Method for manufacturing a planarization material, planarization material, planarization apparatus and component

Abstract

This application relates to the field of planarization, providing a method for manufacturing a planarization material, a planarization material, a planarization device, and a component. The manufacturing method includes: providing a planarization layer, which includes a working surface and an adhesive surface facing away from each other; applying an adhesive material to the adhesive surface; and bonding a support material to the adhesive material. The planarization material includes a planarization layer, an adhesive material, and a support layer stacked sequentially. In one example, the planarization material can be prepared using this manufacturing method. The planarization device includes the planarization material. The component is obtained by processing the planarization material. This application simplifies the manufacturing process and improves production efficiency by first applying the adhesive material to the planarization layer and then bonding it to the support material; the adhesive material directly impregnates and fills the micropores of the adhesive surface, significantly improving the interfacial bonding strength and bonding reliability; by using an anti-adhesive material to shield the window surface before applying the adhesive, or by first opening a second through-hole before assembling the window, the alignment tolerance is relaxed, the process difficulty is reduced, and the yield is improved.

Description

Technical Field

[0001] This application relates to the field of leveling, and more particularly to a method for manufacturing leveling materials, leveling materials, leveling equipment, and components. Background Technology

[0002] Planarization processes are used to flatten the surfaces of workpieces such as wafers. This technology typically employs a planarization material comprising a planarization layer, a binder layer, and a support layer. The planarization layer has micropores and trench structures to store the planarization fluid and mechanically abrade the wafer surface; the support layer is used to fix the wafer to the machine and provides support for the planarization layer. Conventional manufacturing processes for planarization materials are relatively complex and have low production efficiency. Summary of the Invention

[0003] This application provides a method for manufacturing a leveling material, the leveling material itself, leveling equipment, and components, which helps to simplify the manufacturing process of the leveling material and improve production efficiency.

[0004] In a first aspect, embodiments of this application provide a method for manufacturing a smoothing material, the method comprising: providing at least one smoothing layer, wherein the at least one smoothing layer includes a working surface and an adhesive surface disposed opposite to the working surface; disposing an adhesive material on the adhesive surface of the at least one smoothing layer; and bonding a support material to the adhesive material on the at least one smoothing layer.

[0005] In the manufacturing method of this application embodiment, the leveling layer can be a small leveling layer that participates in forming a leveling material; or, the leveling layer can be a large parent layer that can be divided into multiple small leveling layers that participate in forming multiple leveling materials. In the manufacturing method of this application embodiment, adhesive material can be provided on the bonding surface of one or more of the leveling layers, and / or, support material can be bonded to the adhesive material on one or more of the leveling layers.

[0006] In the manufacturing method of this application embodiment, adhesive material is first applied to the bonding surface of the planarization layer, and then the support material is bonded to the adhesive material. This differs from the traditional manufacturing method (first cutting and fixing the support material, then applying adhesive material to the support material, and finally attaching the planarization layer). The manufacturing method of this application embodiment has at least the following technical effects: Bonding the support material to the adhesive on the planarization layer avoids the complex operations (such as using special jigs) required in traditional methods that necessitate the individual fixing and positioning of the soft support material. In some examples, the support material can be fed into the process in continuous raw material form (such as rolls) without needing to be pre-cut to dimensions matching each planarization layer before bonding. Therefore, the manufacturing method of this application embodiment can simplify the process flow and improve production efficiency.

[0007] Furthermore, since the adhesive is applied directly to the bonding surface of the smoothing layer, it can better wet, fill, and conform to the microscopic contours and pores of the bonding surface, thereby forming stronger mechanical interlocking and a larger effective contact area at the microscopic level. Compared to applying the adhesive first to the support layer and then bonding it, this meets the higher requirements of the smoothing layer for adhesion, such as hardness and roughness, significantly improving the interfacial bonding strength between the adhesive and the smoothing layer, and alleviating the problem of separation between the adhesive and the smoothing layer.

[0008] In one implementation of the first aspect, the provision of the adhesive material on the bonding surface of the at least one leveling layer includes: applying the liquid adhesive material to the bonding surface of the at least one leveling layer.

[0009] In this implementation, a liquid adhesive can be applied to the bonding surface of one or more planarization layers. A coating process is used, and the adhesive is in a liquid state during application. The liquid adhesive has good flowability, allowing it to adapt well to and fill the minute undulations of the planarization layer bonding surface (which may itself have a rough or microporous structure). This tight adhesion results in a very strong bond between the adhesive and the bonding surface. This effectively reduces air bubbles at the bonding interface, further improving the bonding quality and uniformity, thus providing a more stable and reliable connection foundation between the planarization layer and the support layer.

[0010] In one implementation of the first aspect, the process of applying the liquid adhesive to the adhesive surface of the at least one leveling layer includes: containing a liquid reactive hot melt adhesive between a heating roller and a coating roller, and heating the liquid reactive hot melt adhesive through the heating roller and the coating roller; such that the at least one leveling layer passes sequentially through the heating roller and the coating roller, and the liquid reactive hot melt adhesive is applied to the adhesive surface of the at least one leveling layer through the coating roller.

[0011] In this implementation, the adhesive material is a liquid reactive hot melt adhesive. The adhesive's adhesion, modulus, and elasticity after curing meet product requirements. Heating rollers and coating rollers are used to maintain the temperature of the reactive hot melt adhesive, and the coating rollers transfer the molten adhesive to the bonding surface. This process is relatively mature and the amount of adhesive applied is easy to control. The reactive hot melt adhesive becomes liquid upon heating and solidifies upon cooling. After curing, the reactive hot melt adhesive provides the key properties such as adhesion, modulus, and elasticity required for the use of the leveling material. This solution uses an "adhesive tank" composed of heating rollers and coating rollers to maintain the adhesive material in a molten state, and the rotation of the two rollers transfers and "coats" the adhesive onto the leveling layer. This roller coating process is relatively mature. By adjusting parameters such as the temperature, spacing, and rotation speed of the heating and coating rollers, as well as the conveying speed of the leveling layer, the amount of adhesive applied to the bonding surface can be controlled relatively precisely and stably, thereby ensuring batch production consistency and uniform adhesive layer thickness.

[0012] In one implementation of the first aspect, the coating roller is elastic; applying liquid reactive hot melt adhesive to the bonding surface of the leveling layer by the coating roller includes: causing the coating roller to elastically press against the leveling layer.

[0013] In this implementation, by making the coating roller elastic and elastically pressing against the leveling layer, it is beneficial for the reactive hot melt adhesive on the coating roller to be transferred to the bonding surface quickly and fully, and for the coating roller to conform to the micro-contour of the bonding surface, thereby reducing air bubbles on the bonding surface, which is beneficial to improving the coating efficiency and coating quality; it can also avoid damage to the leveling layer when the coating roller presses against the leveling layer.

[0014] In one implementation of the first aspect, the step of applying liquid adhesive to the bonding surface of the smoothing layer further includes: heating and smoothing the reactive hot melt adhesive on the bonding surface of the smoothing layer using a spreading roller.

[0015] In this implementation, the distributing roller heats and smooths the reactive hot melt adhesive on the bonding surface of the leveling layer, which can maintain or adjust the temperature of the liquid reactive hot melt adhesive and make the reactive hot melt adhesive relatively flat, which is beneficial for the subsequent bonding of the support material.

[0016] In one implementation of the first aspect, bonding the support material to the adhesive on the at least one leveling layer includes: aligning the support material with the reactive hot melt adhesive on the at least one leveling layer using a conveying roller, and pressing the at least one leveling layer from the side of the at least one leveling layer away from the reactive hot melt adhesive using an extrusion roller, so that the support material is bonded to the reactive hot melt adhesive on the at least one leveling layer.

[0017] In this implementation, a conveyor roller aligns the support material with the reactive hot melt adhesive on the leveling layer, and an extrusion roller extrudes the leveling layer, thus bonding the support material to the adhesive on the leveling layer through roller pressing. The synergistic action of the conveyor roller and the extrusion roller enables continuous operation from alignment to bonding of the support material, which helps improve production efficiency.

[0018] In one implementation of the first aspect, in the step of aligning the support material with the reactive hot melt adhesive on the leveling layer by means of a conveying roller, the reactive hot melt adhesive on the leveling layer is heated by means of a conveying roller.

[0019] In this implementation, by equipping the conveyor roller with a heating function, the viscosity and bonding temperature of the reactive hot melt adhesive before bonding the support material can be adjusted to improve the penetration of the reactive hot melt adhesive into the pores on the surface of the support material, thereby increasing the bonding strength between the leveling layer and the support material.

[0020] In one implementation of the first aspect, the manufacturing method further includes: performing a pressure holding treatment on the planarized material.

[0021] In this implementation, by holding the leveling material under pressure in a flat pressure fixture for a period of time, it is beneficial to avoid the warping of the support layer and the leveling layer, and to ensure the bonding strength of the reactive hot melt adhesive within its open time, thereby improving the bonding tightness between the leveling layer and the support layer.

[0022] In one implementation of the first aspect, in the step of providing at least one leveling layer, the at least one leveling layer has a window integrally formed therewith, the window having a window surface facing away from the working surface; between the step of providing at least one leveling layer and the step of applying adhesive to the bonding surface of the at least one leveling layer, the manufacturing method further includes: using an anti-adhesive material to cover the window surface of the window in the at least one leveling layer; between the step of applying adhesive to the bonding surface of the at least one leveling layer and the step of bonding a support material to the adhesive on the at least one leveling layer, the manufacturing method further includes: removing the anti-adhesive material from the window in the at least one leveling layer; after the step of bonding the support material to the adhesive on the at least one leveling layer, the manufacturing method further includes: forming a first through hole in the support material such that the projection of the first through hole along the thickness direction of the support material onto the window surface overlaps with the window surface.

[0023] In this implementation, one or more windows are integrated within the flattening layer.

