Laser processing apparatus and beam shaping method

Abstract

This application provides a laser processing apparatus, including a light emitting module, a light guiding module, and a control module. The light emitting module includes at least two light-emitting units, each of which emits sub-processing light. The light guiding module includes at least two reflective elements and a beam combining element. Each reflective element receives and reflects the sub-processing light. The beam combining element receives and reflects the sub-processing light to combine the sub-processing light into a processing light beam for processing the workpiece. The control module is communicatively connected to the light guiding module and is used to acquire the light spot pattern formed by the processing light and the output power of the processing light. It is also used to adjust the positions of the reflective elements and / or the beam combining element relative to the light emitting module according to a preset light spot pattern, so that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and that the output power of the processing light is within a preset power range. This application also provides a beam shaping method.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a laser processing device and a beam shaping method. Background Technology

[0002] With the development of technology, laser processing technology is becoming increasingly popular, including laser engraving, laser cutting, laser rust removal, laser marking, and laser welding. Semiconductor lasers have been widely used in processing various materials, such as cutting, engraving, and welding metals, wood, glass, and plastics, and their application scope continues to expand.

[0003] In practical applications, the miniaturization requirements of laser processing equipment have increased the complexity of integrated designs of multiple semiconductor lasers. Laser processing equipment contains multiple semiconductor lasers and multiple reflective mirrors. During assembly and alignment or use, misalignment, obstruction, or excessive tilting (e.g., excessive tilting caused by impacts during use) can easily occur between these reflective mirrors. This can lead to poor beam performance and reduced output power in the processing light emitted from the multiple semiconductor lasers, which in turn can affect the processing results (e.g., insufficient processing depth or reduced processing efficiency). Summary of the Invention

[0004] In a first aspect, embodiments of this application provide a laser processing device, including a light emitting module, a light guiding module, and a control module; the light emitting module includes at least two light-emitting units, each of which emits sub-processing light; the light guiding module includes at least two reflective elements and a light combining element, each of which is movably disposed on the light-emitting side of one of the light-emitting units, for receiving and reflecting the sub-processing light; the light combining element is movably disposed on the light-emitting side of each of the reflective elements, for receiving and reflecting the sub-processing light, so that the sub-processing light is combined into a processing light to process the workpiece; the control module is communicatively connected to the light guiding module, for acquiring the light spot pattern formed by the processing light and the output power of the processing light, and for adjusting the position of the reflective elements and / or the light combining element relative to the light emitting module according to a preset light spot pattern, so that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and that the output power of the processing light is within a preset power range.

[0005] The laser processing equipment provided in this application embodiment, through the inclusion of a control module communicatively connected to the light guiding module, acquires the light spot pattern formed by the processing light and the output power of the processing light. Based on a preset light spot pattern, the control module precisely adjusts the positions of the reflecting elements and / or combining elements relative to the light emitting module. This ensures that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and that the output power of the processing light is within a preset power range. This effectively avoids misalignment, obstruction, or excessive tilting among multiple reflecting elements. It not only shapes the processing light beam during assembly alignment but also during use, ensuring that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and that the output power of the processing light remains stable within the preset power range. This helps improve problems such as poor light spot performance and decreased output power, further preventing processing effects from being affected (e.g., avoiding insufficient processing depth). It also helps improve the processing accuracy, stability, and practicality of the laser processing equipment while meeting the miniaturization requirements.

[0006] In some embodiments, the laser processing equipment further includes a beam combining element and a power detection component. The beam combining element is disposed on the light output side of the light guiding module and is used to reflect part of the processing light to the power detection component and transmit part of the processing light. The power detection component is communicatively connected to the control module and is used to receive and detect the output power of the processing light so that the control module can obtain the output power of the processing light.

[0007] In some embodiments, the laser processing equipment further includes a spot acquisition component communicatively connected to the control module. The spot acquisition component is disposed on the side of the beam combining element away from the light guiding module and is used to receive a portion of the processing light transmitted from the beam combining element, so that the control module acquires the spot pattern formed by the processing light.

[0008] In some embodiments, the power detection component is an integrating sphere power meter or a photoelectric power meter.

[0009] In some embodiments, the light emitting module further includes at least two collimating components. Each collimating component is disposed between one of the light-emitting units and one of the reflective elements. Each collimating component includes a first collimating lens and a second collimating lens. The first collimating lens is disposed on the light-emitting side of the light-emitting unit and is used to receive and reduce the divergence angle of the sub-processing light in the fast axis direction. The second collimating lens is disposed on the light-emitting side of the first collimating lens away from the light-emitting unit and is used to receive and reduce the divergence angle of the sub-processing light in the slow axis direction.

