A soldering apparatus and a soldering method having a tin removal package structure

Abstract

This invention provides a soldering device with a desoldering structure, comprising a solder pot assembly, a transfer mechanism, a loading assembly, and a desoldering assembly. The desoldering assembly is mounted on the transfer assembly and located below the loading assembly. It includes two opposing pull plates and a desoldering drive unit that drives the two pull plates to move towards each other. It also includes a scraper ring located between the two pull plates and pulsatorically connected to them. When the desoldering drive unit drives the two pull plates to move in opposite directions, the two pull plates pull the scraper ring, causing its diameter to decrease. When the desoldering drive unit drives the two pull plates to move towards each other, the inner diameter of the scraper ring elastically recovers. This technical solution removes the solder slick formed on the pins after immersion in solder, ensuring that the molten solder is evenly coated on the pins, thus guaranteeing the quality of the soldering.

Description

Technical Field

[0001] This invention relates to the field of soldering equipment technology, and specifically to a soldering device and soldering method with a desoldering structure. Background Technology

[0002] Coils are one of the most common components in electronic products. Among them, wireless charging coils are a type of coil that achieves wireless charging based on the principle of electromagnetic induction.

[0003] After the wireless charging coil is wound, it usually needs to be soldered at the ends of the two leads to ensure the coil leads can be soldered later and to ensure the effective conductive area and performance of the leads.

[0004] Currently, there are some soldering devices for wireless charging coil leads on the market. They mainly use a dipping process to complete the soldering work. Specifically, it includes a solder pot assembly that carries solder liquid and a transport mechanism for moving the coil toward the solder pot assembly. When the transport mechanism moves the coil above the solder pot assembly and inserts the coil's downward-facing pins into the solder pot assembly below the surface of the solder liquid, the dipping operation is completed, so that the ends of the coil pins are covered with a layer of solder liquid.

[0005] However, due to factors such as slow soldering speed, the spread of multiple copper wires, and poor solder fluidity, a solder bulge, also known as a solder nodule or solder ball, often forms at the tip of the pin after soldering. Solder balls have several negative effects, including significantly impacting the pin's conductivity, causing localized overheating, and making the nodule prone to air bubbles that can lead to cold solder joints. Therefore, it's necessary to process the pin after soldering to eliminate the solder ball. Currently, a widely used method is the solder scraper. Simply put, after the pin leaves the solder surface, two solder scrapers move towards each other to clamp the pin and scrape off the solder ball at the tip. However, this method involves scraping off the solder ball after clamping it, and during this process, the solder ball can deform laterally. This can result in a flattened solder nodule at the pin tip after the scraper treatment. Although the overall volume of the nodule is reduced, the flattened structure still affects the pin's performance.

[0006] Therefore, a new technical solution is urgently needed to solve the above-mentioned technical problems. Summary of the Invention

[0007] One objective of this invention is to provide a soldering device with a desoldering structure to solve the aforementioned technical problems. The invention employs the following technical solution: A soldering apparatus with a desoldering structure includes a platform on which: A tin furnace assembly for melting and holding molten tin; The transfer mechanism is disposed above the tin furnace assembly; A loading assembly for loading a coil to be soldered, the loading assembly being mounted on the transfer mechanism and driven thereto to move along at least two axial directions, comprising a loading member for loading the coil to be soldered, the loading member being driven to reciprocate in a vertical direction; The desoldering assembly, mounted on the transfer assembly and located below the loading assembly, includes two opposing pull plates and a desoldering drive unit that drives the two pull plates to move towards each other. It also includes a desoldering ring located between the two pull plates and pulsatorically connected to them. When the desoldering drive unit drives the two pull plates to move in opposite directions, the two pull plates pull the desoldering ring, causing its diameter to decrease to remove the solder. When the desoldering drive unit drives the two pull plates to move towards each other, the inner diameter of the desoldering ring elastically recovers.