[0024] Traditional manufacturing methods involve forming an adhesive material on a support layer, using an anti-adhesive material to cover the window surface of the window placed on a leveling layer, and then bonding the leveling layer to the support layer. This results in the anti-adhesive material being trapped inside after the leveling layer and support layer are bonded together. It can only be removed after a first through-hole is created in the support layer. However, this requires precise alignment of the first through-hole with the anti-adhesive material or the window surface, leading to high precision requirements, significant manufacturing difficulty, and a relatively small processing window for the first through-hole.

[0025] In this manufacturing method, since an anti-adhesive material is first used to cover the window surface, and then an adhesive is formed on the planarization layer, the anti-adhesive material can be removed before the planarization layer and the support layer are bonded. After the planarization layer and the support layer are bonded, the first through hole can be directly opened. In comparison, this embodiment avoids the problem of the anti-adhesive material being sandwiched within the traditional method, thus avoiding the need for precise alignment of the anti-adhesive material or the window surface when opening the first through hole. This allows the first through hole to be opened without precise alignment of the window surface, thereby reducing the process precision requirements and process difficulty, resulting in a larger process window for the first through hole and higher production efficiency.

[0026] In one implementation of the first aspect, in the step of opening a first through hole in the support material such that the projection of the first through hole on the window surface along the thickness direction of the support material overlaps with the window surface, the projection of the first through hole on the window surface along the thickness direction of the support material falls within the range of the window surface.

[0027] In this implementation, by ensuring that the projection of the first through hole along the thickness direction of the support layer onto the window surface falls within the boundary of the window surface, the outer periphery of the window can be supported by the support layer, thereby improving the mechanical reliability of the window.

[0028] In one implementation of the first aspect, in the step of providing at least one leveling layer, the at least one leveling layer has a second through hole; after the step of bonding the support material to the adhesive on the at least one leveling layer, the manufacturing method further includes: opening a third through hole in the support material aligned with the second through hole; inserting a window into the second through hole and fixing the window to the leveling layer.

[0029] In this embodiment, the third through hole on the supporting material serves the same function as the first through hole, both acting as light transmission detection holes for the planarization material. The use of "third through hole" and "first through hole" is merely for clarity; in reality, both are light transmission detection holes on the supporting material, and their positions may be the same or approximately the same.

[0030] In this implementation, one or more of the planarization layers are provided with the second through hole.

[0031] The traditional manufacturing method involves forming an adhesive material on a support layer; bonding a leveling layer to the support layer; creating a third through-hole in the support layer; and finally installing the window within the second through-hole in the leveling layer. Since the adhesive material is formed on the support layer, it must penetrate the support layer and the adhesive material on top of it to create the third through-hole. This makes creating the third through-hole quite difficult. Furthermore, to completely remove the adhesive material from the target area and avoid adhesive residue within the range of the second through-hole, the third through-hole must be precisely aligned with the second through-hole, and its diameter must be greater than or equal to the diameter of the second through-hole. This not only results in a smaller process window for the third through-hole but also reduces the structural load-bearing capacity of the window and negatively impacts the assembly reliability of the window.

[0032] In the manufacturing method of this implementation, adhesive material is first placed on multiple planarization layers with second through holes. Then, continuously wound support material is bonded to the adhesive material on the planarization layers by roll pressing. Next, the support material is cut into multiple support layers corresponding one-to-one with the multiple planarization layers. Then, third through holes aligned with the second through holes are opened on the support layers. Finally, the window is embedded into the second through hole and fixed to the planarization layer. The fixing method includes, but is not limited to, bonding, to form a planarization material with a window. Since there is no adhesive material on the support layer, the third through hole can be opened by penetrating the support layer without penetrating the adhesive material, making the process of opening the third through hole less difficult. Furthermore, when opening the third through hole, it is not necessary to precisely align it with the boundary of the second through hole, nor is it necessary to ensure that the diameter of the third through hole is greater than or equal to the diameter of the second through hole, thus making the process window of the third through hole larger.

[0033] In one implementation of the first aspect, in the step of opening a third through hole aligned with the second through hole in the support material, the diameter of the third through hole is smaller than the diameter of the second through hole, and a portion of the support material is located within the range of the second through hole; in the step of embedding a window in the second through hole and fixing the window to the planarization layer, the window is fixedly connected to the portion of the support material.

[0034] In this implementation, by making the diameter of the third through hole smaller than that of the second through hole, and by making a portion of the support layer located within the range of the second through hole, a portion of the support layer can be used to support the window and bond it to the window, thereby improving the assembly reliability of the window.

[0035] In one implementation of the first aspect, in the step of providing a leveling layer, there are multiple leveling layers; in the step of disposing of adhesive material on the bonding surface of the at least one leveling layer, the adhesive material is disposed on the bonding surface of each leveling layer; in the step of bonding support material to the adhesive material on the at least one leveling layer, the support material is wound, and the wound support material is bonded to the adhesive material on each leveling layer by roll forming.

[0036] In this implementation, the support material can be a rolled film. In one example, the support material can be a long, continuously wound film, fed and transported as an uncut, continuous roll, comprising multiple consecutive units, each forming a support layer. Such a support material can meet the manufacturing needs of multiple planarization materials. Alternatively, in another example, the support material is a shorter wound film, which can only meet the manufacturing needs of a portion of the planarization materials, requiring replacement with new support material for continued planarization material manufacturing. This implementation defines a manufacturing method for mass production, bonding the wound support material to a large or small number of individually glued planarization layers in a single process using roll bonding. This implementation achieves continuous and scalable support layer bonding, simplifying the process, improving production efficiency, and enabling rapid mass production.

[0037] In one implementation of the first aspect, after the step of bonding the support material to the adhesive on the planarization layer, the manufacturing method further includes: cutting the support material into multiple support layers corresponding to multiple planarization layers, and obtaining multiple planarization materials.

[0038] In this implementation, after roll bonding, all planarization layers are bonded together by a single, continuous support material. At this point, a single cutting step allows this large support material to be cut into individual support layers according to the contours of each planarization layer, resulting in multiple independent, complete planarization materials. This cutting step is highly efficient, and because it involves "overall bonding first, then overall cutting," it ensures precise alignment between each formed support layer and the planarization layer beneath it. This step perfectly consolidates the preceding continuous, batch processes into multiple final planarization materials, avoiding the frequent single-piece handling, alignment, and assembly required in traditional methods, thus guaranteeing high-quality, high-consistency large-scale production.

[0039] Secondly, embodiments of this application provide a leveling material, comprising a leveling layer, an adhesive material, and a support layer stacked sequentially, wherein the adhesive material bonds the leveling layer and the support layer, and the leveling material is prepared using any of the manufacturing methods described above.

[0040] The leveling material in this embodiment is prepared using this manufacturing method. Since the adhesive is applied directly to the bonding surface of the leveling layer rather than the support layer, at the microscopic level, the adhesive can better wet, fill, and adhere to the microscopic contours and pores of the bonding surface of the leveling layer. This creates a mechanical interlock and a larger effective contact area between the adhesive and the leveling layer, resulting in a higher interfacial bonding strength between the adhesive layer and the bonding surface of the leveling layer compared to traditional methods. It also allows for a greater bonding strength between the adhesive layer and the leveling layer than between the adhesive layer and the support layer. This stronger interfacial bonding significantly reduces the risk of delamination, warping, or failure of the leveling material during subsequent use, transportation, or under process stress, ensuring product durability and improving product reliability and lifespan. Compared to traditional single-piece bonding, the continuous rolling process provides more stable process parameters, reducing human and environmental fluctuations. This helps ensure uniform bonding quality between the layers of each leveling material in mass production, improving quality consistency. The leveling pressure can be increased appropriately while avoiding delamination of the leveling material. Higher pressure usually means a higher material removal rate, thereby improving processing efficiency.

[0041] In one implementation of the second aspect, the smoothing layer includes a working surface and an adhesive surface facing away from the working surface, the adhesive being bonded between the adhesive surface and the support layer; the smoothing layer has a window that extends through the thickness direction of the smoothing layer, the window being exposed to the working surface, the window having a window surface facing away from the working surface, and the window being located on the side of the support layer facing the smoothing layer; the support layer has a first through hole, the projection of the first through hole along the thickness direction of the support layer onto the window surface overlaps with the window surface, and the window surface is exposed to the first through hole.

[0042] The leveling material in this implementation has a window, which can be integrated with the leveling layer or assembled into the leveling layer later. This implementation inherits the advantages of the basic solution of placing the adhesive material on the leveling layer and then bonding the supporting material to the adhesive material, resulting in stronger adhesion between the adhesive material and the leveling layer, better meeting the stringent adhesion requirements of the leveling layer. This advantage remains even after adding the window structure, ensuring the stability of the entire composite structure.

[0043] This implementation method successfully bypasses several technological challenges in traditional manufacturing (such as the difficulty in removing the anti-stick material and the need for high-precision alignment of the opening) by changing the application order of the adhesive and anti-stick material and altering the path for achieving the opening. This significantly improves manufacturing efficiency, yield, and structural reliability while preserving the product's superior performance. Specifically, this implementation method can achieve at least the following technical effects: For integrated window solutions, in traditional manufacturing, the anti-stick material is pressed between the planarization layer and the support layer, and can only be removed after a precise hole is drilled in the support layer. This results in a small process window and high difficulty. The proposed solution avoids the problem of "anti-stick material being pressed in the middle layer" by using the method of "masking first, then applying adhesive, and removing before bonding". It eliminates the need for very strict alignment when drilling holes, reduces the process accuracy requirements, expands the process window of the first through hole, and thus greatly improves production efficiency.

[0044] For post-assembly window solutions, traditional methods involve applying adhesive to the support layer. When creating the third through-hole, the adhesive must penetrate the support layer. Furthermore, to prevent adhesive residue from remaining within the second through-hole and affecting subsequent window bonding, precise alignment and a sufficiently large hole are essential. This proposed method, however, applies adhesive first to the planarization layer, eliminating the need for adhesive on the support layer. This significantly reduces the difficulty of creating the third through-hole, requiring only penetration of the support layer itself, without the need for precise alignment with the boundary of the second through-hole or ensuring the hole diameter is larger than the second through-hole. This expands the process window for the third through-hole and improves production efficiency.

