Laminated bodies and methods for manufacturing laminated bodies

Abstract

This invention provides a method for manufacturing a laminate that combines debris suppression during the transfer of semiconductor chips and other items with excellent positional accuracy. This method enables the production of high-quality display devices or semiconductor devices. The invention comprises: a step of preparing a laminate a1x having a first substrate and a light-absorbing layer sequentially; a step of temporarily fixing an item to the light-absorbing layer; a step of patterning the light-absorbing layer; a step of preparing a laminate a2 having a second substrate and a second adhesive layer sequentially; and a step of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer while a gap is provided between the item included in the first substrate and the second adhesive layer included in the second substrate, thereby transferring the item from the light-absorbing layer to the second adhesive layer. In this method, the laminate includes multiple items in contact with the light-absorbing layer, and a recess is formed in the light-absorbing layer.

Description

Technical Field

[0001] This invention relates to a laminate and a method for manufacturing a laminate. More specifically, it relates to a laminate or a method for manufacturing a laminate suitable for use in transferring articles such as semiconductor chips by laser, and a method for manufacturing a display device or a semiconductor device using the laminate. Background Technology

[0002] In recent years, electronic terminal devices have been developing towards higher functionality, miniaturization, thinner profiles, and lighter weights. These electronic terminal devices include semiconductor devices, such as processors or memory. Generally, in these semiconductor manufacturing processes, semiconductor chips assembled into semiconductor devices are transferred and mounted on printed circuit boards using pick-and-place methods such as flip chip bonding. Along with the increasing performance or miniaturization of semiconductor devices, the semiconductor chips assembled into them are also becoming smaller or thinner, and the number of semiconductor chips mounted is also increasing. Therefore, there is a need for methods that can mount multiple miniaturized semiconductor chips in a short time.

[0003] In addition, technologies related to organic light-emitting diode (OLED), quantum dot (LED), or micro-LED (LED) displays are extensively researched in thin displays such as smartphones and televisions. Among these, micro-LED displays are expected to find applications in signage, augmented reality (AR), virtual reality (VR), and transparent displays due to their advantages such as high brightness, high contrast, high-speed response, low power consumption, and wide viewing angle. Since micro-LED displays consist of LEDs, which are semiconductor chips with side lengths ranging from several μm to several hundred μm, arranged as pixels, the current pick-and-place method results in a significant reduction in productivity. Therefore, to reduce process time, a method capable of mounting multiple LEDs in a short time is needed.

[0004] As a method for high-speed mounting of semiconductor chips, one example is the use of laser transfer technology. This technology involves placing the semiconductor chip on a support substrate via an adhesive layer, then irradiating it with a laser from the support substrate side. This erodes the adhesive layer, thereby transferring the semiconductor chip to another substrate (e.g., Patent Documents 1 and 2). Transfer refers to the transfer of a semiconductor chip from one substrate to another. Erosion refers to the phenomenon where, by irradiating a solid or liquid surface with light such as a laser, the surface of the object instantly melts and evaporates due to light absorption, thermalization of the light energy, and plasma generation, releasing ions, electrons, free radicals, molecules, clusters, and solid flakes, thereby explosively releasing the constituent substances of the solid or liquid surface.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: International Publication No. 2022 / 201767

[0008] Patent Document 2: Japanese Patent Application Publication No. 2020-188037 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] However, the method described in Patent Document 1 generates residue from the adhesive layer on the surface of the transferred semiconductor chip when the adhesive layer is etched by laser irradiation. Furthermore, there is the problem of residue adhering to the substrate surface at the transfer destination due to the scattering of the adhesive layer during irradiation. Moreover, there is the problem of reduced positional accuracy during semiconductor chip transfer due to laser irradiation position deviation or misalignment. Additionally, the residue of the adhesive layer on the semiconductor chip surface or the residue on the substrate surface at the transfer destination is referred to as debris. The method described in Patent Document 2 uses a thin film of adhesive layer with a thickness of 0.1 μm to 0.5 μm, and the adhesive layer is patterned by etching. Therefore, it is effective in suppressing debris during semiconductor chip transfer, but it has the problem of reduced positional accuracy during semiconductor chip transfer.

[0011] Therefore, the methods described in Patent Documents 1 and 2 do not simultaneously achieve both debris suppression and positional accuracy during transfer, and further improvements in these characteristics are desired. The object of this invention is to achieve both debris suppression and excellent positional accuracy during the transfer of semiconductor chips and other articles, and to obtain display devices or semiconductor devices with high precision.

[0012] Technical means to solve the problem

[0013] To solve the aforementioned problems, the present invention provides a method for manufacturing a laminate and a laminate as follows [1] to

[20] .

[0014] [1] A method for manufacturing a laminate, comprising: (10) a step of preparing a laminate a1x having a first substrate and a light-absorbing layer in sequence;

[0015] (12) The process of temporarily fixing the item to the light-absorbing layer (hereinafter referred to as process (12)).

[0016] (13) The process of patterning the light absorption layer (hereinafter referred to as process (13));

[0017] (20) A process for preparing a laminate a2 having a second substrate and a second adhesive layer in sequence; and

[0018] (22) In the process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer and transferring the article from the light-absorbing layer to the second adhesive layer with a gap provided between the article included in the first substrate and the second adhesive layer included in the second substrate (hereinafter referred to as process (22)), in the method of manufacturing the laminate, in process (12), there are a plurality of articles in contact with the light-absorbing layer, and in process (13), a recess is formed in the light-absorbing layer.

[0019] [2] According to the manufacturing method of the laminate described in [1], in step (13), the compressive elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 Pa and / or in the process of (13), the glass transition temperature of the light absorption layer is -50°C to 150°C.

[0020] [3] The method for manufacturing the laminate according to [1] or [2] further includes a step of (01) forming an article on an applicant substrate, wherein the step (12) includes a step of (12a) irradiating the article with active chemical rays from the applicant substrate side of the article while the article included in the applicant substrate is in contact with the light-absorbing layer included in the first substrate and transferring the article from the applicant substrate to the light-absorbing layer (hereinafter referred to as step (12a)). In step (12a), the article is used as a mask to irradiate the light-absorbing layer with active chemical rays, and at least a portion of the light-absorbing layer irradiated with active chemical rays is removed.

[0021] [4] The method for manufacturing a laminate according to any one of [1] to [3], wherein, in the (13) step, the light-absorbing layer exists as a plurality of light-absorbing layers of protrusions and a light-absorbing layer of recesses in a state of contact with the first substrate, and the thickness of the light-absorbing layer of the recesses is less than the thickness of the light-absorbing layer of the plurality of protrusions, and the plurality of articles are respectively independently contacted with at least one of the light-absorbing layers of the plurality of protrusions.

[0022] [5] A method for manufacturing a laminate according to any one of [1] to [3], wherein, in step (13), the light-absorbing layer exists as a plurality of island-shaped light-absorbing layers in a state of contact with the first substrate, and the plurality of articles are each independently contacted with at least one of the plurality of island-shaped light-absorbing layers.

[0023] [6] A method for manufacturing a laminate according to any one of [1] to [5], wherein, in the (13) step, any one of the following conditions (a) to (c) is satisfied.

[0024] (a) The light-absorbing layer is a layer containing a positive photosensitive composition, and (13) the process includes (13a) a process of patterning the light-absorbing layer by photolithography (hereinafter referred to as (13a) process).

[0025] (b) The light-absorbing layer is a layer containing a positive or negative photosensitive composition, and process (13) includes process (13b) of patterning the light-absorbing layer by etching (hereinafter referred to as process (13b)).

[0026] (c) The light-absorbing layer is a layer containing a non-photosensitive composition, and (13) the process includes (13b) a process of patterning the light-absorbing layer by etching, thereby the compressive elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 The glass transition temperature of Pa and / or the light absorption layer is -50℃ to 150℃.

[0027] [7] The method for manufacturing a laminate according to [6] wherein, in step (13), the condition of (a) is satisfied, and step (13a) includes (13a-1) irradiating the light-absorbing layer with active chemical rays using an article as a mask from the article side of the light-absorbing layer, and (13a-2) patterning the light-absorbing layer by developing it with a developer.

[0028] [8] According to the method of manufacturing the laminate described in [6], wherein, in the step (13), the condition of (c) is satisfied, the step (13b) includes a step of (13b-1a) performing dry etching on the light-absorbing layer using the article as a mask from the article side of the light-absorbing layer to pattern the light-absorbing layer, or a step of (13b-1b) performing wet etching on the light-absorbing layer using the article as a mask from the article side of the light-absorbing layer to pattern the light-absorbing layer.

[0029] [9] The method for manufacturing a laminate according to any one of [1] to [8], wherein, before or after the (13) step, there is a step (14) of crosslinking the pattern of the light-absorbing layer (hereinafter referred to as the (14) step), the (14) step comprising (14a) heating the pattern of the light-absorbing layer to crosslink it, or (14b-1) irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer.

[0030]

[10] A method for manufacturing a laminate, comprising: (10) a step of preparing a laminate a1x having a first substrate and a light-absorbing layer in sequence;

[0031] (12z) The process of temporarily fixing an item to the light-absorbing layer and etching the light-absorbing layer (hereinafter referred to as the (12z) process).

[0032] (20) A process for preparing a laminate a2 having a second substrate and a second adhesive layer in sequence; and

[0033] (22) In the process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer and transferring the article from the light-absorbing layer to the second adhesive layer with a gap provided between the article included in the first substrate and the second adhesive layer included in the second substrate (hereinafter referred to as the (22) process), in the method of manufacturing the laminate, in the (12z) process, there are a plurality of articles in contact with the light-absorbing layer, and in the (12z) process, a recess is formed in the light-absorbing layer.

[0034]

[11] A laminate comprising a first substrate, a light-absorbing layer, and articles in sequence, wherein the laminate has a plurality of articles in contact with the light-absorbing layer, and the light-absorbing layer has a recess, and the compressive elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 The glass transition temperature of Pa and / or the light-absorbing layer is -50℃ to 150℃.

[0035]

[12] According to the laminate described in

[11] , the light-absorbing layer exists as a plurality of light-absorbing layers of protrusions and a light-absorbing layer of recesses when in contact with the first substrate, and the thickness of the light-absorbing layer of the recesses is less than the thickness of the light-absorbing layers of the plurality of protrusions, and the plurality of articles are respectively independently contacted with at least one of the light-absorbing layers of the plurality of protrusions.

[0036]

[13] According to the laminate described in

[11] , the light-absorbing layer exists as a plurality of island-shaped light-absorbing layers in a state of contact with the first substrate, and the plurality of articles are each independently contacted with at least one of the plurality of island-shaped light-absorbing layers.

[0037]

[14] The laminate according to any one of

[11] to

[13] , wherein the thickness of the light-absorbing layer is less than 5.0 μm.

[0038]

[15] The laminate according to any one of

[11] to

[14] , wherein the light-absorbing layer is a layer comprising a positive photosensitive composition.

[0039]

[16] The laminate according to any one of

[11] to

[15] , wherein the area of ​​the first a surface of the light-absorbing layer as the first substrate side is set to (S 1a The area of ​​the second surface of the light-absorbing layer facing the first surface is set as (S). 2a When ), the relationship of equation (S-1) is satisfied.

[0040] (S) 1a )≥(S 2a (S-1).

[0041]

[17] According to the laminate described in

[16] , wherein the area (S) of the first a surface is... 1a ) and the area (S) of the second surface 2a The ratio of ) is set as (S) 1a ) / (S 2a When (S) 1a ) / (S 2a The value is above 1.10 and below 3.00.

[0042]

[18] The laminate according to any one of

[11] to

[17] , wherein the maximum absorbance of the light-absorbing layer per 1.0 μm of thickness at wavelengths of 180 nm to 550 nm is 0.3 to 10.0.

[0043]

[19] The laminate according to any one of

[11] to

[18] , wherein the light-absorbing layer contains an (XDa) ultraviolet absorber, the (XDa) ultraviolet absorber being contained in a resin having a triazine structure and / or a benzotriazole structure in the structural unit of the resin.

[0044]

[20] A laminate according to any one of

[11] to

[19] , wherein the light-absorbing layer satisfies any one of the following conditions (α) to (γ).

[0045] (α) The light-absorbing layer is a layer formed of a positive photosensitive composition, and the positive photosensitive composition satisfies at least one of the following conditions (1), (3) and (4).

[0046] (β) The light-absorbing layer is a layer formed of a negative photosensitive composition, and the negative photosensitive composition satisfies at least one of the following conditions (2) to (4).

[0047] (γ) The light-absorbing layer is a layer formed of a non-photosensitive composition, and the non-photosensitive composition satisfies the following condition (5) and / or the following condition (6).

[0048] (1) Contains (C1) naphthoquinone diazide compound and (F) crosslinking agent

[0049] (2) Compounds containing (C2) photopolymerization initiator and (B) free radical polymerizable compounds

[0050] (3) Contains (C3) photoacid generator and (F) crosslinking agent

[0051] (4) Contains (C4) light alkali generating agent and (F) crosslinking agent

[0052] (5) Contains (F) crosslinking agent

[0053] (6) Compounds containing (B) free radical polymerizable compounds.

[0054] The effects of the invention

[0055] The laminate of the present invention combines debris suppression during the transfer of semiconductor chips and other materials with excellent positional accuracy, enabling the production of display devices or semiconductor devices with high precision. Furthermore, the manufacturing method of the laminate of the present invention combines debris suppression during the transfer of semiconductor chips and other materials with excellent positional accuracy, enabling the production of display devices or semiconductor devices with high precision. Attached Figure Description

[0056] [ Figure 1 [This is a process diagram illustrating a manufacturing process of a micro LED display using a method for manufacturing a laminate as part of the third and fourth embodiments of the present invention.]

[0057] [ Figure 2 [This is a process diagram illustrating a manufacturing process of a micro LED display that uses a method for manufacturing a laminate as part of the fifth and sixth embodiments of the present invention.]

[0058] [ Figure 3 [This is a process diagram illustrating a manufacturing process of a micro LED display using a method for manufacturing a laminate as part of the seventh and eighth embodiments of the present invention.] Detailed Implementation

[0059] Regarding the manufacturing method of the laminate of the present invention, the manufacturing process of the laminate with semiconductor micro light-emitting diodes (LEDs) transferred on it will be described as an embodiment. Figures 1-3 This is a process diagram showing a part of the manufacturing process of a micro LED display using a laminate manufacturing method. In the diagram, (1) is in other words (process 1). Figure 1 and Figure 2 (6) or Figure 3 The laminate shown in (4) or (5) is a laminate that includes at least an article and has a recess in the light-absorbing layer, and the article is transferred to another laminate. In one embodiment of the present invention, a light-absorbing layer and an article are sequentially included in a first substrate. This is defined as a laminate of the first type. In another embodiment of the present invention, a light-absorbing layer, a first adhesive layer, and an article are sequentially included in a first substrate. This is defined as a laminate of the second type. Hereinafter, representative manufacturing methods, including the presence or absence of the first adhesive layer included in the first substrate, the method of supplying the article, and the method of pattern processing the light-absorbing layer, will be described as manufacturing methods of laminates of the third to eighth types. However, the present invention is not limited to the following embodiments, and various modifications can be made within the scope of achieving the inventive objective without departing from the spirit of the invention.

[0060] In this specification, the term "silicone structure" refers to a structure with a Si-O-Si bond as the main framework and two organic groups on the silicon atom. That is, in a silicone structure, the silicon atom is bonded to two organic groups and two oxygen atoms. Conversely, the term "siloxane structure" refers to a structure with a Si-O-Si bond as the main framework and one organic group on the silicon atom. That is, in a siloxane structure, the silicon atom is bonded to one organic group and three oxygen atoms.

[0061] The laminated bodies that are the first and second embodiments of the present invention will be described. Furthermore, when a laminated body is described as being the present invention, the description relates to the laminated bodies that are the first and second embodiments of the present invention. On the other hand, when a laminated body of a specific embodiment is described, it is described as being the laminated body that is the first embodiment of the present invention, etc.

[0062] <Laminated Body (Laminated Body 1X)>

[0063] The laminate as a first aspect of the present invention has the structure described in

[11] . A first substrate 1 has a light-absorbing layer 2 and an article 4, the light-absorbing layer 2 having a recess. By providing this structure, the manufacturing method of the laminate including the laminate as a first aspect of the present invention can achieve both debris suppression and excellent positional accuracy during the transfer of articles such as semiconductor chips, and can produce display devices or semiconductor devices with high precision. This means that because the light-absorbing layer has a recess, the volume of the light-absorbing layer is reduced compared to the case without a recess. As a result, when transferring an article from the light-absorbing layer, the volume of the light-absorbing layer that is etched is reduced, thus reducing the scattering of the light-absorbing layer and presumably achieving a debris suppression effect. Furthermore, since the etch characteristics of the recess in the light-absorbing layer are reduced, and the opening of the light-absorbing layer is not etched, the laser irradiation position shift or irradiation position deviation is offset, presumably achieving an excellent positional accuracy effect. For example, by patterning the portion of the article that is not in contact with the light-absorbing layer as a recess or as an opening, the volume of the light-absorbing layer can be reduced. In terms of achieving the effect of debris suppression or excellent positional accuracy based on the aforementioned speculation mechanism, it is more suitable to provide a light-absorbing layer with a recess formed by such pattern processing, or a light-absorbing layer with an opening formed by pattern processing.

[0064] Furthermore, it is believed that because the indentation elastic modulus of the light-absorbing layer is within a specific range and / or the glass transition temperature of the light-absorbing layer is within a specific range, the force by which the light-absorbing layer holds the article can be appropriately maintained, thereby suppressing excessive adhesion between the light-absorbing layer and the article. As a result, when transferring the article from the light-absorbing layer, the transfer can be performed with less energy, thus suppressing the residue of the light-absorbing layer on the article surface or the scattering of the light-absorbing layer during erosion, presumably achieving a debris suppression effect. Moreover, since the transfer can be performed with less energy, the absolute value of the irradiation energy deviation is also reduced while maintaining stable behavior of the article during transfer, presumably achieving an excellent positional accuracy effect.

[0065] <Laminated Body (Laminated Body 1Y)>

[0066] The second embodiment of the present invention is a laminate comprising, in sequence, a first substrate, a light-absorbing layer, a first adhesive layer, and articles. The laminate includes a plurality of articles in contact with the first adhesive layer, and both the light-absorbing layer and the first adhesive layer have recesses. The compressive modulus of the first adhesive layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 Pa and / or the glass transition temperature of the first adhesive layer is -50℃ to 150℃.

[0067] By adopting the aforementioned structure, the laminate, as a second embodiment of the present invention, can combine debris suppression during the transfer of semiconductor chips and other articles with excellent positional accuracy, enabling the production of display devices or semiconductor devices with high precision. This means that because the light-absorbing layer and the first adhesive layer have recesses, the volume of the light-absorbing layer and the volume of the first adhesive layer are reduced compared to the case without recesses. As a result, based on the same reasons as for the laminate as the first embodiment of the present invention, it is presumed that both debris suppression and excellent positional accuracy are achieved. Furthermore, it is believed that because the compressive modulus of the first adhesive layer is within a specific range and / or the glass transition temperature of the first adhesive layer is within a specific range, the force by which the first adhesive layer holds the article can be appropriately maintained, thereby suppressing excessive adhesion between the first adhesive layer and the article. As a result, based on the same reasons as for the laminate as the first embodiment of the present invention, it is presumed that both debris suppression and excellent positional accuracy are achieved.

[0068] Furthermore, it is believed that the stacked bodies 1X and 1Y improve the light-emitting characteristics of semiconductor chips and the like by exerting a debris suppression effect or an excellent positional accuracy effect. That is, from the improved light extraction efficiency of semiconductor chips and the like, it is speculated that they exert an excellent light-emitting brightness effect.

[0069] <Structure of Layered Bodies>

[0070] The laminate according to a first embodiment of the present invention sequentially comprises a first substrate, a light-absorbing layer, and an article. The laminate according to the first embodiment of the present invention has a plurality of articles in contact with the light-absorbing layer, and the light-absorbing layer has recesses. Preferably, the light-absorbing layer has a plurality of recesses. Preferably, the light-absorbing layer satisfies any one of the following conditions (p) and (q).

[0071] (p) The light-absorbing layer has a recess, where at least a portion of the light-absorbing layer is removed, resulting in a reduced thickness.

[0072] (q) The light-absorbing layer has a concave portion, which is an opening portion.

[0073] In the laminated body according to the first aspect of the present invention, from the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the light-absorbing layer preferably exists as a light-absorbing layer of multiple protrusions in a state of contact with the first substrate. The laminated body according to the first aspect of the present invention preferably has multiple articles each independently contacted with at least one of the multiple protrusions' light-absorbing layers. The laminated body according to the first aspect of the present invention is more preferably one in which the multiple protrusions' light-absorbing layers each independently contact at least one of the multiple articles.

[0074] In the laminated body according to the first aspect of the present invention, from the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the light-absorbing layer preferably exists as a plurality of island-shaped absorption layers in a state of contact with the first substrate. The laminated body according to the first aspect of the present invention is preferably in which multiple articles are each independently contacted with at least one of the plurality of island-shaped light-absorbing layers. The laminated body according to the first aspect of the present invention is more preferably in which multiple island-shaped light-absorbing layers are each independently contacted with at least one of the plurality of articles.

[0075] Furthermore, in this invention, a laminate having a first substrate, a light-absorbing layer, and an article in sequence is sometimes referred to as laminate 1X. Additionally, a laminate having a first substrate and a light-absorbing layer in sequence is sometimes referred to as laminate a1x.

[0076] The laminate, as a second embodiment of the present invention, sequentially comprises a first substrate, a light-absorbing layer, a first adhesive layer, and an article. The laminate, as a second embodiment of the present invention, has multiple articles in contact with the first adhesive layer, and both the light-absorbing layer and the first adhesive layer have recesses. Preferably, the light-absorbing layer and the first adhesive layer have multiple recesses. Preferably, the light-absorbing layer and the first adhesive layer satisfy any one of the following conditions (py) and (qy).

[0077] (py) The light-absorbing layer and the first adhesive layer have a recess, which is an opening of the first adhesive layer, and at least a portion of the light-absorbing layer is removed at the recess, resulting in a reduced thickness.

[0078] (qy) The light-absorbing layer and the first adhesive layer have a recess, which is an opening.

[0079] In the laminated body according to the second aspect of the present invention, from the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the light-absorbing layer preferably exists as a light-absorbing layer for both the protruding and recessed portions when in contact with the first substrate, and the thickness of the light-absorbing layer for the recessed portions is less than the thickness of the light-absorbing layer for the protruding portions. In the laminated body according to the second aspect of the present invention, from the viewpoint of the same inventive effects, the first adhesive layer preferably exists as a first adhesive layer for the protruding portions when in contact with at least one of the light-absorbing layers for the protruding portions. Furthermore, the first adhesive layer is also preferably existing as a first adhesive layer for the recessed portions when in contact with at least one of the light-absorbing layers for the recessed portions. The laminated body according to the second aspect of the present invention preferably has multiple articles each independently contacted with at least one of the first adhesive layers for the protruding portions. The laminate as a second aspect of the present invention preferably has a light-absorbing layer that exists as a light-absorbing layer of a plurality of protrusions when in contact with a first substrate, and a first adhesive layer that exists as a first adhesive layer of a plurality of protrusions when in contact with at least one of the light-absorbing layers of the plurality of protrusions, thereby having a plurality of articles each independently contacting at least one of the first adhesive layers of the plurality of protrusions (hereinafter referred to as specific structure 1 of the laminate). More preferably, the laminate as a second aspect of the present invention has a first adhesive layer of a plurality of protrusions that is independently contacted with at least one of a plurality of articles. More preferably, the laminate as a second aspect of the present invention has a light-absorbing layer of a plurality of protrusions that is independently contacted with at least one of the first adhesive layers of the plurality of protrusions.

[0080] In the laminated body according to the second aspect of the present invention, from the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the light-absorbing layer preferably exists as a plurality of island-shaped absorption layers in a state of contact with the first substrate. In the laminated body according to the second aspect of the present invention, from the viewpoint of the same inventive effects, the first adhesive layer preferably exists as a plurality of island-shaped first adhesive layers in a state of contact with at least one of the plurality of island-shaped light-absorbing layers. The laminated body according to the second aspect of the present invention preferably has multiple articles each independently contacted with at least one of the plurality of island-shaped first adhesive layers. The laminated body according to the second aspect of the present invention preferably has the light-absorbing layer existing as a plurality of island-shaped light-absorbing layers in a state of contact with the first substrate, and the first adhesive layer existing as a plurality of island-shaped first adhesive layers in a state of contact with at least one of the plurality of island-shaped light-absorbing layers, and then multiple articles each independently contacting at least one of the plurality of island-shaped first adhesive layers (hereinafter referred to as specific structure 2 of the laminated body). The laminated body according to the second aspect of the present invention is more preferably one in which multiple island-shaped first adhesive layers are each independently contacted with at least one of multiple articles. As a second aspect of the present invention, the laminated body is more preferably composed of multiple island-shaped light-absorbing layers, each independently connected to at least one of multiple island-shaped first adhesive layers.

[0081] Furthermore, in this invention, a laminate having a first substrate, a light-absorbing layer, a first adhesive layer, and an article in sequence is sometimes referred to as laminate 1Y. Additionally, a laminate having a first substrate, a light-absorbing layer, and a first adhesive layer in sequence is sometimes referred to as laminate a1y.

[0082] <First substrate>

[0083] The laminate of the present invention includes a first substrate. From the viewpoint of reducing laser irradiation energy and improving positional accuracy, the first substrate is preferably a light-transmitting substrate. A light-transmitting substrate is defined as a substrate with a maximum transmittance of 60% or more in the wavelength range of 180 nm to 1100 nm. The maximum transmittance of the light-transmitting substrate in the wavelength range of 180 nm to 1100 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. From the viewpoint of reducing laser irradiation energy and improving positional accuracy, the light-transmitting substrate is preferably in the range of maximum transmittance in the wavelength range of 180 nm to 550 nm, more preferably in the range of maximum transmittance in the wavelength ranges of 193 nm, 248 nm, 266 nm, 308 nm, 351 nm, 355 nm, or 532 nm. When the first substrate is a multilayer structure, it refers to a substrate with a maximum transmittance of 60% or more in the wavelength range of 180 nm to 1100 nm when it is a multilayer structure. The transmittance at wavelengths of 180 nm to 1100 nm can also be adjusted by adjusting the thickness of the first substrate.

[0084] From the viewpoint of improving impact resistance, the light-transmitting substrate is preferably an inorganic substrate. The inorganic substrate used as the light-transmitting substrate is preferably made of silicon dioxide or aluminum oxide, more preferably of alkali glass substrate, alkali-free glass substrate, borosilicate glass substrate, quartz glass substrate, crystal substrate, or sapphire substrate. The thickness of the inorganic substrate can be selected within a range that does not impair the transmittance; from the viewpoint of improving operability, it is preferably 0.10 mm or more, more preferably 0.30 mm or more. On the other hand, from the viewpoint of ease of acquisition, the thickness is preferably 5.0 mm or less, more preferably 3.0 mm or less.

[0085] From the viewpoint of improving flexibility and operability, the light-transmitting substrate is preferably an organic substrate. The organic substrate used as the light-transmitting substrate is preferably a polyethylene terephthalate substrate, an aromatic polyamide substrate, a polyester substrate, a polypropylene substrate, a cyclic olefin polymer substrate, a polycarbonate substrate, a cellulose triacetate substrate, or a polyimide substrate. The thickness of the organic substrate can be selected within a range that does not impair the transmittance; from the viewpoint of improving operability, it is preferably 0.050 mm or more, more preferably 0.10 mm or more. On the other hand, from the viewpoint of suppressing light scattering during laser irradiation, the thickness is preferably 3.0 mm or less, more preferably 1.0 mm or less.

[0086] Furthermore, more preferably, in the process described later (22) where a gap is provided between the article included on the first substrate and the second adhesive layer included on the second substrate, active chemical rays are irradiated onto the light-absorbing layer from the first substrate side of the light-absorbing layer, and the article is transferred from the light-absorbing layer to the second adhesive layer, the maximum transmittance at the wavelength of the irradiated active chemical rays is 60% or more. Examples and preferred embodiments related to the maximum transmittance are the same as those related to the maximum transmittance at wavelengths of 180 nm to 1100 nm.

[0087] Furthermore, the first substrate is more preferably such that, in the process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer as described later (14b-1), the maximum transmittance at the wavelength of the irradiated active chemical rays is 60% or more. The examples and preferred embodiments related to the maximum transmittance are the same as the examples and preferred embodiments of the maximum transmittance at wavelengths of 180 nm to 1100 nm.

[0088] <Light absorption layer; physical properties of the light absorption layer>

[0089] The laminate according to a first aspect of the present invention has a light-absorbing layer. In the laminate according to the first aspect of the present invention, the light-absorbing layer has a recess. In the laminate according to the first aspect of the present invention, the compressive modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 The glass transition temperature of Pa and / or the light-absorbing layer is -50℃ to 150℃. The shape of the light-absorbing layer is as described above.

[0090] The laminate as a second aspect of the present invention includes a light-absorbing layer. In the laminate as a second aspect of the present invention, the light-absorbing layer has a recess. In the laminate as a second aspect of the present invention, the compressive modulus of the light-absorbing layer at 50°C is preferably 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9The glass transition temperature of Pa and / or the light absorption layer is -50℃ to 150℃.

[0091] From the perspective of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the indentation elastic modulus of the light-absorbing layer at 50°C is preferably 1.0 × 10⁻⁶. 3 Pa or higher, more preferably 1.0 × 10 Pa 4 Pa or higher, and more preferably 5.0 × 10 Pa. 4 Pa or higher, and more preferably 1.0 × 10 Pa. 5 Pa or higher, particularly preferably 5.0 × 10 Pa. 5 Pa or higher. On the other hand, from the viewpoint of achieving the same effect as the invention, the compressive modulus at 50°C is preferably 2.0 × 10⁻⁶. 9 Pa or less, more preferably 5.0 × 10 Pa. 8 Pa below, and more preferably 2.0 × 10 Pa. 8 Below Pa. Furthermore, the compressive modulus is preferably 5.0 × 10⁻⁶. 7 Pa or less, more preferably 2.0 × 10 Pa. 7 Pa or less, and more preferably 5.0 × 10 Pa. 6 Pa below, particularly preferably 2.0 × 10 Pa 6 Below Pa.