[0010] In some embodiments, each of the reflective elements in the light guiding module includes six degrees of freedom; the laser processing equipment further includes a driving module, which is communicatively connected to the control module, each of the reflective elements and the light combining element, and is used to independently adjust the position of each of the reflective elements and / or the light combining element relative to the light emitting module according to the driving signal of the driving module.

[0011] In some embodiments, the six degrees of freedom include three translational degrees of freedom and three rotational degrees of freedom. The three translational degrees of freedom include the ability of the reflecting element to translate along the X-axis, the Y-axis, and the Z-axis, wherein the X-axis is perpendicular to the Y-axis, the Z-axis, and the Y-axis is perpendicular to the Z-axis. The three rotational degrees of freedom include the ability of the reflecting element to rotate about the X-axis, about the Y-axis, and about the Z-axis.

[0012] Secondly, embodiments of this application provide a beam shaping method, applied to the laser processing equipment described in any of the above embodiments, comprising the steps of: acquiring the beam pattern formed by the processing light and the real-time output power of the processing light; determining, based on a preset beam pattern and the beam pattern formed by the processing light, whether the beam pattern formed by the processing light has shifted relative to the preset beam pattern; if the beam pattern formed by the processing light has shifted relative to the preset beam pattern, adjusting the position of each of the reflecting elements and / or the combining elements relative to the light emitting module; repeatedly acquiring the beam pattern formed by the processing light until the beam pattern is obtained. The light spot pattern formed by the processing light is not offset relative to the preset light spot pattern; when the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern, the deflection angle of each of the reflective elements relative to the light emitting module is adjusted to obtain the real-time output power of the processing light at the time of adjustment; based on the real-time output power, the deflection angle of each of the reflective elements relative to the light emitting module corresponding to the preset power is obtained; each reflective element is fixed according to the deflection angle to ensure that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and that the output power of the processing light is within the preset power range.

[0013] The beam shaping method provided in this application adjusts the deflection angle of each reflective element relative to the light emitting module to obtain the real-time output power of the processing light during adjustment; based on the real-time output power, it obtains the deflection angle of each reflective element relative to the light emitting module corresponding to a preset power; and it fixes each reflective element according to the deflection angle to ensure that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and that the output power of the processing light is within a preset power range. This method can not only shape the processing light beam during assembly alignment but also during use. It can effectively avoid misalignment, obstruction, or excessive tilting between multiple reflective elements, thereby ensuring that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and that the output power of the processing light is stable within the preset power range. This helps to improve problems such as poor light spot performance and reduced output power, and further helps to avoid affecting the processing effect (such as avoiding insufficient processing depth). It also helps to improve the processing accuracy, stability, and practicality of laser processing equipment while meeting the miniaturization requirements of laser processing equipment.

[0014] In some embodiments, the step of obtaining the deflection angle of each of the reflective elements relative to the optical emitting module corresponding to the real-time output power includes: obtaining a real-time power data curve of the processed light based on the real-time output power; obtaining the maximum range corresponding to the preset power using a ramping algorithm based on the real-time power data curve; and obtaining the deflection angle of each of the reflective elements relative to the optical emitting module based on the maximum range.

[0015] In some embodiments, the step of determining whether the light spot pattern formed by the processing light is offset relative to the preset light spot pattern based on the preset light spot pattern and the light spot pattern formed by the processing light includes: obtaining the outline grayscale based on the light spot pattern; and determining whether the light spot pattern formed by the processing light is offset relative to the preset light spot pattern based on the preset light spot pattern and the outline grayscale. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a laser processing apparatus according to an embodiment of this application.

[0017] Figure 2 This is a schematic diagram of the light spot pattern formed by the emitted processing light according to an embodiment of this application, wherein... Figure 2 (a) is a schematic diagram showing that the light spot pattern formed by the processing light has no offset relative to the preset light spot pattern. Figure 2 (b) is a schematic diagram when the light spot pattern formed by the processing light is offset relative to the preset light spot pattern.

[0018] Figure 3 This is a schematic diagram of an optical emitting module and an optical guiding module according to an embodiment of this application.

[0019] Figure 4 This is a schematic diagram of the structure of a reflective element according to an embodiment of this application.

[0020] Figure 5 This is a schematic flowchart of a beam shaping method according to an embodiment of this application.

[0021] Figure 6 This is a graph of real-time power data obtained by the control module according to an embodiment of this application.