[0008] Furthermore, the solder scraper ring includes: A linkage component, the two ends of which are slidably connected to the two pull plates respectively; Solder scraping arms, comprising two arranged side by side along the same straight line, with the adjacent ends of the two solder scraping arms fixedly connected to the middle section of the linkage, the two ends of the solder scraping arms that are far apart from each other are elastically bent towards each other, and after the two solder scraping arms cross each other, they define a ring portion and an outward expansion portion located outside the ring portion. The pull member includes two parts corresponding to the solder scraping arm, one end of which is connected to the outer expansion part, and the other end is fixedly mounted on the pull plate.

[0009] Furthermore, both of the pull plates are formed with linkage holes, and the two ends of the linkage member are respectively slidably connected in the linkage holes, and the end of the linkage member extends along the linkage hole to the outside of the pull plate and forms a pull end; The linkage also includes two elastic members respectively fitted on the pulling end, and the pulling end is provided with a limiting boss for limiting the elastic members thereon, one end of the elastic member elastically abutting against the limiting boss and the other end elastically abutting against the outer surface of the pulling plate.

[0010] Furthermore, a connecting portion is formed at the middle position of the linkage component, and the connecting portion extends vertically away from the linkage component, with the ends of the two solder scraping arms fixedly connected to the connecting portion.

[0011] Furthermore, the transfer mechanism includes: The first transfer unit includes a frame symmetrically arranged on both sides of the tin furnace assembly, the frame extending along a first direction, and a crossbeam slidably connected to the frame at both ends along the first direction. A first driving device is also installed on each frame, the first driving device being connected to the crossbeam to drive the crossbeam to reciprocate along the first direction. The second transfer unit is disposed on the crossbeam and includes a vertical plate fixedly mounted on the crossbeam in the vertical direction, and a mounting plate slidably connected to the two plates in the vertical direction. A second driving device is fixedly mounted on the vertical plate and is pulsatorically connected to the mounting plate to drive the mounting plate to reciprocate in the vertical direction. The loading assembly and the desoldering assembly are mounted on the mounting plate.

[0012] Furthermore, the loading component includes: Mounting bracket, which is slidably connected to the mounting plate in a vertical direction, and the loading component is fixedly mounted on the mounting bracket; The third driving device is fixedly mounted on the mounting plate and is connected to the mounting frame in a transmission manner to drive the mounting frame to reciprocate in the vertical direction.

[0013] Furthermore, the loading component includes two opposing brackets, each bracket including a connecting end extending vertically and fixedly connected to the mounting bracket, and a loading end for loading a coil to be soldered, one end of which is formed on the connecting end and the other end extending away from the connecting end, and the loading end having a snap-fit ​​groove.

[0014] Furthermore, the desoldering assembly also includes two opposing mounting arms, which are located on both sides of the solder pot assembly. The desoldering drive unit includes two pneumatic clamps that are fixedly mounted on the two mounting arms. The two pneumatic fingers of the pneumatic clamps are driven to one end of the pull plate, and the pneumatic clamps drive the two pull plates to move towards each other.

[0015] Furthermore, the tin furnace assembly includes: The main furnace is fixedly mounted on the platform and is equipped with a heating component for heating molten tin. The auxiliary furnace is immersed in the main furnace and is used to hold molten tin. The auxiliary furnace also has a lifting unit to raise or lower the auxiliary furnace within the main furnace. The lifting unit includes a vertically placed base plate, on which a lifting cylinder is fixedly installed. The lifting cylinder is connected to the auxiliary furnace via a connecting rod to drive the auxiliary furnace to rise and fall within the main furnace. The tin scraping unit is used to scrape off solidified tin foil. It includes a first cylinder arranged in a vertical direction, a second cylinder mounted on the first cylinder, a piston extending toward the main furnace on the second cylinder, and a tin scraper plate fixedly mounted on the piston.

