Ceramic plate laser processing path planning method and related equipment

Abstract

The application belongs to the technical field of laser processing, and discloses a ceramic plate laser processing path planning method and related equipment, the method comprising: obtaining processing position information of each processing position in a ceramic plate to be processed, obtaining processing parameters of a laser head, determining the processing position closest to the laser head from each processing position as a starting processing position, performing mobile position screening according to the processing position information and the processing parameters to obtain first candidate mobile position screening result information, performing processing efficiency evaluation based on spacing information of the starting processing position to obtain processing efficiency evaluation indexes of each first candidate processing position, selecting a first candidate processing position corresponding to the maximum value as a current optimal processing position, performing optimal processing sequence planning based on the current optimal processing position to obtain an optimal processing path of the ceramic plate to be processed; through the above method, the laser processing efficiency of the ceramic plate is improved.

Description

Technical Field

[0001] This application relates to the technical field of laser processing, and more specifically, to a method and related equipment for laser processing path planning of ceramic plates. Background Technology

[0002] With the rapid growth in demand for precision ceramic components in fields such as electronics, medical, and aerospace, laser processing technology has become an important processing method for hard and brittle ceramic materials such as alumina, aluminum nitride, and zirconium oxide due to its advantages of high precision, non-contact processing, and burr-free operation. However, the inherent low thermal conductivity and high brittleness of ceramic materials pose serious thermal defects during laser processing. Localized concentration of laser energy makes it difficult for heat to dissipate quickly, leading to melting, recrystallization, microcracks, and even spalling in the processed area, severely reducing product yield.

[0003] To mitigate the effects of heat accumulation, traditional processes often employ measures such as reducing processing speed, performing long-distance skip processing, or decreasing laser power. While these methods can suppress thermal damage to some extent, they significantly lengthen the processing cycle per piece, sacrificing production efficiency. For industrial production scenarios with large batches and tight schedules, the conflict between efficiency and quality is particularly pronounced. Furthermore, existing path planning is mostly based on the principle of shortest geometric distance, failing to incorporate the dynamic heat dissipation characteristics of ceramic materials into the constraints. This leads to unreasonable processing sequences and an inability to systematically avoid the risk of heat accumulation, thereby affecting the processing quality and production efficiency of the ceramic plates.

[0004] To address the aforementioned issues, existing technologies urgently need improvement. Summary of the Invention

[0005] The purpose of this application is to provide a method and related equipment for laser processing of ceramic plates. By using information on the location to be processed, the starting position of processing, the laser head movement speed, and the laser processing power, the method performs position filtering, optimal processing position selection, and optimal processing sequence planning to obtain the optimal processing path for the ceramic plate to be processed. This solves the problems of existing laser processing methods for ceramic plates, such as prominent thermal defects, difficulty in balancing processing efficiency and quality, and high risk of heat accumulation due to insufficient consideration of the dynamic heat dissipation characteristics of the material in path planning. The method can dynamically evaluate the heat dissipation conditions between processing positions, avoid excessive heat accumulation, and improve the laser processing efficiency of ceramic plates.

[0006] In a first aspect, this application provides a method for laser processing path planning of ceramic plates, including: The processing position information of each position in the ceramic plate to be processed is obtained, as well as the laser head position information, laser head movement speed information and laser processing power information of the laser head; Based on the processing position information and the laser head position information, the processing start position is determined from the processing positions that are closest to the laser head. Based on the information of the position to be processed, the processing start position, the laser head movement speed information, and the laser processing power information, the movement position is filtered to obtain the first candidate movement position filtering result information of the processing start position; Based on the distance information between the processing start position and each first candidate processing position in the first candidate movement position screening result information, the processing efficiency is evaluated to obtain the processing efficiency evaluation index of each first candidate processing position in the first candidate movement position screening result information. From the processing efficiency evaluation indicators, the first candidate position to be processed corresponding to the maximum value is selected as the current optimal processing position; Based on the processing start position and the current optimal processing position, the optimal processing sequence is planned to obtain the optimal processing path for the ceramic plate to be processed.

[0007] The ceramic plate laser processing path planning method provided in this application can realize laser processing of ceramic plates. By using the processing position information, processing start position, laser head movement speed information, and laser processing power information, the method can screen the movement position, select the optimal processing position, and plan the optimal processing sequence to obtain the optimal processing path for the ceramic plate to be processed. This method solves the problems of existing ceramic plate laser processing methods, such as prominent thermal defects, difficulty in balancing processing efficiency and quality, and high risk of heat accumulation due to insufficient consideration of the dynamic heat dissipation characteristics of the material in path planning. It can dynamically evaluate the heat dissipation conditions between processing positions, avoid excessive heat accumulation, and improve the laser processing efficiency of ceramic plates.

[0008] Optionally, based on the information of the position to be processed, the processing start position, the laser head movement speed information, and the laser processing power information, a movement position screening is performed to obtain the first candidate movement position screening result information of the processing start position, including: Determine the safe movement time threshold corresponding to the laser processing power information; Based on the processing position information, the processing start position, and the laser head movement speed information, the movement time is calculated to obtain the first movement time for the laser head to move from the processing start position to other processing positions; From the first movement time, a second movement time that is greater than the safe movement time threshold is selected to obtain the first candidate movement position selection result information of the processing start position.

[0009] The ceramic plate laser processing path planning method provided in this application can realize laser processing of ceramic plates. By introducing a safe movement time threshold and filtering it in combination with the actual movement time, it ensures that the laser head has enough time to dissipate heat when moving between different processing positions, effectively avoiding processing defects caused by heat accumulation and improving the processing quality of ceramic plates.

[0010] Optionally, determining the safe movement time threshold corresponding to the laser processing power information includes: Obtain the preset safe processing temperature threshold; Based on the laser processing power information and the preset peak temperature ratio coefficient, the processing peak temperature of the laser head at the current position is determined. Based on the peak processing temperature and the preset safe processing temperature threshold, the safe movement time threshold corresponding to the laser processing power information is calculated using the preset safe movement time calculation formula.

[0011] Optionally, based on the processing position information, the processing start position, and the laser head movement speed information, a movement time calculation is performed to obtain the first movement time of the laser head from the processing start position to other processing positions, including: Based on the processing position information and the processing start position, distance calculation is performed to obtain the distance information between the processing start position and other processing positions; Based on the distance information and the laser head speed information, the movement time is calculated to obtain the first movement time of the laser head from the processing start position to other processing positions.

[0012] Optionally, from the first movement time, a second movement time greater than the safe movement time threshold is selected to obtain the first candidate movement position selection result information of the processing start position, including: From the first movement time, select a second movement time that is greater than the safe movement time threshold; The processing position point corresponding to the second movement time is determined as a candidate movement position, and the first candidate movement position screening result information of the processing start position is obtained.

