Method for preparing moisture-curing resin compositions using non-tin catalysts

Abstract

A method includes: combining at least one moisture-curing resin with at least one plasticizer to form an initial mixture; removing moisture by mixing the initial mixture with a first dehydrating agent, a first dehydrating catalyst component, and an additive to form a reaction mixture and heating it to a temperature of at least 60°C; and contacting the reaction mixture with a second dehydrating agent, a second dehydrating catalyst component, and a curable catalyst component to form a curable resin composition, wherein the curable catalyst component is a non-tin complex.

Description

Background Technology

[0001] Moisture-curing resin compositions are commonly used as coating materials for protective structures. Such compositions may include a moisture-curing resin, a catalytic component, and a plasticizer. Conventional methods have proven time-consuming and utilize single-component or two-component moisture-curing formulations. In single-component formulations, the container holds the necessary non-volatile components; however, the aqueous components require dehydration and drying before use, and physical drying is necessary during mixing. In two-component formulations, the catalyst is not added to the initial formulation, but the components must still be dried by chemical and physical means when long-term storage of the final product is required. Formulations containing solid components require heating for dehydration and drying. When using liquid components, vacuum drying or the use of synthetic desiccants is preferred. However, in either two-component case, the storage stability of the formulation needs to be improved by using additional catalysts. Therefore, continuous improvement of methods for forming moisture-curing resin compositions is needed. Summary of the Invention

[0002] This summary is provided to introduce a series of concepts that will be further described in the following detailed description. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help limit the scope of the claimed subject matter.

[0003] The embodiments disclosed in this specification relate to a method comprising: combining at least one moisture-curing resin with at least one plasticizer to form an initial mixture; removing moisture by mixing the initial mixture with a first dehydrating agent, a first dehydrating catalyst component, and an additive to form a reaction mixture and heating it to a temperature of at least 60°C; and contacting the reaction mixture with a second dehydrating agent, a second dehydrating catalyst component, and a curable catalyst component to form a curable resin composition, wherein the curable catalyst component is a non-tin complex.

[0004] Other aspects and advantages of the claimed subject matter will become apparent from the following description and the appended claims. Detailed Implementation

[0005] This disclosure relates to a one-component method for formulating moisture-curing resin compositions, wherein a dehydrating agent and a catalyst are used to promote the chemical drying of the composition. Generally, conventional methods for preparing moisture-curing resins involve adding the dehydrating agent and catalyst only at the end of the process to ensure that the resin does not cure prematurely and has good storage stability. However, this disclosure provides advantages over conventional methods by including multiple additions of the dehydrating agent and catalyst. These two steps improve the overall processing of the composition by reducing the amount of volatile components that must be removed during processing. Furthermore, surprisingly, the disclosed method also improves the mechanical properties of cured resins made from the curable resin composition.

[0006] One or more embodiments of this disclosure relate to a method for preparing a moisture-curing resin. The method of forming a curable resin composition includes the step of combining at least one moisture-curing resin with at least one plasticizer to form an initial mixture. Moisture can be removed from the initial mixture by mixing the initial mixture with a first dehydrating agent, a first dehydrating catalyst component, and an additive to form a reaction mixture and heating to a temperature of 60°C or higher. The reaction mixture is then contacted with a second dehydrating agent, a second dehydrating catalyst component, and a curable catalyst component to form a curable resin composition, wherein the curable catalyst component is a non-tin complex.

[0007] First, before heating, the dehydrating agent and an initial dehydration catalyst are loaded into a container containing a moisture-curing resin. Then, after cooling, these components are treated with additional amounts of the dehydrating agent and catalyst to form a curable resin composition. Adding the dehydrating agent and catalyst at two different time points during the process results in sufficient chemical drying of the curable composition, thereby improving the commercial scalability and processability of the curable resin formulation.

[0008] Therefore, this disclosure generally relates to a method for forming a curable resin composition, wherein multiple components are combined to ultimately form a curable resin. The components used in this method include at least one moisture-curing resin, at least one plasticizer, a dehydrating agent, and a dehydration catalyst. Each of these components, as well as other optional components that may be included, are described below.

[0009] The moisture-curing resin used in the methods of this disclosure may be a polymer containing functional groups that react with moisture or water. In one or more embodiments, the moisture-curing resin comprises reactive organosilicon groups, such as silyl-terminated polyethers and / or silane-terminated polyurethanes.

[0010] The specific structure of the reactive silicon group is not particularly limited, but it may include reactive silicon groups represented by general formula (1): -Si(R 13-a )X a (1) Wherein R¹ represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms; X represents a hydrolyzable group, wherein when there are two or more X groups, each X group may be the same or different; and a is an integer from 1 to 3, wherein when a is 1, each R¹ group may be the same or different, and when a is 2 or 3, each X group may be the same or different.

[0011] In one or more embodiments, the moisture-curing resin includes trimethoxysilyl, methyldimethoxysilyl, triethoxysilyl, methyldiethoxysilyl, or a combination thereof.

[0012] Specific examples of moisture-curing resins may include, but are not limited to, one or more of KANEKA MS POLYMER® S327, S227, S203H and S303H, and KANEKA SILYL® MA904, SAX220, SAX350, SAX530, SAX400, SAX590, SAT145 and SAT115.

[0013] The number of reactive organosilicon groups that each individual polymer chain in a moisture-curing resin may have ranges from about 0.5 to about 6, for example from a lower limit selected from any one of 0.5, 0.6, 0.7, 0.8, 0.9, 1.0 and 1.1 to an upper limit selected from any one of 3, 4, 5 and 6, wherein any lower limit may be paired with any upper limit.

[0014] Moisture-curing resins can have linear or branched structures, and their number-average molecular weight (Mn) can range from about 500 to about 100,000, for example, from a lower limit selected from any one of 500, 1000, 2000, and 3000 to an upper limit selected from any one of 10,000, 15,000, 50,000, and 100,000, wherein any lower limit can be paired with any upper limit. Mn can be measured using an HLC-8120GPC (TOSOH) as the solution delivery system, a TSK-GEL H-type column (TOSOH), and THF solvent.

[0015] The molecular weight distribution (Mn / Mw) (or the ratio of Mn to weight-average molecular weight (Mw)) of the moisture-curing resin is 1.6 or less, for example, 1.6 or less, 1.4 or less, or 1.2 or less.