[0022] Explanation of key component symbols: Laser processing equipment 100 Optical emission module 1 Light-emitting unit 11 Collimation component 13 First collimating lens 133 Second collimating lens 132 Light guiding module 2 Reflective element 21 Photosynthetic element 22 Control Module 3 Driver Module 4 Bundle element 5 Power detection component 6 Light spot acquisition component 7 Sub-processing light L1 Processing light L2 Target box W The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0023] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0024] It should be noted that when a component is considered to be "set on" another component, it can be directly set on the other component or may have an intervening component present. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0025] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0026] Please refer to the following: Figure 1 and Figure 2 The laser processing equipment 100 of this application embodiment includes a light emitting module 1, a light guiding module 2, and a control module 3. The light emitting module 1 includes at least two light-emitting units 11, each of which emits a sub-processing light L1. The light guiding module 2 includes at least two reflective elements 21 and a light combining element 22. Each reflective element 21 is movably disposed on the light-emitting side of one light-emitting unit 11 to receive and reflect the sub-processing light L1. The light combining element 22 is movably disposed on the light-emitting side of each reflective element 21 to receive and reflect the sub-processing light L1, so that the sub-processing light L1 is combined into a processing light L2 to process the workpiece. The laser processing methods can be laser engraving, laser cutting, laser rust removal, laser marking, or laser welding. The control module 3 is communicatively connected to the light guiding module 2 and is used to acquire the light spot pattern formed by the processing light L2 and the output power of the processing light L2. It is also used to adjust the position of the reflective element 21 and / or the light combining element 22 relative to the light emitting module 1 according to the preset light spot pattern, so that the light spot pattern formed by the processing light L2 is not offset relative to the preset light spot pattern and the output power of the processing light L2 is within the preset power range.

[0027] It should be noted that "no offset" in this application means that the light spot pattern formed by the processing light L2 after being shaped by the light guiding module 2 and the control module 3 is consistent with the preset light spot pattern in terms of spatial position, angle, and shape. Please refer to [link / reference]. Figure 2 (a) and Figure 2 (b) When the preset light spot pattern is elliptical, Figure 2 (a) is a schematic diagram showing that the spot pattern formed by the processing light L2 has no offset relative to the preset spot pattern. Figure 2 (b) is a schematic diagram when the spot pattern formed by the processing light L2 is offset relative to the preset spot pattern. When the spot pattern formed by the processing light L2 is not offset relative to the preset spot pattern, the center position and outline boundary of the spot pattern formed by the processing light L2 are not offset relative to the preset spot pattern. That is, the center of the spot pattern has no lateral or longitudinal displacement and no attitude deflection. The long and wide dimensions of the spot pattern are compatible with the standard length and width dimensions of the target frame W. However, when the spot pattern formed by the processing light L2 is offset relative to the preset spot pattern, the center of the spot pattern is displaced laterally or longitudinally, or the attitude of the spot pattern is deflected relative to the preset spot pattern. Either the long side dimension or the short side dimension of the spot pattern is significantly larger than the standard length and width corresponding to the target frame W, or either the actual long side dimension or the short side dimension of the spot pattern is significantly smaller than the standard length and width corresponding to the target frame W. The overall outline of the spot pattern cannot be adapted to the boundary of the target frame W.

[0028] The laser processing equipment 100 provided in this application embodiment, through the setting of a control module 3 communicatively connected to the light guiding module 2, acquires the light spot pattern formed by the processing light L2 and the output power of the processing light L2, and uses it to precisely adjust the position of the reflecting element 21 and / or the light combining element 22 relative to the light emitting module 1 according to the preset light spot pattern, so that the light spot pattern formed by the processing light L2 is not offset relative to the preset light spot pattern and the output power of the processing light L2 is within the preset power range. This not only allows for the shaping of the beam of the sub-processing light L1 during assembly alignment, but also allows for the shaping of the beam during use. Shaping the beam of the processing light L1 can effectively prevent misalignment, obstruction, or excessive tilting among multiple reflecting elements 21. This ensures that the spot pattern formed by the processing light L2 is not offset relative to the preset spot pattern, and also stabilizes the output power of the processing light L2 within the preset power range. This helps to improve the problems of poor spot performance and reduced output power, and further helps to avoid affecting the processing effect (such as avoiding insufficient processing depth). This is beneficial to improving the processing accuracy, stability, and practicality of the laser processing equipment 100 while meeting the miniaturization requirements of the laser processing equipment 100.

