A glass through-hole interconnection method and device based on equal-material integrated manufacturing of additive and subtractive manufacturing

Abstract

The application discloses a glass through-hole interconnection method and device based on equal-material additive and subtractive integrated fusion manufacturing, wherein the method comprises the following steps: constructing a relationship model of manufacturing process parameters, through-hole structure and electromagnetic performance; initializing each process parameter based on the model; sequentially performing pulse and continuous composite laser subtractive hole making, seed layer-free electronic 3D printing additive metal filling and ultrafast laser equal-material welding interface strengthening; in the process, tomography, ultrasonic microscopy and impedance analysis are used to obtain actual parameters, and multi-level deviations from the model predicted values are calculated; when the deviation is greater than or equal to a preset threshold, the system performs real-time feedforward and feedback adjustment based on the model for the current or subsequent process across links. The application completely eliminates the pollution type wet etching and the electroplating process prone to defects, solves the pain points such as low hole making efficiency, non-compact filling of large depth-diameter ratio and weak interface bonding force in one station, and realizes precise closed-loop control of the electromagnetic performance of the product.

Description

Technical Field

[0001] This invention relates to the fields of electronic manufacturing and microelectronic packaging, and specifically to a glass through-hole interconnection method and apparatus based on integrated additive and subtractive manufacturing of equal materials. Background Technology

[0002] The statements in this section are provided only as background information in connection with this disclosure and may not constitute prior art.

[0003] In the fields of advanced electronic manufacturing and microelectronic packaging, with the rapid evolution of AI chips, 5G / 6G RF modules, high-performance computing chips, and 2.5D / 3D integration technologies, device packaging is developing towards higher density, higher reliability, miniaturization, and lower loss. Against this backdrop, through-glass vias (TGVs), with their superior insulation properties, low dielectric loss, excellent thermal stability, and miniaturization capabilities of glass substrates, are gradually replacing traditional through-silicon via (TSV) technology, becoming a core technology for achieving three-dimensional vertical electrical connections.

[0004] However, the core manufacturing processes of current glass through-hole interconnect technology (hole fabrication, metallization, and interface strengthening) mostly employ independent, open, traditional processes, which face three major technological bottlenecks in actual industrialization: In the hole-making process, the commonly used method of modifying Bessel lasers followed by wet etching (such as HF or KOH solution) not only takes several hours but also poses a serious risk of environmental pollution. In the metallization filling process, relying on the pre-made seed layer and electroplating process, this method is prone to defects such as voids and gaps when dealing with through holes with large aspect ratios due to the poor fluidity of the electroplating solution, resulting in non-dense filling. Metals and glass have vastly different coefficients of thermal expansion and physical properties. Traditional methods mainly rely on limited mechanical interlocking, resulting in weak interfacial bonding. Under the action of thermal and mechanical stress, structural failure is easily caused.

[0005] Furthermore, the existing processing steps are isolated from each other, lacking data exchange and overall process closed loop, resulting in poor consistency of the electromagnetic performance of the final product, which seriously restricts the large-scale, high-reliability application of glass through-hole technology. Summary of the Invention

[0006] The purpose of this invention is to address the pain points in current glass through-hole interconnect manufacturing, such as low hole-making efficiency and high pollution, easy occurrence of hole defects in high aspect ratio filling, weak metal-glass interface bonding, and poor consistency of product electromagnetic performance caused by isolated manufacturing processes. This invention provides a glass through-hole interconnect method and device based on integrated additive and subtractive manufacturing of equal materials. It utilizes three innovative processes: composite laser subtractive hole-making, electronic 3D printing additive metallization, and ultrafast laser equal-material welding. Furthermore, it introduces a process parameter-structural characteristic-electromagnetic performance relationship model for cross-process feedback and real-time feedforward closed-loop collaborative adjustment, achieving efficient and defect-free manufacturing without wet corrosion or electroplating. This significantly enhances interface bonding strength and ensures precise control and high consistency of the electromagnetic performance of the glass through-holes.