[0016] The reactive organosilicon groups of moisture-curing resins can be bonded to the ends of polymer chains, or bonded between the ends along the polymer chains, or multiple reactive organosilicon groups can be bonded to the ends and bonded along the polymer chains.

[0017] The number of reactive silicon groups in a single polymer chain of a moisture-curing resin may be 0.5 or more on average, or 1 or more on average; or may be in the range of about 0.5 to 6, for example in the range from a lower limit selected from any one of 0.5, 0.6, 0.7, 0.8, 0.9, 1.0 and 1.1 to an upper limit selected from any one of 3, 4, 5 and 6, wherein any lower limit may be paired with any upper limit.

[0018] The curable resin compositions disclosed herein include at least one plasticizer. Suitable plasticizers may include, but are not limited to, benzoates, phthalates, cyclohexyl diesters, glycol diesters, petroleum fractions, and combinations thereof. Benzoate plasticizers may include isodecanyl benzoate (e.g., Jayflex™ MB10 (“MB10”) available from ExxonMobil), glycol diester plasticizers may include tri(ethylene glycol)bis(2-ethylhexanoate) “TEG-EH” (e.g., Oxfilm 351 available from OQ Chemicals), phthalates may include diisononyl phthalate (e.g., Jayflex™ DINP), cyclohexyl diesters may include diisononyl 1,2-cyclohexanedicarboxylate (e.g., Hexamoll™ DINCH available from BASF), and petroleum fraction plasticizers may include Fluid D 170 LPP (available from TotalEnergies).

[0019] In one or more embodiments, the plasticizer is used alone or in combination with at least one plasticizer of higher viscosity (plasticizer blend). A plasticizer of higher viscosity is defined as a plasticizer having a Brinell viscosity of at least 25 cP at 23°C. When measured using a rotational or Brinell viscometer (“Bruchner viscosity”), at least one plasticizer in the curable resin composition or plasticizer blend may have a dynamic viscosity of less than 25 cP at 23°C. In one or more embodiments, the viscosity of the plasticizer at 23°C ranges from about 1 cP to about 25 cP, for example, from a lower limit selected from any one of 1 cP, 2 cP, 4 cP, and 5 cP to an upper limit selected from any one of 15 cP, 20 cP, and 25 cP, wherein any lower limit may be paired with any upper limit. For example, when measured using a Brookfield LV viscometer with an RV-01 rotor at a temperature of 23°C and 12 revolutions per minute (rpm), the MB10, D 170 LPP, and TEG-EH can exhibit dynamic viscosities of 13 cP, 15 cP, and 17 cP, respectively.

[0020] The dehydrating agent used in the methods disclosed herein may be independently selected from, but not limited to, alkoxysilane compounds, such as n-propyltrimethoxysilane, vinyltrimethoxysilane (VTMO), vinylmethyldimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane, γ-glycidoxypropyltrimethoxysilane, and octyltrimethoxysilane, as well as combinations thereof.

[0021] The dehydration catalyst used in the methods disclosed herein may be independently selected from, but is not limited to: silane coupling agents; reaction products of silane coupling agents, such as silanes containing isocyanate groups, silanes containing amino groups (aminosilanes), silanes containing mercapto groups, silanes containing epoxy groups, silanes containing vinyl unsaturated groups, and halogenated silanes; amino-modified silane polymers; unsaturated aminosilane complexes; phenylamino long-chain alkylsilanes; aminosilanized organosilicones; silanized polyesters; amine compounds, such as aliphatic primary amines, aliphatic secondary amines, aliphatic tertiary amines, and aliphatic unsaturated amines; nitrogen-containing heterocyclic compounds, such as pyridine and imidazole; amidine compounds, such as 1,8-diazabicyclo(5,4,0)undecane-7 (DBU); silanol condensation catalysts, including titanium complexes (e.g., organotin compounds tetrabutyl titanate, tetrapropyl titanate, and tetraacetylacetone titanium), tetravalent tin compounds. (For example, dibutyltin dilaurate, dibutyltin maleate, dibutyltin diphthalate, dibutyltin dioctanoate, dibutyltin diethylhexanoate, dimethyltin dibutyltin maleate, diethyltin dibutyltin maleate, dibutyltin dibutyltin dibutyl maleate, dioctyltin dibutyltin dioctyl maleate, tridecyltin dibutyltin maleate, dibenzyltin dibutyltin maleate, dibutyltin diacetate, diethyltin dioctyltin dioctyltin dioctyltin dioctyltin maleate, dimethoxy Dibutyltin, dinonylphenol dibutyltin, dibutylenyltin oxide, dibutyltin diacetylacetonate, dibutyltin diethylacetoacetate, and the reaction products of dibutyltin oxide with phthalates), divalent tin compounds (e.g., tin octoate, tin naphthenate, tin stearate, and tin tert-carbonate), inorganic tin, and aluminum complexes and organoaluminum compounds (e.g., aluminum triacetylacetonate, aluminum triethylacetoacetate, and aluminum diisopropoxyethylacetoacetate).

[0022] Non-tin catalysts, including non-tin complexes (such as zinc complexes), can also be used as catalysts. A “non-tin” catalyst is a catalyst that does not contain tin or does not contain tin-containing compounds (such as organotin compounds). Non-tin complexes that can be used as curable catalytic components include, but are not limited to, carboxylic acid metal salt catalysts, zinc complexes, titanium complexes and their condensates, amidine-containing complexes, and combinations thereof. Non-tin complexes may also include complexes generated in situ from any of the above combinations. Suitable non-tin catalysts may include, but are not limited to: carboxylic acid metal salt catalysts, such as potassium neodecanoate (e.g., “TIB KAT® K25” available from TIB Chemicals AG); zinc complexes (e.g., “K-KAT 670” available from King Industries); and titanium complexes, such as diisopropoxydiethylacetoacetate titanate (e.g., “Tyzor® PITA” available from Dorf Ketal Chemical, LLC.).

[0023] Other examples of titanium complexes include, but are not limited to, complexes having formula (I): Ti(OR 5 ) d Y 4-d (I) Where R 5 It is a substituted or unsubstituted hydrocarbon having 1 to 20 carbon atoms, Y represents a chelated coordination compound, and d represents 0 or an integer from 1 to 4.