[0016] Another object of the present invention is to provide a soldering method, which utilizes the above-described soldering apparatus with a desoldering structure, and includes the following steps: Load the jig containing the coil to be soldered onto the loading unit, and align the pins of the coil to be soldered with the solder scraper ring; The transfer assembly is activated, causing the coil to be soldered to move above the solder pot assembly and gradually move towards the solder pot assembly; The loading component drives the loading element to move vertically toward the solder pot assembly, causing the lead of the coil to be soldered to pass through the solder scraper ring and be immersed in the molten solder. The transfer component lifts the loading component, causing the pins to detach from the molten solder. The desoldering drive unit drives the pull plate to separate, causing the diameter of the desoldering ring to gradually decrease and gradually tighten the pin; The loading component is driven upward, causing the pin to be pulled out of the tightening solder scraper ring. The reduced diameter solder scraper ring scrapes off the solder slurry formed on the pin. The beneficial effects of this invention are as follows: Compared with the prior art, the present invention has the following advantages: This invention patent provides a soldering machine with a desoldering structure. During the soldering process, the coil is pre-loaded onto a fixture, and then the fixture is loaded onto a loading component. This allows the coil to move towards the solder pot assembly under the drive of a transfer mechanism. When it reaches the solder pot assembly, the loading component moves downward under the drive of the transfer mechanism and the loading component, allowing the coil lead to pass through the desoldering ring and enter the molten solder in the solder pot assembly, thus completing the immersion. After immersion, the desoldering drive unit drives two pull plates to separate, causing the inner diameter of the desoldering ring to elastically shrink. At this time, as the loading component is driven upward and the lead is disengaged from the desoldering ring, the elastically shrinking desoldering ring scrapes off the solder sludge formed on the lead, resulting in only a uniform layer of molten solder covering the lead. When the lead is completely disengaged from the desoldering ring, the desoldering drive unit drives the two pull plates to move towards each other, causing the desoldering ring to elastically recover, and its diameter increases. After the pin is immersed in tin, a through hole with a diameter slightly larger than the pin diameter is formed by the elastic shrinking of the tin scraper ring. This allows the tin foil formed on the pin to be removed when the pin passes through the through hole, ensuring that the molten tin on the pin is in a uniform state. This effectively removes the tin foil and ensures that the molten tin after removal is evenly coated on the pin, without the appearance of flat molten tin. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention.

[0018] Figure 2 This is a schematic diagram of the exploded structure of the present invention.

[0019] Figure 3 This is an exploded structural diagram of the transfer mechanism, loading assembly, and desoldering assembly in this invention.

[0020] Figure 4 This is a schematic diagram of the desoldering component in this invention.

[0021] Figure 5 This is a top view of the desoldering component in this invention.

[0022] Figure 6 for Figure 5 A magnified view of a portion of point A in the middle.

[0023] Figure 7 This is a schematic diagram of the tin furnace assembly in this invention.

[0024] Figure 8 This is an exploded structural diagram of the tin furnace assembly in this invention. Detailed Implementation

[0025] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0026] This embodiment provides a soldering device with a desoldering structure for soldering coil pins. Specifically, it uses a tin-immersion method to coat the coil pins with a layer of solder, thereby ensuring the conductivity of the pins. In this technical solution, by setting a desoldering structure, the tin slab formed on the pins after tin immersion can be removed, so that the molten solder is roughly evenly coated on the pins. At the same time, after removing the tin slab, the molten solder on the pins can be roughly cylindrical, avoiding the appearance of a flat structure.

[0027] Specifically, such as Figure 1-8 As shown, this embodiment provides a soldering apparatus with a desoldering structure, which has a platform 01. A solder pot assembly 100, a transfer mechanism 200, a loading assembly 300, and a desoldering assembly 400 are also provided on the platform 01. The solder pot assembly 100 is used to melt and hold molten solder. The transfer mechanism is located above the solder pot assembly 100. The loading assembly 300 is mounted on the transfer mechanism 200 and driven by it to move along at least two axes. It includes a loading member 310 for loading the coil to be soldered, and the loading member 310 is driven to reciprocate vertically. The desoldering assembly... The package assembly 400 is mounted on the transfer assembly and located below the loading assembly 300. It includes two opposing pull plates 410 and a desoldering drive unit 420 that drives the two pull plates 410 to move towards each other. It also includes a desoldering ring 430 located between the two pull plates 410 and connected to the two pull plates 410 in a transmission manner. When the desoldering drive unit 420 drives the two pull plates 410 to move in opposite directions, the two pull plates 410 pull the desoldering ring 430 and reduce the diameter of the desoldering ring 430 to remove the solder. When the desoldering drive unit 420 drives the two pull plates 410 to move towards each other, the inner diameter of the desoldering ring 430 elastically recovers.