[0092] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the glass transition temperature of the light-absorbing layer is preferably -50°C or higher, more preferably -30°C or higher, and even more preferably -10°C or higher. On the other hand, from the viewpoint of achieving the same effects as the invention, the glass transition temperature is preferably 150°C or lower, more preferably 100°C or lower, even more preferably 70°C or lower, even more preferably 50°C or lower, particularly preferably 30°C or lower, and most preferably 10°C or lower.

[0093] In the laminate of the present invention, the ratio of the indented elastic modulus of the light-absorbing layer at 50°C after any of the following treatments (x1), (x2), and (x3) to the indented elastic modulus of the light-absorbing layer at 50°C before treatment (hereinafter referred to as the ratio of the indented elastic modulus of the light-absorbing layer before and after a specific treatment): (indented elastic modulus after treatment) / (indented elastic modulus before treatment) is preferably 1.0 × 10⁻⁶. 2 ~1.0×10 4 Furthermore, in the laminate of the present invention, the difference between the glass transition temperature of the light-absorbing layer after any of the following treatments (x1), (x2), and (x3) and the glass transition temperature of the light-absorbing layer before treatment (hereinafter referred to as the glass transition temperature difference of the light-absorbing layer before and after the specific treatment) is preferably 30°C to 100°C.

[0094] (x1) Heat the light-absorbing layer at 150°C for 30 minutes.

[0095] (x2) The light-absorbing layer is treated with 300 mJ / cm 2 Irradiation with active chemical rays having extremely long wavelengths in the range of 180 nm to 450 nm

[0096] (x3) The light-absorbing layer is treated with 300 mJ / cm 2 After irradiating the light-absorbing layer with active chemical rays having a maximum wavelength in the range of 180 nm to 450 nm, the light-absorbing layer is heated at 100 °C for 30 minutes.

[0097] The ratio of the indentation elastic modulus of the light-absorbing layer before and after the specific treatment is preferably at least one of the ratios of the indentation elastic modulus of the light-absorbing layer before and after any of the (x1), (x2), and (x3) treatments being 1.0 × 10⁻⁶. 2 ~1.0×10 4 Furthermore, the glass transition temperature difference of the light-absorbing layer before and after the specific treatment is preferably at least one of the glass transition temperature differences of the light-absorbing layer before and after any of the treatments (x1), (x2) and (x3) is 30°C to 100°C.

[0098] From the perspective of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the ratio of the compressive elastic modulus of the light-absorbing layer before and after the specific treatment is preferably 1.0 × 10⁻⁶. 2 The above, more preferably 3.0×10 2 The above, and more preferably 5.0 × 10 2 The above, and more preferably 7.0×10 2 The above, and therefore preferably 1.0 × 10 3 That's all. On the other hand, from the viewpoint of the same invention's effect, the compressive modulus ratio is preferably 1.0 × 10⁻⁶. 4 The following is more preferably 7.0×10 3 The preferred value is 5.0 × 10⁻⁶. 3 the following.

[0099] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the glass transition temperature difference of the light-absorbing layer before and after the specific treatment is preferably 30°C or more, more preferably 40°C or more, and even more preferably 50°C or more. On the other hand, from the viewpoint of achieving the same effect as the invention, the glass transition temperature difference is preferably 100°C or less, more preferably 90°C or less, and even more preferably 80°C or less.

[0100] The indentation modulus of the light-absorbing layer at 50°C, the glass transition temperature of the light-absorbing layer, the ratio of the indentation modulus of the light-absorbing layer before and after a specific treatment, and the difference in glass transition temperature of the light-absorbing layer before and after a specific treatment can be adjusted to the ranges by using a suitable (XA) binder resin in the light-absorbing layer, as described later. In particular, in terms of adjusting these physical properties of the light-absorbing layer to the ranges, suitable resins are those described later: (XA1x) resins having a siloxane structure and / or a silicone structure in the structural units of the resin, or (XA1x) resins having an oxoalkylene structure in the structural units of the resin; acrylic resins having units derived from (meth)acrylate derivatives containing aliphatic groups having 4 to 20 carbon atoms, i.e., (XA2) resins; and (XA2) resins having a siloxane structure and / or a silicone structure in the structural units of the resin, or (XA2) resins having an oxoalkylene structure in the structural units of the resin. In order to adjust the physical properties of these light-absorbing layers to the range described, it is also preferable that the (XA1x) resin or (XA2) resin contains other structures in the structural units of the resin, or that two or more suitable (XA) adhesive resins for light-absorbing layers described later are used.

[0101] From the viewpoint of reducing laser irradiation energy and suppressing debris, the thickness of the light-absorbing layer is preferably less than 5.0 μm, more preferably 4.0 μm or less, even more preferably 3.0 μm or less, even more preferably 2.0 μm or less, and particularly preferably 1.0 μm or less. On the other hand, from the viewpoint of improving positional accuracy, the thickness of the light-absorbing layer is preferably 0.10 μm or more, more preferably 0.30 μm or more, and even more preferably 0.50 μm or more. Furthermore, the thickness of the light-absorbing layer is equivalent to the thickness of the light-absorbing layer of the protrusion.

[0102] The thickness of the light-absorbing layer in the recess is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. Furthermore, it is also preferable that there is no light-absorbing layer at the portion corresponding to the recess.

[0103] From the viewpoint of reducing laser irradiation energy and improving positional accuracy, the maximum absorbance per 1.0 μm of thickness of the light-absorbing layer at wavelengths of 180 nm to 550 nm, and the absorbance per 1.0 μm of thickness of the light-absorbing layer at wavelengths of 193 nm, 248 nm, 266 nm, 308 nm, 351 nm, 355 nm, or 532 nm, are preferably 0.3 or more, more preferably 0.5 or more, and even more preferably 1.0 or more. Furthermore, the maximum absorbance and the absorbance are preferably 1.5 or more, more preferably 2.0 or more, even more preferably 2.5 or more, and particularly preferably 3.0 or more. On the other hand, from the viewpoint of debris suppression and improving positional accuracy, the maximum absorbance and the absorbance are preferably 10.0 or less, more preferably 8.0 or less, even more preferably 7.0 or less, and particularly preferably 6.0 or less. Furthermore, the maximum absorbance is preferably 5.0 or less, more preferably 4.5 or less, and even more preferably 4.0 or less.

[0104] The maximum absorbance per 1.0 μm of thickness in the light-absorbing layer at wavelengths from 180 nm to 550 nm can be adjusted into the range described below by using a suitable (XDa) UV absorber and / or (XDb) colorant in the light-absorbing layer. In particular, for adjusting the absorbance of the light-absorbing layer into the range described below, it is suitable to use one or more (XDa) UV absorbers, or (XDa) UV absorbers with a specific structure, selected from the group consisting of triazine, benzotriazole, benzophenone, isocyanuric acid, and at least two benzene structures. To adjust the absorbance of the light-absorbing layer into the range described below, it is also preferable to use a (XDa) UV absorber or (XDb) colorant different from the (XDa) UV absorber, or to use two or more (XDa) UV absorbers and / or (XDb) colorants in the suitable light-absorbing layer described below.

[0105] Furthermore, the light-absorbing layer is more preferably irradiated with active chemical rays from the first substrate side of the light-absorbing layer in the process of transferring the article from the light-absorbing layer to the second adhesive layer with a gap provided between the article included in the first substrate and the second adhesive layer included in the second substrate, as described later in (22), wherein the absorbance at the wavelength of the irradiated active chemical rays is within the range described above.

[0106] Furthermore, the light-absorbing layer is more preferably such that, in the process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer as described later (14b-1), the absorbance of the transmittance at the wavelength of the irradiated active chemical rays is within the range described above.

[0107] <Structure of the light absorption layer>

[0108] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the light-absorbing layer is preferably set to have an area of ​​(S) on the first a surface of the light-absorbing layer serving as the first substrate. 1a The area of ​​the second surface of the light-absorbing layer facing the first surface is set as (S). 2a When ), the relationship of equation (S-1) is satisfied.

[0109] (S) 1a )≥(S 2a (S-1)

[0110] Under the condition that the relationship of the above equation (S-1) is satisfied, the area of ​​the first a surface (S) 1a ) and the area of ​​the 2a surface (S) 2a The ratio of ) is set as (S) 1a ) / (S 2a From the perspective of debris suppression and improved positional accuracy, (S) 1a ) / (S 2a The value is preferably 1.10 or higher, more preferably 1.30 or higher, even more preferably 1.50 or higher, even more preferably 1.70 or higher, and particularly preferably 2.00 or higher. On the other hand, from the viewpoint of reducing the energy of laser irradiation, (S) 1a ) / (S 2a The value is preferably 5.00 or less, more preferably 4.50 or less, even more preferably 4.00 or less, even more preferably 3.50 or less, and particularly preferably 3.00 or less.

[0111] When the light-absorbing layer exists as a plurality of protruding light-absorbing layers or a plurality of island-shaped light-absorbing layers in a state where it is in contact with the first substrate, from the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the light-absorbing layer is more preferably satisfied with the relationship described in formula (S-1). Furthermore, when the laminate as a first aspect of the present invention has the structure described in

[12] or

[13] , the light-absorbing layer is particularly preferably satisfied with the relationship described in formula (S-1). Furthermore, when the laminate as a second aspect of the present invention has a specific structure 1 or a specific structure 2 of the laminate, the light-absorbing layer is particularly preferably satisfied with the relationship described in formula (S-1).

[0112] Furthermore, when the light-absorbing layer exists as a plurality of protruding light-absorbing layers or a plurality of island-shaped light-absorbing layers in the state of being in contact with the first substrate, and satisfies the relationship of the above formula (S-1), the cone angle of the inclined edge in the cross-section of the plurality of protruding light-absorbing layers or the plurality of island-shaped light-absorbing layers is 90° or less. From the viewpoint of debris suppression and improved positional accuracy, the cone angle of the inclined edge in the cross-section of the plurality of protruding light-absorbing layers or the plurality of island-shaped light-absorbing layers is preferably 90° or less, more preferably 85° or less, further preferably 80° or less, further more preferably 75° or less, and particularly preferably 70° or less. On the other hand, from the viewpoint of reducing laser irradiation energy, the cone angle of the inclined edge is preferably 30° or more, more preferably 45° or more, and further preferably 60° or more. In addition, the so-called cone angle of the inclined edge in the cross-section of the light-absorbing layer refers to the angle formed by the edge of the first substrate in contact with the first a surface of the light-absorbing layer and the inclined edge of the light-absorbing layer.

[0113] It is believed that by satisfying the relationship in equation (S-1) of the light-absorbing layer, the contact area between the light-absorbing layer and the object can be reduced, thereby suppressing excessive adhesion between the light-absorbing layer and the object. As a result, when transferring the object from the light-absorbing layer, the transfer can be performed with less energy, thus suppressing the residue of the light-absorbing layer on the object surface or the scattering of the light-absorbing layer during erosion, and the effect of debris suppression becomes significant. Furthermore, since the transfer can be performed with less energy, the absolute value of the deviation of the irradiation energy is also reduced while the behavior of the object during transfer remains stable, and the effect of excellent positional accuracy becomes significant.

[0114] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, multiple convex light-absorbing layers or multiple island-shaped light-absorbing layers are preferably configured such that their respective areas (hereinafter referred to as the areas of the convex or island-shaped light-absorbing layers) are set to (S). x Let the area of ​​each of the multiple adjacent items be (S). y When ), the relationship of equation (S-xy) is satisfied.

[0115] (S) x )≥(S y (S-xy)

[0116] Under the condition of satisfying the relationship of the above equation (S-xy), when the area of ​​the convex or island-shaped light-absorbing layer (S) is... x ) and the area of ​​the item (S) y The ratio of ) is set as (S) x ) / (S y From the perspective of debris suppression and improved positional accuracy, (S) x ) / (S yThe value is preferably 1.10 or higher, more preferably 1.30 or higher, even more preferably 1.50 or higher, even more preferably 1.65 or higher, and particularly preferably 1.90 or higher. On the other hand, from the viewpoint of reducing the energy of laser irradiation, (S) x ) / (S y The value is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less.

[0117] Furthermore, in the area of ​​the first a surface of the light-absorbing layer that serves as the first substrate side and the area of ​​the second a surface of the light-absorbing layer that faces the first a surface, the area of ​​the island-shaped light-absorbing layer corresponds to the area of ​​the first a surface that serves as the first substrate side.

[0118] Furthermore, the area of ​​the light-absorbing layer of the convex portion and the area of ​​the light-absorbing layer of the concave portion are determined by the following methods (a1) to (a4) to determine the concave and convex portions of the light-absorbing layer.

[0119] (a1) In a top view, identify any object that is in contact with the light absorption layer, and the objects that are adjacent to the arbitrary object (hereinafter referred to as "adjacent objects").

[0120] (a2) Measure the thickness of the light absorption layer at 10 points on each straight line connecting any object to each of its adjacent objects with the shortest distance.

[0121] (a3) For the thickness of the light absorption layer at each of the 10 measured points, find the minimum value of the thickness of each light absorption layer and calculate the average value of each minimum value.

[0122] (a4) The region where the thickness of the light absorption layer is less than the obtained average value + 0.10 μm is designated as the concave part of the light absorption layer, and the region where the thickness of the light absorption layer is greater than the obtained average value + 0.10 μm is designated as the convex part of the light absorption layer.

[0123] The plane for top-down viewing refers to the plane horizontal to the object. Furthermore, top-down viewing refers to the view of the object side within the xy-axis plane when viewed from the z-axis direction, with the plane horizontal to the object defined as the xy-axis plane and the direction orthogonal to the xy-axis plane defined as the z-axis direction. Additionally, when focusing on a specific component during top-down viewing, the view is taken through another component overlapping that specific component. When the object is not planar, the plane horizontal to the light-absorbing layer in contact with the object is defined as the xy-plane.

[0124] Furthermore, from the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the first adhesive layer of the plurality of protrusions or the first adhesive layer of the plurality of islands described later is preferably such that the area of ​​each of the protrusions (hereinafter referred to as the area of ​​the first adhesive layer of the protrusions or islands) is set to (S). p Let the area of ​​each of the multiple adjacent items be (S). q When ), the relationship of equation (S-pq) is satisfied.

[0125] (S) p )≥(S q (S-pq)

[0126] Under the condition that the relationship of the above formula (S-pq) is satisfied, the area of ​​the first adhesive layer of the protrusion or island shape (S) p ) and the area of ​​the item (S) q The ratio of ) is set as (S) p ) / (S q From the perspective of debris suppression and improved positional accuracy, (S) p ) / (S q The value is preferably 1.10 or higher, more preferably 1.30 or higher, even more preferably 1.50 or higher, even more preferably 1.65 or higher, and particularly preferably 1.90 or higher. On the other hand, from the viewpoint of reducing the energy of laser irradiation, (S) p ) / (S q The value is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less.

[0127] Furthermore, in the area of ​​the surface of the first adhesive layer that serves as the light-absorbing layer and the area of ​​the surface facing the surface, the area of ​​the island-shaped first adhesive layer corresponds to the area of ​​the surface that serves as the light-absorbing layer.

[0128] Furthermore, the area of ​​the first adhesive layer of the protrusion and the area of ​​the first adhesive layer of the concave portion are determined by the following methods (b1) to (b4) to determine the concave and convex portions of the first adhesive layer.

[0129] (b1) In a top view, identify any item that is in contact with the first adhesive layer and the items that are adjacent to the arbitrary item (hereinafter referred to as "adjacent items").

[0130] (b2) Measure the thickness of the first adhesive layer at 10 points on each straight line connecting any item to the shortest distance between adjacent items.

[0131] (b3) For the thickness of the first adhesive layer at each of the 10 points measured, find the minimum value of the thickness of the first adhesive layer at each point and calculate the average value of each minimum value.

[0132] (b4) The region where the thickness of the first adhesive layer is less than the obtained average value + 0.10 μm is designated as the concave part of the first adhesive layer, and the region where the thickness of the first adhesive layer is greater than the obtained average value + 0.10 μm is designated as the convex part of the first adhesive layer.

[0133] The plane in the top-view refers to the plane horizontal to the object. Furthermore, "top-view" refers to the view of the object side in the xy-axis plane when viewed from the z-axis direction, with the plane horizontal to the object defined as the xy-axis plane and the direction orthogonal to the xy-axis plane defined as the z-axis direction. Additionally, when focusing on a specific component in the top-view, the view is taken through another component overlapping that specific component. When the object is not planar, the plane horizontal to the first adhesive layer in contact with the object is defined as the xy-plane.

[0134] From the viewpoint of improving positional accuracy, it is also preferable that the area of ​​the first a surface of the light-absorbing layer, which serves as the first substrate side, is set to (S). 1a The area of ​​the second surface of the light-absorbing layer facing the first surface is set as (S). 2a When ), the relationship of equation (S-2) is satisfied.

[0135] (S) 1a )<(S 2a (S-2)

[0136] Given that the relationship in equation (S-2) is satisfied, from the viewpoint of improving positional accuracy, (S 2a ) / (S 1a The value is preferably 1.10 or higher, more preferably 1.30 or higher, even more preferably 1.50 or higher, even more preferably 1.70 or higher, and particularly preferably 2.00 or higher. On the other hand, from the viewpoint of improving positional accuracy, (S) 2a ) / (S 1a The value is preferably 5.00 or less, more preferably 4.50 or less, even more preferably 4.00 or less, even more preferably 3.50 or less, and particularly preferably 3.00 or less.

[0137] When the light-absorbing layer exists as a plurality of protruding light-absorbing layers or a plurality of island-shaped light-absorbing layers in a state where it is in contact with the first substrate, from the viewpoint of improving positional accuracy, the light-absorbing layer is more preferably satisfied with the relationship described in formula (S-2). Furthermore, when the laminate as a first aspect of the present invention has the structure described in

[12] or

[13] , the light-absorbing layer is more preferably satisfied with the relationship described in formula (S-2). Furthermore, when the laminate as a second aspect of the present invention has a specific structure 1 or a specific structure 2 of the laminate, the light-absorbing layer is more preferably satisfied with the relationship described in formula (S-2).

[0138] Furthermore, when the light-absorbing layer exists as a plurality of protruding light-absorbing layers or a plurality of island-shaped light-absorbing layers in the state of being in contact with the first substrate and satisfies the relationship of the above formula (S-2), the taper angle of the inclined edge in the cross-section of the plurality of protruding light-absorbing layers or the plurality of island-shaped light-absorbing layers exceeds 90°. From the viewpoint of improving positional accuracy, the taper angle of the inclined edge in the cross-section of the plurality of protruding light-absorbing layers or the plurality of island-shaped light-absorbing layers is preferably more than 90°, more preferably 95° or more, more preferably 100° or more, more preferably 105° or more, and particularly preferably 110° or more. On the other hand, from the viewpoint of improving positional accuracy, the taper angle of the inclined edge is preferably 150° or less, more preferably 135° or less, and more preferably 120° or less. In addition, the so-called taper angle of the inclined edge in the cross-section of the light-absorbing layer refers to the angle formed by the edge of the first substrate in contact with the first a surface of the light-absorbing layer and the inclined edge of the light-absorbing layer.

[0139] It is believed that by satisfying the relationship in equation (S-2) through the light-absorbing layer, the contact area between the light-absorbing layer and the first substrate can be reduced, and the reaction force of the light-absorbing layer from the first substrate during etching can be suppressed. As a result, the excess energy transferred from the light-absorbing layer to the article due to the reaction force can be suppressed, the behavior of the article during transfer is stable, and thus it is speculated that the effect of excellent positional accuracy becomes significant.

[0140] The light-absorbing layer is preferably a layer containing a photosensitive composition or a layer containing a non-photosensitive composition. That is, the light-absorbing layer is preferably a layer formed of a photosensitive composition or a layer formed of a non-photosensitive composition. Furthermore, the photosensitive composition is a positive photosensitive composition or a negative photosensitive composition.

[0141] <(XA) binder resin in the light-absorbing layer>

[0142] The light-absorbing layer is preferably a (XA) binder resin. The (XA) binder resin in the light-absorbing layer is preferably the (A) binder resin in the composition described later, and also preferably a resin having a structure derived from the (A) binder resin in the composition. From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the (XA) binder resin is preferably an acidic group, more preferably an acidic group in the structural unit of the resin. The acidic group is preferably one or more groups selected from the group consisting of phenolic hydroxyl, hydroxyimide, hydroxyamide, silanol, mercapto, carboxyl, carboxylic anhydride, and sulfonic acid groups, more preferably a (WA) weak acidic group: one or more groups selected from the group consisting of phenolic hydroxyl, hydroxyimide, hydroxyamide, silanol, and mercapto groups. Furthermore, the (XA) binder resin having a (WA) weak acidic group is sometimes also referred to as a (XA1) resin containing a weak acidic group.

[0143] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the (XA) adhesive resin preferably has a free radical polymerizable group, more preferably, a free radical polymerizable group is present in the structural unit of the resin. The free radical polymerizable group is preferably an vinyl unsaturated double bond group, more preferably a photoreactive group, an alkenyl group with 2 to 5 carbon atoms, or an alkynyl group with 2 to 5 carbon atoms. The photoreactive group is preferably styryl, cinnamyl, maleimide, nadicimide, or (meth)acryloyl, and from the viewpoint of suppressing debris and improving positional accuracy, (meth)acryloyl is more preferred. On the other hand, the alkenyl group with 2 to 5 carbon atoms or the alkynyl group with 2 to 5 carbon atoms are preferably vinyl, allyl, 2-methyl-2-propenyl, crotonyl, 2-methyl-2-butenyl, 3-methyl-2-butenyl, 2,3-dimethyl-2-butenyl, ethynyl, or 2-propynyl, and from the viewpoint of suppressing debris and improving positional accuracy, vinyl or allyl is more preferred.

[0144] (XA) The adhesive resin is preferably one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamide-imide, polyamide-imide precursor, polyamide, polysiloxane, silicone resin, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, phenolic resin, polyhydroxystyrene, phenolic epoxy resin, phenolic acrylic resin, acrylic resin, resin containing polycyclic side chains, acid-modified epoxy resin, urethane resin, epoxy resin, and copolymers thereof.

[0145] From the viewpoint of the effects of the invention, the (XA) adhesive resin is preferably a resin containing a (XA1) weakly acidic group (hereinafter referred to as (XA1) resin). The (XA1) resin is preferably a resin containing (XA1x) resin: a resin having one or more structures selected from the group consisting of imide, amide, oxazole, siloxane, and silicone structures (hereinafter referred to as imide structures, etc.) in its structural units, and / or (XA1y) resin: a resin having phenolic hydroxyl groups in its structural units.

[0146] From the viewpoint of the effects of the invention, the (XA1x) resin is more preferably having one or more structural units selected from the group consisting of imide, amide, and oxazole structures, and further preferably having a siloxane and / or silicone structure in the structural units of the resin. From the viewpoint of the effects of the invention, the (XA1x) resin is also more preferably having an oxoalkylene structure in the structural units of the resin. The (XA1x) resin is further preferably having one or more structural units selected from the group consisting of imide, amide, and oxazole structures, and having an oxoalkylene structure in the structural units of the resin.

[0147] Based on a flexible framework derived from siloxane, siloxane, or oxyalkylene structures, the compressive modulus of the light-absorbing layer at 50°C is adjusted to 1.0 × 10⁻⁶ by improving its mechanical properties through imide, amide, or oxazole structures. 3 Pa ~ 2.0 × 10 9 From the viewpoint of at least one of the following: within the range of Pa, and adjusting the glass transition temperature of the light-absorbing layer to a range of -50°C to 150°C, it is particularly suitable to be a resin having one or more (XA1x) resins selected from the group consisting of imide structures, etc., in the structural units of the resin; a resin having a siloxane structure and / or a silicone structure in the structural units of the resin; or a resin having an oxoalkylene structure in the structural units of the resin. Furthermore, the ratio of the compressive modulus of the light-absorbing layer before and after the specific treatment is adjusted to 1.0 × 10⁻⁶. 2 ~1.0×10 4 The (XA1x) resin is particularly suitable from at least one of the following viewpoints: within the range of [specific temperature range] and adjusting the glass transition temperature difference of the light-absorbing layer before and after the specific treatment to a range of 30°C to 100°C.

[0148] The siloxane and silicone structures in the (XA1x) resin are preferably divalent or higher structures bonded to at least two alkylene groups. More preferably, the divalent or higher structures are trivalent or higher, and even more preferably tetravalent or higher. On the other hand, the divalent or higher structures are preferably hexavalent or lower. The number of silicon atoms in the siloxane and / or silicone structures is preferably 5 or more, more preferably 10 or more, even more preferably 15 or more, and particularly preferably 20 or more. On the other hand, the number of silicon atoms is preferably 50 or less, more preferably 40 or less, even more preferably 30 or less, even more preferably 27 or less, and particularly preferably 25 or less.

[0149] The siloxane structure in the (XA1x) resin is preferably a monoalkylsiloxane structure. The monoalkylsiloxane structure preferably has 1 or more carbon atoms in its alkyl group, more preferably 2 or more, and even more preferably 3 or more. Alternatively, the alkyl group preferably has 10 or fewer carbon atoms, more preferably 8 or fewer, and even more preferably 6 or fewer. The silicone structure in the (XA1x) resin is preferably a dialkylsiloxane structure and / or a monoalkylsiloxane structure. The dialkylsiloxane structure and the monoalkylsiloxane structure preferably have 1 or more carbon atoms in their alkyl groups, more preferably 2 or more, and even more preferably 3 or more. Alternatively, the alkyl group preferably has 10 or fewer carbon atoms, more preferably 8 or fewer, and even more preferably 6 or fewer.

[0150] The oxoalkylene structure in the (XA1x) resin is preferably divalent or higher, more preferably trivalent or higher, and even more preferably tetravalent or higher. On the other hand, the oxoalkylene structure is preferably hexavalent or lower. The number of oxoalkylene groups in the (XA1x) resin is preferably 2 or more, more preferably 4 or more, even more preferably 8 or more, and particularly preferably 10 or more. On the other hand, the number of oxoalkylene groups is preferably 30 or less, more preferably 25 or less, even more preferably 20 or less, and particularly preferably 15 or less. The number of carbon atoms in the oxoalkylene group is preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more. On the other hand, the number of carbon atoms in the oxoalkylene group is preferably 6 or less, more preferably 4 or less. The oxoalkylene group is more preferably oxoethylene, oxopropylene, or oxobutylene.

[0151] The oxoalkylene structure in the (XA1x) resin preferably has two or more different oxoalkylene groups, more preferably three or more different oxoalkylene groups. The two or more different oxoalkylene groups may also have different carbon numbers. The oxoalkylene structure is more preferably composed of two or more groups selected from the group consisting of oxoethylene, oxopropylene, and oxobutylene, and more preferably composed of oxoethylene, oxopropylene, and oxobutylene.

[0152] Structural units having an imide structure and the like, as well as structural units having phenolic hydroxyl groups, are structural units constituting the resin, and are repeating units with a repeating number of 2 or more. The repeating number of these units is preferably 2 or more, more preferably 5 or more, and even more preferably 10 or more. On the other hand, the repeating number is preferably 1000 or less.

[0153] The (XA1) resin is preferably a resin comprising (XA1x). The (XA1x) resin is preferably one or more resins selected from the group consisting of polyimides, polyimide precursors, polybenzoxazole, polybenzoxazole precursors, polyamide-imides, polyamide-imide precursors, polyamides, polysiloxanes, silicone resins, maleimide resins, maleimide-styrene resins, maleimide-triazine resins, maleimide-oxazine resins, and copolymers thereof. More preferably, it is a resin selected from the group consisting of polyimides, polyimide precursors, polybenzoxazole, polybenzoxazole precursors, polyamide-imides, polyamides, polyamides, and copolymers thereof (hereinafter referred to as polyimide-based resins having weakly acidic groups). The (XA1x) resin may also be a single resin or any of its copolymers. Polyimide resins with weakly acidic groups preferably contain amine residues with phenolic hydroxyl groups, more preferably, the amine residues with phenolic hydroxyl groups contain a cyclic structure with at least two phenolic hydroxyl groups. Furthermore, the phenolic hydroxyl groups in the amine residues with phenolic hydroxyl groups can also react with structural and / or radical groups in the resin to form a benzoxazole ring. That is, in resins having a benzoxazole ring in the structural unit of the resin, the benzoxazole ring may also contain amine residues with phenolic hydroxyl groups.

[0154] It is believed that because the (XA1x) resin has a (WA) weakly acidic group and an imide structure in its structural units, internal stress is generated through hydrogen bonding or increased intermolecular interactions in the light-absorbing layer, suppressing excessive adhesion between the light-absorbing layer and the article. As a result, transfer can be performed with less energy, thus it is speculated that the effects of debris suppression and improved positional accuracy become significant.

[0155] The (XA1) resin is also preferably a resin containing (XA1y). The (XA1y) resin is preferably one or more resins selected from the group consisting of phenolic resins, polyhydroxystyrene, phenolic epoxy resins, and phenolic acrylic resins. The (XA1y) resin may also be a single resin or a copolymer thereof. The phenolic resin is preferably a phenolic varnish resin, a methyl phenolic resin, or a phenolic aralkyl resin. The polyhydroxystyrene may also have units derived from styrene derivatives or units derived from (meth)acrylate derivatives. The phenolic epoxy resin is preferably a phenolic carboxylate resin or a phenolic epoxy ester resin. The phenolic acrylic resin may also have units derived from styrene derivatives. Furthermore, the phenolic acrylic resin is a resin different from polyhydroxystyrene.