[0024] By R 5 The substituted or unsubstituted hydrocarbon group is preferably an aliphatic or aromatic hydrocarbon group, with aliphatic hydrocarbon groups being preferred. Examples of aliphatic hydrocarbon groups include saturated or unsaturated hydrocarbon groups. Saturated hydrocarbon groups are preferably straight-chain or branched alkyl groups. The hydrocarbon group preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 4 carbon atoms. (The last part, "by R," appears to be a typo and can be left as is.) 5 The hydrocarbon groups represented include, but are not limited to, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, hexyl, heptyl, octyl, 2-ethylhexyl, nonyl, decyl, etc. Examples of substituents that the hydrocarbon group may have include, but are not limited to, methoxy, ethoxy, hydroxyl, and acetoxy. When multiple R groups are present... 5 At the same time, they can be the same or different.

[0025] The chelating coordination compound represented by Y can be a compound known to coordinate with titanium. Examples include, but are not limited to, 2,4-pentanedione, 2,4-hexanedione, 2,4-pentadecanedione, 2,2,6,6-tetramethyl-3,5-heptanedione, 1-phenyl-1-aryl-1,3-butanedione, 1,3-butanedione, 1-(4-methoxyphenyl)-1,3-butanedione, 1,3-diphenyl-1,3-propanedione, 1,3-bis(2-pyridyl)-1,3-propanedione, 1,3-diaryl-1,3-propanedione, and 1,3-bis(4-methoxyphenyl)-1,3-propanedione.

[0026] Y can also be a diketone, such as 3-benzyl-2,4-pentanedione; a ketoester, such as methyl acetoacetate, ethyl acetoacetate, butyl acetoacetate, tert-butyl acetoacetate, ethyl 3-oxohexanoate; an N,N-dimethyl ketoamide, such as acetoacetamide, N,N-diethylacetoacetamide, acetoacetanilide; a malonate, such as dimethyl malonate, diethyl malonate, diphenyl malonate; examples include malonamides, such as N,N,N',N'-tetramethylmalonamide and N,N,N',N'-tetraethylmalonamide. Among these, diketones and ketoesters are preferred.

[0027] When multiple chelating coordination compounds (Y) are present, they may be the same or different. In formula (I), d represents 0 or an integer from 1 to 4. Since the curable resin compositions according to this disclosure exhibit better curability and improved elongation after curing, d preferably represents 0 or an integer from 1 to 3, more preferably 1 to 3. More preferably, it represents an integer 2. Specific examples of titanium compounds represented by general formula (I) include, but are not limited to, tetramethoxytitanium, trimethoxyethoxytitanium, trimethoxyisopropoxytitanium, trimethoxybutoxytitanium, dimethoxydiethoxytitanium, dimethoxydiisopropoxytitanium, dimethoxydibutoxytitanium, methoxytriethoxytitanium, methoxytriisopropoxytitanium, methoxytributoxytitanium, tetraethoxytitanium, triethoxyisopropoxytitanium, triethoxybutoxytitanium, diethoxydiisopropoxytitanium, diethoxydibutoxytitanium, ethoxytriisopropoxytitanium, ethoxytributoxytitanium, tetraisopropoxytitanium, triisopropoxybutoxytitanium, diisopropoxydibutoxytitanium, tetrabutoxytitanium, tetratert-butoxytitanium, diisopropoxytitanium bis(acetylacetonate), diisopropoxytitanium bis(ethyl acetoacetate), diisobutoxytitanium bis(ethyl acetoacetate); condensates of titanium alkoxides, such as tetrabutoxytitanium dimer and tetrabutoxytitanium tetramer. A single titanium compound may be used, or two or more may be used in combination. The titanium compound represented by general formula (I) is preferably a compound containing a chelating coordination compound represented by Y, because it exhibits good curability and improved elongation after curing. Specifically, diisopropoxytitanium bis(acetylacetonate), diisopropoxytitanium bis(ethyl acetoacetate), and diisobutoxytitanium bis(ethyl acetoacetate) are particularly preferred.

[0028] Complexes containing amidine structures are represented by general formula (II): R 2 N=CR 3 -NR 4 2 (II) Where R², R³ and R 4 Same or different, indicating a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms. Two Rs 4 The groups can be the same or different. R², R³, and two Rs 4 Any two or more of them can be bonded together to form a ring structure.

[0029] To improve the curability of the resin composition, R² is preferably a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, and the carbon atom adjacent to the nitrogen atom has an unsaturated bond. More preferably, R² is a hydrocarbon group containing 1 to 10 carbon atoms, and even more preferably a hydrocarbon group containing 1 to 6 carbon atoms (because it is readily available).

[0030] R³ is preferably a hydrogen atom or a component of --NR. 6The organic group represented by 2, more preferably by --NR 6 The 2 indicates an organic group, which increases the curability of the curable resin composition. However, the two Rs... 6 Each group independently represents a hydrogen atom or an organic group having 1 to 20 carbon atoms. In this case, the compound represented by general formula (II) is a guanidine compound.

[0031] Furthermore, R³ can be derived from -NR 7 -C(=NR 8 )-NR 9 2 or by --N=C(NR¹) 0 2) Organic groups represented by -NR¹¹² are preferred because they result in cured products with good physical properties. However, R 7 R 8 and two R 9 Each R1 independently represents a hydrogen atom or an organic group having 1 to 6 carbon atoms. 0 The two R¹¹ each independently represent a hydrogen atom or an organic group having 1 to 6 carbon atoms. In this case, the compound represented by general formula (II) is called a biguanide compound. The two R¹¹ in general formula (II) 4 It is a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, because they are readily available and improve the curability of the curable resin composition. It preferably represents a group, more preferably a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

