a load-bearing bracket 311 fixedly installed on the machine base 1. A lifting slider 312 is longitudinally slidably installed on the load-bearing bracket 311. The lifting slider 312 can be controlled by a telescopic device set on the load-bearing bracket 311 to move linearly back and forth. A damping bearing 313 is fixedly installed in the lifting slider 312. A drive shaft 314 is fixedly installed in the damping bearing 313. The drive shaft 314 is controlled by a micro motor located on the lifting slider 312 to rotate and drive the chip to flip. A Y-shaped load-bearing bracket 315 for symmetrically distributing two right-angle clamping parts 319 is fixedly connected to the drive shaft 314. A T-shaped traction frame 316 is slidably installed on the Y-shaped load-bearing bracket 315. It can be driven by a manual knob in conjunction with a worm gear reducer or by a precision ball screw mechanism driven by a servo motor to push the T-shaped traction frame 316 so that it slides on the Y-shaped load-bearing bracket 315 toward the chip.

[0023] A movable slider 317 is slidably mounted at the end of the T-shaped traction frame 316. The end of the T-shaped traction frame 316, through the movable slider 317 and the limiting rod 318, forms a crank-slider guide mechanism, converting a single thrust into smooth linear motion. The movable slider 317 and the Y-shaped load-bearing bracket 315 are connected by a pin to the limiting rod 318. Two symmetrically distributed right-angle clamping parts 319 are slidably mounted on the Y-shaped load-bearing bracket 315. A traction rod 3110 is connected by a pin between the T-shaped traction frame 316 and the right-angle clamping parts 319. When the T-shaped traction frame 316 moves, the force is transmitted equidistantly to the two symmetrically distributed right-angle clamping parts 319 through the traction rods 3110 on both sides. The two right-angle clamping parts 319 fix and clamp the edge of the chip in the closed state.

[0024] In summary, the capsule-shaped protective film 327, when fully inflated, provides a flexible contact chip edge coating structure to isolate chemical migration between the clamping end and the chip coating.

[0025] Reference Figure 6The protective fixture 32 includes a drive lever 321 that is rotatably mounted on a Y-shaped load-bearing bracket 315 and is movably pulled by a right-angle clamp 319. During the closing process of the right-angle clamp 319, its root moves to pull the driven end of the drive lever 321 through a cam groove structure. A coolant container 322 containing coolant is fixedly mounted on the Y-shaped load-bearing bracket 315. A booster piston 323 is slidably installed in the coolant container 322. The drive lever 321 uses the lever principle to amplify the stroke. Its active swing end pushes the booster piston 323 in the coolant container 322 downward through the synchronous connecting rod 324. The other end of the lever 321 has a slot. A traction bolt that is movably fitted into the slot is integrally connected to the right-angle clamp 319. The synchronous connecting rod 324 is pin-connected between the drive lever 321 and the booster piston 323. The force transmission path of the synchronous connecting rod 324 is such that the clamping force is linearly positively correlated with the coolant injection pressure. That is, the tighter the clamping, the higher the coolant pressure in the capsule-shaped protective film 327, and the more tight the protective contact with the coating.

[0026] In some implementations, the fulcrum of the drive lever 321 is designed with multiple adjustment holes. By changing the lever ratio adjustable force amplification coefficient, a matching curve of clamping force and protection pressure is preset for chips with different brittleness, so as to realize the closed-loop matching of adaptive clamping force and protection pressure, and avoid the risk of coating overpressure caused by uncontrollable clamping force in conventional equipment.

[0027] A supply tube 325 is connected to the coolant container 322. An open receiving groove 326 is provided in the right-angle clamp 319. A capsule-shaped protective membrane 327 that is unidirectionally connected to the supply tube 325 is fixedly installed in the open receiving groove 326. There are 3-5 capsule-shaped protective membranes 327 arranged in a linear array. A first recovery tube 328 is fixedly connected to the capsule-shaped protective membrane 327. A condenser 329 that is unidirectionally connected to the first recovery tube 328 is fixedly installed on the Y-shaped load-bearing bracket 315. A second recovery tube 3210 that is unidirectionally connected to the coolant container 322 is connected to the condenser 329.

