A welding device for high-power semiconductor devices

Abstract

This invention relates to the field of semiconductor device manufacturing welding technology, and discloses a high-power semiconductor device manufacturing welding apparatus, including a base plate, and further comprising: a feeding component, which includes a rotating frame, a bidirectional electric push rod fixedly connected to the bottom of the rotating frame, a pull rod fixedly connected to the telescopic end of the bidirectional electric push rod, an elastic rod fixedly connected to the end of the pull rod, and a slanted panel fixedly connected to the end of the elastic rod away from the pull rod; and a welding component, which includes a welding cover, a welding robotic arm mounted on the top of the inner wall of the welding cover, and a welding device mounted on the bottom of the welding robotic arm. After the support plate of this invention contacts the welding cover, the welding cover is sealed. At this time, a vacuum pump is started to begin operation, drawing the welding cover into a vacuum state. The welding device performs welding on the semiconductor device under vacuum conditions, which can avoid oxidation and bubble defects during welding, thus improving welding quality.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing welding technology, specifically to a high-power semiconductor device manufacturing welding apparatus. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the unique electrical properties of semiconductor materials to perform specific functions. These devices can be used to generate, control, receive, convert, and amplify signals, and to perform energy conversion. The semiconductor materials used in semiconductor devices are silicon, germanium, or gallium arsenide, and they can be used as rectifiers, oscillators, light emitters, amplifiers, photometers, and other similar equipment. To distinguish them from integrated circuits, they are sometimes also called discrete devices. In the manufacturing process of high-power semiconductor devices, the welding process is a key step that determines the performance, reliability and service life of the devices. At present, semiconductor welding equipment generally adopts an open or semi-open structure and performs welding operations in an atmospheric environment under normal pressure. This can easily lead to interference from impurities such as oxygen and moisture in the air during the welding process. When the welding equipment welds the semiconductor device, the semiconductor device is prone to oxidation reaction and the formation of an oxide layer, which affects the welding quality of the semiconductor device. Summary of the Invention

[0003] The purpose of this invention is to provide a welding apparatus for the production of high-power semiconductor devices to solve the problems mentioned in the background art.

[0004] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: This invention relates to a welding apparatus for the production of high-power semiconductor devices, comprising a base plate, and further comprising: The feeding component includes a rotating frame, a bidirectional electric push rod is fixedly connected to the bottom of the rotating frame, a pull rod is fixedly connected to the telescopic end of the bidirectional electric push rod, an elastic rod is fixedly connected to the end of the pull rod, and an inclined plate is fixedly connected to the end of the elastic rod away from the pull rod. The welding component includes a welding cover, a welding robotic arm is mounted on the top of the inner wall of the welding cover, a welding device is mounted on the bottom of the welding robotic arm, and an intelligent monitoring device is mounted on the top of the inner wall of the welding cover. The intelligent monitoring device is used to detect the welding status of the semiconductor device. The processing component includes a circulation pipe, one end of which is connected to a cooling device, the end of which is away from the cooling device is connected to a return pipe, and the end of which is away from the circulation pipe is connected to a storage tank. The transmission component includes a transmission frame, the bottom of which is fixedly connected to the top of a base plate, and the top center of the transmission frame is open.

[0005] Furthermore, the feeding component includes a fixed frame, the bottom of which is fixedly connected to the top of the base plate. A protective cover is fixedly connected to the surface of the fixed frame. A power device is fixedly connected to the bottom of the inner wall of the protective cover. A threaded rod is fixedly connected to the top of the power device. A cross-shaped sliding hole is formed in the inner wall of the fixed frame. A cross is slidably connected to the inner wall of the cross-shaped sliding hole. The inner wall of the cross is threadedly connected to the surface of the threaded rod. A positioning plate is fixedly connected to the end of the cross away from the threaded rod. A support plate is fixedly connected to the lower surface of the positioning plate. A support plate is fixedly connected to the top of the support plate. The surface of the rotating frame is rotatably connected to the inner wall of the support plate. A driving device is installed on the inner wall of the support plate. The output end of the driving device is fixedly connected to the end of the rotating frame.

