Die cutting control method and system for flexible circuit board panelization

Abstract

The application discloses a kind of flexible circuit board's cutting control method and system of patching.The cutting control method includes: determining the patching column number of the flexible circuit board patching to be cut out;When the patching column number meets the first preset condition, the flexible circuit board patching is cut out based on the preset one-out-three cutting mode;When the patching column number meets the second preset condition, the flexible circuit board patching is cut out based on the preset one-out-two cutting mode.In the present application, by determining the patching column number in advance and automatically matching the corresponding cutting mode according to the preset condition, the flexible circuit board patching with different patching column numbers can adapt to the cutting mode of the corresponding number of dies, thereby effectively eliminating the problem of changing the step distance at the end of cutting or increasing the cutting process due to the mismatch between the patching column number and the number of dies, improving the production efficiency, and ensuring the continuity, integrity and process consistency of the cutting process.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board technology, and in particular to a punching control method and system for flexible circuit board panelization. Background Technology

[0002] In the punching process of flexible circuit boards, panel design is a crucial link connecting product layout and the punching process. Currently, the determination of the number of panel columns is usually based solely on material utilization, without precise mathematical matching with the physical layout of the mold and the feeding logic. When the number of panel columns does not match the output specifications of the mold, the punching process will not be able to completely cover all product columns. This usually requires changing the feeding pitch or performing single-cavity supplementary cutting at the end of the punching process, affecting production efficiency and product consistency. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a punching control method and system for flexible circuit board panelization, so as to solve the problem of low production efficiency caused by the mismatch between the number of panelization columns and the mold output specifications.

[0004] In a first aspect, the present invention provides a punching control method for flexible circuit board panelization. The punching control method includes: Determine the number of columns in the flexible circuit board panel to be punched; When the number of columns of the panel meets the first preset condition, the flexible circuit board panel is punched based on the preset one-out-three-punching working mode. When the number of panels meets the second preset condition, the flexible circuit board panel is punched based on the preset one-out-two-punch working mode.

[0005] In one implementation of the first aspect, the flexible circuit board panel is punched based on a preset one-out-three-punch working mode, including: The flexible circuit board assembly is fed into the first punching die; wherein the first punching die includes three punching and forming cavities; The flexible circuit board panel is punched using the three punching cavities on the first punching die.

[0006] In one implementation of the first aspect, the three punching cavities sequentially include cavity A, cavity B, and cavity C along the punching feeding direction; Correspondingly, the flexible circuit board panel is punched based on the three punching cavities on the first punching die, including: The center lines of cavity A, cavity B and cavity C are aligned with the 1st, 3rd and 5th columns of any five adjacent columns of products on the flexible circuit board panel, respectively. The flexible circuit board panel is initialized so that the punch of cavity B is aligned with the center of the first column of products on the flexible circuit board panel. The feeding step distance of the flexible circuit board panel is set to the width of three columns of products; The flexible circuit board panel is continuously moved with the width of the three columns of products as the feeding step distance, so that the A cavity, the B cavity and the C cavity correspond to three different columns of products in each punching, and punching is carried out in a cyclical manner until the punching is completed.

[0007] In one implementation of the first aspect, the flexible circuit board panel is punched based on a preset one-out-two-punch working mode, including: The flexible circuit board assembly is fed into the second punching die; wherein the second punching die includes two punching forming cavities; The flexible circuit board panel is punched using the two punching cavities on the second punching die.

[0008] In one implementation of the first aspect, the two punching forming cavities sequentially include a first cavity and a second cavity along the punching feeding direction; Correspondingly, the flexible circuit board panel is punched based on the two punching cavities on the second punching die, including: The center lines of the first cavity and the second cavity are aligned with the first and fourth columns of any four adjacent columns of products on the flexible circuit board panel, respectively. The flexible circuit board panel is initialized so that the punch of the second cavity is aligned with the center position of the second column of products on the flexible circuit board panel. The feeding step distance of the flexible circuit board panel is set to the width of two columns of products; The flexible circuit board panel is continuously moved with the width of the two columns of products as the feeding step distance, so that the first cavity and the second cavity correspond to two different columns of products in each punching, and punching is carried out in a cyclical manner until the punching is completed.

[0009] In one implementation of the first aspect, the punching control method further includes: If the number of columns of the panel simultaneously meets both the first preset condition and the second preset condition, then the total number of the flexible circuit board panels is determined. If the total quantity is less than or equal to the first preset threshold, the flexible circuit board panel is punched based on the preset one-out-three-punching working mode; If the total quantity is greater than the first preset threshold, the flexible circuit board panel is punched based on the preset one-out-two-punch working mode.