[0032] The amidine-containing compound preferably contains 2 or more carbon atoms, more preferably 6 or more, and particularly preferably 7 or more. There is no particular upper limit to the number of carbon atoms, but it is preferably 10,000 or less. Furthermore, the molecular weight of the amidine-containing compound is preferably 60 or more, more preferably 120 or more, and particularly preferably 130 or more. There is no particular upper limit to the molecular weight, but it is preferably 100,000 or less. Compounds containing an amidine structure (b1) are not particularly limited, but include, for example, pyrimidines, 2-aminopyrimidines, 6-amino-2,4-dimethylpyrimidines, 2-amino-4,6-dimethylpyrimidines, 1,4,5,6-tetrahydropyrimidines, 1,2-dimethyl-1,4,5,6-tetrahydropyrimidines, 1-ethyl-2-methyl-1,4,5,6-tetrahydropyrimidines, 1,2-diethyl-1,4,5,6-tetrahydropyrimidines, 1-n-propyl-2-methyl-1,4,5,6-tetrahydropyrimidines, 2-hydroxy-4,6-dimethylpyrimidines, 1,3-diazanaphthalenes, 2-hydroxy-4-aminopyrimidines, and other pyrimidine compounds; 2-imidazoline, 2-Methyl-2-imidazoline, 2-ethyl-2-imidazoline, 2-propyl-2-imidazoline, 2-vinyl-2-imidazoline, 1-(2-hydroxyethyl)-2-methyl-2-imidazoline, 1,3-dimethyl-2-iminoimidazoline, 1-methyl-2-iminoimidazoline-4-one and other imidazoline compounds; 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU), 1,5-diazabicyclo[4.3.0]non-5-ene (DBN), 2,9-diazabicyclo[4.3.0]non-1,3,5,7-tetraene, 6-(dibutylamino)-1,8-diazabicyclo[5 [4,0] Undec-7-ene (DBA-DBU) and other amidine compounds; guanidine, dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, 1,1-dimethylguanidine, 1,3-dimethylguanidine, 1,2-diphenylguanidine, 1,1,2-trimethylguanidine, 1,2,3-trimethylguanidine, 1,1,3,3-tetramethylguanidine, 1,1,2,3,3-pentamethylguanidine, 2-ethyl-1,1,3,3-tetramethylguanidine, 1,1,3,3-tetramethyl-2-n-propylguanidine, 1,1,3,3-tetramethyl-2-isopropylguanidine, 2-n-butyl-1,1,3,3 -Tetramethylguanidine, 2-tert-butyl-1,1,3,3-tetramethylguanidine, 1,2,3-tricyclohexylguanidine, 1-benzyl-2,3-dimethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-ethyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-n-propyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-isopropyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-n-butyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene.[0]dec-5-ene, 7-cyclohexyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-n-octyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene and other guanidine compounds; biguanides, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-(2-ethylhexyl)biguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1 Biguanide compounds such as 1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1-(o-tolyl)biguanide, 1-morpholinobiguanide, 1-n-butyl-N2-ethylbiguanide, 1,1'-ethylenebiguanide, 1,5-ethylenebiguanide, 1-[3-(diethylamino)propyl]biguanide, 1-[3-(dibutylamino)propyl]biguanide, N',N''-dihexyl-3,12-diimino-2,4,11,13-tetraazatetradecanediamine, etc.; and other compounds. Only one amidine-containing compound may be used, or two or more may be used in combination. The amidine-containing compound is preferably an amidine or a guanidine compound, more preferably DBU, DBA-DBU, DBN, or phenylguanidine, as curability is improved; DBA-DBU or DBN is more preferred, and DBU is particularly preferred. .

[0033] Examples of other catalytic components may include, but are not limited to, phenols and epoxy resins, sulfur, alkyl titanates, and aromatic polyisocyanates, used alone or in combination. As those skilled in the art will understand, although referred to as “catalytic components” in this disclosure, the exemplary catalytic components described above can be used for various purposes in compositions, particularly when used in the amounts of catalysts described below. For example, some of the components described above can be used as adhesion promoters.

[0034] The additives used in the methods disclosed herein may include stabilizers, fillers, rheology modifiers, pigments, and combinations thereof. Other suitable additives include, but are not limited to, thixotropic agents (anti-sagging agents), UV inhibitors / absorbers, antioxidants, flame retardants, curing modifiers, lubricants, antifungal agents, and combinations thereof.

[0035] Examples of fillers may include, but are not limited to, heavy and light calcium carbonate (CaCO3), magnesium carbonate, diatomaceous earth, calcined clay, clay, and bentonite; reinforcing fillers such as fumed silica, precipitated silica, and crystalline silica; and fiber fillers such as glass fibers and filaments.

[0036] Examples of pigments may include, but are not limited to, titanium dioxide (TiO2) and carbon black.

[0037] Examples of thixotropic agents may include, but are not limited to, hydrogenated castor oil, organic amide waxes, organic bentonite, and calcium stearate.

[0038] Examples of UV inhibitors / absorbers may include, but are not limited to, benzophenone compounds, benzotriazole compounds, triazine compounds, salicylates, substituted toluene compounds, and metal chelates.

[0039] Examples of stabilizers may include, but are not limited to, hindered amine light stabilizers (HALS), benzotriazole compounds, and benzoate compounds.

[0040] Examples of antioxidants may include, but are not limited to, hindered phenolic antioxidants such as Irganox® 245, Irganox® 1010 and Irganox® 1076 (available from BASF).

[0041] As described above, this disclosure primarily relates to a method for forming a curable resin composition, the method comprising the steps of: combining at least one moisture-curing resin with at least one plasticizer to form an initial mixture; removing moisture by mixing the initial mixture with a first dehydrating agent and a first dehydrating catalyst component to form a reaction mixture and heating it to a temperature of 60°C or higher; and contacting the reaction mixture with a second dehydrating agent, a second dehydrating catalyst component, and a curable catalyst component to form a curable resin composition. Furthermore, the method for forming the curable resin composition can advantageously be carried out under atmospheric pressure. Compared to conventional preparation methods, eliminating the need for a vacuum pump can significantly simplify the process, thereby reducing the time and cost associated with the preparation of the curable resin. However, the method can also be carried out under reduced pressure, allowing the steps of the method to be performed partially or entirely under reduced pressure.

[0042] In one or more embodiments, at least one moisture-curing resin is combined with at least one plasticizer in a container to form an initial mixture. The at least one moisture-curing resin and the at least one plasticizer can be any curing resin and plasticizer described above. The initial mixture is thoroughly wetted to form the initial mixture. This wetting is to ensure the absence of visible powder components and to achieve initial homogeneity to form the initial mixture, but not necessarily to achieve the degree of powder agglomerate decomposition achievable only through higher shear mixing. The mixer is not particularly limited, and any suitable mixer known in the art can be used. In one or more specific embodiments, a planetary or multi-axis mixer can be used. While the initial wetting step does not require shear mixing, it can be employed at this step as it is useful for subsequent mixing steps, as described below. Initial wetting can be performed at room temperature and atmospheric pressure. In some embodiments, a vacuum can be applied during the wetting step.

