Transferable profiled pasting flexible water and oxygen barrier packaging film and preparation method thereof

Abstract

The application discloses a transferable profiled pasting type flexible water and oxygen barrier packaging film and a preparation method thereof. The packaging film comprises a peelable temporary support layer, a surface functional protection layer, a water and oxygen barrier composite layer, a stress buffering and flattening layer and a thermoplastic embedded packaging layer; the water and oxygen barrier composite layer comprises at least one inorganic dense barrier layer and an organic-inorganic hybrid defect repairing layer. The thermoplastic embedded packaging layer can soften and flow under vacuum hot pressing, adhere to the surface of a device with protrusions, steps and curved surfaces, and the temporary support layer is peeled off after pasting. The application solves the problems of uneven film thickness, pinhole defects and equipment adaptation difficulty of profiled surface coating by preparing a dense barrier layer on a plane through a composite process such as roll-to-roll coating and magnetron sputtering, and then transferring to the surface of a profiled device through low-temperature vacuum hot pressing, and is suitable for water and oxygen barrier packaging of OLED, Mini / Micro LED, electronic paper, flexible display, perovskite and photovoltaic devices.

Description

Technical Field

[0001] This invention belongs to the technical field of functional thin films and electronic device packaging materials, specifically relating to a transferable contour-fitting flexible water and oxygen barrier packaging film and its preparation method, which is particularly suitable for water and oxygen barrier packaging of Mini LED, Micro LED, E-ink electronic paper, flexible display, OLED, photovoltaic modules, perovskite devices, automotive displays and outdoor display devices. Background Technology

[0002] Flexible display devices, Mini LEDs, Micro LEDs, OLEDs, perovskite photovoltaic modules, and flexible electronic devices are susceptible to moisture and oxygen intrusion during use, leading to electrode oxidation, decreased luminous efficiency, increased dark spots, interface delamination, adhesive layer aging, or shortened device lifespan. Therefore, it is necessary to form an encapsulation barrier layer with low water vapor permeability and low oxygen permeability on the device surface.

[0003] Existing flexible water and oxygen barrier membranes mostly employ inorganic barrier layers, organic buffer layers, or alternating inorganic / organic multilayer structures. Among them, inorganic layers have good water and oxygen barrier capabilities, but they are prone to pinholes, cracks, and particle defects during low-temperature deposition, roll-to-roll processing, bending, or lamination. Organic layers can improve flatness and flexibility, but their own water and oxygen barrier capabilities are limited.

[0004] For devices with protruding chips, stepped structures, curved structures, or flexible irregular surfaces, directly depositing inorganic barrier layers on the device surface can easily lead to problems such as uneven film thickness, insufficient shadow coverage, local pinholes, stress cracking, and difficulties in device compatibility. In particular, Mini LED and Micro LED substrates have a large number of chip protrusions and gaps, and ordinary liquid resins are prone to uneven thickness, difficulty in rework, leakage, and subsequent assembly difficulties. Although ordinary OCA or hot-melt encapsulation sheets have good adhesion and embedding properties, their water and oxygen barrier performance is insufficient to meet the long-term packaging requirements of high-reliability display devices and optoelectronic devices.

[0005] Therefore, there is an urgent need for a flexible water and oxygen barrier encapsulation film that can be fabricated with high quality in a planar state and can be transferred and applied to the surface of irregular, curved or protruding devices, so as to take into account water and oxygen barrier, conformal application, low-temperature processing, optical performance, surface protection and large-scale production. Summary of the Invention

[0006] The purpose of this invention is to provide a transferable, contour-fitting flexible water and oxygen barrier encapsulation film and its preparation method, so as to solve the problems of uneven film thickness, defect penetration and equipment adaptation difficulties that exist when directly depositing barrier layers on the surface of irregular, curved or protruding devices, while also solving the problem of insufficient water and oxygen barrier performance of ordinary thermoplastic encapsulation sheets.