[0013] Optionally, based on the processing start position and the current optimal processing position, an optimal processing sequence is planned to obtain the optimal processing path for the ceramic plate to be processed, including: Based on the remaining unprocessed positions in each of the aforementioned unprocessed positions, the movement position filtering and optimal processing position selection are repeatedly performed to obtain the optimal processing position sorting information starting from the processing start position; Based on the optimal processing position sorting information and the laser head position information, the optimal processing path for the ceramic plate to be processed is determined.

[0014] Optionally, based on the remaining unprocessed positions among the aforementioned processing positions, the movement position filtering and optimal processing position selection are repeatedly performed to obtain optimal processing position sorting information starting from the processing start position, including: Step A1: Remove the processing start position and the current optimal processing position from each of the positions to be processed to obtain the remaining positions to be processed; Step A2: Based on the current optimal processing position, filter the remaining processing positions to obtain the second candidate movement position filtering result information; Step A3: From the second candidate movement position screening results, select the second candidate processing position corresponding to the maximum value of the processing efficiency evaluation index as the next optimal processing position; Step A4: Take the next optimal processing position as the current optimal processing position, return to step A1, and continue until all the processing positions have been selected to obtain the optimal processing position sorting information starting from the processing start position.

[0015] The ceramic plate laser processing path planning method provided in this application can realize laser processing of ceramic plates. Through iterative iteration, it dynamically selects the next optimal processing position, ensuring that each step is based on the current best state, thereby achieving globally optimal processing path planning and improving the processing efficiency and quality of ceramic plates.

[0016] Secondly, this application provides a path planning device for laser processing of ceramic plates, comprising: The acquisition module is used to acquire the processing position information of each processing position in the ceramic plate to be processed, as well as the laser head position information, laser head movement speed information and laser processing power information of the laser head; The determination module is used to determine the processing start position as the position that is closest to the laser head from the processing positions based on the processing position information and the laser head position information; The filtering module is used to filter the movement position based on the processing position information, the processing start position, the laser head movement speed information and the laser processing power information, and obtain the first candidate movement position filtering result information of the processing start position; The evaluation module is used to evaluate the processing efficiency based on the distance information between the processing start position and each first candidate processing position in the first candidate movement position screening result information, and to obtain the processing efficiency evaluation index of each first candidate processing position in the first candidate movement position screening result information. The selection module is used to select the first candidate processing position corresponding to the maximum value from the processing efficiency evaluation index as the current optimal processing position; The planning module is used to plan the optimal processing sequence based on the processing start position and the current optimal processing position, so as to obtain the optimal processing path for the ceramic plate to be processed.

[0017] This ceramic plate laser processing path planning device uses information on the location to be processed, the starting position, the laser head speed, and the laser processing power to filter the moving position, select the optimal processing position, and plan the optimal processing sequence, thus obtaining the optimal processing path for the ceramic plate to be processed. This solves the problems of existing ceramic plate laser processing methods, such as prominent thermal defects, difficulty in balancing processing efficiency and quality, and high risk of heat accumulation due to insufficient consideration of the dynamic heat dissipation characteristics of the material in path planning. It can dynamically evaluate the heat dissipation conditions between processing positions, avoid excessive heat accumulation, and improve the laser processing efficiency of ceramic plates.

[0018] Thirdly, this application provides an electronic device, including a processor and a memory, wherein the memory stores a computer program executable by the processor, and when the processor executes the computer program, it performs the steps in the ceramic plate laser processing path planning method described above.

[0019] Fourthly, this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the steps of the ceramic plate laser processing path planning method described above.

[0020] Beneficial effects: The ceramic plate laser processing path planning method and related equipment provided in this application, through the processing position information, processing start position, laser head movement speed information, and laser processing power information, perform moving position screening, optimal processing position selection, and optimal processing sequence planning to obtain the optimal processing path for the ceramic plate to be processed. This solves the problems of prominent thermal defects, difficulty in balancing processing efficiency and quality, and high risk of heat accumulation due to insufficient consideration of the dynamic heat dissipation characteristics of the material in the existing ceramic plate laser processing methods. It can dynamically evaluate the heat dissipation conditions between processing positions, avoid excessive heat accumulation, and improve the laser processing efficiency of ceramic plates. Attached Figure Description

[0021] Figure 1 A flowchart of a ceramic plate laser processing path planning method provided in an embodiment of this application.

[0022] Figure 2 This is a schematic diagram of the structure of the ceramic plate laser processing path planning device provided in the embodiments of this application.

[0023] Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0024] Labeling Explanation: 1. Acquisition Module; 2. Determination Module; 3. Filtering Module; 4. Evaluation Module; 5. Selection Module; 6. Planning Module; 301. Processor; 302. Memory; 303. Communication Bus. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] Please refer to Figure 1 , Figure 1 This application discloses a method for laser processing path planning of ceramic plates, which is used for laser processing of ceramic plates and includes the following steps: Step S101: Obtain the processing position information of each processing position in the ceramic plate to be processed, as well as the laser head position information, laser head movement speed information and laser processing power information of the laser head; Step S102: Based on the processing position information and the laser head position information, determine the processing start position as the processing start position from among the processing positions that are closest to the laser head. Step S103: Based on the information of the position to be processed, the processing start position, the laser head moving speed information, and the laser processing power information, the moving position is filtered to obtain the first candidate moving position filtering result information of the processing start position; Step S104: Based on the spacing information between each first candidate processing position in the first candidate moving position screening result information, perform processing efficiency evaluation to obtain the processing efficiency evaluation index of each first candidate processing position in the first candidate moving position screening result information. Step S105: Select the first candidate processing position corresponding to the maximum value from the processing efficiency evaluation index as the current optimal processing position; Step S106: Based on the processing start position and the current optimal processing position, perform optimal processing sequence planning to obtain the optimal processing path for the ceramic plate to be processed.

[0028] This method for planning the laser processing path of ceramic plates uses information on the location to be processed, the starting position, the laser head speed, and the laser processing power to filter the moving position, select the optimal processing position, and plan the optimal processing sequence, thereby obtaining the optimal processing path for the ceramic plate to be processed. This method solves the problems of existing laser processing methods for ceramic plates, such as prominent thermal defects, difficulty in balancing processing efficiency and quality, and high risk of heat accumulation due to insufficient consideration of the dynamic heat dissipation characteristics of the material in path planning. It can dynamically evaluate the heat dissipation conditions between processing positions, avoid excessive heat accumulation, and improve the laser processing efficiency of ceramic plates.

[0029] Specifically, in step S101, the processing position information of each processing location on the ceramic plate to be processed is obtained, as well as the laser head position information, laser head movement speed information, and laser processing power information of the laser head. The processing position information refers to the coordinate information of each point on the ceramic plate to be processed, which is the basis for path planning. The laser head position information refers to the real-time spatial coordinates of the laser head at the initial moment (before processing begins), used to determine the relative position between the laser head and the processing location. The laser head movement speed information refers to the speed parameter of the laser head during its movement, which directly affects the time required for the laser head to move from one position to another, and can be set according to actual needs. Generally, because the acceleration and deceleration of laser movement are very high, the acceleration and deceleration time is negligible, and the movement process of the laser head will be a uniform speed process. Therefore, when processing the same ceramic plate, the laser head movement speed information will remain unchanged. The laser processing power information refers to the laser power used by the laser head during processing. This power is closely related to the heat accumulation in the processing area, and different processing powers may be configured for each processing location due to different process requirements.