[0028] During the soldering process, the coil is pre-loaded onto a fixture, which is then loaded onto the loading component 310. This allows the coil to move towards the solder pot assembly 100 under the drive of the transfer mechanism 200. When the coil reaches above the solder pot assembly 100, the loading component 310 moves downward under the drive of the transfer mechanism 200 and the loading component 300, causing the coil leads to pass through the solder scraper ring 430 and enter the molten solder in the solder pot assembly 100, thus completing the soldering process. After the soldering process is complete, the solder pot removal drive unit 420... The two pull plates 410 are driven to separate, causing the inner diameter of the solder scraper ring 430 to elastically shrink. During this process, the loading component 310 is driven upwards, disengaging the pin from the solder scraper ring 430. The elastically shrinking solder scraper ring 430 scrapes away the solder slurry formed on the pin, ensuring only a uniform layer of molten solder covers the pin. After the pin is completely removed from the solder scraper ring 430, the solder slurry removal drive unit 420 drives the two pull plates 410 to move towards each other, causing the solder scraper ring 430 to elastically recover, increasing its diameter. After the pin is immersed in solder, the elastic shrinkage of the solder scraper ring 430 creates a through-hole with a diameter slightly larger than the pin's diameter. This allows the solder slurry formed on the pin to be removed when the pin passes through the through-hole, ensuring a uniform state of molten solder on the pin. This effectively removes the solder slurry and ensures that the removed molten solder evenly covers the pin, preventing flattened molten solder.

[0029] In this embodiment, the transfer mechanism 200 is a device capable of moving along two axes, specifically, it can move horizontally and vertically simultaneously, thereby enabling the loading assembly 300 and the desoldering assembly 400 to complete the soldering and desoldering operations while moving along both axes. like Figure 1-3 As shown, the transfer mechanism 200 includes a first transfer unit 210 that moves in the horizontal direction and a second transfer unit 220 that transfers in the vertical direction. The first transfer unit 210 includes a frame 211 symmetrically arranged on both sides of the tin furnace assembly 100. The frame 211 extends in the first direction and includes a crossbeam 212 that is slidably connected to the frame 211 at both ends in the first direction. A first driving device 213 is also installed on any one of the frames 211. The first driving device 213 is connected to the crossbeam 212 to drive the crossbeam 212 to reciprocate in the first direction. The second transfer unit is mounted on the crossbeam 212 and includes a vertical plate 221 fixedly mounted on the crossbeam 212 in the vertical direction, and a mounting plate 222 slidably connected to the two plates in the vertical direction. A second drive device 223 is fixedly mounted on the vertical plate 221 and is connected to the mounting plate 222 in a transmission manner to drive the mounting plate 222 to reciprocate in the vertical direction. The loading component 300 and the desoldering component 400 are mounted on the mounting plate 222.

[0030] The first transfer unit 210 transfers the loading component 300 and the desoldering component 400 horizontally to the top of the solder pot assembly 100. The second transfer unit 220 transfers them vertically, causing the loading component 300 and the desoldering component 400 to move downwards and reduce the distance to the solder pot assembly 100. Then, the loading component 310 is driven to move downwards for the third time. At this time, the coil pin passes through the desoldering ring 430 and is immersed in the molten solder, completing the immersion process. Afterwards, the loading component 310 is driven to move upwards, while the desoldering drive unit 420 drives the two pull plates 410 to separate simultaneously, causing the diameter of the desoldering ring 430 to shrink elastically, which is used to scrape off the solder sludge formed on the pin. The transfer mechanism 200 works together to reset the loading component 300 and the desoldering component 400 to their initial positions, completing one cycle of soldering.