[0156] It is believed that because the (XA1y) resin has (WA) weakly acidic groups, internal stress is generated through hydrogen bonding or increased intermolecular interactions in the light-absorbing layer, suppressing excessive adhesion between the light-absorbing layer and the article. As a result, transfer can be performed with less energy, thus it is speculated that the effects of debris suppression and improved positional accuracy become significant.

[0157] From the viewpoint of the effects of the invention, the (XA) adhesive resin is preferably a resin containing (XA2) without a weakly acidic group (hereinafter referred to as (XA2) resin), preferably having a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group. The (XA2) resin may also be a resin without an acidic group. The (XA2) resin is preferably one or more resins selected from the group consisting of acrylic resins, resins containing polycyclic side chains, acid-modified epoxy resins, urethane resins, and epoxy resins. The (XA2) resin may also be any one of a single resin or a copolymer thereof. The acrylic resin may also have units derived from styrene derivatives. The resin containing polycyclic side chains is preferably a calorie resin. The acid-modified epoxy resin is preferably an epoxy (meth)acrylate resin.

[0158] It is believed that because the (XA2) resin contains carboxyl, carboxylic anhydride, or sulfonic acid groups, internal stress is generated through hydrogen bonding or increased intermolecular interactions in the light-absorbing layer. Furthermore, it is believed that the structural units of acrylic resins, resins containing polycyclic side chains, acid-modified epoxy resins, urethane resins, and epoxy resins can appropriately maintain the force holding the article in place, suppressing excessive adhesion between the light-absorbing layer and the article. As a result, transfer can be performed with less energy, thus it is speculated that the effects of debris suppression and improved positional accuracy become significant.

[0159] From the viewpoint of the effects of the invention, the (XA2) resin is preferably an acrylic resin comprising a unit derived from a (meth)acrylate derivative containing an aliphatic group having 4 to 20 carbon atoms. The aliphatic group in the (XA2) resin preferably has 4 or more carbon atoms, more preferably 6 or more, further preferably 8 or more, and particularly preferably 10 or more. On the other hand, the aliphatic group preferably has 20 or fewer carbon atoms, more preferably 15 or fewer, and further preferably 12 or fewer. The aliphatic group is preferably a straight-chain or branched alkyl, alkenyl, or alkynyl group. The aliphatic group in the (XA2) resin is also preferably composed of two or more different aliphatic groups. The two or more different aliphatic groups may also have different carbon atoms.

[0160] The compressive modulus of the light-absorbing layer at 50°C was adjusted to 1.0 × 10⁻⁶ by utilizing the improved flexibility and mechanical properties resulting from units derived from (meth)acrylate derivatives containing aliphatic groups. 3 Pa ~ 2.0 × 10 9 From the viewpoint of at least one of the following: within the range of Pa, and adjusting the glass transition temperature of the light-absorbing layer to a range of -50°C to 150°C, acrylic resins having units derived from (meth)acrylate derivatives containing aliphatic groups having 4 to 20 carbon atoms are particularly suitable (XA2) resins. Furthermore, the ratio of the compressive modulus of the light-absorbing layer before and after the specific treatment is adjusted to 1.0 × 10⁻⁶. 2 ~1.0×10 4 The (XA2) resin is particularly suitable from at least one of the following viewpoints: within the range of [specific temperature range] and adjusting the glass transition temperature difference of the light-absorbing layer before and after the specific treatment to a range of 30°C to 100°C.

[0161] When the light-absorbing layer is a layer containing a positively photosensitive composition, from the viewpoint of the effects of the invention, the (XA2) resin is preferably an acrylic resin containing units derived from (meth)acrylate derivatives containing aromatic groups having 6 to 15 carbon atoms, or units derived from styrene derivatives having 6 to 15 carbon atoms. The aromatic groups in the (XA2) resin preferably have 6 or more carbon atoms, more preferably 10 or more. On the other hand, the aromatic groups preferably have 15 or fewer carbon atoms, more preferably 14 or fewer. The aromatic groups may also be condensed polycyclic structures.

[0162] From the viewpoint of the effects of the invention, the (XA2) resin is preferably a resin containing one or more resins selected from the group consisting of an imide structure, an amide structure, an oxazole structure, a siloxane structure, and a silicone structure (hereinafter referred to as an imide structure, etc.) in the structural unit of the resin.

[0163] From the viewpoint of the effects of the invention, the (XA2) resin is more preferably having one or more structural units selected from the group consisting of imide, amide, and oxazole structures, and more preferably having a siloxane and / or silicone structure in the structural units of the resin. From the viewpoint of the effects of the invention, the (XA2) resin is also more preferably having an oxoalkylene structure in the structural units of the resin. The (XA2) resin is further preferably having one or more structural units selected from the group consisting of imide, amide, and oxazole structures, and having an oxoalkylene structure in the structural units of the resin.

[0164] The examples and preferred embodiments related to the siloxane structure, silicone structure and oxyalkylene structure in (XA2) resin are the same as those for the (XA1x) resin.

[0165] Based on a flexible framework derived from siloxane, siloxane, or oxyalkylene structures, the compressive modulus of the light-absorbing layer at 50°C is adjusted to 1.0 × 10⁻⁶ by improving its mechanical properties through imide, amide, or oxazole structures. 3 Pa ~ 2.0 × 10 9 From the viewpoint of at least one of the following: within the range of Pa, and adjusting the glass transition temperature of the light-absorbing layer to a range of -50°C to 150°C, it is particularly suitable to be a resin having one or more (XA2) resins selected from the group consisting of imide structures, etc., in the structural units of the resin; a resin having a siloxane structure and / or a silicone structure in the structural units of the resin; or a resin having an oxoalkylene structure in the structural units of the resin. Furthermore, the ratio of the compressive modulus of the light-absorbing layer before and after the specific treatment is adjusted to 1.0 × 10⁻⁶. 2 ~1.0×10 4 The (XA2) resin is particularly suitable from at least one of the following viewpoints: within the range of [specific temperature range] and adjusting the glass transition temperature difference of the light-absorbing layer before and after the specific treatment to a range of 30°C to 100°C.

[0166] The (XA2) resin is preferably one or more resins selected from the group consisting of polyimides, polyimide precursors, polybenzoxazole, polybenzoxazole precursors, polyamide-imides, polyamide-imide precursors, polyamides, polysiloxanes, silicone resins, maleimide resins, maleimide-styrene resins, maleimide-triazine resins, maleimide-oxazine resins, and copolymers thereof. More preferably, it is a resin selected from the group consisting of polyimides, polyimide precursors, polybenzoxazole, polybenzoxazole precursors, polyamide-imides, polyamide-imide precursors, polyamides, and copolymers thereof (hereinafter referred to as polyimide-based resins without weakly acidic groups). The (XA2) resin may also be a single resin or any of its copolymers.

[0167] It is believed that because the (XA2) resin has imide structures and other structural units, internal stress is generated through hydrogen bonding or increased intermolecular interactions in the light-absorbing layer, suppressing excessive adhesion between the light-absorbing layer and the article. As a result, transfer can be performed with less energy, thus it is speculated that the effects of debris suppression and improved positional accuracy become significant.

[0168] Examples of polyimide precursors include: polyamic acid, polyamic acid ester, polyamic acid amide, or polyisoimide. Examples of polyimides include resins obtained by dehydrating and ring-closing a polyimide precursor. Examples of polybenzoxazole precursors include: polyhydroxyamide. Examples of polybenzoxazole precursors include: resins obtained by dehydrating and ring-closing a polybenzoxazole precursor. Examples of polyamide-imide precursors include: resins obtained by reacting tricarboxylic anhydrides, etc., with diamines, etc. Examples of polyamide-imides include: resins obtained by dehydrating and ring-closing a polyamide-imide precursor. Examples of polyamides include: resins obtained by reacting dicarboxylic acid chlorides, etc., with diamines, etc.

[0169] Furthermore, regarding (XA1x) resin, (XA1y) resin, and (XA2) resin, if each of these has a structure or group constituting another resin, they are classified as any one according to the classification method shown in Table 1-1 below. If a resin can be equivalent to two or more of (XA1x) resin, (XA1y) resin, and (XA2) resin, the classification method determines which resin it is equivalent to.

[0170] [Table 1-1]

[0171]

[0172] <(XDa) UV absorber and (XDb) colorant in the light-absorbing layer>

[0173] The light-absorbing layer preferably contains an (XDa) ultraviolet absorber and / or an (XDb) colorant. The (XDa) ultraviolet absorber in the light-absorbing layer is preferably the (Da) ultraviolet absorber described later, and also preferably a compound having a structure derived from the (Da) ultraviolet absorber in the composition. The (XDb) colorant in the absorbing layer is preferably the (Db) colorant described later, and also preferably a compound having a structure derived from the (Db) colorant in the composition.

[0174] The term "(XDa) ultraviolet absorber" refers to a compound that absorbs light with wavelengths (less than 380 nm) in the ultraviolet region. From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positioning accuracy, the (XDa) ultraviolet absorber preferably has phenolic hydroxyl groups, more preferably at least two phenolic hydroxyl groups. The number of phenolic hydroxyl groups in the (XDa) ultraviolet absorber is preferably one or more, more preferably two or more, and even more preferably three or more, particularly preferably four or more. On the other hand, the number of phenolic hydroxyl groups is preferably eight or less, more preferably six or less.

[0175] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the (XDa) ultraviolet absorber is preferably a compound comprising one or more compounds selected from the group consisting of a triazine structure, a benzotriazole structure, a benzophenone structure, an isocyanuric acid structure, and at least two benzene structures. The (XDa) ultraviolet absorber is more preferably a compound comprising a compound having at least two triazine structures, at least two benzotriazole structures, at least two benzophenone structures, or at least two isocyanuric acid structures.

[0176] The (XDa) ultraviolet absorber preferably has two or more triazine structures, benzotriazole structures, benzophenone structures, or isocyanuric acid structures, more preferably three or more. Conversely, the number of triazine structures, benzotriazole structures, benzophenone structures, or isocyanuric acid structures is preferably four or less. Furthermore, the (XDa) ultraviolet absorber preferably has two or more benzene structures, more preferably three or more, and even more preferably four or more. Conversely, the number of benzene structures is preferably eight or less, more preferably six or less.

[0177] When the light-absorbing layer contains an (XDa) UV absorber, from the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the (XDa) UV absorber is preferably a resin containing a triazine structure, a benzotriazole structure, a benzophenone structure, or an isocyanuric acid structure in the structural units of the resin (hereinafter referred to as a (XDa) UV absorber with a specific structure), more preferably a resin containing a triazine structure and / or a benzotriazole structure in the structural units of the resin. Furthermore, the (XDa) UV absorber with a specific structure is a resin different from the (XA) adhesive resin, but the (XDa) UV absorber with a specific structure is equivalent to both the (XDa) UV absorber and the (XA) adhesive resin. That is, when the light-absorbing layer contains a (XDa) UV absorber with a specific structure, the light-absorbing layer contains both the (XDa) UV absorber and the (XA) adhesive resin.

[0178] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the (XDa) ultraviolet absorber with a specific structure is preferably one or more resins selected from the group consisting of polysiloxanes, silicone resins, maleimide resins, maleimide-styrene resins, maleimide-triazine resins, maleimide-oxazine resins, phenolic resins, polyhydroxystyrene, phenolic epoxy resins, phenolic acrylic resins, acrylic resins, resins containing polycyclic side chains, acid-modified epoxy resins, urethane resins, epoxy resins, and copolymers thereof, and more preferably one or more resins selected from the group consisting of phenolic acrylic resins, acrylic resins, maleimide-styrene resins, polyhydroxystyrene, and copolymers thereof.

[0179] In terms of adjusting the maximum absorbance per 1.0 μm of thickness in the wavelength range of 180 nm to 550 nm of the light-absorbing layer to a range of 0.3 to 10.0, it is particularly suitable to be (XDa) ultraviolet absorbers having one or more compounds selected from the group consisting of triazine structure, benzotriazole structure, benzophenone structure, isocyanuric acid structure and at least two benzene structures, or (XDa) ultraviolet absorbers with a specific structure.

[0180] The term "(XDb) colorant" refers to a compound that colors itself by absorbing light of wavelengths (380 nm to 780 nm) of visible light. "Coloring itself" means exhibiting red, orange, yellow, green, blue, or purple. The (XDb) colorant preferably contains pigments and / or dyes. The (XDb) colorant preferably contains one or more of the group consisting of a black agent, a mixture of two or more colorants, and a colorant other than black. From the viewpoint of reducing laser irradiation energy and improving positional accuracy, the black agent preferably contains organic black pigments and / or inorganic black pigments. From the viewpoint of debris suppression and improved positional accuracy, the black agent preferably contains a black dye. The black colorant in the (XDb) colorant is as described in paragraphs

[0284] to

[0285] of International Publication No. 2019 / 087985.

[0181] The organic black pigment is preferably one or more selected from the group consisting of benzophenone-based black pigments, perylene-based black pigments, azo-based black pigments, anthraquinone-based black pigments, aniline-based black pigments, azo-based black pigments, and carbon black. Carbon black is preferably obtained through resin coating, dye coating, oxidation treatment, surface modification using organic groups with ionic groups, or surface treatment using sulfonic acid groups.

[0182] Inorganic black pigments are preferably composed of one or more elements selected from the group consisting of nitrides, carbides, oxynitrides, microparticles, oxides, complex oxides, sulfides, sulfates, nitrates, and carbonates, and contain one or more metallic elements selected from the group consisting of zirconium, vanadium, niobium, hafnium, tantalum, titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, and silver. Inorganic black pigments are also preferably composed of graphite or a silver-tin alloy.

[0183] The black dye is preferably a black dye containing a metal element or a black dye not containing a metal element, and more preferably a black dye containing a metal element or not containing a metal element. The black dye is preferably a black dye containing an azo dye.

[0184] The preferred colorant mixture, consisting of two or more colors, comprises a mixture of two or more colorant pigments and / or a mixture of two or more colorant dyes, more preferably comprising two or more colors including blue and / or purple and including red and orange. Colorants other than black preferably comprise colorant pigments and / or colorant dyes. Colorant pigments preferably comprise anthraquinone-based pigments, diketopyrrolopyrrole-based pigments, perylene-based pigments, isoindoline-based pigments, isoindoline-based pigments, imidazolinone-based pigments, quinacridone-based pigments, pinantrone-based pigments, phthalocyanine-based pigments, indanthrene-based pigments, or dioxazine-based pigments. Colorant dyes preferably comprise squaric acid-based dyes, xanthan dyes, triarylmethane dyes, or phthalocyanine dyes.

[0185] From the viewpoint of reducing laser irradiation energy and improving positional accuracy, the maximum absorbance per 1.0 μm of thickness for the (XA) adhesive resin, (XDa) ultraviolet absorber, or (XDb) colorant at wavelengths of 180 nm to 550 nm is preferably 0.3 or more, more preferably 0.5 or more, and even more preferably 1.0 or more. Furthermore, the maximum absorbance is preferably 1.5 or more, more preferably 2.0 or more, even more preferably 2.5 or more, and particularly preferably 3.0 or more. On the other hand, from the viewpoint of debris suppression and improving positional accuracy, the maximum absorbance is preferably 10.0 or less, more preferably 8.0 or less, even more preferably 7.0 or less, and particularly preferably 6.0 or less. Furthermore, the maximum absorbance is preferably 5.0 or less, more preferably 4.5 or less, and even more preferably 4.0 or less.

[0186] From the viewpoint of reducing laser irradiation energy and improving positional accuracy, the absorbance per 1.0 μm of thickness at wavelengths of 193 nm, 248 nm, 266 nm, 308 nm, 351 nm, 355 nm, or 532 nm for the (XA) adhesive resin, (XDa) ultraviolet absorber, or (XDb) colorant is preferably 0.3 or more, more preferably 0.5 or more, and even more preferably 1.0 or more. Furthermore, the absorbance is preferably 1.5 or more, more preferably 2.0 or more, even more preferably 2.5 or more, and particularly preferably 3.0 or more. On the other hand, from the viewpoint of debris suppression and improved positional accuracy, the absorbance is preferably 10.0 or less, more preferably 8.0 or less, even more preferably 7.0 or less, and particularly preferably 6.0 or less. Furthermore, the maximum value of the absorbance is preferably 5.0 or less, more preferably 4.5 or less, and even more preferably 4.0 or less.

[0187] Furthermore, the (XA) adhesive resin, (XDa) ultraviolet absorber, or (XDb) colorant is more preferably used in the process described later (22) where an active chemical ray is irradiated from the first substrate side of the light-absorbing layer to the light-absorbing layer and the article is transferred from the light-absorbing layer to the second adhesive layer with a gap provided between the article included in the first substrate and the second adhesive layer included in the second substrate, wherein the absorbance at the wavelength of the irradiated active chemical ray is within the range described.

[0188] Furthermore, the (XA) adhesive resin, (XDa) ultraviolet absorber, or (XDb) colorant is more preferably, in the process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer as described later (14b-1), the absorbance of the transmittance at the wavelength of the irradiated active chemical rays is within the range described above.

[0189] <Light-absorbing layer containing a photosensitive composition or a non-photosensitive composition>

[0190] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the light-absorbing layer preferably contains a positive photosensitive composition. Furthermore, when the laminate, as a first aspect of the present invention, has the structure described in

[12] or

[13] , the light-absorbing layer is particularly preferably a layer containing a positive photosensitive composition. Additionally, when the laminate, as a second aspect of the present invention, has a specific structure 1 or a specific structure 2 of the laminate, the light-absorbing layer is particularly preferably a layer containing a positive photosensitive composition. When the light-absorbing layer is a layer containing a positive photosensitive composition, the light-absorbing layer preferably contains one or more of the group consisting of (C1) naphthoquinone diazide compound, (C3) photoacid generator, and (C4) photobase generator selected from the compositions described later, and is also preferably a compound having a structure derived from these compounds in the composition.

[0191] When the light-absorbing layer is a layer containing a positive photosensitive composition, from the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the laminate as the first embodiment of the present invention is preferably one that satisfies the relationship described in formula (S-1), and particularly preferably one that has the structure described in

[12] or

[13] and satisfies the relationship described in formula (S-1). When the light-absorbing layer is a layer containing a positive photosensitive composition, from the viewpoint of the same inventive effect, the laminate as the second embodiment of the present invention is preferably one that satisfies the relationship described in formula (S-1), and particularly preferably one that has a specific structure 1 or a specific structure 2 of the laminate and satisfies the relationship described in formula (S-1). Examples and preferences related to the relationship described in formula (S-1) are described above.

[0192] When the light-absorbing layer is a layer containing a positively photosensitive composition, the thickness of the light-absorbing layer is more preferably less than 5.0 μm. Examples and preferences related to the thickness of the light-absorbing layer are described above.

[0193] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the light-absorbing layer is preferably a layer containing a negative photosensitive composition. Furthermore, if the laminate as a first aspect of the present invention has the structure described in

[12] or

[13] , the light-absorbing layer is more preferably a layer containing a negative photosensitive composition. Furthermore, if the laminate as a second aspect of the present invention has a specific structure 1 or a specific structure 2 of the laminate, the light-absorbing layer is more preferably a layer containing a negative photosensitive composition. When the light-absorbing layer is a layer containing a negative photosensitive composition, the light-absorbing layer preferably contains one or more of the group consisting of a (C2) photopolymerization initiator, a (C3) photoacid generator, and a (C4) photobase generator selected from the compositions described later, and is also preferably a compound having a structure derived from these compounds in the composition.

[0194] When the light-absorbing layer is a layer containing a negative photosensitive composition, from the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the laminate as the first aspect of the present invention is more preferably one that satisfies the relationship described in formula (S-1), and further preferably one that has the structure described in

[12] or

[13] and satisfies the relationship described in formula (S-1). When the light-absorbing layer is a layer containing a negative photosensitive composition, from the viewpoint of the same inventive effect, the laminate as the second aspect of the present invention is more preferably one that satisfies the relationship described in formula (S-1), and further preferably one that has a specific structure 1 or a specific structure 2 of the laminate and satisfies the relationship described in formula (S-1). Examples and preferences related to the relationship described in formula (S-1) are described above.

[0195] When the light-absorbing layer is a layer containing a negative photosensitive composition, the thickness of the light-absorbing layer is more preferably less than 5.0 μm. Examples and preferences related to the thickness of the light-absorbing layer are described above.

[0196] From the viewpoint of improving positional accuracy, the light-absorbing layer is preferably a layer containing a non-photosensitive composition. Furthermore, if the laminate, as a first aspect of the present invention, has the structure described in

[12] or

[13] , the light-absorbing layer is more preferably a layer containing a non-photosensitive composition. Furthermore, if the laminate, as a second aspect of the present invention, has a specific structure 1 or a specific structure 2 of the laminate, the light-absorbing layer is more preferably a layer containing a non-photosensitive composition. When the light-absorbing layer is a layer containing a non-photosensitive composition, the light-absorbing layer preferably contains the (F) crosslinking agent and / or the (B) free radical polymerizable compound described later in the composition, and also preferably contains a compound having a structure derived from these compounds in the composition.

[0197] When the light-absorbing layer is a layer containing a non-photosensitive composition, from the viewpoint of improving positional accuracy, the laminate as the first aspect of the present invention is more preferably one that satisfies the relationship described in formula (S-1), and more preferably one that has the structure described in

[12] or

[13] and satisfies the relationship described in formula (S-1). When the light-absorbing layer is a layer containing a non-photosensitive composition, from the viewpoint of improving positional accuracy, the laminate as the second aspect of the present invention is more preferably one that satisfies the relationship described in formula (S-1), and more preferably one that has a specific structure 1 or a specific structure 2 of the laminate and satisfies the relationship described in formula (S-1). Examples and preferences related to the relationship described in formula (S-1) are described above.

[0198] When the light-absorbing layer is a layer containing a non-photosensitive composition, the thickness of the light-absorbing layer is more preferably less than 5.0 μm. Examples and preferences related to the thickness of the light-absorbing layer are described above.

[0199] From the viewpoint of improving positional accuracy, the laminate as a first aspect of the present invention is preferably one that satisfies the relationship described in equation (S-2), and more preferably one that has the structure described in

[12] or

[13] and satisfies the relationship described in equation (S-2). From the viewpoint of improving positional accuracy, the laminate as a second aspect of the present invention is also preferably one that satisfies the relationship described in equation (S-2), and more preferably one that has a specific structure 1 or a specific structure 2 of the laminate and satisfies the relationship described in equation (S-2). Examples and preferences related to the relationship described in equation (S-2) are described above.

[0200] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the light absorption layer is preferably satisfied with any one of the following conditions (α) to (γ).

[0201] (α) The light-absorbing layer is a layer formed of a positive photosensitive composition, and the positive photosensitive composition satisfies at least one of the following conditions (1), (3) and (4).

[0202] (β) The light-absorbing layer is a layer formed by a negative photosensitive composition, and the negative photosensitive composition satisfies at least one of the following conditions (2) to (4).

[0203] (γ) The light-absorbing layer is a layer formed of a non-photosensitive composition, and the non-photosensitive composition satisfies the conditions of (5) below and / or (6) below.

[0204] (1) Contains (C1) naphthoquinone diazide compound and (F) crosslinking agent

[0205] (2) Compounds containing (C2) photopolymerization initiator and (B) free radical polymerizable compounds

[0206] (3) Contains (C3) photoacid generator and (F) crosslinking agent

[0207] (4) Contains (C4) light alkali generating agent and (F) crosslinking agent

[0208] (5) Contains (F) crosslinking agent

[0209] (6) Compounds containing (B) free radical polymerizable compounds.

[0210] When the light-absorbing layer satisfies condition (α), the positive photosensitive composition also preferably satisfies at least one of conditions (2) and (6). When the light-absorbing layer satisfies condition (β), the negative photosensitive composition also preferably satisfies at least one of conditions (1), (5) and (6).

[0211] <First Adhesive Layer>

[0212] The laminate as a second aspect of the present invention has a first adhesive layer. In the laminate as a second aspect of the present invention, the first adhesive layer has a recess. In the laminate as a second aspect of the present invention, the compressive modulus of the first adhesive layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 The glass transition temperature of Pa and / or the first adhesive layer is -50℃ to 150℃. The light-absorbing layer and the first adhesive layer preferably satisfy any one of the following conditions (py) and (qy).

[0213] (py) The light-absorbing layer and the first adhesive layer have a recess, which is an opening of the first adhesive layer, and at least a portion of the light-absorbing layer is removed at the recess, resulting in a reduced thickness.

[0214] (qy) The light-absorbing layer and the first adhesive layer have a recess, which is an opening.

[0215] The examples and preferred embodiments related to the indentation elastic modulus of the first adhesive layer at 50°C and the glass transition temperature of the first adhesive layer are the same as those examples and preferred embodiments related to the indentation elastic modulus of the light-absorbing layer at 50°C and the glass transition temperature of the light-absorbing layer.

[0216] Furthermore, in the laminate as a second aspect of the present invention, the examples and preferred descriptions related to the difference between the indentation elastic modulus of the first adhesive layer at 50°C after treatment of any of (x1), (x2), and (x3) and the indentation elastic modulus of the first adhesive layer at 50°C before treatment, and the difference between the glass transition temperature of the first adhesive layer after treatment of any of (x1), (x2), and (x3) and the glass transition temperature of the first adhesive layer before treatment are the same as the examples and preferred descriptions of the ratio of the indentation elastic modulus of the light-absorbing layer before and after the specific treatment and the glass transition temperature of the light-absorbing layer before and after the specific treatment.

[0217] From the viewpoint of reducing laser irradiation energy and suppressing debris, the thickness of the first adhesive layer is preferably less than 5.0 μm, more preferably 4.0 μm or less, even more preferably 3.0 μm or less, even more preferably 2.0 μm or less, and particularly preferably 1.0 μm or less. On the other hand, from the viewpoint of improving positional accuracy, the thickness of the first adhesive layer is preferably 0.10 μm or more, more preferably 0.30 μm or more, and even more preferably 0.50 μm or more.

[0218] The thickness of the first adhesive layer in the recess is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. Furthermore, it is also preferable that there is no first adhesive layer at the portion corresponding to the recess.

[0219] Examples and preferred embodiments relating to other physical properties and other structures of the first adhesive layer are the same as those of the light-absorbing layer. Examples and preferred embodiments relating to the (XA) adhesive resin, (XDa) ultraviolet absorber, and (XDb) colorant in the first adhesive layer are the same as those of the light-absorbing layer. The first adhesive layer is preferably a layer containing a positive photosensitizing composition, a layer containing a negative photosensitizing composition, or a layer containing a non-photosensitive composition. Alternatively, the first adhesive layer may also be a layer containing the same composition as the light-absorbing layer.

[0220] The first adhesive layer is preferably a layer of resin containing a polydialkyl silicone structure in the structural units of the resin, more preferably a layer of resin containing units with a polydialkyl silicone structure as the main component, and even more preferably a layer containing these resins as the main component. The unit that is the main component of the resin refers to the unit that is most abundant in the structural units of the resin on a molar ratio basis. The main component in the first adhesive layer refers to the component that is most abundant in the constituent components of the first adhesive layer on a mass basis. The polydialkyl silicone structure is more preferably a polydimethyl silicone structure. Furthermore, these resins may also have a polymonoalkyl monoaryl silicone structure in the structural units of the resin.

[0221] <Items>

[0222] A laminated body according to a first aspect of the present invention includes an article. A laminated body according to a first aspect of the present invention includes a plurality of articles in contact with a light-absorbing layer. A laminated body according to a second aspect of the present invention includes an article. A laminated body according to a second aspect of the present invention includes a plurality of articles in contact with a first adhesive layer.

[0223] The articles in the laminate of the present invention are preferably included in electronic components, electronic devices, mobile bodies, buildings, or windows after being transferred to another laminate. Examples of electronic components include: semiconductor devices, antennas, display devices, optical devices, printed circuit boards, semiconductor packages, active or passive components including semiconductor devices. The laminate of the present invention is preferably used for manufacturing said electronic components, electronic devices, mobile bodies, buildings, or windows.

[0224] Examples of semiconductor devices include those with fan-out wafer-level packaging structures, fan-out panel-level packaging structures, or in-package antenna structures. Examples of antennas include microstrip antennas or stripline antennas. Examples of display devices include organic electroluminescence (EL) displays, quantum dot displays, micro-LED displays, mini-LED displays, or liquid crystal displays. Examples of metal-clad laminates include printed wiring substrates. Electronic components are also preferably those with a hollow structure. The hollow structure has a hollow structure support material and a hollow structure roof material. Examples of electronic components with a hollow structure include microelectromechanical systems (MEMS). The packaging structure in the semiconductor device can be either a single-crystal or multi-crystal structure; from the viewpoint of increasing integration density and suppressing transmission losses between wirings, a multi-crystal structure is preferred. The structure including multiple chips is preferably a chiplet structure, more preferably a chiplet selected from the group consisting of logic circuits, memory, analog integrated circuits, radio frequency (RF) circuits (high frequency circuits) and power semiconductors, and even more preferably includes two or more types of chips.

[0225] The laminate of the present invention is preferably used for manufacturing semiconductor devices, antennas, display devices, optical devices, printed wiring substrates, semiconductor packages, active or passive parts including semiconductor devices, having the structure described above.

[0226] <Item; Semiconductor Chip>

[0227] The preferred material is a semiconductor chip. The semiconductor layer preferably comprises silicon, silicon carbide, gallium nitride, indium gallium nitride, aluminum gallium nitride, gallium trioxide, gallium arsenide, aluminum gallium arsenide, gallium arsenide phosphide, indium phosphide, gallium phosphide, zinc selenide, aluminum indium gallium phosphide, indium tin oxide, indium zinc oxide, indium gallium zinc oxide, diamond, aluminum zinc oxide, or zinc oxide as its main components. The term "main component" in the semiconductor layer refers to the component that constitutes the semiconductor layer by mass.

