An rpetg environmentally-friendly smart card card base and a preparation method thereof, and a smart card

Abstract

The application provides an rPETG environment-friendly smart card card base and a preparation method and a smart card thereof, wherein the card base comprises a first sealing film, a first printing layer, an intermediate layer, a second printing layer and a second sealing film arranged in sequence; the first sealing film, the first printing layer, the intermediate layer, the second printing layer and the second sealing film are all made of rPETG material; the first sealing film is provided with a first adhesive layer, and the first adhesive layer is arranged close to the first printing layer; the second sealing film is provided with a second adhesive layer, and the second adhesive layer is arranged close to the second printing layer; the first sealing film, the first printing layer, the intermediate layer, the second printing layer and the second sealing film are fixed through lamination. The application does not need to additionally coat glue for bonding between the intermediate layer and the printing layer, only coats glue on the first sealing film and the second sealing film, and the intermediate layer is fixed through lamination with the first printing layer and the second printing layer, thereby reducing the overall amount of glue, and meanwhile, the sealing film, the printing layer and the intermediate layer are all made of rPETG, which is more green and environment-friendly.

Description

Technical Field

[0001] This invention relates to the field of smart card technology, specifically to an rPETG environmentally friendly smart card base and its preparation method, and the smart card itself. Background Technology

[0002] Existing smart cards, such as bank cards and social security cards, generally use polyvinyl chloride (PVC) as the main material for their base. PVC has environmental drawbacks, including non-degradability and difficulty in recycling, and its production process requires the addition of harmful substances such as plasticizers, which is incompatible with current "dual-carbon" policies and the trend of green finance. Some products have attempted to use a mixture of virgin polyethylene terephthalate-1,4-cyclohexanedimethyl ester (PETG) and PVC, but the base material still contains PVC components, failing to fundamentally solve the environmental problem. Faced with this situation, all six major international card organizations have explicitly required a shift towards environmentally friendly materials for bank card base production. In particular, Visa plans to completely eliminate PVC bases after 2028, mandating a switch to environmentally friendly materials. Therefore, replacing traditional PVC with environmentally friendly materials in card base manufacturing has become an inevitable trend in the industry.

[0003] Furthermore, regarding processing performance, while PVC material possesses a certain degree of toughness, as card printing processes become increasingly complex, they often employ a combination of techniques such as UV white ink, pearlescent printing, and offset printing. PVC card bases made using these complex printing processes are prone to cracking during subsequent embossing processes, reflecting PVC's insufficient toughness in handling demanding printing and subsequent machining, making it difficult to fully meet the ever-increasing requirements of card manufacturing processes.

[0004] Chinese invention patent application CN118428393A discloses an environmentally friendly smart card. This smart card includes a card base, which comprises a first substrate layer, a second substrate layer, and a functional layer sandwiched between the first and second substrate layers. The functional layer includes a base layer and is bonded to both the first and second substrate layers via a first adhesive layer. Specifically, the first substrate layer includes a first substrate, a first printing layer, and a first film layer; the second substrate layer includes a second substrate, a second printing layer, and a second film layer. The first substrate and the second substrate are bonded to the functional layer via the first adhesive layer. The first, second, and base layers are made of environmentally friendly materials, such as rPETG. However, this design requires both the first and second substrates to be bonded to the functional layer via the first adhesive layer, which necessitates the application of adhesive, thus hindering its environmental friendliness.

[0005] Regarding card base fabrication methods, previous methods based on PVC cannot be applied to rPETG-based card base fabrication. Specifically, conventional PVC lamination temperatures are 130℃-150℃, hot pressing is 5-7 MPa, and cold pressing is 10-12 MPa. Directly using these methods for rPETG card base fabrication will result in abnormalities such as coil imprints and severe material deformation. (See [link to relevant documentation]). Figures 1 to 4 The situation within the red circle, Figure 1 The deformation of the material after lamination at 130°C is shown. Figure 2 This shows a case where severe coil marks were observed after lamination at 130°C. Figure 3 This shows the cracking of the alloy after lamination at 130°C. Figure 4 This shows the presence of severe coil marks after lamination at 140°C. Summary of the Invention

[0006] The primary objective of this invention is to provide an rPETG environmentally friendly smart card base that can reduce the amount of adhesive used, making it more green and environmentally friendly.