[0031] In this embodiment, the loading assembly 300 includes a mounting frame 301 and a third driving device 302. The mounting frame 301 is slidably connected to the mounting plate 222 in the vertical direction, and the loading component 310 is fixedly mounted on the mounting frame 301. The third driving device 302 is fixedly mounted on the mounting plate 222 and is connected to the mounting frame 301 in a transmission manner to drive the mounting frame 301 to reciprocate in the vertical direction.

[0032] The loading component 310 includes two opposing brackets 311. Each bracket 311 includes a connecting end 312 extending vertically and fixedly connected to the mounting bracket 301. It also includes a loading end 313 for loading a coil to be soldered. One end of the loading end 313 is formed on the connecting end 312, and the other end extends in a direction away from the connecting end 312. A snap-fit ​​groove 314 is provided on the loading end 313.

[0033] It is worth noting that, in order to improve soldering efficiency, multiple coils can be mounted side by side on a clamping fixture, with both ends directly engaged in the engaging slots 314 of the loading end 313. This allows the loading component 310 to drive the coils to perform soldering. The fixture can adopt existing technical solutions, which can be simply described as including two mutually mating and stable plates to clamp the coils. Meanwhile, the leads are exposed outside the two plates for easy soldering. Of course, to ensure the positional stability and consistency of the coils clamped between the two plates, positioning grooves identical to those of the coils can also be formed on the surface of the plates to ensure the consistency of the coil positions.

[0034] In this embodiment, the first drive device 213 can be a drive device consisting of a motor and a belt system. The motor drives the belt system through a rotating shaft for transmission. One side of the belt is fixedly connected to the crossbeam 212, thereby driving the crossbeam 212 to reciprocate along the first direction on the frame 211. The second drive device 223 can be a drive device consisting of a motor and a lead screw system. The motor is fixedly mounted on the vertical plate 221 and is connected to the lead screw. The nut that is threadedly connected to the lead screw is fixedly mounted on the mounting plate 222, so that the motor can drive the mounting plate 222 to reciprocate along the vertical direction. The third drive device 302 is a cylinder that can drive the coil to move along the vertical direction through the loading member 310, thereby completing the tinning action.

[0035] In this embodiment, as Figure 4-6 As shown, the desoldering assembly 400 includes two opposing mounting arms 401, which are located on both sides of the solder pot assembly 100. The desoldering drive unit 420 includes two pneumatic clamps 421, which are fixedly mounted on the two mounting arms 401. The two pneumatic fingers of the pneumatic clamps 421 are driven to one end of the pull plate 410, and the pneumatic clamps 421 drive the two pull plates 410 to move towards each other.

[0036] The opening and closing action of the two pneumatic fingers on the pneumatic clamp 421 causes the two pull plates 410 to separate or move closer to each other, thereby causing the solder scraper ring 430 to elastically contract or elastically reset, which is used to scrape the solder on the pins.

[0037] Specifically, the solder scraper ring 430 includes: a linkage member 431, a solder scraper arm 432, and a pulling member 433. The two ends of the linkage member 431 are slidably connected to two pulling plates 410 respectively. The solder scraper arm 432 includes two arranged side by side along the same straight line, and the adjacent ends of the two solder scraper arms 432 are fixedly connected to the middle section of the linkage member 431. The two ends of the solder scraper arms 432 that are far apart from each other are elastically bent towards each other, and after the two solder scraper arms 432 cross each other, a ring portion 4321 and an outer expansion portion 4322 located outside the ring portion 4321 are defined. The pulling member 433 includes two corresponding to the solder scraper arms 432, one end of which is connected to the outer expansion portion 4322, and the other end is fixedly mounted on the pulling plate 410.