[0228] Semiconductor chips are preferably flip-chip structures having multiple electrode terminals on one surface. When an article has multiple electrode terminals on one surface, and the surface of the article facing the light-absorbing layer is designated as surface 1b and the surface of the article facing surface 1b is designated as surface 2b, the article preferably has multiple electrode terminals on surface 1b. When forming the recess or opening of the light-absorbing layer in the laminate as the first aspect of the present invention by alkaline development or etching, this structure is suitable from the viewpoint of inhibiting corrosion of the electrode terminals and improving reliability. Furthermore, when forming the recess or opening of the light-absorbing layer in the laminate as the second aspect of the present invention, and the recess or opening of the first adhesive layer, by alkaline development or etching, this structure is suitable from the viewpoint of inhibiting corrosion of the electrode terminals and improving reliability.

[0229] Furthermore, the semiconductor chip is preferably a vertical type having multiple electrode terminals on one surface and on a surface different from the stated surface. A vertical structure is more preferably a structure having multiple electrode terminals on one surface and on a surface facing the stated surface. In the manufacture of electronic components and the like using the laminate of the present invention, from the viewpoint of high integration of semiconductor devices and improved resolution of display devices, this structure is suitable.

[0230] The electrode terminals are preferably conductive layers. A conductive layer is defined as a layer with a volume resistivity of 1.0 × 10⁻⁶. -8 Ω·cm~1.0×10 -4 The electrode terminal is a layer with a density of Ω·cm. The electrode terminal preferably contains elements as main components, such as Ag, Cu, Au, In, Sb, Sn, Pb, Ti, Al, Ni, Mo, or Cr. The term "main component element" refers to the element that constitutes the electrode terminal in the largest quantity by mass. The length of one side of the electrode terminal is preferably 0.20 μm or more and 100 μm or less. The height of the electrode terminal is preferably 0.10 μm or more and 50 μm or less.

[0231] The preferred component is a semiconductor chip, which is a light-emitting element. The semiconductor chip, serving as a light-emitting element, is preferably included in a display device. The display device having this structure is preferably a micro-LED display or a mini-LED display. The display device preferably has a semiconductor chip serving as a light-emitting element, a wiring layer, a rewiring layer, and an interlayer insulating layer for the rewiring layer, with the semiconductor chip electrically connected to the wiring layer and / or the semiconductor chip and the rewiring layer. Furthermore, the display device preferably also has an isolation layer and / or a planarization layer. The semiconductor chip serving as a light-emitting element is preferably a PN-junction diode formed by bonding a P-type semiconductor and an N-type semiconductor.

[0232] The length of one side of the semiconductor chip serving as the light-emitting element is preferably 0.50 μm or more, more preferably 5.0 μm or more, and even more preferably 10 μm or more. On the other hand, the length of one side is preferably 200 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less. The thickness of one side of the semiconductor chip serving as the light-emitting element is preferably 0.50 μm or more, more preferably 1.0 μm or more, and even more preferably 5.0 μm or more. On the other hand, the thickness of one side is preferably 100 μm or less, more preferably 50 μm or less, and even more preferably 20 μm or less. The laminate of the present invention is preferably used for manufacturing a display device having the aforementioned structure.

[0233] The article is preferably a semiconductor chip, and the semiconductor chip is a light-emitting element, a light-receiving element, an optical coupling element, a filter element, an optical modulation element, or an optical amplification element (hereinafter referred to as an optical communication element, etc.). The semiconductor chip, which is an optical communication element, etc., is preferably included in the optical device. The optical device having the above structure is preferably a semiconductor chip, a logic semiconductor chip, a packaging substrate, and a printed wiring substrate that serve as optical communication elements, etc.

[0234] Optical devices preferably consist of a semiconductor chip, such as an optical communication element, sealed on a packaging substrate, and a logic semiconductor chip, also sealed on a packaging substrate, electrically connected on a printed wiring substrate. More preferably, the optical device comprises a semiconductor chip, such as an optical communication element, and a logic semiconductor chip, both sealed on a packaging substrate and electrically connected via the packaging substrate. Furthermore, the optical device preferably also includes an interposer, through which the semiconductor chip, such as an optical communication element, and the logic semiconductor chip are electrically connected, and sealed on the packaging substrate. Particularly preferably, the optical device comprises semiconductor chips, such as optical communication elements, and logic semiconductor chips stacked vertically and electrically connected, and sealed on the packaging substrate. In the case of semiconductor chips, such as optical communication elements, and logic semiconductor chips stacked vertically and electrically connected, it is preferable that the electrodes are electrically connected to each other via bump bonding, and more preferably that the electrodes are directly electrically connected without using bumps. Furthermore, the optical device is preferably formed on the same substrate as a semiconductor chip and a logic semiconductor chip, which are optical communication elements and are electrically connected.

[0235] The length of one side of the semiconductor chip, such as an optical communication element, is preferably 10 μm or more, more preferably 30 μm or more, and even more preferably 50 μm or more. On the other hand, the length of one side is preferably 2000 μm or less, more preferably 1500 μm or less, and even more preferably 1000 μm or less. The ratio of the length of the long side to the length of the short side of the semiconductor chip, such as an optical communication element, is preferably 2.0 or more, more preferably 3.0 or more, even more preferably 5.0 or more, even more preferably 7.0 or more, and particularly preferably 10 or more. On the other hand, the ratio of the length of the long side to the length of the short side is preferably 200 or less, more preferably 150 or less, and even more preferably 100 or less. Furthermore, the ratio of the length of the long side to the length of the short side is preferably 70 or less, more preferably 50 or less, even more preferably 40 or less, even more preferably 30 or less, and particularly preferably 20 or less. The thickness of one side of the semiconductor chip, such as an optical communication element, is preferably 0.10 μm or more, more preferably 0.50 μm or more, and even more preferably 1.0 μm or more. On the other hand, the thickness of one side is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5.0 μm or less. The laminate of the present invention is preferably used for manufacturing an optical device having the structure described above.

[0236] <Laminated body 0A; Substrate and article>

[0237] Sometimes, a laminate having an application substrate and an article in sequence is also referred to as a laminate 0A. In the first embodiment of the present invention, the article in the laminate is preferably transferred from the laminate 0A to the light-absorbing layer of the laminate a1x. In the second embodiment of the present invention, the article in the laminate is preferably transferred from the laminate 0A to the first adhesive layer of the laminate a1y.

[0238] From the viewpoint of conductivity and insulation control, the substrate is preferably a substrate with a semiconducting layer, and more preferably a substrate with a semiconductor layer. A semiconducting layer is defined as a substrate with a volume resistivity of 1.0 × 10⁻⁶. -4 Ω·cm~1.0×10 8The semiconductor layer has a mass of Ω·cm. The semiconductor layer is preferably composed of elements including Ga, As, Al, In, Zn, Se, Si, Sn, nitrogen, phosphorus, carbon, or oxygen as its main components. The term "main component element" in the semiconductor layer refers to the element that constitutes the semiconductor layer by mass. Furthermore, the semiconductor layer is preferably composed of silicon, silicon carbide, gallium nitride, indium gallium nitride, aluminum gallium nitride, gallium trioxide, gallium arsenide, aluminum gallium arsenide, gallium arsenide phosphide, indium phosphide, gallium phosphide, zinc selenide, aluminum indium gallium phosphide, indium tin oxide, indium zinc oxide, indium gallium zinc oxide, diamond, aluminum zinc oxide, or zinc oxide as its main components. The term "main component element" in the semiconductor layer refers to the component that constitutes the semiconductor layer by mass. The donor substrate is also preferably a substrate comprising multiple layers having a semiconductor layer, with the semiconductor layer being the main component. The term "main component layer" in the donor substrate refers to the layer that constitutes the donor substrate by mass among the multiple layers. Furthermore, the donor substrate is also preferably a semiconductor layer. In addition, the substrate is preferably a substrate comprising multiple layers having an insulating layer and a semiconductor layer, wherein the insulating layer is an alkali glass substrate, an alkali-free glass substrate, a borosilicate glass substrate, a quartz glass substrate, a crystal substrate or a sapphire substrate.

[0239] The donor substrate preferably has a photodegradation layer. That is, at least one of the multiple layers constituting the donor substrate is preferably a photodegradation layer. In addition, the laminate OA is preferably a laminate having the donor substrate, the photodegradation layer and the article in sequence.

[0240] <Laminated body 0B and laminate a0; zeroth substrate, zeroth adhesive layer and article>

[0241] Sometimes, a laminate having a zeroth substrate, a zeroth adhesive layer (described later), and an article in sequence is referred to as laminate OB. Additionally, sometimes a laminate having a zeroth substrate and a zeroth adhesive layer (described later) in sequence is referred to as laminate a0. As a first aspect of the present invention, the article in the laminate is preferably an article that, after being transferred from laminate OB to the zeroth adhesive layer of laminate a0, is transferred from laminate OB to the light-absorbing layer of laminate a1x. As a second aspect of the present invention, the article in the laminate is preferably an article that, after being transferred from laminate OB to the zeroth adhesive layer of laminate a0, is transferred from laminate OB to the first adhesive layer of laminate a1y.

[0242] From the viewpoint of improved impact resistance, the zeroth substrate is preferably an inorganic substrate. Furthermore, from the viewpoint of improved flexibility and operability, the zeroth substrate is preferably an organic substrate. In addition, an inorganic substrate is also preferably a substrate having a semiconductor layer.

[0243] Furthermore, from the viewpoint of reducing laser irradiation energy and improving positional accuracy, the zeroth substrate is preferably a light-transmitting substrate. From the viewpoint of improving impact resistance, the light-transmitting substrate is preferably an inorganic substrate. Furthermore, from the viewpoint of improving flexibility and operability, the light-transmitting substrate is preferably an organic substrate.

[0244] The examples and preferred embodiments related to the light-transmitting substrate, inorganic substrate, organic substrate, substrate having a semiconducting layer, and substrate having a semiconductor layer are the same as those of the first substrate and the donor substrate.

[0245] The zeroth adhesive layer is preferably a layer of resin containing a polydialkylsiloxane structure within the structural units of the resin. Examples and preferred embodiments related to the polydialkylsiloxane structure are the same as those for the first adhesive layer. The zeroth adhesive layer may also use existing materials such as conventional adhesive layers. Alternatively, the zeroth adhesive layer may be a layer containing a conventional composition. Furthermore, the zeroth adhesive layer may also be a layer containing the same composition as the first adhesive layer.

[0246] <Laminated body 2 and laminate a2; second substrate, second adhesive layer and article>

[0247] Sometimes, a laminate having a second substrate, a second adhesive layer (described later), and an article in sequence is also referred to as laminate 2. Additionally, a laminate having a second substrate and a second adhesive layer (described later) in sequence is sometimes referred to as laminate a2. As a first embodiment of the present invention, the article in the laminate is preferably an article transferred from laminate 1X to the second adhesive layer of laminate a2. As a second embodiment of the present invention, the article in the laminate is preferably an article transferred from laminate 1Y to the second adhesive layer of laminate a2.

[0248] From the viewpoint of improved impact resistance, the second substrate is preferably an inorganic substrate. Furthermore, from the viewpoint of improved flexibility and operability, the second substrate is preferably an organic substrate. In addition, the inorganic substrate is also preferably a substrate having a semiconductor layer.

[0249] Furthermore, from the viewpoint of reducing laser irradiation energy and improving positional accuracy, the second substrate is preferably a light-transmitting substrate. From the viewpoint of improving impact resistance, the light-transmitting substrate is preferably an inorganic substrate. Furthermore, from the viewpoint of improving flexibility and operability, the light-transmitting substrate is preferably an organic substrate.

[0250] In the case where, after an article in a laminate (as a first aspect of the present invention) is transferred from laminate 1X to the second adhesive layer of laminate a2, and the electrode terminals, etc., of the article are electrically connected to the wiring included in laminate 2, from the viewpoint of conductivity control and insulation control, the second substrate is preferably a substrate having a semiconducting layer, and more preferably a substrate having a semiconductor layer. In the case where, after an article in a laminate (as a second aspect of the present invention) is transferred from laminate 1Y to the second adhesive layer of laminate a2, and the electrode terminals, etc., of the article are electrically connected to the wiring included in laminate 2, from the viewpoint of conductivity control and insulation control, the second substrate is preferably a substrate having a semiconducting layer, and more preferably a substrate having a semiconductor layer. In laminate 2, when the electrode terminals, etc., of an article transferred from the laminate of the present invention are electrically connected to the wiring included in laminate 2, laminate 2 preferably has an insulating layer. An insulating layer refers to a layer with a volume resistivity of 1.0 × 10⁻⁶. 8 Ω·cm~1.0×10 18 A layer of Ω·cm.

[0251] The examples and preferred embodiments related to the light-transmitting substrate, inorganic substrate, organic substrate, substrate having a semiconducting layer, and substrate having a semiconductor layer are the same as those of the first substrate and the donor substrate.

[0252] The second adhesive layer is preferably a layer of resin containing a polydialkylsiloxane structure within the structural units of the resin. Examples and preferred embodiments related to the polydialkylsiloxane structure are the same as those for the first adhesive layer. The second adhesive layer may also use existing materials such as conventional adhesive layers. Alternatively, the second adhesive layer may be a layer containing a conventional composition. Furthermore, the second adhesive layer may also be a layer containing the same composition as the first adhesive layer.

[0253] When the article transferred from the laminate of the present invention is a semiconductor chip and the semiconductor chip is the optical communication element, the maximum transmittance of the second adhesive layer at wavelengths of 1300 nm to 1600 nm is preferably 60% or more, more preferably 70% or more, more preferably 80% or more, and particularly preferably 90% or more.

[0254] <Laminated body 3J, laminate 3 and laminate a3; component substrate, third adhesive layer and article>

[0255] Sometimes, a laminate having a component substrate, a third adhesive layer (described later), and an article in sequence is referred to as laminate 3. Additionally, a laminate having a component substrate and a third adhesive layer (described later) in sequence is sometimes referred to as laminate a3. A laminate having a component substrate and an article in sequence is sometimes referred to as laminate 3J. The article in the laminate of the present invention is preferably transferred from laminate 2 to the third adhesive layer of laminate a3. Laminate 2 is a laminate obtained by transferring an article onto a second substrate and a second adhesive layer using the present invention. The article in the laminate of the present invention is preferably transferred from laminate 2 to a component substrate. The component substrate preferably has wiring included in the component substrate.

[0256] In the laminate of the present invention, after an article is transferred from laminate 2 to the third adhesive layer of laminate a3, and the electrode terminals, etc., included in the article are electrically connected to the wiring included in laminate 3, from the viewpoint of conductivity control and insulation control, the component substrate is preferably a substrate having a semiconducting layer, and more preferably a substrate having a semiconductor layer. In laminate 3, when the electrode terminals, etc., included in the article transferred from the laminate of the present invention are electrically connected to the wiring included in laminate 3, laminate 3 preferably has an insulating layer. An insulating layer refers to a layer with a volume resistivity of 1.0 × 10⁻⁶. 8 Ω·cm~1.0×10 18 A layer of Ω·cm.

[0257] When an article in the laminate of the present invention is transferred from the laminate 2 to the component substrate, and the electrode terminals, etc., included in the article are electrically connected to the wiring included in the component substrate, from the viewpoint of conductivity control and insulation control, the component substrate is preferably a substrate having a semiconducting layer, and more preferably a substrate having a semiconductor layer. In the component substrate, when the electrode terminals, etc., included in the article transferred from the laminate of the present invention are electrically connected to the wiring included in the component substrate, the component substrate preferably has an insulating layer. An insulating layer refers to a layer with a volume resistivity of 1.0 × 10⁻⁶. 8 Ω·cm~1.0×10 18 A layer of Ω·cm.

[0258] Alternatively, it is preferable to use a component substrate as a support substrate and peel off a portion or all of the layers of the component substrate. This is suitable for chip-first (later RDL-last) manufacturing processes where a component substrate is used as a support substrate and semiconductor chips or other items are placed thereon after forming metal wiring or interlayer insulating layers, or for chip-last (first RDL-first) manufacturing processes where a component substrate is used as a support substrate and metal wiring or interlayer insulating layers are formed thereon after placing semiconductor chips or other items.

[0259] When a component substrate is used as a support substrate, from the viewpoint of improving impact resistance, the component substrate is preferably a layer having an inorganic substrate. Furthermore, from the viewpoint of improving flexibility and operability, the component substrate is preferably a layer having an organic substrate. In addition, the electrical connection between the electrode terminals, etc., included in the article and the wiring included in the component substrate is preferably solder bonding, bonding using anisotropic conductive films, or direct bonding. Direct bonding is preferably a hybrid bonding or other bonding achieved through plasma-based surface activation. The examples and preferred embodiments related to the transparent substrate, inorganic substrate, organic substrate, substrate with a semiconducting layer, and substrate with a semiconductor layer are the same as those for the first substrate and the donor substrate.

[0260] The third adhesive layer is preferably a layer of resin containing a polydialkylsiloxane structure within the structural units of the resin. Examples and preferred embodiments related to the polydialkylsiloxane structure are the same as those for the first adhesive layer. The third adhesive layer may also use existing materials such as conventional adhesive layers. Alternatively, the third adhesive layer may be a layer containing a conventional composition. Furthermore, the third adhesive layer may also be a layer containing the same composition as the first adhesive layer.

[0261] When the article transferred from the laminate of the present invention is a semiconductor chip and the semiconductor chip is the optical communication element, etc., the maximum transmittance of the third adhesive layer at wavelengths of 1300 nm to 1600 nm is preferably 60% or more, more preferably 70% or more, more preferably 80% or more, and particularly preferably 90% or more.

[0262] <Laminated body 1X, laminate a1x, laminate 1Y and laminate a1y; photosensitive composition and non-photosensitive composition>

[0263] The following describes compositions used to form a light-absorbing layer in a laminate according to a first embodiment of the present invention, and a light-absorbing layer or a first adhesive layer in a laminate according to a second embodiment of the present invention. The compositions are either photosensitive or non-photosensitive. However, the use of photosensitive or non-photosensitive compositions is not limited to the following embodiments, and various modifications can be made within the scope of achieving the inventive objective without departing from the spirit of the invention. Furthermore, the photosensitive composition is either a positive or negative photosensitive composition.

[0264] <(A) Adhesive Resin>

[0265] The composition preferably contains (A) binder resin. (A) binder resin is a heat-resistant resin that remains at least partially in the hardened product after the composition has been cured. (A) binder resin is preferably a resin that forms a cross-linked structure and hardens through a reaction. The reaction is not particularly limited to heating, irradiation with energy rays, etc., and the cross-linked structure can also be formed by the (F) cross-linking agent described later. (A) binder resin is preferably a thermosetting resin. (A) binder resin is preferably an alkali-soluble resin having an acidic group or an organic solvent-soluble resin having an organic solvent-soluble structure. (A) binder resin is preferably a resin that imparts positive or negative photosensitivity to the composition through the (C) photosensitizer described later and has solubility capable of forming positive or negative patterns. Examples and preferred formulations related to (A) binder resin are the same as those for (XA) binder resin in the light-absorbing layer.

[0266] <(B) Free radical polymerizable compounds>

[0267] The composition preferably also contains a (B) radical polymerizable compound (hereinafter referred to as (B) compound) and / or a (F) crosslinking agent. The (B) compound refers to a compound having a radical polymerizable group. Examples and preferred formulations related to the radical polymerizable group are the same as those for the (XA) adhesive resin in the light-absorbing layer. From the viewpoint of debris suppression and improved positional accuracy, the radical polymerizable group is preferably (meth)acryloyl. From the viewpoint of debris suppression and improved positional accuracy, the number of radical polymerizable groups in the (B) compound is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more. On the other hand, from the viewpoint of debris suppression and improved positional accuracy, the number of radical polymerizable groups is preferably 12 or less, more preferably 10 or less, even more preferably 8 or less, and particularly preferably 6 or less.

[0268] <(C) Photosensitive agent>

[0269] The photosensitive composition contains a (C) photosensitizer. The (C) photosensitizer refers to a compound that imparts positive or negative photosensitivity to the composition by generating another compound through bond breaking, reaction, or structural change during exposure. The (C) photosensitizer preferably comprises one or more compounds selected from the group consisting of (C1) naphthoquinone diazide compounds (hereinafter referred to as (C1) compounds), (C2) photopolymerization initiators (hereinafter referred to as (C2) compounds), (C3) photoacid generators, and (C4) photobase generators. In the aspect of forming a recess or opening of the light-absorbing layer in the laminate, which is the first aspect of the present invention, by alkaline development, it is suitable to impart positive photosensitivity to the composition. Furthermore, in the aspect of forming a recess or opening of the light-absorbing layer in the laminate, which is the second aspect of the present invention, and a recess or opening of the first adhesive layer, by alkaline development, it is suitable to impart positive photosensitivity to the composition.

[0270] The term (C1) compound refers to a compound that undergoes a structural change upon exposure to produce indene carboxylic acid and / or sulfonated indene carboxylic acid. For positive pattern formation, compounds containing (C1) compounds are suitable. During exposure, due to the acidic compound obtained through the structural change of the (C1) compound, the exposed portion of the film of the composition becomes selectively soluble in the alkaline developer, thus significantly improving debris suppression and positional accuracy. From the viewpoint of improving debris suppression and positional accuracy, the (C1) compound is preferably a compound having a 1,2-naphthoquinone diazido-5-sulfonate structure (hereinafter referred to as a 5-ester structure) and / or a compound having a 1,2-naphthoquinone diazido-4-sulfonate structure (hereinafter referred to as a 4-ester structure), more preferably a compound having both a 5-ester structure and a 4-ester structure. The (C1) compound is preferably a 5-ester structure or a 4-ester structure with phenolic hydroxyl groups.

[0271] The term (C2) compound refers to a compound that generates free radicals through bond breaking and / or reaction during exposure. Compounds containing (C2) compounds are suitable for negative pattern formation. During exposure, even if the free radicals generated by the (C2) compound are small, the free radical polymerization of the (B) compound and the like will proceed in a chain reaction, thus significantly improving debris suppression and positional accuracy. The (C2) compound is preferably a benzyl ketal compound, an α-hydroxy ketone compound, an α-amino ketone compound, a biimidazole compound, a phosphine oxide compound, an oxime ester compound, an acridine compound, a dicene compound, a benzophenone compound, an aromatic ketone ester compound, or a benzoate ester compound; from the viewpoint of debris suppression and improved positional accuracy, an oxime ester compound is more preferred. The oxime ester compound is preferably a compound containing an oxime ester structure (α-oxime structure) and / or a compound containing an oxime ester carbonyl structure (β-oxime structure).

[0272] The term "(C3) photoacid generator" refers to a compound that generates acid through bond breaking and / or reaction during exposure. Furthermore, (C3) compounds are distinct from (C1) compounds. From the viewpoint of promoting cationic polymerization, compounds containing (C3) compounds are suitable for negative pattern formation. On the other hand, in the case of resins or similar materials containing acidic groups protected by acid-dissociable groups, from the viewpoint of freeing these acidic groups through exposure, positive pattern formation is suitable, and the effect of increased sensitivity during exposure becomes significant. Examples of (C3) compounds include ionic and nonionic compounds. Ionic compounds are preferably triorganosulfonium salt compounds. Nonionic compounds are preferably halogen-containing compounds, diazomethane compounds, sulfone compounds, sulfonate compounds, carboxylic acid ester compounds, sulfonylimide compounds, phosphate ester compounds, or sulfobenzotriazole compounds.

[0273] The term "(C4) photoalkali generator" refers to a compound that generates alkali through bond breaking and / or reaction during exposure. From the perspective of promoting anionic polymerization, compounds containing (C4) are suitable for negative patterning. On the other hand, in the case of resins or similar materials containing acidic groups protected by alkali-dissociating groups, from the perspective of freeing these acidic groups through exposure, positive patterning is suitable, and the effect of increasing sensitivity during exposure becomes significant. Examples of (C4) compounds include ionic and nonionic compounds. Ionic compounds are preferably diazabicyclic olefin salts, triazabicyclic olefin salts, α-keto quaternary ammonium salts, benzyl quaternary ammonium salts, guanidine salts, or biguanidine salts. Ionic compounds are preferably those having a ketoprofen structure, an oxazanone structure, a benzofuran structure, or a naphthalene structure. The nonionic compounds are preferably nitrobenzyl carbamate compounds, anthraquinone carbamate compounds, benzoin-based carbamate compounds, anthraquinone-based carbamate compounds, hydroxycinnamamide compounds, or coumarin amide compounds.

[0274] <(Da) UV absorber and (Db) colorant>

[0275] The composition preferably also contains a (Da) ultraviolet absorber and / or a (Db) colorant. A (Da) ultraviolet absorber is a compound that absorbs light of wavelengths less than 380 nm in the ultraviolet region. A (Db) colorant is a compound that colors light by absorbing wavelengths of visible light (380 nm to 780 nm). Coloring refers to exhibiting red, orange, yellow, green, blue, or purple hues. Examples and preferred descriptions related to the (Da) ultraviolet absorber and (Db) colorant are the same as those for the (XDa) ultraviolet absorber and (XDb) colorant in the light-absorbing layer. Furthermore, similar to the (XDa) ultraviolet absorber with a specific structure in the light-absorbing layer, the (Da) ultraviolet absorber with a specific structure is a resin different from the (A) adhesive resin, but the (Da) ultraviolet absorber with a specific structure is equivalent to both the (Da) ultraviolet absorber and the (A) adhesive resin. That is, when the composition contains a (Da) ultraviolet absorber with a specific structure, the composition contains both the (Da) ultraviolet absorber and the (A) adhesive resin.

[0276] <(E) Dispersant>

[0277] From the viewpoint of improving the dispersion stability of pigments, the composition preferably also contains an (E) dispersant. An (E) dispersant refers to a compound having structures that interact with the pigment surface and structures that prevent pigments from approaching each other. The (E) dispersant is preferably a basic group, an acidic group, or a salt thereof, and more preferably a basic group or a salt thereof.

[0278] <(F) Crosslinking agent>

[0279] The composition preferably also contains compound (B) and / or crosslinking agent (F). The crosslinking agent (F) refers to a compound having a crosslinking group, cationic polymerizable group, or anionic polymerizable group capable of reacting with resins, etc. From the viewpoint of debris suppression and improved positional accuracy, the crosslinking agent (F) preferably has one or more groups selected from the group consisting of alkoxyalkyl, hydroxyalkyl, epoxy, oxetyl, and block isocyanate groups (hereinafter referred to as specific crosslinking groups). Alkoxyalkyl is preferably alkoxymethyl or alkoxyethyl, more preferably methoxymethyl or methoxyethyl. Hydroxyalkyl is preferably hydroxymethyl or hydroxyethyl. From the viewpoint of debris suppression and improved positional accuracy, the number of specific crosslinking groups in the crosslinking agent (F) is preferably 2 or more, more preferably 3 or more, further preferably 4 or more, and particularly preferably 6 or more. On the other hand, from the viewpoint of debris suppression and improved positional accuracy, the number of specific crosslinking groups is preferably 12 or less, more preferably 10 or less, and further preferably 8 or less.

[0280] <Other Additives and Solvents>

[0281] The composition also preferably contains a solubility promoter, sensitizer, chain transfer agent, polymerization inhibitor, silane coupling agent, ink remover, or surfactant. Existing additives may also be used. The composition also preferably contains a solvent. When the composition contains a pigment and also a dispersant, from the viewpoint of improving the dispersion stability of the pigment, the solvent is preferably a compound having an acetate bond, propionate bond, or butyrate bond.

[0282] <Method for manufacturing laminates (Laminated Body 1X)>

[0283] Hereinafter, methods for manufacturing laminates according to the third, fourth, fifth, sixth, seventh, and eighth embodiments of the present invention will be described. Furthermore, when describing methods for manufacturing laminates according to the present invention, the description relates to methods for manufacturing laminates according to the third, fourth, fifth, sixth, seventh, and eighth embodiments of the present invention. On the other hand, when describing methods for manufacturing laminates according to specific embodiments, methods for manufacturing laminates according to third embodiments of the present invention will be described. However, the present invention is not limited to the following embodiments, and various modifications can be made within the scope of achieving the inventive objective without departing from the spirit of the invention.

[0284] The method for manufacturing a laminate, as a third-party embodiment of the present invention, has the structure described in [1]. By adopting the structure described above, the method for manufacturing a laminate, as a third-party embodiment of the present invention, can combine debris suppression during the transfer of articles such as semiconductor chips with excellent positional accuracy, and can obtain display devices or semiconductor devices with high precision. This means that since a recess is formed in the light-absorbing layer, the volume of the light-absorbing layer is reduced compared to the case where no recess is formed. As a result, based on the same reason as the laminate as the first embodiment of the present invention, it is presumed that the effect of debris suppression and the effect of excellent positional accuracy are achieved. In addition, it is believed that since the article is transferred by irradiating active chemical rays with a gap provided between the first substrate and the second substrate, the light-absorbing layer evaporated during etching is efficiently released outside the system. As a result, re-attachment on the second substrate after etching can be reduced, and therefore it is presumed that the effect of debris suppression is achieved. Furthermore, it is believed that by achieving the effect of debris suppression or the effect of excellent positional accuracy, the light-emitting characteristics of semiconductor chips, etc. are improved. That is, the light extraction efficiency from semiconductor chips, etc. is improved, and it is presumed that the effect of excellent light-emitting brightness is achieved.

[0285] <Method for manufacturing laminates (Laminated Body 1X)>

[0286] The method for manufacturing a laminate, as a fourth aspect of the present invention, includes:

[0287] (10) A process for preparing a laminate a1x having a first substrate and a light-absorbing layer in sequence;

[0288] (12) A process of temporarily fixing articles to the light-absorbing layer (hereinafter referred to as process (12)); and (13) A process of patterning the light-absorbing layer (hereinafter referred to as process (13)). In the method for manufacturing the laminate, in process (12), there are multiple articles in contact with the light-absorbing layer, and in process (13), the light-absorbing layer has a recess, and in process (13), the compressive modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 Pa and / or in the process of (13), the glass transition temperature of the light absorption layer is -50°C to 150°C.