[0029] In some embodiments, each light-emitting unit 11 is a semiconductor laser. In other embodiments, each light-emitting unit 11 may also be any one of a gas laser, a solid-state laser, a liquid laser, and a fiber laser. This application does not impose any restrictions.

[0030] In some embodiments, the wavelength range of the sub-processing light L1 is 400nm–495nm, i.e., the sub-processing light L1 is blue light. Specifically, the wavelength of the sub-processing light L1 can be 450nm, 460nm, 470nm, 480nm, 490nm, or 495nm. When the wavelength of the sub-processing light L1 is within the above wavelength range, since the power required for blue light is less than that required for infrared light, it is beneficial to reduce power consumption under the condition that the processing light L2, which is a combination of the sub-processing light L1 and L2, cuts to the same depth.

[0031] In some embodiments, the light emitting module 1 further includes at least two collimating components 13. Each collimating component 13 is disposed between a light-emitting unit 11 and a reflective element 21. Each collimating component 13 includes a first collimating lens 131 and a second collimating lens 132. The first collimating lens 131 is disposed on the light-emitting side of the light-emitting unit 11 and is used to receive and reduce the divergence angle of the sub-processing light L1 in the fast axis direction. The second collimating lens 132 is disposed on the light-emitting side of the first collimating lens 131 away from the light-emitting unit 11 and is used to receive and reduce the divergence angle of the sub-processing light L1 in the slow axis direction.

[0032] By setting a collimation assembly 13 containing a first collimating lens 131 and a second collimating lens 132 between the light-emitting unit 11 and the reflective element 21, the first collimating lens 131 can reduce the divergence angle of the sub-processing light L1 along the fast axis, and the second collimating lens 132 can reduce the divergence angle of the sub-processing light L1 along the slow axis, thereby achieving bidirectional collimation of the fast and slow axes of the sub-processing light L1, which is beneficial to optimizing the beam quality of the single-path sub-processing light L1; and by setting a control module 3 that is communicatively connected to the light guiding module 2, the control module 3 can obtain the light spot pattern formed by the processing light L2 and the output power of the processing light L2 in real time.

[0033] Please refer to the following: Figure 1 and Figure 3 In some embodiments, when the number of light-emitting units 11 in the light-emitting module 1 is three, the number of reflective elements 21 in the collimation component 13 and the light-guiding module 2 is three, and the number of light-combining elements 22 is one. The light-combining element 22 is used to reflect the light emitted from the three reflective elements 21, and the three reflective elements 21 are staggered in a direction parallel to the optical axis of the collimation component 13. In some embodiments, when the number of light-emitting units 11 in the light-emitting module 1 is six, the number of reflective elements 21 in the collimation component 13 and the light-guiding module 2 is six, and the number of light-combining elements 22 is two. Each light-combining element 22 is used to reflect the light emitted from the three reflective elements 21, and the three reflective elements 21 are staggered in a direction parallel to the optical axis of the collimation component 13. The two light-combining elements 22 are staggered in a direction parallel to the optical axis of the collimation component 13, thereby avoiding the generation of sub-source light emitted from the two reflective elements 21.

[0034] Please refer to the following: Figure 1 and Figure 4 In some embodiments, each reflective element 21 in the light guiding module 2 includes six degrees of freedom; the six degrees of freedom include three translational degrees of freedom and three rotational degrees of freedom. The three translational degrees of freedom include that the reflective element 21 can translate along the X-axis, along the Y-axis, and along the Z-axis, with the X-axis perpendicular to the Y-axis, the X-axis perpendicular to the Z-axis, and the Y-axis perpendicular to the Z-axis. The three rotational degrees of freedom include that the reflective element 21 can rotate about the X-axis, about the Y-axis, and about the Z-axis.