[0045] In this implementation, the projection of the first through hole onto the window surface overlaps with the window surface. This ensures that the outer periphery of the window (i.e., the area of ​​the window surface not covered by the first through hole) is still supported by the support layer. This allows the support layer to provide additional structural support to the window, preventing the window from shifting or falling off during processing or use, thereby improving the mechanical reliability of the product.

[0046] In one implementation of the second aspect, the window is integral with the smoothing layer, and a portion of the adhesive material is located on the window, for example, on the window surface and / or side of the window.

[0047] This implementation adopts the integrated window scheme. Since the adhesive material is placed on the flattening layer, the adhesive that overflows during the formation of the adhesive material will be distributed on the window, thus forming the structural feature that "a part of the adhesive material is located on the window".

[0048] In one implementation of the second aspect, the planarization layer has a second through hole, the window is fixed in the second through hole, and a portion of the adhesive material is located on the hole wall of the second through hole.

[0049] This implementation adopts the post-installation window scheme. Since the adhesive material is placed on the planarization layer, the adhesive that overflows during the formation of the adhesive material will enter the hole wall of the second through hole of the planarization layer, thereby forming the structural feature that "a part of the adhesive material is located on the hole wall of the second through hole".

[0050] Thirdly, embodiments of this application provide a leveling material comprising a leveling layer, an adhesive, and a support layer stacked sequentially. The leveling layer includes a working surface and an adhesive surface facing away from the working surface. The adhesive is bonded between the adhesive surface and the support layer. The leveling layer has a window that extends through the thickness of the leveling layer and is exposed to the working surface. The window has a window surface facing away from the working surface and is located on the side of the support layer facing the leveling layer. The support layer has a first through hole, the projection of the first through hole along the thickness of the support layer onto the window surface overlaps with the window surface, and the window surface is exposed to the first through hole.

[0051] The preparation process of the planarizing material in the third aspect is not limited to the manufacturing methods described above. In the third aspect, the window in the planarizing material is light-transmitting. When the planarizing material is in operation, a light sensor can be installed below it. The window can transmit light emitted by the light sensor, which can illuminate the workpiece and be reflected back to the light sensor. By analyzing the interference pattern or spectral changes of the reflected light received by the light sensor, the planarization process of the workpiece can be monitored in real time. By making the projection of the first through-hole on the window surface overlap with the window surface, the outer periphery of the window, i.e., the area of ​​the window surface not covered by the first through-hole, is supported by the support layer. This allows the support layer to provide structural support to the window, preventing the window from shifting or falling off during processing or use, thereby improving the mechanical reliability of the product.

[0052] In one implementation of the third aspect, the window is integrated with the planarization layer, and a portion of the adhesive material is located on the window.

[0053] This implementation adopts an integrated window design, which offers the following advantages: the window and the planarization layer are firmly connected through chemical bonding (such as hydrogen bonds), rather than simple physical interlocking. This effectively prevents the window from detaching or separating during the planarization process. Since the window and planarization layer are chemically bonded rather than physically interfaced, ineffective light dissipation caused by physical interfaces is reduced, thereby improving the transmittance efficiency of endpoint detection light and facilitating accurate detection of the planarization endpoint. Process parameters (such as temperature and density) can be precisely controlled through single-piece casting, eliminating the need for subsequent slicing, grinding, and other post-processing. It fully preserves the functionality of both the window and the planarization layer, resulting in a stable product size and structure with uniform internal structure (such as void ratio and void size).

[0054] This integrated window solution can be adapted to advanced processes with extremely high requirements for planarization accuracy and optical inspection consistency.

[0055] In this implementation, the adhesive material can be initially placed on the planarization layer. When the adhesive material is formed, the overflowing adhesive will be distributed on the window, for example, on the surface or side of the window, thus forming the structural feature that "a part of the adhesive material is located on the window".

[0056] In one implementation of the third aspect, the planarization layer has a second through hole, the window is fixed in the second through hole, and a portion of the adhesive material is located on the hole wall of the second through hole.

[0057] In this implementation, the window can be installed into the leveling layer later. This later-installation approach offers the following advantages: Since it avoids methods like hot-melt or vibration-assisted fusion where windows are placed within the leveling layer, the leveling layer will not deform due to high temperature or high-frequency vibration, which is crucial for maintaining the flatness and precision of the leveling material. Furthermore, the later-installation approach allows for the installation of windows with different microstructures or properties into the leveling layer according to process requirements, thus satisfying more diverse process needs.

[0058] In this implementation, the adhesive material can be initially placed on the planarization layer. When the adhesive material is formed, the overflowing adhesive will enter the wall of the second through hole of the planarization layer, thereby forming the structural feature that "a part of the adhesive material is located on the wall of the second through hole".

[0059] Fourthly, embodiments of this application provide a leveling device, including a machine base and a leveling material as described above, wherein the support layer of the leveling material is fixed to the machine base, and the working surface of the leveling layer faces away from the machine base.

[0060] In this embodiment, the leveling equipment uses the leveling material to level the workpiece. Because it uses a relatively reliable, durable and high-precision leveling material, the leveling equipment has high processing accuracy and operational reliability, which can meet manufacturing requirements.

[0061] In one implementation of the fourth aspect, the leveling device further includes a processing head that is opposite to the leveling material and faces the working surface.

[0062] In this implementation, the processing head is used to fix the workpiece, and in some examples, it can also rotate relative to the machine tool. The workpiece is positioned on one side by the processing head, and the leveling material is positioned on the opposite side by the machine tool. Thus, leveling can be achieved through the coordinated operation of the processing head and the machine tool.

[0063] Fifthly, embodiments of this application provide a component obtained after planarization treatment using the planarization material. This component can be a semiconductor device, i.e., a device that utilizes the unique electrical properties of semiconductor materials to achieve specific functions, its core relying on the movement and control of "holes" and "electrons" within the semiconductor material. Semiconductor devices include, but are not limited to, wafers, logic chips, memory chips, power semiconductor devices, microelectromechanical systems (MEMS), complementary metal-oxide-semiconductor (CMOS) image sensors, etc. Alternatively, this component can be an electronic device, i.e., an element in a circuit capable of controlling, transforming, amplifying, storing, or transmitting current, voltage, or signals. Electronic devices include, but are not limited to, packaging substrates, interposers, optical devices, optoelectronic devices, radio frequency devices, storage components (e.g., hard disk platters, magnetic head sliders, etc.), sensors, etc. Semiconductor devices are a type of electronic device. Alternatively, this component can be a component in the field of optics, such as optical glass, sapphire wafers, piezoelectric glass, crystal glass elements, photomasks, etc. Alternatively, the component can be made of metal or ceramic materials, or other materials such as zinc selenide or fiber optic ceramic ferrules.

[0064] The component in this application embodiment undergoes a planarization process using this planarization material. Due to the high reliability, durability, and precision of this planarization material, the component achieves a better microscopic surface quality. For example, when the planarization material is manufactured using the manufacturing method of this application embodiment, the component treated with this planarization material has the following advantages: Because the bonding strength between the planarization layer and the adhesive is greater, the risk of the component surface peeling or detaching entirely due to shear force during the planarization process is effectively reduced, resulting in fewer scratches and defects on the component surface and a higher yield. Furthermore, the increased bonding strength helps suppress micro-vibrations of the planarization layer during high-speed rotation, ensuring more uniform pressure applied by the abrasive grains to the component surface, thereby improving the uniformity of material removal and ultimately resulting in better surface uniformity of the component. Attached Figure Description

[0065] Figure 1 This is a schematic diagram illustrating the working principle of planarizing materials for wafer planarization. Figure 2 yes Figure 1 A partial cross-sectional structural diagram of the planarized material in the image; Figure 3 This is a process flow diagram of a method for manufacturing leveling materials; Figure 4This illustrates the principle of a pretreatment process for removing dust from the bonding surface of a flattening layer in the step of providing a flattening layer in a manufacturing method of one embodiment. Figure 5 This illustrates the principle of a pretreatment process in which the bonding surface of the planarization layer is preheated during the step of providing a planarization layer in a manufacturing method of one embodiment. Figure 6 This illustrates a process principle of a manufacturing method according to an embodiment, which involves placing an adhesive material on the bonding surface of a planarized layer. Figure 7 This illustration illustrates a process principle of a manufacturing method in one embodiment, which involves bonding a support material to an adhesive on a planarization layer. Figure 8 This illustrates a manufacturing method in one embodiment, in which the prepared planarized material undergoes a pressure-holding process. Figure 9 This is a cross-sectional view of the planarization layer and the anti-adhesion material in another embodiment; Figure 10 for Figure 9 A schematic diagram of the structure shown from below; Figure 11 A cross-sectional view of the planarization layer, adhesive material, and anti-adhesive material with a window is shown in one embodiment of the manufacturing method after the step of applying adhesive material to the bonding surface of the planarization layer. Figure 12 for Figure 11 A cross-sectional view of the structure after the anti-adhesive material has been removed. Figure 13 In one embodiment of the manufacturing method, after the step of bonding the support material to the adhesive on the planarization layer, the support layer and the planarization layer are bonded together by the adhesive, as shown in the cross-sectional view. Figure 14 In order to be in Figure 13 A cross-sectional view of the support layer after the first through hole is opened; Figure 15 This is a cross-sectional view of a planarization layer with a second through hole in another embodiment. Figure 16 In another embodiment, a cross-sectional view of the leveling layer and the adhesive material is shown after the step of placing the adhesive material on the bonding surface of the leveling layer. Figure 17 In another embodiment, a cross-sectional view of the leveling layer, adhesive material, and support layer is shown after the step of bonding the support material to the adhesive material on the leveling layer. Figure 18 In order to be in Figure 17A cross-sectional view of the support layer with a third through hole aligned with the second through hole of the planarization layer. Figure 19 In order to be in Figure 18 A cross-sectional view showing a window embedded in the second through hole and bonded to a planarization layer, etc.