[0007] The technical solution of the present invention is as follows: A method for interconnecting glass vias based on integrated additive and subtractive manufacturing with equal materials, comprising: Step S1: Construct a relationship model of process parameters, structural characteristics, and electromagnetic performance. The relationship model is used to associate the process parameters of composite laser subtractive hole making, electronic 3D printing additive metallization, and ultrafast laser welding with the structural characteristic parameters and electromagnetic performance parameters of glass through holes. Step S2: Based on the electrical performance requirements of the glass through-hole, and based on the relationship model, initialize the laser power and scanning speed of composite laser subtractive hole making, the printing gas pressure and printing layer thickness of electronic 3D printing additive metallization, and the spot diameter and welding power of ultrafast laser welding. Step S3: According to the initial process parameters, use a combination of pulsed laser and continuous laser to perform composite laser subtractive drilling on the glass substrate; Step S4: The processed glass through hole is subjected to online structural inspection using optical coherence tomography (OCT) technology to obtain the actual structural parameters of the glass through hole, including hole diameter, hole wall roughness, hole depth and perpendicularity. Step S5: Calculate the first deviation between the actual structural parameters and the predicted structural characteristics output by the relational model. If the first deviation is greater than or equal to the preset first deviation threshold, adjust the initial composite laser subtractive drilling process parameters based on the first deviation feedback, and adjust the electronic 3D printing additive metallization process parameters in real time based on the relational model. Complete the electronic 3D printing additive metallization in the glass through hole based on the adjusted electronic 3D printing additive metallization process parameters. Step S6: Use ultrasonic microscopy to test the filling quality of the glass through-holes after additive metallization, and obtain the actual filling quality parameters, including filling density and porosity. Step S7: Calculate the second deviation between the actual infill quality parameter and the infill quality prediction value output by the relational model. If the second deviation is greater than or equal to the preset second deviation threshold, adjust the initialized electronic 3D printing additive metallization process parameters based on the second deviation feedback, and adjust the ultrafast laser equal material welding process parameters in real time based on the relational model. Complete the ultrafast laser equal material welding of the glass through hole based on the adjusted ultrafast laser equal material welding process parameters. Step S8: The electrical performance of the glass through-hole after ultrafast laser welding is tested using a four-probe method and an impedance analyzer to obtain the actual electromagnetic performance parameters, including on-resistance and insertion loss. Step S9: Input the actual structural parameters and the actual electromagnetic performance parameters into the relational model and compare them with the predicted values ​​output by the relational model. If the comparison deviation is greater than or equal to the preset third deviation threshold, iteratively optimize the process parameters of composite laser subtractive hole making, electronic 3D printing additive metallization and ultrafast laser welding until the comparison deviation is less than the third deviation threshold.

[0008] Furthermore, in step S1, the training method for the relational model is as follows: The historical sample data is used as the training set. The historical sample data uses the process parameters of composite laser subtractive hole making, electronic 3D printing additive metallization and ultrafast laser welding as the model input layer, and the structural characteristic parameters of glass through holes obtained by actual measurement as the model intermediate layer, and the electromagnetic performance parameters obtained by actual measurement as the model output layer. The model is trained using a backpropagation neural network algorithm or a random forest algorithm until the coefficient of determination of the fit of the relation model is greater than or equal to 0.95.

[0009] Furthermore, in step S2, the range of the initialized process parameters is specifically as follows: The pulsed laser is a femtosecond laser or a picosecond laser, and the laser power of the pulsed laser is 10W to 50W, and the scanning speed is 100mm / s to 500mm / s; The laser power of the continuous laser is 5W to 20W, and the scanning speed is 50mm / s to 200mm / s; The printing air pressure is 0.1 MPa to 1 MPa, and the printing layer thickness is 0.1 μm to 10 μm; The diameter of the light spot is 5μm to 50μm, and the welding power is 5W to 50W.

[0010] Further, in step S5, the strategy for adjusting the initialized composite laser subtractive drilling process parameters based on the first deviation feedback is as follows: If the first deviation of the aperture is greater than or equal to 5%, then the scanning speed of the pulsed laser is adjusted; If the first deviation of the hole wall roughness is greater than or equal to 5%, then the laser power of the pulsed laser is adjusted.

[0011] Furthermore, in step S5, the electronic 3D printing additive metallization adopts piezoelectric inkjet printing technology, aerosol printing technology, or direct-write printing technology. The material used in the electronic 3D printing additive metallization is conductive silver paste or conductive copper paste, the solid content of which is 60% to 80% and the viscosity is 1000 mPa·s to 10000 mPa·s.

[0012] Furthermore, in step S6, the actual filling quality parameter also includes the adhesion between the conductive material and the hole wall; In step S7, the standard for the predicted filling quality output by the relational model is: filling density greater than or equal to 99%, porosity less than or equal to 1%, and the adhesion between conductive material and pore wall greater than or equal to 95%. The strategy for adjusting the initialized electronic 3D printing additive metallization process parameters based on the second deviation feedback is as follows: if the second deviation of the filling density is greater than or equal to the second deviation threshold, the printing air pressure is adjusted; if the second deviation of the fit is greater than or equal to the second deviation threshold, the printing layer thickness is adjusted.

[0013] Furthermore, in step S8, the testing accuracy of the four-probe method is less than or equal to 1 mΩ; The impedance analyzer has a test frequency range of 100kHz to 10GHz and is used to test insulation resistance in the range of 106Ω to 1012Ω.

[0014] Furthermore, in step S9, the strategy for iteratively optimizing the process parameters of composite laser subtractive drilling, electronic 3D printing additive metallization, and ultrafast laser welding is as follows: The influence weights of each process parameter on the actual electromagnetic performance parameters are determined through sensitivity analysis of the relationship model. Based on the determined impact weights, the process parameters of the corresponding manufacturing process with the largest impact weight are adjusted first, and the weight ranking is as follows: electronic 3D printing additive metallization is greater than composite laser subtractive drilling, and composite laser subtractive drilling is greater than ultrafast laser welding.