[0035] In some embodiments, the laser processing equipment 100 further includes a drive module 4, which is communicatively connected to the control module 3, each reflective element 21, and the light combining element 22. The drive module 4 is used to independently adjust the position of each reflective element 21 and / or light combining element 22 relative to the light emitting module 1 according to the drive signal of the drive module 4. Currently, the drive module 4 can adopt a variety of high-precision micro-drive schemes, including six-axis piezoelectric ceramic displacement stage, six-axis electromagnetic displacement stage drive, or six-axis electric slide stage drive. For example, the drive module 4 can adjust the position of each reflective element 21 and / or light combining element 22 relative to the light emitting module 1 by electromagnetic drive. The drive module 4 outputs multiple independent electromagnetic drive signals. The bottom or back of the reflective element 21 integrates an electromagnetic actuator (not shown in the figure). The six degrees of freedom micro-displacement and micro-angle deflection of the reflective element 21 and / or light combining element 22 are realized through electromagnetic attraction and repulsion. The use of electromagnetic drive has the advantages of no mechanical friction, fast response, and high precision. In some embodiments, the drive module 4 can also be controlled by piezoelectric drive. The drive module 4 outputs a high-voltage piezoelectric drive signal, and the reflective element 21 is equipped with a six-axis piezoelectric ceramic micro-displacement stage (not shown). This application does not impose any limitations. In some embodiments, the drive module 4 can also adopt a six-axis electric slide scheme to achieve drive control. The drive module 4 outputs multiple independent electric control adjustment signals, and the reflective element 21 and the light combining element 22 are equipped with a six-axis electric slide module (not shown). Relying on the six-axis electric slide, the micro-displacement adjustment and micro-angle deflection of the six degrees of freedom (e.g., translation or rotation in the X / Y / Z axes) of the reflective element 21 and / or the light combining element 22 can be realized. This application does not impose any limitations.

[0036] In some embodiments, the laser processing equipment 100 further includes a beam combiner 5, a power detection component 6, and a spot acquisition component 7. The beam combiner 5 is disposed on the light output side of the light guiding module 2 and is used to reflect part of the processing light L2 to the power detection component 6 and transmit part of the processing light L2; the power detection component 6 is communicatively connected to the control module 3 and is used to receive and detect the output power of the processing light L2 so that the control module 3 can acquire the output power of the processing light L2.

[0037] The power detection component 6 is an integrating sphere power meter or a photoelectric power meter. When the power detection component 6 is an integrating sphere power meter, the processing light L2 is incident inside the power detection component 6. Utilizing the high diffuse reflection coating (not shown) on the inner wall of the sphere, the incident power detection component 6 undergoes multiple uniform diffuse reflections within the sphere, homogenizing the non-uniformly distributed processing light L2. The uniform light signal is then extracted through a small hole in the sphere wall, received by the built-in photodetector, converted into an electrical signal, and transmitted to the control module 3, allowing the control module 3 to acquire the output power of the processing light L2. By setting the power detection component 6 as an integrating sphere power meter, it is insensitive to the incident angle of the processing light L2, which helps reduce measurement errors and mitigates measurement errors caused by beam deviation and interference.

[0038] The laser processing equipment 100 also includes a spot acquisition component 7 that is communicatively connected to the control module 3. The spot acquisition component 7 is disposed on the side of the beam combining element 5 away from the light guiding module 2, and is used to receive a portion of the processing light L2 transmitted from the beam combining element 5, so that the control module 3 can acquire the spot pattern formed by the processing light L2. The spot acquisition component 7 can be a camera.

[0039] The beam shaping method proposed in the embodiments of this application will be described in detail below with reference to the accompanying drawings. Please refer to them together. Figure 2 and Figure 4 The beam shaping method provided in this application can be applied to the laser processing equipment 100 in any of the above embodiments, and can be executed by the control module 3 disposed in the laser processing equipment 100. It should be noted that the beam shaping method of this application is not limited to the order of the following steps, and in other embodiments, the beam shaping method of this embodiment may include only a part of the following steps, or some of the steps may be deleted.

[0040] Please refer to the following: Figure 1 and Figure 5 The beam shaping method of this application includes the following steps S1 to S5: Step S1: Obtain the spot pattern formed by the processing light and the real-time output power of the processing light.

[0041] Step S2: Based on the preset light spot pattern and the light spot pattern formed by the processing light, determine whether the light spot pattern formed by the processing light is offset relative to the preset light spot pattern; if the light spot pattern formed by the processing light is offset relative to the preset light spot pattern, adjust the position of each reflective element and / or light combining element relative to the light emitting module; repeatedly acquire the light spot pattern formed by the processing light until the light spot pattern formed by the processing light is no longer offset relative to the preset light spot pattern.

[0042] Step S3: When the light spot pattern formed by the processing light is not offset from the preset light spot pattern, adjust the deflection angle of each reflective element relative to the light emitting module, and obtain the real-time output power of the processing light during the adjustment.

[0043] Step S4: Based on the real-time output power, obtain the deflection angle of each reflective element relative to the optical emitting module corresponding to the preset power.

[0044] Step S5: Fix each reflective element according to the deflection angle so that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and the output power of the processing light is within the preset power range.