[0028] In some embodiments, the coolant is a perfluoropolyether electronic coolant with high thermal conductivity and low viscosity. It is forced through a long supply tube 325 with a one-way valve into a capsule-shaped protective film 327 installed in the opening receiving groove 326 of the right-angle clamp 319, allowing it to contact the chip through the capsule-shaped protective film 327.

[0029] In summary, the coolant container 322 is used to unidirectionally supply coolant to the protective membrane 327, and the condenser 329 is used to unidirectionally recover the high-temperature coolant in the protective membrane 327 into the coolant container 322. After being processed by the condenser 329, the high-temperature coolant is restored to normal temperature for reuse.

[0030] Reference Figure 7 and Figure 8 The ion air purification unit 4 is located at the rear of the machine base 1. It includes a movable support 41 that is horizontally slidably installed at the rear of the machine base 1. An L-shaped bracket 42 is vertically slidably installed on the movable support 41. The blower shroud 45 is adjusted to the optimal position above the chip by using the cross slide formed by the movable support 41 and the L-shaped bracket 42. A drive gear 43 is rotatably installed on the L-shaped bracket 42, and a guide ring groove 44 is opened in the L-shaped bracket 42. The blower shroud 45, which rotates around the chip from 0° to 180°, is rotatably installed in the guide ring groove 44. A driven gear 46 is integrally connected to the blower shroud 45 and meshes with the guide ring groove 44.

[0031] In some embodiments, a drive motor, which is a small stepper motor or synchronous motor, is installed on the L-shaped bracket 42 to rotate the traction drive gear 43. The drive gear 43 is rotated via a coupling. When the drive gear 43 rotates, the driven gear 46 meshes with it, driving the blower shroud 45 to reciprocate around the chip along the trajectory of the guide ring groove 44 from 0° to 180°, forming an oscillating clean flow field. The drive motor can be controlled by a forward and reverse switching circuit. After the limit switch detects the rotation position signal, the motor direction is automatically switched, achieving continuous oscillating scanning and forming an oscillating clean flow field.

[0032] The machine 1 is equipped with an ionizer 47 that communicates with a blower shroud 45 to provide ionizing air. The inner wall of the blower shroud 45 has circumferentially equidistant Venturi orifices 48. It should be noted that the positive and negative ion airflow generated by the ionizer 47 enters the blower shroud 45 through a corrugated hose and must then be ejected through the circumferentially equidistant Venturi orifices 48 on the inner wall. The Venturi orifices 48 employ a Venturi tube structure design, with a conical converging section at the inlet and a diffuser section at the outlet. The airflow accelerates in the converging section, forming a high-speed, low-pressure zone at the throat, which can entrain and draw in surrounding air, thus amplifying the ionizing airflow volume ejected from the Venturi orifices 48 by 3-5 times, while simultaneously increasing the airflow velocity.

[0033] After welding is completed, the T-shaped traction frame 316 is pulled in the opposite direction, causing the right-angle clamp 319 to release the chip. During this reset process, the drive lever 321 and the synchronous connecting rod 324 drive the pressure boosting piston 323 to retract. The negative pressure in the coolant circulation loop causes the coolant in the capsule-shaped protective film 327 to be drawn back into the coolant container 322, causing the capsule-shaped protective film 327 to contract and detach from the chip coating without damage. Finally, the lifting platform 2 is lowered to remove the processed chip.

[0034] To verify the technical superiority of the limiting part 3 and the ion wind purification part 4, based on the same chip sample and bonding parameters, a comparative experiment was conducted between the limiting part 3 and the ion wind purification part 4 and a typical clamping device in the prior art. The results are analyzed as follows: Comparison test conditions Chip sample: A Si chip with a 100nm SiO2 passivation coating, measuring 10mm × 10mm.

[0035] Bonding parameters: temperature 250℃, ultrasonic power 1.5W, bonding time 80ms.

[0036] Test indicators: scratch rate of coating surface, range of heat-affected zone in clamping area, particulate contaminant removal efficiency (≥0.3μm), and positioning accuracy.