[0289] By adopting the aforementioned structure, the manufacturing method of the laminate, as a fourth aspect of the present invention, can simultaneously achieve debris suppression and excellent positional accuracy during the transfer of semiconductor chips and other articles, enabling the production of display devices or semiconductor devices with high precision. This means that because a recess is formed in the light-absorbing layer, the volume of the light-absorbing layer is reduced compared to the case where no recess is formed. As a result, based on the same reasons as for the laminate as the first aspect of the present invention, it is presumed that both debris suppression and excellent positional accuracy are achieved. Furthermore, it is believed that because the indentation elastic modulus of the light-absorbing layer is within a specific range and / or the glass transition temperature of the light-absorbing layer is within a specific range, the force with which the light-absorbing layer holds the article can be appropriately maintained, thereby suppressing excessive adhesion between the light-absorbing layer and the article. As a result, based on the same reasons as for the laminate as the first aspect of the present invention, it is presumed that both debris suppression and excellent positional accuracy are achieved. Moreover, it is believed that by achieving the effects of debris suppression or excellent positional accuracy, the light-emitting characteristics of semiconductor chips and the like are improved. That is, the light extraction efficiency from semiconductor chips and the like is improved, presumably resulting in excellent light-emitting brightness.

[0290] <Manufacturing Method of Laminated Body (Laminated Body 1Y)>

[0291] The method for manufacturing a laminate, as a fifth aspect of the present invention, includes:

[0292] (10y) A process for preparing a laminate a1y having a first substrate, a light-absorbing layer and a first adhesive layer in sequence;

[0293] (12y) The process of temporarily fixing the item to the first adhesive layer (hereinafter referred to as the (12y) process);

[0294] (13y) The process of patterning the light-absorbing layer and the first adhesive layer (hereinafter referred to as the (13y) process);

[0295] (20) A process for preparing a laminate a2 having a second substrate and a second adhesive layer in sequence; and

[0296] (22y) In the process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer with a gap provided between the article included in the first substrate and the second adhesive layer included in the second substrate, and transferring the article from the first adhesive layer to the second adhesive layer (hereinafter referred to as the (22y) process), in the method for manufacturing the laminate,

[0297] In the (12y) process, there are multiple articles in contact with the first adhesive layer, and in the (13y) process, a recess is formed in the light-absorbing layer and the first adhesive layer.

[0298] By adopting the aforementioned structure, the manufacturing method of the laminate, as the fifth aspect of the present invention, can simultaneously achieve debris suppression and excellent positional accuracy during the transfer of articles such as semiconductor chips, enabling the production of display devices or semiconductor devices with high precision. This means that because recesses are formed in the light-absorbing layer and the first adhesive layer, the volume of the light-absorbing layer and the first adhesive layer is reduced compared to the case where no recesses are formed. As a result, based on the same reasons as for the laminate as the first aspect of the present invention, it is presumed that both debris suppression and excellent positional accuracy are achieved. Furthermore, it is believed that since the article is transferred by irradiating with active chemical rays while a gap is provided between the first and second substrates, the light-absorbing layer and / or the first adhesive layer evaporated during etching are efficiently released outside the system. As a result, re-attachment on the second substrate after etching is reduced, thus presumably achieving debris suppression. Moreover, it is believed that by achieving the aforementioned debris suppression effect or excellent positional accuracy, the light-emitting characteristics of the semiconductor chip, etc., are improved. That is, the light extraction efficiency from the semiconductor chip, etc., is improved, presumably achieving excellent light brightness.

[0299] <Manufacturing Method of Laminated Body (Laminated Body 1Y)>

[0300] The method for manufacturing a laminate, as a sixth aspect of the present invention, includes:

[0301] (10y) A process for preparing a laminate a1y having a first substrate, a light-absorbing layer and a first adhesive layer in sequence;

[0302] (12y) The process of temporarily fixing the item to the first adhesive layer (hereinafter referred to as the (12y) process);

[0303] (13y) A process for patterning the light-absorbing layer and the first adhesive layer (hereinafter referred to as the (13y) process), wherein in the method for manufacturing the laminate, in the (12y) process, a plurality of articles are connected to the first adhesive layer, and in the (13y) process, a recess is formed in the light-absorbing layer and the first adhesive layer.

[0304] In the (13y) process, the compressive elastic modulus of the first adhesive layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 Pa and / or in the (13y) process, the glass transition temperature of the first adhesive layer is -50°C to 150°C.

[0305] By adopting the aforementioned structure, the manufacturing method of the laminate, as the sixth aspect of the present invention, can combine debris suppression during the transfer of semiconductor chips and other articles with excellent positional accuracy, enabling the production of display devices or semiconductor devices with high precision. This means that because recesses are formed in the light-absorbing layer and the first adhesive layer, the volume of the light-absorbing layer and the first adhesive layer is reduced compared to the case where no recesses are formed. As a result, based on the same reasons as for the laminate as the first aspect of the present invention, it is presumed that both debris suppression and excellent positional accuracy are achieved. Furthermore, it is believed that by achieving the effects of debris suppression and excellent positional accuracy, the light-emitting characteristics of the semiconductor chip, etc., are improved. That is, the light extraction efficiency from the semiconductor chip, etc., is improved, and it is presumed that excellent light-emitting brightness is achieved.

[0306] The method for manufacturing a laminate as a seventh aspect of the present invention has the structure described in

[10] . That is, the method for manufacturing a laminate as a seventh aspect of the present invention has:

[0307] (10) A process for preparing a laminate a1x having a first substrate and a light-absorbing layer in sequence;

[0308] (12z) The process of temporarily fixing an item to the light-absorbing layer and patterning the light-absorbing layer (hereinafter referred to as the (12z) process).

[0309] (20) A process for preparing a laminate a2 having a second substrate and a second adhesive layer in sequence; and

[0310] (22) In the process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer and transferring the article from the light-absorbing layer to the second adhesive layer with a gap provided between the article included in the first substrate and the second adhesive layer included in the second substrate (hereinafter referred to as the (22) process), in the method of manufacturing the laminate, in the (12z) process, there are a plurality of articles in contact with the light-absorbing layer, and in the (12z) process, a recess is formed in the light-absorbing layer.

[0311] By adopting the aforementioned structure, the method for manufacturing a laminate as the seventh aspect of the present invention, for the same reasons as the method for manufacturing a laminate as the third aspect of the present invention, is expected to achieve effects such as debris suppression and excellent positional accuracy. Furthermore, for the same reasons, it is believed that the light-emitting characteristics of semiconductor chips, etc., are improved. That is, the light extraction efficiency from semiconductor chips, etc., is improved, and it is expected to achieve excellent light-emitting brightness.

[0312] The method for manufacturing a laminate, as the eighth aspect of the present invention, includes:

[0313] (10) A process for preparing a laminate a1x having a first substrate and a light-absorbing layer in sequence; and

[0314] (12z) The process of temporarily fixing an article to the light-absorbing layer and patterning the light-absorbing layer (hereinafter referred to as the (12z) process), in the manufacturing method of the laminate,

[0315] In the (12z) process, there are multiple articles in contact with the light-absorbing layer, and in the (12z) process, a recess is formed in the light-absorbing layer.

[0316] In the (12z) process, the compressive elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 Pa and / or in the (12z) process, the glass transition temperature of the light-absorbing layer is -50°C to 150°C.

[0317] By adopting the aforementioned structure, the method for manufacturing a laminate as the eighth aspect of the present invention, for the same reasons as the method for manufacturing a laminate as the fourth aspect of the present invention, is expected to achieve effects such as debris suppression and excellent positional accuracy. Furthermore, for the same reasons, it is believed that the light-emitting characteristics of semiconductor chips, etc., are improved. That is, the light extraction efficiency from semiconductor chips, etc., is improved, and it is expected to achieve excellent light-emitting brightness.

[0318] <Substrate preparation process; Steps for preparing laminate>

[0319] The manufacturing method of the laminate of the present invention preferably includes the following steps: preparing a laminate OA having an application substrate and articles in sequence. The laminate OA preferably has multiple articles.

[0320] Examples and preferred embodiments related to laminate 0A are described above. The process of preparing these laminates can also be a process of manufacturing and preparing laminates. Alternatively, the process of preparing these laminates can also be a process of preparing a manufactured laminate.

[0321] <Substrate; Process for forming an article>

[0322] The method for manufacturing the laminate of the present invention may include a (01) step, namely, a step of forming an article on a substrate. The method for manufacturing the laminate of the present invention preferably includes a plurality of articles in the (01) step. Examples and preferences related to the substrate and articles are described above. The term "a plurality of articles in the (01) step" refers to the state after the (01) step. That is, in the (01) step, a plurality of articles are formed on the substrate. The (01) step of forming an article on the substrate is preferably a step of forming a semiconductor chip on the substrate. Methods for forming articles in these steps include, for example, forming one or more methods selected from the group consisting of conductive layers, insulating layers, and semiconductive layers, and preferably forming one or more methods selected from the group consisting of conductive inorganic layers, insulating resin layers, insulating inorganic layers, and semiconductor layers.

[0323] <Zero substrate; Process for preparing the laminate>

[0324] The manufacturing method of the laminate of the present invention preferably includes a step of preparing a laminate a0 having a zeroth substrate and a zeroth adhesive layer in sequence. The manufacturing method of the laminate of the present invention preferably includes a step of preparing a laminate OB having a zeroth substrate, a zeroth adhesive layer, and an article in sequence. The laminate OB preferably has multiple articles. Examples and preferences related to laminate a0 and laminate OB are described above. The step of preparing these laminates can also be a step of manufacturing and preparing laminates. Alternatively, the step of preparing these laminates can also be a step of preparing a manufactured laminate.

[0325] <Process for forming the zeroth substrate and the zeroth adhesive layer>

[0326] The preferred method for manufacturing the laminate of the present invention includes a step (02) of forming a temporary fixing layer on a zeroth substrate. Examples and preferred embodiments related to the zeroth adhesive layer are described above. As methods for forming the zeroth adhesive layer in these steps, for example, methods of coating a composition or methods of preparing a film containing the composition can be listed. Examples and preferred embodiments related to these methods are the same as those for step (11) described later.

[0327] <Zero substrate; process for temporarily fixing an item>

[0328] The manufacturing method of the laminate of the present invention preferably includes a step (03) of temporarily fixing articles to the zeroth adhesive layer (hereinafter referred to as step (03)). The manufacturing method of the laminate of the present invention is more preferably provided with step (01) and step (03). The manufacturing method of the laminate of the present invention preferably includes a plurality of articles in contact with the zeroth adhesive layer in step (03).

[0329] Examples and preferred descriptions related to the articles are as described above. The term "having multiple articles in process (03)" refers to the state after process (03). That is, in process (03), multiple articles are temporarily fixed to the zeroth adhesive layer. Process (03) preferably includes a process in which (03a) active chemical rays are irradiated onto the article from the applicant substrate side while the article included in the applicant substrate is in contact with the zeroth adhesive layer included in the zeroth substrate (hereinafter referred to as process (03a)) or a process in which active chemical rays are irradiated onto the article from the applicant substrate side while a gap is provided between the article included in the applicant substrate and the zeroth adhesive layer included in the zeroth substrate (hereinafter referred to as process (03b)).

[0330] From the viewpoint of reducing process time, steps (03a) and (03b) are preferably performed by transferring multiple articles included in the substrate from the substrate to the zero adhesive layer in one step. Alternatively, it is also preferable to transfer the multiple articles included in the substrate from the substrate to the zero adhesive layer in two or more steps, or more preferably by performing the transfer sequentially in two or more steps. Sequential transfer of multiple articles means transferring multiple articles one by one continuously. In the aspect of transferring articles from the substrate to the zero adhesive layer in step (03a) or (03b), it is suitable that the substrate has the photodecomposition layer, or that the laminate OA has the photodecomposition layer.

[0331] (03) The process is preferably performed before process (03a) or process (03b), and includes a process of contacting and bonding the article included in the substrate with the zero adhesive layer included in the zero substrate. (03) The process is more preferably performed after these processes, and even more preferably, includes a process of hot pressing. The examples and preferred descriptions related to the heating process and the hot pressing process are the same as the examples and preferred descriptions of the process of temporarily fixing the article to the light-absorbing layer in (12) described later.

[0332] <First substrate; Process for preparing the laminate>

[0333] The manufacturing methods of the laminates according to the third, fourth, seventh, and eighth embodiments of the present invention include a step (10) of preparing a laminate a1x having a first substrate and a light-absorbing layer in sequence. The manufacturing methods of the laminates according to the fifth and sixth embodiments of the present invention include a step (10y) of preparing a laminate a1y having a first substrate, a light-absorbing layer, and a first adhesive layer in sequence. The manufacturing methods of the laminates according to the third, fourth, seventh, and eighth embodiments of the present invention preferably include a step (1X) of preparing a laminate 1X, which is a laminate of the present invention. The manufacturing methods of the laminates according to the fifth and sixth embodiments of the present invention preferably include a step (1Xy) of preparing a laminate 1Y, which is a laminate of the present invention. Examples and preferences related to laminate a1x, laminate a1y, laminate 1X, and laminate 1Y are described above. The process of preparing these laminates may also be a process of manufacturing and preparing laminates. In addition, the process of preparing these laminates may also be a process of preparing a manufactured laminate.

[0334] <First substrate; Process for forming a light-absorbing layer>

[0335] The manufacturing methods of the laminates according to the third, fourth, seventh, and eighth embodiments of the present invention preferably include a step of forming a light-absorbing layer on the first substrate (11). The manufacturing methods of the laminates according to the fifth and sixth embodiments of the present invention preferably include a step of forming a light-absorbing layer on the first substrate (11y-1).

[0336] Examples and preferred embodiments related to the first substrate and the light-absorbing layer are described above. Methods for forming the light-absorbing layer in these processes include, for example, methods of coating a composition or methods of preparing a film containing the composition. Methods of coating the composition include, for example, spin coating, curtain coating, spray coating, or slot coating. Furthermore, a pre-baking method after coating the composition is preferred. The pre-baking temperature is preferably 50°C to 150°C. The pre-baking time is preferably 30 seconds to 10 minutes. Methods of preparing a film containing the composition include, for example, methods of hot-pressing the film containing the composition. Hot-pressing is preferably a hot pressing process, a hot lamination process, or a hot vacuum lamination process.

[0337] The preferred method is to perform post-baking after coating the composition and pre-baking. Alternatively, it is also preferred to perform post-baking after hot-pressing the film containing the composition to bond it. The post-baking temperature is preferably above 150°C to 300°C. The post-baking time is preferably 5 minutes to 300 minutes. Examples of processing environments include: air, oxygen, nitrogen, helium, neon, argon, krypton, or xenon; a gaseous environment containing 1 ppm to 10,000 ppm (0.0001% to 1%) of oxygen; or a vacuum. The pre-baking and post-baking methods can involve two or more stages of heating. The pre-baking and post-baking methods can utilize ovens, heating plates, infrared radiation, flash annealing devices, or laser annealing devices, etc.

[0338] <First substrate; process of forming the first adhesive layer>

[0339] The manufacturing method of the laminate as the fifth and sixth embodiments of the present invention preferably includes a step of forming a first adhesive layer in contact with the light-absorbing layer (11y-2). Examples and preferred embodiments related to the first adhesive layer are described above. As a method for forming the first adhesive layer in these steps, for example, methods of coating a composition or methods of preparing a film containing the composition can be listed. Examples and preferred embodiments related to these methods are the same as those for step (11).

[0340] <First substrate; process of irradiating the light-absorbing layer and / or the first adhesive layer with active chemical rays>

[0341] From the viewpoint of reducing laser irradiation energy and improving positional accuracy, the manufacturing method of the laminate as the third and fourth embodiments of the present invention preferably includes a step of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer (hereinafter referred to as the (11z) step) before the (12) step described later. From the viewpoint of reducing laser irradiation energy and improving positional accuracy, the manufacturing method of the laminate as the seventh and eighth embodiments of the present invention preferably includes the (11z) step before the (12z) step described later. When the manufacturing method of the laminate as the third, fourth, seventh, and eighth embodiments of the present invention includes the (11z) step, from the viewpoint of the effect of the invention, it is preferable that the condition described in (b) is satisfied in the (13) step.

[0342] From the viewpoint of reducing laser irradiation energy and improving positional accuracy, the manufacturing method of the laminate as the fifth and sixth embodiments of the present invention preferably includes, before the (12y) step described later, a step of irradiating the light-absorbing layer and the first adhesive layer with active chemical rays from the first substrate side of the light-absorbing layer (hereinafter referred to as the (11zy) step). When the manufacturing method of the laminate as the fifth and sixth embodiments of the present invention includes the (11zy) step, from the viewpoint of the effect of the invention, it is preferable that the conditions described in (by) are met in the (13y) step.

[0343] When the light-absorbing layer and / or the first adhesive layer are layers containing a negatively photosensitive composition, partial photocuring is performed by irradiation with active chemical rays, increasing the degree of cross-linking in these layers. Therefore, it is believed that when temporarily fixing the article to these layers, the article is prevented from being buried in the light-absorbing layer or the first adhesive layer. As a result, when transferring the article from the light-absorbing layer or the first adhesive layer, the transfer can be performed with less energy, and thus, based on the stable behavior of the article during transfer, the absolute value of the deviation of the irradiation energy is also reduced, and the effect of excellent positional accuracy is expected to become significant. The examples and preferred descriptions related to the process of irradiating active chemical rays in these processes are the same as the examples and preferred descriptions of process (14) and (14y) described later.

[0344] <First substrate; process for temporarily fixing the item>

[0345] The manufacturing methods of the laminated body according to the third and fourth embodiments of the present invention include a step (12) of temporarily fixing an article to the light-absorbing layer (hereinafter referred to as step (12)). The manufacturing methods of the laminated body according to the fifth and sixth embodiments of the present invention include a step (12y) of temporarily fixing an article to the first adhesive layer (hereinafter referred to as step (12y)). The manufacturing methods of the laminated body according to the seventh and eighth embodiments of the present invention include a step (12z) of temporarily fixing an article to the light-absorbing layer and patterning the light-absorbing layer (hereinafter referred to as step (12z)).

[0346] The manufacturing methods of the laminate according to the third and fourth embodiments of the present invention include, in step (12), a plurality of articles in contact with the light-absorbing layer. The manufacturing methods of the laminate according to the fifth and sixth embodiments of the present invention include, in step (12y), a plurality of articles in contact with the first adhesive layer. The manufacturing methods of the laminate according to the seventh and eighth embodiments of the present invention include, in step (12z), a plurality of articles in contact with the light-absorbing layer.

[0347] Examples and preferred descriptions related to the articles are as described above. The phrase "having multiple articles in contact with the light-absorbing layer in step (12)" refers to the state after step (12). The phrase "having multiple articles in contact with the first adhesive layer in step (12y)" refers to the state after step (12y). The phrase "having multiple articles in contact with the light-absorbing layer in step (12z)" refers to the state after step (12z). That is, in step (12), multiple articles are temporarily fixed to the light-absorbing layer. Furthermore, in step (12y), multiple articles are temporarily fixed to the first adhesive layer. Furthermore, in step (12z), multiple articles are temporarily fixed to the light-absorbing layer.

[0348] Furthermore, in the manufacturing method of the laminate according to the seventh and eighth embodiments of the present invention, a recess is formed in the light-absorbing layer during the (12z) step. Forming a recess in the light-absorbing layer during the (12z) step means that the layer is processed to this state during the (12z) step. That is, in the (12z) step, a recess is formed in the light-absorbing layer by patterning the light-absorbing layer. Additionally, in the (12z) step, it is preferable that the light-absorbing layer has an opening by patterning the light-absorbing layer. In the (12z) step, the light-absorbing layer preferably satisfies any one of the conditions (p) and (q) below.

[0349] (p) A recess is formed in the light-absorbing layer, where at least a portion of the light-absorbing layer is removed, resulting in a reduced thickness.

[0350] (q) A recess is formed in the light absorption layer, and the recess is an opening.

[0351] The manufacturing methods of the laminates according to the third and fourth embodiments of the present invention are preferably including the (01) step and the (12) step. The manufacturing methods of the laminates according to the third and fourth embodiments of the present invention are also preferably including the (01) step and the (03) step and the (12) step. The manufacturing methods of the laminates according to the fifth and sixth embodiments of the present invention are preferably including the (01) step and the (12y) step. The manufacturing methods of the laminates according to the fifth and sixth embodiments of the present invention are also preferably including the (01) step and the (03) step and the (12y) step. The manufacturing methods of the laminates according to the seventh and eighth embodiments of the present invention are preferably including the (01) step and the (12z) step. The manufacturing methods of the laminates according to the seventh and eighth embodiments of the present invention are also preferably including the (01) step and the (03) step and the (12z) step.

[0352] <The process of temporarily fixing the item (the process of transferring the item by irradiating it with reactive chemical rays)>

[0353] (12) The process preferably includes (12a) irradiating the article with active chemical rays from the side of the article on the side of the application substrate while the article included in the application substrate is in contact with the light-absorbing layer included in the first substrate and transferring the article from the application substrate to the light-absorbing layer (hereinafter referred to as process (12a)) or (12b) irradiating the article with active chemical rays from the side of the article on the side of the application substrate while a gap is provided between the article included in the application substrate and the light-absorbing layer included in the first substrate and transferring the article from the application substrate to the light-absorbing layer (hereinafter referred to as process (12b)).

[0354] From the viewpoint of reducing process time, steps (12a) and (12b) are preferably performed by transferring multiple articles included in the substrate from the substrate to the light-absorbing layer in one step. Alternatively, it is also preferable to transfer the multiple articles included in the substrate from the substrate to the light-absorbing layer in two or more steps, or even more preferably to perform the transfer sequentially in two or more steps. Sequential transfer of multiple articles means transferring multiple articles one by one continuously. In the aspect of transferring articles from the substrate to the light-absorbing layer in step (12a) or (12b), it is suitable that the substrate has the light-decomposing layer, or that the laminate 0A has the light-decomposing layer.

[0355] The (12y) process preferably includes a process in which (12ya) an active chemical ray is irradiated onto the article from the applicant substrate side while the article included in the applicant substrate is in contact with the first adhesive layer included in the first substrate and the article is transferred from the applicant substrate to the first adhesive layer (hereinafter referred to as the (12ya) process), or a process in which an active chemical ray is irradiated onto the article from the applicant substrate side while a gap is provided between the article included in the applicant substrate and the first adhesive layer included in the first substrate and the article is transferred from the applicant substrate to the first adhesive layer (hereinafter referred to as the (12yb) process).

[0356] From the viewpoint of reducing process time, the (12ya) and (12yb) processes preferably involve transferring multiple articles included in the substrate from the substrate to the first adhesive layer in a single transfer. Alternatively, it is also preferable to transfer the multiple articles included in the substrate from the substrate to the first adhesive layer in two or more separate transfers, or even more preferably, to perform the transfer sequentially in two or more separate transfers. Sequential transfer of multiple articles means transferring multiple articles one by one continuously. In the (12ya) or (12yb) process, it is advantageous that the substrate has the photodecomposition layer, or that the laminate 0A has the photodecomposition layer.

[0357] The (12z) process preferably includes a process in which (12za) an active chemical ray is irradiated onto the article from the applicant substrate side while the article included in the applicant substrate is in contact with the light-absorbing layer included in the first substrate, and the article is transferred from the applicant substrate to the light-absorbing layer and patterned on the light-absorbing layer (hereinafter referred to as the (12za) process), or a process in which an active chemical ray is irradiated onto the article from the applicant substrate side while a gap is provided between the article included in the applicant substrate and the light-absorbing layer included in the first substrate, and the article is transferred from the applicant substrate to the light-absorbing layer and patterned on the light-absorbing layer (hereinafter referred to as the (12zb) process).

[0358] From the viewpoint of reducing process time, the (12za) and (12zb) processes preferably involve transferring multiple articles included in the substrate from the substrate to the light-absorbing layer in a single step. Alternatively, it is also preferable to transfer the multiple articles included in the substrate from the substrate to the light-absorbing layer in two or more separate steps, or even more preferably to perform the transfer sequentially in two or more separate steps. Sequential transfer of multiple articles means transferring multiple articles one by one continuously. In the (12za) or (12zb) process, it is advantageous that the substrate has the light-decomposing layer, or that the laminate 0A has the light-decomposing layer.

[0359] In steps (12a), (12b), (12ya), and (12yb), it is also preferable to irradiate the article with active chemical rays from the substrate side of the article through a photomask. From the viewpoint of suppressing the deterioration of the light-absorbing layer and / or the first adhesive layer caused by the active chemical rays, it is preferable that the photomask includes a light-transmitting portion and a light-shielding portion, and the area of ​​the light-transmitting portion is within the area of ​​the substrate including the article, more preferably corresponding to the area including the article. In addition, the area of ​​the light-shielding portion is preferably above the area of ​​the substrate excluding the article, more preferably corresponding to the area excluding the article. The examples and preferred descriptions related to the steps of irradiating active chemical rays in these steps are the same as the examples and preferred descriptions of steps (22) and (22y) described later.

[0360] From the viewpoints of reducing process time, reducing laser irradiation energy, suppressing debris, and improving positional accuracy, steps (12a), (12b), (12za), and (12zb) are preferably performed by irradiating the light-absorbing layer with active chemical rays using the article as a mask, thereby removing at least a portion of the light-absorbing layer irradiated with active chemical rays. From the viewpoints of the same invention's effects, steps (12ya) and (12yb) are preferably performed by irradiating the first adhesive layer with active chemical rays using the article as a mask, thereby removing at least a portion of the first adhesive layer irradiated with active chemical rays. Furthermore, from the viewpoints of the same invention's effects, steps (12ya) and (12yb) are more preferably performed by irradiating both the light-absorbing layer and the first adhesive layer with active chemical rays using the article as a mask, and more preferably by removing at least a portion of the light-absorbing layer irradiated with active chemical rays and at least a portion of the first adhesive layer in contact with the light-absorbing layer.

[0361] In step (12), the light-absorbing layer is preferably one of the following conditions (p) and (q).

[0362] (p) A recess is formed in the light-absorbing layer, where at least a portion of the light-absorbing layer is removed, resulting in a reduced thickness.

[0363] (q) A recess is formed in the light absorption layer, and the recess is an opening.

[0364] In the (12y) process, the light-absorbing layer and the first adhesive layer are preferably either (py) or (qy) that satisfy the following conditions.

[0365] (py) A recess is formed in the light-absorbing layer and the first adhesive layer, the recess being the opening of the first adhesive layer, and at least a portion of the light-absorbing layer is removed at the recess, resulting in a reduced thickness.

[0366] (qy) A recess is formed in the light-absorbing layer and the first adhesive layer, and the recess is an opening.

[0367] In steps (12a), (12b), (12za), or (12zb), if the light-absorbing layer satisfies the condition described in (p), it is preferable that at least a portion of the light-absorbing layer irradiated with active chemical rays is removed, resulting in a reduced thickness. In steps (12a), (12b), (12za), or (12zb), if the light-absorbing layer satisfies the condition described in (q), it is preferable that at least a portion of the light-absorbing layer irradiated with active chemical rays is removed, resulting in an opening.

[0368] In this configuration, the manufacturing method of the laminate as the seventh and eighth embodiments of the present invention is preferably without step (13) described later. In step (12za) or step (12zb) of the manufacturing method of the laminate as the seventh and eighth embodiments of the present invention, at least a portion of the light-absorbing layer irradiated with active chemical rays is removed. As a result, step (13) or step (13y) described later is unnecessary, and thus the effect of reducing process time becomes significant.

[0369] In the manufacturing method of the laminate as the third and fourth embodiments of the present invention, if the conditions of (a) described later are met in step (13), from the viewpoints of reducing process time, reducing laser irradiation energy, suppressing debris, and improving positional accuracy, steps (12a) and (12b) are preferably performed by irradiating the light-absorbing layer with active chemical rays as a mask. In this case, step (13a) described later is also preferably without step (13a-1) described later.

[0370] When the manufacturing method of the laminate, which is the fifth and sixth aspect of the present invention, satisfies the conditions described later in step (13y), from the viewpoint of the same inventive effect, steps (12ya) and (12yb) preferably irradiate the light-absorbing layer with active chemical rays as a mask. From the viewpoint of the same inventive effect, steps (12ya) and (12yb) also preferably irradiate the light-absorbing layer and the first adhesive layer with active chemical rays as a mask. In this structure, step (13ya) described later is also preferably without step (13ya-1) described later.

[0371] When the light-absorbing layer and / or the first adhesive layer are layers containing a positive photosensitive composition, the light-absorbing layer and / or the first adhesive layer are also irradiated with active chemical rays in steps (12a), (12b), (12ya), or (12yb), causing bond breaking, reaction, or structural change of the photosensitizer and making it alkali-soluble. As a result, steps (13a-1) or (13ya-1) in steps (13a) or (13ya) described later are unnecessary, thus significantly reducing process time.

[0372] In the manufacturing methods of the laminates according to the third, fourth, seventh, and eighth embodiments of the present invention, "removing at least a portion of the light-absorbing layer" means that the thickness of the light-absorbing layer is reduced. Preferably, at least a portion of the light-absorbing layer is removed and a recess is formed in the light-absorbing layer; more preferably, the light-absorbing layer exists as a plurality of convex light-absorbing layers and a recessed light-absorbing layer, and the thickness of the recessed light-absorbing layer is less than the thickness of the plurality of convex light-absorbing layers. Furthermore, it is preferable that at least a portion of the light-absorbing layer is removed, exposing at least a portion of the first substrate; more preferably, the light-absorbing layer at the corresponding location is completely removed. Additionally, it is particularly preferable that at least a portion of the light-absorbing layer is removed and the light-absorbing layer exists as a plurality of island-shaped light-absorbing layers.