[0038] The linkage 431 serves as a mounting part to maintain a stable connection with the two pull plates 410. Its two ends are slidably connected to the pull plates 410, so that the solder scraper arm 432 can be held between the two pull plates 410 when the pull plates 410 are separated or close together. The pull plates 410 are connected to the two solder scraper arms 432 through the pulling member 433. When the two pull plates 410 are separated, the two pull plates 410 drive the two outward expansion parts 4322 to move through the pulling member 433, so that the ring part 4321 is pulled and the diameter of the ring part 4321 gradually decreases. At this time, when the pin that has been dipped in solder is removed from the ring part 4321, the ring part 4321 scrapes off the solder on the pin. When the pneumatic clamp 421 drives the two pull plates 410 to move closer together, the pulling member 433 is released, so that the solder scraper arm 432 elastically recovers. At this time, the elastic recovery of the ring part 4321 causes the diameter to increase.

[0039] It can be explained that the solder scraping arm 432 is made of a metal material with elastic deformation capability, and the pulling part 433 is a rope structure made of flexible nylon material. The nylon material has sufficient strength and high temperature resistance, and can be used for a long time.

[0040] The linkage 431 is assembled between the two pull plates 410 as a retaining member, and its two ends are slidably connected to the two pull plates 410 respectively. At this time, both pull plates 410 are formed with linkage holes. The two ends of the linkage 431 are slidably connected in the linkage holes respectively, and the end of the linkage 431 extends along the linkage hole to the outside of the pull plate 410 and forms a pull end 4311. In order to keep the linkage 431 stable during the opening and closing of the two pull plates 410, that is, to keep the position of the solder scraping arm 432 located between the pull plates 410 stable, the linkage 431 also includes two elastic members 4312 respectively fitted on the pull end 4311, and the pull end 4311 is provided with a limiting boss 4313 for limiting the elastic members 4312 thereon. One end of the elastic member 4312 elastically abuts against the limiting boss 4313 and the other end elastically abuts against the outer surface of the pull plate 410.

[0041] By providing elastic elements 4312 at both pull ends 4311, when the two pull plates 410 are opening and closing, the linkage 431 can be in an elastically suspended state under the action of the two elastic elements 4312. At this time, the ring between the two pull plates 410 moves with one of the pull elements 433 during the locking action of the two pull plates 410, thereby making the ring between the two pull plates 410 in a stable state.

[0042] In this embodiment, a connecting portion 4314 is formed at the middle position of the linkage 431. The connecting portion 4314 extends vertically in a direction away from the linkage 431, and the ends of the two solder scraping arms 432 are fixedly connected to the connecting portion 4314.

[0043] The connecting part 4314 can be assembled onto the linkage 431 by bolt connection. For example, an external thread is formed at one end of the connecting part 4314, and a through hole is provided on the linkage 431 for it to pass through. Then, the connecting part 4314 is locked onto the linkage 431 by a nut. At the same time, the two solder scraping arms 432 can be made of a single long strip of metal. The connecting part 4314 is assembled in the middle by welding or other existing connection methods. The outer expansion part 4322 can be connected to the pulling part 433 by bolting. The connection between the pulling part 433 and the pulling plate 410 can be made by pressing or clamping. Through the above-mentioned detachable connection method, the replacement operation of the solder scraping ring 430 can be convenient.

[0044] like Figure 7-8As shown, the solder pot assembly 100 provided in this embodiment includes a main furnace 110, an auxiliary furnace 120, and a solder scraping unit 140. The main furnace 110 is fixedly mounted on the table 01 and is equipped with a heating component for heating molten solder. The auxiliary furnace 120 is immersed in the main furnace 110 and is used to hold the molten solder. The auxiliary furnace 120 also has a lifting unit 130 for raising or lowering the auxiliary furnace 120 within the main furnace 110. The lifting unit 130 includes a vertically placed base plate 131. A lifting cylinder 132 is fixedly installed on the base plate 131. The lifting cylinder 132 is connected to the auxiliary furnace 120 via a connecting rod 133 to drive the auxiliary furnace 120 to move up and down within the main furnace 110. The tin scraping unit 140 is used to scrape off the solidified tin. It includes a first cylinder 141 arranged in a vertical direction. A second cylinder 142 is mounted on the first cylinder 141. The second cylinder 142 is equipped with a piston extending toward the main furnace 110, and a tin scraping plate 143 is fixedly installed on the piston.