[0015] This invention also proposes a glass through-hole interconnect device based on integrated additive and subtractive manufacturing of equal materials, used to realize the above-mentioned glass through-hole interconnect method based on integrated additive and subtractive manufacturing of equal materials, comprising: The subtractive manufacturing unit includes a composite laser processing station and an online detection device for through-hole structure. The composite laser processing station is used to directly form glass through-holes on a glass substrate by composite ablation of pulsed laser and continuous laser. The online detection device for through-hole structure is disposed on the rear side of the composite laser processing station and is used to obtain the hole diameter, hole wall roughness, hole depth and perpendicularity of the glass through-hole online. The additive manufacturing unit includes an electronic 3D printing processing station and an online detection device for filling quality. The electronic 3D printing processing station is used to fill and solidify conductive material into the glass through-holes without a seed layer to complete metallization. The online detection device for filling quality is located behind the electronic 3D printing processing station and is used to obtain the filling density and porosity of the glass through-holes after metallization online. The material manufacturing unit includes an ultrafast laser interface strengthening processing station and an interconnect performance testing device. The ultrafast laser interface strengthening processing station is used to perform laser welding strengthening on the metal-glass interface of the metallized glass via. The interconnect performance testing device is configured on the rear side of the ultrafast laser interface strengthening processing station and is used to obtain the on-resistance and insertion loss of the strengthened glass via online. A central control and transmission system includes a transmission platform and a central controller. The transmission platform is used to transmit the glass substrate between the subtractive manufacturing unit, the additive manufacturing unit, and the equal-material manufacturing unit. The central controller has a built-in process parameter-structural characteristic-electromagnetic performance relationship model and is communicatively connected to the online detection device for through-hole structure, the online detection device for through-hole quality, and the interconnect performance testing device. It is configured to execute the steps of the method as described in any one of claims 1 to 8 according to the acquired parameters to achieve coordinated adjustment of the process parameters of each unit.

[0016] Furthermore, the electronic 3D printing processing station integrates a thermosetting device, which is used to heat and sinter the conductive material filled into the glass through-hole; The transmission platform includes a marble platform, a guide rail, and an XY precision displacement stage mounted on the guide rail. The glass substrate is fixed on the XY precision displacement stage. The central controller is electrically connected to the XY precision displacement stage and is used to control the movement of the XY precision displacement stage between manufacturing units.

[0017] Compared with existing technologies, the advantages of this invention are: 1. Green and efficient innovation in hole-making process: The subtractive hole-making method adopts a coaxial composite of pulsed laser and continuous laser. It utilizes the synergistic effect of pulsed laser modification and continuous laser ablation to directly vaporize and remove glass material, completely eliminating the time-consuming and environmentally polluting hydrofluoric acid / potassium hydroxide wet etching process, and greatly improving hole-making efficiency and environmental friendliness.

[0018] 2. Overcoming the challenge of high aspect ratio defect-free filling: By adopting electronic 3D printing additive metallization technology, the conductive paste is directly filled from the bottom up using its own structural viscosity, eliminating the cumbersome magnetron sputtering seed layer and electroplating process. This eliminates voids and gaps caused by poor fluidity of the electroplating solution from a physical mechanism perspective, achieving extremely dense filling of high aspect ratio through holes.

[0019] 3. Achieving a leap forward in interfacial bonding strength: A pioneering ultrafast laser-based equal-material welding process uses three-dimensional spiral scanning to induce micro-regional melting at the metal-glass interface within the through-hole, generating an in-situ compositional gradient transition layer. This breaks through the limitations of traditional metal-glass bonding relying solely on weak mechanical interlocking, increasing interfacial shear strength by nearly nine times and fundamentally eliminating potential failures caused by thermal and mechanical stresses.

[0020] 4. Cross-process intelligent closed-loop ensures optimal yield: This invention constructs a full-process "process parameter-structural characteristic-electromagnetic performance relationship model," and through layer-by-layer interconnected first, second, and third deviations and corresponding thresholds, achieves global linkage between independent processes through "feedforward guidance + real-time detection + feedback correction." This fundamental transformation from "experience silos" to "data model-driven" enables precise convergence and 100% controllability of the final product's impedance and other electromagnetic properties. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments recorded in the embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0022] Figure 1 This is a flowchart of a glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal materials; Figure 2 This is a schematic diagram of a glass through-hole interconnect device based on integrated additive and subtractive manufacturing of equal materials.

[0023] Reference numerals: 1-Composite laser processing station; 2-Online detection device for through-hole structure; 3-Electronic 3D printing processing station; 4-Online detection device for hole filling quality; 5-Ultrafast laser interface strengthening processing station; 6-Interconnection performance testing device; 7-Laser; 8-Host computer; 9-Guide rail; 10-Marble platform; 11-XY precision displacement stage; 12-Sample to be processed. Detailed Implementation

[0024] It should be noted that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0025] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0026] Example 1 First, it should be noted that in order to meet the stringent requirements of high-density, high-reliability advanced packaging (such as AI chips, 5G / 6G RF modules, 2.5D / 3D integration, etc.) for glass through-hole interconnect technology, this embodiment provides a brand-new manufacturing paradigm.