[0373] In the manufacturing methods of the laminate as the fifth and sixth embodiments of the present invention, the removal of at least a portion of the light-absorbing layer and at least a portion of the first adhesive layer means that the thickness of the light-absorbing layer and the thickness of the first adhesive layer become smaller. Preferably, at least a portion of the light-absorbing layer and at least a portion of the first adhesive layer are removed, and a recess is formed in the light-absorbing layer and the first adhesive layer. More preferably, the light-absorbing layer exists as a plurality of convex light-absorbing layers and a recessed light-absorbing layer, and the thickness of the recessed light-absorbing layer is less than the thickness of the plurality of convex light-absorbing layers, and the first adhesive layer exists as a first adhesive layer for the plurality of convex portions. Furthermore, it is preferable that at least a portion of the light-absorbing layer and at least a portion of the first adhesive layer are removed, exposing at least a portion of the first substrate. More preferably, the first adhesive layer at the corresponding portion is completely removed, and even more preferably, the light-absorbing layer and the first adhesive layer at the corresponding portion are completely removed. Additionally, it is particularly preferable that at least a portion of the light-absorbing layer and at least a portion of the first adhesive layer are removed, and the light-absorbing layer and the first adhesive layer exist as a plurality of island-shaped light-absorbing layers and a plurality of island-shaped first adhesive layers.

[0374] As described above, by patterning the portion of the article that is not in contact with the light-absorbing layer and / or the first adhesive layer as a recess or as an opening, the volume of the light-absorbing layer and / or the first adhesive layer can be reduced. It is more suitable to have a light-absorbing layer and / or the first adhesive layer having a recess formed by such patterning, or a light-absorbing layer and / or the first adhesive layer having an opening formed by patterning, where the effect of debris suppression or excellent positional accuracy based on the aforementioned speculation mechanism becomes significant.

[0375] The thickness of the light-absorbing layer after at least a portion is removed is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. Furthermore, it is also preferable that the light-absorbing layer at the corresponding location is completely removed and not present. The thickness of the first adhesive layer after at least a portion is removed is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. Furthermore, it is also preferable that the first adhesive layer at the corresponding location is completely removed and not present.

[0376] (12) In process (12z), the light-absorbing layers with multiple protrusions or multiple islands in process (12z) are preferably such that the area of ​​each of them (hereinafter referred to as the area of ​​the light-absorbing layer with protrusions or islands) is set to (S). x Let the area of ​​each of the multiple adjacent items be (S). y When ), the relationship of equation (S-xy) is satisfied.

[0377] (S) x )≥(S y (S-xy)

[0378] Under the condition of satisfying the relationship of the above equation (S-xy), when the area of ​​the convex or island-shaped light-absorbing layer (S) is... x ) and the area of ​​the item (S) y The ratio of ) is set as (S) x ) / (S y From the perspective of debris suppression and improved positional accuracy, (S) x ) / (S y The value is preferably 1.10 or higher, more preferably 1.30 or higher, even more preferably 1.50 or higher, even more preferably 1.65 or higher, and particularly preferably 1.90 or higher. On the other hand, from the viewpoint of reducing the energy of laser irradiation, (S) x ) / (S y The value is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less.

[0379] Furthermore, in the area of ​​the first a surface of the light-absorbing layer that serves as the first substrate side and the area of ​​the second a surface of the light-absorbing layer that faces the first a surface, the area of ​​the island-shaped light-absorbing layer corresponds to the area of ​​the first a surface that serves as the first substrate side. Additionally, the areas of the convex and concave light-absorbing layers are determined by the methods described in (a1) to (a4) to determine the concave and convex portions of the light-absorbing layer.

[0380] In the (12y) process, the first adhesive layer of multiple protrusions or the first adhesive layer of multiple islands is preferably set to (S) where the area of ​​each of the protrusions (hereinafter referred to as the area of ​​the first adhesive layer of the protrusions or islands) is (S). p Let the area of ​​each of the multiple adjacent items be (S). q When ), the relationship of equation (S-pq) is satisfied.

[0381] (S) p )≥(S q (S-pq)

[0382] Under the condition that the relationship of the above formula (S-pq) is satisfied, the area of ​​the first adhesive layer of the protrusion or island shape (S) p ) and the area of ​​the item (S) q The ratio of ) is set as (S) p ) / (S q From the perspective of debris suppression and improved positional accuracy, (S) p ) / (S q The value is preferably 1.10 or higher, more preferably 1.30 or higher, even more preferably 1.50 or higher, even more preferably 1.65 or higher, and particularly preferably 1.90 or higher. On the other hand, from the viewpoint of reducing the energy of laser irradiation, (S) p ) / (S q The value is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less.

[0383] Furthermore, in the area of ​​the surface of the first adhesive layer that serves as the light-absorbing layer and the area of ​​the surface facing that surface, the area of ​​the island-shaped first adhesive layer corresponds to the area of ​​the surface that serves as the light-absorbing layer. Additionally, the area of ​​the first adhesive layer of the convex portion and the area of ​​the first adhesive layer of the concave portion are determined by the methods described in (b1) to (b4). The examples and preferred embodiments related to the convex light-absorbing layer, the island-shaped light-absorbing layer, the convex first adhesive layer, and the island-shaped first adhesive layer in steps (12), (12y), and (12z) are the same as those in step (13) described later.

[0384] In the manufacturing method of the laminate as the third and fourth embodiments of the present invention, if the conditions of (a) described later are met in step (13), from the viewpoints of reducing process time, reducing laser irradiation energy, suppressing debris, and improving positional accuracy, steps (12a) and (12b) are preferably performed by irradiating the light-absorbing layer with active chemical rays as a mask. In this case, step (13a) described later is preferably without step (13a-1) described later.

[0385] When the manufacturing method of the laminate, which is the fifth and sixth aspect of the present invention, satisfies the conditions described later in step (13y), from the viewpoint of the same inventive effect, steps (12ya) and (12yb) preferably irradiate the light-absorbing layer with active chemical rays as a mask. From the viewpoint of the same inventive effect, steps (12ya) and (12yb) also preferably irradiate the light-absorbing layer and the first adhesive layer with active chemical rays as a mask. In this structure, step (13ya) described later preferably does not include step (13ya-1) described later.

[0386] When the light-absorbing layer and / or the first adhesive layer are layers containing a positive photosensitive composition, the light-absorbing layer and / or the first adhesive layer are also irradiated with active chemical rays in steps (12a), (12b), (12ya), or (12yb), causing bond breaking, reaction, or structural change of the photosensitizer and making it alkali-soluble. As a result, steps (13a-1) or (13ya-1) in steps (13a) or (13ya) described later are unnecessary, thus significantly reducing process time.

[0387] (12) The process is preferably performed before the (12a) process, which involves contacting and bonding the article included in the substrate with the light-absorbing layer included in the first substrate. The (12y) process is preferably performed before the (12ya) process, which involves contacting and bonding the article included in the substrate with the first adhesive layer included in the first substrate. The (12z) process is preferably performed before the (12za) process, which involves contacting and bonding the article included in the substrate with the light-absorbing layer included in the first substrate. The (12), (12y), and (12z) processes are more preferably performed after these processes, and even more preferably, they involve a heat-pressing process. The heat-pressing method is preferably a heat pressing process, a heat lamination process, or a heat vacuum lamination process. As a heat-pressing method, for example, a method using a press, a wafer bonder, or a vacuum laminator that can control the pressure during heat pressing can be listed.

[0388] The heating temperature is preferably 50°C or higher, more preferably 60°C or higher, and even more preferably 80°C or higher. On the other hand, the heating temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 100°C or lower. The heating time is preferably 10 seconds or higher, more preferably 30 seconds or higher, even more preferably 60 seconds or higher, and particularly preferably 180 seconds or higher. On the other hand, the heating time is preferably 30 minutes or lower, more preferably 20 minutes or lower, even more preferably 10 minutes or lower, and particularly preferably 5.0 minutes or lower.

[0389] The hot-pressing temperature is preferably 20°C or higher, more preferably 40°C or higher, even more preferably 50°C or higher, and particularly preferably 60°C or higher. On the other hand, the hot-pressing temperature is preferably 150°C or lower, more preferably 120°C or lower, even more preferably 100°C or lower, and particularly preferably 80°C or lower. The hot-pressing time is preferably 10 seconds or higher, more preferably 30 seconds or higher, and even more preferably 60 seconds or higher. On the other hand, the hot-pressing time is preferably 30 minutes or lower, more preferably 20 minutes or lower, even more preferably 10 minutes or lower, and particularly preferably 5.0 minutes or lower. The pressure for hot-pressing is preferably 0.050 MPa or higher, more preferably 0.10 MPa or higher. On the other hand, the pressure for hot-pressing is preferably 10 MPa or lower, more preferably 5 MPa or lower. The heating process and the hot-pressing process can be performed in two or more stages. The preferred processing environment is in the presence of air, oxygen, nitrogen, helium, neon, argon, krypton, or xenon; in a gaseous environment containing 1 ppm to 10,000 ppm (0.0001% to 1%) of oxygen; or in a vacuum.

[0390] <The process of temporarily fixing items (the process of attaching and transferring items)>

[0391] (12) The process preferably includes (12c) a process of contacting and bonding the article included in the substrate with the light-absorbing layer included in the first substrate and transferring the article from the substrate to the light-absorbing layer (hereinafter referred to as process (12c)). The (12y) process preferably includes (12yc) a process of contacting and bonding the article included in the substrate with the first adhesive layer included in the first substrate and transferring the article from the substrate to the first adhesive layer (hereinafter referred to as process (12yc)). The (12z) process preferably includes (12zc) a process of contacting and bonding the article included in the substrate with the light-absorbing layer included in the first substrate and transferring the article from the substrate to the light-absorbing layer and patterning the light-absorbing layer (hereinafter referred to as process (12zc)). The (12c) process and the (12zc) process are more preferably performed by heating while the article is in contact with and bonded to the light-absorbing layer, and more preferably by hot pressing. (12yc) The process is more preferably performed by heating while the article is in contact with and bonded to the first adhesive layer, and more preferably by hot pressing. Examples and preferred embodiments related to the heating process and the hot pressing process are the same as those for the process (12).

[0392] (12) The process preferably includes (12d) a process in which the article included on the zeroth substrate is brought into contact with and bonded to the light-absorbing layer included on the first substrate, and the article is transferred from the zeroth adhesive layer to the light-absorbing layer (hereinafter referred to as the (12d) process). The (12y) process preferably includes (12yd) a process in which the article included on the zeroth substrate is brought into contact with and bonded to the first adhesive layer included on the first substrate, and the article is transferred from the zeroth adhesive layer to the first adhesive layer (hereinafter referred to as the (12yd) process). The (12z) process preferably includes (12zd) a process in which the article included on the zeroth substrate is brought into contact with and bonded to the light-absorbing layer included on the first substrate, and the article is transferred from the zeroth adhesive layer to the light-absorbing layer, and the light-absorbing layer is patterned (hereinafter referred to as the (12zd) process). The (12d) process and the (12zd) process are more preferably performed by heating while the article is brought into contact with and bonded to the light-absorbing layer, and more preferably by hot pressing. (12yd) The process is more preferably performed by heating while the article is in contact with and bonded to the first adhesive layer, and more preferably by hot pressing. Examples and preferred embodiments related to the heating process and the hot pressing process are the same as those for the process (12).

[0393] <First substrate; process of patterning the light-absorbing layer and / or the first adhesive layer>

[0394] The manufacturing methods of the laminate according to the third and fourth embodiments of the present invention include a step of (13) patterning the light-absorbing layer (hereinafter referred to as step (13)). The manufacturing methods of the laminate according to the fifth and sixth embodiments of the present invention include a step of (13y) patterning the light-absorbing layer and the first adhesive layer (hereinafter referred to as step (13y)). The manufacturing methods of the laminate according to the seventh and eighth embodiments of the present invention preferably include a step of (13) patterning the light-absorbing layer (hereinafter referred to as step (13)).

[0395] In the manufacturing methods of the laminate according to the third and fourth embodiments of the present invention, a recess is formed in the light-absorbing layer in step (13). In the manufacturing methods of the laminate according to the fifth and sixth embodiments of the present invention, a recess is formed in both the light-absorbing layer and the first adhesive layer in step (13y). In the manufacturing methods of the laminate according to the seventh and eighth embodiments of the present invention, it is preferable that the light-absorbing layer has a recess in step (13). Forming a recess in the light-absorbing layer in step (13) means that the process is completed in step (13). Forming a recess in both the light-absorbing layer and the first adhesive layer in step (13y) means that the process is completed in step (13y). That is, in step (13), a recess is formed in the light-absorbing layer by patterning the light-absorbing layer. In addition, in step (13), it is also preferable that the light-absorbing layer has an opening by patterning the light-absorbing layer. Furthermore, in step (13y), a recess is formed in the light-absorbing layer and the first adhesive layer by patterning. Additionally, in step (13y), it is preferable that the light-absorbing layer and the first adhesive layer have openings by patterning. Moreover, in order to form a recess in the light-absorbing layer in step (12z), the method for manufacturing the laminate according to the seventh and eighth embodiments of the present invention allows for further patterning of the light-absorbing layer in step (13).

[0396] In step (13), the light-absorbing layer is preferably one of the following conditions (p) and (q).

[0397] (p) A recess is formed in the light-absorbing layer, where at least a portion of the light-absorbing layer is removed, resulting in a reduced thickness.

[0398] (q) A recess is formed in the light absorption layer, and the recess is an opening.

[0399] In the (13y) process, the light-absorbing layer and the first adhesive layer are preferably either (py) or (qy) that satisfy the following conditions.

[0400] (py) A recess is formed in the light-absorbing layer and the first adhesive layer, the recess being the opening of the first adhesive layer, and at least a portion of the light-absorbing layer is removed at the recess, resulting in a reduced thickness.

[0401] (qy) A recess is formed in the light-absorbing layer and the first adhesive layer, and the recess is an opening.

[0402] From the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate as the seventh and eighth embodiments of the present invention is preferably such that, in the (12z) step, the light-absorbing layer exists as a plurality of light-absorbing layers for protrusions and concave portions while in contact with the first substrate, and the thickness of the light-absorbing layer for the concave portions is less than the thickness of the light-absorbing layers for the protrusions. The manufacturing method of the laminate as the seventh and eighth embodiments of the present invention is preferably such that multiple articles are each independently contacted with at least one of the multiple light-absorbing layers for protrusions. The term "in the (12z) step" refers to the state after the (12z) step. That is, in the (12z) step, the light-absorbing layer is patterned, thereby making the light-absorbing layer exist as a plurality of light-absorbing layers for protrusions. Furthermore, in the (12z) step, the light-absorbing layer is patterned, thereby making multiple articles each independently contact with at least one of the multiple light-absorbing layers for protrusions.

[0403] From the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, in the manufacturing methods of the laminate as the seventh and eighth embodiments of the present invention, it is preferable that the light-absorbing layer exists as a plurality of island-shaped light-absorbing layers while in contact with the first substrate during the (12z) step. The manufacturing methods of the laminate as the seventh and eighth embodiments of the present invention are preferably such that multiple articles are each independently contacted with at least one of the plurality of island-shaped light-absorbing layers. The term "during the (12z) step" refers to the state after the (12z) step. That is, during the (12z) step, the light-absorbing layer is patterned, thereby making the light-absorbing layer exist as a plurality of island-shaped light-absorbing layers. Furthermore, during the (12z) step, the light-absorbing layer is patterned, thereby making multiple articles each independently contacted with at least one of the plurality of island-shaped light-absorbing layers.

[0404] (13) Preferably, at least a portion of the light-absorbing layer is removed in the process. (13y) Preferably, at least a portion of the first adhesive layer is removed in the process. Furthermore, (13y) is more preferably a process in which at least a portion of the light-absorbing layer and at least a portion of the first adhesive layer in contact with the light-absorbing layer are removed in the process.

[0405] In the manufacturing methods of the laminates according to the third, fourth, seventh, and eighth embodiments of the present invention, "removing at least a portion of the light-absorbing layer" means that the thickness of the light-absorbing layer is reduced. Preferably, at least a portion of the light-absorbing layer is removed and a recess is formed in the light-absorbing layer; more preferably, the light-absorbing layer exists as a plurality of convex light-absorbing layers and a recessed light-absorbing layer, and the thickness of the recessed light-absorbing layer is less than the thickness of the plurality of convex light-absorbing layers. Furthermore, it is preferable that at least a portion of the light-absorbing layer is removed, exposing at least a portion of the first substrate; more preferably, the light-absorbing layer at the corresponding location is completely removed. Additionally, it is particularly preferable that at least a portion of the light-absorbing layer is removed and the light-absorbing layer exists as a plurality of island-shaped light-absorbing layers.

[0406] In the manufacturing methods of the laminate as the fifth and sixth embodiments of the present invention, the removal of at least a portion of the light-absorbing layer and at least a portion of the first adhesive layer means that the thickness of the light-absorbing layer and the thickness of the first adhesive layer become smaller. Preferably, at least a portion of the light-absorbing layer and at least a portion of the first adhesive layer are removed, and a recess is formed in the light-absorbing layer and the first adhesive layer. More preferably, the light-absorbing layer exists as a plurality of convex light-absorbing layers and a recessed light-absorbing layer, and the thickness of the recessed light-absorbing layer is less than the thickness of the plurality of convex light-absorbing layers, and the first adhesive layer exists as a first adhesive layer for the plurality of convex portions. Furthermore, it is preferable that at least a portion of the light-absorbing layer and at least a portion of the first adhesive layer are removed, exposing at least a portion of the first substrate. More preferably, the first adhesive layer at the corresponding portion is completely removed, and even more preferably, the light-absorbing layer and the first adhesive layer at the corresponding portion are completely removed. Additionally, it is particularly preferable that at least a portion of the light-absorbing layer and at least a portion of the first adhesive layer are removed, and the light-absorbing layer and the first adhesive layer exist as a plurality of island-shaped light-absorbing layers and a plurality of island-shaped first adhesive layers.

[0407] As described above, by patterning the portion of the article that is not in contact with the light-absorbing layer and / or the first adhesive layer as a recess or as an opening, the volume of the light-absorbing layer and / or the first adhesive layer can be reduced. It is more suitable to have a light-absorbing layer and / or the first adhesive layer having a recess formed by such patterning, or a light-absorbing layer and / or the first adhesive layer having an opening formed by patterning, where the effect of debris suppression or excellent positional accuracy based on the aforementioned speculation mechanism becomes significant.

[0408] The thickness of the light-absorbing layer after at least a portion is removed is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. Furthermore, it is also preferable that the light-absorbing layer at the corresponding location is completely removed and not present. The thickness of the first adhesive layer after at least a portion is removed is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. Furthermore, it is also preferable that the first adhesive layer at the corresponding location is completely removed and not present.

[0409] (13) In the process, the light-absorbing layers with multiple protrusions or multiple islands are preferably designed such that their respective areas (hereinafter referred to as the areas of the light-absorbing layers with protrusions or islands) are set to (S). x Let the area of ​​each of the multiple adjacent items be (S). y When ), the relationship of equation (S-xy) is satisfied.

[0410] (S) x )≥(S y (S-xy)

[0411] Under the condition of satisfying the relationship of the above equation (S-xy), when the area of ​​the convex or island-shaped light-absorbing layer (S) is... x ) and the area of ​​the item (S) y The ratio of ) is set as (S) x ) / (S y From the perspective of debris suppression and improved positional accuracy, (S) x ) / (S y The value is preferably 1.10 or higher, more preferably 1.30 or higher, even more preferably 1.50 or higher, even more preferably 1.65 or higher, and particularly preferably 1.90 or higher. On the other hand, from the viewpoint of reducing the energy of laser irradiation, (S) x ) / (S y The value is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less.

[0412] Furthermore, in the area of ​​the first a surface of the light-absorbing layer that serves as the first substrate side and the area of ​​the second a surface of the light-absorbing layer that faces the first a surface, the area of ​​the island-shaped light-absorbing layer corresponds to the area of ​​the first a surface that serves as the first substrate side. Additionally, the areas of the convex and concave light-absorbing layers are determined by the methods described in (a1) to (a4) to determine the concave and convex portions of the light-absorbing layer.

[0413] (13y) In the process, the first adhesive layer of multiple protrusions or the first adhesive layer of multiple islands is preferably set to (S) where the area of ​​each of the protrusions (hereinafter referred to as the area of ​​the first adhesive layer of the protrusions or islands) is (S). p Let the area of ​​each of the multiple adjacent items be (S). q When ), the relationship of equation (S-pq) is satisfied.

[0414] (S) p )≥(S q (S-pq)

[0415] Under the condition that the relationship of the above formula (S-pq) is satisfied, the area of ​​the first adhesive layer of the protrusion or island shape (S) p ) and the area of ​​the item (S) q The ratio of ) is set as (S) p ) / (S q From the perspective of debris suppression and improved positional accuracy, (S) p ) / (S q The value is preferably 1.10 or higher, more preferably 1.30 or higher, even more preferably 1.50 or higher, even more preferably 1.65 or higher, and particularly preferably 1.90 or higher. On the other hand, from the viewpoint of reducing the energy of laser irradiation, (S) p ) / (S q The value is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less.

[0416] Furthermore, in the area of ​​the surface of the first adhesive layer that serves as the light-absorbing layer and the area of ​​the surface facing that surface, the area of ​​the island-shaped first adhesive layer corresponds to the area of ​​the surface that serves as the light-absorbing layer. Additionally, the area of ​​the first adhesive layer of the convex portion and the area of ​​the first adhesive layer of the concave portion are determined by the methods described in (b1) to (b4) to determine the concave and convex portions of the first adhesive layer.

[0417] The preferred manufacturing method for the laminate as the third, fourth, seventh and eighth embodiments of the present invention is to satisfy any one of the conditions (a) to (c) in step (13).

[0418] (a) The light-absorbing layer is a layer containing a positive photosensitive composition, and (13) the process includes (13a) a process of patterning the light-absorbing layer by photolithography (hereinafter referred to as (13a) process).

[0419] (b) The light-absorbing layer is a layer containing a positive or negative photosensitive composition, and process (13) includes process (13b) of patterning the light-absorbing layer by etching (hereinafter referred to as process (13b)).

[0420] (c) The light-absorbing layer is a layer containing a non-photosensitive composition, and process (13) includes process (13b) of patterning the light-absorbing layer by etching (hereinafter referred to as process (13b)), thereby the compressive modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 The glass transition temperature of Pa and / or the light absorption layer is -50℃ to 150℃.

[0421] The manufacturing method of the laminate as the fifth and sixth embodiments of the present invention is preferably one that satisfies any one of the conditions (ay) to (cy) in the (13y) step. Satisfying the conditions in the (13) step refers to the state after the (13) step. Satisfying the conditions in the (13y) step refers to the state after the (13y) step.

[0422] (ay) The light-absorbing layer and / or the first adhesive layer are layers containing a positive photosensitive composition, and the (13y) process has a (13ya) process of patterning the light-absorbing layer and the first adhesive layer by photolithography (hereinafter referred to as the (13ya) process).

[0423] (by) the light-absorbing layer and / or the first adhesive layer are layers comprising a positive or negative photosensitive composition, and the (13y) process includes a (13yb) process of patterning the light-absorbing layer and the first adhesive layer by etching (hereinafter referred to as the (13yb) process).

[0424] (cy) The light-absorbing layer and / or the first adhesive layer are layers comprising a non-photosensitive composition, and the (13y) process includes a (13yb) process of patterning the light-absorbing layer and the first adhesive layer by etching (hereinafter referred to as the (13yb) process), thereby the compressive modulus of the first adhesive layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 The glass transition temperature of Pa and / or the first adhesive layer is -50℃ to 150℃.

[0425] <Processes for pattern processing (processes performed using photolithography)>

[0426] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate as the third, fourth, seventh, and eighth aspects of the present invention is preferably one that satisfies the condition described in (a) in step (13). Satisfying the condition in step (13) refers to the state after step (13). From the viewpoint of the same inventive effect, the manufacturing method of the laminate as the third, fourth, seventh, and eighth aspects of the present invention is preferably one that satisfies the condition described in (a) in step (13). Step (13a) of patterning the light-absorbing layer by photolithography (hereinafter referred to as step (13a)) includes (13a-1) a step of irradiating the light-absorbing layer with an active chemical ray using an article as a mask from the article side of the light-absorbing layer (hereinafter referred to as step (13a-1)) and (13a-2) a step of patterning the light-absorbing layer by developing with a developer (hereinafter referred to as step (13a-2)).

[0427] From the viewpoint of the same invention's effects, the method for manufacturing the laminate as the fifth and sixth aspects of the present invention is preferably to satisfy the conditions described in (ay) during the (13y) step. Satisfying the conditions during the (13y) step refers to the state after the (13y) step. From the viewpoint of the same invention's effects, the method for manufacturing the laminate as the fifth and sixth aspects of the present invention is preferably to satisfy the conditions described in (ay) during the (13y) step, wherein the (13ya) step of patterning the light-absorbing layer and the first adhesive layer by photolithography (hereinafter referred to as the (13ya) step) comprises (13ya-1) a step of irradiating the light-absorbing layer and the first adhesive layer with an article as a mask from the article side of the light-absorbing layer (hereinafter referred to as the (13ya-1) step), and (13ya-2) a step of patterning the light-absorbing layer and the first adhesive layer by developing with a developer (hereinafter referred to as the (13ya-2) step).

[0428] As described above, by patterning the portion of the article that is not in contact with the light-absorbing layer and / or the first adhesive layer as a recess or as an opening, the volume of the light-absorbing layer and / or the first adhesive layer can be reduced. It is more suitable to have a light-absorbing layer and / or the first adhesive layer having a recess formed by such patterning, or a light-absorbing layer and / or the first adhesive layer having an opening formed by patterning, where the effect of debris suppression or excellent positional accuracy based on the aforementioned speculation mechanism becomes significant.

[0429] As a method for irradiating reactive chemical rays in processes (13a-1) and (13ya-1), examples include patterning exposure using exposure machines such as steppers, scanners, mirror projection mask aligners (MPA), or parallel light mask aligners (PLA). Since processes (13a) and (13ya) use the article as a mask to irradiate the reactive chemical rays, a photomask may not be required. Alternatively, from the viewpoint of suppressing damage to the article caused by reactive chemical rays, irradiation of the reactive chemical rays can be performed through a photomask.

[0430] The maximum wavelength of the active chemical rays is preferably 180 nm or more, more preferably 200 nm or more, even more preferably 240 nm or more, even more preferably 300 nm or more, and particularly preferably 340 nm or more. On the other hand, the maximum wavelength of the active chemical rays is preferably 450 nm or less, more preferably 420 nm or less, and even more preferably 400 nm or less. The active chemical rays are preferably the j-rays (wavelength 313 nm), i-rays (wavelength 365 nm), h-rays (wavelength 405 nm), and g-rays (wavelength 436 nm) of a mercury lamp, and more preferably a mixture of i-rays, h-rays, and g-rays of a mercury lamp. The active chemical rays are also preferably ArF lasers (wavelength 193 nm), KrF lasers (wavelength 248 nm), XeCl lasers (wavelength 308 nm), XeF lasers (wavelength 351 nm), or yttrium aluminum garnet (YAG) lasers (wavelength 266 nm, 355 nm, or 532 nm).

[0431] The exposure dose of active chemical radiation, measured in terms of i-ray irradiance, is preferably 10 mJ / cm². 2 The above, more preferably 50 mJ / cm 2 The above, and more preferably 100 mJ / cm 2 The above, and more preferably 200 mJ / cm 2 The above, especially preferred, is 300 mJ / cm. 2 That's all. On the other hand, the exposure amount, measured in I-ray irradiance values, is preferably 3000 mJ / cm². 2 The following is more preferably 2000 mJ / cm 2 The preferred value is 1500 mJ / cm. 2 Furthermore, 1000 mJ / cm is even more preferred. 2 The following is particularly preferred: 500 mJ / cm 2the following.

[0432] From the viewpoints of improved sensitivity, improved resolution after development, and expanded permissible range of development conditions, post-exposure baking is preferred after irradiation with active chemical rays. Post-exposure baking is particularly preferred when the light-absorbing layer or the first adhesive layer is a layer containing a chemically amplified positive photosensitive composition.

[0433] As a method for developing in steps (13a-2) and (13ya-2), for example, developing using an automatic developing machine can be listed. As a developing method, for example, liquid developing, spray developing, or immersion developing can be listed. When the light-absorbing layer or the first adhesive layer is a layer containing a positive photosensitive composition, a pattern can be formed after the exposed portion is removed by the developing solution.

[0434] The developing solution is preferably an alkaline solution, preferably a solution of an organic alkaline compound or an aqueous solution of a compound exhibiting alkalinity. Examples of organic alkaline compounds or compounds exhibiting alkalinity include: 2-aminoethanol, 2-(dimethylamino)ethanol, 2-(diethylamino)ethanol, diethanolamine, trimethylamine, triethylamine, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, tetramethylammonium hydroxide, or tetraethylammonium hydroxide; existing compounds can be used. The alkalinity concentration of the alkaline solution is preferably 0.010% by mass or more, more preferably 0.10% by mass or more, further preferably 1.0% by mass or more, and particularly preferably 2.0% by mass or more. On the other hand, the alkalinity concentration is preferably 20% by mass or less, more preferably 10% by mass or less, further preferably 5.0% by mass or less, and particularly preferably 3.0% by mass or less.

[0435] The developer is preferably an organic solvent. The organic solvent may also be a solvent from the composition. The developer may also be a mixed solution containing an organic solvent and a solvent that is undesirable relative to the light-absorbing layer or the first adhesive layer.

[0436] The temperature of the developer is preferably 10°C or higher, more preferably 20°C or higher, even more preferably 30°C or higher, and particularly preferably 40°C or higher. On the other hand, the temperature of the developer is preferably 100°C or lower, more preferably 80°C or lower, and even more preferably 60°C or lower. The development time is preferably 10 seconds or higher, more preferably 30 seconds or higher, and even more preferably 60 seconds or higher. On the other hand, the development time is preferably 10 minutes or lower, more preferably 5.0 minutes or lower, and even more preferably 3.0 minutes or lower.

[0437] After development, the obtained pattern is preferably cleaned with a rinsing solution. When using an alkaline solution as the developer, water is preferred as the rinsing solution. Aqueous solutions of alcohols, esters, acidic compounds, or organic solvents may also be used as the rinsing solution.