[0007] The second objective of this invention is to provide a method for preparing the substrate of the aforementioned rPETG environmentally friendly smart card.

[0008] A third objective of this invention is to provide a smart card comprising the aforementioned card base.

[0009] To achieve the aforementioned first objective, the present invention provides an rPETG environmentally friendly smart card base, comprising: a first sealing film, a first printed layer, an intermediate layer, a second printed layer, and a second sealing film arranged sequentially; the first sealing film, the first printed layer, the intermediate layer, the second printed layer, and the second sealing film are all made of rPETG material; a first adhesive layer is disposed on the first sealing film, the first adhesive layer being disposed close to the first printed layer; a second adhesive layer is disposed on the second sealing film, the second adhesive layer being disposed close to the second printed layer; the first sealing film, the first printed layer, the intermediate layer, the second printed layer, and the second sealing film are fixed together by lamination.

[0010] As can be seen from the above scheme, the sealing film, printing layer, and intermediate layer of this invention are all made of rPETG, which is more environmentally friendly. Moreover, since it is based on recycled materials, the cost is lower than that of virgin PETG, directly replacing PVC to meet the needs of green finance. This invention does not require additional adhesive to be applied between the intermediate layer and the printing layer for bonding. Adhesive is only applied to the first and second sealing films, and the intermediate layer is fixed to the first and second printing layers by lamination, reducing the overall amount of adhesive used. This invention uses rPETG recycled materials to realize the smart card base, which is easy to recycle, contains no plasticizers, and has lower carbon emissions than PVC, which is in line with the trend of green and environmentally friendly development and the future development trend of card organizations.

[0011] A further proposed solution is that the first sealing film is identical to the second sealing film and meets the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.06 to 0.08 mm thick; Vicat softening temperature of 67 ± 2 °C; surface roughness requirement Ra of 0.5 to 2.2 μm; fiber orientation of 314; elongation at break ≥ 150%; tensile strength ≥ 40 MPa; the first printing layer is identical to the second printing layer and meets the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.15 to 0.26 mm thick; Vicat softening temperature of 74 ± 2 °C; surface roughness requirement Ra The fiber width is 1.0 to 1.6 micrometers; the fiber orientation is 478; the elongation at break is ≥150%; the tensile strength is ≥40 MPa; the surface tension requirement is ≥38 mN / m on the front printed side and ≥36 mN / m on the back; the intermediate layer meets the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.18 to 0.44 mm thick; Vicat softening temperature is 67±2℃; the fiber orientation is 314; the elongation at break is ≥150%; the tensile strength is ≥40 MPa; the sensing distance is ≥2.5 cm; the resonant frequency is 14.5±0.5 MHz; the process is wire picking, conductive, or tin sheet process.

[0012] Therefore, this invention effectively solves the pain points currently existing in the industry's rPETG card base manufacturing: rPETG material is relatively soft and has better toughness, so excessively high lamination temperatures and pressures can lead to obvious coil imprints and material deformation; however, excessively low lamination temperatures and pressures can easily result in insufficient adhesion between the film (the adhesion between the sealing film and the printed layer) and the core layer (the adhesion between the intermediate layer and the printed layer). The card manufacturing process parameters of this invention effectively solve these pain points, balancing adhesion without causing coil imprints or cracking of the metal frame. Furthermore, rPETG has better toughness than PVC / RPVC, making it less prone to cracking / breakage during card base manufacturing.

[0013] A further proposed solution is that the surface of the first printing layer closest to the first sealing film is the printing surface; and the surface of the second printing layer closest to the second sealing film is the printing surface.