[0006] Furthermore, the top of the threaded rod is rotatably connected to the top of the inner wall of the protective cover. The protective cover is located at the end of the fixed frame away from the positioning plate. The end of the pull rod near the elastic rod passes through the rotating frame and extends into the interior of the rotating frame. There are two inclined panels, which are symmetrically arranged with the rotating frame as the center. The bottom of the inclined panel is in contact with the bottom of the inner wall of the rotating frame, and the upper surface of the inclined panel is inclined.

[0007] Furthermore, the welding component includes a mounting frame, the bottom of which is fixedly connected to the top of the welding cover. A vacuum pump is installed on the inner wall of the mounting frame, and the air inlet of the vacuum pump is connected to the top of the welding cover. A rectangular frame is fixedly connected to the surface of the welding cover, and multiple air holes are opened on the inner wall of the welding cover. A bent plate is fixedly connected to the surface of the rectangular frame, and the end of the bent plate away from the rectangular frame is fixedly connected to the surface of the fixed frame.

[0008] Furthermore, the positioning plate is located at one end of the fixing frame and the welding cover that are close to each other, the plurality of air holes are set in two groups, the two groups of air holes have the same number of air holes, and the two groups of air holes are symmetrically arranged with the welding robot arm as the center, and the welding cover is located above the support plate.

[0009] Furthermore, the processing component includes a transfer pump, the bottom of which is fixedly connected to the top of the base plate. The feed end of the transfer pump is connected to the bottom of the storage tank. A transfer pipe is connected to the end of the transfer pump away from the storage tank. The end of the transfer pipe away from the transfer pump is connected to the end of the cooling device. An automatic valve is connected to the surface of the rectangular frame. A rectangular tube is connected to the end of the automatic valve away from the rectangular frame. An exhaust fan is connected to the center of the rectangular tube. An air pipe is connected to the end of the exhaust fan away from the rectangular tube. An air purification device is installed on the top of the base plate. The bottom of the air pipe is connected to the top of the air purification device.

[0010] Furthermore, the circulation pipe is located inside the rectangular frame, and the end of the circulation pipe passes through the rectangular frame and extends to the outer end of the rectangular frame. There are two automatic valves, which are symmetrically arranged with the rectangular pipe as the center. The center of the rectangular pipe is located above the welding cover. The lower surface of the cooling device is fixedly connected to the surface of the fixed frame. The upper surface of the storage tank is provided with a filling pipe.

[0011] Furthermore, the transmission component includes a transmission device, which is installed at the end of the transmission frame. The end of the transmission frame has a feed hole, and the end of the transmission device extends into the interior of the transmission frame through the feed hole and is located inside the support plate. A loading robotic arm is fixedly connected to the surface of the transmission frame.

[0012] Furthermore, the support plate is located inside the transmission frame, the end of the transmission frame extends to the outer end of the base plate, and there are two transmission devices, which are symmetrically arranged with the transmission frame as the center.

[0013] The present invention has the following beneficial effects: This invention utilizes the elasticity of a spring bar to press and fix the semiconductor device using a slanted panel. The spring bar pre-clamps the semiconductor device, preventing displacement during clamping. When the bidirectional electric push rods move closer together, they compress the spring bar, pushing the slanted panel to press the semiconductor device, improving stability after loading. After loading, the cross-shaped mechanism moves upwards, pushing the semiconductor device into the welding component for welding via a rotating frame. This automatic loading method eliminates the need for workers to approach the welding position, improving safety.

[0014] When the support plate of this invention moves upward, it will contact the bottom of the welding cover. After the support plate contacts the welding cover, the welding cover will be in a sealed state. At this time, the vacuum pump is started to start the operation. The vacuum pump will draw the welding cover into a vacuum state. The welding device welds the semiconductor device in a vacuum state, which can avoid oxidation and bubble defects during welding and improve the welding quality.

[0015] After cooling, the coolant enters the circulation pipe. As the coolant flows through the circulation pipe, it cools the welding shield and the semiconductor device. Finally, the coolant in the circulation pipe returns to the storage tank through the return pipe, allowing the coolant to be recycled. This circulation process ensures that the coolant remains at a low temperature, preventing a decrease in cooling effect due to the coolant heating up. It also cools the semiconductor device after welding, preventing the semiconductor device from overheating after welding, which could easily lead to cracking and performance damage due to excessive thermal stress.

