A device for providing a stamp element, a stamp element for such a device, a storage device for such a device, a facility for such a device, and a method for manufacturing and operating such a device.

Abstract

An apparatus for providing a stamp element (1) that leaves a structured portion when used in an impression material (10), the stamp element comprising: a profile element (4) that acts on the impression material (10) when the stamp element (1) is used, wherein the profile element (4) is preferably configured in the form of a soft stamp; and a support element (3) that supports the profile element (4) and, in particular, serves as a support when the stamp element (3) is used, wherein the profile element (4) and the support element (3) are disposed on and / or on a carrier substrate (2) for transport.

Description

Technical Field

[0001] The present invention relates to an apparatus for providing a stamp element, a stamp element for such an apparatus, a storage device and facility for such an apparatus, a method for manufacturing such an apparatus, and a method for operating such an apparatus. Background Technology

[0002] Over the past few years, one of the most important technologies in the manufacture of electronic components, especially in the field of providing structures, has been imprint lithography, which has increasingly replaced or at least expanded upon classical lithography. With the help of imprint lithography, it is now possible to fabricate structures in the nanoscale using HVM (high-volume manufacturing) methods.

[0003] The advantages of imprint lithography lie in its high throughput, low cost, and the quality and reproducibility of structures. Classical lithography equipment, which is required to produce structures in the nanometer range, is becoming increasingly expensive. Furthermore, mask production is costly and resource-intensive.

[0004] Conversely, in imprint lithography, pre-manufactured stamps are used, and these stamps can be reused multiple times. A distinction is made between hard and soft stamps. Hard stamps are made from materials that are difficult to deform, primarily metals, metal alloys with very little ceramic, or glass. Hard stamps are shape-stable, but like all tools, they wear down over time. Wear is a significant problem because hard stamps are very expensive to manufacture. As an alternative, soft stamps are very often used. These stamps are molded from a pre-made hard stamp as a negative. The hard stamp is also called a master stamp or simply a template. The material used for soft stamps is typically a polymer. Although soft stamps also wear down over time, they can be remolded from the master stamp very quickly and cost-effectively.

[0005] It has been demonstrated that manufacturing a high-quality, expensive master stamp and multiple soft stamps molded from it is not only economically worthwhile but also offers technological advantages. The embossing structure of a soft stamp is flexible, using a soft polymer as the stamp material; this embossing structure is a mold of the structure to be manufactured in the embossing material. This flexibility allows the embossing structure to be more easily demolded from the embossing material. Furthermore, soft stamps are generally transparent to the electromagnetic radiation used, by means of which the embossing material should preferably be cured.

[0006] In existing technologies, flexible stamps are typically provided on a support element. In the field of imprint lithography, the support element is sometimes also referred to as a backplane. The support element should be rigid enough to allow for the transport and handling of the flexible stamp, but thin enough to remain flexible and resilient. In most cases, the thickness of the support element is very small, preferably in the range of millimeters or sub-millimeters.

[0007] Furthermore, the support element must meet certain chemical and physical properties, particularly regarding cleanability. The soft stamp made on the support element should be easily removable from it after a certain number of uses.

[0008] The problem is that support elements are typically made of brittle materials, preferably glass, silicon, or other materials that are frequently used in the semiconductor industry and are as inexpensive as possible. Furthermore, support elements are difficult to manipulate. Summary of the Invention

[0009] Therefore, the object of the present invention is to provide a well-functioning stamp element that can be manufactured or supplied relatively simply and cost-effectively. Furthermore, the stamp element should be easy to operate, for example, and can be used in stamping equipment, especially embossing equipment, with as little complexity as possible.

[0010] The present invention achieves the stated object by means of the apparatus according to claim 1, the stamp element according to claim 10, the storage device according to claim 11, the facility according to claim 13, the method for operating the apparatus according to claim 15, and the method for manufacturing the apparatus. All combinations of at least two features given in the specification, claims, and / or drawings also fall within the scope of the invention. In the case of the given value range, values ​​within the mentioned limits should also be considered as limit values ​​and can be claimed in any combination.

[0011] According to a first aspect of the invention, an apparatus is provided for providing a stamp element, the stamp element being designed to leave a structured portion in the impression material during its use, the stamp element comprising:

[0012] - A profile element, which acts on the impression material when the stamp element is used, wherein the profile element is preferably constructed in the form of a soft stamp element, and

[0013] - A support element that supports the profile element and, in particular, serves as a support when using a stamp element.