[0438] In step (13a-2), the dissolution rate in the thickness direction of the exposed portion of the light-absorbing layer is preferably 1.0 μm / min or more, more preferably 3.0 μm / min or more, even more preferably 5.0 μm / min or more, even more preferably 10.0 μm / min or more, and particularly preferably 15.0 μm / min or more. On the other hand, the dissolution rate in the thickness direction is preferably 100 μm / min or less, more preferably 50.0 μm / min or less, and even more preferably 30.0 μm / min or less.

[0439] In step (13a-2), the ratio of the dissolution rate in the thickness direction of the exposed portion of the light-absorbing layer to the dissolution rate in the thickness direction of the unexposed portion is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, even more preferably 7 or more, and particularly preferably 10 or more. On the other hand, the ratio of dissolution rates is preferably 50 or less, more preferably 30 or less, and even more preferably 20 or less.

[0440] In step (13ya-2), the dissolution rate in the thickness direction of the exposed portion of the light-absorbing layer is preferably 1.0 μm / min or more, more preferably 3.0 μm / min or more, even more preferably 5.0 μm / min or more, even more preferably 10.0 μm / min or more, and particularly preferably 15.0 μm / min or more. On the other hand, the dissolution rate in the thickness direction is preferably 100 μm / min or less, more preferably 50.0 μm / min or less, and even more preferably 30.0 μm / min or less.

[0441] In the (13ya-2) process, the ratio of the dissolution rate of the exposed portion of the light-absorbing layer in the film thickness direction to the dissolution rate of the unexposed portion in the film thickness direction is preferably 1 or more, more preferably 3 or more, further preferably 5 or more, further preferably 7 or more, and particularly preferably 10 or more. On the other hand, the ratio of dissolution rates is preferably 50 or less, more preferably 30 or less, and further preferably 20 or less.

[0442] In the (13ya-2) process, the examples and preferred descriptions related to the dissolution rate in the thickness direction of the exposed portion of the first adhesive layer and the ratio of the dissolution rate in the thickness direction of the exposed portion of the first adhesive layer to the dissolution rate in the thickness direction of the unexposed portion are the same as the examples and preferred descriptions related to the dissolution rate in the thickness direction of the exposed portion of the light-absorbing layer and the ratio of the dissolution rate in the thickness direction of the exposed portion of the light-absorbing layer to the dissolution rate in the thickness direction of the unexposed portion.

[0443] <Processes for pattern processing (processes performed by etching)>

[0444] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate as the third, fourth, seventh, and eighth aspects of the present invention is preferably to satisfy the condition described in (b) in step (13). Satisfying the condition in step (13) refers to the state after step (13). From the viewpoint of the same inventive effect, the manufacturing method of the laminate as the third, fourth, seventh, and eighth aspects of the present invention is preferably to satisfy the condition described in (b) in step (13), wherein step (13b) of patterning the light-absorbing layer by etching (hereinafter referred to as step (13b)) includes step (13b-1a) of patterning the light-absorbing layer by dry etching using an article as a mask from the article side of the light-absorbing layer (hereinafter referred to as step (13b-1a)), or step (13b-1b) of patterning the light-absorbing layer by wet etching using an article as a mask from the article side of the light-absorbing layer (hereinafter referred to as step (13b-1b)).

[0445] From the viewpoint of the same inventive effect, the method for manufacturing the laminate as the fifth and sixth aspects of the present invention is preferably to satisfy the conditions described in the (by) step in the (13y) step. Satisfying the conditions in the (13y) step refers to the state after the (13y) step. From the viewpoint of the same inventive effect, the method for manufacturing the laminate as the fifth and sixth aspects of the present invention is preferably to satisfy the conditions described in the (by) step in the (13y) step, wherein the (13yb) step of patterning the light-absorbing layer and the first adhesive layer by etching (hereinafter referred to as the (13yb) step) includes a (13yb-1a) step of dry etching the light-absorbing layer and the first adhesive layer from the article side of the light-absorbing layer using the article as a mask to pattern the light-absorbing layer and the first adhesive layer (hereinafter referred to as the (13yb-1a) step), or a (13yb-1b) step of wet etching the light-absorbing layer and the first adhesive layer from the article side of the light-absorbing layer using the article as a mask to pattern the light-absorbing layer (hereinafter referred to as the (13yb-1b) step).

[0446] From the viewpoint of improving positional accuracy, the manufacturing method of the laminate as the third, fourth, seventh, and eighth embodiments of the present invention is preferably one in which the condition described in (c) is satisfied in step (13). Satisfying the condition in step (13) refers to the state after step (13). From the viewpoint of improving positional accuracy, the manufacturing method of the laminate as the third, fourth, seventh, and eighth embodiments of the present invention is preferably one in which, when the condition described in (c) is satisfied in step (13), step (13b) includes (13b-1a) a step of dry etching the light-absorbing layer using an article as a mask from the article side of the light-absorbing layer to pattern the light-absorbing layer, or (13b-1b) a step of wet etching the light-absorbing layer using an article as a mask from the article side of the light-absorbing layer to pattern the light-absorbing layer.

[0447] From the viewpoint of improving positional accuracy, the manufacturing method of the laminate as the fifth and sixth embodiments of the present invention is preferably such that the condition (cy) is met in the (13y) step. Meeting the condition in the (13y) step refers to the state after the (13y) step. From the viewpoint of improving positional accuracy, the manufacturing method of the laminate as the fifth and sixth embodiments of the present invention is preferably such that, when the condition (cy) is met in the (13y) step, the (13yb) step includes either (13yb-1a) a step of dry etching the light-absorbing layer using the article as a mask from the article side of the light-absorbing layer to pattern the light-absorbing layer, or (13yb-1b) a step of wet etching the light-absorbing layer using the article as a mask from the article side of the light-absorbing layer to pattern the light-absorbing layer.

[0448] As described above, by patterning the portion of the article that is not in contact with the light-absorbing layer and / or the first adhesive layer as a recess or as an opening, the volume of the light-absorbing layer and / or the first adhesive layer can be reduced. It is more suitable to have a light-absorbing layer and / or the first adhesive layer having a recess formed by such patterning, or a light-absorbing layer and / or the first adhesive layer having an opening formed by patterning, where the effect of debris suppression or excellent positional accuracy based on the aforementioned inference mechanism becomes significant. Examples and preferred embodiments related to the indentation modulus of elasticity at 50°C and the glass transition temperature of the light-absorbing layer are described above. Examples and preferred embodiments related to the indentation modulus of elasticity at 50°C and the glass transition temperature of the first adhesive layer are described above.

[0449] Methods for performing dry etching in processes (13b-1a) and (13yb-1a) include, for example, reactive gas etching that exposes the etching gas, plasma etching that exposes the etching gas after it has been ionized or radicalized by electromagnetic waves, or reactive ion etching that accelerates and causes collisions by applying a bias voltage to the etching gas after it has been ionized or radicalized by electromagnetic waves.

[0450] The etching gas is preferably a gas containing oxygen, argon, fluorine, or chlorine as its main components. The main component of the etching gas refers to the element that is present most abundantly by mass among the constituent elements of the etching gas. The etching gas is preferably a gas containing one or more elements selected from the group consisting of oxygen, ozone, argon, fluorine, and chlorine, more preferably a gas containing oxygen or ozone. The total content of oxygen, ozone, argon, fluorine, and chlorine in the etching gas is preferably 10% by mass or more, more preferably 30% by mass or more, more preferably 50% by mass or more, more preferably 70% by mass or more, and particularly preferably 80% by mass or more. On the other hand, the total content of oxygen, ozone, argon, fluorine, and chlorine in the etching gas is preferably 100% by mass or less. The etching gas is preferably a gas containing oxygen, ozone, argon, fluorine, or chlorine as its main components. The main component of the etching gas refers to the component that is present most abundantly by mass among the constituent elements of the etching gas. Existing gases can also be used as the etching gas.

[0451] The dry etching temperature is preferably 10°C or higher, more preferably 20°C or higher, even more preferably 30°C or higher, and particularly preferably 40°C or higher. On the other hand, the dry etching temperature is preferably 200°C or lower, more preferably 150°C or lower, and even more preferably 120°C or lower. Furthermore, the dry etching temperature is preferably 100°C or lower, more preferably 80°C or lower, and even more preferably 60°C or lower. The dry etching time is preferably 10 seconds or higher, more preferably 30 seconds or higher, even more preferably 60 seconds or higher, even more preferably 180 seconds or higher, and particularly preferably 300 seconds or higher. On the other hand, the dry etching time is preferably 60 minutes or lower, more preferably 30 minutes or lower, even more preferably 20 minutes or lower, and particularly preferably 10 minutes or lower.

[0452] In processes (13b-1a) and (13yb-1a), the etching rate in the thickness direction of the light-absorbing layer is preferably 0.10 μm / min or more, more preferably 0.50 μm / min or more, even more preferably 1.0 μm / min or more, even more preferably 2.0 μm / min or more, and particularly preferably 3.0 μm / min or more. On the other hand, the etching rate in the thickness direction is preferably 10.0 μm / min or less, more preferably 7.0 μm / min or less, and even more preferably 5.0 μm / min or less.

[0453] In processes (13b-1a) and (13yb-1a), the ratio of the etching rate in the thickness direction of the light-absorbing layer to the etching rate in the in-plane direction is preferably 3 or more, more preferably 5 or more, even more preferably 10 or more, even more preferably 20 or more, and particularly preferably 30 or more. On the other hand, the etching rate ratio is preferably 200 or less, more preferably 100 or less, and even more preferably 50 or less.

[0454] The examples and preferred descriptions related to the etching rate in the thickness direction of the first adhesive layer and the ratio of the etching rate in the thickness direction of the first adhesive layer to the etching rate in the in-plane direction in the (13yb-1a) process are the same as the examples and preferred descriptions related to the etching rate in the thickness direction of the light-absorbing layer and the ratio of the etching rate in the thickness direction of the light-absorbing layer to the etching rate in the in-plane direction.

[0455] Examples of methods for wet etching in processes (13b-1b) and (13yb-1b) include: coating with an etching solution, spraying the etching solution as a mist, immersing the sample in the etching solution, or irradiating the sample with ultrasound after immersion in the etching solution. The etching solution is preferably an alkaline solution, preferably a solution of an organic alkaline compound or an aqueous solution of a compound exhibiting alkalinity. Examples and preferred embodiments related to alkaline solutions are the same as those described for the developing solution.

[0456] The etching solution is preferably an acidic solution. The acidic solution is preferably an aqueous solution of a compound exhibiting acidity. Examples of acidic solutions include hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, phosphorous acid, acetic acid, or oxalic acid; existing solutions can also be used. The etching solution is also preferably an organic solvent. The solvent in the composition can also be used as the organic solvent. Examples of organic solvents include cyclopentanone, cyclohexanone, propylene glycol monomethyl ether acetate, diethylene glycol monobutyl ether, N-methyl-2-pyrrolidone, or γ-butyrolactone; existing organic solvents can also be used. The etching solution can also be a mixed solution containing an organic solvent and a solvent that is undesirable relative to the light-absorbing layer or the first adhesive layer. Examples and preferred descriptions of the conditions for the wet etching method are the same as those of the conditions for the development method.

[0457] In process (13b-1b), the etching rate in the thickness direction of the light-absorbing layer is preferably 0.10 μm / min or more, more preferably 0.50 μm / min or more, even more preferably 1.0 μm / min or more, even more preferably 2.0 μm / min or more, and particularly preferably 3.0 μm / min or more. On the other hand, the etching rate in the thickness direction is preferably 10.0 μm / min or less, more preferably 7.0 μm / min or less, and even more preferably 5.0 μm / min or less.

[0458] In the (13yb-1b) process, the etching rate in the thickness direction of the light-absorbing layer is preferably 0.10 μm / min or more, more preferably 0.50 μm / min or more, even more preferably 1.0 μm / min or more, even more preferably 2.0 μm / min or more, and particularly preferably 3.0 μm / min or more. On the other hand, the etching rate in the thickness direction is preferably 10.0 μm / min or less, more preferably 7.0 μm / min or less, and even more preferably 5.0 μm / min or less.

[0459] The examples and preferred embodiments related to the etching rate in the thickness direction of the first adhesive layer in process (13yb-1b) are the same as those related to the etching rate in the thickness direction of the light-absorbing layer. Furthermore, since processes (13b-1a), (13yb-1a), (13b-1b), and (13yb-1b) use the article as a mask for dry or wet etching, a photoresist pattern may not be formed. Additionally, from the viewpoint of suppressing damage to the article caused by etching gas or etching solution, a photoresist pattern in contact with the light-absorbing layer or the first adhesive layer may be formed. When a photoresist pattern is formed, it is preferable to remove the photoresist pattern after dry etching or wet etching. Methods for removing the photoresist pattern include, for example, removal using a resist stripping solution or removal by ashing.

[0460] Examples and preferred embodiments relating to the light-absorbing layer and the first adhesive layer being layers comprising a positive photosensitive composition, a negative photosensitive composition, or a non-photosensitive composition are described above. Furthermore, examples and preferred embodiments relating to conditions (a) to (c) and conditions (ay) to (cy) are the same as those relating to conditions (α) to (γ).

[0461] From the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate according to the third, fourth, seventh, and eighth embodiments of the present invention is preferably such that, in step (13), the light-absorbing layer exists as a light-absorbing layer of multiple protrusions and a light-absorbing layer of multiple concave portions while in contact with the first substrate, and the thickness of the light-absorbing layer of the concave portions is less than the thickness of the light-absorbing layer of multiple protrusions. The manufacturing method of the laminate according to the third, fourth, seventh, and eighth embodiments of the present invention is preferably such that multiple articles are independently contacted with at least one of the multiple protrusions' light-absorbing layers. The term "in step (13)" refers to the state after step (13). That is, in step (13), the light-absorbing layer is patterned, thereby making the light-absorbing layer exist as a light-absorbing layer of multiple protrusions and a light-absorbing layer of multiple concave portions. Furthermore, in step (13), the light-absorbing layer is patterned, thereby making multiple articles independently contacted with at least one of the multiple protrusions' light-absorbing layers. Furthermore, in the manufacturing method of the laminate as the seventh and eighth aspects of the present invention, in step (12z), the light-absorbing layer exists as a plurality of light-absorbing layers of protrusions and a light-absorbing layer of concave portions in a state of contact with the first substrate, and the thickness of the light-absorbing layer of the concave portions is less than the thickness of the light-absorbing layer of the plurality of protrusions. In step (13), it also exists in the same manner.

[0462] From the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate according to the third, fourth, seventh, and eighth embodiments of the present invention is preferably such that, in step (13), the light-absorbing layer exists as a plurality of island-shaped light-absorbing layers while in contact with the first substrate. The manufacturing method of the laminate according to the third, fourth, seventh, and eighth embodiments of the present invention is preferably such that multiple articles are independently contacted with at least one of the plurality of island-shaped light-absorbing layers. The term "in step (13)" refers to the state after step (13). That is, in step (13), the light-absorbing layer is patterned, thereby making the light-absorbing layer exist as a plurality of island-shaped light-absorbing layers. Furthermore, in step (13), the light-absorbing layer is patterned, thereby making multiple articles independently contacted with at least one of the plurality of island-shaped light-absorbing layers. Furthermore, in the manufacturing method of the laminate as the seventh and eighth aspects of the present invention, in step (12z), the light-absorbing layer exists as a plurality of island-shaped light-absorbing layers in a state of contact with the first substrate, and it also exists in the same manner in step (13).

[0463] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate according to the fifth and sixth embodiments of the present invention preferably involves, in the (13y) step, the light-absorbing layer existing as a light-absorbing layer for multiple protrusions and a light-absorbing layer for multiple recesses while in contact with the first substrate, and the thickness of the light-absorbing layer for the recesses being less than the thickness of the light-absorbing layer for multiple protrusions. From the viewpoint of the same inventive effect, the manufacturing method of the laminate according to the fifth and sixth embodiments of the present invention preferably involves, in the (13y) step, the first adhesive layer existing as a first adhesive layer for multiple protrusions while in contact with at least one of the light-absorbing layers for multiple protrusions. Furthermore, the first adhesive layer is also preferably existing as a first adhesive layer for multiple recesses while in contact with at least one of the light-absorbing layers for multiple recesses. The manufacturing method of the laminate according to the fifth and sixth embodiments of the present invention preferably involves multiple articles being independently contacted with at least one of the first adhesive layers for multiple protrusions. The term "in the (13y) step" refers to the state after the (13y) step. That is, in process (13y), the light-absorbing layer and the first adhesive layer are patterned, thereby making the first adhesive layer exist as the first adhesive layer for a plurality of protrusions. In addition, in process (13y), the light-absorbing layer and the first adhesive layer are patterned, thereby making a plurality of articles independently contact with at least one of the first adhesive layers of the plurality of protrusions.

[0464] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate as the fifth and sixth embodiments of the present invention is preferably such that, in the (13y) step, the light-absorbing layer exists as a plurality of island-shaped light-absorbing layers while in contact with the first substrate. From the viewpoint of the same inventive effect, the manufacturing method of the laminate as the fifth and sixth embodiments of the present invention is preferably such that, in the (13y) step, the first adhesive layer exists as a plurality of island-shaped first adhesive layers while in contact with at least one of the plurality of island-shaped light-absorbing layers. The manufacturing method of the laminate as the fifth and sixth embodiments of the present invention is preferably such that multiple articles are each independently contacted with at least one of the plurality of island-shaped first adhesive layers. The term "in the (13y) step" refers to the state after the (13y) step. That is, in the (13y) step, the light-absorbing layer and the first adhesive layer are patterned, thereby making the first adhesive layer exist as a plurality of island-shaped first adhesive layers. In addition, in the (13y) process, the light-absorbing layer and the first adhesive layer are patterned, thereby allowing multiple articles to be independently attached to at least one of the multiple island-shaped first adhesive layers.

[0465] <Processes for pattern processing (structure and physical properties of the light-absorbing layer and / or the first adhesive layer)>

[0466] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate of the present invention preferably sets the area of ​​the first a surface of the light-absorbing layer, which is the first substrate side, to (S) in steps (13), (13y), (12), (12y), or (12z). 1a The area of ​​the second surface of the light-absorbing layer facing the first surface is set as (S). 2a When ), the relationship of equation (S-1) is satisfied.

[0467] (S) 1a )≥(S 2a (S-1)

[0468] The statement that the light absorption layer satisfies equation (S-1) in process (13) refers to the state after process (13). The statement that the light absorption layer satisfies equation (S-1) in process (13y) refers to the state after process (13y). The statement that the light absorption layer satisfies equation (S-1) in processes (12), (12y), or (12z) refers to the state after process (12), (12y), or (12z). Examples and preferred embodiments related to the relationship described in equation (S-1) are as described above.

[0469] In steps (13), (13y), (12), (12y), or (12z), the light-absorbing layer or the first adhesive layer satisfies the relationship of the aforementioned formula (S-1), thereby reducing the contact area between the light-absorbing layer and the article or the first adhesive layer and the article. Therefore, it is believed that excessive adhesion between the light-absorbing layer and the article or the first adhesive layer and the article can be suppressed. As a result, when transferring the article from the light-absorbing layer or the first adhesive layer, the transfer can be performed with less energy, thus suppressing the scattering of the light-absorbing layer or the first adhesive layer on the surface of the article due to residue or erosion, and the effect of debris suppression becomes significant. Furthermore, since the transfer can be performed with less energy, the absolute value of the deviation of the irradiation energy is also reduced based on the stable behavior of the article during transfer, and the effect of excellent positional accuracy becomes significant.

[0470] From the viewpoint of improving positional accuracy, the manufacturing method of the laminate of the present invention is also preferably such that, in step (13), step (13y), step (12), step (12y), or step (12z), the area of ​​the first a surface of the light-absorbing layer, which is the first substrate side, is set to (S). 1a The area of ​​the second surface of the light-absorbing layer facing the first surface is set as (S). 2a When ), the relationship of equation (S-2) is satisfied.

[0471] (S) 1a )<(S 2a(S-2)

[0472] The statement that the light absorption layer satisfies equation (S-2) in process (13) refers to the state after process (13). The statement that the light absorption layer satisfies equation (S-2) in process (13y) refers to the state after process (13y). The statement that the light absorption layer satisfies equation (S-2) in processes (12), (12y), or (12z) refers to the state after process (12), (12y), or (12z). Examples and preferred embodiments related to the relationship described in equation (S-2) are as described above.

[0473] In steps (13), (13y), (12), (12y), or (12z), the light-absorbing layer or the first adhesive layer satisfies the relationship of equation (S-2), thereby reducing the area of ​​contact between the light-absorbing layer and the first substrate or the area of ​​contact between the first adhesive layer and the light-absorbing layer. Therefore, it is believed that the reaction force exerted on the light-absorbing layer from the first substrate or the reaction force exerted on the first adhesive layer from the light-absorbing layer during etching can be suppressed. As a result, excess energy transferred from the light-absorbing layer or the first adhesive layer to the article due to the reaction force can be suppressed, the behavior of the article during transfer is stable, and thus, the effect of excellent positional accuracy becomes significant.

[0474] In the manufacturing method of the laminate as the fourth aspect of the present invention, in step (13), the compressive elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 Pa and / or in step (13), the glass transition temperature of the light-absorbing layer is -50°C to 150°C. Preferably, in step (13), the compressive modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 Pa and / or in process (13), the glass transition temperature of the light-absorbing layer is -50°C to 150°C.

[0475] In the manufacturing method of the laminate according to the eighth aspect of the present invention, in the (12z) step, the compressive elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 In Pa and / or in the (12z) process, the glass transition temperature of the light-absorbing layer is -50°C to 150°C. Preferably, in the manufacturing method of the laminate according to the seventh aspect of the present invention, the compressive modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶ in the (12z) process. 3 Pa ~ 2.0 × 10 9In Pa and / or in the (12z) process, the glass transition temperature of the light-absorbing layer is -50°C to 150°C.

[0476] In the manufacturing method of the laminate according to the sixth aspect of the present invention, in the (13y) step, the compressive elastic modulus of the first adhesive layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 In Pa and / or in the (13y) process, the glass transition temperature of the first adhesive layer is -50°C to 150°C. Preferably, in the fifth embodiment of the present invention, the manufacturing method of the laminate is such that, in the (13y) process, the compressive modulus of the first adhesive layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 In Pa and / or in the (13y) process, the glass transition temperature of the first adhesive layer is -50°C to 150°C.

[0477] The range of indented elastic modulus and / or glass transition temperature in process (13) refers to the state after process (13). The range of indented elastic modulus and / or glass transition temperature in process (13y) refers to the state after process (13y). The range of indented elastic modulus and / or glass transition temperature in process (12z) refers to the state after process (12z). Examples and preferred embodiments related to the indented elastic modulus and glass transition temperature of the light-absorbing layer at 50°C are described above. Examples and preferred embodiments related to the indented elastic modulus and glass transition temperature of the first adhesive layer at 50°C are described above. Examples and preferred embodiments related to the structure and physical properties of other light-absorbing layers are described above. In addition, examples and preferred embodiments related to the structure and physical properties of other first adhesive layers are also described above.

[0478] <First substrate; process of crosslinking the light-absorbing layer and / or the first adhesive layer>

[0479] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate as the third and fourth embodiments of the present invention preferably includes a step (14) of cross-linking the pattern of the light-absorbing layer (hereinafter referred to as step (14)) before or after step (13). From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate as the seventh and eighth embodiments of the present invention preferably includes a step (14) of cross-linking the pattern of the light-absorbing layer (hereinafter referred to as step (14)) after step (12z). From the viewpoint of the same effects of the invention, the manufacturing method of the laminate as the third, fourth, seventh, and eighth embodiments of the present invention preferably includes a step (14a) of heating the pattern of the light-absorbing layer (hereinafter referred to as step (14a)) or a step (14b-1) of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer (hereinafter referred to as step (14b-1)).

[0480] The manufacturing method of the laminate as the third and fourth embodiments of the present invention preferably includes a step (14) after step (12) and before step (13). The manufacturing method of the laminate as the third and fourth embodiments of the present invention is also preferably including a step (14) after step (13) and before step (20), or after step (13) and before step (21). In addition, the manufacturing method of the laminate as the seventh and eighth embodiments of the present invention is preferably including a step (14) after step (12z) and before step (20), or after step (12z) and before step (21).

[0481] As a method for manufacturing a laminate according to the third, fourth, seventh and eighth aspects of the present invention, when the method includes step (14), from the viewpoint of the effect of the invention, it is preferable to satisfy any one of the conditions (a) to (c) in step (13), more preferably to satisfy the conditions (a) and / or (b), and even more preferably to satisfy the conditions (a).

[0482] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing method of the laminate as the fifth and sixth embodiments of the present invention preferably includes a step (14y) of crosslinking the pattern of the light-absorbing layer and / or the pattern of the first adhesive layer (hereinafter referred to as the (14y) step) before or after the (13y) step. From the viewpoint of the same effects of the invention, the manufacturing method of the laminate as the sixth and sixth embodiments of the present invention preferably includes a step (14ya) of heating the pattern of the light-absorbing layer and / or the pattern of the first adhesive layer (hereinafter referred to as the (14ya) step) or a step (14yb-1) of irradiating the light-absorbing layer and the first adhesive layer with active chemical rays from the first substrate side of the light-absorbing layer (hereinafter referred to as the (14yb-1) step).

[0483] The manufacturing method of the laminate as the fifth and sixth embodiments of the present invention preferably includes a (14y) step after the (12y) step and before the (13y) step. The manufacturing method of the laminate as the fifth and sixth embodiments of the present invention is also preferably an (14y) step after the (13y) step and before the (20) step, or after the (13y) step and before the (21) step.

[0484] In the case of the (14y) step, the manufacturing method of the laminate as the fifth and sixth aspects of the present invention is preferably, from the viewpoint of the effect of the invention, to satisfy any one of the conditions (ay) to (cy) in the (13y) step, more preferably to satisfy the conditions (ay) and / or (by), and even more preferably to satisfy the conditions (ay).

[0485] When the light-absorbing layer and / or the first adhesive layer are layers containing a negatively photosensitive composition, photocuring is performed by irradiation with reactive chemical rays, increasing the degree of cross-linking in these layers. Alternatively, heating generates free radicals, acids, or bases, thereby initiating curing and increasing the degree of cross-linking in these layers. When the light-absorbing layer and / or the first adhesive layer are layers containing a positively photosensitive composition, irradiation with reactive chemical rays causes bond breaking, reaction, or structural changes in the photosensitizer, increasing the number of carboxyl groups or phenolic hydroxyl groups. As a result, through significant changes in polarity within these layers, hydrogen bond formation or intermolecular interactions increase. Furthermore, heating generates free radicals, acids, or bases, thereby initiating curing and increasing the degree of cross-linking in these layers. Therefore, it is believed that internal stress is generated in these layers, suppressing excessive adhesion between the light-absorbing layer and the article, or between the first adhesive layer and the article. As a result, when transferring an article from the light-absorbing layer or the first adhesive layer, the transfer can be performed with less energy. Therefore, the scattering of the light-absorbing layer or the first adhesive layer during residue removal or erosion on the surface of the article can be suppressed, and the effect of debris suppression is expected to become significant. Furthermore, since the transfer can be performed with less energy, the absolute value of the deviation of the irradiation energy is also reduced while the behavior of the article during transfer remains stable, and the effect of excellent positional accuracy is expected to become significant.

[0486] As a method of heating in processes (14a) and (14ya), examples include heating using an oven, a heating plate, infrared radiation, a flash annealing device, or a laser annealing device.

[0487] The heating temperature is preferably 50°C or higher, more preferably 80°C or higher, even more preferably 100°C or higher, even more preferably 120°C or higher, and particularly preferably 150°C or higher. On the other hand, the heating temperature is preferably 500°C or lower, more preferably 400°C or lower, even more preferably 300°C or lower, even more preferably 250°C or lower, and particularly preferably 200°C or lower. The heating time is preferably 10 seconds or higher, more preferably 30 seconds or higher, even more preferably 60 seconds or higher, even more preferably 180 seconds or higher, and particularly preferably 300 seconds or higher. On the other hand, the heating time is preferably 60 minutes or lower, more preferably 30 minutes or lower, even more preferably 20 minutes or lower, and particularly preferably 10 minutes or lower. The heating process can be performed in two or more stages. The processing environment is preferably in air, oxygen, nitrogen, helium, neon, argon, krypton, or xenon; in a gaseous environment containing 1 ppm to 10,000 ppm (0.0001% to 1%) of oxygen; or under vacuum.

[0488] As a method for irradiating active chemical rays in the (14b-1) and (14yb-1) processes, for example, exposure methods using exposure machines such as steppers, scanners, mirror projection mask aligners (MPA) or parallel light mask aligners (PLA) can be listed.

[0489] The maximum wavelength of the active chemical rays is preferably 180 nm or more, more preferably 200 nm or more, even more preferably 240 nm or more, even more preferably 300 nm or more, and particularly preferably 340 nm or more. On the other hand, the maximum wavelength of the active chemical rays is preferably 450 nm or less, more preferably 420 nm or less, and even more preferably 400 nm or less. The active chemical rays are preferably the j-rays (wavelength 313 nm), i-rays (wavelength 365 nm), h-rays (wavelength 405 nm), and g-rays (wavelength 436 nm) of a mercury lamp, and more preferably a mixture of i-rays, h-rays, and g-rays of a mercury lamp. The active chemical rays are also preferably ArF laser (wavelength 193 nm), KrF laser (wavelength 248 nm), XeCl laser (wavelength 308 nm), XeF laser (wavelength 351 nm), or YAG laser (wavelength 266 nm, 355 nm, or 532 nm).

[0490] The exposure dose of active chemical radiation, measured in terms of i-ray irradiance, is preferably 10 mJ / cm². 2 The above, more preferably 50 mJ / cm 2 The above, and more preferably 100 mJ / cm 2 The above, and more preferably 200 mJ / cm 2 The above, especially preferred, is 300 mJ / cm. 2 That's all. On the other hand, the exposure amount, measured in I-ray irradiance values, is preferably 3000 mJ / cm². 2 The following is more preferably 2000 mJ / cm 2 The preferred value is 1500 mJ / cm. 2 Furthermore, 1000 mJ / cm is even more preferred. 2 The following is particularly preferred: 500 mJ / cm 2 the following.