[0030] Specifically, in step S102, all positions to be processed are traversed, and their straight-line distances (or Euclidean distances, which can be selected according to the movement of the laser head) from the current position of the laser head are calculated. Then, the point with the shortest distance is selected as the starting point of this processing.

[0031] Specifically, in step S103, based on the information of the position to be processed, the processing start position, the laser head movement speed information, and the laser processing power information, the movement position is filtered to obtain the first candidate movement position filtering result information of the processing start position, including: Determine the safe movement time threshold corresponding to the laser processing power information; Based on the information of the position to be processed, the starting position of processing, and the laser head moving speed, the movement time is calculated to obtain the first movement time of the laser head from the starting position of processing to other positions to be processed; From the first movement time, a second movement time that is greater than the safe movement time threshold is selected to obtain the first candidate movement position selection result information of the processing start position.

[0032] Specifically, in step S103, determining the safe movement time threshold corresponding to the laser processing power information includes: Obtain the preset safe processing temperature threshold; Based on the laser processing power information and the preset peak temperature ratio coefficient, the processing peak temperature of the laser head at the current position is determined. Based on the peak processing temperature and the preset safe processing temperature threshold, the safe movement time threshold corresponding to the laser processing power information is obtained by using the preset safe movement time calculation formula.

[0033] In step S103, before laser processing the ceramic plate, based on factors such as the material properties, thickness, and processing quality requirements of the ceramic plate, a maximum temperature that other parts of the ceramic plate can withstand when processing any position is set during the processing process. This ensures that there is no mutual interference between all positions of the ceramic plate during processing, preventing excessive local heat accumulation in the ceramic plate during processing. This safe processing temperature threshold can be obtained experimentally.

[0034] The preset peak temperature scaling factor is a coefficient obtained by fitting experimental data. It characterizes the relationship between the maximum temperature that a local area of ​​the ceramic plate may reach and the laser power at a specific laser processing power. By multiplying the laser processing power information by this peak temperature scaling factor, the peak processing temperature that the laser head may reach locally on the ceramic plate at the current position under the current processing power can be estimated. ,in, For the peak processing temperature, For laser processing power, This is the preset peak temperature scaling factor. In actual operation, the laser head may be configured with different laser processing powers at different processing positions according to process requirements, which will result in different peak processing temperatures that the laser head may reach at different processing positions.

[0035] Based on the peak processing temperature and a preset safe processing temperature threshold, a pre-defined safe movement time calculation formula is used to obtain the safe movement time threshold corresponding to the laser processing power information. This safe movement time calculation formula is a pre-established mathematical model whose input parameters include the peak processing temperature and the safe processing temperature threshold. The output is the shortest time required for the laser head to safely move between different processing positions. This formula typically considers physical processes such as heat conduction and heat diffusion to ensure that the temperature of a localized area of ​​the ceramic plate can drop below the safe processing temperature threshold during the laser head's movement from one processing position to the next, thereby avoiding damage caused by heat accumulation.

[0036] The specific formula for calculating safe movement time is as follows: ; in, To ensure safe processing temperature thresholds; The ambient temperature; This refers to the peak processing temperature. It is a natural constant; The safe movement time threshold; The heat dissipation coefficient is determined by the material's thermal properties. , The convective heat transfer coefficient is... The surface area of ​​the ceramic plate. For the volume of the ceramic plate, Density of ceramic plate material This refers to the specific heat capacity of the ceramic plate.

[0037] Specifically, in step S103, based on the information of the position to be processed, the processing start position, and the laser head moving speed information, a movement time calculation is performed to obtain the first movement time of the laser head moving from the processing start position to other positions to be processed, including: Based on the information of the position to be processed and the starting position of processing, the distance is calculated to obtain the distance information between the starting position of processing and other positions to be processed; Based on distance information and laser head speed information, the movement time is calculated to obtain the first movement time of the laser head from the processing start position to other processing positions.

[0038] In step S103, based on the processing position information and the processing start position, the straight-line distance (or Euclidean distance) between the processing start position and each other processing position is calculated to quantify the spatial distance required for the laser head to move from the processing start position to any processing position, thereby obtaining the distance information between the processing start position and other processing positions.

[0039] Dividing the calculated distance information by the laser head speed information yields the time required for the laser head to move from the processing start position to other processing positions. This transforms spatial distance into a time dimension consideration, providing the first movement time for the laser head to move from the processing start position to other processing positions, and providing a time basis for subsequent movement position selection.

[0040] Specifically, in step S103, a second movement time greater than the safe movement time threshold is selected from the first movement time to obtain the first candidate movement position selection result information of the processing start position, including: From the first movement time, select a second movement time that is greater than the safe movement time threshold; The processing position point corresponding to the second movement time is determined as the candidate movement position, and the first candidate movement position screening result information of the processing start position is obtained.

[0041] In step S103, after calculating the first movement time of the laser head from the processing start position to other processing positions, each of these first movement times is compared with a predetermined safe movement time threshold. If any first movement time exceeds the safe movement time threshold, it is considered a valid "second movement time". The second movement time ensures that the laser head has sufficient time to cool down or avoid overheating during the movement, thereby ensuring processing quality and equipment safety.

[0042] After identifying all second movement times that meet the safety movement time requirements, the original processing positions corresponding to these second movement times are marked as potential processing targets, i.e., candidate movement positions. These marked processing positions collectively constitute the first candidate movement position screening result information for the processing start position. The purpose of determining the processing positions corresponding to the second movement times as candidate movement positions is to initially screen out those positions from all processing positions that can be processed safely and stably under the current laser processing power and movement speed conditions, laying the foundation for subsequent optimal processing position selection.

[0043] In an optional embodiment, when there is no movement time greater than the safe movement time threshold in the first movement time, the difference between the safe movement time threshold and all the first movement times is calculated, and the first movement time corresponding to the minimum value of the difference is selected as the second movement time. The processing position point corresponding to the second movement time is determined as the candidate movement position. Alternatively, the processing point with the smallest distance is selected as the candidate movement position. When planning the processing path, the waiting time corresponding to the difference between the safe movement time threshold and the first movement time corresponding to the candidate movement position is added. This ensures that during actual processing, the laser head waits for the waiting time corresponding to the difference at the current position (including the processing start position and any subsequent processing position) before heading to the candidate movement position. This avoids the processing process at the candidate movement position from affecting the previous processing position and prevents excessive local heat accumulation.