[0014] The profile elements and support elements are disposed on and / or on the carrier substrate for transportation purposes.

[0015] Unlike existing technologies, this invention proposes providing the stamp element, particularly for transporting the stamp element, using a carrier substrate. Specifically, unlike common practices in the prior art, it proposes functional separation, where the carrier device ensures that a support element and a profile element can be transported to operate the stamp element. The primary function of the support element is, especially during the stamping process, i.e., when using the stamp element, to act as a support so that the profile element can induce the desired imprinting function in the imprinting material. Therefore, it is advantageous that the support element assumes the function of ensuring the transportability of the entire stamp element. In other words, it is feasible to achieve functional separation within the device, where the support element serves as a support during the stamping process, and the carrier device assumes the transport function to properly place the stamp element in the imprinting equipment and / or to allow for stamp element replacement. This proves advantageous because it increases the flexibility of the support element design, for example, in terms of material selection and / or geometry. In particular, this also allows for simpler influence on the stamping element during the stamping process, because, for example, by increasing the elasticity of the support element, such as by using a thinner support element, it is easier to induce localized deformation throughout the stamping element or within the support element. This deformation can have a corresponding corrective effect during the stamping process. Furthermore, the characteristics of the stamping element can facilitate easier separation of the soft stamping element or profile portion from the support element in subsequent processes. Preferably, the carrier substrate, designed to be larger than the stamping element in the lateral direction or in a direction extending parallel to the main extension plane, is preferably designed such that the carrier substrate allows for the transport of the stamping element, and in particular, also enables the stamping element to be placed in the corresponding stamping equipment. It is conceivable that the carrier substrate is removed from the support element again after the transport process, or similarly becomes part of the stamping equipment. Here, the support element and the profile element do not need to be forcibly placed on the same side of the carrier substrate, especially stacked vertically. It is also conceivable that the profile element and the support element are placed on opposite sides of the carrier substrate. Particularly preferably, the profile element and the support element are placed on only one side of the carrier substrate. Alternatively, only one support element and only one profile element are respectively disposed on opposite sides of the carrier substrate.

[0016] In particular, the support elements and profile elements are arranged stacked one on top of the other along a direction perpendicular to the main extension plane. The stamp element includes profile elements and support elements.

[0017] In one particular embodiment, however, the support element and the profile element are located on opposite sides of the carrier substrate. In this particular case, the profile element is formed directly on the carrier substrate, and the support element stabilizes the carrier substrate and the profile element from the back side of the carrier substrate, or is used as a support, particularly in the manner in which the support element acts on the profile element via the carrier substrate.

[0018] The preferred support element for the substrate is a wafer, particularly a silicon wafer. Silicon wafers are readily available and easy to handle, inexpensive, and the most extensively studied. Their physical and chemical properties are well-known. The task of the support element is to impart the desired, precisely configurable stability and formability to the soft stamp. This is currently preferably understood as the supporting capacity of the support element. In particular, the supporting function of the support element should be understood as follows: when using the stamp element, the force reaction or action of the imprint material on the stamp element, especially on the side of the profile element facing the imprint material, is applied not only in the direction perpendicular to the main extension plane but also in the direction parallel to the main extension plane. The supporting function is used to ensure that the sections of the profile element remain in a fixed position and / or orientation. In other words, displacement or reorientation of sections and profile elements, especially due to the stamping process, should be avoided to ensure the reproducibility of the resulting structure.

[0019] Preferably, the apparatus, particularly the support element, carrier substrate, and / or profile element, has at least one orientation mark. In a preferred embodiment, the support element has at least one orientation mark. Due to the rigidity of the support element, the orientation mark can be applied with very high precision. The orientation mark is particularly useful for simplifying orientation. If present, the orientation mark can only be manufactured very imprecisely on the film serving as the carrier substrate or on the profile element. The orientation feasibility of the profile element connected to the support element relative to the structure to be imprinted will be correspondingly poor.

[0020] The rigidity of the support elements also significantly helps the profile elements maintain shape stability before, during, and after the embossing process. This results in very good overlap accuracy, another advantage compared to existing technologies.

[0021] The main advantage of support elements is that numerous methods known in the semiconductor industry can be implemented at the support element to set corresponding physical and / or chemical properties, especially for profiled elements. Such setting on a carrier substrate, especially on a thin film, is not always feasible. For example, depositing layers, hydrophilizing or hydrophobizing, and creating directional markings on thin films made of polymers are difficult or even impossible.