[0027] This embodiment provides a glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal-material materials. This method transforms "experience-driven" into "data and model-driven" approaches, providing a one-stop solution to three major industry pain points in traditional technologies: low hole-making efficiency, incomplete filling at large aspect ratios, and weak bonding between the metal and glass interfaces. Its key features include the following steps: Step S1: Construct a relationship model of process parameters, structural characteristics, and electromagnetic performance. The relationship model is used to associate the process parameters of composite laser subtractive hole making, electronic 3D printing additive metallization, and ultrafast laser welding with the structural characteristic parameters and electromagnetic performance parameters of glass through holes.

[0028] To achieve accurate prediction and control, in this embodiment, the training method for the relational model is specifically as follows: Design a full factorial experiment to systematically change the key process parameters of the above three processing steps, and prepare multiple sets (e.g., 400 sets) of historical glass through-hole samples according to different parameter combinations; The historical sample data is used as the training set. The historical sample data uses the process parameters of composite laser subtractive hole making, electronic 3D printing additive metallization and ultrafast laser welding as the model input layer, the structural characteristic parameters of glass through holes obtained by actual measurement (such as cross-sectional morphology parameters characterized by electron microscopy) as the model intermediate layer, and the electromagnetic performance parameters obtained by actual measurement (such as characteristic impedance at 20 GHz) as the model output layer. The model is trained using a backpropagation neural network algorithm or a random forest algorithm until the coefficient of determination (R²) of the relationship model is greater than or equal to 0.95, thus obtaining a high-precision prediction model.

[0029] Step S2: Based on the electrical performance requirements of the glass through-hole and the aforementioned relationship model, initialize the laser power and scanning speed for composite laser subtractive hole fabrication, the printing gas pressure and printing layer thickness for electronic 3D printing additive metallization, and the spot diameter and welding power for ultrafast laser welding.

[0030] As a preferred implementation parameter range, the range of the initialization process parameters is specifically as follows: The pulsed laser is a femtosecond laser or a picosecond laser, and the laser power of the pulsed laser is 10W to 50W, and the scanning speed is 100mm / s to 500mm / s; The laser power of the continuous laser is 5W to 20W, and the scanning speed is 50mm / s to 200mm / s; The printing air pressure is 0.1 MPa to 1 MPa, and the printing layer thickness is 0.1 μm to 10 μm; The diameter of the light spot is 5μm to 50μm, and the welding power is 5W to 50W.

[0031] In a specific processing example, a 4-inch, 500μm thick quartz glass substrate is taken, fixed on a precision displacement stage, and a glass through-hole with a diameter of 50μm is to be processed, and a specific characteristic impedance target value (such as 50Ω) is set.

[0032] Step S3: According to the initial process parameters, use a combination of pulsed laser and continuous laser to perform composite laser subtractive drilling on the glass substrate.

[0033] In this embodiment, it should be noted that this step breaks through the traditional Bessel laser modification hole-making method, which relies on wet etching with hydrofluoric acid (HF) or potassium hydroxide (KOH) for several hours. Specifically, a picosecond laser (e.g., wavelength 355nm, pulse width 10ps, average power 15W) and a continuous fiber laser (e.g., wavelength 1080nm, power 25W) are coaxially combined and focused onto the glass surface. During this process, the picosecond laser is responsible for nonlinear absorption and modification of the glass material. The absorption characteristics of the modified area change abruptly, thus strongly absorbing the energy of the continuous laser. The combined effect of the two lasers causes the glass material to undergo instantaneous pyrolysis and vaporization, directly ablating out a through-hole, completely eliminating the time-consuming and environmentally polluting wet etching process.

[0034] Step S4: The processed glass through hole is subjected to online structural inspection using optical coherence tomography (OCT) technology to obtain the actual structural parameters of the glass through hole, including hole diameter, hole wall roughness, hole depth, and perpendicularity.

[0035] Step S5: Calculate the first deviation between the actual structural parameters and the predicted structural characteristics output by the relational model. If the first deviation is greater than or equal to a preset first deviation threshold, adjust the initial composite laser subtractive drilling process parameters based on the first deviation feedback, and adjust the electronic 3D printing additive metallization process parameters in real time based on the relational model. Complete the electronic 3D printing additive metallization in the glass through-hole based on the adjusted electronic 3D printing additive metallization process parameters.

[0036] In this step, the strategy for adjusting the initialized composite laser subtractive drilling process parameters based on the first deviation feedback is as follows: if the first deviation of the aperture is greater than or equal to 5%, the scanning speed of the pulsed laser is adjusted; if the first deviation of the hole wall roughness is greater than or equal to 5%, the laser power of the pulsed laser is adjusted.

[0037] When performing electronic 3D printing additive metallization, piezoelectric inkjet printing technology, aerosol printing technology, or direct writing printing technology are used; the materials used are conductive silver paste or conductive copper paste, the solid content of the materials is 60% to 80%, and the viscosity is 1000 mPa·s to 10000 mPa·s.