[0007] To achieve the above objectives, the present invention provides a transferable conformal adhesive flexible water and oxygen barrier encapsulation film, wherein the flexible water and oxygen barrier encapsulation film comprises, from the outside to the inside, a peelable temporary support layer, a surface functional protection layer, a water and oxygen barrier composite layer, a stress buffer planarization layer, and a thermoplastic embedded encapsulation layer.

[0008] The water-oxygen barrier composite layer comprises at least one inorganic dense barrier layer and at least one organic-inorganic hybrid defect repair layer. The inorganic dense barrier layer provides the primary water-oxygen barrier function; the organic-inorganic hybrid defect repair layer fills pinholes, particulate defects, and microcracks on the surface of the inorganic layer and releases stress between the multilayer films.

[0009] The thermoplastic embedded encapsulation layer is used to soften and flow during vacuum hot pressing, filling gaps between LED chips, microstructures on the electronic paper surface, and gaps between curved or stepped surfaces, and forming a stable encapsulation layer after cooling. The stress buffer planarization layer is used to reduce the risk of cracking of the water-oxygen barrier composite layer during transfer application, bending, hot pressing, and peeling off of the temporary support layer.

[0010] The surface functional protective layer can be configured as an anti-reflective, anti-glare, anti-fouling, scratch-resistant, UV-resistant, anti-fingerprint, or composite optical functional layer according to application requirements.

[0011] The present invention also provides a method for preparing the flexible water and oxygen barrier encapsulation film, comprising sequentially forming a surface functional protective layer, an inorganic dense barrier layer, an organic-inorganic hybrid defect repair layer, a stress buffer planarization layer, and a thermoplastic embedded encapsulation layer on a peelable temporary support layer.

[0012] The present invention also provides a device packaging method, comprising placing the thermoplastic embedded packaging layer of the flexible water and oxygen barrier packaging film toward the surface of the device to be packaged, hot-pressing it under vacuum conditions to soften the thermoplastic embedded packaging layer to fill the gaps of protrusions, steps or curved surfaces, and peeling off the peelable temporary support layer after cooling to obtain a packaged device with an outer surface water and oxygen barrier composite layer.

[0013] Compared with existing technologies, the present invention has the following advantages: 1. The present invention adopts the technical route of "planar film preparation - transfer bonding - contour packaging", avoiding uneven film thickness, insufficient shadow area coverage and equipment adaptation difficulties caused by directly depositing barrier layers on the surface of irregular or curved devices; 2. The present invention achieves the coating of protruding chips, steps or curved surfaces through thermoplastic embedded encapsulation layers, which can improve the flatness of the encapsulation and the device yield; 3. The present invention reduces the probability of pinholes and microcracks through the combination of inorganic dense barrier layers and organic-inorganic hybrid defect repair layers, and improves the stability of water and oxygen barrier; 4. The present invention extends the water and oxygen diffusion path and consumes a small amount of permeated water and oxygen through the synergistic effect of sheet-like nanofillers and water and oxygen capturing components, thereby improving the barrier retention rate after humid heat aging; 5. The present invention can be integrated with surface functions such as anti-reflection, anti-glare, anti-fouling and scratch resistance, and is suitable for display, photovoltaic, electronic paper and flexible electronic packaging scenarios, and can be mass-produced through roll-to-roll processes. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the layer structure of the flexible water and oxygen barrier encapsulation film of the present invention.

[0015] Figure 2 This is a schematic diagram of the preparation method of the flexible water and oxygen barrier encapsulation film of the present invention.

[0016] Figure 3 This is a schematic diagram comparing the planar coating transfer and application route with the direct deposition route on irregular surfaces in this invention.

[0017] Figure 4 This is a schematic diagram of the flexible water and oxygen barrier encapsulation film of the present invention being applied to a Mini / Micro LED raised structure substrate.

[0018] Figure 5 This is a schematic diagram of the verification test route for the E-ink, TPU, and roll material samples of this invention.

