A copper foil bending and attaching mechanism and an attaching method thereof
Patent Information
- Application Number
- CN202610747401.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-05-28
- Publication Date
- 2026-08-18
AI Technical Summary
[0004]为解决上述缺陷,本发明提供一种铜箔折弯贴合机构及其贴合方法,以解决现有技术中屏幕侧边及邦定区铜箔贴合效率低、精度差、一致性不佳的技术问题
[0022] (1) High degree of automation and high efficiency: Through the precise linkage of the horizontal movement and rotation of the adsorption platform and the two-dimensional motion module, the entire process from positioning, bending to bonding is automated, and the bonding operation of multiple sides of the screen can be completed continuously, which greatly improves production efficiency.
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Figure CN122583472A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of automated bonding equipment technology, and more specifically, to a bending bonding mechanism and bonding method for bonding copper foil to the side and bonding area of a silicon-based OLED display. Background Technology
[0002] With the rapid development of near-eye display devices such as augmented reality (AR) and virtual reality (VR), silicon-based OLED (Micro-OLED) screens have become core display devices due to their advantages such as high resolution, high contrast, and fast response speed. However, at high pixel densities, power consumption and heat generation increase significantly, and heat dissipation directly affects the brightness, color stability, and lifespan of the display. Therefore, highly thermally and electrically conductive copper foil is typically attached to the back, sides, and bonding area of the screen to achieve both heat dissipation and electromagnetic shielding.
[0003] Existing technologies offer mature automated solutions for copper foil lamination in planar areas. However, for the sides of the screen (which typically have curved or right-angle transitions) and raised bonding areas, flexible copper foil needs to be three-dimensionally bent and tightly bonded, a process currently mostly completed manually or with semi-automatic auxiliary tools. This method has several drawbacks: low efficiency, poor consistency, difficulty in controlling bonding pressure (easily causing air bubbles or damaging the screen), and difficulty in guaranteeing bending angle and positional accuracy, becoming one of the key bottlenecks restricting the mass production of high-precision screens. Therefore, there is an urgent need for a dedicated device capable of achieving high-precision, high-consistency, and automated bending and bonding. Summary of the Invention
[0004] To address the aforementioned shortcomings, this invention provides a copper foil bending and bonding mechanism and its bonding method, thereby resolving the technical problems of low bonding efficiency, poor precision, and inconsistent bonding of copper foil on the screen side and bonding area in the prior art.
[0005] In a first aspect, the present invention provides a copper foil bending and bonding mechanism, comprising: an adsorption platform for supporting and fixing a screen to be bonded; a two-dimensional motion module for driving an execution component to move in the horizontal and vertical directions; and a bonding roller assembly installed at the output end of the two-dimensional motion module for rolling and bending the copper foil placed on the side and bonding area of the screen on the adsorption platform.
[0006] In one embodiment of the present invention, the adsorption platform includes: a jig traversing module; a jig rotating platform disposed at the movable end of the jig traversing module; and an adsorption jig mounted on the jig rotating platform for adsorbing and fixing the screen to be bonded; wherein the jig traversing module and the jig rotating platform are each driven by an independent driving device.
[0007] In one embodiment of the present invention, the two-dimensional motion module includes: a horizontal linear module, the driving end of which is connected to a horizontal servo motor; a vertical mounting plate, which is perpendicularly connected to the movable end of the horizontal linear module; and a vertical linear module, which is mounted on the vertical mounting plate and whose driving end is connected to a vertical servo motor.
[0008] In one embodiment of the present invention, the bonding roller assembly includes: a mounting substrate connected to the output end of the two-dimensional motion module; a support member slidably connected to the mounting substrate via a linear guide mechanism; a large roller mounted on one side of the support member for bending the copper foil on the side of the screen; and a small roller assembly mounted on the support member and having a height difference with the large roller for pressing the copper foil in the bonding area of the screen.