[0016] This invention features two transmission devices: one for transferring unsoldered semiconductor devices into the transmission rack, and the other for transferring soldered semiconductor devices out, thereby improving the convenience of loading and unloading semiconductor devices. During loading, the loading robot places the unsoldered semiconductor devices inside the rotating rack to complete the loading, thus improving the soldering efficiency of semiconductor devices.

[0017] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall structure of the feeding component of the present invention; Figure 3 This is another structural schematic diagram of the feeding component of the present invention; Figure 4 This is a schematic diagram of the rotating frame structure of the present invention; Figure 5 This is a schematic diagram of the bottom structure of the rotating frame of the present invention; Figure 6 This is a schematic diagram of the overall structure of the welding component of the present invention; Figure 7 This is another structural schematic diagram of the welding component of the present invention; Figure 8 This is a schematic diagram of the overall structure of the processing component of the present invention; Figure 9 This is another schematic diagram of the processing component of the present invention; Figure 10 This is a schematic diagram of the overall structure of the transmission component of the present invention.

[0020] The attached diagram lists the components represented by each number as follows: In the diagram: 1. Base plate; 2. Feeding component; 3. Welding component; 4. Processing component; 5. Conveying component; 10. Fixing frame; 11. Support plate; 12. Support plate; 13. Protective cover; 14. Threaded rod; 15. Power unit; 16. Positioning plate; 17. Cross; 18. Rotating frame; 19. Sloping panel; 20. Drive unit; 21. Elastic rod; 22. Pull rod; 23. Bidirectional electric actuator; 30. Welding cover; 31. Mounting frame; 32. Vacuum pump; 33. Bending plate; 34. Rectangular frame; 35. Intelligent monitoring device; 36. Air vent; 37. Welding device; 38. Welding robotic arm; 40. Storage tank; 41. Transfer pump; 42. Transfer pipe; 43. Cooling device; 44. Automatic valve; 45. Exhaust fan; 46. Rectangular tube; 47. Circulation pipe; 48. Air pipe; 49. Air purification device; 50. Return pipe; 60. Transfer frame; 61. Loading robotic arm; 62. Feed port; 63. Transfer device. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-10 As shown, the present invention is a welding apparatus for the production of high-power semiconductor devices, including a base plate 1, and further comprising: The feeding component 2 includes a rotating frame 18. A bidirectional electric push rod 23 is fixedly connected to the bottom of the rotating frame 18. A pull rod 22 is fixedly connected to the telescopic end of the bidirectional electric push rod 23. An elastic rod 21 is fixedly connected to the end of the pull rod 22. An inclined plate 19 is fixedly connected to the end of the elastic rod 21 away from the pull rod 22. Welding component 3 includes a welding cover 30, a welding robotic arm 38 is installed on the top of the inner wall of the welding cover 30, a welding device 37 is installed on the bottom of the welding robotic arm 38, and an intelligent monitoring device 35 is installed on the top of the inner wall of the welding cover 30. Processing component 4 includes a circulation pipe 47, one end of which is connected to a cooling device 43, the other end of which is connected to a return pipe 50, and the other end of which is connected to a storage tank 40. The transmission component 5 includes a transmission frame 60, the bottom of which is fixedly connected to the top of the base plate 1, and the top center of the transmission frame 60 is provided with an opening.