[0491] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing methods of the laminates according to the third, fourth, seventh, and eighth embodiments of the present invention are preferably, in the case of step (13a), the wavelength of the active chemical ray in step (14b-1) is a different wavelength than the wavelength of the active chemical ray in step (13a). From the viewpoint of the same inventive effect, the manufacturing methods of the laminates according to the fifth and sixth embodiments of the present invention are preferably, in the case of step (13ya), the wavelength of the active chemical ray in step (14yb-1) is a different wavelength than the wavelength of the active chemical ray in step (13ya). From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing methods of the laminates according to the seventh and eighth embodiments of the present invention are preferably, the wavelength of the active chemical ray in step (14b-1) is a different wavelength than the wavelength of the active chemical ray in step (12z). By adopting the aforementioned structure, a light-absorbing layer and / or a first adhesive layer that will not be cross-linked by the active chemical rays in processes (13a), (13ya), or (12z) can be applied. Furthermore, it is suitable from the viewpoint that the light-absorbing layer and / or the first adhesive layer can be selectively cross-linked using the active chemical rays in processes (14b-1) or (14yb-1).

[0492] From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing methods of the laminates according to the third, fourth, seventh, and eighth embodiments of the present invention preferably include a step (14b-1) after step (14b-1) to heat the pattern of the light-absorbing layer (hereinafter referred to as step (14b-2)). From the viewpoint of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, the manufacturing methods of the laminates according to the fifth and sixth embodiments of the present invention preferably include a step (14yb-1) after step (14yb-1) to heat the pattern of the light-absorbing layer (hereinafter referred to as step (14yb-2)). The examples and preferred descriptions related to the heating steps in steps (14b-2) and (14yb-2) are the same as those for steps (14a) and (14ya).

[0493] <Second substrate; Process for preparing the laminate>

[0494] The manufacturing methods of the laminates according to the third, fifth, and seventh embodiments of the present invention include a step (20) of preparing a laminate a2 having a second substrate and a second adhesive layer sequentially (hereinafter referred to as step (20)). The manufacturing methods of the laminates according to the fourth, sixth, and eighth embodiments of the present invention preferably also include a step (20) of preparing a laminate a2 having a second substrate and a second adhesive layer sequentially (hereinafter referred to as step (20)). Examples and preferences related to the laminate a2 are described above. The process of preparing these laminates may also be a process of manufacturing and preparing laminates. In addition, the process of preparing these laminates may also be a process of preparing a manufactured laminate.

[0495] <Second substrate; process of forming the second adhesive layer>

[0496] The manufacturing methods of the laminates according to the third, fifth, and seventh embodiments of the present invention preferably include a step (21) of forming a second adhesive layer on a second substrate. The manufacturing methods of the laminates according to the fourth, sixth, and eighth embodiments of the present invention preferably also include a step (21) of forming a second adhesive layer on a second substrate. Examples and preferences related to the second substrate and the second adhesive layer are described above. As methods for forming the second adhesive layer in these steps, for example, methods of coating a composition or methods of preparing a film containing a composition can be listed. Examples and preferences related to these methods are the same as those for step (11).

[0497] <Second substrate; process for transferring the printed article>

[0498] The manufacturing methods of the laminate according to the third and seventh embodiments of the present invention include a step (22) in which, with a gap provided between the article included on the first substrate and the second adhesive layer included on the second substrate, an active chemical ray is irradiated onto the light-absorbing layer from the first substrate side of the light-absorbing layer to transfer the article from the light-absorbing layer to the second adhesive layer (hereinafter referred to as step (22)). From the viewpoint of improving yield and reliability, the manufacturing methods of the laminate according to the fourth and eighth embodiments of the present invention preferably further include step (22). The manufacturing methods of the laminate according to the third, fourth, seventh, and eighth embodiments of the present invention preferably include a plurality of articles in contact with the second adhesive layer in step (22).

[0499] The method for manufacturing a laminate according to a fifth aspect of the present invention includes a step (22y) in which, with a gap provided between an article included on a first substrate and a second adhesive layer included on a second substrate, an active chemical ray is irradiated onto a light-absorbing layer from the first substrate side of the light-absorbing layer to transfer the article from the first adhesive layer to the second adhesive layer (hereinafter referred to as the (22y) step). The method for manufacturing a laminate according to a sixth aspect of the present invention preferably further includes the (22y) step. The methods for manufacturing a laminate according to the fifth and sixth aspects of the present invention preferably include a plurality of articles in contact with the second adhesive layer in the (22) step.

[0500] Examples and preferred descriptions related to the articles are as described above. The term "having multiple articles in process (22)" refers to the state after process (22). The term "having multiple articles in process (22y)" refers to the state after process (22y). That is, in process (22), multiple articles are transferred from the light-absorbing layer to the second adhesive layer. Furthermore, in process (22y), multiple articles are transferred from the first adhesive layer to the second adhesive layer.

[0501] From the viewpoint of improving yield and reliability, process (22) is preferably performed by transferring multiple items included in the first substrate from the light-absorbing layer to the second adhesive layer in two or more separate steps, and more preferably by performing the transfer sequentially in two or more separate steps. From the viewpoint of improving yield and reliability, process (22y) is preferably performed by transferring multiple items included in the first substrate from the first adhesive layer to the second adhesive layer in two or more separate steps, and more preferably by performing the transfer sequentially in two or more separate steps. The term "sequentially transferring multiple items" means transferring multiple items one by one continuously.

[0502] In steps (22) and (22y), from the viewpoint of debris suppression, the gap between the article and the second adhesive layer is preferably 10 μm or more, more preferably 20 μm or more, further preferably 30 μm or more, and particularly preferably 50 μm or more. On the other hand, from the viewpoint of reducing laser irradiation energy and improving positional accuracy, the gap between the article and the second adhesive layer is preferably 500 μm or less, more preferably 300 μm or less, further preferably 200 μm or less, and particularly preferably 100 μm or less.

[0503] In steps (22) and (22y), it is also preferable to irradiate the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer through a photomask. From the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, it is preferable that the photomask includes a light-transmitting portion and a light-shielding portion, and that the region of the light-transmitting portion is within the region of the first substrate that includes the article, more preferably corresponding to the region that includes the article. In addition, the region of the light-shielding portion is preferably above the region of the first substrate that does not include the article, more preferably corresponding to the region that does not include the article.

[0504] From the perspective of reducing process time, suppressing debris, and improving positional accuracy, reactive chemical rays are preferably lasers. Furthermore, from the perspective of reducing process time, reactive chemical rays are also preferably incoherent light. Examples of lasers include solid-state lasers such as YAG lasers, YVO4 lasers, fiber lasers, or semiconductor lasers; and gas lasers such as carbon dioxide lasers, excimer lasers, or argon lasers. The beam shape and spot size of the laser are not limited. Even when the laser spot size is smaller than the workpiece, the laser spot can scan and irradiate the entire surface of the workpiece.

[0505] The maximum wavelength of the active chemical rays is preferably 180 nm or more, more preferably 200 nm or more, even more preferably 240 nm or more, even more preferably 300 nm or more, and particularly preferably 340 nm or more. On the other hand, the maximum wavelength of the active chemical rays is preferably 550 nm or less, more preferably 450 nm or less, even more preferably 420 nm or less, and particularly preferably 400 nm or less. The active chemical rays are also preferably the j-rays (wavelength 313 nm) of a mercury lamp, the i-rays (wavelength 365 nm) of a mercury lamp, the h-rays (wavelength 405 nm) of a mercury lamp, and the g-rays (wavelength 436 nm) of a mercury lamp, and more preferably a mixture of the i-rays, h-rays, and g-rays of a mercury lamp. When the active chemical rays are lasers, the lasers are particularly preferably ArF lasers (wavelength 193 nm), KrF lasers (wavelength 248 nm), XeCl lasers (wavelength 308 nm), XeF lasers (wavelength 351 nm), or YAG lasers (wavelength 266 nm, 355 nm, or 532 nm).

[0506] From the perspective of reducing process time, the laser energy density is preferably 100 mJ / cm². 2 The above, more preferably 300 mJ / cm 2 The above, and more preferably 300 mJ / cm 2 That's all. On the other hand, from the viewpoints of improved yield, increased reliability, debris suppression, and improved positioning accuracy, an energy density of 3000 mJ / cm³ is preferred. 2 The following is more preferably 2000 mJ / cm 2 The preferred value is 1000 mJ / cm. 2 the following.

[0507] <Component substrate; Process for preparing laminate>

[0508] The manufacturing method of the laminate of the present invention preferably further includes a step (30) of preparing a laminate a3 having a component substrate and a third adhesive layer in sequence (hereinafter referred to as step (30)). Examples and preferences related to the laminate a3 are described above. The step of preparing these laminates may also be a step of manufacturing and preparing laminates. In addition, the step of preparing these laminates may also be a step of preparing a manufactured laminate.

[0509] <Component substrate; Process for forming the third adhesive layer>

[0510] The manufacturing method of the present invention preferably further includes a step (31) of forming a third adhesive layer on the component substrate (hereinafter referred to as step (31)). Examples and preferences related to the component substrate and the third adhesive layer are described above. As methods for forming the third adhesive layer in these steps, for example, methods of coating a composition or methods of preparing a film containing the composition can be listed. Examples and preferences related to these methods are the same as those for step (11).

[0511] <Component substrate; process of transferring an article onto a third adhesive layer>

[0512] The manufacturing method of the laminate of the present invention preferably further includes a step (32) of contacting and bonding an article included in the second substrate with a third adhesive layer included in the component substrate, and transferring the article from the second adhesive layer to the third adhesive layer (hereinafter referred to as step (32)). Step (32) is more preferably performed by heating while the article is in contact with and bonded to the third adhesive layer, and more preferably by hot pressing. The manufacturing method of the laminate of the present invention preferably includes a plurality of articles in contact with the third adhesive layer in step (32).

[0513] <Component substrate; the process of transferring an article onto a component substrate>

[0514] The manufacturing method of the laminate of the present invention preferably further includes a step (32J) of contacting and bonding the article included in the second substrate with the component substrate and / or the wiring included in the component substrate, and transferring the article from the second adhesive layer to the component substrate (hereinafter referred to as step (32J)). Furthermore, the manufacturing method of the laminate of the present invention preferably includes step (30) and step (31) when step (32J) is included. Step (32J) is more preferably performed by heating while the article is in contact with and bonded to the component substrate and / or the wiring included in the component substrate, and more preferably by hot pressing.

[0515] The manufacturing method of the laminate of the present invention preferably includes a step (31J) of performing plasma treatment on the component substrate and / or the wiring included in the component substrate (hereinafter referred to as step (31J)). The manufacturing method of the laminate of the present invention preferably includes step (32J) after step (31J). The manufacturing method of the laminate of the present invention preferably includes multiple articles connected to the component substrate and / or the wiring included in the component substrate in step (32J). Examples and preferences related to articles are described as above. The term "multiple articles in step (32)" refers to the state after step (32). The term "multiple articles in step (32J)" refers to the state after step (32J). That is, in step (32), multiple articles are transferred from the second adhesive layer to the third adhesive layer. In addition, in step (32J), multiple articles are transferred from the second adhesive layer to the component substrate. The examples and preferred embodiments of the heating process and the hot pressing process in these processes are the same as those of the process (12).

[0516] The preferred method for manufacturing the laminate of the present invention is to electrically connect the electrode terminals included in the article to the wiring included in the component substrate by solder bonding or by bonding using an anisotropic conductive film during or after step (32).

[0517] The method for manufacturing the laminate of the present invention is preferably used for manufacturing electronic components, electronic devices, mobile bodies, buildings, or windows. Examples of electronic components include: semiconductor devices, antennas, display devices, optical devices, printed wiring substrates, semiconductor packages, and active or passive components including semiconductor devices. Examples and preferred embodiments related to electronic components, semiconductor devices, antennas, display devices, optical devices, printed wiring substrates, semiconductor packages, and active or passive components including semiconductor devices are described above.

[0518] <Schematic cross-sectional view of the manufacturing process of micro LED displays>

[0519] Taking, as an example, the manufacturing process of a micro LED display having an LED as a semiconductor chip, which uses the manufacturing method of the laminate as the third and fourth aspects of the present invention, in Figure 1A schematic cross-sectional view is shown in the figure for illustration. In the figure (1), (step 1) is shown, and the same applies below. (Step 1) First, a pre-baked film containing a positive photosensitive composition, namely a light-absorbing layer 2, is formed on the first substrate (quartz glass substrate) 1. (Step 2) Next, a semiconductor chip (LED) 4 including electrode terminals 4a and having gallium nitride semiconductor is prepared and placed on the donor substrate (sapphire substrate) 3, and the light-absorbing layer 2 is attached to the semiconductor chip 4. (Step 3) Then, a laser 5 is irradiated only on the semiconductor chip 4 from the donor substrate 3 side to transfer the semiconductor chip 4 from the donor substrate 3 to the light-absorbing layer 2. (Step 4) Thereafter, the donor substrate 3 is peeled off from the semiconductor chip 4. (Step 5) Next, the semiconductor chip 4 is used as a mask to irradiate the light-absorbing layer 2 with active chemical rays 6 from the semiconductor chip 4 side to form an exposed light-absorbing layer 7 with alkali solubility and an unexposed light-absorbing layer 8. (Step 6) Next, an alkaline developer is used to develop the light-absorbing layer 7 after exposure, thus obtaining the pattern of the light-absorbing layer 2. Then, the unexposed light-absorbing layer 8 is heated to crosslink it, forming a crosslinked light-absorbing layer 9. (Step 7) Next, a second adhesive layer 11 is formed on the second substrate (alkali-free glass substrate) 10. Thereafter, with a gap between the semiconductor chip 4 and the second adhesive layer, the semiconductor chip 4 is irradiated with a laser 5 from the first substrate 1 side. At this time, the laser 5 is irradiated twice or more to transfer the semiconductor chip 4 from the first substrate 1 to the second adhesive layer 11 sequentially. (Step 8) While suppressing debris during laser transfer, multiple semiconductor chips 4 are transferred to the desired positions on the second adhesive layer 11 with excellent positional accuracy. The laser-irradiated light-absorbing layer 12 is formed on the first substrate 1, or the laser-irradiated light-absorbing layer 12 is not left due to ablation during laser irradiation. Subsequently, a micro LED display is obtained by using an existing chip-first (RDL) manufacturing process, in which semiconductor chips 4 are arranged on a support substrate and metal wiring or interlayer insulating layers are formed.

[0520] The manufacturing processes of steps 1 to 8 are equivalent to the manufacturing method of the laminate as a third aspect of the present invention. Furthermore, the manufacturing processes of steps 1 to 5 or steps 1 to 6 are equivalent to the manufacturing method of the laminate as a fourth aspect of the present invention. Moreover, the laminate obtained in step 5 or step 6 is equivalent to the laminate as a first aspect of the present invention.

[0521] Furthermore, taking the manufacturing process of a micro-LED display having an LED as a semiconductor chip, which utilizes the manufacturing methods of the laminate as the fifth and sixth aspects of the present invention, as an example, in Figure 2The schematic cross-sectional view is shown below for illustration. (Step 1) First, a pre-baked film containing a positive photosensitive composition, namely a light-absorbing layer 2, is formed on a first substrate (quartz glass substrate) 1, and then a pre-baked film containing a positive photosensitive composition, namely a first adhesive layer 2a, is formed. (Step 2) Next, a semiconductor chip (LED) 4, including electrode terminals 4a and having gallium nitride semiconductor, is prepared and placed on a donor substrate (sapphire substrate) 3, and the first adhesive layer 2a is attached to the semiconductor chip 4. (Step 3) Subsequently, a laser 5 is irradiated only on the semiconductor chip 4 from the donor substrate 3 side, transferring the semiconductor chip 4 from the donor substrate 3 to the first adhesive layer 2a. (Step 4) Thereafter, the donor substrate 3 is peeled off from the semiconductor chip 4. (Step 5) Next, using the semiconductor chip 4 as a mask, the light-absorbing layer 2 and the first adhesive layer 2a are irradiated with active chemical rays 6 to form an exposed light-absorbing layer and the first adhesive layer 7a, which are alkali-soluble, as well as an unexposed light-absorbing layer 8 and the unexposed first adhesive layer 8a. (Step 6) Subsequently, the exposed light-absorbing layer and the first adhesive layer 7a are removed using an alkaline developer to obtain the pattern of the light-absorbing layer 2 and the pattern of the first adhesive layer 2a. Then, the unexposed light-absorbing layer 8 and the unexposed first adhesive layer 8a are heated to crosslink them, forming a crosslinked light-absorbing layer 9 and a crosslinked first adhesive layer 9a. (Step 7) Next, a second adhesive layer 11 is formed on the second substrate (alkali-free glass substrate) 10. Thereafter, with a gap between the semiconductor chip 4 and the second adhesive layer, the semiconductor chip 4 is irradiated with laser 5 from the first substrate 1. At this time, the semiconductor chip 4 is transferred from the first substrate 1 to the second adhesive layer 11 by irradiating with laser 5 twice or more. (Step 8) While suppressing debris during laser transfer, multiple semiconductor chips 4 are transferred to the desired positions on the second adhesive layer 11 with excellent positioning accuracy. A light-absorbing layer and a first adhesive layer 12a are formed on the first substrate 1 after laser irradiation, or the light-absorbing layer and the first adhesive layer 12a are left unretained due to ablation during laser irradiation. Subsequently, a micro-LED display is obtained using a conventional chip-to-RDL manufacturing process, where semiconductor chips 4 are arranged on a support substrate or the like, and metal wiring or interlayer insulating layers are formed.

[0522] The manufacturing processes of steps 1 to 8 are equivalent to the manufacturing method of the laminate as the fifth aspect of the present invention. Furthermore, the manufacturing processes of steps 1 to 5 or steps 1 to 6 are equivalent to the manufacturing method of the laminate as the sixth aspect of the present invention. Moreover, the laminate obtained in step 5 or step 6 is equivalent to the laminate as the second aspect of the present invention.

[0523] Taking, as an example, the manufacturing process of a micro-LED display having an LED as a semiconductor chip, which uses the manufacturing method of the laminate as the seventh and eighth aspects of the present invention, in Figure 3 The schematic cross-sectional view is shown for illustration. (Step 1) First, a pre-baked film containing a positive photosensitive composition, namely a light-absorbing layer 2, is formed on a first substrate (quartz glass substrate) 1. (Step 2) Next, a semiconductor chip (LED) 4, including electrode terminals 4a and having gallium nitride semiconductor, is prepared and placed on a donor substrate (sapphire substrate) 3, and the light-absorbing layer 2 is bonded to the semiconductor chip 4. (Step 3) Subsequently, a laser 5 is irradiated onto the semiconductor chip 4 from the donor substrate 3 side, and the light-absorbing layer 2 is irradiated with the laser 5 using the semiconductor chip 4 as a mask. The semiconductor chip 4 after laser 5 irradiation is transferred from the donor substrate 3 to the light-absorbing layer 2, and the light-absorbing layer 2 at the laser-irradiated portion is removed to form an unexposed light-absorbing layer 8. That is, in this step, the semiconductor chip 4 is transferred to the light-absorbing layer 2, and a pattern of the light-absorbing layer 2 is obtained. (Step 4) Thereafter, the donor substrate 3 is peeled off from the semiconductor chip 4. (Step 5) Next, the unexposed light-absorbing layer 8 is heated to crosslink it, forming a crosslinked light-absorbing layer 9. (Step 6) Then, a second adhesive layer 11 is formed on the second substrate (alkali-free glass substrate) 10. Thereafter, with a gap between the semiconductor chip 4 and the second adhesive layer, the semiconductor chip 4 is irradiated with a laser 5 from the first substrate 1 side. At this time, the laser 5 is irradiated twice or more to transfer the semiconductor chip 4 from the first substrate 1 to the second adhesive layer 11 sequentially. (Step 7) While suppressing debris during laser transfer, multiple semiconductor chips 4 are transferred to the desired positions on the second adhesive layer 11 with excellent positional accuracy. The light-absorbing layer 12 after laser irradiation is formed on the first substrate 1, or the light-absorbing layer 12 after laser irradiation is not left due to ablation during laser irradiation. Thereafter, a micro LED display is obtained by using the existing chip-first (RDL) manufacturing process, in which the semiconductor chip 4 is arranged on a support substrate or the like and metal wiring or interlayer insulating layer is formed.

[0524] The manufacturing processes of steps 1 to 7 are equivalent to the manufacturing method of the laminate as the seventh aspect of the present invention. Furthermore, the manufacturing processes of steps 1 to 4 or steps 1 to 5 are equivalent to the manufacturing method of the laminate as the eighth aspect of the present invention. Moreover, the laminate obtained in step 4 or step 5 is equivalent to the laminate as the first aspect of the present invention.

[0525] Example

[0526] The present invention will be described in more detail below with examples, reference examples, and comparative examples, but the present invention is not limited to these scopes. Furthermore, for compounds used with abbreviations in the following description or tables, the corresponding names are shown in Tables 1-2. The structures corresponding to the abbreviations ADMS1, ADMS2, and OADA are shown below.

[0527] [Table 1-2]

[0528]

[0529] [Chemistry 1]

[0530]

[0531] <Synthesis Examples of Various Resins>

[0532] As the (A) adhesive resin, the compositions of the resins obtained in Synthesis Examples 1 to 19 are shown in Tables 1-3 to 1-5. Each resin was synthesized using existing methods, with appropriate changes to the monomeric compounds or copolymerization ratios as monomers, based on methods described in existing literature. The copolymerization ratios of the monomers are as shown in Tables 1-3 to 1-5.

[0533] In Synthesis Example 3, DFA, as an esterifying agent, was reacted with the amic acid structural unit in the resin to convert its structure into an amic acid ester structural unit with a methyl group.

[0534] In Synthesis Example 10, ...

Claims

1. A method for manufacturing a laminate, comprising: (10) a step of preparing a laminate a1x having a first substrate and a light-absorbing layer in sequence; (12) The process of temporarily fixing the item to the light-absorbing layer (hereinafter referred to as process (12)). (13) The process of patterning the light absorption layer (hereinafter referred to as process (13)); (20) A process for preparing a laminate a2 having a second substrate and a second adhesive layer in sequence; and (22) In the process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer and transferring the article from the light-absorbing layer to the second adhesive layer with a gap provided between the article included in the first substrate and the second adhesive layer included in the second substrate (hereinafter referred to as process (22)), in the method for manufacturing the laminate, In step (12), there are multiple articles in contact with the light-absorbing layer, and in step (13), a recess is formed in the light-absorbing layer.

2. The method for manufacturing a laminate according to claim 1, wherein, In step (13), the compressive elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 Pa and / or in the process of (13), the glass transition temperature of the light absorption layer is -50°C to 150°C.

3. The method for manufacturing a laminate according to claim 1 or 2 further comprises (01) a step of forming an article on a substrate. The (12) process includes (12a) irradiating the article with active chemical rays from the side of the article on the subject substrate while the article included in the subject substrate is in contact with the light-absorbing layer included in the first substrate and transferring the article from the subject substrate to the light-absorbing layer (hereinafter referred to as the (12a) process). In step (12a), the article is used as a mask to irradiate the light-absorbing layer with active chemical rays, and at least a portion of the light-absorbing layer irradiated with active chemical rays is removed.

4. The method for manufacturing a laminate according to claim 1 or 2, wherein, In step (13), the light-absorbing layer exists as a plurality of light-absorbing layers for protrusions and a plurality of light-absorbing layers for recesses when in contact with the first substrate, and the thickness of the light-absorbing layer for the recesses is less than the thickness of the light-absorbing layers for the plurality of protrusions. Furthermore, each of the plurality of items is independently connected to at least one of the light-absorbing layers of the plurality of protrusions.

5. The method for manufacturing a laminate according to claim 1 or 2, wherein, In the (13) process, the light-absorbing layer exists as a plurality of island-shaped light-absorbing layers in a state of contact with the first substrate, and the plurality of articles are each independently contacted with at least one of the plurality of island-shaped light-absorbing layers.

6. The method for manufacturing a laminate according to claim 1 or 2, wherein, In step (13), any one of the following conditions (a) to (c) is satisfied: (a) The light-absorbing layer is a layer containing a positive photosensitive composition, and (13) the process includes (13a) a process of patterning the light-absorbing layer by photolithography (hereinafter referred to as (13a) process). (b) The light-absorbing layer is a layer containing a positive or negative photosensitive composition, and process (13) includes process (13b) of patterning the light-absorbing layer by etching (hereinafter referred to as process (13b)). (c) The light-absorbing layer is a layer containing a non-photosensitive composition, and (13) the process includes (13b) a process of patterning the light-absorbing layer by etching, thereby the compressive elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 The glass transition temperature of Pa and / or the light absorption layer is -50℃ to 150℃.

7. The method for manufacturing a laminate according to claim 6, wherein, In step (13), the condition of (a) is satisfied. The process (13a) includes (13a-1) irradiating the light-absorbing layer with active chemical rays using the article as a mask from the article side of the light-absorbing layer, and (13a-2) patterning the light-absorbing layer by developing it with a developing solution.

8. The method for manufacturing a laminate according to claim 6, wherein, In step (13), the condition of (c) is satisfied. The (13b) process includes (13b-1a) a process of dry etching the light-absorbing layer using the article as a mask from the article side of the light-absorbing layer to form a pattern, or (13b-1b) a process of wet etching the light-absorbing layer using the article as a mask from the article side of the light-absorbing layer to form a pattern.

9. The method for manufacturing a laminate according to claim 1 or 2, wherein, Before or after step (13), there is also a step (14) to cross-link the pattern of the light-absorbing layer (hereinafter referred to as step (14)). The process (14) includes (14a) a process of heating the pattern of the light-absorbing layer to crosslink it, or (14b-1) a process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer.

10. A method for manufacturing a laminate, comprising: (10) a step of preparing a laminate a1x having a first substrate and a light-absorbing layer in sequence; (12z) The process of temporarily fixing an item to the light-absorbing layer and etching the light-absorbing layer (hereinafter referred to as the (12z) process). (20) A process for preparing a laminate a2 having a second substrate and a second adhesive layer in sequence; and (22) In the process of irradiating the light-absorbing layer with active chemical rays from the first substrate side of the light-absorbing layer and transferring the article from the light-absorbing layer to the second adhesive layer with a gap provided between the article included in the first substrate and the second adhesive layer included in the second substrate (hereinafter referred to as process (22)), in the method for manufacturing the laminate, In the (12z) process, there are multiple articles in contact with the light-absorbing layer, and in the (12z) process, a recess is formed in the light-absorbing layer.

11. A laminated body comprising, in sequence, a first substrate, a light-absorbing layer, and an article, wherein, The device comprises a plurality of articles in contact with the light-absorbing layer, and the light-absorbing layer has a recess. The compressive elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10⁻⁶. 3 Pa ~ 2.0 × 10 9 The glass transition temperature of Pa and / or the light-absorbing layer is -50℃ to 150℃.

12. The laminate according to claim 11, wherein, When in contact with the first substrate, the light-absorbing layer exists as a plurality of convex light-absorbing layers and a plurality of concave light-absorbing layers, wherein the thickness of the concave light-absorbing layer is less than the thickness of the plurality of convex light-absorbing layers. Furthermore, each of the plurality of items is independently connected to at least one of the light-absorbing layers of the plurality of protrusions.

13. The laminate according to claim 11, wherein, The light-absorbing layer exists as a plurality of island-shaped light-absorbing layers when it is in contact with the first substrate, and the plurality of articles are each independently in contact with at least one of the plurality of island-shaped light-absorbing layers.

14. The laminate according to claim 12 or 13, wherein, The thickness of the light-absorbing layer is less than 5.0 μm.

15. The laminate according to claim 12 or 13, wherein, The light-absorbing layer is a layer containing a positive photosensitizing composition.

16. The laminate according to claim 13, wherein, Let the area of ​​the first a surface of the light-absorbing layer, which is the first substrate side, be (S). 1a The area of ​​the second surface of the light-absorbing layer facing the first surface is set as (S). 2a When ), the relationship of equation (S-1) is satisfied. (S 1a )≥(S 2a ) (S-1)。 17. The laminate according to claim 16, wherein, The area (S) of the first surface 1a ) and the area (S) of the second surface 2a The ratio of ) is set as (S) 1a ) / (S 2a When (S) 1a ) / (S 2a The value is above 1.10 and below 3.

00.

18. The laminate according to claim 12 or 13, wherein, The maximum absorbance of the light-absorbing layer per 1.0 μm of thickness in the wavelength range of 180 nm to 550 nm is 0.3 to 10.

0.

19. The laminate according to claim 12 or 13, wherein, The light-absorbing layer contains (XDa) ultraviolet absorber. The (XDa) ultraviolet absorber is contained in a resin having a triazine structure and / or a benzotriazole structure in the structural unit of the resin.

20. The laminate according to claim 12 or 13, wherein, The light-absorbing layer satisfies any one of the following conditions (α) to (γ). (α) The light-absorbing layer is a layer formed of a positive photosensitive composition, and the positive photosensitive composition satisfies at least one of the following conditions (1), (3) and (4). (β) The light-absorbing layer is a layer formed of a negative photosensitive composition, and the negative photosensitive composition satisfies at least one of the following conditions (2) to (4). (γ) The light-absorbing layer is a layer formed of a non-photosensitive composition, and the non-photosensitive composition satisfies the following condition (5) and / or the following condition (6). (1) Contains (C1) naphthoquinone diazide compound and (F) crosslinking agent (2) Compounds containing (C2) photopolymerization initiator and (B) free radical polymerizable compounds (3) Contains (C3) photoacid generator and (F) crosslinking agent (4) Contains (C4) light alkali generating agent and (F) crosslinking agent (5) Contains (F) crosslinking agent (6) Compounds containing (B) free radical polymerizable compounds.

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