[0044] Specifically, in step S104, during the laser processing of ceramic plates, the processing efficiency is related not only to the distance between the current processing position and the next processing position (spacing information, i.e., the movement distance of the laser head), but also to the laser processing speed and peak processing temperature at the current processing position, as well as the movement speed of the laser head. Specifically, the greater the distance between the current and next processing positions, the higher the processing efficiency; processing efficiency is inversely proportional to distance. The faster the laser processing speed at the current processing position, the higher the processing efficiency; processing efficiency is directly proportional to laser processing speed. The higher the peak processing temperature at the current processing position, the longer the cooling time, and the lower the processing efficiency; processing efficiency is inversely proportional to peak processing temperature. The faster the movement speed of the laser head, the higher the processing efficiency; processing efficiency is directly proportional to the movement speed of the laser head. Therefore, to achieve high-efficiency laser processing of ceramic plates, a faster laser processing speed and laser movement speed, a processing point with a lower peak processing temperature, and a shorter movement distance are required.

[0045] In summary, based on the distance information between each first candidate processing position in the first candidate moving position screening results (i.e., the distance between the processing start position and the first candidate processing position), combined with the laser processing speed and peak processing temperature of the laser head at the processing start position and the moving speed of the laser head, the processing efficiency evaluation can be carried out, and the processing efficiency evaluation index of each first candidate processing position in the first candidate moving position screening results can be calculated.

[0046] For example, when evaluating processing efficiency in practice, an efficiency evaluation index function can be constructed based on the above relationships (the correspondence between processing efficiency and the distance between the current processing position and the next processing position, the laser processing speed and peak processing temperature of the laser head at the current processing position, and the moving speed of the laser head). This efficiency evaluation index function can comprehensively consider factors such as moving distance, processing time, and heat accumulation risk (peak processing temperature), and output the processing efficiency evaluation index for the corresponding candidate processing positions (including the first candidate processing position and the subsequent second candidate processing position). Specifically, the processing efficiency evaluation index is as follows: ; in, As an indicator for evaluating processing efficiency; The processing speed at the laser head's current location (when the calculated location is the starting position of processing). (This refers to the processing speed of the laser head at the initial processing position). , This is the ratio coefficient between processing speed and laser power; This refers to the moving speed of the laser head (laser head speed information). This information pertains to the distance between the laser head's location and the target location (when the calculated target location is the first candidate location to be processed). This refers to the distance information between the laser head location and the first candidate location to be processed.

[0047] Specifically, in step S105, the first candidate processing position corresponding to the maximum value from the processing efficiency evaluation index is selected as the current optimal processing position. This step aims to select the next processing point that appears to be the most "efficient" from the initially screened candidate positions.

[0048] Generally, when processing the same ceramic plate, the processing efficiency evaluation index of the candidate processing position is affected by the laser head's moving speed, the processing speed and peak processing temperature at the current processing position, and the distance between the current processing position and the candidate processing position. However, since the current optimal processing position is a point that has not yet been determined, while the laser head's moving speed, the processing speed at the current processing position, and the peak processing temperature are already determined data, the current optimal processing position is actually only affected by the distance between the current processing position and the candidate processing position. Therefore, in actual selection, the point with the smallest distance among the candidate processing positions can be selected as the current optimal processing position.

[0049] Specifically, in step S106, based on the processing start position and the current optimal processing position, optimal processing sequence planning is performed to obtain the optimal processing path for the ceramic plate to be processed, including: Based on the remaining unprocessed positions in each unprocessed position, the movement position filtering and optimal processing position selection are repeatedly performed to obtain the optimal processing position sorting information starting from the processing start position; Based on the optimal processing position sorting information and laser head position information, the optimal processing path for the ceramic plate to be processed is determined.

[0050] Specifically, in step S106, based on the remaining unprocessed positions in each unprocessed position, the movement position filtering and optimal processing position selection are repeatedly performed to obtain the optimal processing position sorting information starting from the processing start position, including: Step A1: Remove the starting processing position and the current optimal processing position from each position to be processed to obtain the remaining positions to be processed; Step A2: Based on the current optimal processing position, filter the remaining processing positions to obtain the second candidate movement position filtering result information; Step A3: From the results of the second candidate moving position screening, select the second candidate processing position corresponding to the maximum value of the processing efficiency evaluation index as the next optimal processing position; Step A4: Select the next optimal processing position as the current optimal processing position, return to step A1, and continue until all processing positions have been selected, thus obtaining the optimal processing position sorting information starting from the processing start position.

[0051] In step S106, before selecting the optimal processing position for the next round, the processing positions that have been determined as the processing start position and the current optimal processing position need to be removed from the total set of processing positions to ensure that subsequent selections are made at positions that have not yet been processed, avoiding duplicate selections. This results in a set containing all unplanned processing positions, i.e., the remaining processing positions.

[0052] Based on the current optimal processing position, the remaining processing positions are filtered to obtain the second candidate movement position filtering results. Specifically, the first movement time required for the laser head to move from the current optimal processing position to each of the remaining processing positions is calculated, and second movement times exceeding a safe movement time threshold are selected. The processing positions corresponding to these second movement times constitute the second candidate movement position filtering results. This filtering process is similar to the previously described movement position filtering, aiming to determine candidate movement positions that meet the safe movement time threshold from the remaining processing positions based on the laser head speed information and laser processing power information.

[0053] From the results of the second candidate movement position selection, the second candidate processing position corresponding to the maximum value of the processing efficiency evaluation index is selected as the next optimal processing position. This is the same logic as the initial selection of the current optimal processing position. The processing efficiency evaluation index is calculated for each candidate processing position in the second candidate movement position selection results using a preset efficiency evaluation index function, and the position with the largest index value is selected as the next highest priority processing position.

[0054] The next optimal processing position is selected as the current optimal processing position, and the process returns to step A1. This iterative process continues until all processing positions have been selected, meaning all processing positions have been assigned a definite processing order. Through this iterative approach, a complete processing path can be gradually constructed, and the optimal processing position sorting information starting from the processing start position can be obtained.

[0055] By iteratively executing the steps of filtering movement positions and selecting the optimal processing position, it is ensured that each step in planning the optimal processing path is based on the currently determined optimal processing position, while also considering the processing efficiency of all remaining positions to be processed. By eliminating selected processing positions in each iteration, duplication and redundancy in path planning are avoided. Simultaneously, by continuously filtering candidate positions that meet the safe movement time threshold and selecting the next position with the highest processing efficiency, the entire processing path maximizes processing efficiency while ensuring safety. This point-by-point determination method can effectively construct a globally optimal or near-optimal processing sequence.

[0056] Specifically, in step S106, after obtaining the processing sequence of all positions to be processed, these ordered processing positions are connected together with the laser head position information to form a complete processing path that the laser head can follow. This path not only considers processing efficiency but also takes into account the movement characteristics of the laser head, and can also prevent excessive local heat accumulation during processing, ensuring the smoothness and efficiency of the processing.