[0045] Specifically, in step S1, each light-emitting unit 11 in the light-emitting module 1 emits sub-processing light L1. The sub-processing light L1 passes sequentially through the first collimating lens 131 and the second collimating lens 132 of the corresponding collimating component 13, reducing the divergence angles in the fast axis and slow axis directions respectively. After bidirectional collimation, it is incident on the corresponding reflecting element 21. The reflecting element 21 reflects the collimated sub-processing light L1 to the combining element 22. The combining element 22 performs light combining processing on the multiple sub-processing lights L1 to form a unified processing light L2. The processing light L2 is transmitted to the processing area via the light guiding module 2, forming a light spot pattern on the surface of the processed workpiece or a preset detection plane. The control module 3 is communicatively connected to the power detection component 6, the light spot acquisition component 7, and the light guiding module 2. By controlling the power detection component 6 and the light spot acquisition component 7, the control module 3 acquires the light spot pattern formed by the processing light L2 and the real-time output power of the processing light L2.

[0046] In some embodiments, step S2, which determines whether the spot pattern formed by the processing light is offset relative to the preset spot pattern based on the preset spot pattern and the spot pattern formed by the processing light, includes steps S21 to S22: Step S21: Obtain the outline grayscale based on the light spot pattern.

[0047] Step S22: Based on the preset spot pattern and outline grayscale, determine whether the spot pattern formed by the processing light is offset relative to the preset spot pattern.

[0048] In step S21, based on the light spot pattern, the control module 3 preprocesses the real-time light spot pattern acquired in step S1. First, a filtering algorithm is used to remove noise interference in the light spot pattern to avoid noise causing contour recognition deviation. Then, a binarization processing algorithm is used to convert the light spot pattern into a black and white binary image, clarifying the boundary between the light spot area and the background area. Subsequently, an edge detection algorithm is used to extract the complete contour of the light spot, locate the pixel coordinates of the light spot contour, and form a contour grayscale dataset. In step S22, the control module 3 compares and analyzes the real-time light spot pattern acquired in step S1 with a preset light spot pattern. An image recognition algorithm is used to compare the center coordinate deviation, contour boundary deviation, and shape deviation of the two to determine whether the real-time light spot pattern has shifted relative to the preset light spot pattern. If no offset is determined after comparison, proceed to step S3; if an offset is determined, the control module 3 generates a position adjustment command and sends it to the drive module 4; after receiving the position adjustment command, the drive module 4 adjusts each reflective element 21 and performs six-degree-of-freedom adjustment (translation along the X / Y / Z axes or rotation around the X / Y / Z axes) on the reflective element 21, avoiding misalignment, obstruction, or excessive tilting between reflective elements 21 during the adjustment process. After each adjustment is completed, the control module 3 repeats step S1, re-acquires the adjusted spot pattern and real-time output power, and compares it again with the preset spot pattern to determine whether an offset still exists, until the spot pattern formed by the processing light L2 has no offset relative to the preset spot pattern.

[0049] After confirming that the light spot pattern is not offset, the control module 3 executes step S3 to adjust the deflection angle of each reflective element 21 relative to the light emitting module 1, and obtains the real-time output power of the processing light L2 during the adjustment. After each adjustment of the deflection angle by one step, the control module 3 synchronously obtains the real-time output power of the processing light L2 detected by the power detection component 6, and records the specific deflection angle parameters of each reflective element 21 at the current time, and establishes the correspondence between "deflection angle and real-time power".

[0050] In some embodiments, step S4, which involves obtaining the deflection angle of each reflective element relative to the optical emitting module based on the real-time output power, includes steps S41-S43: Step S41: Obtain the real-time power data curve of the processing light based on the real-time output light power.

[0051] Step S42: Based on the real-time power data curve, use the ramping algorithm to obtain the maximum range corresponding to the preset power.

[0052] Step S43: Based on the maximum range, obtain the deflection angle of each reflective element relative to the light emitting module.

[0053] Please refer to the following: Figure 1 , Figure 5 and Figure 6, Figure 6 The figure shows a real-time power data curve obtained by the control module of an embodiment of this application. The horizontal axis represents the time change of the deflection angle adjustment process of the reflective element, and the vertical axis is the real-time output power of the processing light. When the preset power is 0.25w (±0.5w), the maximum range corresponding to the preset power is obtained by using a ramping algorithm based on the real-time power data curve.