[0022] The profile element, especially in the form of a soft stamp element, is made of soft stamp impression material, preferably formed by imprinting with a main stamp. The soft stamp is preferably made of at least one of the following material categories:

[0023] ● Carbon-based polymers

[0024] ○ Perfluoropolyether (PFPE)

[0025] ○ Polyurethane acrylate

[0026] ● Silicon-based polymers

[0027] ○ Polydimethylsiloxane (PDMS)

[0028] ○ Polymeric oligomeric silsesquioxane (POSS)

[0029] ○ Tetraethyl orthosilicate (TEOS)

[0030] ○ Poly(organo)siloxane (silicone)

[0031] ● Thermoplastics

[0032] ● Thermosetting plastics

[0033] ● Elastomers

[0034] Soft stamp materials are typically multi-component materials. The thickness of the profile element can only be given as an average value due to its soft stamp embossing structure on the surface. However, thickness can also affect deformation behavior and is therefore explicitly disclosed. The thickness of the profile element is between 100 nm and 1 mm, preferably between 500 nm and 500 µm, more preferably between 750 nm and 250 µm, most preferably between 1 µm and 200 µm, and completely most preferably between 2 µm and 100 µm.

[0035] The size of the soft stamp embossed structure ranges from 1 nm to 500 µm. Therefore, the smallest structures in the nanometer range can be embossed using imprint lithography, for example, to fabricate functional units, and structures in the micrometer range can be embossed, for example, to fabricate microlenses. The size of the soft stamp embossed structure thus depends on the structure to be embossed.

[0036] Preferably, the profile element can be detached from the support element. This allows for the reuse of the support element and the carrier substrate. In this case, the profile element is removed from the support element, the support element and / or carrier element are cleaned, and then the support element is re-imprinted onto the support element by an imprinting process to create a new profile element. The detachment of the profile element from the support element is preferably performed by at least one of the following methods:

[0037] ● Physical removal

[0038] ● Plasma

[0039] ○ Mechanical separation is performed using the following methods

[0040] ▪ Blade

[0041] ▪ Wire

[0042] ● Chemical removal

[0043] solvent

[0044] acid

[0045] alkali

[0046] The separation of the profile element from the support element preferably begins at the edge. Therefore, it is particularly advantageous that the support element, especially at the edge of the profile element, can be easily bent, i.e., it has low bending resistance. Here, the support element can be manufactured such that the bending resistance about an axis parallel to the surface of the support element is a function of position. Thus, the support element can have high bending resistance at the center and low bending resistance at the edges. This physical property is not feasible in the prior art using a simple carrier substrate, especially a thin film.

[0047] In particular, it is conceivable that the E-modulus of the support element can be set vertically and / or horizontally, preferably as a function of position. This can be achieved by depositing different layers and their masking.

[0048] In particular, the adhesion strength (more precisely, the bonding strength) between the carrier substrate and the support element should be 1.1 times, preferably 1.5 times, more preferably 2.0 times, most preferably 5.0 times, and most preferably 10.0 times greater than the adhesion strength between the support element and the profile element. The adhesion strength can be determined, for example, according to the standard DIN EN ISO 4624. The unit of adhesion strength is Newtons per square meter. Adhesion strength represents the force, in Newtons, that must be applied per square meter to cause separation of two surfaces bonded together. In the semiconductor industry, especially when characterizing two bonded surfaces, it is expressed in Joules per square meter, i.e., the amount of energy required to separate the two surfaces from each other. Therefore, the relative numerical range of adhesion strength also applies to other conceivable physical variables by which the adhesion between two surfaces can be described. Both methods are known to those skilled in the art.

[0049] Particularly preferably, the carrier substrate is designed as a thin film, at least partially, preferably completely, particularly preferably more than 50%, more than 70%, and particularly preferably more than 80%. In a particularly preferred embodiment, the carrier substrate is a simple thin film, especially a film used to fix the substrate for dicing. This type of film is the most common, cost-effective, suitable, and can fix other substrates in the semiconductor industry. Due to the common use of this film, it is also called a dicing tape. Other films can also be used in principle. The film is preferably tensioned or laminated on a frame. If the film is a dicing tape, the frame on which the film is tensioned is called a dicing frame. The frame can be made of plastic or metal. In the following, these two technical expressions, dicing tape and dicing frame, are used as synonyms for all types of films and film tensioners. The preferred method of fixing the support element to the film is adhesive bonding. Most films are delivered with an adhesive layer already present. Alternatively, an adhesive layer can be applied to the support element and / or carrier substrate using methods known in the semiconductor industry.