[0023] The feeding component 2 includes a fixed frame 10, the bottom of which is fixedly connected to the top of the base plate 1. A protective cover 13 is fixedly connected to the surface of the fixed frame 10. A power unit 15 is fixedly connected to the bottom of the inner wall of the protective cover 13. A threaded rod 14 is fixedly connected to the top of the power unit 15. A cross-shaped sliding hole is opened in the inner wall of the fixed frame 10. A cross 17 is slidably connected to the inner wall of the cross-shaped sliding hole. The inner wall of the cross 17 is threadedly connected to the surface of the threaded rod 14. A positioning plate 16 is fixedly connected to the end of the cross 17 away from the threaded rod 14. A support plate 11 is fixedly connected to the lower surface of the positioning plate 16. A support plate 12 is fixedly connected to the top of the support plate 11. The surface of the rotating frame 18 is rotatably connected to the inner wall of the support plate 12. A driving device 20 is installed on the inner wall of the support plate 12. The output end of the device 20 is fixedly connected to the end of the rotating frame 18. The inclined plate 19 uses the elasticity of the elastic rod 21 to squeeze and fix the semiconductor device. The elastic rod 21 is used to pre-clamp the semiconductor device to avoid displacement when clamping it. When the bidirectional electric push rod 23 is activated to move closer to each other, the bidirectional electric push rod 23 will compress the elastic rod 21 to push the inclined plate 19 to squeeze the semiconductor device, improving the stability of the semiconductor device after feeding. After feeding is completed, when the cross 17 moves upward, it pushes the semiconductor device into the welding component 3 through the rotating frame 18 for welding. The semiconductor device is fed by automatic feeding, so that the worker does not need to approach the welding position when welding the semiconductor device, thus improving safety.

[0024] The top of the threaded rod 14 is rotatably connected to the top of the inner wall of the protective cover 13. The protective cover 13 is located at the end of the fixed frame 10 away from the positioning plate 16. The end of the pull rod 22 near the elastic rod 21 passes through the rotating frame 18 and extends into the interior of the rotating frame 18. There are two inclined panels 19. The two inclined panels 19 are symmetrically arranged with the rotating frame 18 as the center. The bottom of the inclined panel 19 contacts the bottom of the inner wall of the rotating frame 18. The upper surface of the inclined panel 19 is inclined.

[0025] The welding component 3 includes a mounting bracket 31, the bottom of which is fixedly connected to the top of the welding cover 30. A vacuum pump 32 is installed on the inner wall of the mounting bracket 31, and the air inlet of the vacuum pump 32 is connected to the top of the welding cover 30. A rectangular frame 34 is fixedly connected to the surface of the welding cover 30. Multiple air holes 36 are opened on the inner wall of the welding cover 30. A bent plate 33 is fixedly connected to the surface of the rectangular frame 34. The end of the bent plate 33 away from the rectangular frame 34 is fixedly connected to the surface of the fixed frame 10. When the support plate 11 moves upward, it will contact the bottom of the welding cover 30. After the support plate 11 contacts the welding cover 30, the welding cover 30 will be in a sealed state. At this time, the vacuum pump 32 is started to start the operation. The vacuum pump 32 will draw the welding cover 30 into a vacuum state. The welding device 37 welds the semiconductor device in a vacuum state, which can avoid oxidation and bubble defects during welding and improve the welding quality.

[0026] The positioning plate 16 is located at one end of the fixed frame 10 and the welding cover 30 that are close to each other. The multiple air holes 36 are set in two groups, with the same number of air holes 36 in both groups. The two groups of air holes 36 are symmetrically arranged with the welding robot arm 38 as the center. The welding cover 30 is located above the support plate 11.

[0027] The processing unit 4 includes a transfer pump 41, the bottom of which is fixedly connected to the top of the base plate 1. The feed end of the transfer pump 41 is connected to the bottom of the storage tank 40. A transfer pipe 42 is connected to the end of the transfer pump 41 away from the storage tank 40. The end of the transfer pipe 42 away from the transfer pump 41 is connected to the end of the cooling device 43. An automatic valve 44 is connected to the surface of the rectangular frame 34. A rectangular tube 46 is connected to the end of the automatic valve 44 away from the rectangular frame 34. An exhaust fan 45 is connected to the center of the rectangular tube 46. An air pipe 48 is connected to the end of the exhaust fan 45 away from the rectangular tube 46. An air purification device 49 is installed on the top of the base plate 1. The bottom of the air pipe 48 is connected to the air purifier 49. The top of the air purification device 49 is connected, and the cooled liquid enters the interior of the circulation pipe 47. When the cool liquid flows inside the circulation pipe 47, it cools the welding cover 30 and the semiconductor device. Finally, the cool liquid in the circulation pipe 47 enters the storage tank 40 through the return pipe 50, so that the cool liquid can be recycled. This circulation process can ensure that the cool liquid is kept at a low temperature, avoiding the decrease in cooling effect due to the increase in the temperature of the cool liquid. It also cools the semiconductor device after welding, preventing the semiconductor device from being too hot after welding, which can easily lead to cracking and performance damage due to excessive thermal stress.