[0043] In one or more embodiments, the amount of moisture-curing resin in the initial mixture is in the range of about 10 wt% to about 70 wt% of the initial mixture, for example, from the lower limit selected from any one of 10 wt%, 20 wt%, and 30 wt% to the upper limit selected from any one of 50 wt%, 60 wt%, and 70 wt%, wherein any lower limit may be paired with any upper limit.

[0044] In one or more embodiments, the amount of plasticizer in the initial mixture is in the range of about 5 wt% to about 50 wt% of the initial mixture, for example, from a lower limit selected from any one of 5 wt%, 10 wt%, and 20 wt% to an upper limit selected from any one of 30 wt%, 40 wt%, and 50 wt%, wherein any lower limit may be paired with any upper limit.

[0045] In one or more embodiments, the content of the moisture-curing resin and plasticizer in the initial mixture is in the range of about 20 wt% to about 90 wt% of the initial mixture, for example, from the lower limit selected from any one of 20 wt%, 30 wt%, and 40 wt% to the upper limit selected from any one of 70 wt%, 80 wt%, and 90 wt%, wherein any lower limit may be paired with any upper limit. Other components constituting the remainder of the initial mixture are as follows.

[0046] As described above, the curable resin composition may also include additives. Therefore, the step of combining the moisture-curing resin with the plasticizer may further include contacting the initial mixture with additives, such as stabilizers, fillers, rheology modifiers, pigments, thixotropic agents (anti-sagging agents), UV inhibitors / absorbers, antioxidants, flame retardants, curing modifiers, lubricants, and antifungal agents, as well as combinations thereof. Furthermore, those skilled in the art will recognize that many such additives can have various uses in the composition and can also be used in method steps involving the reaction mixture. For example, UV absorbers and antioxidants can be used as stabilizers. In one or more embodiments, the amount of additives present in the initial mixture is in the range of about 5 wt% to about 80 wt% of the initial mixture, for example, from the lower limit selected from any one of 5 wt%, 10 wt%, 15 wt%, and 20 wt% to the upper limit selected from any one of 50 wt%, 60 wt%, 70 wt%, and 80 wt%, wherein any lower limit may be paired with any upper limit.

[0047] In one or more embodiments that include a stabilizer, the amount of stabilizer in the initial mixture is in the range of about 0 wt% to about 3 wt% of the initial mixture, for example, from a lower limit selected from any one of 0, 0.1 wt% and 0.2 wt% to an upper limit selected from any one of 0.5 wt%, 1 wt%, 2 wt% and 3 wt%, wherein any lower limit may be paired with any upper limit.

[0048] In one or more embodiments that include filler, the amount of filler in the initial mixture is in the range of about 0 wt% to about 75 wt% of the initial mixture, for example, from a lower limit selected from any one of 0, 1 wt%, 5 wt% and 10 wt% to an upper limit selected from any one of 55 wt%, 65 wt% and 75 wt%, wherein any lower limit may be paired with any upper limit.

[0049] In one or more embodiments including pigments, the amount of pigment in the initial mixture is in the range of about 0 wt% to about 10 wt% of the initial mixture, for example, from a lower limit selected from any one of 0, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, and 0.5 wt% to an upper limit selected from any one of 6 wt%, 7 wt%, 8 wt%, 9 wt%, and 10 wt%, wherein any lower limit can be paired with any mathematically compatible upper limit.

[0050] In one or more embodiments including a thixotropic agent, the amount of thixotropic agent in the initial mixture is in the range of about 0 wt% to about 4 wt% of the initial mixture, for example, from a lower limit selected from any one of 0, 0.1 wt%, and 0.2 wt% to an upper limit selected from any one of 1 wt%, 1.5 wt%, 1.7 wt%, 2 wt%, 3 wt%, 3.9 wt%, and 4 wt%, wherein any lower limit may be paired with any upper limit.

[0051] After the initial mixture is formed, it can be mixed with a first portion of dehydrating agent and a first portion of dehydrating catalyst to form a reaction mixture. In one or more embodiments, these components can be slowly added to a container so that no visible liquid residue remains, and the mixture can then be mixed using a high-shear mixer. In some embodiments, the reaction mixture is heated to a temperature of at least 60°C by external heating or shear friction to promote dehydration, as described in more detail below.

[0052] The combination of the first dehydrating catalyst component and the first dehydrating agent acts as a moisture remover, promoting the chemical drying of the initial mixture rather than relying heavily on physical drying methods (such as drying under vacuum and high temperature). Volatile components in the reaction mixture can damage the vacuum pump; therefore, utilizing chemical drying methods can significantly improve resin processing.

[0053] The amount of the first dehydrating agent used can range from about 0.1 wt% to about 3 wt% of the reaction mixture, for example, from the lower limit selected from any one of 0.1 wt%, 0.2 wt%, and 0.3 wt% to the upper limit selected from any one of 0.5 wt%, 1 wt%, 2 wt%, and 3 wt%, where any lower limit can be paired with any upper limit. Generally, based on the humidity specifications of each component, the initial amount of dehydrating agent can be stoichiometrically close to the theoretical humidity level of the formulation. Therefore, as those skilled in the art will understand, the amount of dehydrating agent can be appropriately selected to suit a given formulation.

[0054] The amount of the initial dehydration catalyst component should be optimized to ensure adequate chemical treatment of the mixture without causing excessive premature curing of the resin. Therefore, the content of the initial catalyst component in the reaction mixture can range from about 0.1 wt% to about 3 wt% of the reaction mixture, for example, from the lower limit selected from any one of 0.1 wt%, 0.15 wt%, 0.2 wt%, 0.5 wt%, and 1 wt% to the upper limit selected from any one of 0.5 wt%, 1.0 wt%, 1.5 wt%, 2 wt%, 2.5 wt%, and 3 wt%, where any lower limit can be paired with any upper limit.