[0050] It is also conceivable that the carrier substrate is at least partially or entirely formed of a plurality of overlapping and intersecting strips and / or strip-shaped elements. The carrier substrate may also be at least partially or entirely a wafer and / or a plate. The plate may in particular be a metal plate or a ceramic plate. In particular, the carrier substrate is designed such that the support elements fixed thereon, along with the soft stamp, can be transported in a standardized manner. While the carrier substrate can also provide support for support elements and profile elements, transport efficiency is the primary objective.

[0051] In particular, the carrier substrate is designed to maintain the shape stability of the stamp element in the device during transport, especially even if the stamp element itself, i.e., without the support element, is shape unstable. This simplifies and improves the orientation and placement of the stamp element in the stamping equipment. Alternatively, it is conceivable that the carrier substrate, together with the support element, can be partially and controllably deformed, for example, forming an arch and / or partially rolled up. Controlled deformation is particularly understood to be feasible by means of the carrier substrate contacting or supporting the support element at multiple points, thereby enabling controlled deformability. In particular, shape-stable transport of the stamp element is feasible through contact at multiple points or areas, preferably more than three or four points. This can also simplify operation in some cases, especially during the placement process in the stamping equipment.

[0052] Preferably, the support element is releasably fastened to the carrier substrate. This allows the carrier substrate to be advantageously removed again during or after the insertion of the support element. This exposes the back side of the support element, which can be influenced, for example, by mechanical action. Consequently, the support element can also be manipulated to influence the stamping process.

[0053] Preferably, the film is at least partially fixed in or at the frame. In particular, the film is clamped within the frame to ensure necessary stability during transport. The frame preferably comprises frame components facing each other, with at least a portion of the film and / or carrier substrate clamped between the frame components. For example, the spacing of the frame elements can tension the carrier substrate, especially when the carrier substrate is designed as a film, to allow, for example, the stamping element to be transported as planar as possible, or to apply necessary pressure when inserted into a stamping device. Preferably, the frame elements are designed at least partially around the stamping element, for example, in a U-shape and / or a square configuration.

[0054] Preferably, a tensioning device is provided, by means of which the tension of the carrier substrate can be set or ensured, especially the film tension in the case of a thin film.

[0055] Preferably, the film is configured as a continuous strip to provide multiple stamp elements, particularly on the carrier substrate provided as the continuous strip. The stamp elements, or hybrid stamps, are then manufactured in batches on the continuous strip and can be separated as needed. It is also conceivable that support elements are initially applied only in rows on the continuous strip. Such portions are separated from the continuous strip only when a carrier substrate-support element combination is required to mold a soft stamp thereon.

[0056] Preferably, the carrier substrate is designed to prevent lateral displacement of the stamp elements, i.e., the support elements and / or profile elements. For this purpose, for example, it is proposed that the carrier substrate, particularly the film, has a coating, which preferably serves an adhesive function. It is also conceivable that the carrier substrate has corresponding stops and / or clamping and / or fixing devices, configured to laterally secure the stamp elements to be transported, so as to prevent slippage during transport. It is also conceivable that the carrier substrate, particularly the film, is locally deep-drawn, to, for example, ensure that the support elements do not shift during transport.

[0057] It is also conceivable that the transport element has reference markings to enable, for example, an automated process for integrating the substrate element into the stamping equipment. Advantageously, this avoids embedding, or having to embed, the corresponding reference markings on the support element. For example, this involves barcodes or QR codes for identifying the corresponding stamp elements. The reference markings are primarily used to identify the transport element.

[0058] Preferably, the support element is transparent so that the imprint material can be cured, for example, by transmitting light through the support element. If the carrier substrate is removed again after the stamp element has been installed in the printing apparatus, the material of the carrier substrate is more flexible because it is no longer mandatory for the carrier substrate to be transparent. If the carrier substrate remains at the stamp element or at the support and profile elements, it is also preferably transparent to allow exposure from the back side of the stamp element, first through the carrier substrate and support element, and then through the profile element, provided that the support and profile elements are located on the same side of the carrier substrate.