[0057] As can be seen from the above, the method for planning the laser processing path of ceramic plates obtains the processing position information of each processing location in the ceramic plate to be processed, as well as the laser head position information, laser head movement speed information, and laser processing power information. Based on the processing position information and laser head position information, the processing start position is determined from each processing location with the smallest distance from the laser head. The moving position is then filtered according to the processing position information, the processing start position, the laser head movement speed information, and the laser processing power information to obtain the first candidate moving position filtering result information for the processing start position. Based on the distance information between the processing start position and each first candidate processing location in the first candidate moving position filtering result information, the processing efficiency is evaluated to obtain the processing efficiency of each first candidate processing location in the first candidate moving position filtering result information. The efficiency evaluation index selects the first candidate processing position corresponding to the maximum value from the processing efficiency evaluation index as the current optimal processing position. Based on the processing start position and the current optimal processing position, the optimal processing sequence is planned to obtain the optimal processing path of the ceramic plate to be processed. Thus, by using the processing position information, processing start position, laser head movement speed information, and laser processing power information, the optimal processing position is selected and the optimal processing sequence is planned to obtain the optimal processing path of the ceramic plate to be processed. This solves the problems of prominent thermal defects, difficulty in balancing processing efficiency and quality, and high risk of heat accumulation due to insufficient consideration of the dynamic heat dissipation characteristics of the material in the path planning of existing ceramic plate laser processing methods. It can dynamically evaluate the heat dissipation conditions between processing positions, avoid excessive heat accumulation, and improve the laser processing efficiency of ceramic plates.

[0058] refer to Figure 2 This application provides a ceramic plate laser processing path planning device for laser processing of ceramic plates, comprising: The acquisition module 1 is used to acquire the processing position information of each processing position in the ceramic plate to be processed, as well as the laser head position information, laser head movement speed information and laser processing power information of the laser head; The determination module 2 is used to determine the processing start position as the position that is closest to the laser head from the processing positions based on the processing position information and the laser head position information. The filtering module 3 is used to filter the movement position based on the information of the position to be processed, the processing start position, the laser head moving speed information and the laser processing power information, and obtain the first candidate movement position filtering result information of the processing start position; Evaluation module 4 is used to evaluate the processing efficiency based on the distance information between each first candidate processing position in the first candidate moving position screening result information, and to obtain the processing efficiency evaluation index of each first candidate processing position in the first candidate moving position screening result information. Selection module 5 is used to select the first candidate processing position corresponding to the maximum value from the processing efficiency evaluation index as the current optimal processing position; Planning module 6 is used to plan the optimal processing sequence based on the processing start position and the current optimal processing position, so as to obtain the optimal processing path of the ceramic plate to be processed.

[0059] This ceramic plate laser processing path planning device uses information on the location to be processed, the starting position, the laser head speed, and the laser processing power to filter the moving position, select the optimal processing position, and plan the optimal processing sequence, thus obtaining the optimal processing path for the ceramic plate to be processed. This solves the problems of existing ceramic plate laser processing methods, such as prominent thermal defects, difficulty in balancing processing efficiency and quality, and high risk of heat accumulation due to insufficient consideration of the dynamic heat dissipation characteristics of the material in path planning. It can dynamically evaluate the heat dissipation conditions between processing positions, avoid excessive heat accumulation, and improve the laser processing efficiency of ceramic plates.

[0060] Specifically, during execution, module 1 acquires the processing position information of each location on the ceramic plate to be processed, as well as the laser head position information, laser head speed information, and laser processing power information. The processing position information refers to the coordinates of each point on the ceramic plate that needs laser processing; this information is the basis for path planning. The laser head position information refers to the real-time spatial coordinates of the laser head at the initial moment (before processing begins), used to determine the relative position between the laser head and the processing location. The laser head speed information refers to the speed parameter of the laser head during its movement, which directly affects the time required for the laser head to move from one position to another and can be set according to actual needs. Generally, because the acceleration and deceleration of laser movement are very high, the acceleration and deceleration time is negligible, and the laser head movement process will be a constant-speed motion. Therefore, when processing the same ceramic plate, the laser head speed information will remain unchanged. The laser processing power information refers to the laser power used by the laser head during processing. This power is closely related to the heat accumulation in the processing area, and different processing powers may be configured for each processing location due to different process requirements.

[0061] Specifically, when module 2 is executed, it traverses all positions to be processed, calculates their straight-line distance (or Euclidean distance, which can be selected according to the movement mode of the laser head) from the current position of the laser head, and then selects the point with the shortest distance as the starting point of this processing.

[0062] Specifically, when the filtering module 3 performs position filtering based on the processing position information, processing start position, laser head speed information, and laser processing power information, and obtains the first candidate position filtering result information for the processing start position, it executes the following: Determine the safe movement time threshold corresponding to the laser processing power information; Based on the information of the position to be processed, the starting position of processing, and the laser head moving speed, the movement time is calculated to obtain the first movement time of the laser head from the starting position of processing to other positions to be processed; From the first movement time, a second movement time that is greater than the safe movement time threshold is selected to obtain the first candidate movement position selection result information of the processing start position.

[0063] Specifically, when determining the safe movement time threshold corresponding to the laser processing power information, the screening module 3 performs the following: Obtain the preset safe processing temperature threshold; Based on the laser processing power information and the preset peak temperature ratio coefficient, the processing peak temperature of the laser head at the current position is determined. Based on the peak processing temperature and the preset safe processing temperature threshold, the safe movement time threshold corresponding to the laser processing power information is obtained by using the preset safe movement time calculation formula.

[0064] When the screening module 3 is executed, before laser processing the ceramic plate, it sets a maximum temperature that other parts of the ceramic plate can withstand when processing any position during the processing, based on factors such as the material properties, thickness, and processing quality requirements of the ceramic plate. This ensures that there is no mutual interference between all parts of the ceramic plate during processing and prevents excessive local heat accumulation. This safe processing temperature threshold can be obtained experimentally.

[0065] The preset peak temperature scaling factor is a coefficient obtained by fitting experimental data. It characterizes the relationship between the maximum temperature that a local area of ​​the ceramic plate may reach and the laser power at a specific laser processing power. By multiplying the laser processing power information by this peak temperature scaling factor, the peak processing temperature that the laser head may reach locally on the ceramic plate at the current position under the current processing power can be estimated. ,in, For the peak processing temperature, For laser processing power, This is the preset peak temperature scaling factor. In actual operation, the laser head may be configured with different laser processing powers at different processing positions according to process requirements, which will result in different peak processing temperatures that the laser head may reach at different processing positions.