[0010] In one implementation of the first aspect, the first preset condition is that the sum of the number of columns in the layout and 2 is an integer multiple of 3, and the second preset condition is that the number of columns in the layout is an even number.

[0011] Secondly, the present invention provides a punching control system for flexible circuit board panelization. The punching control system includes: The column number determination module is used to determine the number of columns in the flexible circuit board panel to be punched; The mode determination module is used to determine the punching working mode of the flexible circuit board panel based on the number of panel columns, so as to select a one-out-three punching working mode when the number of panel columns meets the first preset condition and to select a one-out-two punching working mode when the number of panel columns meets the second preset condition. The punching module is used to punch the flexible circuit board panel according to the one-out-three punching working mode or the one-out-two punching working mode.

[0012] In one implementation of the second aspect, the punching module includes a first punching unit, the first punching unit includes a first punching die, and the first punching die has three punching forming cavities.

[0013] In one implementation of the second aspect, the punching module includes a second punching unit, the second punching unit includes a second punching die, and the second punching die has two punching forming cavities.

[0014] The beneficial effects of this invention are as follows: By pre-determining the number of panel columns and automatically matching the corresponding punching working mode according to preset conditions, flexible circuit board panels with different panel column numbers can be adapted to the punching working mode of the corresponding output specifications. When the number of panel columns matches the mold output specifications (such as a one-out-of-three punching working mode or a one-out-of-two punching working mode), the material can be continuously fed at a constant pitch during the punching process, thereby ensuring that each product column is punched by the corresponding forming cavity only once. This effectively eliminates the problem of needing to change the pitch or add a supplementary cutting process at the end of the punching process due to the mismatch between the number of panel columns and the mold output, thus improving production efficiency and ensuring the continuity, integrity, and process consistency of the punching process. Attached Figure Description

[0015] Figure 1 This is a flowchart of the steps of a punching control method for flexible circuit board panelization disclosed in an embodiment of the present invention.

[0016] Figure 2 This is a schematic diagram of the layout of three punching cavities in the effective punching area width of the first punching die disclosed in an embodiment of the present invention.

[0017] Figure 3This is a schematic diagram of the layout of two punching cavities in the effective punching area width of the second punching die disclosed in an embodiment of the present invention.

[0018] Figure 4 This is a schematic diagram of a complete punching sequence based on a one-out-three-punch working mode and N=16, as disclosed in an embodiment of the present invention.

[0019] Figure 5 This is a schematic diagram of a complete punching sequence based on a one-out-two-punch working mode and N=12, as disclosed in an embodiment of the present invention.

[0020] Figure 6 This is a system diagram of a punching control system for flexible circuit board panelization disclosed in an embodiment of the present invention. Detailed Implementation

[0021] To explain in detail the technical content, objectives, and effects of the present invention, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0022] To facilitate understanding of the technical solutions provided in the embodiments of the present invention by those skilled in the art, the relevant technologies are described below: In the FPC (Flexible Printed Circuit) industry, die-cutting is a key process that determines the final product's forming quality, production efficiency, and cost. The core contradiction currently facing the industry lies in the fact that while pursuing high efficiency with multi-output (e.g., five-output) dense dies results in weak structural strength and short lifespan, simpler, more robust dies are less efficient. Specifically: (1) Disconnect between panel design and mold process: The design of the number of panel columns usually only considers the material utilization rate and does not accurately match the physical layout of the mold and the feeding logic mathematically, which leads to the production process not being optimized or the risk of incomplete coverage, thus reducing production efficiency.

[0023] (2) The trade-off between strength and efficiency: The denser the layout of punches (i.e., punching die cavity / punching forming cavity), the weaker the stress beam of the die body. Under long-term impact, fatigue fracture or loss of precision is likely to occur, and frequent maintenance will lead to downtime losses.

[0024] (3) The inherent problem of process edge protection: In continuous punching, the punch located at the edge of the panel is very easy to damage the process edge used for transmission, positioning or testing, and the measures to protect the process edge often come at the cost of sacrificing efficiency or increasing design complexity.

[0025] To address at least the aforementioned problems, this invention provides a punching control method and system for continuous punching of flexible circuit board panelization. This solution abandons unrealistically high output count designs, focusing instead on two punching modes: one-out-of-three and one-out-of-two. It achieves a better balance between mold strength and production efficiency, and establishes precise panelization design rules and process flows for each. Specifically, this solution constructs a dual-mode collaborative system based on the number of panelization columns, implementing one-out-of-three and one-out-of-two punching modes. By pre-determining the number of panelization columns and automatically matching the corresponding working mode according to preset conditions, the punching process achieves continuous feeding with a constant step distance, eliminating the need to change the step distance or perform supplementary cutting at the end, thereby improving production efficiency and product consistency.