[0028] The circulation pipe 47 is located inside the rectangular frame 34. The end of the circulation pipe 47 passes through the rectangular frame 34 and extends to the outer end of the rectangular frame 34. There are two automatic valves 44. The two automatic valves 44 are symmetrically arranged with the rectangular pipe 46 as the center. The center of the rectangular pipe 46 is located above the welding cover 30. The lower surface of the cooling device 43 is fixedly connected to the surface of the fixed frame 10. The upper surface of the storage tank 40 is provided with a filling pipe.

[0029] The transmission component 5 includes a transmission device 63, which is installed at the end of the transmission frame 60. The end of the transmission frame 60 has a feed hole 62. The end of the transmission device 63 extends into the interior of the transmission frame 60 through the feed hole 62 and is located inside the support plate 11. A loading robot arm 61 is fixedly connected to the surface of the transmission frame 60. Two transmission devices 63 are provided, one for transferring unsoldered semiconductor devices into the interior of the transmission frame 60 and the other for transferring soldered semiconductor devices out, thereby improving the convenience of loading and unloading semiconductor devices. During loading, the loading robot arm 61 places the unsoldered semiconductor devices inside the rotating frame 18 to complete the loading, thereby improving the soldering efficiency of semiconductor devices.

[0030] The support plate 11 is located inside the transmission frame 60. The end of the transmission frame 60 extends to the outer end of the base plate 1. There are two transmission devices 63, which are symmetrically arranged with the transmission frame 60 as the center.

[0031] In use, when the semiconductor device is placed inside the rotating frame 18, the end of the semiconductor device preferentially contacts the inclined surface of the inclined plate 19. As the semiconductor device continues to move downward, it pushes the inclined plate 19 to move away from each other and compresses the elastic rod 21 to contract. At this time, the inclined plate 19 uses the elasticity of the elastic rod 21 to squeeze and fix the semiconductor device, using the elastic rod 21 to pre-clamp the semiconductor device and prevent displacement during clamping. When the bidirectional electric push rod 23 is activated to move closer to each other, the bidirectional electric push rod 23 compresses the elastic rod 21 and pushes the inclined plate 19 to squeeze the semiconductor device, improving the stability of the semiconductor device after loading. After loading is completed, the power device 15 is activated to drive the threaded rod 14 to rotate. When the threaded rod 14 rotates, it pushes the cross 17 to slide upward through the threaded connection. The cross 17 slides inside the cross-shaped sliding hole. The cross 17 moves upward to improve the stability of the support plate 11. When the cross 17 moves upward, the rotating frame 18 pushes the semiconductor device into the welding component 3 for welding. The semiconductor device is fed by automatic feeding, so that the worker does not need to approach the welding position when the semiconductor device is welded, which improves safety. When the drive device 20 is started, the drive device 20 will drive the rotating frame 18 to rotate. The rotating frame 18 can rotate to 90 degrees so that the welding robot arm 38 can operate the welding device 37 to perform welding operations on the semiconductor device. The rotating frame 18 rotates 90 degrees to both ends with the forward and reverse rotation of the drive device 20 so that the angle of the semiconductor device can be adjusted during welding. After the welding is completed, the threaded rod 14 reverses to push the support plate 11 to reset. After reset, the bidirectional electric push rod 23 performs an extension reset operation to unload the semiconductor device. When the support plate 11 moves upward, it will contact the bottom of the welding cover 30. After the support plate 11 contacts the welding cover 30, the welding cover 30 will be in a sealed state. At this time, the vacuum pump 32 is started to start the operation. The vacuum pump 32 will draw the welding cover 30 into a vacuum state. The welding device 37 welds the semiconductor device in a vacuum state, which can avoid oxidation and bubble defects during welding and improve the welding quality. After the semiconductor device soldering is completed, the transfer pump 41 is started to begin operation. The transfer pump 41 transfers the coolant in the storage tank 40 to the cooling device 43 through the transfer pipe 42. The cooling device 43 cools the coolant, and the cooled coolant then enters the circulation pipe 47. As the coolant flows inside the circulation pipe 47, it cools the soldering cover 30 and the semiconductor device. Finally, the coolant in the circulation pipe 47 returns to the storage tank 40 through the return pipe 50, allowing the coolant to be recycled. This circulation process ensures that the coolant remains at a low temperature, preventing a decrease in cooling effect due to coolant temperature rise, and effectively cooling the soldered semiconductor device to prevent the semiconductor device temperature from becoming too high after soldering. High temperature and high humidity can easily lead to cracking and performance damage due to excessive thermal stress. After cooling, the automatic valve 44 opens, and oxygen in the rectangular tube 46 enters the interior of the welding cover 30, causing the vacuum in the welding cover 30 to disappear. At this time, the threaded rod 14 can be activated to push the support plate 11 downward to unload the semiconductor device. This prevents the support plate 11 from being unable to move under suction. When the support plate 11 starts to move downward, the exhaust fan 45 is activated simultaneously. At this time, the flue gas in the welding cover 30 will enter the rectangular tube 46 under the suction of the exhaust fan 45. Finally, the flue gas is transmitted to the air purification device 49 through the air pipe 48 for purification. After the flue gas is treated, the automatic valve 44 closes, so that the welding cover 30 can be in a vacuum state to weld the semiconductor device. When the support plate 11 moves downward, it enters the interior of the transfer frame 60. After the bidirectional electric push rod 23 extends and resets, the loading robot arm 61 starts working. The loading robot arm 61 removes the semiconductor device from the interior of the rotating frame 18. After removal, the loading robot arm 61 places the semiconductor device on the surface of the transfer device 63. The soldered semiconductor device is then transferred out through the transfer device 63. There are two transfer devices 63, one for transferring unsoldered semiconductor devices to the interior of the transfer frame 60 and the other for transferring soldered semiconductor devices out, which improves the convenience of loading and unloading semiconductor devices. During loading, the loading robot arm 61 places the unsoldered semiconductor device inside the rotating frame 18 to complete the loading, thereby improving the soldering efficiency of semiconductor devices.