[0066] Based on the peak processing temperature and a preset safe processing temperature threshold, a pre-defined safe movement time calculation formula is used to obtain the safe movement time threshold corresponding to the laser processing power information. This safe movement time calculation formula is a pre-established mathematical model whose input parameters include the peak processing temperature and the safe processing temperature threshold. The output is the shortest time required for the laser head to safely move between different processing positions. This formula typically considers physical processes such as heat conduction and heat diffusion to ensure that the temperature of a localized area of ​​the ceramic plate can drop below the safe processing temperature threshold during the laser head's movement from one processing position to the next, thereby avoiding damage caused by heat accumulation.

[0067] The specific formula for calculating safe movement time is as follows: ; in, To ensure safe processing temperature thresholds; The ambient temperature; It is a natural constant; The safe movement time threshold; The heat dissipation coefficient is determined by the material's thermal properties. , The convective heat transfer coefficient is... The surface area of ​​the ceramic plate. For the volume of the ceramic plate, Density of ceramic plate material This refers to the specific heat capacity of the ceramic plate.

[0068] Specifically, when the filtering module 3 calculates the movement time based on the processing position information, the processing start position, and the laser head movement speed information to obtain the first movement time for the laser head to move from the processing start position to other processing positions, it executes the following: Based on the information of the position to be processed and the starting position of processing, the distance is calculated to obtain the distance information between the starting position of processing and other positions to be processed; Based on distance information and laser head speed information, the movement time is calculated to obtain the first movement time of the laser head from the processing start position to other processing positions.

[0069] When the filtering module 3 is executed, it calculates the straight-line distance (or Euclidean distance) between the processing start position and each other processing position based on the processing start position information and the processing start position, so as to quantify the spatial distance required for the laser head to move from the processing start position to any processing position, and obtain the distance information between the processing start position and other processing positions.

[0070] Dividing the calculated distance information by the laser head speed information yields the time required for the laser head to move from the processing start position to other processing positions. This transforms spatial distance into a time dimension consideration, providing the first movement time for the laser head to move from the processing start position to other processing positions, and providing a time basis for subsequent movement position selection.

[0071] Specifically, when the filtering module 3 filters out the second movement time that is greater than the safe movement time threshold from the first movement time and obtains the first candidate movement position filtering result information of the processing start position, it executes: From the first movement time, select a second movement time that is greater than the safe movement time threshold; The processing position point corresponding to the second movement time is determined as the candidate movement position, and the first candidate movement position screening result information of the processing start position is obtained.

[0072] During execution, the screening module 3 calculates the first movement time of the laser head from the processing start position to other processing positions, and then compares these first movement times with a predetermined safe movement time threshold. Any first movement time exceeding this safe movement time threshold is considered a valid "second movement time." The second movement time ensures that the laser head has sufficient time to cool down or avoid overheating during movement, thereby guaranteeing processing quality and equipment safety.

[0073] After identifying all second movement times that meet the safety movement time requirements, the original processing positions corresponding to these second movement times are marked as potential processing targets, i.e., candidate movement positions. These marked processing positions collectively constitute the first candidate movement position screening result information for the processing start position. The purpose of determining the processing positions corresponding to the second movement times as candidate movement positions is to initially screen out those positions from all processing positions that can be processed safely and stably under the current laser processing power and movement speed conditions, laying the foundation for subsequent optimal processing position selection.

[0074] In an optional embodiment, when there is no movement time greater than the safe movement time threshold in the first movement time, the difference between the safe movement time threshold and all the first movement times is calculated, and the first movement time corresponding to the minimum value of the difference is selected as the second movement time. The processing position point corresponding to the second movement time is determined as the candidate movement position. Alternatively, the processing point with the smallest distance is selected as the candidate movement position. When planning the processing path, the waiting time corresponding to the difference between the safe movement time threshold and the first movement time corresponding to the candidate movement position is added. This ensures that during actual processing, the laser head waits for the waiting time corresponding to the difference at the current position (including the processing start position and any subsequent processing position) before heading to the candidate movement position. This avoids the processing process at the candidate movement position from affecting the previous processing position and prevents excessive local heat accumulation.

[0075] Specifically, during the execution of evaluation module 4, the processing efficiency in the laser processing of ceramic plates is related not only to the distance between the current processing position and the next processing position (spacing information, i.e., the movement distance of the laser head), but also to the laser processing speed and peak processing temperature at the current processing position, as well as the movement speed of the laser head. Specifically, the greater the distance between the current and next processing positions, the higher the processing efficiency; processing efficiency is inversely proportional to distance. The faster the laser processing speed at the current processing position, the higher the processing efficiency; processing efficiency is directly proportional to laser processing speed. The higher the peak processing temperature at the current processing position, the longer the cooling time, and the lower the processing efficiency; processing efficiency is inversely proportional to peak processing temperature. The faster the movement speed of the laser head, the higher the processing efficiency; processing efficiency is directly proportional to the movement speed of the laser head. Therefore, to achieve high-efficiency laser processing of ceramic plates, a faster laser processing speed and laser movement speed, a processing point with a lower peak processing temperature, and a shorter movement distance are required.

[0076] In summary, based on the distance information between each first candidate processing position in the first candidate moving position screening results (i.e., the distance between the processing start position and the first candidate processing position), combined with the laser processing speed and peak processing temperature of the laser head at the processing start position and the moving speed of the laser head, the processing efficiency evaluation can be carried out, and the processing efficiency evaluation index of each first candidate processing position in the first candidate moving position screening results can be calculated.

[0077] For example, when evaluating processing efficiency in practice, an efficiency evaluation index function can be constructed based on the above relationships (the correspondence between processing efficiency and the distance between the current processing position and the next processing position, the laser processing speed and peak processing temperature of the laser head at the current processing position, and the moving speed of the laser head). This efficiency evaluation index function can comprehensively consider factors such as moving distance, processing time, and heat accumulation risk (peak processing temperature), and output the processing efficiency evaluation index for the corresponding candidate processing positions (including the first candidate processing position and the subsequent second candidate processing position). Specifically, the processing efficiency evaluation index is as follows: ; in, As an indicator for evaluating processing efficiency; The processing speed at the laser head's current location (when the calculated location is the starting position of processing). (This refers to the processing speed of the laser head at the initial processing position). , This is the ratio coefficient between processing speed and laser power; This refers to the moving speed of the laser head (laser head speed information). This information pertains to the distance between the laser head's location and the target location (when the calculated target location is the first candidate location to be processed). This refers to the distance information between the laser head location and the first candidate location to be processed.

[0078] Specifically, when module 5 is executed, it selects the first candidate processing position corresponding to the maximum value from the processing efficiency evaluation indicators, and uses this as the current optimal processing position. This step aims to select the next processing point that appears to be the most "efficient" from the initially screened candidate positions.

[0079] Generally, when processing the same ceramic plate, the processing efficiency evaluation index of the candidate processing position is affected by the laser head's moving speed, the processing speed and peak processing temperature at the current processing position, and the distance between the current processing position and the candidate processing position. However, since the current optimal processing position is a point that has not yet been determined, while the laser head's moving speed, the processing speed at the current processing position, and the peak processing temperature are already determined data, the current optimal processing position is actually only affected by the distance between the current processing position and the candidate processing position. Therefore, in actual selection, the point with the smallest distance among the candidate processing positions can be selected as the current optimal processing position.