[0014] Therefore, it can be seen that the first printing surface is set relative to the first adhesive layer on the first sealing film, and the second printing surface is set relative to the second adhesive layer on the second sealing film, which can adhere the ink of the printing layer while ensuring the overall bonding strength.

[0015] A further option is to also provide a magnetic strip on the second sealing film, with the magnetic strip positioned on the surface of the second sealing film away from the second adhesive layer.

[0016] This demonstrates that a card base capable of supporting magnetic stripe functionality can be implemented.

[0017] To achieve the second objective mentioned above, the present invention provides a method for preparing the rPETG environmentally friendly smart card base, comprising the following steps: printing a pattern on the printing surface of a first printing sheet and / or a second printing sheet; stacking and binding the cards in the order of a first sealing film, a first printing layer, an intermediate layer, a second printing layer, and a second sealing film; performing hot pressing, followed by cold pressing; wherein the hot pressing includes: laminating at a pressure of 1 to 2 MPa for 4 to 6 minutes, at a pressure of 2 to 3.5 MPa for 4 to 5 minutes, and at a pressure of 4 to 4.5 MPa for 10 to 12 minutes at a hot pressing temperature of 110 to 130°C; the cold pressing includes: laminating at a pressure of 5 to 6 MPa for 5 to 7 minutes, and at a pressure of 9 to 10 MPa for 15 to 20 minutes at a temperature of 23°C ± 2°C; cutting the card; hot stamping according to the card base requirements; milling grooves; and finally encapsulating the card.

[0018] As can be seen from the above solution, the present invention is compatible with existing processes, does not modify existing card manufacturing processes, and can achieve mass production of rPETG environmentally friendly smart cards simply by using specific raw materials and adjusting the card pressing process parameters.

[0019] A further option is to apply gold leaf according to card base requirements after printing the pattern on the printing surface of the first printed sheet and / or the second printed sheet, and before stacking and binding them in the order of first sealing film, first printed layer, intermediate layer, second printed layer and second sealing film.

[0020] A further embodiment is that the thickness of the first and second sealing films is 0.07 mm; the thickness of the first and second printing layers is 0.26 mm; the thickness of the intermediate layer is 0.18 mm; the hot pressing temperature is 115°C, and the layers are sequentially laminated at a pressure of 1 MPa for 5 minutes, at a pressure of 3 MPa for 5 minutes, and at a pressure of 4.5 MPa for 12 minutes; the cold pressing temperature is 23°C, and the layers are sequentially laminated at a pressure of 5 MPa for 5 minutes and at a pressure of 10 MPa for 16 minutes.

[0021] A further embodiment is that the thickness of the first and second sealing films is 0.06 mm; the thickness of the first and second printing layers is 0.15 mm; the thickness of the intermediate layer is 0.44 mm; the hot pressing temperature is 125°C, and the layers are sequentially laminated at a pressure of 1 MPa for 5 minutes, at a pressure of 2 MPa for 5 minutes, and at a pressure of 4.5 MPa for 10 minutes; the cold pressing temperature is 23°C, and the layers are sequentially laminated at a pressure of 5 MPa for 5 minutes and at a pressure of 9.5 MPa for 18 minutes.

[0022] A further embodiment is that the thickness of the first and second sealing films is 0.08 mm; the thickness of the first and second printing layers is 0.17 mm; the thickness of the intermediate layer is 0.36 mm; the hot pressing temperature is 125°C, and the layers are sequentially laminated at a pressure of 1 MPa for 5 minutes, at a pressure of 2 MPa for 5 minutes, and at a pressure of 4.5 MPa for 10 minutes; the cold pressing temperature is 23°C, and the layers are sequentially laminated at a pressure of 5 MPa for 5 minutes and at a pressure of 9.5 MPa for 18 minutes.

[0023] To achieve the third objective mentioned above, the present invention provides a smart card, characterized in that it includes: a method for preparing the above-mentioned rPETG environmentally friendly smart card base. Attached Figure Description

[0024] Figure 1 This is a schematic diagram illustrating the material deformation that occurs when the existing technology of preparing card bases using PVC is applied to preparing card bases using rPETG.