[0032] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A welding apparatus for manufacturing high-power semiconductor devices, comprising a base plate (1), characterized in that, Also includes: The feeding component (2) includes a rotating frame (18), a bidirectional electric push rod (23) is fixedly connected to the bottom of the rotating frame (18), a pull rod (22) is fixedly connected to the telescopic end of the bidirectional electric push rod (23), an elastic rod (21) is fixedly connected to the end of the pull rod (22), and an inclined plate (19) is fixedly connected to the end of the elastic rod (21) away from the pull rod (22). Welding component (3), the welding component (3) includes a welding cover (30), a welding robotic arm (38) is installed on the top of the inner wall of the welding cover (30), a welding device (37) is installed on the bottom of the welding robotic arm (38), and an intelligent monitoring device (35) is installed on the top of the inner wall of the welding cover (30). Processing component (4), the processing component (4) includes a circulation pipe (47), the end of the circulation pipe (47) is connected to a cooling device (43), the end of the circulation pipe (47) away from the cooling device (43) is connected to a return pipe (50), and the end of the return pipe (50) away from the circulation pipe (47) is connected to a storage tank (40). The transmission component (5) includes a transmission frame (60), the bottom of which is fixedly connected to the top of the base plate (1), and the top center of the transmission frame (60) is set with an opening.

2. The welding apparatus for high-power semiconductor device production according to claim 1, characterized in that: The feeding component (2) includes a fixed frame (10), the bottom of which is fixedly connected to the top of the base plate (1). A protective cover (13) is fixedly connected to the surface of the fixed frame (10). A power device (15) is fixedly connected to the bottom of the inner wall of the protective cover (13). A threaded rod (14) is fixedly connected to the top of the power device (15). A cross-shaped sliding hole is provided on the inner wall of the fixed frame (10). A cross (17) is slidably connected to the inner wall of the cross-shaped sliding hole. The inner wall of the cross (17) is connected to... The surface of the threaded rod (14) is threaded. The end of the cross (17) away from the threaded rod (14) is fixedly connected to a positioning plate (16). The lower surface of the positioning plate (16) is fixedly connected to a support plate (11). The top of the support plate (11) is fixedly connected to a support plate (12). The surface of the rotating frame (18) is rotatably connected to the inner wall of the support plate (12). The inner wall of the support plate (12) is equipped with a driving device (20). The output end of the driving device (20) is fixedly connected to the end of the rotating frame (18).