[0019] Figure 6 This is a schematic diagram of the phased curing and online testing process of the present invention.

[0020] Figure 7 This is a schematic diagram comparing the water vapor transmission rate of the embodiments and comparative examples of the present invention.

[0021] 1. Peelable temporary support layer; 11. Release layer; 2. Surface functional protective layer; 3. Water and oxygen barrier composite layer; 31. First inorganic dense barrier layer; 32. Organic-inorganic hybrid defect repair layer; 33. Second inorganic dense barrier layer; 4. Stress buffer planarization layer; 5. Thermoplastic embedded encapsulation layer; 6. Substrate of device to be encapsulated; 61. LED chip; 7. Vacuum hot pressing device; 8. Roll-to-roll preparation device. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments. It should be understood that the following embodiments are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. For those skilled in the art, substitutions or adjustments can be made to the materials, layer thickness, process parameters, and application objects without departing from the concept of the present invention, and such substitutions or adjustments should all fall within the scope of protection of the present invention.

[0023] like Figure 1 As shown, the flexible water and oxygen barrier encapsulation film of the present invention comprises, from the outside to the inside, a peelable temporary support layer 1, a release layer 11, a surface functional protective layer 2, a water and oxygen barrier composite layer 3, a stress buffer planarization layer 4, and a thermoplastic embedded encapsulation layer 5. The water and oxygen barrier composite layer 3 includes a first inorganic dense barrier layer 31, an organic-inorganic hybrid defect repair layer 32, and a second inorganic dense barrier layer 33.

[0024] The peelable temporary support layer 1 can be selected from PET, PEN, PI, TAC, PC, PMMA, TPU, COP, COC, or composite films thereof, and its thickness can be from 12 μm to 250 μm, preferably from 25 μm to 100 μm. The release layer 11 can be a silicone release layer, a non-silicone release layer, a fluorine-containing release layer, or a heat-release release layer, used to achieve the peeling of the temporary support layer after application.

[0025] The surface functional protective layer 2 can be one or more composite layers selected from scratch-resistant protective layer, anti-reflective layer, anti-glare layer, anti-fingerprint layer, anti-fouling layer, anti-UV layer, low-reflection layer, and hardening layer. The surface functional protective layer 2 can be formed from one or more of fluorosiloxanes, fluoroacrylates, silica sols, acrylate resins, polyurethane acrylates, and epoxy acrylates, thereby endowing the encapsulation film with anti-reflective, anti-fouling, weather-resistant, or scratch-resistant functions.

[0026] The first inorganic dense barrier layer 31 and the second inorganic dense barrier layer 33 can be selected from one or more of alumina, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxynitride, titanium oxide, zirconium oxide, hafnium oxide, zinc oxide, tin oxide, niobium oxide, and tantalum oxide. The inorganic dense barrier layer can be prepared by magnetron sputtering, electron beam evaporation, thermal evaporation, plasma-enhanced chemical vapor deposition, atomic layer deposition, or ion beam-assisted deposition, and the thickness of a single layer is 5 nm to 500 nm, preferably 10 nm to 150 nm.

[0027] The organic-inorganic hybrid defect repair layer 32 may include one or more of the following: siloxane resin, acrylate resin, epoxy resin, polyurethane resin, polyimide precursor, fluorinated resin, silane coupling agent, hydrolytic condensation silica sol, aluminum sol, zirconium sol, and titanium sol. This layer can be prepared by sol-gel coating, slot coating, microgravure coating, blade coating, spray coating, inkjet printing, or roll coating, with a thickness of 20 nm to 10 μm, preferably 50 nm to 2 μm.

[0028] The organic-inorganic hybrid defect repair layer 32 may also contain sheet-like nanofillers and / or water and oxygen capture components. The sheet-like nanofillers may be selected from one or more of boron nitride nanosheets, graphene oxide, reduced graphene oxide, montmorillonite, mica sheets, talc sheets, layered double hydroxides, and MXene nanosheets; the sheet-like nanofillers may be surface modified by silane coupling agents, fluorinated silanes, epoxy silanes, amino silanes, or acrylate silanes, and oriented in the film surface direction.