[0025] Figure 2 This is a schematic diagram of the coil imprint that appears when the existing technology of preparing card base using PVC is applied to preparing card base using rPETG.

[0026] Figure 3 This is a schematic diagram illustrating the cracking that occurs when the existing technology of preparing card base using PVC is applied to preparing card base using rPETG.

[0027] Figure 4 This is a schematic diagram illustrating the severe indentation that occurs when the existing technology of preparing card bases using PVC is applied to card bases prepared using rPETG.

[0028] Figure 5 This is a schematic diagram of the structure of an embodiment of the rPETG environmentally friendly smart card base of the present invention.

[0029] Figure 6 This is a flowchart of the first embodiment of the preparation method of the rPETG environmentally friendly smart card base of the present invention.

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0031] This invention enables the preparation of environmentally friendly smart card substrates based on rPETG material, achieving stable mass production of environmentally friendly smart cards.

[0032] The terms "first," "second," and "third" are used to distinguish similar things and do not imply any order or sequence.

[0033] Example of rPETG environmentally friendly smart card base: See Figure 5The rPETG environmentally friendly smart card base includes a first sealing film 11, a first printing layer 21, an intermediate layer 31, a second printing layer 41, and a second sealing film 51 arranged sequentially.

[0034] A first adhesive layer 111 is provided on the first sealing film 11, and the first adhesive layer 111 is disposed close to the first printed layer 21. A second adhesive layer 211 is provided on the second sealing film 51, and the second adhesive layer is disposed close to the second printed layer 41. A magnetic strip is also provided on the second sealing film, and the magnetic strip is disposed on the surface of the second sealing film away from the second adhesive layer.

[0035] The surface of the first printed layer 21 closest to the first sealing film 11 is the first printed surface 211. The surface of the second printed layer 41 closest to the second sealing film 51 is the second printed surface 511.

[0036] The first sealing film 11, the first printed layer 21, the intermediate layer 31, the second printed layer 41, and the second sealing film 51 are all made of rPETG material. The first adhesive layer 111 and the second adhesive layer 211 use PUR hot melt adhesive, such as YATIC MX-3542.

[0037] The first sealing film 11, the first printed layer 21, the intermediate layer 31, the second printed layer 41, and the second sealing film 51 are fixed together by lamination. The lamination methods include hot pressing and cold pressing. Hot pressing includes: laminating at a temperature of 110°C to 130°C for 4 to 6 minutes under a pressure of 12 MPa to 2 MPa, then laminating at a pressure of 2 MPa to 3.5 MPa for 4 to 5 minutes, and finally laminating at a pressure of 4 MPa to 4.5 MPa for 10 to 12 minutes. Cold pressing includes: laminating at a temperature of 23°C ± 2°C for 5 to 7 minutes under a pressure of 5 MPa to 6 MPa, then laminating at a pressure of 9 MPa to 10 MPa for 15 to 20 minutes.

[0038] For rPETG, the material is soft and (compared to PVC) not resistant to high temperatures. Using conventional lamination parameters for PVC card bases inevitably results in coil imprints and severe material deformation, thus necessitating a reduction in lamination temperature and pressure. This invention employs a lamination temperature of 110-130℃ and a lamination pressure below 10 MPa, effectively resolving the severe material deformation problem to a certain extent. Under the lamination parameters of this invention, the coil imprint problem is also resolved. Furthermore, this invention has been tested at lamination temperatures ranging from 95℃ to 145℃ and lamination pressures from 6 to 13 MPa. At temperatures below 110℃ and lamination pressures below 9 MPa, the resulting card base core layer (intermediate layer) exhibits low adhesion / film adhesion, and can be peeled off with force. At temperatures above 130℃ and lamination pressures above 10 MPa, the resulting card base intermediate layer shows obvious coil imprints, ink cracking, and severe material overflow and deformation. Therefore, the optimal lamination temperature is 110~130℃ and the lamination pressure is 9~10MPa (hot pressing pressure is controlled at 5-6MPa and cold pressing pressure is controlled at 9-10MPa).