[0059] The support element preferably comprises one of the following material categories:

[0060] ● Metals

[0061] ○ Cu, Al, Fe, Ni, Co, W, Cr, Ti, Ta

[0062] ● Metal alloys

[0063] ○ Steel

[0064] ● Semiconductors

[0065] ○ Elemental Semiconductors

[0066] ▪ Si, Ge

[0067] ○ Compound semiconductors

[0068] ▪ GaAs, GaNInP, InxGa1-xN, InSb, InAs, GaSb, AlN, InN, GaP, BeTe, ZnO, CuInGaSe2, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe , Hg(1-x)Cd(x)Te, BeSe, HgS, AlxGa1-xAs, GaS, GaSe, GaTe, InS, InSe, InTe, CuInSe2, CuInS2, CuInGaS2, SiC, SiGe

[0069] ● Ceramics

[0070] ○ Nitride ceramics

[0071] ▪ Si3N4

[0072] ● Glass

[0073] ● Plastic

[0074] It is conceivable that the carrier substrate has voids. For example, it is conceivable that voids are strategically provided, particularly multiple voids, which allow action on the support element. For example, it is conceivable that voids are provided in the carrier substrate so that when the carrier substrate is also held fastened at the support element in the stamping equipment, light can pass through the support element to reach the imprint material and cause curing there, particularly partial curing. It is also conceivable that voids are strategically provided so that when the device having the carrier substrate is arranged in the stamping equipment, it can mechanically act on the support element. For example, it is conceivable that the carrier substrate has a grid-like and / or checkerboard arrangement of voids so that it can act strategically in a defined area to cause deformation of the support element, which is then transmitted to the profile element so that the orientation of the profile element can be correspondingly corrected during and / or before the stamping process. It is also conceivable that by acting on the support element, separation between the carrier substrate and the support element is simplified.

[0075] Alternatively, the carrier substrate could have a particularly central, circular opening, the diameter of which is slightly smaller than the diameter of the support element. Thus, the support element is held in place by the carrier substrate on the periphery, but can be directly illuminated through the opening, allowing the use of an opaque carrier substrate. A disadvantage of this embodiment is that the overall stability of the stamp element is reduced.

[0076] Alternatively, it is conceivable to generate LEDs on the surface of the carrier substrate facing the profile element, which serve as a direct light source for exposing the imprint material. In this case, the carrier substrate no longer needs to be transparent, as it itself becomes the light source. OLEDs can be used when a thin film is used as the carrier substrate. If the carrier substrate is a semiconductor material, a corresponding inorganic LED is generated.

[0077] Preferably, the film thickness is between 10µm and 500µm, more preferably between 50µm and 400µm, even more preferably between 100µm and 350µm, most preferably between 150µm and 300µm, and most preferably between 180µm and 250µm. If the carrier substrate is a wafer instead of a thin film, the thickness begins at the maximum SEMI standard thickness of 525µm. Otherwise, the preferred value range is similar.

[0078] Specifically, it is proposed that the support element is made of an elastic material and / or the thickness of the support element is between 10 nm and 525 µm, preferably between 100 nm and 525 µm, more preferably between 500 nm and 525 µm, most preferably between 1 µm and 525 µm, and most preferably between 10 µm and 525 µm. Such a thin support element is generally not shape-stable during transportation. Furthermore, the support element can be more easily deformed locally and in a restricted manner.

[0079] The support element is preferably thinned and polished to achieve its desired thickness, and the support element has been fixed to the carrier substrate.

[0080] Typically, the following method steps can be performed, particularly for surface treatment. This includes, in particular:

[0081] ● Thinning

[0082] ● Grinding

[0083] ● Plasma treatment

[0084] ● Hydrophilic

[0085] ● Hydrophobicity

[0086] ● Deposition of layers

[0087] ● Generation of directional markers, especially in sedimentation

[0088] ● Photolithographic structuring of layers, especially the generation of masking masks

[0089] ● Etching

[0090] ● Roughening of substrate surface

[0091] In particular, the generation of directional marks at the support element is a significant improvement over existing technologies. The rigidity of the support element allows for the generation of directional marks with high accuracy and precision, especially through deposition, and the marks can be observed through the profile element and / or the support element and carrier substrate. In existing technologies, directional marks are primarily generated at the profile element using a soft stamping structure, or directly at the profile element, which is disadvantageous for various reasons. Preferably, the directional marks are generated on the surface where the profile element is located. However, it is also conceivable to generate the directional marks on the surface facing the carrier substrate.

[0092] Creating a mask on the support element allows for the definition of the exposure area. This can be used to create an exposure mask that ensures that only the desired area of ​​the imprint material is subsequently exposed.

[0093] After the surface of the support element is prepared, the profile element can be manufactured on it, especially by molding from the master stamp.