[0026] The one-out-of-three punching mode achieves an optimal balance between efficiency and strength by adhering to the rules that "the number of panel columns N satisfies (N+2) divisible by 3" and "occupies five columns, outputs three cavities, and has a three-column pitch," serving the needs of regular mass production. The one-out-of-two punching mode, on the other hand, achieves extreme mold structural strength by adhering to the rules that "the number of panel columns N satisfies (N+2) divisible by 2" and "occupies four columns, outputs two cavities, and has a two-column pitch," serving high-reliability production scenarios. Both modes achieve absolute protection of the process edges through air punching at both ends and can be automated for continuous production. This allows producers to choose between the high-efficiency balanced mode (i.e., the one-out-of-three punching mode) or the extreme strength mode (i.e., the one-out-of-two punching mode) based on product characteristics, thus providing a complete technical solution that simultaneously addresses the multiple requirements of FPC punching die life, production efficiency, and process quality.

[0027] The technical solutions according to the present invention will be described below with reference to specific embodiments and in conjunction with the accompanying drawings.

[0028] Figure 1 This is a flowchart illustrating the steps of a punching control method for flexible circuit board panelization according to an embodiment of the present invention. (Refer to...) Figure 1 The punching control method includes the following steps 100 to 104.

[0029] Step 100: Determine the number of columns in the flexible circuit board panel to be punched; Step 102: When the number of columns of the panel meets the first preset condition, the flexible circuit board panel is punched based on the preset one-out-three-punch working mode; Step 104: When the number of panels meets the second preset condition, the flexible circuit board panel is punched based on the preset one-out-two-punch working mode.

[0030] As described above, the beneficial effects of this invention are as follows: By pre-determining the number of panel columns and automatically matching the corresponding punching working mode according to preset conditions, flexible circuit board panels with different panel column numbers can adapt to the punching working mode of the corresponding output specifications. When the number of panel columns matches the mold output specifications (such as a one-out-of-three punching working mode or a one-out-of-two punching working mode), continuous feeding with a constant step distance can be achieved during the punching process, thereby ensuring that each product column is punched by the corresponding forming cavity only once. This effectively eliminates the problem of needing to change the step distance or add supplementary cutting processes at the end of the punching process due to the mismatch between the number of panel columns and the mold output, improving production efficiency and ensuring the continuity, integrity, and consistency of the punching process. Furthermore, this invention can complete the selection of the punching working mode through simple panel column number determination, making it easy to operate and responsive. It is compatible with existing punching production lines without complex equipment modifications or additional testing procedures, possessing good universality and scalability.

[0031] The following combination Figure 1 The steps in steps 100 to 104, as well as other optional steps, are described in detail.

[0032] Step 100: Determine the number of columns in the flexible circuit board panel to be punched.

[0033] The flexible circuit board panel refers to the overall board formed by arranging multiple flexible circuit board product units in an array on the same substrate; the number of panel columns refers to the number of product units arranged in the panel along the punching and feeding direction.

[0034] Step 102: When the number of panels meets the first preset condition, the flexible circuit board panel is punched based on the preset one-out-three-punch working mode.

[0035] It should be noted that the first preset condition can be selected and set according to the actual situation. For example, the first preset condition can be: the sum of the number of layout columns and 2 is an integer multiple of 3. In practical applications, when the number of layout columns meets the first preset condition, the number of layout columns N can be 10, 13, 16, 19, 22, 25, 28, 31, 34 or 37 columns.

[0036] In an optional embodiment, step 102, punching the flexible circuit board panel based on a preset one-out-three-punch working mode, may include the following steps: Step 200: The flexible circuit board panel is fed into the first punching die; wherein the first punching die includes three punching forming cavities; wherein the three punching forming cavities include cavity A, cavity B and cavity C in sequence along the punching feeding direction; Step 202: The flexible circuit board panel is punched based on the three punching cavities on the first punching die. It should be noted that when punching the flexible circuit board panel based on the one-out-three-punch working mode, the total number of punching times is M = (N + 2) / 3.

[0037] As described above, by using a first punching die containing three punching cavities to perform a one-out-three punching working mode, a single punching operation can process three rows of products simultaneously. With the same number of feeding operations, more product rows can be covered, and the output per unit time can be effectively increased, thereby effectively improving the overall production efficiency of the punching process.

[0038] In an optional embodiment, step 202, punching the flexible circuit board panel based on the three punching cavities on the first punching die, may include the following steps: Step 300: Control the center lines of cavity A, cavity B and cavity C to align with the 1st, 3rd and 5th columns of any five adjacent columns of products on the flexible circuit board panel, respectively; Step 302: Initialize the flexible circuit board panel to align the punch of cavity B with the center of the first column of products on the flexible circuit board panel. Step 304: Set the feeding step distance of the flexible circuit board panel to the width of three columns of products; Step 306: The flexible circuit board panel is continuously moved with the width of the three columns of products as the feeding step distance, so that the A cavity, the B cavity and the C cavity correspond to three different columns of products in each punching, and punching is carried out in a cyclical manner until the punching is completed.