[0066] Explanation of reference numerals in the attached figures: 1-Leveling equipment; 10-Processing head; 20-Processing object; 30-Leveling material; 40-Machinery; 50-Leveling liquid; 60-Nozzle; 70-Dust-adhesive roller; 80-Plate; 90-Heating device; 100-Container; 110-Heating roller; 120-Receiving tank; 130-Coating roller; 131-First lowest point; 140-Equalizing roller; 141-Second lowest point; 150-Conveyor belt; 160-Core; 170-Supporting material; 180-Intermediate roller; 190-Conveying roller; 191-Third lowest point; 200-Extrusion roller; 201-Highest point; 210-Flat plate pressure-holding fixture; 31-Smoothing layer; 311-Working surface; 312-Bonding surface; 313-Micropore; 314-Groove; 315-Second through hole; 3151-First hole; 3152-Second hole; 316-Step surface; 32-Adhesive material; 33-Support layer; 331-First surface; 332-Second surface; 333-First through hole; 334-Partial portion; 335-Third through hole; 34 - Adhesive backing layer; 35-Window; 351-Window surface; 352-First part; 353-Second part; 36 - Anti-stick material; 37 - Adhesive layer; P - Pressure; D - Thickness direction. Detailed Implementation

[0067] To make it easier to understand, the following will be combined with Figures 1-2 Explain the application scenarios, basic structure, and working principle of leveling materials.

[0068] Figure 1 This is a schematic diagram illustrating the working principle of the leveling device 1 in one embodiment for leveling the workpiece 20.

[0069] like Figure 1 As shown, the leveling equipment 1 may include a machine base 40, a leveling material 30, and a processing head 10, etc. The leveling material 30 may be fixed to the machine base 40, and the processing head 10 may be opposite to the leveling material 30. In one example, in Figure 1From one perspective, the machine tool 40 and the leveling material 30 can be positioned below, while the processing head 10 can be positioned above. In another example, the machine tool 40 and the leveling material 30 can be positioned above, while the processing head 10 can be positioned below.

[0070] like Figure 1 As shown, the processing object 20 includes, but is not limited to, semiconductor devices, electronic devices, optical components, substrate materials, metal materials, or other parts to be processed. The planarizing material 30 can be or is approximately a circular sheet structure, which facilitates its bonding to the disc-shaped machine tool 40. It is understood that the above-described shapes of the planarizing material 30 and the machine tool 40 are merely examples, and the embodiments of this application do not limit them.

[0071] Figure 2 for Figure 1 A schematic cross-sectional view of the planarizing material 30. (See diagram below.) Figure 2 As shown, the leveling material 30 may include a leveling layer 31, an adhesive 32, a support layer 33, and an adhesive backing layer 34, which are stacked in sequence.

[0072] like Figure 2 As shown, for ease of description, the thickness direction D of the leveling material 30 can be defined. The thickness direction D of the leveling material 30 can be the stacking direction of the leveling layer 31, adhesive material 32, support layer 33, and backing adhesive layer 34. The thickness directions of the leveling layer 31, adhesive material 32, support layer 33, and backing adhesive layer 34 can be consistent with or substantially consistent with the thickness direction D of the leveling material 30.

[0073] like Figure 2 As shown, the leveling layer 31 may include a working surface 311 and an adhesive surface 312 facing away from the working surface 311. The side where the working surface 311 is located can be called the working side. The working side may have multiple grooves 314 and multiple micropores 313. The grooves 314 may form openings on the working surface 311, and the grooves 314 may be arranged in a certain pattern. The grooves 314 can serve as macroscopic delivery channels for the leveling fluid, ensuring that the leveling fluid can be quickly and evenly distributed to the entire working surface 311 and carrying away the debris generated during the leveling process. The micropores 313 are microporous structures that can be distributed throughout the entire working side, for example, they can be formed on the bottom and side walls of the grooves 314 and on the protrusions between the grooves 314. The micropores 313 can be used to store the leveling fluid and abrasive particles, and continuously and stably release the leveling fluid and abrasive particles to the workpiece 20 and the working surface 311 during the leveling process to maintain the continuous chemical reaction and the stability of the mechanical grinding. The micropores 313 can also increase the elasticity of the planarization layer 31, helping to buffer pressure and reduce scratches. Understandably, Figure 1 The arrangement, relative size, number, and structure of the micropores 313 and grooves 314 shown are merely illustrative and are not intended to limit the embodiments of this application.

[0074] like Figure 2 As shown, the support layer 33 may include a first surface 331 facing the planarization layer 31 and a second surface 332 facing away from the planarization layer 31. The first surface 331 may be bonded to the bonding surface 312 via the adhesive 32, and the second surface 332 may be bonded to the machine base 40 via the backing adhesive layer 34.

[0075] Combination Figure 1 and Figure 2 As shown, the leveling material 30 can be adhered to the machine base 40 via the adhesive backing layer 34, with the working surface 311 of the leveling layer 31 facing away from the machine base 40. The workpiece 20 is fixed to the processing head 10 and faces the working surface 311.

[0076] Combination Figure 1 and Figure 2 As shown, during the leveling process, the nozzle 60 above the machine tool 40 can spray leveling liquid 50 onto the working surface 311. The leveling liquid 50 can enter the micropores 313 and grooves 314 of the leveling layer 31. The processing head 10 can apply a certain pressure P to keep the workpiece 20 in contact with the working surface 311 of the leveling layer 31. The machine tool 40 and the processing head 10 can rotate in opposite directions, causing the leveling layer 31 and the workpiece 20 to rub against each other. During this process, the leveling liquid 50 can chemically react with the workpiece 20 to generate a softening layer, which is then removed by mechanical friction. This synergistic effect of chemical corrosion and mechanical abrasion can achieve the removal of nanoscale materials, ultimately leveling the surface of the workpiece 20. It is understood that the process equipment described above working with the leveling material 30 is merely an example, and the embodiments of this application do not limit the application scenarios of the leveling material 30.

[0077] refer to Figure 1 and Figure 2 As shown, in some embodiments, a light sensor may be provided below the planarizing material 30, and the planarizing material 30 may have a window. The window may have high light transmittance, wear resistance, corrosion resistance, and mechanical stability. The window allows light emitted by the light sensor to pass through, which can illuminate the workpiece 20 and be reflected back to the light sensor by the workpiece 20. By analyzing the interference pattern or spectral changes of the reflected light received by the light sensor, the planarization process of the workpiece 20 can be monitored in real time.

[0078] The manufacturing method of the leveling material 30 according to the embodiments of this application will be described in detail below.

[0079] refer to Figure 3 As shown, this application embodiment provides a method 300 for manufacturing a planarizing material 30. Figures 4-8 They respectively indicate the relationship with Figure 3The process principle diagram corresponding to the corresponding step in manufacturing method 300.

[0080] refer to Figure 3 As shown, manufacturing method 300 includes: Step S10: Provide multiple leveling layers, wherein each leveling layer includes a working surface and an adhesive surface disposed opposite to the working surface.

[0081] Step S20: Apply the adhesive to the bonding surface of each smoothing layer; Step S30: The continuously wound support material is bonded to the adhesive material on each leveling layer by roller pressing; Step S40: Cut the support material into multiple support layers that correspond one-to-one with the multiple planarization layers, and obtain multiple planarization materials.

[0082] The following will explain each point in detail.

[0083] refer to Figure 1 and Figure 2 As shown, exemplarily, in step S10, multiple planarization layers 31 can be manufactured using appropriate manufacturing processes. Each planarization layer 31 can be a circular disc structure. The working surface 311 of the planarization layer 31 may have micropores 313 and grooves 314 on one side. The adhesive surface 312 of the planarization layer 31 is used to bond it to the support layer 33 via adhesive 32. It is understood that multiple planarization layers 31 can be arranged sequentially and spaced apart on a conveyor belt, which can transport the multiple planarization layers 31 along a set direction for subsequent steps.

[0084] For example, step S10 may include a pretreatment process for the planarization layer 31.

[0085] Figure 4 and Figure 5 This diagram illustrates a pretreatment process principle for the planarization layer 31. (See attached diagram.) Figure 4 and Figure 5 As shown, step S10 may include: Step S11: Please refer to Figure 4 The working surface 311 of the leveling layer 31 can be fixed to the pad 80, for example, by adhering it to the pad 80 with peelable double-sided adhesive. The pad 80 can be, for example, a rigid pad to provide sufficient support for the leveling layer 31; the shape of the pad 80 can be determined according to product requirements. A dust roller 70 is used to remove dust from the bonding surface 312 of the leveling layer 31. The design of the dust roller 70 for removing dust from the bonding surface 312 ensures the cleanliness of the bonding surface 312.

[0086] Step S12: Please refer to Figure 5The bonding surface 312 of the smoothing layer 31 is preheated using a heating device 90 to facilitate the subsequent application of adhesive material to the bonding surface 312. The heating device 90 includes, but is not limited to, an infrared heating device.

[0087] It is understood that steps S11 and S12 are pretreatment steps set according to process requirements. In another embodiment, manufacturing method 300 may also exclude steps S11 and S12.

[0088] In step S20, the adhesive material disposed on the bonding surface 312 includes, but is not limited to, solid adhesive materials or liquid adhesive materials. Solid adhesive materials may be, for example, adhesive films or tapes; liquid adhesive materials may be, for example, liquid ordinary reactive adhesives, which are liquid at room temperature and can be cured into solid states; or, liquid adhesive materials may be, for example, reactive hot melt adhesives that have been heated to a liquid state and can be cured into solid states. In step S20, the method by which the adhesive material is disposed on the bonding surface 312 can be selected according to process requirements, including but not limited to direct bonding, coating, or application.