[0094] It is particularly preferred that the material constituting the support element has a strength or stiffness greater than that of the profile element. This ensures, in particular, that the support element functions as a support to ensure that portions or sections of the profile element do not move when engaged with the imprint material.

[0095] Another subject of the invention is a stamp element for a device according to the invention, wherein the stamp element comprises a profile element and a support element, and wherein the stamp element is shape-unstable.

[0096] "Shape unstable" is preferably understood as the stamp element bending, particularly non-shape unstable, at least in part due to the acting gravity, when in point contact with the support element, especially due to the shape unstable design of the support element. Therefore, unilateral operation without bending is not feasible. Bending is understood as a deviation from the horizontal extension, said deviation being greater than 2°, preferably greater than 5°, and particularly preferably greater than 10°. Here, the outer edge of the stamp element furthest from the contact point is used as a reference, with an imaginary horizontal plane extending through said outer edge as a reference.

[0097] Specifically, it is pointed out that the support element does not constitute a means for independently transporting the stamp element. For example, the support element lacks the shape stability to ensure that the support element can be transported independently. For example, the support element is formed thinly or made of a very elastic or deformable material, which will cause the support element to lack the stability required for transport.

[0098] Another advantage is that the stamp element can be placed without contact with the support or profile elements via an object or operating device, thereby avoiding damage and / or contamination of the stamp element, for example, by the operating device. Alternatively, contact is achieved via a carrier substrate that is easy to clean and, in particular, easy to replace.

[0099] Another subject of the invention is a storage device for storing multiple devices according to the invention. All the advantages and features described for the devices can be similarly applied to the storage device. In particular, it is conceivable that the devices, together with their frames, are stacked vertically within the storage device. Preferably, a push-in region is provided into which the corresponding devices can be pushed. Preferably, the devices are spaced apart within the storage device. For example, it is also conceivable that the frame elements are thickly designed so that the devices can be stacked vertically, with the frame elements contacting each other while the profile elements do not collide with the carrier elements respectively located thereon. This avoids damage to the profile elements.

[0100] Preferably, the storage device is designed to be movable or mobile. This allows, for example, the simultaneous transport of multiple devices when the corresponding stamping element is to be used in other stamping equipment.

[0101] Another subject of the equipment is a facility, particularly a stamping or embossing facility, having the means according to the invention. All the characteristics and advantages of the device described herein can be similarly applied to the equipment. Particularly preferably, the facility is designed to house or operate the device. For example, the facility includes operating equipment, such as a robot, which receives, transports, and, for example, places the device at a target location. For this purpose, the robot may, for example, utilize corresponding reference marks on a carrier substrate. Preferably, the facility includes a cleanroom.

[0102] Another subject of the invention is a method for operating a stamp element, wherein the stamp element has a profile element and a support element, wherein the stamp element is supported by a carrier substrate, wherein the carrier substrate is preferably configured as a thin film. All the advantages and characteristics described for the apparatus can be similarly applied to the method for operating the stamp element, and vice versa.

[0103] Furthermore, a method for manufacturing the device according to the invention is proposed. All the advantages and characteristics described for the device can be similarly transferred to the method for manufacturing it, and vice versa. Preferably, the manufacturing comprises:

[0104] - Provide carrier substrate

[0105] - Attach the support element to the carrier substrate, and

[0106] - Attach the profile element to the support element and / or the carrier substrate. It is conceivable that the profile element is attached to the support element when the support element is attached to the carrier substrate, or that the support element and the profile element are attached to the carrier substrate on opposite sides.

[0107] A method for manufacturing hybrid stamps or stamp elements is described later in this paper.

[0108] In the first method step, a carrier substrate is provided. The carrier substrate is preferably a carrier film stretched on a carrier film frame. The carrier substrate preferably has an adhesive layer. The carrier substrate can be fixed to a substrate holder, particularly by means of a fixing device.

[0109] In the second method step, the support element is positioned relative to the carrier substrate, at least roughly oriented if necessary. If a carrier film or carrier substrate frame is required, the support element can be positioned and oriented as centrally as possible relative to the carrier film frame.

[0110] In the third method step, the support element is connected to the carrier substrate. The support element and the carrier substrate are close to each other. Preferably, the carrier substrate, especially when the carrier substrate is a carrier film, is fixed to a substrate holder, while the support element is preferably placed on the carrier substrate from above.

[0111] In another alternative method step, the support element is back-thinned. Back-thinning allows for precise setting of the support element's bending capability. However, unlike prior art, the support element is already located on the carrier substrate and is therefore mechanically stabilized by the carrier substrate, thus allowing for thinning to a relatively small thickness.