[0054] In the initial state (normal power): when the reflective element 21 is not deflected, the output power is stable in the normal range of about 0.257W. At this time, the beam alignment is good, there is no obvious coupling deviation, and the power output is stable. If misalignment, obstruction, or excessive tilting occurs between multiple reflective lenses during the assembly and alignment process or during use (e.g., excessive tilting of reflective element 21 caused by bumps during use), when the deflection angle of reflective element 21 deviates, the optical path alignment is disrupted, the beam coupling efficiency drops sharply (i.e., from time T1 to time T2), and the output power drops significantly. The curve shows a clear power trough (i.e., from time T2 to time T3), corresponding to the power degradation caused by beam offset or beam obstruction. When the reflective element 21 is adjusted to gradually restore the beam coupling state, the output power increases accordingly (i.e., from time T3 to time T4), and the curve rises from the trough, reflecting the gradual recovery of coupling efficiency during the optical path alignment process. When the deflection angle is adjusted excessively, causing the beam to be overcoupled, the optical path alignment deviates from the optimal state again, and the output power drops twice, forming a new power trough (i.e., from time T5 to time T6). This indicates that the attitude of the reflective element exceeds the effective alignment range. By obtaining the maximum range PT corresponding to the preset power, the deflection angle of each reflective element 21 relative to the optical emission module in the coupled state can be obtained, thereby completing the beam shaping.

[0055] Specifically, the control module 3 executes step S3 to coarsely adjust the deflection angle of each reflective element 21 relative to the light emitting module 1 (or coarsely adjust the displacement of each reflective element 21 relative to the light emitting module 1), and completely collects the optical path output power data corresponding to each position within the entire travel range. The step size of this coarse adjustment process is set relatively large, which can quickly traverse the entire adjustment range. Within the entire adjustment travel range, it can quickly screen and locate the approximate global power maximum point and its corresponding range, that is, obtain the maximum range corresponding to the preset power, thereby completing the large-scale preliminary optimization and positioning process. After completing the coarse adjustment traversal and positioning, the control module 3 automatically switches to the fine adjustment optimization stage. Taking the position of the approximate global power maximum obtained from the coarse adjustment as the center, a small-range precise adjustment range is defined. A smaller adjustment step size is used to perform fine scanning and fine adjustment of the displacement and rotation angle of the small reflector within this local range. Real-time optical path power data is continuously collected and compared to correct the adjustment position. Finally, the actual global power maximum value of the optical path output can be accurately locked, thereby completing the optimal calibration of the small reflector attitude and position. This coarse-fine two-stage climbing algorithm retains the advantages of the coarse-adjustment stage, which can scan the entire area and quickly lock the optimal interval, while the fine-adjustment stage makes up for the shortcomings of the coarse-adjustment stage, which has a large step size and insufficient accuracy. It can balance the efficiency of optical path optimization and the adjustment accuracy, and can effectively improve the stability of the combined optical path and the accuracy of output power.

[0056] In some embodiments, the control module 3 includes a memory (not shown) and a processor (not shown). The memory stores a computer program and preset parameters (such as a preset spot pattern of the laser processing equipment 100 and a preset power under normal operating conditions). The processor is used to execute the computer program. The processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0057] The laser processing equipment 100 provided in this application embodiment, through the setting of a control module 3 communicatively connected to the light guiding module 2, acquires the light spot pattern formed by the processing light L2 and the output power of the processing light L2, and uses it to precisely adjust the position of the reflecting element 21 and / or the light combining element 22 relative to the light emitting module 1 according to the preset light spot pattern, so that the light spot pattern formed by the processing light L2 is not offset relative to the preset light spot pattern and the output power of the processing light L2 is within the preset power range. This not only allows for beam shaping of the processing light L1 during assembly alignment, but also allows for beam shaping during use. Shaping the beam of the processing light L1 can effectively prevent misalignment, obstruction, or excessive tilting among multiple reflecting elements 21. This ensures that the spot pattern formed by the processing light L2 is not offset from the preset spot pattern, and also stabilizes the output power of the processing light L2 within the preset power range. This helps to improve the problems of poor spot performance and reduced output power, and further helps to avoid affecting the processing effect (such as avoiding insufficient processing depth). It also helps to improve the processing accuracy, stability, and practicality of the laser processing equipment 100 while meeting the miniaturization requirements of the laser processing equipment 100.

[0058] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of protection claimed in this application.

Claims

1. A laser processing device, characterized in that, include: A light emitting module includes at least two light-emitting units, each of which is used to emit process light. A light guiding module includes at least two reflective elements and a light combining element. Each reflective element is movably disposed on the light-emitting side of one of the light-emitting units for receiving and reflecting the sub-processing light. The light combining element is movably disposed on the light-emitting side of each reflective element for receiving and reflecting the sub-processing light, so that the sub-processing light is combined into a processing light to process the workpiece. The control module is communicatively connected to the light guiding module and is used to acquire the light spot pattern formed by the processing light and the output power of the processing light. It is also used to adjust the position of the reflective element and / or the light combining element relative to the light emitting module according to the preset light spot pattern, so that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and the output power of the processing light is within the preset power range.