[0039] In practical applications, the core positioning of the one-out-of-three punching working mode is a high-efficiency balanced mode, aiming to achieve the optimal trade-off between efficiency and strength. This one-out-of-three punching working mode is suitable for flexible circuit board panels that meet the following conditions: the number of columns N ≥ 10, and N satisfies the mathematical condition N³ ≡ 1 (mod 3) (e.g., 10, 13, 16, 19, 22, 25, 28, 31, 34, 37, etc.); at the same time, the punching production scenario of the flexible circuit board panel needs to have the ability to continuously transfer and process at equal intervals, while taking into account the requirements of mold structure strength and stability. Correspondingly, in terms of mold layout, such as Figure 2As shown, the effective cutting area of ​​the first punching die in this one-out-of-three punching working mode occupies the width of five rows of products. Three punching cavities are set within the effective cutting area of ​​this first punching die, producing three rows of products in a single punch. The spacing between adjacent punching cavities is the width of one row of products, and the feeding step distance is the spacing between the three rows of products. It should be noted that compared to the one-out-of-two punching working mode, the one-out-of-three punching working mode produces more products per punch and has a larger feeding step distance, resulting in a significant efficiency advantage. Compared to densely arranged multi-output dies, the spacing design of the one-out-of-three punching working mode allows the die body to retain more substantial structural integrity, significantly improving strength and achieving a good balance between production efficiency and die life.

[0040] As described above, by positioning the three forming cavities A, B, and C respectively in the 1st, 3rd, and 5th columns of any five adjacent product columns, and coordinating the initial alignment of cavity B with the 1st column of the flexible circuit board panel, and the continuous feeding of three columns of products in each step, the product column numbers aligned by the three forming cavities in each punching are sequentially connected, non-overlapping, and without omissions or repetitions. This mathematically guarantees complete coverage of all product columns without requiring changes to the step distance or additional cutting processes. Simultaneously, the spatial layout of one column of products between adjacent forming cavities allows the mold body to retain sufficient solid material, which is beneficial for improving the mold's impact resistance. Furthermore, by initially aligning cavity B with the 1st column of the flexible circuit board panel, it is possible to achieve empty punching at both ends. That is, cavity A is located outside the flexible circuit board panel during the first punching, and cavity C is located outside the flexible circuit board panel during the last punching, so the left and right process edges are not physically punched. For example, if... Figure 4 As shown, the area marked by the dashed line (i.e., the process edge) is not punched, thus achieving non-destructive protection of the process edge.

[0041] Step 104: When the number of panels meets the second preset condition, the flexible circuit board panel is punched based on the preset one-out-two-punch working mode.

[0042] It should be noted that the second preset condition is that the number of columns in the layout is even. In practical applications, when the number of columns in the layout meets the second preset condition, the number of columns N can be 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34 or 36 columns, and is not limited here.

[0043] In an optional embodiment, in step 104, the flexible circuit board panel is punched based on a preset one-out-two-punch working mode, including: Step 400: The flexible circuit board assembly is fed into the second punching die; wherein the second punching die includes two punching forming cavities; the two punching forming cavities include a first cavity and a second cavity in sequence along the punching feeding direction; Step 402: The flexible circuit board panel is punched based on the two punching cavities on the second punching die. It should be noted that when punching the flexible circuit board panel based on the one-out-two-punch working mode, the total number of punching times is M = (N+2) / 2.

[0044] As described above, by using a mold with two punching cavities to perform a one-out-two-punch working mode, two rows of products can be processed simultaneously in a single punching operation. While ensuring a certain output efficiency, the mold body retains a wider stress-bearing cross section and more solid structures due to the smaller number of forming cavities. This effectively improves the overall rigidity and load-bearing capacity of the mold, making it less prone to deformation or cracking under long-term impact loads, and significantly extending the service life of the mold.

[0045] In an optional embodiment, step 402, punching the flexible circuit board panel based on the two punching cavities on the second punching die, includes: Step 500: Control the center lines of the first cavity and the second cavity to be aligned with the first and fourth columns of any four adjacent columns of products on the flexible circuit board panel, respectively; Step 502: Initialize the flexible circuit board panel to align the punch of the second cavity with the center of the second column of products on the flexible circuit board panel. Step 504: Set the feeding step distance of the flexible circuit board panel to the width of two columns of products; Step 506: The flexible circuit board panel is continuously moved with the width of the two columns of products as the feeding step distance, so that the first cavity and the second cavity correspond to two different columns of products in each punching, and punching is carried out in a cyclical manner until the punching is completed.