[0029] The water and oxygen capturing component can be selected from one or more of the following: molecular sieves, calcium oxide, magnesium oxide, barium oxide, anhydrous sulfates, metal-organic framework materials, deoxidizers, hindered phenolic antioxidants, phosphite antioxidants, and thioester antioxidants. Preferably, the water and oxygen capturing component is a microencapsulated water and oxygen capturing component, and its shell material can be polyolefin, polyurethane, acrylic resin, epoxy resin, silicone resin, polyurea, or polyamide.

[0030] The stress-reducing planarization layer 4 is an organic-inorganic hybrid resin layer that can be cured by UV or heat, with a thickness of 0.1 μm to 50 μm, preferably 0.5 μm to 10 μm. This layer is used to reduce the risk of cracking of the water-oxygen barrier composite layer 3 during bending, stretching, vacuum hot pressing, and peeling off the temporary support layer.

[0031] The thermoplastic embedded encapsulation layer 5 may include one or more of the following: thermoplastic polyolefin, polyolefin elastomer, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, thermoplastic polyurethane, butyl rubber, styrene-based thermoplastic elastomer, acrylic hot melt adhesive, polyamide hot melt adhesive, and ionomer resin. Its thickness may be from 5 μm to 300 μm, preferably from 10 μm to 100 μm. The thermoplastic embedded encapsulation layer 5 is flowable at temperatures from 80°C to 180°C and forms a solid encapsulation layer upon cooling.

[0032] like Figure 2As shown, the preparation method of the flexible water-oxygen barrier encapsulation film of the present invention includes: S1, forming a surface functional protective layer on a peelable temporary support layer; S2, forming at least one inorganic dense barrier layer on the surface functional protective layer; S3, forming an organic-inorganic hybrid defect repair layer on the inorganic dense barrier layer; S4, repeating steps S2 and S3 once or more to obtain a water-oxygen barrier composite layer; S5, forming a stress buffer planarization layer on the water-oxygen barrier composite layer; S6, composite a thermoplastic embedded encapsulation layer on the stress buffer planarization layer.

[0033] like Figure 3 As shown, compared to directly depositing the barrier layer on irregular surfaces, this invention first forms a water-oxygen barrier composite layer on a planar temporary support layer, and then transfers and applies it to the surface of irregular, curved, or protruding devices. This technical approach can reduce uneven film thickness, insufficient shadow coverage, and stress cracks that occur when directly depositing on curved or stepped surfaces.

[0034] like Figure 4 As shown, in the Mini LED or Micro LED substrate packaging, the thermoplastic embedded encapsulation layer 5 is vacuum thermo-pressed toward the LED chip 61. The thermoplastic embedded encapsulation layer 5 softens upon heating and fills the gaps between the chips, forming a stable encapsulation layer upon cooling. The structure is assembled, and then the removable temporary support layer 1 is peeled off, leaving the water-oxygen barrier composite layer 3 and the surface functional protection layer 2 on the outer surface of the device.

[0035] like Figure 5 As shown, the present invention can verify the encapsulation film through E-ink RA testing, TPU WVTR testing, and roll sample testing. Test items may include water vapor transmission rate, oxygen transmission rate, visible light transmission rate, haze, cross-cut adhesion, double 85 aging, flexural retention rate, and appearance defect detection.

[0036] like Figure 6 As shown, after the thermoplastic embedded encapsulation layer is laminated or applied, staged curing and online inspection can be performed. Staged curing may include a first stage of UV curing, hot pressing for debubbling and leveling, and a second stage of UV curing or thermal curing; online inspection may include film thickness deviation, degree of curing, bubble rate, pinhole defects, and appearance defects. Example 1

[0037] A non-silicone release layer is formed on the surface of a low-shrinkage PET temporary support film with a thickness of 50 μm. Subsequently, a fluorinated siloxane-acrylate surface functional protective layer is formed on the surface of the release layer by microgravure coating. After drying, it is cured under ultraviolet light. The thickness of the surface functional protective layer is 0.5 μm to 2 μm.