[0055] After adding the first portion of the dehydrating agent and the first portion of the dehydrating catalyst, the reaction mixture is heated. The mixing step is carried out in a temperature range of about 60°C to about 120°C, for example, in a range from the lower limit selected from any one of 60°C, 70°C, 80°C, and 90°C to the upper limit selected from any one of 100°C, 110°C, and 120°C, where any lower limit can be paired with any upper limit. Heat can be applied externally, for example by using a jacketed vessel with external heating, or by friction provided by a mixer geometry that provides a sufficiently high shear rate (e.g., a Cowles disperser).

[0056] In one or more embodiments, the reaction mixture is initially maintained at about 80°C for at least 15 minutes to allow initial condensation of the dehydrating agent. After initial condensation, a reduced pressure may be applied to the reaction mixture to supplement chemical drying. The reduced pressure may be applied using a vacuum pump (e.g., but not limited to a diaphragm pump) or any other device that can be used to reduce pressure and facilitate physical removal of moisture or water. However, as an alternative to applying a reduced pressure, the mixing step may be performed at atmospheric pressure.

[0057] In one or more embodiments, the amount of time for the mixing step is in the range of at least 15 minutes to 4 hours, for example, in the range of a lower limit selected from any one of 15 minutes, 30 minutes and 60 minutes to an upper limit selected from any one of 2 hours, 3 hours and 4 hours, wherein any lower limit can be paired with any upper limit.

[0058] Following the mixing step, the reaction mixture is cooled and contacted with a second dehydrating agent, a second dehydrating catalyst component, and a curable catalyst component to form a curable resin composition. In one or more embodiments, the contacting step is carried out in a temperature range of 20°C to 50°C, thereby cooling the reaction mixture to a target temperature range, for example, from a lower limit selected from any one of 20°C, 22.5°C, 25°C, and 30°C to an upper limit selected from any one of 40°C, 45°C, and 50°C, wherein any lower limit may be paired with any upper limit. The reaction mixture can be cooled using an external cooling medium through a jacketed container or by allowing the heat of the reaction medium to dissipate over time.

[0059] The dehydrating agent in the second part can be any dehydrating agent described above. The amount of the second part of the dehydrating agent used can be in the range of about 0.1 wt% to about 3 wt% of the curable resin composition, for example, from the lower limit selected from any one of 0.1 wt%, 0.2 wt%, and 0.3 wt% to the upper limit selected from any one of 0.5 wt%, 1 wt%, 2 wt%, and 3 wt%, wherein any lower limit can be paired with any upper limit.

[0060] The catalytic component in the secondary dehydration catalytic component can be any catalytic component described above. The content of the secondary dehydration catalytic component can range from about 0.1 wt% to about 20 wt% of the curable resin composition, for example, from the lower limit selected from any one of 0.1 wt%, 0.5 wt%, and 1 wt% to the upper limit selected from any one of 4 wt%, 4.5 wt%, and 5 wt%, wherein any lower limit can be paired with any upper limit. In embodiments involving non-tin catalyst complexes as curable catalytic compositions, the non-tin catalyst complex comprises an amidine-containing compound and a titanium complex or a condensate thereof, wherein the weight ratio of the titanium compound or its condensate to the amidine-containing compound is in the range of about 0.1 to 20.

[0061] Following the addition of the second dehydrating agent and the second dehydrating catalyst in the contact step, the curable resin composition can be treated with additional additives, including any additives described above, any volatile components, and / or additional catalysts. While the first and second catalysts are used to assist the chemical drying process concurrently with the formation of the curable resin composition, once the curable resin composition is formed, an additional amount of the final catalyst can be added to enhance its ability to cure upon exposure to moisture. Therefore, the final catalyst can be added immediately before packaging into moisture-proof packaging. The catalyst in the final catalyst can be any catalyst described above. The amount of the final catalyst can range from about 0.01 wt% to 1.0 wt% of the curable resin composition, for example, from the lower limit selected from any one of 0.01 wt%, 0.03 wt%, and 0.5 wt% to the upper limit selected from any one of 0.7 wt%, 0.85 wt%, and 1.0 wt%, wherein any lower limit can be paired with any upper limit. Therefore, the total amount of the catalytic component (including the initial, secondary, and final portions of the catalytic component) provides sufficient catalytic activity so that the compound will have ideal surface drying time and overall curing properties upon contact with ambient moisture. In one or more embodiments, the total amount of the catalytic component in the curable resin composition is in the range of about 0.1 wt% to about 5.2 wt%, for example, selected from the lower limit of any one of 0.2 wt%, 1 wt%, and 2 wt% to the upper limit selected from any one of 3 wt%, 4 wt%, 5 wt%, and 5.1 wt%, wherein any lower limit may be paired with any upper limit.

[0062] Once the above method steps are completed and the composition is packaged in moisture-proof packaging, a storage-stable curable resin composition is formed. The curable resin composition can have suitable properties for a variety of applications. For example, the viscosity of the curable resin composition can be within a suitable range for its intended commercial application. As mentioned above, this viscosity can be achieved through simpler processing without the need for depressurization.

[0063] That is, the present invention relates to the following: (1) a method for preparing a moisture-curing resin composition, comprising the steps of: combining at least one moisture-curing resin with at least one plasticizer to form an initial mixture; removing moisture by mixing the initial mixture with a first dehydrating agent, a first dehydrating catalyst component and an additive to form a reaction mixture and heating it to a temperature of at least 60°C; and contacting the reaction mixture with a second dehydrating agent, a second dehydrating catalyst component and a curable catalyst component to form a curable resin composition, wherein the at least one moisture-curing resin comprises a reactive silicon group represented by general formula (1): -Si(R 13-a )X a (1) Wherein R¹ represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms; wherein X represents a hydrolyzable group, wherein when there are two or more X groups, each X may be the same or different; wherein a is an integer from 1 to 3, wherein when a is 1, each R¹ may be the same or different, and when a is 2 or 3, each X may be the same or different; and wherein the curable catalytic component is a non-tin complex.

[0064] (2) According to the method of (1), wherein the additive is selected from the group consisting of stabilizers, fillers, rheology modifiers, pigments, and combinations thereof.

[0065] (3) The method according to (1) or (2), wherein the mixing is carried out at atmospheric pressure.

[0066] (4) The method according to any one of (1) to (3), wherein the at least one moisture-curing resin is selected from the group consisting of trimethoxysilyl, methyldimethoxysilyl, triethoxysilyl, and methyldiethoxysilyl, and combinations thereof.