3. The welding apparatus for high-power semiconductor device production according to claim 2, characterized in that: The top of the threaded rod (14) is rotatably connected to the top of the inner wall of the protective cover (13). The protective cover (13) is located at the end of the fixed frame (10) away from the positioning plate (16). The end of the pull rod (22) near the elastic rod (21) passes through the rotating frame (18) and extends into the interior of the rotating frame (18). There are two inclined panels (19). The two inclined panels (19) are symmetrically arranged with the rotating frame (18) as the center. The bottom of the inclined panel (19) is in contact with the bottom of the inner wall of the rotating frame (18). The upper surface of the inclined panel (19) is inclined.

4. The welding apparatus for high-power semiconductor device production according to claim 3, characterized in that: The welding component (3) includes a mounting bracket (31), the bottom of which is fixedly connected to the top of the welding cover (30). A vacuum pump (32) is installed on the inner wall of the mounting bracket (31), and the air inlet of the vacuum pump (32) is connected to the top of the welding cover (30). A rectangular frame (34) is fixedly connected to the surface of the welding cover (30). Multiple air holes (36) are opened on the inner wall of the welding cover (30). A bent plate (33) is fixedly connected to the surface of the rectangular frame (34), and one end of the bent plate (33) away from the rectangular frame (34) is fixedly connected to the surface of the fixing frame (10).

5. The welding apparatus for high-power semiconductor device production according to claim 4, characterized in that: The positioning plate (16) is located at one end of the fixing frame (10) and the welding cover (30) that are close to each other. The plurality of air holes (36) are set in two groups, with the same number of air holes (36) in both groups, and the two groups of air holes (36) are symmetrically arranged with the welding robot arm (38) as the center. The welding cover (30) is located above the support plate (11).

6. The welding apparatus for high-power semiconductor device production according to claim 5, characterized in that: The processing component (4) includes a transfer pump (41), the bottom of which is fixedly connected to the top of the base plate (1), the feed end of which is connected to the bottom of the storage tank (40), the end of which is away from the storage tank (40) is connected to a transfer pipe (42), the end of which is away from the transfer pump (41) is connected to the end of the cooling device (43), the surface of the rectangular frame (34) is connected to an automatic valve (44), the end of which is away from the rectangular frame (34) is connected to a rectangular tube (46), the center of which is connected to an exhaust fan (45), the end of which is away from the rectangular tube (46) is connected to an air pipe (48), the top of the base plate (1) is equipped with an air purification device (49), and the bottom of which is connected to the top of the air pipe (48).

7. The welding apparatus for high-power semiconductor device production according to claim 6, characterized in that: The circulation pipe (47) is located inside the rectangular frame (34). The end of the circulation pipe (47) passes through the rectangular frame (34) and extends to the outer end of the rectangular frame (34). There are two automatic valves (44). The two automatic valves (44) are symmetrically arranged with the rectangular pipe (46) as the center. The center of the rectangular pipe (46) is located above the welding cover (30). The lower surface of the cooling device (43) is fixedly connected to the surface of the fixing frame (10). The upper surface of the storage tank (40) is provided with a filling pipe.

8. The welding apparatus for producing high-power semiconductor devices according to claim 7, characterized in that: The transmission component (5) includes a transmission device (63), which is installed at the end of the transmission frame (60). The end of the transmission frame (60) has a feed hole (62). The end of the transmission device (63) extends into the interior of the transmission frame (60) through the feed hole (62) and is located inside the support plate (11). A loading robot arm (61) is fixedly connected to the surface of the transmission frame (60).

9. A high-power semiconductor device manufacturing welding apparatus according to claim 8, characterized in that: The support plate (11) is located inside the transmission frame (60), the end of the transmission frame (60) extends to the outer end of the base plate (1), and there are two transmission devices (63), which are symmetrically arranged with the transmission frame (60) as the center.

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