[0039] The smart card base in this embodiment adopts a symmetrical structure to ensure the flatness of the card base and avoid warping due to the asymmetry of the card base. The first sealing film and the second sealing film are the same, as are the first printing layer and the second printing layer.

[0040] The first and second sealing films must meet the following requirements: dimensions of 314 mm wide, 478 mm long, and 0.06 to 0.08 mm thick; Vicat softening temperature of 67 ± 2 °C; surface roughness Ra of 0.5 to 2.2 μm; fiber orientation of 314; elongation at break ≥ 150%; tensile strength ≥ 40 MPa.

[0041] The first and second printed layers meet the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.15 to 0.26 mm thick; Vicat softening temperature of 74 ± 2 °C; surface roughness Ra of 1.0 to 1.6 μm; fiber orientation of 478°; elongation at break ≥ 150%; tensile strength ≥ 40 MPa; surface tension ≥ 38 mN / m on the front printed surface and ≥ 36 mN / m on the back printed surface. The front printed surface of the first printed layer is the first printed surface 211, and its back printed surface is the opposite side of the first printed layer. The front printed surface of the second printed layer is the second printed surface 411, and its back printed surface is the opposite side of the second printed layer.

[0042] Tensile properties ensure that the card base will not easily break under normal use and tension. Elongation at break represents the material's toughness; furthermore, the card base requires a cross-fiber structure during production to guarantee its various toughness properties. Roughness affects ink application, printing effect, and the smoothness of paper feeding. Surface tension affects ink adhesion. The Vicat softening temperature ensures that the card base will not soften or deform under normal use; for example, in hot summer weather, the card base temperature can reach 50-60 degrees Celsius without deformation (if the Vicat softening temperature is too low, the card base will deform in hot summer weather).

[0043] The intermediate layer meets the following requirements: dimensions of 314 mm wide, 478 mm long, and 0.18 to 0.44 mm thick; Vicat softening temperature of 67 ± 2 °C; fiber orientation of 314; elongation at break ≥ 150%; tensile strength ≥ 40 MPa; sensing distance ≥ 2.5 cm; resonant frequency of 14.5 ± 0.5 MHz; and processing methods including wire lifting, conductive, or solder sheet processing.

[0044] First embodiment of the preparation method of rPETG environmentally friendly smart card base: See Figure 6 This embodiment includes the following steps: S1: Prepare materials.

[0045] S2: Print the pattern on the printing surfaces of the first and second printing sheets.

[0046] S3: Apply gold leaf according to card base requirements.

[0047] S4: Stack the layers in the order of first sealing film, first printed layer, intermediate layer, second printed layer and second sealing film, and then bind them.

[0048] S5: Perform the pressing process.

[0049] S6: Perform the card cutting process.

[0050] S7: Hot stamping according to card base requirements.

[0051] S8: Perform the milling process.

[0052] S9: Perform the packaging process.

[0053] In step S1 above, the materials prepared include a first sealing film, a first printing layer, an intermediate layer, a second printing layer, and a second sealing film.

[0054] The first sealing film is the same as the second sealing film and meets the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.07 mm thick; Vicat softening temperature of 67 ± 2 °C; surface roughness requirement Ra of 0.5 to 2.2 micrometers; fiber orientation of 314; elongation at break ≥ 150%; tensile strength ≥ 40 MPa. The first and second printed layers are identical and meet the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.26 mm thick; Vicat softening temperature of 74 ± 2 °C; surface roughness requirement Ra of 1.0 to 1.6 micrometers; fiber orientation of 478°; elongation at break ≥ 150%; tensile strength ≥ 40 MPa; surface tension requirement ≥ 38 mN / m on the front printed surface and ≥ 36 mN / m on the back printed surface. The intermediate layer meets the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.18 mm thick; Vicat softening temperature of 67±2℃; fiber orientation of 314; elongation at break ≥150%; tensile strength ≥40 MPa; sensing distance ≥2.5 cm; resonant frequency of 14.5±0.5 MHz; and processing methods of wire picking, conductive, or tin sheet processing.