[0089] Figure 6 This illustrates a process principle diagram corresponding to step S20. For example... Figure 6 As shown, exemplarily, step S20 may include: Step S21: Apply the liquid adhesive 32 to the bonding surface 312 of each planarization layer 31. Here, "liquid adhesive 32" means that the adhesive 32 is liquid during the coating step, and it can also remain liquid after being applied to the bonding surface 312. This embodiment limits the adhesive 32 to be liquid, and it can be applied to the bonding surface 312 using a coating process, but it does not limit the specific type of adhesive 32. For example, the adhesive 32 can be a liquid reactive hot melt adhesive. In this embodiment, the liquid adhesive 32 can better conform to the microscopic contours of the bonding surface 312, resulting in a tighter bond between the adhesive 32 and the bonding surface 312. In another embodiment, the adhesive 32 can also be a solid adhesive, such as a pressure-sensitive adhesive, which can be directly adhered to the bonding surface 312.

[0090] For example, step S21 may include: Step S22: Please refer to Figure 6A liquid reactive hot melt adhesive is contained between a heating roller 110 and a coating roller 130, and the liquid reactive hot melt adhesive is heated by the heating roller 110 and the coating roller 130 to maintain or adjust the temperature of the liquid reactive hot melt adhesive. Exemplarily, the heating roller 110 and the coating roller 130 may form a receiving groove 120 for containing the liquid reactive hot melt adhesive. The liquid reactive hot melt adhesive may be stored in a container 100 and conveyed from the container 100 to the receiving groove 120 formed by the heating roller 110 and the coating roller 130. The type of heating roller 110 can be determined according to product needs; for example, it may be a mirror steel roller, which is rigid and its surface cannot be elastically compressed. The type and characteristics of the coating roller 130 are not limited. The heating roller 110 and the coating roller 130 can rotate in opposite directions; for example, the heating roller 110 can rotate clockwise, and the coating roller 130 can rotate counterclockwise, so that the reactive hot melt adhesive is transferred from the coating roller 130 to the bonding surface 312. The reactive hot melt adhesive is an adhesive that is melted into a liquid state by heating and then cured by natural cooling. The curing time of the reactive hot melt adhesive can be, for example, less than 10 minutes.

[0091] Step S23: Please refer to Figure 6 This causes each leveling layer 31 to pass sequentially through the heating roller 110 and the coating roller 130, and the liquid reactive hot melt adhesive is coated onto the bonding surface 312 of each leveling layer 31 by the coating roller 130.

[0092] like Figure 6 As shown, exemplarily, in step S23, the leveling layer 31 can be placed on the conveyor belt 150. For example, the working surface 311 can be fixed to the pad 80 and the pad 80 can be placed on the conveyor belt 150. The conveyor belt 150 can move the pad 80 and the leveling layer 31 thereon, and pass them sequentially through the heating roller 110 and the coating roller 130. When the leveling layer 31 moves below the coating roller 130, the coating roller 130 transfers the reactive hot melt adhesive on its surface to the bonding surface 312.

[0093] like Figure 6 As shown, for example, the tangential direction of the movement of the first lowest point 131 of the coating roller 130 can be consistent with the direction of movement of the leveling layer 31. For example, the leveling layer 31 can move from left to right, and the coating roller 130 can rotate counterclockwise. This movement mode ensures that the rotational movement of the coating roller 130 does not hinder the movement of the leveling layer 31.

[0094] like Figure 6As shown, exemplarily, the coating roller 130 can be elastic. For example, the inner core of the coating roller 130 can be a rigid material, such as steel; the outer periphery of the inner core of the coating roller 130 is wrapped with an elastic material, such as rubber, which allows the surface of the coating roller 130 to be elastically compressed. Exemplarily, in step S23, the coating roller 130 can elastically press against the leveling layer 31. For example, the bottom of the coating roller 130 can be lower than the adhesive surface 312 of the leveling layer 31, so that when the coating roller 130 contacts the leveling layer 31, the circumferential surface of the coating roller 130 can elastically deform and compress the leveling layer 31. By making the coating roller 130 elastic and elastically pressing against the leveling layer 31, it is beneficial for the reactive hot melt adhesive on the coating roller 130 to be transferred to the bonding surface 312 more quickly and fully, and for the coating roller 130 to conform to the micro-contour of the bonding surface 312, thereby reducing air bubbles on the bonding surface 312, which is beneficial to improving the coating efficiency and coating quality; it can also prevent damage to the leveling layer 31 when the coating roller 130 presses against the leveling layer 31.

[0095] Step S24: Please refer to Figure 6 The reactive hot melt adhesive on the bonding surface 312 of each leveling layer 31 is heated and smoothed by the leveling roller 140.

[0096] like Figure 6 As illustrated, exemplarily, in step S24, the tangential direction of the movement of the second lowest point 141 of the distribution roller 140 can be opposite to the movement direction of the leveling layer 31. For example, the leveling layer 31 can move from left to right, and the distribution roller 140 can rotate counterclockwise. This movement facilitates the distribution roller 140 applying shear force to the reactive hot melt adhesive on the bonding surface 312 to level the reactive hot melt adhesive. The distribution roller 140 heats the reactive hot melt adhesive, which can maintain or adjust the temperature of the liquid reactive hot melt adhesive.

[0097] It is understood that step S24 can make the reactive hot melt adhesive smoother; this is just an illustrative example. Depending on product requirements, in another embodiment, step S20 may not include step S24.

[0098] like Figure 6As shown, exemplarily, in step S20, the amount of adhesive applied can be adjusted by regulating the temperatures of the heating roller 110 and the coating roller 130, the distance between the heating roller 110 and the coating roller 130, the height of the coating roller 130 relative to the leveling layer 31, the rotation speed of the coating roller 130, and the moving speed of the leveling layer 31. For example, under constant conditions, within a certain range, the higher the temperature of the heating roller 110 and the coating roller 130, the lower the viscosity of the reactive hot melt adhesive, and the smaller the amount of adhesive adhering to the coating roller 130, resulting in a smaller amount of adhesive transferred from the coating roller 130 to the bonding surface 312. For example, the larger the distance between the heating roller 110 and the coating roller 130, the thicker the reactive hot melt adhesive covering the surface of the coating roller 130, resulting in a larger amount of adhesive applied to the bonding surface 312. For example, when the bottom of the coating roller 130 is lower than the bonding surface 312 of the leveling layer 31, the lower the height of the coating roller 130 relative to the leveling layer 31, the easier it is to press and contact the bonding surface 312, resulting in a larger amount of adhesive transferred from the coating roller 130 to the bonding surface 312. For example, the faster the rotation speed of the coating roller 130, the faster the adhesive application speed, resulting in a larger amount of adhesive applied to the bonding surface 312. For example, the slower the moving speed of the leveling layer 31, the longer the residence time of the coating roller 130 on the bonding surface 312, resulting in a larger amount of adhesive applied to the bonding surface 312.

[0099] like Figure 6 As shown, in this embodiment, the adhesive 32 is a liquid reactive hot melt adhesive. The adhesive strength, modulus, and elasticity of the reactive hot melt adhesive after curing meet product requirements. The temperature of the reactive hot melt adhesive is maintained using a heating roller 110 and a coating roller 130, and the coating roller 130 is used to transfer the molten reactive hot melt adhesive to the bonding surface 312. This process is relatively mature and the amount of adhesive applied is easy to control. In another embodiment, the adhesive 32 may not be a liquid reactive hot melt adhesive; for example, it may be a reactive adhesive that is liquid at room temperature. Alternatively, the adhesive 32 can be coated using other tools such as a scraper, nozzle, or slot die.

[0100] In step S30, "roller bonding" refers to conveying the continuously wound support material to the corresponding position of the adhesive 32 on each leveling layer through a rotating roller, and pressing the leveling layer to bond the support material to the adhesive 32 on the leveling layer 31.

[0101] Figure 7 This illustrates a process principle diagram corresponding to step S30. For example... Figure 7 As shown, exemplarily, step S30 may include: Step S31: The support material 170 is aligned with the reactive hot melt adhesive on each leveling layer 31 by the conveying roller 190, and each leveling layer 31 is squeezed from the side opposite to the reactive hot melt adhesive by the extrusion roller 200, so that the support material 170 is bonded to the reactive hot melt adhesive on each leveling layer 31. Here, "alignment" means conveying the support material 170 to the position corresponding to the reactive hot melt adhesive above the leveling layer 31 and aligning the support material 170 with the reactive hot melt adhesive. It can be understood that... Figure 7 The illustration only shows the support material 170 bonded to the reactive hot melt adhesive on one planarization layer 31. In fact, in the embodiments of this application, the support material 170 is continuously bonded to multiple planarization layers 31.

[0102] like Figure 7 As shown, exemplarily, in step S31, the conveying roller 190 and the extrusion roller 200 can rotate in opposite directions. For example, the conveying roller 190 can rotate counterclockwise, and the extrusion roller 200 can rotate clockwise. The opposite rotation directions of the conveying roller 190 and the extrusion roller 200 ensure that the tangential direction of the conveying roller 190 at its third lowest point 191 is consistent with the tangential direction of the extrusion roller 200 at its highest point 201, making the extrusion process more stable. Both the tangential direction of the conveying roller 190 at its third lowest point 191 and the tangential direction of the extrusion roller 200 at its highest point 201 can be consistent with the moving direction of the leveling layer 31, ensuring that the rotational movement of the conveying roller 190 and the extrusion roller 200 does not hinder the movement of the leveling layer 31.

[0103] like Figure 7 As shown, the type of conveyor roller 190 can be determined according to product requirements. For example, it can be a mirror-finish steel roller, which is rigid and its surface cannot be elastically compressed. The smooth surface of the mirror-finish steel roller is beneficial to improving the conveying and bonding efficiency of the support material 170. The type of extrusion roller 200 can be determined according to product requirements. For example, the inner core of the extrusion roller 200 can be a rigid material, such as steel; the outer periphery of the inner core of the extrusion roller 200 is wrapped with an elastic material, such as rubber, which allows the surface of the extrusion roller 200 to be elastically compressed. In another embodiment, the conveyor roller 190 can be a roller with a rigid inner core and an elastic outer periphery, and the extrusion roller 200 can be a mirror-finish steel roller, or the types of the conveyor roller 190 and the extrusion roller 200 are not limited to these.