[0009] In one embodiment of the present invention, the small roller assembly includes: at least one pair of adjusting plates mounted on both ends of the support member; a bearing seat connected to the adjusting plates by a first fastener; a roller mounting shaft with both ends mounted on the bearing seat; and a small roller sleeved on the roller mounting shaft.
[0010] In one embodiment of the present invention, the support member has an oblong hole extending in the vertical direction, and the bearing seat is connected to the support member by a second fastener passing through the oblong hole to adjust the installation height of the small roller.
[0011] In one embodiment of the present invention, the bonding roller assembly further includes a pressure control mechanism, the pressure control mechanism comprising: an elastic element disposed between the mounting base and the support member, for providing a pressing force toward the screen to the support member and the roller mounted thereon; a guide rod sleeved within the elastic element, one end of which is slidably connected to the support member or a limiting plate connected to the support member, and the other end of which is provided with a limiting ring and a fixing ring; and a force sensor disposed between the fixing ring and the mounting base, for detecting the magnitude of the pressing force.
[0012] Secondly, the present invention provides a bonding method for a copper foil bending and bonding mechanism, comprising the following steps:
[0013] S1: After the front-end equipment has finished attaching the copper foil on the back of the screen, the screen is placed on the adsorption fixture of the adsorption platform and adsorbed and fixed.
[0014] S2: The adsorption platform transports the screen to the bonding station;
[0015] S3: The horizontal linear module of the two-dimensional motion module drives the bonding roller assembly to move forward, so that the large roller presses against the arc edge of the adsorption fixture and applies a preset pressure through the spring;
[0016] S4: The vertical linear module of the two-dimensional motion module drives the bonding roller assembly to move upward, so that the large roller moves upward along the arc edge, gradually bending and bonding the copper foil on the side of the screen.
[0017] S5: After the side bonding is completed, the vertical straight module continues to move upward until the center height of the small roller is flush with the copper foil bend of the screen bonding area;
[0018] S6: The horizontal linear module drives the bonding roller assembly forward again, so that the small roller presses and bonds the copper foil in the bonding area.
[0019] S7: After the bonding of one side of the screen is completed, the adsorption platform drives the screen to rotate at a set angle, and repeats steps S3-S6 until the copper foil bending and bonding of multiple sides of the screen is completed.
[0020] In one embodiment of the present invention, the surface adhesion of the small roller can be replaced or adjusted depending on whether the copper foil has a release film.
[0021] In summary, this invention provides a copper foil bending and bonding mechanism and its bonding method. The beneficial effects of this invention are:
[0022] (1) High degree of automation and high efficiency: Through the precise linkage of the horizontal movement and rotation of the adsorption platform and the two-dimensional motion module, the entire process from positioning, bending to bonding is automated, and the bonding operation of multiple sides of the screen can be completed continuously, which greatly improves production efficiency.
[0023] (2) High bonding quality and good consistency: The composite rolling process of large roller bending and small roller precision pressing, combined with an adsorption fixture with an arc-shaped guide edge, achieves smooth and wrinkle-free bending of copper foil along complex three-dimensional contours. The closed-loop pressure control system ensures that the bonding force is uniform and constant each time, effectively avoiding problems such as air bubbles, incomplete bonding or screen damage.
[0024] (3) High precision and high adaptability: The high-precision linear module driven by the servo motor ensures the accuracy of the motion trajectory. The height-adjustable design of the small roller assembly allows it to adapt to the height differences of the bonding area of different screen models, enhancing the versatility of the equipment.
[0025] (4) Intelligent control: The introduction of force sensors makes the bonding process monitorable, feedbackable and adjustable, laying the foundation for digital management and adaptive control of process parameters and improving the stability and reliability of the process. Attached Figure Description
[0026] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the copper foil bending and bonding mechanism in one embodiment of the present invention.
[0027] Figure 2for Figure 1 A three-dimensional structural diagram of the adsorption platform.
[0028] Figure 3 for Figure 1 A schematic diagram of the three-dimensional structure of the two-dimensional motion module.