[0046] In practical applications, the core positioning of the one-out-two-punch working mode is the ultimate strength mode, specifically designed for scenarios with extremely high requirements for mold structural strength and reliability. This one-out-two-punch working mode is suitable for printing plates with an even number of columns (e.g., 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36, etc.), and also requires N≥10 and the ability to continuously transfer and process materials at equal intervals. Regarding mold layout, such as... Figure 3As shown, in this one-out-two-punch working mode, the effective punching area of ​​the second punching die occupies the width of four rows of products. Two punching cavities are set within the effective punching area of ​​this die, thus producing two rows of products in a single punching operation. The interval between two adjacent punching cavities is the width of two rows of products, and the feeding step distance is the width of two rows of products. Compared to the one-out-three-punch working mode, the one-out-two-punch working mode produces fewer products per cycle and has a smaller feeding step distance, making a certain concession in efficiency. However, the ultra-wide interval between the two punching cavities provides the die body with the largest stress beam cross-section, enabling the die to reach an extremely high strength level. This is particularly suitable for demanding production scenarios with large product sizes, high punching stress, or extreme requirements for die life. Furthermore, in this one-out-two-punch working mode, the second punching die maintains accuracy and stability even under long-term high-intensity impact conditions, significantly reducing maintenance frequency and downtime losses.

[0047] As described above, by positioning the two punching cavities at the first and fourth columns of any four adjacent product rows, a large space is created between the two cavities, spaced two columns apart. This significantly increases the cross-section of the mold's load-bearing beam and maximizes structural strength, making it suitable for demanding production scenarios with large product sizes, high punching stress, or extreme requirements for mold lifespan. Simultaneously, by initializing the second cavity to align with the second column of the panel and continuously moving the two columns with equal spacing, complete coverage of all product rows is achieved, maintaining continuous feeding with equal spacing throughout, without needing to change the spacing or add supplementary cutting processes. Furthermore, aligning the second cavity to the second column of the flexible circuit board panel allows for air punching at both ends, preventing the left and right process edges from being physically punched. For example, if... Figure 5 As shown, the area marked by the dashed line (i.e., the process edge) is not punched, thus achieving non-destructive protection of the process edge.

[0048] In an optional embodiment, the punching control method may further include the following steps: Step 600: If the number of columns of the panel simultaneously satisfies both the first preset condition and the second preset condition, then determine the total number of the flexible circuit board panels. Step 602: If the total quantity is less than or equal to the first preset threshold, the flexible circuit board panel is punched based on the preset one-out-three-punching working mode. Step 604: If the total quantity is greater than the first preset threshold, the flexible circuit board panel is punched based on the preset one-out-two-punch working mode.

[0049] In practical applications, if the number of columns N in the panel simultaneously meets both the first and second preset conditions (such as when the number of columns is 10, 16, 22, 28, 34, etc.), the number of outputs can be selected based on the total number of flexible circuit board panels (i.e., the order quantity of flexible circuit board panels). When the order quantity is large (i.e., when the total number of flexible circuit board panels is greater than the first preset threshold), the flexible circuit board panels are punched based on the preset one-out-three-punching working mode, that is, the first punching die is selected; when the order quantity is small (i.e., when the total number of flexible circuit board panels is less than or equal to the first preset threshold), the flexible circuit board panels are punched based on the preset one-out-two-punching working mode, that is, the second punching die is selected. It should be noted that the above-mentioned first preset threshold can be selected according to the actual situation and is not limited here.

[0050] As described above, when the number of columns in the panel meets both preset conditions, the production party can prioritize production efficiency for large-volume orders and prioritize reducing mold costs or extending mold life for small-volume orders by selecting the corresponding working mode according to the order volume. This achieves flexible adjustment of production strategy and optimal allocation of resources.

[0051] To make this application easier to understand, an exemplary application is provided below. In this exemplary application, a dual-mode collaborative punching system is provided. Based on this dual-mode collaborative punching system, the punching control method for flexible circuit board panels may include the following steps: S1: Evaluate whether the flexible circuit board panel meets the following conditions: it has an independent, equally spaced number of panel columns, the number of panel columns is ≥10, and it can be continuously and equally spaced for production processing; if the above conditions are met, proceed to step S2 or step S3 below. S2: If the number of columns N of the panel satisfies N3≡1 (mod3), that is, when the number of columns N of the panel satisfies the first preset condition, then select the one-out-three-punch working mode; then punch the flexible circuit board panel in the one-out-three-punch working mode based on the first punching die. S3: If the number of columns N of the panel satisfies N2≡0 (mod2), that is, when the number of columns N of the panel satisfies the second preset condition, then select the one-out-two-punch working mode; then punch the flexible circuit board panel in the one-out-two-punch working mode based on the second punching die.