[0045] The solder is placed inside the main furnace 110 and melted into a liquid state under the action of the heating components. At this time, the auxiliary furnace 120 is immersed in the main furnace 110, so that the melted solder can fill the auxiliary furnace 120. When it is necessary to tin the coil pins, the auxiliary furnace 120 is raised by the lifting cylinder 132, which facilitates the tinning operation of the coil pins. At the same time, in order to remove the solidified tin on the surface of the tin liquid, the tin scraper 143 scrapes the upper surface of the tin liquid in the auxiliary furnace 120 under the drive of the first cylinder 141 and the second cylinder 142, thereby removing the tin and ensuring the tinning effect of the coil pins.

[0046] In this embodiment, a soldering method is also provided, applied to the soldering apparatus with a desoldering structure described above, comprising the following steps: The fixture containing the coil to be soldered is loaded onto the loading part 310, and the pins of the coil to be soldered are aligned with the solder scraper ring 430. The transfer component is activated to move the coil to be soldered above the solder pot assembly 100 and gradually move towards the solder pot assembly 100; The loading component 300 drives the loading component 310 to move vertically toward the solder pot assembly 100, so that the lead of the coil to be soldered passes through the solder scraper ring 430 and is immersed in the molten solder. The transfer component lifts the loading component 300, causing the pins to detach from the molten solder; The desoldering drive unit 420 drives the pull plate 410 to separate, causing the diameter of the desoldering ring 430 to gradually decrease and gradually tighten the pins. The loading component 310 is driven to rise, causing the pin to be pulled out in the tightened solder scraper ring 430, which scrapes off the solder slurry formed on the pin.

[0047] The above soldering method can complete the soldering operation of the coil pins. When the diameter of the squeegee ring 430 is reduced, the pins can be gradually tightened. When the pins are gradually separated from the squeegee ring 430, the squeegee ring 430 scrapes off the solder slurry formed on the pins, thereby ensuring that the pins are covered with a roughly uniform layer of molten solder and ensuring the quality of the soldering.

[0048] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the present invention without departing from the scope of the present invention are within the scope of the present invention.

Claims

1. A soldering apparatus with a desoldering structure, comprising a platform, characterized in that, The platform is also equipped with: A tin furnace assembly for melting and holding molten tin; The transfer mechanism is disposed above the tin furnace assembly; A loading assembly for loading a coil to be soldered, the loading assembly being mounted on the transfer mechanism and driven thereto to move along at least two axial directions, comprising a loading member for loading the coil to be soldered, the loading member being driven to reciprocate in a vertical direction; The desoldering assembly, mounted on the transfer assembly and located below the loading assembly, includes two opposing pull plates and a desoldering drive unit that drives the two pull plates to move towards each other. It also includes a desoldering ring located between the two pull plates and pulsatorically connected to them. When the desoldering drive unit drives the two pull plates to move in opposite directions, the two pull plates pull the desoldering ring, causing its diameter to decrease to remove the solder. When the desoldering drive unit drives the two pull plates to move towards each other, the inner diameter of the desoldering ring elastically recovers.

2. The soldering device with a desoldering structure according to claim 1, characterized in that, The solder scraper ring includes: A linkage component, the two ends of which are slidably connected to the two pull plates respectively; Solder scraping arms, comprising two arranged side by side along the same straight line, with the adjacent ends of the two solder scraping arms fixedly connected to the middle section of the linkage, the two ends of the solder scraping arms that are far apart from each other are elastically bent towards each other, and after the two solder scraping arms cross each other, they define a ring portion and an outward expansion portion located outside the ring portion. The pull member includes two parts corresponding to the solder scraping arm, one end of which is connected to the outer expansion part, and the other end is fixedly mounted on the pull plate.

3. A soldering device with a desoldering structure according to claim 2, characterized in that, Both of the pull plates are formed with linkage holes, and the two ends of the linkage member are respectively slidably connected in the linkage holes, and the end of the linkage member extends along the linkage hole to the outside of the pull plate and forms a pull end; The linkage also includes two elastic members respectively fitted on the pulling end, and the pulling end is provided with a limiting boss for limiting the elastic members thereon, one end of the elastic member elastically abutting against the limiting boss and the other end elastically abutting against the outer surface of the pulling plate.