[0029] Figure 4 for Figure 1 A three-dimensional structural diagram of the in-line bonding roller assembly.
[0030] Figure 5 for Figure 1 A three-dimensional structural diagram of the in-line bonding roller assembly.
[0031] Figure 6 This is a schematic diagram of the product before bending and bonding.
[0032] Figure 7 This is a schematic diagram of the product after bending and bonding.
[0033] Description of main elements:
[0034] 1. Adsorption platform; 11. Fixture lateral movement module; 12. Fixture rotation platform; 13. Adsorption fixture;
[0035] 2. Two-dimensional motion module; 21. Horizontal linear module; 22. Vertical mounting plate; 23. Vertical linear module;
[0036] 3. Adhesive roller assembly; 31. Mounting base plate; 32. Linear guide mechanism; 33. Support member; 331. Oval hole;
[0037] 34. Large roller; 35. Small roller assembly; 351. Adjusting plate; 352. Bearing housing; 353. Roller mounting shaft; 354. Small roller; 355. First fastener;
[0038] 4. Pressure control mechanism; 41. Spring; 42. Force sensor; 43. Limit plate; 44. Fixing ring; 45. Limit ring;
[0039] 5. Screen; 6. FPC; 7. Copper foil. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to represent selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0041] Please see Figures 1 to 7 This invention provides a copper foil bending and bonding mechanism and bonding method, specifically for precisely attaching copper foil 7 to the side and bonding area (usually adjacent to the flexible circuit board FPC 6) of a silicon-based OLED screen 5 to achieve heat dissipation and electromagnetic shielding functions.
[0042] like Figure 1 As shown, the copper foil bending and bonding mechanism of the present invention mainly includes three core parts: an adsorption platform 1 for supporting and positioning the screen 5, a two-dimensional motion module 2 for providing precise two-dimensional motion, and a bonding roller assembly 3 for performing pressing and bending actions.
[0043] Adsorption platform 1 is the basic positioning unit of the mechanism. For example... Figure 2 As shown, it mainly consists of a jig traversing module 11, a jig rotating platform 12, and an adsorption jig 13.
[0044] The fixture traversing module 11 preferably employs a high-precision linear motor module or a ball screw linear module, whose movable end can move precisely along the horizontal direction (e.g., the Y-axis). The fixture rotating platform 12 (e.g., a hollow rotating platform or a DD direct drive motor) is fixedly mounted on the movable end of the fixture traversing module 11 and can be driven by an independent rotary drive device (e.g., a servo motor) to achieve precise rotational positioning within a range of 0° to 360°. The adsorption fixture 13 is fixedly mounted on the upper surface of the fixture rotating platform 12. The adsorption fixture 13 has multiple vacuum adsorption holes and is used to adsorb and fix the screen to be bonded. When the screen 5 is placed on the adsorption fixture 13, the vacuum system is activated, and the negative pressure generated by the adsorption holes firmly adsorbs and fixes the screen 5. The fixture traversing module 11 and the fixture rotating platform 12 are driven by independent servo motors or other drive devices, realizing the horizontal position switching and angle adjustment of the screen 5 in the horizontal plane, providing a basis for multi-sided continuous bonding.
[0045] The two-dimensional motion module 2 is used to drive the bonding roller assembly 3 to move in the horizontal and vertical directions (such as the X and Z axes) to plan a precise bending and bonding trajectory. Figure 1 and Figure 3 As shown, it includes a horizontal linear module 21, a vertical mounting plate 22, and a vertical linear module 23.
[0046] The horizontal linear module 21 is fixed to the frame via its mounting base, and its movable end can move along the X-axis (i.e., towards or away from the screen 5). The drive end of the horizontal linear module 21 is connected to a horizontal servo motor, providing high-precision, high-response horizontal feed power. The vertical mounting plate 22 is a rigid plate, its bottom perpendicularly connected to the movable end of the horizontal linear module 21, thus allowing it to move together with the horizontal linear module 21. The vertical linear module 23 is fixedly mounted on the side of the vertical mounting plate 22, and its movable end can move along the Z-axis (i.e., vertical up-down direction). The drive end of the vertical linear module 23 is also connected to a vertical servo motor. The horizontal linear module 21 and the vertical linear module 23 work together to control the contact roller assembly 3 mounted at their ends to move along any path in the XZ plane.