[0038] In this embodiment, the glass substrate with the holes formed is transferred to the 3D printing station. Based on the location information of the through-holes, the print head employs a bottom-up filling strategy to precisely inject the aforementioned high-viscosity conductive slurry into the through-holes. Due to the extremely strong adhesion between the slurry and the glass sidewalls, and its own structural viscosity, it can perfectly fill the high aspect ratio through-hole space without the need for additional negative pressure assistance, and without causing flow, collapse, or breakage. After filling, it is heated and cured in an inert atmosphere sintering furnace (e.g., held at 160°C for 1 hour) to fully sinter the metal nanoparticles into dense conductive pillars. This mechanism completely replaces the cumbersome traditional process of "magnetron sputtering to create a seed layer + electroplating filling," fundamentally eliminating defects such as voids and gaps caused by poor electroplating solution fluidity.

[0039] In this embodiment, taking a specific continuous production run as an example, when the optical coherence tomography (OCT) in step S4 detects a first deviation of +6% (greater than the set 5% threshold) between the actual structural parameters of the current glass via diameter and the target predicted value, it indicates that the current via diameter is too large due to local material fluctuations. At this time, the central control system quickly makes a two-step coordinated response based on model calculations: Step 1 (Feedback): Send a command to the composite laser processing station to increase the scanning speed of the pulsed laser from the current 300mm / s to 320mm / s by 20mm / s, and correct the aperture of the subsequent substrate by shortening the laser single-point action time; The second step (real-time intervention): The system model predicts that if the original parameters are used during the subsequent metallization of the "oversized" through-holes already processed, the filling amount will be insufficient (porosity will exceed the standard). Therefore, the system immediately issues a real-time adjustment command to the electronic 3D printing processing station, dynamically increasing the corresponding printing air pressure from the initial 0.5MPa to 0.55MPa for these oversized through-holes, in order to increase the volume of conductive paste sprayed in a single stroke.

[0040] Ultimately, through the aforementioned cross-process "feedback + real-time feedforward" collaborative fine-tuning, the through-holes in this batch, which originally exhibited deviations in a single process, still maintained perfect electrical performance, such as insertion loss, within the target yield range during the S8 test. This completely broke the traditional deadlock of "each process isolated and helpless," achieving true intelligent flexible manufacturing.

[0041] Step S6: Use ultrasonic microscopy to test the filling quality of the glass through-hole after additive metallization, and obtain the actual filling quality parameters, including filling density, porosity, and the adhesion between the conductive material and the hole wall.

[0042] Step S7: Calculate the second deviation between the actual infill quality parameter and the predicted infill quality value output by the relational model. If the second deviation is greater than or equal to the preset second deviation threshold, adjust the initialized electronic 3D printing additive metallization process parameters based on the second deviation feedback, and adjust the ultrafast laser equal material welding process parameters in real time based on the relational model. Perform ultrafast laser equal material welding on the glass through hole based on the adjusted ultrafast laser equal material welding process parameters.

[0043] In this step, the standard for the predicted fill quality value output by the relational model is: The filling density is greater than or equal to 99%, the porosity is less than or equal to 1%, and the adhesion between the conductive material and the pore wall is greater than or equal to 95%. The feedback adjustment strategy is as follows: If the second deviation of the filling density is greater than or equal to the second deviation threshold, the printing air pressure is adjusted; if the second deviation of the fit is greater than or equal to the second deviation threshold, the printing layer thickness is adjusted.

[0044] In this embodiment, further addressing the problem that traditional metals (such as copper) and glass have vastly different coefficients of thermal expansion and physical properties, leading to weak interfacial bonding and susceptibility to thermal stress failure when mechanically joined alone, this step introduces equal-material welding strengthening. The specific operation is as follows: The substrate was moved to an ultrafast laser interface strengthening processing station. A femtosecond laser (e.g., wavelength 1030 nm, pulse width 400 fs, repetition rate 100 kHz) was used. By controlling the linkage between the beam mirror and the Z-axis displacement stage, the laser focus was scanned from top to bottom along a three-dimensional helical trajectory with a specific pitch (e.g., 5 μm) inside the through-holes filled with conductive pillars. A specific single-pulse energy (e.g., 12 μJ) was set so that the laser energy was selectively absorbed by the metal surface and the glass interface region, achieving instantaneous melting of the micro-area. After rapid cooling, a compositional gradient transition layer of approximately 1-2 μm thick was generated in situ at the metal-glass interface. Testing showed that the average shear strength of the treated interface could reach up to 75 MPa, more than 9 times that of the untreated sample (approximately 8 MPa).

[0045] Step S8: The electrical performance of the glass through-hole after ultrafast laser welding is tested using a four-probe method and an impedance analyzer to obtain the actual electromagnetic performance parameters, including on-resistance and insertion loss.

[0046] The four-probe method has a testing accuracy of less than or equal to 1 mΩ; the impedance analyzer has a testing frequency range of 100 kHz to 10 GHz, and is used to test insulation resistance in a range of 10 GHz. 6 Ω to 10 12 Ω.

[0047] Step S9: Input the actual structural parameters and the actual electromagnetic performance parameters into the relational model and compare them with the predicted values ​​output by the relational model. If the comparison deviation is greater than or equal to the preset third deviation threshold, iteratively optimize the process parameters of composite laser subtractive hole making, electronic 3D printing additive metallization and ultrafast laser welding until the comparison deviation is less than the third deviation threshold.