[0037] Coating surface scratch rate (%) 15.8 0.3 The flexible membrane and chemically inert barrier layer of the limiting part 3 and the ion wind purification part 4 transform rigid hard contact into flexible surface contact, and completely isolate chemical migration, reducing the coating damage rate by approximately 98%. Width of the heat-affected zone in the clamping area (μm) 350-500 80-120 The active cooling cycle between the limiting part 3 and the ion wind purification part 4 directly and continuously removes interfacial heat through the capsule-shaped protective film 327, reducing the heat-affected zone by more than 70% and preventing thermal degradation of the coating. 0.3μm particle removal efficiency (%) < 20 < 98 The limiting part 3 and the ion wind purification part 4 utilize the oscillating ion wind based on the Venturi effect to achieve scanning and dead-angle-free high-efficiency purging, whose purification capacity far exceeds that of static or simple airflow designs in existing technologies. Positioning drift (μm) at 250℃ 12.5 2.1 The limiting part 3 and the ion air purification part 4 are connected by the Invar alloy lifting platform 2 and the symmetrical linkage clamping structure. Combined with active cooling to suppress the thermal deformation of the clamp, the positioning thermal stability is improved by approximately 83%. It can be seen that the limiting part 3 and the ion wind purification part 4, through their original pure mechanical linkage and composite structure design, achieve an order-of-magnitude performance improvement in key indicators such as coating protection, thermal management and purification efficiency compared with the existing technology.

[0038] The ion wind generator 47 blows ion wind onto the chip coating area through the blower shroud 45.

[0039] The lifting platform 2 is vertically slidably positioned at the center line of the machine tool 1. By adjusting the height of the lifting platform 2, a welding operation space is provided for the chip.

[0040] One-way valves are installed between the coolant container 322 and the protective membrane 327, and between the protective membrane 327 and the condenser 329, to control the one-way flow of coolant.

[0041] It should be noted that the main body of the capsule-shaped protective film 327 is a Parylene C flexible capsule, and a 20nm thick dense Al2O3 inorganic film is grown on its outer surface through atomic layer deposition, which has the following effects: Parylene C substrate provides cushion-like elasticity, which can fit tightly to the micro-undulations of the chip edge in a flexible state, transforming point or line contact into surface contact and reducing clamping pressure. The outer Al2O3 film is a completely dense ceramic layer that can effectively prevent the migration of materials inside the capsule protective film 327 and possible chemical substances from the clamping end to the chip coating during high-temperature processing, thus solving the problem of coating contamination caused by material outgassing or diffusion.

[0042] In some embodiments, when the one-way valve on the first recovery tube 328, which is connected to the capsule-shaped protective membrane 327, is closed, the pressure inside the membrane is maintained to achieve a tight bond. When the heat transferred by the bonding tool causes the chip to heat up, the coolant inside the capsule-shaped protective membrane 327 absorbs heat and heats up. The one-way valve on the first recovery tube 328 is a thermosensitive wax-driven type, which is closed at room temperature and automatically opens after reaching a set temperature. When the temperature reaches a set threshold, the thermosensitive wax-driven one-way valve automatically opens, and the high-temperature coolant flows into the condenser 329 through the first recovery tube 328.

[0043] Furthermore, the condenser 329 consists of a set of copper finned tubes, cooled by natural air cooling or forced convection cooling. If forced convection cooling is used, a small axial fan can be installed on one side of the condenser 329. The cooled coolant flows back through a second recovery pipe 3210, which is unidirectionally connected to the coolant container 322, completing one cooling cycle. This passive cooling cycle, linked to the clamping action, eliminates the need for additional pumps, enabling continuous active thermal management during chip processing.

[0044] A corrugated hose is connected between the ion wind generator 47 and the blower hood 45.

[0045] It should be noted that the specific model and specifications of the ion wind generator 47 need to be selected and determined according to the actual specifications of the device. For example, the Simco-Ion model Aerostat XC ion wind generator can be selected, with an ion balance of ≤±30V and an adjustable air volume range of 50-150CFM. The specific selection calculation method adopts the existing technology in this field, so it will not be elaborated here.