[0038] A dense inorganic barrier layer of alumina with a thickness of 40 nm to 80 nm was deposited on the surface functional protective layer by magnetron sputtering.

[0039] An organic-inorganic hybrid defect repair layer was coated onto the surface of an inorganic dense barrier layer of alumina using a sol-gel method. The organic-inorganic hybrid defect repair layer comprises silica sol, epoxy silane, acrylate resin, and surface-modified boron nitride nanosheets. After drying and curing, a defect repair layer with a thickness of 100 nm to 800 nm was formed.

[0040] Then, a dense inorganic barrier layer of silicon oxynitride or silicon oxide with a thickness of 40 nm to 120 nm is deposited by magnetron sputtering to obtain a water-oxygen barrier composite layer.

[0041] A stress buffer planarization layer with a thickness of 1 μm to 5 μm is coated on the water-oxygen barrier composite layer, and then a thermoplastic polyolefin embedding encapsulation layer with a thickness of 30 μm to 80 μm is laminated to obtain a transferable conformal flexible water-oxygen barrier encapsulation film. Example 2

[0042] The thermoplastic embedded encapsulation layer of the flexible water and oxygen barrier encapsulation film prepared in Example 1 is oriented toward the Mini LED substrate, wherein the surface of the Mini LED substrate has a chip protrusion structure with a height of 30 μm to 150 μm.

[0043] The LED chip is bonded in a vacuum hot-pressing apparatus at a temperature of 120°C to 160°C, a pressure of 10 kPa to 2 MPa, a vacuum holding time of 10 s to 120 s, and a hot-pressing time of 30 s to 300 s. The thermoplastic embedded encapsulation layer softens and fills the gaps between the LED chips, forming a flat encapsulation surface after cooling.

[0044] Subsequently, the PET temporary support film is peeled off, leaving the surface functional protective layer and the water and oxygen barrier composite layer on the outer surface of the Mini LED substrate, thus obtaining a Mini LED packaging module with water and oxygen barrier function. Example 3

[0045] The flexible water and oxygen barrier encapsulation film was prepared using the method of Example 1, except that microencapsulated molecular sieves and microencapsulated calcium oxide were added to the thermoplastic embedded encapsulation layer, the microcapsule shell was a polyurethane-acrylate composite shell, and the content of water and oxygen capturing components was 0.5 wt% to 10 wt%.

[0046] The resulting encapsulation film is used for surface encapsulation of E-ink electronic paper. After vacuum hot pressing, it can conform to the surface of electronic paper, reducing the risk of water and oxygen intrusion into electronic paper in a humid and hot environment. Example 4

[0047] The peelable temporary support layer is continuously conveyed in a roll-to-roll manner, passing sequentially through the surface functional protective layer coating station, the first inorganic dense barrier layer deposition station, the sol-gel defect repair layer coating station, the second inorganic dense barrier layer deposition station, the stress buffer planarization layer coating station, and the thermoplastic embedded encapsulation layer composite station, to obtain a roll material sample with a width of more than 22 cm.

[0048] After the roll sample is cut, a thermoplastic embedded encapsulation layer is vacuum hot-pressed onto the TPU or electronic paper simulated substrate. After the temporary support layer is peeled off, the water vapor transmission rate, appearance, adhesion and barrier retention rate after bending are tested. Test case

[0049] The flexible water and oxygen barrier encapsulation film prepared according to the above embodiments can be evaluated using the following test items.