[0047] The bonding roller assembly 3 is the execution unit that directly performs the copper foil bending and pressing functions, such as... Figure 1 , Figure 4 and Figure 5 As shown, the bonding roller assembly 3 mainly includes a mounting base plate 31, a linear guide mechanism 32, a support member 33, a large roller 34, a small roller assembly 35, and a pressure control mechanism 4.
[0048] The mounting base plate 31 is fixedly connected to the output end of the two-dimensional motion module 2 (i.e., the movable end of the vertical linear module 23). The support member 33 is slidably connected to the mounting base plate 31 via a linear guide mechanism 32. Specifically, the linear guide mechanism 32 may include two parallel linear guide rails mounted on the mounting base plate 31 and a corresponding slider, which is fixed to the support member 33. This design allows the support member 33 (and all the rollers mounted on it) to float freely and slightly relative to the mounting base plate 31 along the X-axis direction.
[0049] The large roller 34 is mounted on one side of the support 33 (the side closest to the screen 5) via bearings and a pivot. The large roller 34 has a large diameter and its outer edge is covered with a flexible material (such as silicone). It is mainly responsible for guiding and initially bending and bonding the copper foil 7 on the side of the screen 5.
[0050] The small roller assembly 35 is mounted on the support member 33. The specific structure of the small roller assembly 35 includes: a pair of adjusting plates 351, respectively fixed to both ends of the support member 33 by screws; two bearing seats 352, each bearing seat 352 connected to the corresponding adjusting plate 351 by a first fastener 355 (such as a screw); a roller mounting shaft 353, whose two ends are supported on the two bearing seats 352 by bearings; and a small roller 354, which is sleeved on the roller mounting shaft 353 by bearings. There is a certain height difference between the small roller 354 and the large roller 34 to accommodate the curved side surface of the screen 5 and the upper bonding area plane, respectively. The small roller 354 has a smaller diameter and is used for the final precision pressing of the copper foil 7 in the bonding area. To accommodate the height differences of the bonding areas of different screen models 5, the support member 33 has an oblong hole 331 extending vertically. The bearing seat 352 is connected to the support member 33 by a second fastener passing through the oblong hole 331. Loosen the second fastener to slide the bearing seat 352 up and down, thereby adjusting the height of the small roller 354 relative to the support 33 and the large roller 34. After adjustment, tighten it. It is highly versatile.
[0051] The pressure control mechanism 4 is used to provide constant and monitorable contact pressure during the bonding process. For example... Figure 4 and Figure 5 As shown, it mainly includes a spring 41, a force sensor 42, a limiting plate 43, a fixing ring 44, and a limiting ring 45.
[0052] The limiting plate 43 is fixedly connected to the back of the support member 33. One end of the guide rod (covered by the spring 41 in the figure) is slidably connected to the limiting plate 43, and the other end is provided with a limiting ring 45 and a fixing ring 44. The spring 41 is sleeved on the guide rod, and its two ends are respectively abutted by the limiting plate 43 and the limiting ring 45 and fixing ring 44 installed on the guide rod. The elastic force of the spring 41 is transmitted to the support member 33 through the limiting plate 43, so that the support member 33 has a tendency to drive the large roller 34 and the small roller 354 to press towards the screen 5. The force sensor 42 (such as a weighing sensor or a pressure sensor) is installed between the fixing ring 44 and the mounting base plate 31. When the roller contacts the screen and generates pressure, the reaction force is transmitted to the fixing ring 44 through the support member 33, the limiting plate 43, and the guide rod, and is then detected in real time by the force sensor 42. This pressure signal is fed back to the control system, forming a closed-loop control circuit. Based on this feedback signal, the control system can adjust the position of the guide rod by adjusting the electric proportional valve of the drive cylinder (controlling the air pressure to change the spring preload) or by directly controlling a micro-feed motor, thereby achieving precise and dynamic control of the bonding pressure, ensuring that the pressure is stable at the set value, and avoiding damage to the screen due to excessive pressure or poor bonding due to insufficient pressure.