[0055] In step S5 above, the lamination process includes hot pressing and cold pressing. Hot pressing is performed first, followed immediately by cold pressing. Hot pressing includes: lamination at 115°C for 5 minutes at 1 MPa, lamination at 3 MPa for 5 minutes, and lamination at 4.5 MPa for 12 minutes. Cold pressing is performed at 23°C for 5 minutes at 5 MPa, and lamination at 10 MPa for 16 minutes.

[0056] In step S7 above, signature strips and holograms from various card organizations are hot stamped according to the cardholder's requirements.

[0057] In step S9 above, the packaging process uses a wire pick (TX) process.

[0058] Thus, the smart card base was prepared.

[0059] Table 1 shows the experimental data of the first embodiment. Before aging, the coating adhesion strength was greater than 8.5 N, and after aging, the coating adhesion strength increased to greater than 11 N.

[0060] Table 1. Adhesion strength of the coating on the smart card base before and after aging in this embodiment.

[0061] For comparison, see Table 2, which shows the lamination adhesion data when both the first and second sealing films are made of PVC, the first and second adhesive layers use PVC film-matched adhesive, and the rest is the same as in this embodiment. It can be seen that the lamination adhesion using PVC film (PVC film adhesive) is extremely poor, with the lowest lamination adhesion as low as 0.736 N.

[0062] Table 2. Adhesion strength of the coating on the smart card base before and after aging (comparative example)

[0063] Second embodiment of the preparation method of rPETG environmentally friendly smart card base: The difference between this embodiment and the first embodiment described above lies in step S5.

[0064] In step S5 of this embodiment, the hot pressing temperature is 125°C, and lamination is performed sequentially at a pressure of 1 MPa for 5 minutes, at a pressure of 2 MPa for 5 minutes, and at a pressure of 4.5 MPa for 10 minutes. The cold pressing temperature is 23°C, and lamination is performed sequentially at a pressure of 5 MPa for 5 minutes and at a pressure of 9.5 MPa for 18 minutes.

[0065] Third embodiment of the preparation method of rPETG environmentally friendly smart card base: The difference between this embodiment and the first embodiment described above lies in step S5.

[0066] In step S5 of this embodiment, the hot pressing temperature is 120°C, and the lamination is sequentially performed at a pressure of 1 MPa for 6 minutes, at a pressure of 2.5 MPa for 4 minutes, and at a pressure of 5 MPa for 11 minutes. The cold pressing temperature is 23°C, and the lamination is sequentially performed at a pressure of 5 MPa for 5 minutes and at a pressure of 10 MPa for 17 minutes.

[0067] Fourth embodiment of the preparation method of rPETG environmentally friendly smart card base: The difference between this embodiment and the first embodiment described above lies in steps S1 and S5.

[0068] In step S1 of this embodiment, the thickness of both the first sealing film and the second sealing film is 0.06 mm; the thickness of both the first printing layer and the second printing layer is 0.15 mm; and the thickness of the intermediate layer is 0.44 mm. In step S5 of this embodiment, the hot pressing temperature is 125°C, and the lamination is carried out sequentially at a pressure of 1 MPa for 5 minutes, at a pressure of 2 MPa for 5 minutes, and at a pressure of 4.5 MPa for 10 minutes; the cold pressing temperature is 23°C, and the lamination is carried out sequentially at a pressure of 5 MPa for 5 minutes, and at a pressure of 9.5 MPa for 18 minutes.

[0069] Fifth embodiment of the preparation method of rPETG environmentally friendly smart card base: The difference between this embodiment and the first embodiment described above lies in steps S1 and S5.

[0070] In step S1 above, the thickness of the first sealing film and the second sealing film is 0.08 mm; the thickness of the first printing layer and the second printing layer is 0.17 mm; and the thickness of the intermediate layer is 0.36 mm.