[0112] In another optional method step, the surface of the support element is polished to set the surface characteristics for depositing the impression material that produces the soft stamp.

[0113] In another alternative method step, the surface of the support element is treated with plasma.

[0114] In another alternative method step, the surface of the support element is made hydrophilic or hydrophobic.

[0115] In another alternative method step, a layer can be deposited on the surface of the support element using known deposition methods. The layer can serve many functions, too numerous to list. Some of the objectives are: to establish improved adhesion between the support element and the soft stamp; to serve as a release layer so that the soft stamp can be more easily removed from the support element after wear; and to serve as a heating layer, which is heated by an alternating electromagnetic field, thereby heating the soft stamp and thus the embossing material.

[0116] In another optional, but particularly preferred, method step, orientation marks may be placed on the support element. These orientation marks are used in subsequent method steps to orient the profile element. If the orientation marks are to be formed on the surface facing the carrier substrate, then the fabrication of the orientation marks must have already taken place between the first and second method steps.

[0117] In another step, an imprint material is deposited onto a support element. Deposition is preferably performed by droplet dispense. However, other methods are also conceivable.

[0118] In another method step, the profile element is molded on the support element by means of a master stamp (which is preferably a hard stamp).

[0119] In another step, the profile elements on the support element are cured before the master stamp is removed again. Curing is preferably performed electromagnetically. Thermal or chemical curing is also possible, but more complex and costly. Attached Figure Description

[0120] Other advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the accompanying drawings. The drawings show:

[0121] Figure 1 A device for providing seal elements is shown;

[0122] Figure 2 A storage device according to an exemplary embodiment of the present invention is shown;

[0123] Figure 3 A stamping apparatus, particularly an embossing apparatus, is shown according to an exemplary embodiment of the present invention; and

[0124] Figure 4 An apparatus for providing alternatives to a stamp element is shown according to an exemplary embodiment of the present invention.

[0125] In the accompanying drawings, identical components or components with the same function are denoted by the same reference numerals. The drawings are not to scale. In particular, the thickness relationships of the components are incorrect. The thicknesses are generally shown in greater detail to improve clarity and expressiveness. Detailed Implementation

[0126] Figure 1 An apparatus according to an exemplary embodiment of the present invention is shown, wherein the apparatus includes a carrier substrate 2 and a stamp element or hybrid stamp, namely a support element 3 and a soft stamp as a profile element 4. In the present case, the carrier substrate 2 includes a thin film 2f, an adhesive layer 2k, and a frame 2r on which the thin film 2f is tensioned. The carrier substrate 2 of this type has the advantages of standardization and ease of transport. The profile element 4 has a soft stamp imprinting structure 4p. The support element surface 3s can be treated in various ways and methods before the soft stamp is deposited. In particular, it is feasible and preferred to generate orientation marks 11 at the support element 3, especially at the support element surface 3s.

[0127] The use of a thin film 2f stretched on a frame 2r enables efficient storage and transport of the stamp element 1. The frame 2r is preferably standardized and therefore suitable for corresponding storage devices, particularly transport boxes. In this manner, the frame can be easily secured by a robot and transported over short distances, as well as clamped into devices. This eliminates the need to manipulate the profile element 4 with or without the support element 3; instead, manipulation is performed via a standardized carrier substrate 2, while the functionality of the stamp element 1 lies in the profile element 4 and / or the support element 3. This achieves a separation between functionality and transportability.

[0128] Figure 2The storage device 5 is shown, particularly as a transport box 5 (without a lid), in which multiple stamp elements 1 can be stored. The transport box 5 can be transported between different modules or even between different countries.

[0129] Figure 3 A schematic diagram of the imprinting apparatus 6 is shown, indicating that the product substrate 8 is fixed to the substrate holder via a fixing element 7 and a substrate holder 9. The carrier substrate 2, and thus the stamp element 1, is fixed by the fixing element 7. Imprint material 10 has been deposited on the product substrate 8. It can be seen that a force F is applied to the stamp element 1 from the back side. The force F can be applied by a deformable element, such as a pin. It is also conceivable that overpressure or negative pressure may be generated behind the carrier substrate. The carrier substrate should preferably be able to withstand a pressure difference of at least one bar with atmospheric pressure without damage. This is the possibility of pressing a soft stamp or profile element 4 into the imprint material 10. It is also conceivable that the soft stamp and the product substrate 8 are oriented towards each other, or a combination of these two processes. Advantageously, the stamp element 1 can be fixed as a whole on the carrier substrate 2 in the imprinting apparatus 6 in a simple manner and method. It is conceivable that a robot (not shown) moves from the transport box 5 (see...) Figure 2 The stamp element 1 is removed from the machine and directly loaded into the imprinting device 6. The robot can then be used directly there.