[0104] like Figure 7As shown, exemplarily, in step S31, the support material 170 can be wound around the outer periphery of the core 160 and transferred to the conveyor roller 190 via the intermediate roller 180. The core 160, the intermediate roller 180, and the conveyor roller 190 can rotate in the same direction, so that the support material 170 is continuously conveyed over the reactive hot melt adhesive via the intermediate roller 180 and the conveyor roller 190.

[0105] like Figure 7 As shown, exemplarily, in step S31, the reactive hot melt adhesive on each leveling layer 31 can be heated by the conveyor roller 190. By enabling the conveyor roller 190 to have a heating function, the viscosity and bonding temperature of the reactive hot melt adhesive before bonding with the support material 170 can be adjusted to improve the penetration of the reactive hot melt adhesive into the pores on the surface of the support material 170, thereby improving the bonding strength between the leveling layer 31 and the support material 170. Alternatively, the reactive hot melt adhesive on each leveling layer 31 can be heated by a dedicated heating device to adjust the viscosity and bonding temperature of the reactive hot melt adhesive before bonding with the support material 170. In another embodiment, if necessary, the reactive hot melt adhesive on each leveling layer 31 may not be heated in step S31.

[0106] refer to Figure 7 As shown, in one embodiment, the surface of the support material 170 facing the core 160 may be pre-integrated with an adhesive material. For example, the adhesive material may be PSA, and the surface of the adhesive material may be covered with a protective film. In step S31, the adhesive material may be transferred synchronously to the planarization layer 31 along with the support material 170.

[0107] In another embodiment, the surface of the support material 170 facing the core 160 may not have adhesive material. Instead, adhesive material is applied to the surface of the support layer 33 facing away from the planarization layer 31 by adding step S32 between steps S31 and S40. (See reference) Figure 7 As shown, exemplarily, in step S32, continuously wound adhesive material is rolled and bonded to the surface of the support material 170 facing away from the planarization layer 31. The adhesive material may be, for example, PSA, and the surface of the adhesive material may be covered with a protective film.

[0108] refer to Figure 2 and Figure 7 As shown, for example, in step S40, "one-to-one correspondence" means that each support layer 33 cut from the support material 170 corresponds to a planarization layer 31, and the projection of each support layer 33 along the thickness direction D of the support layer 33 onto its corresponding planarization layer 31 overlaps with the planarization layer 31.

[0109] refer to Figure 2 and Figure 7As shown, for example, in step S40, the support material 170 can be cut by die-cutting. Die-cutting is a processing method that uses a precision die to quickly and accurately cut continuous material into a specific outer contour shape through stamping. This method can improve cutting efficiency and ensure that each support layer 33 is accurately aligned with its corresponding planarization layer 31.

[0110] refer to Figure 2 and Figure 7 As shown, exemplarily, in step S40, while cutting the support material 170 into multiple support layers 33, the adhesive material on the support material 170 and the protective film on the surface of the adhesive material can also be cut into multiple adhesive backing layers 34 and protective layers corresponding one-to-one with the multiple support layers 33. Combined with... Figure 1 As shown, when it is necessary to fix the leveling material 30 to the machine base 40, the protective layer can be removed, and the leveling material 30 can be bonded to the machine base through the adhesive backing layer 34.

[0111] For example, after step S40, the manufacturing method 300 may further include: Step S50: Please refer to Figure 8 Each leveling material 30 is subjected to a pressure-holding treatment. The pressure and holding time can be determined according to product requirements. For example, the leveling material 30 can be pressure-held using a flat pressure-holding fixture 210. The pressure applied by the flat pressure-holding fixture 210 can be within 5 MPa, for example, 1 MPa, 2 MPa, 5 MPa, etc.; the holding time can be within 60 minutes, for example, 10 minutes, 30 minutes, 60 minutes, etc. By holding the leveling material 30 under pressure in the flat pressure-holding fixture 210 for a period of time, it is beneficial to avoid warping of the support layer 33 and the leveling layer 31, and to ensure its bonding strength within the open time of the reactive hot melt adhesive, thereby improving the bonding tightness between the leveling layer 31 and the support layer 33. In another embodiment, the leveling material 30 may not be subjected to a pressure-holding treatment.

[0112] The traditional manufacturing method for the leveling material 30 involves first pre-die-cutting the continuously wound support material 170 into support layers 33 and fixing them, then applying adhesive 32 to the support layers 33, and finally bonding the leveling layer 31 to the support layers 33. This process, which involves cutting the continuously wound support material into multiple support layers 33 and then bonding each support layer 33 to a leveling layer 31 individually, is cumbersome and difficult to implement for continuous and batch production. Furthermore, the support material is relatively soft, making its fixing troublesome and requiring special fixtures. The assembly and disassembly of these fixtures are complex and can increase costs. To prevent the support material from bonding to the fixture, liner paper or other consumables are also needed between them. In summary, the traditional manufacturing method is complex and has low production efficiency.

[0113] Unlike traditional manufacturing methods, in the manufacturing method 300 of this application embodiment, adhesive material 32 is first placed on multiple planarization layers 31. Then, continuously wound support material 170 is bonded to the adhesive material 32 on each planarization layer 31 by roll forming. The support material 170 is then cut into multiple support layers 33 corresponding one-to-one with the multiple planarization layers 31, resulting in multiple planarization materials 30. Compared to traditional manufacturing methods, the manufacturing method 300 of this application embodiment does not require pre-die-cutting and fixing of the continuously wound support material 170. Instead, it uses roll forming to bond the continuously wound support material 170 to multiple planarization layers 31 in one step, significantly simplifying the process and improving production efficiency. Furthermore, it avoids the fixing process of the support material 170, thus eliminating the need for special fixtures and backing paper, simplifying the process, improving production efficiency, and reducing costs. In addition, based on the adhesive properties of the adhesive material 32, the adhesive material 32 is pre-placed on the smoothing layer 31 instead of the support layer 33, which can make the adhesive material 32 and the smoothing layer 31 have a larger adhesive force. This can meet the high requirements of the smoothing layer 31 for adhesive force such as hardness and roughness, and can improve the problem of separation between the adhesive material 32 and the smoothing layer 31.

[0114] Understandable Figures 3-8 The illustrated embodiment uses the manufacture of a flattened material 30 without windows as an example; this is merely an illustrative example. In other embodiments, the flattened material 30 may have a light-transmitting window. The manufacturing method of a flattened material 30 with a window is described below with reference to the accompanying drawings.

[0115] Figure 9 This is a cross-sectional view of the planarization layer 31 and the anti-sticking material 36 in another embodiment. Figure 10 for Figure 9 The diagram shown is a bottom view of the structure.

[0116] like Figure 9 As shown, in step S10, each leveling layer 31 may have a window 35 integrally connected to the leveling layer 31, and the window 35 has a window surface 351 facing away from the working surface 311. For example, the window 35 can be embedded into the leveling layer 31 to form an integral structure by integral casting.

[0117] like Figure 9 As shown, for example, the window surface 351 may protrude from the adhesive surface 312. In another embodiment, the window surface 351 may also be flush with the adhesive surface 312, or the window surface 351 may also be recessed relative to the adhesive surface 312.

[0118] like Figure 9As shown, exemplarily, window 35 may include a first portion 352 and a second portion 353, and along the thickness direction D of window 35, the projection of the first portion 352 onto the second portion 353 may fall within the range of the second portion 353. This type of window 35 may be referred to as a "T-shaped" window. By making window 35 "T-shaped," corresponding product requirements can be met. In another embodiment, window 35 may also be rectangular or other shapes that meet the requirements.

[0119] Between step S10 and step S20, the manufacturing method further includes: Step S60: See Figure 9 and Figure 10 As shown, an anti-adhesive material 36 is used to cover the window surface 351 of each window 35 to prevent the adhesive material 32 from covering the window surface 351 in subsequent steps. For example, the anti-adhesive material 36 can be a sheet material, such as a peelable single-sided adhesive, with one side of the anti-adhesive material 36 adhering to the window surface 351 and the other side having anti-adhesive properties. Figure 10 In the figure, 31 (312) is used to represent the bonding surface 312 of the smoothing layer 31, and 35 (351) is used to represent the window surface 351 of the window 35. The following similar reference numerals indicate similar meanings.

[0120] Step S20 in this embodiment can be referred to the description above, and will not be repeated here. Figure 11 As shown, after step S20, the adhesive surface 312 of the smoothing layer 31 is covered with adhesive material 32, while the anti-adhesive material 36 is not covered with adhesive material 32.

[0121] Between step S20 and step S30, the manufacturing method further includes: Step S70: Please refer to Figure 11 and Figure 12 Remove the anti-stick material 36 from each window 35. This embodiment does not limit the specific method of removing the anti-stick material 36.

[0122] Steps S30 and S40 in this embodiment can be referred to the description above, and will not be repeated here. Figure 13 As shown, after steps S30 and S40, the support layer 33 and the flattening layer 31 are bonded together by the adhesive 32, and there is no adhesive 32 on the window surface 351.

[0123] refer to Figure 8 As shown, for example, after step S40, the manufacturing method may further include step S50. The specific process can be referred to above and will not be repeated here.