[0048] In this step, the strategy for iteratively optimizing process parameters is as follows: the influence weight of each process parameter on the actual electromagnetic performance parameter is determined through sensitivity analysis of the relationship model; based on the determined influence weight, the process parameters of the corresponding manufacturing process with the largest influence weight are adjusted first, and the weight ranking is: electronic 3D printing additive metallization is greater than composite laser subtractive drilling, and composite laser subtractive drilling is greater than ultrafast laser welding.

[0049] In this embodiment, it should be noted that when sampling glass vias on a mass production line, if the actual characteristic impedance value is quickly measured to be 48Ω (target value 50Ω), the comparison deviation exceeds the threshold. The control system calls a pre-trained random forest model to perform inverse optimization, outputs a global optimization scheme, and automatically issues instructions: fine-tuning the power of the preceding picosecond laser from 15W to 14.7W, and simultaneously increasing the sintering temperature of the subsequent 3D printing from 150℃ to 160℃. The system continuously monitors the impedance value of subsequent products until it stably converges within the target range of 50Ω. This forms an intelligent closed loop of "model pre-guidance - process implementation - detection feedback - model iteration," truly achieving precise and controllable performance of high-performance glass vias.

[0050] Example 2 To realize the glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal materials described in Embodiment 1, this embodiment provides a glass through-hole interconnection device based on integrated additive and subtractive manufacturing of equal materials that perfectly maps to it. This device is not a simple patchwork of isolated devices, but an intelligent closed-loop manufacturing platform with full-chain capabilities of "perception-decision-execution" under a unified hardware underlying and data flow architecture.

[0051] Combined with appendix Figure 2 As shown, the integrated glass through-hole interconnect device specifically includes: a central control and transmission system, a subtractive manufacturing unit, an additive manufacturing unit, and an equal-material manufacturing unit. Each unit is sequentially arranged on the same physical platform along the workpiece flow direction.

[0052] 1. Central control and transmission system (system base and brain) This system is responsible for the overall material flow and process coordination control, including the transmission platform and the host computer 8 (i.e., the central controller) which acts as the "brain".

[0053] To ensure the extreme structural rigidity and shock resistance required for micron-level processing, a marble platform 10 is used as the physical base for the transfer platform. High-precision guide rails 9 and XY precision displacement stages 11 mounted on the guide rails 9 are installed on the marble platform 10. The sample 12 to be processed (i.e., the glass substrate) is fixed to the XY precision displacement stage 11 by vacuum adsorption or other methods. The host computer 8 is electrically connected to the drive motor of the XY precision displacement stage 11, used to precisely control the XY precision displacement stage 11 to carry the sample 12 between various processing and inspection stations.

[0054] The host computer 8 is equipped with the "process parameter-structural characteristic-electromagnetic performance relationship model" described in Example 1, and establishes communication connections with all the processing stations and testing devices described below through an industrial-grade data bus.

[0055] 2. Subtractive manufacturing unit (enabling laser drilling) Along the transmission direction of guide rail 9, the first station is a subtractive manufacturing unit, which includes a composite laser processing station 1 and an online inspection device for through-hole structures 2 configured on its rear side.

[0056] The composite laser processing station 1 receives pulsed and continuous lasers from the laser 7 integrated at the rear of the equipment via an optical path system, and focuses them onto the sample 12 to be processed to directly ablate and form glass through holes. Following this, an online detection device 2 for the through-hole structure (such as an OCT optical coherence tomography probe) scans the newly formed through-hole in real time, acquiring the hole diameter, hole wall roughness, hole depth, and perpendicularity online, and instantly uploading these "actual structural parameters" to the host computer 8 via a communication link.

[0057] 3. Additive manufacturing unit (achieving seedless metallization filling) Downstream of the subtractive manufacturing unit is the additive manufacturing unit, which includes an electronic 3D printing processing station 3 and an online inspection device for filling quality 4 located behind it.

[0058] The electronic 3D printing processing station 3 uses an inkjet or direct-write printhead to fill the glass through-holes with conductive paste. Notably, this processing station integrates a thermosetting device (such as a local infrared heating module or a micro furnace, not separately labeled in the figure, but set up in conjunction with the printing station) to perform in-situ heating and sintering of the conductive material filled into the glass through-holes. Subsequently, the online detection device 4 for filling quality (such as a SAM ultrasonic microscope probe) performs non-destructive testing on the metallized through-holes, obtaining the filling density and porosity, and feeding it back to the host computer 8.

[0059] 4. Material equalization manufacturing unit (to achieve interface strengthening and final quality inspection) Located at the end of the transmission line is the material manufacturing unit, which includes an ultrafast laser interface strengthening processing station 5 and an interconnect performance testing device 6.

[0060] The ultrafast laser interface strengthening processing station 5 can also utilize the femtosecond laser source provided by laser 7 to perform spiral scanning welding on the metal-glass interface within the through-hole using an internal three-dimensional galvanometer system, achieving interface fusion strengthening. Finally, the interconnect performance testing device 6 (integrating an online probe station and a high-frequency impedance analyzer) performs a pin test on the strengthened glass through-hole to obtain the final on-resistance and insertion loss parameters, which are then uploaded to the host computer 8.