[0080] Specifically, when planning module 6 calculates the optimal processing sequence based on the processing start position and the current optimal processing position to obtain the optimal processing path for the ceramic plate to be processed, it executes the following: Based on the remaining unprocessed positions in each unprocessed position, the movement position filtering and optimal processing position selection are repeatedly performed to obtain the optimal processing position sorting information starting from the processing start position; Based on the optimal processing position sorting information and laser head position information, the optimal processing path for the ceramic plate to be processed is determined.

[0081] Specifically, when the planning module 6 repeatedly performs the movement position filtering and optimal processing position selection based on the remaining processing positions in each processing position to obtain the optimal processing position sorting information starting from the processing start position, it executes: Step A1: Remove the starting processing position and the current optimal processing position from each position to be processed to obtain the remaining positions to be processed; Step A2: Based on the current optimal processing position, filter the remaining processing positions to obtain the second candidate movement position filtering result information; Step A3: From the results of the second candidate moving position screening, select the second candidate processing position corresponding to the maximum value of the processing efficiency evaluation index as the next optimal processing position; Step A4: Select the next optimal processing position as the current optimal processing position, return to step A1, and continue until all processing positions have been selected, thus obtaining the optimal processing position sorting information starting from the processing start position.

[0082] When planning module 6 executes, before selecting the next optimal processing position, it needs to remove the processing positions that have already been determined as the processing start position and the current optimal processing position from the total set of processing positions. This ensures that subsequent selections are made at positions that have not yet been processed, avoiding duplicate selections. Thus, a set containing all unplanned processing positions is obtained, i.e., the remaining processing positions.

[0083] Based on the current optimal processing position, the remaining processing positions are filtered to obtain the second candidate movement position filtering results. Specifically, the first movement time required for the laser head to move from the current optimal processing position to each of the remaining processing positions is calculated, and second movement times exceeding a safe movement time threshold are selected. The processing positions corresponding to these second movement times constitute the second candidate movement position filtering results. This filtering process is similar to the previously described movement position filtering, aiming to determine candidate movement positions that meet the safe movement time threshold from the remaining processing positions based on the laser head speed information and laser processing power information.

[0084] From the results of the second candidate movement position selection, the second candidate processing position corresponding to the maximum value of the processing efficiency evaluation index is selected as the next optimal processing position. This is the same logic as the initial selection of the current optimal processing position. The processing efficiency evaluation index is calculated for each candidate processing position in the second candidate movement position selection results using a preset efficiency evaluation index function, and the position with the largest index value is selected as the next highest priority processing position.

[0085] The next optimal processing position is selected as the current optimal processing position, and the process returns to step A1. This iterative process continues until all processing positions have been selected, meaning all processing positions have been assigned a definite processing order. Through this iterative approach, a complete processing path can be gradually constructed, and the optimal processing position sorting information starting from the processing start position can be obtained.

[0086] By iteratively executing the steps of filtering movement positions and selecting the optimal processing position, it is ensured that each step in planning the optimal processing path is based on the currently determined optimal processing position, while also considering the processing efficiency of all remaining positions to be processed. By eliminating selected processing positions in each iteration, duplication and redundancy in path planning are avoided. Simultaneously, by continuously filtering candidate positions that meet the safe movement time threshold and selecting the next position with the highest processing efficiency, the entire processing path maximizes processing efficiency while ensuring safety. This point-by-point determination method can effectively construct a globally optimal or near-optimal processing sequence.

[0087] Specifically, during execution, the planning module 6, after obtaining the processing sequence of all positions to be processed, connects these ordered processing positions together with the laser head position information to form a complete processing path that the laser head can follow. This path not only considers processing efficiency but also takes into account the movement characteristics of the laser head, and can also prevent excessive local heat accumulation during processing, ensuring the smoothness and efficiency of the processing.

[0088] As can be seen from the above, this ceramic plate laser processing path planning device acquires the processing position information of each processing location in the ceramic plate to be processed, as well as the laser head position information, laser head movement speed information, and laser processing power information. Based on the processing position information and laser head position information, it determines the processing start position from among the processing locations with the smallest distance from the laser head. Based on the processing position information, processing start position, laser head movement speed information, and laser processing power information, it performs movement position filtering to obtain the first candidate movement position filtering result information for the processing start position. Based on the distance information between the processing start position and each first candidate processing location in the first candidate movement position filtering result information, it evaluates the processing efficiency to obtain the processing efficiency of each first candidate processing location in the first candidate movement position filtering result information. The efficiency evaluation index selects the first candidate processing position corresponding to the maximum value from the processing efficiency evaluation index as the current optimal processing position. Based on the processing start position and the current optimal processing position, the optimal processing sequence is planned to obtain the optimal processing path of the ceramic plate to be processed. Thus, by using the processing position information, processing start position, laser head movement speed information, and laser processing power information, the optimal processing position is selected and the optimal processing sequence is planned to obtain the optimal processing path of the ceramic plate to be processed. This solves the problems of prominent thermal defects, difficulty in balancing processing efficiency and quality, and high risk of heat accumulation due to insufficient consideration of the dynamic heat dissipation characteristics of the material in the path planning of existing ceramic plate laser processing methods. It can dynamically evaluate the heat dissipation conditions between processing positions, avoid excessive heat accumulation, and improve the laser processing efficiency of ceramic plates.

[0089] Please refer to Figure 3 , Figure 3This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device includes a processor 301 and a memory 302. The processor 301 and the memory 302 are interconnected and communicate with each other via a communication bus 303 and / or other forms of connection mechanisms (not shown). The memory 302 stores a computer program executable by the processor 301. When the electronic device is running, the processor 301 executes the computer program to perform the ceramic plate laser processing path planning method in any optional implementation of the above embodiments, to achieve the following functions: obtaining the processing position information of each processing position in the ceramic plate to be processed, and obtaining the laser head position information, laser head movement speed information, and laser processing power information of the laser head; based on the processing position information and the laser head position information, calculating the processing path planning method from each processing position in the ceramic plate to be processed. In the processing position, the position with the smallest distance from the laser head is determined as the processing start position. Based on the processing position information, processing start position, laser head movement speed information, and laser processing power information, the movement position is filtered to obtain the first candidate movement position filtering result information of the processing start position. Based on the distance information between the processing start position and each first candidate processing position in the first candidate movement position filtering result information, the processing efficiency is evaluated to obtain the processing efficiency evaluation index of each first candidate processing position in the first candidate movement position filtering result information. From the processing efficiency evaluation index, the first candidate processing position corresponding to the maximum value is selected as the current optimal processing position. Based on the processing start position and the current optimal processing position, the optimal processing sequence is planned to obtain the optimal processing path of the ceramic plate to be processed.