[0071] In step S5 of this embodiment, the hot pressing temperature is 125°C, and the lamination is carried out sequentially at a pressure of 1 MPa for 5 minutes, at a pressure of 2 MPa for 5 minutes, and at a pressure of 4.5 MPa for 10 minutes; the cold pressing temperature is 23°C, and the lamination is carried out sequentially at a pressure of 5 MPa for 5 minutes, and at a pressure of 9.5 MPa for 18 minutes.

[0072] Sixth embodiment of the preparation method of rPETG environmentally friendly smart card base: The difference between this embodiment and the fourth embodiment described above lies in step S9. In this embodiment, conductive (DD) process is used for packaging.

[0073] Seventh Example of the Preparation Method of rPETG Environmentally Friendly Smart Card Base: The difference between this embodiment and the fourth embodiment described above lies in step S9. In this embodiment, the tin foil (XP) process is used for packaging.

[0074] Smart card example: The smart card in this embodiment includes a card base, which can be any of the card bases described in the above embodiments.

[0075] In summary, this invention uses rPETG for the sealing film, printing layer, and intermediate layer, making it more environmentally friendly. Furthermore, because it is based on recycled materials, its cost is lower than virgin PETG, directly replacing PVC to meet the needs of green finance. This invention only applies adhesive to the first and second sealing films, with the intermediate layer fixed to the first and second printing layers through lamination, reducing the overall amount of adhesive used. This invention uses rPETG recycled material to create the smart card base, facilitating recycling and aligning with the trend of green and environmentally friendly development. This invention effectively addresses the pain points in current rPETG card base manufacturing based on card manufacturing process parameters, ensuring adhesion while avoiding issues such as coil marks and gold foil cracking. This invention is compatible with existing processes, requiring no modification to existing card manufacturing processes; mass production of rPETG environmentally friendly smart cards can be achieved simply by using specific raw materials and adjusting the pressing process parameters.

[0076] Finally, it should be emphasized that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. For example, the card base stacking thickness can be fine-tuned according to the actual situation of the card base, and the temperature / pressure range can be fine-tuned. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A rPETG environmentally friendly smart card base, characterized in that, include: The first sealing film, the first printing layer, the intermediate layer, the second printing layer, and the second sealing film are sequentially arranged. The first sealing film, the first printed layer, the intermediate layer, the second printed layer, and the second sealing film are all made of rPETG material; The first sealing film has a first adhesive layer disposed close to the first printed layer; the second sealing film has a second adhesive layer disposed close to the second printed layer. The first sealing film, the first printed layer, the intermediate layer, the second printed layer, and the second sealing film are fixed together by lamination.

2. The rPETG environmentally friendly smart card base as described in claim 1, characterized in that: The first sealing film is the same as the second sealing film and meets the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.06 to 0.08 mm thick; Vicat softening temperature of 67 ± 2 °C; surface roughness Ra of 0.5 to 2.2 μm; fiber orientation of 314; elongation at break ≥ 150%; tensile strength ≥ 40 MPa. The first printed layer is identical to the second printed layer and meets the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.15 to 0.26 mm thick; Vicat softening temperature of 74 ± 2 °C; surface roughness requirement Ra of 1.0 to 1.6 μm; fiber orientation of 478°; elongation at break ≥ 150%; tensile strength ≥ 40 MPa; surface tension requirement ≥ 38 mN / m on the front printed surface and ≥ 36 mN / m on the back printed surface. The intermediate layer meets the following parameter requirements: dimensions of 314 mm wide, 478 mm long, and 0.18 to 0.44 mm thick; Vicat softening temperature of 67 ± 2 °C; fiber orientation of 314; elongation at break ≥ 150%; tensile strength ≥ 40 MPa; sensing distance ≥ 2.5 cm; resonant frequency of 14.5 ± 0.5 MHz; and the process is wire picking, conductive, or tin sheet process.