[0067] (5) The method according to any one of (1) to (4), wherein the at least one moisture-curing resin comprises a silane-terminated polyether.

[0068] (6) The method according to any one of (1) to (5), wherein the at least one plasticizer is selected from the group consisting of benzoic acid esters, phthalic acid esters, cyclohexyl diesters, glycol diesters, petroleum fractions, and combinations thereof.

[0069] (7) The method according to any one of (1) to (6), wherein the content of the first dehydrating agent ranges from 0.1 wt% to 3 wt%.

[0070] (8) The method according to any one of (1) to (7), wherein the content of the second dehydrating agent ranges from 0.1 wt% to 3 wt%.

[0071] (9) The method according to any one of (1) to (8), wherein the first dehydrating agent and the second dehydrating agent are independently selected from the group consisting of n-propyltrimethoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane, γ-glycidoxypropyltrimethoxysilane, and combinations thereof.

[0072] (10) The method according to any one of (1) to (9), wherein the moisture-curing resin and the plasticizer are in the reaction mixture in the range of 20 wt% to 90 wt%.

[0073] (11) The method according to any one of (1) to (10), wherein the content of the first dehydration catalyst component in the reaction mixture ranges from 0.1 wt% to 3 wt%.

[0074] (12) The method according to any one of (1) to (11), wherein the content of the first dehydration catalyst component in the reaction mixture ranges from 0.1 wt% to 0.5 wt%.

[0075] (13) The method according to any one of (1) to (12), wherein the content of the second part of the dehydration catalyst component in the reaction mixture ranges from 0.1 wt% to 5 wt%.

[0076] (14) The method according to any one of (1) to (13), wherein the non-tin complex is selected from the group consisting of carboxylic acid metal salt catalysts, zinc complexes, titanium complexes and their condensates, complexes containing amidine structures, and combinations thereof.

[0077] Example

[0078] The following examples are provided to illustrate embodiments of this disclosure. These examples are not intended to limit the scope of the invention and should not be interpreted in that way.

[0079] The "SAX350" (MS polymer) and "SAX220" (MS polymer) in Tables 1 through 10 are moisture-curing resins purchased from Kaneka. The plasticizer diisononyl phthalate (DINP) is a non-benzoic acid plasticizer with a boiling point above 400°C. DINP has a dynamic viscosity of 86 cP when measured at 6 rpm at 23°C using a Brookfield LV viscometer with an RV-01 rotor. UltraPflex is available from Specialty Minerals. Hubercarb® Q3T is available from Huber. Ti-Pure™ R902+ is available from Chemours. CRAYVALLAC® SLT is available from Arkema. Eversorb® HP6 is available from Everlight Chemical. VTMO, DAMO-T, Dynasylan 1146, and Dynasylan 6490 are available from Evonik. NEOSTANN U-220H organotin catalyst is available from Nitto Kasi. Tyzor® PITA and Tyzor® TPT are available from Dorf Ketal Chemicals. TIB KAT® K25 is available from TIB Chemicals AG.

[0080] Examples 1 to 9 and Comparative Examples 1 and 2 of moisture-curing resin compositions were prepared by mixing moisture-curing resin, plasticizer, catalyst and various additives, as shown in Tables 1 to 3.

[0081] Compare Examples 1 and 2 with Examples 1 through 9

[0082] For Comparative Examples 1 and 2, and Examples 1 to 9, the MS polymer and the plasticizer diisononyl phthalate (DINP) were first combined in a container with varying amounts of additives, namely calcium carbonate (UltraPflex, Q3T), titanium dioxide (Ti-Pure R902+), Crayvallac SLT, and HP6, as shown in Tables 1 to 3. These components were thoroughly wetted, then mixed and heated to 60°C. The first portion of VTMO and the first portion of DAMO-T (as shown in Tables 1 to 3, if applicable) were added and mixed under heating. Comparative Example 1 used a thermal process. For Comparative Examples 2, Examples 1 to 4, and Examples 6 to 9, chemical drying entirely from VTMO and the catalytic components was used to facilitate moisture removal. The mixture was cooled, and then a second dehydrating agent (VTMO or Dynasylan 6490), a second catalyst component (DAMO-T or Dynasylan 1146), and an organotin or non-tin complex (U-220H, Tyzor PITA, Tyzor TPT, and / or DBU) were added under vacuum, in amounts shown in Tables 1 to 3. The mixing time for Comparative Example 2 and Examples 2, 3, 6, 8, and 9 was 90 minutes, while the mixing time for Examples 1, 4, 5, and 7 was 30 minutes.

[0083] Table 1

[0084] Table 2

[0085] Table 3

[0086] physical properties

[0087] The dynamic viscosity of the resin composition was measured using a Brinell rotational viscometer (“HA” or “Bruchner” viscosity) with a 07 rotor. Viscosities were measured at frequencies of 1 rpm, 2 rpm, and 10 rpm. The Brinell thixotropic index value for each resin composition was determined by dividing the HA viscosity at 2 rpm by the HA viscosity of the same resin composition at 10 rpm. The increase in viscosity was defined as the difference between (i) the dynamic viscosity of the resin composition after mixing of the components and (ii) the dynamic viscosity of the resin composition after storage at 50°C for 4 weeks.

[0088] The surface drying time of the resin composition was determined by placing the resin composition in a container and measuring the time required for skin formation under conditions of 23°C and 50% relative humidity (RH). The surface drying time test of the resin composition was performed immediately after the components were mixed.

[0089] Each curable composition is extruded from the cartridge and filled into a mold frame approximately 5 mm thick using a scraper. The surface of each filled composition is then completely smoothed, and the smoothing completion time is set as the curing start time. Every minute, the surface of each composition is touched with the scraper, and the skin formation time is measured as the time when the composition no longer adheres to the scraper.

[0090] The curing depth is defined as the thickness (in mm) of the composition when it cures to the elastomeric state during an aging process at ambient temperature and humidity over a specified time period.

[0091] After 1 day and 7 days, the residual stickiness was observed by touch and measured on a scale of 1 to 8, where 8 indicates no residual stickiness and 1 indicates very sticky.

[0092] The hardness measured by the Shore A hardness tester refers to the indentation hardness. The hardness mentioned in this instruction manual is measured according to ASTM C661 standard.