[0061] In this embodiment, it should also be noted that in this device, the host computer 8 acquires data from three "sensing nodes"—the online detection device 2 for through-hole structure, the online detection device 4 for hole filling quality, and the interconnection performance testing device 6—and inputs this data into their built-in relational models for calculation. When the model's judgment shows a deviation, the host computer 8 can directly adjust the optical shutter or scanning galvanometer of the composite laser processing station 1, the air pressure controller of the electronic 3D printing processing station 3, and the power regulator of the ultrafast laser interface strengthening processing station 5 by issuing digital control commands. This "one brain (host computer), multiple hands (processing stations), and multiple eyes (detection stations)" hardware connection architecture physically supports the "feedforward and feedback coordinated adjustment" across processes in Embodiment 1, completely overcoming the shortcomings of existing discrete equipment that cannot achieve data interoperability and process coordination.

[0062] The embodiments described above merely illustrate specific implementation methods of this application, and while the descriptions are detailed and specific, they should not be construed as limiting the scope of protection of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the technical solution of this application, and these modifications and improvements all fall within the scope of protection of this application.

[0063] This background section is provided to generally present the context of the invention. The work of the currently named inventors, the work to the extent described in this background section, and aspects of this section that did not constitute prior art at the time of application are neither expressly nor impliedly acknowledged as prior art to the invention.

Claims

1. A method for interconnecting glass vias based on integrated additive and subtractive manufacturing with equal materials, characterized in that, include: Step S1: Construct a relationship model of process parameters, structural characteristics, and electromagnetic performance. The relationship model is used to associate the process parameters of composite laser subtractive hole making, electronic 3D printing additive metallization, and ultrafast laser welding with the structural characteristic parameters and electromagnetic performance parameters of glass through holes. Step S2: Based on the electrical performance requirements of the glass through-hole, and based on the relationship model, initialize the laser power and scanning speed of composite laser subtractive hole making, the printing gas pressure and printing layer thickness of electronic 3D printing additive metallization, and the spot diameter and welding power of ultrafast laser welding. Step S3: According to the initial process parameters, use a combination of pulsed laser and continuous laser to perform composite laser subtractive drilling on the glass substrate; Step S4: The processed glass through hole is subjected to online structural inspection using optical coherence tomography (OCT) technology to obtain the actual structural parameters of the glass through hole, including hole diameter, hole wall roughness, hole depth and perpendicularity. Step S5: Calculate the first deviation between the actual structural parameters and the predicted structural characteristics output by the relational model. If the first deviation is greater than or equal to the preset first deviation threshold, adjust the initial composite laser subtractive drilling process parameters based on the first deviation feedback, and adjust the electronic 3D printing additive metallization process parameters in real time based on the relational model. Complete the electronic 3D printing additive metallization in the glass through hole based on the adjusted electronic 3D printing additive metallization process parameters. Step S6: Use ultrasonic microscopy to test the filling quality of the glass through-holes after additive metallization, and obtain the actual filling quality parameters, including filling density and porosity. Step S7: Calculate the second deviation between the actual infill quality parameter and the infill quality prediction value output by the relational model. If the second deviation is greater than or equal to the preset second deviation threshold, adjust the initialized electronic 3D printing additive metallization process parameters based on the second deviation feedback, and adjust the ultrafast laser equal material welding process parameters in real time based on the relational model. Complete the ultrafast laser equal material welding of the glass through hole based on the adjusted ultrafast laser equal material welding process parameters. Step S8: The electrical performance of the glass through-hole after ultrafast laser welding is tested using a four-probe method and an impedance analyzer to obtain the actual electromagnetic performance parameters, including on-resistance and insertion loss. Step S9: Input the actual structural parameters and the actual electromagnetic performance parameters into the relational model and compare them with the predicted values ​​output by the relational model. If the comparison deviation is greater than or equal to the preset third deviation threshold, iteratively optimize the process parameters of composite laser subtractive hole making, electronic 3D printing additive metallization and ultrafast laser welding until the comparison deviation is less than the third deviation threshold.

2. The glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal materials according to claim 1, characterized in that, In step S1, the training method for the relational model is as follows: The historical sample data is used as the training set. The historical sample data uses the process parameters of composite laser subtractive hole making, electronic 3D printing additive metallization and ultrafast laser welding as the model input layer, and the structural characteristic parameters of glass through holes obtained by actual measurement as the model intermediate layer, and the electromagnetic performance parameters obtained by actual measurement as the model output layer. The model is trained using a backpropagation neural network algorithm or a random forest algorithm until the coefficient of determination of the fit of the relation model is greater than or equal to 0.

95.

3. The glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal materials according to claim 1, characterized in that, In step S2, the range of the initialized process parameters is specifically as follows: The pulsed laser is a femtosecond laser or a picosecond laser, and the laser power of the pulsed laser is 10W to 50W, and the scanning speed is 100mm / s to 500mm / s; The laser power of the continuous laser is 5W to 20W, and the scanning speed is 50mm / s to 200mm / s; The printing air pressure is 0.1 MPa to 1 MPa, and the printing layer thickness is 0.1 μm to 10 μm; The diameter of the light spot is 5μm to 50μm, and the welding power is 5W to 50W.