[0053] Combination Figure 6 and Figure 7Our organization's workflow, namely the copper foil bending and bonding method, specifically includes the following steps:
[0054] S1: Loading and Fixing. After the front-end automated equipment (such as a flat film laminating machine) has laminated the copper foil 7 on the main plane of the back of the screen 5, the robotic arm transfers the screen 5 (with the copper foil already laminated on the main surface and the copper foil 7 to be bent pre-laid on the sides and bonding area) onto the adsorption fixture 13 of this mechanism. The vacuum is activated to firmly adsorb and fix the screen 5.
[0055] S2: Transport and positioning. The jig lateral movement module 11 is activated, moving the entire adsorption platform 1 and screen 5 horizontally from the loading station to the bonding station, so that the side of the screen 5 to be bonded is precisely aligned with the large roller 34 of the bonding roller assembly 3.
[0056] S3: Horizontal feed and pre-pressure. The horizontal linear module 21 of the two-dimensional motion module 2 drives the entire bonding roller assembly 3 to move towards the screen 5. The large roller 34 slowly approaches and finally gently presses against the preset arc-shaped edge of the adsorption fixture 13. At this time, the spring 41 is further compressed, and the pressure value detected by the force sensor 42 reaches the preset initial bonding pressure.
[0057] S4: Side bending and bonding. The vertical straight module 23 is activated, driving the bonding roller assembly 3 to move at a constant speed along the positive Z-axis (upward). During this process, the large roller 34 rolls upward along the arc-shaped guide surface of the adsorption fixture 13, smoothly and progressively bending the copper foil 7 covering the side of the screen 5, and using constant pressure to roll and bond it to the curved surface of the side of the screen 5, as shown. Figure 7 The fit of the middle and side edges is shown in the figure.
[0058] S5: Height Adjustment. After the large roller 34 completes the bending and bonding of the side copper foil 7, the vertical straight module 23 continues to move upward by a precisely set distance. This distance ensures that the central axis of the small roller 354 is aligned with the bonding surface of the screen 5 bonding area (i.e., the stepped plane above the side, usually led out by the FPC 6).
[0059] S6: Bonding Area Pressing and Laying. The horizontal linear module 21 restarts, driving the laminating roller assembly 3 to move forward. The small roller 354 moves forward, contacts the copper foil 7 above the bonding area, and rolls and lays it flat on the bonding area plane until the area is completely covered, as shown. Figure 7 The bonding effect of the middle bonding zone is shown. Throughout steps S4 and S6, the force sensor 42 continuously monitors the pressure to ensure its stability.
[0060] S7: Rotation and Cycling. After completing the bonding of one side of screen 5, the fixture rotation platform 12 of the adsorption platform 1 drives the adsorption fixture 13 and screen 5 to rotate 90° (or other preset angle). After rotating into position, repeat steps S3 to S6 to bond the copper foil to the next side and bonding area of screen 5. This cycle continues until all sides of screen 5 that need to be bonded (usually three adjacent sides) are completed.
[0061] Furthermore, during the bonding area pressing process using the small roller 354 (step S6), small rollers with different surface properties can be selected based on the process state of the copper foil 7. For example, if the copper foil 7 has a release film on its surface, a silicone roller with high adhesion can be used to peel off the release film while pressing, utilizing its adhesiveness; if the copper foil 7 is a bare material, a smooth silicone or metal roller can be used to provide a flat pressing effect. The small roller 354 can be designed as a quick-change structure for easy adjustment according to process requirements.