[0130] Figure 4 An apparatus according to another exemplary embodiment of the present invention is shown, the apparatus being... Figure 1 The difference in the first embodiment is that the support element 3 and the profile element 4 are located on opposite sides of the carrier substrate 2. The support element 3 may still be used to mechanically stabilize the profile element 4 or to form a support for the profile element 4. Advantageously, in this embodiment, a fixing is provided between the carrier substrate 2 and the support element 3 to prevent the support element 3 from separating from the carrier substrate 2. In addition, the support element 3 has an orientation mark 11 for orienting the profile element 4.

[0131] List of reference numerals

[0132] 1,1' Seal Component

[0133] 2. Support substrate

[0134] 2f thin film

[0135] 2k adhesive layer

[0136] 2r framework

[0137] 3 Supporting elements

[0138] Type 4 profile element

[0139] 4p soft stamp embossing structure

[0140] 5 shipping boxes

[0141] 6 Imprinting Equipment

[0142] 7 Fixing Components

[0143] 8 Product Substrates

[0144] 9 Substrate holding device

[0145] 10 Imprinting Material

[0146] 11 Orientation Markers

Claims

1. An apparatus for providing a stamp element (1), said stamp element being required to leave a structured portion in an impression material (10) during its use, said stamp element comprising: - A profile element (4), which acts on the impression material (10) when the stamp element (1) is used, wherein the profile element (4) is preferably constructed in the form of a soft stamp, and - Supporting element (3), which supports the profile element (4) and, in particular, serves as a support when using the stamp element (3). The profile element (4) and the support element (3) are disposed on and / or on the carrier substrate (2) for transport purposes.

2. The apparatus according to claim 1, The carrier substrate (2) is at least partially configured as a thin film (2f).

3. The apparatus according to claim 2, The carrier substrate (2) is at least partially fixed in the frame (2r).

4. The apparatus according to claim 2 or 3, It includes a tensioning device for setting the film tension.

5. The apparatus according to any one of claims 2 to 4, The thin film (2f) is configured as a continuous strip.

6. The apparatus according to any one of the preceding claims, The carrier substrate (2) is designed to prevent lateral displacement of the stamp element (1), wherein the carrier substrate (2), especially the film (2f), preferably has a coating, such as an adhesive layer (2k), a stop, and / or a fixing device, such as a clamping device, and / or a locally deep-drawn design to prevent the lateral displacement.

7. The apparatus according to any one of the preceding claims, The carrier substrate (2) has a thickness between 10µm and 500µm, preferably between 50µm and 400µm, more preferably between 100µm and 350µm, most preferably between 150µm and 300µm, or even between 180µm and 250µm.

8. The apparatus according to any one of the preceding claims, The device, particularly the support element (3), the carrier substrate (2) and / or the profile element (4), has at least one orientation mark (11).

9. The apparatus according to any one of the preceding claims, The thickness of the support element (3) is between 10 nm and 525 µm, preferably between 100 nm and 525 µm, more preferably between 500 nm and 525 µm, most preferably between 1 µm and 525 µm, and most preferably between 10 µm and 525 µm.

10. A stamp element (1) for use in the apparatus according to any one of the preceding claims. The stamp element (1) includes a profile element (4) and a support element (3), and the stamp element (1) is shape-unstable.

11. The stamp element (1) according to claim 10. The support element (3) has at least one orientation mark (11).

12. A storage device for storing a plurality of devices according to any one of the preceding claims, The storage device is preferably designed to be mobile, for example, as a transport box (5).

13. A facility, particularly stamping equipment, such as embossing equipment (6), said facility having the means according to any one of claims 1 to 9 or the stamp element according to claim 10.

14. A method for operating a stamp element (1), The stamp element (1) has a profile element (4) and a support element (3), wherein the stamp element (1) is carried in the device according to any one of claims 1 to 9 by a carrier substrate (2) preferably at least partially configured as a thin film (2f).

15. A method for manufacturing an apparatus according to any one of claims 1 to 10, the method preferably comprising: - Provide a carrier substrate (2). - Attach the support element (3) to the carrier substrate (2), and - Attach the profile element (4) to the support element (3) and / or the carrier substrate (2).

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