[0050]

[0051] like Figure 7 As shown, ordinary thermoplastic packaging sheets can be used as a comparative example. By adding a water and oxygen barrier composite layer on the outer surface, the present invention reduces the water vapor permeability from the gram level of ordinary thermoplastic packaging sheets to no more than 1 g / (m²·day), and in the preferred embodiment, it further reduces it to no more than 0.01 g / (m²·day). Industrial applicability

[0052] The flexible water and oxygen barrier encapsulation film of this invention can be continuously prepared through processes such as roll-to-roll coating, sol-gel, magnetron sputtering, evaporation deposition, thermal lamination, and vacuum hot pressing, making it suitable for large-area, low-cost, and mass production. This encapsulation film can be applied to water and oxygen barrier encapsulation in products such as Mini LED, Micro LED, E-ink electronic paper, OLED, perovskite cells, flexible photovoltaics, sensors, automotive displays, and outdoor displays.

Claims

1. A transferable, contour-fitting, flexible water and oxygen barrier encapsulation film, characterized in that, The flexible water-oxygen barrier encapsulation film comprises, from the outside in, a peelable temporary support layer, a surface functional protection layer, a water-oxygen barrier composite layer, a stress buffer planarization layer, and a thermoplastic embedded encapsulation layer. The water-oxygen barrier composite layer includes at least one inorganic dense barrier layer and at least one organic-inorganic hybrid defect repair layer. The thermoplastic embedded encapsulation layer can soften and fill the protrusion gaps, step gaps, or curved micro-gaps on the surface of the device to be encapsulated under vacuum hot pressing conditions. The peelable temporary support layer is used to support the water-oxygen barrier composite layer during planar film fabrication and transfer bonding, and is peeled off after the flexible water-oxygen barrier encapsulation film is applied to the device to be encapsulated.

2. The flexible water and oxygen barrier encapsulation film according to claim 1, characterized in that, The peelable temporary support layer is one of PET, PEN, PI, TAC, PC, PMMA, TPU, COP, COC or a composite film thereof; a release layer is provided on the side of the peelable temporary support layer near the surface functional protective layer, and the release layer is a silicone release layer, a non-silicone release layer, a fluorine-containing release layer or a heat-release release layer.

3. The flexible water and oxygen barrier encapsulation film according to claim 1, characterized in that, The surface functional protective layer is one or more composite layers selected from scratch-resistant protective layer, anti-reflective layer, anti-glare layer, anti-fingerprint layer, anti-fouling layer, anti-ultraviolet layer, low-reflection layer, and hardening layer; the surface functional protective layer includes one or more selected from fluorinated siloxane, fluorinated acrylate, silica sol, acrylate resin, polyurethane acrylate, and epoxy acrylate.

4. The flexible water and oxygen barrier encapsulation film according to claim 1, characterized in that, The inorganic dense barrier layer is selected from one or more of alumina, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxynitride, titanium oxide, zirconium oxide, hafnium oxide, zinc oxide, tin oxide, niobium oxide, and tantalum oxide; the single-layer thickness of the inorganic dense barrier layer is from 5 nm to 500 nm.

5. The flexible water and oxygen barrier encapsulation film according to claim 1, characterized in that, The organic-inorganic hybrid defect repair layer comprises one or more of the following: siloxane resin, acrylate resin, epoxy resin, polyurethane resin, polyimide precursor, fluorinated resin, silane coupling agent, hydrolytic condensation type silica sol, aluminum sol, zirconium sol, and titanium sol; the thickness of the organic-inorganic hybrid defect repair layer is 20 nm to 10 μm.

6. The flexible water and oxygen barrier encapsulation film according to claim 5, characterized in that, The organic-inorganic hybrid defect repair layer contains sheet-like nanofillers and / or water and oxygen capturing components; the sheet-like nanofillers are selected from one or more of boron nitride nanosheets, graphene oxide, reduced graphene oxide, montmorillonite, mica sheets, talc sheets, layered double hydroxides, and MXene nanosheets; the water and oxygen capturing components are selected from molecular sieves, calcium oxide, magnesium oxide, barium oxide, anhydrous sulfate, and gold. It belongs to one or more of the following categories: organic framework materials, deoxidizers, hindered phenolic antioxidants, phosphite antioxidants, and thioester antioxidants.