4. The glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal materials according to claim 1, characterized in that, In step S5, the strategy for adjusting the initialized composite laser subtractive drilling process parameters based on the first deviation feedback is as follows: If the first deviation of the aperture is greater than or equal to 5%, then the scanning speed of the pulsed laser is adjusted; If the first deviation of the hole wall roughness is greater than or equal to 5%, then the laser power of the pulsed laser is adjusted.

5. The glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal materials according to claim 1, characterized in that, In step S5, the electronic 3D printing additive metallization adopts piezoelectric inkjet printing technology, aerosol printing technology, or direct writing printing technology. The material used in the electronic 3D printing additive metallization is conductive silver paste or conductive copper paste, the solid content of which is 60% to 80% and the viscosity is 1000 mPa·s to 10000 mPa·s.

6. The glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal materials according to claim 1, characterized in that, In step S6, the actual filling quality parameter also includes the adhesion between the conductive material and the hole wall; In step S7, the standard for the predicted filling quality output by the relational model is: filling density greater than or equal to 99%, porosity less than or equal to 1%, and the adhesion between conductive material and pore wall greater than or equal to 95%. The strategy for adjusting the initialized electronic 3D printing additive metallization process parameters based on the second deviation feedback is as follows: if the second deviation of the filling density is greater than or equal to the second deviation threshold, the printing air pressure is adjusted; if the second deviation of the fit is greater than or equal to the second deviation threshold, the printing layer thickness is adjusted.

7. The glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal materials according to claim 1, characterized in that, In step S8, the testing accuracy of the four-probe method is less than or equal to 1 mΩ; The impedance analyzer has a test frequency range of 100kHz to 10GHz and is used to test insulation resistance in a range of 10 GHz. 6 Ω to 10 12 Ω.

8. The glass through-hole interconnection method based on integrated additive and subtractive manufacturing of equal materials according to claim 1, characterized in that, In step S9, the strategy for iteratively optimizing the process parameters of composite laser subtractive drilling, electronic 3D printing additive metallization, and ultrafast laser welding is as follows: The influence weights of each process parameter on the actual electromagnetic performance parameters are determined through sensitivity analysis of the relationship model. Based on the determined impact weights, the process parameters of the corresponding manufacturing process with the largest impact weight are adjusted first, and the weight ranking is as follows: electronic 3D printing additive metallization is greater than composite laser subtractive drilling, and composite laser subtractive drilling is greater than ultrafast laser welding.

9. A glass through-hole interconnect device based on integrated additive and subtractive manufacturing of equal materials, characterized in that, A method for implementing a glass through-hole interconnect based on integrated additive and subtractive manufacturing according to any one of claims 1 to 8 includes: The subtractive manufacturing unit includes a composite laser processing station and an online detection device for through-hole structure. The composite laser processing station is used to directly form glass through-holes on a glass substrate by composite ablation of pulsed laser and continuous laser. The online detection device for through-hole structure is disposed on the rear side of the composite laser processing station and is used to obtain the hole diameter, hole wall roughness, hole depth and perpendicularity of the glass through-hole online. The additive manufacturing unit includes an electronic 3D printing processing station and an online detection device for filling quality. The electronic 3D printing processing station is used to fill and solidify conductive material into the glass through-holes without a seed layer to complete metallization. The online detection device for filling quality is located behind the electronic 3D printing processing station and is used to obtain the filling density and porosity of the glass through-holes after metallization online. The material manufacturing unit includes an ultrafast laser interface strengthening processing station and an interconnect performance testing device. The ultrafast laser interface strengthening processing station is used to perform laser welding strengthening on the metal-glass interface of the metallized glass via. The interconnect performance testing device is configured on the rear side of the ultrafast laser interface strengthening processing station and is used to obtain the on-resistance and insertion loss of the strengthened glass via online. A central control and transmission system includes a transmission platform and a central controller. The transmission platform is used to transmit the glass substrate between the subtractive manufacturing unit, the additive manufacturing unit, and the equal-material manufacturing unit. The central controller has a built-in process parameter-structural characteristic-electromagnetic performance relationship model and is communicatively connected to the online detection device for through-hole structure, the online detection device for through-hole quality, and the interconnect performance testing device. It is configured to execute the steps of the method as described in any one of claims 1 to 8 according to the acquired parameters to achieve coordinated adjustment of the process parameters of each unit.

10. A glass through-hole interconnect device based on integrated additive and subtractive manufacturing according to claim 9, characterized in that, The electronic 3D printing processing station integrates a thermosetting device, which is used to heat and sinter the conductive material filled into the glass through-hole. The transmission platform includes a marble platform, a guide rail, and an XY precision displacement stage mounted on the guide rail. The glass substrate is fixed on the XY precision displacement stage. The central controller is electrically connected to the XY precision displacement stage and is used to control the movement of the XY precision displacement stage between manufacturing units.

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