[0052] In addition, it should be noted that if the number of columns N of the panel meets both the first and second preset conditions mentioned above (such as when the number of columns is 10, 16, 22, 28, 34, etc.), the output number can be selected according to the order quantity. If the order quantity is large, the one-out-three-punch working mode and the corresponding first punching die can be selected; if the order quantity is small, the one-out-two-punch working mode and the corresponding second punching die can be selected.

[0053] To further understand the above-mentioned one-out-three-punch and one-out-two-punch working modes, the following provides a detailed introduction to these two punching working modes.

[0054] (1) One-out-three-punch working mode (high-efficiency balance mode) The one-out-of-three punching working mode is used for efficient and balanced production. While ensuring the robustness of the mold structure, it pursues the optimal overall production efficiency, making it the preferred solution for general scenarios. To perform punching based on this one-out-of-three punching working mode, the following conditions must be met.

[0055] Panelization Design Rules: The total number of product columns along the punching feed direction of the flexible circuit board panel is N. N must satisfy the following mathematical condition: (N + 2) is divisible by 3, i.e., N³ ≡ 1 (mod 3). To achieve cost-effective mass production, it is recommended that N ≥ 10, for example, columns 10, 13, 16, 19, 22, 25, 28, 31, 34, 37, etc. It should be noted that... Figure 2 , Figure 3 , Figure 4 as well as Figure 5 The arrow in the image indicates the direction of the punching feed.

[0056] The design rules for the first punching die corresponding to this three-punch working mode are as follows: Figure 2 As shown, the effective cutting area width of the first punching die corresponds to the spacing between five columns of products on the flexible circuit board panel. Within this effective cutting area width, three punching forming cavities are set, which are defined as cavity A, cavity B, and cavity C along the punching feeding direction. The centerlines of these three punching forming cavities are evenly distributed, precisely corresponding to the positions of the 1st, 3rd, and 5th columns of any five adjacent columns of products in the flexible circuit board panel, with a space of one column of products' width between adjacent punching forming cavities.

[0057] Process and feeding rules: When punching the flexible circuit board panel using the first punching die, the fixed feeding step distance is the width of three columns of products. Through initial positioning and continuous equal-step feeding, the three cavities A, B, and C cover all product columns in a predetermined sequence, and the first and last punches are performed on the outside of the panel to ensure the integrity of the process edges.

[0058] For example, the process of punching a flexible circuit board panel with N=16 columns using a one-out-three-punch working mode can be as follows: First, panelization verification: Based on the product dimensions, determine whether the number of columns in the flexible circuit board panel (i.e., N=16) meets the first preset condition. Verification: (16+2) / 3=6, which is an integer, thus meeting the rule of the first preset condition.

[0059] Secondly, mold preparation: process and manufacture the first punching mold. In the first punching mold, the center distance of the three punches in cavity A, cavity B and cavity C is strictly divided and positioned according to the total width of the five columns of products on the flexible circuit board panel, so as to ensure that they are aligned with the 1st, 3rd and 5th columns of the width area respectively.

[0060] Next, the punching operation (initialization and punching sequence): First, adjust the position of the flexible circuit board panel through the initialization operation so that the B-cavity punch in the first punching die is aligned with the center of the first column of products on the flexible circuit board panel. Then, set the feeding step distance to the width of three adjacent columns of products, and the automatic punch press follows the program in Table 1. Figure 4 The complete punching sequence runs, in which, Figure 4 The section between the two dashed lines represents the product rows on the flexible circuit board panel. Figure 4 Products listed at the same height were cut in the same punching cycle, such as... Figure 4 As shown, columns -1, 1, and 3 were cut in the same stroke; columns 2, 4, and 6 were cut in the same stroke; ...; columns 11, 13, and 15 were cut in the same stroke; columns 14, 16, and 18 were cut in the same stroke.

[0061] Table 1: When N=16, punching is performed according to the one-out-three-punch working mode.

[0062] As shown in Table 1 above, after 6 punching operations, all product rows were completely separated, and the left and right process edges remained intact.

[0063] (1) One-out-two-punch working mode (extreme strength mode) The one-out-two-cutting working mode is used for high-strength and reliable production. It prioritizes the strength and reliability of the die structure, and is particularly designed for scenarios with large product sizes, high cutting stress, or extreme requirements on die life. To perform cutting based on this one-out-two-cutting working mode, the following conditions must be met.