4. A soldering device with a desoldering structure according to claim 3, characterized in that, A connecting portion is formed in the middle of the linkage component, and the connecting portion extends vertically away from the linkage component. The ends of the two solder scraping arms are fixedly connected to the connecting portion.

5. A soldering device with a desoldering structure according to claim 1, characterized in that, The transfer mechanism includes: The first transfer unit includes a frame symmetrically arranged on both sides of the tin furnace assembly, the frame extending along a first direction, and a crossbeam slidably connected to the frame at both ends along the first direction. A first driving device is also installed on each frame, the first driving device being connected to the crossbeam to drive the crossbeam to reciprocate along the first direction. The second transfer unit is disposed on the crossbeam and includes a vertical plate fixedly mounted on the crossbeam in the vertical direction, and a mounting plate slidably connected to the two plates in the vertical direction. A second driving device is fixedly mounted on the vertical plate and is pulsatorically connected to the mounting plate to drive the mounting plate to reciprocate in the vertical direction. The loading assembly and the desoldering assembly are mounted on the mounting plate.

6. A soldering device with a desoldering structure according to claim 5, characterized in that, The loading component includes: Mounting bracket, which is slidably connected to the mounting plate in a vertical direction, and the loading component is fixedly mounted on the mounting bracket; The third driving device is fixedly mounted on the mounting plate and is connected to the mounting frame in a transmission manner to drive the mounting frame to reciprocate in the vertical direction.

7. A soldering device with a desoldering structure according to claim 6, characterized in that, The loading component includes two opposing brackets, each bracket including a connecting end extending vertically and fixedly connected to the mounting bracket, and a loading end for loading a coil to be soldered. One end of the loading end is formed on the connecting end, and the other end extends in a direction away from the connecting end. The loading end has a snap-fit ​​groove.

8. A soldering device with a desoldering structure according to claim 5, characterized in that, The desoldering assembly also includes two opposing mounting arms, which are located on both sides of the solder pot assembly. The desoldering drive unit includes two pneumatic clamps that are fixedly mounted on the two mounting arms. The two pneumatic fingers of the pneumatic clamps are driven to one end of the pull plate, and the pneumatic clamps drive the two pull plates to move towards each other.

9. A soldering device with a desoldering structure according to claim 1, characterized in that, The tin furnace assembly includes: The main furnace is fixedly mounted on the platform and is equipped with a heating component for heating molten tin. The auxiliary furnace is immersed in the main furnace and is used to hold molten tin. The auxiliary furnace also has a lifting unit to raise or lower the auxiliary furnace within the main furnace. The lifting unit includes a vertically placed base plate, on which a lifting cylinder is fixedly installed. The lifting cylinder is connected to the auxiliary furnace via a connecting rod to drive the auxiliary furnace to rise and fall within the main furnace. The tin scraping unit is used to scrape off solidified tin foil. It includes a first cylinder arranged in a vertical direction, a second cylinder mounted on the first cylinder, a piston extending toward the main furnace on the second cylinder, and a tin scraper plate fixedly mounted on the piston.

10. A soldering method, characterized in that, Using a soldering apparatus with a desoldering structure as described in any one of claims 1-9 includes the following steps: Load the jig containing the coil to be soldered onto the loading unit, and align the pins of the coil to be soldered with the solder scraper ring; The transfer assembly is activated, causing the coil to be soldered to move above the solder pot assembly and gradually move towards the solder pot assembly; The loading component drives the loading element to move vertically toward the solder pot assembly, causing the lead of the coil to be soldered to pass through the solder scraper ring and be immersed in the molten solder. The transfer component lifts the loading component, causing the pins to detach from the molten solder. The desoldering drive unit drives the pull plate to separate, causing the diameter of the desoldering ring to gradually decrease and gradually tighten the pin; The loading component is driven upward, causing the pin to be pulled out in the tightening squeegee ring, which scrapes off the solder slurry formed on the pin by the reduced diameter squeegee ring.

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