[0046] The functional principle of this invention can be explained through the following operational methods: First, the chip to be processed is initially placed on the lifting platform 2 at the vertical position of the machine tool 1. The lifting platform 2 slides longitudinally, and its height is adjusted by manually turning the knob or using a screw mechanism so that the chip is approximately located on the clamping plane of the two sets of limiting parts 3, providing an initial height reference for subsequent precision clamping and positioning; The T-shaped traction frame 316 is pushed to slide towards the chip on the Y-shaped load-bearing bracket 315. The end of the T-shaped traction frame 316 slides on the movable slider 317. At the same time, the movement is ensured to be smooth by the constraint of the limiting pull rod 318. When the T-shaped traction frame 316 moves, the two symmetrically distributed right-angle clamping parts 319 are pulled along the Y-shaped load-bearing bracket 315 to slide towards each other through the traction pull rods 3110 on both sides until they close to fix and clamp the edge of the chip.

[0047] The entire limiting part 3 is fixed on the machine base 1 by the load-bearing bracket 311. The lifting slider 312, together with the drive shaft 314 in the damping bearing 313, can provide smooth rotation support and buffer.

[0048] During the closing process of the right-angle clamp 319, the mechanically connected movable traction drive lever 321 is driven downward through the synchronous connecting rod 324 to push the pressurizing piston 323 in the coolant container 322. The pressurizing piston 323 pressurizes the coolant in the coolant container 322, forcing it to be injected unidirectionally into the bladder-shaped protective membrane 327 installed in the opening receiving groove 326 of the right-angle clamp 319 through the long supply pipe 325 with a one-way valve. As coolant is injected, the capsule-shaped protective film 327 gradually expands and fits tightly against the edge coating structure of the chip in a flexible state. It not only provides a buffer clamping force to prevent hard contact damage to the coating, but also isolates the migration of chemical substances between the clamping end and the chip coating through physical encapsulation. The one-way valve on the first recovery pipe 328, which is connected to the bladder-like protective membrane 327, is in the closed state to maintain the pressure inside the membrane. When the coolant temperature rises due to continuous processing, the one-way valve opens, and the high-temperature coolant flows into the condenser 329 through the first recovery pipe 328. After being cooled down in the condenser 329, it flows back through the second recovery pipe 3210, which is connected to the coolant container 322 in one direction, to complete the circulation and regeneration of the coolant and ensure a continuous cooling and protection effect.

[0049] After the chip is securely clamped and cooling protection is activated, the ion wind generator 47 is started: According to the chip size, the operator can use the lateral sliding of the movable support 41 on the rear side of the machine 1 and the longitudinal sliding of the L-shaped bracket 42 on the movable support 41 to roughly adjust the blower shroud 45 to the optimal position above the chip processing area. The ion wind generator 47 generates positive and negative ion airflow, which is delivered to the blower shroud 45 through a corrugated hose. At the same time, the drive gear 43 is manually or mechanically rotated, which drives the driven gear 46 that meshes with it to make the blower shroud 45 reciprocate around the chip along the trajectory of the guide ring groove 44 from 0° to 180°. After the ionized airflow enters the blower 45, it is ejected at high speed from the Venturi holes 48 that are evenly distributed around the inner wall. The Venturi effect increases the airflow velocity and forms a uniform air curtain. Under the rotating cover, it blows efficiently and without dead angles toward the chip coating area, eliminates static electricity accumulation, and blows away microscopic dust and metal particles generated during the processing, ensuring the cleanliness of the bonding or soldering area. In a precisely positioned, flexibly protected, efficiently cooled, and clean environment, external bonding or welding equipment begins processing the chip. The heat generated during processing is continuously carried away by the coolant within the protective membrane 327, and dust is removed in real time by the ion air purification unit 4. Pulling the T-shaped traction frame 316 in the opposite direction causes the two right-angle clamping parts 319 to move in the opposite direction, releasing the chip. As the right-angle clamping parts 319 reset, the booster piston 323 is driven back through the drive lever 321 and the synchronous connecting rod 324. The coolant in the capsule-shaped protective film 327 is drawn back into the coolant container 322. The capsule-shaped protective film 327 contracts and detaches from the chip coating. Finally, the lifting platform 2 is lowered to remove the processed chip.