3. The rPETG environmentally friendly smart card base as described in claim 1, characterized in that: The surface of the first printed layer closest to the first sealing film is the printing surface; the surface of the second printed layer closest to the second sealing film is the printing surface.

4. The rPETG environmentally friendly smart card base as described in claim 1, characterized in that: The second sealing film is also provided with a magnetic strip, which is disposed on the surface of the second sealing film away from the second adhesive layer.

5. A method for preparing the substrate of an rPETG environmentally friendly smart card according to any one of claims 1 to 4, characterized in that, Includes the following steps: A pattern is printed on the printing surface of the first printed sheet and / or the second printed sheet; The first sealing film, the first printed layer, the intermediate layer, the second printed layer, and the second sealing film are stacked and bound in that order. Hot pressing is performed, followed by cold pressing; wherein the hot pressing includes: laminating at a pressure of 1 to 2 MPa for 4 to 6 minutes, at a pressure of 2 to 3.5 MPa for 4 to 5 minutes, and at a pressure of 4 to 4.5 MPa for 10 to 12 minutes during a hot pressing temperature of 110 to 130°C. The cold pressing includes: laminating at a pressure of 5 to 6 MPa for 5 to 7 minutes and at a pressure of 9 to 10 MPa for 15 to 20 minutes at a temperature of 23℃±2. Cut card; Hot stamping is performed according to the cardholder's requirements; Milling grooves, and finally encapsulation.

6. The method for preparing the rPETG environmentally friendly smart card substrate as described in claim 5, characterized in that: After the set pattern is printed on the printing surface of the first printed sheet and / or the second printed sheet, before stacking and binding in the order of the first sealing film, the first printed layer, the intermediate layer, the second printed layer and the second sealing film, gold plating is applied according to the card base requirements.

7. The method for preparing the rPETG environmentally friendly smart card substrate as described in claim 5, characterized in that: The thickness of both the first and second sealing films is 0.07 mm; the thickness of both the first and second printed layers is 0.26 mm; and the thickness of the intermediate layer is 0.18 mm. The hot pressing temperature is 115°C, and the lamination is carried out sequentially at a pressure of 1 MPa for 5 minutes, at a pressure of 3 MPa for 5 minutes, and at a pressure of 4.5 MPa for 12 minutes. The cold pressing temperature is 23°C, and the lamination is carried out sequentially at a pressure of 5 MPa for 5 minutes and then sequentially at a pressure of 10 MPa for 16 minutes.

8. The method for preparing the rPETG environmentally friendly smart card substrate as described in claim 5, characterized in that: The thickness of both the first and second sealing films is 0.06 mm; the thickness of both the first and second printed layers is 0.15 mm; and the thickness of the intermediate layer is 0.44 mm. The hot pressing temperature is 125°C, and the lamination is carried out sequentially at a pressure of 1 MPa for 5 minutes, at a pressure of 2 MPa for 5 minutes, and at a pressure of 4.5 MPa for 10 minutes. The cold pressing temperature is 23°C, and the lamination is carried out sequentially at a pressure of 5 MPa for 5 minutes, and then sequentially at a pressure of 9.5 MPa for 18 minutes.

9. The method for preparing the rPETG environmentally friendly smart card substrate as described in claim 5, characterized in that: The thickness of both the first and second sealing films is 0.08 mm; the thickness of both the first and second printed layers is 0.17 mm; and the thickness of the intermediate layer is 0.36 mm. The hot pressing temperature is 125°C, and the lamination is carried out sequentially at a pressure of 1 MPa for 5 minutes, at a pressure of 2 MPa for 5 minutes, and at a pressure of 4.5 MPa for 10 minutes. The cold pressing temperature is 23°C, and the lamination is carried out sequentially at a pressure of 5 MPa for 5 minutes, and then sequentially at a pressure of 9.5 MPa for 18 minutes.

10. A smart card, characterized in that, include: The method for preparing the rPETG environmentally friendly smart card substrate as described in any one of claims 5 to 9.

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