[0124] After step S40 or step S50, the manufacturing method further includes: Step S80: Please refer to Figure 13 and Figure 14 A first through-hole 333 is formed on each support layer 33, such that the projection of the first through-hole 333 along the thickness direction D of the support layer 33 onto the window surface 351 overlaps with the window surface 351. The projected area of ​​the first through-hole 333 on the window surface 351 is not limited; for example, the projected area can be smaller than or equal to the area of ​​the window surface 351. For example, the axis of the first through-hole 333 can coincide with or approximately coincide with the axis of the window 35, thus aligning or approximately aligning the first through-hole 333 with the window 35. Alternatively, there can be a large gap between the axis of the first through-hole 333 and the axis of the window 35, thus offsetting the first through-hole 333 relative to the window 35. This embodiment does not limit the specific method of forming the first through-hole 333; for example, the first through-hole 333 can be formed by processes such as punching, laser cutting, or etching.

[0125] like Figure 14 As shown, exemplarily, in step S80, along the thickness direction D of the support layer 33, the projection of the first through hole 333 onto the window surface 351 can fall within the area of ​​the window surface 351. Here, "the projection falls within the area of ​​the window surface 351" does not include the boundary of the window surface 351; that is, the projection of the first through hole 333 falls within the boundary of the window surface 351, and the projected area of ​​the first through hole 333 is smaller than the area of ​​the window surface 351. This allows the outer periphery of the window 35 to be supported by the support layer 33, improving the mechanical reliability of the window 35. In another embodiment, the relationship between the projection of the first through hole 333 and the boundary of the window surface 351 is not limited, as long as the projection of the first through hole 333 overlaps with the window surface 351.

[0126] Combination Figure 1 and Figure 14 As shown, by opening the first through hole 333, light from below the leveling material 30 can pass through the window 35 to illuminate the workpiece 20 on the leveling material 30, and light reflected from the workpiece 20 can pass through the window 35, so as to realize the monitoring of the leveling process.

[0127] Combination Figures 9-14 As shown, in the manufacturing method of this embodiment, the window 35 is integrated with the flattening layer 31. After the window surface 351 is covered with the anti-adhesive material 36, the adhesive material 32 is placed on multiple flattening layers 31. Then the anti-adhesive material 36 is removed. Then the continuously wound support material 170 is bonded to the adhesive material 32 on each flattening layer 31 by roller pressing. Then the support material 170 is cut into multiple support layers 33 corresponding to multiple flattening layers 31. Finally, a first through hole 333 is opened on the support layer 33 to form a flattening material 30 with window 35.

[0128] The traditional manufacturing method involves forming an adhesive material 32 on the support layer 33, using an anti-adhesive material 36 to cover the window surface 351 of the window 35 on the planarization layer 31, and then bonding the planarization layer 31 to the support layer 33. This results in the anti-adhesive material 36 being trapped inside the planarization layer 31 after bonding to the support layer 33. It can only be removed after creating a first through-hole 333 in the support layer 33. However, this requires precise alignment of the anti-adhesive material 36 or the window surface 351 when creating the first through-hole 333, leading to high precision requirements, greater process difficulty, or a smaller process window for the first through-hole 333.

[0129] In the manufacturing method of this embodiment, since the window surface 351 is first covered with an anti-adhesive material 36, and then an adhesive 32 is formed on the planarization layer 31, the anti-adhesive material 36 can be removed before the planarization layer 31 is bonded to the support layer 33. After the planarization layer 31 is bonded to the support layer 33, the first through hole 333 can be directly opened. In comparison, the manufacturing method of this embodiment avoids the problem of the anti-adhesive material 36 being sandwiched inside the traditional solution, and thus avoids the problem of needing to strictly align the anti-adhesive material 36 or the window surface 351 to open the first through hole 333. This allows the first through hole 333 to be opened without strict alignment with the window surface 351, thereby reducing the process precision requirements and process difficulty, resulting in a larger process window for the first through hole 333 and higher production efficiency.

[0130] It is understood that opening the first through hole 333 after step S40 or step S50 is merely an illustrative example. In another embodiment, the first through hole 333 can also be opened between steps S30 and S40, such that the projection of each first through hole 333 along the thickness direction D of the supporting material 170 onto a window surface 351 overlaps with the window surface 351. In this embodiment, the first through hole 333 does not need to be precisely aligned with the boundary of the window surface 351; for example, it can be located within the boundary of the window surface 351, resulting in a larger process window for the first through hole 333 and higher production efficiency.

[0131] Figures 9-14 The illustrated embodiment uses the window 35 and the flattening layer 31 as an example, which is only an illustrative example. In another embodiment, the window 35 can be installed inside the flattening layer 31 after the flattening layer 31 and the support layer 33 are attached, as will be described below.

[0132] Figure 15 This is a cross-sectional view of the planarization layer 31 in another embodiment.

[0133] like Figure 15As shown, in step S10, the planarization layer 31 may have a second through hole 315. The second through hole 315 penetrates the planarization layer 31 along the thickness direction D of the planarization layer 31. For example, the second through hole 315 may be a stepped hole, which may include a first hole 3151 and a second hole 3152. The diameter of the first hole 3151 may be larger than the diameter of the second hole 3152, forming a stepped surface 316 on the planarization layer 31. The first hole 3151 is near the working surface 311, and the second hole 3152 is near the bonding surface 312. In another embodiment, the second through hole 315 may not be a stepped hole; for example, it may be a straight hole.

[0134] Step S20 in this embodiment can be referred to the description above, and will not be repeated here. Figure 16 As shown, after step S20, there is basically no adhesive material 32 at the position corresponding to the second through hole 315 of the smoothing layer 31. For example, the adhesive material 32 can be coated on the bonding surface 312 by the coating roller 130, so that the inner wall of the second through hole 315 will basically not be attached with adhesive material 32.

[0135] Steps S30 and S40 in this embodiment can be referred to the description above, and will not be repeated here. Figure 17 As shown, after steps S30 and S40, the support layer 33 and the leveling layer 31 are bonded together by the adhesive material 32.

[0136] refer to Figure 8 As shown, for example, after step S40, the manufacturing method may further include step S50. The specific process can be referred to above and will not be repeated here.

[0137] In this embodiment, after step S40 or step S50, the manufacturing method further includes: Step S90: Please refer to Figure 17 and Figure 18 A third through hole 335 aligned with the second through hole 315 is formed on each support layer 33. For example, the third through hole 335 can be formed by a punching process. Here, "alignment" means that the third through hole 335 is connected to the second through hole 315, and the axis of the third through hole 335 coincides with or is approximately coincident with the axis of the second through hole 315.

[0138] like Figure 18 As shown, exemplarily, in step S90, the diameter of the third through hole 335 can be made smaller than the diameter of the second through hole 315, and a portion 334 of the support layer 33 is located within the range of the second through hole 315. It is understood that when the second through hole 315 is... Figure 18 When a stepped hole is shown, the diameter of the second through hole 315 refers to the diameter of the second hole 3152.

[0139] Step S100: Please refer to Figure 18 and Figure 19 A window 35 is embedded in each of the second through holes 315, and each window 35 is bonded to a planarization layer 31, that is, the window 35 is bonded to the inner wall of the second through hole 315. After the window 35 is bonded to the planarization layer 31, an adhesive layer 37 can be formed between the two.

[0140] like Figure 19 As shown, exemplarily, in step S100, the window 35 can include a first portion 352 and a second portion 353. Along the thickness direction D of the window 35, the projection of the first portion 352 onto the second portion 353 can fall within the range of the second portion 353. This type of window 35 can be referred to as a "T-shaped" window. The second portion 353 of the window 35 can be supported on and bonded to the step surface 316. The first portion 352 of the window 35 can be supported on and bonded to a portion 334 of the support layer 33. By bonding the window 35 not only to the flattening layer 31 but also to a portion 334 of the support layer 33, the assembly reliability of the window 35 can be improved through a two-stage load-bearing structure.

[0141] It is understood that the structure of the window 35, the construction of the second through hole 315, and the aperture size of the third through hole 335 described above are merely examples, and the embodiments of this application are not limited thereto. For example, in another embodiment, the aperture of the third through hole 335 may not be smaller than the aperture of the second through hole 315, and the support layer 33 may not have a load-bearing function for the window 35.

[0142] The conventional manufacturing method involves forming an adhesive 32 on the support layer 33; bonding the leveling layer 31 to the support layer 33; opening a third through hole 335 on the support layer 33; and finally installing a window 35 in the second through hole 315 of the leveling layer 31. Since the adhesive 32 is formed on the support layer 33, it needs to penetrate the support layer 33 and the adhesive 32 thereon to form the third through hole 335. This makes it difficult to create the third through hole 335. In order to completely remove the adhesive 32 from the target area and avoid the adhesive 32 remaining within the range of the second through hole 315, the third through hole 335 needs to be precisely aligned with the second through hole 315, and the diameter of the third through hole 335 needs to be greater than or equal to the diameter of the second through hole 315. This not only makes the process window of the third through hole 335 smaller, but also reduces the structural load of the window 35 and is detrimental to the assembly reliability of the window 35. Moreover, if the adhesive 32 is a reactive hot melt adhesive, the open time of reactive hot melt adhesives is short, for example, only 1 min to 5 min. Creating the third through hole 335 on the support layer 33 needs to be completed within such a short open time, which makes the process difficult and the process window smaller.

[0143] In the manufacturing method of this embodiment, the adhesive material 32 is first disposed on a plurality of planarization layers 31 having second through holes 315. Then, the continuously wound support material 170 is bonded to the adhesive material 32 on each planarization layer 31 by roller pressing. Then, the support material 170 is cut into a plurality of support layers 33 corresponding one-to-one with the plurality of planarization layers 31. Then, a third through hole 335 aligned with the second through hole 315 is opened on each support layer 33. Finally, the window 35 is embedded in the second through hole 315 and the window 35 is bonded to the planarization layer 31 to form a planarization material 30 with a window. Since there is no adhesive material 32 on the support layer 33, the third through hole 335 can be opened by penetrating the support layer 33 without penetrating the adhesive material 32, making the process of opening the third through hole 335 less difficult. Furthermore, when opening the third through hole 335, it is not necessary to precisely align it with the boundary of the second through hole 315, nor is it necessary to ensure that the diameter of the third through hole 335 is greater than or equal to the diameter of the second through hole 315, thus making the process window of the third through hole 335 larger. Moreover, the diameter of the third through hole 335 can be smaller than the diameter of the second through hole 315, thereby allowing a portion 334 of the support layer 33 to be used to support the window 35, thus improving the assembly reliability of the window 35. In addition, reactive hot melt adhesive can be used in this embodiment. Since the reactive hot melt adhesive is applied to the planarization layer 31 rather than the support layer 33, opening the third through hole 335 on the support layer 33 is not limited by the open time of the reactive hot melt adhesive, which is beneficial for increasing the process window.