7. The flexible water and oxygen barrier encapsulation film according to claim 1, characterized in that, The stress-relief planarization layer is an organic-inorganic hybrid resin layer that can be cured by UV or heat, with a thickness of 0.1 μm to 50 μm; the thermoplastic embedded encapsulation The layer includes one or more of the following: thermoplastic polyolefin, polyolefin elastomer, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, thermoplastic polyurethane, butyl rubber, styrene-based thermoplastic elastomer, acrylic hot melt adhesive, polyamide hot melt adhesive, and ionomer resin.

8. The flexible water and oxygen barrier encapsulation film according to claim 1, characterized in that, The flexible water and oxygen barrier encapsulation film, after vacuum hot-pressing, can cover raised structures with a height of 5 μm to 500 μm, and forms a continuous outer surface barrier layer after peeling off the peelable temporary support layer; the visible light transmittance of the flexible water and oxygen barrier encapsulation film is not less than 85%, the haze is not more than 15%, and the water vapor transmittance under 40 ℃ and 90%RH conditions is not more than 1 g / (m 2 ·day).

9. A method for preparing the flexible water-oxygen barrier encapsulation film according to any one of claims 1 to 8, characterized in that, The process includes the following steps: S1, forming a surface functional protective layer on a peelable temporary support layer; S2, forming at least one inorganic dense barrier layer on the surface functional protective layer; S3, forming an organic-inorganic hybrid defect repair layer on the inorganic dense barrier layer; S4, repeating steps S2 and S3 once or more to obtain a water-oxygen barrier composite layer; S5, forming a stress-buffered planarization layer on the water-oxygen barrier composite layer; S6, bonding a thermoplastic embedded encapsulation layer on the stress-buffered planarization layer to obtain a transferable conformal adhesive flexible water-oxygen barrier encapsulation film.

10. The preparation method according to claim 9, characterized in that, The inorganic dense barrier layer is prepared by one or more of the following methods: magnetron sputtering, electron beam evaporation, thermal evaporation, plasma-enhanced chemical vapor deposition, atomic layer deposition, and ion beam-assisted deposition; the organic-inorganic hybrid defect repair layer is prepared by one or more of the following methods: sol-gel coating, slot coating, microgravure coating, blade coating, spray coating, inkjet printing, and roll coating.

11. The preparation method according to claim 9, characterized in that, The preparation method is a roll-to-roll continuous preparation method; after the thermoplastic embedded encapsulation layer is laminated, it also includes a staged curing and online detection step, wherein the online detection includes detecting one or more of the following: film thickness deviation, degree of curing, bubble rate, pinhole defects, and appearance defects.

12. A method for encapsulating a device using the flexible water-oxygen barrier encapsulation film according to any one of claims 1 to 8, characterized in that, The process includes the following steps: A1, placing the thermoplastic embedded encapsulation layer of the flexible water and oxygen barrier encapsulation film toward the surface of the device to be encapsulated; A2, hot-pressing the flexible water and oxygen barrier encapsulation film and the device to be encapsulated under vacuum conditions, so that the thermoplastic embedded encapsulation layer softens and fills the protrusions, steps or curved gaps on the surface of the device to be encapsulated. A3. After cooling and solidification, peel off the peelable temporary support layer to obtain a packaged device with an outer surface water and oxygen barrier composite layer.

13. The device packaging method according to claim 12, characterized in that, The vacuum hot pressing temperature is 80℃ to 180℃, the pressure is 5 kPa to 2 MPa, the vacuum holding time is 5 s to 300 s, and the hot pressing time is 10 s to 600 s; the device to be packaged is a Mini LED display module, a Micro LED display module, an E-ink electronic paper, an OLED device, a flexible display device, a photovoltaic module, a perovskite cell, a sensor, an automotive display device, or a flexible electronic device.

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