[0064] Panelization design rules: The total number of product columns (i.e., panelization columns) along the punching and feeding direction of the flexible circuit board panel is N. The number of panelization columns N must satisfy the following mathematical condition: (N+2) is divisible by 2, that is, N is an even number. To improve efficiency, it is recommended that N ≥ 10, for example, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36 columns, etc.

[0065] The design rules for the second punching die corresponding to the one-out-two-punch working mode are as follows: Figure 3As shown, the effective cutting area width of the second punching die corresponds to the width of four columns of products on the flexible circuit board panel. Within this effective cutting area width, two punching forming cavities are provided, which are defined as the first cavity and the second cavity sequentially along the punching feeding direction. The center lines of these two punching forming cavities are located at the positions of the first and fourth columns of products in any four adjacent columns of the flexible circuit board panel, respectively, with a gap of two columns of product width between them.

[0066] Process and feeding rules: During punching, the fixed feeding step distance is the width of two columns of products. Through specific initial positioning and continuous equal-step feeding, the first and second cavities cover all product columns in a predetermined sequence, and the first and last punches are performed empty punches on the outside of the assembly, ensuring the integrity of the process edge. That is, the one-out-two-punch working mode can effectively protect the integrity of the process edge by controlling that at least one punch is performed empty punches on the outside of the assembly during the first and last punches.

[0067] For example, the process of punching a flexible circuit board panel with N=12 columns using a one-out-two-punch working mode can be as follows: First, panel layout verification: Due to the large product size and the panel layout column number N=12 satisfying the second preset condition, a one-out-two-punch working mode is selected to ensure mold life. Verification: (12+2) / 2=7, which is an integer.

[0068] Secondly, mold preparation: process and manufacture the second punching mold, the center distance of the two punches in the first cavity and the second cavity is strictly positioned according to the total width of the four adjacent columns of products on the flexible circuit board panel, to ensure that they are aligned with the first and fourth columns of the area respectively.

[0069] Next, the punching operation (i.e., initialization and punching sequence): First, adjust the position of the flexible circuit board panel so that the punch in the second cavity of the second punching die is aligned with the center of the second column of products on the flexible circuit board panel (this initialization position differs from the one-out-of-three punching working mode and is one of the characteristics of this mode). Then, set the feeding step distance to the width of the two adjacent columns of products, and the automatic punch press follows the program in Table 2. Figure 5 The complete punching sequence runs, in which, Figure 5 The section between the two dashed lines represents the product rows on the flexible circuit board panel. Figure 5 Products listed at the same height were cut in the same punching cycle, such as... Figure 5 As shown, columns -1 and 2 were cut from the same stroke; columns 1 and 4 were cut from the same stroke; ...; columns 9 and 12 were cut from the same stroke; columns 11 and 14 were cut from the same stroke.

[0070] Table 2: When N=12, punching is performed according to the one-out-two-punch working mode.

[0071] As shown in Table 2 above, after 7 punching operations, all product lines were completely separated, the mold stress condition was optimal, and the process edges were intact.

[0072] Figure 6 This is a system diagram of a punching control system for flexible circuit board panelization disclosed in an embodiment of the present invention. (Refer to...) Figure 6 The punching control system 700 includes a column number determination module 710, a mode judgment module 720, and a punching module 730.

[0073] The column number determination module 710 is used to determine the number of columns of the flexible circuit board panel to be punched; The mode determination module 720 is used to determine the punching working mode of the flexible circuit board panel based on the number of panel columns, so as to select a one-out-three punching working mode when the number of panel columns meets the first preset condition and to select a one-out-two punching working mode when the number of panel columns meets the second preset condition. The punching module 730 is used to punch the flexible circuit board panel according to the one-out-three punching working mode or the one-out-two punching working mode.

[0074] In an optional embodiment, the punching module 730 includes a first punching unit, the first punching unit including a first punching die, the first punching die having three punching forming cavities.

[0075] In an optional embodiment, the punching module 730 includes a second punching unit, the second punching unit including a second punching die, the second punching die having two punching forming cavities.

[0076] It should be understood that the column number determination module 710, the mode judgment module 720, and the punching module 730 can be further configured to execute the corresponding steps or actions in the punching control method described in the above embodiments, which will not be repeated here.

[0077] In summary, the punching control method and system for flexible circuit board panelization according to the present invention: (1) It ends the dilemma of trade-off between strength and efficiency: For the first time in the industry, two verified optimal output schemes for non-four or higher outputs are clearly defined and provided. Users do not need to hesitate between fragile dense molds and inefficient simple molds, and can scientifically choose the optimal path according to actual production. (2) It achieves non-destructive protection of process edges: Both punching working modes, through rigorous mathematical rules and the design of empty punching at the beginning and end, logically and physically eliminate the possibility of punching damage to process edges, and improve the pass rate of subsequent SMT and other processes. (3) It provides a complete solution covering all production needs: the one-out-three-punch working mode serves 80% of the regular high-efficiency production needs; the one-out-two-punch working mode solves 20% of the special high-intensity production needs, and the two together constitute a production technology system without dead ends. (4) It greatly improves mold life and production stability: the intermittent layout greatly enhances the mechanical strength of the mold body, reduces maintenance frequency and unexpected downtime, reduces long-term operating costs, and ensures delivery stability.