[0093] Tensile properties were measured according to ASTM D412. A Japanese Industrial Standard No. 3 dumbbell specimen, punched from sheet material, was used. The 100% tensile modulus (M100), tensile strength, and elongation at break of the specimen were measured using a universal testing machine at a tensile rate of 200 mm / min.

[0094] Each curable composition was extruded from a barrel, allowing it to adhere to different substrates, and then aged at 23°C for 7 days. Subsequently, a 90-degree manual peel test was performed on the compositions. The degradation of the cured material was observed, and the cohesive failure rate and adhesion failure rate (CF rate) were investigated.

[0095] The various physical properties of the resin compositions of Examples 1 to 9 and Comparative Examples 1 and 2 are measured as follows.

[0096] Tables 4 through 7 illustrate the changes in the physical properties of the compositions resulting from the use of dehydrating agents and catalytic components in the formulation and subsequent physical drying. Examples 1 through 9 of the present invention employ a combination of a non-tin catalyst (titanium compound TyzorPITA or Tyzor TPT and K25) with an amidine structure (DBU), which provides sufficient catalytic activity to show improvements in tensile and elongation properties compared to Comparative Example 2, which uses only an organotin catalyst. Specifically, a comparison between Comparative Example 2 and Example 2 shows that the use of the non-tin complex exhibits improvements in tensile strength, elongation at break, and viscosity increase. Example 1 shows that using a different second portion of dehydrating agent and catalytic component with the non-tin catalyst still shows an improvement in elongation at break. Example 3 shows that using 1 phr as the first portion and 2 phr as the second portion of the catalytic component during long-term storage of the composition shows further improved tensile and elongation properties, as well as a lower viscosity increase. Similar effects are shown between Example 2 and Example 6, where the latter example only reduces the mixing time (to 30 minutes) but improves the viscosity increase. Examples 4 and 5 compare the physical properties obtained using only chemical drying versus using both chemical and physical drying. While the tensile properties in Examples 4 and 5 are still improved compared to Comparative Example 2, the viscosity increase is more pronounced. Overall, these examples demonstrate that the in-situ oligomers of VTMO / DAMO-T (likely due to the unique inclusion of the product of chemical dehydration promoted by the moisture scavenger and catalytic component prior to the main mixing step) can be used to improve the surface drying time in the finished product, even when using a non-tin curing catalyst.

[0097] Table 4

[0098] Table 5

[0099] Table 6

[0100] Table 7

[0101] While the scope of these methods has been described with reference to several embodiments, it should be understood that those skilled in the art will appreciate that numerous examples, variations, and modifications of the compositions and methods described herein are within the scope and concept of this disclosure. Therefore, the described embodiments are set forth without loss of generality and do not impose any limitation on this disclosure. Those skilled in the art will understand that the scope includes all possible combinations and uses of the specific features described in the specification.

[0102] Although only a few exemplary embodiments have been described in detail above, those skilled in the art will readily understand that many modifications can be made to the exemplary embodiments without substantially departing from the invention. Therefore, all such modifications are intended to be included within the scope of this disclosure as defined by the appended claims. In the claims, the means-plus-function clause is intended to cover structures described in this disclosure as performing the enumerated functions, encompassing not only structural equivalents but also equivalent structures. Thus, although nails and screws may not be structural equivalents—because nails have a cylindrical surface for securing wooden parts together, while screws have a helical surface—nails and screws can be equivalent structures in the context of fastening wooden parts.

Claims

1. A method for preparing a moisture-curing resin composition, the method comprising the following steps: The step of combining at least one moisture-curing resin with at least one plasticizer to form an initial mixture; The step of removing moisture by mixing the initial mixture with a first portion of dehydrating agent, a first portion of dehydrating catalyst and additives to form a reaction mixture and heating it to a temperature of at least 60°C; as well as The step of contacting the reaction mixture with a second part of dehydrating agent, a second part of dehydrating catalyst, and a curable catalyst to form a curable resin composition. Wherein, the at least one moisture-curing resin comprises a reactive silicon group represented by general formula (1): -Si(R 1 3-a )X a (1), Wherein, R¹ represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms; Where X represents a hydrolyzable group, and when there are two or more Xs, each X may be the same or different; Where a is an integer from 1 to 3, when a is 1, each R¹ can be the same or different, when a is 2 or 3, each X can be the same or different; and The curable catalytic component is a non-tin complex.

2. The method according to claim 1, wherein, The additive is selected from the group consisting of stabilizers, fillers, rheology modifiers, pigments, and combinations thereof.

3. The method according to claim 1, wherein, The mixing takes place at atmospheric pressure.

4. The method according to claim 1, wherein, The at least one moisture-curing resin is selected from the group consisting of trimethoxysilyl, methyldimethoxysilyl, triethoxysilyl, and methyldiethoxysilyl, as well as combinations thereof.

5. The method according to claim 1, wherein, The at least one moisture-curing resin includes a silane-terminated polyether.

6. The method according to claim 1, wherein, The at least one plasticizer is selected from the group consisting of benzoic acid esters, phthalic acid esters, cyclohexyl diesters, glycol diesters, petroleum fractions, and combinations thereof.

7. The method according to claim 1, wherein, The content of the first dehydrating agent ranges from 0.1 wt% to 3 wt%.

8. The method according to claim 1, wherein, The content of the second dehydrating agent ranges from 0.1 wt% to 3 wt%.

9. The method according to claim 1, wherein, The first dehydrating agent and the second dehydrating agent are independently selected from the group consisting of n-propyltrimethoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane, γ-glycidoxypropyltrimethoxysilane, and combinations thereof.

10. The method according to claim 1, wherein, The moisture-curing resin and the plasticizer are present in a concentration range of 20 wt% to 90 wt% in the reaction mixture.

11. The method according to claim 1, wherein, The content of the first dehydration catalyst component in the reaction mixture ranges from 0.1 wt% to 3 wt%.

12. The method according to claim 1, wherein, The content of the first dehydration catalyst component in the reaction mixture ranges from 0.1 wt% to 0.5 wt%.

13. The method according to claim 1, wherein, The content of the secondary dehydration catalyst component in the reaction mixture ranges from 0.1 wt% to 5 wt%.

14. The method according to claim 1, wherein, The non-tin complex is selected from the group consisting of carboxylic acid metal salt catalysts, zinc complexes, titanium complexes and their condensates, complexes containing amidine structures, and combinations thereof.

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