[0050] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An auxiliary positioning device for processing coated chips of integrated circuits, comprising a machine base (1) for welding chips, wherein a lifting platform (2) for supporting the initial placement of chips is provided on the machine base (1), characterized in that, Also includes: Two sets of limiting parts (3) are symmetrically arranged on the left and right sides of the machine tool (1), and each set consists of a fixing fixture (31) and a protective fixture (32). The fixing fixture (31) includes symmetrically distributed right-angle clamping parts (319). The two right-angle clamping parts (319) are closed and clamp the edge of the chip. The protective fixture (32) includes a capsule-shaped protective film (327) fitted in the right-angle clamping parts (319). The capsule-shaped protective film (327) is filled and flexibly contacts the chip edge coating structure to isolate the chemical migration between the clamping end and the chip coating. Ion wind purification unit (4) is located at the rear of the machine (1) and includes a blower hood (45) that rotates around the chip from 0° to 180°. An ion wind generator (47) is provided on the machine (1) and communicates with the blower hood (45) to provide ion wind. The ion wind generator (47) blows ion wind to the chip coating area through the blower hood (45).

2. The auxiliary positioning device for integrated circuit coated chip processing according to claim 1, characterized in that, The lifting platform (2) is longitudinally slidably positioned at the vertical line of the machine platform (1).

3. The auxiliary positioning device for integrated circuit coated chip processing according to claim 2, characterized in that, The fixed fixture (31) also includes a load-bearing bracket (311) fixedly installed on the machine base (1). A lifting slider (312) is longitudinally slidably installed on the load-bearing bracket (311). A damping bearing (313) is fixedly installed in the lifting slider (312). A drive shaft (314) is fixedly installed in the damping bearing (313). A Y-shaped load-bearing bracket (315) for symmetrically distributing two right-angle clamping parts (319) is fixedly connected to the drive shaft (314).

4. The auxiliary positioning device for integrated circuit coated chip processing according to claim 3, characterized in that, The Y-shaped load-bearing bracket (315) is slidably mounted with a T-shaped traction frame (316) for pulling two right-angle clamps (319) to move in opposite directions or in the opposite direction.

5. The auxiliary positioning device for integrated circuit coated chip processing according to claim 4, characterized in that, The protective fixture (32) also includes a coolant container (322) fixedly mounted on a Y-shaped load-bearing bracket (315). The coolant container (322) is used to unidirectionally supply coolant to the capsule-shaped protective membrane (327). A condenser (329) is also mounted on the Y-shaped load-bearing bracket (315). The condenser (329) is used to unidirectionally recover the high-temperature coolant in the capsule-shaped protective membrane (327) into the coolant container (322).

6. The auxiliary positioning device for integrated circuit coated chip processing according to claim 5, characterized in that, One-way valves are provided between the coolant container (322) and the bladder-shaped protective membrane (327), and between the bladder-shaped protective membrane (327) and the condenser (329).

7. The auxiliary positioning device for integrated circuit coated chip processing according to claim 6, characterized in that, The capsule-shaped protective membrane (327) is mainly a flexible capsule, and a dense inorganic film is grown on the outer surface of the flexible capsule using an atomic layer deposition process.

8. The auxiliary positioning device for integrated circuit coated chip processing according to claim 7, characterized in that, The ion air purification unit (4) also includes a movable support (41) that is laterally slidably installed on the rear side of the machine (1), and an L-shaped bracket (42) for rotating the blower hood (45) is longitudinally slidably installed on the movable support (41).

9. The auxiliary positioning device for integrated circuit coated chip processing according to claim 8, characterized in that, The inner wall of the blower shroud (45) is provided with circumferentially equidistant Venturi holes (48).

10. The auxiliary positioning device for integrated circuit coated chip processing according to claim 9, characterized in that, A corrugated hose is connected between the ion wind generator (47) and the blower hood (45).

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