[0078] It should be understood that the terms "first," "second," etc., are used in this invention to describe various types of information, but these terms are not limited to them and are only used to distinguish information of the same type from each other. For example, without departing from the scope of this invention, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.

[0079] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A punching control method for flexible circuit board panelization, characterized in that, include: Determine the number of columns in the flexible circuit board panel to be punched; When the number of columns of the panel meets the first preset condition, the flexible circuit board panel is punched based on the preset one-out-three-punching working mode. When the number of panels meets the second preset condition, the flexible circuit board panel is punched based on the preset one-out-two-punch working mode.

2. The punching control method according to claim 1, characterized in that, The flexible circuit board panel is punched based on a preset one-out-three-punch working mode, including: The flexible circuit board assembly is fed into the first punching die; wherein the first punching die includes three punching and forming cavities; The flexible circuit board panel is punched using the three punching cavities on the first punching die.

3. The punching control method according to claim 2, characterized in that, The three punching forming cavities, along the punching feeding direction, include cavity A, cavity B, and cavity C in sequence; Correspondingly, the flexible circuit board panel is punched based on the three punching cavities on the first punching die, including: The center lines of cavity A, cavity B and cavity C are aligned with the 1st, 3rd and 5th columns of any five adjacent columns of products on the flexible circuit board panel, respectively. The flexible circuit board panel is initialized so that the punch of cavity B is aligned with the center of the first column of products on the flexible circuit board panel. The feeding step distance of the flexible circuit board panel is set to the width of three columns of products; The flexible circuit board panel is continuously moved with the width of the three columns of products as the feeding step distance, so that the A cavity, the B cavity and the C cavity correspond to three different columns of products in each punching, and punching is carried out in a cyclical manner until the punching is completed.

4. The punching control method according to claim 1, characterized in that, The flexible circuit board panel is punched based on a preset one-out-two-punch working mode, including: The flexible circuit board assembly is fed into the second punching die; wherein the second punching die includes two punching forming cavities; The flexible circuit board panel is punched using the two punching cavities on the second punching die.

5. The punching control method according to claim 4, characterized in that, The two punching forming cavities include a first cavity and a second cavity sequentially along the punching feeding direction; Correspondingly, the flexible circuit board panel is punched based on the two punching cavities on the second punching die, including: The center lines of the first cavity and the second cavity are aligned with the first and fourth columns of any four adjacent columns of products on the flexible circuit board panel, respectively. The flexible circuit board panel is initialized so that the punch of the second cavity is aligned with the center position of the second column of products on the flexible circuit board panel. The feeding step distance of the flexible circuit board panel is set to the width of two columns of products; The flexible circuit board panel is continuously moved with the width of the two columns of products as the feeding step distance, so that the first cavity and the second cavity correspond to two different columns of products in each punching, and punching is carried out in a cyclical manner until the punching is completed.

6. The punching control method according to claim 1, characterized in that, Also includes: If the number of columns of the panel simultaneously meets both the first preset condition and the second preset condition, then the total number of the flexible circuit board panels is determined. If the total quantity is less than or equal to the first preset threshold, the flexible circuit board panel is punched based on the preset one-out-three-punching working mode; If the total quantity is greater than the first preset threshold, the flexible circuit board panel is punched based on the preset one-out-two-punch working mode.

7. The punching control method according to claim 1, characterized in that, The first preset condition is that the sum of the number of columns in the layout and 2 is an integer multiple of 3, and the second preset condition is that the number of columns in the layout is an even number.

8. A punching control system for flexible circuit board panelization, characterized in that, include: The column number determination module is used to determine the number of columns in the flexible circuit board panel to be punched; The mode determination module is used to determine the punching working mode of the flexible circuit board panel based on the number of panel columns, so as to select a one-out-three punching working mode when the number of panel columns meets the first preset condition and to select a one-out-two punching working mode when the number of panel columns meets the second preset condition. The punching module is used to punch the flexible circuit board panel according to the one-out-three punching working mode or the one-out-two punching working mode.

9. The punching control system according to claim 8, characterized in that, The punching module includes a first punching unit, which includes a first punching die, and the first punching die has three punching forming cavities.

10. The punching control system according to claim 8, characterized in that, The punching module includes a second punching unit, which includes a second punching die, and the second punching die has two punching forming cavities.

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