[0090] This application provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it executes the ceramic plate laser processing path planning method in any optional implementation of the above embodiments to achieve the following functions: obtaining the processing position information of each processing position in the ceramic plate to be processed, and obtaining the laser head position information, laser head movement speed information, and laser processing power information of the laser head; based on the processing position information and the laser head position information, determining the processing starting position from each processing position with the smallest distance from the laser head as the processing starting position; and based on the processing position information, the processing starting position, and the laser head movement speed information... Based on the information and laser processing power, the moving position is filtered to obtain the first candidate moving position filtering result information of the processing start position. Based on the distance information between the processing start position and each first candidate to be processed position in the first candidate moving position filtering result information, the processing efficiency is evaluated to obtain the processing efficiency evaluation index of each first candidate to be processed position in the first candidate moving position filtering result information. From the processing efficiency evaluation index, the first candidate to be processed position corresponding to the maximum value is selected as the current optimal processing position. Based on the processing start position and the current optimal processing position, the optimal processing sequence is planned to obtain the optimal processing path of the ceramic plate to be processed. The storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read Only Memory (EPROM), Programmable Red-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0091] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0092] Furthermore, the units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0093] Furthermore, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0094] In this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations.

[0095] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A method for laser processing path planning of ceramic plates, characterized in that, include: The processing position information of each position in the ceramic plate to be processed is obtained, as well as the laser head position information, laser head movement speed information and laser processing power information of the laser head; Based on the processing position information and the laser head position information, the processing start position is determined from the processing positions that are closest to the laser head. Based on the information of the position to be processed, the processing start position, the laser head movement speed information, and the laser processing power information, the movement position is filtered to obtain the first candidate movement position filtering result information of the processing start position; Based on the distance information between the processing start position and each first candidate processing position in the first candidate movement position screening result information, the processing efficiency is evaluated to obtain the processing efficiency evaluation index of each first candidate processing position in the first candidate movement position screening result information. From the processing efficiency evaluation indicators, the first candidate position to be processed corresponding to the maximum value is selected as the current optimal processing position; Based on the processing start position and the current optimal processing position, the optimal processing sequence is planned to obtain the optimal processing path for the ceramic plate to be processed.

2. The method for planning the laser processing path of ceramic plates according to claim 1, characterized in that, Based on the information of the position to be processed, the processing start position, the laser head movement speed information, and the laser processing power information, a movement position is filtered to obtain the first candidate movement position filtering result information of the processing start position, including: Determine the safe movement time threshold corresponding to the laser processing power information; Based on the processing position information, the processing start position, and the laser head movement speed information, the movement time is calculated to obtain the first movement time for the laser head to move from the processing start position to other processing positions; From the first movement time, a second movement time that is greater than the safe movement time threshold is selected to obtain the first candidate movement position selection result information of the processing start position.

3. The method for planning the laser processing path of ceramic plates according to claim 2, characterized in that, Determining the safe movement time threshold corresponding to the laser processing power information includes: Obtain the preset safe processing temperature threshold; Based on the laser processing power information and the preset peak temperature ratio coefficient, the processing peak temperature of the laser head at the current position is determined. Based on the peak processing temperature and the preset safe processing temperature threshold, the safe movement time threshold corresponding to the laser processing power information is calculated using the preset safe movement time calculation formula.

4. The method for planning the laser processing path of ceramic plates according to claim 2, characterized in that, Based on the information of the position to be processed, the processing start position, and the laser head movement speed information, a movement time calculation is performed to obtain the first movement time of the laser head from the processing start position to other positions to be processed, including: Based on the processing position information and the processing start position, distance calculation is performed to obtain the distance information between the processing start position and other processing positions; Based on the distance information and the laser head speed information, the movement time is calculated to obtain the first movement time of the laser head from the processing start position to other processing positions.

5. The method for planning the laser processing path of ceramic plates according to claim 2, characterized in that, From the first movement time, a second movement time greater than the safe movement time threshold is selected to obtain the first candidate movement position selection result information of the processing start position, including: From the first movement time, select a second movement time that is greater than the safe movement time threshold; The processing position point corresponding to the second movement time is determined as a candidate movement position, and the first candidate movement position screening result information of the processing start position is obtained.

6. The method for planning the laser processing path of ceramic plates according to claim 1, characterized in that, Based on the processing start position and the current optimal processing position, an optimal processing sequence is planned to obtain the optimal processing path for the ceramic plate to be processed, including: Based on the remaining unprocessed positions in each of the aforementioned unprocessed positions, the movement position filtering and optimal processing position selection are repeatedly performed to obtain the optimal processing position sorting information starting from the processing start position; Based on the optimal processing position sorting information and the laser head position information, the optimal processing path for the ceramic plate to be processed is determined.

7. The method for planning the laser processing path of ceramic plates according to claim 6, characterized in that, Based on the remaining unprocessed positions in each of the aforementioned unprocessed positions, the movement position filtering and optimal processing position selection are repeatedly performed to obtain optimal processing position sorting information starting from the processing start position, including: Step A1: Remove the processing start position and the current optimal processing position from each of the positions to be processed to obtain the remaining positions to be processed; Step A2: Based on the current optimal processing position, filter the remaining processing positions to obtain the second candidate movement position filtering result information; Step A3: From the second candidate movement position screening results, select the second candidate processing position corresponding to the maximum value of the processing efficiency evaluation index as the next optimal processing position; Step A4: Take the next optimal processing position as the current optimal processing position, return to step A1, and continue until all the processing positions have been selected to obtain the optimal processing position sorting information starting from the processing start position.

8. A path planning device for laser processing of ceramic plates, characterized in that, include: The acquisition module is used to acquire the processing position information of each processing position in the ceramic plate to be processed, as well as the laser head position information, laser head movement speed information and laser processing power information of the laser head; The determination module is used to determine the processing start position as the position that is closest to the laser head from the processing positions based on the processing position information and the laser head position information; The filtering module is used to filter the movement position based on the processing position information, the processing start position, the laser head movement speed information and the laser processing power information, and obtain the first candidate movement position filtering result information of the processing start position; The evaluation module is used to evaluate the processing efficiency based on the distance information between the processing start position and each first candidate processing position in the first candidate movement position screening result information, and to obtain the processing efficiency evaluation index of each first candidate processing position in the first candidate movement position screening result information. The selection module is used to select the first candidate processing position corresponding to the maximum value from the processing efficiency evaluation index as the current optimal processing position; The planning module is used to plan the optimal processing sequence based on the processing start position and the current optimal processing position, so as to obtain the optimal processing path for the ceramic plate to be processed.

9. An electronic device, characterized in that, It includes a processor and a memory, the memory storing a computer program executable by the processor, and when the processor executes the computer program, it performs the steps in the ceramic plate laser processing path planning method as described in any one of claims 1-7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it performs the steps in the ceramic plate laser processing path planning method as described in any one of claims 1-7.

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