[0062] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A copper foil bending and bonding mechanism, characterized in that, It includes: An adsorption platform is used to support and fix the screen to be bonded. A two-dimensional motion module is used to drive the actuators to move in the horizontal and vertical directions; The bonding roller assembly is installed at the output end of the two-dimensional motion module and is used to roll and bend the copper foil on the side of the screen and the bonding area placed on the adsorption platform.
2. The copper foil bending and bonding mechanism as described in claim 1, characterized in that: The adsorption platform includes: Fixture lateral movement module; A jig rotation platform is located at the movable end of the jig lateral movement module; An adsorption fixture is installed on the rotating platform of the fixture and is used to adsorb and fix the screen to be bonded. The jig traverse module and the jig rotation platform are each driven by an independent drive device.
3. The copper foil bending and bonding mechanism as described in claim 1, characterized in that: The two-dimensional motion module includes: The horizontal linear module has its drive end connected to a horizontal servo motor. A vertical mounting plate is perpendicularly connected to the movable end of the horizontal linear module; A vertical linear module is mounted on the vertical mounting plate, and its drive end is connected to a vertical servo motor.
4. The copper foil bending and bonding mechanism as described in claim 1, characterized in that: The bonding roller assembly includes: The mounting base is connected to the output end of the two-dimensional motion module; The support member is slidably connected to the mounting base plate via a linear guide mechanism; A large roller, installed on one side of the support member, is used to bend the copper foil on the side of the screen; The small roller assembly is mounted on the support and has a height difference with the large roller, and is used to press the copper foil in the screen bonding area.
5. The copper foil bending and bonding mechanism according to claim 4, characterized in that, The small roller assembly includes: At least one pair of adjustment plates are installed at both ends of the support member; The bearing housing is connected to the adjusting plate via a first fastener; The roller mounting shaft has its two ends mounted on the bearing seats; The small roller is fitted onto the roller mounting shaft.
6. The copper foil bending and bonding mechanism according to claim 5, characterized in that, The support member has an oblong hole extending vertically, and the bearing seat is connected to the support member by a second fastener passing through the oblong hole to adjust the installation height of the small roller.
7. The copper foil bending and bonding mechanism according to claim 4, characterized in that, The bonding roller assembly further includes a pressure control mechanism, the pressure control mechanism comprising: An elastic element is disposed between the mounting base and the support member to provide a pressing force toward the screen to the support member and the rollers mounted thereon; A guide rod is sleeved inside an elastic element. One end of the guide rod is slidably connected to the support member or a limiting plate connected to the support member, and the other end is provided with a limiting ring and a fixing ring. A force sensor is disposed between the retaining ring and the mounting base plate, and is used to detect the magnitude of the clamping force.
8. A bonding method for a copper foil bending and bonding mechanism, characterized in that, Includes the following steps: S1: After the front-end equipment has finished attaching the copper foil on the back of the screen, the screen is placed on the adsorption fixture of the adsorption platform and adsorbed and fixed. S2: The adsorption platform transports the screen to the bonding station; S3: The horizontal linear module of the two-dimensional motion module drives the bonding roller assembly to move forward, so that the large roller presses against the arc edge of the adsorption fixture and applies a preset pressure through the spring; S4: The vertical linear module of the two-dimensional motion module drives the bonding roller assembly to move upward, so that the large roller moves upward along the arc edge, gradually bending and bonding the copper foil on the side of the screen. S5: After the side bonding is completed, the vertical straight module continues to move upward until the center height of the small roller is flush with the copper foil bend of the screen bonding area; S6: The horizontal linear module drives the bonding roller assembly forward again, so that the small roller presses and bonds the copper foil in the bonding area. S7: After the bonding of one side of the screen is completed, the adsorption platform drives the screen to rotate at a set angle, and repeats steps S3-S6 until the copper foil bending and bonding of multiple sides of the screen is completed.
9. The bonding method according to claim 8, characterized in that, The surface adhesion of the small roller can be replaced or adjusted depending on whether the copper foil has a release film.