[0144] It is understood that the third through hole 335 is opened after step S40 or step S50; this is merely an illustrative example. In another embodiment, the third through hole 335 may also be opened between steps S30 and S40, such that each third through hole 335 is aligned with a second through hole 315. In this embodiment, the third through hole 335 does not need to penetrate the adhesive material 32, nor does it need to be precisely aligned with the boundary of the second through hole 315, resulting in lower process difficulty, a larger process window, and higher production efficiency.

[0145] The above embodiments are all illustrated by taking the processing of multiple planarization layers at one time, the use of continuously wound support materials, and the achievement of mass production through roll forming. However, the embodiments of this application are not limited to this. Based on the technical concept of the embodiments of this application, namely, "firstly, the adhesive material is directly applied to the bonding surface of the planarization layer, and then the support material is bonded to the adhesive material", the embodiments of this application can be implemented in a more advanced manner.

[0146] For example, in one embodiment, where the application scenario or production scale does not require continuous batch operation, the manufacturing method of this application embodiment is also applicable to situations where only a small number of planarization layers are provided, such as a single planarization layer. In this case, the form of the incoming support material is not limited; it can be a pre-cut single sheet material, or it can be in the form of a roll or continuous roll. Accordingly, the step of bonding the support material to the adhesive on the planarization layer can be achieved by roll forming, flat forming, or other suitable methods. Regardless of the specific method used, the process sequence of applying adhesive first and then bonding can be achieved, thereby obtaining better interfacial bonding strength between the adhesive and the planarization layer, and also avoiding the cumbersome step of fixing the support material first in the traditional solution. Thus, it can also achieve the beneficial effects of simplifying the process, reducing costs, and improving bonding reliability in single-piece or small-batch production.

[0147] Furthermore, in the case where only one leveling layer is provided, since the support material corresponds one-to-one with the leveling layer, after bonding the support material to the adhesive, there is no need to cut the continuous support material into multiple support layers. In other words, this manufacturing method directly forms the leveling material by providing the leveling layer, placing the adhesive on its bonding surface, and bonding the support material to it, making the process more streamlined.

[0148] In summary, the scope of protection of this application should cover all the above-mentioned implementations, and should not be construed as limited to mass production scenarios based on multiple planarization layers and continuously wound support materials.

[0149] It is understood that the structures shown in the various structural diagrams and working principle diagrams provided in the embodiments of this application are merely schematic and do not reflect the actual construction of the components.

[0150] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more.

[0151] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0152] The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," "top," and "bottom," are only for reference to the directions in the accompanying drawings. These directional terms are used to better and more clearly explain and understand the embodiments of this application, and are not intended to explicitly or implicitly suggest that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, etc., and therefore should not be construed as limiting the embodiments of this application.

[0153] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, possible embodiments of this application and features thereof can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for manufacturing a smoothing material, characterized in that, include: At least one leveling layer is provided, wherein the at least one leveling layer includes a working surface and an adhesive surface disposed opposite to the working surface; The adhesive is applied to the bonding surface of the at least one smoothing layer; The support material is bonded to the adhesive material on the at least one leveling layer.

2. The manufacturing method according to claim 1, characterized in that, The step of applying the adhesive material to the bonding surface of the at least one leveling layer includes: applying the liquid adhesive material to the bonding surface of the at least one leveling layer.

3. The manufacturing method according to claim 2, characterized in that, The step of applying the liquid adhesive to the bonding surface of the at least one smoothing layer includes: A liquid reactive hot melt adhesive is contained between a heating roller and a coating roller, and the liquid reactive hot melt adhesive is heated by the heating roller and the coating roller. The at least one leveling layer passes sequentially through the heating roller and the coating roller, and the liquid reactive hot melt adhesive is applied to the bonding surface of the at least one leveling layer by the coating roller.

4. The manufacturing method according to claim 3, characterized in that, The bonding of the support material to the adhesive on the at least one planarization layer includes: The support material is aligned with the reactive hot melt adhesive on the at least one leveling layer by a conveying roller, and the at least one leveling layer is squeezed from the side of the at least one leveling layer away from the reactive hot melt adhesive by an extrusion roller, so that the support material is bonded to the reactive hot melt adhesive on the at least one leveling layer.

5. The manufacturing method according to any one of claims 1-4, characterized in that, In the step of providing at least one leveling layer, the at least one leveling layer is provided with a window integrally connected to the leveling layer, the window having a window surface facing away from the working surface; Between the step of providing at least one smoothing layer and the step of applying adhesive to the bonding surface of the at least one smoothing layer, the manufacturing method further includes: using an anti-adhesive material to cover the window surface of the window in the at least one smoothing layer; Between the step of placing the adhesive on the bonding surface of the at least one planarization layer and the step of bonding the support material to the adhesive on the at least one planarization layer, the manufacturing method further includes: removing the anti-stick material from the window in the at least one planarization layer; After the step of bonding the support material to the adhesive on the at least one planarization layer, the manufacturing method further includes: opening a first through hole in the support material such that the projection of the first through hole along the thickness direction of the support material onto the window surface overlaps with the window surface.

6. The manufacturing method according to claim 5, characterized in that, In the step of creating a first through hole in the support material such that the projection of the first through hole on the window surface along the thickness direction of the support material overlaps with the window surface, the projection of the first through hole on the window surface along the thickness direction of the support material falls within the range of the window surface.

7. The manufacturing method according to any one of claims 1-4, characterized in that, In the step of providing at least one planarization layer, the at least one planarization layer has a second through-hole; After the step of bonding the support material to the adhesive on the at least one planarization layer, the manufacturing method further includes: A third through hole aligned with the second through hole is formed in the supporting material; A window is inserted into the second through hole and the window is fixed to the planarization layer.

8. The manufacturing method according to claim 7, characterized in that, In the step of opening a third through hole in the support material that is aligned with the second through hole, the diameter of the third through hole is smaller than the diameter of the second through hole, and a portion of the support material is located within the range of the second through hole. In the step of embedding a window in the second through hole and fixing the window to the planarization layer, the window is fixedly connected to the portion of the support material.

9. The manufacturing method according to any one of claims 1-4, characterized in that, In the step of providing a planarization layer, there are multiple planarization layers; In the step of applying adhesive to the bonding surface of the at least one leveling layer, the adhesive is applied to the bonding surface of each of the leveling layers; In the step of bonding the support material to the adhesive on the at least one leveling layer, the support material is wound, and the wound support material is bonded to the adhesive on each of the leveling layers by roll forming.

10. The manufacturing method according to claim 9, characterized in that, In the step of bonding the support material to the adhesive on the at least one planarization layer, the support material is continuously wound.

11. The manufacturing method according to claim 9, characterized in that, After the step of bonding the support material to the adhesive on the at least one planarization layer, the manufacturing method further includes: The supporting material is cut into multiple supporting layers corresponding to the multiple planarization layers.

12. A leveling material, characterized in that, The leveling material comprises a leveling layer, an adhesive material, and a support layer stacked sequentially, wherein the adhesive material bonds the leveling layer and the support layer, and the leveling material is prepared by the manufacturing method according to any one of claims 1-11.

13. The leveling material according to claim 12, characterized in that, The leveling layer includes a working surface and an adhesive surface facing away from the working surface, and the adhesive material is bonded between the adhesive surface and the support layer; The leveling layer has a window that extends through the thickness of the leveling layer, is exposed on the working surface, has a window surface facing away from the working surface, and is located on the side of the support layer facing the leveling layer. The support layer is provided with a first through hole, and the projection of the first through hole along the thickness direction of the support layer on the window surface overlaps with the window surface, and the window surface is exposed to the first through hole.

14. The leveling material according to claim 13, characterized in that, The window is integrated with the smoothing layer, and a portion of the adhesive material is located on the window.

15. The leveling material according to claim 13, characterized in that, The smoothing layer has a second through hole, the window is fixed inside the second through hole, and a portion of the adhesive material is located on the hole wall of the second through hole.

16. A leveling material, characterized in that, The leveling material includes a leveling layer, an adhesive material, and a support layer stacked sequentially. The leveling layer includes a working surface and an adhesive surface facing away from the working surface. The adhesive material is bonded between the adhesive surface and the support layer. The leveling layer has a window that extends through the thickness of the leveling layer, is exposed on the working surface, has a window surface facing away from the working surface, and is located on the side of the support layer facing the leveling layer. The support layer is provided with a first through hole, and the projection of the first through hole along the thickness direction of the support layer on the window surface overlaps with the window surface, and the window surface is exposed to the first through hole.

17. The leveling material according to claim 16, characterized in that, The window is integrated with the smoothing layer, and a portion of the adhesive material is located on the window.

18. The leveling material according to claim 16, characterized in that, The smoothing layer has a second through hole, the window is fixed inside the second through hole, and a portion of the adhesive material is located on the hole wall of the second through hole.

19. A leveling device, characterized in that, The device includes a machine base and a leveling material as described in any one of claims 12-18, wherein the support layer in the leveling material is fixed to the machine base, and the working surface of the leveling layer faces away from the machine base.

20. The leveling equipment according to claim 19, characterized in that, The leveling equipment also includes a processing head, which is opposite to the leveling material and faces the working surface.

21. A component, characterized in that, The component is subjected to a leveling treatment using the leveling material described in any one of claims 12-18.

22. The component according to claim 21, characterized in that, The components include semiconductor devices or electronic devices.

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