2. The laser processing equipment as described in claim 1, characterized in that, The laser processing equipment further includes a beam combining element and a power detection component. The beam combining element is disposed on the light output side of the light guiding module and is used to reflect part of the processing light to the power detection component and transmit part of the processing light. The power detection component is communicatively connected to the control module and is used to receive and detect the output power of the processing light so that the control module can obtain the output power of the processing light.

3. The laser processing equipment as described in claim 2, characterized in that, The laser processing equipment further includes a spot acquisition component that is communicatively connected to the control module. The spot acquisition component is disposed on the side of the beam combining element away from the light guiding module and is used to receive a portion of the processing light transmitted from the beam combining element, so that the control module can acquire the spot pattern formed by the processing light.

4. The laser processing equipment as described in claim 2, characterized in that, The power detection component is an integrating sphere power meter or a photoelectric power meter.

5. The laser processing equipment as described in claim 1, characterized in that, The light emitting module further includes at least two collimating components. Each collimating component is disposed between one of the light-emitting units and one of the reflective elements. Each collimating component includes a first collimating lens and a second collimating lens. The first collimating lens is disposed on the light-emitting side of the light-emitting unit and is used to receive and reduce the divergence angle of the sub-processing light in the fast axis direction. The second collimating lens is disposed on the light-emitting side of the first collimating lens away from the light-emitting unit and is used to receive and reduce the divergence angle of the sub-processing light in the slow axis direction.

6. The laser processing equipment as described in claim 1, characterized in that, Each of the reflective elements in the light guiding module includes six degrees of freedom; the laser processing equipment also includes a driving module, which is communicatively connected to the control module, each of the reflective elements and the light combining element, and is used to independently adjust the position of each of the reflective elements and / or the light combining element relative to the light emitting module according to the driving signal of the driving module.

7. The laser processing equipment as described in claim 6, characterized in that, The six degrees of freedom include three translational degrees of freedom and three rotational degrees of freedom. The three translational degrees of freedom include the ability of the reflecting element to translate along the X-axis, the Y-axis, and the Z-axis, with the X-axis perpendicular to the Y-axis and the Z-axis, respectively. The three rotational degrees of freedom include the ability of the reflecting element to rotate about the X-axis, the Y-axis, and the Z-axis.

8. A beam shaping method, applied to the laser processing equipment as described in any one of claims 1-7, characterized in that, include: The spot pattern formed by the processing light and the real-time output power of the processing light are obtained; Based on the preset light spot pattern and the light spot pattern formed by the processing light, it is determined whether the light spot pattern formed by the processing light is offset relative to the preset light spot pattern; if the light spot pattern formed by the processing light is offset relative to the preset light spot pattern, the position of each of the reflecting elements and / or the combining elements relative to the light emitting module is adjusted; the light spot pattern formed by the processing light is repeatedly acquired until the light spot pattern formed by the processing light is no longer offset relative to the preset light spot pattern; When the light spot pattern formed by the processing light has no offset relative to the preset light spot pattern, the deflection angle of each of the reflective elements relative to the light emitting module is adjusted to obtain the real-time light output power of the processing light during the adjustment. Based on the real-time output power, obtain the deflection angle of each of the reflective elements relative to the light emitting module corresponding to the preset power; Each of the reflective elements is fixed according to the deflection angle so that the light spot pattern formed by the processing light is not offset relative to the preset light spot pattern and the output power of the processing light is within the preset power range.

9. The beam shaping method as described in claim 8, characterized in that, The step of obtaining the deflection angle of each of the reflective elements relative to the optical emitting module based on the real-time output power includes: Based on the real-time output light power, obtain the real-time power data curve of the processing light; Based on the real-time power data curve, a ramping algorithm is used to obtain the maximum interval corresponding to the preset power. Based on the maximum range, the deflection angle of each of the reflective elements relative to the light emitting module is obtained.

10. The beam shaping method as described in claim 8, characterized in that, The step of determining whether the light spot pattern formed by the processing light has shifted relative to the preset light spot pattern, based on the preset light spot pattern and the light spot pattern formed by the processing light, includes: Based on the light spot pattern, obtain the outline grayscale; Based on the preset spot pattern and the outline grayscale, it is determined whether the spot pattern formed by the processing light is offset relative to the preset spot pattern.

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